UM100 Protocol Datasheet

UM100 Protocol Datasheet
Full Specification of IR-UWB Module UM100
This small IR-UWB module (13.4mm*13.4mm*2.60mm) can be used for RTLS (Real Time Location System), location
tracking devices or wireless network system (WPAN wireless personal area networks, Wireless connectivity …).
This module offer best in class indoor location system, with precision down to 10cm, and a range up to 880m LOS “Line
of Sight”.
It is highly flexible, and can work in standalone mode or can be controlled by an external microcontroller. A lot of
control interfaces are available (UART, I2C, SPI, USB), as well as numerous GPIOs (General Purpose In Out), and external
interfaces (UART, SPIs, I2C) to control external devices such as LEDs, Sensors, …
Application:
This module is specially designed for warehousing and logistics companies, healthcare maintenance, security and
building controls, Robotics, virtual reality and gaming, personal navigation devices, wearable sensors…
Features:
2 power supplies:
-
Vbat from 2.7V to 5.25V
Vdd_IO_MCU from 1.8V to 3.6V (IOs voltage settings to be compliant with customer baseband voltages)
Low power modes, down to 6µA with RTC (Real-Time Clock) counter enabled for module version available in Q1 2015.
Up to 10 GPIOs available if USB control is used or 7 GPIOs if SPI bus is used to control the module and one I2C bus is
used to control an external device.
Embedded application programming interfaces for firmware upgrade (Mode selection, Hardware interface selection,
external device control…)
Compact design: 13.4 x 13.4 x 2.60mm
Surface-mount device (SMD) module
Full specification 2.13 – AUGUST 2016 Page 1
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UWB advantages:
-
High data rate, up to 2Mbps
High density of devices
Low susceptibility to multipath fading
High immunity against wireless networks interferences
Secure communication
Mitigation techniques supported: LDC (Low duty cycle), DAA (Detect and Avoid), TPC (Transmit Power
Control)
Module control interface:
This module can be controlled either by:




USB (USB_DM, USB_DP)
SPI (SPI_MISO, SPI_MOSI, SPI_NSS, SPI_CLK)
I2C (I2C_SCL, I2C_SDA)
UART (or 5 pins USART: UART_Tx, UART_Rx, UART_CTS, UART_RTS, UART_CLK)
The interface selection is mainly done by software settings.
External control interface:
This module is quite flexible, and can control external devices with:




10 GPIOs
SPI (1 SPI bus, with 3 chips select)
I2C
UART (or USART, can be configured as SPI bus)
Caution! ESD sensitive device. Precaution should be used when handling the device in order to prevent
permanent damage.
Disclaimer: Specifications and data are subject to change without prior notice.
Full specification 2.13 – AUGUST 2016 Page 2
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Table of contents
Full Specification of IR-UWB Module UM100................................................................................................................................ 1
Document history..............................................................................................................................................................................7
Introduction.......................................................................................................................................................................................8
Block diagram.................................................................................................................................................................................... 8
Pin description...................................................................................................................................................................................9
Pin layout....................................................................................................................................................................................... 9
Pin definitions............................................................................................................................................................................... 9
Application proposal.......................................................................................................................................................................12
Standalone solution....................................................................................................................................................................12
External Master MCU associated:.............................................................................................................................................13
ST Debug interface:.................................................................................................................................................................... 14
USB configuration....................................................................................................................................................................... 15
Electrical characteristics.................................................................................................................................................................16
Absolute maximum rating......................................................................................................................................................... 16
General operating conditions....................................................................................................................................................16
General input/output characteristics....................................................................................................................................... 17
UWB features.................................................................................................................................................................................. 18
Frequency range:........................................................................................................................................................................ 18
Receiver sensitivity:....................................................................................................................................................................19
Transmitter performances:........................................................................................................................................................20
General physical characteristics:...............................................................................................................................................21
Current consumption profile:....................................................................................................................................................22
PSDU Frame format........................................................................................................................................................................ 23
Internal blocks.................................................................................................................................................................................24
MCU............................................................................................................................................................................................. 24
Clocks........................................................................................................................................................................................... 24
Reset............................................................................................................................................................................................ 25
Wake up.......................................................................................................................................................................................25
Interruption (IT).......................................................................................................................................................................... 25
Timers.......................................................................................................................................................................................... 25
Full specification 2.13 – AUGUST 2016 Page 3
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SPI.................................................................................................................................................................................................25
I2C................................................................................................................................................................................................ 26
USART.......................................................................................................................................................................................... 26
USB............................................................................................................................................................................................... 26
ADC...............................................................................................................................................................................................26
DAC...............................................................................................................................................................................................27
BOOT Mode.................................................................................................................................................................................27
Serial Wire debug (SWD)............................................................................................................................................................27
Lower Power Modes...................................................................................................................................................................28
Voltage regulators...................................................................................................................................................................... 28
Software modules API.................................................................................................................................................................... 29
System control commands........................................................................................................................................................ 30
Radio control commands........................................................................................................................................................... 31
Sequencer control commands...................................................................................................................................................32
Protocol control commands...................................................................................................................................................... 33
SPI command diagram................................................................................................................................................................34
Product Outline...............................................................................................................................................................................35
Land Pattern recommendation..................................................................................................................................................... 36
Soldering proposal.......................................................................................................................................................................... 37
Packaging information....................................................................................................................................................................38
Product Marking......................................................................................................................................................................... 38
Product Package......................................................................................................................................................................... 38
Storage and Use control.................................................................................................................................................................39
Applicable standards...................................................................................................................................................................... 40
Contacts........................................................................................................................................................................................... 41
Full specification 2.13 – AUGUST 2016 Page 4
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List of Figures
Figure 1 Block diagram of UM100..........................................................................................................................................8
Figure 2 Pin layout................................................................................................................................................................... 9
Figure 3 Pin connections for standalone solution.............................................................................................................. 12
Figure 4 Pin connections to an external host MCU............................................................................................................13
Figure 5 Pin connections for ST debug interface................................................................................................................14
Figure 6 Pin connections for USB configuration.................................................................................................................15
Figure 7 PSDU frame format.................................................................................................................................................23
Figure 8 SPI command diagram............................................................................................................................................34
Figure 9 Product outline....................................................................................................................................................... 35
Figure 10 Land pattern recommendation........................................................................................................................... 36
Figure 11 Soldering profile proposal....................................................................................................................................37
Figure 12 Product Marking................................................................................................................................................... 38
Figure 13 Product Package................................................................................................................................................... 38
Full specification 2.13 – AUGUST 2016 Page 5
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List of Tables
Table 1 Document history. (1) Firmware version 2.0, 2.1.0, 2.2.0 do not exist due to Version alignment....................7
Table 2 Pin definition............................................................................................................................................................ 11
Table 3 Absolute maximum rating.......................................................................................................................................16
Table 4 General operating conditions................................................................................................................................. 16
Table 5 General input characteristics.................................................................................................................................. 17
Table 6 General output characteristics............................................................................................................................... 17
Table 7 Frequency range.......................................................................................................................................................18
Table 8 Receiver sensitivity.................................................................................................................................................. 19
Table 9 Transmitter performances...................................................................................................................................... 20
Table 10 General physical characteristics........................................................................................................................... 21
Table 11 Current consumption profile................................................................................................................................ 22
Table 12 32KHz clock parameters........................................................................................................................................24
Table 13 26MHz clock parameters...................................................................................................................................... 24
Table 14 ADC parameters..................................................................................................................................................... 26
Table 15 DAC parameters..................................................................................................................................................... 27
Table 16 UWB radio power modes..................................................................................................................................... 28
Table 17 Categories of module commands.........................................................................................................................29
Table 18 System control commands....................................................................................................................................30
Table 19 Radio control commands...................................................................................................................................... 31
Table 20 Sequencer control commands..............................................................................................................................32
Table 21 Protocol control commands................................................................................................................................. 33
Full specification 2.13 – AUGUST 2016 Page 6
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Document history
Revision
2.1
Date
05/10/2014
2.2
15/01/2015
2.3
22/01/2015
2.4
02/02/2015
2.5
19/02/2015
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
23/03/2015
13/04/2015
17/06/2015
28/08/2015
04/11/2015
02/01/2016
06/06/2016
30/08/2016
Software Compatibility
First customers release
Firmware version 0.2
Firmware version 1.0
Updated Datasheet with
erratum 20150109
Firmware version 1.1
Updated Datasheet with
erratum 20150122
Firmware version 1.2
Updated Datasheet with
erratum 20150202
Firmware version 1.3 and
1.4
Firmware version 1.3 and
1.4
Firmware version 1.5
Firmware version 1.6
Firmware version 1.7
Firmware version 1.8
Firmware version 1.9
Firmware version 2.2.1(1)
Firmware version 2.3.0(2)
Firmware version 2.4.x
Table 1 Document history.
(1) Firmware version 2.0, 2.1.0, 2.2.0 do not exist due to Version alignment.
(2) Firmware version 2.3.0 is an Internal version
Full specification 2.13 – AUGUST 2016 Page 7
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Introduction
UPosition is a professional solution provider for indoor & outdoor location systems. We provide our customers
hardware devices, back-end customized solutions and also consultant service regarding location-based applications (for
more information, please visit www.uposition.com). Collaborating closely with BeSpoon, a fabless semiconductor
company (for more information, please visit www.bespoon.com ), we unveil the first ultra-small IR-UWB module UM100
for high-precision indoor location purposes based on BeSpoon chip.
UM100 module offers best in class indoor location solution in term of precision (down to 10cm), ranging (up to 880m
Line of Sight) and receiver sensitivity (down to -118dBm). Customers can quickly integrate this module in their hardware
without any knowledge of radio communication. Several source codes are provided to allow customers to write their
own application, and start measuring distances between two or more devices.
Block diagram
Module
Enable
Vdd_IO_MCU voltage
Settings
Module Control
interface
Vbat
regulator
Always ON
Level
shifter
MCU
STM32F072
regulator
Ext. Ref.
Voltage (2v5)
IR-UWB
chip
Antenna
32KHz
XTAL
26MHz
VCTCXO
2v5 GPIOs & External
devices control interface
Figure 1 Block diagram of UM100
PLEASE NOTE: The voltage VDD_IO_MCU must be supplied to enable SPI interface and all signals supplied by this voltage
(please check pin definition section).
Full specification 2.13 – AUGUST 2016 Page 8
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Pin description
Pin layout
Figure 2 Pin layout
Pin definitions
Pin Pin Name
#
(function after
reset)
Alternate
functions (soft
setting)
In / Out
VIO_ ref.
Supply /
GND(1)
Description of Main
function
Internal
level
shifter
Yes
1
GND
GND
GND
2
MCU_WAKEUP
In
VDD_IO_MCU
Ext. Pin to wake up the
module MCU
3
USART2_TX
ADC or SPI slave
MISO,
GPIO_G1IO3
Out
VDD_2v5(3)
For trace.
4
USART2_RX
ADC or SPI slave
MOSI,
GPIO_G1IO4
In
VDD_2v5(3)
For trace.
Full specification 2.13 – AUGUST 2016 Page 9
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5
DAC1
ADC, SPI slave CLK,
GPIO_G2IO1
6
MCU_MODULE_IT GPIO_G4IO2
Out
VDD_2v5(3)
Out
VDD_IO_MCU(2
)
7
8
MCU_USB_DM
MCU_USB_DP
USART1_CTS,
GPIO_G4IO3
In/Out
USART1_RTS,
GPIO_G4IO4
In/Out
VDD_IO_MCU(2
)
VDD_IO_MCU(2
)
9
GND
GND
GND
10
MCU_SWDIO
In/Out
VDD_IO_MCU(2
)
11
MCU_SWCLK
In
VDD_IO_MCU(2
)
12
MCU_SPI1_NSS
In
VDD_IO_MCU(2
)
13
GPIO_G3IO4
SPI2_ NSS
Out
VDD_2v5(3)
14
MCU_SPI1_CLK
GPIO_G5IO1
In
VDD_IO_MCU(2
)
15
MCU_SPI1_MISO
GPIO_G5IO2
Out
VDD_IO_MCU(2
)
16
MCU_SPI1_MOSI
Wake up 6
In
VDD_IO_MCU(2
)
17
GND
18
MCU_USART1_TX
19
20
MCU_USART1_RX
I2C2_SCL
GND
GND
I2C1_SCL,
GPIO_G5IO3
Out
VDD_IO_MCU(2
I2C1_SDA,
GPIO_G5IO4
In
USART3_TX, SPI2_
MOSI
Out
Debug, Programming
interface IO
Debug, Programming
interface clock
SPI slave bus to control
the module
Yes
SPI slave bus to control
the module
Yes
SPI slave bus to control
the module
Yes
SPI slave bus to control
the module
Yes
Yes
)
VDD_IO_MCU(2
)
Full specification 2.13 – AUGUST 2016 Page 10
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Pin to wake up ext.
MCU that controls the
module
VDD_2v5(2)
Yes
21
I2C2_SDA
In
VDD_2v5(2)
22
GPIO_G6IO2
Out
VDD_2v5(2)
23
MCU_NRST
In
VDD_IO_MCU
24
VDD_IO_MCU
In
1.8 to
VBAT_MODULE
25
GND
GND
GND
26
VBAT_MODULE
3 to 4.2V
27
ENABLE
1.8 to
VBAT_MODULE
28
VDD_2v5
Out
29
GND RF
GND
30
ANTENNA
31
GND RF
GND
GND
32
BOOTMODE
In
VDD_2v5(3)
(1)
(2)
(3)
USART3_RX, SPI2_
MISO,
GPIO_G6IO1
UART3_CLK, SPI2_
CLK
Internal reference
voltage
GND
RF Path
For the main function after reset
5 V tolerant. For more details specification, please refer to STM32F072 datasheet
3.3V tolerant
Table 2 Pin definition
Full specification 2.13 – AUGUST 2016 Page 11
Embedded
Yes
Antenna pads
Application proposal
Standalone solution
In this configuration, the module can act as a standalone tag, replying to master request.
A short circuit is required between pin # 32 (BOOTMODE) and pin # 1(GND), connect the battery on pin # 26
(VBAT_MODULE) and on pin #27 (ENABLE), pin # 30 (ANTENNA) should be connected to the external antenna..
Figure 3 Pin connections for standalone solution
Full specification 2.13 – AUGUST 2016 Page 12
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External Master MCU associated:
In this configuration, an external Master MCU can control the module with a dedicated power domain (VDD_IO_MCU).
Make sure that the right voltage of the host interface is provided at pin #24 (VDD_IO_MCU).
The Master MCU can control the UM100 module with several interfaces : UART, I2C or SPI with a power domain
reference at 2.5V. Pin # 32 (BOOTMODE) is connected to GND to start module boot sequence from embedded code in
Flash, otherwise if the MCU needs to re-program flash memory this pin must be set to high voltage at start up.
PLEASE NOTE: the module by default is in sleep mode (Low power mode). To be able to communicate/program the
module you must first either wake up it via the SPI bus (review paragraph: SPI command diagram), or make sure pin # 2
(MCU_WAKEUP) is LOW: MCU is active and it prevent from sleeping when doing protocol.
Figure 4 Pin connections to an external host MCU
Full specification 2.13 – AUGUST 2016 Page 13
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ST Debug interface:
In this configuration, with ST debugger/programmer ST Linkv2 interface, you can flash the module, run the code, do step
by step instruction, add break point, review register values…
To control the module via ST Link, nRST must be held at low level at start up (Mode connect under reset)
Figure 5 Pin connections for ST debug interface
Full specification 2.13 – AUGUST 2016 Page 14
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USB configuration
In this configuration, the module is used in USB mode. An external regulator is required as the STM32 require a 3V
minimum voltage to be USB compliant.
Figure 6 Pin connections for USB configuration
Full specification 2.13 – AUGUST 2016 Page 15
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Electrical characteristics
Absolute maximum rating
Voltages and temperatures out of those values may cause permanent damage to the module.
Symbol
Parameter
VBatt.
Supply voltage
V DD_IO_MCU
Supply voltage
All IOs
Input / ouput all
digital IOs
Comments
Min.
Max.
Unit
-0.3
5.25
V
Must not be supplied if Vbatt.is
not present
-0.3
4
V
On 5V tolerant pins(1)
-0.3
5.5
V
All others pins
-0.3
4
V
Ts
Storage
temperature
-40
+85
°C
To
Operating
temperature
-10
+60
°C
Max.
Unit
4.2
V
3.6
V
(1)
5 V tolerant. For more details specification, please refer to STM32F072 datasheet
Table 3 Absolute maximum rating
General operating conditions
Symbol
Parameter
VBatt.
Supply voltage input
Comments
Min.
Typ.
2.7
VDD_IO_MCU Supply voltage input
Must not be supplied if Vbatt.is
not present
1.65
All IOs
On 5V tolerant pins(1)
-0.3
5.5
V
All others pins
-0.3
VIO_ ref.
+0.3
V
2.52
V
Input / output all
digital IOs
Vdd_2v5
(1)
Supply voltage output
2.48
1.8
2.5
5 V tolerant. For more details specification, please refer to STM32F072 datasheet
Table 4 General operating conditions
Full specification 2.13 – AUGUST 2016 Page 16
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General input/output characteristics
Symbol Parameter
Comments
VIL
5V tolerant inputs (no
Low level input voltage
VIL
Min.
Max.
Unit
V
level shifter)
0.475* VIO_ ref.
- 0.2
Vdd_IO_MCU pins (with
0.35* VIO_ ref.
V
level shifter)
VIL
Boot0
0.3* VIO_ ref. 0.3
V
VIL
Pin # 3, 4&5
0.3* VIO_ ref. +
0.07
V
VIH
High level input voltage
5V tolerant inputs (no
0.5* VIO_ ref. + 0.2
V
0.65* VIO_ ref.
V
level shifter)
VIH
5V tolerant inputs (with
level shifter)
VIH
Boot0
0.2* VIO_ ref. + 0.95
V
VIH
Pin # 3, 4&5
0.445* VIO_ ref. - 0.398
V
See STM32F072 datasheet
+/-0.1
Ilkg
Input leakage current
10
A
Max.
Unit
0.4
V
Table 5 General input characteristics
Symbol Parameter
Comments
VOL
Output Low level voltage
All pins
VOH
Output High level voltage
All pins
Iodc
Output drive current for pin
with VIO_ ref. = VDD_2v5
Iodc
Output drive current for pin
with VIO_ ref. =
VDD_IO_MCU
Min.
VIO_ ref. – 0.4
2
Level shifter pins limitation
25
Table 6 General output characteristics
Full specification 2.13 – AUGUST 2016 Page 17
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V
8
mA
A
UWB features
Frequency range:
The module supports the frequency band from 3 to 5GHz. All frequencies are provided by an internal PLL using as a
standard reference clock VCTCXO @ 26MHz.
Symbol
Parameter
CH1
Channel 1
BW1
Freq. bandwidth of
channel 1
CH2
Channel 2
BW2
Freq. bandwidth of
channel 2
CH3
Comments
Min.
Typ.
Max.
Unit
3494.4
MHz
500
MHz
3993.6
MHz
@ -10dB
500
MHz
Channel 3
Filtering required on
antenna side at 4.8GHz
4492.8
MHz
BW3
Freq. bandwidth of
channel 3
@ -10dB
500
MHz
CH4
Channel 4
3993.6
MHz
BW4
Freq. bandwidth of
channel 4
1000
MHz
@ -10dB
@ -10dB
Table 7 Frequency range
Full specification 2.13 – AUGUST 2016 Page 18
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Receiver sensitivity:
Measured at the antenna input pin with preamble of 512 symbols and data rate of 110kbps.
Symbol
Parameter
Comments
Min.
S2_optimum
CH2 (3993.6MHz), BW
= 500MHz
PER 20%, 4Bytes
-113
dBm
S1
CH1 (3494.4MHz), BW
= 500MHz
PER 1%, 20Bytes
-110
dBm
S2
CH2 (3993.6MHz), BW
= 500MHz
PER 1%, 20Bytes
-110
dBm
S3
CH3 (4492.8MHz), BW
= 500MHz
PER 1%, 20Bytes
-110
dBm
S4
CH4 (3494.4MHz), BW
= 1000MHz
PER 1%, 20Bytes
-108
dBm
S2
CH2 (3993.6MHz), BW
= 500MHz
PER 20%, 4bytes, 15
to 2Kbps
-118
Table 8 Receiver sensitivity
Full specification 2.13 – AUGUST 2016 Page 19
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Typ.
Max.
-116.5
Unit
dBm
Transmitter performances:
Measured at the antenna output pin with preamble of 512 symbols and data rate of 110kbps.
Symbol
Parameter
Comments
Txpeak
BW = 500MHz
Txrms
Typ.
Max.
Unit
Max. output Power
in 50MHz BW
-8.5
-8
dBm
BW = 500MHz
Max. Mean Power
-41.3
-36
dBm/MHz
Txpeak
BW = 1000MHz
Max. output Power
in 50MHz BW
-11.5
-11
dBm
Txrms
BW = 1000MHz
Max. Mean Power
-41.3
-40
dBm/MHz
0
4
dB
Tx Step
Power range from 41.3dBm/MHz
reference
Min.
-12
Tpulse
Pulse duration
0,7
3
ns
BW
Pulse Freq. Bandwidth
450
1500
MHz
Table 9 Transmitter performances
Full specification 2.13 – AUGUST 2016 Page 20
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General physical characteristics:
UWB radio physical controller is optimized for ranging, and not data throughput.
Symbol
Parameter
PRF
Pulse Repetition
Frequency
Symb.
Symbol Code length
Preamble
Preamble Length
53
Symb.
SFD
Start Frame Delimiter
Length
16
Symb.
PHR(1)
PHY Header
0
PSDU(1)
PHY Service Data Unit
0
Mod.
Modulation Type
(1)
(2)
Comments
Min.
Typ.
15.6
PRP = 1/PRF
7(2)
127
0
DBPSK
PHR & PSDU are flexible. Internal CRC and/or FEC optimized for short packet data size can be enabled.
Allow data rate up to 2Mbps
Table 10 General physical characteristics
Full specification 2.13 – AUGUST 2016 Page 21
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Max.
Unit
MHz
127
PRP
16
Symb.
127
Bytes
Current consumption profile:
All data provided are computed data, final data and current profile will be provided later on.
Power Mode
PM_3
PM_2
PM_2
PM_0
STDBY
TX_IDLE
TX_ON
RX_IDLE
RX_ON
UWB chip mode
OFF
Sleep – RTC
ON
Sleep –RTC
ON
Init
Standby
Tx Idle
Tx
Rx Idle
Rx
MCU mode
OFF
Standby
Stop
Run & sleep
mode
Run &
sleep mode
Run &
sleep mode
Run &
sleep mode
Run &
sleep mode
Run &
sleep mode
Description
The module is
in OFF state (no
supply or
enable pin # 27
= 0V)
UWB chip:
32KHz running
& counting
next event.
MCU : No RAM
retention, only
20Bytes are
kept alive.
UWB chip: 32KHz
running &
counting next
event. MCU: .
RAM retention
and regulator low
power mode
UWB chip: running
with 26MHz Clock,
all internal
regulator ON.
MCU: in run or
sleep mode,
depends on the
required activity.
UWB chip:
running with
26MHz and
counting with
his most
accurate
reference
clock.
UWB chip:
ready to
transmit.
UWB chip:
transmitting
UWB chip:
ready to
receive.
UWB chip:
receiving
UWB Current
consumption(2)
<100nA
4uA
4uA
3,9mA
10mA
12,7mA
13,6mA
95mA
120mA(1
UWB Current
172µA
)
172µA
172µA
3,9mA
12,8mA
14,7mA
16,6mA
102mA
130mA(1)
2µA
5µA
When MCU active current 18,5mA – for ranging activity is around 7,8ms max.
40ms from
OFF state
40ms from
OFF state
3.5ms from
MCU ON or
OFF
Reset or
MCU
watchdog
timer
IRq from
UWB chip or
SPI, UART,
MCU_wake
up pin or
MCU counter
consumption(3)
MCU Current
consumption
Duration to
reach power
mode state(4)
MCU wake up
condition
(1)
(2)
(3)
(4)
Supply
provided
and enable
pin
activated
500µs from
INIT
200µs from
Standby
Average duration between preamble synchronization and PSDU demodulation (50% of time for each state).
Total current consumption for Module of next release, current consumption due to MCU activity is not included.
Total current consumption of 1st Module release, current consumption due to MCU activity is not included.
Indicative values, performances can be improved with final design.
Table 11 Current consumption profile
Full specification 2.13 – AUGUST 2016 Page 22
Embedded
Automatic
or <200µs
from TxIdle
500µs from
standby
Automatic
or <200µs
from RxIdle
PSDU Frame format
The packet size PSDU can be defined in different ways: using a PHR or not with the help of register
programming.
Figure 7 PSDU frame format
1) Fixed packet length:
In this case no PHR is use (PHR = 0), the size of the packet is defined by one module command: set_data_size
Min PSDU size: 0 bits max size 1024 bits
2) Variable packet length (current) :
The first byte after the synch word gives the length of the Payload in bytes.
PHR = 8: Min PSDU Size: 0 byte, max size: 127 Bytes (no CRC), 125 Bytes with CRC.
PHR = 16: Min PSDU size: 0 byte, Max size 126 Bytes (no CRC), 124 Bytes with CRC
3) CRC
A CRC can be added separately on PHR and/or PSDU. The size can be either 12 or 16bits.
4) FEC (Forward Error Correction)
A FEC can be enabled on PHR + PSDU.
The FEC uses a Golay channel encoder adding 12bits for 12bits of data preventing frame loss due to fading /
transmission errors.
Full specification 2.13 – AUGUST 2016 Page 23
Embedded
Internal blocks
MCU
The MCU is a STM32F072 from ST, with ARM® Core 32-bit Cortex™-M0 CPU.
The MCU can be clocked at a frequency up to 48 MHz, with 128KB of embedded flash memory and 16KB of SRAM.
Clocks
It is important to understand that the module includes several internal clocks. Some from the MCU itself with frequency
clocks from 40 KHz up to 48MHz. Two clocks are required by the UWB chip: one at 32KHz Xtal and one at 26MHz
VCTCXO.
The 32KHz is a low power clock, which is always enabled. It allows the UWB chip to count for the next event to occurs,
and will wake up automatically the MCU and the 26MHz. The 26MHz is used during Tx and Rx, and to accurately
measure the elapsed time between two events when it is needed (In case of a 2 way or 3 way ranging for example).
32KHz and 26MHz clocks can be adjusted internally:
For the 32KHz:
Symbol
Parameter
Min
Freq.
Default frequency
Range
Minimum frequency offset
range
-40
Step
Programming step
1
Typ.
Max.
32768
3
Unit
Hz
+100
ppm
10
ppm/LSB
Table 12 32KHz clock parameters
Frequency adjustment of 32KHz clock is explained in paragraph: SYS_SET_CAPATUNE_VAL
For the 26MHz:
Symbol
Parameter
Freq.
Default frequency
Range
Minimum Frequency offset
range
Step
Programming step
Min
Typ.
Max.
26
-6
MHz
+6
0,004
Unit
ppm
ppm/LSB
Table 13 26MHz clock parameters
Frequency adjustment of 26MHz clock is explained in paragraph: SYS_SET_DAC_VAL
Full specification 2.13 – AUGUST 2016 Page 24
Embedded
Reset
The NRST pin includes a permanent pull-up resistor, RPU of 4,7Kohms typical
To reset the module hold the voltage low for at least 500ns.
Wake up
When the microcontroller is in stop mode (Low power mode), it can be woken up with an internal interrupt from UWB
chip to MCU, or with the external pin #2 (MCU_WAKEUP):


MCU_WAKEUP pin LOW: MCU is active and it prevent from sleeping when doing protocol
MCU_WAKEUP pin High : MCU is put in stop mode or will be able to go in stop in protocol mode when doing
ranging
Interruption (IT)
The Module has a dedicated hardware pin to wake up or request events from external MCU controlling the module.
The internal MCU also handle UWB chip ITs which are generated on following events:
Rx completed
Rx preamble time out
Rx SFD time out
Tx completed
TS-Delay …
Timers
The STM32 includes 8 timers of 16bits, and one timer of 32bits. For further information, please have a look at
STM32F072 datasheet.
The UWB chip also includes a way to program events at dedicated time. This programming is done by counting events
with numbers of 32KHz period and/or with numbers of 26MHz period and sub-26MHz period down to 125ps.
SPI
Two SPI Buses are available, one to control the module and one to program external devices, several GPIOs and
SPI2_emul_NSS can be used to select specific devices.
SPI bus can run up to 18Mbps.
Full specification 2.13 – AUGUST 2016 Page 25
Embedded
I2C
The I2C bus can run in three modes:
Standard with a frequency up to 100KHz
Fast mode with a frequency up to 400KHz
Fast mode+ with a frequency up to 1MHz
USART
3 UART buses can be available, depending on the configuration used.
USB
To be compliant with USB 2.0, the USB ports require a Vdd_IO_MCU voltage between 3 to 3.6V.²
ADC
One 12-bit analog to digital converter is used to measure the internal:
Temperature sensor
Reference voltage of the MCU
Module supply voltage
Pin # 3 to 5 can be used for this purpose.
Symbol
Parameter
VDD
Analog supply voltage
Min
IDD(ADC)
Typ.
Max.
Unit
2.5
V
0.9
mA
F(ADC)
Sampling rate
0.05
1
MHz
VADC
Conversion voltage range
0
2.5
V
RIN
External input impedance
50
KOhms
Table 14 ADC parameters
Full specification 2.13 – AUGUST 2016 Page 26
Embedded
DAC
One 12-bit buffered DAC channel is used to convert digital signals into analog voltage signal outputs on pin # 5.
Symbol
Parameter
Vdd
Analog supply voltage
RLOAD
CLOAD
Buffer ON
Min
Typ.
Max.
2.5
Unit
V
5
Kohms
Buffer OFF
15
Kohms
Capacitive load
50
pF
2.3
V
DAC Range
0.2
Table 15 DAC parameters
BOOT Mode
There are 2 boot modes which are selected by the boot mode pin level during start up time:
- Boot from MCU internal memory: pin #32 (BOOTMODE) must be kept in low voltage mode (The bootloader is
embedded in the system memory.)
- reprogram the module: pin #32 (BOOTMODE) must be kept at high level during start up time.
You can reprogram the module on following interfaces:
USART2: Pin # 3 & 4
I2C1: Pin # 18 & 19
USB: Pin # 7 & 8 with DFU (Device Firmware Upgrade) interface.
Serial Wire debug (SWD)
An ARM SW-DP interface is provided to allow a serial wire debugging tool to be connected to the MCU.
Use Pin # 10 & 11.
Full specification 2.13 – AUGUST 2016 Page 27
Embedded
Lower Power Modes
Several low power modes are available for the UWB radio:
Mode
OFF
description
No Power Supply provided to the module.
PM_3
UWB chip initialized, memory retention
PM_2
UWB chip uses low power 32KHz Xtal clock, and potentially counting
next event to do
PM_0
UWB regulator ON, 26MHz ON
PM_STDBY
UWB running with precise 26MHz clock
PM_RX_IDLE
UWB ready to perform Rx
PM_TX_IDLE
UWB ready to perform Tx
PM_TXRX_IDLE
UWB ready to perform either Tx or Rx
Table 16 UWB radio power modes
Voltage regulators
The module includes two internal regulators at 2.5V. These regulators are used to provide power supplies to the
embedded MCU and the IR-UWB chip.
The module also provides an output voltage from the main regulator. Voltage is at 2.5V when module enable is set to
High level.
Full specification 2.13 – AUGUST 2016 Page 28
Embedded
Software modules API
Module can embed software that will provide different kind of operations:
1) GENERIC software, provided by BeSpoon.
Such software allows direct access to UWB chip solution:
- UWB chip initialization
- Configuration of symbol length, channel, setting the scheduler
- Data to send
- Action to do: Tx, Rx, No Action
- Received Data & TOA (Time of Arrival) timing
- Error management info
Generic software user can then manage their software sequence.
As a matter of fact, they must then create and develop their own UWB layer.
2) Software with BeSpoon Protocol.
This software embeds a full abstraction of UWB chip.
It allows access to BeSpoon Protocol:
- BeSpoon protocol initialization
- Configuration of slots, device mode
- Getting distances, Data & TOA (Time of Arrival)
Using such software with the module allows fast time to market as it can be integrated easily in a complete RTLS
system.
Such software is Available under specific license with BeSpoon
Both GENERIC and PROTOCOL firmware can be accessed and controlled by external Master MCU through a set of SPI
commands:
Commands are grouped in four categories:
Type of command
Description
Module firmware
required
System control
Global module configuration and status
GENERIC / PROTOCOL
Radio control
UWB Radio control
GENERIC / PROTOCOL
Sequencer control
UWB Sequencer control
Protocol control
BeSpoon protocol control
Table 17 Categories of module commands
Refer to UM100 Reference Manual for more details on APIs.
Full specification 2.13 – AUGUST 2016 Page 29
Embedded
GENERIC
PROTOCOL
System control commands
Command name
Description
SYS_GET_INFO
Get info on module
SYS_SET_MCU_STATE
Put MCU under a pm state
SYS_GET_DAC_VAL
Get DAC value
SYS_SET_DAC_VAL
Set new DAC value
SYS_GET_CAPATUNE_VAL
Get current Capa-tune val for 32Khz oscillator
SYS_SET_CAPATUNE_VAL
Set new Capa-tune to tune 32Khz oscillator
SYS_GET_RXFRAME_CFG
Get the RX frame format sent to host MCU
SYS_SET_RXFRAME_CFG
Set the RX frame format sent to host MCU
SYS_GET_STATUS_MSK
Get event mask value
SYS_SET_STATUS_MSK
Set new event mask
SYS_GET_STATUS
Get current module status
Table 18 System control commands
Full specification 2.13 – AUGUST 2016 Page 30
Embedded
Radio control commands
Command name
Description
RADIO_INIT
Reset and initialize UWB radio
RADIO_SPI_READ
Read single or burst of radio register
RADIO_SPI_WRITE
Read single or burst of radio register
RADIO_GET_PM_STATE
Get current radio state
RADIO_SET_PM_STATE
Set new radio state
RADIO_GET_PHY_CFG
Get current radio settings
RADIO_SET_PHY_CFG
Set new radio settings
RADIO_GET_RX_CFG
Get current module RX configuration.
This API are not available with software embedding BeSpoon Protocol, as it is not necessary.
RADIO_SET_RX_CFG
Set new module RX configuration.
This API are not available with software embedding BeSpoon Protocol, as it is not necessary.
RADIO_CLR_RNG_TIMER
Reset module ranging timer
This API are not available with software embedding BeSpoon Protocol, as it is not necessary.
RADIO_WRITE_TX_DATA
Write data to TX FIFO.
This API are not available with software embedding BeSpoon Protocol, as it is not necessary.
RADIO_READ_RX_DATA
Get RX_DATA.
This API are not available with software embedding BeSpoon Protocol, as it is not necessary.
RADIO_PHY_CTRL
Start/Stop a TX and/or -a RX.
This API are not available with software embedding BeSpoon Protocol, as it is not necessary.
Table 19 Radio control commands
Full specification 2.13 – AUGUST 2016 Page 31
Embedded
Sequencer control commands
In this module some events such as Tx, Rx, NO ACTION can be launched automatically thanks to a timer sequencer
embedded in UWB chip. This timer used the 32KHz Xtal and/or 26MHz + 32KHz from 26MHz (~26MHZ/794) clocks,
which allow the user to perform actions at with very precise timing down to 125ps.
These APIs are not available with software embedding BeSpoon Protocol.
Command name
Description
SEQ_INIT
Initialize sequencer
SEQ_GET_CFG
Get global sequencer configuration
SEQ_SET_CFG
Set global sequencer configuration
SEQ_QUEUE_SINGLE_ACT
Enqueue single action to be performed by sequencer
SEQ_CTRL
Start/Stop sequencer
Table 20 Sequencer control commands
Full specification 2.13 – AUGUST 2016 Page 32
Embedded
Protocol control commands
With Protocol firmware, more abstracted commands are available, to ease system development.
This are available only under specific license with BeSpoon.
Command name
Description
PROT_INIT
Initialize BeSpoon Protocol
PROT_SET_CAPS
Set current BeSpoon protocol capabilities and device type.
PROT_GET_CAPS
Get current BeSpoon protocol capabilities and device type.
PROT_SET_SFRAME_SCH
Set BeSpoon protocol Superframe info. It’s the timing configuration shema
PROT_GET_SFRAME_SCH
Get current BeSpoon protocol Superframe info.
PROT_GET_STATS
Get BeSpoon protocol statistics.
PROT_RESET_STATS
Reset BeSpoon protocol statistics.
PROT_GET_ARTLS_PKT
Get ARTLS command from BeSpoon protocol while its running (Live control and information).
PROT_SET_ARTLS_PKT
Send new ARTLS command to BeSpoon protocol while its running (Live control).
PROT_GET_RANGING_PKT
Get Ranging data (configurable)
PROT_CTRL
Start / Stop BeSpoon Protocol. Allow to get status of BeSpoon Protocol
Table 21 Protocol control commands
Full specification 2.13 – AUGUST 2016 Page 33
Embedded
SPI command diagram
Default module control interface is SPI1. This interface is configured as standard 4-pins SPI, MODE 0: CPOL=0, CPHA=0
(sampling on rising edge of SPI clock). SPI word size is a byte, MSB sent first. SPI clock maximum frequency is 16MHz.
Figure 8 SPI command diagram
In case the module is programmed to enter in deep sleep mode, host must be sure that time between NSS and first
clock is at least 80µseconds to let the module wake-up before sampling SPI data.
To avoid this delay, it is possible to force the MCU to stay in awaken state (see SYS_SET_MCU_STATE), or to use pin #2
(MCU_WAKEUP) (Set MCU_WAKEUP pin to low).
Full specification 2.13 – AUGUST 2016 Page 34
Embedded
Product Outline
The pinout is always seen from the Top, the Land Pattern recommendation show the real requirement for you own PCB.
Figure 9 Product outline
Full specification 2.13 – AUGUST 2016 Page 35
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Land Pattern recommendation
All dimensions in mm
Figure 10 Land pattern recommendation
Full specification 2.13 – AUGUST 2016 Page 36
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Soldering proposal
This section need to be reviewed carefuly. For the time being it is a recommended / wished profile
Figure 11 Soldering profile proposal
Caution:
1) When opening the stencil of the mainboard where the module sits on, the hole of bonding pad of module
should be expanded outward 0.7 mm. The thickness of the solder paste should be no more than 0.12 mm.
2) Operators should wear gloves and anti-static ring during accessing the modules.
Full specification 2.13 – AUGUST 2016 Page 37
Embedded
Packaging information
Product Marking
Figure 12 Product Marking
A label is stuck on the shielding of each UM100 module. The 2-dimensional code on the label includes all necessary
information of the module, such as hardware version, MAC address, production serial number and production data.
Product Package
1. The unit of the tray size in above picture is millimeter.
2. The tolerance of the length and width of the tray is ±1 mm.
3. Material: 0.6mm thickness black Polystyrene with antistatic finish (anti-static index: 103~108Ω)
Figure 13 Product Package
Full specification 2.13 – AUGUST 2016 Page 38
Embedded
Storage and Use control
1. The storage life of modules in tray with the vacuum packing:
Shelf life: 12 months;
Storage conditions: Temperature should be -40 °C ~85 °C. Relative humidity: < 90% R.H.
2. The module`s vacuum packing once opened, time limit of the assembly:
1) Check the humidity card, the display value should be less than 30% (blue), such as: 30% ~ 40% (pink), or greater
than 40% (red), which means module has moisture absorption.
2) Factory environmental temperature should be controlled ≦ 30% °C and humidity should be controlled ≦ 60% R.H.
3) Once the vacuum packing opened, save life will be 168 hours.
3. Once the vacuum packing opened and not used up within 168 hours:
1) The module must be bake again in order to remove moisture absorption.
2) The baking temperature should be 125 °C, 8 hours.
3) Put the desiccant and seal packages after baking.
Full specification 2.13 – AUGUST 2016 Page 39
Embedded
Applicable standards
US FCC Part 15
EU ECC/ETSI
Full specification 2.13 – AUGUST 2016 Page 40
Embedded
Contacts
Please contact us at sales@uposition.com for any support you wish from us.
Full specification 2.13 – AUGUST 2016 Page 41
Embedded
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