service manual led tv

service manual led tv
Internal Use Only
LED TV
SERVICE MANUAL
CHASSIS : LU60A
MODEL : 24LH4530
CAUTION
24LH4530-PU
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
P/NO : MFL69169512 (1601-REV00)
CONTENTS
CONTENTS ............................................................................................... 2
SAFETY PRECAUTIONS.......................................................................... 3
SERVICING PRECAUTIONS..................................................................... 4
SPECIFICATION........................................................................................ 6
ADJUSTMENT INSTRUCTION................................................................. 8
TROUBLE SHOOTING............................................................................ 12
BLOCK DIAGRAM................................................................................... 16
EXPLODED VIEW ................................................................................... 17
SCHEMATIC CIRCUIT DIAGRAM ............................................ APPENDIX
Copyright ©
LG Electronics. Inc. All right reserved.
Only for training and service purposes
-2-
LGE Internal Use Only
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by
in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Keep wires away from high voltage or high temperature parts.
AC Volt-meter
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Copyright ©
LG Electronics. Inc. All right reserved.
Only for training and service purposes
-3-
To Instrument's
exposed
METALLIC PARTS
0.15µF
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
1.5 Kohm/10W
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
LGE Internal Use Only
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
Copyright ©
LG Electronics. Inc. All right reserved.
Only for training and service purposes
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 ˚F to 600 ˚F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
-4-
LGE Internal Use Only
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
Copyright ©
LG Electronics. Inc. All right reserved.
Only for training and service purposes
-5-
LGE Internal Use Only
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application Range
This spec sheet is applied all of the TV used LU60A chassis.
2. Specification
Each part is tested as below without special appointment
1) Temperature : 25 ˚C ± 5 ˚C (77 ˚F ± 9 ˚F),
CST : 40 ˚C ± 5 ˚C
2) Relative Humidity : 65 % ± 10 %
3) Power Voltage : Standard input voltage
(100 V - 240 ­V ~, 50 / 60 Hz)
· Standard Voltage of each products is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3.Test method
1) Performance : LGE TV test method followed
2) Demanded other specification
- Safety : UL
- EMI : FCC
4. Model general specification
No
Item
Specification
Remarks
1
Market
AMERICA, CANADA, MEXICO
LH4530 series is US only
MT48x Series is Mexico only.
2
Receiving system
ATSC / NTSC-M / 64 & 256 QAM
3
Available Channel
VHF 2-13, UHF 14-69, CATV 1-135, DTV 2-69, CADTV 1-135
4
Interface
RF / Composite(CVBS) / Component / HDMI / D-Sub / USB
22,24LH4530 serise : RF/ HDMI/
USB(SVC only)
28LH4530 : RF/ HDMI/USB
MT48x serise : RF, Component/
CVBS/ HDMI/ DSUB/ USB
5. Feature and Function
No
Item
Specification
Analog
NTSC
DTV
ATSC
Remarks
1
RF Input
2
HDMI Input (Rear)
HDMI version 1.4/ support PC
Support HDCP
Rear : 1EA
3
Component Input
(Rear, 1EA)
Y/Pb/Pr
LH4530 not support
4
CVBS Input
ATSC/NTSC-M
common port with Component.
5
USB (Side, 1EA)
For My Media(Photo/Music List)
22,24LH4530 not support
Picture + Music
6
D-Sub
RGB-PC
LH4530 not support
Copyright ©
LG Electronics. Inc. All right reserved.
Only for training and service purposes
-6-
LGE Internal Use Only
5. External Input Support Format
- RGB/HDMI (PC) *LH4530 doesn’t support RGB
No.
Resolution
H-freq(kHz)
V-freq(Hz)
Pixel clock(MHz)
1
720*400
31.468
70.080
28.321
2
640*480
31.469
59.940
25.175
3
640*480
37.500
75.000
31.500
4
800*600
37.879
60.317
40.000
5
800*600
46.875
75.000
49.500
6
1024*768
48.363
60.004
65.000
7
1024*768
60.023
75.029
78.750
8
1280*800
49.702
59.81
83.500
9
1366*768
47.717
59.79
85.5
Remark
- HDMI (DTV)
No.
Resolution
H-freq(kHz)
V-freq(Hz)
Pixel clock(MHz)
Remark
1
720* 480
31.469 / 31.5
59.94 / 60
27.00/ 27.03
SDTV 480P
2
720*576
31.25
50.00
27.864
SDTV 576P
3
1280*720
37.50
50.00
74.250
HDTV 720P
4
1280* 720
44.96 / 45
59.94 / 60
74.17/ 74.25
HDTV 720P
5
1920* 1080
33.72 / 33.75
59.94 / 60
74.17/ 74.25
HDTV 1080I
6
1920* 1080
28.125
50.00
74.25
HDTV 1080I
7
1920* 1080
27.00
24
74.25
HDTV 1080P
8
1920* 1080
33.75
30.00
74.25
HDTV 1080P
9
1920* 1080
56.250
50
148.5
HDTV 1080P
10
1920* 1080
67.43 / 67.5
59.94 / 60
148.35/ 148.50
HDTV 1080P
- Component *LH4530 doesn’t support RGB
No
1
Specification
Resolution
720x480
H-freq(kHz)
15.730
59.940
2
15.750
60.000
3
31.470
59.940
31.500
60.000
15.625
50.000
31.250
50.000
44.960
59.940
45.000
60.000
37.500
50.000
33.720
59.940
10
33.750
60.000
11
28.125
50.000
12
56.250
50.000
13
67.432
59.940
14
67.500
60.000
4
5
720x576
6
7
1280x720
8
9
1920x1080
Remark
V-freq(Hz)
720x480i
720x480p
720x576p
1280x720p
1920x1080i
1920x1080p
- Video Color Format : YcbCr 444, 422 (xvYcc is not supported)
Copyright ©
LG Electronics. Inc. All right reserved.
Only for training and service purposes
-7-
LGE Internal Use Only
ADJUSTMENT INSTRUCTION
1. Application Range
4) Click “Read” tab, and then load download file(XXXX.bin) by
clicking “Read”
This document is applied all of monitor TV models with LU60A
chassis..
(4)
filexxx.bin
2. Designation
1) The adjustment is according to the order which is designated and which must be followed, according to the plan which
can be changed only on agreeing.
2) Power adjustment : Free Voltage.
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specification Standard.
5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 % ± 10 %
Input voltage : 220 V, 60 Hz
6) Adjustment equipments : Color Analyzer (CA-210 or CA110), DDC Adjustment Jig equipment, SVC remote controll.
7) Push The "IN STOP KEY" – For memory initialization
5) Click “Auto” tab and set as below
6) Click “Run”.
7) After downloading, check “OK” message.
(5)
(5)
(7) ……….OK
Case1 : Software version up
1) After downloading S/W by USB , Multi-vision set will
reboot automatically
2) Push "In-stop" key
3) Push "Power on" key
4) Function inspection
5) After function inspection, Push "In-stop" key.
(6)
* USB DOWNLOAD
1) Make New folder named “LG_DTV” and put ISP file(*.bin)
in the folder.
2) Put the USB Stick to the USB socket.
3) 3 Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is
Low, it didn’t work. But your downloaded version is
High, USB data is automatically detecting.
4) TV Software Upgrade feature will be displayed.
Case2 : Function check at the assembly line
1) When TV set is entering on the assembly line, Push "Instop" key at first.
2) Push "Power on" key for turning it on.
→ If you push "Power on" key, TV set will recover channel
information by itself.
3) After function inspection, Push "In-stop" key.
3. Main PCB check process
* APC - After Manual-Insult, executing APC
* Boot file Download
1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
2) Set as below, and then click “Auto Detect” and check “OK”
message. If display “Error”, Check connect computer, jig,
and set.
3) Click “Connect” tab. If display “Can’t ”, Check connect
computer, jig, and set.
(1)
5) Updating is starting.
(3)
6) Updating Completed, The TV will restart automatically.
(2)
OK
Please Check the Speed :
Use the speed under
200KHz.
Copyright ©
LG Electronics. Inc. All right reserved.
Only for training and service purposes
* After downloading, have to adjust TOOL OPTION again.
-8-
LGE Internal Use Only
3.1. EDID Process
- HDMI : Checksum : 96 F0
3.1.1. EDID download
1) Press “Power only” key of service remote controll.
2) Press the “ADJ” Key of service remote controll.
3) Enter EDID D/L mode by pushing “►” key at “EDID D/L”.
4) Select “Start” menu to download EDID data.
5) Check the “OK” message.
6) Press EXIT key on R/C.
0
10
20
30
40
50
60
70
0
10
20
30
40
→ Caution: Do not connect HDMI Cable when download
EDID
50
60
70
* Edid data and Model option download (RS232)
NO
Item
CMD
1
CMD
2
Enter
download
MODE
Download
‘Mode In’
A
A
0
0
When transfer the
‘Mode In’,
Carry the command.
EDID data and
Model option
download
Download
A
E
00
10
Automatically download
(The use of a internal
Data)
0
0
1
12
1
33
3D
44
0
1
FF
19
50
1
0
9
20
0A
2
FF
1
54
1
FD
0
48
20
3
FF
3
A7
1
1E
0A
44
20
4
FF
80
6A
1
11
20
20
20
5
FF
33
0
1
0
20
4C
20
6
FF
1D
31
66
0
20
47
20
7
0
78
4F
21
1E
20
20
20
8
1E
EA
45
56
0
20
54
20
9
6D
62
4F
AA
0
20
56
20
A
CA
75
61
51
0
0
0A
20
B
59
A3
4F
0
FD
0
20
20
C
1
55
81
1E
0
0
0
20
D E
F
1 1 1
4F A0 27
0 1 1
30 46 8F
38 4B 1E
FC 0 32
0 0 FF
20 1 96
0
2
1F
0
1
0
21
6
45
1
3
7
72
1D
9E
0
44
0
2
1E
16
51
80
1
0
21
56
3
F1
23
D0
18
1D
9E
0
50
4
4E
9
1E
71
80
2
0
21
5
84
57
20
1C
D0
3A
1E
0
6
5
7
38
16
72
80
2
0
7
3
66
88
20
1C
D0
3A
1E
8
2
3
15
58
16
72
80
0
9
20
0C
0
2C
20
38
18
0
A
22
0
56
25
10
2D
71
0
B
10
10
50
0
2C
40
38
0
C
11
0
21
56
25
10
2D
0
D
13
80
0
50
80
2C
40
0
E
12
1
0
21
C4
45
58
0
F
14
1D
1E
0
8E
20
2C
F0
Data 0
3.2. Function Check
3.2.1. Check display and sound
*Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (SCART/CVBS)
3) COMPONENT (480i)
4) HDMI
* Display and Sound check is executed by Remote controll.
→ Caution
* Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
→ Caution : Not to push the INSTOP KEY after completion if
the function inspection.
3.1.2. EDID Data
- a. RGB : Checksum – B1
0
10
20
30
40
50
60
70
0
0
1
12
1
33
3D
44
0
1
FF
19
50
1
0
9
20
0A
2
FF
1
54
1
FD
0
48
20
3
FF
3
A7
1
1E
0A
44
20
4
FF
68
6A
1
11
20
20
20
5
FF
33
0
1
0
20
4C
20
6
FF
1D
31
66
0
20
47
20
7
0
78
4F
21
1E
20
20
20
8
1E
EA
45
56
0
20
54
20
9
6D
62
4F
AA
0
20
56
20
A
C8
75
61
51
0
0
0A
20
B
59
A3
4F
0
FD
0
20
20
C
1
55
81
1E
0
0
0
20
Copyright ©
LG Electronics. Inc. All right reserved.
Only for training and service purposes
D E
F
1 1 1
4F A0 27
0 1 1
30 46 8F
38 4B 1E
FC 0 32
0 0 FF
20 0 B1
-9-
LGE Internal Use Only
4. Total Assembly line process
4.4. White balance adjustment
-Equipment
*Connection
1) Color Analyzer: CA-210 (LED Module : CH 14)
2) Adj. Computer(During auto adj., RS-232C protocol is
needed)
3) Adjust Remocon
RGB_Gains are fixed data for each model.
Insert RS-232C Jack which is connected with PC for White
Balance or equivalent device.
* Total Assembly line should be check whether the color
coordinate(x,y) data refer to below table were meet or not.
Color coordinate is differ from panel’s characteristics of color
temperature. Please check panel characteristics about color
temperature.
4.1. Tool option & ADC Check
1) Press “Power on” key of service remote control.
2) Connect D-SUB cable D-SUB jack for RS232.
3) Check the 'Tool Option' (Refer to the BOM Comments or
Adjustment spec)
4) Check the ‘ADC’ is ok
- Cool Panel
Color
Temperature
4.2. Model name & Serial number Download
4.2.1. Model name & Serial number D/L
1) Press "Power on" key of service remote control.
2) Connect RS232 Signal Cable to RS-232 Jack.
3) Write Serial number by use RS-232.
4) Must check the serial number at the Diagnostics of SET UP
menu.
4.2.2. Method & notice
1) Model Name & Serial Number D/L is using of scan equipment.
2) Setting of scan equipment operated by Manufacturing
Technology Group.
3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0
4) Check the model name Instart menu → Factory name
displayed (ex 24LN4500)
5) Check the Diagnostics (DTV country only) → Buyer model
displayed (ex 24LN4500)
Luminance
(cd/m²)
Cool
13,000
°K
X=0.276 (±0.04)
Y=0.275 (±0.04)
Medium
9,300k
°K
X=0.291 (±0.04)
Y=0.294 (±0.04)
Warm
6,500k
°K
X=0.318 (±0.04)
Y=0.334 (±0.04)
Cool
Min : 80
Typ : 110
Medium
Min : 80
Typ : 110
Warm
Min : 70
Typ : 110
4.3.1. Check display and sound
▪ White Balance Default value
Gain
MT48
LH4530
22MT48
22LH4530
28MT48
28LH4530
*Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (SCART/CVBS)
3) COMPONENT (480i)
4) HDMI
* Display and Sound check is executed by Remote controll.
<Test Signal>
Inner pattern
(204gray,80IRE)
*Note : *Note : x,y coordinates are drifted about 0.005 after
30 mins heat-run. So checking color coordinate within
5-min at total assembly line, consider x,y coordinates
might be up to 0.005 than x,y target of each color
temperature
24MT48
24LH4530
4.3. Function Check
<Test Signal>
Inner pattern
(204gray,80IRE)
LGD
(AHIPS /
FHD)
CMI
LE2
(VA /
HD)
BOE
(VA /
HD)
Cut
R
G
B
R
G
B
Cool
121
126
192
128
128
128
Medium
165
172
210
128
128
128
Warm
186
185
192
128
128
128
Cool
171
172
208
128
128
128
Medium
192
192
188
128
128
128
Warm
192
162
122
128
128
128
Cool
182
172
222
140
140
140
Medium
192
173
192
140
140
140
Warm
192
168
130
140
140
140
→ Caution : Not to push the INSTOP KEY after completion if
the function inspection.
Copyright ©
LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 10 -
LGE Internal Use Only
* When doing Adjustment, Please make circumstance as
below.
Color Analyzer
Probe
RS-232C
Computer
DFT JIG
RS-232C
RGB Cable
RS-232C
※
Pattern Generator
Signal Source
※If TV internal pattern is used, not needed
*Auto-control interface and directions
1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10ux).
2) Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80~100°).
3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others,
check the back light on.
MIN
* Press the ‘Instart’ key of ADJ remote controll
4.5.1. Model Name& SW Version Check
1) Check ‘Model Name’.
2) Check ‘S/W Version’ (Refer to the IC Ver. in the BOM)
4.5.2. Adjust Check
* Auto adjustment Map(RS-232C)
RS-232C COMMAND
[ CMD ID DATA ]
Wb 00
00
White Balance Start
Wb 00
ff
White Balance End
RS-232C COMMAND
[CMD ID DATA]
4.5. M
odel Name & SW Version & Adjust
check.
CENTER
(DEFAULT)
1) Check ‘Country Group’
2) Check ‘Area Option’
3) Check ‘Tool Option’ (Refer to the BOM Comments)
4) Check ‘EDID[RGB&HDMI]’ is OK.
* After check all, Press the 'EXIT' key of ADJ remote controll
to go out SVC menu.
MAX
Cool
Mid
Warm
Cool
Mid
Warm
R Gain
jg
Ja
jd
00
172
192
192
192
G Gain
jh
Jb
je
00
172
192
192
192
B Gain
ji
Jc
jf
00
192
192
172
192
R Cut
64
64
64
128
G Cut
64
64
64
128
B Cut
64
64
64
128
** Caution **
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.
(when R/G/B Gain are all C0, it is the FULL Dynamic Range
of Module)
*Note : Manual W/B process using adjusts Remote control.
1) After enter Service Mode by pushing "ADJ" key,
2) Enter "White Balance" by pushing "►" key at "White Balance".
Copyright ©
LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.6. Outgoing condition Configuration
* After all function test., press IN-STOP Key by SVC Remote
controll. And make Outgoing Condition
4.7. Ship-out mode check (In-stop)
▪ After final inspection, if monitor is power only mode, In-stop
process is started automatically when PC is turned off by
command.
Check that the unit goes to Stand-by mode.
▪ For manual in-stop, press In-Stop key of the Adj. R/C and
check that the unit goes to Stand-by mode.
▪ In-stop time
- total required time : around 10 second.(Maximum 12
second)
; time to display “In-stop OSD” : 8 second.
; time to turn on RED LED : 2 second.
- 11 -
LGE Internal Use Only
TROUBLE SHOOTING
1. No Power
Check C500
Voltage Level (19V)
N
Check Power connector
OK ?
N
Replace IC501 &
Recheck
N
Replace IC502 &
Recheck
N
Replace IC503 &
Recheck
Y
Replace Adapter
Y
Check IC501 Output
Voltage Level (3.3V)
Y
Check IC502 Output
Voltage Level (1.15V)
Y
Check IC503 Output
Voltage Level (5V)
Y
Check X300 Clock
24MHz
N
Replace X300
Y
Replace IC405 Flash
Memory
Copyright ©
LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 12 -
LGE Internal Use Only
2. No Picture
N
N
Check WLED_ENABLE High?
Module Back Light On?
Check IC300
Replace Main SOC
Y
Y
Check LED Driver Output
(C706)
Check Panel Power 12V (P401 #30)
Check IC500 Output 12V
N
N
Check IC700 & Q700
Replace LED Driver IC or FET
Replace IC500 &
Recheck
Y
Check Panel input Clock
P401 (#9, #10 )
N
Check IC300
Repair Main B/D
Y
Check FFC Cable for Damage or
Open Conductors
N
Replace Cable
Y
Replace T-Con Board or Module
Copyright ©
LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 13 -
LGE Internal Use Only
3. No Video - Digital TV
Check RF Cable
Y
1. Check RF IC(L200) Power (3.3V)
2. Check IC501 Output voltage(3.3V)
N
Replace IC501 &
Recheck
N
Replace TU200 or
IC300(=> Main Scaler)
Y
Check SCL/SDA Line(TU200 #3, #4)
Copyright ©
LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 14 -
LGE Internal Use Only
4. No Video - HDMI
Check input signal format
Is it supported?
Y
Check HDMI Cable for Damage or
Open Connector
Y
Check JK100 for proper
connection or Damage
N
Replace Connector
Y
Check I2C Signal
(JK100)
N
Re Download EDID Data
Y
Replace Main Scaler
(IC300)
Copyright ©
LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
LGE Internal Use Only
Copyright ©
LG Electronics. Inc. All right reserved.
Only for training and service purposes
HDMI 1
TMDS
22inch :148.5MHz(FHD)
20/24/28inch : 85.5MHz(HD)
MT48 : TDSS-H701F(LGIT/Half NIM)
LH4530 : VA4S1UB1388(Sharp/Half NIM)
Can tuner
IF
TMDS/DDC
S DA/SCL
I F (NTSC)
I F (ATSC)
- 16 RX
HDMI
Front
End
Audio
Video
Front
End
A nalog
Demod
DEM OD
(24M Hz)
X -ta l
EEPROM
USB2.0
540mV
UART
RX/TX
DSP
172mV
Audio
XTAL : 24MHz
HD/SD
Video
Encoder
64K x 8bi t
(128 Pin)
M1L
DDR : 800MHz
64Mbit
DDR2
8M x 8bit
S e rial Flash
LVDS
Con.
FHD
( Di gital AM P)
BM 28720MUV
S i de USB
MT48, 28LH4530 : For user
22/24LH4530 : Service only
MT48, 28LH4530 : Use(Service only)
22/24LH4530 : Not use
RS -232C(Phone j ack)
I2S
M CLK
22inch : LVDS 2ch, 1920x1080,60hz , 175MHz
20/24/28inch : LVDS 1ch, 1366x768,60hz, 82MHz
FHD or HD
LVDS out
BLOCK DIAGRAM
LGE Internal Use Only
A ir/Cable
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
300
510
200
832
831
540
A2
120
541
730
900
LV1
400
910
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts
are identified by
in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as recommended
in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Copyright ©
LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 17 -
LGE Internal Use Only
<HDMI>
+3.3V_ST
5V_HDMI_1
MMBD6100
D102
R102
10K
JP109
OPT
VA101
JP107
C
5V_DET_HDMI_1
JP110
A2
AR104
47K
A1
+5V
C
Q100
2N3904S
B
E
R120
R121
2.7K
2.7K
5.6V
5V_HDMI_1
DDC_SDA_1
DDC_SCL_1
SHIELD
R100
1K
20
C
19
18
VA100
18V
17
Q101
2N3904S
OPT
VA103
18V
OPT
B
R110
10K
HPD1
E
DDC_SDA_1
16
DDC_SCL_1
15
14
VA108
18V
EAG59023302
13
OPT
VA102
18V
12
11
10
9
8
7
6
5
4
3
2
1
VA109
18V
CK+
CK-_HDMI1
D0-
CK+_HDMI1
D0-_HDMI1
D0_GND
D0+
D1-
D0+_HDMI1
AR106
5.1
D1_GND
Jack Shield (HDMI)
D1+
D1-_HDMI1
D2-
D1+_HDMI1
D2-_HDMI1
D2_GND
D2+_HDMI1
D2+
AR105
5.1
JackShield(for NonCKD)
M100
JackShield(for CKD)
M100-*1
MGJ64944801
MGJ64944802
JK100
COMPONENT
6A
[GN/YL]E-LUG
5A
[GN/YL]O-SPRING
COMP_Y+
[GN/YL]CONTACT
5B
[BL]O-SPRING
7C
[RD1]E-LUG-S
+3.3V
Event only
+3.3V_ST
P100
COMP
AR107
10K
4A
COMP
R105
75
1%
COMP
VA113
5.6V
1
COMP
R118
1K
2
3
+3.3V_ST
4
[RD1]O-SPRING
4C
[RD1]CONTACT
5D
[WH]O-SPRING
4E
[RD2]CONTACT
5E
[RD2]O-SPRING
AV_DET
<USB_SIDE>
+5V
IC100
BD2242G
COMP_Pb+
COMP
VA104
5.6V
5
MAX 1.5A(USB 2.0)
RS232C
AR101
4.7K
5C
OPT
C102
0.1uF
16V
OPT
VA105
5.6V
10V->6.3V for CI
150625 YJLee
COMP
R106
75
VOUT
6
1
5
2
4
3
VIN
PM_TXD
1%
[RD2]E-LUG
COMP_DET
C104
10uF ZD100
5V
6.3V
OPT
PPJ245-31
JK101
COMP
VA106
5.6V
OPT
USB_SPG
(Obsolete)USB_SPG
SPG15-UCS-0203 SPG15-UCS-0203
JK103-*1
ILIM
OC
C105
0.1uF
16V
GND
R103
100
EN
USB1_CTL
R119
10K
R104
JK103
1
2
R101
100
RS232C
USB1_OCD
JP113
SIDE_USB_DM
3
JP112
AR103
100
RS232C
6
M6
1
M1
3
M3_DETECT
4
M4
5
M5_GND
SIDE_USB_DP
R112
2.2
4
2
3
<RS232C>
R111
2.2
5
4
5
COMP
R114
12K
USB DOWN STREAM
R108
COMP
470K
C100
OPT
1000pF
50V
COMP_L_IN
USB DOWN STREAM
COMP
R107
75
1%
COMP
10K
AR100
VA107
5.6V
OPT
1
COMP_Pr+
COMP
VA112
5.6V
+3.3V
PM_RXD
14K
4.7K
R122
6E
6.3V
C103
22uF
OPT
COMP
R117
1K
JP111
OPT
VA110
18V
OPT
VA111
18V
Add for EOS
150309 YJLee
RS232C
VA123
18V
RS232C
VA124
18V
JK104
COMP_R_IN
VA122
5.6V
OPT
R109
COMP
470K
C101
OPT
1000pF
50V
COMP
R113
12K
JP116
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2016 LG Electronics. Inc. All right reserved.
Only for training and service purposes
JP128
JP129
JP130
M1L_CI
JACK INTERFACE
2015-06-27
1
7
LGE Internal Use Only
TUNER
+3.3V_TU
TU200
VA4S1UB1388
R207
1.8K
1
2
3
4
5
6
7
8
R208
1.8K
SCL
AR201
TU_SCL
200
SDA
TU_SDA
OPT
B[+3.3V]
OPT
C204
18pF
50V
C206
18pF
50V
C208
20pF
50V
C209
20pF
50V
NC_1
+3.3V_TU
121118
SS BEAD->SUNLORD BEAD
IF_AGC
L200 120OHM
NC_2
IF[N]
AR200
C212
0.1uF
16V
C211
100pF
50V
33
IF[P]
C214
100uF
16V
105C
OPT
close to the tuner pin, add,09029
Close to the tuner
OPT
C200
0.1uF
16V
9
OPT
C201
0.1uF
16V
R206
1K
IF_AGC
C207
0.1uF
16V
SHIELD
should be guarded by ground
Close to TUNER
Ready to solve noise issue.
DIF_N
DIF_P
1. should be guarded by ground
2. No via on both of them
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils
+3.3V
Apply->OPT for CI
150625 YJLee
Bead(3.3_TU)
L203
UBW2012-121F
C210
22uF
6.3V
C213
0.1uF
16V
C215
22uF
6.3V
C217
0.1uF
16V
60mA
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
0ohm(3.3_TU)
L203-*1
0
+3.3V_TU
M1L_CI
Tuner block
2015-06-27
2
7
TUNER
Copyright ⓒ 2016 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+3.3V_ST
AR309
4.7K
+3.3V_ST
R313
10K
R314
PWM1
M1L Chip sel
PDIM
10V
C341
2.2uF
R300
4.7K
OPT
R310
3.9K
PWM0
100
WLED_DIM_ADJ
R302
4.7K
RXA0+
BLU_CURRENT_CTL
1/16W
5%
USB1_OCD
DIMMING
RXA0-
USB1_CTL
RXB3+
RXB3-
RXBCK-
RXBCK+
RXB2+
RXB1+
RXB2-
RXB0+
RXB1-
RXB0-
P_AMP_SDA
TU_SDA
P_AMP_SCL
MULTI_ON
TU_SCL
HPD1
PANEL_CTL
PWM1
PWM0
SPI_SDO
SPI_SDI
0.1uF
C335
AR305
10K
/SPI_CS
SPI_SCK
+5V
Delete AMP_SCL/SDA Pull-up resistor for CI
150630 YJLee
PM_TXD
PM_RXD
I2C_SCL
/FLASH_WP
16V
I2C_SDA
LVA0P
65
66
LVA0M
GPIO29
67
GPIO28
68
LVB3P
LVB3M
70
69
LVBCLKP
71
LVBCLKM
72
LVB2P
AVDD_LPLL
73
74
LVB2M
75
LVB1P
76
LVB1M
77
LVB0P
78
LVB0M
79
GPIO7
80
GPIO5
GPIO6
81
82
GPIO4
83
GPIO2
84
GPIO1
85
86
GPIO0
HOTPLUG_A
87
88
PWM0/GPIO15
89
SPI_DO
90
SPI_DI
91
SPI_CZ
92
SPI_CK
64
97
RXA1-
LVA1P
IR
INT/GPIO64/I2S_OUT_MCK
98
63
LVA2M
RESET
99
62
LVA2P
DM_P0
100
61
LVACLKM
LED_AMBER
SOC_RESET
SIDE_USB_DM
DP_P0
101
AVDD_MOD_3
102
+3.3V_ST
[M1L] 128 PIN
RXA2RXA2+
RXACK-
60
LVACLKP
59
LVA3M
RXACK+
RXA3-
SAR0/GPIO75
103
58
LVA3P
SAR1/GPIO74
104
57
GPIO53/I2S_OUT_SD
SAR2/GPIO73
105
56
GPIO52/I2S_OUT_BCK
VDDC_4
106
55
GPIO51/I2S_OUT_MCK
VDDIO_DATA
107
54
GPIO50/I2S_OUT_WS
GPIO54
108
53
GPIO49/SPDIF_OUT
KEY1
RXA3+
KEY2
111
112
DDCDA_CLK
113
GPIO67
114
GPIO70
115
GPIO86
116
DDCDB_DAT
117
DDC_SDA_1
AMP_MUTE
VDDIO_CMD
45
AVDD_MOD_2
44
XTAL_OUT
AVDD3P3_DMPLL
EFUSE
120
41
AVDD3P3_DADC
R339
XTAL_IN
40
VIFM
122
39
VIFP
RXCP_B
123
38
IFAGC
RX0N_B
124
37
LINEOUT_R3
RX0P_B
125
36
LINEOUT_L3
RX1N_B
126
35
VRM_ADC
RX1P_B
127
34
VAG
[EP]
128
C338
0.1uF
16V
C327
10V->6.3V for CI
150625 YJLee
10V->6.3V for CI
150625 YJLee
0.1uF
+3.3V_ST
DTV_IF
C329
0.1uF
16V
DIF_N
0.1uF
16V
C337
0.1uF
16V
DIF_P
OPT
C334
100pF
50V
0ohm(IF_AGC)
L303-*1
0
OPT
C333
50V
100pF
+3.3V
0.1uF
Apply->OPT for CI
150625 YJLee
NON_A_DEMODE
AGC 1.25V
100 OHM SERIAL
A_DEMODE 0ohm
C342
16V
16V
0.1uF
C325
R340
10K
R341
100
IF_AGC
C345
0.047uF
25V
L302
BLM15PX121SN1
6.3V
10uF
C326
32
LINEIN_L1
31
14.08.21
27->30pF
30pF
+3.3V_ST
16V C328
33
50V
Close to MSTAR
COMP_L_IN
2.2uF
10V
C324
LINEIN_R1
30
LINEIN_L0
29
LINEIN_R0
COMP
COMP_R_IN
+1.15V_VDDC
+3.3V_ST
2.2uF
C323
10V
COMP
28
27
VDDC_1
AVDD_AU33
25
26
CVBS_OUT1
R338
180
C322
0.047uF
VCOM
COMP_Y+
COMP_Pr+
COMP_Y+
R333 COMP 68
+3.3V_ST
25V
24
23
CVBS0
RIN1P
22
21
GIN1M
GIN1P
20
SOGIN1
COMP
R309
33
COMP_Pb+
D2+_HDMI1
D2-_HDMI1
D1+_HDMI1
D1-_HDMI1
D0+_HDMI1
D0-_HDMI1
CK+_HDMI1
16V
CK-_HDMI1
19
12
HSYNC0
11
RX2P_A
10
RX2N_A
9
RX1P_A
8
RX1N_A
7
RX0P_A
6
RX0N_A
5
RXCP_A
4
RXCN_A
3
2
THERMAL
129
121
RXCN_B
X300
24.0MHz C344
30pF
50V
Close to MSTAR
VDDC_5
C336
0.1uF
+1.8V_DDR
C343
42
RX2N_B
0.1uF
16V
C310
16V
0.1uF
0.1uF
16V
C308
0.1uF
16V
C307
C306
10V
C304
1uF
10uF
C302
6.3V
46
43
+3.3V_ST
Copyright ⓒ 2016 LG Electronics. Inc. All right reserved.
Only for training and service purposes
+1.15V_VDDC
+1.15V_VDDC
119
10V->6.3V for CI
150625 YJLee
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
VDDC_2
118
1
+1.15V_VDDC
VDDC_3
47
HOTPLUG_B
AVDD_MOD_1
<VDDC 1.15V>
GPIO44/I2C_SDAM/UART_TX1
48
DDCDB_CLK
RX2P_B
+1.15V_VDDC
GPIO45/I2C_SCLM/UART_RX1
MODEL_OPT
49
+3.3V_ST
BIN1P
I2C_SCL
COMP
0.047uF
C316
25V
COMP
COMP
1000pF
R311
33 C317
50V
COMP
COMP
R312
33 C318
0.047uF
25V
COMP
C319
0.047uF
25V
COMP
COMP
C320
R315
33
0.047uF
25V
COMP
COMP 25V
0.047uF
R337
150 C321
I2C_SDA
18
DDC_SCL_1
17
HD
VSYNC0
FHD
AVDD3P3_ADC
MODEL_OPT_1
16
HIGH
15
LOW
RIN0P
PIN NAME
50
R1069
OPT
0
C303
GPIO83
DDCDA_DAT
AMP_RESET_N
GPIO46
5V_DET_HDMI_1
GIN0M
10V->6.3V for CI
150625 YJLee
MODEL OPTION
GPIO47
51
10uF
LED_RED
52
0.1uF
16V
GPIO84
110
6.3V
C301
109
16V
GPIO55
6.3V
C340
0.1uF
22
AUD_LRCK
COMP_DET
C331
10uF
100
R317
14
MO_HD
R305
1K
R316
DISP_EN
MODEL_OPT
GIN0P
POWER_ON/OFF1
13
C311
0.1uF
16V
10uF
6.3V
C309
MO_FHD
R304
1K
+3.3V_ST
AUD_SCK
BLM15PX121SN1
+1.15V_VDDC
BIN0P
+1.8V_DDR
IC301
<HW_OPT>
MSD8222LUM
AUD_LRCH
Bead(IF_AGC)
L303
16V
10V
C339
0.1uF
SIDE_USB_DP
C332
1uF
RXA1+
1M
1%
C305
0.1uF
16V
R303
100K
DDCA_DA
AV_DET
IRIN
A1
LVA1M
CEC/GPIO71
SOC_RESET
C
D400
MMBD6100
OPT A2
93
R307
22
94
C300
10uF
6.3V
96
10V->6.3V for CI
150625 YJLee
95
+3.3V_ST
DDCA_CK
E
TESTPIN
Q300
2N3904S
AR302
33
DISP_EN
1/16W
1%
R347
20K
<SOC_RESET>
B
PWM1/GPIO14
WLED_ENABLE
C
R301
4.7K
C330
0.1uF
16V
M1L_CI
MAIN
2015-06-27
3
7
LGE Internal Use Only
Module(HD)
IR/LED and Control
HD(12V Panel)
Module(FHD)
P401
10031HR-30
+3.3V_ST
FHD(5V Panel)
P400
P402
12507WR-08L
10031HR-30
+5V_PANEL_POWER
Apply->OPT for CI
150625 YJLee
5
3
JP402
30V
16Y_CONTROL
AR401
30V
100
D410
CDS3C30GTH
KEY1
FHD(5V Panel)
C404
0.1uF
16V
4
4
RXA3+
6
RXA3-
7
For Interlace Mode
High : Interlace Mode
Low : Normal Mode
2013.07.15
8
100
C
Q400
C
R404
10K
2N3904S
E
B
7
Q401
LED_AMBER
PIN22(23.6")
R406
200
2N3904S
R405
4.7K
OPT
R420
100
2
3
4
5
R422
0
6
7
RXACK+
9
10
RXA3+
8
RXACK-
11
RXA3-
9
12
RXACK+
10
RXA2+
13
RXACK-
11
RXA2-
8
IR
E
0~0.7V
JP410
50V
C400
1000pF
OPT
R402
10K
6
JP409
9
VESA
JEDIA
2.7~3.3V/Open
PIN22(27.5"BOE,29")
0~0.7V
JEDIA
VA400 18V
B
LED_RED
OPT
R418
4.7K
JP414
5
JP408
R400
10K
+3.3V
1
5.6K
R421
2
2
5.6K
R419
1
JP401
FHD(5V Panel)
JP400
3
KEY2
D411
CDS3C30GTH
15Y_CONTROL
AR400
FHD(5V Panel)
3.3K
AR413
1
RXA2+
12
15
RXA2-
13
RXA1+
RXA1-
16
RXA0+
VESA
2.7~3.3V/Open
14
RXA1+
15
18
RXA1-
16
17
19
RXA0-
#21 23.6(LGD) Interlace Mode Selection
High : Interlace Mode
Low : Normal Mode
0
R401
2015.08.18
PIN22(27.5"CSOT)
0~0.7V/Open
VESA
2.7~3.3V
14
17
23.6"LGD(LVDS)
0
R417
JEDIA
R416
PIN23
23.6"CMI(LVDS)
0
20
RXA0+
18
21
RXA0-
19
22
RXB3+
20
23
RXB3-
21
24
RXBCK+
22
25
RXBCK-
23
27.5"(LVDS)
GND
27.5"
NC(OPEN)
23.6",29"
Change option
150508 YJLee
25V->16V for CI
150625 YJLee
27
RXB2+
25
28
RXB2-
26
29
RXB1+
27
30
RXB1-
28
RXB0+
29
RXB0-
30
31
5.6K
R415
5.6K
R414
HD(12V Panel)
HD(12V Panel)
C403
0.1uF
16V
HD(12V Panel)
+12V_PANEL_POWER
24
26
31
JP412
JP413
<SERIAL FLASH>
+3.3V_ST +3.3V_ST
<NVRAM>
SPI_FLASH_MACRONIX_16Y
+3.3V_ST
IC405
MX25L6433FM2I-08G
R564
10K
R569
4.7K
OPT
CS#
/SPI_CS
1
8
2
7
3
6
4
5
VCC
C556
0.1uF
16V
SO/SIO1
SPI_SDO
HOLD#/SIO3
+3.3V_ST
WP#/SIO2
/FLASH_WP
GND
SCLK
SPI_SCK
SI/SIO0
SPI_SDI
ATMEL_EEPROM
AT24C512C-SSHD-T
SPI_FLASH_WINBOND_15Y
Rohm_EEPROM
IC403-*1
BR24G512FJ-3
IC405-*1
W25Q64FVSSIG
CS
DO[IO1]
WP[IO2]
GND
1
8
2
7
3
6
4
5
VCC
%HOLD[IO3]
CLK
DI[IO0]
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2016 LG Electronics. Inc. All right reserved.
Only for training and service purposes
A0
A1
1
8
2
7
3
6
4
5
A0
VCC
A1
GND
8
2
7
VCC
WP
IC403
WP
A2
A2
1
SCL
3
6
SCL
R573
22
SDA
R574
22
I2C_SCL
SDA
GND
4
5
C552
0.1uF
16V
I2C_SDA
M1L_CI
MEMORY/LVDS/IR
2015-06-27
4
7
LGE Internal Use Only
19V to 12V (For HD Panel)
MULTI_ON
** 3.3V_ST -> 1.15V VDDC
HD(12V Panel)
IC500
MP2315GJ
+19V
JK500
OPT
R501
47K
JP500
HD(12V Panel)
R508
10K
AAM
1
8
2
7
FB
IC501
AP7173-SPG-13 HF(DIODES)
+12V_Normal
KJA-DC-1-0032
[EP]
L502
VCC
10uH HD(12V Panel)
2
1
JP501
OPT
OPT
C500
C501
C502
10uF
10uF
47uF
25V
25V
25V
105C
Check the Ripple
SW
C504
2.2uF
25V
C506
0.1uF
50V
GND
3
3A
4
68->100 150322 YJLee
BST To reduce SW spike voltage
OPT
R509
2K
R505
100
5
HD(12V Panel)
HD(12V Panel)
1
8
EN/SYNC
6
HD(12V Panel)
25V->16V for CI
150625 YJLee
C517
0.1uF
16V
C528
0.1uF
16V
C524
10uF
16V
R520
43K
1%
PG
VCC
R521
100K
1%
R502
10K
Change X7R(3216)->X5R(2012) for CI
150625 YJLee
C512
0.1uF
50V
HD(12V Panel)
C522
10uF
16V
R522
10K
1%
EN
2
9
IN
THERMAL
IN
4
+1.15V_VDDC
V0 = 0.8*(1+(R1/R2))
+3.3V_ST
HD(12V Panel)
R517
33K
7
3
6
4
5
OUT
FB
R1
R503
6.8K
GND
1%
OPT
C513
10uF
10V
OPT
ZD500
2.5V
1%
C505
560pF
50V
C503
10uF
10V
X5R(EAE31360401) -> X7R(EAE52158501)
To improve CST Issue.
2013.11.27 by BJ.KIM
HD(12V Panel)
X5R(EAE31360401) -> X7R(EAE52158501)
To improve CST Issue.
2013.11.27 by BJ.KIM
HD(12V Panel)
HD(12V Panel)
HD(12V Panel)
HD(12V Panel)
OPT
C508
10uF
10V
C507
10uF
10V
R506
3K
R2
SS
HD(12V Panel)
HD(12V Panel)
+3.3V_ST
S
+3.3V
R544
22K
C534
G
4.7uF
10V
SSM3J332R
Q502
+3.3V_ST
D
C536
R542
R537
10K
POWER_ON/OFF1
100
C
R538
100K
1uF
10V
OPT
Q500
2N3904S
B
C540
0.1uF
16V
E
+3.3V
+1.8V_DDR
IC504
AZ1117EH-ADJTRG1
IN
OUT
ADJ/GND
R500
330
1/10W
1%
1.3A
R516
150
1/16W
1%
C533
10uF
6.3V
10V->6.3V for CI
150625 YJLee
R1
ZD300
2.5V
OPT
C537
10uF
6.3V
R2
10V->6.3V for CI
150625 YJLee
Vout=1.25*(1+R2/R1)+Iadj*R2
R559
1K
PANEL POWER CONTROL
+5V
8
2
7
FB
L503
SW
C509
2.2uF
25V
C511
0.1uF
50V
GND
3
4
6
3A
5
VCC
10uH
EN/SYNC
R529
47K
BST
68->100 150322 YJLee
To reduce SW spike voltage
R549
10K
IN
R514
100
C516
0.1uF
50V
1%
C520
0.1uF
16V
C527
10uF
6.3V
C531
10uF
6.3V
C532
0.1uF
16V
Copyright ⓒ 2016 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Q503
SSM3J332R
R545
100K
C
FHD(5V Panel)
Q504
2N3904S
B
7.5K
1%
10V->6.3V for CI
150625 YJLee
C535
4.7uF
16V
+5V_PANEL_POWER
HD(12V Panel)
R550
0
FHD(5V Panel)
R551
0
E
R530
R530:8.2k->7.5k
150918 HJChoi
FHD(5V Panel)
HD(12V Panel)
R546
R546-*1
15K
75K
0
R567
FHD(5V Panel)
PANEL_CTL
R540
4.7K
C
Q501
2N3904S
B
R531
R546:10k->15k
FHD/150918 HJChoi
10K
1%
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
FHD(5V Panel) HD(12V Panel)
R541
R539
0
0
S
1
+12V_PANEL_POWER
G
AAM
+5V
R519
33K
FHD(5V Panel)
R588
1K
R504
47K
+12V_Normal
D
IC503
MP2315GJ
C510
0.47uF
16V
OPT
R543
10K
MULTI_ON
E
M1L_CI
POWER
2015-06-27
6
7
LGE Internal Use Only
AMP_RESET_N
AUDIO AMP
+3.3V_ST
R604
10K
R606
100
Q600
2N3904S
C606
1000pF
50V
OPT
10K
E
C607
50V
R601 B
AMP_MUTE
1000pF
OPT
C
AR600
10K
+3.3V
L602
10.0uH
P_AMP_SDA
GNDP1
22
BSP1N
21
OUT1N
18
GNDP2
DGND
8
17
VCCP2
OUT2N
NC_1
ERROR
STADAO
4 SPK_L+
+19V
C612
4.7uF
10uF
C609
10V
JP603
JP602
JP601
3 SPK_L-
L600
10.0uH
25V
C630
10uF
25V
2 SPK_R+
NRS6045T100MMGK
C619
680pF
50V
16
7
15
REG15
14
BSP2P
13
OUT2P
19
12
20
6
11
5
PLL
10
TEST1
P600
250A1-WR-H04M
OPT
C614
100uF
25V
105C
C621
0.33uF
50V
R610
5.6
R611
5.6
C620
680pF
50V
OPT
C625
0.47uF
50V
JP607
23
NRS6045T100MMGK
C613
100uF
25V
105C
25V
L603
10.0uH
JP606
VCCP1
C624
0.33uF
50V
C616
4.7uF
10V
24
C629
10uF
25V
C618
680pF
50V
OPT
C626
0.47uF
50V
JP604
OUT1P
C610
10uF
25
REG_G
27
RSTX
NC_2
28
29
MUTEX
30
31
C611
4
TEST3
10V
C601
1uF
0.027uF C603
50V
IC600
BM28720MUV
9
1.5K
R603
OPT
SDATA
C605
1uF
10V
C600
2700pF
50V
R609
5.6
C615
4.7uF
10V
3
C623
0.33uF
50V
JP605
10uF
10V
4.7uF
10V
2
LRCK
NRS6045T100MMGK
R608
5.6
+19V
THERMAL
33
DVDD
JP600
SCL
C608
BCLK
AUD_LRCK
AUD_LRCH
C617
680pF
50V
1
TEST2
AUD_SCK
32
ADDR
SDA
[EP]
3.3K
R605
BSP1P
C604
33pF
50V
OPT
BSP2N
C602
33pF
50V
OPT
26
P_AMP_SCL
1 SPK_R-
WAFER-ANGLE
C622
0.33uF
50V
L601
10.0uH
NRS6045T100MMGK
R607
100K
+3.3V
Copyright ⓒ 2016 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
+3.3V
M1L_CI
AMP_ROHM
2015-06-27
6
7
LGE Internal Use Only
LED DRIVER
+19V
L1001
33uH
D1002
BR210
100V
High : 1.5V
PDIM
R1039
100
ADIM
R1006
0
WLED_ENABLE
IC1001
MP3378E
OPT
C1019
100pF
50V
Apply->OPT for CI
150727 YJLee
Switching
R1036
20K
1%
Freq:306KHz
R1035
200K
1%
GND1
OSC
27.5 22/23.6LGD/27.5
R1024
R1025
1.3K
6.2K
1%
1%
23.6LGD
R1025-*3
2.7K
ISET
1
2
OPT
R1023
C1020
100K
100pF
1%
50V
Apply->OPT for CI
150727 YJLee
[EP]GND
PWM
28
D
R1051
29
3
26
22
R1025-*1
3.3K 1%
R1041
2K
ADIM
4
25
C1032
COMP
VCC1
C1022
VIN1
1uF
25V
23.6CMI
C1021
1000pF
50V
NC_1
+19V
CH1
R1005
NOT23.6CMI
R1000
0
7
22
8
21
ISENSE
SYNC
R1009
3.9K
1%
R1026
FB
9
20
10
19
11
18
12
17
BST
EN2
23.6CMI
R1001
0
13
Add sync circuit
150512 YJLee
68->100 150322 YJLee
To reduce SW spike voltage
AGND
R1018
100
GND2_2
C1017
0.1uF
50V
R1027
10K
+3.3V_ST
GND2_1
L1003
16
19V to 3.3V Ground should be separated
10uH
SW
+19V
R1007
15K
14
R1028
VIN2
15
C1016
0.1uF
50V
C1011
0.1uF
16V
R1059 100K
LED_CH1
R1056 100K
LED_CH3
R1058 100K
LED_CH2
CH3
VCC2
0.1
1%
3.9K
1%
100K
CH2
CH4
23
1K
NC_2
23.6
R1022-*1
12K
1%
1/8W
6
C1031
1uF
25V
GATE
0
23.6CMI
R1066
LED1
OVP
23.6_NOT
R1022
9.1K
1%
1/8W
24
C1033
0.47uF
50V
1%
R1010
LED2
R1034
510K
1/8W
1%
LED3
5
R1045
270
R1044
100k->33k(3V->1.6V)
140323 YJLee
LED4
4700pF
50V
+19V
C1030
2.2uF
25V
C1018
22uF
6.3V
OPT
C1028
10uF
6.3V
1.6K
C1029
0.1uF
16V
1%
R1029
PESD5V0S1UA
R1042
33K
1%
0
23.6CMI
R1063
1%
23.6CMI
R1025-*2 R1024-*1
3.9K 1%
270 1%
Q1002
AOD2922
G
S
1%
BLU_CURRENT_CTL
33
EN1
27
ZD1000
5V
PDIM
R1019
100K
1%
THERMAL
WLED_DIM_ADJ
1.6K
1%
R1008
51K
10V->6.3V for CI
150625 YJLee
33K->51K
R1030
1K
+19V
1%
GND->19V MPS recommend
150326 YJLee
(OPT)Bead_500ohm
R1003-*1
Vout
500
0ohm
R1003
L1000
500
0
OPT
C1000
1uF
50V
OPT
R1002
100K
OPT
C1001
1uF
50V
OPT
R1004
100K
7
6
M1005
5
M1006
4
CMI23.6
R1068 M1007
0
CH3
R1049
0
3
2
M1008
Copyright ⓒ 2016 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2
1
12507WR-06L
P1004
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
3
33uF->10uF for CI
150704 YJLee
1
CH4
CMI23.6_NOT
4
C1023
33uF
100V
12507WR-06L
P1005
Vout
5
CH2
6
(LEFT WAFER)22"NOT
M1004
CH1
(UPSIDE WAFER)22"
7
C1024
10uF
100V
M1L_CI
LED DRIVER
2015-06-27
7
7
LGE Internal Use Only
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