Samsung 1GB, DDR III SDRAM, 1066MHz, CL7, 2GB, DDR III SDRAM, 1066MHz, CL7, 1GB, DDR III SDRAM, 1333MHz, CL9, 2GB, DDR III SDRAM, 1333MHz, CL9 User guide

Samsung 1GB, DDR III SDRAM, 1066MHz, CL7, 2GB, DDR III SDRAM, 1066MHz, CL7, 1GB, DDR III SDRAM, 1333MHz, CL9, 2GB, DDR III SDRAM, 1333MHz, CL9 User guide
General Information
DDR3 SDRAM
DDR3 SDRAM Product Guide
December 2008
Memory Division
December 2008
General Information
DDR3 SDRAM
1. DDR3 SDRAM Component Ordering Information
1
2
3
4
5
6
7
8
9
10
11
K 4 B X X X X X X X - X X X X
Speed
SAMSUNG Memory
DRAM
Temp & Power
DRAM Type
Package Type
Density
Revision
Interface (VDD, VDDQ)
Bit Organization
# of Internal Banks
1. SAMSUNG Memory : K
7. Interface ( VDD, VDDQ)
6 : SSTL (1.5V, 1.5V)
2. DRAM : 4
8. Revision
3. DRAM Type
B : DDR3 SDRAM
4. Density
51 : 512Mb
1G :
1Gb
2G :
2Gb
4G :
4Gb
M
A
B
C
D
E
F
G
H
: 1st Gen.
: 2nd Gen.
: 3rd Gen.
: 4th Gen.
: 5th Gen.
: 6th Gen.
: 7th Gen
: 8th Gen
: 9th Gen
9. Package Type
5. Bit Organization
04 : x 4
08 : x 8
16 : x16
Z
H
J
M
:
:
:
:
FBGA (Lead-free)
FBGA (Halogen-free & Lead-free)
FBGA (Lead-free, DDP)
FBGA (Halogen-free & Lead-free, DDP)
10. Temp & Power
C : Commercial Temp.( 0°C ~ 85°C) & Normal Power
L : Commercial Temp.( 0°C ~ 85°C) & Low Power
Y : Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
6. # of Internal Banks
3 : 4 Banks
4 : 8 Banks
5 : 16 Banks
11. Speed
F7 : DDR3-800
F8 : DDR3-1066
H9 : DDR3-1333
K0 : DDR3-1600
(400MHz @ CL=6, tRCD=6, tRP=6)
(533MHz @ CL=7, tRCD=7, tRP=7)
(667MHz @ CL=9, tRCD=9, tRP=9)
(800MHz @ CL=11, tRCD=11, tRP=11)
December 2008
General Information
DDR3 SDRAM
2. DDR3 SDRAM Component Product Guide
Density
1Gb D-die
Banks
8Banks
Org.
PKG
K4B1G0446D
Part Number
HC(L)F7/F8/H9
256M x 4
K4B1G0846D
HC(L)F7/F8/H9
128M x 8
78 + 4 ball
FBGA
K4B1G1646D
1Gb E-die
2Gb B-die
DDP 2Gb D-die
DDP 2Gb E-die
DDP 4Gb B-die
8Banks
8Banks
Package & Power, Temp. (-C/-L) & Speed
HC(L)F7/F8/H9
64M x 16
K4B1G0446E
HC(L)F7/F8/H9/K0
256M x 4
K4B1G0846E
HC(L)F7/F8/H9/K0
128M x 8
K4B1G1646E
HC(L)F7/F8/H9/K0
64M x 16
K4B2G0446B
HC(L)F7/F8/H9
512M x 4
K4B2G0846B
HC(L)F7/F8/H9
256M x 8
K4B2G1646B
HC(L)F7/F8/H9
128M x 16
K4B2G0446D
MC(L)F7/F8/H9
512M x 4
K4B2G0846D
MC(L)F7/F8/H9
256M x 8
K4B2G0446E
MC(L)F7/F8/H9
512M x 4
K4B2G0846E
MC(L)F7/F8/H9
256M x 8
K4B4G0446B
MC(L)F7/F8/H9
1G x 4
K4B2G0846B
MC(L)F7/F8/H9
512M x 8
8Banks
8Banks
8Banks
Avail.
Note
Now
96 + 4 ball
FBGA
78 ball
FBGA
Now
96 ball
FBGA
78 ball
FBGA
Now
96 ball
FBGA
78 ball
FBGA
Now
78 ball
FBGA
2Q’09
78 ball
FBGA
1Q’09
December 2008
General Information
DDR3 SDRAM
3. DDR3 SDRAM Module Ordering Information
1
2
3
4
5
6
7
8
9
10
11
12
M X X X B X X X X X X X - X X X
Memory Module
DIMM Type
Data bits
Speed
DRAM Component Type
Temp & Power
Depth
PCB Revision
Package
# of Banks in Comp. & Interface
Component Revision
Bit Organization
1. Memory Module : M
8. Component Revision
M : 1st Gen.
B : 3rd Gen.
D : 5th Gen.
F : 7th Gen.
2. DIMM Type
3 : DIMM
4 : SODIMM
3. Data Bits
71 :
78 :
91 :
92 :
93 :
x64
x64
x72
x72
x72
204pin Unbuffered SODIMM
240pin Unbuffered DIMM
240pin ECC unbuffered DIMM
240pin VLP Registered DIMM
240pin Registered DIMM
A
C
E
G
:
:
:
:
2nd Gen.
4th Gen.
6th Gen.
8th Gen.
9. Package
: FBGA(Lead-free)
Z
: FBGA(Lead-free & Halogen-free)
H
: FBGA(Lead-free, DDP)
J
M : FBGA(Lead-free & Halogen-free, DDP)
10. PCB Revision
4. DRAM Component Type
0 : None
2 : 2nd Rev.
4 : 4th Rev.
1 : 1st Rev.
3 : 3rd Rev.
B : DDR3 SDRAM (1.5V VDD)
5. Depth
32 : 32M
64 : 64M
28 : 128M
56 : 256M
51 : 512M
1G : 1G
2G : 2G
33
65
29
57
52
1K
2K
: 32M (for 128Mb/512Mb)
: 64M (for 128Mb/512Mb)
: 128M (for 128Mb/512Mb)
: 256M (for 512Mb/2Gb)
: 512M (for 512Mb/2Gb)
: 1G (for 2Gb)
: 2G (for 2Gb)
6. # of Banks in comp. & Interface
7 :
11. Temp & Power
C : Commercial Temp.( 0°C ~ 85°C) & Normal Power
L : Commercial Temp.( 0°C ~ 85°C) & Low Power
Y : Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
12. Speed
F7 : DDR3-800
F8 : DDR3-1066
H9 : DDR3-1333
K0 : DDR3-1600
(400MHz @ CL=6, tRCD=6, tRP=6)
(533MHz @ CL=7, tRCD=7, tRP=7)
(667MHz @ CL=9, tRCD=9, tRP=9)
(800MHz @ CL=11, tRCD=11, tRP=11)
8Banks & SSTL-1.5V
Note: PC3-6400(DDR3-800),PC3-8500(DDR3-1066),
PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)
7. Bit Organization
0 : x4
3 : x8
4 : x16
December 2008
General Information
DDR3 SDRAM
4. DDR3 SDRAM Module Product Guide
240Pin DDR3 Unbuffered DIMM
Org.
128Mx 64
Density
Composition
Comp.
Version
Internal
Banks
Part Number
Speed
Rank
PKG
Height
Avail.
M378B2873DZ1
F8/H9
128M x 8 * 8 pcs
1Gb
D-die
78 + 4 ball
FBGA
Now
M378B2873EH1
F8/H9/K0
128M x 8 * 8 pcs
1Gb
E-die
78 ball
FBGA
Now
Note
1GB
1
128Mx 72
256Mx 64
256Mx 72
M391B2873DZ1
F8/H9
128M x 8 * 9 pcs
1Gb
D-die
78 + 4 ball
FBGA
Now
M391B2873EH1
F8/H9/K0
128M x 8 * 9 pcs
1Gb
E-die
78 ball
FBGA
Now
M378B5673DZ1
F8/H9
128M x 8 * 16 pcs
1Gb
D-die
78 + 4 ball
FBGA
1GB
2GB
8
M378B5673EH1
F8/H9/K0
128M x 8 * 16 pcs
1Gb
E-die
M391B5673DZ1
F8/H9
128M x 8 * 18 pcs
1Gb
D-die
2GB
Now
30mm
78 ball
FBGA
Now
78 + 4 ball
FBGA
Now
2
M391B5673EH1
F8/H9/K0
128M x 8 * 18 pcs
1Gb
E-die
78 ball
FBGA
Now
512Mx 64
4GB
M378B5273BH1
F8/H9
256M x 8 * 16 pcs
2Gb
B-die
78 ball
FBGA
Now
512Mx 72
4GB
M391B5273BH1
F8/H9
256M x 8 * 18 pcs
2Gb
B-die
78 ball
FBGA
Now
204Pin DDR3 SODIMM
Org.
128Mx 64
256Mx 64
512Mx 64
Density
Composition
Comp.
Version
Part Number
Speed
M471B2874DZ1
CF7/F8/H9
64M x 16 * 8 pcs
1Gb
M471B2873EH1
CF7/F8/H9
128M x 8 * 8 pcs
M471B5673DZ1
CF7/F8/H9
M471B5673EH1
M471B5273BH1
Internal
Banks
Rank
PKG
Height
Avail.
D-die
2
96 + 4 ball
FBGA
Now
1Gb
E-die
1
78 ball
FBGA
Now
128M x 8 * 16 pcs
1Gb
D-die
2
78 + 4 ball
FBGA
CF7/F8/H9
128M x 8 * 16 pcs
1Gb
E-die
2
78 ball
FBGA
Now
CF7/F8/H9
256M x 8 * 16 pcs
2Gb
B-die
2
78 ball
FBGA
Now
Note
1GB
8
30mm
Now
2GB
4GB
December 2008
General Information
DDR3 SDRAM
240Pin DDR3 Registered DIMM
Org.
128Mx 72
256Mx 72
512Mx 72
1Gx 72
2Gx 72
Density
Composition
Comp.
Version
Part Number
Speed
M393B2873DZ1
CF7/F8/H9
128M x 8 * 9 pcs
1Gb
M393B2873EH1
CF7/F8/H9
128M x 8 * 9 pcs
M393B5673DZ1
CF7/F8/H9
M393B5673EH1
Internal
Banks
Rank
PKG
Height
Avail.
D-die
1
78 + 4 ball
FBGA
Now
1Gb
E-die
1
78 ball
FBGA
Now
128M x 8 * 18 pcs
1Gb
D-die
2
78 + 4 ball
FBGA
Now
CF7/F8/H9
128M x 8 * 18 pcs
1Gb
E-die
2
78 ball
FBGA
Now
M393B5670DZ1
CF7/F8/H9
256M x 4 * 18 pcs
1Gb
D-die
1
78 + 4 ball
FBGA
Now
M393B5670EH1
CF7/F8/H9
256M x 4 * 18 pcs
1Gb
E-die
1
78 ball
FBGA
Now
M393B5173DZ1
CF7/F8
128M x 8 * 36 pcs
1Gb
D-die
4
78 + 4 ball
FBGA
Now
M393B5173EH1
CF7/F8
128M x 8 * 36 pcs
1Gb
E-die
4
78 ball
FBGA
M393B5170DZ1
CF7/F8/H9
256M x 4 * 36 pcs
1Gb
D-die
2
78 + 4 ball
FBGA
Now
M393B5170EH1
CF7/F8/H9
256M x 4 * 36 pcs
1Gb
E-die
2
78 ball
FBGA
Now
M393B1G70DJ1
CF7/F8
DDP
x 4 * 36 pcs
512M
1Gb
D-die
4
78 ball
FBGA
Now
M393B1G70EM1
CF7/F8
DDP
x 4 * 36 pcs
512M
1Gb
E-die
4
78 ball
FBGA
1Q’09
M393B1K73BH1
CF7/F8
256M x 8 * 36 pcs
2Gb
B-die
4
78 ball
FBGA
Now
M393B1K70BH1
CF7/F8/H9
512M x 4 * 36 pcs
2Gb
B-die
2
78 ball
FBGA
Now
M393B2K70BM1
CF7/F8
DDP
x 4 * 36 pcs
1G
2Gb
B-die
4
78 ball
FBGA
1Q’09
Rank
PKG
Note
1GB
2GB
8
30mm
Now
4GB
8GB
16GB
240Pin DDR3 VLP Registered DIMM
Org.
128Mx 72
Density
Part Number
Speed
M392B2873DZ1
CF7/F8/H9
Composition
128M x 8 * 9 pcs
Comp.
Version
1Gb
Internal
Banks
D-die
1GB
Height
Avail.
78 + 4 ball
FBGA
Now
78 ball
FBGA
Now
78 + 4 ball
FBGA
Now
Note
1
M392B2873EH1
CF7/F8/H9
128M x 8 * 9 pcs
1Gb
E-die
M392B5673DZ1
CF7/F8/H9
128M x 8 * 18 pcs
1Gb
D-die
2
256Mx 72
M392B5673EH1
CF7/F8/H9
128M x 8 * 18 pcs
1Gb
E-die
78 ball
FBGA
Now
M392B5670DZ1
CF7/F8/H9
256M x 4 * 18 pcs
1Gb
D-die
78 + 4 ball
FBGA
Now
2GB
1
M392B5670EH1
CF7/F8/H9
256M x 4 * 18 pcs
1Gb
78 ball
FBGA
E-die
8
M392B5170DJ1
CF7/F8/H9
DDP
x 4 * 18 pcs
512M
1Gb
Now
18.75mm
D-die
78 ball
FBGA
Now
78 ball
FBGA
1Q’09
2
512Mx 72
1Gx 72
M392B5170EM1
CF7/F8/H9
DDP
x 4 * 18 pcs
512M
1Gb
E-die
M392B5273BH1
CF7/F8/H9
256M x 8 * 18 pcs
2Gb
B-die
2
78 ball
FBGA
Now
M392B5270BH1
CF7/F8/H9
512M x 4 * 18 pcs
2Gb
B-die
1
78 ball
FBGA
Now
M392B1K73BM1
CF7/F8
DDP
x 8 * 18 pcs
512M
2Gb
B-die
4
78 ball
FBGA
1Q’09
M392B1K70BM1
CF7/F8/H9
DDP
x 4 * 18 pcs
1G
2Gb
B-die
2
78 ball
FBGA
1Q’09
4GB
8GB
December 2008
General Information
DDR3 SDRAM
5. RDIMM RCD Information
1. RCD Identification in JEDEC Description in Module Label
2. Label Example
4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P0
Made in Korea
M393B5170EH1-CH9
0849
3. RCD Information
- Example
Vendor
Revision
Module P/N
JEDEC Description On Label
Inphi
B2
M393B5170EH1-CH9
4GB 2Rx4 PC3-10600R-09-10-E1-P0
IDT
B0
M393B5170EH1-CH9
4GB 2Rx4 PC3-10600R-09-10-E1-D2
December 2008
General Information
DDR3 SDRAM
9.00 ± 0.10
0.10MAX
78 + 4Ball FBGA for 1Gb D-die (x4/x8)
A
0.80 x 10 = 8.00
1.60
#A1 INDEX MARK
4.00
#A1
11.00 ± 0.10
0.80 x 12 = 9.60
4.80
0.80
0.80
(Datum B)
A
B
C
D
E
F
G
H
J
K
L
M
N
9.00 ± 0.10
B
11 10 9 8 7 6 5 4 3 2 1
0.50 ± 0.05
0.80
11.00 ± 0.10
(Datum A)
0.35 ± 0.05
(0.95)
82 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
MOLDING AREA
1.10 ± 0.10
(1.90)
0.2 M A B
Top
Bottom
: Support Ball
9.00 ± 0.10
0.10MAX
96 + 4Ball FBGA for 1Gb D-die (x16)
A
0.80 x 10 = 8.00
#A1 INDEX MARK
1.60
4.00
#A1
11 10 9 8 7 6 5 4 3 2 1
13.30 ± 0.10
13.30 ± 0.10
0.80 x 15 = 12.00
6.00
0.40
(Datum B)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
0.80
(Datum A)
9.00 ± 0.10
B
0.50 ± 0.05
0.80
0.35 ± 0.05
(0.95)
100 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
MOLDING AREA
1.10 ± 0.10
(1.90)
0.2 M A B
Bottom
Top
: Support Ball
December 2008
General Information
DDR3 SDRAM
7.50 ± 0.10
0.10MAX
78 Ball FBGA for 1Gb E-die (x4/x8)
A
0.80 x 8 = 6.40
#A1 INDEX MARK
3.20
#A1
11.00 ± 0.10
0.80 x 12 = 9.60
0.80
4.80
A
B
C
D
E
F
G
H
J
K
L
M
N
0.80
(Datum B)
7.50 ± 0.10
B
9 8 7 6 5 4 3 2 1
0.50 ± 0.05
0.80 1.60
11.00 ± 0.10
(Datum A)
0.35 ± 0.05
(0.95)
78 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
MOLDING AREA
1.10 ± 0.10
(1.90)
0.2 M A B
Top
Bottom
7.50 ± 0.10
0.10MAX
96 Ball FBGA for 1Gb E-die (x16)
A
0.80 x 8 = 6.40
0.80 1.60
3.20
#A1 INDEX MARK
7.50 ± 0.10
#A1
13.30 ± 0.10
13.30 ± 0.10
0.35 ± 0.05
(0.95)
96 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
0.2 M A B
0.80 x 15 = 12.00
6.00
0.40
(Datum B)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
0.80
(Datum A)
0.50 ± 0.05
B
9 8 7 6 5 4 3 2 1
MOLDING AREA
1.10 ± 0.10
(1.90)
Bottom
Top
December 2008
General Information
DDR3 SDRAM
9.00 ± 0.10
0.80
A
#A1 INDEX MARK
3.60
1.60
#A1
11.50 ± 0.10
0.80
0.80 x 12 = 9.60
4.80
A
B
C
D
E
F
G
H
J
K
L
M
N
0.80
(Datum B)
9.00 ± 0.10
B
9 8 7 6 5 4 3 2 1
11.50 ± 0.10
(Datum A)
0.10MAX
78Ball FBGA for 2Gb B-die (x4/x8)
0.35 ± 0.05
(0.95)
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
MOLDING AREA
1.10 ± 0.10
(1.90)
0.2 M A B
TOP VIEW
BOTTOM VIEW
9.00 ± 0.10
0.10MAX
96Ball FBGA for 2Gb B-die (x16)
A
#A1 INDEX MARK
0.80
1.60
3.60
#A1
9 8 7 6 5 4 3 2 1
13.30 ± 0.10
13.30 ± 0.10
0.35 ± 0.05
(0.95)
96 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 M A B
0.80 x 12 = 12.00
6.00
0.40
(Datum B)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
0.80
(Datum A)
9.00 ± 0.10
B
MOLDING AREA
1.10 ± 0.10
(1.90)
BOTTOM VIEW
TOP VIEW
December 2008
General Information
DDR3 SDRAM
x64/x72 240pin DDR3 SDRAM Unbuffered DIMM
Units : Millimeters
(4X)3.00 ± 0.1
133.35
30.00 ± 0.15
128.95
N/A
9.50
(for x64)
SPD
ECC
(2)
2.50
A
17.30
2.50 +0.1/-0
(for x72)
B
47.00
71.00
4.00
N/A
(for x64)
ECC
(for x72)
1.270 ± 0.10
2x 2.10 ± 0.15
2.50 ± 0.20
5.00
0.80 ± 0.05
3.80
2.50
1.50±0.10
Detail A
0.2 ± 0.15
1.00
Detail B
December 2008
General Information
DDR3 SDRAM
x64 204pin DDR3 SDRAM Unbuffered SODIMM
Units : Millimeters
67.60
20.00 mm
30.00 mm nom.
SPD
Max 3.8
1.00 ± 0.10
3.00
2X 1.80
0.10 M C A B
(OPTIONAL HOLES)
2X 4.00 ± 0.10
0.10 M C A B
0.60
0.45 ± 0.03
4.00 ± 0.10
1.00 ± 0.10
Detail A
2.55
0.25 MAX
Detail B
December 2008
General Information
DDR3 SDRAM
x72 240pin DDR3 SDRAM Registered DIMM
Units : Millimeters
133.35
10.9
128.95
32.40
18.92
18.93
9.74
4.00 max
Register
10.00
9.76
(2X)4.00
131.35
(2)
2.50
17.80
2.30
30.00
1.0 max
1.27 ± 0.10
2x 2.10 ± 0.15
2.50 ± 0.20
5.00
0.80 ± 0.05
3.80
2.50
0.2 ± 0.15
1.00
1.50±0.10
Detail B
D9
D10
D11
D12
D17
D0
D1
D2
D3
D8
Register
Detail A
D13
D14
D15
D16
D4
D5
D6
D7
Address, Command and Control lines
December 2008
General Information
DDR3 SDRAM
Registered DIMM Heat Spreader Design
1. FRONT PART
Outside
R0 .2
4.65± 0.12
1
2 ± 0.1
2
2
2.6 ± 0.2
0.15
1.3
1
0.
R
127 ± 0.12
25.6 ± 0.15
31.4
23.6 ± 0.15
11.9
29.77
25.6 ± 0.15
0.65 ± 0.2
130.45 ± 0.15
9.26
1+0/ -0.3
133.15 ± 0.2
1.3
0.4
Inside
Green Line : TIM Attatch Line
7.45
Reg. pedestal line
80.78
119.29
128.5
2. BACK PART
Outside
Inside
Green Line : TIM Attatch Line
December 2008
General Information
DDR3 SDRAM
3. CLIP PART
39.3 ± 0.2
Upper Bending
Tilting Gap
29.77
5.8
5
1.
R
6.8 ± 0.1
43.9
0.1 ~ 0.3
0.5
4. DDR3 RDIMM ASS’Y View
Reference thickness total (nominal) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness)
1.27
1.05
132.95 ± 133.45
39.3 ± 0.2
19
19 ± 0.1
6.8 ± 0.1
K
text mark ’B’ or ’K’
punch press_stamp
Clip open size
2.5~3.6
December 2008
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