The Wireless Guide

The Wireless Guide
Integrated Connections:
The Wireless Guide
The Wireless Guide
Advancements in wireless technology have opened the door to unprecedented innovation across a wide range of market segments.
Consumers and business users have come to expect continuous network access and wireless connectivity is the underlying foundation
of the Internet of Things (IoT). Designers integrating wireless technology into new or legacy applications have numerous complex
factors to evaluate as they go through product definition. Among these considerations are transmission distance and frequency, power
consumption and interoperability with other devices in the overall system. These decisions are further compounded by the need to
align with a standard at a time when several are still competing to be primary along with the need to obtain regulatory certification.
Finally, engineering departments may not have the necessary in-house resources for executing critical features such as antenna design.
A mistake here could prove costly if re-designs are needed to acquire regulatory certifications not to mention the ramifications of
missing market windows.
Developers can turn to Avnet for support when building wireless technology into their application. Avnet has a broad offering of wireless
modules and components to support everything from near field communication (NFC) to Bluetooth® to local and wide area networking.
Avnet’s field based engineers are able to address the trade-offs between different technology options and standards so you get it right
the first time. The Avnet team also brings extensive practical experience to each opportunity sharing best practices to complete the
design. Their knowledge spans drivers, software and the nuances of developing with coexistent modalities of wireless communications.
Your Avnet team is ready to support your wireless design requirements. As you review the innovative products featured in this guide,
you can rely on Avnet to support every step of your product development process. From design consideration, prototyping and
regulatory certification to new product introduction and ramping up volume production; Avnet is the right choice for design and
supply-chain support.
TABLE OF CONTENTS
Featured Products............................................................................................................................................4
Laird/LSR.......................................................................................................................................6
Microchip.......................................................................................................................................8
Molex.......................................................................................................................................10
ON Semiconductor................................................................................................................................12
TDK....................................................................................................................................................14
Texas Instruments.................................................................................................................................16
Kits, Tools & Reference Designs.....................................................................................................................18
Laird/LSR.......................................................................................................................................20
Microchip.......................................................................................................................................22
On Semiconductor................................................................................................................................24
Texas Instruments.................................................................................................................................26
Services & Support.........................................................................................................................................28
3
Featured Products
LAIRD & LSR CONNECTIVITY SOLUTIONS
Together, Laird’s Connectivity Solutions and recently acquired LSR offer an extensive range of embedded
wireless products and innovative antenna options that help you connect and protect your wireless
deployments. Our straightforward Bluetooth®, Bluetooth Smart, Zigbee®, and both Enterprise
and Professional Series Wi-Fi® solutions are ideal for robust data connectivity, mobile computers,
medical devices, and other business-critical applications.
Some of Laird’s recent developments include Industrial Frequency Hopping modules for Point-to-Point
and Point-to-Multipoint M2M applications, as well as a new module series featuring LoRaWAN™ technology.
All Laird embedded modules feature the Laird stamp of reliability and are fully supported for any issues
that occur in the field.
Complementing their wireless modules and antennas, Laird also offers wireless product development
services as well as EMC testing and certification. Laird’s Products and Services are here to help, simplifying
wireless technology to accelerate the development of connected IoT solutions.
WI-FI® + BLUETOOTH® COMBO MODULES
STERLING-LWB™: 2.4 GHZ WI-FI® AND BLUETOOTH® SMART READY MULTISTANDARD MODULE
LSR's Sterling-LWB™ 2.4 GHz Wi-Fi and Bluetooth Smart Ready Multi-Standard Module provides your
customers with more options, more certifications and a greater variety of antenna options, which
altogether provides greater flexibility to meet the challenging requirements of many wireless designs. This
certified module is based upon the Broadcom 4343W chipset, and supports IEEE 802.11 b/g/n, BT 2.1+EDR,
and BLE 4.1 wireless connectivity. The module comes in three configurations to best address specific
applications, and features an industrial temperature rating (-40° to +85° C) and an industry-leading breadth
of certifications and antenna options.
-- Three configuration options available:
-SiP
Module (10 mm x 10 mm x 1.2 mm)
-Module
with chip antenna (15.5 mm x 21 mm x 2 mm)
-Module
with External U.FL antenna port (15.5 mm x 21 mm x 2 mm)
-- Enhanced collaborative co-existence algorithms
-- Best-in-class Output Power and Rx Sensitivity
-- Direct driver support for both Linux and Android
-- SIG certified Bluetooth driver
-- Multiple certified 2.4 GHz antenna options
-Chip,
Dipole, FlexPIFA™ & FlexNotch™
-LSR
offers in-house certification of additional antennas at little to no cost
6
BLUETOOTH® & BLUETOOTH® SMART MODULES
BT900 SERIES: INTELLIGENT DUAL-MODE BLUETOOTH® V4.0 MODULES FEATURING
SMARTBASIC
Laird’s innovative BT900 series of modules reduce the engineering burden and design risk of integrating
Bluetooth and Bluetooth Low Energy into any OEM device. The BT900’s tiny form factor, on-module
MCU and BT stack for hostless operation, and integrated antenna and U.FL port options provide a secure,
stable Bluetooth environment for your embedded design. A USB dongle form factor (BT900-US) is also
available. Let Laird's innovative BT900 series, smartBASIC programming language, and decades of
expertise in Bluetooth module design speed your product to market.
SABLE-X: 2.4 GHZ BLUETOOTH® LOW ENERGY (BLE) MODULE
LSR’s SaBLE-x certified Bluetooth Smart module is built to deliver unmatched RF and power performance.
This module can deliver over twice the signal range and can operate at nearly 1/3 the average power for a
1 second connection interval when compared to the previous generation Bluetooth low energy technology.
Based on the new TI SimpleLink™ Bluetooth Smart CC2640 wireless microcontroller (MCU), this selfcontained module provides unmatched integration, including an ARM Cortex-M3 application processor,
an ARM Cortex-M0 processor for the RF core, separate Sensor Processor Engine, FLASH memory, and
both high and low-speed clocks. And the innovative Serial-to-BLE API and development tools make it
simpler than ever to implement BLE connectivity with an existing microcontroller in your design.
LORA® + BLUETOOTH® SMART MODULES
RM1XX SERIES: LORA™ + BLUETOOTH® LOW ENERGY (BLE) INTEGRATED SOLUTION
The all-new RM1xx LoRaWAN + BLE series of modules offer a powerful, convenient solution for long-range
Enterprise IoT (EIoT) deployments. Laird innovatively combines Bluetooth v4.0 with LoRaWAN™,
the emerging standard in Low Power Wide Area Networks (LPWAN), into one module. RM1xx modules
aggregate and transmit data from hardwired or Bluetooth® Smart (BLE) devices and sensors over LoRa® to
gateways as far as 15 km (~10 miles) away. This bridges the personal area network to the wide area network
in a unique way. The RM1xx Series is LoRa® Alliance certified and fully interoperable with any LoRaWAN™adherent gateway. In addition, on-module MCU with both LoRa and BLE stack allows for hostless
operation, with your business-specific application seamlessly added using Laird’s intuitive smartBASIC
programming language.
7
Microchip offers a broad portfolio of wireless solutions which are cost effective and very easy to
implement. Depending on your application requirements, you can choose the product that fits your needs
from our various transmitters, receivers, transceivers and agency certified modules for Bluetooth®,
Wi-Fi®, IEEE 802.15.4/ZigBee®, ISM Band Sub-GHz and LoRa® Technology.
EMBEDDED WIRELESS
2.4 GHZ
Microchip provides transceiver-based solutions to customers which complement the PIC® family of microcontrollers. These products
provide a flexible, cost-effective platform for customers to create the optimum wireless products, and solutions for their given application.
Transceiver
Data Rate
Frequency Range (MHz)
Sensitivity (dBm)
Tx Power
Rx Mode
Output Power (dBm)
MRF24J40
250 kbps
2.405 – 2.475
-94
23 mA
19 mA
0
Module
Data Rate
Frequency Range (MHz)
Sensitivity (dBm)
Tx Power
Rx Mode
Output Power (dBm)
2.405 – 2.475
-94
23 mA
19 mA
0
2.405 – 2.475
-102
130 mA
25 mA
20
2.405 – 2.475
-104
140 mA
32 mA
19
MRF24J40MA
MRF24J40MD
250 kbps
MRF24J40ME
LORA®
LoRa® Technology is a wireless modulation for long-range, low-power, low-data-rate applications.
Part No.
Output Power (dBm)
Frequency (MHz)
Package
Sensitivity (dBm)
Range
Size (mm)
+10 @ 433 MHz
433, 868 (Europe)
Surface Mount Module
-148
>15 km (suburban)
17.8 x 26.7 x 3.0
+14 @ 868 MHz
433, 868 (Europe)
Surface Mount Module
-148
>15 km (suburban)
17.8 x 26.7 x 3.0
Adjustable
915
Surface Mount Module
-146
>15 km (suburban)
17.8 x 26.7 x 3.0
Up to +18
915
Surface Mount Module
-146
>15 km (suburban)
17.8 x 26.7 x 3.0
RN2483
RN2903
SUB-GHZ
Microchip provides Sub-GHz RF solutions that are ideal for many short-range, low-data rate and low-power wireless applications.
Transmitters
Radio
Type
MICRF114
MICRF113
MICRF112
8
Transmitter
Modulation
Data Rate (kbps)
Frequency Range (MHz)
Tx Power (dBm)
OOK
115.2 (NRZ), 57.6 (Manchester Encoded)
285 – 445
13
ASK
20
300 – 450
10
ASK/FSK
50 (ASK), 10 (FSK)
300 – 450
10
Receivers
Radio
Type
Modulation
Data Rate (kbps)
Frequency Range (MHz)
Tx Power
(dBm)
MICRF219A
Receiver (with Auto-Poll)
ASK/OOK
20
300 – 450
-110
MICRF220
Receiver
ASK/OOK
20
300 – 450
-110
MRF39RA
Receiver
FSK/GFSK/MSK/GMSK/OOK
300
290 – 1020
-120
MICRF221
Receiver
ASK/OOK
10 (Manchester Encoded)
850 – 950
-109
MICRF229
Receiver (Auto-Poll & RSSI)
ASK/OOK
20
400 – 450
-112
MICRF230
Receiver (RSSI & Squelch)
ASK/OOK
20
400 – 450
-112
Transceivers
Radio
Type
Modulation
Data Rate (kbps)
Frequency Range (MHz)
Tx Power (dBm)
MRF89XA
Transceiver
FSK/OOK
200
868/915/955
-113
MRF49XA
Transceiver
FSK
256
434/868/915
-110
BLUETOOTH® MODULES
Microchip offers ultra-low power embedded Bluetooth® modules, ideal for adding Bluetooth connectivity to embedded applications.
Product
Bluetooth Classic-Data/SPP
Bluetooth Classic Audio
Bluetooth Low Energy
FCC Certified
BM20
X
X
X
BM23
X
X
X
BM62
X
X
X
X
X
X
X
X
X
BM63
BM64
X
X
BM70
X
X
BM71
X
X
X
X
X
X
BM78
X
BM90
X
RN4020
RN41
X
RN42
X
RN4678
X
X
X
X
X
RN4870
X
X
RN4871
X
X
RN52
X
X
X
BTLC1000
X
X
SAMB11
X
X
WI-FI® MODULES
Microchip provides embedded Wi-Fi® solutions designed for adding low power Wi-Fi connectivity to enable the “Internet of Things.”
Part No.
Radio
Antenna
RN1810/RN1810E
802.11 b/g/n
MRF24WN0MA/B
Power Consumption
Output Power
Off*
Sleep**
PS
Rx
Tx
PCB/W.FL
N/a
40 μA
N/a
64 mA
246 mA (+18 dBm)
+18 dBm
802.11 b/g/n
PCB/W.FL
10 μA
N/a
N/a
64 mA
246 mA (+18 dBm)
0 dBm to +18 dBm
ATWINC1500-XSTK
802.11 b/g/n
PCB/ U.FL
<4 μA
380 μA
N/a
80 mA
312 mA (+20 dBm)
20 dBm
ATSAMW25
802.11 b/g/n
PCB/ U.FL
<4 μA
380 μA
N/a
80 mA
312 mA (+20 dBm)
20 dBm
9
Wireless mobile devices and broadband connectivity are becoming more embedded than ever in society
and business around the world, and are key drivers of trends such as mobile payments, video streaming,
and the Internet of Things (IoT). The number of connected devices continues to grow as the use of mobile
technology and smart devices grows exponentially.
Machine-to-machine (M2M) technology is also
expected to change the way we do business.
It will also increase productivity and efficiency
while remaking monitoring and measurement
applications, quality control, decision-making,
customer relationship management and more.
Molex has extensive mechanical and RF design
experience in all frequency bands used by wireless
services.
WIRELESS MODULE INTERCONNECT SOLUTIONS
MCX RF CONNECTORS
The MCX RF connectors are designed for use in any wire-to-board application where quick and easy
snap-on mating is needed. Available in 50 and 75 Ohm and frequencies up to 6 GHz, the MCX subminiature
snap-on connectors offer a stable and durable connection. The subminiature design allows other electronic
assemblies to be densely packaged on the PCB. MCX connectors are approximately 30% smaller than SMB
connectors, and are available in both 50 and 75 Ohm versions and provide good electrical performance to
6 GHz. These connectors are used in telecommunications systems as well as wireless and GPS applications.
For medical MRI applications, non-magnetic versions are available. Molex also provides multi-port MCX
connectors for coplanar board-to-board and cable-to-board applications.
FAKRA II SMB CONNECTOR SYSTEM
FAKRA II SMB connectors, with 360° rotation and secondary locking latch deliver easy cable routing
between antennas and multi-media units while meeting the USCAR requirements for on-board telematics
systems. Molex’s FAKRA II SMB product offering meets both American USCAR and German FAKRA
automotive standards. The FAKRA II SMB connector system retains the high-performing, cost-effective RF
attributes as the original FAKRA connector series. The enhanced features offered by the FAKRA II connector
system demonstrate Molex’s dedication to meet the continued mechanical and environmental requirements
of the automotive industry.
10
MOLEX HIGH-PERFORMANCE STANDARD ANTENNA SOLUTIONS
MULTI-BAND CELLULAR AND COMBO CELLULAR/WI-FI® FLEXIBLE ANTENNAS WITH
BALANCED TRANSMISSION ADVANCED FLEXIBLE ANTENNA TECHNOLOGY
Combine extended cellular coverage with Wi-Fi capabilities for better connectivity and faster wirelessdevice processing. This balanced combo antenna with ground-plane independent design, reduces
engineering resources and costs needed to mitigate PCB ground-induced radiation. High radiation
efficiencies support high-performance RF application needs. Poly-flexible, double-sided adhesive tape on
antenna enables easy peel-and-stick mounting anywhere within the device casing.
2.4 GHZ SURFACE MOUNT DEVICE (SMD) ON-GROUND ANTENNA
Developed with the power and precision of Laser Direct Structuring (LDS) technology, Molex’s 2.4 GHz SMD
on-ground antenna is the smallest on-ground MID (Molded Interconnect Device) antenna in the market.
The lightweight Molded Interconnect Device (MID) chip antenna weighs only 0.03g and is used in portable
electronic devices based on Bluetooth®, Wi-Fi®, ZigBee® and other wireless standards. Measuring only
3.00mm by 3.00mm by 4.00mm (0.118" by 0.118" by 0.157") and used on one side of the PCB, the antenna
allows board makers to realize significant PCB real estate savings by leaving the ground layers in the PCB
intact while freeing up space on the reverse side of the PCB for other component assemblies.
2.4/5GHZ WI-FI® FLEXIBLE ANTENNA WITH BALANCED TRANSMISSION, ROHSCOMPLIANT, HALOGEN-FREE
Dual-band transmission-balanced antennas combine ground-plane independence with high-radiation
efficiency for better connectivity and faster wireless device processing. Balanced antenna with groundplane independent design reduces engineering resources and costs needed to mitigate PCB groundinduced radiation. High radiation efficiency with 34.90 by 9.00 mm strip antenna offers total efficiency
values of 75% minimum in the 2.4GHz band and 70% minimum in the 5GHz band. Poly-flexible, doublesided adhesive tape on antenna enables easy peel-and-stick mounting anywhere within the device casing.
ONLINE PRODUCT DESIGN TOOLS
MOLEX RF CABLE ASSEMBLY CONFIGURATOR
The RF Cable Assembly Configurator allows users to have the flexibility to select from many requirements.
A multitude of RF connector interface types and styles are available. If specific interface or cable types
are not known, your electrical and mechanical needs, which are also allowed to be purposed within the
Configurator, will be addressed by Molex’s engineers and the correct connectors and cable types will be
suggested for your specific application. By selecting from this list, you can choose the specific layout that
you need, speeding up your design process and, in turn, bringing products to market faster.
11
ON Semiconductor's sub-1 GHz family of devices provides easy entry to high-performance wireless
connectivity. ON Semiconductor RF products are designed to provide maximum performance and ultralow power consumption for every major wireless sub-1 GHz standard, as well as proprietary wireless
solutions. These solutions combine RF and baseband components, ultra-low-power micro-controller
technology, and support for high-performance firmware stacks to provide single chip solutions.
RF TRANSCEIVERS, TRANSMITTERS, AND RECEIVERS
ON Semiconductor provides a wide range of sub-1 GHz RF transceivers, receivers, and transmitters covering
multiple standards including Sigfox, KNX, Wireless M-Bus, and EnOcean, as well as proprietary solutions. ON
Semiconductor transceivers are known for high efficiency and excellent sensitivity in the range of -110 dBm
to -126 dBm for 1.2 kbps (narrow-band or general-purpose).
AX5043:
ULTRA-LOW POWER RF TRANSCEIVER FOR 27-1050 MHZ FREQUENCY BANDS
The AX5043 is a true single chip, narrow-band, ultra-low-power ASK and FSK RF transceiver for the 27 MHz
to 1050 MHz frequency bands. It offers the unique combination of ultra-low power consumption for transmit and receive operation combined with highest sensitivity and high selectivity. A link budget of 143 dB
at 1 kbps is achieved, if the built-in forward error correction (FEC) is used this can be extended to 146 dB
without additional external components. The AX5043 operates down to 1 kbps in a 6.25 kHz channel.
The AX5043 supports FSK, MSK, 4-FSK, GFSK, GMSK, AFSK and ASK modulations. In transmit mode,
all modulations are shaped. For FSK Gaussian filters with BT=0.3 or BT=0.5 are available to meet the
most stringent regulatory requirements. Power ramping can be configured without restrictions.
Maximum output power level is 16 dBm.
12
RF MICROCONTROLLERS AND SOCS
In addition to leading-edge RF transceiver technology, ON Semiconductor offers fully integrated systemon-chip (SoC) solutions to support the implementation of wireless networks with a minimal number of
components. These solutions combine the superb performance of ON Semiconductor wireless transceivers
with an ultra-low-power micro-controller core with 64 kByte Flash, 8.25 kByte RAM, and sleep current
consumption of 500-1500 nA.
AX8052F143:
ULTRA-LOW POWER RF TRANSCEIVER FOR 27-1050 MHZ FREQUENCY BANDS
The AX8052F143 is a one chip solution compatible with many standard applications in the Internet of
Things. A sensitivity of -126 dBm at 868 MHz and 1.2 kbps with a current consumption of only 9.5 mA make
the AX8052F143 an outstanding device in its field. Frequency range support from 27 MHz to 1050 MHz,
low phase noise, and a high efficiency 16 dBm transmitter allows this RF-microcontroller to be the ideal
device for many applications including automatic meter reading and security. The average 4.5 µA dutycycle receive current is just one of the many outstanding parameters.
The AX8052F143 microcontroller core executes the industry standard 8052 instruction set.
The system clock can be programmed freely from DC to 20 MHz. As instructions are executed in a single
cycle, the core can deliver 20 MIPS. A 64 kByte flash memory is provided, allowing the programming of
applications in C. A fully associative cache and a pre-fetch controller hide the latency of the flash memory.
The AX8052F143 features a dual channel DMA engine that can transfer data to and from XRAM
to any peripheral on chip. A dedicated AES engine with its own DMA engine is provided for encryption.
Further peripherals include three general purpose timers with optional sigma-delta output mode.
The timers can be used as baud rate generators for the two UARTs. A master/slave SPI inter-face is
provided. A 10-bit, 500 kSample/s ADC with flexible input modes, as well as comparators allow to interface
with analog data streams.
AX-SIGFOX & AX-SIGFOX-API: ULTRA-LOW POWER SIGFOX COMPLIANT SOCS
In the Internet of Things, the demand for nationwide coverage and ultra−low power consumption for small
amounts of data cannot be addressed by established standards such as GPRS or LTE. This void is now filled
by Sigfox, the ultra−low power cellular connectivity solution. It combines a low cost and simple approach
together with ultra−low power consumption.
AX−Sigfox is a single chip solution for a node on the Sigfox network with both up− and down−link
functionality. The AX−Sigfox chip is delivered fully ready for operation and contains all the necessary
firmware to transmit and receive data from the Sigfox network. It connects to the customer product
using a logic level RS232 UART. AT commands are used to send frame and configure radio parameters.
AX−Sigfox−API is not delivered with any firmware and requires the purchase of the Sigfox protocol library.
This version is ideal for customers who do not want another microcontroller in their product and
prefer to implement product functionality on the AX−Sigfox−API chip. AX−Sigfox−API is Sigfox ready
certified for end products.
13
TDK simplifies your choice by breaking through the decision maze with superior product and application
guidance. EPCOS SAW devices are an ideal match for every wireless RF application.
SAW FILTERS FOR WIRELESS CONNECTIVITY APPLICATIONS
Surface Acoustic Wave (SAW) filters provide a filtering function for RF signals at defined frequencies.
By using SAW filters, interferers can be suppressed and the sensitivity and reliability of receivers can be
enhanced. In transmitting systems, for example, SAW filters provide suppression of unwanted emissions
and help fulfill international standards such as FCC or ETSI.
EPCOS brand RF / SAW filters provide a large breadth of devices, including sub GHz ISM, 2.4GHz,
and cellular, telematics and IoT discrete filters, duplexers, and modules.
WIRELESS CONNECTIVITY PORTFOLIO
Classic connectivity applications include 2.4GHz Wireless Local Area Network (WLAN), Bluetooth®/BLE, and
ZigBee®. TDK offers a wide portfolio of 2.4GHz filters, including filters to assure LTE co-existence (e.g. Band
7, Bands 40/41).
Sub GHz connectivity applications are growing, especially in the IoT market. Application standards include
Z-Wave, Zigbee, HaLOW, (sub GHZ WLAN), and LPWAN solutions such as LoRa® and SIGFOX. As these
are geared for the industrial and automotive markets, components are required to operate at extended
temperature and for automotive they are required to be AEC-Q200 compliant. EPCOS has the largest
industrial grade temperature and AEC-Q200 qualified SAW and BAW filter portfolio in the industry!
BAW RF filter for Bluetooth/WLAN with LTE Co-­‐existence.
Magnitude (dB)
BAW RF FILTER FOR BLUETOOTH®/WLAN WITH LTE CO-EXISTENCE
Frequency (MHz)
14
EPCOS SAW DEVICES BY TDK
Wireless Connectivity
Spectrum
Part Number
Ordering Code
Package Size (mm)
Feature
B9604
B39242B9604P810
1.4 x 1.1
Industry Standard with LTE B7, B40,
B41 co-existence
B8328
B39242B8328P810
1.4 x 1.1
Low insertion loss
B8852
B39242B88524P810
1.1 x 0.9
High Attenuation in B40
B4346
B39242B4346P810
1.4 x 1.1
Automotive grade with LTE B7, B40,
B41 co-existence
B9634
B39242B9634P810
1.4 x 1.1
Industrial grade with LTE B7, B40,
B41 co-existence
B3912
B39242B3912U410
3.0 x 3.0
Automotive grade
B3440
B39871B3440U410
3.0 x 3.0
Industry Standard with LTE suppression
B3725
B39871B3725U410
3.0 x 3.0
Industry Standard with high nearby suppression
B4316
B39871B4316P810
1.4 x 1.1
Industry Standard / small size with low loss
B3588
B39921B3588U410
3.0 x 3.0
Industry Standard with high ultimate rejection
B3728
B39921B3728U410
3.0 x 3.0
Industry Standard with low loss
B4301
B39921B4301F210
1.4 x 1.1
Industry Standard / small size with low loss
2.4GHz WLAN/BT
Sub GHz
(869MHz)
Sub GHz
(915MHz)
15
Texas Instruments (TI), is committed to delivering a broad portfolio of wireless connectivity solutions which
consume the lowest power and are the easiest to use. Ranging from certified modules to easy to design
with QFN package ICs, with TI innovation supporting your designs you can share, monitor and manage data
wirelessly for applications in wearable devices, home and building automation, manufacturing, smart cities,
healthcare and automotive.
HIGH PERFORMANCE WI-FI® (WILINK WI-FI) MODULES
The TI WiLink™ 8 FCC/IC/ETSI/ Telec certified module family enables manufacturers to easily add
fully integrated 2.4 and 5-GHz versions of Wi-Fi and dual-mode Bluetooth® 4.0 solutions to embedded
applications such as industrial, home and building automation, audio and wearables. Offers high
throughput, robust Bluetooth and TI ZigBee coexistence mechanism, and now Wi-Fi Mesh for greater
network coverage.
WL1801MOD - WiLink™ 8 – Single band 2.4 GHz, Wi-Fi only module
WL1835MOD - WiLink™ 8 – Single band 2.4 GHz combo 2x2 MIMO Wi-Fi,
Bluetooth & Bluetooth Smart module
WL1837MOD - WiLink™ 8 – Industrial dual band, 2.4 GHz + 5 GHz 2x2 MIMO Wi-Fi,
Bluetooth & Bluetooth Smart module
EMBEDDED WI-FI® (SIMPLELINK WI-FI) MODULES
TI makes connectivity even easier with the next-generation SimpleLink Wi-Fi solutions. The product family
features Internet-on-a-chip™, Wi-Fi CERTIFIED™ solutions solving industry challenges for broad embedded
applications. With SimpleLink CC3100 and CC3200 pin-to-pin compatible solutions you can:
-- Add Wi-Fi to any MCU very easily or program applications on the industry’s
first Internet-on-a- chip solution with dedicated MCU
-- Add Wi-Fi to battery-operated designs for more than a year on two AA batteries
-- Start quickly, no Wi-Fi experience needed
CC3100MOD – Add Wi-Fi to your application: SimpleLink™ Wi-Fi and Internet-of-Things solution
connecting easily to your MCU.
CC3200 – A Single-Chip Wireless MCU, SimpleLink™ Wi-Fi and Internet-of-Things solution.
BLUETOOTH® DUAL-MODE MODULE
TI’s dual-mode Bluetooth module transceiver (classic and BLE on one single device) is Bluetooth 4.1
certified (FCC, IC and CE) and Bluetooth 4.1 controller subsystem qualified (QDID 64631), compliant up to
the HCI Layer, providing a fast and easy installation. Bluetooth software is delivered and supported by
Texas Instruments. Easily connects to TI micro-controller including ultra-low power MSP432. Additional
support available for STM32F4 MCUs.
CC2564MODA – Certified Dual-mode Bluetooth module with integrated antenna
16
BLUETOOTH® LOW ENERGY (BLE) SOLUTIONS
TI offers a large choice of easy to use wireless MCU for BLE. Portfolio delivers Lowest power, longest range
and most integrated across easy to design with QFN package ICs and certified modules.
CC2640 – SimpleLink ultra-low power BLE wireless MCU (pin to pin and SW compatible with Sub-1 GHz
CC1310)
CC2540 – BLE + USB Interface Wireless MCU
CC2540T – Extreme temperature BLE (+125 degree Celsius) Wireless MCU
CC2541-Q1 – Automotive qualified BLE Wireless MCU
SUB 1-GHZ
When range matters, combined with ultra-low power and robustness, Sub-1 GHz ISM bands technology is a
perfect fit. With the new generation SimpleLink CC1310 ultra-low power wireless MCU, TI delivers 20km on
a coin cell battery. CC1310 is the most integrated solution with ARM® Cortex®-M3 MCU and RF in a 4x4 mm
WFN single chip.
CC1310 – SimpleLink ultra-low power Sub-1 GHz wireless MCU (pin to pin and SW compatible with 2.4GHz
CC26xx)
C1120 – Narrowband performance line transceiver, SigFox support
CC1200 – 802.15.4g performance line transceiver
CC1125 – Ultra narrowband performance line transceiver
MULTI-PROTOCOL
TI SimpleLink Ultra-low power wireless MCU platform offers a unique pin to pin and SW compatibility
between 2.GHz and Sub-1 GHz enabling developers to leverage their investment and address more markets
quicker.
In addition, developers can leverage the platform flexibility with multi-protocol solutions.
CC2650 – One Hardware, 6 different technologies with SW change: 2.4GHz SimpleLink ultra-low power
wireless MCU supporting BLE, ZigBee®, 6LowPan, RF4CE and 2.GHz proprietary
CC1350 – SimpleLink ultra-low power wireless MCU – BLE + Sub-1 GHz on one single chip
NEAR FIELD COMMUNICATION (NFC)
Texas Instruments provides one of the industry’s largest, most differentiated NFC product portfolios
enabling lower power solutions to meet a broad range of RF connectivity needs.
-- TRF7970A Multi-Protocol Fully Integrated 13.56-MHz NFC / RFID Transceiver IC – TRF79
-- RF430CL33xH: Dynamic NFC Interface Transponder for Large File Transfer
-- RF37S114 Tag-it-HF-I Type 5 NFC, ISO15693 Transponder, 4mm x 4mm
-- RF430FRL154H: NFC ISO15693 Sensor Transponder with SPI/I2C Interface
17
Kits, Tools &
Reference Designs
TIWICONNECT™ IOT PLATFORM
PART NUMBER: 450-0143 (TIWICONNECT™ WI-FI® DEV KIT)
LSR introduces the TiWiConnect™ cloud connectivity platform, the first true end-to-end IoT solution for
wirelessly connecting products to the cloud. This IoT platform enables smartphone apps and web portals
that can re-define the product experience for both your customers and service professionals alike.
TiWiConnect simplifies your product development efforts by providing all 3 components of a
comprehensive solution, all built from the ground up to connect seamlessly: Embedded wireless modules,
cloud platform and apps. This Development kit features a lifetime developers account for the TiWiConnect
cloud, allowing you to begin sending and receiving data between kit and the cloud in under 5 minutes.
STERLING-LWB WI-FI® + BLUETOOTH® DEVELOPMENT KIT
PART NUMBER: 450-0155 (WITH U.FL),
450-0156 (WITH CHIP ANTENNA)
The Sterling-LWB development kit features a convenient SD Card form factor
for convenience compatibility with a variety of Microprocessor development
platforms, such as NXP/Freescale i.MX6. Full driver support for Linux, along
with step-by-step user guides, dramatically simplifies adding a powerful Wi-Fi
module to your Linux-based development project.
BT900 DUAL-MODE BLUETOOTH® DEVELOPMENT KIT
PART NUMBER: DVK-BT900-SA (WITH INTERNAL ANTENNA),
DVK-BT900-SC (WITH U.FL CONNECTOR)
The BT900 Development Kit offers a complete out of the box experience – no
additional components needed! Just unbox, plug in and test BT/BLE operation
in minutes!
A Quick Start Guide and the Laird Toolkit mobile app make it simple to begin
interfacing with your BT900 kit right from your smart device. Comprehensive
documentation and development tools make it easy to begin utilizing the
smartBASIC programming language for the BT900, as well.
20
SABLE-X BLE DEVELOPMENT KIT
PART NUMBER: 450-0150
LSR’s Development Kit for the SaBLE-x Bluetooth® Smart module will provide
you with a fast out-of-the-box experience with all the hardware you need,
including adapter boards for development with TI or Arduino platforms.
A simplified evaluation kit version is also available
Along with the Development Kit hardware, BLE developers can utilize LSR’s
Developer Tool Suite software. This suite of developer tools simplifies the work
to integrate the SaBLE-x module with your host MCU through LSR’s exclusive
Serial-to-BLE API and Source Code, along with Boot Loader. Furthermore,
the companion mobile app, ModuleLink for BLE, works seamlessly with the
SaBLE-x Dev Board so you can range-test and test communications with
any iOS or Android device.
RM1XX LORA®+ BLE DEVELOPMENT KIT
PART NUMBER: DVK-RM191-SM (915 MHZ LORA® FOR US
CANADA), DVK-RM186-SM (868 MHZ LORA FOR EUROPE)
The Laird DVK-RM1xx development kit provides a platform for rapid wireless
connectivity prototyping, providing multiple options for the development of
LoRa® and Bluetooth® Low Energy (BLE) applications. The kit, which features
connectivity with Arduino-style shields, also features Laird’s innovative event
driven programming language – smartBASIC, along with comprehensive sample
service code libraries, videos, application notes, and more.
21
LORA® TECHNOLOGY EVALUATION KIT – 915 MHZ
PART NUMBER: DV164140-2
The LoRa® Network Evaluation Kit makes it easy for customers to test LoRa® technology, range and
data rate. The full-featured gateway board includes an LCD screen, SD Card for Config Data, Ethernet
connection, 915 MHz antenna, and full-band capture radios. The Gateway evaluation kit also includes
two RN2903 Mote boards (Part # DM164139).
The gateway uses a local version of the LoRaWAN™ network server running under Windows so it does not
need an external network connection. This creates a self-contained demo network that makes testing the
LoRa® network quick and easy.
915 MHZ RN2903 LORA® TECHNOLOGY MOTE
PART NUMBER: DM164139
The RN2903 LoRa® Mote is a LoRaWAN™ Class A end-device based on the RN2903 LoRa® modem. As a
standalone battery-powered node, the Mote provides a convenient platform to quickly demonstrate the
long-range capabilities of the modem, as well as to verify inter-operability when connecting to LoRaWAN™
v1.0 compliant gateways and infrastructure.
The Mote includes light and temperature sensors to generate data, which are transmitted either on a fixed
schedule or initiated by a button-press. An OLED display provides feedback on connection status, sensor
values and downlink data or acknowledgments. A standard USB interface is provided for connection to a
host computer, providing a bridge to the UART interface of the RN2903 modem. As with all Microchip RN
family of products, this enables rapid setup and control of the on-board LoRaWAN™ protocol stack using
the high level ASCII command set.
RN2903 LORA® TECHNOLOGY PICTAIL™/PICTAIL PLUS DAUGHTER BOARD
PART NUMBER: RN-2903-PICTAIL
The RN2903 LoRa® Technology PICtail™/PICtail Plus Daughter Board is a development board that
showcases the Microchip RN2903 Low-Power Long Range, LoRa® Technology Transceiver Module.
This versatile development board has PICtail™ and PICtail Plus interfaces for connecting to Microchip's
PIC18 Explorer board or Explorer 16 board. It also has an on-board USB to UART bridge for easy
development with a PC.
The PICtail™ board also has an on-board PIC18 MCU available for custom user functions. It is preprogrammed to provide a simple USB-to-UART serial bridge enabling easy serial connection. Demonstration
of the RN2903 is performed by plugging the daughter board into a USB port of a PC. The USB port powers
the daughter board and enables the user to communicate using the RN2903’s simple ASCII command
interface.
22
RN1810 WI-FI® PICTAIL™ / PICTAIL PLUS
PART NUMBER: RN-1810-PICTAIL
Based on Microchip's new low power IEEE 802.11b/g/n Wi-Fi module the RN1810, the RN1810 PICtail™/
PICtail Plus Daughter Board allows customers to easily develop Wi-Fi applications using Microchip’s 8,
16 and 32-bit PIC® microcontrollers. The kit includes a fully integrated TCP/IP stack allowing for a simple
serial to Wi-Fi connection to the microcontroller.
The board features an on-board USB to UART bridge for easy plug-and-play development with a PC. The
board is also compatible with the Explorer 16 Development Board (DM240001), PICDEM.net2 Development
Board (DM163024) and PIC32 Starter Kit (DM320001) with I/O Expansion Board (DM320002).
WINC1500 EVALUATION BOARD
PART NUMBER: ATWINC1500-XPRO
Microchip's ATWINC1500-XPRO is an extension board to the Xplained Pro evaluation platform.
The ATWINC1500-XPRO extension board allows you to evaluate the WINC1500 low cost, low power 802.11
b/g/n Wi-Fi® network controller module. Supported by the Atmel Studio integrated development platform,
the kit provides easy access to the features of the WINC1500 and explains how to integrate the device
in a custom design.
RN4870 BLUETOOTH® LOW ENERGY PICTAIL™/ PICTAIL PLUS
PART NUMBER: RN-4870-SNSR
The RN-4870-SNSR is a development board based on the ultra-compact Bluetooth 4.2 Low Energy RN4870
module. The RN4870 uses a simple ASCII command interface over the UART. The board enables evaluation
of the RN4870 and development of Bluetooth low Energy applications in two different ways:
-- Out of the box: When plugged into the USB port of a PC, the board will enumerate as a Communication
Device Class (CDC) Serial device. Through a terminal program, users can configure and control the
module and transfer data using the easy to use provided command set.
-- As a PICtail™/PICtail Plus, the board interfaces to Explorer 8 or Explorer 16 Development Board.
The Explorer 8/16 modular development system works with one of hundreds of available PIC 8, 16,
32 bit Microcontrollers PIM (Plug-In-Modules). The PICtail™ bridges the host MCU UART to the RN4870's
UART interface for data transfer or configuration using the straight-forward, easy-to-use ASCII style
command set. 23
ON Semiconductor’s comprehensive suite of development kits simplifies the entry into wireless solutions.
Development kits are supported by a suite of software tools consisting of code generators for full
RF application C-code and an integrated development environment which comes with a source code
debugger and C-compiler.
DVK-BASE-2-GEVK: DEVELOPMENT KIT FOR RF TRANSCEIVERS
OVERVIEW
The DVK-BASE-2-GEVK features the AX8052F100 ultra-low-power microcontroller on the main boards,
allowing developers using ON Semiconductor’s radio chips and microcontrollers to design, program, and
evaluate their applications under real world conditions. A range of RF-modules with different RF ICs for
various carrier frequencies are available as add-on kits.
HARDWARE
The DVK-2 hardware is designed to demonstrate the features of the AX8052F100 and ON Semiconductor
RF-ICs. The ultra-low-power micro-controller can be used in all operating modes including low clock
speeds and sleep modes. A pair of main boards together with an RF add-on is the perfect base to evaluate
and develop RF systems. All RF-modules are matched to 50 Ω and are equipped with SMA connectors that
can either be used with antennas or connected to laboratory equipment.
-- ADD5043-169-2-GEVK: 169 MHz Add-on kit for DVK-2 Evaluation Kit
-- ADD5043-433-2-GEVK: 433 MHz Add-on kit for DVK-2 Evaluation Kit
-- ADD5043-868-2-GEVK: 868/915 MHz Add-on kit for DVK-2 Evaluation Kit
SOFTWARE
The DVK-2 comes with a productivity enhancing IDE and C-compiler. The AXCode::Blocks integrated
development environment (IDE) is a complete tool suite that supports development and debugging of C and
assembler code for ON Semiconductor microcontrollers. Its intuitive GUI provides an environment that
accelerates the development cycle. The tabbed interface with code highlighting and folding helps to keep
overview, while code completion, smart indent and a class browser help to speedup code generation.
CODE GENERATORS
The AX-RadioLab code generator creates fully functional sample code for a variety of applications.
C-COMPILER
A full featured C-compiler is available for free download at www.onsemi.com, allowing the developer to
begin immediately. The included optimizer can be flexibly configured for speed or code size.
DEBUG LINK
The debug link features not only unlimited break-points, but also a UART style terminal link. This UART link
can be used together with AXCode::Blocks for debugging without extra hardware effort.
24
F143-MINI-2-GEVK: MINIATURE DEVELOPMENT KIT FOR THE AX8052F143 RF SOC
OVERVIEW
The F143-MINI-2-GEVK is ON Semiconductor’s miniaturized development kit for the designer starting
out with the AX8052F143 SoC RF SoC. Kit hardware consists of a USB debugging adapter and a pair of RF
modules (F143-Mini-A-MOD and F143-Mini-B-MOD modules) and includes all software necessary to develop
systems in shortest times. The modules have a tiny footprint of just 33 x 15 mm2. One module comes with a
chip antenna the other is equipped with an SMA connector.
HARDWARE
The F143-Mini-A-MOD module is equipped with an SMA connector that may be used either to connect a
50 Ω whip antenna or measurement equipment. This module does not allow for batteries to be connected
but can be powered via the debug adapter. The F143-Mini-B-MOD module is equipped with two 1.5 V LR44
batteries and a chip antenna. It can be powered either by the batteries or the debug adapter. The PCB
section containing the battery clips can be broken away if not used, resulting in a module equal in size to
the F143- Mini-A-MOD. Modules are designed for use at a carrier frequency of 868.3 MHz.
SOFTWARE
The F143-MINI-2-GEVK is fully compatible with the DVK-2 and ON Semiconductor’s AX8052 development
software environment. The software comes with a productivity enhancing IDE and C-compiler. The
AXCode::Blocks integrated development environment (IDE) is a complete tool suite that supports
development and debugging of C and assembler code for ON Semiconductor microcontrollers. Its intuitive
GUI provides an environment that accelerates the development cycle. The tabbed interface with code
highlighting and folding helps to keep overview, while code completion, smart indent and a class browser
help to speed-up code generation.
DVK-SFEU-1-GEVK: SIGFOX DEVELOPMENT KIT
The Sigfox DVK (DVK-SFEU -1-GEVK) is a miniaturized development kit for the designer starting out with
the AX-SIGFOX chip, a ultra-low power high performance Sigfox SoC for up-link and downlink. The Sigfox
DVK hardware consists of a USB debug adapter and an RF module and includes all software necessary to
develop systems in shortest times. The module has a tiny footprint of just 33 x 15 mm2, and is equipped
with an SMA connector. The Sigfox DVK enables instant testing via AT commands for ON Semiconductor’s
single chip solution for a node on the Sigfox network.
25
HIGH PERFORMANCE WI-FI® (WILINK WI-FI) MODULES
WL1837MODCOM8I: WILINK™ 8 DUAL BAND 2.4 & 5 GHZ WI-FI® + BLUETOOTH®
COM8 EVALUATION MODULE
The WL1837MODCOM8I, which is compatible with many processors including TI’s Sitara™ processors, easily
enables customers to add both Wi-Fi® and Bluetooth® to home and building automation, smart energy,
gateways, wireless audio, enterprise, wearable devices and many more industrial and Internet of Things (IoT)
applications.
WL18XXCOM82SDMMC
The WiLink SDIO board is a SDMMC adapter board and is an easy to use connector between a WiLink COM8
Evaluation module like the WL1837MODCOM8i and a generic SD/MMC card slot on a host processor EVM.
EMBEDDED WI-FI® (SIMPLELINK WI-FI) MODULES
CC3200MODLAUNCHXL
The SimpleLink™ Wi-Fi® CC3200MOD LaunchPad (with certified module) is an evaluation development
platform for the CC3200 wireless microcontroller (MCU), the industry’s first single-chip programmable MCU
with built-in Wi-Fi connectivity. The board features on-board emulation using FTDI and includes sensors for
a full out-of-the-box experience. This board can be directly connected to a PC for use with development
tools such as CCS and IAR.
BLUETOOTH® DUAL MODE MODULE
CC2564MODAEM
For a complete evaluation solution, the CC2564MODAEM board plugs directly into TI hardware development
kits, including MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C123G, and DK-TM4C129X. Moreover,
a certified and royalty-free TI Bluetooth Stack (TIBLUETOOTHSTACK-SDK) is available for the MSP430
and TM4C12x MCUs. Additional royalty-free SW (CC256XSTBTBLESW) works directly with the hardware
development kit STM3240G-EVAL when combined with the CC256XEM-STADAPT adapter board.
BLUETOOTH® LOW ENERGY (BLE) SOLUTIONS/2.4GHZ MULTI-PROTOCOL
LAUNCHXL-CC2650 WIRELESS MCU LAUNCHPAD™ KIT
The CC2650 LaunchPad kit brings easy Bluetooth® Smart connectivity to the LaunchPad kit ecosystem
with the SimpleLink ultra-low power CC26xx family of devices. This LaunchPad kit also supports
development for multi-protocol support for the SimpleLink multi-standard CC2650 wireless MCU and
the rest of CC26xx family of products: CC2630 wireless MCU for ZigBee®/6LoWPAN and CC2640
wireless MCU for Bluetooth® Smart.
26
CC2650STK - SIMPLELINK™ BLUETOOTH SMART®/MULTI-STANDARD SENSORTAG
The SensorTag IoT kit invites you to realize your cloud-connected product idea. The new SensorTag
connects 10 low-power MEMS sensors to the cloud with Bluetooth Smart and get your sensor
data online in 3 minutes. The SensorTag is ready to use right out the box with an iOS and Android app,
with no programming experience required to get started. SensorTag can be enabled with ZigBee®/
6LoWPAN technology.
SUB-1 GHZ
LAUNCHXL-CC1310: SIMPLELINK™ SUB-1 GHZ WIRELESS MICROCONTROLLER (MCU)
LAUNCHPAD™ DEVELOPMENT KIT
The SimpleLink™ Sub-1 GHz CC1310 wireless microcontroller (MCU) LaunchPad™ development kit is the
first LaunchPad kit with a Sub-1 GHz radio, which offers long-range connectivity, combined with a 32-bit
ARM® Cortex®-M3 processor on a single chip.
TIDC-SIGFOX-CC1120-CC1190-BP
The Sub-1 GHz CC1120-CC1190 BoosterPack™ for the SIGFOX network is a certified hardware design to
enable users to connect to the SIGFOX Low Power Wireless Area Network (LPWAN) platform targeted for
the Internet of Things (IoT) market.
NEAR FIELD COMMUNICATION (NFC)
NFCLINK LAUNCHPAD EVALUATION KIT BUNDLE
This bundled solution contains the DLP Design NFC/RFID BoosterPack (DLP-7970ABP) which is an add-on
board designed to fit all of TI’s MCU LaunchPads and the MSP-EXP430F5529LP LaunchPad. This bundle
allows the software application developer to get familiar with the functionalities of TRF7970A NFC
transceiver IC without having to worry about developing the RF section and the NFCLink software firmware
library enables developers to quickly and easily create NFC applications in all three operating modes
reader/writer, card emulation and peer-to-peer for the TRF7970A NFC transceiver. Bundle also exists
for MSP430G2x and 32-bit Cortex MSP432.
ALL-IN-ONE NFC EVALUATION KIT
For evaluating the complete NFC solution with Dynamic NFC Transponder Interface, NFC Transceiver IC
and NFCLink software, the all-in-one NFC Evaluation Kit, contains the TRF7970ATB Target Board, the MSPEXP430F5529 USB Experimenter's Board, RF430CL330HTB Target Board and the MSP-EXP430FR5739
Experimenter Board.
27
Wireless Services & Support
DESIGN CHAIN SERVICES®
Avnet offers engineers a host of services from any point
in the design cycle from concept to architectural design to
new product introduction and on through next generation
modification or end-of-life. Avnet has the technical products,
services and tools to accelerate design cycles — including ASIC
and programmable logic engineering services, IP cores and
more. With offerings that run the gamut from Web seminars to
connector assembly, Avnet offers it all.
Assembly and Programming
- Commercial and military interconnect assembly
- Custom cable assembly
- Device programming
- Motor modification
- ElectroAir™ avionic components
- Power supply modification
- Thermal management
Design Tools
- Design Resource Center
- Development and evaluation kits
- Embedded OS solutions
- IP cores
Engineering Services
- ASIC design/FPGA design
- Systems design
- Design service partners
SUPPLY CHAIN SERVICES®
Avnet optimizes supply chains by providing end-to-end supply
chain services to electronic original equipment manufacturers
(EOEMs), Electronic Manufacturing Services (EMS) providers
and electronic component manufacturers. By combining internal
competencies of global warehousing and logistics, finance,
information technology and asset management with objective,
external industry-wide data, Avnet’s supply chain services
allow customers to increase their overall business knowledge —
enabling more informed decisions.
Component Intelligence
- Bill of material (BOM) analysis
- Inventory optimization services
- Green initiative programs
Supply Chain Assessment
- Discovery and logistical analysis
- Financial analysis
- Project implementation
Inventory Management Solutions
- Bonded inventory programs
- EDI Point-of-Use Replenishment Systems (POURS)
- Vendor-managed inventory
- In-plant stores
- New product introduction (NPI) program support
- Pipeline inventory from forecasts
- Inventory ownership programs
Technical Education
- SpeedWay Design Workshops™
- On-Ramp Technical Sessions™
- Seminars/Webinars
Copyright © 2017 Avnet. All other brands are the property of their respective owners. 1485r201703
Avnet
2211 S 47th Street
Phoenix, AZ 85034
1-800-332-8638
avnet.com
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