10G 850 XFP T Module

Accelar ™

10G

BPS

850

NM

XFP T

RANSCEIVER

Module

K

EY

B

ENEFITS

• Industry-wide XFP MSA form factor

• Standard compliant optical specifications

• Superior thermal performance

• Denser I/O implementation

• Excellent EMI performance

• Multivendor availability

• High reliability

• In-house precision alignment

A

PPLICATIONS

• 10 Gigabit Ethernet (LAN PHY)

IEEE 802.3ae 10GBASE-SR and

10GBASE-SW

• 10G Fibre Channel optical interconnects

• Cross-connect switches

• Router interconnect

• MAN aggregation links

• Computer cluster cross-connect

• Custom high-speed data pipes

http://www.xfpmsa.org

PL-XXL-SC-S45-22

Picolight’s MSA compliant 10Gbps 850 nm XFP transceiver is a cost-effective, high-reliability optoelectronic (O/E) device that transmits and receives standard compliant high-speed serial 10 Gbps optical and electrical signals. The Picolight design provides a single product solution for the IEEE 802.3ae 10GBASE-SR,

10GBASE-SW, and 10GFC optical interconnects that are used in Telecommunication, Data Communication, and

Storage Area Network applications. The transceiver features a Picolight 850 nm Vertical Cavity Surface

Emitting Laser (VCSEL) and a PIN photodiode. The XFI electrical interface uses 10 Gbps differential data channels for communications to the module as specified in the 10 Gigabit Small Form Factor Pluggable Module

MSA. The transceiver’s MSA compliant “hot-z-pluggable” mechanical design offers the system designer the smallest footprint 10 Gbps solution and enables the highest density front-panel designs with up to 16 10G ports per line card. The PL-XXL-SC-S45-22 is another

10Gbps product in Picolight’s Accelar product line of

850nm transceivers targeted at short reach (>300 meter) applications.

H

IGHLIGHTS

‹

Compliant to Ethernet and Fiber Channel 10 Gbps

Specifications Simplifies supply chain.

‹

Hot pluggable enables real-time in-field system upgrades

‹

Serial XFI electrical interface enables flexible routing for

line cards and backplanes of up to 12 inches over enhanced PCB traces

‹

System monitoring and component mapping via I

2

C management interface

‹

Design based on high volume optoelectronics packaging

‹

Proven supply chain and reliable long-term supply

based on Picolight’s reliable VCSELs and PIN diodes

‹

>300 meter reach over enhanced multimode fiber

05001604 R3 October 2006

10G

BPS

850

NM

XFP T

RANSCEIVER

Module

PL-XXL-SC-S45-22 F

EATURES AND

S

PECIFICATION

H

IGHLIGHTS

:

• Incorporates a directly modulated

850nm Picolight oxide VCSEL

• Low power consumption (< 2.0 W max.)

• Mechanical design features compliant with XFP MSA v 3.1

• Center-pull bail mechanism for consistent installation and removal

• 0

°

C To 70

°

C case temperature operating range

• 9.95 Gbits/s to 10.75 Gbit/s serial optical and electrical interface

• LC receptacled optical connector

• Durable plastic bail delatch mechanism

• 30 pin XFP compatible connector

• System and line-side loopback modes

• Loss of Signal (RX_LOS) Indicator

• Transmitter Disable (TX_DIS) pin

• Power Down (P_Down) pin.

• Module De-select, Module Absent, and Module Not Ready pins

• XFI compatible electrical interface, single differential channel operating at up to 10.75 Gbit/s

• Bit error rate < 1x10

-12

• I

2

C interface with XFP-compliant diagnostic functions

• 5V, 3.3V, and 1.8V power supplies

• IEC 60825-1 Class 1 laser eye safe

• FCC Class B compliant

• ESD Class 2 per MIL-STD 883

Method 3015

12.8

18.35

77.9

DIMENSIONS ARE REFERENCE ONLY IN MM

PL-XXL-SC-S45-22 M

ECHANICAL

F

OOTPRINT

.

O

RDERING

I

NFORMATION

P

ART

N

UMBER

: D

ESCRIPTION

:

PL-XXL-SC-S45-22 850nm XFP duplex LC receptacled 10 Gigabit transceiver module with beige, plastic bail

C

ONTACT

I

NFORMATION

:

Picolight Incorporated

1480 Arthur Avenue

Louisville, CO 80027 USA

Tel: 303.530.3189

E-mail: [email protected]

Web site: www.picolight.com

October 2006 Page 2 of 16 05001604 R3

10G

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850

NM

XFP T

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S

ECTION

1

F

UNCTIONAL

D

ESCRIPTION

The PL-XXL-SC-S45-22 850 nm VCSEL-based 10 Gigabit XFP transceiver is a full duplex serial electric, serial optical device with both transmit and receive functions contained in a single module. It is designed to be compliant with IEEE 802.3ae 10GBASE-SR, 10GBASE-SW (300 m), and 10 G Fibre

Channel specifications. The transceiver is also fully compliant with the XFP 10 Gigabit Small Form

Factor Pluggable Module Revision 3.1, Multi-Source Agreement. This device is the ideal solution for high density, cost effective 10Gbps 850nm multimode-mode fiber (MMF) interconnects. A block diagram of the PL-XXL-SC-S45-22 transceiver is shown in Figure 1 below.

The PL-XXL-SC-S45-22 XFP transceiver has several low-speed interface connections including a 2wire serial interface. These connections include; module not ready (Mod_NR), module deselect

(Mod_DeSel), Interrupt, transmitter disable (TX_DIS), module absent (Mod_ABS), receive loss

(RX_LOS), and power down/reset (P_Down/RST).

F

IGURE

1 PL-XXL-SC-S45-22 XFP T

RANSCEIVER

B

LOCK

D

IAGRAM

ROSA

CDR

TIA

system loopback

E

Q

CDR

line loopback

μcontroller

Laser Driver

TOSA

LC

LC

Two loopback modes are available through the two-wire serial interface. The loopback modes are useful to facilitate stand-alone testing. In system loopback mode, data recovered from the system side transmit interface is re-directed to the system side receive interface. This facilitates system side test and debug. In network loopback mode, data recovered from the line side receive interface (optics) is looped to the line side transmitter output back to the fiber.

T

RANSMITTER

The transmitter path converts 9.95, 10.3, 10.5, or 10.75 Gbps NRZ electrical data to a standard compliant optical signal. The transmitter accepts a 100 Ohm differential 40 mV peak-to-peak to 1000 mV peak-to-peak 10Gbps CML electrical signal on TD- and TD+ pins. This performance exceeds the

XFI “Ziffy” specification in the XFP MSA revision 3.1 specification and provides over 300 mm (12 inches) reach on improved FR4 material (loss tangent of 0.016) and offers greater flexibility to system integrators for host board layout.

Inside the module, the differential signals pass through a signal conditioner with equalization that compensates for losses and deterministic jitter present on the input data stream. A reference clock input (RefCLK+, RefCLK-) is used by the internal PLL to determine line rate and signal lock condition.

The Tx clock circuit provides a lock alarm output, failure to lock results in Mod_NR asserted. The output of the Tx signal conditioner is input to the laser driver circuit which transforms the small swing digital voltage to an output modulation and bias current that drives a directly modulated 850nm

VCSEL. The optical signal is engineered to meet the IEEE 802.3ae 10GBASE-SR, 10GBASE-SW, and 10 GFC specifications. Closed-loop control of the transmitted laser power over temperature and

05001604 R3 Page 3 of 16 October 2006

10G

BPS

850

NM

XFP T

RANSCEIVER

Module

voltage variations is provided. An LC connectorized receptacle provides the mechanical interface to the multi-mode fibre plant.

R

ECEIVER

The receiver converts incoming arbitrarily encoded serial 9.95, 10.3, 10.5, or 10.75 Gbps NRZ optical data into serial XFI electrical data. An LC connectorized receptacle provides the mechanical interface to the multi-mode fiber plant. A high speed PIN photodiode converts the optical signal into a current which is converted to a voltage in a high-gain transimpedance amplifier. The amplified signal is passed to a signal conditioning IC that provides clock and data recovery. Loss of signal, and signal lock detection is included in the receive circuitry that is reflected in the Mod_NR status pin. The recovered data is output on the RD+ and RD- pins as a 100 Ohms 250mV peak-to-peak CML signal. The output signal meets the XFP MSA requirements.

L

OW

S

PEED

S

IGNALING

Low speed signaling is based on low voltage TTL (LVTTL) operating at a nominal voltage of 3.3V

SCL/SDA: Two wire Serial interface clock and data line. Hosts should use a pull-up resistor connected to Vcc 3.3V on the two-wire interface SCL (clock), SDA (data), and all low speed outputs.

Mod_NR: Output pin. When asserted high indicates that the module has detected a condition that renders Tx and or Rx data invalid.

Mod_DeSel: Input pin. When held low by the host the module responds to 2-wire serial communication commands. When high the module does not respond to or acknowledge any 2-wire interface communication from the host.

Interrupt: Output pin. When low indicates possible module operational fault or a status critical to the host system.

TX_DIS: Input pin. When asserted high the transmitter output is turned off.

Mod_ABS: Input pin. Asserted high when the XFP module is absent and is pulled low when the XFP module is inserted.

RX_LOS: Output pin. Asserted high when insufficient optical power for reliable signal reception

P_Down/RST: Multifunction input pin. The module can be powered down or reset by pulling the lowspeed P-Down pin high. In power down mode no data is transmitted on the optical Tx or the electrical

Rx path. The reset pulse is generated on the falling edge of the P-Down signal. Following reset, the internal PLL’s must reacquire lock and will cause a Mod_NR failure.

October 2006 Page 4 of 16 05001604 R3

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BPS

850

NM

XFP T

RANSCEIVER

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S

ECTION

2

A

PPLICATION

S

CHEMATICS

Recommended MSA connections to the PL-XXL-SC-S45-22 transceiver are shown in Figure 2 below.

F

IGURE

2 A

PPLICATION

S

CHEMATIC FOR THE

PL-XXL-SC-S45-22 T

RANSCEIVER

POWER INPUT OUTPUT

2

2

2

2

RefCLK +/-

TD +/-

RD +/-

XFP Module

Power supply filtering is recommended for the PL-XXL-SC-S45-22 module. To limit wide band noise power, the host system and module shall each meet a maximum of 2% peak-to-peak noise when measured with a 1MHz low pass filter. In addition, the host system and the module shall each meet a maximum of 3% peak-to-peak noise when measured with a high pass filter from 1MHz-10MHz.

A typical board-to-board application using a XAUI based MAC/Framer ASIC is shown below in Figure

3. High-speed serial 10Gbps ASICs will eliminate the need for the SER-DES IC. However, the XAUI implementation offers greater flexibility in layout as the XFI interface is limited to reaches of 12 inches, while the XAUI interface can span over 50 inches on the host PCBA.

F

IGURE

3 B

OARD

-

TO

-B

OARD

XFP A

PPLICATION

D

IAGRAM

ASIC

05001604 R3 Page 5 of 16

ASIC

October 2006

10G

BPS

850

NM

XFP T

RANSCEIVER

Module

S

ECTION

3

T

ECHNICAL

D

ATA

Technical data related to the includes:

S

ECTION

3.1

S

ECTION

3.2

S

ECTION

3.3

S

ECTION

3.4

S

ECTION

3.5

S

ECTION

3.6

S

ECTION

3.7

S

ECTION

3.8

P

IN

F

UNCTION

D

EFINITIONS ON PAGE

6

XFP/XFI R

EFERENCE

M

ODEL

C

OMPLIANCE

P

OINTS ON PAGE

8

A

BSOLUTE

M

AXIMUM

R

ATINGS ON PAGE

8

E

LECTRICAL

C

HARACTERISTICS ON PAGE

8

J

ITTER

S

PECIFICATIONS ON PAGE

9

I

NPUT

R

EFERENCE

C

LOCK

S

PECIFICATIONS ON PAGE

10

T

IMING

R

EQUIREMENT OF

C

ONTROL AND

S

TATUS

I/O

ON PAGE

10

XFP 2-

WIRE

I

NTERFACE

P

ROTOCOL AND

M

ANAGEMENT

I

NTERFACE ON PAGE

11

S

ECTION

3.9

O

PTICAL

C

HARACTERISTICS ON PAGE

12

S

ECTION

3.10

O

PTICAL

L

INK

D

ISTANCES ON PAGE

12

S

ECTION

3.11

R

EGULATORY

C

OMPLIANCE ON PAGE

13

S

ECTION

3.12

PCB L

AYOUT ON PAGE

13

S

ECTION

3.13

M

ODULE

O

UTLINE ON PAGE

14

S

ECTION

3.14

C

ONNECTORS ON PAGE

14

3.1

Pin Function Definitions

T

ABLE

1 T

RANSCEIVER

P

IN

-

OUT ON

H

OST

B

OARD

25

26

27

28

22

23

24

29

30

19

20

21

16

17

18

GND

RD-

RD+

GND

VCC2

P_Dow n/RST

VCC2

GND

RefCLK+

RefCLK-

GND

GND

TD-

TD+

GND

GND

RX_LOS

M od_NR

M od_ASB

SDA

SCL

VCC3

VCC3

GND

VCC5

_______

M od_DeSel

VEE5

GND

4

3

6

5

2

1

9

8

7

12

11

10

15

14

13

October 2006 Page 6 of 16 05001604 R3

10G

BPS

850

NM

XFP T

RANSCEIVER

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T

ABLE

2 P

IN

D

ESCRIPTIONS

17

18

19

20

21

13

14

15

16

9

10

11

12

7

8

5

6

Pin no.

1

2

3

4

Type

LVTTL-I

LVTTL-O

LVTTL-I

LVTTL-I

LVTTL-I/O

LVTTL-O

LVTTL-O

LVTTL-O

CML-O

CML-O

LVTTL-I

Name

GND

VEE5

SCL

GND

GND

RD-

RD+

2

SDA

2

1

Mod_Desel

Interrupt

TX_DIS

VCC5

GND

1

VCC3

VCC3

1

1

GND

1

VCC2

2

Mod_Abs

2

Mod_NR

2

RX_LOS

2

P_Down/RST

Description

Module Ground

Not Used; may be left unconnected (Optional -5.2V Power Supply)

Module De-select; When held low allows the module to respond to 2wire serial interface commands”

Interrupt; Indicates presence of an important condition which can be read over the serial 2-wire interface

Transmitter Disable; Transmitter Laser Source Turned Off

+5V Power Supply

Module Ground

+3.3V Power Supply

+3.3V Power Supply

Two Wire Interface Clock

Two Wire Interface Data Line

Indicates Module is not present. Grounded in the Module

Module Not Ready; Indicating Module Operational Fault

Receiver Loss Of Signal Indicator

Module Ground

Module Ground

Receiver Inverted Data Output

Receiver Non-Inverted Data Output

Module Ground

+1.8V Power Supply.

Power down; When high, requires the module to limit power consumption to 1.5W or below. Serial interface must be functional in the low power mode.

Reset; The falling edge initiates a complete reset of the module including the serial interface, equivalent to a power cycle.

22

23

24

25

26

27

PECL-I

PECL-I

VCC2

GND

1

RefCLK+

RefCLK-

GND

1

GND

1

+1.8V Power Supply

Module Ground

Reference Clock Non-Inverted Input, AC coupled on the host board

Reference Clock Inverted Input, AC coupled on the host board

Module Ground

Module Ground

28

29

30

CML-I

CML-I

TD-

TD+

GND

1

Transmitter Inverted Data Input

Transmitter Non-Inverted Data Input

Module Ground

1. Module ground pins (GND) are isolated from the module case and chassis ground within the module

2. Shall be pulled up with 4.7K-10Kohms to a voltage between 3.15V and 3.45V on the host board

05001604 R3 Page 7 of 16 October 2006

10G

BPS

850

NM

XFP T

RANSCEIVER

Module

3.2

XFP/XFI R

EFERENCE

M

ODEL

C

OMPLIANCE

P

OINTS

D C' C

RX

ASIC/

SERDES

TX

A B' B

XFP Module

3.3

A

BSOLUTE

M

AXIMUM

R

ATINGS

(Damage Threshold, CW operation unless otherwise stated)

Storage Temperature

Operating case temperature

Relative Humidity

T st

T op

RH

-40 to +100

-40 to 80

5 to 95 (non-condensing)

3.4

E

LECTRICAL

C

HARACTERISTICS

(T op

= 0

°C - 70°C case, CW operation unless otherwise stated)

Unit

°

C

°

C

%

Voltage

3

Voltage

5

Voltage

2

Supply Current

3

Supply Current

5

Supply Current

2

Vcc

Vcc

Vcc

Icc

Icc

Icc

3

5

2

3

5

2

Supply currents and voltages

3.14

4.75

1.71

3.3

5.0

1.8

330

50

10

3.46

5.25

1.89

400

60

15

V

V mA mA mA

With Respect to GND

VPS

VPS

Low speed control and sense signals (detailed specification in XFP MSA v3.1 at http://www.xfpmsa.org

)

Outputs (Interrupt, Mod_NR,

RX_LOS)

V

OL

0.0

0.4

V

Inputs (TX_DIS, P_Down/RST)

V

V

V

OH

IL

IH host_Vcc-0.5

-0.3

2.0

host_Vcc+ 0.3

Vcc

0.8

3

+ 0.3

V

V

V

Rpullup pulled to host _Vcc, measured at host side of connector. IOL(max)=3mA

Rpullup pulled to host _Vcc, measured at host side of connector.

Rpullup pulled to host _Vcc, measured at XFP side of connector. IIL(max)=-10uA

Rpullup pulled to host _Vcc, measured at XFP side of connector. IIL(max)=10uA

October 2006 Page 8 of 16 05001604 R3

10G

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850

NM

XFP T

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Module

3.4

E

LECTRICAL

C

HARACTERISTICS

(continued)

(T op

= 0

°C - 70°C case, CW operation unless otherwise stated)

SCL and SDA Inputs V

V

IL

IH

-0.3

Vcc

3

*0.7

Vcc

3

*0.3

Vcc

3

+0.5

Rpullup pulled to host _Vcc, measured at XFP side of connector. IIL(max)=-10uA

Rpullup pulled to host _Vcc, measured at XFP side of connector. IIL(max)=10uA

Transmitter Input (detailed specification in XFP MSA v3.1 at http://www.xfpmsa.org

)

Data input baud rate nominal

Data input bit rate tolerance

Data input compliance

Data input Differential

Impedance

R

I

9.95

80

10.3125

C

100

10.75

+/-100

120

GBd ppm

Ω internally AC coupled signals

Receiver Output (detailed specification in XFP MSA v3.1 at http://www.xfpmsa.org

)

Data output baud rate nominal

Data output compliance

Data output bit rate stability

9.95

10.3125

B

10.75

+/-100

GBd ppm internally AC coupled signals

3.5

J

ITTER

S

PECIFICATIONS

Transmitter electrical input jitter from host at B (detailed specification in XFP MSA v3.1 at http://www.xfpmsa.org

)

Total jitter less ISI Total Non-DDJ Jitter

Total Jitter

Eye Mask

TJ

X1

0.41

0.61

0.305

UI(p-p)

UI(p-p)

UI Mask coordinate X1=0.205 if total non-DDJ is measured

Eye Mask

Eye mask

Y1

Y2

60

410 mV mV 50 mV is allocated for multiple reflections

Receiver electrical output jitter to host at C (detailed specification in XFP MSA v3.1 at http://www.xfpmsa.org

)

Deterministic Jitter

Total Jitter

Sinusoidal Jitter Tolerence

Eye Mask

Eye Mask

Eye Mask

Eye Mask

DJ

TJ

SJ

170

0.18

0.34

0.17

0.42

UI(p-p)

UI(p-p)

UI

UI mV mV

Includes jitter transferred from the optical receiver during any valid operational input condition.

425

Datacom module transmitter and receiver (detailed specification in XFP MSA v3.1 at http://www.xfpmsa.org

)

05001604 R3 Page 9 of 16 October 2006

10G

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850

NM

XFP T

RANSCEIVER

Module

Jitter Transfer Bandwidth

Jitter Peaking

Meets the requirements of IEEE802.3ae and 10GFC

BW 8 MHz PRBS 2^31-1, Data or scrambled 64B/66B as detailed in IEEE 802.3ae Clause 52

1 dB Frequency >50 KHz

3.6

I

NPUT

R

EFERENCE

C

LOCK

S

PECIFICATIONS

Clock differential input impedance

Differential input clock amplitude

Reference clock duty cycle

Reference Clock Rise/Fall time

Reference clock frequency

RMS random jitter

Reference clock frequency tolerance

Zd

Tr/Tf f

0

σ

Δ f -100

80

640

40

200

100

Baud/64

120

1600

60

1250

10

+100

Ω mV

% ps

MHz ps ppm

AC coupled PECL

20%-80% up to 100 MHz

3.7

T

IMING

R

EQUIREMENT OF

C

ONTROL AND

S

TATUS

I/O

TX_DIS assert time

TX_DIS negate time

Time to initialize

Interrupt assert delay

Interrupt negate delay

P_Down/RST assert delay

Mod_NR assert delay t_off t_on t_init

Interrupt_on

Interrupt_off

P_Down.RST_on

Mod_NR_on

Mod_NR_off Mod_NR negate delay

P-Down reset time

RX_LOS assert delay

RX_LOS negate delay t_loss_on t_loss_off

10

2-wire serial bus timing is described in Chapter 4 of XFP MSA v3.1

500

100

1

1

10

2

300

200

100

100

μ sec Rising edge of TX_DIS to fall of output signal below 10% of nominal msec Falling edge of TX_DIS to rise of output signal above 90% of nominal msec From power on or from power falling edge of P_Down/RST msec From occurrence of the condition triggering Interrupt.

μ sec

μ sec

From clear on read Interrupt flags

From power down initiation msec From occurrence of fault to assertion of Mod_NR msec From clearance of signal to negation of Mod_NR

μ sec Min. length of P-Down assert to initiate reset

μ sec From Occurrence of loss of signal to assertion of RX_LOS

μ sec From Occurrence of loss of signal to negation of RX_LOS

October 2006 Page 10 of 16 05001604 R3

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NM

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3.8

XFP 2-

WIRE

I

NTERFACE

P

ROTOCOL AND

M

ANAGEMENT

I

NTERFACE

The Picolight PL-XXL-SC-S45-22 module incorporates a XFP compliant 2-wire management interface which is used for serial ID, digital diagnostics, and certain control functions. It is modeled on the SFF-

8472 Rev 9.3 specification modified to accommodate a single 2-wire interface address. In addition to the basic I2C read/write functionality the modules support packet error checking that, when enabled, allows the host system to confirm the validity of any read data. Details of the protocol and interface are explicitly described in the MSA. Please refer to the MSA for design reference.

Figure 4 XFP 2-

WIRE

S

ERIAL

D

IGITAL

D

IAGNOSTIC

M

EMORY

M

AP

05001604 R3 Page 11 of 16 October 2006

10G

BPS

850

NM

XFP T

RANSCEIVER

Module

3.9

O

PTICAL

C

HARACTERISTICS

(T case

= 0 to 70

°C, CW operation unless otherwise stated)

9.95

Transmitter

10.3125

Signal speed

Signal tolerance

Average Optical Power

Extinction Ratio

P

Avg

Er

Triple trade off curve compliance

OMA (Optical modulation amplitude)

RMS Spectral Width

Center Wavelength

Relative Intensity Noise

Transmitter and Dispersion

Penalty

Return Loss Tolerance

OMA

Δλ

λ p

RIN

12

OMA

TDP

-5.0

3

380

840

-2.76

5.5

600

0.25

850

10.75

+/-100

-1.5

9.0

1000

0.45

860

-128

3.9

12

Gbps ppm dBm dB uW nm nm dB/Hz dB dB

Triple trade off curves define

OMA, Spectral Width and

Center Wavelength (any two parameters fix the third)

Receiver

Signal Speed

Wavelength

Return Reflectance

Average receive power

λ p

9.95

840

10.3125

10.75

860

-12

-1.0

GBd nm dB dBm

Stressed Rx Sensitivity OMA

Bit Error Ratio

S

S

BER

-7.5

10

-12 dBm

Without FEC

*

See IEEE P802.3ae Media Access Control (MAC)Parameters, Physical Layer, and Management Parameters for 10 Gb/s Operation for complete specification

3.10

O

PTICAL

L

INK

D

ISTANCES

Data Rate

9.95-

10.3125

Gbps

Fiber Type

Modal Bandwidth @ 850nm

(MHz-km)

62.5/125um MMF 160

62.5/125um MMF 200

50/125um MMF

50/125um MMF

50/125um MMF

400

500

2000

Worst case distance range specified (m)

2 - 26

2 - 33

2 - 66

2 - 82

2 - 300

Typical range (m)

>400

October 2006 Page 12 of 16 05001604 R3

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850

NM

XFP T

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3.11

R

EGULATORY

C

OMPLIANCE

The PL-XXL-SC-S45-22 complies with international Electromagnetic Compatibility (EMC) and

international safety requirements and standards (see details in Table 3 on page 13). EMC

performance is dependent on the overall system design. Information included herein is intended as a figure of merit for designers to use as a basis for design decisions.

T

ABLE

3 R

EGULATORY

C

OMPLIANCE

Feature

Component Safety

Laser Eye Safety

CE

Electromagnetic Emissions

Electromagnetic Immunity

ESD Immunity

Radiated Immunity

Test Method Performance

UL 60950

UL94-V0

EN 60950

EN 60825

U. S. 21CFR 1040.10 and 1040.11

UL File E209897

TUV Report/Certificate (CB Scheme)

Electromagnetic Compatibility

EU Declaration of Conformity Compliant with European EMC and Safety Standards

EMC Directive 89/336/EEC

FCC CFR47 Part 15

IEC/CISPR 22

AS/NZS CISPR22

EN 55022

ICES-003, Issue 4

VCCI-03

EMC Directive 89/336/EEC

IEC /CISPR/24

EN 55024

CDRH compliant and Class 1 laser eye safe

TUV Certificate

Noise frequency range: 30 MHz to 16 GHz. Good system EMI design practice required to achieve Class B margins.

Class 1 (> 1 kV)

EN 61000-4-2

EN 61000-4-3: 1998

Exceeds Requirements. Withstands discharges of; 15kV contact,

25kV air

Exceeds Requirements. Field strength of 10V/m RMS, from 10

MHz to 1 GHz. No effect on transmitter/receiver performance is detectable between these limits.

3.12

PCB L

AYOUT

Recommended PCB layout is given in XFP MSA v 3.1

05001604 R3 Page 13 of 16 October 2006

10G

BPS

850

NM

XFP T

RANSCEIVER

Module

3.13

M

ODULE

O

UTLINE

71 6.9

1

18.35

18.35

1.5

2.8

62.35

44.1

2

4.55

4.25

1 2.25

1 1.7

1.5

8.5

13.2

2X 1

DIMENSIONS ARE REFERENCE ONLY IN MM

3.14

C

ONNECTORS

F

IBER

The XFP module has a duplex LC receptacled connector.

E

LECTRICAL

The electrical connector is the 30-way, two row PCB edge connector. Customer connector is Tyco/

AMP Part No.

788862C

or equivalent.

October 2006 Page 14 of 16 05001604 R3

10G

BPS

850

NM

XFP T

RANSCEIVER

Module

S

ECTION

4

R

ELATED

I

NFORMATION

Other information related to the includes:

S

ECTION

4.1

P

ACKAGE AND

H

ANDLING

I

NSTRUCTIONS BELOW

S

ECTION

4.2

ESD D

ISCHARGE

(ESD)

BELOW

S

ECTION

4.3

E

YE

S

AFETY ON PAGE

16

4.1

P

ACKAGE AND

H

ANDLING

I

NSTRUCTIONS

C

ONNECTOR COVERS

The PL-XXL-SC-S45-22 is supplied with an LC duplex receptacle. The connector covers supplied protect the connector during standard manufacturing processes and handling by preventing contamination from dust, aqueous solutions, body oils, or airborne particles.

Note:

It is recommended that the connector plug remain on whenever the transceiver optical fiber connector is not inserted.

R

ECOMMENDED CLEANING AND DE

-

GREASING CHEMICALS

Picolight recommends the use of methyl, isopropyl and isobutyl alcohols for cleaning.

Do not use halogenated hydrocarbons (e.g. trichloroethane, ketones such as acetone, chloroform, ethyl acetate, MEK, methylene chloride, methylene dichloride, phenol, N-methylpyrolldone).

H

OUSING

The PL-XXL-SC-S45-22 housing is made from zinc.

4.2

ESD D

ISCHARGE

(ESD)

H

ANDLING

Normal ESD precautions are required during the handling of this module. This transceiver is shipped in

ESD protective packaging. It should be removed from the packaging and otherwise handled in an ESD protected environment utilizing standard grounded benches, floor mats, and wrist straps.

T

EST AND OPERATION

In most applications, the optical connector will protrude through the system chassis and be subjected to the same ESD environment as the system. Once properly installed in the system, this transceiver should meet and exceed common ESD testing practices and fulfill system ESD requirements.

Typical of optical transceivers, this module’s receiver contains a highly sensitive optical detector and amplifier which may become temporarily saturated during an ESD strike. This could result in a short burst of bit errors. Such an event might require that the application re-acquire synchronization at the higher layers (e.g. Serializer/Deserializer chip).

05001604 R3 Page 15 of 16 October 2006

10G

BPS

850

NM

XFP T

RANSCEIVER

Module

4.3

E

YE

S

AFETY

The PL-XXL-SC-S45-22 is an international Class 1 laser product per IEC 60825-1 Amendment 2

(2001) and IEC 60825-2 1997. The PL-XXL-SC-S45-22 is an eye safe device when operated within the limits of this specification.

Operating this product in a manner inconsistent with intended usage and specification may result in hazardous radiation exposure.

C

AUTION

!

Tampering with this laser based product or operating this product outside the limits of this specification may be considered an act of “manufacturing,” and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (21 CFR 1040).

Published by ©Picolight Incorporated. All rights reserved.

Information in this document is provided in connection with Picolight Incorporated (“Picolight”) products. These materials are provided by Picolight as a service to its customers and may be used for informational purposes only. Picolight assumes no responsibility for errors or omissions in these materials. Picolight may make changes to pricing, specifications, and product descriptions at any time, without notice. Picolight makes no commitment to update this information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specification and product descriptions. No license, expressed or implied, to any intellectual property rights is granted by this document. Except as provided in

Picolight’s Terms and Conditions of Sale for such products, Picolight assumes no liability whatsoever.

THESE MATERIALS ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESSED OR IMPLIED, RELATING TO SALE

AND/OR USE OF PICOLIGHT PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,

CONSEQUENTIAL OR INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER

INTELLECTUAL PROPERTY RIGHT. PICOLIGHT FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE

INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. PICOLIGHT SHALL NOT BE LIABLE FOR ANY

SPECIAL, INDIRECT INCIDENTAL, OR CONSEQUENTAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST

PROFITS, WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.

Printed October 18, 2006

October 2006 Page 16 of 16 05001604 R3

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