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- 2GB, DDR III SDRAM, 1333MHz, CL9
- User guide
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General Information DDR3 SDRAM DDR3 SDRAM Product Guide December 2008 Memory Division December 2008 General Information DDR3 SDRAM 1. DDR3 SDRAM Component Ordering Information 1 2 3 4 5 6 7 8 9 10 11 K 4 B X X X X X X X - X X X X Speed SAMSUNG Memory DRAM Temp & Power DRAM Type Package Type Density Revision Interface (VDD, VDDQ) Bit Organization # of Internal Banks 1. SAMSUNG Memory : K 7. Interface ( VDD, VDDQ) 6 : SSTL (1.5V, 1.5V) 2. DRAM : 4 8. Revision 3. DRAM Type B : DDR3 SDRAM 4. Density 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb M A B C D E F G H : 1st Gen. : 2nd Gen. : 3rd Gen. : 4th Gen. : 5th Gen. : 6th Gen. : 7th Gen : 8th Gen : 9th Gen 9. Package Type 5. Bit Organization 04 : x 4 08 : x 8 16 : x16 Z H J M : : : : FBGA (Lead-free) FBGA (Halogen-free & Lead-free) FBGA (Lead-free, DDP) FBGA (Halogen-free & Lead-free, DDP) 10. Temp & Power C : Commercial Temp.( 0°C ~ 85°C) & Normal Power L : Commercial Temp.( 0°C ~ 85°C) & Low Power Y : Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V) 6. # of Internal Banks 3 : 4 Banks 4 : 8 Banks 5 : 16 Banks 11. Speed F7 : DDR3-800 F8 : DDR3-1066 H9 : DDR3-1333 K0 : DDR3-1600 (400MHz @ CL=6, tRCD=6, tRP=6) (533MHz @ CL=7, tRCD=7, tRP=7) (667MHz @ CL=9, tRCD=9, tRP=9) (800MHz @ CL=11, tRCD=11, tRP=11) December 2008 General Information DDR3 SDRAM 2. DDR3 SDRAM Component Product Guide Density 1Gb D-die Banks 8Banks Org. PKG K4B1G0446D Part Number HC(L)F7/F8/H9 256M x 4 K4B1G0846D HC(L)F7/F8/H9 128M x 8 78 + 4 ball FBGA K4B1G1646D 1Gb E-die 2Gb B-die DDP 2Gb D-die DDP 2Gb E-die DDP 4Gb B-die 8Banks 8Banks Package & Power, Temp. (-C/-L) & Speed HC(L)F7/F8/H9 64M x 16 K4B1G0446E HC(L)F7/F8/H9/K0 256M x 4 K4B1G0846E HC(L)F7/F8/H9/K0 128M x 8 K4B1G1646E HC(L)F7/F8/H9/K0 64M x 16 K4B2G0446B HC(L)F7/F8/H9 512M x 4 K4B2G0846B HC(L)F7/F8/H9 256M x 8 K4B2G1646B HC(L)F7/F8/H9 128M x 16 K4B2G0446D MC(L)F7/F8/H9 512M x 4 K4B2G0846D MC(L)F7/F8/H9 256M x 8 K4B2G0446E MC(L)F7/F8/H9 512M x 4 K4B2G0846E MC(L)F7/F8/H9 256M x 8 K4B4G0446B MC(L)F7/F8/H9 1G x 4 K4B2G0846B MC(L)F7/F8/H9 512M x 8 8Banks 8Banks 8Banks Avail. Note Now 96 + 4 ball FBGA 78 ball FBGA Now 96 ball FBGA 78 ball FBGA Now 96 ball FBGA 78 ball FBGA Now 78 ball FBGA 2Q’09 78 ball FBGA 1Q’09 December 2008 General Information DDR3 SDRAM 3. DDR3 SDRAM Module Ordering Information 1 2 3 4 5 6 7 8 9 10 11 12 M X X X B X X X X X X X - X X X Memory Module DIMM Type Data bits Speed DRAM Component Type Temp & Power Depth PCB Revision Package # of Banks in Comp. & Interface Component Revision Bit Organization 1. Memory Module : M 8. Component Revision M : 1st Gen. B : 3rd Gen. D : 5th Gen. F : 7th Gen. 2. DIMM Type 3 : DIMM 4 : SODIMM 3. Data Bits 71 : 78 : 91 : 92 : 93 : x64 x64 x72 x72 x72 204pin Unbuffered SODIMM 240pin Unbuffered DIMM 240pin ECC unbuffered DIMM 240pin VLP Registered DIMM 240pin Registered DIMM A C E G : : : : 2nd Gen. 4th Gen. 6th Gen. 8th Gen. 9. Package : FBGA(Lead-free) Z : FBGA(Lead-free & Halogen-free) H : FBGA(Lead-free, DDP) J M : FBGA(Lead-free & Halogen-free, DDP) 10. PCB Revision 4. DRAM Component Type 0 : None 2 : 2nd Rev. 4 : 4th Rev. 1 : 1st Rev. 3 : 3rd Rev. B : DDR3 SDRAM (1.5V VDD) 5. Depth 32 : 32M 64 : 64M 28 : 128M 56 : 256M 51 : 512M 1G : 1G 2G : 2G 33 65 29 57 52 1K 2K : 32M (for 128Mb/512Mb) : 64M (for 128Mb/512Mb) : 128M (for 128Mb/512Mb) : 256M (for 512Mb/2Gb) : 512M (for 512Mb/2Gb) : 1G (for 2Gb) : 2G (for 2Gb) 6. # of Banks in comp. & Interface 7 : 11. Temp & Power C : Commercial Temp.( 0°C ~ 85°C) & Normal Power L : Commercial Temp.( 0°C ~ 85°C) & Low Power Y : Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V) 12. Speed F7 : DDR3-800 F8 : DDR3-1066 H9 : DDR3-1333 K0 : DDR3-1600 (400MHz @ CL=6, tRCD=6, tRP=6) (533MHz @ CL=7, tRCD=7, tRP=7) (667MHz @ CL=9, tRCD=9, tRP=9) (800MHz @ CL=11, tRCD=11, tRP=11) 8Banks & SSTL-1.5V Note: PC3-6400(DDR3-800),PC3-8500(DDR3-1066), PC3-10600(DDR3-1333), PC3-12800(DDR3-1600) 7. Bit Organization 0 : x4 3 : x8 4 : x16 December 2008 General Information DDR3 SDRAM 4. DDR3 SDRAM Module Product Guide 240Pin DDR3 Unbuffered DIMM Org. 128Mx 64 Density Composition Comp. Version Internal Banks Part Number Speed Rank PKG Height Avail. M378B2873DZ1 F8/H9 128M x 8 * 8 pcs 1Gb D-die 78 + 4 ball FBGA Now M378B2873EH1 F8/H9/K0 128M x 8 * 8 pcs 1Gb E-die 78 ball FBGA Now Note 1GB 1 128Mx 72 256Mx 64 256Mx 72 M391B2873DZ1 F8/H9 128M x 8 * 9 pcs 1Gb D-die 78 + 4 ball FBGA Now M391B2873EH1 F8/H9/K0 128M x 8 * 9 pcs 1Gb E-die 78 ball FBGA Now M378B5673DZ1 F8/H9 128M x 8 * 16 pcs 1Gb D-die 78 + 4 ball FBGA 1GB 2GB 8 M378B5673EH1 F8/H9/K0 128M x 8 * 16 pcs 1Gb E-die M391B5673DZ1 F8/H9 128M x 8 * 18 pcs 1Gb D-die 2GB Now 30mm 78 ball FBGA Now 78 + 4 ball FBGA Now 2 M391B5673EH1 F8/H9/K0 128M x 8 * 18 pcs 1Gb E-die 78 ball FBGA Now 512Mx 64 4GB M378B5273BH1 F8/H9 256M x 8 * 16 pcs 2Gb B-die 78 ball FBGA Now 512Mx 72 4GB M391B5273BH1 F8/H9 256M x 8 * 18 pcs 2Gb B-die 78 ball FBGA Now 204Pin DDR3 SODIMM Org. 128Mx 64 256Mx 64 512Mx 64 Density Composition Comp. Version Part Number Speed M471B2874DZ1 CF7/F8/H9 64M x 16 * 8 pcs 1Gb M471B2873EH1 CF7/F8/H9 128M x 8 * 8 pcs M471B5673DZ1 CF7/F8/H9 M471B5673EH1 M471B5273BH1 Internal Banks Rank PKG Height Avail. D-die 2 96 + 4 ball FBGA Now 1Gb E-die 1 78 ball FBGA Now 128M x 8 * 16 pcs 1Gb D-die 2 78 + 4 ball FBGA CF7/F8/H9 128M x 8 * 16 pcs 1Gb E-die 2 78 ball FBGA Now CF7/F8/H9 256M x 8 * 16 pcs 2Gb B-die 2 78 ball FBGA Now Note 1GB 8 30mm Now 2GB 4GB December 2008 General Information DDR3 SDRAM 240Pin DDR3 Registered DIMM Org. 128Mx 72 256Mx 72 512Mx 72 1Gx 72 2Gx 72 Density Composition Comp. Version Part Number Speed M393B2873DZ1 CF7/F8/H9 128M x 8 * 9 pcs 1Gb M393B2873EH1 CF7/F8/H9 128M x 8 * 9 pcs M393B5673DZ1 CF7/F8/H9 M393B5673EH1 Internal Banks Rank PKG Height Avail. D-die 1 78 + 4 ball FBGA Now 1Gb E-die 1 78 ball FBGA Now 128M x 8 * 18 pcs 1Gb D-die 2 78 + 4 ball FBGA Now CF7/F8/H9 128M x 8 * 18 pcs 1Gb E-die 2 78 ball FBGA Now M393B5670DZ1 CF7/F8/H9 256M x 4 * 18 pcs 1Gb D-die 1 78 + 4 ball FBGA Now M393B5670EH1 CF7/F8/H9 256M x 4 * 18 pcs 1Gb E-die 1 78 ball FBGA Now M393B5173DZ1 CF7/F8 128M x 8 * 36 pcs 1Gb D-die 4 78 + 4 ball FBGA Now M393B5173EH1 CF7/F8 128M x 8 * 36 pcs 1Gb E-die 4 78 ball FBGA M393B5170DZ1 CF7/F8/H9 256M x 4 * 36 pcs 1Gb D-die 2 78 + 4 ball FBGA Now M393B5170EH1 CF7/F8/H9 256M x 4 * 36 pcs 1Gb E-die 2 78 ball FBGA Now M393B1G70DJ1 CF7/F8 DDP x 4 * 36 pcs 512M 1Gb D-die 4 78 ball FBGA Now M393B1G70EM1 CF7/F8 DDP x 4 * 36 pcs 512M 1Gb E-die 4 78 ball FBGA 1Q’09 M393B1K73BH1 CF7/F8 256M x 8 * 36 pcs 2Gb B-die 4 78 ball FBGA Now M393B1K70BH1 CF7/F8/H9 512M x 4 * 36 pcs 2Gb B-die 2 78 ball FBGA Now M393B2K70BM1 CF7/F8 DDP x 4 * 36 pcs 1G 2Gb B-die 4 78 ball FBGA 1Q’09 Rank PKG Note 1GB 2GB 8 30mm Now 4GB 8GB 16GB 240Pin DDR3 VLP Registered DIMM Org. 128Mx 72 Density Part Number Speed M392B2873DZ1 CF7/F8/H9 Composition 128M x 8 * 9 pcs Comp. Version 1Gb Internal Banks D-die 1GB Height Avail. 78 + 4 ball FBGA Now 78 ball FBGA Now 78 + 4 ball FBGA Now Note 1 M392B2873EH1 CF7/F8/H9 128M x 8 * 9 pcs 1Gb E-die M392B5673DZ1 CF7/F8/H9 128M x 8 * 18 pcs 1Gb D-die 2 256Mx 72 M392B5673EH1 CF7/F8/H9 128M x 8 * 18 pcs 1Gb E-die 78 ball FBGA Now M392B5670DZ1 CF7/F8/H9 256M x 4 * 18 pcs 1Gb D-die 78 + 4 ball FBGA Now 2GB 1 M392B5670EH1 CF7/F8/H9 256M x 4 * 18 pcs 1Gb 78 ball FBGA E-die 8 M392B5170DJ1 CF7/F8/H9 DDP x 4 * 18 pcs 512M 1Gb Now 18.75mm D-die 78 ball FBGA Now 78 ball FBGA 1Q’09 2 512Mx 72 1Gx 72 M392B5170EM1 CF7/F8/H9 DDP x 4 * 18 pcs 512M 1Gb E-die M392B5273BH1 CF7/F8/H9 256M x 8 * 18 pcs 2Gb B-die 2 78 ball FBGA Now M392B5270BH1 CF7/F8/H9 512M x 4 * 18 pcs 2Gb B-die 1 78 ball FBGA Now M392B1K73BM1 CF7/F8 DDP x 8 * 18 pcs 512M 2Gb B-die 4 78 ball FBGA 1Q’09 M392B1K70BM1 CF7/F8/H9 DDP x 4 * 18 pcs 1G 2Gb B-die 2 78 ball FBGA 1Q’09 4GB 8GB December 2008 General Information DDR3 SDRAM 5. RDIMM RCD Information 1. RCD Identification in JEDEC Description in Module Label 2. Label Example 4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P0 Made in Korea M393B5170EH1-CH9 0849 3. RCD Information - Example Vendor Revision Module P/N JEDEC Description On Label Inphi B2 M393B5170EH1-CH9 4GB 2Rx4 PC3-10600R-09-10-E1-P0 IDT B0 M393B5170EH1-CH9 4GB 2Rx4 PC3-10600R-09-10-E1-D2 December 2008 General Information DDR3 SDRAM 9.00 ± 0.10 0.10MAX 78 + 4Ball FBGA for 1Gb D-die (x4/x8) A 0.80 x 10 = 8.00 1.60 #A1 INDEX MARK 4.00 #A1 11.00 ± 0.10 0.80 x 12 = 9.60 4.80 0.80 0.80 (Datum B) A B C D E F G H J K L M N 9.00 ± 0.10 B 11 10 9 8 7 6 5 4 3 2 1 0.50 ± 0.05 0.80 11.00 ± 0.10 (Datum A) 0.35 ± 0.05 (0.95) 82 - ∅0.45 Solder ball (Post Reflow ∅0.05 ± 0.05) MOLDING AREA 1.10 ± 0.10 (1.90) 0.2 M A B Top Bottom : Support Ball 9.00 ± 0.10 0.10MAX 96 + 4Ball FBGA for 1Gb D-die (x16) A 0.80 x 10 = 8.00 #A1 INDEX MARK 1.60 4.00 #A1 11 10 9 8 7 6 5 4 3 2 1 13.30 ± 0.10 13.30 ± 0.10 0.80 x 15 = 12.00 6.00 0.40 (Datum B) A B C D E F G H J K L M N P R T 0.80 (Datum A) 9.00 ± 0.10 B 0.50 ± 0.05 0.80 0.35 ± 0.05 (0.95) 100 - ∅0.45 Solder ball (Post Reflow ∅0.05 ± 0.05) MOLDING AREA 1.10 ± 0.10 (1.90) 0.2 M A B Bottom Top : Support Ball December 2008 General Information DDR3 SDRAM 7.50 ± 0.10 0.10MAX 78 Ball FBGA for 1Gb E-die (x4/x8) A 0.80 x 8 = 6.40 #A1 INDEX MARK 3.20 #A1 11.00 ± 0.10 0.80 x 12 = 9.60 0.80 4.80 A B C D E F G H J K L M N 0.80 (Datum B) 7.50 ± 0.10 B 9 8 7 6 5 4 3 2 1 0.50 ± 0.05 0.80 1.60 11.00 ± 0.10 (Datum A) 0.35 ± 0.05 (0.95) 78 - ∅0.45 Solder ball (Post Reflow ∅0.05 ± 0.05) MOLDING AREA 1.10 ± 0.10 (1.90) 0.2 M A B Top Bottom 7.50 ± 0.10 0.10MAX 96 Ball FBGA for 1Gb E-die (x16) A 0.80 x 8 = 6.40 0.80 1.60 3.20 #A1 INDEX MARK 7.50 ± 0.10 #A1 13.30 ± 0.10 13.30 ± 0.10 0.35 ± 0.05 (0.95) 96 - ∅0.45 Solder ball (Post Reflow ∅0.05 ± 0.05) 0.2 M A B 0.80 x 15 = 12.00 6.00 0.40 (Datum B) A B C D E F G H J K L M N P R T 0.80 (Datum A) 0.50 ± 0.05 B 9 8 7 6 5 4 3 2 1 MOLDING AREA 1.10 ± 0.10 (1.90) Bottom Top December 2008 General Information DDR3 SDRAM 9.00 ± 0.10 0.80 A #A1 INDEX MARK 3.60 1.60 #A1 11.50 ± 0.10 0.80 0.80 x 12 = 9.60 4.80 A B C D E F G H J K L M N 0.80 (Datum B) 9.00 ± 0.10 B 9 8 7 6 5 4 3 2 1 11.50 ± 0.10 (Datum A) 0.10MAX 78Ball FBGA for 2Gb B-die (x4/x8) 0.35 ± 0.05 (0.95) 78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) MOLDING AREA 1.10 ± 0.10 (1.90) 0.2 M A B TOP VIEW BOTTOM VIEW 9.00 ± 0.10 0.10MAX 96Ball FBGA for 2Gb B-die (x16) A #A1 INDEX MARK 0.80 1.60 3.60 #A1 9 8 7 6 5 4 3 2 1 13.30 ± 0.10 13.30 ± 0.10 0.35 ± 0.05 (0.95) 96 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) 0.2 M A B 0.80 x 12 = 12.00 6.00 0.40 (Datum B) A B C D E F G H J K L M N P R T 0.80 (Datum A) 9.00 ± 0.10 B MOLDING AREA 1.10 ± 0.10 (1.90) BOTTOM VIEW TOP VIEW December 2008 General Information DDR3 SDRAM x64/x72 240pin DDR3 SDRAM Unbuffered DIMM Units : Millimeters (4X)3.00 ± 0.1 133.35 30.00 ± 0.15 128.95 N/A 9.50 (for x64) SPD ECC (2) 2.50 A 17.30 2.50 +0.1/-0 (for x72) B 47.00 71.00 4.00 N/A (for x64) ECC (for x72) 1.270 ± 0.10 2x 2.10 ± 0.15 2.50 ± 0.20 5.00 0.80 ± 0.05 3.80 2.50 1.50±0.10 Detail A 0.2 ± 0.15 1.00 Detail B December 2008 General Information DDR3 SDRAM x64 204pin DDR3 SDRAM Unbuffered SODIMM Units : Millimeters 67.60 20.00 mm 30.00 mm nom. SPD Max 3.8 1.00 ± 0.10 3.00 2X 1.80 0.10 M C A B (OPTIONAL HOLES) 2X 4.00 ± 0.10 0.10 M C A B 0.60 0.45 ± 0.03 4.00 ± 0.10 1.00 ± 0.10 Detail A 2.55 0.25 MAX Detail B December 2008 General Information DDR3 SDRAM x72 240pin DDR3 SDRAM Registered DIMM Units : Millimeters 133.35 10.9 128.95 32.40 18.92 18.93 9.74 4.00 max Register 10.00 9.76 (2X)4.00 131.35 (2) 2.50 17.80 2.30 30.00 1.0 max 1.27 ± 0.10 2x 2.10 ± 0.15 2.50 ± 0.20 5.00 0.80 ± 0.05 3.80 2.50 0.2 ± 0.15 1.00 1.50±0.10 Detail B D9 D10 D11 D12 D17 D0 D1 D2 D3 D8 Register Detail A D13 D14 D15 D16 D4 D5 D6 D7 Address, Command and Control lines December 2008 General Information DDR3 SDRAM Registered DIMM Heat Spreader Design 1. FRONT PART Outside R0 .2 4.65± 0.12 1 2 ± 0.1 2 2 2.6 ± 0.2 0.15 1.3 1 0. R 127 ± 0.12 25.6 ± 0.15 31.4 23.6 ± 0.15 11.9 29.77 25.6 ± 0.15 0.65 ± 0.2 130.45 ± 0.15 9.26 1+0/ -0.3 133.15 ± 0.2 1.3 0.4 Inside Green Line : TIM Attatch Line 7.45 Reg. pedestal line 80.78 119.29 128.5 2. BACK PART Outside Inside Green Line : TIM Attatch Line December 2008 General Information DDR3 SDRAM 3. CLIP PART 39.3 ± 0.2 Upper Bending Tilting Gap 29.77 5.8 5 1. R 6.8 ± 0.1 43.9 0.1 ~ 0.3 0.5 4. DDR3 RDIMM ASS’Y View Reference thickness total (nominal) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness) 1.27 1.05 132.95 ± 133.45 39.3 ± 0.2 19 19 ± 0.1 6.8 ± 0.1 K text mark ’B’ or ’K’ punch press_stamp Clip open size 2.5~3.6 December 2008
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Key Features
- 2 GB DDR3 1066 MHz
- CAS latency: 7
- 1.5 V