null  User manual
EMBEDDED MEMORY and STORAGE SOLUTIONS
AUTOMOTIVE COMMUNICATIONs INDUSTRIAL NETWORKING SECURITY
Why choose Swissbit
Swissbit, the largest independent embedded memory and storage solutions
manufacturer in Europe, was created through a management buyout from
Siemens Semiconductor in 2001. With over 20 years of experience in the memory
and storage industry, Swissbit has become a world class leader in technology
supplying high quality, high reliability memory and storage solutions with all
established DRAM and Flash interfaces.
Overview of services Swissbit is offering its customers:
Products
Customization
Compliance With
-Complete line of DRAM modules and
NAND Flash Solid State Drives with
industry standard interfaces and
form factors
-Both leading edge technology and
legacy product offerings
-Extended and industrial temperature
grade products
-Chip-On-Board (COB) and Systemin-Package technology
-Small form factor removable NAND
Flash cards
-Memory in-Package solutions
-Mobile Security Solutions, like
Secure microSD, SD and more
-Security firmware, drivers and SDK
-Custom memory and storage
solutions
-Security features
-Individual marking
- Conformal coating
-JEDEC, SDA, CFA, USB-IF, SATA-IO
-RoHS, REACH, and WEEE
-UL
-FCC, CE
Sales Service and
Engineering Support
-Fast, effective, and competent sales
staff on hand to serve your needs
-Our expert technical staff is available for quick response
-Joint product qualification service
-In-house manufacturing in Germany
-Design-in support
2
Quality Standards
OEM Services
-Controlled bill of materials (BOM)
-Serialization and lot code tracking
-Support of long life cycles
-Stringent PCN and ECN process
Test for Reliability
-Final extended and industrial
temperature testing with KTI and
Tanisys Technology equipment
-World class Swissbit application testing
-System Level Test During Burn-In
(TDBI)
-Environmental testing according to
industrial and automotive standards
-ISO 9001:2008
-TS 16949
-ISO 14001
Associations
-JEDEC
-CompactFlash Association (CFA)
-SATA-IO
-USB Implementer Forum
-Secure Digital Association (SDA)
-Memory Implementers Forum
-Small Form Factor Special Interest
Group SFF-SIG
INTRODUCTION
Swissbit Target Applications........ 4
Swissbit Product Features........... 6
Swissbit’s Unique 360°
Customer Service....................... 8
Storage Solutions
Flash Storage Solutions.............. 9
2.5“ PATA & SATA SSDs............... 10
SATA SSD Modules..................... 12
SATA SSD Modules SLC................. 13
SATA SSD Modules MLC................ 15
Flash Life Time Prediction........... 14
CFast™ cards.......................... 16
CompactFlash™ cards............... 18
MicroSD memory cards............... 20
SD memory cards..................... 22
USB Flash Drives / Modules.......... 24
SECURITY SOLUTIONS
Security Products..................... 26
Security microSD card............... 28
Memory Solutions
Unbuffered DIMMs...................
SODIMMs...............................
XRDIMMs...............................
Mini / Micro DIMMs...................
Module Options.......................
Mini RDIMMs..........................
SORDIMMs..............................
Registered DIMMs....................
33
33
33
33
34
35
35
35
TECHNOLOGY
System-in-Package (SiP)............ 36
Part Number Decoders
Storage and Security
Part Numbers......................... 38
Memory Solutions
Part Numbers......................... 39
Global Presence...................... 40
3
SWISSBIT TARGET APPLICATIONS
Industry
Typical applications:
Industrial Automation
• Process- / motion control
• Industrial PC / embedded
• industrial measurement
• Building technology
• Identification / access systems
•Surveillance
Infotainment
• POS terminals
• Information terminals
• Ticket- / vending terminals
• Digital signage and advertising
• Casino gaming
• VLTs & lottery terminals
Energy
• Energy distribution
• Energy consumption
• Smart grid
Healthcare
•Diagnostics
• Point of care testing
• Mobil systems
•Imaging
Transportation
• Train Control and Monitoring
Systems (TCMS)
• Multifunctional terminals
• Data recorders
Aerospace and defense
• In-flight Entertainment &
Communication (IFE&C)
• Communications, Command,
Control and Intelligence (C4ISR)
• Combat management systems
• Battlefield sensor systems
Memory and non-volatile storage solutions for embedded applications must
provide reliable operation even in the most extreme conditions (e.g., temperature, shock, and vibration). As such, both the qualification cycle and
the support life cycle needed for these products far exceed those of devices
designed for typical consumer applications.
Swissbit‘s embedded memory and storage solutions are the perfect fit for
such demanding applications. They offer the highest reliability and quality
with long availability and controlled BOM. To guarantee such high quality
standards, each product undergoes thorough functional testing before being
released for shipment.
Automotive
Typical applications:
•
•
•
•
Entertainment systems
Navigation systems
Head unit / dashboard
Black box / crash recorder
The increasing varieties of infotainment and dashboard applications in our
cars today require significantly higher storage capacities than before. All
components used in automotive applications need to operate within a wide
temperature range and withstand sudden power loss as well as shock and
vibration. Additionally, very low failure rates are essential, because replacements
of malfunctioning parts can incur high costs.
Swissbit is the only independent embedded memory and storage manufacturer
with TS16949. Our new S-45 SD and microSD memory card lineup caters to
the demands of an automotive application, offering the highest reliability
and quality at competitive prices.
4
NETWORKING / COMMUNICATION
Typical applications:
• ATCA Blade
• Cable modem
• Content and video delivery
• Digital Subscriber Line access
multiplexer
• Enterprise Media Gateway
• Switches and routers
• Optical network
• Radar / Sonar
• Radio network controller
•Security
• Tetra Base Station
• Wireless Base Station
Telecommunication infrastructure is implemented globally in every possible
climate zone; therefore the equipment has to operate under most severe weather
conditions such as heat, cold, humidity, or dust. This results in a long, expensive
qualification and testing process and the need for products that guarantee
long-term availability to minimize the number of requalifications.
Our cards provide features that are particularly suitable for NetCom applications,
where high reliability, longer duty cycles, and on-field firmware upgrade are
key requirements.
Swissbit‘s product portfolio is very much focused on products and form factors
that will dominate the NetCom sector in the near future, such as small form
factors like our newest SATA III devices including M.2, mSATA, and slimSATA.
Among our solutions, we have customized products able to guarantee a high
level of random performance meeting or exceeding most NetCom application
requirements.
Swissbit‘s embedded memory and storage solutions are tested specifically
for rough environmental conditions and guarantee industry leading reliability
standards. Long-term relationships with our suppliers allow us to guarantee
a fixed BOM along with the highest possible longevity.
SECURITY
Governments, enterprises, banks, and industry demand high-end security.
Swissbit‘s secure storage solutions offer smart modularization of algorithms
and secure storage of encryption keys in one runtime environment. Thus
solution providers can concentrate fully on system design while the computation
of cryptographic operations is delegated to the trusted execution environment,
e.g., a smart card chip in the Flash memory device. The Swissbit Security
Interface supports all relevant mobile, portable, embedded, and PC platforms.
TARGET APPLICATIONS
5
SWISSBIT PRODUCT FEATURES
Wide Temperature Support
Swissbit‘s embedded memory and storage
solutions are designed and approved for reliable
operation over a wide temperature range. The
products are verified at temperature corners
and pre-stressed with a burn-in operating
functional test (Test During Burn In-TDBI).
ESD and EMI safe
The product designs are in line with the latest
regulations for electrostatic discharge and electromagnetic interference. Swissbit strives to exceed
these limits with our own in-house technology
and production capabilities, for example with
System-in-Package (SiP) competence.
Shock and Vibration
Robustness is one of our key specification
targets. The design, assembly, and use of
selected materials guarantee an extremely
solid design, which has been validated by
extensive testing.
Life Time Monitoring (LTM)
The Swissbit Life Time Monitoring feature
enables users to access the memory device’s
detailed Life Time Status and allows imminent
failure prediction thereby avoiding unexpected
data loss. This feature uses an extended
S.M.A.R.T. (Self-Monitoring, Analysis and
Reporting Technology) interface or vendor
specific commands to retrieve Flash product
information.
Zone Protection
The device allows the configuration of multiple
zones with either no protection, write protection,
or access protected settings. Each zone is secured
with a separate password. A Windows tool and
a programming library are available.
SECURE ERASE (SANITIZE / PURGE) / FAST ERASE
This feature uses an uninterruptable sequence of
data erase commands. Even a power-off can’t
stop the process, which will continue upon
restoration of power. The optional enhanced
feature allows the customer to sanitize the data
according to different standards like DoD, NSA,
IREC, etc. The purge algorithm can be started by a
software command or through a hardware pin.
6
SWISSBIT FEATURES
Conformal Coating
Swissbit offers a special protective coating on
selected products. This coating is a thin
polyurethane film, which protects against
aggressive environmental conditions such as
dust, moisture, or corrosive gas.
TEMPERATURE SENSOR
The sensor allows the host hardware or software
to monitor memory device temperature to
improve data reliability in the target application
environment.
HEAT SPREADER
Heat spreader for DRAM modules allow
temperature hot spots to be dissipated over
a larger surface area and improve the
module’s reliability.
POWER FAIL PROTECTION and
RECOVERY
Intelligent power fail protection and recovery
protects data from unexpected power loss.
During an unintentional shutdown, firmware
routines and an intelligent hardware architecture
ensure that no corruption of user or system
data will occur.
Wear Leveling
Sophisticated wear leveling and bad block
management ensure that Flash cells are sparingly
and equally used to prolong the device‘s life.
READ-ONLY OPTIMIZED
In many industrial applications, content is
written to the NAND Flash once and is only read
afterwards. For such cases, the firmware can be
optimized to guarantee the highest possible
data retention and less read disturb.
TRIM SUPPORT
The TRIM command allows the operating
system to inform the SSD about which blocks
of data are no longer considered in use and
can be wiped internally, which increases
system performance during subsequent write
accesses. With TRIM support, data scrap, which
would otherwise slow down future write
operations to the involved blocks, can be
deleted in advance.
LOW POWER CONSUMPTION
Electronic devices with lower power consumption
increase the value of the product, because they
decrease energy cost, prolong battery life, and
reduce heat generation in the device and hence
require less cooling.
Data Care Management
LONGEVITY
Various effects like data retention, read disturb
limits, or temperature can impact data reliability.
The latest generation of Swissbit products uses
special methods to maintain and refresh the
data for greater data integrity.
The longevity product lines use special components with a long-term supply commitment of
up to ten years. These products offer the lowest
TCO in demanding applications with high
requalification cost.
SECURITY FEATURES
TRUE HARDWARE RNG
SECURE VOICE
True random numbers are generated inside the
secure element. True randomness is the key
prerequisite for secure systems to prevent
brute force attacks.
Secure Voice calls are a requirement for confidential
communication. Swissbit Security products are
optimal for fast, encrypted, user friendly secure
voice solutions.
DIGITAL SIGNATURE AND
ELLIPTIC CURVE CRYPTOGRAPHY
VERFICATION
SUPPORT
Digital signatures are very popular and inevitable
to protect against data or code manipulation.
Elliptic curves are faster and more efficient than
RSA cryptography.
HARDWARE BASED DATA
Secure CD-ROM
ENCRYPTION
Hardware based security is key when it comes
to replaceability, simple workflows, and
trusted runtime environments.
The Flash memory can be partially or totally
switched to read-only. This function ensures
that e.g., important data can be modified only
after PIN authentication.
MOBILE BANKING AND ePURSE
Data Protection and Encryption
Swissbit Security products for mobile banking
and payment offer strong authentication and
offline security.
Various data protection modes ensure privacy of
stored data. The card offers a data safe function
with strong AES encryption and PIN access
protection.
DEVICE PROTECTION BY DUAL
K
H
KNOW + HAVE
FACTOR AUTHENTICATION
Secure Logging
The user needs to have the card and know
the PIN.
In large, hidden storage, any system event log,
tax data, consumption data, or audit trails can
be stored securely in write-once mode, queue
mode, or random access mode.
SWISSBIT FEATURES
7
SWISSBIT’S UNIQUE 360° CUSTOMER SERVICE
PRE-SALES
YOUR FUTURE WITH OUR SOLUTION
Swissbit’s experienced BDM and FAE teams in Europe, North America, and Asia support you in the selection and qualification
of the most suitable memory and storage solution for your applications.
Our services include
• TCO support,
• consulting (design / concept / technology),
• qualification cycle support & joint qualification,
• evaluation units,
•
•
•
•
hardware customization,
firmware customization,
midware customization for security products, and
consulting for your future product generations.
PRESALES
CUSTOMER
AFTERSALES
AFTERSALES
SALES
LOCAL SUPPORT — GLOBALLY
LOCAL SUPPORT — GLOBALLY
Our engagement stretches far beyond the delivery of our
products. Through sophisticated lifecycle management,
we can ensure maximum longevity and smooth transitions
in the event of product changes. And while we are proud
of our best-in-class quality, we are still prepared to
provide fast and solution-oriented RMA support at any time,
including 4D and 8D reports whenever required.
Our services include
• local high level engineering support,
• longevity of product lines - up to ten years,
• field support (including firmware upgrades),
• full product and service life support, and
• PCN process.
8
SALES
Customer Service
We understand the importance of providing local
support in your language and time zone. For that reason,
Swissbit has established sales offices in all major regions
plus a strong network of partners that reaches even
farther. Our experienced sales teams manage forecasting
and order fulfillment, if desired also through third-party
logistics or distribution networks.
Our services include
• Global Account and Key Account Management,
• highly sophisticated channel partners who can
support sampling within 24 hours,
• fast, reliable response time,
• highly reliable inventory management using an
integrated CRM/ERP/BI system for smart data
analysis and forecasting.
Swissbit‘s Embedded Storage Solutions
OEM‘s of various industries require a
variety of memory and storage solutions.
In contrast to typical consumer devices,
Swissbit‘s embedded memory and
storage solutions are designed for highest
reliability under extreme environmental
conditions. They come with a large
feature set tailored to the demands of
the industrial, automotive, and NetCom
markets and with our commitment to
long-term availability.
Swissbit‘s embedded memory and
storage solutions portfolio covers all
relevant interfaces and form factors
including SD and microSD memory
cards, CompactFlashTM and CFastTM
cards, 2.5“ PATA and SATA SSDs, SLIM
SATA and mSATA SSDs, M.2, USB Flash
Drives (UFD) and modules.
Our sophisticated Flash handling
algorithms optimize performance and
life of the Single Level Cell (SLC) and
Multi Level Cell (MLC) NAND Flash used
in our products.
SLC
Chip Capacity
Cost per Bit
Product development according to
stringent design rules and extensive
product qualification procedures
ensures the electrical and mechanical
robustness of Swissbit‘s embedded
storage solutions. All products are
offered in commercial (0°C to +70°C)
and industrial (-40°C to +85°C)
temperature ranges. Available Flash
handling features include diagnostic
information, built-in error correction,
bad block management, static and
dynamic wear leveling and power fail
protection. Our service team can offer
product life time calculations for special
use cases with specific workloads. The
diagnostic features we provide enable
our customers to access device state
information and schedule replacements
before the system stops working.
EM-MLC
MLC
TLC
++
+++
+++
++++
++++
+++
++
+
Reliability & Endurance
++++
+++
++
+
Industrial Temperature
++++
+++
+++
+
Write Performance
++++
++
+++
+
+
++
++
++++
Data Retention
++++
++
+++
+
Longevity
++++
+++
++
+
ECC Requirement
NAND Flash Technology
COMPARISON
++++ highest; +++ high; ++ medium; + low
FLASH STORAGE SOLUTIONS
2.5“ PATA & SATA SSDs
Swissbit offers various 2.5” SSDs with PATA and SATA interfaces.
Swissbit’s X-500 and X-55 SATA II SSDs are designed as a
rugged and extremely reliable storage solution for stable
operation in harsh environmental conditions such as wide
temperature range, shock, vibration, or humidity. They use
the most reliable SLC (X-500) or EM-MLC (X-55) NAND Flash
available on the market today and comprise a large number
of features. These features include various options for Secure
Erase, Purge, and Sanitize methods as well as detailed,
S.M.A.R.T. based Life Time Monitoring tools that allow the
user to have full control of mission critical data at any given
time. The BCH-ECC (error correction code) in combination with
an intelligent power fail protection mechanism guarantees
the highest possible data reliability. Special features such as
ATA-8, NCQ, and TRIM commands enable higher sequential
and random performance while providing the high level of
reliability required in industrial applications.
X-500 SSDs are the ideal solution for applications requiring the
highest level of endurance or maximum longevity.
The X-55 series were designed for industrial applications
with a balanced read / write workload and offer more than
ten times the endurance of SSDs using standard MLC.
The P-120 (PATA) and X-200 (SATA II) complement Swissbit’s
2.5” SSD product portfolio and are an ideal fit for low-to
medium-density applications. They are designed for longterm industrial use and support key requirements such as
long data retention, no compromise power fail safety, and
long product life cycles.
LOCKING / LATCHING
SATA CONNECTOR
Swissbit‘s X-500 and X-55 SSDs
are designed with a latching SATA
connector. Multiple notches
support the latching cables for
highest vibration and shock
resistance.
X-55
X-500
X-200
p-120
Industry Leading;
10
default implemented;
FLASH STORAGE SOLUTIONS
on request;
not available
Cross section
Series Name
2.5“ SATA
2.5“ SATA
2.5“ SATA
2.5“ PATA
SSD
SSD
SSD
SSD
X-55
X-500
X-200
P-120
Interface
Data Transfer Mode
SATA II - 3 Gbit/s
up to UDMA6 / PIO4/ MDMA2
15 + 7 pin Serial ATA with latch protection /
special feature connector
Connector
Outline Dimensions
Flash Type
IDE / PATA
up to UDMA4 / PIO4 / MDMA2
15 + 7 pin Serial ATA
ATA 44 pin, 2 mm pitch
100.2 x 69.85 x 9.3 mm
100.2 x 69.85 x 9 mm
EM-MLC
SLC
Density Range
30 GB - 480 GB
Data Retention
5 years @ life begin
3 months @ life end
Endurance
420 / 310 TBW
(60 GB, JESD219 Client /
Enterprise workload)
Operating Temperature
16 GB - 512 GB
4 GB - 8 GB
4 GB - 32 GB
10 years @ life begin
1 year @ life end
2700 / 370 TBW
(64 GB, JESD219 Client /
Enterprise workload)
100,000 P/E cycles
(Flash cell level)
Commercial: 0°C to +70°C
Industrial: -40°C to +85°C
Storage Temperature
-55°C to +95°C
-50°C to +100°C
Performance
Burst Rate (MB/s)
Sequential Read (MB/s)
Sequential Write (MB/s)
Random 4KB Read (IOPS)
Random 4KB Write (IOPS)
up to 300
up to 240
up to 160
up to 14,800
up to 3,200
up to 300
up to 240
up to 220
up to 14,500
up to 5,300
up to 300
up to 120
up to 95
up to 3,100
up to 25
up to 66
up to 45
up to 35
up to 3,840
up to 51
MTBF
≥ 2,000,000 hours
≥ 2,500,000 hours
Shock
MIL-STD810; 2,000 G, 0.4 ms; 50 G, 11 ms
1,500 G
MIL-STD810; 20 G, 10-2,000 Hz random
20 G
Vibration
Humidity
Voltage
Power Consumption
85 % RH 85°C, 1,000 hrs
5 V ± 10 %
3.3 V optional
Slumber 140 mA
max 700 mA
Idle 200 mA
5 V ± 10 %
PIO typ 55 mA
max 160 mA
Idle 5 mA
max 320 mA
Idle 140 mA
Proven Power Fail Safety
ATA security feature set
Enhanced Secure Erase, Purge and Sanitize features (MIL STD)
Features & Tools
NCQ, TRIM
Advanced Wear Leveling & Bad Block management
In-field firmware update
Proven Power Fail Safety
Security Features available
Wear Leveling & Bad Block management
SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring
SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring
Part Number
SFSAxxxxQvBJxss-t-dd-rrr-ccc
SFSAxxxxQvBRxss-t-dd-rrr-ccc
SFPAxxxxQvBOxss-t-dd-rrr-ccc
FLASH STORAGE SOLUTIONS
11
SATA SSD Modules
Swissbit’s mSATA (MO-300), SLIM SATA (MO-297), and the
new M.2 SSDs are ideal solutions for embedded applications
requiring solid state storage in smaller, removable form
factors. Our SATA SSD modules offer a long service life
combined with controlled BOM and a change notification
process. Each unit undergoes extensive testing over the
full temperature range before being released for
shipment.
The X-60 SATA III series is Swissbit’s solution for high
performance, cost sensitive, high capacity markets. The
SSD modules will be available as mSATA (X-60m), SLIM
SATA (X-60s), and M.2 (X-60m2). They were designed for
all industrial, NetCom, and automotive applications
requiring high data transfer rates up to 525 MB/s in
sequential access and 79,000 IOPS in 4 KB random
access. In addition, they offer a wide range of features
such as Swissbit’s proven Power Fail Safety, ATA security
feature set, Data Care Management tools, a Windows or
Linux tool and SDK for detailed S.M.A.R.T.-based Life
Time Monitoring, NCQ, TRIM, advanced wear leveling & bad
block management and in-field firmware update functionality.
The newly introduced SLC-based X-600 series are highly
reliable storage solutions with outstanding endurance
and are available with the same set of features as the
X-60 products. They are built using the most reliable SLC
Flash on the market and an industrial grade SATA III
controller and operate from -40°C to +85°C.
SATA 2.5“
SOLID STATE DRIVE
M.2 2280
M.2 2260
69.85 mm
22.00 mm
X-600m / X-60m
X-600s / X-60s
X-600m2 / X-60m2
X-200m
X-200s
12
default implemented;
FLASH STORAGE SOLUTIONS
on request;
not available
39 mm
36.40 mm
50.80 mm
54 mm
22.00 mm
Product size comparision
Industry Leading;
mSATA SSD
MO-300 full size
CFastTM card
60.00 mm
80.00 mm
100.20 mm
SLIM SATA SSD
MO-297
29.85 mm
42.80 mm
SLC BASED MODULES
MO-300
MO-297
M.2
MO-300
MO-297
Full Size
slim SATA
2242 / 2260 /
full size
slim SATA
X-200m
X-200s
2280
Series Name
X-600m
X-600s
Interface
Data Transfer Mode
X-600m2
SATA III - 6 Gbit/s
ATA8
SATA II - 3 Gbit/s
up to PIO4, MDMA2, UDMA6
Connector
52 pos. Edge Connector
PCI Express (PCIe) mini
15 + 7 pin Serial ATA
Connector
75 pos. Edge Connector
B & M key
52 pos. PCI Express
(PCIe) mini
15 + 7 pin Serial ATA
Connector
Outline Dimensions
50.8 x 29.85 x 3.3 mm
54 x 39 x 4 mm
22 x 42 / 60 / 80 x 3.6 mm
50.8 x 29.85 x 3.3 mm
54 x 39 x 4 mm
Flash Type
Density Range
SLC
8 GB - 120 GB
15 GB - 120 GB
2 GB - 64 GB
10 years @ life begin
1 year @ life end
Data Retention
max 9.8 TBW per GB drive capacity
(per JESD219)
Endurance
Operating Temperature
8 GB - 60 GB (2242)
8 GB - 120 GB (2260 / 2280)
100,000 P/E cycles
(Flash cell level)
Commercial: 0°C to +70°C
Industrial: -40°C to +85°C
Storage Temperature
-50°C to +100°C
Performance
up to 600
up to 520
up to 400
up to 75,000
up to 75,000
Burst Rate (MB/s)
Sequential Read (MB/s)
Sequential Write (MB/s)
Random 4KB Read (IOPS)
Random 4KB Write (IOPS)
up to 300
up to 120
up to 95
up to 3,100
up to 25
Voltage
3.3 V ± 5 %
5 V ± 10 %
3.3 V ± 5 %
3.3 V ± 5 %
5 V ± 10 %
Power Consumption
typ 450 mA
max 800mA
Idle 110 mA
typ 300 mA
max 550 mA
Idle 60 mA
typ 450 mA
max 800mA
Idle 110 mA
typ 300 mA
max 490 mA
Idle 180 mA
typ 260 mA
max 320 mA
Idle 140 mA
Features & Tools
Proven Power Fail Safety
Proven Power Fail Safety
NCQ, TRIM
Advanced Wear Leveling & Bad Block
management
Advanced Wear Leveling & Bad Block management
In-field firmware update
SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring
Part Number
SFSAxxxxUvAAxss-t-dd- SFSAxxxxVvAAxss-t-ddrrr-ccc
rrr-ccc
SBLTM Tool & SDK for S.M.A.R.T. based Life
Time Monitoring
SFSAxxxxMvAAxss-t-dd- SFSAxxxxUvBRxss-t-dd- SFSAxxxxVvBRxss-t-ddrrr-ccc
rrr-ccc
rrr-ccc
X-600 series: target specification
FLASH STORAGE SOLUTIONS
13
Flash life time prediction
The endurance of Flash based products is one of the most controversial aspects of this technology.
NAND Flash component suppliers specify the endurance of their products based on the number of allowed PE (program / erase) cycles before Flash cell degradation reaches a level exceeding the controller’s error correction capability. SLC
components allow 100,000 PE cycles per block while MLC is typically specified as 3,000 PE cycles.
This transparency of NAND component endurance is no longer provided for integrated Flash cards with controllers
and firmware. For each write that the host initiates, the Flash controller has to perform internal management steps
and may need to erase and write multiple blocks even at the smallest external write transfer size. The ratio between
internal write data volume and the external request size is called WAF (write amplification factor).
The WAF can vary between one (theoretical best case) and several hundred depending on card structure, Flash
components used, firmware architecture, and user-application write profile.
The WAF directly influences the IOPS rate but the endurance even more. With a WAF of 100, internal PE cycles are
100 times greater than expected from the external data rate, and the endurance limit is reached 100 times faster
than anticipated.
Customer application use cases have a huge impact on the WAF. For example data base applications can cause catastrophic
numbers of small writes to the disk that wear out the Flash in shortest time frame. In most cases, how the software‘s
access profile will translate into Flash writes can hardly be predicted.
Swissbit supports a realistic prediction of the WAF and the endurance of their SSDs and storage cards with help of the Swissbit
Life Time Monitoring Tool and statistical data stored into the Flash by the firmware. This tool can read out usage data such as
number of writes, number of erase cycles, the bad block statistic, the successful ECC correction, and much more.
The realistic predicted endurance can be calculated following this procedure:
• Dump the status of a Swissbit Flash product as initial state with help of the Swissbit Life Time Monitor.
• Run your real-life application for a defined period of time, e.g., seven days.
• Dump the product‘s status after finishing the test run.
Send the initial and final dump to the Swissbit FAE team which will happily provide you with the calculated life
expectancy of this card in your application.
If you have confidential applications where you don‘t want to disclose the results, Swissbit will instruct you how to
extrapolate the recorded number of PE cycles into the life expectancy.
The Swissbit Life Time Monitor can also be used to visualize the detailed S.M.A.R.T. status and history of Swissbit‘s
Flash products.
The Swissbit Life Time Monitor is available as stand-alone
executables for Windows or Linux, or as an API to be
integrated into the customer‘s software architecture.
Swissbit also offers to port the tool into an existing
embedded application.
The monitor can be run as a background process in
minimized mode in the system tray where it displays the
current device S.M.A.R.T. status and performs periodic
snapshots of the statistical values for a complete device
life history.
14
FLASH STORAGE SOLUTIONS
MLC BASED MODULES
Series Name
MO-300
MO-297
M.2
Full Size
slim SATA
2242 / 2260 / 2280
X-60m
X-60s
X-60m2
Interface
Data Transfer Mode
SATA III - 6 Gbit/s
ATA8
Connector
52 pos. Edge Connector
PCI Express (PCIe) mini
15 + 7 pin Serial ATA Connector
75 pos. Edge Connector
B & M key
Outline Dimensions
50.8 x 29.85 x 3.3 mm
54 x 39 x 4 mm
22 x 42 / 60 / 80 x 3.6 mm
Flash Type
MLC
Density Range
10 years @ life begin
1 year @ life end
Data Retention
max. 1.9 TBW per GB drive capacity
(per JESD219)
Endurance
Operating Temperature
30 GB - 240 GB (2242)
30 GB - 480 GB (2260 / 2280)
8 GB - 480 GB
Commercial: 0°C to +70°C
Industrial: -40°C to +85°C
Storage Temperature
-50°C to +95°C
Performance
up to 600
up to 525
up to 450
up to 75,000
up to 79,000
Burst Rate (MB/s)
Sequential Read (MB/s)
Sequential Write (MB/s)
Random 4KB Read (IOPS)
Random 4KB Write (IOPS)
Voltage
3.3 V ± 5 %
5 V ± 10 %
3.3 V ± 5 %
Power Consumption
typ 450 mA
max 800mA
Idle 110mA
typ 300mA
max 550mA
Idle 60mA
typ 450 mA
max 800mA
Idle 110mA
Proven Power Fail Safety
NCQ, TRIM
Features & Tools
Advanced Wear Leveling & Bad Block management
In-field firmware update
SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring
Part Number
SFSAxxxxUvAAxss-t-dd-rrr-ccc
SFSAxxxxVvAAxss-t-dd-rrr-ccc
SFSAxxxxMvAAxss-t-dd-rrr-ccc
X-60 series: target specification
FLASH STORAGE SOLUTIONS
15
CFast™ Cards
CFast™ cards combine two existing industry standards into a single product: the CompactFlash™ (CF) card
form factor and the Serial ATA (SATA) interface commonly used in hard disks. CFast™ cards can replace
both HDDs and CompactFlash™ cards in applications requiring small form factors, high endurance and
the ability to withstand shock, vibration, extreme temperatures (-40°C to +85°C), high altitude and rough
environmental conditions. Swissbit’s CFast™ cards provide rugged storage for embedded and industrial
systems where performance, data and system reliability, power fail protection and flexibility are important
design considerations.
Swissbit CFast™ cards operate with a 3.3 Volt low power source and support three SATA power management states: Active, Partial, and Slumber. This standard is a perfect choice for both boot devices and as
removable media for applications requiring low to medium storage densities with a small footprint.
Additionally, the Swissbit CFast™ cards come with full engineering and customization support, S.M.A.R.T.
based Life Time Monitoring features, our intelligent Flash Management algorithms and Error Correction,
guaranteeing the highest level of reliability even in rough application environments.
Swissbit’s latest innovations are the F-60 / F-600 SATA III CFast™ card series. Using state of the art controllers
and MLC / SLC Flash technology, the F-60 / F-600 achieve data transfer rates up to 525 MB/s in sequential
access and 70,000 IOPS in 4 KB random access. In addition, the F-60 / F-600 series feature Swissbit’s
proven Power Fail Safety, ATA security feature set, enhanced Secure Erase tools, a Windows or Linux tool
and SDK for detailed S.M.A.R.T.-based Life Time Monitoring, NCQ, TRIM, advanced wear leveling and bad
block management or in-field firmware update functionality.
F-600
F-60
F-240
Industry Leading;
16
default implemented;
FLASH STORAGE SOLUTIONS
on request;
not available
Series Name
CFastTM Card
CFastTM Card
CFastTM Card
F-600
F-60
F-240
Interface
Data Transfer Mode
CFast™ 2.0 - SATA III - 6 Gbit/s
ATA8
Connector
CFast™ Type I
Outline Dimensions
36.4 x 42.8 x 3.6 mm
Flash Type
SLC
MLC
Density Range
8 GB - 60 GB
16 GB - 240 GB
SLC
Data Retention
Endurance
CFast™ 1.0 - SATA II - 3 Gbit/s
ATA7
2 GB - 64 GB
10 years @ life begin
1 year @ life end
9.8 TBW per GB drive capacity
1.9 TBW per GB drive capacity
100,000 P/E cycles
(Flash cell level)
Commercial: 0°C to +70°C
Industrial: -40°C to +85°C
Operating Temperature
Storage Temperature
-50°C to +100°C
Performance
Burst Rate (MB/s)
Sequential Read (MB/s)
Sequential Write (MB/s)
Random 4KB Read (IOPS)
Random 4KB Write (IOPS)
up to 600
up to 520
up to 340
up to 70,000
up to 40,000
up to 600
up to 525
up to 340
up to 70,000
up to 40,000
up to 300
up to 130
up to 100
up to 3,300
up to 95
MTBF
≥ 2,500,000 hours
Shock
1,500 G
Vibration
20 G
Humidity
85 % RH 85°C, 1,000 hrs
Voltage
Power Consumption
3.3 V ± 5 %
typ max 450mA
650mA
typ max 450mA
650mA
typ 140 mA
max 250mA
55mA
Idle
PHYSLP <20mA
Proven Power Fail Safety
Sophisticated Wear Leveling &
Bad Block management
Proven Power Fail Safety
NCQ, TRIM
Features & Tools
Advanced Wear Leveling & Bad Block management
In-field firmware update
SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring
Read Disturb Management
TRIM
Low Power Consumption
Security & SBZoneProtection
features available
SBLTM Tool & SDK for S.M.A.R.T.
based Life Time Monitoring
Evaluation kit with 2.5” SATA
adapter board available
Part Number
SFCAxxxxHvAAxss-t-dd-rrr-ccc
SFCAxxxxHvAAxss-t-dd-rrr-ccc
SFCAxxxxHvBVxss-t-dd-rrr-ccc
F-600 series: target specification
FLASH STORAGE SOLUTIONS
17
CompactFlash™ Cards
To this day, CompactFlash™ (CF) cards are still the most popular Flash-based
storage solution used in the embedded and industrial markets and the
CompactFlash™ card form factor and connector are well established. Swissbit‘s
CF cards were developed with strong focus on quality, reliability, robustness,
and longevity. We select only high-quality components and apply design
rules fitting the stringent requirements of our customers. Hardware and firmware were tested and qualified by our experienced technical team and features
and functionality have been proven in many challenging customer applications.
Swissbit‘s CF Series C-3x0 and C-4x0 are offered in both commercial (0°C to
+70°C) and industrial (-40°C to +85°C) temperature ranges, providing rugged,
reliable memory for a wide range of demanding use cases. They are designed
to address a broad range of concerns from compatibility, booting, and power
fail safety to long-term supply, controlled BOM, and outstanding Flash protocolhandling techniques to ensure highest possible data integrity. In contrast to
commonly promoted sequential performance values, Swissbit is especially
focused on optimized random-access speed, one of the key requirements in
legacy embedded CompactFlash applications.
Swissbit’s most recent CF card product family is the C-300 Longevity series,
which offers maximum long-term availability (until at least 2021). In addition,
the C-300 Longevity CF card ensures optimized backward compatibility with
legacy systems, high random access speed, and a wide range of capacities from
32 MB to 8 GB using highly reliable SLC Flash with 100,000 program / erase cycles.
C-300
C-300
Longevity
C-320
C-440
Industry Leading;
18
default implemented;
FLASH STORAGE SOLUTIONS
on request;
not available
Longevity
Series Name
CompactFlash™
CompactFlash™
CompactFlash™
CompactFlash™
Card
Card
Card
Card
C-300
C-300 Longevity
C-320
C-440
Interface
Data Transfer Mode
CFC Type I
Outline Dimensions
36.4 x 42.8 x 3.3 mm
Flash Type
SLC
128 MB to 8 GB
32 MB to 8 GB
2 GB to 32 GB
2 GB to 64 GB
10 years @ life begin
1 year @ life end
Data Retention
100,000 P/E Cycles
(Flash Cell Level)
Endurance
Operating Temperature
CFA5.0
True IDE / PC card - Up to
UDMA6, MDMA4 & PIO6
CFA4.1
True IDE / PC card - Up to UDMA4, MDMA4 & PIO6
Connector
Density Range
UDMA6 CF
Commercial: 0°C to +70°C
Industrial:-40°C to +85°C
Storage Temperature
-50°C to +100°C
Performance
Burst Rate (MB/s)
Sequential Read (MB/s)
Sequential Write (MB/s)
Random 4KB Read (IOPS)
Random 4KB Write (IOPS)
up to 66
up to 37
up to 20
up to 3,300
up to 40
up to 66
up to 37
up to 20
up to 3,300
up to 50
up to 66
up to 45
up to 35
up to 2,800
up to 44
MTBF
≥ 3,000,000 hours
Shock
1,500 G
Vibration
20 G
Humidity
85 % RH 85°C, 1,000 hrs
3.3 V ± 5 %
5 V ± 10 %
Voltage
Power Consumption
up to 133
up to 65
up to 40
up to 2,400
up to 300 (with TRIM)
PIO typ 50 mA @ 3.3 V
DMA typ 70 mA @ 3.3 V
DMA typ 110 mA @ 5 V
PIO typ 60 mA @ 3.3 V
DMA typ 90 mA @ 3.3 V
DMA typ 130 mA @ 5 V
PIO typ 60 mA @ 3.3 V
DMA typ 80 mA @ 3.3 V
DMA typ 90 mA @ 5 V
Proven Power Fail Safety
Sophisticated Wear Leveling &
Proven Power Fail Safety
Features & Tools
Sophisticated Wear Leveling & Bad Block management
Security & SBZoneProtection features available
SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring
Bad Block management
Read Disturb Management
TRIM
Security & SBZoneProtection
features available
SBLTM Tool & SDK for S.M.A.R.T.
based Life Time Monitoring
Part Number
SFCFxxxxHxBKxss-t-xx-rrr-ccc
SFCFxxxxHxBKxss-t-xx-rrr-ccc
SFCFxxxxHxBOxss-t-dd-rrr-ccc
SFCFxxxxHvBUxss-t-dd-rrr-ccc
FLASH STORAGE SOLUTIONS
19
Flash Management
Mechanism
- Optimized error correction code
- Efficient algorithms for bad block
management
- Real life time monitoring
- Sophisticated wear leveling and
bad block management
- Power fail protection
microSD Memory Cards
Swissbit‘s Industrial microSD memory cards are designed, manufactured and tested to withstand
extreme environmental conditions.
Each of our product series is designed for a broad, embedded use case with its unique requirements
for longevity, service life, endurance, temperature, data retention, and cost. In addition to the
existing microSD memory card series, Swissbit has recently introduced the S-40u, which targets
read-centric applications requiring the highest level of data reliability for long periods of time. The
combination of MLC (multi level cell) NAND Flash with innovative controller and firmware technology
enables prolonged data retention and extended life cycles despite the write endurance limitations of
MLC Flash. The special firmware features in the S-40u include powerful built-in error correction, read
retry, autonomous data care management, life time monitoring and diagnostic features, randomizer,
wear leveling and bad block management algorithms, and intelligent power fail protection.
The new S-45u (MLC version) and S-450u (SLC version) series include the same set of sophisticated features
and, through the implementation of UHS-I, support data transfer rates of up to 80 MB/s.
All Swissbit microSD cards can withstand extreme environmental conditions. They provide the highest
level of mechanical stability and enhanced ESD protection. Furthermore, the hard gold SD connectors
endure a minimum of 20,000 insertion cycles.
S-300u
S-200u
S-40U / S-45U
S-450u
Industry Leading;
20
default implemented;
FLASH STORAGE SOLUTIONS
not available
microSD
microSD
microSD
microSD
microSD
Memory
Memory
MEMORY
MEMORY
MEMORY
Card
Card
CARD
CARD
CARD
(SD / SDHC)
(SD)
(SDHC)
(SDHC)
(SD / SDHC)
Series Name
S-300µ
S-200µ
S-40µ
S-45μ
S-450µ
Interface
Data Transfer Mode
SD 2.0, Class 6 / 10
SD 2.0, Class 6
SD 3.0, Class 6
Connector
microSD
Outline Dimensions
15 x 11 x 0.7 / 1 mm
Flash Type
Density Range
SLC
1 GB - 2 GB (SD)
4 GB - 8 GB (SDHC)
MLC
512 MB - 2 GB (SD)
SLC
512 MB - 2 GB (SD)
4 GB - 8 GB (SDHC)
4 GB - 32 GB (SDHC)
10 years @ life begin
1 year @ life end
Data Retention
100,000 P/E Cycles
(Flash Cell Level)
Endurance
3,000 P/E Cycles
(Flash Cell Level)
100,000 P/E Cycles
(Flash Cell Level)
Extended: -25°C to +85°C
Industrial: -40°C to +85°C
Operating Temperature
Storage Temperature
SD 3.0, Class 10, UHS-I
-40°C to +85°C
-40°C to +100°C
Performance
Burst Rate (MB/s) up to 25
Sequential Read (MB/s) up to 24
Sequential Write (MB/s) up to 22
up to 25
up to 21
up to 18
up to 25
up to 24
up to 14
up to 104
up to 50
up to 19
Optimized for random
write IOPS
MTBF
≥ 3,000,000 hours
Shock
1,500 G
Vibration
up to 104
up to 30
up to 24
50 G
Humidity
93 % RH 40°C, 500 hrs
Voltage
Power Consumption
Read typ
Write typ
85 % RH 85°C, 1,000 hrs
2.7 - 3.6 V Normal
50 mA
50 mA
Read typ
Write typ
30 mA
40 mA
Read typ
Write typ
40 mA
60 mA
Read typ 100 mA
Write typ 100 mA
Proven Power Fail Safety
Proven Power Fail Safety
Features & Tools
Sophisticated Wear
Leveling & Bad Block
Advanced Wear Leveling
Management
& Bad Block management
Diagnostic features
Proven Power Fail Safety
Sophisticated Wear Leveling & Bad Block management
Autonomous Data Care Management
SBLTM Tool & SDK for detailed Life Time Monitoring
Life Time Monitoring
Part Number
SFSDxxxxLvBWxss-t-ddrrr-ccc
SFSDxxxxNxBNxss-t-ddrrr-ccc
SFSDxxxxNxBMxss-t-dd-rrr-ccc
S-45μ: target specification
FLASH STORAGE SOLUTIONS
21
Flash Management
Mechanism
- Optimized error correction code
- Efficient algorithms for bad block
management
- Diagnostic with real life time
monitoring
- Sophisticated wear leveling and
bad block management resistance
- Power fail protection
SD Memory Cards
Swissbit’s Industrial Secure Digital (SD) card series are designed, manufactured and tested to
withstand extreme environmental conditions.
The use of SLC Flash in the S-200 / 220 series combined with an industrial grade Flash controller
provide a number of enhanced product features such as built-in error correction, wear leveling and
bad block management algorithms, power fail protection, and power saving modes. The housing
with special connector support provides resistance against bending and torque.
In addition to the existing SD memory card series, Swissbit has recently introduced the S-40, which
targets read-centric applications requiring the highest level of data reliability for long periods of
time. The combination of MLC (multi level cell) NAND Flash with innovative controller and firmware
technology enable prolonged data retention and extended life cycles despite the write endurance
limitations of MLC Flash. The special firmware features in the S-40 include a powerful built-in error
correction, read retry, autonomous data care management, life time monitoring and diagnostic
features, randomizer, wear leveling and bad block management algorithms and intelligent power
fail protection.
The new S-45 (MLC version) and S-450 (SLC version) series include the same set of sophisticated features
and, through the implementation of UHS-I, support data transfer rates of up to 80 MB/s.
All Swissbit SD cards can withstand extreme environmental conditions. They provide the highest level
of mechanical stability and enhanced ESD protection. Furthermore, the hard gold SD connectors
endure a minimum of 20,000 insertion cycles.
S-200 / 220
S-40 / S-45
S-450
Industry Leading;
22
default implemented;
FLASH STORAGE SOLUTIONS
not available
SD Memory
SD Memory
SD Memory
SD Memory
Card
Card
Card
Card
(SD / SDHC)
(SDHC / SDXC)
(SD / SDHC)
(SD / SDHC)
Series Name
S-200 / 220
S-40
S-45
S-450
Interface
Data Transfer Mode
SD 2.0, Class 6 / 10
SD 3.0, Class 6
SD 3.0, Class 10, UHS-I
Connector
SD
Outline Dimensions
32 x 24 x 2.1 mm
Flash Type
SLC
Density Range
512 MB - 2 GB (SD)
4 GB - 8 GB (SDHC)
MLC
SLC
512 MB - 2 GB (SD)
4 GB - 32 GB (SDHC)
4 GB - 32 GB (SDHC)
64 GB –128 GB (SDXC)
10 years @ life begin
1 year @ life end
Data Retention
Endurance
100,000 P/E Cycles
(Flash Cell Level)
Operating Temperature
3,000 P/E Cycles
(Flash Cell Level)
100,000 P/E Cycles
(Flash Cell Level)
Extended: -25°C to +85°C
Industrial: -40°C to +85°C
Storage Temperature
-40°C to +100°C
Performance
Burst Rate (MB/s) up to 25
Sequential Read (MB/s) up to 21
Sequential Write (MB/s) up to 18
up to 25
up to 24
up to 19
up to 104
up to 50
up to 19
Optimized for random
write IOPS
MTBF
≥ 3,000,000 hours
Shock
1,000 G
Vibration
15 G
1,500 G
50 G
Humidity
85 % RH 85°C, 1,000 hrs
2.7 - 3.6 V Normal
Voltage
Power Consumption
Read typ
Write typ
28 mA
55 mA
Proven Power Fail Safety
Features & Tools
Part Number
up to 104
up to 90
up to 75
Sophisticated Wear Leveling
& Bad Block management
Read typ
Write typ
40 mA
60 mA
Read typ
Write typ
100 mA
100 mA
Proven Power Fail Safety
Sophisticated Wear Leveling & Bad Block management
Autonomous Data Care Management
Diagnostic features & Life Time
Monitoring through SD / SPI
command set
SBLTM Tool & SDK for detailed Life Time Monitoring
SFSDxxxxLvBNxss-t-dd-rrr-ccc
SFSDxxxxLxBMxss-t-dd-rrr-ccc
S-45: target specification
FLASH STORAGE SOLUTIONS
23
USB Flash Drives / Modules
The Universal Serial Bus (USB) interface is very well established and has almost
entirely replaced any other forms of serial or parallel interfaces for computer
peripherals and memory storage devices. Advantages of USB are its flexibility,
fast sequential data transfer rate, and the ability to obtain power through the
connector. Most computer and embedded systems support these devices
either via the standard USB connector or internal, on-board terminal headers.
Swissbit offers both options in different form factors and in commercial and
industrial operating temperature ranges. State of the art NAND Flash handling
algorithms, stringent component selection, product change control, and a
100% in-process final system test at full temperature range (-40°C to +85°C)
qualify Swissbit’s USB Flash Drive (UFDs) for embedded and industrial markets.
Swissbit’s U-110 and U-4x Series (USB Flash Module) offers a no compromise
Flash based storage solution for:
• embedded PCs that need a rugged reliable storage solution,
• servers with backup or recovery functionality, and
• general industrial computers needing easy-to-use boot media.
All Swissbit USB solutions combine security features and Life Time Monitoring
tools for product life control.
U-45
U-400
U-110
unitedCONTRAST II
default implemented;
24
on request;
FLASH STORAGE SOLUTIONS
not available
Series Name
eUSB Flash
eUSB Flash
eUSB Flash
Module
Module
Module
U-400
U-45
U-110
USB FLASH DRIVE
unitedCONTRAST II
USB 2.0
Interface
Data Transfer Mode
High / Full Speed
Standard:
2.54 mm - 10 Pin (key option)
Low Profile: 2.00 mm - 10 Pin (key option)
Connector
USB 2.0 A-Plug
Standard: 36.8 mm x 26.65 mm x 9.6 mm
Low Profile: 36.8 mm x 26.65 mm x 5.7 mm
Outline Dimensions
68.0 mm x 18.0 mm x 8.0 mm
Flash Type
SLC
MLC (pSLC mode option)
SLC
SLC
Density Range
1 GB to 16 GB (32 GB opt.)
4 GB to 32 GB
1 GB to 16 GB
512 MB to 16 GB
10 years @ life begin
1 year @ life end
Data Retention
Endurance
100,000 P/E Cycles
(Flash Cell Level)
Operating Temperature
3,000 P/E Cycles
(Flash Cell Level)
100,000 P/E Cycles
(Flash Cell Level)
Commercial: 0°C to +70°C
Industrial: -40°C to +85°C
Storage Temperature
-50°C to +100°C
Performance
Burst Rate (MB/s)
Sequential Read (MB/s)
Sequential Write (MB/s)
Random 4KB Read (IOPS)
Random 4KB Write (IOPS
up to 60
up to 37
up to 26
up to 1,600
up to 30
up to 60
up to 32
up to 23
up to 650
up to 650
up to 60
up to 32
up to 23
up to 1,600
up to 30
MTBF
≥ 3,000,000 hours
Shock
50 G
Vibration
15 G
Humidity
85 % RH 85°C, 500 hrs
Voltage
Power Consumption
3.3 V ± 5 % / 5 V ± 10 %
5 V ± 10 %
(3.3 V ± 5 % optional)
Full Speed typ 90 mA
High Speed typ 100 mA
Proven Power Fail Safety
Proven Power Fail Safety
Windows / Linux – Spare block
read out
Bootable USB Drive
Hot Pluggable / Plug & Play
Supports latest OS as Fixed Drive
Optimized Wear Leveling
Connector pitch variations available
Security features
Shock & vibration resistant
Part Number
2.54 mm:
SFUIxxxxJvABxss-t-dd-rrr-ccc
2.00 mm:
SFUIxxxxKvABxss-t-dd-rrr-ccc
5 V ± 10 %
Full Speed typ 80 mA
High Speed typ 100 mA
Windows / Linux – Spare block read out
Features & Tools
up to 60
up to 32
up to 23
up to 1,600
up to 30
Password manager available
2.54 mm:
SFUIxxxxJvBPxss-t-dd-rrr-ccc
2.00 mm:
SFUIxxxxKvBPxss-t-dd-rrr-ccc
SFU2xxxxEvBPxss-t-dd-rrr-ccc
U-4x: target specification
FLASH STORAGE SOLUTIONS
25
Security SOLUTIONS
Security is becoming mandatory in diverse markets. Data breaches and
compromised IT environments are becoming a reality. Customers and solution
providers are rightly concerned about risks, creating a necessity to improve
security in a reliable and flexible fashion.
That GSM calls can easily be tapped has been widely publicized in the telecommunications market. Reports about the mass interception of Internet
data on a global scale compromise trust in the privacy of communications.
Sophisticated attacks on industrial facilities raise questions about liability
and reliability. A new class of threats and risks needs consideration. Consumers,
governments, enterprises, and industry are affected by security breaches
directly or indirectly, visible or invisible.
Swissbit supports its customers in industrial, medical, government,
telecommunications, and the banking sector in delivering secure systems.
Each and every system requires storage to operate. While globally recognized
as a leader in highly reliable Flash memory solutions, Swissbit also designs,
develops, and manufactures security products that provide additional security
functions and features. Swissbit demonstrates a continuous, uninterrupted
migration path towards secure systems while maintaining the reliability and
flexibility of existing memory form factors.
Swissbit offers product related services:
• Security firmware and drivers
• Logo printing
• Optical and electronic personalization
• Design-in of consigned smart card chips
As well as extended services:
• Security consulting
• Security training
• Customer support
• Design-in support
• Connection with eco-system partner network for turn
key solutions and quick time to market
26
SECURITY SOLUTIONS
Security Products – PS-100u Series
The security product series in the
microSD form factor addresses the
growing demand for mobile and
portable security. The products offer
tangible hardware security in the
same manner as the plug and play
approach.
For various markets, Swissbit offers a
broad set of security use cases. The
Flash memory can be used by any
host to store data on the cards at
high speed. Additional security
functions of the card can be activated
to protect any data.
Valuable data such as sensitive files,
emails, photos, and even voice calls
can be protected by encryption,
access protection, or made resistant
to tampering by digital signature. The
best fitting product can be chosen
depending on the use case.
Our PS-100u series provides high
security by the optional smart card
chip or by the Swissbit security
firmware. The block diagram below
illustrates the architecture of the
Swissbit Security Interface, the Flash
Controller, and the Encrypted Flash
Chip.
The Swissbit Security Interface
empowers solution providers to build
applications on various platforms. An
SDK is available to develop applications
on Windows™ and Linux™ PC platforms
and on mobile phones and tablets
like Android™ and BlackBerry™.
AES
Partner and Customer
solutions (like
applications, services,
middleware,
license control)
Swissbit
Security
Interface
Flash Memory
Controller
APP
with Swissbit
Security Firmware
(optional)
Secure
Element
Java
Applet
(Encrypted)
Flash
Memory
SECURITY SOLUTIONS
27
Security Products
SECURITY SOLUTIONS
PS-100u
SE / VE / PE
FE
Compliance
SD 3.0 SD, ASSD V1.1
SD 3.0 SD, ASSD V1.1
Data transfer
SPI mode supported
Speed class 10
SPI mode supported
Speed class 10
Density
4 GB / 8 GB / 16 GB
8 GB / 16 GB
Temperature
Extended: -25°C to +85°C
Extended: -25°C to +85°C
Security
Infineon SLE 78 smart card
chip
CC EAL 5+ HW and OS
Java card 3.0.4
Global Platform 2.2.1
Smart card OS jTop ID
Infineon SLE 78 smart card
chip
FIPS 140-2 level 3
Java card V2.2.x (ext. of V3.0)
Global Platform 2.2.1
Gemalto ID Core 30
RSA up to 2048 bit
optional ECC up to 512 / 521 bit
AES up to 256 bit
SHA2 up to 512 bit
RNG AIS31, FIPS-140
RSA up to 2048 bit
ECC up to 512 / 521 bit
AES up to 256 bit
SHA2 up to 512 bit
Compatible Middleware:
• AET SafeSign
• Charismathics
• Cryptovision
Compatible Middleware:
• Gemalto
80 k EEPROM secure storage
160 k EEPROM secure storage
WinXP, 7, 8, Vista, Linux,
BlackBerry, Android
SDK available
WinXP, 7, 8, Vista, Linux,
BlackBerry, Android
SDK available
Drivers / API
28
PS-100u
Security
The Standard Edition PS-100u SE fits best into authentication and PKI (Public
Key Information) use cases.
The card is supported by leading middleware vendors in mobile, desktop,
and tablet use cases to ensure a seamless design-in into existing security
infrastructures.
Typical applications are:
• mobile email encryption,
• digital signature,
• user authentication for PC and mobile login, and
• true random number generation.
The Voice Edition PS-100u VE provides Elliptic Curve Cryptography. The enormous
advantage of computation and security combined with small certificate sizes
makes the PS-100u VE card ideal for online key and certificate exchange.
Solution providers choose the PS-100u VE card to build secure mobile voice
solutions. The users (caller and person called) only need to enter their PIN
into their mobile device and the security chip performs end-to-end
encryption on their behalf. All encryption keys for authentication and key
agreements remain highly protected in the card at all times. Only AES key
stream segments suitable for voice stream encryption are passed to the
mobile host application.
The PS-100u VE extends the features of the PS-100u SE.
The PS-100u DP and PS-100u PE cards provide Flash memory encryption,
secure logging, and flexible CD-ROM storage.
The PS-100u PE offers asymmetric and symmetric cryptography by the
embedded smart card, whereas the PS-100u DP offers symmetric encryption
without smart card.
The PS-100u FE provides a secure element according FIPS 140-2 certification.
US governmental organizations and enterprises that need to follow the FIPS
140-2 security standard now benefit from smart integration into the microSD
form factor.
K
H
KNOW + HAVE
PS-100u SE
PS-100u VE
PS-100u FE
PS-100u PE
PS-100u DP
supported;
not available;
SECURITY SOLUTIONS
29
MEMORY SOLUTIONS
Swissbit commits to offering the highest quality, JEDEC standard and customized
DRAM modules for industrial applications. As a DRAM module manufacturer,
we use strategic multiple sources of DRAM suppliers to offer our customers a
reliable, long-term supply of leading edge and legacy memory module
products. Special focus is put into working with suppliers that offer extended
availability of DRAM die revisions, avoiding frequent requalification efforts
with our customers.
Swissbit’s quality focus starts with sourcing the highest quality DRAMs and
utilizing fully compliant JEDEC module raw cards either as in-house PCB
design or from top quality design partners. For all modules, the passives
and other active components selected are of the highest available quality.
Using surface mount technology (SMT) processes in production on fully certified
facilities in Germany allows Swissbit to sustain a quality focus during the
entire assembly process. Traceability is guaranteed through the complete
manufacturing and testing flow. We ensure the highest quality level for our
customers with world class application testing. Swissbit uses in-house developed
application software to test 100 % of all modules under real-world conditions
with diverse pattern and stress methods and to cover the complete memory
array including ECC components by constantly adapting to the latest memory
controller features. For industrial temperature grade modules the application
tests are performed at -40°C and +85°C T AMBIENT.
With a stringent internal product qualification, fast customer return processing
and the dedication to always be an improving company, Swissbit constantly
works on providing its customers the best DRAM modules available on
the market at a competitive price. Swissbit is committed and able to design,
manufacture, and test customer-specific module solutions. We offer PCB
design and layout services, development of individual test solutions, thermal
simulations, DRAM component sourcing, controlled manufacturing, and
special coating options.
By using Swissbit DRAM modules, you can keep the total system cost to
a minimum.
30
DRAM MODULES
DRAM SPECIFIC OPTIONS
DDR1
DIMM / RDIMM
DDR1
SODIMM / SO-RDIMM
DDR2
DIMM / RDIMM
DDR2
SODIMM
DDR3
DIMM
DDR3
RDIMM
DDR3
MiniDIMM
DDR3
SODIMM / SO-UDIMM
DDR3
XR-DIMM
default implemented;
on request;
not available
DDR4, FASTER AT LOW POWER
With its architectural features and the subsequent
extension to 1.35 V, DDR3 technology had the widest
range of data rates. But the end of DDR3 technology's
evolution has finally come. Further improvements were
necessary to open a path for even higher data rates.
The new JEDEC standard, DDR4 addresses, these requirements.
Its spec targets a doubling of the data rate from today’s
DDR3-1600 to a blazing DDR4-3200. The introduction of
DDR4 already starts at 2133 Mb/s and offers a 30% higher
bandwidth compared to main stream DDR3L speed.
At the same time, the operating voltage could be reduced
from 1.35 V to 1.20 V. Together with several new power
saving features like an improved termination scheme,
data bus inversion, and grouping of banks, the total power
consumption and heat dissipation has been significantly
reduced vis-à-vis DDR3L.
The DDR4 standard also adds reliability features like CRC
and command / address bus parity.
DDR4 has been fully standardized at JEDEC and the most
recent memory controllers support it.
Swissbit will offer a complete portfolio of DDR4 modules
as JEDEC releases them, focusing on the form
factors that are most important to the industrial market,
beginning with ECC SODIMMs.
MEMORY SOLUTIONS
31
RUGGEDIZED DIMMS
Designers of rugged platforms face a difficult decision
when planning their memory layout: either they use
DRAM components directly soldered to the system board,
the most rugged but also expensive and inflexible solution,
or they try to ruggedize standard SODIMMs by using
straps or glue to fasten them in their sockets.
In cooperation with the SFF-SIG consortium (Small Form
Factor-Special Interest Group), Swissbit has developed a
rugged module called XR-DIMMTM, the abbreviation XR
standing for eXtreme Rugged.
Using special mezzanine connectors and mounting holes
to attach the module to the system board creates a truly
rugged system with the easy integration and flexibility
of DIMM solutions and the shock and vibration immunity
of memory down implementations.
The XR-DIMM closely follows the DDR3 72 bit SODIMM
standard and makes design-in as easy as using a JEDEC
module, unburdening the system designer from memory
channel layout.
With multiple module densities, the system integrator
can create different memory populations with one
system platform, avoiding multiple system board SKUs
and taking advantage of perfectly tested modules with a
just-in-time purchase option.
Memory down
SODIMM with fixture
XR-DIMM
Design-in / Layout
Difficult
Easy
Easy
Flexibility of memory population
Difficult
Easy
Easy
Testability after soldering
Medium
Easy
Easy
Upgrade / Repair
Difficult
Easy
Easy
Small to Medium
Medium to Small
Medium to Small
No
Yes
Yes
Good
Medium (with glue / strap)
Good
Required board space
Stackable solution
Protection against shock
Protection against Vibration
MEMORY COST
32
MEMORY SOLUTIONS
Good
Bad
Good
Low to Medium
Low
Medium
UNBUFFERED DIMM PRODUCTS
LONG UDIMM / WITH AND WITHOUT ECC
Data Rate / CL
Density
Org
Height
Voltage
Pins
Partnumber
Package
DDR4-UDIMM
2133 / CL15
4 GB – 16 GB
x64
31.25 mm
1.20 V
260
SHUxxx64xxxxxxx-ssR
BGA
DDR3L-UDIMM
1600 / CL11
2 GB - 8 GB
x64
1.18“ (29.97 mm)
1.35 / 1.50 V
240
SLUxxx64xxxxxxx-ssR
BGA
DDR3L-UDIMM ECC
1600 / CL11
2 GB - 8 GB
x72
1.18“ (29.97 mm)
1.35 / 1.50 V
240
SLUxxx72xxxxxxx-ssR
BGA
DDR2-UDIMM
800 / CL6
512 MB - 2 GB
x64
1.18“ (29.97 mm)
1.80 V
240
SEUxxx64xxxxxxx-ssR
BGA
DDR2-UDIMM ECC
800 / CL6
1 GB - 2 GB
x72
1.18“ (29.97 mm)
1.80 V
240
SEUxxx72xxxxxxx-ssR
BGA
DDR1-UDIMM
400 / CL3
512 MB - 1 GB
x64
1.25“ (31.75 mm)
2.50 V
184
SDUxxx64xxxxxxx-ssR
TSOP
DDR1-UDIMM ECC
400 / CL3
512 MB - 1 GB
x72
1.25“ (31.75 mm)
2.50 V
184
SDUxxx72xxxxxxx-ssR
TSOP
SODIMM / WITH AND WITHOUT ECC / RUGGED XR-DIMM
Data Rate / CL
Density
Org
Height
Voltage
Pins
Partnumber
DDR4-SODIMM
2133 / CL15
4 GB – 16 GB
x64
30 mm
1.20 V
260
SHNxxx64xxxxxxx-ssRT
Package
BGA
DDR4-SODIMM ECC
2133 / CL15
4 GB – 16 GB
x72
30 mm
1.20 V
260
SHNxxx72xxxxxxx-ssRT
BGA
DDR3L-SODIMM
1600 / CL11
1 GB - 8 GB
x64
1.18“ (29.97 mm)
1.35 / 1.50 V
204
SLNxxx64xxxxxxx-ssRT
BGA
DDR3L-SO-UDIMM
1600 / CL11
2 GB - 8 GB
x72
1.18“ (29.97 mm)
1.35 / 1.50 V
204
SLNxxx72xxxxxxx-ssRT
BGA
DDR3-SODIMM
1600 / CL11
1 GB - 8 GB
x64
1.18“ (29.97 mm)
1.50 V
204
SGNxxx64xxxxxxx-ssRT
BGA
DDR3-SO-UDIMM
1600 / CL11
1 GB - 8 GB
x72
1.18“ (29.97 mm)
1.50 V
204
SGNxxx72xxxxxxx-ssRT
BGA
DDR3-XR-DIMMTM
1600 / CL11
1 GB - 8 GB
x72
38 mm x 67.5 mm
1.35 / 1.50 V
240
SLVxxx72xxxxxxx-ssRT
BGA
DDR2-SODIMM
800 / CL6
512 MB - 4 GB
x64
1.18“ (29.97 mm)
1.80 V
200
SENxxx64xxxxxxx-ssR
BGA
DDR1-SODIMM
400 / CL3
256 MB - 1 GB
x64
1.25“ (31.75 mm)
2.50 V
200
SDNxxx64xxxxxxx-ssR
BGA
MINI-UDIMM / 100PIN-DIMM
Data Rate / CL
Density
Org
Height
Voltage
Pins
Partnumber
Package
DDR3-MiniUDIMM
1600 / CL11
2 GB - 8 GB
x72
1.18“ / 0.74“
1.50 V
244
SGLxxx72xxxxxxx-ssRT
BGA
DDR1-100PIN_DIMM
333 / CL2.5
128 MB - 512 MB
x72
1.00“ (25.40 mm)
2.50 V
100
SDUxxx32xxxxxxx-ssR
TSOP
MEMORY SOLUTIONS
33
MODULE OPTIONS
HEAT SPREADER
CONFORMAL COATING
The critical condition for DRAMs is a high die temperature,
because it leads to loss of cell information. With die sizes
continually shrinking, power dissipation is concentrated
on only a few square millimeters. Adding a heat spreader
to a module allows the hot spots to more easily dissipate
the heat over a bigger surface. This heat spreader levels
out the module's heat dissipation, thus reducing
the hot-spot temperature and improving the module's
reliability.
Swissbit offers heat-spreader solutions for some of its
industrial temperature grade SODIMMs and MiniDIMMs.
Industrial DRAM modules often do not operate in a clean
air environment relative to standard office or home
conditions. A heavy-industry environment with hot or
humid air, aggressive chloride of sulfite loaded gas or dust
can reduce the life span of a DRAM module by corroding
the PCB lines or solder contacts.
Swissbit offers a full module surface coating with a thin
film of polyurethane, which effectively protects against
most hazardous environmental conditions. The module's
endurance is greatly improved with this protection, thus
reducing maintenance periods and avoiding sudden
breakdown of a system. This option is currently available
for SODIMMs as well as for several Flash products.
CORROSION RESISTANCE
For demanding applications Swissbit uses a thick, 30 microinch layer of gold on the DIMM contacts and special sulfur
corrosion resistant passives to offer the highest reliability
and longest lifetime.
TEMPERATURE SENSOR
Unprotected PCB after highly
accelerated corrosion test
For all DDR3 SODIMMs, MiniDIMMs, and registered DIMMs,
Swissbit offers an integrated temperature sensor by default
within the SPD device. It allows permanent monitoring of
the module temperature over the system management bus.
By utilizing this feature, system management can actually
control the module's self-heating in a more accurate
manner than by using calculation methods for memory
throttling. This results in greater useable bandwidth and
avoids overheating of the module.
Industrial Temperature Range
Swissbit protected PCB
after highly accelerated
corrosion test
34
MEMORY SOLUTIONS
Besides modules for commercial temperature range
0°C to +70°C, Swissbit also offers products for an extended
temperature range of 0°C to +85°C T AMBIENT as well as the full
industrial temperature range -40°C to +85°C T AMBIENT.
With intensive application testing of each individual
module at low and high temperature, Swissbit ensures
the highest quality and reliability of their products.
Registered DIMM products
Long RDIMM / standard height / with ECC and C/A Parity
DDR3L-RDIMM
ECC+Parity
DDR3-RDIMM
ECC+Parity
DDR2-RDIMM
ECC+Parity
Data Rate / CL
Density
Org
Height
Voltage
Pins
Partnumber
Package
1600 / CL11
4 GB - 8 GB
x72
1.18“ (29.97 mm)
1.35 V
240
SLPxxx72xxxxxx-ssR
BGA
1333 / CL9
1 GB - 8 GB
x72
1.18“ (29.97 mm)
1.50 V
240
SGPxxx72xxxxxx-ssR
BGA
800 / CL6
1 GB - 4 GB
x72
1.18“ (29.97 mm)
1.80 V
240
SEPxxx72xxxxxxx-ssR
BGA
Low Profile Long RDIMM, UDIMM / with ECC
DDR3-RDIMM
ECC+Parity
DDR3L-UDIMM
ECC
DDR3-UDIMM
ECC
DDR2-RDIMM
ECC+Parity
Data Rate / CL
Density
Org
Height
Voltage
Pins
Partnumber
Package
1333 / CL9
2 GB - 8 GB
x72
0.70“ (17.78 mm)
1.50 V
240
SGPxxx72xxxxxxx-ssR
BGA
1600 / CL11
2 GB - 8 GB
x72
0.74“ (18.90 mm)
1.35 V
240
SLUxxx72xxxxxxx-ssR
BGA
1333 / CL9
2 GB - 4 GB
x72
0.70“ (17.78 mm)
1.50 V
240
SGUxxx72xxxxxxx-ssR
BGA
800 / CL6
1 GB - 2 GB
x72
0.72“ (18.29 mm)
1.80 V
240
SEPxxx72xxxxxxx-ssR
BGA
VLP MiniRDIMM with ECC, Registered SO-RDIMM with ECC
Data Rate / CL
Density
Org
Height
Voltage
Pins
Partnumber
Package
DDR3-MiniRDIMM
1333 / CL9
2 GB – 4 GB
x72
0.72“ (18.29 mm)
1.50 V
244
SGHxxx72xxxxxxx-ssR
BGA
DDR2-MiniRDIMM
667 / CL5
1 GB
x72
0.72“ (18.29 mm)
1.80 V
244
SEHxxx72xxxxxxx-ssR
BGA
DDR2-SO-RDIMM
667 / CL5
1 GB - 2 GB
x72
1.18“ (29.97 mm)
1.80 V
200
SEGxxx72xxxxxxx-ssR
BGA
MEMORY SOLUTIONS
35
SYSTEM-IN-PACKAGE (SiP)
System-in-Package (SiP) is the processing of sensitive bare dies or chips into
robust finished modules or components. With 20 years of experience, Swissbit
successfully uses advanced packaging technologies to achieve the smallest
form factors and to build multi-chip-packages. With this electronic integration
approach, our products provide more functionality or highest memory densities
inside one package, various functional blocks (RF, digital, sensors, security,
and memory) as well as passive components are combined.
Beginning with the wafer and bare die handling, Swissbit utilizes a flexible
chip-on-board (COB) assembly and packaging line. Processes like SMT assembly,
die bonding, Au and Al wire bonding, dam&fill, transfer molding, precise
separation with laser technology and sawing, housing, labeling, laser marking,
etc. are very well established.
Die stacking, especially for Flash and DRAM, is one of our expertises besides
the integration of additional hardware features and an experienced team of
testing and quality engineers. Our own Memory-In-Package line qualifies
(but does not limit) Swissbit as the development and production partner for
any dedicated or customized memory-related product with challenging
integration or reliability requirements. If you cannot satisfy the special demands
regarding space and performance using traditional components and processes,
Swissbit offers feasibility studies, manages or supports your development
project, and produces prototypes and small and mid-size volumes (up to 50,000
pieces / month). We will aid you beginning at your project's conception: from
the design phase, prototyping, determining the circuit layout, and material
selection to preparing the appropriate packaging for transport.
Swissbit produces and develops according to ISO 9001:2008, TS 16949, and
ISO 14001 approved processes and is an experienced partner in global industrial
and automotive accounts.
Swissbit´s technology portfolio combined with its strong engineering knowhow and experience enables new, innovative MCP (Multi Chip Packages)/SiP/
COB configurations like stacked dies, side-by-side, sensors integration, etc.
System-in-Package solutions could be smaller, cheaper, and having tighter
security.
System-in-Package benefits:
• Reduced process complexity
• Lower TCO (total cost of ownership)
• Reduced system board space due to smaller sized solutions than
individually packaged ICs
• Layer count reduction in System PCB
• Reduced board mounted height
• Mixed analog / digital design
• Reduced system board test complexity
36
SWISSBIT SiP and COB COMPETENCY
CONCEPTION
• Product definition
• Feasibility studies
• Verification plan
• Qualification plan
• Design for test
• Design for
production
• Design to cost
VERIFICATION &
DEVELOPMENT
•Package
development
•Process
development
• Substrate layout
• Test engineering
and development
• Failure analysis
consulting
Qualification
• Product verification
•Debugging
•Optimization
• Reliability testing
• Life time
• Compliance to CE /
FCC / VCCI, UL, RoHS,
and REACH
Production
• Fast prototyping
• Ramp up
• Yield management
• Series production of:
•SMT
•SiP
•COB
•MCP
•BGA
Logistics
• Stock management
• Supply chain
management
• One-stop sourcing
Swissbit is offering the following production technologies
SMD
SEPARATION / SINGULATION
Die Attach / Chip Bonding / Wire Bonding
DIE STACKING
ENCAPSULATION
ADHESIVE APPLY
MARKING
Conformal
Coating
System in Package (SiP)
37
Swissbit Part Number – The DNA of your specific product
Flash and Security Part Number Decoder
S
1
F
2
CF
3
2048
4
H
5
4
6
B
7
o
8
2
9
TO - I - M
10
11
12
S
13
-
*
14
-
*
15
Swissbit
Memory (1)
Design Option (15)
Configuration (14)
Memory Type (2)
F: Flash Products
PIN Mode (13)
0:1 nCE & R/nB
Product Type (3)
1:2 nCE & R/nB
U2: USB 2.0 Flash Drive
2:4 nCE & R/nB
CA:CFast™
A:LGA 1 nCE & R/nB
CF: CompactFlash™
B:LGA 2 nCE & R/nB
PC: PCIe
C: LGA 4 nCE & R/nB
UI: UFD internal / Module
E:COB 1 nCE
SD: SD memory card
F:COB 2 nCE
MM:Multimedia card
G:COB 4 nCE & R/nB
PA: PATA / IDE
H:COB 8 nCE & R/nB
SA:SATA
O:2 TSOP, single channel, 1 nCE & R/nB
P:2 TSOP, single channel, 2 nCE & R/nB
Density (4)
Q:2 TSOP, single channel, 4 nCE & R/nB
0016: 16 MB
4096: 4 GB
030G:30 GB
S:TSOP 1 nCE & R/nB
0032: 32 MB
8192: 8 GB
060G:60 GB
T: TSOP 2 nCE & R/nB
0064: 64 MB
016G: 16 GB
120G:120 GB
U:TSOP 4 nCE & R/nB
0128: 128 MB
032G: 32 GB
240G:240 GB
0256: 256 MB
064G: 64 GB
480G:480 GB
960G:960 GB
Flash Package Classification (12)
0512: 512 MB
128G: 128 GB
1024: 1 GB
256G: 256 GB
D:SLC DDP (dual die package)
2048: 2 GB
512G: 512 GB
Q:SLC QDP (quad die package)
Product Dimension (5)
M:SLC SDP (single die package)
N:SLC ODP (octal die package)
G:MLC SDP (single die package)
H:CompactFlashTM / CFastTM
L: MLC DDP (dual die package)
J: UFD Module 2.54 mm terminal header
H:MLC QDP (quad die package)
K: UFD Module 2.00 mm terminal header
O:MLC ODP (octal die package)
L: SD memory card
M: M.2 SSD
Temperature Rating (11)
N:microSD memory card
I: Industrial Temp. (-40°C to +85°C)
O:Multimedia card
E:Extended Temp. (-25°C to +85 / 90°C)
Q:SSD 2.5”
C:Commercial Temp. (0°C to +70°C)
U:mSATA (MO-300)
V: SLIM SATA (MO-297)
Product Generation (6)
Memory Organization (7)
Flash Supplier (10 )
SA:Samsung
MT:Micron Technology
HY: SK Hynix
TO:Toshiba
MA:Macronix
Technology (8)
AP:Spansion
Chips / Channels (9)
38
Part Numbers
DRAM Part Number Decoder
S
1
Swissbit
l
N
08G
64
E2
B
d
2
2
3
4
5
6
7
8
9
SA - DC
10
11
*
12
R
T
13
14
Memory (1)
Product Group (2)
S: SDRAM SDR
3.30 V
D:SDRAM DDR
2.50 V
E: SDRAM DDR2
1.80 V
G:SDRAM DDR3
1.50 V
Thermal Sensor (14)
Material (13)
R: RoHS conform
L: SDRAM DDR3L 1.35 / 1.50 V
H:SDRAM DDR4
S: RoHS conform, Sulfur resistant
1.20 V
Temperature Rating (12)
Module Type (3)
SDR
N: 144 Pin SODIMM
DDR
U: 184 Pin UDIMM
R: 184 Pin RDIMM
N: 200 Pin SODIMM
M: 172 Pin Micro-DIMM
DDR2 U: 240 Pin UDIMM
C: (or blank)
(0°C to +70°C)
E: Ext. Temp.
(0°C to +85°C)
I: Ext. Temp. (-25°C to +85°C)
W:Ind. Temp. (-40°C to +85°C)
Speed (11)
DDR4 DK: DDR4-1600 CL11 EM:DDR4-1866 CL13
R: 240 Pin RDIMM, w/o Parity
P: 240 Pin RDIMM, w/ Parity
DDR3 AA: DDR3-800 CL5
BB:DDR3-1066 CL7
F: 240 Pin FBDIMM
DC:DDR3-1600 CL11
N: 200 Pin SODIMM
DDR2 50: DDR2-400 CL3
37: DDR2-533 CL4
G: 200 Pin SO-RDIMM
H: 244 Pin MiniRDIMM, w/ Parity
30: DDR2-667 CL5
3A:DDR2-667 CL4
M: 214 Pin MicroDIMM
25: DDR2-800 CL6
2A:DDR2-800 CL5
BB: DDR2-1066 CL7
DDR
08: DDR-200 CL2
75: DDR-266B CL2.5
70: DDR-266A CL2
7A:DDR-266A CL2
60: DDR-333B CL2.5 6A:DDR-333A CL2
DDR3 U: 240 Pin UDIMM
DDR3L P: 240 Pin RDIMM
N: 204 Pin SODIMM / SOUDIMM
G: 204 Pin SO-RDIMM
M: 214 Pin MicroDIMM
FP: DDR4-2133 CL15 GU:DDR4-2400 CL18
CC: DDR3-1333 CL9
50: DDR-400B CL3
5A:DDR-400A CL2.5
L: 244 Pin MiniUDIMM
SDR
10: PC-100 CL3
08: PC-100 CL2
H: 244 Pin MiniRDIMM
75: PC-133 CL3
70: PC-133 CL2
V: 240 Pin XR-DIMM
DDR4 U: 288 Pin UDIMM
P: 288 Pin RDIMM
N: 260 Pin SODIMM x64, x72
Address Depth / Capacity (4)
008:
DRAM Manufacturer (10 )
EP:Elpida
ET:Etron
HY:SK Hynix
MT:Micron Technology
NA:Nanya
PT:Promos
SA:Samsung
WI:Winbond
8 MB x (5)
01G: 1 GB
016: 16 MB x (5)
02G: 2 GB
032: 32 MB x (5)
04G: 4 GB
1:1 Rank Module
064: 64 MB x (5)
08G: 8 GB
2:2 Rank Module
128: 128 MB x (5)
16G:16 GB
4:4 Rank Module
Module Ranks (9)
256:256 MB x (5)
DRAM Revision (8)
Data Width (5)
32: w/o Parity
DRAM Organization (7)
36: w/ Parity
A:x4
64: w/o ECC
C:x16
D:x4 TSOP Stack
72: w/ ECC
G: x4 BGA DDP
H: x8 BGA DDP
B:x8
Printed Circuit Board with Revision (6)
Part Numbers
39
Swissbit NA Port Chester, NY
HQ SBNA + Sales
18 Willett Ave #202,
Port Chester, NY 10573, USA
[email protected]
Swissbit NA Orange County, CA
FAE support
29222 Rancho Viejo Rd,
San Juan Capistrano, CA 92675, USA
[email protected]
Swissbit NA Eagle, ID
FAE support + Sales
1117 E Plaza Dr,
Eagle, ID 83616, USA
[email protected]
40
Swissbit Security
R&D, FAE support, Sales
Kirchenstraße 62,
81675 Munich, Germany
[email protected]
Swissbit AG
Headquarters, R&D,
FAE support, Sales
Industriestraße 4,
9552 Bronschhofen, Switzerland
[email protected]
Swissbit Germany
Design Center
Dresden, Germany
[email protected]
Swissbit NA Westford, MA
R&D + FAE support
238 Littleton Rd #202b,
Westford, MA 01886, USA
[email protected]
Swissbit Germany
R&D + Production
Wolfener Straße 36,
12681 Berlin, Germany
[email protected]
Swissbit Taiwan
R&D, FAE support, Sales
2F., No. 125, Shengli 2nd Rd,
Zhubel City, Hsinchu County 302,
Taiwan (R.O.C.)
[email protected]
Swissbit Japan
FAE support + Sales
2-1-24 Koenji-Kita,
Suginami-Ku Tokyo 166-0002,
Japan
[email protected]
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