BOOSTXL-AUDIO Audio BoosterPack™ Plug-in

BOOSTXL-AUDIO Audio BoosterPack™ Plug-in

User's Guide

SLAU670A – March 2016 – Revised November 2016

BOOSTXL-AUDIO Audio BoosterPack™ Plug-in Module

When plugged into a LaunchPad™ development kit, the BOOSTXL-AUDIO Audio BoosterPack™ Plug-in

Module adds audio input functionality from a microphone and audio output through an onboard speaker.

Headphone input and output are also supported, and are automatically enabled when a plug is inserted into the BoosterPack module. This audio input/output stream lets developers experiment with the digital signal processing (DSP) and filtering capabilities of the microcontroller found on the attached LaunchPad development kit.

Figure 1. BOOSTXL-AUDIO BoosterPack Plug-in Module

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Contents

Getting Started

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3

Hardware

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Software Examples

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Additional Resources

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Schematics

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List of Figures

BOOSTXL-AUDIO BoosterPack Plug-in Module

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BOOSTXL-AUDIO Overview

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BoosterPack Pinout

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Record

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Playback

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Alternate Microphone Configuration

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TI Resource Explorer Cloud

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CCS Cloud

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Directing the Project →Import Function to the Demo Project

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When CCS Has Found the Project

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Software Examples in TI Resource Explorer

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Schematics

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List of Tables

DAC8311 Pinout

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Microphone Pinout

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Hardware Change Log

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Software Examples

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IDE Minimum Requirements for MSP-EXP430FR5994

Source File and Folders

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Source File and Folders

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Trademarks

LaunchPad, BoosterPack, Code Composer Studio are trademarks of Texas Instruments.

IAR Embedded Workbench, C-SPY are registered trademarks of IAR Systems.

All other trademarks are the property of their respective owners.

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1 Getting Started

Getting Started

1.1

Introduction

When plugged into a LaunchPad development kit, the BOOSTXL-AUDIO Audio BoosterPack Plug-in

Module adds audio input functionality from a microphone and audio output through an onboard speaker.

Headphone input and output are also supported, and are automatically enabled when a plug is inserted into the BoosterPack module. This audio input/output stream lets developers experiment with the digital signal processing (DSP) and filtering capabilities of the microcontroller found on the attached LaunchPad development kit.

There are various options, selectable by a jumper on the BoosterPack module, for connecting the speaker to the processor on the LaunchPad development kit: (1) output audio data over SPI to the SPI DAC provided on the Audio BoosterPack module; (2) directly connecting to the DAC of the MCU on the

LaunchPad kit (if available) or (3) use the PWM output of the LaunchPad kit together with a basic R/C filter on the BoosterPack module to create a simple low-cost analog audio signal.

1.2

Key Features

• TI DAC8311 14-bit digital-to-analog converter for high-quality audio output

• Onboard low-profile speaker

• Onboard microphone with front-end amplifier

• Volume control slider

• TI TS3A225E for autonomous headset type detection which supports 4-pin or 3-pin 3.5-mm audio jack headset

• 40-pin BoosterPack plug-in module standard for use with any LaunchPad development kit

1.3

What’s Included

1.3.1

Kit Contents

• 1 x BOOSTXL-AUDIO BoosterPack plug-in module

• 1 x Quick start guide

1.3.2

Software Examples

• MSP-EXP430FR5994 LaunchPad development kit + BOOSTXL-AUDIO demos (see

Section 3

)

– BOOSTXL-AUDIO_RecordPlayback_MSP430FR5994

– Signal Processing with LEA TI Design

1.4

Next Steps: Looking Into the Provided Code

After the EVM features have been explored, the fun can begin. It’s time to open an integrated development environment (IDE) and start looking at the code examples.

Section 3

describes the example projects available to make it easy to understand the provided software. For more information on where to find and download an IDE, see

Section 4

.

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Hardware

2 Hardware

Figure 2

shows an overview of the BoosterPack plug-in module hardware.

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Figure 2. BOOSTXL-AUDIO Overview

2.1

Hardware Features

2.1.1

BoosterPack Pinout

Figure 3

shows the pinout of this BoosterPack module.

Figure 3. BoosterPack Pinout

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Hardware

The audio signal processing BoosterPack kit adheres to the 40-pin LaunchPad and BoosterPack pinout standard. This standard was created to aid compatibility between LaunchPad development kit and

BoosterPack module tools across the TI ecosystem.

The 40-pin standard is compatible with the 20-pin standard that is used by other LaunchPad kits like the

MSP-EXP430G2 LaunchPad development kit. This allows for 40-pin BoosterPack modules to be used with 20-pin LaunchPad kits with some limited functionality.

The BOOSTXL-AUDIO supports BoosterPack module stacking with its male and female BoosterPack headers. See how many BoosterPack modules you can stack onto your LaunchPad development kit to add more functionality like wireless and battery power.

More information about compatibility can also be found at http://www.ti.com/launchpad .

2.1.2

Audio Output

There are three options to select how the audio output is generated: the onboard TI DAC8311 digital-toanalog converter (DAC), a built-in DAC on the LaunchPad development kit, or a PWM that generates audio out. Select an option by moving the J5 jumper.

2.1.2.1

TI DAC8311 14-Bit Digital-to-Analog Converter

The DAC8311 is a 14-bit low-power single-channel linear-voltage-output DAC. This DAC uses a 3-wire serial interface that operates at clock rates of up to 50 MHz and is compatible with standard SPI, QSPI,

Microwire, and digital signal processor (DSP) interfaces (see

Table 1 ). The reference designator for the

DAC8311 is U2. Move jumper J5 to the SPI DAC location to use the DAC8311 to generate the audio signal.

More information on the DAC8311 DAC can be found at http://www.ti.com/product/dac8311 .

Table 1. DAC8311 Pinout

BoosterPack Header Connection

J1.8

J1.9

J5.10

Pin Function

DAC8311 Sync

SPI SCLK

SPI MOSI

2.1.2.2

DAC Integrated on LaunchPad Development Kit

If the LaunchPad development kit that the user has selected has an integrated DAC that is pinned out to the BoosterPack headers (for example, the MSP-EXP430FR5994), this DAC can be used to generate audio for the BOOSTXL-AUDIO BoosterPack plug-in module. The DAC output pin is J3.30 for the output of the onboard DAC on the LaunchPad development kit. Move jumper J5 to the LP DAC location to use the onboard DAC of the LaunchPad development kit to generate the audio signal.

2.1.2.3

PWM Audio

A varying duty-cycle PWM can also generate audio. See Voice Band Audio Playback using a PWM DAC

TI-Design for more information. Move jumper J5 to the PWM location to configure the audio input when using a PWM to generate the audio signal. Two pins can be used to drive the PWM audio: J2.19 (default) and J4.39 (alternate). To configure the BoosterPack module to use the alternate PWM pin, move the 0-Ω resistor on R9 to R10.

2.1.3

TI TS3A225E Audio Jack Detection

The TS3A225E is an audio-headset switch device. This device detects the presence of a headset and an analog microphone and switches a system analog microphone pin between different connectors in an audio stereo jack. The microphone connection in a stereo connector can be swapped with the ground connection depending on manufacturer. When the TS3A225E detects a certain configuration, the device automatically connects the microphone line to the appropriate pin. The device also reports the presence of an analog microphone on an audio stereo jack. The reference designator for the TS3A225E is U1.

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Hardware

For more information on the TS3A225E autonomous audio switch with headset detection, see http://www.ti.com/product/TS3A225E .

www.ti.com

2.1.4

Microphone With Front-End Amplifier

The PUI POM-2242P-C33-R omnidirectional microphone utilizes a TI TLV2760 operational amplifier to boost the output of the microphone. The human ear can hear frequencies of 0 to 20 kHz, and the operating range of the microphone is 20 Hz to 20 kHz. The reference designator for the microphone is

MIC1, and the reference designator for the TLV2760 is U5. The microphone can also be powered on and off from GPIO pin J1.5 (default) or J4.31 (alternate) (see

Table 2

). To configure the microphone for its alternate pins, move the 0-Ω resistors on R1 and R4 to R3 and R5, respectively.

For more information on the microphone, see http://www.puiaudio.com/pdf/pom-2242p-c33-r.pdf

.

Table 2. Microphone Pinout

(1)

BoosterPack Header Connection

J1.6

Pin Function

Microphone Output

J1.5

J3.26

(1)

J4.31

(1)

Microphone Power

Alt Microphone Output

Alt Microphone Power

The alternate microphone output and power are required if also using the Sharp LCD BoosterPack plug-in module.

2.1.5

Onboard Loudspeaker

The onboard loudspeaker is a PUI ASE03008MR-LW150-R with reference designator S1. It is driven by an onboard audio amplifier, the TI TPA301, which has reference designator U4. The TPA301 is a bridgetied load (BTL) audio power amplifier developed for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA301 can deliver 250 mW of continuous power into a BTL

8-ohm load at less than 1% total harmonic distortion plus noise throughout voice-band frequencies. The

TPA301 also uses a GPIO for turning on and off the amplifier using software through pin J2.13 (default) or

J4.38 (alternate). To configure the amplifier on and off switch to use J4.38, move the 0-Ω resistor on R6 to

R8.

For more information on the loudspeaker, see http://www.puiaudio.com/pdf/ASE03008MR-LW150-R.pdf

.

2.2

Power

The board is designed to be powered by the attached LaunchPad development kit and requires 3.3 V.

2.3

Design Files

2.3.1

Hardware

See

Section 5

for the schematics. All design files including schematics, layout, bill of materials (BOM),

Gerber files, and documentation are available on the BOOSTXL-AUDIO Hardware Design Files on the download page .

2.3.2

Software

All design files including TI-TXT object-code firmware images, software example projects, and documentation are available in the software folder that is specific to each LaunchPad development kit. To determine which LaunchPad development kits feature BOOSTXL-AUDIO examples, visit the download page .

2.3.3

Quick Start Guide

See the

BOOSTXL-AUDIO BoosterPack Plug-in Module Quick Start Guide

for an overview of this

BoosterPack plug-in module and help getting started.

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2.4

Hardware Change Log

Table 3

lists the revision history of the BOOSTXL-AUDIO hardware releases.

PCB Revision

Rev 1.1

Rev 1.2

Table 3. Hardware Change Log

Description

Initial release

Added CE marking to silkscreen for compliance. No functional or layout change.

Hardware

3 Software Examples

Two software examples are included in the MSP-EXP430FR5994 Software Examples zip folder with the

MSP-EXP430FR5994 LaunchPad development kit for the Audio BoosterPack module (see

Table 4 ).

Demo Name

BOOSTXL-AUDIO_

RecordPlayback_MSP430FR5994 tidm-filtering-signalprocessing-lea

Table 4. Software Examples

LaunchPad and

BoosterPack Required

• MSP-EXP430FR5994

• BOOSTXL-AUDIO

• MSP-EXP40FR5994

• BOOSTXL-AUDIO

• 430BOOST-SHARP96

Description

Demonstrates how to record and playback audio from FRAM memory using DMA

Demonstrates the performance of the MSP

Low-Energy Accelerator (LEA) by performing FFT and FIR

More Details

Section 3.1

Section 3.2

To use any of the software examples with the LaunchPad development kit, you must have an integrated development environment (IDE) that supports the MSP430FR5994 device.

Table 5

lists the minimum IDE requirements.

Table 5. IDE Minimum Requirements for MSP-EXP430FR5994

Code Composer Studio™ IDE

CCS v6.1.3 or later

IAR Embedded Workbench ® IDE

IAR Embedded Workbench for Texas Instruments 430 6.40 or later

For more details on how to get started quickly and where to download the latest CCS or IAR, see

Section 4 .

3.1

BOOSTXL-AUDIO_RecordPlayback_MSP430FR5994

This section describes the functionality and structure of the BOOSTXL-

AUDIO_RecordPlayback_MSP430FR5994 demo that is included in the MSP-EXP430FR5994 Software

Examples download or is more easily accessible through MSPWare (see

Section 4.6

).

3.1.1

Source File Structure

The project is split into multiple files (see

Table 6

). This makes it easier to navigate and reuse parts of it for other projects.

Name

main.c

application/application.c

application/audio_collect.c

application/audio_playback.c

application/dac8311.c

application/global.h

Table 6. Source File and Folders

Description

The demo’s clock, GPIO, DAC and interrupt configurations.

Main application loop and interrupt service routines

Setup, start, stop and shutdown audio collect functions

Setup, start and stop playback functions and interrupt service routines

Operating modes or functions of the onboard SPI DAC

Global variables definitions

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Software Examples

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Library: driverlib

Name

Table 6. Source File and Folders (continued)

Description

MSP Driver Library

3.1.2

Operation

This demo uses the built-in ADC12 on the MSP430FR5994 to sample from the output of the analog microphone on the Audio BoosterPack module. Using direct memory access (DMA), the 12-bit microphone data is stored to and retrieved from FRAM memory. During playback, the microphone data is sent through SPI to the onboard DAC to drive the audio output of the onboard speaker or headphones.

To begin recording an audio sample, press switch S1 on the MSP-EXP430FR5994 LaunchPad development kit(see

Figure 4

). LED1 is on while audio is being recorded, and it turns off when the recording phase is complete. You can also use headphones with an inline microphone to record audio.

The BoosterPack module automatically detects the inline microphone when the headphones are plugged into the provided jack (J6) and records from it instead of the onboard microphone.

Figure 4. Record

To play the recorded audio sample, press switch S2 on the MSP-EXP430FR5994 LaunchPad development kit (see

Figure 5 ). LED2 turns on during playback and turns off when the playback phase is

complete. You can use headphones to listen to the audio playback by plugging headphones into the provided jack (J6).

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Software Examples

Figure 5. Playback

3.2

Filtering and Signal Processing With LEA TI Design

This section describes the functionality and structure of the tidm-filtering-signalprocessing-lea demo that is included in the MSP-EXP430FR5994 Software Examples download, or more easily accessible through

MSPWare (see

Section 4.6

).

3.2.1

Source File Structure

The project is split into multiple files (see

Table 7

). This makes it easier to navigate and reuse parts of it for other projects.

Name

main.c

application/application.c

application/audio_collect.c

application/audio_playback.c

application/dac8311.c

application/global.h

application/fir.c

application/FFT.c

application/FFT_430.asm

application/benchmark.c

application/fir_coefficient

Library: DSPLib

Library: grlib

Library: driverlib

Table 7. Source File and Folders

Description

The demo’s clock, GPIO, display and interrupt configurations.

Main application loop and interrupt service routines

Setup, start, stop and shutdown audio collect functions

Setup, start and stop playback functions and interrupt service routines

Operating modes/functions of the onboard SPI DAC

Global variables definitions

FIR filtering functions

Fast Fourier Transform filtering functions

MSP430™ Fast Fourier Transform filtering functions in assembly

Performance benchmark timer and interrupt service routines

FIR coefficient definitions

MSP430 DSP Library

MSP430 Graphics Library

MSP Driver Library

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Additional Resources

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3.2.2

Operation

This demo is a TI Design that highlights the signal processing capabilities and performance of the

MSP430FR5994 MCU and its integrated Low Energy Accelerator (LEA). This example also uses the

430BOOST-SHARP96 BoosterPack module to display the filtered output of the audio signal and act as a user interface. To use this code example, configure the Audio BoosterPack module to use its alternate microphone power and output pins by moving the 0-Ω resistors on R1 to R3 and R4 to R5 (see

Figure 6 ).

For more information on this example, visit the TI Design page at http://www.ti.com/tool/tidm-filteringsignalprocessing .

Figure 6. Alternate Microphone Configuration

4 Additional Resources

4.1

TI LaunchPad Development Kit Portal

More information about LaunchPad development kits, supported BoosterPack plug-in modules, and available resources can be found at:

• TI LaunchPad portal : information about all LaunchPad development kits from TI, for all microcontrollers

4.2

TI Cloud Development Tools

TI cloud-based software development tools provide instant access to MSPWare software content and a web-based IDE.

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Additional Resources

4.2.1

TI Resource Explorer Cloud

TI Resource Explorer Cloud (see

Figure 7 ) provides a web interface for browsing the examples, libraries,

and documentation that are found in the MSPWare software without having to download files to your local drive.

Go check out TI Resource Explorer Cloud now at https://dev.ti.com/ .

Figure 7. TI Resource Explorer Cloud

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Additional Resources

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4.2.2

Code Composer Studio Cloud IDE

Code Composer Studio Cloud (CCS Cloud) IDE (see

Figure 8

) is a web-based IDE that enables you to quickly create, edit, build, and debug applications for a LaunchPad development kit. No need to download and install large software packages, simply connect the LaunchPad development kit and begin. You can select from a large variety of examples in MSPWare software and Energia or develop your own application. CCS Cloud IDE supports debug features such as execution control, breakpoints and viewing variables.

A full comparison between CCS IDE Cloud and CCS Desktop is available here .

Go check out Code Composer Studio Cloud IDE now at https://dev.ti.com/ .

Figure 8. CCS Cloud

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Additional Resources

4.3

Code Composer Studio IDE

Code Composer Studio IDE Desktop is a professional integrated development environment that supports

TI's microcontroller and embedded processor portfolio. Code Composer Studio IDE comprises a suite of tools that are used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code editor, project build environment, debugger, profiler, and many other features.

Learn more about CCS and download it at http://www.ti.com/tool/ccstudio .

CCS IDE v6.1 or higher is required. When CCS has been launched, and a workspace directory chosen, use Project →Import Existing CCS Eclipse Project. Direct the wizard to the desired demo project directory that contains main.c (see

Figure 9 ).

Figure 9. Directing the Project →Import Function to the Demo Project

Selecting the \CCS subdirectory also works. The CCS-specific files are located there.

When you click OK, the CCS IDE should recognize the project and allow you to import it. The indication that CCS has found it is that the project appears in the box shown in

Figure 10 , and it has a checkmark to

the left of it.

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Additional Resources

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Figure 10. When CCS Has Found the Project

Sometimes the CCS IDE finds the project but does not show a checkmark. This might mean that the workspace already has a project by that name. Resolve this by renaming or deleting that project. Even if you do not see it in the CCS IDE workspace, be sure to check the workspace directory on the file system.

4.4

IAR Embedded Workbench for MSP430

IAR Embedded Workbench for MSP430 MCUs is another very powerful integrated development environment that allows you to develop and manage complete embedded application projects. It integrates the IAR C/C++ Compiler, IAR Assembler, IAR ILINK Linker, editor, project manager, command line build utility, and IAR C-SPY

®

Debugger.

Learn more about IAR Embedded Workbench for MSP430 and download it at http://supp.iar.com/Download/SW/?item=EW430-EVAL .

IAR 6.10 or higher is required. To open the demo in IAR, click File

→Open→Workspace…, and browse to the *.eww workspace file inside the \IAR subdirectory of the desired demo. All workspace information is contained within this file.

The subdirectory also has an *.ewp project file. This file can be opened into an existing workspace by clicking Project →Add-Existing-Project….

Although the software examples have all of the code required to run them, IAR users may download and install MSPWare software, which contains MSP430 MCU libraries and the TI Resource Explorer. By default, these are included in a Code Composer Studio installation.

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Additional Resources

4.5

Energia

Energia is a simple open-source community-driven code editor that is based on the Wiring and Arduino framework. Energia provides unmatched ease of use through very high-level APIs that can be used across hardware platforms. Energia is a light-weight IDE that does not have the full feature set of Code

Composer Studio IDE or IAR Embedded Workbench IDE. However, Energia is great for anyone who wants to get started very quickly or who does not have significant coding experience.

Learn more about Energia and download it at www.energia.nu

.

4.6

MSPWare Software and TI Resource Explorer

MSPWare software is a complete collection of libraries and tools. It includes a driver library (driverlib), graphics library (grlib), and many other software tools. MSPWare software is optionally included in a CCS installation or can be downloaded separately. IAR users must download it separately.

MSPWare software includes the TI Resource Explorer, for easily browsing tools. For example, all of the software examples are shown in the tree (see

Figure 11 ).

Figure 11. Software Examples in TI Resource Explorer

Inside TI Resource Explorer, these examples and many more can be found and easily imported into Code

Composer Studio IDE with one click.

4.7

The Community

4.7.1

TI E2E™ Online Community

Search the forums at http://e2e.ti.com

. If you cannot find an answer, post your question to the community.

4.7.2

Community at Large

Many online communities focus on the LaunchPad development kit and BoosterPack plug-in module ecosystem. One example is http://www.43oh.com

. You can find additional tools, resources, and support from these communities.

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Schematics

5 Schematics

Figure 12

shows the schematics. All hardware design files are included in the BOOSTXL-AUDIO Hardware Design Files .

www.ti.com

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Figure 12. Schematics

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Revision History

Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from March 25, 2016 to November 9, 2016

......................................................................................................

Page

• Changed all instances of "LEA_SC" to "LEA"

.........................................................................................

3

• Added Rev 1.2 to

Table 3 , Hardware Change Log

...................................................................................

7

• Changed

Figure 12

, Schematics

.......................................................................................................

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Clocks and Timers

Interface

Logic

Power Mgmt

Microcontrollers

RFID

OMAP Applications Processors

Wireless Connectivity www.ti.com/audio amplifier.ti.com

dataconverter.ti.com

www.dlp.com

dsp.ti.com

www.ti.com/clocks interface.ti.com

logic.ti.com

power.ti.com

microcontroller.ti.com

Applications

Automotive and Transportation

Communications and Telecom

Computers and Peripherals

Consumer Electronics

Energy and Lighting

Industrial

Medical

Security

Space, Avionics and Defense

Video and Imaging www.ti-rfid.com

www.ti.com/omap

TI E2E Community

www.ti.com/wirelessconnectivity www.ti.com/automotive www.ti.com/communications www.ti.com/computers www.ti.com/consumer-apps www.ti.com/energy www.ti.com/industrial www.ti.com/medical www.ti.com/security www.ti.com/space-avionics-defense www.ti.com/video e2e.ti.com

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