InvenSense MPU-6555 Data Sheet

InvenSense Inc.

1745 Technology Drive, San Jose, CA 95110 U.S.A.

Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104

Website: www.invensense.com

Document Number: DS-000008

Revision: 1.0

Release Date: 09/10/2014

MPU-6555

Product Specification

Revision 1.0

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MPU-6555-01

MPU-6555 Product Specification


Revision: 1.0


TABLE OF CONTENTS

TABLE OF TABLES .......................................................................................................................................... 5

1

DOCUMENT INFORMATION ...................................................................................................................... 6

1.1

R

EVISION

H

ISTORY

.............................................................................................................................. 6

1.2

P

URPOSE AND

S

COPE

.......................................................................................................................... 7

1.3

P

RODUCT

O

VERVIEW

........................................................................................................................... 7

1.4

A

PPLICATIONS

..................................................................................................................................... 7

2

FEATURES .................................................................................................................................................. 8

2.1

G

YROSCOPE

F

EATURES

....................................................................................................................... 8

2.2

A

CCELEROMETER

F

EATURES

............................................................................................................... 8

2.3

A

DDITIONAL

F

EATURES

........................................................................................................................ 8

2.4

M

OTION

P

ROCESSING

........................................................................................................................... 8

3

ELECTRICAL CHARACTERISTICS ........................................................................................................... 9

3.1

G

YROSCOPE

S

PECIFICATIONS

.............................................................................................................. 9

3.2

A

CCELEROMETER

S

PECIFICATIONS

..................................................................................................... 10

3.3

E

LECTRICAL

S

PECIFICATIONS

............................................................................................................. 11

3.4

I2C T

IMING

C

HARACTERIZATION

......................................................................................................... 15

3.5

SPI T

IMING

C

HARACTERIZATION

......................................................................................................... 16

3.6

A

BSOLUTE

M

AXIMUM

R

ATINGS

........................................................................................................... 18

4

APPLICATIONS INFORMATION .............................................................................................................. 19

4.1

P

IN

O

UT

D

IAGRAM AND

S

IGNAL

D

ESCRIPTION

..................................................................................... 19

4.2

T

YPICAL

O

PERATING

C

IRCUIT

............................................................................................................. 20

4.3

B

ILL OF

M

ATERIALS FOR

E

XTERNAL

C

OMPONENTS

.............................................................................. 20

4.4

B

LOCK

D

IAGRAM

............................................................................................................................... 21

4.5

O

VERVIEW

........................................................................................................................................ 21

4.6

T

HREE

-A

XIS

MEMS G

YROSCOPE WITH

16-

BIT

ADC

S AND

S

IGNAL

C

ONDITIONING

................................ 22

4.7

T

HREE

-A

XIS

MEMS A

CCELEROMETER WITH

16-

BIT

ADC

S AND

S

IGNAL

C

ONDITIONING

........................ 22

4.8

D

IGITAL

M

OTION

P

ROCESSOR

............................................................................................................ 22

4.9

P

RIMARY

I2C

AND

SPI S

ERIAL

C

OMMUNICATIONS

I

NTERFACES

............................................................ 22

4.10

A

UXILIARY

I2C S

ERIAL

I

NTERFACE

...................................................................................................... 24

4.11

S

ELF

-T

EST

........................................................................................................................................ 25

4.12

C

LOCKING

......................................................................................................................................... 25

4.13

S

ENSOR

D

ATA

R

EGISTERS

................................................................................................................. 26

4.14

FIFO ................................................................................................................................................ 26

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4.15

I

NTERRUPTS

...................................................................................................................................... 26

4.16

D

IGITAL

-O

UTPUT

T

EMPERATURE

S

ENSOR

.......................................................................................... 26

4.17

B

IAS AND

LDO

S

................................................................................................................................ 27

4.18

C

HARGE

P

UMP

.................................................................................................................................. 27

4.19

S

TANDARD

P

OWER

M

ODES

................................................................................................................ 27

5

PROGRAMMABLE INTERRUPTS ............................................................................................................ 28

5.1

W

AKE

-

ON

-M

OTION

I

NTERRUPT

........................................................................................................... 29

6

DIGITAL INTERFACE ............................................................................................................................... 30

6.1

I2C

AND

SPI S

ERIAL

I

NTERFACES

...................................................................................................... 30

6.2

I2C I

NTERFACE

.................................................................................................................................. 30

6.3

I2C C

OMMUNICATIONS

P

ROTOCOL

..................................................................................................... 30

6.4

I

2

C T

ERMS

........................................................................................................................................ 33

6.5

SPI I

NTERFACE

................................................................................................................................. 34

7

SERIAL INTERFACE CONSIDERATIONS ............................................................................................... 35

7.1

MPU-6555 S

UPPORTED

I

NTERFACES

................................................................................................. 35

8

ASSEMBLY ............................................................................................................................................... 36

8.1

O

RIENTATION OF

A

XES

...................................................................................................................... 36

8.2

P

ACKAGE

D

IMENSIONS

...................................................................................................................... 37

9

PART NUMBER PACKAGE MARKING ................................................................................................... 38

10

RELIABILITY ............................................................................................................................................. 39

10.1

Q

UALIFICATION

T

EST

P

OLICY

............................................................................................................. 39

10.2

Q

UALIFICATION

T

EST

P

LAN

................................................................................................................ 39

11

REFERENCE ............................................................................................................................................. 40

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Table of Figures

Figure 1: I2C Bus Timing Diagram ................................................................................................................... 15

Figure 2: SPI Bus Timing Diagram ................................................................................................................... 16

Figure 3: Pin out Diagram for MPU-6555 3.0x3.0x0.9mm QFN ....................................................................... 19

Figure 4: MPU-6555 QFN Application Schematic. (a) I2C operation, (b) SPI operation. ................................ 20

Figure 5: MPU-6555 Block Diagram ................................................................................................................. 21

Figure 6: MPU-6555 Solution Using I

2

C Interface ............................................................................................ 23

Figure 7: MPU-6555 Solution Using SPI Interface ........................................................................................... 24

Figure 8. Wake-on-Motion Interrupt Configuration ........................................................................................... 29

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Table of Tables

Table 1: Gyroscope Specifications ..................................................................................................................... 9

Table 2: Accelerometer Specifications ............................................................................................................. 10

Table 3: D.C. Electrical Characteristics ............................................................................................................ 11

Table 4: A.C. Electrical Characteristics ............................................................................................................ 13

Table 5: Other Electrical Specifications ............................................................................................................ 14

Table 6: I

2

C Timing Characteristics .................................................................................................................. 15

Table 7: SPI Timing Characteristics ................................................................................................................. 16

Table 8: fCLK = 20MHz .................................................................................................................................... 17

Table 9: Absolute Maximum Ratings ................................................................................................................ 18

Table 10: Signal Descriptions ........................................................................................................................... 19

Table 11: Bill of Materials ................................................................................................................................. 20

Table 12: Standard Power Modes for MPU-6555............................................................................................. 27

Table 13: Table of Interrupt Sources ................................................................................................................ 28

Table 14: Serial Interface .................................................................................................................................. 30

Table 15: I

2

C Terms .......................................................................................................................................... 33

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Revision

Date

Revision Description

09/10/2014 1.0 Initial

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1.2 Purpose and Scope

This document is a product specification, providing a description, specifications, and design related information on the MPU-6555™ MotionTracking device. The device is housed in a small 3x3x0.90mm QFN package.

Specifications are subject to change without notice. Final specifications will be updated based upon characterization of production silicon. For references to register map and descriptions of individual registers, please refer to the MPU-6555 Register Map and Register Descriptions document.

The MPU-6555 is a 6-axis MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer, and a Digital Motion Processor™ (DMP) all in a small 3x3x0.9mm package. It also features a 512-byte FIFO that can lower the traffic on the serial bus interface, and reduce power consumption by allowing the system processor to burst read sensor data and then go into a low-power mode. With its dedicated I the MPU-6555 directly accepts inputs from external I

2

2

C sensor bus,

C devices. MPU-6555, with its 6-axis integration, onchip DMP, and run-time calibration firmware, enables manufacturers to eliminate the costly and complex selection, qualification, and system level integration of discrete devices, guaranteeing optimal motion performance for consumers. MPU-6555 is also designed to interface with multiple non-inertial digital sensors, such as pressure sensors, on its auxiliary I

2

C port.

The gyroscope has a programmable full-scale range of ±250, ±500, ±1000, and ±2000 degrees/sec and very low rate noise at 0.01 dps/√Hz. The accelerometer has a user-programmable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g. Factory-calibrated initial sensitivity of both sensors reduces production-line calibration requirements.

Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, a precision clock with 1% drift from -40°C to 85°C, an embedded temperature sensor, and programmable interrupts. The device features I

2

C and SPI serial interfaces, a VDD operating range of 1.71 to 3.6V, and a separate digital

IO supply, VDDIO from 1.71V to 3.6V.

Communication with all registers of the device is performed using either I

20MHz.

2

C at 400kHz or SPI at 1MHz. For applications requiring faster communications, the sensor and interrupt registers may be read using SPI at

The MPU-6555 includes support for Automatic Activity Recognition (AAR

TM

) on a wrist-worn device. It works in conjunction with the AAR™ library to detect walk, run, bike, stationary, and sleep. The AAR™ library achieves high detection accuracy and low power by using the gyro sensor in a smart duty cycle fashion. It is capable of identifying a new activity within 10sec of its transition. The AAR™ library offers a high accuracy pedometer that benefits from the contextual awareness of knowing which activities will require steps and which will not.

By leveraging its patented and volume-proven CMOS-MEMS platform, which integrates MEMS wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the package size down to a footprint and thickness of 3x3x0.9mm (24-pin QFN), to provide a very small yet high performance low cost package. The device provides high robustness by supporting 10,000g shock reliability.

1.4 Applications

 Wearable sensors for health, fitness and sports

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2 Features

Features

The triple-axis MEMS gyroscope in the MPU-6555 includes a wide range of features:

 Digital-output X-, Y-, and Z-axis angular rate sensors (gyroscopes) with a user-programmable fullscale range of ±250, ±500, ±1000, and ±2000°/sec and integrated 16-bit ADCs

 Digitally-programmable low-pass filter

 Gyroscope operating current: 3.2mA

 Factory calibrated sensitivity scale factor

 Self-test

Features

The triple-axis MEMS accelerometer in MPU-6555 includes a wide range of features:

 Digital-output X-, Y-, and Z-axis accelerometer with a programmable full scale range of ±2g, ±4g,

±8g and ±16g and integrated 16-bit ADCs

 Accelerometer normal operating current: 450µA

 Low power accelerometer mode current: 6.37µA at 0.98Hz, 17.75µA at 31.25Hz

 User-programmable

 Self-test interrupts

 Wake-on-motion interrupt for low power operation of applications processor

The MPU-6555 includes the following additional features:

 Auxiliary master I

2

C bus for reading data from external sensors (e.g. magnetometer)

 3.4mA operating current when all 6 motion sensing axes are active

 VDD supply voltage range of 1.8 – 3.3V ± 5%

 VDDIO reference voltage of 1.8 – 3.3V ± 5% for auxiliary I

2

C devices

 Smallest and thinnest QFN package for portable devices: 3x3x0.9mm

 Minimal cross-axis sensitivity between the accelerometer and gyroscope axes

 512 byte FIFO buffer enables the applications processor to read the data in bursts temperature

 User-programmable digital filters for gyroscope, accelerometer, and temp sensor

 10,000 g shock tolerant

 400kHz Fast Mode I

2

C for communicating with all registers

 1MHz SPI serial interface for communicating with all registers

 20MHz SPI serial interface for reading sensor and interrupt registers

 MEMS structure hermetically sealed and bonded at wafer level

 RoHS and Green compliant

2.4 MotionProcessing

 Internal Digital Motion Processing™ (DMP™) engine supports advanced MotionProcessing and low power functions such as gesture recognition using programmable interrupts

 Low-power pedometer functionality allows the host processor to sleep while the DMP maintains the step count.

 The DMP is optimized for Android K support..

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Specifications

Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, T

A

=25°C, unless otherwise noted.

PARAMETER CONDITIONS MIN TYP MAX UNITS

Full-Scale Range

GYROSCOPE SENSITIVITY

FS_SEL=0 ±250 º/s

NOTES

3

Gyroscope ADC Word Length

Sensitivity Scale Factor FS_SEL=0

16

131 bits

LSB/(º/s)

3

3

Sensitivity Scale Factor Tolerance

Sensitivity Scale Factor Variation Over

Temperature

Nonlinearity

Cross-Axis Sensitivity

Initial ZRO Tolerance

ZRO Variation Over Temperature

25°C

-40°C to +85°C

Best fit straight line; 25°C

ZERO-RATE OUTPUT (ZRO)

25°C

-40°C to +85°C

±3

±4

±0.1

±2

±5

±0.24

%

%

%

%

º/s

º/s/°C

2

1

1

1

2

1

GYROSCOPE NOISE PERFORMANCE (FS_SEL=0)

Total RMS Noise

Rate Noise Spectral Density

DLPFCFG=2 (92 Hz) 0.1

0.01

GYROSCOPE MECHANICAL FREQUENCIES

LOW PASS FILTER RESPONSE

Programmable

GYROSCOPE START-UP TIME

From Sleep mode 35

OUTPUT DATA RATE

Programmable, Normal (Filtered) mode

Table 1: Gyroscope Specifications

º/s-rms 2

º/s/√Hz 4

Notes:

1. Derived from validation or characterization of parts, not guaranteed in production.

2. Tested in production.

3. Guaranteed by design.

4. Calculated from Total RMS Noise.

Please refer to the following document for information on Self-Test: MPU-6500 Accelerometer and

Gyroscope Self-Test Implementation; AN-MPU-6500A-02

ms

1

Hz

1

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Specifications


A


PARAMETER CONDITIONS MIN TYP MAX UNITS NOTES

ACCELEROMETER SENSITIVITY


Revision: 1.0


Full-Scale Range

ADC Word Length

Sensitivity Scale Factor

Output in two’s complement format 16 bits 3

Initial Tolerance

Sensitivity Change vs. Temperature

Nonlinearity

Cross-Axis Sensitivity

Initial Tolerance

Zero-G Level Change vs. Temperature

Component-level

-40°C to +85°C AFS_SEL=0

Component-level

Best Fit Straight Line

ZERO-G OUTPUT

Component-level, all axes

-40°C to +85°C,

Board-level

X and Y axes

Z axis

NOISE PERFORMANCE

Power Spectral Density Low noise mode

LOW PASS FILTER RESPONSE

Programmable

INTELLIGENCE FUNCTION

INCREMENT

ACCELEROMETER STARTUP TIME

From Sleep mode

From Cold Start, 1ms V

DD

ramp

Low power (duty-cycled)

OUTPUT DATA RATE

Duty-cycled, over temp

Low noise (active)

0.24

4

±3 % 2

±0.026 %/°C 1

±0.5

±2

%

%

1

1

±60

±0.64

±1

300

20

30

±15 mg 2 mg/°C 1 mg/°C 1

µg/√Hz

4

3 ms ms

500 Hz

%

1

1

1

4000 Hz

Table 2: Accelerometer Specifications

Notes:


2. Tested in production.


4. Calculated from Total RMS Noise.

Please refer to the following document for information on Self-Test: MPU-6500 Accelerometer and

Gyroscope Self-Test Implementation; AN-MPU-6500A-02

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3.3.1 D.C. Electrical Characteristics


A


PARAMETER CONDITIONS MIN TYP MAX Units

SUPPLY VOLTAGES

VDD

VDDIO

Notes

1.71 1.8 3.45 V 1

1.71 1.8 3.45 V 1

SUPPLY CURRENTS

Normal Mode

Accelerometer Low Power Mode

Standby Mode

Full-Chip Sleep Mode

Specified Temperature Range

3-axis Gyroscope

3-Axis Accelerometer, 4kHz ODR

0.98 Hz update rate

31.25 Hz update rate

TEMPERATURE RANGE

Performance parameters are not applicable beyond Specified Temperature Range

3.2

450

7.27

18.65

1.6

6 mA

µA

µA

µA mA

µA

Table 3: D.C. Electrical Characteristics

Notes:


2. Accelerometer Low Power Mode supports the following output data rates (ODRs): 0.24, 0.49, 0.98,

1.95, 3.91, 7.81, 15.63, 31.25, 62.50, 125, 250, 500Hz. Supply current for any update rate can be calculated as: a. Supply Current in µA = 6.9 + Update Rate * 0.376

1

1

1,2

1,2

1

1

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3.3.2 A.C. Electrical Characteristics


A


Parameter Conditions MIN TYP MAX Units NOTES

Supply Ramp Time

SUPPLIES

Monotonic ramp. Ramp rate is 10% to 90% of the final value

0.1 100 ms

1

TEMPERATURE SENSOR

Operating Range

Room Temp Offset

Ambient

21°C

-40

Sensitivity Untrimmed

333.87

0

85 °C

LSB/°C

1

LSB

I

Supply Ramp Time (T

RAMP

Start-up time for register read/write

2

C ADDRESS

From power-up

AD0 = 0

AD0 = 1

Power-On RESET

RESET 20

1101000

1101001

DIGITAL INPUTS (FSYNC, AD0, SCLK, SDI, CS)

0.7*VDDIO

100 ms 1

V

IH

, High Level Input Voltage

V

IL

, Low Level Input Voltage

C

I

, Input Capacitance

V

0.3*VDDIO

DIGITAL OUTPUT (SDO, INT)

V

OH

, High Level Output Voltage

V

OL1

, LOW-Level Output Voltage

R

R

LOAD

LOAD

=1MΩ;

=1MΩ;

V

OL.INT1

, INT Low-Level Output Voltage

OPEN=1, 0.3mA sink

Output Leakage Current

Current

OPEN=1 t

INT

, INT Pulse Width LATCH_INT_EN=0

0.9*VDDIO V

0.1

100 nA

I2C I/O (SCL, SDA)

V

V

IL

IH

, LOW Level Input Voltage

, HIGH-Level Input Voltage

0.5V

0.1*VDDIO V

V hys

, Hysteresis

V

OL


I

OL

, LOW-Level Output Current

3mA sink current

V

OL

=0.4V

V

OL

=0.6V

3

6 mA mA

Output Leakage Current t of

, Output Fall Time from V

IHmax

to V

ILmax

V

V

V

V

IL

IH

, LOW-Level Input Voltage

, HIGH-Level Input Voltage hys

OL1

, Hysteresis


C b

bus capacitance in pf

20+0.1C

b

250 ns

AUXILLIARY I/O (AUX_CL, AUX_DA)

VDDIO > 2V; 1mA sink current

0.7* VDDIO VDDIO +

0.5V

V

0.1* V

1

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I

Parameter

V

OL3

OL


, LOW-Level Output Current

Output Leakage Current t of

, Output Fall Time from V

IHmax

Sample Rate

to V

ILmax

Clock Frequency Initial Tolerance

Frequency Variation over Temperature

Conditions

VDDIO < 2V; 1mA sink current

V

V

OL

OL

C b

= 0.4V

= 0.6V

bus capacitance in pF

MIN TYP MAX Units NOTES

3 mA

6 mA

100 nA

20+0.1C

b

250 ns

INTERNAL CLOCK SOURCE

Fchoice=0,1,2

SMPLRT_DIV=0

Fchoice=3;

DLPFCFG=0 or 7

SMPLRT_DIV=0

Fchoice=3;

DLPFCFG=1,2,3,4,5,6;

SMPLRT_DIV=0

CLK_SEL=0, 6; 25°C

CLK_SEL=1,2,3,4,5; 25°C

CLK_SEL=0,6

CLK_SEL=1,2,3,4,5

Table 4: A.C. Electrical Characteristics

Notes:



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3.3.3 Other Electrical Specifications


A


PARAMETER CONDITIONS MIN TYP MAX Units Notes

SERIAL INTERFACE

SPI Operating Frequency, All

Registers Read/Write

SPI Operating Frequency, Sensor and Interrupt Registers Read Only

I

2

C Operating Frequency

Low Speed Characterization

High Speed Characterization

All registers, Fast-mode

All registers, Standard-mode

100

±10%

kHz 1

1 ±10% MHz 1

20 ±10% MHz 1

400

100 kHz kHz

1

1

Table 5: Other Electrical Specifications

Notes:


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3.4 I2C Timing Characterization


A


Parameters

I

2

C TIMING

f

SCL

, SCL Clock Frequency t

HD.STA

Time

, (Repeated) START Condition Hold t

LOW

, SCL Low Period t

HIGH

, SCL High Period t

SU.STA

Time

, Repeated START Condition Setup t

HD.DAT

, SDA Data Hold Time t

SU.DAT

, SDA Data Setup Time t r

, SDA and SCL Rise Time t f

, SDA and SCL Fall Time t

SU.STO

, STOP Condition Setup Time t

BUF

, Bus Free Time Between STOP and

START Condition

C b

, Capacitive Load for each Bus Line t

VD.DAT

, Data Valid Time t

VD.ACK

, Data Valid Acknowledge Time

Conditions

I

2

C FAST-MODE

C b

bus cap. from 10 to 400pF

C b

bus cap. from 10 to 400pF

Min

1.3

0.6

Table 6: I

2

C Timing Characteristics

Typical Notes

1

2

0

100

µs ns

2

2

20+0.1C

b

300 ns 2

20+0.1C

b

300 ns 2

0.6 µs 2

< 400

Max

400

0.9

0.9

Units

kHz

µs

µs pF

µs

µs

2

2

2

2

2

Notes:

1. Timing Characteristics apply to both Primary and Auxiliary I2C Bus

2. Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets

Figure 1: I2C Bus Timing Diagram

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3.5 SPI Timing Characterization


A


Parameters

SPI TIMING

f

SCLK

, SCLK Clock Frequency t

LOW

, SCLK Low Period t

HIGH

, SCLK High Period t

SU.CS

, CS Setup Time t

HD.CS

, CS Hold Time t

SU.SDI

, SDI Setup Time t

HD.SDI

, SDI Hold Time t

VD.SDO

, SDO Valid Time t

HD.SDO

, SDO Hold Time t

DIS.SDO

, SDO Output Disable Time

Conditions

C load

= 20pF

C load

= 20pF

Min

400

400

8

500

11

7

4

Typical Max Units

Notes

1 MHz 1 ns 1 ns 1 ns ns ns ns ns 100 ns 1

50 ns 1

1

1

1

1

1

Table 7: SPI Timing Characteristics

Notes:


3.5.1 fSCLK = 20MHz

Parameters

SPI TIMING

f

SCLK

, SCLK Clock Frequency t

LOW

, SCLK Low Period t

HIGH

, SCLK High Period t

SU.CS

, CS Setup Time t

HD.CS

, CS Hold Time

Figure 2: SPI Bus Timing Diagram

Conditions Min

0.9

-

-

1

1

Typical Max

20

-

-

Units

MHz ns ns ns ns

Notes

1

1

1

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SU.SDI

, SDI Setup Time t

HD.SDI

, SDI Hold Time t

VD.SDO

, SDO Valid Time t

DIS.SDO

, SDO Output Disable Time

C load

= 20pF

0

1

25

25 ns ns ns ns

1

1

1

1

Table 8: fCLK = 20MHz

Notes:


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3.6 Absolute Maximum Ratings

Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device.

These are stress ratings only and functional operation of the device at these conditions is not implied.

Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability.

Parameter

Supply Voltage, VDD

Supply Voltage, VDDIO

REGOUT

Input Voltage Level (AUX_DA, AD0, FSYNC, INT, SCL, SDA)

Acceleration (Any Axis, unpowered)

Operating Temperature Range

Storage Temperature Range

Electrostatic Discharge (ESD) Protection

Latch-up

Rating

-0.5V to +4V

-0.5V to +4V

-0.5V to 2V

-0.5V to VDD + 0.5V

10,000g for 0.2ms

-40°C to +105°C

-40°C to +125°C

2kV (HBM);

250V (MM)

JEDEC Class II (2),125°C, ±100mA

Table 9: Absolute Maximum Ratings

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4.1 Pin Out Diagram and Signal Description

Pin Number

7

8

9

10

11

Pin Name

AUX_CL

VDDIO

AD0 / SDO

REGOUT

FSYNC

12

13

18

19

20

21

22

23

24

1 – 6, 14 - 17

INT

VDD

GND

RESV

RESV

AUX_DA nCS

SCL / SCLK

SDA / SDI

NC

Pin Description

I

2

C master serial clock, for connecting to external sensors

Digital I/O supply voltage

I

2

C slave address LSB (AD0); SPI serial data output (SDO)

Regulator filter capacitor connection

Frame synchronization digital input. Connect to GND if unused.

Interrupt digital output (totem pole or open-drain)

Note: The Interrupt line should be connected to a pin on the

Application Processor (AP) that can bring the AP out of suspend mode.

Power supply voltage and digital I/O supply voltage

Power supply ground

Reserved. Do not connect.

Reserved. Connect to GND.

I

2

C master serial data, for connecting to external sensors

Chip select (SPI mode only)

I

2

C serial clock (SCL); SPI serial clock (SCLK)

I

2

C serial data (SDA); SPI serial data input (SDI)

No connect pins. Do not connect.

Table 10: Signal Descriptions

NC

NC

NC

NC

NC

NC

4

5

6

1

2

3

MPU-6555

18

GND

17

NC

16

NC

15

NC

14

NC

13 VDD

Figure 3: Pin out Diagram for MPU-6555 3.0x3.0x0.9mm QFN

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4.2 Typical Operating Circuit


SCL

SDA

VDDIO nCS

SCLK

SDI


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NC

NC

NC

NC

NC

NC

1

2

3

4

5

6

MPU-6555

18

GND

17

16

NC

NC

15 NC

14

13

NC

VDD

1.8 – 3.3VDC

C2, 0.1

F

NC

NC

NC

NC

NC

NC

1

2

3

4

5

6

MPU-6555

18

GND

17

16

NC

NC

15 NC

14

13

NC

VDD

1.8 – 3.3VDC

C2, 0.1 F

1.8 – 3.3VDC

1.8 – 3.3VDC

C3, 10 nF

C1, 0.1

F

C3, 10 nF

C1, 0.1

F

AD0

(a)

SD0

(b)

Figure 4: MPU-6555 QFN Application Schematic. (a) I2C operation, (b) SPI operation.

4.3 Bill of Materials for External Components

Component

Regulator Filter Capacitor

VDD Bypass Capacitor

VDDIO Bypass Capacitor

Label

C1

C2

C3

Specification

Ceramic, X7R, 0.1µF ±10%, 2V

Ceramic, X7R, 0.1µF ±10%, 4V

Ceramic, X7R, 10nF ±10%, 4V

Table 11: Bill of Materials

Quantity

1

1

1

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MPU-6555

Self test

Self test

Self test

Self test

Self test

Self test

X Accel

Y Accel

Z Accel

X Gyro

Y Gyro

Z Gyro

ADC

ADC

ADC

ADC

ADC

ADC

Interrupt

Status

Register

FIFO

User & Config

Registers

Sensor

Registers

Slave I2C and

SPI Serial

Interface

Master I 2C

Serial

Interface

Serial

Interface

Bypass

Mux

Digital Motion

Processor

(DMP)

INT nCS

AD0 / SDO

SCL / SCLK

SDA / SDI

AUX_CL

AUX_DA

FSYNC

Temp Sensor ADC

Bias & LDOs

Charge

Pump

VDD GND REGOUT

Figure 5: MPU-6555 Block Diagram

Note: The Interrupt line should be connected to a pin on the Application Processor (AP) that can bring the AP out of suspend mode.

4.5 Overview

The MPU-6555 is comprised of the following key blocks and functions:

 Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning

 Three-axis MEMS accelerometer sensor with 16-bit ADCs and signal conditioning

 Digital Motion Processor (DMP) engine

I

 Auxiliary

 Self-Test

 Clocking

 Sensor Data Registers

 FIFO

 Interrupts

 Digital-Output Temperature Sensor

 Bias and LDOs

Pump

 Standard Power Modes

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4.6 Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning

The MPU-6555 consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about the X-, Y-, and Z- Axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes a vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filtered to produce a voltage that is proportional to the angular rate. This voltage is digitized using individual on-chip

16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensors may be digitally programmed to ±250, ±500, ±1000, or ±2000 degrees per second (dps). The ADC sample rate is programmable from 8,000 samples per second, down to 3.9 samples per second, and user-selectable low-pass filters enable a wide range of cut-off frequencies.

4.7 Three-Axis MEMS Accelerometer with 16-bit ADCs and Signal Conditioning

The MPU-6555’s 3-Axis accelerometer uses separate proof masses for each axis. Acceleration along a particular axis induces displacement on the corresponding proof mass, and capacitive sensors detect the displacement differentially. The MPU-6555’s architecture reduces the accelerometers’ susceptibility to fabrication variations as well as to thermal drift. When the device is placed on a flat surface, it will measure

0g on the X- and Y-axes and +1g on the Z-axis. The accelerometers’ scale factor is calibrated at the factory and is nominally independent of supply voltage. Each sensor has a dedicated sigma-delta ADC for providing digital outputs. The full scale range of the digital output can be adjusted to ±2g, ±4g, ±8g, or ±16g.

4.8 Digital Motion Processor

The embedded Digital Motion Processor (DMP) within the MPU-6555 offloads computation of motion processing algorithms from the host processor. The DMP acquires data from accelerometers, gyroscopes, and additional 3 rd

party sensors such as magnetometers, and processes the data. The resulting data can be read from the FIFO. The DMP has access to one of the MPU’s external pins, which can be used for generating interrupts.

The purpose of the DMP is to offload both timing requirements and processing power from the host processor. Typically, motion processing algorithms should be run at a high rate, often around 200Hz, in order to provide accurate results with low latency. This is required even if the application updates at a much lower rate; for example, a low power user interface may update as slowly as 5Hz, but the motion processing should still run at 200Hz. The DMP can be used to minimize power, simplify timing, simplify the software architecture, and save valuable MIPS on the host processor for use in applications.

 The DMP is optimized for Android K support.

4.9 Primary I2C and SPI Serial Communications Interfaces

The MPU-6555 communicates to a system processor using either a SPI or an I

2

C serial interface. The MPU-

6555 always acts as a slave when communicating to the system processor. The LSB of the of the I

2

C slave address is set by pin 9 (AD0).

4.9.1 MPU-6555 Solution Using I2C Interface

I

In the figure below, the system processor is an I

2

2

C master to the MPU-6555. In addition, the MPU-6555 is an

C master to the optional external compass sensor. The MPU-6555 has limited capabilities as an I

The MPU-6555 has an interface bypass multiplexer, which connects the system processor I

2 and 24 (SCL and SDA) directly to the auxiliary sensor I

2

2

C bus pins 23

C bus pins 21 and 7 (AUX_DA and AUX_CL).

C

Master, and depends on the system processor to manage the initial configuration of any auxiliary sensors.

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Once the auxiliary sensors have been configured by the system processor, the interface bypass multiplexer should be disabled so that the MPU-6555 auxiliary I

2

C master can take control of the sensor I

2

C bus and gather data from the auxiliary sensors.

For further information regarding I

2

C master control, please refer to section 6.

Interrupt

Status

Register

INT

I

2

C Processor Bus: for reading all sensor data from MPU and for configuring external sensors (i.e. compass in this example )

MPU-6555

FIFO

User & Config

Registers

Sensor

Register

Factory

Calibration

Slave I

2

C or SPI

Serial

Interface

Sensor

Master I

2

C

Serial

Interface

Interface

Bypass

Mux

AD0

SCL

SDA/SDI

VDD or GND

Sensor I

2

C Bus: for configuring and reading from external sensors

AUX_CL

AUX_DA

Optional

SCL

SDA

Compass

SCL

SDA

System

Processor

Digital

Motion

Processor

(DMP)

Interface bypass mux allows direct configuration of compass by system processor

Bias & LDOs

VDD GND REGOUT

Figure 6: MPU-6555 Solution Using I

2

C Interface


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4.9.2 MPU-6555 Solution Using SPI Interface

In the figure below, the system processor is an SPI master to the MPU-6555. Pins 22, 9, 23, and 24 are used to support the CS, SDO, SCLK, and SDI signals for SPI communications. Because these SPI pins are shared with the I

2

C slave pins (9, 23 and 24), the system processor cannot access the auxiliary I

2

C bus through the interface bypass multiplexer, which connects the processor I

2 interface pins. Since the MPU-6555 has limited capabilities as an I

2

C interface pins to the sensor I

C Master, and depends on the system processor to manage the initial configuration of any auxiliary sensors, another method must be used for programming the sensors on the auxiliary sensor I

2

C bus pins 21 and 7 (AUX_DA and AUX_CL).

2

C

When using SPI communications between the MPU-6555 and the system processor, configuration of devices on the auxiliary I

2

C sensor bus can be achieved by using I transactions on any device and register on the auxiliary I

2

2 perform only single byte read and write transactions. Once the external sensors have been configured, the

MPU-6555 can perform single or multi-byte reads using the sensor I

2

C Slaves 0-4 to perform read and write

C bus. The I

2

C Slave 4 interface can be used to

C bus. The read results from the Slave

0-3 controllers can be written to the FIFO buffer as well as to the external sensor registers.

For further information regarding the control of the MPU-6555’s auxiliary I

2

MPU-6555 Register Map and Register Descriptions document.

C interface, please refer to the

Processor SPI Bus: for reading all data from MPU and for configuring

MPU and external sensors

Interrupt

Status

Register

INT

MPU-6555

FIFO

Config

Register

Sensor

Register

Slave I

2

C or SPI

Serial

Interface

Sensor

Master I

2

C

Serial

Interface

Interface

Bypass

Mux nCS

SDO

SCLK

SDI

AUX_CL

AUX_DA

Sensor I

2

C Bus: for configuring and reading data from external sensors

Optional

SCL

SDA

Compass nCS

SDI

SCLK

SDO

System

Processor

Factory

Calibration

Digital

Motion

Processor

(DMP)

I

2

C Master performs read and write transactions on

Sensor I

2

C bus.

Bias & LDOs

VDD GND REGOUT

Figure 7: MPU-6555 Solution Using SPI Interface


4.10 Auxiliary I2C Serial Interface

The MPU-6555 has an auxiliary I

2

C bus for communicating to an off-chip 3-Axis digital output magnetometer or other sensors. This bus has two operating modes:

 I

2

C Master Mode: The MPU-6555 acts as a master to any external sensors connected to the auxiliary I

2

C bus

Mode: The MPU-6555 directly connects the primary and auxiliary I allowing the system processor to directly communicate with any external sensors.

2

C buses together,

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Auxiliary I

2

C Bus Modes of Operation:

 I

2

C Master Mode: Allows the MPU-6555 to directly access the data registers of external digital sensors, such as a magnetometer. In this mode, the MPU-6555 directly obtains data from auxiliary sensors without intervention from the system applications processor.

For example, In I

2

C Master mode, the MPU-6555 can be configured to perform burst reads, returning the following data from a magnetometer:

 X magnetometer data (2 bytes)

 Y magnetometer data (2 bytes)

 Z magnetometer data (2 bytes)

The I

2

C Master can be configured to read up to 24 bytes from up to 4 auxiliary sensors. A fifth sensor can be configured to work single byte read/write mode.

 Pass-Through Mode: Allows an external system processor to act as master and directly communicate to the external sensors connected to the auxiliary I

2

AUX_CL). In this mode, the auxiliary I

2

C bus control logic (3

MPU-6555 is disabled, and the auxiliary I connected to the main I

2

2 rd

C bus pins (AUX_DA and

party sensor interface block) of the

C pins AUX_DA and AUX_CL (Pins 21 and 7) are

C bus (Pins 23 and 24) through analog switches internally.

Pass-Through mode is useful for configuring the external sensors, or for keeping the MPU-6555 in a low-power mode when only the external sensors are used. In this mode the system processor can still access MPU-6555 data through the I

2

C interface.

4.11 Self-Test

Please refer to the register map document for more details on self-test.

Self-test allows for the testing of the mechanical and electrical portions of the sensors. The self-test for each measurement axis can be activated by means of the gyroscope and accelerometer self-test registers

(registers 13 to 16).

When the self-test is activated, the electronics cause the sensors to be actuated and produce an output signal. The output signal is used to observe the self-test response.

The self-test response is defined as follows:

Self-test response = Sensor output with self-test enabled – Sensor output without self-test enabled

The self-test response for each gyroscope axis is defined in the gyroscope specification table, while that for each accelerometer axis is defined in the accelerometer specification table.

When the value of the self-test response is within the specified min/max limits of the product specification, the part has passed self-test. When the self-test response exceeds the min/max values, the part is deemed to have failed self-test. It is recommended to use InvenSense MotionApps software for executing self-test.

4.12 Clocking

The MPU-6555 has a flexible clocking scheme, allowing a variety of internal clock sources to be used for the internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and ADCs, the

DMP, and various control circuits and registers. An on-chip PLL provides flexibility in the allowable inputs for generating this clock.

Allowable internal sources for generating the internal clock are:

 An internal relaxation oscillator

 Any of the X, Y, or Z gyros (MEMS oscillators with a variation of ±1% over temperature)

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Selection of the source for generating the internal synchronous clock depends on the requirements for power consumption and clock accuracy. These requirements will most likely vary by mode of operation. For example, in one mode, where the biggest concern is power consumption, the user may wish to operate the

Digital Motion Processor of the MPU-6555 to process accelerometer data, while keeping the gyros off. In this case, the internal relaxation oscillator is a good clock choice. However, in another mode, where the gyros are active, selecting the gyros as the clock source provides for a more accurate clock source.

Clock accuracy is important, since timing errors directly affect the distance and angle calculations performed by the Digital Motion Processor (and by extension, by any processor).

There are also start-up conditions to consider. When the MPU-6555 first starts up, the device uses its internal clock until programmed to operate from another source. This allows the user, for example, to wait for the MEMS oscillators to stabilize before they are selected as the clock source.

4.13 Sensor Data Registers

The sensor data registers contain the latest gyro, accelerometer, auxiliary sensor, and temperature measurement data. They are read-only registers, and are accessed via the serial interface. Data from these registers may be read anytime.

4.14 FIFO

The MPU-6555 contains a 512-byte FIFO register that is accessible via the Serial Interface. The FIFO configuration register determines which data is written into the FIFO. Possible choices include gyro data, accelerometer data, temperature readings, auxiliary sensor readings, and FSYNC input. A FIFO counter keeps track of how many bytes of valid data are contained in the FIFO. The FIFO register supports burst reads. The interrupt function may be used to determine when new data is available.

For further information regarding the FIFO, please refer to the MPU-6555 Register Map and Register

Descriptions document.

4.15 Interrupts

Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include

I the INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that can trigger an interrupt are (1) Clock generator locked to new reference oscillator (used when switching clock sources); (2) new data is available to be read (from the FIFO and Data registers); (3) accelerometer event interrupts; and (4) the MPU-6555 did not receive an acknowledge from an auxiliary sensor on the secondary

2

C bus. The interrupt status can be read from the Interrupt Status register.

For further information regarding interrupts, please refer to the MPU-6555 Register Map and Register

Descriptions document.

4.16 Digital-Output Temperature Sensor

An on-chip temperature sensor and ADC are used to measure the MPU-6555 die temperature. The readings from the ADC can be read from the FIFO or the Sensor Data registers.

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4.17 Bias and LDOs

The bias and LDO section generates the internal supply and the reference voltages and currents required by the MPU-6555. Its two inputs are an unregulated VDD and a VDDIO logic reference supply voltage. The

LDO output is bypassed by a capacitor at REGOUT. For further details on the capacitor, please refer to the

Bill of Materials for External Components.

An on-chip charge pump generates the high voltage required for the MEMS oscillators.

4.19 Standard Power Modes

The following table lists the user-accessible power modes for MPU-6555.

4

5

6

2

3

Mode Name Gyro Accel

Off Off

DMP

Off

Standby Mode Drive On Off

Low-Power Accelerometer Mode Off Duty-Cycled

Off

Off

Low-Noise Accelerometer Mode Off

Gyroscope Mode On

6-Axis Mode On

On

Off

On

Off

On or Off

On or Off

Table 12: Standard Power Modes for MPU-6555

Notes:

1. Power consumption for individual modes can be found in section 3.3.1.

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The MPU-6555 has a programmable interrupt system which can generate an interrupt signal on the INT pin.

Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled individually.

Interrupt Name

Motion Detection

Module

Motion

FIFO Overflow FIFO

Data Ready Sensor Registers

I

2

C Master errors: Lost Arbitration, NACKs I

2

C Master

I

2

C Slave 4 I

2

C Master

Table 13: Table of Interrupt Sources

For information regarding the interrupt enable/disable registers and flag registers, please refer to the MPU-

6555 Register Map and Register Descriptions document. Some interrupt sources are explained below.

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The MPU-6555 provides motion detection capability. A qualifying motion sample is one where the high passed sample from any axis has an absolute value exceeding a user-programmable threshold. The following flowchart explains how to configure the Wake-on-Motion Interrupt. For further details on individual registers, please refer to the MPU-6555 Registers Map and Registers Description document.

Configuration Wake‐on‐Motion Interrupt using low power Accel mode

Make Sure Accel is running:

• In PWR_MGMT_1 (0x6B) make CYCLE =0, SLEEP = 0 and STANDBY = 0

• In PWR_MGMT_2 (0x6C) set DIS_XA, DIS_YA, DIS_ZA = 0 and DIS_XG, DIS_YG, DIS_ZG = 1



Set Accel LPF setting to 184 Hz Bandwidth:

• In ACCEL_CONFIG 2 (0x1D) set ACCEL_FCHOICE_B = 0 and A_DLPFCFG[2:0]=1(b001)

Enable Motion Interrupt:

• In INT_ENABLE (0x38), set the whole register to 0x40 to enable motion interrupt only.

Enable Accel Hardware Intelligence:

• In MOT_DETECT_CTRL (0x69), set ACCEL_INTEL_EN = 1 and ACCEL_INTEL_MODE = 1

Set Motion Threshold:

• In WOM_THR (0x1F), set the WOM_Threshold [7:0] to 1~255 LSBs (0~1020mg)

Set Frequency of Wake‐up:

• In LP_ACCEL_ODR (0x1E), set Lposc_clksel [3:0] = 0.24Hz ~ 500Hz

Enable Cycle Mode (Accel Low Power Mode):

• In PWR_MGMT_1 (0x6B) make CYCLE =1

Motion Interrupt Configuration Completed

Figure 8. Wake-on-Motion Interrupt Configuration

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6.1 I2C and SPI Serial Interfaces

The internal registers and memory of the MPU-6555 can be accessed using either I

2

1MHz. SPI operates in four-wire mode.

C at 400 kHz or SPI at

Pin Number Pin Name Pin Description

9 AD0 / SDO I

2

C slave address LSB (AD0); SPI serial data output (SDO)

22

23

24 nCS Chip select (SPI mode only)

SCL / SCLK I

2

C serial clock (SCL); SPI serial clock (SCLK)

SDA / SDI I

2

C serial data (SDA); SPI serial data input (SDI)

Table 14: Serial Interface

Note:

To prevent switching into I

2

C mode when using SPI, the I

2

C interface should be disabled by setting the

I2C_IF_DIS

configuration bit. Setting this bit should be performed immediately after waiting for the time specified by the “Start-Up Time for Register Read/Write” in Section 6.3.

For further information regarding the I2C_IF_DIS bit, please refer to the MPU-6555 Register Map and

Register Descriptions document.

I

2

C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the lines are open-drain and bi-directional. In a generalized I

2

C interface implementation, attached devices can be a master or a slave. The master device puts the slave address on the bus, and the slave device with the matching address acknowledges the master.

The MPU-6555 always operates as a slave device when communicating to the system processor, which thus acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is

400 kHz.

The slave address of the MPU-6555 is b110100X which is 7 bits long. The LSB bit of the 7 bit address is determined by the logic level on pin AD0. This allows two MPU-6555s to be connected to the same I low) and the address of the other should be b1101001 (pin AD0 is logic high).

2

C bus.

When used in this configuration, the address of the one of the devices should be b1101000 (pin AD0 is logic

6.3 I2C Communications Protocol

START (S) and STOP (P) Conditions

Communication on the I

2

C bus starts when the master puts the START condition (S) on the bus, which is defined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus is considered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to

HIGH transition on the SDA line while SCL is HIGH (see figure below).

Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.

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SDA

SCL

S P

START condition STOP condition

Figure 9: START and STOP Conditions

Data Format / Acknowledge

I

2

C data bytes are defined to be 8-bits long. There is no restriction to the number of bytes transmitted per data transfer. Each byte transferred must be followed by an acknowledge (ACK) signal. The clock for the acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse.

If a slave is busy and cannot transmit or receive another byte of data until some other task has been performed, it can hold SCL LOW, thus forcing the master into a wait state. Normal data transfer resumes when the slave is ready, and releases the clock line (refer to the following figure).

DATA OUTPUT BY

TRANSMITTER (SDA) not acknowledge

DATA OUTPUT BY

RECEIVER (SDA)

SCL FROM

MASTER

1 2

START condition

Figure 10: Acknowledge on the I

2

C Bus

acknowledge

8 9 clock pulse for acknowledgement

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Communications

After beginning communications with the START condition (S), the master sends a 7-bit slave address followed by an 8 th

bit, the read/write bit. The read/write bit indicates whether the master is receiving data from or is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge signal (ACK) from the slave device. Each byte transferred must be followed by an acknowledge bit. To acknowledge, the slave device pulls the SDA line LOW and keeps it LOW for the high period of the SCL line.

Data transmission is always terminated by the master with a STOP condition (P), thus freeing the communications line. However, the master can generate a repeated START condition (Sr), and address another slave without first generating a STOP condition (P). A LOW to HIGH transition on the SDA line while

SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the exception of start and stop conditions.

SDA

SCL

1 – 7 8 9 1 – 7 8 9 1 – 7 8 9

S P

START condition

ADDRESS R/W ACK DATA ACK DATA ACK

STOP condition

Figure 11: Complete I

2

C Data Transfer

To write the internal MPU-6555 registers, the master transmits the start condition (S), followed by the I

2 address and the write bit (0). At the 9 th

C

clock cycle (when the clock is high), the MPU-6555 acknowledges the transfer. Then the master puts the register address (RA) on the bus. After the MPU-6555 acknowledges the reception of the register address, the master puts the register data onto the bus. This is followed by the ACK signal, and data transfer may be concluded by the stop condition (P). To write multiple bytes after the last

ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case, the

MPU-6555 automatically increments the register address and loads the data to the appropriate register. The following figures show single and two-byte write sequences.

Single-Byte Write Sequence

Slave ACK ACK ACK

Burst Write Sequence

Slave ACK ACK ACK ACK

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To read the internal MPU-6555 registers, the master sends a start condition, followed by the I

2

C address and a write bit, and then the register address that is going to be read. Upon receiving the ACK signal from the

MPU-6555, the master transmits a start signal followed by the slave address and read bit. As a result, the

MPU-6555 sends an ACK signal and the data. The communication ends with a not acknowledge (NACK) signal and a stop bit from master. The NACK condition is defined such that the SDA line remains high at the

9 th

clock cycle. The following figures show single and two-byte read sequences.

Single-Byte Read Sequence

Master S AD+W

Slave

RA S AD+R NACK P

Burst Read Sequence

Master S AD+W

Slave

RA S AD+R ACK

ACK DATA

NACK P

DATA

6.4 I

2

C Terms

Signal Description

S Start Condition: SDA goes from high to low while SCL is high

W

R

Write bit (0)

Read bit (1)

ACK Acknowledge: SDA line is low while the SCL line is high at the

9 th

clock cycle

NACK Not-Acknowledge: SDA line stays high at the 9 th

clock cycle

RA MPU-6555 internal register address

DATA Transmit or received data

P Stop condition: SDA going from low to high while SCL is high

Table 15: I

2

C Terms

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SPI is a 4-wire synchronous serial interface that uses two control lines and two data lines. The MPU-6555 always operates as a Slave device during standard Master-Slave SPI operation.

With respect to the Master, the Serial Clock output (SCLK), the Serial Data Output (SDO) and the Serial

Data Input (SDI) are shared among the Slave devices. Each SPI slave device requires its own Chip Select

(CS) line from the master.

CS goes low (active) at the start of transmission and goes back high (inactive) at the end. Only one CS line is active at a time, ensuring that only one slave is selected at any given time. The CS lines of the nonselected slave devices are held high, causing their SDO lines to remain in a high-impedance (high-z) state so that they do not interfere with any active devices.

SPI Operational Features

1. Data is delivered MSB first and LSB last

2. Data is latched on the rising edge of SCLK

3. Data should be transitioned on the falling edge of SCLK

4. The maximum frequency of SCLK is 1MHz

5. SPI read and write operations are completed in 16 or more clock cycles (two or more bytes). The first byte contains the SPI Address, and the following byte(s) contain(s) the SPI data. The first bit of the first byte contains the Read/Write bit and indicates the Read (1) or Write (0) operation.

The following 7 bits contain the Register Address. In cases of multiple-byte Read/Writes, data is two or more bytes:

SPI Address format

MSB LSB

R/W A6 A5 A4 A3 A2 A1 A0

SPI Data format

MSB LSB

D7 D6 D5 D4 D3 D2 D1 D0

6. Supports Single or Burst Read/Writes.

SPI Master

/CS1

/CS2

SCLK

SDI

SDO

/CS

SPI Slave 1

SCLK

SDI

SDO

/CS

SPI Slave 2

Figure 12 Typical SPI Master / Slave Configuration

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7 Serial Interface Considerations

7.1 MPU-6555 Supported Interfaces

The MPU-6555 supports I

2 auxiliary interface.

.

C communications on both its primary (microprocessor) serial interface and its

The MPU-6555’s I/O logic levels are set to be VDDIO.

The figure below depicts a sample circuit of MPU-6555 with a third party magnetometer attached to the auxiliary I

2

C bus. It shows the relevant logic levels and voltage connections.

Note: Actual configuration will depend on the auxiliary sensors used.

VDDIO

VDD

(0V ‐ VDDIO)

VDDIO

SYSTEM BUS

VDD_IO

System

Processor IO

(0V ‐ VDDIO)

FSYNC

VDD INT

(0V ‐ VDDIO)

SDA

SCL

(0V ‐ VDDIO)

(0V ‐ VDDIO)

VDDIO

VDDIO

(0V, VDDIO)

MPU‐6555

VDDIO

AD0

AUX_DA

AUX_CL

(0V ‐ VDDIO )

(0V ‐ VDDIO)

SDA

SCL

VDD_IO

3 rd

Party

Magnetometer

CS

INT 1

(0V, VDDIO)

(0V ‐ VDDIO)

(0V ‐ VDDIO)

INT 2

(0V, VDDIO)

SA0

Figure 13: I/O Levels and Connections


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8 Assembly

This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems

(MEMS) gyros packaged in Quad Flat No leads package (QFN) surface mount integrated circuits.

8.1 Orientation Axes

The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1 identifier (•) in the figure.

+Z

+Z

MP

U-6

555

+Y

+Y

+X +X

Figure 14: Orientation of Axes of Sensitivity and Polarity of Rotation

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8.2 Package

24 Lead QFN (3x3x0.9) mm NiPdAu Lead-frame finish


Revision: 1.0


SYMBOLS DESCRIPTION

Package thickness

e f (e-b)

K

L

R

R’

R’’ s h w y

A

A1 b c

D

D2

E

E2

Lead finger (pad) width

Lead frame (pad) height

Package width

Exposed pad width

Package length

Exposed pad length

Lead finger-finger (pad-pad) pitch

Lead-lead (Pad-Pad) space

Lead (pad) to Exposed Pad Space

Lead (pad) length

Lead (pad) corner radius

Corner lead (pad) outer radius

Corner lead (pad) inner radius

Corner lead-lead (pad-pad) spacing

Corner lead dimension

Corner lead dimension

h w

DIMENSIONS IN MILLIMETERS

MIN NOM MAX

0.85 0.90 0.95

0.15

---

2.90

1.65

2.90

1.49

---

0.15

---

0.25

0.075

0.10

0.10

---

0.20

0.20 REF

3.00

1.70

3.00

1.54

0.40

0.20

0.35 REF

0.30

REF

0.11

0.11

0.25 REF

0.22

0.12

0.25

---

0.35

---

0.12

0.12

---

0.25

---

3.10

1.75

3.10

1.59

---

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9 Part Number Package Marking

The part number package marking for MPU-6555 devices is summarized below:

Part Number Part Number Package Marking

MPU-6555 M65

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10 Reliability

10.1 Qualification Test Policy

InvenSense’s products complete a Qualification Test Plan before being released to production. The

Qualification Test Plan for the MPU-6555 followed the JESD47I Standards, “Stress-Test-Driven Qualification of Integrated Circuits,” with the individual tests described below.

10.2 Qualification Test Plan

Accelerated Life Tests

TEST Method/Condition Lot

Quantity

Sample /

Lot

Acc /

Reject

Criteria

(HTOL/LFR)

High Temperature Operating Life

(HAST)

Highly Accelerated Stress Test

(1)

(HTS)

High Temperature Storage Life

JEDEC JESD22-A108D, Dynamic, 3.63V biased,

Tj>125°C [read-points 168, 500, 1000 hours]

JEDEC JESD22-A118A

Condition A, 130°C, 85%RH, 33.3 psia. unbiased, [readpoint 96 hours]

JEDEC JESD22-A103D, Cond. A, 125°C Non-Bias Bake

[read-points 168, 500, 1000 hours]

3 77 (0/1)

TEST

Device Component Level Tests

Method/Condition

(ESD-HBM)

ESD-Human Body Model

ANSI/ESDA/JEDEC JS-001-2012, (2KV)

(ESD-MM)

ESD-Machine Model

(LU)

Latch Up

JEDEC JESD22-A115C, (250V)

JEDEC JESD-78D Class II (2), 125°C; ±100mA

(MS)

Mechanical Shock

(VIB)

Vibration

JEDEC JESD22-B104C, Mil-Std-883,

Method 2002.5, Cond. E, 10,000g’s, 0.2ms,

±X, Y, Z – 6 directions, 5 times/direction

JEDEC JESD22-B103B, Variable Frequency (random),

Cond. B, 5-500Hz,

X, Y, Z – 4 times/direction

(TC)

Temperature Cycling

(1)

JEDEC JESD22-A104D

Condition G [-40°C to +125°C],

Soak Mode 2 [5’], 1000 cycles

(1) Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F

Lot

Quantity

1

1

1

3

Sample /

Lot

3

Acc /

Reject

Criteria

(0/1)

3

6

5

(0/1)

(0/1)

(0/1)

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11 Reference

Please refer to “InvenSense MEMS Handling Application Note (AN-IVS-0002A-00)” for the following information:

 Manufacturing Recommendations o

Assembly Guidelines and Recommendations o

PCB Design Guidelines and Recommendations o

MEMS Handling Instructions o

Considerations o

Reflow o

Storage o

Package Marking Specification o

Tape & Reel Specification o

Reel & Pizza Box Label o

Packaging o

Representative Shipping Carton Label

 Compliance o

Environmental o

DRC o

Compliance Disclaimer

This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.

Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.

InvenSense® is a registered trademark of InvenSense, Inc. MPU

TM

, MPU-6555

TM

, Digital Motion Processor

™

, DMP

™

, Motion Processing

Unit™, MotionFusion™, MotionInterface™, MotionTracking™, and MotionApps™ are trademarks of InvenSense, Inc.

©2014 InvenSense, Inc. All rights reserved.

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InvenSense MPU-6555 Data Sheet

MPU-6555

Product Specification

Revision 1.0

TABLE OF CONTENTS

Table of Figures

Table of Tables

2 Features

7 Serial Interface Considerations

8 Assembly

9 Part Number Package Marking

10 Reliability

11 Reference

Related manuals

Table of contents

InvenSense MPU-6555 Data Sheet

MPU-6555

Product Specification

Revision 1.0

TABLE OF CONTENTS

Table of Figures

Table of Tables

2 Features

7 Serial Interface Considerations

8 Assembly

9 Part Number Package Marking

10 Reliability

11 Reference

Related manuals

InvenSense

MPU-6000 and MPU-6050

Table of contents