Hollywood™ mobile broadcast single

Hollywood™ mobile broadcast single
TM
Technology for Innovators
Hollywood ™ mobile broadcast
single-chip solutions: DTV1000 and DTV1001
Key features
Facts
• First mobile DTV single chip solution—integrates RF, demod, decoder
and memory
• World’s smallest footprint package—less than 30 mm2 resulting in low-cost BOM
• Low-Power Design—90 nm RF CMOS design, low 1-V core design
• Both DVB-H (DTV1000) and ISDB-T (DTV1001) products available
• Fast time-to-market: Development platform OS agnostic driver and
API integration package
P R O D U C T
Overview
B U L L E T I N
Texas Instruments’ (TI's) Hollywood™ family of mobile digital broadcast products provides the first ever single-chip solutions for mobile DTV standards DVB-H (DTV1000)
and ISDB-T (DTV1001). Using TI’s industry leading DRP™ technology, the Hollywood
chips enable a single low-voltage CMOS design. TI’s Hollywood solutions also
simplify integration by adding intelligence to the mobile DTV chip thereby off-loading
takes from the host processor (digital cellular baseband or application processor).
Product features
Smallest solution footprint—smaller product design
• Single-chip solution, less than 30 mm2 package
• 51 mm2 for base line configuration
• No external memory required
Low bill-of-materials count—lower solutions cost
• Single chip—Low part count keeps solution cost low
• Integrated LDOs and VCO/PLL (only 1 voltage and clock source needed)
• No external memory, keeps solution cost low
• Single-ended RF LNA (no external balun)
Low power consumption—longer view time
• Integrated data, programmable memory leads to lower power
• Integrated on-chip smart power control—6 power modes
• Single-chip design reduces chip-to-chip I/O consumption
• Low 1.8 voltage peripherals and 1-volt core
www.ti.com/hollywood
Reduced time-to-market
• Common high-speed serial interfaces (SPI and SDIO)
• Tuning, hand-over control and power control handle on chip
• Complete SPI/SDIO driver and API sourced code package
• Reference Development Board (RDP) available
• Compact module available through module vendor
• PC-based diagnostic and data/message logging tools
High performance—ready for broadcaster service rollout
• Support for 2 concurrent Elementary Streams and 8 IP filters
• 20 to 30 Mbps data processing throughput
• High sensitivity RF and low-noise figure
• Harmonic rejection filters for improved interference rejection
DTV100x
specifications
Standards and bands
supported
Diagnostic and
debug interfaces
•
•
•
•
• PC direct connect to UART
• Also via host
DVB-H: 470-750 MHz and 1.67 GHz
ISDB-T 1-seg: 470-770 MHz
Tunable 0.5 MHz (ISDB-T) bandwidth modes
Tunable 5, 6, 7, 8 MHz (DVB-H)
bandwidth modes
Reference input clock
• 13, 15.36, 16.8, 19.2, 26, 38.4 MHz
• Other clocks internal
Embedded system memory
Boot options
• MPE-FEC and Link-Layer Buffering on chip
• Built-in program and data RAM for ARM
• Downloaded via SPI/SDIO
• Boot loader provided
Host data and control
interfacing
Package and
power management
• 48-MHz SPI
• 4-bit 25 MHz SDIO
• Driver, API source code
•
•
•
•
Antenna control
• 10 programmable GPIOs
• 1.8-V PWM
Wafer Scale Package
88 balls, 0.5 mm ball pitch
1.8-V source (1-V core, 1.8 I/O)
Green and lead-free compliant
Operating temperature
• -30°C to +85°C
DTV100x block diagram
Analog
BB or
Switcher
TPS62300
1.8 V
VCore
Clock
Manager
ClockREF
RTCCLK
TS
DEMUX
DTV100x
OFDM
Demod
UHF-FE
ADC
1.6G-FE
DTV_CLK_REQ
OMAP2420
OMAP2430
OMAP-DM275
OMAP-Vox™
DTVNSHUTDOWN
WSPI/SDIO
WSPI/SDIO
IRQ
UART
Antenna
Selection
MPE-FEC
Or Link
Layer Buffer
ARM966E
128 I-RAM
128 D-RAM
Antenna
Module
PreSelect
Filter
GPIO0-2
Power, Reset
Clock
Management
Optional
Debug to PC
GPIO3
GPIO9
PWM
Low Pass
Filter
VANT
Antenna
Tuning
5 or 3.3 V
TI’s Hollywood and an OMAP™ processor provide a complete mobile TV solution for handsets. The OMAP processor manages
the client software, A/V processing, IP/UDP processing stack, DRM, display control, DTV service manager and ESG.
Important Notice: The products and services of Texas Instruments Incorporated and its subsidiaries described herein are sold subject to TI’s standard terms and
conditions of sale. Customers are advised to obtain the most current and complete information about TI products and services before placing orders. TI assumes no
liability for applications assistance, customer’s applications or product designs, software performance, or infringement of patents. The publication of information
regarding any other company’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Technology for Innovators, the black/red banner, Hollywood, OMAP and DRP are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
© 2005 Texas Instruments Incorporated
Printed in the U.S.A.
Printed on recycled paper.
A091905
SWPT016
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