Anti-Surge Thick Film Chip Re sis tors 0603, 0805, 1206, 1210

Anti-Surge Thick Film Chip Re sis tors 0603, 0805, 1206, 1210
Anti-Surge Thick Film Chip Resistors
Anti-Surge Thick Film Chip Resistors
0603, 0805, 1206, 1210
Type:
ERJ P03, P06, P08, P14
■ Features
● Anti-Surge characteristics superior to standard metal film resistors
● High reliability
Metal glaze thick film resistive element and three layers of electrodes
● Suitable for both reflow and flow soldering
● High power…0.2 W : 1608(0603) size
0.25 W : 2012(0805) size
0.33 W : 3216(1206) size
0.5 W : 3225(1210) size
● Reference Standards…IEC 60115-8, JIS C 5201-8
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
R
J
P
0
6
D
1
0
0
2
V
Product Code
Thick Film
Chip Resistors
Size, Power Rating
Type: inches
Power R.
P03 : 0603
0.2 W
P06 : 0805
0.25 W
P08 : 1206
0.33 W
P14 : 1210
0.5 W
Resistance Tolerance
Code
D
F
J
Packaging Methods
Code
Tolerance
± 0.5 %
±1%
±5%
Type
ERJP03
ERJP06
ERJP08
Packaging
V
Punched Carrier Taping
4 mm pitch
U
Embossed Carrier Taping
ERJP14
4 mm pitch
Resistance Value
The first two or three digits are significant figures of resistance
and the third one denotes number of zeros following.
Example: 222촞2.2 k
1002촞10 k
■ Construction
■ Dimensions in mm (not to scale)
L
Protective coating
Alumina substrate
a
Electrode (Inner)
W
t
b
Electrode
(Between)
Thick film
resistive element
Electrode (Outer)
Type
(inches)
Dimensions (mm)
L
W
a
b
Mass (Weight)
[g/1000 pcs.]
t
ERJP03
(0603)
0.15+0.15
0.30±0.15 0.45±0.10
1.60±0.15 0.80+0.15
–0.05
–0.10
ERJP06
(0805)
2.00
0.25
±0.20
0.40
ERJP08
(1206)
3.20 –0.20 1.60 –0.15 0.40
±0.20
0.50
ERJP14
(1210)
3.20
±0.20
0.50
±0.20
+0.05
±0.20
±0.10
1.25
+0.05
±0.20
2.50
0.35
2
±0.20
0.60
±0.10
4
±0.20
0.60
±0.10
10
±0.20
0.60
±0.10
16
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Mar. 2008
Anti-Surge Thick Film Chip Resistors
■ Ratings
Limiting Element
Power Rating
Maximum Overload Resistance
Voltage
(2)
at 70 °C
Voltage
Tolerance
(1)
(Maximum RCWV)
(W)
(V)
(%)
(V)
Type
(inches)
Resistance
Range
()
10 to 1 M
(E24, E96)
10 to 1 M
(E24, E96)
1 to 1 M
(E24)
10 to 1 M
(E24, E96)
1 to 1 M
(E24)
10 to 1 M
(E24, E96)
1 to 10 M
(E24)
10 to 1 M
(E24, E96)
1 to 1 M
(E24)
±0.5
ERJP03
(0603)
0.2
150
200
±1
±5
±0.5, ±1
ERJP06
(0805)
0.25
ERJP08
(1206)
0.33
ERJP14
(1210)
0.5
150
200
±5
200
(3)
(500)
400
(3)
(1000)
±0.5, ±1
±5
±0.5, ±1
200
400
±5
Category Temperature
T.C.R.
Range (Operating
[10 –6/°C (ppm/°C)] Temperature Range)
(°C)
±150
±200
–55 to +155
±200
Less than 10 : –150 to +400
Less than 33 : ±300
More than 33 : ±100
Less than 33 : ±300
More than 33 : ±200
–55 to +155
±100
–55 to +155
Less than 10 : –100 to +600
More than 10 : ±200
±100
–55 to +155
Less than 10 : –100 to +600
More than 10 : ±200
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV=Power Rating Resistance Values, or Limiting Element Voltage
(max. RCWV) listed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 Power Rating or max. Overload Voltage listed above
whichever less.
(3) Please contact us when resistors with guaranteed higt voltage are need.
–55 °C
100
Rated Load (%)
Power Derating Curve
For resistors operated in ambient temperatures above
70 °C, power rating shall be derated in accordance
with the figure on the right.
✽ When the temperature of ERJP06/08/14 is 155 °C or
less, the derating start temperature can be changed to
125 °C. (See the dotted line)
70 °C
125 °C
80
60
40
20
0
–60 –40 –20
■ ESD Characteristic
C=150pF
Anti-Surge Thick Film Chip Resistors(ERJP Type)
Thick Film Chip Resistors(ERJ Type)
ERJP03(1608 (0603) size)
ERJP
-5%
-10%
ERJ
-15%
-20%
-25%
10
100
1k
10k 100k
ERJP
-5%
-10%
-15%
ERJ
-20%
-30%
1M
ERJP08(3216 (1206) size)
ERJ
-10%
-15%
-20%
-25%
10
100
1k
10k 100k
100
1k
1M
10k 100k
1M
ERJP14(3225 (1210) size)
ERJP
-0%
Change Ratio of
Resistance Value
-5%
10
-5%
ERJP
-0%
Change Ratio of
Resistance Value
-0%
-25%
-5%
-30%
ERJP06(2012 (0805) size)
-5%
Change Ratio of
Resistance Value
Change Ratio of
Resistance Value
Sample
-0%
-30%
20 40 60 80 100 120 140 160 180
Ambient Temperature (°C)
R=0/150
±3.0kV
-5%
155 °C
0
-5%
ERJ
-10%
-15%
-20%
-25%
-30%
10
100
1k
10k 100k
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
1M
Jul. 2008
Anti-Surge Thick Film Chip Resistors
■ Packaging Methods (Taping)
● Standard Quantity
Type
Kind of Taping
Pitch (P1)
Quantity
4 mm
5000 pcs./reel
ERJP03
Punched Carrier Taping
ERJP06
ERJP08
Embossed Carrier Taping
ERJP14
● Carrier Tape
(Unit : mm)
Embossed Carrier
P1
φD0
P2
P0
B
W
F
E
Punched Carrier
A
T
T
φD1 (Only Emboss)
Type
ERJP03
A
1.10
B
±0.10
±0.15
W
1.90
±0.10
2.50
±0.20
ERJP06
1.65
ERJP08
2.00 ±0.15
3.60 ±0.20
ERJP14
±0.20
±0.20
2.80
3.50
F
E
P1
P2
φD 0
P0
8.00 ±0.20
3.50 ±0.05
1.75 ±0.10
4.00 ±0.10
2.00 ±0.05
4.00 ±0.10
+0.10
1.50−0
8.00 ±0.30
T
φD1
0.70 ±0.05
–
–
0.84±0.05
1.00
–
±0.10
1.0 +0.10
−0
● Taping Reel
(Unit : mm)
Type
T
φA
φB
φC
W
T
9.0 ±1.0
11.4±1.0
ERJP03
ERJP06
ERJP08
φC
180.0 +0
13.0 ±1.0
−3.0 60 min.
φB
ERJP14
φA
W
■ Recommended Land Pattern
In case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount properly.
Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of reflow soldering, solder
amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
c
Chip Resistor
a
b
Type
(inches)
Dimensions (mm)
a
b
c
ERJP03
(0603)
0.7 to 0.9
2 to 2.2
0.8 to 1
ERJP06
(0805)
1 to 1.4
3.2 to 3.8
0.9 to 1.4
ERJP08
(1206)
2 to 2.4
4.4 to 5
1.2 to 1.8
ERJP14
(1210)
2 to 2.4
4.4 to 5
1.8 to 2.8
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Mar. 2008
Anti-Surge Thick Film Chip Resistors
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
● Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
Temperature
Peak
Preheating
Heating
For soldering (Example : Sn/Pb)
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 5 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
Time
Preheating
150 °C to 180 °C
60 s to 120 s
Main heating
Above 230 °C
30 s to 40 s
Peak
max. 260 °C
max. 10 s
Time
● Recommended soldering conditions for flow
Preheating
Soldering
For soldering
Temperature
Time
140 °C to 180 °C
60 s to 120 s
245 ± 5 °C
20 s to 30 s
For lead-free soldering
Temperature
Time
150 °C to 180 °C
60 s to 120 s
max. 260 °C
max. 10 s
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER2 of this catalog.
1. Take measures against mechanical stress during and after mounting of Anti-Surge Thick Film Chip Resistors (hereafter
called the resistors) so as not to damage their electrodes and protective coatings.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.
3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance
and/or reliability.
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors'
protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Safety Precautions
(Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and stan dard use in general elec tron ic
equipment (e.g. AV equipment, home electric ap plianc es, offi ce equipment, information and com mu ni cation
equipment)
• These products are not intended for use in the following special conditions. Before using the products, carefully
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin
or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will not
affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or
inflammables, such as vinyl-coated wires, near these products .
• Note that non- cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the
performance or reliability of the products.
• Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave
water residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your
company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °
C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their
electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials)
may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Oct. 2007
– ER3 –
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