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PowerEdge T110 II
Technical Guide
Ideal for collaboration, file sharing, and data protection, the
T110 II is an ideal first server for small businesses.
This document is for informational purposes only. Dell reserves the right to make changes without further notice to any products herein. The content provided is as is and without express or implied warranties of any kind.
Dell, PowerEdge, Dell OpenManage, and ReadyRails are trademarks of Dell, Inc. Intel, Xeon,
Pentium, and Celeron are registered trademarks and Core is a trademark of Intel Corporation in the
U.S. and other countries. Broadcom is a registered trademark and NetXtreme is a trademark of
Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the
EU. Linux is a registered trademark of Linus Torvalds. Matrox is a registered trademark of Matrox
Electronic Systems Ltd. Microsoft, Windows, Windows Server, SQL Server, Active Directory, and
SharePoint are either registered trademarks or trademarks of Microsoft Corporation in the United
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September 2013 | Version 4.0
PowerEdge T110 II Technical Guide ii
Table of Contents
PowerEdge T110 II Technical Guide iii
Advanced Programmable Interrupt Controller (APIC) ............................................... 28
Processor Present Indicator ..................................................................... 29
Error Code Correction (ECC) Reporting ....................................................... 29
Power Management .............................................................................. 31
PowerEdge T110 II Technical Guide iv
Unified Server Configurator .................................................................... 41
Base Management Functionality ............................................................... 42
Statement of Volatility ...................................................................... 44
Certifications .................................................................................. 47
Industry Standards ........................................................................... 49
Tables
Comparison of PowerEdge T110 II to T110 and T310 .............................................. 7
Formulas for Maximum Operating Temperature at Given Altitude ............................ 19
Supported Memory Configurations ................................................................. 26
Power Management Features ....................................................................... 31
Unified Server Configurator Features and Description .......................................... 41
Electromagnetic Compatibility Certifications .................................................... 48
Figures
Dimensions (mm) and Weight (kg) ................................................................. 12
PowerEdge T110 II Technical Guide v
1 Product Comparison
1.1 Overview
The Dell™ PowerEdge™ T110 II is a powerful and reliable server in a tower form factor that is designed to deliver the right combination of performance, data protection and value. It is an ideal first server for small businesses considering or implementing desktop consolidation, file sharing, printer sharing or wishing to reduce software licensing charges. The T110 II delivers continuity and confidence, allowing you to focus on running your business instead of running your computers.
1.2 Business Value
The PowerEdge T110 II is designed to meet the needs of your small business environment, both now and as it grows into the future. It has sizeable performance headroom and its data-storage capability can be expanded by adding more hard drives or higher-capacity hard drives. Your data can be secured using RAID options for added data protection. The T110 II also provides straightforward systems management for easy deployment, monitoring and ongoing administration.
1.3 Easy Access
Run applications, share information or access your data from any workstation in the office and let employees work collaboratively by moving to a server-based network.
Adding a server to your business gives you the ability to connect with collaboration suites to meet and share documents or desktops over the Internet, deliver instant messages, make calls over the
Internet and share desktops during conference calls—all without adding an IT staff.
The PowerEdge T110 II is ideally suited to give your business the flexibility and access you and your employees need to get more done.
1.4 Secure Technology
Keep data secure and control file access with built-in encryption, security and data protection options. When coupled with the latest version of Microsoft ® Windows ® Small Business Server 2011
(SBS 2011), the PowerEdge T110 II delivers an integrated solution that can further protect your data by providing automatic backup and restore functionality, as well as email, remote access and collaboration to help take your business to the next level.
With the PowerEdge T110 II, you can:
Avoid costly business interruptions and potentially catastrophic security breaches with hardware-enabled advanced security and encryption features.
Configure your system with an optional RAID controller to make copies of data automatically, preventing downtime in the event of a hard drive failure.
Protect your files with the Microsoft Windows Small Business Server 2011 standard backup features that let you restore files and recover data, including automatic backups on
PowerEdge servers.
PowerEdge T110 II Technical Guide 6
1.5 Business Friendly
Easy to install, tailorable to your specific requirements and offering room for growth, the PowerEdge
T110 II is the ideal server for small businesses and for remote offices of larger organizations.
Get the processing power your business demands with options from the Intel
® Xeon ® and G800 series, and Intel Celeron G400 and G500 series.
Choose processor options and memory configurations that are balanced to run typical business
processor
E3-1200 product family, Intel Xeon processor E3-1200 V2 product family, Intel Pentium G600 applications, including Microsoft Windows Small Business Server, SQL Server ®
Workgroup/Standard, Active Directory ® , SharePoint ® Server and file and print.
Meet the needs of noise-sensitive environments, thanks to a design that gives you business-class performance with similar sound levels as a standard desktop computer.
1.6 Comparison
Feature
Processor
Front Side Bus
Sockets
Cores
L2/L3 Cache
Chipset
DIMMs
Table 1.
Min/Max RAM
Hard Drive Bays
Comparison of PowerEdge T110 II to T110 and T310
T110 (Predecessor)
Quad-core Intel ® Xeon processor 3400 series
®
Dual-core
Intel Celeron ® G1101
Dual-core Intel Pentium
G6950
®
Dual-core Intel Core™ i3
530 processors
Dual-core Intel Core i3
540 processors
Dual-core Intel Core i3
550 processors
DMI
1
2 or 4
4MB or 8MB
Intel 3420
4 DDR3
Unbuffered with ECC
1333/1066MT/s
1GB/16GB
4 x 3.5”
Hard Drive Types Default SATA
Optional SAS with add-in controller
T110 II
Intel Xeon processor
E3-1200 product family
Intel Xeon processor
E3-1200 V2 product family
Intel Pentium G600 and
G800 series
Intel Celeron G400 and
G500 series
DMI II
1
2 or 4
3MB or 8MB
Intel C202
4 DDR3
Unbuffered with ECC
1333/1066/1600MT/s
1GB/32GB
4 x 3.5” or 6 x 2.5”
Default SATA
Optional SAS with add-in controller
T310
Quad-core Intel Xeon processor 3400 series
Dual-core Intel Celeron
G1101
Dual-core Intel Pentium
G6950
Dual-core Intel Core i3 processor 530 series
DMI
1
2 or 4
4MB or 8MB
Intel 3420
6 DDR3
Unbuffered with ECC
1333/1066MT/s
1GB/32GB
4 x 3.5”
Optional hot-plug
Support 2.5" hard drives with hot-plug tray
Default SATA
Optional SAS and SSD with add-in controller
PowerEdge T110 II Technical Guide 7
Feature
External Drive
Bays
Embedded Hard
Drive Controller
Optional Storage
Controller
Availability
Server
Management
I/O Slots
NIC/LOM
USB
Power Supplies
Fans
T110 (Predecessor)
2 x 5.25”
T110 II
2 x 5.25”
T310
2 x 5.25”
Chipset-based SATA
PERC S100 (Embedded
SW RAID)
Non-RAID:
SAS 5/E
LSI 2032 (for tape backup unit only)
RAID:
SAS 6/iR Adapter
PERC S300
PERC H200
ECC memory, add-in
RAID, TPM/CTPM
Baseboard Management
Controller (BMC), IPMI
2.0 compliant
1 PCIe x16 (x8 routing)
(under 25W only)
1 PCIe x8 (x8 routing)
1 PCIe x8 (x4 routing)
1 PCIe x1 (x1 routing)
1 x GbE LOM
Optional: various NICs available
2 front, 4 back, 2 internal
Non-redundant, 305W
Non-redundant, non-hot pluggable
Chipset-based SATA
PERC S100 (Embedded
SW RAID)
Non-RAID:
6GB SAS HBA
RAID:
PERC S300
PERC H200
ECC memory, add-in
RAID, TPM/CTPM
Baseboard Management
Controller (BMC), IPMI
2.0 compliant
Dell OpenManage™
Unified Server
Configurator
1 PCIe x16 (x8 routing)
(under 25W only)
1 PCIe x8
1 PCIe x8 (x4 routing)
1 PCIe x1
1 x GbE LOM
Optional: various NICs available
2 front, 4 back, 2 internal
Non-redundant, auto-sensing, 305W (80+)
Non-redundant, non-hot pluggable
Chipset-based SATA
PERC S100 (Embedded SW
RAID)
Non-RAID:
SAS 5/E
LSI 2032 (for tape backup unit only)
RAID:
SAS 6/iR
PERC S300
PERC H200
PERC 6/i
PERC 6/E
Hot-plug hard drives
Redundant power
Quad-pack LED or LCD diagnostic with hot-plug hard drive chassis
Baseboard Management
Controller (BMC), IPMI
2.0 compliant, Full Dell
OpenManage™ suite
Optional: iDRAC6
Express, iDRAC6
Enterprise, vFlash media
1 PCIe x16 (x8 routing)
1 PCIe x8 (x8 routing)
1 PCIe x8 (x4 routing)
2 PCIe x1 (x1 routing)
2 x GbE LOM
Optional: various NICs available
2 front, 4 back, 2 internal
Non-redundant, 375W
(80+ SILVER)
Optional redundant,
400W (80+ GOLD)
Auto-ranging (100V~240V)
Non-redundant, non-hot pluggable
PowerEdge T110 II Technical Guide 8
2 Key Technologies
2.1 Overview
The PowerEdge T110 II uses the latest Intel ® C202 chipset and supports the Intel Xeon
G800 series, and Intel Celeron G400 and G500 series.
® processor
E3-1200 product family, Intel Xeon processor E3-1200 V2 product family, Intel Pentium G600 and
Key technologies include the following:
Significant performance improvement (up to 25%) over previous generation
Twice the memory footprint at 32GB
Direct Media Interface (DMI) Gen 2
Support for up to four 3.5” SAS, nearline SAS, or SATA drives; support for up to six 2.5” SAS or
SSD hard drives
2.2 Processor Features
The Intel Xeon processor E3-1200 product family features:
New micro architecture on 32 nm processor provides higher performance and lower power
Next generation Intel Turbo Boost Technology
Dynamic Turbo
Dual-core and quad-core processing
New Advanced Encryption Standard (AES) for improved encryption and decryption performance
PowerEdge T110 II Technical Guide 9
3 System Information
3.1 Overview
Table 2 summarizes the features for the PowerEdge T110 II. For the latest information on supported
features, visit Dell.com
.
Table 2.
Product Features Summary
Feature
Form Factor
Processors
Technical Specification
Tower
Quad-core Intel ® Xeon ® processor E3-1200 product family
Intel Xeon processor E3-1200 V2 product family
Dual-core Intel Pentium ® G600 and G800 series
Dual-core Intel Celeron ® G400 and G500 series
Processor Sockets 1
Front Side Bus or
HyperTransport
Cache
Chipset
Memory 1
DMI II (Direct Media Interface)
8MB
I/O Slots
RAID Controller
Intel C202
Up to 32GB (4 DIMMs): 1GB/2GB/4GB/8GB DDR3 up to 1600MT/s
4 PCIe slots:
Two x8 slots (one with x16 connector)
One x4 slot (with x8 connector)
One x1 slot
Internal:
PERC H200
PERC S100 (software based)
PERC S300 (software based)
External:
6GB/s SAS HBA
Drive Bays
Hard Drives
Up to four 3.5” cabled SAS, nearline SAS, or SATA drives or
Up to six 2.5” cabled SATA SSD or SAS drives
Maximum Internal
Storage 1
Up to 12TB
3.5” SAS (15K), nearline SAS (7.2K), SATA (7.2K, 5.4K)
2.5” SATA SSD, SAS (10K)
Embedded LOM/
NIC
Integrated Broadcom ® BCM5722 Gigabit Ethernet Controller
PowerEdge T110 II Technical Guide 10
Feature
Communications
Power Supply
Availability
Video
Technical Specification
Optional add-in NICs :
Broadcom NetXtreme ®
Interface Card
II 5722 Single Port Ethernet PCI-Express Network
Broadcom NetXtreme II 5709 Dual Port Ethernet PCIe Card with TOE
Broadcom NetXtreme II 5709 Dual Port Ethernet PCIe Card with TOE and iSCSI Offload
Intel PRO/1000 PT Server Adapter
Intel Gigabit ET Dual Port Server Adapter
Single cabled power supply (305W)
Quad-pack LED diagnostics, ECC memory, add-in RAID, TPM/TCM
Matrox ® G200eW with 8MB memory
Remote
Management
N/A
Systems
Management
Dell™ OpenManage™
BMC, IPMI 2.0 compliant
Unified Server Configurator
Operating Systems
Microsoft ® Windows Server ® 2012
Microsoft Windows Server 2012 Essentials
Microsoft Windows ® Small Business Server 2011
Microsoft Windows Small Business Server 2008
Microsoft Windows Server 2008 R2 Foundation SP1 2
Microsoft Windows Server 2008 SP2, x86/x64 (x64 includes Hyper-V ® )
Microsoft Windows Server 2008 R2 SP1, x64 (includes Hyper-V)
Novell ® SUSE ® Linux Enterprise Server
Red Hat ® Enterprise Linux ®
Virtualization options:
VMware ® vSphere ® i™
Red Hat Enterprise Virtualization ®
For more information on the specific versions and additions, visit
Dell.com/OSsupport .
Featured Database
Applications
Microsoft ® SQL Server ® solutions (see Dell.com/SQL )
1 GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and operating environment and will be less.
2 Windows Server 2008 R2 Foundation SP1 allows only 15 user accounts and requires certain
Active Directory (AD) configurations. If not configured according to the product documentation, the software will generate warnings to correct the configuration. After a certain amount of time, the software will only run for one hour at a time until the configuration is corrected. For more information about these features review the product documentation located at http://go.microsoft.com/fwlink/?LinkId=143551
PowerEdge T110 II Technical Guide 11
4 Mechanical
4.1 Chassis Description
The PowerEdge T110 II is a tower chassis design that supports the following features:
Four 3.5” cabled hard drives or six 2.5” cabled hard drives
Single non-redundant power supply
Diagnostic LED panel
4.2 Dimensions and Weight
*Note: Zb goes to the nominal rear wall external surface where the motherboard I/O connectors reside.
Xa Xb Ya Yb Yc
189.35 N/A 417.90 420.3 N/A
Za
(with bezel)
37.50
Za
(without bezel)
N/A
Zb* Zc
Max
Weight
407.20 426.22 15.50
Figure 1. Dimensions (mm) and Weight (kg)
PowerEdge T110 II Technical Guide 12
4.3 Front-Panel View and Features
Figure 2 shows the front-panel view of the PowerEdge T110 II.
Figure 2. Front-Panel View
See the Front-Panel Features and Indicators section in the About Your System chapter of the
PowerEdge T110 II Systems Owner’s Manual on Support.Dell.com
for more information on features.
PowerEdge T110 II Technical Guide 13
4.4 Back-Panel View and Features
Figure 3 shows the back-panel view of the PowerEdge T110 II.
Figure 3. Back-Panel View
See the Back-Panel Features and Indicators section in the About Your System chapter of the
PowerEdge T110 II Systems Owner’s Manual on Support.Dell.com
for more information on features.
PowerEdge T110 II Technical Guide 14
4.5 Internal-Chassis View
Figure 4 shows the internal-chassis view of the PowerEdge T110 II.
Figure 4. Internal-Chassis View
4.6 Power Indicator
All Dell PowerEdge servers have a green LED integrated in the power button which indicates the
system’s power state. Figure 5 shows the power button.
Figure 5. Power Button
4.7 NIC Indicators
See the NIC Indicator Codes section in the About Your System chapter of the PowerEdge T110 II
Systems Owner’s Manual on Support.Dell.com
for more information.
4.8 Rails and Cable Management
The PowerEdge T110 II is not a rackable system and does not have a rack kit. However, the T110 II can be stored in a rack using a third-party rack tray.
4.9 Fans
There is one cabled system fan located at back of the system. It is not hot-pluggable.
PowerEdge T110 II Technical Guide 15
4.10 LED Control Panel
Figure 6 shows the LED control panel located on the front of the T110 II system.
Figure 6. LED Control Panel
For a complete description of LED indicators, their causes, and possible courses of action to take to resolve an error, see the Diagnostic Lights (Optional) section in the About Your System chapter in the
PowerEdge T110 II Systems Owner’s Manual on Support.Dell.com
.
4.11 Security
For additional information regarding the following security features, see the PowerEdge T110 II
Systems Owner’s Manual on Support.Dell.com
.
4.11.1
Cover Latch
The PowerEdge RT10 II comes with a lockable entry latch on the side cover of the unit and provides security for the entire system. The latch provides for toolless access to the chassis.
4.11.2
Bezel
The bezel is a one piece plastic bezel that cannot be removed from the front of the chassis.
4.11.3
Hard Drive
The hard drives are secured by the lockable cover latch on the side of the system.
4.11.4
TPM
The Trusted Platform Module (TPM) is used to generate and store keys, protect and authenticate passwords, and create and store digital certificates. The TPM can also be used to store Microsoft
BitLocker™ keys for hard drive encryption features in Microsoft Windows Server ® 2008. TPM is
® enabled through a BIOS option.
4.11.5
Power Off Security
There is a setting in the CMOS setup that disables the power button function.
4.11.6
Intrusion Alert
A switch mounted on the inside of the chassis detects chassis intrusion. When the cover is opened, the switch circuit closes to indicate intrusion.
4.11.7
Secure Mode
BIOS has the ability to enter a secure boot mode through Setup. This mode includes the option to lock out the power or set up a system password.
For more information, see System and Setup Password Features section in the About Your System chapter in the PowerEdge T110 II Systems Owner’s Manual on Support.Dell.com
.
PowerEdge T110 II Technical Guide 16
4.12 USB Key
The PowerEdge T110 II has two internal USB keys.
4.13 Battery
A replaceable coin cell CR2032 3V battery is mounted on the planar provides backup power for the
Real-Time Clock and CMOS RAM on the PCH C202 chip.
4.14 Field Replaceable Units (FRU)
The planar contains a 32K bit serial EEPROM to store FRU information including Dell part number, part revision level, and serial number. This part will also be used as SEL (system event log) especially to be used by the baseboard management controller (BMC).
4.15 User Accessible Jumpers, Sockets, and Connectors
See the Jumpers and Connectors chapter in the PowerEdge T110 II Hardware Owner’s Manual on
Support.Dell.com
.
PowerEdge T110 II Technical Guide 17
5 Power, Thermal, Acoustic
5.1 Power Supplies
The base PowerEdge T110 II system includes a single 305W power supply. This unit provides power to the planar, the internal hard drive bays, and the two 5.25” internal drive bays. Power is soft-switched, allowing power cycling using a switch on the front of the system enclosure or through software control (server management functions). The power system is compatible with industry standards, such as ACPI and Server 2000.
5.2 Power Supply Specifications
Table 3.
Feature
Dimensions
Status Indicators
Integrated Fans
Power Supply Specifications
Non-redundant Power Supply
L-140mm x W-150mm x H-98mm
N/A
Yes
Yes
Fixed Input Plug
AC Cord Rating
Input Voltage
Auto-ranging
Line Frequency
Maximum Inrush Current
Hot-Swap Capability
Output Power
Maximum Heat Dissipation
Efficiency (20% - 100% Load)
15A @ 120 VAC, 10A @ 240 VAC
90–264 VAC
Yes
47Hz–63Hz
58A for 10 ms or less
No
305 Watts
1300 BTU per hour
80% @ 115 VAC
5.3 Heat Dissipation
The heat dissipation for the T110 II power supply is measured at 1300 BTU/hr (maximum).
PowerEdge T110 II Technical Guide 18
5.4 Environmental Specifications
Table 4 summarizes the environmental specifications for the PowerEdge T110 II.
Table 4.
Environmental Specifications
Specification Operating Requirements Non-Operating Requirements
Temperature Ranges
(For altitude ≤ 900m or 2952.75ft)
Temperature Ranges
(For altitude > 900m or 2952.75ft)
Temperature Gradient
(maximum per 60 minutes)
10°C to 35°C
10°C
(50°F to 95°F)
10°C to T 1
(50°F to T 1
°C
°F)
-40°C to 65°C
20°C
(-40°F to 149°F)
Humidity Percent Ranges
(noncondensing)
20% to 80%
(maximum wet bulb temperature = 29°C)
5% to 95%
(maximum wet bulb temperature = 38°C)
Humidity Gradient
(maximum per 60 minutes)
10% 10%
Altitude Ranges
Airborne contaminants
Low Limits
High Limits
ISA-71 Level
-50ft
(-15.2m)
10,000ft
(3048m)
-50ft
(-15.2m)
35,000ft
(10,668m)
G1 – Maximum corrosive contaminant levels measured at ≤ 50% relative humidity. See Table 3 in ISA-71.04-1985.
1
altitude (in meters or feet).
Temperature
Scale
Celsius
Fahrenheit
Table 5.
Formulas for Maximum Operating Temperature at Given Altitude
Formula
Altitude in Meters Altitude in Feet
35 –
Maximum Altitude (meters) 900
300
°C 35 –
Maximum Altitude (feet) 2952.75
9 4.25
°C
95 –
(Maximum Altitude (meters) 900) x 1.
300
°F 95 –
(Maximum Altitude (feet) 2952.75) x 1.
9 4.25
°F
PowerEdge T110 II Technical Guide 19
Table 6 shows the shock and vibration specifications for the PowerEdge T110 II.
Table 6.
Shock and Vibration Specifications
Maximum Vibration
Operating
Storage
Maximum Shock
0.26Grms at 5–350Hz for 15 minutes
1.88Grms at 10–500Hz for 15 minutes
Operating
Storage
5.5 Maximum Input Amps
Maximum input current (high-output power supply):
9A @ 90 VAC
4.5A @ 180 VAC
One shock pulse in the positive z axis (one pulse on each side of the system) of 31G for 2.6ms in the operational orientation
Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71G for up to
2ms.
Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of Half-sine shock
71G for up to 2ms and square-wave shock 32G,
270 in/sec.
5.6 Thermal
The thermal design of the PowerEdge T110 II reflects the following:
Closed-loop thermal fan speed control: The closed-loop thermal control method uses feedback temperatures to dynamically determine proper fan speeds.
Comprehensive thermal management: The PowerEdge T110 II controls system cooling fan speed based on several different responses from critical component sensors, such as processor temperature, inlet ambient temperature, and system configurations. The thermal management adjusts proper cooling for the system according to what the system really needs.
Optimized Ventilation: The T110 II chassis has a custom ventilation design for optimized air flow path. Each component and peripheral is ensured sufficient air for cooling.
Environmental Specifications: The optimized thermal management makes the T110 II reliable under a wide range of operating environments.
5.7 Acoustics
The acoustical design of the PowerEdge T110 II reflects the following:
Adherence to Dell’s high standards for sound quality: Sound quality is different from sound power level and sound pressure level in that it describes how humans respond to annoyances in sound, like whistles and hums. One of the sound quality metrics in the Dell specification is
prominence ratio of a tone, which is listed in Table 7.
PowerEdge T110 II Technical Guide 20
Hardware configurations affect system noise levels: Dell’s thermal control provides for cooling flexible to varying hardware configurations. Acoustical performances associated with
two common configurations are listed in Table 7.
Quiet office acoustics: Compare the values for LpA in Table 6 and note that they are lower than ambient measurements of typical office environments. The minimal configuration of the
T110 II shown in Table 6 (LpA ~27 dBA, which is similar to a quiet bedroom) would be inaudible in most environments.
Noise ramp and descent at Boot-up: Fan speeds (hence noise levels) ramp up during the boot process to add a layer of protection for component cooling (in the case that the system does not boot properly).
Table 7.
Acoustical Specifications
Processor
Minimum Configuration @ 23°C Ambient
Hard
Drives
Power
Supply
Tape Drives
PCI
Cards
RAID
Operating
Mode
LwA-UL
(bels)
LpA
(dBA)
Prominent
Tones
Standby 2.7 16 None
Intel
(65W)
2 x 3.5”
SATA
(7.2K)
500GB
1 x
305W
None None None
Idle
Active hard drives
Stressed processor
Processor
Typical Configuration @ 23°C Ambient
Hard
Drives
Power
Supply
Tape Drives
PCI
Cards
RAID
Operating
Mode
Standby
Intel Xeon
E3-1200 product family
(80W)
4 x 3.5”
SATA
(7.2K)
1TB
1 x
250W
1 x Dell™
PowerVault™
RD1000
1 x dualport NIC
PERC
H200
Idle
Active hard drives
Stressed processor
4.2
4.2
4.2
LwA-UL
(bels)
2.7
4.9
4.9
4.9
27
27
27
LpA
(dBA)
Prominent
Tones
16
34
34
34
None
None
None
None
None
None
None
Definitions
Standby: AC Power is connected to power supplies but the system is not turned on.
Idle: Reference ISO7779 (1999) definition 3.1.7; system is running in its OS but no other specific activity.
Active Hard Drives: An operating mode per ISO7779 (1999) definition 3.1.6; Section C.9 of ECMA-74
9th ed. (2005) is followed in exercising the hard disk drives.
Stressed Processor: An operating mode per ISO7779 (1999) definition 3.1.6; SPECPower set to 50% loading is used.
LwA–UL: The upper limit sound power level (LwA) calculated per section 4.4.2 of ISO 9296 (1988) and measured in accordance to ISO 7779 (1999).
PowerEdge T110 II Technical Guide 21
LpA-Op: A-Weighted sound pressure level. The system is placed in center of ISO7779 table, while the acoustic transducer is located 150 cm above the floor and 50 cm in front of the equipment.
Prominent tones: Criteria of D.6 and D.11 of ECMA-74 11th ed. (2010) are followed to determine if discrete tones are prominent. The system is placed in a rack with its bottom at 75-cm from the floor.
The acoustic transducer is at front bystander position, ref ISO7779 3rd (2010), Section 8.6.2.
PowerEdge T110 II Technical Guide 22
6 Processors
6.1 Overview
The Dell™ PowerEdge™ T110 II system is a 1-socket entry-level server, supporting the Intel
G600 and G800 series, and Intel Celeron ® G400 and G500 series.
® Xeon processor E3-1200 product family, Intel Xeon processor E3-1200 V2 product family, Intel Pentium
®
®
6.2 Processor Features
Key features of the T110 II processors include:
New micro architecture with 32 nm process provides higher performance and lower power
Intel Advanced Vector Extensions (AVX) accelerate FP-intensive applications
Next generation Intel Turbo Boost Technology
New Advanced Encryption Standard (AES) improves encryption and decryption performance
Dynamic Turbo
Dual-core and quad-core
Power Aware Interrupt routing for power saving
PCIe 3.0 graphics and I/O
Integrated memory channel o 2 channels DDR3-1600 o 2 DIMMs per channel
6.3 Supported Processors
Processors supported on the T110 II are listed in Table 6. For the most up-to-date listings, see
Dell.com
.
Model
Intel Xeon E3-1280
Intel Xeon E3-1270
Intel Xeon E3-1240
Intel Xeon E3-1230
Intel Xeon E3-1220
Intel Xeon E3-1260L
Intel Xeon E3-1220L
Intel Core i3-2100
Intel Pentium G850
Intel Pentium G840
Intel Pentium G645
Intel Pentium G620
Intel Celeron G550
Intel Celeron G530
Speed
Table 8.
Power
3.5GHz
3.4GHz
3.3GHz
3.2GHz
3.1GHz
2.4GHz
2.2GHz
3.1GHz
2.9GHz
2.8GHz
2.9GHz
2.6GHz
2.6GHz
2.4GHz
45W
20W
65W
65W
65W
65W
65W
95W
80W
80W
80W
80W
65W
65W
8MB
3MB
3MB
3MB
3MB
3MB
3MB
8MB
8MB
8MB
8MB
8MB
2MB
2MB
Supported Processors
Cache Cores Threads Turbo Memory
(MT/s)
Process
2
2
2
4
2
8
4
2
2
8
8
8
8
4
2
2
2
2
2
4
2
2
2
4
4
4
4
4
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
No
No
No
No
1333
1333
1333
1333
1333
1333
1333
1333
1333
1333
1333
1333
1333
1333
32nm
32nm
32nm
32nm
32nm
32nm
32nm
32nm
32nm
32nm
32nm
32nm
32nm
32nm
PowerEdge T110 II Technical Guide 23
Model Speed
Intel Xeon E3-1280 v2
Intel Xeon E3-1270 v2
Intel Xeon E3-1240 v2
Intel Xeon E3-1230 v2
3.5GHz
3.4GHz
3.3GHz
3.2GHz
Intel Xeon E3-1220 v2 3.1GHz
Intel Xeon E3-1220L v2 2.3GHz
Intel Core i3-3220
Intel Pentium G2120
3.3GHz
3.1GHz
Power
69W
69W
69W
69W
69W
17W
55W
65W
Cache
8MB
8MB
8MB
8MB
8MB
3MB
3MB
3MB
Cores Threads Turbo Memory
(MT/s)
Process
4
4
4
4
4
2
2
2
8
8
8
8
4
4
4
2
Yes
Yes
Yes
Yes
Yes
Yes
No
No
1600
1600
1600
1600
1600
1600
1600
1600
22nm
22nm
22nm
22nm
22nm
22nm
22nm
22nm
6.4 Processor Configurations
The PowerEdge T110 II operates with a single processor. The memory controller is embedded in the processor.
6.5 Processor Installation
Refer to the Processors section in the Installing System Components chapter of the Dell PowerEdge
T110 II Systems Owner’s Manual on Support.Dell.com
for processor installation and removal instructions.
PowerEdge T110 II Technical Guide 24
7 Memory
7.1 Overview
The PowerEdge T110 II supports DDR3 memory, providing a high performance, high-speed memory interface capable of low latency response and high throughput. The T110 II supports unbuffered ECC
DDR3 DIMMs (UDIMM).
Key features of the T110 II memory system include:
2 channels per processor
Support for UDIMM ECC DDR3 DIMMs
DDR3 speeds of 1066/1333/1600MT/s
4 DIMM sockets (32GB maximum capacity)
Support for single-rank and dual-rank DIMMs
7.2 DIMMs Supported
The T110 II supports the following DIMM types:
1GB, DDR3 UDIMM, 1333/1600 with ECC
2GB, DDR3 UDIMM, 1333/1600 with ECC
4GB, DDR3 UDIMM, 1333/1600 with ECC
8GB, DDR3 UDIMM, 1333/1600 with ECC
7.3 DIMM Slots
The PowerEdge T110 II has four 72-bit (240-pin) DIMM slots for memory, supporting up to 2 DIMMs per channel. The modules are configured as 72 bits wide to provide for ECC. The memory controller in the processor performs the ECC.
7.4 Speed
The PowerEdge T110 II supports up to 1600MT/s DDR3 memory.
7.5 Sparing
Memory sparing is not supported.
7.6 Mirroring
Memory mirroring is not supported.
7.7 RAID
Memory RAID is not supported.
7.8 Supported Configurations
Supported memory configurations for the T110 II are listed in Table 9. For the latest information on
memory options, visit Dell.com
.
PowerEdge T110 II Technical Guide 25
Table 9.
System
Capacity
(GB)
DIMM
Capacity
(GB)
DIMM
Quantity
8
8
4
4
1
2
2
4
8
16
8
16
16
8
8
4
4
16
32
2
32
2
4
2
4
1
2
1
1
8
4
8
2
4
2
4
8
8
1
8
8
4
4
2
2
1
1
1
2
4
1
4
2
4
2
2
1
2
4
1
4
1
4
Supported Memory Configurations
DIMM
Type
UDIMM
UDIMM
UDIMM
UDIMM
UDIMM
UDIMM
UDIMM
UDIMM
UDIMM
UDIMM
UDIMM
UDIMM
UDIMM
UDIMM
UDIMM
UDIMM
UDIMM
UDIMM
UDIMM
UDIMM
UDIMM
DIMM
Speed
(MT/s)
Number of
Channel
Ranks per
DIMM
Memory
Data
Width
Volts
1333
1333
1333
1333
1333
1333
1333
1333
1333
1333
1333
1333
1600
1600
1600
1600
1600
1600
1600
1600
1600
2
2
2
1
2
2
1
1
2
2
2
2
1
2
2
2
2
1
2
2
2
1
2
1
2
1
1
1
1
1
2
2
1
2
1
2
2
2
1
2
2
2 x8
X8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8
X8 x8 x8 x8
X8
X8
X8 x8
X8
1.35
1.35
1.35
1.35
1.35
1.35
1.35
1.35
1.35
1.35
1.35
1.35
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
PowerEdge T110 II Technical Guide 26
8 Chipset
8.1 Overview
The PowerEdge T110 II planar incorporates the Intel ® below are part of the chipset.
C200 Series PCH chipset. The features listed
8.2 Direct Media Interface
Direct Media Interface (DMI) is the chip-to-chip connection between the processor and C200 series chipset. This high-speed interface integrates advanced priority-based servicing allowing for concurrent traffic and true isochronous transfer capabilities. Base functionality is completely software-transparent, permitting current and legacy software to operate normally.
8.3 PCI Express Interface
The C200 series chipset provides up to 8 PCI Express root ports, supporting bandwidths of 2.5 GT/s and 5 GT/s. PCI Express Root Ports 1-4 can be statically configured as four x1 ports or ganged together to form one x4 port. Ports 5 and 6 can only be used as two x1 ports.
8.4 SATA interface
The chipset supports up to six Serial ATA (SATA) ports capable of independent DMA operation. The
SATA controllers are completely software transparent with an IDE interface, providing a lower pin count and higher performance. PCH SATA interface supports data transfer rates up to 3 Gb/s (300
MB/s) per port. The SATA controller contains two modes of operation— a legacy mode using I/O space and an AHCI mode using memory space.
The chipset supports the Serial ATA Specification, Revision 3.0. Additionally, the chipset is capable of supporting data transfer rates up to 3 Gb/s (300 MB/s) external SATA (eSATA) to ease the addition of external high performance storage devices.
8.5 AHCI
The C200 series chipset provides hardware support for Advanced Host Controller Interface (AHCI), a new programming interface for SATA host controllers. Platforms supporting AHCI may take advantage of performance features, such as having no master/slave designation for SATA devices—each device is treated as a master—and hardware-assisted native command queuing. AHCI also provides usability enhancements such as hot-plugging. AHCI requires appropriate software support (an AHCI driver) and for some features, it requires hardware support in the SATA device or additional platform hardware.
8.6 PCI Interface
The chipset PCI interface provides a 33 MHz, Revision 2.3 implementation. It integrates a PCI arbiter that supports up to four external PCI bus masters in addition to the internal chipset requests. This allows for combinations of up to four PCI down devices and PCI slots.
8.7 Low Pin Count (LPC) Interface
The C200 series chipset implements an LPC Interface as described in the LPC 1.1 Specification. The
Low Pin Count (LPC) bridge function of the chipset resides in PCI Device 31: Function 0. In addition to the LPC bridge interface function, D31:F0 contains other functional units including DMA, interrupt controllers, timers, power management, system management, GPIO, and RTC.
PowerEdge T110 II Technical Guide 27
8.8 Serial Peripheral Interface (SPI)
The chipset implements an SPI Interface as an alternative interface for the BIOS flash device. The chipset supports up to two SPI flash devices with speeds up to 20 MHz, 33 MHz utilizing two chip select pins.
8.9 Compatibility Module
The DMA controller incorporates the logic of two 82C37 DMA controllers, with seven independently programmable channels. Channels 0–3 are hardwired to 8-bit, count-by-byte transfers, and channels
5–7 are hardwired to 16-bit, count-by-word transfers. Any two of the seven DMA channels can be programmed to support fast Type-F transfers. Channel 4 is reserved as a generic bus master request.
The chipset supports LPC DMA, which is similar to ISA DMA, through the DMA controller. LPC DMA is handled through the use of the LDRQ# lines from peripherals and special encoding on LAD[3:0] from the host. Single, Demand, Verify, and Increment modes are supported on the LPC interface.
The timer/counter block contains three counters that are equivalent in function to those found in one 82C54 programmable interval timer. These three counters are combined to provide the system timer function, and speaker tone. The 14.31818 MHz oscillator input provides the clock source for these three counters.
The chipset provides an ISA-Compatible Programmable Interrupt Controller (PIC) that incorporates the functionality of two, 82C59 interrupt controllers. The two interrupt controllers are cascaded so that 14 external and two internal interrupts are possible. In addition, the chipset supports a serial interrupt scheme.
All of the registers in these modules can be read and restored. This is required to save and restore system state after power has been removed and restored to the platform.
8.10 Advanced Programmable Interrupt Controller (APIC)
In addition to the standard ISA compatible Programmable Interrupt Controller (PIC) described in the previous section, the chipset incorporates the Advanced Programmable Interrupt Controller (APIC).
8.11 USB interface
The C200 series Essential supports twelve USB 2.0 ports that support high-speed, full-speed, and lowspeed USB devices. The PCH has two EHCI Host Controllers: EHCI#1 with 8 ports, and EHCI#2 with 6 ports. Each EHCI has an integrated USB 2.0 Rate Matching Hub (RMH). The RMHs replace the functionality of the UHCI controllers by converting high-speed traffic into low- and full-speed traffic.
When the RMHs are enabled the UHCI controllers are disabled.
8.12 RTC
The chipset contains a Motorola MC146818A-compatible real-time clock with 256 bytes of batterybacked RAM.
The real-time clock performs two key functions: keeping track of the time of day and storing system data, even when the system is powered down. The RTC operates on a 32.768 KHz crystal and a 3 V battery.
The RTC also supports two lockable memory ranges. By setting bits in the configuration space, two 8byte ranges can be locked to read and write accesses. This prevents unauthorized reading of passwords or other system security information.
The RTC also supports a date alarm that allows for scheduling a wake up event up to 30 days in advance, rather than only 24 hours in advance.
PowerEdge T110 II Technical Guide 28
8.13 GPIO
Various general purpose inputs and outputs are provided for custom system design. The number of inputs and outputs varies depending on C200 series configuration.
8.14 Enhanced Power Management
The C200 series power management functions include enhanced clock control and various low-power
(suspend) states (for example, Suspend-to-RAM and Suspend-to-Disk). A hardware-based thermal management circuit permits software-independent entrance to low-power states. The chipset contains full support for the Advanced Configuration and Power Interface (ACPI) Specification,
Revision 3.0a.
8.15 System Management Features
The C200 series chipset integrates several functions designed to manage the system and lower the total cost of ownership (TCO) of the system. These system management functions are designed to report errors, diagnose the system, and recover from system lockups without the aid of an external microcontroller.
8.15.1
TCO Timer
The chipset’s integrated programmable TCO timer is used to detect system locks. The first expiration of the timer generates an SMI# that the system can use to recover from a software lock. The second expiration of the timer causes a system reset to recover from a hardware lock.
8.15.2
Processor Present Indicator
The chipset looks for the processor to fetch the first instruction after reset. If the processor does not fetch the first instruction, the chipset will reboot the system.
8.15.3
Error Code Correction (ECC) Reporting
When detecting an ECC error, the host controller has the ability to send one of several messages to the chipset. The host controller can instruct the chipset to generate an SMI#, NMI, SERR#, or TCO interrupt.
8.15.4
Function Disable
The chipset provides the ability to disable the following integrated functions: LAN, USB, LPC, Intel
HD Audio, SATA, PCI Express or SMBus. Once disabled, these functions no longer decode I/O, memory, or PCI configuration space. Also, no interrupts or power management events are generated from the disabled functions.
8.16 System Management Bus (SMBus 2.0)
The chipset contains an SMBus Host interface that allows the processor to communicate with SMBus slaves. This interface is compatible with most I2C devices. Special I2C commands are implemented.
The chipset’s SMBus host controller provides a mechanism for the processor to initiate communications with SMBus peripherals (slaves). Also, the chipset supports slave functionality, including the Host Notify protocol. Hence, the host controller supports eight command protocols of the SMBus interface: Quick Command, Send Byte, Receive Byte, Write Byte/Word, Read Byte/Word,
Process Call, Block Read/Write, and Host Notify.
PowerEdge T110 II Technical Guide 29
8.17 Intel Virtualization Technology for Directed I/O
The chipset provides hardware support for implementation of Intel Virtualization Technology with
Directed I/O (Intel VT-d). Intel VT-d Technology consists of technology components that support the virtualization of platforms based on Intel Architecture Processors. Intel VT-d Technology enables multiple operating systems and applications to run in independent partitions. A partition behaves like a virtual machine (VM) and provides isolation and protection across partitions. Each partition is allocated its own subset of host physical memory.
PowerEdge T110 II Technical Guide 30
9 BIOS
9.1 Overview
The PowerEdge T110 II BIOS supports ACPI and power management features.
9.2 Supported ACPI States
The PowerEdge T110 II BIOS is compliant with ACPI version 2.0a.
9.2.1
Power Management
Power management features come in two types: fixed or generic. Fixed features use bits defined in the ACPI specification for specific capabilities. The fixed feature bits give the OS complete control over the power management of a device, since the location of the bits is given to the OS in the FACP table. Thus, a driver can directly access bits to control a device’s power management. Generic features have defined enable and status bits, but the functionality is not fully visible to the OS. Dell provides ASL code to handle the details of generic features, allowing the OS to intelligently communicate with system-specific hardware.
Table 10 summarizes the power management features on this system:
Feature
Table 10.
Type
ACPI Mode Switch Fixed
Sleep States
Power Button
Fixed
Fixed
Real-Time Clock Fixed
Power Mgmt.
Timer
Power Mgmt. Event
(PME)
Fixed
Generic
PowerEdge T110 II Technical Guide
Power Management Features
Enable/Status/
Ctrl bit location
PCH
Description
PCH
PCH
PCH
PCH
PCH
The OS uses the SCI_EN bit in
PCH to switch from legacy mode to ACPI mode.
Supported states: S0
(Working), S4-OS
(‘Hibernation’), and S5 (Softoff).
S1 (also called standby or suspend) and S3 are not supported.
In ACPI mode, OS has control of the power button. In non-
ACPI mode, SMI handler owns power button events.
The OS is able to configure the system to wake on the RTC alarm.
PCH 32-bit power management timer is used
When a device signals PME, the system wakes (if necessary), the OS detects the event, and a Dell-defined ASL routine handles the event. Wake-on-
LAN is one example of a PME.
31
Feature
USB Wake
Type
Generic
DBS
C State Support
N/A
N/A
Power Profile
Support
N/A
Enable/Status/
Ctrl bit location
N/A
Description
Processor MSRs
Processor and PCH registers
Processor and PCH chipset registers
This feature is not supported on this system since the S1 state is not supported.
This feature handles P state transition under Windows.
This feature allows multiple Cstate support for the processor. This feature will work under Windows and an
ACPI OS that understands C states.
In addition to P, C, and T states, the BIOS will expose the Power Profiles to the OS.
Each Power profile will have a specific settings and it will fine tune the processor and South
Bridge.
PowerEdge T110 II Technical Guide 32
10 Embedded NICs/LAN on Motherboard (LOM)
10.1 Overview
The PowerEdge T110 II has an embedded dual-port Gigabit Ethernet controller. The embedded
Broadcom ® 5722 LAN controller is on the T110 II planar as an independent Gigabit Ethernet interface device. There is one RJ-45 connector on the back of the system. The firmware for the LOM chip resides in a flash part. The PowerEdge T110 II supports Wake-On-LAN (WOL) from either port. The
Broadcom 5722 chip supports IPv6.
10.2 NICs
The following add-on NICs are supported on the T110 II:
Broadcom
® NetXtreme ® II 5722 Single Port Ethernet PCI-Express Network Interface Card
Broadcom NetXtreme II 5709 Dual Port Ethernet PCIe Card with TOE
Broadcom NetXtreme II 5709 Dual Port Ethernet PCIe Card with TOE and iSCSI Offload
Intel
® PRO/1000 PT Server Adapter
Intel Gigabit ET Dual Port Server Adapter
For the latest information on NIC offerings for the T110 II, see Dell.com
.
PowerEdge T110 II Technical Guide 33
11 PCI Slots
11.1 Overview
The PowerEdge T110 II planar provides four PCI Express expansion slots as follows:
Two x8 PCIe Gen2 slots for full-height cards, connected to the CPU
One x4 PCIe Gen2 slot for a full-height card, connected to the PCH
One x1 PCIe Gen2 slot for a full-height card, connected to the PCH
The system supports 25 W maximum power for all four PCIe cards.
11.2 Quantities and Priorities
For information on expansion-card quantities and priorities, see the Expansion Cards section in the
Installing System Components chapter of the Dell PowerEdge T110 II Systems Owner’s Manual on
Support.Dell.com
.
11.3 PCI Card Dimensions
For information about PCIe slots and card dimensions, see the Expansion Cards section in the
Installing System Components chapter in the Dell PowerEdge T110 II Systems Owner’s Manual on
Support.Dell.com
.
PowerEdge T110 II Technical Guide 34
12 Storage
12.1 Overview
The PowerEdge T110 II supports up to four 3.5” internal hard drives or up to six 2.5” internal hard drives. The following drive configurations are supported:
4 x 3.5” cabled SATA from motherboard SATA connector
4 x 3.5” cabled SAS or SATA with add-on storage controller
6 x 2.5” cabled SAS with add-on storage controller
12.2 Hard Drives
Table 9 lists the supported hard drives for the PowerEdge T110 II. For the latest information on supported hard drives, visit Dell.com
.
Table 11.
Supported Hard Drives
Form Factor Capacity
3.5” 250GB, 500GB, 1TB, 2TB, 4TB
3.5” 2TB
3.5”
3.5”
2.5”
2.5”
500GB, 1TB, 2TB, 4TB
146GB, 300GB, 450GB, 600GB
200GB, 400GB
146GB, 300GB, 600GB, 900GB
Speed Type
7.2K
SATA
5.4 K SATA
7.2 K NL SAS
15 K
NA
10 K
SAS
SAS SSD
SAS
12.3 RAID Configurations
Table 12 details the factory RAID configurations for the PowerEdge T110 II.
Table 12.
Factory Configuration
Configuration
Type Configuration
No Hard drive 0 NCZCBL
SATA—No RAID 1 MSTCBL
SATA RAID
Factory RAID Configurations
Description
No controller/No hard drive
2a
3
MSTR0CBL
2b MSTR0CBL
MSTR1CBL
On-board SATA Controller
Embedded SATA SW RAID—RAID 0 with
2 hard drives
Embedded SATA SW RAID—RAID 0 with above 2 hard drives
Embedded SATA SW RAID—RAID 1
1
2
3
2
Non Mixed drives, all
SATA or all
SAS
Min
HDD
Max
HDD
0 0
4
2
4
2
4 MSTR5CBL Embedded SATA SW RAID—RAID 5
PowerEdge T110 II Technical Guide
3 4
35
Factory Configuration
Configuration
Type Configuration Description
SAS/SATA RAID
5
6a
6b
MSTR10CBL Embedded SATA SW RAID—RAID 10
ASSCBL
ASSCBL
Add-in SAS/SATA RAID card, No RAID
(PERC S300) with 1 hard drive
Add-in SAS/SATA RAID card, No RAID
(PERC S300) with 2 hard drives
6c
7a
ASSCBL
ASSR0CBL
4
1
Add-in SAS/SATA RAID card, RAID 0
(PERC S300) with 2 hard drives
2
Add-in SAS/SATA RAID card, No RAID
(PERC S300) with above 2 hard drives 3
2
7b
8
9
10
11
12
13
14
ASSR0CBL
ASSR1CBL
ASSR5CBL
ASSR10CBL
ASSCBL
ASSR0CBL
ASSR1CBL
ASSR10CBL
Add-in SAS/SATA RAID card, RAID 0
(PERC S300) with above 2 hard drives 3
Add-in SAS/SATA RAID card, RAID 1
(PERC S300)
Add-in SAS/SATA RAID card, RAID 5
(PERC S300)
2
3
Add-in SAS/SATA RAID card, RAID 10
(PERC S300)
Add-in SAS/SATA RAID card, No RAID
(PERC H200)
4
1
Add-in SAS/SATA RAID card, RAID 0
(PERC H200)
Add-in SAS/SATA RAID card, RAID 1
(PERC H200)
Add-in SAS/SATA RAID card, RAID 10
(PERC H200)
2
2
4
Non Mixed drives, all
SATA or all
SAS
Min
HDD
Max
HDD
4
1
2
6
2
6
2
6
6
6
6
2
6
No hard drive
15 NCZCBL No controller/No hard drive
Additional restrictions for RAID configurations are as follows:
Configurations 0 to 5 are for 3.5” hard drives only
Configurations 6 to 14 are for 2.5” or 3.5” hard drives
0 0
12.4 Storage Controllers
T110 II supports software RAID (PERC S100, PERC S300) and hardware RAID (PERC H200) for internal storage.
PowerEdge T110 II Technical Guide 36
12.5 Optical Drives
The PowerEdge T110 II supports two internal optical drives and an optional external USB DVD-ROM.
The T110 II is able to boot from any internal optical drive. The following internal optical drives configurations are available on the PowerEdge T110 II:
No optical drive configuration
DVD-ROM (SATA)
DVD+RW (SATA)
12.6 Tape Drives
Internal and external tape drives and tape libraries are supported. For more information on supported tape drives and tape libraries, see Dell.com/Storage .
PowerEdge T110 II Technical Guide 37
13 Video
The PowerEdge T110 II includes a Matrox ®
WPCM450 (BMC controller).
G200eW with 8 MB memory integrated in Winbond ®
Supported resolutions are listed in Table 13.
Table 13.
Graphics Video Modes
Resolution Refresh Rate (Hz) Color Depth
(bit)
640 x 480
800 x 600
60, 72, 75, 85
60, 72, 75, 85
8, 16, 32
8, 16, 32
1024 x 768
1280 x 1024 1
1280 x 1024 2
60, 70, 75, 85
60
8, 16
32
60, 75, 85 8, 16
1 32 bit color only supported at 60Hz for this resolution.
2 85Hz for KVM and 1600x1200 at 60Hz for video out.
PowerEdge T110 II Technical Guide 38
14 Rack Information
Dell does not provide rack support for the PowerEdge T110 II. However, the system can be placed in a rack enclosure using a 3 rd party tray.
PowerEdge T110 II Technical Guide 39
15 Operating Systems
For detailed information, see the following:
Operating System Support Matrix for Dell PowerEdge Systems on Dell.com
Dell PowerEdge T110 II Systems Getting Started Guide on Support.Dell.com
PowerEdge T110 II Technical Guide 40
16 Systems Management
16.1 Overview
Dell delivers open, comprehensive, and integrated solutions that help you reduce the complexity of managing disparate IT assets. Combining Dell PowerEdge Servers with a wide selection of Dell developed systems management solutions gives you choice and flexibility, so you can simplify and save in IT environments of any size. To help you meet your server management demands, Dell offers
Dell OpenManage™ systems management solutions for:
• Monitoring of server and storage health and maintenance
• Update of system, operating system, and application software
Dell offers IT management solutions for organizations of all sizes—priced and sized appropriately and supported comprehensively.
16.2 Server Management
A Dell Systems Management and Documentation DVD are included with the product. ISO images are also available. A brief description of available content:
• Dell Systems Build and Update Utility (SBUU): Dell Systems Build and Update Utility assists in
OS install and pre-OS hardware configuration and updates.
• Server Update Utility (SUU): This DVD has an inventory tool for managing updates to firmware, BIOS, and drivers for either Linux or Windows varieties.
• OpenManage Server Administrator (OMSA): The OpenManage Server Administrator tool provides a comprehensive, one-to-one (one console to one server) systems management solution, designed for system administrators to manage systems locally and remotely over a network. OMSA allows system administrators to focus on managing their entire network by providing comprehensive one-to-one systems management.
• Dell Systems Service Diagnostics Tools: Dell Systems Service and Diagnostics tools deliver the latest Dell optimized drivers, utilities, and operating system-based diagnostics that you can use to update your system.
• eDocs: The section includes PDF files for PowerEdge systems, storage peripherals and Dell
OpenManage™ software.
16.3 Embedded Server Management
Embedded management for the PowerEdge T110 II includes the Unified Server Configurator (USC), along with base management functionality features.
16.3.1
Unified Server Configurator
The Unified Server Configurator (USC) is a graphical user interface (GUI) that aids in local server provisioning in a pre-OS environment. To access the Unified Server Configurator, press the <F10> key
within 10 seconds of the Dell logo appearance during the system boot process. Table 14 details
current functionality enabled by the USC.
Table 14.
Feature
Faster O/S Installation
Unified Server Configurator Features and Description
Description
Drivers and the installation utility are embedded on system, so no need to scour Dell.com.
PowerEdge T110 II Technical Guide 41
Feature
Faster System Updates
Update Rollback
More Comprehensive Diagnostics
Simplified Hardware Configuration
Description
Integration with Dell support automatically directed to latest versions of the Unified Server
Configurator, RAID, BIOS, NIC, and power supply.
Ability to recover to previous “known good state” for all updatable components.
Diagnostic utilities are embedded on system.
Detects RAID controller and allows user to configure virtual disk and choose virtual disk as boot device, eliminating the need to launch a separate utility. Also provides configuration for
BIOS and NIC/LOM.
16.3.2
Base Management Functionality
The following base management features are supported on the PowerEdge T110 II:
IPMI v2.0 support
Conductivity: o Shared/failover network modes o IPv4 o VLAN tagging o Dynamic DNS
Security and authentication: o Role-based authority o Local users
Remote management and remediation: o Server power control o Serial-over-LAN (with proxy)
Monitoring: o Sensor monitoring and alerting o Real-time power monitoring o Real-time power graphing o Historical power counters
System Event Log
PowerEdge T110 II Technical Guide 42
17 Peripherals
The PowerEdge T110 II supports the following USB devices:
DVD (bootable; requires two USB ports)
USB key (bootable)
Keyboard (only one USB keyboard is supported)
Mouse (only one USB mouse is supported)
PowerEdge T110 II Technical Guide 43
Appendix A. Statement of Volatility
The Dell PowerEdge T110 II contains both volatile and non-volatile (NV) components. Volatile components lose their data immediately upon removal of power from the component. Non-volatile components continue to retain their data even after the power has been removed from the component. Components chosen as user-definable configuration options (those not soldered to the motherboard) are not included in the Statement of Volatility. Configuration option information
(pertinent to options such as microprocessors, system memory, remote access controllers, and
storage controllers) is available by component separately. The NV components detailed in Table 15
are present in the PowerEdge T110 II server.
Table 15.
Size:
Server BIOS Memory
Type [Flash PROM, EEPROM]:
Can user programs or operating system write data to it during normal operation?
Purpose? [boot code]
How is data input to this memory?
Volatility Table
Details
64 Mbit
Flash EEPROM
No
Boot Code and Configuration Information
Loading flash memory requires a vendor provided firmware file and loader program which is executed by booting up the system from a floppy or OS based executable containing the firmware file and the loader. System loaded with arbitrary data in firmware memory would not operate.
Software write protected
Details
How is this memory write protected?
Remarks
Server CMOS (Complementary Metal-Oxide
Semiconductor) Memory
Size:
Type [Flash PROM, EEPROM]:
Can user programs or operating system write data to it during normal operation?
Purpose? [boot code]
How is data input to this memory?
How is this memory write protected?
512 Bytes
Battery-backed NVRAM
No
RTC and Configuration settings
F2 Setup Menu during POST
N/A
PowerEdge T110 II Technical Guide 44
LOM (LAN [Network Interface] on
Motherboard) Memory
Size:
Type [Flash PROM, EEPROM]:
Can user programs or operating system write data to it during normal operation?
Purpose? [boot code]
How is data input to this memory?
Details
4Mb (512KB)
Flash
Yes, under software control.
How is this memory write protected?
Remarks:
Server System Event Log Memory/FRU
Size:
Type [Flash PROM, EEPROM]:
Can user programs or operating system write data to it during normal operation?
Purpose? [boot code]
How is data input to this memory?
How is this memory write protected?
Remarks
TPM (Trusted Platform Module; For boards shipped outside of China; Boards sold to destinations in China do not have TPM at this time)
Size:
Type [Flash PROM, EEPROM]:
Can user programs or operating system write data to it during normal operation?
Purpose? [boot code]
How is data input to this memory?
How is this memory write protected?
Remarks
Contains LOM boot code and config data
Requires vendor provided firmware file and loader program used during factory assembly or possible field update. A system loaded with arbitrary data in firmware memory would not operate.
Software control.
Details
4 KB
SEEPROM
No
Store System Events
BMC controller write
Not write protected
Details
Unspecified size of user ROM, RAM, EEPROM;
128 bytes of OTP memory included
ROM, RAM, EEPROM
Yes, OS and applications that conform to the
TCG standard can write data to the TPM during normal operation. Access to the NV
Storage is controlled by the TPM owner.
Trusted Platform Module NV storage. May be used to securely storage of encryption keys.
TCG TPM Specification defined command interface or Using TPM Enabled operating systems
As defined by the TCG TPM Specification, protection of this NV memory area is configurable by the TPM owner.
PowerEdge T110 II Technical Guide 45
Server BMC (Baseboard Management
Controller) Firmware Flash Memory
Size:
Type [Flash PROM, EEPROM]:
Can user programs or operating system write data to it during normal operation?
Purpose? [boot code]
How is data input to this memory?
Details
16MB Flash
SPI Flash
No
Stores the BMC Firmware
Loading flash memory requires a vendor provided firmware file and loader program which is executed by booting up the system from a floppy or OS based executable containing the firmware file and the loader. System loaded with arbitrary data in firmware memory would not operate.
Software write protected How is this memory write protected?
Remarks
To obtain optional component information, please refer to the Dell Statement of Volatility for the individual components. Please direct any questions to your Dell Marketing contact.
PowerEdge T110 II Technical Guide 46
Appendix B. Certifications
B 1.
Regulatory Certifications
Regulatory compliance certificates can be located at the following sites:
http://www.dell.com/content/topics/global.aspx/about_dell/values/regulatory_compliance
/dec_conform?c=us&l=en&s=corp
B 2.
Product Safety Certifications
The product has been certified and bears the Mark, as applicable, of the Product Safety authorities
Table 16.
Country/Region
Argentina
Belarus
Canada
China
Croatia
European Union
Germany
IECEE
Israel
Kazakhstan
Kenya
Kuwait
Mexico
Moldova
Nigeria
Norway
Russia
Saudi Arabia
South Africa
Taiwan
Ukraine
United States
Uzbekistan
Product Safety Certifications
Authority or Mark
IRAM
BELLIS
SCC
CNCA or CCC
KONCAR
CE
TUV
IECEE CB
SII
OTAN – CKT
KEBS
KUCAS
NYCE or NOM
INSM
SONCAP
NEMKO
GOST
KSA ICCP
NRCS
BSMI
UKRTEST or
UKRSERTCOMPUTER
NRTL
STZ
PowerEdge T110 II Technical Guide 47
B 3.
Electromagnetic Compatibility
The product has been certified and bears the Mark, as applicable, of the EMC authorities as indicated
Table 17.
Country/Region
Australia/New
Zealand
Belarus
Bosnia &
Herzegovina,
Montenegro, Serbia
Canada
China
Croatia
European Union
Israel
Japan
Kazakhstan
Moldova
Norway
Russia
South Africa
South Korea
Taiwan
Ukraine
United States
Uzbekistan
Vietnam
Electromagnetic Compatibility Certifications
Authority or Mark
ACMA or C-Tick
Class
Class B
Class B BELLIS
KVALITET
ICES
CNCA or CCC
KONCAR
CE
SII
VCCI
OTAN – CKT
INSM
NEMKO
GOST
SABS
Class B
Class B
Class B
Class B
KCC
BSMI
Class B
Class B
UKRTEST or UKRSERTCOMPUTER Class B
FCC
STZ
ICT
Class B
Class B
Class B
Class B
Class B
Class B
Class B
Class B
Class B
Class B
Class B
B 4.
Ergonomics, Acoustics and Hygienics
The product has been certified and bears the Mark, as applicable, of the Ergonomics, Acoustics and
Hygienics authorities as indicated in Table 18.
Table 18.
Ergonomics, Acoustics and Hygienics
Country/Region
Belarus
Germany
Russia
Authority or Mark
BELLIS
GS
GOST
PowerEdge T110 II Technical Guide 48
Appendix C. Industry Standards
The PowerEdge T110 II system conforms to the industry standards detailed in Table 19.
Standard
ACPI
Advance Configuration and
Power Interface Specification, v2.0c
Energy Star
EPA Version 1.0 of the
Computer Server specification
Ethernet
IEEE 802.3-2005
IPMI
Intelligent Platform
Management Interface, v2.0
DDR3 Memory
DDR3 SDRAM Specification,
Rev. 3A
LPC
Low Pin Count Interface
Specification, Rev. 1.1
PCI Express
PCI Express Base Specification
Rev. 2.0
PMBus
Power System Management
Protocol Specification, v1.1
SAS
Serial Attached SCSI, v1.1
SATA
Serial ATA Rev. 2.6;
SATA II, Extensions to SATA
1.0a, Rev. 1.2
SMBIOS
System Management BIOS
Reference Specification, v2.6
TPM
Trusted Platform Module
Specification, v1.2
UEFI
Unified Extensible Firmware
Interface Specification, v2.1
Table 19.
Industry Standards
URL for Information and Specifications http://www.acpi.info/ http://www.energystar.gov/index.cfm?c=archives.enterprise
_servers http://standards.ieee.org/getieee802/802.3.html http://www.intel.com/design/servers/ipmi/ http://www.jedec.org/download/search/JESD79-3A.pdf http://developer.intel.com/design/chipsets/industry/lpc.ht
m http://www.pcisig.com/specifications/pciexpress/ http://pmbus.info/specs.html http://www.t10.org/cgi-bin/ac.pl?t=f&f=sas1r10.pdf http://sata-io.org/ http://www.dmtf.org/standards/smbios/ http://www.trustedcomputinggroup.org/resources/tpm_mai n_specification http://www.uefi.org/specs/
PowerEdge T110 II Technical Guide 49
Standard
USB
Universal Serial Bus
Specification, Rev. 2.0
Windows Logo
Windows Logo Program System and Device Requirements, v3.10
URL for Information and Specifications http://www.usb.org/developers/docs/ http://www.microsoft.com/whdc/winlogo/hwrequirements.
mspx
PowerEdge T110 II Technical Guide 50
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