MEMS audio sensor omnidirectional digital microphone

MEMS audio sensor omnidirectional digital microphone

MP45DT02-M

MEMS audio sensor omnidirectional digital microphone

Datasheet - production data

Features

Single supply voltage

Low power consumption

120 dBSPL acoustic overload point

Omnidirectional sensitivity

PDM single-bit output with option for stereo configuration

HLGA metal package (SMD-compliant)

ECOPACK

®

, RoHS, and “Green” compliant

Applications

Mobile terminals

Laptop and notebook computers

Portable media players

VoIP

Speech recognition

A/V eLearning devices

Gaming and virtual reality input devices

Digital still and video cameras

Antitheft systems

Description

The MP45DT02-M is a compact, low-power, topport, omnidirectional, digital MEMS microphone.

The MP45DT02-M is built with a sensing element and an IC interface with stereo capability.

The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors.

The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.

The MP45DT02-M has an acoustic overload point of 120 dBSPL with a best on the market

61 dB signal-to-noise ratio and -26 dB sensitivity.

The MP45DT02-M is available in an SMDcompliant metal package and is guaranteed to operate over an extended temperature range from -30 °C to +85 °C.

The MP45DT02-M’s digital output and package size (1.25 mm thick) make this device the best solution for laptop and portable computing applications.

Order code

Table 1: Device summary

Temp. range [°C] Package Packing

MP45DT02TR-M -30 to +85

HLGA

4.72 x 3.76 6LD

Tape and reel

June 2016 DocID029435 Rev 1

This is information on a product in full production.

1/16

www.st.com

Contents

Contents

MP45DT02-M

1 Pin description ................................................................................ 5

2 Acoustic and electrical specifications ........................................... 6

2.1

2.2

2.3

Acoustic and electrical characteristics ............................................... 6

Timing characteristics ....................................................................... 7

Frequency response ......................................................................... 8

3 Sensing element .............................................................................. 9

4 Absolute maximum ratings ........................................................... 10

5 Functionality .................................................................................. 11

5.1

L/R channel selection ...................................................................... 11

6 Application recommendations ..................................................... 12

7 Package information ..................................................................... 13

7.1

7.2

Soldering information ...................................................................... 13

HLGA (4.72 x 3.76 mm) 6L (metal) package information ................ 14

8 Revision history ............................................................................ 15

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MP45DT02-M

List of tables

List of tables

Table 1: Device summary ........................................................................................................................... 1

Table 2: Pin description .............................................................................................................................. 5

Table 3: Acoustic and electrical characteristics .......................................................................................... 6

Table 4: Distortion specifications ................................................................................................................ 6

Table 5: Timing characteristics ................................................................................................................... 7

Table 6: Absolute maximum ratings ......................................................................................................... 10

Table 7: L/R channel selection ................................................................................................................. 11

Table 8: Recommended soldering profile limits ........................................................................................ 13

Table 9: Document revision history .......................................................................................................... 15

DocID029435 Rev 1 3/16

List of figures

List of figures

MP45DT02-M

Figure 1: Pin connections ........................................................................................................................... 5

Figure 2: Timing waveforms ....................................................................................................................... 7

Figure 3: Typical frequency response normalized at 1 kHz........................................................................ 8

Figure 4: MP45DT02-M electrical connections ......................................................................................... 12

Figure 5: MP45DT02-M electrical connections for stereo configuration ................................................... 12

Figure 6: Recommended soldering profile limits ...................................................................................... 13

Figure 7: HLGA (4.72 x 3.76 mm) 6-lead package outline and mechanical data ..................................... 14

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MP45DT02-M

1 Pin description

Figure 1: Pin connections

Vdd

6

DOUT

CLK

2

GND

LR

GND

Pin description

3

4

5

6

Pin n°

1

2

( B O T T O M V I E W )

Table 2: Pin description

Pin name

Function

GND 0 V supply

LR

Left/right channel selection;

MIC1 LR is connected to GND or Vdd and MIC2 LR is connected to Vdd or GND

(see

Figure 5: "MP45DT02-M electrical connections for stereo configuration"

GND 0 V supply

CLK Synchronization input clock

DOUT Left/right PDM data output

Vdd Power supply

DocID029435 Rev 1 5/16

Acoustic and electrical specifications

2

2.1

Acoustic and electrical specifications

MP45DT02-M

Acoustic and electrical characteristics

The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz,

T = 25 °C, unless otherwise noted.

Symbol

Table 3: Acoustic and electrical characteristics

Parameter Test condition Min.

Typ.

(1)

Max.

Vdd

Idd

IddPdn

Supply voltage

Current consumption in normal mode

Current consumption in

power-down mode

(2)

Scc Short-circuit current

AOP Acoustic overload point

So Sensitivity

SNR Signal-to-noise ratio

PSR Power supply rejection

No load on data line

A-weighted @1 kHz, 1 Pa

Guaranteed by

design

(3)

1.64

1

-29

1.8

0.65

20

120

-26

61

-70

3.6

10

-23

Clock

Input clock frequency

(4)

1 2.4 3.25

TWK

Wake-up time

(5)

Guaranteed by design

10

Unit

V mA

µA mA dBSPL dBFS dB dBFS

MHz ms

Top

V

IOL

V

IOH

Operating temperature range

Low level logic input/output voltage

High level logic input/output voltage

I out

= 1 mA

I out

= 1 mA

-30

-0.3

0.65xVdd

+85

0.35xVdd

Vdd+0.3

°C

V

V

Notes:

(1)

Typical specifications are not guaranteed.

(2)

Input clock in static mode.

(3)

Test signal: 217 Hz square wave, 100 mVpp on Vdd pin.

(4)

Duty cycle: min = 40% max = 60%.

(5)

Time from the first clock edge to valid output data.

Parameter

Table 4: Distortion specifications

Test condition

Distortion

Distortion

100 dBSPL (50 Hz - 4 kHz)

115 dBSPL (1 kHz)

Value

< 1% THD + N

< 5% THD + N

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MP45DT02-M

2.2 Timing characteristics

Parameter

Acoustic and electrical specifications

Table 5: Timing characteristics

Description Min Max Unit

f

CLK f

PD

T

CLK

T

R,EN

T

R,DIS

T

L,EN

T

L,DIS

Clock frequency for normal mode

Clock frequency for power-down mode

Clock period for normal mode

Data enabled on DATA line, L/R pin = 1

Data disabled on DATA line, L/R pin = 1

Data enabled on DATA line, L/R pin = 0

Data disabled on DATA line, L/R pin = 0

1

308

30

(1)

30

(1)

3.25

0.23

1000

16

(1)(2)

16

(1)(2)

Notes:

(1)

From design simulations

(2)

In order to measure the disable time, a 1 kΩ pull-down resistor must be added to the DOUT pin.

Figure 2: Timing waveforms

MHz

MHz ns ns ns ns ns

DocID029435 Rev 1 7/16

Acoustic and electrical specifications

2.3 Frequency response

Figure 3: Typical frequency response normalized at 1 kHz

MP45DT02-M

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MP45DT02-M

3

Sensing element

Sensing element

The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound pressure into the changes of coupled capacity between those two plates.

Omron Corporation supplies this element for STMicroelectronics.

DocID029435 Rev 1 9/16

Absolute maximum ratings

4 Absolute maximum ratings

MP45DT02-M

Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Symbol

Table 6: Absolute maximum ratings

Ratings Maximum value Unit

Vdd

Vin

T

STG

ESD

Supply voltage

Input voltage on any control pin

Storage temperature range

Electrostatic discharge protection

-0.3 to 6

-0.3 to Vdd +0.3

-40 to +125

2 (HBM)

V

V

°C kV

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MP45DT02-M

5

5.1

Functionality

Functionality

L/R channel selection

The L/R digital pad lets the user select the DOUT signal pattern as explained in

Table 7:

"L/R channel selection"

. The L/R pin must be connected to Vdd or GND.

L/R

Table 7: L/R channel selection

CLK low CLK high

GND

Vdd

Data valid

High impedence

High impedence

Data valid

DocID029435 Rev 1 11/16

Application recommendations

6 Application recommendations

Figure 4: MP45DT02-M electrical connections

10 µF

Vdd

10 0 nF

MP45DT02-M

L/R

2

1

3

5

4

6

Dout

C L K

Figure 5: MP45DT02-M electrical connections for stereo configuration

Vd d

1 0 µ F

10 0 n F

MIC 1

1

2

3

6

5

D out

4

MIC 2

1

Vd d

2

3

6

5

D out

4

CODEC

12/16

Power supply decoupling capacitors (100 nF ceramic, 10 µF ceramic) should be placed as near as possible to pin 6 of the device (common design practice).

The L/R pin must be connected to Vdd or GND (refer to

Table 7: "L/R channel selection"

).

DocID029435 Rev 1

MP45DT02-M

7

7.1

Package information

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK

®

packages, depending on their level of environmental compliance. ECOPACK

® specifications, grade definitions and product status are available at: www.st.com.

ECOPACK

®

is an ST trademark.

Soldering information

The HLGA (4.72 x 3.76 x 1.25) mm package is also compliant with the RoHS and “Green” standards and is qualified for soldering heat resistance according to JEDEC J-STD-020.

Landing pattern and soldering recommendations are available at www.st.com.

Figure 6: Recommended soldering profile limits

Table 8: Recommended soldering profile limits

Description Parameter

Average ramp rate

Preheat

Minimum temperature

Maximum temperature

Time (T

SMIN

to T

SMAX

)

Ramp-up rate

Time maintained above liquidus temperature

Liquidus temperature

Peak temperature

Time within 5 °C of actual peak temperature

Ramp-down rate

Time 25 °C (t25 °C) to peak temperature

T

L

to T

P

T

SMIN

T

SMAX t

S

T

SMAX

to T

L t

L

T

L

T

P

Pb free

3 °C/sec max

150 °C

200 °C

60 sec to 120 sec

60 sec to 150 sec

217 °C

260 °C max

20 sec to 40 sec

6 °C/sec max

8 minutes max

DocID029435 Rev 1 13/16

Package information

7.2

MP45DT02-M

HLGA (4.72 x 3.76 mm) 6L (metal) package information

Figure 7: HLGA (4.72 x 3.76 mm) 6-lead package outline and mechanical data

ITEM

L e n g t h [ L ]

W i d t h

H e i g h t

[ W ]

[ H ]

Dimensions are in millimeter unless othe rwise specified

General Tolerance is +/-0.15mm unless otherwise spe cified

OUTER DIMENSIONS

DIMENSION [mm ]

4 .

7 2

3 .

7 6

1 .

2 5

TOL ERANCE [mm ]

± 0 .

1

± 0 .

1

± 0 .

1

8499123_A

Note: The MEMS microphone metal cap can exhibit some level of variation in color when

the device is subjected to a thermal process.

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MP45DT02-M

8 Revision history

Date Revision

Table 9: Document revision history

Changes

13-Jun-2016 1 Initial release

Revision history

DocID029435 Rev 1 15/16

MP45DT02-M

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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

© 2016 STMicroelectronics – All rights reserved

16/16 DocID029435 Rev 1

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