HP Compaq dc5800 Business PC

HP Compaq dc5800 Business PC

QuickSpecs

Overview

1.

(2) 5.25” external bays and (2) 3.5” internal bays

2.

(1) 3.5” external bay for optional HP 16-in-1 Media Card

Reader, diskette drive, or other 3.5” device

3.

300-watt power supply

5.

(1) full-height PCI slot, (2) full-height PCIe x1 slots, (1) fullheight PCIe x16 (ADD2/SDVO) slot

6.

Front I/O: (2) USB 2.0, headphone and microphone, Dual

Color Diagnostic LEDs

4.

Rear I/O: (6) USB 2.0, (1) standard serial port, (1) optional serial port, (1) optional parallel port, (2) PS/2,

(1) RJ-45, (1) VGA, (1) audio in, (1) audio out

7.

2-Button Scroll Mouse (PS/2, Optical Scroll Mouse (PS/2 or

USB), or USB Laser Mouse

8.

HP Standard Keyboard (PS/2 or USB) or HP USB Smartcard

Keyboard

9.

Monitor (sold separately)

DA - 12863 North America — Version 1 — February 11, 2008 Page 1

QuickSpecs

Overview

1.

(1) 3.5” external bay for optional HP 16-in-1 Media Card

Reader, diskette drive, or other 3.5” device;

(1) 3.5” internal bay

2.

3.

(1) 5.25” external bay for optional optical drive, or other

5.25” device (bay tilts up for device removal and insertion)

240-watt power supply

4.

Rear I/O: (6) USB 2.0, (1) standard serial port, (1) optional serial port, (1) optional parallel port, (2) PS/2, (1) RJ-45, (1)

VGA, audio in/out

5.

(1) low profile PCI slot, (2) low profile PCIe x1 slots,

(1) low profile PCIe x16 (SDVO/ADD2) slot

6.

Front I/O: (2) USB 2.0, headphone and microphone, Dual

Color Diagnostic LEDs

7.

2-Button Scroll Mouse (PS/2), Optical Scroll Mouse (PS/2 or USB), or USB Laser Mouse

8.

HP Standard Keyboard (PS/2 or USB) or HP USB Smartcard

Keyboard

9.

Monitor (sold separately)

DA - 12863 North America — Version 1 — February 11, 2008 Page 2

QuickSpecs

Overview

The HP Compaq dc5800 offers a stable solution with mainstream features and flexibility that exceed basic business requirements

Intel® Q33 Express chipset, Intel Core™ 2 Duo processors, Intel Core 2 Quad processors, and Intel Graphics Media

Accelerator 3100 integrated graphics

Embedded TPM1.2 compliant security module* (Vista Bit-Locker ready)

Support for up to 500-GB SATA 3.0Gb/s Smart IV hard drives

Value-added software on select models

HP Total Care Advisor

HP Backup and Recovery Manager

HP Software Agent

HP ProtectTools security software suite

Altiris Deployment Solution Agent

Symantec AntiVirus 10.0 with 60 day Live Update Subscription

HP Insight Diagnostics software

Microsoft Office 2007

Verdiem Surveyor remote power management agent

PDF Complete

Computrace for Desktops (select countries)

Value-added software available for free download from the Web ( http://www.hp.com/go/easydeploy )

HP Client Configuration Manager, Basic Edition

HP Client Manager for Altiris

Altiris Out-of-Band Management Solution

HP SoftPaq Download Manager

HP System Software Manager

HP Client Catalog for Microsoft SMS

Verdiem Surveyor remote power management agent

Fully compatible software OS image across all models (Microtower, Small Form Factor)

HP BIOS for security, manageability and software image stability

Standard 3-years parts, 3-years labor, and 3-years on-site warranty services

(terms and conditions vary by country; certain restrictions and exclusions apply)

HP Insight Diagnostics software

Selected configurations with global availability easily set up and ordered through HP.com Business to Business portals

( http://h10019.www1.hp.com/business-site/index.html

)

Tailored HP Factory Express deployment and lifecycle services available

( http://h71028.www7.hp.com/enterprise/cache/97688-0-0-225-121.aspx

)

*TPM module disabled where use is restricted by law; for example, Russia.

DA - 12863 North America — Version 1 — February 11, 2008 Page 3

QuickSpecs

Configurable Components - Select Models (localized by Regions)

configuration choice specified in the body of this document and may include references to modules that are out of date and no longer available.

DA - 12863 North America — Version 1 — February 11, 2008 Page 4

QuickSpecs

Standard Features and Configurable Components

One of the following

Genuine Windows Vista Business 32*

Genuine Windows Vista Business 64*

Genuine Windows Vista Home Basic 32*

Genuine Windows Vista Ultimate 32*

Genuine Windows Vista Business 32* with downgrade to XP Professional preinstalled

FreeDOS

Red Hat Enterprise Linux

SUSE Linux Enterprise Desktop 10

* Certain Windows Vista product features require advanced or additional hardware. See http://www.microsoft.com/windowsvista/getready/hardwarereqs.mspx

and http://www.microsoft.com/windowsvista/getready/capable.mspx

for details. Windows Vista Upgrade

Advisor can help you determine which features of Windows Vista will run on your computer. To download the tool, visit http://www.windowsvista.com/upgradeadvisor .

select models; not included with FreeDOS)

Altiris Deployment Solution Agent

HP Software Agent

Altiris Out-of-Band Management Solution

HP Insight Diagnostics

(available via HP Backup and Recovery Manager)

Computer Setup Utility

HP Backup and Recovery Manager

HP Total Care Advisor

Microsoft Office 2007 Basic

Microsoft Office 2007 Personal

Microsoft Office 2007 Professional

Microsoft Office 2007 Small Business

Microsoft Works 8.5

Microsoft Internet Explorer with AOL Toolbar

PDF Complete

Computrace for Desktops (select countries) Symantec AntiVirus 10.0 with 60 day Live Update

Subscription

Sonic/Roxio DigitalMedia Plus 7.2

(select models)

or

Easy Media Creator 9 (select models)

Verdiem Surveyor agent

InterVideo WinDVD 5.0 (select models)

HP ProtectTools security software suite

(available for free download from the Web http://www.hp.com/ go/easydeploy )

HP Client Configuration Manager, Basic Edition HP Client Catalog for Microsoft SMS

HP Client Manager for Altiris

HP SoftPaq Download Manager

HP Systems Software Manager

Verdiem Surveyor agent

HP Stable Platform Program

Business-to-Business Portals

HP Global Series Services

Factory Express Deployment and Lifecycle Services

TPM 1.2 Security chip*

* TPM module disabled where use is restricted by law; for example, Russia.

DA - 12863 North America — Version 1 — February 11, 2008 Page 5

QuickSpecs

Standard Features and Configurable Components

On-site Warranty and Service

Note 1

: This three-year (3-3-3), limited warranty and service offering delivers three years of parts, labor and on-site repair. Response time is next business-day

Note 2

and includes free telephone support

Note 3

24 x 7. Global coverage

Note 2

ensures that any product purchased in one country and transferred to another non-restricted country will remain fully covered under the original warranty and service offering. Some countries/regions do not offer one year onsite and labor. For HP Care Pack services see http://www.hp.com/go/lookuptool .

HP third-party provider, and is not available in certain countries. Global service response times are based on commercially reasonable best effort and may vary by country.

hardware and software. Toll-free calling and 24 x 7 support may not be available in some countries.

14.85 x 6.95 x 16.85 in 3.95 x 13.3 x 14.9 in

(H x W x D)

N/A 1.05 x 6.95 x 7.83 in

(26.75 x 176.46 x 198.87 mm)

(H x W x D)

19.75 lb (8.96 kg)

1739 cu in

28.79 lb (13.06 kg)

77.1 lb (35 kg)

17.86 lb (8.10 kg)

941.63 cu in

26.70 lb (12.11 kg)

77.1 lb (35 kg) orientation)

12.0 x 19.76 x 23.62 in

(H x W x D)

* Configured with 1 hard drive, 1 optical drive, no diskette drive, and no PCI card.

300W power supply – passive PFC

USB 2.0

Serial

Parallel

9.72 x 19.68 x 22.67 in

240W power supply – active PFC

300W 80 PLUS* power supply – active PFC 240W 80 PLUS* power supply – active PFC

* This alternate 80% efficient power supply is a requirement for ENERGY STAR 4.0 compliance in conjunction with a select range of processors and modules.

8 (2 front, 6 rear)

1 standard with 2 nd

optional

1 optional

PS/2

Video

DVI output

Support for Multi-Monitor

Audio

NIC (RJ-45)

1 keyboard, 1 mouse analog for integrated graphics available via ADD2 card in PCIe x16 connector available via ADD2 card in PCIe x16 connector or via PCIe graphics cards

Integrated High Definition audio with internal speaker

Front – mic and headphone

Rear – input (supports microphone or line input), line out

Integrated Intel 82566DM Gigabit Network Connection Ethernet

DA - 12863 North America — Version 1 — February 11, 2008 Page 6

QuickSpecs

Standard Features and Configurable Components

Intel Q33 Express chipset X X

One of the following

Intel Celeron 420 Processor (1.6-GHz, 512K L2 cache, 800-MHz FSB)

Intel Celeron 430 Processor (1.8-GHz, 512K L2 cache, 800-MHz FSB)

Intel Celeron E1200 Processor (1.6-GHz, 512K L2 cache, 800-MHz FSB)

Intel Pentium E2160 Processor (1.8-GHz, 1-MB L2 cache, 800-MHz FSB)

Intel Pentium E2180 Processor (2.0-GHz, 1-MB L2 cache, 800-MHz FSB)

Intel Pentium E2200 Processor (2.2-GHz, 1-MB L2 cache, 800-MHz FSB)

Intel Core 2 Duo E4500 Processor (2.20-GHz, 2 MB L2 cache, 800-MHz FSB)

Intel Core 2 Duo E4600 Processor (2.40-GHz, 2 MB L2 cache, 800-MHz FSB)

Intel Core 2 Duo E6550 Processor (2.33-GHz, 4 MB L2 cache, 1333-MHz FSB)

Intel Core 2 Duo E6750 Processor (2.66-GHz, 4 MB L2 cache, 1333-MHz FSB)

Intel Core 2 Duo E8200 Processor (2.66-GHz, 6 MB L2 cache, 1333-MHz FSB)

Intel Core 2 Duo E8400 Processor (3.0-GHz, 6 MB L2 cache, 1333-MHz FSB)

Intel Core 2 Quad Q9300 Processor (2.50-GHz, 6 MB L2 cache, 1333-MHz FSB) X X

* Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families.

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

Memory upgrades are accomplished by adding single or multiple DIMMs of the same or varied sizes.

This chart does not represent all possible memory configurations. The Intel Q33 Express chipset supports non-ECC DDR2 PC2-6400 (800-MHz) memory.

removing memory modules. Regardless of the power-on state, voltage is always supplied to the memory modules as long as the computer is plugged in to an active AC outlet. Adding or removing memory modules while voltage is present may cause irreparable damage to the memory modules or system board.

For best performance, add the same amount of total memory to each channel and do not mix speeds.

For dual-channel symmetric performance, the total amount of memory in each channel must be equal. If speeds are mixed, speed will default to the slowest DIMM.

DA - 12863 North America — Version 1 — February 11, 2008 Page 7

QuickSpecs

Standard Features and Configurable Components

Supports up to 8-GB of DDR2 SYNCH DRAM. Slot 1 is black and must always be populated. Not all

memory configurations possible are represented below.

memory may not be available due to system resource requirements. Addressing memory above 4 GB requires a 64-bit operating system.

512-MB

1-GB

512-MB 512-MB

(dual-channel symmetric)

1-GB 1-GB

(dual-channel symmetric)

512-MB 512-MB 512-MB 512-MB

(dual-channel symmetric)

1-GB 512-MB 1-GB 512-MB

(dual-channel symmetric)

1-GB 1-GB 1-GB 1-GB

(dual-channel symmetric)

2-GB 2-GB 2-GB 2-GB

(dual-channel symmetric)

* The Intel Q33 Express chipset includes a built-in Management Engine (ME), which allocates memory for manageability functions.

Management Engine memory is shared with system memory. If the PC contains a single DIMM, 16 MB of memory is pre-allocated for it at system startup. If the PC contains two DIMMs, 32 MB of memory is pre-allocated. This memory is not made available to the operating system, just as pre-allocated video memory is not available.

One of the following

512-MB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (1 x 512)

1-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (1 x 1GB)

1-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (2 x 512)

2-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (1 x 2GB)

2-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (2 x 1GB)

2-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (4 x 512)

3-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (3 x 1GB)

4-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (4 x 1GB)

4-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (2 x 2GB)

8-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (4 x 2GB)

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

DA - 12863 North America — Version 1 — February 11, 2008 Page 8

QuickSpecs

Standard Features and Configurable Components

1 full-height

35W

2

10W

1 full-height functions as SDVO/ADD2 slot)

3.5”

5.25”

Internal 3.5” HDD Bays

60W

1

2

2

SATA

SATA 3.0Gb/s

1 low-profile

35W

2

10W

1 low-profile

25W

1

1

1

SATA

SATA 3.0Gb/s

DA - 12863 North America — Version 1 — February 11, 2008 Page 9

QuickSpecs

Standard Features and Configurable Components

Quantity Supported

Position Supported

Controller

One or two of the following

(optional)

1

USB/Diskette

2

,

SATA

2

, ,

SATA

(optional)

1

USB/Diskette

1

SATA

2

,

SATA

80-GB SATA 3.0-Gb/s Hard Drive (8MB Cache, 7200 RPM, NCQ, Smart IV)

160-GB SATA 3.0-Gb/s Hard Drive (8MB Cache, 7200 RPM, NCQ, Smart IV)

250-GB SATA 3.0-Gb/s Hard Drive (8MB Cache, 7200 RPM, NCQ, Smart IV)

500-GB SATA 3.0-Gb/s Hard Drive (16MB Cache, 7200 RPM, NCQ, Smart IV)

80-GB SATA 3.0-Gb/s Hard Drive (16MB Cache,10,000 RPM, NCQ, Smart III)

160-GB SATA 3.0-Gb/s Hard Drive (16MB Cache, 10,000 RPM, NCQ, Smart III)

3.5” Removable 80-GB SATA 3.0 Gb/s Hard Drive (8MB Cache, 7200 RPM, NCQ,

Smart IV)

3.5” Removable 160-GB SATA 3.0 Gb/s Hard Drive (8MB Cache, 7200 RPM, NCQ,

Smart IV)

3.5” Removable 250-GB SATA 3.0 Gb/s Hard Drive (8MB Cache, 7200 RPM, NCQ,

Smart IV)

2 nd

hard drive, 80-GB SATA 3.0-Gb/s Hard Drive (8MB Cache, 7200 RPM, NCQ,

Smart IV)

2 nd

hard drive, 250-GB SATA 3.0-Gb/s Hard Drive (8MB Cache, 7200 RPM, NCQ,

Smart IV)

2 nd

hard drive, 500-GB SATA 3.0-Gb/s Hard Drive (16MB Cache, 7200 RPM,

NCQ, Smart IV)

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

DA - 12863 North America — Version 1 — February 11, 2008 Page 10

QuickSpecs

Standard Features and Configurable Components

One or more of the following depending on form factor (see Storage –

Drive Support section above)

1.44-MB Diskette Drive

HP 16-in-1 Media Reader (USB connection on the system board)

SATA DVD-ROM Drive

1

SATA CD-RW/DVD-ROM Combo Drive

1,2

SATA SuperMulti LightScribe DVD Writer Drive

1,2,3

1

For playing DVDs, InterVideo WinDVD 5

2

For writing CDs, choice of Sonic/Roxio DigitalMedia Plus 7.2 (Windows XP only) or

Easy Media Creator 9

3

For writing CDs and DVDs, video editing and authoring DVDs, choice of Sonic/Roxio

DigitalMedia Plus 7.2 (Windows XP only) or Easy Media Creator 9

X

X

X

X

X

X

X

X

X

X

HP 16-in-1 3.5” Media Card Reader X X

One of the following

Integrated 1.2 TPM Embedded Security Chip*

HP Desktop Security lock kit (lock and cable)

Security cable with Kensington lock

HP ProtectTools security software suite

* TPM module disabled where use is restricted by law; for example, Russia.

Intel 82566DM Gigabit Network Connection (integrated on system board)

Broadcom NetXtreme Gigabit Ethernet PCIe NIC Card

Intel PRO/1000 PT PCIe Gigabit NIC

Wireless A+G PCI Card (full height bracket)

Wireless A+G PCI Card (low profile bracket)

2006 Agere PCI 56K International SoftModem (full height)

2006 Agere PCI 56K International SoftModem (low profile)

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

DA - 12863 North America — Version 1 — February 11, 2008 Page 11

QuickSpecs

Standard Features and Configurable Components

Integrated Intel Graphics Media Accelerator 3100

HP ADD2 SDVO PCIe DVI-D adapter

HP ADD2 SDVO PCIe VGA/TV-Out Adapter

X

X

X

NVIDIA Quadro NVS 290 256MB DH PCIe x16 Graphics Card

NVIDIA GeForce 8400 GS 256MB DH PCIe x1 Graphics Card

*

NVIDIA GeForce 8400 GS 256MB SH PCIe x16 Graphics Card

ATI Radeon HD 2400 XT 256MB DH PCIe x16 Graphics Card

X

X

X

X

† 1GB of system memory required. Graphics cards use part of the total system memory to enhance graphics performance.

* Two NVIDIA GeForce 8400 GS 256MB DH PCIe x1 graphics cards can be installed to provide support for four monitors.

X

X

X

X

X

X

X

Integrated High Definition audio with ADI1884 codec (all ports are stereo)

Microphone and Headphone front ports

Line-out and Line-In rear ports*

Multistreaming capable*

X

X

X

X

X

X

X

X

Internal Speaker X X

* Rear audio input port is re-taskable as Line-in or Microphone-in. External speakers must be powered externally. Multistreaming can be enabled in the ADI control panel to allow independent audio streams to be sent to/from the front and rear jacks. This allows for different audio applications to use separate audio ports on the system. For example, the front jacks could be used with a headset for a communications application while the rear jacks are being used with external speakers and a multimedia application.

HP PS/2 Standard Keyboard

HP USB Standard Keyboard

USB 2-Button Laser Mouse

PS/2 2-Button Optical Scroll Mouse

USB 2-Button Optical Scroll Mouse

X

X

X

X

X

X

X

X

X

X

HP FireWire / IEEE 1394 PCI Card (full height)

HP FireWire / IEEE 1394 PCI Card (low profile)

2 nd

serial port adapter

2 nd

serial port adapter (low profile)

Tower stand

1-GB Flash Module for Vista ReadyBoost

X

X

X

X

X

X

X

DA - 12863 North America — Version 1 — February 11, 2008 Page 12

QuickSpecs

After-Market Options (availability may vary by region)

MS Office Basic Edition 2007 – Media-less License Kit

MS Office Small Business Edition 2007 – Media-less License Kit

MS Office Professional Edition 2007 – Media-less License Kit

X

X

X

X

X

X

RZ361A#ABA

RZ365A#ABA

RZ363A#ABA

HP Wireless A+G PCI Card (North America only)

HP Wireless A+G PCI Card (WW except North America)

HP BT450 USB Bluetooth Wireless Printer and PC Adapter

Broadcom NetXtreme Gigabit Ethernet PCIe NIC Card

Intel PRO/1000 PT PCIe Gigabit NIC Card

Agere 2006 PCI 56K International Modem

Bundle Connectivity Starter Kit – Surge Protector/LAN cable/Printer cable

X

X

X

X

X

X

X

X

X

X

X

X

X

X

EA118AA

PZ928AA

IPQ639A

EA833AA

EH352AA

EK694AA

RT174AA

HP ADD2 SDVO DVI-D Adapter

NVIDIA GeForce 8400 GS 256MB SH PCIe x16 Graphics Card*

X

X

X

X

DY674A

GJ119AA

HP DVI to DVI Cable

NVIDIA Quadro NVS 290 256MB DH PCIe x1 Graphics Card

NVIDIA Quadro NVS 290 256MB DH PCIe x16 Graphics Card

NVIDIA GeForce 8400 GS 256MB DH PCIe x1 Graphics Card*

X

X

X

X

X

X

X

X

DL139A

KN586AA

KG748AA

GJ120AA

* 1GB of system memory required. Graphics cards use part of the total system memory to enhance graphics performance.

HP 80-GB SATA (NCQ/Smart IV) 3.0-Gb/s Hard Drive

HP 160-GB SATA (NCQ/Smart IV) 3.0-Gb/s Hard Drive

HP 250-GB SATA (NCQ/Smart IV) 3.0-Gb/s Hard Drive

HP 500-GB SATA (NCQ/Smart IV) 3.0-Gb/s Hard Drive

HP Removable SATA Hard Drive Enclosure (Frame & Carrier)

HP Removable SATA Hard Drive Enclosure (Carrier Only)

X

X

X

X

X

X

X

X

X

X

X

X

PY276AA

PY277AA

PY278AA

PV943A

RY102AA

RY103AA

DA - 12863 North America — Version 1 — February 11, 2008 Page 13

QuickSpecs

After-Market Options (availability may vary by region)

HP PS/2 Standard Keyboard

HP USB Standard Keyboard

HP USB Smartcard Keyboard

HP USB Laser Mouse

HP PS/2 2-Button Optical Scroll Mouse

HP USB 2-Button Optical Scroll Mouse

HP 2-GB PC2-6400 (DDR2 800 MHz) DIMM

HP 1-GB PC2-6400 (DDR2 800 MHz) DIMM

HP 512-MB PC2-6400 (DDR2 800 MHz) DIMM

HP 2-GB PC2-5300 (DDR2 667 MHz) DIMM

HP 1-GB PC2-5300 (DDR2 667 MHz) DIMM

HP 512-MB PC2-5300 (DDR2 667 MHz) DIMM

1GB Flash Module for Windows Ready Boost

HP L1506 15" TFT Flat Panel Monitor – Analog only

HP L1710 17" TFT Flat Panel Monitor – Analog only

HP L1750 17" TFT Flat Panel Display – Analog/Digital

HP L1745 17" TFT Flat Panel Display – Analog/Digital

HP L1906 19" TFT Flat Panel Display – Analog only

HP L1910 19" TFT Flat Panel Display – Analog only

HP L1950 19" TFT Flat Panel Display – Analog/Digital

HP LP1965 19" TFT Flat Panel Display – Analog/Digital

HP LP2065 20" TFT Flat Panel Display – Analog/Digital

HP L1908w 19" Widescreen Flat Panel Display – Analog

HP L2045w 20" Widescreen Flat Panel Display – Analog/Digital

HP LP2465 24" TFT Widescreen Flat Panel Display – Analog/Digital

HP LP3065 30" TFT Widescreen Flat Panel Display – Analog/Digital

HP L1908wm 19" Widescreen Flat Panel Display with Built in Multimedia

HP L5006tm 15" Touch Screen Flat Panel Display

HP L1908wi 19" Widescreen Flat Panel Display plus Integrated Work Stand

HP Flat Panel Speaker Bar

DA - 12863 North America — Version 1 — February 11, 2008

X

X

X

X

X

X

X

X

X

X

X

X

DT527A

DT528A

ED707AA

GW405AA

EY703AA

DC172B

X

X

X

X

X

X

X

X

X

X

X

X

X

X

AH060AA

AH058AA

AH056AA

PX977AA

PX976AA

PX975AA

KG274AA

3PO Offering

PX848AA#ABA

GS917AA#ABA

GF904AA#ABA

GE178AA#ABA

PX850AA#ABA

GS918AA#ABA

GG458AA#ABA

RA373AA#ABA

EF227A4#ABA

GP536AA#ABA

RD125AA#ABA

EF224A4#ABA

EZ320A4#ABA

KA214AA#ABA

3PO Offering

RB146AA#ABA

GP537AA#ABA

EE418AA

Page 14

QuickSpecs

After-Market Options (availability may vary by region)

HP Quick Release Kit

HP Intergrated Work Stand (stand alone)

HP USB Powered Speakers

HP SATA DVD-ROM Drive

HP SATA SuperMulti LightScribe DVD Writer Drive

48X SATA CD-RW/DVD-ROM Combo Drive

HP 1.44-MB External USB Diskette Drive

HP 1.44-MB Internal Diskette Drive

HP 16-in-1 Media Card Reader with PCI Card

Kensington lock

HP ProtectTools security software suite

HP 2007 Wall Mount/Security Sleeve

HP USB Biometric Fingerprint Reader

HP USB Smartcard Keyboard

HP Client Configuration Manager, Premium Edition

HP ProtectTools Client Security Software including

HP ProtectTools Security Manager

BIOS Configuration for HP ProtectTools

Credential Manager for HP ProtectTools

Device Access Manager for HP ProtectTools

Drive Encryption for HP ProtectTools

Embedded Security for HP ProtectTools

Java Card Security for HP ProtectTools

Altiris Client Management Suite Level 1

Includes:

Altiris Deployment Solution

Altiris Inventory Solution

Altiris Application Metering Solution

Altiris Carbon Copy Solution

Altiris Software Delivery Solution

Altiris Application Management Solution

X

X

DA - 12863 North America — Version 1 — February 11, 2008

X

X

X

X

X

EM870AA

GN783AA

RD628AA X X

X

X

X

X

X

X

AH047AA

GF343AA

AH046AA

X

X

X

X

X

X

DC141B

AH053AA

EM718AA

X

X

X

X

X

PC766A

KN740AA

GF344AA

EM717AA

ED707AA

X

X

T3488AA

(use T3489AA for

1000 licenses)

KN740AA

X DR605A

(use DR606A for

1000+ licenses)

Page 15

QuickSpecs

After-Market Options (availability may vary by region)

Altiris Patch Management Solution

HP 2007 SFF Tower Stand

HP Tower Stand

HP 2 nd

Serial Port Adapter

HP Parallel Port Adapter

Belken USB to Serial Adapter

HP FireWire / IEEE 1394 PCI Card

DVI to DVI Cable

5.25" Blank Bezel Kit (Carbonite 50/Bulk Pack)

Local Area Network (LAN) cable, Ethernet cable

Firewire (1394) Cable

7-outlet Surge Protector

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

GJ118AA

RG048AA

PA716A

KD061AA

EM449AA

PA997A

DC198A

DC177B

AH122AA

AH123AA

AG290AA

DA - 12863 North America — Version 1 — February 11, 2008 Page 16

QuickSpecs

Technical Specifications

General Unit Operating Guidelines

Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit is operated within the specified operating range.

Leave a 10.2 cm (4 in) clearance on all vented sides of the computer to permit the required airflow.

Never restrict airflow into the computer by blocking any vents or air intakes.

Do not stack computers on top of each other or place computers so near each other that they are subject to each other's recirculated or preheated air.

Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other foreign matter can block the vents and limit the airflow.

If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the enclosure, and the same operating guidelines listed above will still apply.

Operating: 50° to 95° F (10° to 35° C)*

Non-operating: -22° to 140° F(-30° to 60° C)

Operating: 10% to 90% (non-condensing at ambient)

Non-operating: 5% to 95% (non-condensing at ambient)

Operating: 10,000 ft (3048 m)

Non-operating: 30,000 ft (9144 m) sustained sunlight. Maximum rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed.

Operating Voltage Range

Rated Voltage Range

Rated Line Frequency

Operating Line Frequency Range

Rated Input Current

Heat Dissipation

Power Supply Fan

ENERGY STAR 4.0 Compliant

FEMP Standby Power Compliant

(<2W in S5 – Power Off)**

300-watt BTX power supply – Passive PFC

115v/230v line switch

90 to 132VAC, or 180 to 264VAC

100 to 127VAC, or

200 to 240VAC

50/60 Hz

47–63 Hz

8A/4A 5A/2.5A

Typical 315 btu/hr

(79 kg-cal/hr)

Maximum 1575 btu/hr

(397 kg-cal/hr)

Typical 270 btu/hr

(68 kg-cal/hr)

Maximum 1280 btu/hr

(322 kg-cal/hr)

Variable speed fan

X

300-watt 80 PLUS*

BTX power supply –

Active PFC

90 to 264VAC

100 to 240VAC

50/60 Hz

47–63 Hz

Variable speed fan

X

X

240-watt BTX power supply – Active PFC

115v/230v line switch

90 to 132VAC, or 180 to 264VAC

100 to 127VAC, or

200 to 240VAC

50/60 Hz

47–63 Hz

6A/3A

Typical 315 btu/hr

(79 kg-cal/hr)

Maximum

1260 btu/hr

(317 kg-cal/hr)

Variable speed fan

240-watt 80 PLUS*

BTX power supply –

Active PFC

90 to 264VAC

100 to 240VAC

50/60 Hz

47–63 Hz

3.5A/1.75

Typical 270 btu/hr

(68 kg-cal/hr)

Maximum 1025 btu/hr

(258 kg-cal/hr)

X

Variable speed fan

X

X

DA - 12863 North America — Version 1 — February 11, 2008 Page 17

QuickSpecs

Technical Specifications

Power Consumption in ES Mode –

Suspend to RAM (S3)

(Instantly Available PC)

<4W <3W <4W <3W

* This 80% efficient power supply is a requirement for ENERGY STAR 4.0 compliance in conjunction with a select range of processors and modules.

** Power consumption in the Off/Apparent Off mode is measured and reported with the network interface controller “Wake on LAN” feature disabled in F10 Setup (default is “enabled”).

Key features of the HP BIOS in the dc5800 include:

Deployment and manageability – HP BIOS provides several technologies that help integrate the HP Business desktop computer into the enterprise, such as PXE, remote configuration, remote control, and F10 Setup support for 12 languages.

Stability – HP BIOS supports the HP stable product roadmap by releasing only critical BIOS changes to the factory and advanced change notification.

Security – HP BIOS offers a robust and flexible set of security features to help the system administrator secure their systems from removal of sensitive data, and help prevent access by unauthorized users.

Tracking and tracing capabilities in case of theft available in select countries (subscription sold separately).

Thermal and power management – The HP BIOS provides and enables thermal and power management technologies to assist in operating the HP Business Desktop computer in any enterprise environment.

Serviceability – HP BIOS provides diagnostic and detailed service information.

Upgrades and recovery – HP BIOS provides numerous ways to upgrade HP Business Desktop computers, including BIOS updates from within DOS (Flashlite), BIOS updates from within Windows (HPQFlash, SSM), HP Client Manager, and fail-safe recovery. In addition, the HP Business Desktop BIOS Utilities tool enables replicated BIOS setup throughout the Enterprise; it is available from within the BIOS software and from the support website.

Additional HP BIOS Features

Administrator password – Also known as the setup password, this helps prevent unauthorized changes to the system configuration. If the administrator password is not known, the BIOS version cannot be changed and changes cannot be made to BIOS settings using F10 setup or under the OS.

Advanced Configuration and Power Interface (ACPI) – Represents a significant innovation in power and configuration management, allowing operating systems and applications to manage power based on activity and usage. Provides power conservation features under Windows XP.

Ability to mute the internal speaker

ACPI-Ready Hardware

SMBIOS Ver. 2.4

Wired for Management Support

Dual-State Power Button

Advanced Configuration and Power Management Interface (ACPI).

Allows the system to wake from a low power mode.

Controls system power consumption, making it possible to place individual cards and peripherals in a low-power or powered-off state without affecting other elements of the system.

System Management BIOS, previously known as DMI BIOS, for system management information

Intel-driven, industry-wide initiative to make Intel architecture-based PCs, servers and mobile computers more inherently manageable right out of the box and over the network

Power button acts as both an on/off button and suspend-to-sleep button

DA - 12863 North America — Version 1 — February 11, 2008 Page 18

QuickSpecs

Technical Specifications

Dual Color Power LED on Front of Computer (Indicates Normal Operations and Fault Conditions)

Diagnostic LED Explanation Table Number of 1-second red LED blinks followed by 2-second pause, then repeats:

2-processor thermal protection activated

3-processor not installed

4-power supply failure

5-memory error

6-video error

7-PCA failure (ROM detected failure prior to video)

8-invalid ROM, bootblock recover mode

System/Emergency ROM Flash ROM

Flash Recovery with Video

Over-Temp Warning on Screen

(Requires IM Agents)

Restore CD

5 Aux Power LED on System PCA

Clear Password Jumper

Clear CMOS Switch

CMOS Battery Holder for easy

Replacement

Processor ZIF Socket for easy Upgrade

DIMM Connectors for easy Upgrade

NIC LEDs (integrated) (Green &

Amber)

Dual Color Power and HD LED –

To Indicate Normal Operations and Fault Conditions

Front power switch

Color coordinated cables and connectors

System memory can be upgraded upgraded on Microtower without removing any internal components

Tool-less Hood Removal (thumbscrews for Microtower, spring-latch for Small

Form Factor)

Tool-less Hard Drive, CD & Diskette

Removal

Towerable

Drive Self Tests (DPS)

DPS Access through F10 Setup during

Boot

Product can be oriented as a tower (in addition to desktop orientation)

Drive Protection System

A diagnostic hard drive self test. It scans critical physical components and every sector of the hard drive for physical faults and then reports any faults to the user.

Running independently of the operating system, it can be accessed through a

Windows-based diagnostics utility or through the computer's setup procedure. It produces an evaluation on whether the hard drive is the source of the problem and needs to be replaced.

The system expands on the Self-Monitoring, Analysis, and Reporting Technology

(SMART), a continuously running systems diagnostic that alerts the user to certain types of failures.

SMART IV Technology*

(Self-Monitoring, Analysis and Reporting

Technology)

Allows hard drives to monitor their own health and to raise flags if imminent failures were predicted

Predicts failures before they occur. Tracks fault prediction and failure indication parameters such as re-allocated sector count, spin retry count, calibration retry count

By avoiding actual hard drive failures, SMART hard drives act as “insurance” against unplanned user downtime and potential data loss from hard drive failure

DA - 12863 North America — Version 1 — February 11, 2008 Page 19

QuickSpecs

Technical Specifications - Audio

Integrated

Yes – 4-channel ADI 1884 codec

Front microphone-In (150-K ohm Input Impedance)

Rear Line-In/Microphone input (150-K ohm Input Impedance, function is configurable by audio driver)

Rear Line-Out * (190 ohms Output Impedance, expects at least a 10-K ohm load)

Front Headphone-Out (0.5 Ohm Output Impedance, expects at least a 32 ohm load)

*Internal Speaker Amplifier is for Internal Speaker only. External Speakers need to be powered externally.

Rear Line in audio port is re-taskable as Line-in or Microphone-in.

Multistreaming Capable Multistreaming can be enabled in the ADI control panel to allow independent audio streams to be sent to/from the front and rear jacks.

8 kHz – 192 kHz

Yes – Uses OS soft wavetable

(software)

Yes

Stereo (Left & Right channels)

(mono/stereo)

1.5 W

Yes; ability to mute internal speaker through F10 Setup

Yes

(Line-Out)

DA - 12863 North America — Version 1 — February 11, 2008 Page 20

QuickSpecs

Technical Specifications - Communications

RJ-45

Intel Nineveh Gigabit platform LAN Connect Networking Controller

Integrated 96KbB on chip buffer memory

10/100/1000 Mbps

IEEE 802.1P, 802.1Q, 802.2, 802.3, 802.3 ab and 802.3u compliant,

GLCI, LCI interface. Intel specific MAC to PHY interface

At gigabit GLCI (802.3 serdes) is for Data, LCI (parallel bus)for MDIO, at

10/100 LCI for both data and MDIO, GLCI is idle.

Hardware certifications FCC, B, CE, TUV- cTUVus Mark Canada and United States, TUV- GS Mark for European Union

Require 3.3Vaux,1.8V and 1.0V or just 3.3V with integrated regulators

Power consumption 1.16 Watts for 82566, whole LOM 2.53 Watts

Intel Auto Connect Battery Saving feature

Yes

Network transfer mode Full-duplex

Half-duplex (not available for the 1000BASE-T transceiver)

10BASE-T (half-duplex) 10 Mbps

10BASE-T (full-duplex) 20 Mbps

100BASE-TX (half-duplex) 100 Mbps

100BASE-TX (full-duplex) 200 Mbps

1000BASE-T (full-duplex) 2000 Mbps

Operating temperature 32° to 131°F (0° to 55° C)

To 70° C for external regulator

85% at 131° F (55° C) diagnostic.

RJ-45

Intel 82572EI Gigabit Ethernet Controller

Integrated Dual 48K configurable transmit receive FIFO Buffers

10/100/1000 Mbps

IEEE 802.1P, 802,1Q, 802.2, 802.3, 802.3AB and 802.3u compliant,

802.3x flow control

PCI-E 1.0a

Bus-master DMA

Hardware certifications FCC, B, CE, TUV- cTUVus Mark Canada and United States, TUV- GS Mark for European Union

Aux 3.3V, 3.0 Watts in 1000base-T and 2.0 Watts in 100Base-T

Yes

DA - 12863 North America — Version 1 — February 11, 2008 Page 21

QuickSpecs

Technical Specifications - Communications

10BASE-T (half-duplex) 10 Mbps

10BASE-T (full-duplex) 20 Mbps

100BASE-TX (half-duplex) 100 Mbps

100BASE-TX (full-duplex) 200 Mbps

1000BASE-T (full-duplex) 2000 Mbps (actual rate limited by PCI Bus)

6.4 x 2.6 x 0.8 in (16.3 x 6.6 x 1.9 cm)

32° to 131°F (0° to 55° C)

85% at 131° F (55° C)

RJ-45

Broadcom 5751 PCI-Express LAN Controller

Integrated 96Kb frame buffer memory

10/100/1000 Mbps

IEEE 802.1P, 802.1Q, 802.2, 802.3, 802.3AB and 802.3u compliant,

802.3x flow control

PCI-E

Single channel, PCI-E

Bus-master DMA

Hardware certifications FCC, B, CE, TUV- cTUVus Mark Canada and United States, TUV- GS Mark for European Union

3.1 watts @ +3.3V AUX supply with 5V tolerance

Yes

Network transfer mode Full-duplex

Half-duplex (not available for the 1000BASE-T transceiver)

10BASE-T (half-duplex) 10 Mbps

10BASE-T (full-duplex) 20 Mbps

100BASE-TX (half-duplex) 100 Mbps

100BASE-TX (full-duplex) 200 Mbps

1000BASE-T (full-duplex) 2000 Mbps (actual rate limited by PCI Bus)

32° to 131°F (0° to 55° C)

4.4 x 2.2 x 0.08 in (11.2 x 5.5 x 2 cm)

85% at 131° F (55° C)

DA - 12863 North America — Version 1 — February 11, 2008 Page 22

QuickSpecs

Technical Specifications - Communications

HP Wireless A+G PCI Dimensions 4.99 x 2.54 x 0.71 in (126.8 x 64.4 x 18.0 mm)

0.268 lb (65 g)

Atheros AR5414X chipset

PCI Spec 2.2

IEEE 802.11a/b/g

5.1500 to 5.8500 GHz

2.4000 to 2.4835 GHz

2.4465 to 2.4835 GHz (Europe, Middle East, Asia and Asia Pacific – excluding Japan)

2.4000 to 2.4697 GHz (Japan)

Operating temperature 32° to 140° F (0° to 60° C), operating

-4° to 176° F (-20° to 80° C), non-operating

10% to 85% non-condensing

5V ± 5%

Tx/Rx peak 560/250mA @ 3.3V (max.)

15 dBM ±2dB

(approximately)

-90dBm at 11 Mbps (typical)

Standard rates of 1, 2, 5.5, 11, 6, 9, 12, 18, 24, 48, 54 and Super AG

Mode108-Mbps

DSSS (Direct Sequence Spread Spectrum)

64(40h) bit, 128(104h) bit, WPA, IEEE802.1X, AES-OCB, AES-CCM,

Microsoft PEAP,TKIP, WEP.

External 5dBi antenna

200 ft (60.96 m) – Indoor 108 Mbps (only with Belkin 54G or above router that supports 108 Mbps speed)

54 Mbps

11 Mbps

Wi-Fi certified

200 ft (60.96 m) – Indoor

200 ft (60.96 m) – Indoor

North America: United States, Canada

Europe: Austria, Belgium, Cyprus, Denmark, Finland, France, Germany,

Greece, Iceland, Ireland, Italy, Liechtenstein, Luxembourg, Netherlands,

Norway, Portugal, Spain, Sweden, Switzerland, United Kingdom

Australia

New Zealand

DA - 12863 North America — Version 1 — February 11, 2008 Page 23

QuickSpecs

Technical Specifications - Communications

Technology speeds: 56,000 Kbps maximum downstream data, controllerless sites. Other conditions may limit modem speed. FCC limitations allow a maximum of 53 Kbps during download transmissions.

(Upload only)

33,600/31,200/28,800/26,400/21,600/19,200/16,800/14,400/12,000/

9,600/7,200/4,800/2,400/1,200/300

ITU-T V.90, ITU-T, ITU-T V.34, V.44, V.42, V.42bis21, V.32bis, Bell 212A, and Bell 103

14,400/12,000/9,600/7,200/4,800/2,400/1,200/300 b/s

Fax Mode Capabilities ITU-T T.31 class 1 FAX, V. 17, V.29, V.27ter, and V.21 Channel 2

V.44, 42bis, V.42 and MNP2-5

ACPI; PPMI 1.1 and wake support with PME and Vaux; meets PCI 2.3

requirements and PC 2001 requirements

Driver upgradeable for future enhancements

ITU-T V.80 video ready interface

TIA/EIA 602 standard AT command set

Integrated DTE interface with speeds of up to 115.2 Kbps, parallel 16550a

UART-compatible interface

Optional ring wakeup signal

Operating Temperature 32° to 158° F (0° to 70° C)

20% to 90%, non-condensing

Requires a 3.3-V auxiliary power rail on PCI bus

Uses only one PCI load (i.e., one grant/request pair), one shared IRQ, one electrical load

Agere Systems SV92PL – Integrated PCI interface with 5-V tolerant buffers and

CardBus support

Complies with PCI low profile specifications-6.7 x 2.3 in (17.0 x 5.8 cm) and supports high- and low-profile brackets

Single RJ-11 connector

Digital line protection, call progress monitoring via on-board piezo device, support for high profile and low profile brackets, PnP ID support

UL recognized to UL 1950, 3 rd

edition (U.S. and Canada); IEC 950 (TUV,

NEMKO, DEMKO, SEMKO); CE Mark, EC 950 (TUV, NEMKO, DEMKO,

SEMKO, CE mark

FCC Part 15, IC ES003, EN 55022, 3rd edition, EN 55024, annex A, EN

61000-4-6, EN 61000-4-8

FCC Part 68, IC-CS-03 (Canada); Worldwide PTT approvals

Not available in Korea or the Republic of South Africa.

Bare PCB material compliant to 94V-0 or better (marked as such)

PC 2001 compliant, PCI version 2.3, WHQL approved; ACPI compliant

DA - 12863 North America — Version 1 — February 11, 2008 Page 24

QuickSpecs

Technical Specifications - Graphics

Microsoft DirectX® 9 based with support for Pixel Shader 2.0, 4:1 anisotropic filtering, Gaussian texture filtering, shadow maps, volumetric textures, double-sided stencil buffers, and 4 pixel pipes.

Integrated

PCI Express™ x16 (If an external graphics card is installed in a PCI or PCIe x1 slot, the internal graphics can be enabled or disabled using the system's

BIOS setup utility. If a graphics card other than an SDVO/ADD2 card is installed in the PCI Express™ x16 slot, the internal graphics cannot be enabled).

Integrated, 350 MHz ([email protected] Hz)

Graphics memory is shared with system memory. Graphics memory usage varies depending on the amount of system memory installed and system load. 8 MB is pre-allocated for graphics use at system boot time. Additional memory is allocated for graphics as needed using Intel's Dynamic Video

Memory Technology (DVMT), to provide an optimal balance between graphics and system memory use.

8 MB pre-allocated + 248 MB DVMT = max frame buffer of 256 MB

Single overlay support with 5x3 filtering

Maximum Color Depth 32 bits/pixel

85 Hz at up to 1920x1440, 75 Hz at 2048x1536. Varies with mode and configuration. See table below.

Support for one CRT via the motherboard's VGA connector on SFF and MT.

Support for an additional display on SFF/MT can be accomplished with the addition of SDVO/ADD2 option installed in PCIe x16 slot.

Microsoft DirectX®9, DirectXVA®, VMR9, GDI/GDI+; OpenGL® 1.4.

Resolutions Supported

1

640 x 480

800 x 600

1024 x 768

1280 x 1024

1600 x 1200

1920 x 1080

1920 x 1200

1920 x 1440

2048 x 1536

85

85

85

85

85

85

85

85

75

60

60

60

60

60

60

60

N/A

N/A

1 Modes listed are supported with a single active display. The supported mode list for multiple active displays is a subset of this list.

Not all modes will support video playback and some supported modes may use software MC (motion compensation) rather than hardware MC. Not all modes will support 3D acceleration depending on the system configuration (e.g., resolution selected, size of frame buffer, number of installed memory modules, etc.).

DA - 12863 North America — Version 1 — February 11, 2008 Page 25

QuickSpecs

Technical Specifications - Graphics

HP ADD2 SDVO DVI-D Out Adapter

Low-profile card

Digital connection only

Yes, when used with the integrated VGA connector

HP L1740

HP L1940T

HP L2045W

HP LP1965 standards.

Blanking

640 x 480

800 x 600

1024 x 768

VGA

SVGA

XGA

1280 x 1024 SXGA

1600 x 1200 UXGA

All modes support 8-bpp, 16-bpp, and 24-bpp color depths

Complies with the Intel ADD2 and Intel Serial Digital Video Output (SDVO) specifications

165 MHz maximum

Supports display modes that require up to 165-MHz bandwidth on the link, as shown in the following table.

5% reduced

Yes

Yes

Yes

Yes

Yes

GTF

Yes

Yes

Yes

Yes

Yes

GTF

Yes

Yes

Yes

No

No

GTF

Yes

Yes

Yes

No

No

Low Profile

PCIe x16

256 MB 400MHz DDR2 SDRAM unified frame buffer, Z-buffer and Texture storage

DMS-59, includes DMS-59 to Dual DVI-I cable. DMS-59 to Dual VGA cable available as an option.

Dual integrated analog display controllers supporting up to two analog displays at 2048x1536 @ 85Hz on both displays or dual digital displays at

1920x1200 (single-link).

NVIEW advanced multi-display desktop and application management seamlessly integrated into Microsoft Windows

Integrated dual 400MHz

32-bit color buffer

Hardware supported

Advanced multi-display desktop & application management seamlessly integrated into Microsoft Windows.

Dual monitor support

DMS-59 (to dual DVI-SL)

Full-screen, full-frame video playback of HDTV and DVD content

DA - 12863 North America — Version 1 — February 11, 2008 Page 26

QuickSpecs

Technical Specifications - Graphics

DVD-ready motion compensation for MPEG-

2Independent hardware color controls for video overlay

Hardware color-space conversion (YUV 4:2:2 and 4:2:0)

IDCT motion compensation

5-tap horizontal by 3-tap vertical filtering

8:1 up/down scaling

Supported graphics APIs OGL 2.1 & DX10 Support; Shader Model 4.0

PCI Express (x16 lanes)

85 Hz

Integrated 400 MHz RAMDAC

Display max resolution 2048 x 1536 (analog), 2560 x 1600 (digital)

TV-out (4 pin S-video)

DVI-I + TV

DVI-I supports analog CRT or flat panel or digital flat panel (using DVI-A,

DVI-D or DVI-I connector)

DVI-I supports analog CRT or flat panel (with VGA connector and DVI-I to

VGA dongle)

TV connector is a 4-pin mini-DIN S-video connector

Graphics Chip

Core clock

Memory clock

Frame buffer

NVIDIA P413-260

460 MHz

200 MHz

256 MB DDR2

24 languages: English, Arabic, Chinese Simplified, Chinese Traditional,

Czechoslovakian, Danish, Dutch, Finnish, French, German, Greek, Hebrew,

Hungarian, Italian, Japanese, Korean, Norwegian, Polish, Portuguese,

Russian, Spanish, Swedish, Thai, Turkish

1GB of system memory required

25 W (Max board power)

DA - 12863 North America — Version 1 — February 11, 2008 Page 27

QuickSpecs

Technical Specifications - Graphics

640 x 480

800 x 600

1024 x 768

1280 x 1024

1600 x 1200

1920 x 1080

1920 x 1200

1920 x 1440

2048 x 1536

640 x 480

800 x 600

1024 x 768

1280 x 1024

1600 x 1200

1920 x 1200*

1920 x 1440**

2560 x 1600**

* Reduced blanking timings used when connected to a single-link DVI monitor

** Requires a dual-link DVI capable monitor

85 Hz

85 Hz

85 Hz

85 Hz

85 Hz

85 Hz

85 Hz

85 Hz

85 Hz

60 Hz

60 Hz

60 Hz

60 Hz

60 Hz

60 Hz

60 Hz

60 Hz

PCIe x1

85 Hz

Integrated 400 MHz RAMDAC

Display max resolution 2048 x 1536 (analog), 2560 x 1600 (digital)

TV-out (4 pin S-video)

DMS59 + TV

DMS59 supports either 2 VGA displays with the included cable or 2 DVII displays with optional

HP DMS59 DVI Dual-head Connector Cable kit #DL139A

TV connector is a 4-pin mini-DIN S-video connector

Graphics Chip

Core clock

Memory clock

Frame buffer

NVIDIA GeForce 8400 GS

460 MHz

200 MHz

256 MB DDR2

DA - 12863 North America — Version 1 — February 11, 2008 Page 28

QuickSpecs

Technical Specifications - Graphics

24 languages: English, Arabic, Chinese Simplified, Chinese Traditional,

Czechoslovakian, Danish, Dutch, Finnish, French, German, Greek, Hebrew,

Hungarian, Italian, Japanese, Korean, Norwegian, Polish, Portuguese,

Russian, Spanish, Swedish, Thai, Turkish

1GB of system memory required

25 W (Max board power)

640 x 480

800 x 600

1024 x 768

1280 x 1024

1600 x 1200

1920 x 1080

1920 x 1200

1920 x 1440

2048 x 1536

640 x 480

800 x 600

1024 x 768

1280 x 1024

1600 x 1200

1920 x 1200*

* Reduced blanking timings used when connected to a single-link DVI monitor

85 Hz

85 Hz

85 Hz

85 Hz

85 Hz

85 Hz

85 Hz

85 Hz

85 Hz

85 Hz

85 Hz

85 Hz

85 Hz

85 Hz

85 Hz

DA - 12863 North America — Version 1 — February 11, 2008 Page 29

QuickSpecs

Technical Specifications - Hard Drives

500,107,862,016 bytes

1 in (2.54 cm)

Media diameter: 3.5 in (8.89 cm)

Physical size: 4 in (10.2 cm)

Serial ATA (3.0 Gb/s)

Up to 3 Gb/s

16 MB

2.0 ms includes controller overhead, including settling)

7,200 rpm

976,773,168

Operating Temperature 41° to 131° F (5° to 55° C)

11 ms

21 ms

250,059,350,016 bytes

1 in (2.54 cm)

Media diameter: 3.5 in (8.89 cm)

Physical size: 4 in (10.2 cm)

Serial ATA (3.0 Gb/s)

Up to 3 Gb/s

8 MB

2.0 ms includes controller overhead, including settling)

7,200 rpm

488,397,168

Operating Temperature 41° to 131° F (5° to 55° C)

11 ms

21 ms

DA - 12863 North America — Version 1 — February 11, 2008 Page 30

QuickSpecs

Technical Specifications - Hard Drives

160,041,885,696 bytes

1 in (2.54 cm)

Media diameter: 3.5 in (8.89 cm)

Physical size: 4 in (10.2 cm)

Serial ATA (3.0 Gb/s)

Up to 3 Gb/s

8 MB

2.0 ms includes controller overhead, including settling)

7,200 rpm

312,581,808

Operating Temperature 41° to 131° F (5° to 55° C)

11 ms

21 ms

80,026,361,856 bytes

1 in (2.54 cm)

Media diameter: 3.5 in (8.89 cm)

Physical size: 4 in (10.2 cm)

Serial ATA (3.0 Gb/s)

Up to 3 Gb/s

8 MB

2.0 ms includes controller overhead, including settling)

7,200 rpm

156,301,488

Operating Temperature 41° to 131° F (5° to 55° C)

11 ms

21 ms

DA - 12863 North America — Version 1 — February 11, 2008 Page 31

QuickSpecs

Technical Specifications - Input/Output Devices

104, 105, 106, 107, 109 layout (depending upon country)

Dimensions 18.0 x 6.4 x 0.98 in (45.8 x 16.3 x 2.5 cm)

2 lb (0.9 kg) minimum

+ 5VDC ± 5%

50-mA maximum (with three LEDs ON)

PS/2 6-pin mini din connector

CE level 4, 15-kV air discharge

Conforms to FCC rules for a Class B computing device

38 available

Low-profile design

55-g nominal peak force with tactile feedback

20 million keystrokes (using Hasco modified tester)

Contamination-resistant switch membrane

6 ft (1.8 m)

43-dBA maximum sound pressure level

Operating temperature 50° to 122° F (10° to 50° C)

-22° to 140° F (-30° to 60° C)

10% to 90% (non-condensing at ambient)

Non-operating humidity 20% to 80% (non-condensing at ambient)

40 g, six surfaces

80 g, six surfaces

2-g peak acceleration

Non-operating vibration 4-g peak acceleration

26 in (66 cm) on carpet, six-drop sequence

42 in (107 cm) on concrete, 16-drop sequence

UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC

Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS

DA - 12863 North America — Version 1 — February 11, 2008 Page 32

QuickSpecs

Technical Specifications - Input/Output Devices

Dimensions 3.95 x 6.21 x 11.7 cm (1.56 x 2.44 x 4.61 in)

4.44 oz (126 g)

Operating temperature -32° to 104°F (0° to 40° C)

-4° to 140°F ( -20° to 60° C)

10% to 90% (non condensing at ambient)

Non-operating humidity 10% to 90% non condensing

40 g, 6 surfaces

80 g, 6 surfaces

2 g peak acceleration

Non-operating vibration 4 g peak acceleration

80 cm height onto asphalt tile over concrete or equivalent, 5-drop in 5 direction except the cable face

5 VDC ± 10%

100mA

PS/2 mini-din connector

CE level 4, 15 kV air discharge

Conforms to FCC rules for a Class B computing device

Microsoft PC99 – 2001 Functionally compliant

400 ± 20% DPI

10 in/s (25.4 cm/s) maximum

100 in/s/s (2.54 m/s/s)

61 g nominal peak force

3,000,000 operations (using Hasco modified tester)

Low force micro-switches

Tracking mechanism life 155 mi (250 km) at average speed of 10 in/s

6 ft (1.8 m)

Microsoft PC99 – 2001 Mechanically compliant

8 mm

1.01 in (25.6 mm)

Light force micro-switch

1 million operations

Minimum 200,000 revolutions

UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI,

BSMI, C-Tick, MIC

DA - 12863 North America — Version 1 — February 11, 2008 Page 33

QuickSpecs

Technical Specifications - Input/Output Devices

Dimensions 1.5 x 4.5 x 2.5 in (3.8 x 11.6 x 6.3 cm)

0.27 lb (0.12 kg)

72.8 in (185 cm)

DA - 12863 North America — Version 1 — February 11, 2008 Page 34

QuickSpecs

Technical Specifications - Optical Storage

5.25-inch, half-height, tray-load

Either horizontal or vertical

SATA/ATAPI

8.5 GB DL or 4.7 GB standard

Dimensions 5.9 x 1.7 x 8.0 in (15.0 x 4.4 x 20.3 cm)

2.6 lb (1.2 kg)

Up to 12X

Up to 16X

Up to 8X

Up to 8X

Up to 8X

Up to 16X

Up to 6X

Up to 48X

Up to 32X

Up to 12X

Up to 8X

Up to 8X

Up to 16X

(typical reads, including settling)

(operating – noncondensing)

Up to 48X

Up to 32X

DVD: < 140 ms (typical), CD: < 125 ms

(typical)

DVD: < 250 ms (seek), CD: < 210 ms (seek)

SATA DC power receptacle

DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p

12 VDC ± 5%-200 mV ripple p-p

5 VDC (< 1000 mA typical, 1600 mA maximum)

12 VDC (< 600 mA typical, 1400 mA maximum)

41° to 122° F (5° to 50° C)

10% to 90%

86° F (30° C)

DA - 12863 North America — Version 1 — February 11, 2008 Page 35

QuickSpecs

Technical Specifications - Optical Storage

5.25-inch, half-height, tray-load

Either horizontal or vertical

SATA/ATAPI

Single layer: Up to 4.7 GB (6 times capacity of CD-ROM)

Double layer: Up to 8.5 GB (12 times capacity of CD-ROM)

Dimensions 5.9 x 1.7 x 8.0 in (15.0 x 4.4 x 20.3 cm)

2.6 lb (1.2 kg)

Up to 48X

Up to 32X

Up to 8X

(typical reads, including settling)

(all conditions non-condensing)

Up to 16X

Up to 48X

Up to 32X

DVD: < 140 ms (typical), CD: < 125 ms

(typical)

DVD: < 250 ms (typical), CD: < 210 ms

(typical)

SATA DC power receptacle

DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p

12 VDC ± 5%-200 mV ripple p-p

5 VDC (< 1000 mA typical, < 1600 mA maximum)

12 VDC (< 600 mA typical, < 1400 mA maximum)

41° to 122° F (5° to 50° C)

10% to 90%

86° F (30° C)

SATA DVD-ROM Drive Height 5.25-inch, half-height, tray-load

Either horizontal or vertical

SATA/ATAPI

Single layer: Up to 4.7 GB (6 times capacity of CD-ROM)

Double layer: Up to 8.5 GB (12 times capacity of CD-ROM)

Dimensions 5.9 x 1.7 x 8.0 in (15.0 x 4.4 x 20.3 cm)

2.6 lb (1.2 kg)

Up to 8X

Up to 16X

Up to 4X

Up to 48X

Up to 32X

DA - 12863 North America — Version 1 — February 11, 2008 Page 36

QuickSpecs

Technical Specifications - Optical Storage

(typical reads, including setting)

(all conditions non-condensing)

Yes

Yes

Yes

Yes

Yes

Yes

Yes

No

No

No

No

No

No

No

Yes

Yes

Yes

Yes

No

No

No

No

Yes No

DVD: < 140 ms (typical), CD: < 125 ms

(typical)

DVD: < 250 ms (seek), CD: < 210 ms (seek)

2 MB (minimum)

ATA PIO mode 4 (16.7 MB/s); ATA Multi-word

DMA mode 2 (16.7 MB/s); ATA UltraDMA Mode

3 (44.4 MB/s -default)

SATA DC power receptacle

DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p

12 VDC ± 5%-200 mV ripple p-p

5 VDC – <1000 mA typical, < 1600 mA maximum

12 VDC –< 600 mA typical, < 1400 mA maximum

41° to 122° F (5° to 50° C)

10% to 90%

86° F (30° C)

DA - 12863 North America — Version 1 — February 11, 2008 Page 37

QuickSpecs

Technical Specifications - Removable Storage

USB 2.0 High-speed device

Supports hardware CRC (Cyclic Redundancy Check) function

Supports MS 4-bit parallel transfer mode

Supports MS-PRO 4-bit parallel transfer mode

Supports SD 4-bit parallel transfer mode

Supports high-speed 50-MHz SD 4-bit card (version 1.1)

Support high-speed 52-MHz MMC 8-bit card

MicroSD (T-Flash)

Memory Stick Micro

Test Parameters/Conditions – Power applied, unit operating on system ±5% nominal supply voltage.

10°C 10% R.H. = 24 hours

10°C 90% R.H. = 24 hours

20°C 90% R.H. = 24 hours

30°C 90% R.H. = 24 hours

40°C 90% R.H. = 24 hours

50°C 90% R.H. = 24 hours

50°C 10% R.H. = 24 hours

Test Parameters/Conditions

60°C @ 80% R.H. for 96 hours

-30°C @ 20% R.H. for 48 hours

No power applied

Delta °C < 1.0°C/min

Delta % R.H. < 1.5% R.H./min

USB-IF, WHQL, Compliant with USB Mass Storage Class Bulk only Transport

Specification Rev. 1.0, Compliant Intel Front Panel I/O Connectivity Design

Guide V. 1.2

FCC, CE, BSMI, C-Tick, VCCI, MIC, cUL, TUV-T

DA - 12863 North America — Version 1 — February 11, 2008 Page 38

Normal Operation On-

Idle (ENERGY STAR Idle

(S0))

ENERGY STAR “Sleep”

(S3) (Wake On LAN

(WOL) Enabled)

ENERGY STAR “Sleep”

(S3) (Wake On LAN

(WOL) Disabled)

ENERGY STAR “Standby”

(Off) (S5) (Wake On LAN

(WOL) Enabled)

ENERGY STAR “Standby”

(Off) (S5) (Wake On LAN

(WOL) Disabled)

Normal Operation On-

Idle (ENERGY STAR Idle

(S0))

ENERGY STAR “Sleep”

(S3) (Wake On LAN

(WOL) Enabled)

ENERGY STAR “Sleep”

(S3) (Wake On LAN

(WOL) Disabled)

ENERGY STAR “Standby”

(Off) (S5) (Wake On LAN

(WOL) Enabled)

QuickSpecs

Technical Specifications - Environmental Data

This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks:

US Energy Star

US Federal Energy Management Program (FEMP)

Taiwan Green Mark

China Energy Conservation Program

IT ECO declaration

EPEAT Rated – GOLD

Korea Eco-label

Japan PC Green label*

* This product conforms to the examination standards (2003 version) under JEITA's 'PC Green Label

System.'

The configuration used for the Energy Consumption and Declared Noise Emissions data for the Small

Form Factor Desktop model is based on a typically configured product.

56.4813 W

3.2813 W

3.2795 W

1.6005 W

0.8966 W

55.4734 W

3.5599 W

3.5581 W

1.8699 W

1.1596 W

57.0071 W

3.2663 W

3.2692 W

1.5823 W

0.8763 W

192.714 BTU/hr

11.195 BTU/hr

11.189 BTU/hr

5.46 BTU/hr

189.275 BTU/hr

12.146 BTU/hr

12.14 BTU/hr

6.38 BTU/hr

194.508 BTU/hr

11.144 BTU/hr

11.154 BTU/hr

5.398 BTU/hr

DA - 12863 North America — Version 1 — February 11, 2008 Page 39

QuickSpecs

Technical Specifications - Environmental Data

ENERGY STAR “Standby”

(Off) (S5) (Wake On LAN

(WOL) Disabled)

3.059 BTU/hr 3.956 BTU/hr 2.989 BTU/hr

* Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.

This product is in compliance with US executive order 13221, WOL (wake on LAN) disabled.

(in accordance with

ISO 7779 and ISO 9296)

System Fan Off

Idle

Fixed Disk (random writes)

(LWAd, bels)

3.8

3.9

This product complies with ISO standards:

(LpAm, decibels)

27

28

EU Directive 91/ 157/ EEC

EU Directive 93/ 86/ EEC

EU Directive 98/ 101/ EEC

Batteries used in the product do not contain:

Mercury greater the 5ppm by weight

Cadmium greater than 10ppm by weight

Lead greater than 4000ppm by weight.

Battery size: CR2032 (coin cell)

Battery type: Lithium

This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive -

2002/95/EC.

This product is in compliance with California Proposition 65 (State of California; Safe Drinking

Water and Toxic Enforcement Act of 1986).

This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE)

Directive – 2002/96/EC.

This product is in compliance with the IEEE 1680 (EPEAT) standard at the GOLD level, see http://www.epeat.net

Plastics parts weighing over 25 grams used in the product are marked per ISO 11469 and

ISO1043.

This product contains 0% recycled materials (by wt.)

This product is 93% recyclable when properly disposed of at end of life.

Corrugated Paper 1600 g

EPE Foam

LDPE Bag

200 g

52 g

The EPE foam packaging material is made from 30 to 60% industrial recycled content.

The corrugated paper packaging materials contain at least 80% post consumer recycled content.

DA - 12863 North America — Version 1 — February 11, 2008 Page 40

QuickSpecs

Technical Specifications - Environmental Data

The configuration used for the Energy Consumption and Declared Noise Emissions data for the

Minitower Desktop model is based on a typically configured product.

Normal Operation On-

Idle (ENERGY STAR Idle

(S0))

ENERGY STAR “Sleep”

(S3) (Wake On LAN

(WOL) Enabled)

ENERGY STAR “Sleep”

(S3) (Wake On LAN

(WOL) Disabled)

ENERGY STAR “Standby”

(Off) (S5) (Wake On LAN

(WOL) Enabled)

ENERGY STAR “Standby”

(Off) (S5) (Wake On LAN

(WOL) Disabled)

57.7234 W

3.0145 W

3.0142 W

1.4702 W

0.8089 W

57.1631 W

3.3215 W

3.3181 W

1.7589 W

1.0882 W

58.1231 W

2.9863 W

2.983 W

1.4495 W

0.7862 W

Normal Operation On-

Idle (ENERGY STAR Idle

(S0))

ENERGY STAR “Sleep”

(S3) (Wake On LAN

(WOL) Enabled)

ENERGY STAR “Sleep”

(S3) (Wake On LAN

(WOL) Disabled)

ENERGY STAR “Standby”

(Off) (S5) (Wake On LAN

(WOL) Enabled)

196.952 BTU/hr

10.285 BTU/hr

10.284 BTU/hr

5.016 BTU/hr

195.04 BTU/hr

11.332 BTU/hr

11.321 BTU/hr

6.001 BTU/hr

198.316 BTU/hr

10.189 BTU/hr

10.177 BTU/hr

4.945 BTU/hr

ENERGY STAR “Standby”

(Off) (S5) (Wake On LAN

(WOL) Disabled)

2.759 BTU/hr 3.712 BTU/hr 2.682 BTU/hr

* Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.

This product is in compliance with US executive order 13221, WOL (wake on LAN) disabled.

(in accordance with

ISO 7779 and ISO 9296)

Idle

Fixed Disk (random writes)

(LWAd, bels)

3.8

3.9

(LpAm, decibels)

27

28

DA - 12863 North America — Version 1 — February 11, 2008 Page 41

QuickSpecs

Technical Specifications - Environmental Data

This product complies with ISO standards:

EU Directive 91/ 157/ EEC

EU Directive 93/ 86/ EEC

EU Directive 98/ 101/ EEC

Batteries used in the product do not contain:

Mercury greater the 5ppm by weight

Cadmium greater than 10ppm by weight

Lead greater than 4000ppm by weight.

Battery size: CR2032 (coin cell)

Battery type: Lithium

This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive -

2002/95/EC.

This product is in compliance with California Proposition 65 (State of California; Safe Drinking

Water and Toxic Enforcement Act of 1986).

This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE)

Directive – 2002/96/EC.

This product is in compliance with the IEEE 1680 (EPEAT) standard at the GOLD level, see http://www.epeat.net

Plastics parts weighing over 25 grams used in the product are marked per ISO 11469 and

ISO1043.

This product contains 0% recycled materials (by wt.)

This product is 93% recyclable when properly disposed of at end of life.

Corrugated Paper 1642 g

EPE Foam

LDPE Bag

385 g

50 g

The EPE foam packaging material is made from 30 to 60% industrial recycled content.

The corrugated paper packaging materials contains at least 80% post consumer recycled content.

Hewlett-Packard is committed to compliance with all applicable environmental laws and regulations, including the European Union Restriction of Hazardous Substances (RoHS) Directive. HP's goal is to exceed compliance obligations by meeting the requirements of the RoHS Directive on a worldwide basis.

By July 1, 2006, RoHS substances were virtually eliminated (virtually = to levels below legal limits) for all

HP electronic products subject to the RoHS Directive, except where it is widely recognized that there is no technically feasible alternative (as indicated by an exemption under the EU RoHS Directive).

This product does not contain any of the following substances in excess of regulatory limits (refer to the

HP General Specification for the Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/ supplychain/gen_specifications.html

):

Asbestos

Certain Azo Colorants

Certain Brominated Flame Retardants – may not be used as flame retardants in plastics

Cadmium

Chlorinated Hydrocarbons

Chlorinated Paraffins

Formaldehyde

DA - 12863 North America — Version 1 — February 11, 2008 Page 42

QuickSpecs

Technical Specifications - Environmental Data

Halogenated Diphenyl Methanes

Lead carbonates and sulfates

Lead and Lead compounds

Mercuric Oxide Batteries

Nickel – finishes must not be used on the external surface designed to be frequently handled or carried by the user.

Ozone Depleting Substances

Polybrominated Biphenyls (PBBs)

Polybrominated Biphenyl Ethers (PBBEs)

Polybrominated Biphenyl Oxides (PBBOs)

Polychlorinated Biphenyl (PCB)

Polychlorinated Terphenyls (PCT)

Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been voluntarily removed from most applications.

Radioactive Substances

Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

HP follows these guidelines to decrease the environmental impact of product packaging:

Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials.

Eliminate the use of ozone-depleting substances (ODS) in packaging materials.

Design packaging materials for ease of disassembly.

Maximize the use of post-consumer recycled content materials in packaging materials.

Use readily recyclable packaging materials such as paper and corrugated materials.

Reduce size and weight of packages to improve transportation fuel efficiency.

Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.

Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic areas.

To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers . These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment.

For more information about HP's commitment to the environment:

Global Citizenship Report http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html

Eco-label certifications http://www.hp.com/hpinfo/globalcitizenship/environment/productdesign/ecolabels.html

ISO 14001 certificates: http://www.hp.com/hpinfo/globalcitizenship/environment/operations/envmanagement.html

© Copyright 2008 Hewlett-Packard Development Company, L.P.

The information contained herein is subject to change without notice.

Intel and Pentium are U.S. registered trademarks of Intel Corporation. Microsoft and Windows are U.S. registered trademarks of

Microsoft Corporation. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

DA - 12863 North America — Version 1 — February 11, 2008 Page 43

Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project