Computer-On
Computer-On-Module
COM Express
Modules
Mini
Compact
Basic
Carrier Board
Qseven
Modules
Carrier Board
Revision Control • Long Product Life Cycle
Form Factor
Computer-On-Module Product Reference
Mini
84 mm x 55 mm
Qseven
70 mm x 70 mm
COM Express Mini
Compact
95 mm x 95 mm
Type
R2.1, Type 10
Model
BT9A3
CD9A3
COM Express Compact
Basic
125 mm x 95 mm
Type
Model
R2.1, Type 6
R2.0, Type 2
R1.0, Type 2
HU968
CD905-B
CP908-B
CR908-B
OT905-B
HR908-B
BT968
KB968
Basic
t
ompac
95
C
70
55
COM Express Basic
Type
Model
Qseven Mini
R2.1, Type 6
HM961-QM87
R2.1, Type 2
HM920-QM87
R1.0, Type 2
HR900-B
CP900-B
HM960-QM87
HM920-HM86
HM961-HM86
CR902-B
HM960-HM86
CR900-B
CR960-QM77
CR902-BL
CR901-B
HR902-B
CR960-HM76
HR902-BL
CM960-B
CM901-B
Qseven
Type
0
Model
R2.0
R1.2
R1.1
BT700
FS700
QB700-B
QB702-B
QB701-B
0
www.dfi.com
70
84 95
125
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Computer-On-Module Thermal Solution
Computer-On-Module Thermal Solution
Cooling option
Heat
Heat
Heat
Heat
COM Express Compact
spreader
sink
sink + fan
spreader + heat sink + fan
Model name
Heat spreader
Heat sink
HU968
Thermal Test
Uses thermal probe to measure each component in order to determine the actual
temperature of each component
Heat sink with fan
Heat spreader with heat
sink and fan
●
●
CR908-B
●
●
●
HR908-B
●
●
●
CP908-B
●
●
●
BT968
Support and Services
CD905-B Series
Provides 3D illustrations of custom thermal solution design
Provides MTBF and MTTF based on thermal test results
Thermal simulation of customized heat sink
KB968
OT905-B Series
●
●
●
●
●
●
●
●
●
Heat sink with fan
Heat spreader with
heat sink and fan
COM Express Basic
Heat sink
Heat spreader with
heat sink and fan
Heat sink with fan
Qseven
Model name
Heat spreader
Heat sink
HM961-QM87
●
●
HM961-HM86
●
●
HM960-QM87
●
●
HM960-HM86
●
●
HM920-QM87
●
●
HM920-HM86
●
●
CR960-QM77
●
CR960-HM76
●
Model name
Heat spreader
Heat sink
Heat spreader with
Heat sink with fan
heat sink
BT700
●
●
●
CR902-B
●
QB702-B
●
●
CR902-BL
●
Heat spreader with
heat sink and fan
QB701-B
●
CR901-B
●
●
●
QB700-B
●
CR900-B
●
●
●
COM Express Mini
HR902-B
●
HR902-BL
●
HR900-B
Heat spreader with
heat sink and fan
Model name
Heat spreader
Heat sink
Heat sink with fan
BT9A3
●
●
●
CM960-B
●
●
CM901-B
CD9A3 Series
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
●
●
●
●
CP900-B
●
●
●
●
Expertise on Carrier Board Design
COM Express® Mini Computer-On-Module
1. Customized evaluation of carrier board design
Design
Atom
Develop
Manufacture
BT9A3
CD9A3 Series
Intel® Atom™ E3800 series
Intel® AtomTM D2550/N2800/N2600
Chipset
N/A
Intel® NM10
Memory
2GB/4GB DDR3L ECC memory down
2GB DDR3 memory down
Display
LVDS, DDI
LVDS, DDI
1 Intel
1 Intel
USB 3.0
1
N/A
USB 2.0
8
8
SATA 3.0
N/A
N/A
SATA 2.0
2
2
SSD
N/A
Yes (option)
IDE, FDD
N/A
N/A
CF
N/A
N/A
Yes (option)
N/A
PCIe x16
N/A
N/A
PCIe x4
N/A
N/A
PCIe x1
3
3
Mini PCIe
N/A
N/A
PCI
N/A
N/A
8-bit
8-bit
HDA
HDA
LPC
N/A
N/A
CAN-bus
N/A
N/A
TPM (optional)
N/A
N/A
Watchdog
Yes
Yes
Power Input
4.75V~20V
4.75V~20V
Compliance
R2.1, Type 10
R2.1, Type 10
Dimensions
84mm x 55mm
84mm x 55mm
Model
2. Customized BIOS and software services
BIOS
SDK
API
BSP
3. Customized validation and testing
Atom
Processor
Ethernet
USB
4. Customized product life cycle management
5. Carrier board design guide
● We provide schematics/placement and layout to aid you in designing your own carrier board
2
4
3
2
4
3
1
1
1
2
2
11
10
1 40
U50
eMMC
204
203
203
204
1
DDR3_2
206
2
1
10
DDR3_1
208
10
2
8
206
5
2
8
208
30
8
1
1
CR960
61 59 57 55 53 51 49 47 45 43 41 39 37 35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1
42 40 38 36 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2
20
BG
BF
BE
BD
BC
BB
BA
AY
AW
AV
AU
AT
AR
AP
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
20
30
8
U17
21 20
30
31
1
2
10
5
6 7
3
9
10
SSD
8
5
18 17 15 13
1211109 8
71
16
3 4
1
39 37
33 31 29 27 25
424140393837363534
73
1 2
4
49 47 45 43
72
A
B
20
71
B
G
H
J
E
U
V
W
N
P
R
L
M
C
AB
AC
F
T
6
1
17
72
8
74
5
B
73
10
E
E
C
74
BJ
BH
BG
BF
BE
BD
BC
BB
BA
AY
AW
AU
AT
AR
AP
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
U
R
N
L
J
G
E
D
C
B
A
1
1
7 5 3 1
6 4 2
11
-
CPU_FAN
2
D
1
+
1
2
1
G
S
37
48
D2
1
36
SPI
G1 S1
205
207
G2
D1
205
1
C
C
1
S1
G1
D2
D1
1
12
A
G2
C
25
A
A
207
A
1
C
24
13
1
A
1
D
G
S
C
1
C
REV.2
MADE IN TAIWAN
3
1
3
2
4
1
2
4
4
3
1
4
2
3
2
Expansion
1
2
6. EAPI Programming Guide
● Backlight function
● I2C Bus function
● GPIO function
● Storage function
● Watchdog function
7. Customized embedded OS
8. Customized API library for functions like Watchdog, GPIO, Backlight, etc.
Watchdog
www.dfi.com
GPIO
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Digital I/O
Audio
Controller
COM Express Mini
Storage
Computer-On-Module
● Revision control
● Continuous supply of components and stock inventory management
● Support and services
Intel® AtomTM E3800 Series
COM Express® Mini
Intel® AtomTM E3800 Series
COM Express® Mini
BT9A3
BT9A3
Features
MEMORY
EXPANSION
Atom
2GB/4GB DDR3L ECC memory down
3 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 LVDS, 1 DDI (HDMI/DVI/DP)
1 HDA
9 USB: 1 USB 3.0, 8 USB 2.0
2 SATA 2.0
eMMC (optional)
8-bit DIO
1 LAN
COM Express® R2.1 Mini, Type 10
84mm x 55mm (3.30" x 2.16")
DDR3L
Intel Atom
E3800 Series
DDR3L
CPU Fan
LAN
DIMENSIONS
TOP
DDR3L
Specifications
PROCESSOR
• Intel® AtomTM/Intel® Celeron® processors
• BGA 1170 packaging technology
• 22nm process technology
SYSTEM MEMORY
• 2GB/4GB DDR3L ECC memory down
• Supports DDR3L 1333MHz (-E45/-E27/-J00/-N30)
Supports DDR3L 1066MHz (-E15)
• Supports single channel memory interface
850C
-400C
USB 3.0
SATA 2.0
eMMC
Wide
Temperature
BOTTOM
4.00
80.00
84.00
51.00
4.00
0.00
0.00
4.00
80.00
DDI Port 0
LVDS
BIOS
• AMI BIOS
- 64Mbit SPI BIOS
POWER CONSUMPTION
• TBD
OS SUPPORT
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
• Windows 8.1 Enterprise x86 (32-bit)
• Windows 8.1 Enterprise x64 (64-bit)
• Windows 8.1 Embedded Pro x86 (32-bit)
• Windows 8.1 Embedded Pro x64 (64-bit)
ONBOARD LAN FEATURES
• Intel® I210 Gigabit Ethernet Controller
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
TEMPERATURE
• Operating
: 0oC to 60oC - Atom, Celeron (Fanless)
: -20ooC to 70ooC - Atom (Fanless with air flow)
: -40 C to 85 C - Atom (Fanless with air flow)
• Storage: -40oC to 85oC
SERIAL ATA (SATA) INTERFACE
• Supports 2 Serial ATA interfaces
• SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
HUMIDITY
• 5% to 90%
eMMC*
• Supports 4GB, 8GB, 16GB and 32GB eMMC onboard
PCB
• Dimensions
- COM Express® Mini
- 84mm (3.30") x 55mm (2.16")
• Compliance
- PICMG COM Express® R2.1, Type 10
POWER INPUT
• 4.75V~20V, 5VSB, VCC_RTC (ATX mode)
• 4.75V~20V, VCC_RTC (AT mode)
DDI Port 1
D
PTN3460
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
LPC Bus
SLP/LID
S
/
WDT
System Fan
PWM/TACH
I2C Bus
Bottom View
Embedded
Controller
IT8528
DDR3L 1GB ECC
8x memory down
DDR3
1333MHz
Single Channel
EEPROM
Ordering Information
SM Bus
8-bit DIO
T
TCA6408A
0.00
9.80
0.00
HD Audio
Atom E3800 Series
/Celeron
C/D
Serial Port 1, 2 Tx/Rx
A/B
6.00
USB 3.0 1x
USB 2.0
2 0 4x
20.00
USB 2.0 4x
85.00
USB4604I
USB HSIC
MMC Bus
SATA 2.0 2x
PCIe x1
PCIe x1
60.00
Intel® GLAN
I210
Memory Down
4GB DDR3L ECC
4GB DDR3L non-ECC
4GB DDR3L ECC
4GB DDR3L ECC
2GB DDR3L ECC
eMMC
8GB
None
None
None
4GB
Power
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
Thermal
Fanless
Fanless
Fanless
Fanless
Fanless
PCIe xx1
Switch
-
Temperature
Memory Down
eMMC
B
B: 0oC to 60oC
E: -20oC to 70oC
T: -40oC to 85oC
2
2: 2GB
4: 4GB
0
0:
4:
8:
1:
3:
Processors
-
None
4GB
8GB
16GB
32GB
E45
E45: Intel® AtomTM E3845, Quad Core, 2M Cache, 1.91GHz, 10W
E27: Intel® AtomTM E3827, Dual Core, 1M Cache, 1.75GHz, 8W
E15: Intel® AtomTM E3815, Single Core, 0.5M Cache, 1.46GHz, 5W
J00: Intel® Celeron® J1900, Quad Core, 2M Cache, 2GHz (2.41GHz), 10W
N30: Intel® Celeron® N2930, Quad Core, 2M Cache, 1.83GHz (2.16GHz), 7.5W
Heatsink
16.50
Packing List
2.00
20.00
Module PCB
Standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Temperature
0oC to 60oC
0oC to 60oC
0oC to 60oC
-40oC to 85oC
-40oC to 85oC
The following specifications will be available upon request. Please contact your sales representative for more information.
BT9A3
PCIe x1 (Opt.)
GLAN
G
BT9A3-B40-E45 Intel® AtomTM E3845, Quad Core, 2M Cache, 1.91GHz, 10W
BT9A3-T40-E45 Intel® AtomTM E3845, Quad Core, 2M Cache, 1.91GHz, 10W
BT9A3-T24-E15 Intel® AtomTM E3815, Single Core, 0.5M Cache, 1.46GHz, 5W
Model Name
PCIe x1
SPI
Flash
eMMC
(Optional)
Model Name
Processor
BT9A3-B48-E45 Intel® AtomTM E3845, Quad Core, 2M Cache, 1.91GHz, 10W
BT9A3-B40-J00 Intel® Celeron® J1900, Quad Core, 2M Cache, 2GHz (2.41GHz), 10W
•
•
•
•
1
1
1
1
BT9A3 board
QR (Quick Reference)
DVD
Heat sink: A71-011055-000G
Optional Items
• COM100-B carrier board kit: 770-COM101-000G
• Heat sink with fan: A71-111020-000G
• Heat spreader: A71-011052-000G
COM Express Mini
Top View
4.00
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics
• Supports LVDS and DDI interfaces
• LVDS: NXP PTN3460, 18/24-bit, single channel, resolution up to
1366x768 @ 60Hz
• Digital Display Interface: HDMI, DVI and DP
• HDMI, DVI: resolution up to 1920x1080 @ 60Hz
• DP: resolution up to 2560x1600 @ 60Hz
• Supports hardware acceleration for DirectX 11, OCL 1.2, OGL 4.0, H.264,
MPEG2, MVC, VC-1, WMV9 and VP8 (supported version dependent on OS)
Computer-On-Module
55.00
51.00
DAMAGE FREE INTELLIGENCE
• Monitors CPU/system temperature and overheat alarm
• Monitors Vcore/Vgfx/VDDR/3V3 voltages and failure alarm
• Monitors CPU/system fan speed and failure alarm
• Watchdog timer function
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
Block Diagram
Mechanical Drawing
EXPANSION INTERFACES
• Supports 1 USB 3.0 port
• Supports 8 USB 2.0 ports
- 4 integrated USB 2.0 ports
- 1 USB HSIC for 4 USB 2.0 ports
• Supports 3 PCIe x1 (default); or 1 PCIe x4 (PCIe port 3, by default, is shared
with the onboard LAN)*
• Supports LPC
interface
• Supports I2C interface
• Supports SMBus interface
• Suppotrs 2 serial interfaces (TX/RX)
• Supports 8-bit Digital I/O
Please refer to the Ordering Information below
DDR3L
ECC
Memory
* Optional and is not supported in standard model. Please contact your sales representative for more information.
Intel® AtomTM D2550/N2800/N2600
COM Express® Mini
CD9A3 Series
Intel® AtomTM D2550/N2800/N2600
COM Express® Mini
MEMORY
EXPANSION
Atom
2GB DDR3 onboard
3 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 LVDS, 1 DDI (HDMI/DVI/DP)
8 USB 2.0
2 SATA 2.0
8-bit DIO
1 LAN
COM Express® R2.1 Mini, Type 10
84mm x 55mm (3.30" x 2.16")
CPU Fan
Intel Atom
D2550/2800/
2600
Intel NM10
DDR3
LAN
DIMENSIONS
TOP
SSD
Optional
DDR3
onboard
8 USB
2 SATA
Specifications
CHIPSET
• Intel® NM10 Express chipset
R2.1
Type10
BOTTOM
Mechanical Drawing
Block Diagram
0.00
4.00
80.00
76.00
5.80
0.00
63.50
85.00
4.50
76.00
6.50
60.00
47.00
2.00
COM Express Type 10 Board to Board Connector
43.50
40.00
CORE
LVDS
(24 bit, Single Channel)
0.00
4.00
2.00
0.00
ONBOARD GRAPHICS FEATURES
• Intel® GMA 3650 (Intel® AtomTM D2550/N2800)
Intel® GMA 3600 (Intel® AtomTM N2600)
• Supports LVDS and DDI interfaces
• LVDS: resolution up to 1440x900 @ 60Hz, 18/24bit (Intel® AtomTM D2550);
resolution up to 1366x768 @ 60Hz, 18bit (Intel® AtomTM N2800/N2600)
• Digital Display Interface: HDMI, DVI and DP
• HDMI, DVI: resolution up to 1920x1200 @ 60Hz
• DP: resolution up to 1600x1200 @ 60Hz
• Supports Hardware H.264/AVC, MPEG-2 video decoder, VC-1, DirectX 9,
1080p decoder
Intel® Atom™
D2550/N2800/N2600
Graphics
CORE
DDI
CORE
Memory
Controller
DMI 4x/2x
(Direct Media
Interface)
CK505
DDR3 8x
total 2GB
DDR3 800/1066MHz
non-ECC
Single Channel
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -40oC to 85oC
HUMIDITY
• 10% to 90%
SERIAL ATA (SATA) INTERFACE
• Supports 2 Serial ATA interfaces
• SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
SSD*
• 4GB/8GB/16GB/32GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
BIOS
• 16Mbit SPI BIOS
POWER INPUT
• 4.75V~20V, 5VSB, VCC_RTC (ATX mode)
• 4.75V~20V, VCC_RTC (AT mode)
PCB
• Dimensions
- COM Express® Mini
- 84mm (3.30") x 55mm (2.16")
• Compliance
- PICMG COM Express® R2.1, Type 10
CERTIFICATION
• RoHS
PCIe x1 3x
GLAN
I210
MDI
PCIe x1
USB 2.0
2 0 8x
LPC
8-bit
8
bit
DIO
SMBus
WDT
EC
IT8518VG
SYS Fan
Intel® NM10
Express Chipset
Serial p
port 2x
I2C
Backup EEPROM
HDA Link
SPI
SPI Flash
SATA 2.0 2x
Ordering Information
Model Name
CD9A3-25B20
CD9A3-28B20
CD9A3-26B20
Part Number
777-CD9A31-0F0G
777-CD9A31-1F0G
777-CD9A31-2F0G
Description
Intel® AtomTM D2550, onboard DDR3 2GB
Intel® AtomTM N2800, onboard DDR3 2GB
Intel® AtomTM N2600, onboard DDR3 2GB
Heatsink
SSD (optional)
Module PCB
8.00
Packing List
Module PCB
The height of the
highest parts 3.50
Carrier Board
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
• 1 CD9A3 board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
• COM100-B carrier board kit
• Heat sink: A71-011020-000G
• Heat sink with fan: 761-CD9030-000G
COM Express Mini
Processor
VR12/IMVP7
EXPANSION INTERFACES
• Supports 8 USB 2.0 ports
• Supports 3 PCIe x1 interfaces
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports 2 serial interfaces (TX/RX)
• Supports 8-bit Digital I/O
Computer-On-Module
Top View
Bottom View
SYSTEM MEMORY
• 2GB DDR3 onboard
ONBOARD LAN FEATURES
• Intel® I210AT Gigabit Ethernet Controller
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
• Supports wire management
51.00
47.00
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 256 seconds
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature
• Monitors CPU fan speed
• Monitors Vcore/VCC RTC/DDR3 voltages
• Watchdog timer function
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
Ø2.70(*4 pcs)
51.00
47.00
* Optional and is not supported in standard model. Please contact your sales representative for more information.
PROCESSOR
• CD9A3-25B20:
- Intel® AtomTM D2550, 1.86GHz, 2x 512K L2, 10W TDP, dual-core
- Cooling option: heatsink with cooling fan
• CD9A3-28B20:
- Intel® AtomTM N2800, 1.86GHz, 2x 512K L2, 6.5W TDP, dual-core
- Cooling option: heatsink (fanless solution)
• CD9A3-26B20:
- Intel® AtomTM N2600, 1.6GHz, 2x 512K L2, 3.5W TDP, dual-core
- Cooling option: heatsink (fanless solution)
DDR3
0.00
4.00
CD9A3 Series
Features
COM Express® Compact Computer-On-Module
ULT
COM Express® Compact Computer-On-Module
QM77
QM67
HM55
HU968
CR908-B
HR908-B
CP908-B
4th Generation Intel® CoreTM
3rd/2nd Generation Intel® CoreTM
3rd/2nd Generation Intel® CoreTM
Intel® CoreTM i7/i5/i3/Celeron®
Chipset
N/A
Intel® QM77
Intel® QM67
Intel® HM55
Memory
2GB/4GB/8GB DDR3L memory down
1 DDR3/DDR3L SODIMM up to 8GB
1 DDR3/DDR3L SODIMM up to 8GB
1 DDR3 SODIMM
up to 4GB
Display
VGA, LVDS, DDI
3 Independent Displays
VGA, LVDS, DDI
VGA, LVDS, DDI
VGA, LVDS
1 Intel
1 Intel
1 Intel
1 Intel
USB 3.0
2
4
4
N/A
USB 2.0
8
4
4
8
SATA 3.0
3
2
N/A
N/A
SATA 2.0
N/A
2
8
4
SSD
Yes
N/A
N/A
N/A
IDE, FDD
N/A
N/A
N/A
1 IDE
Yes (option)
N/A
N/A
N/A
N/A
1
1
1
PCIe x4
1
1
1
N/A
PCIe x1
1
3
3
4
N/A
N/A
N/A
4
4-bit input and 4-bit output
4-bit input and 4-bit output
4-bit input and 4-bit output
8-bit
HDA
HDA
HDA
HDA
LPC
Yes
Yes
Yes
Yes
SMBus
Yes
Yes
Yes
Yes
CAN-bus
N/A
N/A
N/A
N/A
TPM (optional)
Yes
N/A
N/A
N/A
Watchdog
Yes
Yes
Yes
Yes
Power Input
12V
12V
12V
12V
Compliance
R2.1, Type 6
R2.0, Type 6
R2.0, Type 6
R1.0, Type 2
Dimensions
95mm x 95mm
95mm x 95mm
95mm x 95mm
95mm x 95mm
Model
Processor
Ethernet
USB
PCIe x16
Expansion
PCI
Digital I/O
Audio
Controller
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Computer-On-Module
eMMC
COM Express Compact
Storage
COM Express® Compact Computer-On-Module
COM Express® Compact Computer-On-Module
Atom
Atom
AMD G-Series SoC
BT968
CD905-B Series
KB968
Intel® Atom™ E3800 series
Intel® AtomTM D2550/N2800/N2600
AMD® Embedded G-Series SoC
AMD® G-Series
Chipset
N/A
Intel® NM10
N/A
AMD® A55E
Memory
2 DDR3L SODIMM up to 8GB/
1 DDR3L SODIMM up to 4GB
1 DDR3 SODIMM up to 4GB/
1 DDR3 SODIMM up to 2GB
1 DDR3 SODIMM up to8GB
1 DDR3 SODIMM up to 8GB
Display
VGA, LVDS, DDI
VGA, LVDS
VGA, DP/LVDS, DP
VGA, LVDS
1 Intel
1 Intel
1 Intel
1 Intel
USB 3.0
1
N/A
2
N/A
USB 2.0
8
8
6
8
SATA 3.0
N/A
N/A
2
4
SATA 2.0
2
2
N/A
N/A
SSD
N/A
N/A
Yes (option)
N/A
IDE, FDD
N/A
1 IDE
N/A
1 IDE
Yes (option)
N/A
N/A
N/A
PCIe x16
N/A
N/A
N/A
N/A
PCIe x4
N/A
N/A
1
N/A
PCIe x1
3
4
4
6
N/A
4
N/A
4
8-bit
8-bit
8-bit
8-bit
HDA
HDA
HDA
HDA
LPC
Yes
N/A
Yes
Yes
SMBus
Yes
N/A
Yes
Yes
CAN-bus
N/A
N/A
N/A
N/A
TPM (optional)
Yes
N/A
Yes
Yes
Watchdog
Yes
Yes
Yes
Yes
Power Input
12V
12V
12V
12V
Compliance
R2.1, Type 6
R2.0, Type 2
R2.1, Type 6
R2.0, Type 2
Dimensions
95mm x 95mm
95mm x 95mm
95mm x 95mm
95mm x 95mm
Model
Processor
Ethernet
AMD G-Series
OT905-BT56N
OT905-BT40N
USB
Expansion
PCI
Digital I/O
Audio
Controller
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Computer-On-Module
eMMC
COM Express Compact
Storage
4th Gen Intel® CoreTM
COM Express® Compact
4th Gen Intel® CoreTM
COM Express® Compact
HU968
MEMORY
EXPANSION
ULT
2GB/4GB/8GB DDR3L memory down
1 PCIe x4, 1 PCIe x2, 1 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 VGA, 1 LVDS, 1 DDI (HDMI/DVI/DP)
10 USB: 2 USB 3.0, 8 USB 2.0
3 SATA 3.0
SSD (optional)
DDR3L
BGA1168
Specifications
CPU Fan
Please refer to the Ordering Information below
1 LAN
COM Express® R2.1 Compact, Type 6
95mm x 95mm (3.74" x 3.74")
SSD
DDR3L
USB 3.0
SATA 3.0
95.00
91.00
52.63
4.00
DDR3L
80.00
4.00
0.00
eDP
18.00
VR12.6
(Vcore)
6.00
0.00
0.00
16.50
74.20
DDI Port 2
(Opt. share with DP to VGA)
HD Audio
DDI Port 1
Embedded
Controller
IT8528E
DDR3 1600MHz
Dual Channel
SM Bus
A/B
SM Bus
SM Bus
DIO
Memory Down
2GB DDR3L
2GB DDR3L
HU968-B40-4300U Intel® CoreTM i5-4300U, 3M Cache, 1.9GHz (2.9GHz), 15W
HU968-B40-4010U Intel® CoreTM i3-4010U, 3M Cache, 1.7GHz, 15W
HU968-B40-2980U Intel® Celeron® 2980U, 2M Cache, 1.6GHz, 15W
4GB DDR3L
4GB DDR3L
4GB DDR3L
USB 3.0 2x
Model Name
HU968
-
SATA 3.0 1x
PCIe x1 Lane 6
Fan
PCIe x1 Lane 0~3 (4 x1 or 2 x2 or 1 x4)
Module PCB
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
2.00
Standoff
Temperature
B
B: 0oC to 60oC
Memory
2
2: 2GB
4: 4GB
8: 8GB
SSD
0
0: None
2: 2GB
4: 4GB
8: 8GB
1: 16GB
3: 32GB
6: 64GB
Packing List
Heatspreader
11.00
2nd SPI Bus
20.00
Intel® GLAN
I218LM
PCIe x1 Lane 4~5 (1 x1 or 1 x2)
Heat sink
55.00
22.00
LAN
PCIe x1
PCB
• Dimensions
- COM Express® Compact
- 95mm (3.74") x 95mm (3.74")
• Compliance
- PICMG COM Express® R2.1, Type 6
Ordering Information
USB 2.0 8x
SATA 3.0 1x
(Opt. share with PCIe x1 Lane 6)
HUMIDITY
• 5% to 90%
Model Name
Processor
HU968-B24-4650U Intel® CoreTM i7-4650U, 4M Cache, 1.7GHz (3.3GHz), 15W
HU968-B20-4300U Intel® CoreTM i5-4300U, 3M Cache, 1.9GHz (2.9GHz), 15W
HU968-B20-4010U Intel® CoreTM i3-4010U, 3M Cache, 1.7GHz, 15W
HU968-B20-2980U Intel® Celeron® 2980U, 2M Cache, 1.6GHz, 15W
HU968-B24-2980U Intel® Celeron® 2980U, 2M Cache, 1.6GHz, 15W
HU968-B40-4650U Intel® CoreTM i7-4650U, 4M Cache, 1.7GHz (3.3GHz), 15W
SATA 3.0
3 0 2x
SSD Chip
(Optional)
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
2GB
2GB
2GB
4GB
DDR3L
DDR3L
DDR3L
DDR3L
SSD
4GB
None
None
None
4GB
None
None
None
None
Power
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
Thermal
Fan
Fan
Fan
Fan
Fan
Fan
Fan
Fan
Fan
The following specifications will be available upon request. Please contact your sales representative for more information.
C/D
4th Generation
®
Intel Core™ i7/i5/i3;
®
Intel Celeron™
Sys Fan
PWM/TACH
4 in/4 out DIO
O
95.00
53.00
DDR3L
2GB/4GB/8GB
95.00
WDT
SSD*
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
Bottom View
DDI Port 2
Serial Port1,
2 Tx/Rx
OS SUPPORT
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
• Windows 8.1 Enterprise x86 (32-bit)
• Windows 8.1 Enterprise x64 (64-bit)
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
Block Diagram
I2C Buss
POWER CONSUMPTION
• TBD
INTEL ACTIVE MANAGEMENT TECHNOLOGY (AMT)
• Supports iAMT9.5
• Out-of-band system access
• Remote troubleshooting and recovery
• Hardware-based agent presence checking
• Proactive alerting
• Remote hardware and software asset tracking
4.00
BOTTOM
TPM 1.2
SLB9635
(optional)
POWER
• Input: 12V, VCC_RTC, 5VSB*
Computer-On-Module
4.00
0.00
Backup
EEPROM
WATCHDOG TIMER
• Software programmable from 1 to 255 seconds
•
•
•
•
1 HU968 board
1 QR (Quick Reference)
1 DVD
Heat spreader with heat sink and fan: 761-HU9681-000G
-
Processors
4650U
4650U: Intel® CoreTM i7-4650U, 4M Cache, up to 3.3 GHz, 15W
4300U: Intel® CoreTM i5-4300U, 3M Cache, up to 2.9 GHz, 15W
4010U: Intel® CoreTM i3-4010U, 3M Cache, 1.7 GHz, 15W
2980U: Intel® Celeron® 2980U, 2M Cache, 1.6 GHz, 15W
Optional Items
• COM331-B carrier board kit: 770-COM331-000G
• Heat sink with fan: A71-111023-000G
Temperature
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
COM Express Compact
Top View
LPC Bus
BIOS
• AMI BIOS
- 64Mbit SPI BIOS
SERIAL ATA (SATA) INTERFACE
• Supports 3 SATA 3.0 with data transfer rate up to 6Gb/s
- One shares with PCIe Lane 6
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1/5
• Supports Intel® Smart Response Technology
95.00
91.00
91.00
DP to VGA
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/1.05V/DDR voltages and failure alarm
• Watchdog timer function
ONBOARD LAN FEATURES
• Intel® I218LM with iAMT9.5 Gigabit Ethernet Phy
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Mechanical Drawing
R.G.B
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics GT Series
• Supports VGA, LVDS and DDI interfaces
• VGA: Chrontel CH7517, resolution up to 1920x1200 @ 60Hz
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to 1920x1200 @ 60Hz
• Digital Display Interface: HDMI, DVI and DP
• HDMI, DVI: resolution up to 4096x2304 @ 24Hz
• DP: resolution up to 3200x2000 @ 60Hz
• Intel® Clear Video Technology
• Intel® Advanced Vector Extensions 2.0 (Intel® AVX 2.0) Instructions
• Supports DirectX 11.1, OpenGL 4.0, OpenCL 1.2
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
TOP
eDP to LVDS
EXPANSION INTERFACES
• Supports 2 USB 3.0 interfaces
• Supports 8 USB 2.0 interfaces
• Supports 1 PCIe x4; or 2 PCIe x2; or 4 PCIe x1 interfaces
• Supports 1 PCIe x2; or 1 PCIe x1 interface
• Supports 1 PCIe x1 interface (PCIe Lane 6 shares with 1 SATA 3.0 port)
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
SYSTEM MEMORY
• 2GB/4GB/8GB DDR3L memory down
• Supports DDR3L 1600MHz
• Supports dual channel memory interface
Optional
AMT
* Optional and is not supported in standard model. Please contact your sales representative for more information.
PROCESSOR
• 4th generation Intel® CoreTM processors
• BGA 1168 packaging technology
• 22nm process technology
4-bit input and 4-bit output GPIO
LAN
DIMENSIONS
LVDS Port
(Dual Channel))
HU968
Features
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
CR908-B
MEMORY
EXPANSION
QM77
1 DDR3/DDR3L SODIMM up to 8GB
1 PCIe x16, 7 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP/SDVO)
8 USB: 4 USB 3.0/2.0, 4 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Compact, Type 6
95mm x 95mm (3.74" x 3.74")
BGA 1023
DDR3/DDR3L
SODIMM
LAN
DIMENSIONS
Intel QM77
CPU Fan
Mechanical Drawing
91.00
87.00
Please refer to the Ordering Information below
CHIPSET
• Intel® QM77 Express chipset
SYSTEM MEMORY
• One 204-pin SODIMM socket
• Supports DDR3 SODIMM
3rd Generation Processors 2nd Generation Processors
DDR3 1066/1333/1600MHz
DDR3 1066/1333MHz (i5/i3/Celeron)
DDR3 1600MHz (i7)
• Supports DDR3L SODIMM
- 1066/1333MHz when operating at 1.35V
- 1066/1333/1600MHz when operating at 1.5V
• Supports up to 8GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM technologies are
supported for x8 and x16 devices, unbuffered, non-ECC
DDR3/
DDR3L
SODIMM
Ø2.70(*4 pcs)
Channel A
1066/1333/
1600MHz
Processor
CORE CORE CORE
SM Bus
IMVP7
(Vcore,Vgfx)
3rd/2nd Generation;
Intel® Core™ i7/i5/i3
Graphics
CORE
CMOS Backup
EEPROM
CORE
DMI x4
(Direct Media
Interface)
®
SM Bus
DDI Port B/SDVO Port B
DDI Port C
0.00
12.50
70.20
USB 2.0 8x
95.00
SATA 2.0
202
2x, SATA 3.0
3 0 2x
2
87.00
(D l Channel)
Ch
l)
LVDS (Dual
CRT
PCI x1,
PCIe
1 Lane
L
6
6x
Mobile Intel®
QM77
Express Chipset
DDI Port D
3rd Gen Processors
USB 3.0 4x
2ndd SPI B
Bus
95.00
87.00
Serial
S
i l Port1,
P t1 2 TX/RX
LAN Ports
P t
PCIe x1, Lane 8
Fan
Heat spreader
11.00 22.00
Module PCB
3.25
55.00
53.00
Heat sink
www.dfi.com
PCIe x1 Lane 7
Sys FAN PWM/TACH_IN
/
Intel® GLAN
PHY 82579LM
standoff
HUMIDITY
• 10% to 90%
POWER
• Input: 12V, 5VSB, VCC_RTC
Model Name
CR908-B3120ME
CR908-B810E
CR908-B847E
CR908-B827E
Part Number
777-CR9081-400G
777-CR9081-E00G
777-CR9081-F00G
777-CR9081-700G
Description
Intel® CoreTM i3-3120ME, 3M Cache, 2.40 GHz, 35W
Intel® CeleronTM B810E, 2M Cache, 1.6GHz, 35W
Intel® CeleronTM 847E, 2M Cache, 1.1GHz, 17W
Intel® CeleronTM 827E, 1.5M Cache, 1.4GHz, 17W
The following processors will be available upon request. Please contact your sales representative for more information.
GPIO,WDT,I2C
(Embedded
Controller)
WDT
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
CERTIFICATION
• CE, FCC Class B, UL, RoHS
2nd Gen Processors
8-bit DIO
I2C Bus
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
USB INTERFACE
• XHCI Host Controller supports up to 4 super speed USB 3.0 ports
C/D
A/B
2.00
0.00
POWER CONSUMPTION
• 35.42 W with i7-3612QE at 2.1GHz and 1x 2GB DDR3 SODIMM
PCB
• Dimensions ®
- COM Express Compact
- 95mm (3.74") x 95mm (3.74")
• Compliance
- PICMG COM Express® R2.1 Compact form factor, Type 6
3rd Gen Processors
Intel FDI
(Flexible Display
Interface)
LPC Bus
14.00
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature
• Monitors CPU fan speed
• Monitors Vcore/VGFX/DDR voltages
• Watchdog timer function
SERIAL ATA (SATA) INTERFACE
• Supports 4 Serial ATA interfaces
• 2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1/5/10
HD Audio
Bottom View
BIOS
• 64Mbit UEFI SPI BIOS
Ordering Information
PEG 16x LANES
Memory
Controller
EXPANSION INTERFACES
• Supports 8 USB 2.0 interfaces (4 supports USB 3.0)
• Supports 1 PCIe x16 interface
- Supports Gen 3.0
- Configurations (supported only via a riser card):
: One x8 (GFX) and two x4 (I/O)
: Two x8 (GFX, I/O)
: One x16 (GFX, I/O)
• Supports 1 PCIe x4 and 3 PCIe x1 (default); or 7 PCIe x1 interfaces
• Supports LPC interface
• Supports SMBus
interface
• Supports I2C interface
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
2nd Gen Processors
Model Name
CR908-B3615QE
CR908-B3612QE
CR908-B3555LE
CR908-B3517UE
CR908-B3610ME
CR908-B3217UE
CR908-B1020E
CR908-B1047UE
CR908-B927UE
CR908-B2715QE
CR908-B2655LE
CR908-B2610UE
CR908-B2515E
CR908-B2310E
CR908-B2340UE
CR908-B807UE
Part Number
777-CR9081-600G
777-CR9081-000G
777-CR9081-100G
777-CR9081-200G
777-CR9081-300G
777-CR9081-500G
777-CR9081-I00G
777-CR9081-J00G
777-CR9081-K00G
777-CR9081-800G
777-CR9081-900G
777-CR9081-A00G
777-CR9081-B00G
777-CR9081-C00G
777-CR9081-D00G
777-CR9081-G00G
Description
Intel® CoreTM i7-3615QE, 6M Cache, up to 3.30 GHz, 45W
Intel® CoreTM i7-3612QE, 6M Cache, up to 3.10 GHz, 35W
Intel® CoreTM i7-3555LE, 4M Cache, up to 3.20 GHz, 25W
Intel® CoreTM i7-3517UE, 4M Cache, up to 2.80 GHz, 17W
Intel® CoreTM i5-3610ME, 3M Cache, up to 3.30 GHz, 35W
Intel® CoreTM i3-3217UE, 3M Cache, 1.60 GHz, 17W
Intel® CeleronTM 1020E, 2M Cache, 2.20 GHz, 35W
Intel® CeleronTM 1047UE, 2M Cache, 1.40 GHz, 17W
Intel® CeleronTM 927UE, 1M Cache, 1.50 GHz, 17W
Intel® CoreTM i7-2715QE, 6M Cache, up to 3.00 GHz, 45W
Intel® CoreTM i7-2655LE, 4M Cache, up to 2.90 GHz, 25W
Intel® CoreTM i7-2610UE, 4M Cache, up to 2.40 GHz, 17W
Intel® CoreTM i5-2515E, 3M Cache, up to 3.10 GHz, 35W
Intel® CoreTM i3-2310E, 3M Cache, 2.10 GHz, 35W
Intel® CoreTM i3-2340UE, 3M Cache, 1.30 GHz, 17W
Intel® CeleronTM 807UE, 1M Cache, 1.00 GHz, 10W
Packing List
• 1 CR908 board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
•
•
•
•
•
COM331-B carrier board kit
COM101-BAT carrier board kit
Heat spreader: TBD
Heat sink with fan:A71-111008-000G
Heat spreader with heat sink and fan: 761-CR9080-000G (CR908-B3615QE)
Computer-On-Module
91.00
0.00
4.00
76.00
0.00
4.00
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
COM Express Compact
Top View
53.00
PROCESSOR
• BGA 1023 packaging technology
- 3rd generation Intel® CoreTM processors (22nm process technology)
- 2nd generation Intel® CoreTM processors (32nm process technology)
ONBOARD LAN FEATURES
• Intel® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
95.00
95.00
* Optional and is not supported in standard model. Please contact your sales representative for more information.
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
91.00
87.00
0.00
4.00
91.00
87.00
Specifications
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4000 (3rd generation processors)
• Intel® HD Graphics 3000 (2nd generation processors)
• Intel® HD Graphics (Intel® CeleronTM processors)
• Supports VGA, LVDS and DDI interfaces
• VGA: resolution up to 1920x1200 @ 60Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit, resolution up to
1920x1200 @ 60Hz
• Digital Display Interfaces: HDMI, DVI, DP and SDVO
• HDMI, DVI, DP: resolution up to 1920x1200 @ 60Hz
• Intel® Clear Video Technology
• DirectX Video Acceleration (DXVA) for accelerating video processing
- Full AVC/VC1/MPEG2 HW Decode
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0 (3rd generation processors)
• Supports DirectX 10.1/10/9 and OpenGL 3.0 (2nd generation processors)
Block Diagram
0.00
4.00
CR908-B
Features
Intel® AtomTM E3800 Series
COM Express® Compact
Intel® AtomTM E3800 Series
COM Express® Compact
BT968
BT968
Features
MEMORY
Atom
DDR3L
SODIMM
CPU Fan
2 DDR3L SODIMM up to 8GB
(-E45/-E27/-E26/-J00/-N30)
1 DDR3L SODIMM up to 4GB
(-E15)
3 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 VGA, 1 LVDS, 1 DDI (HDMI/DVI/DP)
1 HDA
9 USB: 1 USB 3.0, 8 USB 2.0
2 SATA 2.0
eMMC (optional)
8-bit DIO
1 LAN
COM Express® R2.1 Compact, Type 6
95mm x 95mm (3.74" x 3.74")
EXPANSION
Intel Atom
E3800 Series
LAN
DIMENSIONS
Specifications
PROCESSOR
• Intel® AtomTM/Intel® Celeron® processors
• BGA 1170 packaging technology
• 22nm process technology
SYSTEM MEMORY
• Two 204-pin DDR3L SODIMM sockets (-E45/-E27/-E26/-J00/-N30)
- up to 8GB system memory
- dual channel memory interface
One 204-pin DDR3L SODIMM socket (-E15)
- up to 4GB system memory
- single channel memory interface
• Supports DDR3L 1333MHz (-E45/-E27/-J00/-N30)
Supports DDR3L 1066MHz (-E26/-E15)
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3L DRAM
technologies are supported for x8 and x16 devices, unbuffered, non-ECC
-400C
DDR3L
DDR3L
SODIMM
USB 3.0
Wide
Temperature
eMMC
SATA 2.0
Mechanical Drawing
95.00
91.00
4.00
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics
• Supports VGA, DDI, LVDS (default) or DDI* interfaces
• Supports 2 display interfaces at the same time
• VGA: 24-bit, resolution up to 2560x1600 @ 60Hz
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to 1920x1200 @ 60Hz
• Digital Display Interface: HDMI, DVI and DP
• HDMI, DVI: resolution up to 1920x1080 @ 60Hz
• DP: resolution up to 2560x1600 @ 60Hz
• Supports hardware acceleration for DirectX 11, OCL 1.2, OGL 3.2, H.264,
MPEG2, MVC, VC-1, WMV9 and VP8
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
POWER CONSUMPTION
• BT968-TS0-E45: 15.88W with E3845 at 1.91GHz and 2x 4GB DDR3L SODIMM
OS SUPPORT
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
• Windows 8.1 Enterprise x86 (32-bit)
• Windows 8.1 Enterprise x64 (64-bit)
• Windows 8.1 Embedded Pro x86 (32-bit)
• Windows 8.1 Embedded Pro x64 (64-bit)
TEMPERATURE
• Operating
: 0oC to 60oC - Atom, Celeron (Fanless)
: -20ooC to 70ooC - Atom (Fanless with air flow)
: -40 C to 85 C - Atom (Fanless with air flow)
• Storage: -40oC to 85oC
ONBOARD LAN FEATURES
• Intel® I210AT Gigabit Ethernet Controller
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
80.00
SERIAL ATA (SATA) INTERFACE
• Supports 2 Serial ATA interfaces
• SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
HUMIDITY
• 5% to 90%
eMMC*
• Supports 4GB, 8GB, 16GB and 32GB eMMC onboard
PCB
• Dimensions
- COM Express® Compact
- 95mm (3.74") x 95mm (3.74")
• Compliance
- PICMG COM Express® R2.1, Type 6
POWER INPUT
• 12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
Block Diagram
Computer-On-Module
4.00
4.00
0.00
BOTTOM
BIOS
• AMI BIOS
- 64Mbit SPI BIOS
Ordering Information
Bottom View
LVDS Ports (Dual Channel)
eDP to LVDS
(PTN3460)
DDI
Port 1
VGA
Default
I2C Bus
IMVP7
Embedded SLB9635
Controller ((optional)
IT8518E
DDI Port 0 (to BTB DDI Port1)
A/B
SMBus
BT968
DDR3
1066/1333MHz
Dual Channel
USB 3.0 Port 1
HD Audio
AtomTM
AtomTM
AtomTM
AtomTM
E3815, Single Core, 0.5M Cache, 1.46GHz, 5W
E3827, Dual Core, 1M Cache, 1.75GHz, 8W
E3827, Dual Core, 1M Cache, 1.75GHz, 8W
E3845, Quad Core, 2M Cache, 1.91GHz, 10W
-
Temperature
Memory
eMMC
B
B: 0oC to 60oC
E: -20oC to 70oC
T: -40oC to 85oC
S
S: Socket
0
0:
4:
8:
1:
3:
95.00
USB 2.0 4x
USB4604
Intel®
Intel®
Intel®
Intel®
C/D
Atom E3800 Series
/Celeron
TCA6408A
C 6 08
BT968-TS4-E15
BT968-TS0-E27
BT968-TS8-E27
BT968-TS0-E45
Model Name
DDR3L Memory
Slot 2x
EEPROM
Processor
Intel® Celeron® N2930, Quad Core, 2M Cache, 1.83GHz (2.16GHz), 7.5W
Intel® Celeron® J1900, Quad Core, 2M Cache, 2GHz (2.41GHz), 10W
USB HSIC
SATA 2.0 2x
eMMC
SODIMM
2 (8GB DDR3L)
2 (8GB DDR3L)
1 (4GB DDR3L)
2 (8GB DDR3L)
2 (8GB DDR3L)
2 (8GB DDR3L)
eMMC
None
None
4GB
None
8GB
None
Power
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
Thermal
Fanless
Fanless
Fanless
Fanless
Fanless
Fanless
Temperature
0oC to 60oC
0oC to 60oC
-40oC to 85oC
-40oC to 85oC
-40oC to 85oC
-40oC to 85oC
The following specifications will be available upon request. Please contact your sales representative for more information.
95.00
8-bit
8-bit DIO
USB 2.0 4x
0.00
TPM 1.2
WDT
16.50
SLP/LID
6.00
0.00
74.20
Serial Port 0,1
Fan PWM/
TACH_IN
18.00
eDP (DDI) Port
1:2 DP S/W
PI3VDP612A
DDI Port1
1
(to
DDI Port 2))
(t BTB D
(co-lay with PTN3460))
LPC Bus
Model Name
BT968-BS0-N30
BT968-BS0-J00
eMMC
(Optional)
Processors
-
None
4GB
8GB
16GB
32GB
E45
E45: Intel® AtomTM E3845, Quad Core, 2M Cache, 1.91GHz, 10W
E27: Intel® AtomTM E3827, Dual Core, 1M Cache, 1.75GHz, 8W
E26: Intel® AtomTM E3826, Dual Core, 1M Cache, 1.46GHz, 7W
E15: Intel® AtomTM E3815, Single Core, 0.5M Cache, 1.46GHz, 5W
J00: Intel® Celeron® J1900, Quad Core, 2M Cache, 2GHz (2.41GHz), 10W
N30: Intel® Celeron® N2930, Quad Core, 2M Cache, 1.83GHz (2.16GHz), 7.5W
PCIe GEN2 (3 x1 or 1 x4)
Intel® GLAN
I210AT
Packing List
PCIe xx1
Module PCB
11.00
SPI Flash
Heatspreader
3.00
SPI Bus
Standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
2.00
LAN
•
•
•
•
1
1
1
1
BT968 board
QR (Quick Reference)
DVD
Heat spreader: A71-011039-000G
Optional Items
• COM331-B carrier board kit: 770-COM331-000G
• Heat sink: A71-011054-000G
• Heat spreader with heat sink and fan: 761-BT9681-000G
COM Express Compact
Top View
4.00
0.00
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature
• Monitors Vcore/Vgfx/VDDR/1V0/VBAT voltages
• Monitors CPU/system fan speed
• Watchdog timer function
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
95.00
91.00
91.00
EXPANSION INTERFACES
• Supports 1 USB 3.0 port
• Supports 8 USB 2.0 ports
- 4 integrated USB 2.0 ports
- 1 USB HSIC for 4 USB 2.0 Ports
• Supports 3 PCIe x1 (default); or 1 PCIe x4 (PCIe port 3, by default, is shared
with the onboard LAN)*
• Supports LPC
interface
• Supports I2C interface
• Supports SMBus interface
• Suppotrs 2 serial interfaces (TX/RX)
• Supports 8-bit Digital I/O
Please refer to the Ordering Information below
850C
TOP
* Optional and is not supported in standard model. Please contact your sales representative for more information.
Intel® AtomTM D2550/N2800/N2600
COM Express® Compact
CD905-B Series
Intel® AtomTM D2550/N2800/N2600
COM Express® Compact
MEMORY
Atom
1 DDR3 SODIMM up to 4GB (-B2550/-B2800)
1 DDR3 SODIMM up to 2GB (-B2600)
4 PCIe x1, 4 PCI
1 LPC, 1 I2C, 1 IDE
1 VGA, 1 LVDS
8 USB 2.0
2 SATA 2.0
8-bit DIO
1 LAN
COM Express® R2.0 Compact, Type 2
95mm x 95mm (3.74" x 3.74")
EXPANSION
Intel Atom
D2550/N2800/
N2600
CD905-B Series
Features
DDR3
SODIMM
Intel NM10
LAN
DIMENSIONS
System Fan
Specifications
* Optional and is not supported in standard model. Please contact your sales representative for more information.
PROCESSOR
• CD905-B2550:
- Intel® AtomTM D2550, 1.86GHz, 2x 512K L2, 10W TDP, dual-core
- Cooling option: heatsink with cooling fan
• CD905-B2800:
- Intel® AtomTM N2800, 1.86GHz, 2x 512K L2, 6.5W TDP, dual-core
- Cooling option: heatsink (fanless solution)
• CD905-B2600:
- Intel® AtomTM N2600, 1.6GHz, 2x 512K L2, 3.5W TDP, dual-core
- Cooling option: heatsink (fanless solution)
WATCHDOG TIMER*
• Watchdog timeout programmable via software from 1 to 256 seconds
CHIPSET
• Intel® NM10 Express chipset
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/VGFX/1.5V voltages and failure alarm
• Watchdog timer function
SYSTEM MEMORY
• One 204-pin DDR3 SODIMM socket
• Supports DDR3 1066MHz (Intel® AtomTM D2550/N2800)
Supports DDR3 800MHz (Intel® AtomTM N2600)
• Supports single channel memory interface
• Supports up to 4GB system memory (Intel® AtomTM D2550/N2800)
Supports up to 2GB system memory (Intel® AtomTM N2600)
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM technologies are
supported for x8 and x16 devices, unbuffered, non-ECC
Mechanical Drawing
ONBOARD GRAPHICS FEATURES
• Intel® GMA 3650 (Intel® AtomTM D2550/N2800)
Intel® GMA 3600 (Intel® AtomTM N2600)
• Supports LVDS and VGA interfaces
• LVDS: Chrontel CH7511B, 24-bit, dual channel, resolution up to 1920x1200 @
60Hz
• VGA: resolution up to 1920x1200 @ 60Hz
• Supports Hardware H.264/AVC, MPEG-2 video decoder, VC-1, DirectX 9, 1080p
decoder
Block Diagram
91.00
87.00
0.00
4.00
91.00
87.00
91.00
87.00
IMVP7
(Vcore,Vgfx)
95.00
0.00
4.00
0.00
4.00
ONBOARD LAN FEATURES
• Intel® 82574 Gigabit Ethernet Controller
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
• Supports wire management
95.00
91.00
76.00
0.00
4.00
Ø2.70(*4 pcs)
VGA
Analog
Display
Processor
CORE CORE CORE
eDP to LVDS
DDI
Signal
Bottom View
CORE
SODIMM 1x
DDR3 1066MHz
(-B2550/-B2800)
SODIMM 1x
DDR3 800MHz
(-B2600)
Intel® Atom™ D2550 (-B2550)
Intel® Atom™ N2800 (-B2800)
Intel® Atom™ N2600 (-B2600)
Graphics
CORE
SERIAL ATA (SATA) INTERFACE
• Supports 2 Serial ATA interfaces
• SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
CK505
Memory
Controller
POWER CONSUMPTION
• CD905-B2550: 24.51W with D2550 at 1.86GHz and 1x 1GB DDR3 SODIMM
• CD905-B2600: 17.40W with N2600 at 1.6GHz and 1x 2GB DDR3 SODIMM
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 10% to 90%
POWER INPUT
• 12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
PCB
• Dimensions
- COM Express® Compact
- 95mm (3.74") x 95mm (3.74")
• Compliance
- PICMG COM Express® R2.0, Type 2
CERTIFICATION
• CE
• FCC Class B
• RoHS
• UL
DMI
(Direct Media
Interface)
14.00
2.00
0.00
0.00
12.50
70.20
HDA
95.00
87.00
Intel® NM10
Express Chipset
USB 2.0 8x
PCIe x1 3x
C/D
A/B
4.00
33.40
PCI 4x
IT8208M
PCI Arbiter
SATA 2.0 2x
SPI
SPI
SPI Flash
87.00
95.00
LPC Bus
I2C
EC
IT8518E
Ordering Information
LPC Bus
IDE
PCIe x1 1x
GLAN
82574L
4.00
4.00
76.00
83.50
PCIe x1 1x
XIO 3130
JMB 368
Model Name
CD905-B2550
CD905-B2800
CD905-B2600
Part Number
777-CD9051-000G
777-CD9051-800G
777-CD9051-600G
Description
Intel® AtomTM D2550, 1.86GHz, 10W TDP
Intel® AtomTM N2800, 1.86GHz, 6.5W TDP
Intel® AtomTM N2600, 1.6GHz, 3.5W TDP
Module PCB
33.40
23.40
35.40
Cooler
Module PCB The height
of the highest parts
2.00
3.50
1.60
Standoff
Carrier Board
5.0 or 8.0 mm
Heat sink height: 23.40mm
Heat spreader height: 11mm
Heat spreader with heat sink and fan height: 43mm
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
• 1 CD905-B board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
•
•
•
•
•
COM330-B carrier board kit
COM630-B carrier board kit
Heat spreader: A71-011007-000G
Heat sink: A71-011017-000G
Heat spreader with heat sink and fan: 761-CD9050-000G
Computer-On-Module
Top View
BIOS
• 16Mbit SPI BIOS
COM Express Compact
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
EXPANSION INTERFACES
• Supports 8 USB 2.0 ports
• Supports 4 PCIe x1 interfaces
• Supports 4 PCI interfaces
• Supports LPC interface
• Supports I2C interface
• Supports 1 IDE interface
• Supports 8-bit Digital I/O
AMD® Embedded G-Series SoC
COM Express® Compact
KB968
KB968
Features
MEMORY
EXPANSION
®
AMD
Embedded
G-Series SoC
CPU Fan
1 DDR3 SODIMM up to 8GB
1 PCIe x4, 4 PCIe x1
1 LPC, 1 I2C, 1 SMBus, 2 serial
1 VGA, 1 DP/LVDS, 1 DP
8 USB: 2 USB 3.0/2.0, 6 USB 2.0
2 SATA 3.0
8-bit DIO
1 LAN
COM Express® R2.1 Compact, Type 6
95mm x 95mm (3.74" x 3.74")
LAN
DIMENSIONS
Specifications
R2.1
Type6
Please refer to the Ordering Information below
SYSTEM MEMORY
• One 204-pin DDR3 SODIMM socket
• Supports DDR3 1066/1333/1600MHz
• Supports single channel memory interface
• Supports up to 8GB system memory
• DRAM device technologies: 1Gb, 2Gb, 4Gb and 8Gb DDR3 DRAM
technologies are supported for x8 and x16 devices, unbuffered, non-ECC
SSD
Optional
VGA
USB 3.0
* Optional and is not supported in standard model. Please contact your sales representative for more information.
APU (Accelerated Processing Unit)
• AMD® Embedded G-Series SoC FT3 BGA
• 28nm process technology
DDR3 SODIMM
SATA 3.0
ONBOARD GRAPHICS FEATURES
• Advanced discrete-level GPU integrated in the processor
• Supports VGA, DP/LVDS and DP interfaces
• VGA: resolution up to 2048x1536 @ 60Hz
• LVDS: 18-bit, single channel, resolution up to 1600x900 @ 60Hz
• DP: resolution up to 4096x2160 @ 30Hz
• Supports hardware acceleration for DirectX 11.1, H.264, MPEG-2, MPEG-4 AVC,
VC-1 and WMV
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
Mechanical Drawing
91.00
87.00
0.00
4.00
ONBOARD LAN FEATURES
• Intel® WGI210AT Gigabit Ethernet Controller
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Block Diagram
Top View
0.00
4.00
SSD*
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
0.00
4.00
91.00
76.00
0.00
4.00
LVDS Port
(Single Channel)
LTDP0
1066~1600MT/s
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
UNBUFFERED
DDR3 SODIMM
EXPANSION INTERFACES
• Supports 8 USB 2.0 ports (first 2 USB ports support up to USB 3.0)
• Supports 1 PCIe x4 (GFX)
• Supports 4 PCIe x1 (GPP, GPP3 is connected to onboard LAN by default)
• Supports LPC interface
• Supports I2C interface
• Supports SMBus interface
• Supports 2 serial interfaces (TX/RX)
• Supports 8-bit Digital I/O
DAMAGE FREE INTELLIGENCE
• Monitors APU temperature
• Monitors APU fan speed
• Monitors APU_VDD/APU_VDDNB/APU_VDDIO_SUS/1V8/0V95 voltages
• Watchdog timer function
BIOS
• 32Mbit SPI BIOS
POWER CONSUMPTION
• KB968-GX420BBS: 28.58 W with GX-420CA at 2.0GHz and 1x 4GB
DDR3 SODIMM
OS SUPPORT
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
Computer-On-Module
SERIAL ATA (SATA) INTERFACE
• Supports 2 Serial ATA interfaces
• SATA 3.0 with data transfer rate up to 6Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
HUMIDITY
• 5% to 90%
POWER INPUT
• 12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
PCB
• Dimensions
- COM Express® Compact
- 95mm (3.74") x 95mm (3.74")
• Compliance
- PICMG COM Express® R2.1, Type 6
VGA
PCIe GEN2 (GFX 1 x4)
SMBus (Optional)
HD Audio
TDP1
LPC Bus
DDI Port 1
8-bit
8
bit DIO
Bottom View
I2C Bus/SMBuss
WDT
Serial Port1,
2 Tx/Rx
LPC
Embedded TPM 1.2
E
Controller SLB9635
IT8518E (Optional)
Sys Fan
PWM/TACH
14.00
USB 3.0
0.00
12.50
70.20
CMOS Backup
EEPROM
USB 2.0 8x
SATA 3.0
3 0 2x
53.00
SSD Chip
(Optional)
95.00
PCIe GEN2
(1 x4 or 4 x1
G 0,1,2,3
GPP
LAN
SATA 1
LAN
SPI ROM
GPP 3
SPI I/F
USB_SS 0,1
C/D
A/B
2.00
0.00
Ordering Information
AMD Embedded
G-Series SoC
Model Name
KB968-GX415BBS
Processor
AMD® GX-415GA, Quad Core, 2M Cache, 1.5GHz, 15W
SODIMM
2 (8GB DDR3)
SSD
None
Power
ATX/AT
Thermal
Cooler
Temperature
0oC to 60oC
KB968-GX420BBS
AMD® GX-420CA, Quad Core, 2M Cache, 2.0GHz, 25W
2 (8GB DDR3)
None
ATX/AT
Cooler
0oC to 60oC
2
2
2
2
None
None
None
None
ATX/AT
ATX/AT
ATX/AT
ATX/AT
Cooler
Cooler
Cooler
Cooler
0oC
0oC
0oC
0oC
KB968-GX217BBS
KB968-GX210HBBS
KB968-GX210JBBS
KB968-GX416BBS
®
AMD
AMD®
AMD®
AMD®
GX-217GA, Dual Core, 1M Cache, 1.65GHz, 15W
GX-210HA, Dual Core, 1M Cache, 1.0GHz, 9W
GX-210JA, Dual Core, 1M Cache, 1.0GHz, 6W
GX-416RA, Quad Core, 2M Cache, 1.6GHz, 15W, without GPU
(8GB
(8GB
(8GB
(8GB
DDR3)
DDR3)
DDR3)
DDR3)
95.00
SPI Bus
SD Card I/F (Optional)
Heat spreader
Module PCB
2.00
Standoff
www.dfi.com
Packing List
Heat sink
22.00
53.00
20.00
Fan
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
•
•
•
•
1 KB968 board
1 QR (Quick Reference)
1 DVD
Heat spreader with heat sink and fan: 761-KB9680-000G
Optional Items
• COM331-B carrier board kit: 770-COM331-000G
to
to
to
to
60oC
60oC
60oC
60oC
COM Express Compact
91.00
87.00
91.00
87.00
11.00
G-Series
SoC
AMD® Embedded G-Series SoC
COM Express® Compact
AMD® Embedded G-Series
COM Express® Compact
AMD® Embedded G-Series
COM Express® Compact
OT905-B Series
MEMORY
EXPANSION
G-Series
CPU Fan
AMD
T56N/T40N
1 DDR3 SODIMM up to 8GB
6 PCIe x1, 4 PCI
1 LPC, 1 SMBus, 1 IDE
1 VGA, 1 LVDS
8 USB 2.0
4 SATA 3.0
8-bit DIO
1 LAN
COM Express® R2.0 Compact, Type 2
95mm x 95mm (3.74" x 3.74")
LAN
DIMENSIONS
AMD A55E
Specifications
CHIPSET
• AMD® A55E Controller Hub
SYSTEM MEMORY
• One 204-pin DDR3 SODIMM socket
• Supports DDR3 1066/1333MHz (OT905-BT56N)
Supports DDR3 1066MHz (OT905-BT40N)
• Supports single channel memory interface
• Supports up to 8GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM
technologies are supported for x8 and x16 devices, unbuffered, non-ECC
91.00
87.00
0.00
4.00
91.00
87.00
CH7511B
Processor
CORE CORE
ONBOARD LAN FEATURES
• Intel® 82574L Gigabit Ethernet Controller
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
DDR3
SODIMM
Max
M 8GB
91.00
76.00
0.00
4.00
SERIAL ATA (SATA) INTERFACE
• Supports 4 Serial ATA interfaces
• SATA 3.0 with data transfer rate up to 6Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1/5/10
AMD® T56N
VGA
Ø2.70(*4 pcs)
AMD® T40N
APU-PCIe Port 0-3
Graphics
CORE
Memory
Controller
IDE INTERFACE
• JMicron JMB368 PCI Express to PATA host controller
• DMA mode: Ultra ATA up to 100MB/s
• PIO mode: up to 16MB/s
Bottom View
UMI x4
AMD TSI
EXPANSION INTERFACES
• Supports 8 USB 2.0 ports
• Supports 6 PCIe x1 interfaces
• Supports 4 PCI interfaces
• Supports 8-bit Digital I/O
• Supports 1 IDE interface
• Supports LPC interface
• Supports SMBus interface
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/Vnb/1.5V voltages and failure alarm
• Watchdog timer function
BIOS
• 32Mbit SPI BIOS
POWER CONSUMPTION
• 17.21 W with T40N at 1.0GHz and 1x 2GB DDR3 SODIMM
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
POWER INPUT
• 12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
PCB
• Dimensions
- COM Express® Compact
- 95mm (3.74") x 95mm (3.74")
• Compliance
- PICMG COM Express® R2.0, Type 2
CERTIFICATION
• CE
• FCC Class B
• RoHS
• UL
14.00
2.00
0.00
GLAN
PCI
FCH-PCIe
Port 2
Intel®
82574L
FCH-PCIe Port 3
HDA
95.00
87.00
AMD® A55E
Express Chipset
SATA 3.0 4x
USB 2.0 8x
LPC Bus
95.00
87.00
SPI Flash
4.00
IDE
Ordering Information
EC
ITE8518E
SPI
4.00
JMB368
TPM
(option)
WTD
EC_GPIO
C/D
A/B
0.00
12.50
70.20
4.00
33.40
FCH-PCIe Port 0-1
Model Name
OT905-BT56N
OT905-BT40N
Part Number
770-OT9051-000G
770-OT9051-500G
Description
AMD® T56N, 1.65GHz, 18W TDP
AMD® T40N, 1.00GHz, 9W TDP
76.00
83.50
Module PCB The height
of the highest parts
33.40
2.00
3.50
1.60
Standoff
Carrier Board
5.0 or 8.0 mm
www.dfi.com
Packing List
Module PCB
23.40
35.40
Cooler
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
•
•
•
•
1 OT905-BT56N/OT905-BT40N board
1 QR (Quick Reference)
1 DVD
Heat sink with fan: 761-011004-000G
Optional Items
• COM330-B carrier board kit: 770-COM330-000G
• Heat spreader: A71-011014-000G
• Heat spreader with heat sink and fan: 761-OT9050-000G
Computer-On-Module
DDI Port1
LVDS
0.00
4.00
0.00
4.00
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 256 seconds
HUMIDITY
• 10% to 90%
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
Top View
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
COM Express Compact
ONBOARD GRAPHICS FEATURES
• Advanced discrete-level GPU integrated in the processor
- AMD RadeonTM HD 6320 (OT905-BT56N)
- AMD RadeonTM HD 6290 (OT905-BT40N)
• Supports LVDS and VGA interfaces
• LVDS: Chrontel CH7511B, 24-bit, dual channel, resolution up to
1920x1200 @ 60Hz
• VGA: resolution up to 2048x1536 @ 60Hz (OT905-BT56N); resolution
up to 1920x1200 @ 60Hz (OT905-BT40N)
• Supports AMD Turbo Core 2.0 technology
• Supports DirectX 11, OpenGL 3.2 and OpenCL 1.1
• Supports Hardware H.264, MPEG4 Part 2, VC-1, and MPEG2 decode
Block Diagram
91.00
87.00
* Optional and is not supported in standard model. Please contact your sales representative for more information.
APU (Accelerated Processing Unit)
• OT905-BT56N:
- AMD® T56N, 1.65GHz, 2x 512KB L2, 18W TDP, dual-core
- Cooling option: heat sink with cooling fan
• OT905-BT40N:
- AMD® T40N, 1.0GHz, 2x 512KB L2, 9W TDP, dual-core
- Cooling option: heat sink with cooling fan
DDR3
SODIMM
Mechanical Drawing
OT905-B Series
Features
COM Express® Basic Computer-On-Module
QM87
QM87
HM961-QM87
Model
COM Express® Basic Computer-On-Module
QM87
HM960-QM87
HM920-QM87
4th Generation
Intel® Core™ i7/i5/i3
Processor
2 DDR3L ECC SODIMM
up to 16GB
Memory
Display
4th Generation
Intel® Core™ i7/i5/i3
2 DDR3L SODIMM
up to 16GB
2 DDR3L SODIMM
up to 16GB
HM86
HM86
HM961-HM86
HM960-HM86
4th Generation
Intel® Core™ i7/i5/i3
2 DDR3L ECC SODIMM
up to 16GB
2 DDR3L SODIMM
up to 16GB
QM77
HM76
HM920-HM86
CR960-QM77
CR960-HM76
4th Generation
Intel® Core™ i7/i5/i3
3rd/2nd Generation
Intel® Core™ i7/i5/i3
3rd/2nd Generation
Intel® Core™ i7/i5/i3
2 DDR3L SODIMM
up to 16GB
2 DDR3/DDR3L SODIMM
up to 16GB
2 DDR3/DDR3L SODIMM
up to 16GB
HM86
VGA, LVDS, DDI
VGA, LVDS
VGA, LVDS, DDI
VGA, LVDS
VGA, LVDS and DDI
VGA, LVDS and DDI
1 Intel
1 Intel
1 Intel
1 Intel
1 Intel
1 Intel
USB 3.0
4
N/A
2
N/A
4
4
USB 2.0
8
8
8
8
8
8
SATA 3.0
4
4
2
2
2
2
SATA 2.0
N/A
N/A
2
2
2
2
SSD
Yes (option)
Yes (option)
Yes (option)
Yes (option)
Yes (option)
Yes (option)
IDE
N/A
1
N/A
1
N/A
N/A
eMMC
N/A
N/A
N/A
N/A
N/A
N/A
1
1
1
1
1
1
PCIe x4
N/A
N/A
N/A
N/A
N/A
N/A
PCIe x1
7
5
7
5
7
7
Mini PCIe
N/A
N/A
N/A
N/A
N/A
N/A
PCI
N/A
4
N/A
4
N/A
N/A
4-bit input and 4-bit output
4-bit input and 4-bit output
4-bit input and 4-bit output
4-bit input and 4-bit output
4-bit input and 4-bit output
4-bit input and 4-bit output
HDA
HDA
HDA
HDA
HDA
HDA
LPC
Yes
Yes
Yes
Yes
Yes
Yes
SMBus
Yes
Yes
Yes
Yes
Yes
Yes
CAN-bus
N/A
N/A
N/A
N/A
N/A
N/A
TPM (optional)
Yes
Yes
Yes
Yes
Yes
Yes
Watchdog
Yes
Yes
Yes
Yes
Yes
Yes
Power Input
12V, VCC_RTC, 5VSB (option)
12V, VCC_RTC, 5VSB (option)
12V, VCC_RTC, 5VSB (option)
12V, VCC_RTC, 5VSB (option)
5VSB (option), 12V, VCC_RTC
5VSB (option), 12V, VCC_RTC
Compliance
R2.1, Type 6
R2.1, Type 2
R2.1, Type 6
R2.1, Type 2
R2.1, Type 6
R2.1, Type 6
Dimensions
95mm x 125mm
95mm x 125mm
95mm x 125mm
95mm x 125mm
95mm x 125mm
95mm x 125mm
Ethernet
USB
Expansion
Digital I/O
Audio
Controller
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
COM Express Basic
PCIe x16
Computer-On-Module
Storage
COM Express® Basic Computer-On-Module
QM77
HM76
CR902-B
Model
CR902-BL
QM77
COM Express® Basic Computer-On-Module
QM77
CR901-B
CR900-B
QM67
HM65
HR902-B
HR902-BL
QM67
HM55
AMD R-Series
AMD R-Series
HR900-B
CP900-B
CM960-B
CM901-B
3rd/2nd Generation
Intel® Core™ i7/i5/i3
3rd/2nd Generation
Intel® Core™ i7/i5/i3
3rd/2nd Generation
Intel® Core™ i7/i5/i3
3rd/2nd Generation
Intel® Core™ i7/i5/i3
Intel® Core™ i7/i5
Intel® Celeron®
AMD® A70M
AMD® A70M
Memory
2 DDR3/DDR3L SODIMM
up to 16GB
2 DDR3/DDR3L SODIMM
up to 16GB
2 DDR3 SODIMM
up to 16GB
2 DDR3 SODIMM
up to 16GB
2 DDR3 SODIMM
up to 8GB
2 DDR3 SODIMM
up to 16GB
2 DDR3 SODIMM
up to 16GB
Display
VGA, LVDS, DDI
VGA, LVDS, DDI
VGA, LVDS
VGA, LVDS
3 Independent Displays
DP, DP/LVDS, DP/VGA
3 Independent Displays
DP, DP/LVDS, DP/VGA
1 Intel
1 Intel
1 Intel
1 Intel
1 Intel
N/A
N/A
N/A
4
4
Processor
Ethernet
3 Independent
Displays
VGA, LVDS, DDI
1 Intel
VGA, LVDS
1 Intel
USB 3.0
N/A
4
N/A
USB 2.0
8
8
8
8
8
4
4
SATA 3.0
2
2
2
2
N/A
4
4
SATA 2.0
2
2
2
2
4
N/A
N/A
N/A
Yes (option)
N/A
N/A
N/A
Yes (option)
Yes (option)
1 IDE
1 IDE
1 IDE
N/A
N/A
USB
IDE, FDD
eMMC
N/A
1 IDE
N/A
N/A
N/A
N/A
N/A
N/A
N/A
1
1
1
1
1
N/A
1
PCIe x8
N/A
N/A
N/A
N/A
N/A
1
N/A
PCIe x1
5
5
5
4
7
7
N/A
N/A
N/A
N/A
N/A
4
4
4
N/A
N/A
PCIe x16
Expansion
1 IDE
Mini PCIe
PCI
5
N/A
4
Digital I/O
7
N/A
N/A
4
8-bit
4-bit input and 4-bit output
8-bit
8-bit
8-bit
8-bit
8-bit
HDA
HDA
HDA
HDA
HDA
HDA
HDA
LPC
Yes
Yes
Yes
Yes
Yes
Yes
Yes
SMBus
Yes
N/A
Yes
Yes
Yes
N/A
N/A
CAN-bus
N/A
N/A
N/A
N/A
N/A
N/A
N/A
TPM (optional)
N/A
N/A
N/A
N/A
N/A
N/A
Watchdog
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Power Input
12V
12V
12V
12V
12V
12V/5VSB
12V/5VSB
Compliance
R2.1, Type 2
R2.1, Type 2
R1.0, Type 2
R1.0, Type 2
R2.1, Type 6
R2.1, Type 6
Dimensions
95mm x 125mm
95mm x 125mm
95mm x 125mm
95mm x 125mm
95mm x 125mm
95mm x 125mm
Audio
Controller
www.dfi.com
N/A
R2.1, Type 6
Yes
R2.1, Type 2
95mm x 125mm
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
COM Express Basic
SSD
Computer-On-Module
Storage
4th Gen Intel® CoreTM
COM Express® Basic
4th Gen Intel® CoreTM
COM Express® Basic
HM961-QM87
MEMORY
EXPANSION
QM87
2 DDR3L ECC SODIMM up to 16GB
1 PCIe x16, 7 PCIe x1
1 LPC, 1 I2C, 1 SMBus, 2 serial
1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP)
12 USB: 4 USB 3.0, 8 USB 2.0
4 SATA 3.0
SSD (optional)
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 6
95mm x 125mm (3.74" x 4.9")
BGA 1364
DDR3L_2
SODIMM
DDR3L_1
SODIMM
Intel QM87
LAN
DIMENSIONS
CPU Fan
Specifications
Please refer to the Ordering Information below
Mechanical Drawing
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/1.05V/DDR voltages and failure alarm
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4600
• Supports 1 VGA, 1 LVDS and 3 DDI
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to 1920x1200 @ 60Hz
• Digital Display Interface: HDMI, DVI and DP
• HDMI: resolution up to 4096x2304 @ 24Hz or 2560x1600 @ 60Hz
• DVI: resolution up to 1920x1200 @ 60Hz
• DP: resolution up to 3840x2160 @ 60Hz
• Intel® Clear Video Technology
• Intel® Advanced Vector Extensions (Intel® AVX) Instructions
• Supports DirectX 11.1, OpenGL 4.0, OpenCL 1.2
BIOS
• AMI BIOS
- 64Mbit SPI BIOS
WATCHDOG TIMER
• Software programmable from 1 to 255 seconds
POWER
• Input: 12V, VCC_RTC, 5VSB*
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
Block Diagram
POWER CONSUMPTION
• HM961-QM87BS4-4700EQ: 55.39W with i7-4700EQ at 2.4GHz and 2x 8GB
DDR3L SODIMM
ONBOARD LAN FEATURES
• Intel® I217LM with iAMT9.0 Gigabit Ethernet Phy
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
125.15
121.08
91.08
37.48
4.08
0.00
0.00
4.08
EXPANSION INTERFACES
• Supports 4 USB 3.0 interfaces
• Supports 8 USB 2.0 interfaces
• Supports 1 PCIe x16 Gen 3 interface
• Supports 7 PCIe x1 interfaces
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
SYSTEM MEMORY
• Two 204-pin DDR3L SODIMM sockets
• Supports DDR3L 1333/1600MHz ECC SODIMM
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3L DRAM technologies are
supported for x8 and x16 devices, ECC DRAM only
USB 3.0
SATA 3.0
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
CHIPSET
• Intel® QM87 Express Chipset
Optional
ECC
Memory
AMT
* Optional and is not supported in standard model. Please contact your sales representative for more information.
PROCESSOR
• 4th generation Intel® CoreTM processors
• BGA 1364 packaging technology
• 22nm process technology
SSD
45.61
(based on Intel's Windows XP support list)
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
USB INTERFACE
• XHCI Host Controller supports up to 4 super speed USB 3.0 ports
LVDS Ports
79.64
91.08
104.85
121.08
119.07
80.08
4.08
DDR3L SODIMM
(ECC Memory)
DDR3L SODIMM
(ECC Memory)
SSD*
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
Processor
eDP
PTN
3460
CORE CORE CORE
Channel A
/
1333/1600MHz
Channel B
/
1333/1600MHz
CORE
VR12.5
(Vcore)
4th Generation
Intel® Core™ i7/i5/i3
Graphics
CORE
DMI x4
(Direct Media
Interface)
®
Intel FDI
(Flexible Display
Interface)
HD Audio
LPC Bus
Bottom View
Backup
EEPROM
2.00
0.00
WDT
SM Bus
SLP/LID
0.00
12.50
70.20
Embedded
Controller
Serial Port 1, 2
Tx/Rx
53.00
Ordering Information
DDI Port C
4 in/4 out
DIO
SM Bus
DIO
DDI Port D
Mobile
Intel® QM87
Express Chipset
USB 3.0 4x
PCIe x1 Lane 7
USB 2.0 8x
SATA 3.0
3 0 4x
PCIe x1 Lane 8
(Opt. share with onboard LAN)
CRT
PCIe x1
x1, Lane 1~6
2nd SPI Bus
Sys FAN PWM/TACH_IN
LAN Port
SATA Port 4
SSD Chip
(option)
C/D
A/B
14.00
DDI Port B
LPC TPM 1.2
SLB9635(option)
I2C Bus
PCB
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R2.1, Type 6
INTEL ACTIVE MANAGEMENT TECHNOLOGY (AMT)
• Supports iAMT9.0
• Out-of-band system access
• Remote troubleshooting and recovery
• Hardware-based agent presence checking
• Proactive alerting
• Remote hardware and software asset tracking
PEG 16x LANES
Memory
Controller
HUMIDITY
• 5% to 90%
Model Name
Processor
HM961-QM87BS4-4700EQ Intel® CoreTM i7-4700EQ, 6M Cache, 2.4GHz (3.4GHz), 47W
HM961-QM87BS4-4400E
Intel® CoreTM i5-4400E, 3M Cache, 2.7GHz (3.3GHz), 37W
HM961-QM87BS0-4402E
HM961-QM87BS0-4100E
HM961-QM87BS0-4102E
Intel® CoreTM i5-4402E, 3M Cache, 1.6GHz (2.7GHz), 25W
Intel® CoreTM i3-4100E, 3M Cache, 2.4GHz, 37W
Intel® CoreTM i3-4102E, 3M Cache, 1.6GHz, 25W
SODIMM
2 (16GB DDR3L
2 (16GB DDR3L
2 (16GB DDR3L
2 (16GB DDR3L
2 (16GB DDR3L
ECC)
ECC)
ECC)
ECC)
ECC)
SSD
4GB
4GB
None
None
None
Power
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
Thermal
Fan
Fan
Fan
Fan
Fan
The following specifications will be available upon request. Please contact your sales representative for more information.
Model Name
HM961
-
Chipset
QM87
Temperature
B
B: 0oC to 60oC
Memory
S
S: Socket
PCIe x1, Lane 8
Intel® GLAN
PHY I217LM
SSD
0
0: None
2: 2GB
4: 4GB
8: 8GB
1: 16GB
3: 32GB
6: 64GB
-
Processors
4700EQ
4700EQ: Intel® CoreTM i7-4700EQ, 6M Cache, 2.4GHz (3.4GHz), 47W
4400E: Intel® CoreTM i5-4400E, 3M Cache, 2.7GHz (3.3GHz), 37W
4402E: Intel® CoreTM i5-4402E, 3M Cache, 1.6GHz (2.7GHz), 25W
4100E: Intel® CoreTM i3-4100E, 3M Cache, 2.4GHz, 37W
4102E: Intel® CoreTM i3-4102E, 3M Cache, 1.6GHz, 25W
Heat spreader
Packing List
22.00
Module PCB
2.00
11.00
55.00
20.00
Heat sink and fan
standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Temperature
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
•
•
•
•
1 HM961 board
1 QR (Quick Reference)
1 DVD
Heat spreader with heat sink and fan: 761-HSWMBL-000G
Optional Items
• COM331-B carrier board kit: 770-COM331-000G
• Heat spreader: A71-011029-000G
COM Express Basic
Top View
Computer-On-Module
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
SERIAL ATA (SATA) INTERFACE
• Supports 4 SATA 3.0 with data transfer rate up to 6Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1/5/10
• Supports Intel® Smart Response Technology
4.08
12.84
91.08
95.15
HM961-QM87
Features
4th Gen Intel® CoreTM
COM Express® Basic
4th Gen Intel® CoreTM
COM Express® Basic
HM960-QM87
MEMORY
EXPANSION
QM87
2 DDR3L SODIMM up to 16GB
1 PCIe x16, 7 PCIe x1
1 LPC, 1 I2C, 1 SMBus, 2 serial
1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP)
12 USB: 4 USB 3.0, 8 USB 2.0
4 SATA 3.0
SSD (optional)
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 6
95mm x 125mm (3.74" x 4.9")
BGA 1364
DDR3L_2
SODIMM
DDR3L_1
SODIMM
Intel QM87
LAN
DIMENSIONS
CPU Fan
Specifications
Please refer to the Ordering Information below
CHIPSET
• Intel® QM87 Express Chipset
SYSTEM MEMORY
• Two 204-pin DDR3L SODIMM sockets
• Supports DDR3L 1333/1600MHz SODIMM
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3L DRAM technologies are
supported for x8 and x16 devices, unbuffered, non-ECC
SSD
DDR3L
AMT
Mechanical Drawing
USB 3.0
SATA 3.0
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4600
• Supports 1 VGA, 1 LVDS and 3 DDI
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to 1920x1200 @ 60Hz
• Digital Display Interface: HDMI, DVI and DP
• HDMI: resolution up to 4096x2304 @ 24Hz or 2560x1600 @ 60Hz
• DVI: resolution up to 1920x1200 @ 60Hz
• DP: resolution up to 3840x2160 @ 60Hz
• Intel® Clear Video Technology
• Intel® Advanced Vector Extensions (Intel® AVX) Instructions
• Supports DirectX 11.1, OpenGL 4.0, OpenCL 1.2
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
Block Diagram
ONBOARD LAN FEATURES
• Intel® I217LM with iAMT9.0 Gigabit Ethernet Phy
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
125.15
121.08
91.08
37.48
4.08
0.00
0.00
4.08
* Optional and is not supported in standard model. Please contact your sales representative for more information.
PROCESSOR
• 4th generation Intel® CoreTM processors
• BGA 1364 packaging technology
• 22nm process technology
Optional
4.08
45.61
LVDS Ports
79.64
104.85
121.08
119.07
80.08
4.08
DDR3L
SODIMM
DDR3L
SODIMM
Processor
eDP
PTN
3460
91.08
USB INTERFACE
• XHCI Host Controller supports up to 4 super speed USB 3.0 ports
CORE CORE CORE
Channel A
/
1333/1600MHz
Channel B
/
1333/1600MHz
CORE
4th Generation;
Intel® Core™ i7/i5/i3
Graphics
CORE
PEG 16x LANES
Memory
Controller
DMI x4
(Direct Media
Interface)
SSD*
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
VR12.5
(Vcore)
INTEL ACTIVE MANAGEMENT TECHNOLOGY (AMT)
• Supports iAMT9.0
• Out-of-band system access
• Remote troubleshooting and recovery
• Hardware-based agent presence checking
• Proactive alerting
• Remote hardware and software asset tracking
®
Intel FDI
(Flexible Display
Interface)
LPC Bus
Backup
EEPROM
Bottom View
DDI Port B
LPC TPM 1.2
SLB9635(option)
I2C Bus
2.00
0.00
DDI Port C
WDT
Sys FAN PWM/
TACH_IN/
SLP/LID
Embedded
Controller
0.00
12.50
70.20
B
SM Bus
4 in/4 out
DIO
53.00
SM Bus
DIO
Serial Port 1, 2 Tx/Rx
C/D
A/B
14.00
HD Audio
USB 2.0
2 0 8x
8
3 0 4x
4
SATA 3.0
USB 3.0 4x
PCIe x1 Lane 7
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/1.05V/DDR voltages and failure alarm
BIOS
• AMI BIOS
- 64Mbit SPI BIOS
WATCHDOG TIMER
• Software programmable from 1 to 255 seconds
POWER
• Input: 12V, VCC_RTC, 5VSB*
POWER CONSUMPTION
• TBD
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
(based on Intel's Windows XP support list)
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 5% to 90%
PCB
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R2.1, Type 6
Ordering Information
DDI Port D
Mobile
Intel® QM87
Express Chipset
EXPANSION INTERFACES
• Supports 4 USB 3.0 interfaces
• Supports 8 USB 2.0 interfaces
• Supports 1 PCIe x16 Gen 3 interface
• Supports 7 PCIe x1 interfaces
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
Model Name
HM960-QM87BS0-4700EQ
HM960-QM87BS0-4400E
Processor
Intel® CoreTM i7-4700EQ, 6M Cache, 2.4GHz (3.4GHz), 47W
Intel® CoreTM i5-4400E, 3M Cache, 2.7GHz (3.3GHz), 37W
SODIMM
2 (16GB DDR3L)
2 (16GB DDR3L)
SSD
None
None
Power
ATX/AT
ATX/AT
Thermal
Cooler
Cooler
PCIe x1 Lane 8
(Opt. share with onboard LAN)
CRT
PCI x1,
PCIe
1 Lane
L
1~6
1 6
SPI Bus
LAN Port
SATA Ports
SSD Chip
(option)
PCIe x1, Lane 8
Intel® GLAN
PHY I217LM
Heat spreader
Packing List
22.00
Module PCB
2.00
11.00
55.00
20.00
Heat sink and fan
standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
•
•
•
•
1 HM960 board
1 QR (Quick Reference)
1 DVD
Heat spreader with heat sink and fan: 761-HSWMBL-000G
Optional Items
• COM331-B carrier board kit: 770-COM331-000G
• Heat spreader: A71-011029-000G
Temperature
0oC to 60oC
0oC to 60oC
COM Express Basic
SERIAL ATA (SATA) INTERFACE
• Supports 4 SATA 3.0 with data transfer rate up to 6Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1/5/10
• Supports Intel® Smart Response Technology
Top View
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
Computer-On-Module
12.84
91.08
95.15
HM960-QM87
Features
4th Gen Intel® CoreTM
COM Express® Basic
4th Gen Intel® CoreTM
COM Express® Basic
HM920-QM87
HM920-QM87
Features
MEMORY
EXPANSION
QM87
2 DDR3L SODIMM up to 16GB
1 PCIe x16, 5 PCIe x1, 4 PCI
1 LPC, 1 SMBus, 1 I2C, 1 IDE
1 VGA, 1 LVDS
8 USB 2.0
4 SATA 3.0
SSD (optional)
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 2
95mm x 125mm (3.74" x 4.9")
BGA 1364
DDR3L_2
SODIMM
DDR3L_1
SODIMM
Intel QM87
LAN
DIMENSIONS
CPU Fan
Specifications
PROCESSOR
• 4th generation Intel® CoreTM processors
• BGA 1364 packaging technology
• 22nm process technology
Please refer to the Ordering Information below
CHIPSET
• Intel® QM87 Express Chipset
SYSTEM MEMORY
• Two 204-pin DDR3L SODIMM sockets
• Supports DDR3L 1333/1600MHz SODIMM
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3L DRAM technologies are
supported for x8 and x16 devices, unbuffered, non-ECC
SSD
Optional
DDR3L
AMT 9.0
Mechanical Drawing
USB 2.0
SATA 3.0
121.00
117.00
87.00
0.00
4.00
SERIAL ATA (SATA) INTERFACE
• Supports 4 SATA 3.0 with data transfer rate up to 6Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1/5/10
• Supports Intel® Smart Response Technology
45.39
LVDS Port
LV
0.00
4.00
76.00
117.00
0.00
4.00
DDR3L
SODIMM
DDR3L
SODIMM
Processor
eDP
PTN
3460
CORE CORE CORE
Channel A
/
1333/1600MHz
Channel B
/
1333/1600MHz
Graphics
CORE
VR12.5
(Vcore)
PEG 16x LANES
Memory
Controller
DMI x4
(Direct Media
Interface)
SSD*
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
CORE
4th Generation;
Intel® Core™ i7/i5/i3
Intel® FDI
(Flexible Display
Interface)
PCIe x1
Lane 7
Bottom View
IT8892E
PCIe to PCI
PCI BUS
LPC Bus
2.00
0.00
CMOS
backup
C/D
A/B
14.00
LPC TPM 1.2
SLB9635(option)
I2C
Bus
0.00
12.50
70.20
PCIe x1
Lane 6
Embedded
Controller
WDT
SM Bus
53.00
n/4 outt
4 iin/4
DIO
SM Bus
DIO
IDB368
PCIe to PATA
Mobile Intel
QM87
Express Chipset
USB 2.0 8x
CRT
PCI x1,
PCIe
1 Lane
L
1
1~5
5
PCIe x1, Lane 8
SATA Port
SSD Chip
(option)
EXPANSION INTERFACES
• Supports 8 USB 2.0 interfaces
• Supports 1 PCIe x16 Gen 3 interface
• Supports 5 PCIe x1 interfaces
• Supports 4 PCI interfaces (PCI 2.3)
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports IDE interface
• Supports 4-bit input and 4-bit output GPIO
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/1.05V/DDR voltages and failure alarm
BIOS
• AMI BIOS
- 64Mbit SPI BIOS
WATCHDOG TIMER
• Software programmable from 1 to 255 seconds
POWER
• Input: 12V, VCC_RTC, 5VSB*
POWER CONSUMPTION
• TBD
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
(based on Intel's Windows XP support list)
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 5% to 90%
PCB
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R2.1, Type 2
Ordering Information
IDE BUS
S
®
SATA 3.0
3 0 4x
4
LAN Port
INTEL ACTIVE MANAGEMENT TECHNOLOGY (AMT)
• Supports iAMT9.0
• Out-of-band system access
• Remote troubleshooting and recovery
• Hardware-based agent presence checking
• Proactive alerting
• Remote hardware and software asset tracking
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
Model Name
HM920-QM87BS0-4700EQ
HM920-QM87BS0-4700EQ
Processor
Intel® CoreTM i7-4700EQ, 6M Cache, 2.4GHz (3.4GHz), 47W
Intel® CoreTM i7-4700EQ, 6M Cache, 2.4GHz (3.4GHz), 47W
HM920-QM87BS0-4400E
HM920-QM87BS0-4400E
Intel® CoreTM i5-4400E, 3M Cache, 2.7GHz (3.3GHz), 37W
Intel® CoreTM i5-4400E, 3M Cache, 2.7GHz (3.3GHz), 37W
HM920-QM87BS0-4402E
HM920-QM87BS0-4402E
Intel® CoreTM i5-4402E, 3M Cache, 1.6GHz (2.7GHz), 25W
Intel® CoreTM i5-4402E, 3M Cache, 1.6GHz (2.7GHz), 25W
SODIMM
2 (16GB DDR3L)
2 (16GB DDR3L)
2 (16GB DDR3L)
2 (16GB DDR3L)
2 (16GB DDR3L)
2 (16GB DDR3L)
SSD
None
None
None
None
None
None
Power
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
Thermal
None
Cooler
None
Cooler
None
Cooler
Intel® GLAN
PHY I217LM
Heat spreader
Packing List
22.00
Module PCB
2.00
11.00
55.00
20.00
Heat sink and fan
standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
•
•
•
•
1 HM920 board
1 QR (Quick Reference)
1 DVD
Heat spreader with heat sink and fan: 761-HSWMBL-000G
Optional Items
• COM330-B carrier board kit: 770-COM330-000G
• Heat spreader: A71-011029-000G
Temperature
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
COM Express Basic
Top View
IDE INTERFACE
• Supports one IDE device
• DMA mode: Ultra ATA up to 100MB/s
• PIO mode: up to 16MB/s
Computer-On-Module
ONBOARD LAN FEATURES
• Intel® I217LM with iAMT9.0 Gigabit Ethernet Phy
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
91.00
87.00
0.00
4.00
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4600
• Supports 1 VGA and 1 LVDS
• VGA: resolution up to 2048x1536 @ 60Hz
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to 1920x1200 @ 60Hz
• Intel® Clear Video Technology
• Intel® Advanced Vector Extensions (Intel® AVX) Instructions
• Supports DirectX 11.1, OpenGL 4.0, OpenCL 1.2
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
Block Diagram
91.00
87.00
* Optional and is not supported in standard model. Please contact your sales representative for more information.
4th Gen Intel® CoreTM
COM Express® Basic
4th Gen Intel® CoreTM
COM Express® Basic
HM961-HM86
MEMORY
EXPANSION
HM86
2 DDR3L ECC SODIMM up to 16GB
1 PCIe x16, 7 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP)
2 USB 3.0, 8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
SSD (optional)
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 6
95mm x 125mm (3.74" x 4.9")
BGA 1364
DDR3L_2
SODIMM
DDR3L_1
SODIMM
Intel HM86
LAN
DIMENSIONS
CPU Fan
Specifications
Mechanical Drawing
DIO
CHIPSET
• Intel® HM86 Express Chipset
SYSTEM MEMORY
• Two 204-pin DDR3L SODIMM sockets
• Supports DDR3L 1333/1600MHz ECC SODIMM
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3L DRAM technologies are
supported for x8 and x16 devices, ECC DRAM only
USB 3.0
SATA 3.0
Block Diagram
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/1.05V/DDR voltages and failure alarm
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4600
• Supports 1 VGA, 1 LVDS and 3 DDI
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to 1920x1200 @ 60Hz
• Digital Display Interface: HDMI, DVI and DP
• HDMI: resolution up to 4096x2304 @ 24Hz or 2560x1600 @ 60Hz
• DVI: resolution up to 1920x1200 @ 60Hz
• DP: resolution up to 3840x2160 @ 60Hz
• Intel® Clear Video Technology
• Intel® Advanced Vector Extensions (Intel® AVX) Instructions
• Supports DirectX 11.1, OpenGL 4.0, OpenCL 1.2
BIOS
• AMI BIOS
- 64Mbit SPI BIOS
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
WATCHDOG TIMER
• Software programmable from 1 to 255 seconds
POWER
• Input: 12V, VCC_RTC, 5VSB*
POWER CONSUMPTION
• TBD
ONBOARD LAN FEATURES
• Intel® I217LM Gigabit Ethernet Phy
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
125.15
121.08
91.08
37.48
4.08
0.00
0.00
4.08
EXPANSION INTERFACES
• Supports 2 USB 3.0 interfaces
• Supports 8 USB 2.0 interfaces
• Supports 1 PCIe x16 Gen 3 interface
• Supports 7 PCIe x1 interfaces
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
Please refer to the Ordering Information below
Optional
ECC
Memory
* Optional and is not supported in standard model. Please contact your sales representative for more information.
PROCESSOR
• 4th generation Intel® CoreTM processors
• BGA 1364 packaging technology
• 22nm process technology
SSD
4.08
(based on Intel's Windows XP support list)
45.61
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 5% to 90%
USB INTERFACE
• XHCI Host Controller supports up to 2 super speed USB 3.0 ports
LVDS Ports
79.64
91.08
104.85
121.08
119.07
80.08
4.08
DDR3L SODIMM
(ECC Memory)
DDR3L SODIMM
(ECC Memory)
Processor
eDP
PTN
3460
CORE CORE CORE
Channel A
1333/1600MHz
/
Channel B
1333/1600MHz
/
VR12.5
(Vcore)
4th Generation
Intel® Core™ i7/i5/i3
Graphics
CORE
PEG 16x LANES
Memory
Controller
DMI x4
(Direct Media
Interface)
PCB
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R2.1, Type 6
SSD*
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
CORE
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
®
Intel FDI
(Flexible Display
Interface)
HD Audio
LPC Bus
Bottom View
Backup
EEPROM
2.00
0.00
WDT
DDI Port C
SM Bus
SLP/LID
0.00
12.50
70.20
Embedded
Controller
Serial Port 1, 2
Tx/Rx
4 in/4 out
DIO
53.00
Ordering Information
LPC TPM 1.2
SLB9635(option)
I2C Bus
SM Bus
DIO
DDI Port D
Mobile
Intel® HM86
Express Chipset
USB 3.0 4x
PCIe x1 Lane 7
USB 2.0 8x
SATA 3.0
3 0 2x
2x, SATA 2.0
2 0 2x
PCIe x1 Lane 8
(Opt. share with onboard LAN)
CRT
PCIe x1
x1, Lane 1~6
2nd SPI Bus
Sys FAN PWM/TACH_IN
LAN Port
SATA Port 4
SSD Chip
(option)
C/D
A/B
14.00
DDI Port B
Model Name
Processor
HM961-HM86BS0-4700EQ Intel® CoreTM i7-4700EQ, 6M Cache, 2.4GHz (3.4GHz), 47W
HM961-HM86BS0-4400E
Intel® CoreTM i5-4400E, 3M Cache, 2.7GHz (3.3GHz), 37W
HM961-HM86BS0-4402E
HM961-HM86BS0-4100E
HM961-HM86BS0-4102E
Intel® CoreTM i5-4402E, 3M Cache, 1.6GHz (2.7GHz), 25W
Intel® CoreTM i3-4100E, 3M Cache, 2.4GHz, 37W
Intel® CoreTM i3-4102E, 3M Cache, 1.6GHz, 25W
SODIMM
2 (16GB DDR3L
2 (16GB DDR3L
2 (16GB DDR3L
2 (16GB DDR3L
2 (16GB DDR3L
ECC)
ECC)
ECC)
ECC)
ECC)
SSD
None
None
None
None
None
Power
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
Thermal
Fan
Fan
Fan
Fan
Fan
The following specifications will be available upon request. Please contact your sales representative for more information.
Model Name
HM961
-
Chipset
HM86
Temperature
B
B: 0oC to 60oC
Memory
S
S: Socket
PCIe x1, Lane 8
Intel® GLAN
PHY I217LM
SSD
0
0: None
2: 2GB
4: 4GB
8: 8GB
1: 16GB
3: 32GB
6: 64GB
-
Processors
4700EQ
4700EQ: Intel® CoreTM i7-4700EQ, 6M Cache, 2.4GHz (3.4GHz), 47W
4400E: Intel® CoreTM i5-4400E, 3M Cache, 2.7GHz (3.3GHz), 37W
4402E: Intel® CoreTM i5-4402E, 3M Cache, 1.6GHz (2.7GHz), 25W
4100E: Intel® CoreTM i3-4100E, 3M Cache, 2.4GHz, 37W
4102E: Intel® CoreTM i3-4102E, 3M Cache, 1.6GHz, 25W
Heat spreader
Packing List
22.00
Module PCB
2.00
11.00
55.00
20.00
Heat sink and fan
standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Temperature
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
•
•
•
•
1 HM961 board
1 QR (Quick Reference)
1 DVD
Heat spreader with heat sink and fan: 761-HSWMBL-000G
Optional Items
• COM331-B carrier board kit: 770-COM331-000G
• Heat spreader: A71-011029-000G
COM Express Basic
SERIAL ATA (SATA) INTERFACE
• Supports 2 SATA 3.0, and 2 SATA 2.0
• Supports 2 SATA 3.0, 1 SATA 2.0, and 1 SSD*
• Integrated Advanced Host Controller Interface (AHCI) controller
Top View
Computer-On-Module
12.84
91.08
95.15
HM961-HM86
Features
4th Gen Intel® CoreTM
COM Express® Basic
4th Gen Intel® CoreTM
COM Express® Basic
HM960-HM86
MEMORY
EXPANSION
HM86
2 DDR3L SODIMM up to 16GB
1 PCIe x16, 7 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP)
2 USB 3.0, 8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
SSD (optional)
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 6
95mm x 125mm (3.74" x 4.9")
BGA 1364
DDR3L_2
SODIMM
DDR3L_1
SODIMM
Intel HM86
LAN
DIMENSIONS
CPU Fan
Specifications
Please refer to the Ordering Information below
CHIPSET
• Intel® HM86 Express Chipset
SYSTEM MEMORY
• Two 204-pin DDR3L SODIMM sockets
• Supports DDR3L 1333/1600MHz SODIMM
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3L DRAM technologies are
supported for x8 and x16 devices, unbuffered, non-ECC
Optional
DDR3L
Mechanical Drawing
DIO
USB 3.0
SATA 3.0
Block Diagram
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4600
• Supports 1 VGA, 1 LVDS and 3 DDI
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to 1920x1200 @ 60Hz
• Digital Display Interface: HDMI, DVI and DP
• HDMI: resolution up to 4096x2304 @ 24Hz or 2560x1600 @ 60Hz
• DVI: resolution up to 1920x1200 @ 60Hz
• DP: resolution up to 3840x2160 @ 60Hz
• Intel® Clear Video Technology
• Intel® Advanced Vector Extensions (Intel® AVX) Instructions
• Supports DirectX 11.1, OpenGL 4.0, OpenCL 1.2
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
125.15
121.08
91.08
37.48
4.08
0.00
0.00
4.08
* Optional and is not supported in standard model. Please contact your sales representative for more information.
PROCESSOR
• 4th generation Intel® CoreTM processors
• BGA 1364 packaging technology
• 22nm process technology
SSD
Top View
SERIAL ATA (SATA) INTERFACE
• Supports 2 SATA 3.0, and 2 SATA 2.0
• Supports 2 SATA 3.0, 1 SATA 2.0, and 1 SSD*
• Integrated Advanced Host Controller Interface (AHCI) controller
45.61
LVDS Ports
79.64
104.85
121.08
119.07
80.08
4.08
DDR3L
SODIMM
DDR3L
SODIMM
Processor
eDP
PTN
3460
91.08
CORE CORE CORE
Channel A
/
1333/1600MHz
Channel B
/
1333/1600MHz
VR12.5
(Vcore)
4th Generation;
Intel® Core™ i7/i5/i3
Graphics
CORE
SSD*
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
PEG 16x LANES
Memory
Controller
DMI x4
(Direct Media
Interface)
USB INTERFACE
• XHCI Host Controller supports up to 2 super speed USB 3.0 ports
CORE
®
Intel FDI
(Flexible Display
Interface)
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
LPC Bus
Backup
EEPROM
Bottom View
DDI Port B
DDI Port C
WDT
Sys FAN PWM/
TACH_IN/
SLP/LID
Embedded
Controller
0.00
12.50
70.20
B
SM Bus
4 in/4 out
DIO
53.00
SM Bus
DIO
Serial Port 1, 2 Tx/Rx
C/D
A/B
2.00
0.00
BIOS
• AMI BIOS
- 64Mbit SPI BIOS
WATCHDOG TIMER
• Software programmable from 1 to 255 seconds
POWER
• 12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
POWER CONSUMPTION
• HM960-HM86BS0-4400E: 41.57W with i5-4400E at 2.7GHz and 1x 8GB
DDR3 SODIMM
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
(based on Intel's Windows XP support list)
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 5% to 90%
PCB
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R2.1, Type 6
LPC TPM 1.2
SLB9635(option)
I2C Bus
14.00
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/1.05V/DDR voltages and failure alarm
Ordering Information
DDI Port D
Mobile
Intel® HM86
Express Chipset
HD Audio
USB 2.0
2 0 8x
8
3.0
02
2x, SATA 2.0
202
2x
SATA 3
USB 3.0 2x
PCIe x1 Lane 7
Model Name
HM960-HM86BS0-4400E
HM960-HM86BS0-4402E
Processor
Intel® CoreTM i5-4400E, 3M Cache, 2.7GHz (3.3GHz), 37W
Intel® CoreTM i5-4402E, 3M Cache, 1.6GHz (2.7GHz), 25W
HM960-HM86BS0-4102E
Intel® CoreTM i3-4102E, 3M Cache, 1.6GHz, 25W
SODIMM
2 (16GB DDR3L)
2 (16GB DDR3L)
2 (16GB DDR3L)
SSD
None
None
None
Power
ATX/AT
ATX/AT
ATX/AT
Thermal
Cooler
Cooler
Cooler
PCIe x1 Lane 8
(Opt. share with onboard LAN)
CRT
PCI x1,
PCIe
1 Lane
L
1~6
1 6
SPI Bus
LAN Port
SATA Ports
SSD Chip
(option)
PCIe x1, Lane 8
Intel® GLAN
PHY I217LM
Heat spreader
Packing List
22.00
Module PCB
2.00
11.00
55.00
20.00
Heat sink and fan
standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
•
•
•
•
1 HM960 board
1 QR (Quick Reference)
1 DVD
Heat spreader with heat sink and fan: 761-HSWMBL-000G
Optional Items
• COM331-B carrier board kit: 770-COM331-000G
• Heat spreader: A71-011029-000G
Temperature
0oC to 60oC
0oC to 60oC
0oC to 60oC
COM Express Basic
12.84
EXPANSION INTERFACES
• Supports 2 USB 3.0 interfaces
• Supports 8 USB 2.0 interfaces
• Supports 1 PCIe x16 Gen 3 interface
• Supports 7 PCIe x1 interfaces
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
Computer-On-Module
ONBOARD LAN FEATURES
• Intel® I217LM Gigabit Ethernet Phy
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
4.08
91.08
95.15
HM960-HM86
Features
4th Gen Intel® CoreTM
COM Express® Basic
4th Gen Intel® CoreTM
COM Express® Basic
HM920-HM86
HM920-HM86
Features
MEMORY
EXPANSION
HM86
2 DDR3L SODIMM up to 16GB
1 PCIe x16, 5 PCIe x1, 4 PCI
1 LPC, 1 SMBus, 1 I2C, 1 IDE
1 VGA, 1 LVDS
8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
SSD (optional)
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 2
95mm x 125mm (3.74" x 4.9")
BGA 1364
DDR3L_2
SODIMM
DDR3L_1
SODIMM
Intel HM86
LAN
DIMENSIONS
CPU Fan
Specifications
PROCESSOR
• 4th generation Intel® CoreTM processors
• BGA 1364 packaging technology
• 22nm process technology
Please refer to the Ordering Information below
CHIPSET
• Intel® HM86 Express Chipset
SSD
Optional
DDR3L
Mechanical Drawing
DIO
USB 2.0
SATA 3.0
SYSTEM MEMORY
• Two 204-pin DDR3L SODIMM sockets
• Supports DDR3L 1333/1600MHz SODIMM
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3L DRAM technologies are
supported for x8 and x16 devices, unbuffered, non-ECC
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4600
• Supports 1 VGA and 1 LVDS
• VGA: resolution up to 2048x1536 @ 60Hz
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to 1920x1200 @ 60Hz
• Intel® Clear Video Technology
• Intel® Advanced Vector Extensions (Intel® AVX) Instructions
• Supports DirectX 11.1, OpenGL 4.0, OpenCL 1.2
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
Block Diagram
121.00
117.00
87.00
0.00
4.00
SERIAL ATA (SATA) INTERFACE
• Supports 2 SATA 3.0, 2 SATA 2.0
• Supports 2 SATA 3.0, 1 SATA 2.0, and 1 SSD*
• Integrated Advanced Host Controller Interface (AHCI) controller
LVDS Port
LV
PTN
3460
0.00
4.00
0.00
4.00
76.00
117.00
0.00
4.00
DDR3L
SODIMM
DDR3L
SODIMM
Processor
eDP
CORE CORE CORE
Channel A
/
1333/1600MHz
Channel B
/
1333/1600MHz
Graphics
CORE
VR12.5
(Vcore)
PEG 16x LANES
Memory
Controller
DMI x4
(Direct Media
Interface)
SSD*
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
CORE
4th Generation;
Intel® Core™ i7/i5/i3
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
®
Intel FDI
(Flexible Display
Interface)
PCIe x1
Lane 7
Bottom View
IT8892E
PCIe to PCI
I2C
Bus
0.00
12.50
70.20
WDT
4 in/4 out
DIO
LPC TPM 1.2
SLB9635(option))
PCIe x1
Lane 6
Embedded
Controller
SM Bus
53.00
C/D
A/B
2.00
0.00
CMOS
backup
SM Bus
DIO
IDB368
PCIe to PATA
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/1.05V/DDR voltages and failure alarm
BIOS
• AMI BIOS
- 64Mbit SPI BIOS
WATCHDOG TIMER
• Software programmable from 1 to 255 seconds
POWER
• Input: 12V, VCC_RTC, 5VSB*
POWER CONSUMPTION
• HM920-HM86BS0-4100E: 37.62W with i3-4100E at 2.4GHz and 1x 4GB
DDR3L SODIMM
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
(based on Intel's Windows XP support list)
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 5% to 90%
PCB
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R2.1, Type 2
PCI BUS
Ordering Information
LPC Bus
14.00
EXPANSION INTERFACES
• Supports 8 USB 2.0 interfaces
• Supports 1 PCIe x16 Gen 3 interface
• Supports 5 PCIe x1 interfaces
• Supports 4 PCI interfaces (PCI 2.3)
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports IDE interface
• Supports 4-bit input and 4-bit output GPIO
S
IDE BUS
Mobile Intel®
HM86
Express Chipset
USB 2.0 8x
SATA 3.0 2x, SATA 2.0 2x
Model Name
HM920-HM86BS0-4400E
HM920-HM86BS0-4400E
Processor
Intel® CoreTM i5-4400E, 3M Cache, 2.7GHz (3.3GHz), 37W
Intel® CoreTM i5-4400E, 3M Cache, 2.7GHz (3.3GHz), 37W
HM920-HM86BS0-4402E
HM920-HM86BS0-4402E
Intel® CoreTM i5-4402E, 3M Cache, 1.6GHz (2.7GHz), 25W
Intel® CoreTM i5-4402E, 3M Cache, 1.6GHz (2.7GHz), 25W
HM920-HM86BS0-2000E
HM920-HM86BS0-2002E
Intel® Celeron® 2000E, 2M Cache, 2.2GHz, 37W
Intel® Celeron® 2002E, 2M Cache, 1.5GHz, 25W
SODIMM
2 (16GB DDR3L)
2 (16GB DDR3L)
2 (16GB DDR3L)
2 (16GB DDR3L)
2 (16GB DDR3L)
2 (16GB DDR3L)
SSD
None
None
None
None
None
None
Power
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
Thermal
None
Cooler
None
Cooler
Cooler
Cooler
CRT
PCIe x1, Lane 1~5
LAN Port
PCIe x1, Lane 8
SATA Port
SSD Chip
(option)
Intel® GLAN
PHY I217LM
Heat spreader
Packing List
22.00
Module PCB
2.00
11.00
55.00
20.00
Heat sink and fan
standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
•
•
•
•
1 HM920 board
1 QR (Quick Reference)
1 DVD
Heat spreader with heat sink and fan: 761-HSWMBL-000G
Optional Items
• COM330-B carrier board kit: 770-COM330-000G
• Heat spreader: A71-011029-000G
Temperature
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
COM Express Basic
Top View
45.39
IDE INTERFACE
• Supports one IDE device
• DMA mode: Ultra ATA up to 100MB/s
• PIO mode: up to 16MB/s
Computer-On-Module
ONBOARD LAN FEATURES
• Intel® I217LM Gigabit Ethernet Phy
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
91.00
87.00
91.00
87.00
* Optional and is not supported in standard model. Please contact your sales representative for more information.
3rd Gen Intel® CoreTM
COM Express® Basic
3rd Gen Intel® CoreTM
COM Express® Basic
CR960-QM77
MEMORY
EXPANSION
QM77
2 DDR3/DDR3L SODIMM up to 16GB
1 PCIe x16, 7 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP/SDVO)
12 USB: 4 USB 3.0, 8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
SSD (optional)
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 6
95mm x 125mm (3.74" x 4.9")
BGA 1023
DDR3_2
SODIMM
DDR3_1
SODIMM
Intel QM77
CPU Fan
LAN
DIMENSIONS
SSD
Optional
Mechanical Drawing
Block Diagram
PROCESSOR
• BGA 1023 packaging technology
- 3rd generation Intel® CoreTM processors (22nm process technology)
Please refer to the Ordering Information below
CHIPSET
• Intel® QM77 Express Chipset
SYSTEM MEMORY
• Two 204-pin DDR3/DDR3L SODIMM sockets
• Supports DDR3/DDR3L 1333/1600 MHz (i7/i5/i3)
Supports DDR3/DDR3L 1066/1333/1600 MHz (i7 Quad Core)
• Supports dual channel memory interface
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM technologies are
supported for x8 and x16 devices, unbuffered, non-ECC
121.00
76.00
0.00
4.00
117.00
DDR3
SODIMM
91.00
Channel A
1
/ 600
1333/1600MHz
Processor
CORE CORE CORE
Channel B
1
1333/1600MHz
CORE
IMVP7
(Vcore,Vgfx)
3rd Generation
Intel® Core™ i7/i5/i3
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4000
• Supports VGA, LVDS and DDI interfaces
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit, resolution up to
1920x1200 @ 60Hz
• Digital Display Interfaces: HDMI, DVI, DP or SDVO (for Port B)
• HDMI, DVI, DP: resolution up to 1920x1200 @ 60Hz
• Intel® Clear Video Technology
• DirectX Video Acceleration (DXVA) for accelerating video processing
- Full AVC/VC1/MPEG2 HW Decode
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0
PEG 16X LANES
Memory
Controller
Graphics
CORE
FDI
LPC Bus
WDT
Serial Port 0/1
System Fan Embedded
/
PWM/TACH_IN
DDI Port C
I2C
Backup
EEPROM
DDI Port D
SM Bus
S
DIO SMBus
HD Audio
2 0 8x
USB 2.0
0.00
12.50
70.20
2.00
0.00
Panther Point
Mobile
Intel® QM77
USB 3.0 4x
PCIe x1/ Lane 7
SATA 2.0
2 0 4x
LVDS (Dual
(D l Channel)
Ch
l)
CRT
125.00
PCIe x1/ Lane 8
(Opt. share with on board LAN)
PCIe x1/Lanes 1~6
87.00
SPI Bus
SPI Flash
95.00
87.00
LAN Ports
TEMPERATURE
• 0oC to 60oC
SATA Ports 4
( p )
(Opt.)
CR960-QM77BS0-3612QE
CR960-QM77BS0-3517UE
CR960-QM77BS0-3610ME
CR960-QM77BS0-3555LE
Model Name
CR960
-
SSD Chip
Chipset
QM77
Temperature
B
B: 0oC to 60oC
Memory
S
S: Socket
Packing List
Module PCB
Standoff
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
SODIMM
2 (16GB DDR3L)
2 (16GB DDR3L)
2 (16GB DDR3L)
2 (16GB DDR3L)
2 (16GB DDR3L)
2 (16GB DDR3L)
SSD
None
None
None
None
None
None
Power
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
Thermal
Fan
Fan
Fan
Fan
Fan
Fan
Temperature
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
The following specifications will be available upon request. Please contact your sales representative for more information.
Fan
Heat spreader
PCB
• Dimensions: 95mm (3.74") x 125mm (4.9")
• Compliance: PICMG COM Express® R2.1 basic form factor, Type 6
Intel® CoreTM i7-3612QE, 6M Cache, 2.1GHz (3.1GHz), 35W
Intel® CoreTM i7-3517UE, 4M Cache, 1.7GHz (2.8GHz), 17W
Intel® CoreTM i5-3610ME, 3M Cache, 2.7GHz (3.3GHz), 35W
Intel® CoreTM i7-3555LE, 4M Cache, 2.5GHz (3.2GHz), 25W
PCIe x1,
PCI
1 LLane 8
Heatsink
HUMIDITY
• 5% to 90%
Model Name
Processor
CR960-QM77BS0-3120ME Intel® CoreTM i3-3120ME, 3M Cache, 2.4GHz, 35W
CR960-QM77BS0-3615QE Intel® CoreTM i7-3615QE, 6M Cache, 2.3GHz (3.3GHz), 45W
Intel® GLAN
PHY 82579LM
22.00
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
Ordering Information
DDI Port B/SDVO Port B
Controler
8bit DIO
14.00
LPC TPM
1.2 (Opt.)
C/D
A/B
Bottom View
11.00
POWER CONSUMPTION
• CR960-QM77BS0-3120ME: 45.46W with i3-3120ME at 2.4GHz and 2x 4GB
DDR3L SODIMM
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
DMI x4
(Direct Media
Interface)
SLP/LID
55.00
POWER
• Input: 5VSB*, 12V, VCC_RTC
SSD*
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
125.00
53.00
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
•
•
•
•
1 CR960 board
1 QR (Quick Reference)
1 DVD
Heat spreader with heat sink and fan: 761-CR9601-000G
SSD
0
0: None
2: 2GB
4: 4GB
8: 8GB
1: 16GB
3: 32GB
6: 64GB
-
Processors
3615QE
3615QE: Intel® CoreTM i7-3615QE, 6M Cache, 2.3GHz (3.3GHz), 45W
3612QE: Intel® CoreTM i7-3612QE, 6M Cache, 2.1GHz (3.1GHz), 35W
3555LE: Intel® CoreTM i7-3555LE, 4M Cache, 2.5GHz (3.2GHz), 25W
3517UE: Intel® CoreTM i7-3517UE, 4M Cache, 1.7GHz (2.8GHz), 17W
3610ME: Intel® CoreTM i5-3610ME, 3M Cache, 2.7GHz (3.3GHz), 35W
3120ME: Intel® CoreTM i3-3120ME, 3M Cache, 2.4GHz, 35W
Optional Items
• COM331-B carrier board kit: 770-COM331-000G
COM Express Basic
87.00
www.dfi.com
BIOS
• 64Mbit SPI BIOS
Computer-On-Module
DDR3
SODIMM
53.00
EXPANSION INTERFACES
• Supports 4 USB 3.0 ports
• Supports 8 USB 2.0 ports
• Supports 1 PCIe x16 interface
• Supports 7 PCIe x1 interfaces
• Supports LPC interface
• Supports I2C interface
• Supports SMBus interface
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
SERIAL ATA (SATA) INTERFACE
• Supports 4 Serial ATA interfaces
• 2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1/5/10
95.00 Top View
87.00
91.00
* Optional and is not supported in standard model. Please contact your sales representative for more information.
ONBOARD LAN FEATURES
• Intel® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
4.00
0.00
0.00
Specifications
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
121.00
117.00
87.00
4.00
0.00
4.00
CR960-QM77
Features
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
CR960-HM76
MEMORY
EXPANSION
HM76
2 DDR3/DDR3L SODIMM up to 16GB
1 PCIe x16, 7 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP/SDVO)
12 USB: 4 USB 3.0, 8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
SSD (optional)
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 6
95mm x 125mm (3.74" x 4.9")
BGA 1023
DDR3_2
SODIMM
DDR3_1
SODIMM
Intel HM76
CPU Fan
LAN
DIMENSIONS
SSD
Optional
HM76
Mechanical Drawing
Block Diagram
121.00
117.00
87.00
4.00
0.00
4.00
PROCESSOR
• BGA 1023 packaging technology
- 3rd generation Intel® CoreTM processors (22nm process technology)
- 2nd generation Intel® CoreTM processors (32nm process technology)
Please refer to the Ordering Information below
CHIPSET
• Intel® HM76 Express Chipset
SYSTEM MEMORY
• Two 204-pin DDR3/DDR3L SODIMM sockets
• 3rd generation processors
- Supports DDR3/DDR3L 1333/1600 MHz
• 2nd generation processors
- Supports DDR3 1066/1333 MHz
• Supports dual channel memory interface
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM technologies are
supported for x8 and x16 devices, unbuffered, non-ECC
CORE CORE CORE
Channel B
1
1333/1600MHz
CORE
IMVP7
(Vcore,Vgfx)
3rd/2nd Generation
Intel® Core™ i7/i5/i3
DMI x4
(Direct Media
Interface)
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4000 (3rd generation processors)
• Intel® HD Graphics 3000 (2nd generation processors)
• Intel® HD Graphics (Intel® CeleronTM processors)
• Supports VGA, LVDS and DDI interfaces
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit, resolution up to
1920x1200 @ 60Hz
• Digital Display Interfaces: HDMI, DVI, DP or SDVO (for Port B)
• HDMI, DVI, DP: resolution up to 1920x1200 @ 60Hz
• Intel® Clear Video Technology
• DirectX Video Acceleration (DXVA) for accelerating video processing
- Full AVC/VC1/MPEG2 HW Decode
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0 (3rd generation processors)
• Supports DirectX 10.1/10/9 and OpenGL 3.0 (2nd generation processors)
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
TEMPERATURE
• 0oC to 60oC
HUMIDITY
• 5% to 90%
DDI Port C
I2C
Backup
EEPROM
DDI Port D
SM Bus
S
DIO SMBus
HD Audio
Panther Point
Mobile
Intel® HM76
2 0 8x
USB 2.0
0.00
12.50
70.20
2.00
0.00
USB 3.0 4x
PCIe x1/ Lane 7
SATA 2.0
2 0 4x
LVDS (Dual
(D l Channel)
Ch
l)
CRT
125.00
PCIe x1/ Lane 8
(Opt. share with on board LAN)
PCIe x1/Lanes 1~6
87.00
SPI Bus
SPI Flash
LAN Ports
95.00
87.00
PCB
• Dimensions: 95mm (3.74") x 125mm (4.9")
• Compliance: PICMG COM Express® R2.1 basic form factor, Type 6
DDI Port B/SDVO Port B
Controler
8bit DIO
14.00
LPC TPM
1.2 (Opt.)
SATA Ports 4
( p )
(Opt.)
SSD Chip
C/D
A/B
Bottom View
Ordering Information
Model Name
CR960-HM76BS0-810E
CR960-HM76BS0-847E
Processor
Intel® CeleronTM B810E, 2M Cache, 1.6GHz, 35W
Intel® CeleronTM 847E, 2M Cache, 1.1GHz, 17W
CR960-HM76BS0-827E
Intel® CeleronTM 827E, 1.5M Cache, 1.4GHz, 17W
CR960-HM76BS0-1020E
Intel® CeleronTM 1020E, 2M Cache, 2.20 GHz, 35W
CR960-HM76BS0-3610ME Intel® CoreTM i5-3610ME, 3M Cache, 2.7GHz (3.3GHz), 35W
Model Name
CR960
-
Chipset
HM76
Temperature
B
B: 0oC to 60oC
Memory
S
S: Socket
PCIe x1,
PCI
1 LLane 8
Packing List
Fan
Heatsink
Heat spreader
Module PCB
Standoff
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
SODIMM
2 (16GB DDR3L)
2 (16GB DDR3L)
2 (16GB DDR3L)
2 (16GB DDR3L)
2 (16GB DDR3L)
SSD
None
None
None
None
None
Power
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
Thermal
Fan
Fan
Fan
Fan
Fan
Temperature
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
The following specifications will be available upon request. Please contact your sales representative for more information.
Intel® GLAN
PHY 82579LM
22.00
POWER CONSUMPTION
• TBD
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
SLP/LID
WDT
Serial Port 0/1
System Fan Embedded
/
PWM/TACH_IN
11.00
POWER
• Input: 5VSB*, 12V, VCC_RTC
SSD*
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
PEG 16X LANES
Memory
Controller
Graphics
CORE
LPC Bus
55.00
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
SERIAL ATA (SATA) INTERFACE
• Supports 4 Serial ATA interfaces
• 2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
Processor
FDI
53.00
BIOS
• 64Mbit SPI BIOS
•
•
•
•
1 CR960 board
1 QR (Quick Reference)
1 DVD
Heat spreader with heat sink and fan: 761-CR9601-000G
SSD
0
0: None
2: 2GB
4: 4GB
8: 8GB
1: 16GB
3: 32GB
6: 64GB
-
Processors
3615QE
3rd Generation
3610ME: Intel® CoreTM i5-3610ME, 3M Cache, 2.7GHz (3.3GHz), 35W
1020E: Intel® CeleronTM 1020E, 2M Cache, 2.20 GHz, 35W
2nd Generation
810E: Intel® CeleronTM B810E, 2M Cache, 1.6GHz, 35W
847E: Intel® CeleronTM 847E, 2M Cache, 1.1GHz, 17W
827E: Intel® CeleronTM 827E, 1.5M Cache, 1.4GHz, 17W
Optional Items
• COM331-B carrier board kit: 770-COM331-000G
COM Express Basic
121.00
76.00
0.00
4.00
117.00
DDR3
SODIMM
91.00
Channel A
1
/ 600
1333/1600MHz
125.00
www.dfi.com
EXPANSION INTERFACES
• Supports 4 USB 3.0 ports
• Supports 8 USB 2.0 ports
• Supports 1 PCIe x16 interface
• Supports 7 PCIe x1 interfaces
• Supports LPC interface
• Supports I2C interface
• Supports SMBus interface
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
Computer-On-Module
DDR3
SODIMM
87.00
53.00
* Optional and is not supported in standard model. Please contact your sales representative for more information.
ONBOARD LAN FEATURES
• Intel® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
95.00 Top View
87.00
91.00
Specifications
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
4.00
0.00
0.00
CR960-HM76
Features
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
CR902-B
MEMORY
EXPANSION
QM77
2 DDR3/DDR3L SODIMM up to 16GB
1 PCIe x16, 1 PCIe x4 and 1 PCIe x1, 4 PCI
1 LPC, 1 SMBus, 1 IDE
1 VGA, 1 LVDS, 2 DDI (HDMI/DVI/DP/SDVO)
8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
8-bit DIO
1 LAN
COM Express® R2.1 Basic, Type 2
95mm x 125mm (3.74" x 4.9")
BGA 1023
DDR3_2
SODIMM
DDR3_1
SODIMM
Intel QM77
LAN
DIMENSIONS
CPU Fan
DDR3/
DDR3L
Mechanical Drawing
8 DIO
GbE LAN
USB 2.0
SATA 3.0
121.00
117.00
87.00
0.00
4.00
4.00
0.00
DDR3
SODIMM
70.20
12.50
0.00
DDR3
SODIMM
0.00
2.00
Channel B
1
0
1066/1333/1600
MHz
Processor
CORE CORE CORE
IMVP7
(Vcore,Vgfx)
3rd/2nd Generation
Intel® Core™ i7/i5/i3
Graphics
CORE
CMOS
Backup EEPROM
12.00
CORE
PEG 16x LANES
P
DMI x4
(Direct Media
Interface)
Intel® FDI
DI
(Flexible Display
isplay
ce)
Interface)
Multiplexer
Switch
SM Bus
Bottom View
HD Audio
LVDS (Dual Channel)
CRT
PCIe x1 5x
Port B: SDVO/
HDMI/DVI
Mobile Intel® QM77
(CR902-B)
Mobile Intel® HM76
(CR902-BL)
PCIe x1
Lane 7
PEG/SDVO/
HDMI/DP Mux
PCIe to
PCI
PCI Bus
PCIe to
PATA
IDE Bus
2nd SPI Bus
LAN Ports
PCIe x1
Lane
a e6
PCIe x1, Lane 8
Intel® GLAN
PHY 82579LM
SYSTEM MEMORY
• Two 204-pin DDR3/DDR3L SODIMM sockets
• 3rd generation processors
- Supports DDR3/DDR3L 1333/1600 MHz (i7/i5/i3)
- Supports DDR3/DDR3L 1067/1333/1600 MHz (i7 Quad Core)
• 2nd generation processors
- Supports DDR3 1066/1333 MHz (i7/i5/i3/Celeron)
- Supports DDR3 1066/1333/1600 MHz (i7 Quad Core)
• Supports dual channel memory interface
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM technologies are
supported for x8 and x16 devices, unbuffered, non-ECC
20.00
22.00
Standoff
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
IDE INTERFACE
• Supports up to two IDE devices
• DMA mode: Ultra ATA up to 100MB/s
• PIO mode: up to 16MB/s
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/VCCRTC/DDR/+1.05V/VCCSA voltages and failure alarm
• Watchdog timer function
BIOS
• 64Mbit SPI BIOS
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
TEMPERATURE
• 0oC to 60oC
HUMIDITY
• 10% to 90%
ONBOARD LAN FEATURES
• Intel® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
POWER
• Input: 5VSB*, 12V, VCC_RTC
PCB
• Dimensions: 95mm (3.74") x 125mm (4.9")
• Compliance: PICMG COM Express® R2.1 basic form factor, Type 2
CERTIFICATION
• CE, FCC Class B, RoHS
Ordering Information
Model Name
CR902-B3517UE
CR902-B3120ME
CR902-B847E
CR902-B847E
Processor
Intel® CoreTM i7-3517UE, 4M Cache, 1.7GHz (2.80GHz), 17W
Intel® CoreTM i3-3120ME, 3M Cache, 2.40GHz, 35W
Intel® Celeron® 847E, 2M Cache, 1.1GHz, 17W
Intel® Celeron® 847E, 2M Cache, 1.1GHz, 17W
CR902-B827E
CR902-B827E
CR902-B810E
CR902-B810E
Intel®
Intel®
Intel®
Intel®
Celeron® 827E, 1.5M Cache, 1.4GHz, 17W
Celeron® 827E, 1.5M Cache, 1.4GHz, 17W
Celeron® B810E, 2M Cache, 1.6GHz, 35W
Celeron® B810E, 2M Cache, 1.6GHz, 35W
Packing List
Heat spreader
Module PCB
EXPANSION INTERFACES
• Supports 8 USB 2.0 ports
• Supports 1 PCIe x16 interface (multiplex digital display interface)
• Supports 2 DDI (multiplex with PCIe x16)
- Port B for SDVO/HDMI/DVI
- Port C for HDMI/DVI/DisplayPort
• Supports 1 PCIe x4 and 1 PCIe x1 (default); or 5 PCIe x1 interfaces
• Supports 4 PCI interfaces (PCI 2.3 interface)
• Supports LPC interface
• Supports SMBus interface
• Supports IDE interface
• Supports 8-bit Digital I/O
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
Heat sink with fan
11.00
54.60
CHIPSET
• Intel® QM77 Express Chipset
C/D
A/B
LPC Bus
USB 2.0 8x
SATA 2.0 2x, SATA 3.0 2x
53.00
Please refer to the Ordering Information below
SERIAL ATA (SATA) INTERFACE
• Supports 4 Serial ATA interfaces
• 2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1/5/10
Memory
Controller
Portt C
P
C: HDMI/DVI/DP
95.00
87.00
91.00
Channel A
1066/1333/1600
0
MHz
PROCESSOR
• BGA 1023 packaging technology
- 3rd generation Intel® CoreTM processors (22nm process technology)
- 2nd generation Intel® CoreTM processors (32nm process technology)
•
•
•
•
1 CR902 board
1 QR (Quick Reference)
1 DVD
Heat spreader with heat sink and fan: 761-HR9020-300G
SODIMM
2 (16GB DDR3/DDR3L)
2 (16GB DDR3/DDR3L)
2 (16GB DDR3)
2 (16GB DDR3)
2 (16GB DDR3)
2 (16GB DDR3)
2 (16GB DDR3)
2 (16GB DDR3)
Power
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
Thermal
Cooler
None
None
Cooler
None
Cooler
None
Cooler
Optional Items
• COM330-B carrier board kit: 770-COM330-000G
Temperature
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
COM Express Basic
Top View
Ø2.70(*7 pcs)
* Optional and is not supported in standard model. Please contact your sales representative for more information.
Computer-On-Module
125.00
121.00
117.00
0.00
4.00
76.00
87.00
91.00
Specifications
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4000 (3rd generation processors)
• Intel® HD Graphics 3000 (2nd generation processors)
• Intel® HD Graphics (Intel® CeleronTM processors)
• Supports LVDS, VGA and DDI interfaces
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit, resolution up to
1920x1200 @ 60Hz
• Digital Display Interfaces: HDMI, DVI, DP or SDVO
• HDMI, DVI, DP, SDVO: resolution up to 1920x1200 @ 60Hz
• Intel® Clear Video Technology
• DirectX Video Acceleration (DXVA) for accelerating video processing
- Full AVC/VC1/MPEG2 HW Decode
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0 (3rd generation processors)
• Supports DirectX 10.1/10/9 and OpenGL 3.0 (2nd generation processors)
Block Diagram
4.00
0.00
www.dfi.com
CR902-B
Features
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
CR902-BL
CR902-BL
Features
MEMORY
EXPANSION
HM76
2 DDR3/DDR3L SODIMM up to 16GB
1 PCIe x16, 1 PCIe x4 and 1 PCIe x1, 4 PCI
1 LPC, 1 SMBus, 1 IDE
1 VGA, 1 LVDS, 2 DDI (HDMI/DVI/DP/SDVO)
8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
8-bit DIO
1 LAN
COM Express® R2.1 Basic, Type 2
95mm x 125mm (3.74" x 4.9")
BGA 1023
DDR3_2
SODIMM
DDR3_1
SODIMM
Intel HM76
LAN
DIMENSIONS
CPU Fan
DDR3/
DDR3L
Mechanical Drawing
8 DIO
GbE LAN
USB 2.0
SATA 3.0
121.00
117.00
87.00
0.00
4.00
4.00
0.00
DDR3
SODIMM
70.20
12.50
0.00
DDR3
SODIMM
0.00
2.00
Channel B
1
0
1066/1333/1600
MHz
CORE
IMVP7
(Vcore,Vgfx)
3rd/2nd Generation
Intel® Core™ i7/i5/i3
Graphics
CORE
CMOS
Backup EEPROM
12.00
HD Audio
Port B: SDVO/
HDMI/DVI
USB 2.0 8x
SATA 2.0 2x, SATA 3.0 2x
LVDS (Dual Channel)
53.00
CRT
PCIe x1 5x
Mobile Intel® QM77
(CR902-B)
Mobile Intel® HM76
(CR902-BL)
PCIe x1
Lane 7
PCIe x1
a e6
Lane
PCIe x1, Lane 8
2nd Gen Processors
PEG/SDVO/
HDMI/DP Mux
PCIe to
PCI
PCI Bus
PCIe to
PATA
IDE Bus
3rd Gen Processors
2nd Gen Processors
20.00
Heat sink with fan
CERTIFICATION
• CE, FCC Class B, RoHS
Model Name
CR902-BL3120ME
CR902-BL810E
CR902-BL847E
CR902-BL827E
Part Number
777-CR9021-500G
777-CR9021-C00G
777-CR9021-D00G
777-CR9021-E00G
Description
Intel® CoreTM i3-3120ME, 3M Cache, 2.40 GHz, 35W
Intel® CeleronTM B810E, 2M Cache, 1.6GHz, 35W
Intel® CeleronTM 847E, 2M Cache, 1.1GHz, 17W
Intel® CeleronTM 827E, 1.5M Cache, 1.4GHz, 17W
Model Name
CR902-BL3615QE
CR902-BL3612QE
CR902-BL3555LE
CR902-BL3517UE
CR902-BL3610ME
CR902-BL3217UE
CR902-BL1020E
CR902-BL1047UE
CR902-BL927UE
CR902-BL2715QE
CR902-BL2655LE
CR902-BL2610UE
CR902-BL2515E
CR902-BL2310E
CR902-BL2340UE
CR902-BL807UE
Part Number
777-CR9021-000G
777-CR9021-100G
777-CR9021-200G
777-CR9021-300G
777-CR9021-400G
777-CR9021-G00G
777-CR9021-H00G
777-CR9021-I00G
777-CR9021-J00G
777-CR9021-600G
777-CR9021-700G
777-CR9021-800G
777-CR9021-900G
777-CR9021-A00G
777-CR9021-B00G
777-CR9021-F00G
Description
Intel® CoreTM i7-3615QE, 6M Cache, up to 3.30 GHz, 45W
Intel® CoreTM i7-3612QE, 6M Cache, up to 3.10 GHz, 35W
Intel® CoreTM i7-3555LE, 4M Cache, up to 3.20 GHz, 25W
Intel® CoreTM i7-3517UE, 4M Cache, up to 2.80 GHz, 17W
Intel® CoreTM i5-3610ME, 3M Cache, up to 3.30 GHz, 35W
Intel® CoreTM i3-3217UE, 3M Cache, 1.60 GHz, 17W
Intel® CeleronTM 1020E, 2M Cache, 2.20 GHz, 35W
Intel® CeleronTM 1047UE, 2M Cache, 1.40 GHz, 17W
Intel® CeleronTM 927UE, 1M Cache, 1.50 GHz, 17W
Intel® CoreTM i7-2715QE, 6M Cache, up to 3.00 GHz, 45W
Intel® CoreTM i7-2655LE, 4M Cache, up to 2.90 GHz, 25W
Intel® CoreTM i7-2610UE, 4M Cache, up to 2.40 GHz, 17W
Intel® CoreTM i5-2515E, 3M Cache, up to 3.10 GHz, 35W
Intel® CoreTM i3-2310E, 3M Cache, 2.10 GHz, 35W
Intel® CoreTM i3-2340UE, 3M Cache, 1.30 GHz, 17W
Intel® CeleronTM 807UE, 1M Cache, 1.00 GHz, 10W
Heat spreader
22.00
Packing List
Module PCB
11.00
54.60
PCB
• Dimensions: 95mm (3.74") x 125mm (4.9")
• Compliance: PICMG COM Express® R2.1 basic form factor, Type 2
The following processors will be available upon request. Please contact your sales representative for more information.
Intel® GLAN
PHY 82579LM
Standoff
www.dfi.com
TEMPERATURE
• 0oC to 60oC
POWER
• Input: 5VSB*, 12V, VCC_RTC
2nd SPI Bus
LAN Ports
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
ONBOARD
LAN FEATURES
• Intel® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
C/D
A/B
LPC Bus
BIOS
• 64Mbit SPI BIOS
HUMIDITY
• 10% to 90%
3rd Gen Processors
Intel® FDI
DI
isplay
(Flexible Display
Interface)
ce)
Multiplexer
Switch
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/VCCRTC/DDR/+1.05V/VCCSA voltages and failure alarm
• Watchdog timer function
Ordering Information
PEG 16x LANES
P
DMI x4
(Direct Media
Interface)
IDE INTERFACE
• Supports up to two IDE devices
• DMA mode: Ultra ATA up to 100MB/s
• PIO mode: up to 16MB/s
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
Memory
Controller
SM Bus
Bottom View
SYSTEM MEMORY
• Two 204-pin DDR3/DDR3L SODIMM sockets
• 3rd generation processors
- Supports DDR3/DDR3L 1333/1600 MHz (i7/i5/i3)
- Supports DDR3/DDR3L 1067/1333/1600 MHz (i7 Quad Core)
• 2nd generation processors
- Supports DDR3 1066/1333 MHz (i7/i5/i3/Celeron)
- Supports DDR3 1066/1333/1600 MHz (i7 Quad Core)
• Supports dual channel memory interface
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM technologies
are supported for x8 and x16 devices, unbuffered, non-ECC
SERIAL ATA (SATA) INTERFACE
• Supports 4 Serial ATA interfaces
• 2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
Processor
CORE CORE CORE
Portt C
P
C: HDMI/DVI/DP
95.00
Ø2.70(*7 pcs)
Channel A
0
1066/1333/1600
MHz
Please refer to the Ordering Information below
CHIPSET
• Intel® HM76 Express Chipset
EXPANSION INTERFACES
• Supports 8 USB 2.0 ports
• Supports 1 PCIe x16 interface (multiplex digital display interface)
• Supports 2 DDI (multiplex with PCIe x16)
- Port B for SDVO/HDMI/DVI
- Port C for HDMI/DVI/DisplayPort
• Supports 1 PCIe x4 and 1 PCIe x1 (default); or 5 PCIe x1 interfaces
• Supports 4 PCI interfaces (PCI 2.3 interface)
• Supports LPC interface
• Supports SMBus interface
• Supports IDE interface
• Supports 8-bit Digital I/O
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
• 1 CR902 board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
• COM330-B carrier board kit
• Heat spreader with heat sink and fan: 761-HR9020-300G
(CR902-BL3120ME, CR902-BL810E, CR902-BL847E, CR902-BL827E)
COM Express Basic
Top View
87.00
91.00
PROCESSOR
• BGA 1023 packaging technology
- 3rd generation Intel® CoreTM processors (22nm process technology)
- 2nd generation Intel® CoreTM processors (32nm process technology)
Computer-On-Module
125.00
121.00
117.00
0.00
4.00
76.00
87.00
91.00
* Optional and is not supported in standard model. Please contact your sales representative for more information.
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4000 (3rd generation processors)
• Intel® HD Graphics 3000 (2nd generation processors)
• Intel® HD Graphics (Intel® CeleronTM processors)
• Supports LVDS, VGA and DDI interfaces
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit, resolution up to
1920x1200 @ 60Hz
• Digital Display Interfaces: HDMI, DVI, DP or SDVO
• HDMI, DVI, DP, SDVO: resolution up to 1920x1200 @ 60Hz
• Intel® Clear Video Technology
• DirectX Video Acceleration (DXVA) for accelerating video processing
- Full AVC/VC1/MPEG2 HW Decode
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0 (3rd generation processors)
• Supports DirectX 10.1/10/9 and OpenGL 3.0 (2nd generation processors)
Block Diagram
4.00
0.00
Specifications
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
CR901-B
CR901-B
Features
MEMORY
EXPANSION
QM77
2 DDR3/DDR3L SODIMM up to 16GB
1 PCIe x16, 7 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP/SDVO)
12 USB: 4 USB 3.0, 8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 6
95mm x 125mm (3.74" x 4.9")
Socket G2
988B
DDR3_2
SODIMM
DDR3_1
SODIMM
Intel QM77
LAN
DIMENSIONS
CPU Fan
Specifications
* Optional and is not supported in standard model. Please contact your sales representative for more information.
PROCESSOR
• Socket G2 988B for:
- 3rd Generation Intel® CoreTM processors (22nm process technology)
: Intel® Core™ i7-3610QE (6M Cache, up to 3.3 GHz); 45W
: Intel® Core™ i5-3610ME (3M Cache, up to 3.3 GHz); 35W
: Intel® Core™ i3-3120ME (3M Cache, 2.4 GHz); 35W
- 2nd Generation Intel® CoreTM processors (32nm process technology)
: Intel® Core™ i7-2710QE (6M Cache, up to 3.0 GHz); 45W
: Intel® Core™ i5-2510E (3M Cache, up to 3.1 GHz); 35W
: Intel® Core™ i3-2330E (3M Cache, 2.2 GHz); 35W
: Intel® Celeron® B810 (2M Cache, 1.6 GHz); 35W
CHIPSET
• Intel® QM77 Express chipset
SYSTEM MEMORY
• Two 204-pin SODIMM sockets
• Supports DDR3 SODIMM
3rd Generation Processors
DDR3 1066/1333/1600MHz
Mechanical Drawing
• Supports DDR3L SODIMM
- 1066/1333MHz when operating at 1.35V
- 1066/1333/1600MHz when operating at 1.5V
• Supports dual channel memory interface
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM technologies are
supported for x8 and x16 devices, unbuffered, non-ECC
Block Diagram
121.00
117.00
87.00
0.00
4.08
Top View
76.00
0.00
4.08
37.41
DDR3
SODIMM
117.00
0.00
4.00
Channel A
1066/1333/
1600MHz
Channel B
1066/1333/
1600MHz
DDR3
SODIMM
125.00
Processor
CORE CORE CORE
CMOS Backup
EEPROM
SM Bus
CORE
3 Generation;
Intel® Core™ i7/i5/i3
2nd Generation;
®
Intel Core™ i7/i5/i3; Intel® Celeron™
rd
Graphics
CORE
IMVP7
(Vcore,Vgfx)
Memory
Controller
DMI x4
(Direct Media
Interface)
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
PEG 16x LANES
ONBOARD LAN FEATURES
• Intel® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Intel® FDI
(Flexible Display
Interface)
SM Bus
HD A
Audio
di
Bottom View
DDI Port B/SDVO Port B
LPC Bus
2.00
0.00
DDI Port C
0.00
12.50
70.20
GPIO,WDT,I2C
(Embedded
Controller)
I2C Bus
WDT
DDI Port D
USB 2.0 8x
95.00
87.00
4.00
LPC TPM 1.2
SLB9635(option)
8-bit DIO
SATA 2.0
202
2x, SATA 3.0
3 0 2x
2
LVDS (Dual
(D l Channel)
Ch
l)
Mobile Intel® QM77
Express Chipset
CRT
USB 3.0 4x
PCIe x1 Lane 7
PCI x1,
PCIe
1 Lane
L
1~6
1 6
2nd
SPI B
Bus
95.00
87.00
Serial
S i l Port1,
P t1 2 TX/RX
/
Sys FAN PWM/TACH_IN
LAN Ports
P ts
PCIe x1, Lane 8
4.00
®
Intel GLAN
PHY 82579LM
4.00
C/D
A/B
14.00
SERIAL ATA (SATA) INTERFACE
• Supports 4 Serial ATA interfaces
• 2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1/5/10
76.00
USB INTERFACE
• XHCI Host Controller supports up to 4 super speed USB 3.0 ports
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
EXPANSION INTERFACES
• Supports 12 USB interfaces
- 4 USB 3.0
- 8 USB 2.0
• Supports 1 PCIe x16 interface
- Supports Gen 3.0 (3rd generation processors)
- Supports Gen 2.0 (2nd generation processors)
- Configurations (supported only via a riser card):
: One x8 (GFX) and two x4 (I/O)
: Two x8 (GFX, I/O)
: One x16 (GFX, I/O)
• Supports 1 PCIe x4 and 3 PCIe x1 (default); or 7 PCIe x1 interfaces
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
DAMAGE FREE INTELLIGENCE
• Detects CPU temperature
• Detects CPU fan speed
• Detects Vcore/VGFX/DDR voltages
• Watchdog timer function
BIOS
• 64Mbit SPI BIOS
POWER CONSUMPTION
• 63.06 W with i7-3610QE at 2.30GHz and 2x 2GB DDR3 SODIMM
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 10% to 90%
POWER
• Input: 5VSB*, 12V, VCC_RTC
PCB
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R2.1, Type 6
CERTIFICATION
• CE, FCC Class B, UL, RoHS
PCIe x1 Lane 8
(Opt. share with onboard LAN)
SATA Port4
SSD Chip
(option)
Ordering Information
Model Name
CR901-B
Part Number
770-CR9011-000G
Description
3rd/2nd generation Intel® CoreTM processors
24.70
34.70
Packing List
Module PCB
24.70
36.70
34.70
Cooler
3.50
Module PCB The height of
the highest parts
2.00
1.60
5.0 or 8.0 mm
Standoff
www.dfi.com
CarrierBoard
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
•
•
•
•
1 CR901-B board
1 QR (Quick Reference)
1 DVD
Heat sink with fan: 761-111007-000G
Optional Items
• COM331-B carrier board kit: 770-COM331-000G
• Heat spreader: A71-011012-000G
• Heat spreader with heat sink and fan: 761-CR9000-000G
COM Express Basic
95.00
43.67
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
Computer-On-Module
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4000
• Supports VGA, LVDS and DDI interfaces
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit, resolution up to
1920x1200 @ 60Hz
• Digital Display Interfaces: HDMI, DVI, DP and SDVO (for Port B)
• HDMI, DVI, DP: resolution up to 1920x1200 @ 60Hz
• Intel® Clear Video Technology
• DirectX Video Acceleration (DXVA) for accelerating video processing
- Full AVC/VC1/MPEG2 HW Decode
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0
Ø2.70(*7 pcs)
91.00
87.00
87.00
2nd Generation Processors
DDR3 1066/1333MHz (i5/i3/Celeron)
DDR3 1600MHz (i7)
SSD*
• 4GB/8GB/16GB/32GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
CR900-B
CR900-B
Features
MEMORY
EXPANSION
QM77
2 DDR3/DDR3L SODIMM up to 16GB
1 PCIe x16, 5 PCIe x1, 4 PCI
1 LPC, 1 SMBus, 1 I2C, 1 IDE
1 VGA, 1 LVDS
8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 2
95mm x 125mm (3.74" x 4.9")
Socket G2 988B
DDR3_1
SODIMM
DDR3_2
SODIMM
Intel QM77
LAN
DIMENSIONS
CPU Fan
Specifications
* Optional and is not supported in standard model. Please contact your sales representative for more information.
PROCESSOR
• Socket G2 988B for:
- 3rd Generation Intel® CoreTM processors (22nm process technology)
: Intel® Core™ i7-3610QE (6M Cache, up to 3.3 GHz); 45W
: Intel® Core™ i5-3610ME (3M Cache, up to 3.3 GHz); 35W
: Intel® Core™ i3-3120ME (3M Cache, 2.4 GHz); 35W
- 2nd Generation Intel® CoreTM processors (32nm process technology)
: Intel® Core™ i7-2710QE (6M Cache, up to 3.0 GHz); 45W
: Intel® Core™ i5-2510E (3M Cache, up to 3.1 GHz); 35W
: Intel® Core™ i3-2330E (3M Cache, 2.2 GHz); 35W
: Intel® Celeron® B810 (2M Cache, 1.6 GHz); 35W
CHIPSET
• Intel® QM77 Express Chipset
SYSTEM MEMORY
• Two 204-pin SODIMM sockets
• Supports DDR3 SODIMM
3rd Generation Processors
DDR3 1066/1333/1600MHz
Mechanical Drawing
• Supports DDR3L SODIMM
- 1066/1333MHz when operating at 1.35V
- 1066/1333/1600MHz when operating at 1.5V
• Supports dual channel memory interface
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM technologies are
supported for x8 and x16 devices, unbuffered, non-ECC
Block Diagram
121.00
117.00
87.00
0.00
4.00
Top View
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
Processor
0.00
4.00
0.00
4.00
76.00
37.41
0.00
4.00
121.00
117.00
125.00
DDR3
SODIMM
Ø2.70(*7 pcs)
DDR3
SODIMM
Channel A
1066/1333/
1600MHz
Channel B
1066/1333/
1600MHz
CORE CORE CORE
Bottom View
Graphics
CORE
PEG 16x LANES
Memory
Controller
DMI x4
(Direct Media
Interface)
ONBOARD LAN FEATURES
• Intel® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
IMVP7
(Vcore,Vgfx)
3rd Generation;
Intel® Core™ i7/i5/i3
2nd Generation;
Intel® Core™ i7/i5/i3; Intel® Celeron™
CMOS Backup
EEPROM
SM Bus
CORE
SERIAL ATA (SATA) INTERFACE
• Supports 4 Serial ATA interfaces
• 2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1/5/10
®
Intel FDI
(Flexible Display
Interface)
SM Bus
PCI Bus
HD A
Audio
di
LPC Bus
2.00
0.00
IDE Bus
USB 2.0 8x
95.00
87.00
4.00
PCIe x1,Lane 7
GPIO,WDT,I2C
(Embedded
Controller)
us
I2C Bus
WDT
0.00
12.50
70.20
34.70
8-bit DIO
SATA 2.0 2x, SATA 3.0 2x
LVDS (Dual Channel)
Mobile Intel® QM77
Express Chipset
CRT
PCI x1,
PCIe
1 Lane
L
1
1-5
5
C/D
A/B
14.00
IT8892E
PCIe to
PCI Bridge
LPC TPM 1.2
SLB9635(option)
IDE INTERFACE
• Supports up to two IDE devices
• DMA mode: Ultra ATA up to 100MB/s
• PIO mode: up to 16MB/s
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
EXPANSION INTERFACES
• Supports 8 USB 2.0/1.1 interfaces
• Supports 4 PCI slots (PCI 2.3 interface)
• Supports 1 PCIe x16 interface
- Supports Gen 3.0 (3rd generation processors)
- Supports Gen 2.0 (2nd generation processors)
- Configurations (supported only via a riser card):
: One x8 (GFX) and two x4 (I/O)
: Two x8 (GFX, I/O)
: One x16 (GFX, I/O)
• Supports 1 PCIe x1 and 1 PCIe x4 (default); or 5 PCIe x1 interfaces
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports IDE interface
• Supports 4-bit input and 4-bit output GPIO
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature
• Monitors CPU fan speed
• Monitors Vcore/VGFX/DDR/1.05V/VCCSA voltages
• Watchdog timer function
BIOS
• 64Mbit SPI BIOS
POWER CONSUMPTION
• 59.78 W with i7-3610QE at 2.30GHz and 2x 1GB DDR3 SODIMM
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 10% to 90%
POWER
• Input: 5VSB*, 12V, VCC_RTC
PCB
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R2.1, Type 2
CERTIFICATION
• CE
• FCC Class B
• RoHS
• UL
PCIe to
PATA
JMB368
PCIe x1, Lane 6
2nd SPI Bus
95.00
87.00
LAN Ports
PCIe x1, Lane 8
SATA Port4
SSD Chip
(option)
Ordering Information
4.00
Intel® GLAN
PHY 82579LM
4.00
Model Name
CR900-B
76.00
Cooler
36.70
34.70
24.70
2.00
1.60
standoff
CarrierBoard
5.0 or 8.0 mm
www.dfi.com
Packing List
Module PCB
3.50
Module PCB
The height of the
highest parts
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Part Number
770-CR9001-000G
•
•
•
•
1 CR900-B board
1 QR (Quick Reference)
1 DVD
Heat sink with fan: 761-111007-000G
Description
3rd/2nd generation Intel® CoreTM processors
Optional Items
• COM330-B carrier board kit: 770-COM330-000G
• Heat spreader: A71-011012-000G
• Heat spreader with heat sink and fan: 761-CR9000-000G
COM Express Basic
95.00
43.67
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
Computer-On-Module
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4000
• Supports LVDS and VGA interfaces
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel: 36/48-bit, resolution up to
1920x1200 @ 60Hz
• Intel® Clear Video Technology
• DirectX Video Acceleration (DXVA) for accelerating video processing
- Full AVC/VC1/MPEG2 HW Decode
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0
91.00
87.00
91.00
87.00
2nd Generation Processors
DDR3 1066/1333MHz (i5/i3/Celeron)
DDR3 1600MHz (i7)
SSD*
• 4GB/8GB/16GB/32GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
AMD® Embedded R-Series
COM Express® Basic
AMD® Embedded R-Series
COM Express® Basic
CM960-B
CM960-B
Features
MEMORY
EXPANSION
R-Series
AMD
Embedded
R-Series
2 DDR3 SODIMM up to 16GB
1 PCIe x8, 7 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
3 Independent Displays
1 DP, 1 DP/LVDS, 1 DP/VGA
8 USB: 4 USB 3.0, 4 USB 2.0
4 SATA 3.0
SSD (optional)
8-bit DIO
1 LAN
COM Express® R2.1 Basic, Type 6
95mm x 125mm (3.74" x 4.9")
DDR3_2
SODIMM
AMD A70M
DDR3_1
SODIMM
CPU Fan
LAN
DIMENSIONS
Specifications
APU
• AMD® Embedded R-Series APUs
• FP2 BGA packaging technology
• 32nm process technology
CHIPSET
• AMD® A70M Fusion Controller Hub
SYSTEM MEMORY
• Two 204-pin DDR3 SODIMM sockets
• Supports DDR3 (1.5V), LVDDR3(1.35V), ULVDDR3 (1.25V) up to 1600MHz
• Supports dual channel memory interface
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb, 4Gb and 8Gb DDR3 DRAM technologies
are supported for x8 and x16 devices, unbuffered, non-ECC
R2.1
Type6
Optional
SATA 3.0
USB INTERFACE
• XHCI Host Controller supports up to 4 super speed USB 3.0 ports
Please refer to the Ordering Information below
SSD
RAID
USB 3.0
* Optional and is not supported in standard model. Please contact your sales representative for more information.
ONBOARD GRAPHICS FEATURES
• Supports DP, DP/LVDS and DP/VGA interfaces
• VGA: resolution up to 1920x1600 @ 60Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel: 36/48-bit, resolution up to
1920x1200 @ 60 Hz
• DP: resolution up to 4096x2160 @ 30Hz
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
Mechanical Drawing
125.00
121.00
91.00
4.00
95.00
91.00
91.00
DDI Port 2
PCB
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R2.1, Type 6
4.00
104.77
121.00
119.00
80.00
54.80
4.00
0.00
DP to LVDS
TRANSLATOR
CH7511B
Processor
CORE CORE CORE CORE
800~1600MT/s
B
A
DISPLAY Port
SWITCH
PI3VDP12412
DP0
GPP 0,1,2,3
AMD Embedded
R-Series APUs
Bottom View
Graphics
CORE
Memory
Controller
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
PCI GEN2
PCIe
G
x8
8
DDI Port 1
DP2
PCI GEN2
PCIe
(1x4 or 4x1)
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
UNBUFFERED
DDR3 SODIMM 2x
DP1
DISPLAY Port
SWITCH
PI3VDP12412
A
UMI-Link x4
SMBus (Optional)
B
DDI Port 3
HD Audio
LPC Bus
/
Bus
I2C Bus/SM
18.08
WDT
Serial Port1,
2 Tx/Rx
E
Embedded
Controller
IT8518E
LPC
TPM 1.2
SLB9635
(optional)
USB 3.0
USB_SS 0,1,2,3
Sys Fan
PWM/TACH
125.00
CMOS Backup
EEPROM
0 4x
SATA 3
3.0
SSD Chip
(Optional)
95.00
PCIe GEN2 x1
GPP 3
CM960
-
PCIe GEN2 x1
GPP 1,2
LAN
SATA 4
Ordering Information
Model Name
AMD A70M FCH
USB 2.0 8x
C/D
0.00
16.58
74.28
53.00
8-bit
8
bit DIO
A/B
6.08
0.00
Intel GbE
I210AT
Chipset
Temperature Memory
SSD
A70M
B
S
0
B: 0oC to 60oC
S: Socket
0:
2:
4:
8:
1:
3:
6:
GPP 0
SPI I/F
SPI ROM
SPI Bus
VGA
SD Card I/F (Optional)
Processors
- 464L
None
2GB
4GB
8GB
16GB
32GB
64GB
464L: AMD® R-464L, Quad Core, 2x 2M Cache, up to 3.2GHz, 35W
460H: AMD® R-460H, Quad Core, 2x 2M Cache, up to 2.8GHz, 35W
460L: AMD® R-460L, Quad Core, 2x 2M Cache, up to 2.8GHz, 25W
452L: AMD® R-452L, Qual Core, 2x 2M Cache, up to 2.4GHz, 19W
260H: AMD® R-260H, Dual Core, 2M Cache, up to 2.6GHz, 17W
252F: AMD® R-252F, Dual Core, 1M Cache, up to 2.4GHz, 17W
Heatsink
Packing List
22.00
Heatspreader
Module PCB
11.00
55.00
20.00
Fan
Standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
•
•
•
•
1 CM960-B board
1 QR (Quick Reference)
1 DVD
Heat spreader with heat sink and fan: 761-CM9601-000G
Optional Items
• COM331-B carrier board kit: 770-COM331-000G
COM Express Basic
POWER
• Input: 12V, 5VSB*, VCC_RTC
SSD*
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
Computer-On-Module
4.00
0.00
LVDS (Dual Channel)
POWER CONSUMPTION
• 38.3553W with R-460L at 2.00GHz and 2x 1GB DDR3 SODIMM
HUMIDITY
• 5% to 90%
49.34
15.44
BIOS
• 32Mbit SPI BIOS
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
SERIAL ATA (SATA) INTERFACE
• Supports 4 Serial ATA interfaces
• 4 SATA 3.0 with data transfer rate up to 6Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1
Top View
DAMAGE FREE INTELLIGENCE
• Monitors APU temperature
• Monitors APU fan speed
• Monitors APU_VDD/APU_VDDNB/APU_VDDIO_SUS/1V2/1V1 voltages
• Watchdog timer function
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
ONBOARD LAN FEATURES
• Intel® I210AT Gigabit Ethernet controller
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Block Diagram
EXPANSION INTERFACES
• Supports 8 USB 2.0 ports (first 4 USB ports support up to USB 3.0)
• Supports 1 PCIe x8 interface
• Supports 7 PCIe x1 interfaces (the first 4 PCIe x1 can be configured to
support PCIe x4)
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports 2 serial interfaces (TX/RX)
• Supports 8-bit Digital I/O (4 In, 4 Out)
AMD® Embedded R-Series
COM Express® Basic
AMD® Embedded R-Series
COM Express® Basic
CM901-B
CM901-B
Features
MEMORY
EXPANSION
R-Series
PGA (FS1r2)
socket
2 DDR3 SODIMM up to 16GB
1 PCIe x16, 7 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
3 Independent Displays
DP, DP/LVDS, DP/VGA
8 USB: 4 USB 3.0/2.0, 4 USB 2.0
4 SATA 3.0
8-bit DIO
1 LAN
COM Express® R2.1 Basic, Type 6
95mm x 125mm (3.74" x 4.9")
DDR3_2
SODIMM
AMD A70M
DDR3_1
SODIMM
CPU fan
LAN
DIMENSIONS
Specifications
APU
• AMD® Embedded R-Series APUs
: R-464L Quad-core 2.3GHz, 35W
: R-460H Quad-core 1.9GHZ, 35W
: R-272F Dual-core 2.7GHz, 35W
: R-268D Dual-core 2.5GHz, 35W
• PGA (FS1r2) socket
• 32nm process technology
R2.1
Type6
SSD
RAID
USB 3.0
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
CHIPSET
• AMD® A70M Fusion Controller Hub
Optional
SATA 3.0
* Optional and is not supported in standard model. Please contact your sales representative for more information.
SYSTEM MEMORY
• Two 204-pin DDR3 SODIMM sockets
• Supports DDR3 (1.5V), LVDDR3(1.35V), ULVDDR3 (1.25V) up to 1600MHz
• Supports dual channel memory interface
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb, 4Gb and 8Gb DDR3 DRAM technologies
are supported for x8 and x16 devices, unbuffered, non-ECC
ONBOARD GRAPHICS FEATURES
• Supports DP, DP/LVDS and DP/VGA interfaces
• VGA: resolution up to 1920x1600 @ 60Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel: 36/48-bit, resolution up to
1920x1200 @ 60 Hz
• DP: resolution up to 4096x2160 @ 30Hz
Mechanical Drawing
Block Diagram
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
121.00
117.00
87.00
50.80
0.00
4.00
95.00
SERIAL ATA (SATA) INTERFACE
• Supports 4 Serial ATA interfaces
• 4 SATA 3.0 with data transfer rate up to 6Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1
0.00
4.00
0.00
4.00
LVDS (Dual Channel)
DDI Port 2
SSD*
• 4GB/8GB/16GB/32GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
125.00
121.00
117.00
76.00
0.00
4.00
Ø2.70(*7 pcs)
DP to LVDS
TRANSLATOR
CH7511B
Processor
CORE CORE CORE CORE
B
A
DISPLAY Port
SWITCH
PI3VDP12412
DP0
PCIe GEN2
(1x4 or 4x1)
GPP 0,1,2,3
CMOS Backup
EEPROM
Bottom View
SM Bus
800~1600MT/s
AMD Embedded
R-Series APUs
Graphics
CORE
Memory
Controller
UNBUFFERED
DDR3 SODIMM 2x
PCIe GEN2
2 x16
UMI-Link x4
USB INTERFACE
• XHCI Host Controller supports up to 4 super speed USB 3.0 ports
DDI Port 1
DP2
DP1
DISPLAY Port
SWITCH
PI3VDP12412
A
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
B
SM Bus
DDI Port 3
HD Audio
A dio
BIOS
• 32Mbit SPI BIOS
POWER CONSUMPTION
• 31.12 W with R-464L at 2.3GHz and 2x 1GB DDR3 SODIMM
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -40oC to 85oC
HUMIDITY
• 10% to 90%
POWER
• Input: 12V, 5VSB (optional), VCC_RTC
PCB
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R2.1, Type 6
CERTIFICATION
• CE
• FCC Class B
• RoHS
LPC Bus
14.00
8-bit
8
bit DIO
I2C Bus
0.00
12.50
70.20
A/B
WDT
Serial Port1,
2 Tx/Rx
Embedded
E
Controller
IT8518E
LPC
TPM 1.2
SLB9635
(option)
USB 3.0
USB_SS 0,1,2,3
Sys Fan
PWM/TACH
C/D
2.00
0.00
USB 2
2.0
08
8x
4.00
34.20
95.00
87.00
SATA 3.0
3 0 4x
SSD Chip
(Optional)
LAN
SATA 4
AMD A70M FCH
PCIe GEN2 x1
GPP 1,2
PCIe GEN2 x1
Intel GbE
LAN82574L
GPP 0
SPI I/F
SPI ROM
95.00
87.00
SPI Bus
VGA
GPP 3
Ordering Information
Model Name
CM901-B
Part Number
777-CM9011-000G
Description
AMD® Embedded R-Series APUs
SD Card I/F (Optional)
4.00
4.00
76.00
83.00
Packing List
34.20
24.20
Heat sink with fan
2.00
Module PCB
3.50
Module PCB
The height
of the highest parts
8.00
1.60
Standoff
www.dfi.com
Carrier Board
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
• 1 CM901-B board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
•
•
•
•
•
COM331-B carrier board kit
COM101-BAT carrier board kit
Heat spreader: TBD
Heat spreader with heat sink and fan: TBD
Heat sink with fan: TBD
COM Express Basic
Top View
45.34
DAMAGE FREE INTELLIGENCE
• Monitors APU temperature
• Monitors APU fan speed
• Monitors APU_VDD/APU_VDDNB/APU_VDDIO_SUS/1V2/1V1 voltages
• Watchdog timer function
Computer-On-Module
ONBOARD LAN FEATURES
• Intel® 82574L Gigabit Ethernet controller
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
91.00
87.00
91.00
87.00
EXPANSION INTERFACES
• Supports 8 USB 2.0 ports (first 4 USB ports support up to USB 3.0)
• Supports 1 PCIe x16 interface
• Supports 7 PCIe x1 interfaces (the first 4 PCIe x1 can be configured to
support PCIe x4)
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports 2 serial interfaces (TX/RX)
• Supports 8-bit Digital I/O (4 In, 4 Out)
Carrier Board COM Express®
Carrier Board COM Express®
Module and Carrier Board Matrix
Carrier Board
Model
Model
COM101-BAT
COM100-B
COM331-B
COM330-B
COM630-B
Display
VGA, DisplayPort,
LVDS
DisplayPort, LVDS
VGA, DisplayPort,
LVDS
VGA, LVDS
VGA, LVDS
1
1
1
1
1
USB 3.0
2 Rear
2 Rear
4 Rear
N/A
N/A
USB 2.0
4 Rear
4 Rear
4 Rear
4 Rear,
4 by pin header
RS232/422/485
N/A
N/A
N/A
RS232
N/A
2 Rear
N/A
SATA 3.0
COM101-BAT
COM100-B
COM331-B
COM330-B
COM630-B
Mini-ITX
Mini-ITX
microATX
microATX
ATX
R2.1, Type 6
R2.1, Type 10
R2.0, Type 6
R2.1, Type 2
R1.0, Type 2
Type
BT9A3
R2.1, Type 10
●
CD9A3
R2.1, Type 10
●
HU968
R2.1, Type 6
●
●
4 Rear, 4 by pin
header
CR908-B
R2.1, Type 6
●
●
N/A
N/A
HR908-B
R2.1, Type 6
●
●
1 Rear,
1 by pin header
3 Rear,
1 by pin header
3 Rear, 1 by pin
header
CP908-B
R1.0, Type 2
N/A
N/A
N/A
1
BT968
R2.1, Type 6
1
1
2
2
N/A
CD905-B
R2.0, Type 2
SATA 2.0
N/A
N/A
2
2
4
KB968
R2.1, Type 6
SSD
N/A
N/A
N/A
N/A
N/A
OT905-B
R2.0, Type 2
HM961-QM87
R2.1, Type 6
IDE, FDD
N/A
N/A
N/A
N/A
1 IDE, 1 FDD
●
●
HM960-QM87
R2.1, Type 6
CF
N/A
N/A
N/A
1
1
●
●
HM920-QM87
R2.1, Type 2
PCIe x16
N/A
N/A
1
1
1
HM961-HM86
R2.1, Type 6
PCIe x4
N/A
N/A
1
1
N/A
●
●
HM960-HM86
R2.1, Type 6
●
●
PCIe x1
1
1
2
N/A
2
HM920-HM86
R2.1, Type 2
Mini PCIe
2
3
1
1
N/A
CR960-QM77
R2.1, Type 6
●
●
N/A
N/A
N/A
2
4
CR960-HM76
R2.1, Type 6
●
●
8-bit
8-bit
8-bit
8-bit
8-bit
CR902-B
R2.1, Type 2
●
HDA
HDA
HDA
HDA
HDA
CR902-BL
R2.1, Type 2
●
LPC
Yes
Yes
Yes
Yes
Yes
CR901-B
R2.1, Type 6
SMBus
Yes
Yes
Yes
Yes
N/A
CR900-B
R2.1, Type 2
●
CAN-bus
N/A
N/A
N/A
N/A
N/A
HR902-B
R2.1, Type 2
●
ExpressCard
N/A
Yes
Yes
Yes
N/A
HR902-BL
R2.1, Type 2
●
Watchdog
N/A
Yes
N/A
N/A
Yes
HR900-B
R1.0, Type 2
●
Power Input
DC-in
DC-in
24-pin ATX
24-pin ATX
24-pin ATX
CP900-B
R1.0, Type 2
●
Compliance
R2.1, Type 6
R2.1, Type 10
R2.0, Type 6
R2.0, Type 2
R1.0, Type 2
CM960-B
R2.1, Type 6
●
●
Dimensions
170mm x 170mm
170mm x 170mm
244mm x 244mm
244mm x 244mm
305mm x 244mm
CM901-B
R2.1, Type 6
●
●
Ethernet
USB
Serial
Parallel
PCI
Digital I/O
Audio
Controller
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
●
●
●
●
●
●
●
●
●
●
Basic
●
●
Carrier Board
Expansion
Compact
Computer-On-Module
Storage
Mini
COM Express Carrier Board
COM Express Carrier Board
COM101-BAT
EXPANSION
USB 2.0 LAN
Line-in/
Surround
Line-out
DisplayPort VGA
DC-in
Mic-in/
Center+Subwoofer
USB 3.0
SMBus
I2C
LPC
Smart
Battery 2
PCIe x1
1 PCIe x1
2 Mini PCIe
1 SIM
DISPLAY OUTPUTS 1 DisplayPort
1 VGA
1 LVDS
LAN
1 LAN
USB
6 USB: 2 USB 3.0, 4 USB 2.0
STORAGE
1 SATA 3.0
DIO
8-bit DIO
DIMENSIONS
170mm x 170mm (6.7" x 6.7")
Specifications
SATA 3.0
ONBOARD AUDIO FEATURES
• Realtek ALC886 7.1-channel High Definition Audio
• Audio outputs: Mic-in/Center+Subwoofer, line-in/surround and line out
• S/PDIF audio interface
ONBOARD USB FEATURES
• 2 USB 3.0 ports
• 4 USB 2.0 ports
Smart
Battery 1
SATA Power
STORAGE
• 1 SATA 3.0 port with data transfer rate up to 6Gb/s
DIGITAL I/O
• 8-bit Digital I/O connector
- 4-bit GPI (General Purpose Input)
- 4-bit GPO (General Purpose Output)
Compact
SIM
System
Fan
DIO
LVDS LCD
Panel
Basic
EXPANSION SLOTS
• 1 PCIe x1 slot (PCIe 2.0)
• 2 Mini PCIe slots (PCIe 2.0)
- 1 slot supports PCIe and USB signals for 3G module
- 1 slot supports PCIe, USB or mSATA signal
- Supports half/full size Mini PCIe card
• 1 SIM card socket
ROM INTERFACE
• 1 SPI interface
- Supports up to 64Mbit
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 10% to 90%
POWER OUTPUT
• 12V, 5VSB, VCC_RTC (ATX mode)
12V, 5V, VCC_RTC (AT mode)
12V, VCC_RTC (AT mode)
PCB
• Dimensions
- Mini-ITX form factor
- 170mm (6.7") x 170mm (6.7")
• Compliance
- PICMG COM Express® R2.1, Type 6
Mini PCIe_2
Block Diagram
157.48
151.76
123.38
111.92
94.89
73.83
71.92
54.83
38.92
26.92
24.92
21.23
0.00
10.16
10.16
0.00
22.86
Audio Codec
Front Audio
SATA 3.0
Smart Charger
47.37
PCIE x1
GLAN
Audio
LPC
TYPE 6
PCIE 2
USB 7
PCIE/USB 8
Connector
Row AB
SATA
Mini PCIE x1
(SIM)
Mini PCIE x1
(mSATA Opt.)
USB 2.0 4x
USB 3.0 2x
93.93
105.07
110.87
110.87
118.13
121.87
127.10
151.87
SM Bus
LVDS
I2C
8-bit DIO
Serial Port 2x
VGA
DisplayPort
SPI
SLP & LID
159.84
163.65
157.48
111.92
104.78
80.63
71.92
24.92
0.00
6.35
www.dfi.com
Connector
Row CD
SYS Fan
151.87
154.94
159.84
TYPE 6
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
•
•
•
•
1
1
1
1
COM101-BAT board
SATA data with power cable
QR (Quick Reference)
DVD
Optional Items
• SATA data with power cable
• Power adapter (120W, 19V) : 671-112004-100G
Carrier Board
I/O CONNECTORS
• 2 3-pin connectors for general purpose serial interface (Type 6)
• 1 LVDS LCD panel connector
• 1 LCD/inverter power connector
• 1 8-bit Digital I/O connector
• 1 front audio connector for line-out and mic-in jacks
• 1 S/PDIF connector
• 1 SATA 3.0 port
• 1 SATA power connector
• 2 Smart battery charger connectors
• 1 LPC connector
• 1 I2C connector
• 1 SMBus connector
• 1 front panel connector
• 1 fan connector
Computer-On-Module
REAR PANEL I/O PORTS
• 19V DC-in jack
• 1 DisplayPort
• 1 RJ45 LAN port
• 2 USB 3.0 ports
• 4 USB 2.0 ports
• 1 VGA port
• Line-in/Surround, Line out, Mic-in/Center+Subwoofer jacks
Mini PCIe_1
Mechanical Drawing
* Optional and is not supported in standard model. Please contact your sales representative for more information.
ONBOARD GRAPHICS FEATURES
• Display ports
- 1 DisplayPort
- 1 VGA
- 1 24-bit dual channel LVDS
Supports Compact and Basic modules
COM Express
connector
LCD/Inverter
Power
COM101-BAT
Features
COM Express Carrier Board
COM Express Carrier Board
COM100-B
USB 2.0
Line-in/
Surround
COM100-B
Features
EXPANSION
LAN
COM 1
USB 3.0
COM 2
1 PCIe x1
3 Mini PCIe
1 SIM
DISPLAY OUTPUTS 1 DisplayPort
1 LVDS
LAN
1 LAN
COM
2 COM
USB
6 USB: 2 USB 3.0, 4 USB 2.0
STORAGE
1 SATA 3.0
DIO
8-bit DIO
DIMENSIONS
170mm x 170mm (6.7" x 6.7")
Line-out
Mic-in/
Center+Subwoofer
DC-in jack
DisplayPort
Specifications
* Optional and is not supported in standard model. Please contact your sales representative for more information.
ONBOARD GRAPHICS FEATURES
• Display ports
- 1 DisplayPort
- 1 24-bit single channel LVDS
ONBOARD AUDIO FEATURES
• Realtek ALC886 7.1-channel High Definition Audio
• Audio outputs: Mic-in/Center+Subwoofer, line-in/surround and line out
• S/PDIF audio interface
ONBOARD USB FEATURES
• 2 USB 3.0 ports
• 4 USB 2.0 ports
LPC
PCIe x1
SATA Power
STORAGE
• 1 SATA 3.0 port with data transfer rate up to 6Gb/s
SMBus
SATA 3.0
Charger
connector
Mini
DIO
8 DIO
1 SATA
7 USB
DIGITAL I/O
• 8-bit Digital I/O connector
- 4-bit GPI (General Purpose Input)
- 4-bit GPO (General Purpose Output)
Supports Mini modules
2
IC
System Fan
LCD/inverter Power
PCIe x1, USB and
3G signal
Serial Interface
Block Diagram
163.65
151.76
124.83
94.89
73.83
54.83
21.23
0.00
6.35
PCIE x1
GLAN
PCIE
Audio Codec
10.16
0.00
SATA 3.0
22.86
SMBus
USB
TYPE 10
PCIE
USB
PCIE
44.14
Smart Charger
I2C
91.14
Connector
Row AB
Serial Port 2x
SATA
Mini PCIE x1
Mini PCIE x1
I/O CONNECTORS
• 1 serial interface for 2 serial ports (TX/RX)
• 1 LVDS LCD panel connector
• 1 LCD/inverter power connector
• 1 8-bit Digital I/O connector
• 1 front audio connector for line-out and mic-in jacks
• 1 S/PDIF connector
• 1 SATA 3.0 port
• 1 SATA power connector
• 1 Smart battery charger connector
• 1 LPC connector
• 1 I2C connector
• 1 SMBus connector
• 1 front panel connector
• 2 fan connectors
ROM INTERFACE
• 1 SPI interface
- Supports up to 64Mbit
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 10% to 90%
POWER OUTPUT
• 12V, 5VSB, VCC_RTC (ATX mode)
12V, 5V, VCC_RTC (AT mode)
12V, VCC_RTC (AT mode)
PCB
• Dimensions
- Mini-ITX form factor
- 170mm (6.7") x 170mm (6.7")
• Compliance
- PICMG COM Express® R2.1, Type 10
Mini PCIE x1
(mSATA Opt.)
USB 2.0 4x
LVDS
GPIO
SYS Fan
LPC Super IO
Display Port
163.65
157.48
110.21
34.21
154.94
159.84
Fan
SLP & LID
COM 2x
USB 3.0 2x
LPC
Packing List
•
•
•
•
•
•
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
1
1
1
1
1
1
COM100-B board
SATA data cable
SATA power cable
I/O shield
QR (Quick Reference)
DVD
Optional Items
•
•
•
•
SATA data cable
Serial ATA power cable
I/O shield
Power adapter (120W, 19V) : 671-112004-100G
Carrier Board
Mechanical Drawing
DAMAGE FREE INTELLIGENCE
• Legacy Super I/O support*
- Monitors 5V/1.5V/12V/3.3V
- Monitors SIO_Fan
Computer-On-Module
REAR PANEL I/O PORTS
• 5V~19V DC-in jack
• 2 DB-9 RS232 serial ports
• 1 DisplayPort
• 1 RJ45 LAN port
• 2 USB 3.0 ports
• 4 USB 2.0 ports
• Line-in/Surround, Line out, Mic-in/Center+Subwoofer jacks
LVDS LCD
Panel
PCIe x1/
mSATA signal
SUPPORTED COM EXPRESS MODULE
• Mini form factor
2 COM
SIM slot
COM Express
connector
PCIe x1 and
USB signal
EXPANSION SLOTS
• 1 PCIe x1 slot (PCIe 2.0)
• 3 Mini PCIe slots (PCIe 2.0)
- 1 slot supports PCIe and USB signals for 3G module
- 1 slot supports PCIe and USB signals
- 1 slot supports PCIe or mSATA signal
- Supports half/full size Mini PCIe card
• 1 SIM card socket
COM Express Carrier Board
COM Express Carrier Board
COM331-B
Line-in
EXPANSION
USB 2.0
LAN
COM 1
Line-out
USB 3.0
Mic-in
DisplayPort 2
VGA
USB 3.0
DisplayPort 1
SATA 2.0
PCIe x1
PCIe x1
1 PCIe x16, 1 PCIe x4, 2 PCIe x1
1 Mini PCIe (PCIe signal only)
DISPLAY OUTPUTS 1 VGA, 3 DisplayPorts, 1 LVDS
LAN
1 LAN
COM
2 COM
USB
8 USB: 4 USB 3.0, 4 USB 2.0
STORAGE
4 SATA: 2 SATA 3.0, 2 SATA 2.0
1 SDIO
DIO
8-bit DIO
DIMENSIONS
244mm x 244mm (9.6" x 9.6")
SATA 3.0
PCIe x4
PCIe x16
COM Express
connector
COM 2
Supports Compact and Basic modules
SIO _Fan 1
Compact
Basic
Mini PCIe
SMBus
DIO
SDIO
SIO_Fan 2
System Fan
+12V power
Serial Interface ATX power Display Port 3
Serial Interface
GLAN
209.55
203.20
197.48
171.72
137.63
110.63
82.61
63.51
47.28
45.72
26.97
6.65
0.00
13.67
34.29
0.00
PCIe 6x
TYPE 6
Audio Codec
10.16
USB 2.0 8x
1
2
1
22.86
SATA 3.0 2x
LVDS
Connector
Row
A+B
SATA 2.0 2x
46.94
ONBOARD AUDIO FEATURES
• Realtek ALC886 5.1-channel High Definition Audio
• Audio outputs: Mic-in/Center+Subwoofer, line-in/surround and line out
• S/PDIF audio interface
STORAGE
• 4 Serial ATA ports
- 2 SATA 3.0 ports with data transfer rate up to 6Gb/s
- 2 SATA 2.0 ports with data transfer rate up to 3Gb/s
DIGITAL I/O
• 8-bit Digital I/O connector
- 4-bit GPI (General Purpose Input)
- 4-bit GPO (General Purpose Output)
VGA
GPIO
58.59
A32
A31
B31
B32
71.09
LPC Bus
Super I/O
(Option)
COM 2x
I/O CONNECTORS
• 1 connector for 1 external RS232 serial port
• 2 serial interface connectors (TX/RX)
• 1 SDIO slot
• 1 DisplayPort
• 1 LVDS LCD panel connector
• 1 LCD/inverter power connector
• 1 8-bit Digital I/O connector
• 1 front audio connector for line-out and mic-in jacks
• 1 S/PDIF connector
• 4 Serial ATA ports
• 1 LPC connector
• 1 I2C connector
• 1 SMBus connector
• 1 24-pin ATX power connector
• 1 4-pin 12V power connector
• 1 chassis intrusion connector
• 1 front panel connector
• 3 fan connectors
SUPPORTED COM EXPRESS MODULES
• Basic
• Compact
DAMAGE FREE INTELLIGENCE
• Legacy Super I/O support*
- Monitors 5V/1.5V/12V/3.3V
- Monitors SIO_Fan 1/SIO_Fan 2/System fan
ROM INTERFACE
• 1 SPI interface
- Supports up to 64Mbit
• 1 LPC/FWH interface
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 10% to 90%
POWER OUTPUT
• 12V, 5VSB, VCC_RTC (ATX mode)
12V, 5V, VCC_RTC (AT mode)
12V, VCC_RTC (AT mode)
PCB
• Dimensions
- microATX form factor
- 244mm (9.6") x 244mm (9.6")
• Compliance
- PICMG COM Express® R2.0, Type 6
CERTIFICATION
• CE
• FCC Class B
• RoHS
EXPANSION SLOTS
• 1 PCIe x16 Gen 3 slot
• 1 PCIe x4 Gen 2 slot
• 2 PCIe x1 slots (PCIe 2.0)
• 1 Mini PCIe slot (PCIe 2.0) (PCIe signal only)
- USB signal: optional
- Supports half/full size Mini PCIe card
FAN Connector
2x
134.59
COM331
145.59
154.94
154.94
H8
175.59
227.33
233.68
227.33
233.68
209.55
203.20
162.89
122.89
89.89
77.89
75.89
45.72
34.29
20.32
Mini PCIe
TYPE 6
PCIe x16
Connector
Row
C+D
USB 3.0 4x
Display Port 3x
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
•
•
•
•
•
•
1
2
1
1
1
1
COM331-B board
Serial ATA data cables
COM port cable (with bracket)
I/O shield
QR (Quick Reference)
DVD
Optional Items
•
•
•
•
Serial ATA data cable
COM port cable
I/O shield
Serial ATA power cable
Carrier Board
Block Diagram
10.16
* Optional and is not supported in standard model. Please contact your sales representative for more information.
Computer-On-Module
Mechanical Drawing
Specifications
REAR PANEL I/O PORTS
• 1 DB-9 RS232 serial port
• 1 DB-15 VGA port
• 2 DisplayPorts
• 1 RJ45 LAN port
• 4 USB 3.0 ports
• 4 USB 2.0 ports
• Line-in/Surround, Line out, Mic-in/Center+Subwoofer jacks
LPC
COM Express
connector
LVDS LCD
Panel
LVDS/inverter
power
COM331-B
Features
COM Express Carrier Board
COM Express Carrier Board
COM330-B
EXPANSION
LAN
Line-in
COM2
COM4
PS/2 Mouse
Line-out
(option)
PS/2 KB
Mic-in
(option)
USB 2.0
VGA
COM1
SATA 3.0
PCI 2
PCIe x4
PCI 1
PCIe x16
USB 6-7
COM 3
1 PCIe x16, 1 PCIe x4, 2 PCI
1 Mini PCIe (PCIe signal only)
DISPLAY OUTPUTS 1 VGA, 1 LVDS
LAN
1 LAN
COM
4 COM
USB
8 USB 2.0
STORAGE
4 SATA: 2 SATA 3.0, 2 SATA 2.0
1 CF
DIO
8-bit DIO
DIMENSIONS
244mm x 244mm (9.6" x 9.6")
Specifications
LPC
COM Express
connector
COM Express
connector
ATX power
USB 4-5
STORAGE
• 4 Serial ATA ports
- 2 SATA 3.0 ports with data transfer rate up to 6Gb/s
- 2 SATA 2.0 ports with data transfer rate up to 3Gb/s
• 1 CompactFlash socket
DIGITAL I/O
• 8-bit Digital I/O connector
- 4-bit GPI (General Purpose Input)
- 4-bit GPO (General Purpose Output)
Supports Compact and Basic modules
Compact
REAR PANEL I/O PORTS
• 3 DB-9 RS232 serial ports
• 1 DB-15 VGA port
• 1 RJ45 LAN port
• 4 USB 2.0/1.1 ports
• Line-in/Surround, Line out, Mic-in/Center+Subwoofer jacks
• 1 mini-DIN-6 PS/2 mouse port*
• 1 mini-DIN-6 PS/2 keyboard port*
+12V power
LVDS/Inverter
Power
Basic
SIO_Fan 3
DIO
SIO_Fan 2
SIO_Fan 1
CF
Mini PCIe SMBus
Giga LAN
209.55
203.20
197.50
171.43
135.34
109.18
87.57
65.78
47.28
45.72
26.97
13.67
6.65
0.00
34.29
USB2.0
USB 8x
0.00
SATA3.0
SATA 2x
22.86
29.25
Mini PCIe
Audio Codec
10.16
10.16
PCIe 4x
TYPE 2
Connector
Row
A+B
SATA2.0
SATA 2x
LVDS
VGA
SUPPORTED COM EXPRESS MODULES
• Basic
• Compact
DAMAGE FREE INTELLIGENCE
• Legacy Super I/O support*
- Monitors 5V/1.5V/12V/3.3V
- Monitors SIO_Fan 1/SIO_Fan 2/SIO_Fan 3
ROM INTERFACE
• 1 SPI interface
- Supports up to 64Mbit
• 1 LPC/FWH interface
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 10% to 90%
POWER OUTPUT
• 12V, 5VSB, VCC_RTC (ATX mode)
12V, 5V, VCC_RTC (AT mode)
12V, VCC_RTC (AT mode)
PCB
• Dimensions
- microATX form factor
- 244mm (9.6") x 244mm (9.6")
• Compliance
- PICMG COM Express® R2.0, Type 2
CERTIFICATION
• CE
• FCC Class B
• RoHS
SPI
GPIO
46.94
58.26
I/O Controller
LPC Bus
Super I/O
(Opt.)
COM 4x
121.76
PS/2 Keyboard
FAN Connector
PS/2 Mouse
132.76
154.94
154.94
162.76
CF
227.33
232.06
227.33
233.68
209.55
203.20
167.20
127.20
94.20
82.20
80.20
45.72
34.29
20.32
www.dfi.com
PCI 2x
PEG
IDE Bus
TYPE 2
Connector
Row
C+D
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
•
•
•
•
•
•
•
1
2
1
1
1
1
1
COM330-B board
Serial ATA data cables
USB port cable (with bracket)
COM port cable (with bracket)
I/O shield
QR (Quick Reference)
DVD
Optional Items
•
•
•
•
•
Serial ATA data cable
COM port cable
USB port cable
I/O shield
Serial ATA power cable
Carrier Board
Block Diagram
I/O CONNECTORS
• 2 connectors for 4 external USB 2.0/1.1 ports
• 1 connector for 1 external RS232 serial port
• 1 LVDS LCD panel connector
• 1 LCD/inverter power connector
• 1 8-bit Digital I/O connector
• 1 front audio connector for line-out and mic-in jacks
• 1 S/PDIF connector
• 4 Serial ATA ports
• 1 LPC connector
• 1 I2C connector
• 1 SMBus connector
• 1 24-pin ATX power connector
• 1 4-pin 12V power connector
• 1 chassis intrusion connector
• 1 front panel connector
• 3 fan connectors
EXPANSION SLOTS
• 1 PCIe x16 Gen 3 slot
• 1 PCIe x4 Gen 2 slot
• 1 Mini PCIe slot (PCIe 2.0) (PCIe signal only)
- USB signal: optional
- Supports half/full size Mini PCIe card
• 2 PCI slots (PCI 2.3)
Computer-On-Module
Mechanical Drawing
* Optional and is not supported in standard model. Please contact your sales representative for more information.
ONBOARD AUDIO FEATURES
• Realtek ALC886 5.1-channel High Definition Audio
• Audio outputs: Mic-in/Center+Subwoofer, line-in/surround and line out
• S/PDIF audio interface
SATA 2.0
LVDS LCD
Panel
COM330-B
Features
COM Express Carrier Board
COM Express Carrier Board
COM630-B
LAN COM 4 COM 2
Mic-in
Line-in
Line-out
USB 3
PS/2 Mouse
PS/2 K/B
USB 2
VGA
USB 0-1
COM 1
EXPANSION
DISPLAY OUTPUTS
LAN
COM
USB
PARALLEL
STORAGE
DIO
PCIe x1
PCIe x1
PCI 1
PCI 2
PCI 3
Parallel
PCI 4
PCIe x16
COM 3
COM Express
connector
COM Express
connector
Compact
FDD
SATA 0-1
DIO
DIMENSIONS
1 PCIe x16, 2 PCIe x1, 4 PCI
1 VGA, 1 LVDS
1 LAN
4 COM
8 USB 2.0
1 Parallel
4 SATA 2.0
1 CF
1 IDE
1 FDD
8-bit DIO
305mm x 244mm (12" x 9.6")
Specifications
SERIAL ATA FEATURES
• SATA speed up to 3Gb/s
• Four SATA ports
IDE FEATURES
• Supports up to Ultra ATA 100
• One IDE channel supports up to 2 IDE devices
BIOS FEATURES*
• FWH/LPC interface
• Supports up to 4Mbit flash ROM
• PLCC32 socket
• Supports WP# jumper
• Carrier board ROM enable/disable function supported
Supports Compact and Basic modules
Basic
IDE
ATX power
Front
panel
I/O CHIP 1 FEATURES
• Winbond 83627HG-AW controller
• LPC interface
• Supports Smart fan
• Default I/O port address "2eh"
SATA 2-3 LVDS LCD Panel
Block Diagram
Giga LAN
288.29
281.94
276.22
250.38
214.44
187.95
166.33
144.55
124.46
78.74
65.07
44.75
24.43
16.51
4.11
0.00
USB 8x
10.16
LVDS
0.00
Audio Codec
TYPE 2
USB2.0
LVDS Bus
VGA
Connector
Row
A+B
MSIC Logic
22.86
49.80
93.98
I/O Controller
COM 4x
LPC Bus
PS/2 Keyboard
FAN Connector
PS/2 Mouse
FDD
Super I/O
EXPANSION SLOTS
• 1 CompactFlash socket
• 1 PCI Express x16 (Graphics or Dual SDVO)
• 2 PCI Express x1
• 4 PCI slots (PCI 2.3, 32-bit, 33MHz)
REAR PANEL I/O PORTS
• 1 mini-DIN-6 PS/2 mouse port
• 1 mini-DIN-6 PS/2 keyboard port
• 3 DB-9 serial ports
• 1 DB-15 VGA port
• 1 RJ45 LAN port
• 4 USB 2.0/1.1 ports
• Mic-in, line-in and line-out
DAMAGE FREE INTELLIGENCE
• Monitors system temperature and overheat alarm
• Monitors system fan speed and failure alarm
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• Operating: 10% to 90%
COM EXPRESS CONNECTORS
• Two 220-pin COM Express standard connectors
• Module connector pin: Tyco 3-631849-6
Dimensions
• Dimensions
- ATX form factor
- 305mm (12") x 244mm (9.6")
• Compliance
- PICMG COM Express® R1.0, Type 2
CERTIFICATION
• CE
• FCC Class B
• UL
• RoHS
125.80
154.94
154.94
166.80
COM630
196.80
IDE
TYPE 2
SATA 4x
Connector
Row
C+D
LPC Bus
PCI 5x
227.33
227.33
271.48
281.94
256.48
235.48
169.48
124.46
0.00
PCIe
www.dfi.com
Packing List
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
PCIe x1 Port 1-2
•
•
•
•
•
•
•
•
1
1
1
1
1
1
1
1
COM630-B board
USB port cable
Serial ATA data cable
Serial ATA power cable
IDE cable
FDD cable
I/O shield
QR (Quick Reference)
Optional Items
•
•
•
•
•
Serial ATA data cable
IDE cable
USB port cable
I/O shield
Serial ATA power cable
Carrier Board
I/O CHIP 2 FEATURES
• Fintek F81216D controller
• LPC interface
• Supports 4 COM ports
• Supports IrDA
• Watchdog timer function
• Default I/O port address "4eh"
I/O CONNECTORS
• 2 connectors for 4 additional external USB 2.0/1.1 ports
• 1 connector for an external serial port
• 1 LVDS LCD panel connector
• 1 LCD/inverter power connector
• 1 Digital I/O connector
• 1 Digital I/O power connector
• 1 front audio connector for line-out and mic-in jacks
• 1 CD-in internal audio connector
• 1 S/PDIF-in/out connector
• 1 GPIO connector
• 1 connector for IrDA interface
• 4 Serial ATA connectors
• 1 40-pin IDE connector
• 1 FDD connector
• 1 parallel connector*
• 1 24-pin ATX power connector
• 1 4-pin 12V power connector
• 1 Wake-On-Ring connector
• 1 chassis open connector
• 1 front panel connector
• 3 fan connectors
• 1 diagnostic LED*
Computer-On-Module
Mechanical Drawing
* Optional and is not supported in standard model. Please contact your sales representative for more information.
AUDIO FEATURES
• Realtek ALC262 audio codec (ALC655*)
• 6-channel audio output
USB 4-7
CompactFlash socket
COM630-B
Features
Qseven Computer-On-Module
Qseven Computer-On-Module
Atom
Freescale
850C
850C
-400C
-400C
Wide
Temperature
Model
Processor
Wide
Temperature
Module
Carrier Board
Module
Carrier Board
FS700
Q7A-551
BT700
Q7X-151
Freescale i.MX 6 series
Intel® Atom™ E3800 series
Memory
1GB/2GB DDR3 memory down
N/A
2GB/4GB DDR3L memory down
(single channel)
N/A
Display
HDMI, LVDS
HDMI, LVDS
LVDS, DDI
LVDS, DP
1
1
1
1
USB 3.0
N/A
N/A
1
1
USB 2.0
4 USB 2.0, 1 USB OTG
2 Rear, 1 USB OTG
6
6
N/A
1 Rear, 1 by pin header
N/A
N/A
1
1 Rear
N/A
2 Rear
SATA 3.0
N/A
N/A
N/A
1
SATA 2.0
1
N/A
2
N/A
SSD
N/A
N/A
N/A
N/A
eMMC
Yes
N/A
Yes (option)
N/A
Mini PCIe
N/A
2 (1 mSATA, 1 Mini PCIe)
N/A
1 (mSATA)
PCIe x16
N/A
N/A
N/A
N/A
PCIe x4
N/A
N/A
N/A
1
PCIe x1
1
N/A
3
N/A
ExpressCard
N/A
N/A
N/A
N/A
SIM
N/A
1
N/A
N/A
I2C
Yes
N/A
Yes
Yes
Digital I/O
N/A
12-bit
N/A
N/A
I2S
I2S
HDA
HDA
LPC
N/A
N/A
Yes
Yes
SMBus
N/A
N/A
Yes
Yes
CAN-bus
Yes
Yes (option)
N/A
Yes
TPM (optional)
N/A
N/A
Yes
N/A
Watchdog
Yes
N/A
Yes
Yes
Power Input
5V
12~36V DC-in
5V
12V DC-in
Compliance
Qseven R1.2
N/A
Qseven R2.0
N/A
Dimensions
70mm x 70mm
190mm x 102mm
70mm x 70mm
170mm x 170mm
Ethernet
USB
RS232/422/485
Serial
RS232
Storage
Controller
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Qseven
Audio
Computer-On-Module
Expansion
Qseven Computer-On-Module
Qseven Computer-On-Module
Atom
850C
Atom
Atom
700C
-400C
-200C
Wide
Temperature
Wide
Temperature
Module
Module
Carrier Board
Module
Carrier Board
QB702-B
QB701-B
Q7-100
QB700-B
Q7-951
Processor
Intel® Atom™ E6x0T
Intel® Atom™ E6xxT/E6xx
Memory
1GB DDR2 onboard
1GB DDR2 onboard
N/A
512MB/ 1GB
DDR2 onboard
N/A
Display
LVDS, SDVO
LVDS, SDVO
DVI, VGA, LVDS
LVDS, SDVO
VGA, LVDS
1 Micrel
1 Micrel
2
1 Micrel
1
USB 3.0
N/A
N/A
N/A
N/A
N/A
USB 2.0
8 USB 2.0
7 USB host and
1 USB host/client
4 Rear, 4 by pin header (1 USB
client)
6 USB ports
1 USB client
2 Rear, 4 by pin header
RS232/422/485
N/A
N/A
N/A
N/A
1 by pin header
RS232
N/A
N/A
2 Rear
N/A
1 Rear
SATA 3.0
N/A
N/A
2
N/A
N/A
SATA 2.0
2
1
N/A
2
2
SSD
N/A
2GB (-B620T012)
4GB (-B640T122)
N/A
N/A
N/A
SDIO
Yes
Yes
Yes
Yes
Yes
Mini PCIe
N/A
N/A
1
N/A
1
PCIe x16
N/A
N/A
N/A
N/A
N/A
PCIe x4
N/A
N/A
N/A
N/A
N/A
PCIe x1
3
3
1
3
N/A
ExpressCard
1
N/A
Yes
N/A
N/A
I2C
Yes
Yes
Yes
Yes
Yes
Digital I/O
8-bit
N/A
8-bit
N/A
8-bit
HDA
HDA
HDA
HDA
HDA
LPC
Yes
Yes
Yes
Yes
Yes
SMBus
Yes
Yes
Yes
Yes
Yes
CAN-bus
Yes
Yes
Yes
Yes
Yes
TPM (optional)
Yes
Yes
N/A
N/A
Yes
Watchdog
Yes
Yes
N/A
Yes
N/A
Power Input
5V
5V
24-pin ATX
5V
12V
Compliance
Qseven R1.2
Qseven R1.2
N/A
Qseven R1.1
N/A
Dimensions
70mm x 70mm
70mm x 70mm
170mm x 170mm
70mm x 70mm
102mm x 147mm
Model
Ethernet
USB
Serial
Storage
Controller
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Qseven
Audio
Computer-On-Module
Expansion
Intel® Atom™ E6xx
FreescaleTM i.MX6 Series
Qseven
FreescaleTM i.MX6 Series
Qseven
FS700
MEMORY
1GB/2GB DDR3 memory down
DISPLAY OUTPUTS 1 HDMI, 2 LVDS
EXPANSION
1 PCIe x1
2 I2C, 1 CAN-bus
4 USB 2.0, 1 USB OTG
1 SATA 2.0
eMMC onboard, 1 microSD
1 SDIO
1 RS232
LAN
1 LAN
DIMENSIONS
Qseven R1.2
70mm x 70mm (2.76" x 2.76")
Freescale
microSD
DDR3
Freescale
i.MX6 series
DDR3
TOP
Specifications
SYSTEM MEMORY
• 1GB/2GB DDR3 memory down
850C
-400C
CAN-bus
DDR3
SD/MMC
* Optional and is not supported in standard model. Please contact your sales representative for more information.
PROCESSOR
• Freescale i.MX 6 series processors
- i.MX6Q: i.MX 6Quad, up to 1.0GHz, Four Cortex-A9 cores
- i.MX6D: i.MX 6Dual, up to 1.0GHz, Two Cortex-A9 cores
- i.MX6L: i.MX 6DualLite, up to 1.0GHz, Two Cortex-A9 cores
- i.MX6S: i.MX 6Solo, up to 1.0GHz, One Cortex-A9 core
eMMC
eMMC
Wide
Temperature
ONBOARD GRAPHICS FEATURES
• Supports HDMI and LVDS interfaces
• HDMI: HDMI v1.4, resolution up to 1920x1200 @ 60Hz
• LVDS: 18/24-bit
- One port up to 165 Mpixels/sec (e.g. 2560x1600 @ 60Hz)
- Two ports up to 85 Mpixels/sec (e.g. WUXGA+ @ 60Hz) each
• Built-in Video, 2D graphics and 3D graphics processors
• Supports OpenCL, OpenVG 1.1 and 1080p/720p decoder/encoder
ONBOARD AUDIO FEATURES
• Supports I2S interface
DDR3
ONBOARD LAN FEATURES
• One Atheros AR8033 Ethernet PHY
• Supports 10Mbps, 100Mbps and 1Gbps data transmission
BOTTOM
Mechanical Drawing
Block Diagram
SERIAL ATA (SATA) INTERFACE
• Supports 1 SATA 2.0 interface (Quad and Dual processors only)
• SATA speed up to 3Gb/s (SATA 2.0)
70.00
64.90
56.50
23.65
2.50
0.00
0.00
3.00
FS700
Features
eMMC
• Supports 4GB (standard), 8GB and 16GB eMMC onboard
24 bits LVDS
3.95
DDR3
24 bits LVDS
11.53
SD4
Backlight
eMMC
POWER
• Input: 5V
POWER CONSUMPTION
• Under 5W @ 5V
OS SUPPORT
• LTIB Linux 3.0.35
• Android 4.3 (Default Preloaded)
- Quad, Dual and DualLite processors only
TEMPERATURE
• Operating
: 0oC to 60oC - DualLite, Solo
: -40oC to 85oC - Quad, Dual
• Storage: -40oC to 85oC
HUMIDITY
• 5% to 90%
PCB
• Dimensions
- Qseven form factor
- 70mm (2.76") x 70mm (2.76")
• Compliance
- Qseven specification revision 1.2
WATCHDOG TIMER
• Software programmable
I2C 2
SD2
HDMI
micro SD
Top View
38.92
MDI
GLAN PHY
I2C
RGMII
MIPI CSI
UART5
67.00
70.00
66.06
AMXM Golden Finger
52.00
SATA
Freescale
i.MX6
PCIe
SPI 1
CAN Bus
SDIO (SD3)
HDA (I2S)
UART1
Sensor
Camera
Ordering Information
Model Name
FS700-M60-6S104
Processor
Freescale i.MX 6Solo at 1.0GHz, One Cortex-A9 core
FS700-M60-6L204
FS700-M60-6D204
FS700-M60-6Q208
Freescale i.MX 6DualLite at 1.0GHz, Two Cortex-A9 cores
Freescale i.MX 6Dual at 1.0GHz, Two Cortex-A9 cores
Freescale i.MX 6Quad at 1.0GHz, Four Cortex-A9 cores
Memory Down
1GB DDR3
2GB DDR3
2GB DDR3
2GB DDR3
eMMC
4GB
4GB
4GB
8GB
SATA
None
None
SATA 2.0
SATA 2.0
Power
ATX/AT
ATX/AT
ATX/AT
ATX/AT
Thermal
Fanless
Fanless
Fanless
Fanless
Temperature
0oC to 60oC
0oC to 60oC
-40oC to 85oC
-40oC to 85oC
More configurations are available for ODM project. Please contact your sales representative for more information.
Power ON
Reset
USB OTG
Bottom View
USB 0-3
Power
USB Hub
PMIC
USB
P
Power
Packing List
• 1 FS700-M60 board
• 1 QR (Quick Reference)
• 1 Heat spreader (for temperature -40°C to 85°C only)
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Optional Items
• Q7A-551 carrier board kit: 770-Q7A551-000G
• WM-240 WiFi kit: 761-110092-000G
• UC20 Mini-PCIe UMTS/HSPA+ Module: 612-110040-600G
Qseven
Computer-On-Module
18.00
microSD
• 1 microSD socket
EXPANSION INTERFACES
• Supports 4 USB 2.0 interfaces
• Supports 1 USB OTG (Type B) interface
• Supports 1 PCIe x1 interface
• Supports 1 RS232 serial interface
• Supports 2 I2C interfaces
• Supports CAN-bus (Controller-Area Network) interface
• Supports SDIO interface
Qseven Carrier Board
Qseven Carrier Board
Q7A-551
DC-in
LAN
COM
Features
EXPANSION
USB 0-1
Line-out
USB OTG
HDMI
SIM
DIO
1 Mini PCIe
1 SIM
DISPLAY OUTPUTS 1 HDMI, 1 LVDS
LAN
1 LAN
COM
3 COM
USB
2 USB 2.0, 1 USB OTG
STORAGE
1 mSATA
1 SD card
DIO
12-bit DIO
DIMENSIONS
190mm x 102mm (7.48" x 4.02")
Specifications
ONBOARD GRAPHICS FEATURES
• Display ports
- 1 HDMI
- 2 24-bit single channel LVDS
ONBOARD AUDIO FEATURES
• Supports I2S audio interface
• 2 1W audio amplifier connectors (left and right sides)
ONBOARD USB FEATURES
• 2 USB 2.0 ports
• 1 USB OTG port
Mini PCIe
mSATA
COM 1
MXM
Connector
LVDS LCD P
Panell
mSATA
SD Card
SIM slot
12 DIO
12~36V
DC-in
COM 2
FS700
Q7A-551
Mechanical Drawing
STORAGE
• 1 mSATA via a Mini PCIe slot
• 1 SD card socket
PANEL I/O PORTS
• 2 USB 2.0 ports
• 1 USB OTG port
• 2 DB-9 serial ports
- 1 RS232/422/485
- 1 RS232/UART
• 1 RJ45 LAN port
• 1 HDMI port
• 1 Line-out/Mic-in jack
• 1 12~36V DC-in jack
For FS700
SD card
* Optional and is not supported in standard model. Please contact your sales representative for more information.
Q7A-551
EXPANSION SLOTS
• 1 Mini PCIe slot
- supports PCIe and USB signals
- Supports full size Mini PCIe card
• 1 SIM card socket
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 10% to 90%
BOARD TO BOARD CONNECTORS
• One MXM connector
DIMENSIONS
• 190mm (7.48") x 102mm (4.02")
I/O CONNECTORS
• 1 connector for an external RS232/422/485 serial port (2.0mm pitch)
• 1 LVDS LCD panel connector
• 2 1W audio amplifier connectors (left and right sides)
• 1 CAN-bus (Controller-Area Network) connector*
• 1 12-bit Digital I/O connector
Block Diagram
Computer-On-Module
5.50
28.88
GLAN
Audio Codec
45.00
50.01
mSATA
58.50
73.70
75.00
USB 2x
USB OTG
87.40
101.50
104.01
117.51
119.14
136.21
PCIe
HDA
USB
Mini PCIe 2x
SATA 2.0
SPI
USB 2.0
USB OTG
Q7
MXM
Connector
LVDS
HDMI
Digital I/O
COM 3x
SDIO
145.49
Packing List
173.65
185.00
190.01
97.00
59.52
39.21
17.00
26.71
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
•
•
•
•
1
1
1
1
Q7A-551 board
I/O shield
QR (Quick Reference)
DVD
Optional Items
• I/O shield
• Power adapter (60W, 19V) : 671-106005-000G
Qseven Carrier Board
102.03
96.07
90.71
75.71
41.71
29.94
24.00
14.98
0.00
0.00
5.50
Intel® AtomTM E3800 Series
Qseven
Intel® AtomTM E3800 Series
Qseven
BT700
MEMORY
EXPANSION
Atom
2GB/4GB DDR3L memory down (single channel)
3 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 1 UART
1 LVDS, 1 DDI (HDMI/DVI/DP)
1 HDA
7 USB: 1 USB 3.0, 6 USB 2.0
2 SATA 2.0
eMMC (optional)
1 SD
1 LAN
Qseven R2.0
70mm x 70mm (2.76" x 2.76")
Intel Atom
E3800 Series
DDR3L
DDR3L
DDR3L
DDR3L
LAN
DIMENSIONS
TOP
850C
-400C
SD
SATA 2.0
DDR3L
DDR3L
DDR3L
USB 3.0
eMMC
Wide
Temperature
* Optional and is not supported in standard model. Please contact your sales representative for more information.
PROCESSOR
• Intel® AtomTM processors
• BGA 1170 packaging technology
• 22nm process technology
Mechanical Drawing
Block Diagram
Please refer to the Ordering Information below
SYSTEM MEMORY
• 2GB/4GB DDR3L memory down
• Supports DDR3L 1333MHz (-E45)
Supports DDR3L 1066MHz (-E26/-E15)
• Supports single channel memory interface
70.00
66.99
66.05
11.52
3.95
2.99
64.90
56.50
LVDS
PTN3460
eDP
DDI
0.00
POWER CONSUMPTION
• BT700-T44-E45: 12.72W with E3845 at 1.91GHz and 4GB DDR3L memory down
OS SUPPORT
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
• Windows 8.1 Enterprise x86 (32-bit)
• Windows 8.1 Enterprise x64 (64-bit)
• Windows 8.1 Embedded Pro x86 (32-bit)
• Windows 8.1 Embedded Pro x64 (64-bit)
TEMPERATURE
• Operating
: 0oC to 60oC - Atom (Fanless)
: -20oC to 70oC - Atom (Fanless with air flow)
: -40oC to 85oC - Atom (Fanless with air flow)
• Storage: -40oC to 85oC
2GB/4GB DDR3L
memory down
LPC
DDR3 1333MHz
Single Channel
SM Bus
AMXM Golden Finger
00.0
00.0
SPI Flash
64Mbit
Atom E3800
Series
SD
2
I C Bus
UART
SATA 2.0 2x
64.90
USB 2.0 4x
USB 3.0 1x
70.00
USB
HSIC
GbE
GLAN
I210
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
PCB
• Dimensions
- Qseven form factor
- 70mm (2.76") x 70mm (2.76")
• Compliance
- Qseven specification revision 2.0
Ordering Information
eMMC
eMMC
(optional)
Model Name
BT700-B40-E45
BT700-B40-E26
Processor
Intel® AtomTM E3845, Quad Core, 2M Cache, 1.91GHz, 10W
Intel® AtomTM E3826, Dual Core, 1M Cache, 1.46GHz, 7W
Memory Down
4GB DDR3L
4GB DDR3L
BT700-E40-E15
BT700-T44-E45
BT700-T40-E45
Intel® AtomTM E3815, Single Core, 0.5M Cache, 1.46GHz, 5W
Intel® AtomTM E3845, Quad Core, 2M Cache, 1.91GHz, 10W
Intel® AtomTM E3845, Quad Core, 2M Cache, 1.91GHz, 10W
4GB DDR3L
4GB DDR3L
4GB DDR3L
eMMC
None
None
None
4GB
None
Power
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
Thermal
Fanless
Fanless
Fanless
Fanless
Fanless
Temperature
0oC to 60oC
0oC to 60oC
-20oC to 70oC
-40oC to 85oC
-40oC to 85oC
The following specifications will be available upon request. Please contact your sales representative for more information.
USB 2.0 2x
(Opt. share with USB 3.0)
USB 2.0 2x
HUMIDITY
• 5% to 90%
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
Switch
Bottom View
SD INTERFACE
• Supports 1 SD interface
• Supports SDIO specification Ver. 3.0, HC Standard specification Ver. 3.0,
physical layer specification Ver. 3.0, security specification Ver. 1.01
USB
HSIC
Model Name
BT700
PCIe x1
-
Temperature
B
B: 0oC to 60oC
E: -20oC to 70oC
T: -40oC to 85oC
PCIe x1 (Opt.)
1.20
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
eMMC
0
0: None
4: 4GB
8: 8GB
1: 16GB
3: 32GB
-
Processors
E45
E45: Intel® AtomTM E3845, Quad Core, 2M Cache, 1.91GHz, 10W
E26: Intel® AtomTM E3826, Dual Core, 1M Cache, 1.46GHz, 7W
E15: Intel® AtomTM E3815, Single Core, 0.5M Cache, 1.46GHz, 5W
Packing List
Heatsink
Module PCB
Memory Down
2
2: 2GB
4: 4GB
•
•
•
•
1
1
1
1
BT700 board
QR (Quick Reference)
DVD
Heat sink: A71-012004-000G
Optional Items
•
•
•
•
Q7X-151 carrier board kit: 770-Q7X151-000G
Heat spreader: A71-012005-000G
Heat spreader with heat sink: 761-BT7000-000G
1 Bracket: A31-028001-200G
Qseven
11.53
HDA
PCIe x1 3x
14.00
POWER
• Input: VCC_RTC, 5V standby, 5V
Computer-On-Module
0.00
20.00
BIOS
• AMI BIOS
- 64Mbit SPI BIOS
eMMC*
• Supports 4GB, 8GB, 16GB and 32GB eMMC onboard
Top View
6.00
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature
• Monitors system fan speed
• Monitors Vcore/VGFX/VSM voltages
• Watchdog timer function
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics
• Supports LVDS and DDI interfaces
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to 1920x1200 @ 60Hz
• Digital Display Interface: HDMI, DVI and DP
• HDMI, DVI: resolution up to 1920x1080 @ 60Hz
• DP: resolution up to 2560x1600 @ 60Hz
• Supports hardware acceleration for DirectX 11, OCL 1.2, OGL 4.0, H.264,
MPEG2, MVC, VC-1, WMV9 and VP8 (supported version dependent on OS)
SERIAL ATA (SATA) INTERFACE
• Supports 2 Serial ATA interfaces
• SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
70.00
www.dfi.com
EXPANSION INTERFACES
• Supports 1 USB 3.0 port and 1 USB HSIC for 2 USB 2.0 (default); or
4 USB 2.0 ports (USB 3.0, by default, is shared with the USB 2.0 port 6 and 7)*
• Supports 4 USB 2.0 ports
• Supports 3 PCIe x1 (default); or 1 PCIe x4 (PCIe port 3, by default, is shared
with the onboard LAN)*
• Supports LPC interface
• Supports I2C interface
• Supports SMBus interface
• Suppotrs 1 UART interface (TX/RX/CTS/RTS)
ONBOARD LAN FEATURES
• Intel® I210AT/IT Gigabit Ethernet Controller
- Intel® I210IT supports wide temperature (-40oC to 85oC)
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
BOTTOM
56.50
Specifications
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
DDR3L
20.00
BT700
Features
Qseven Carrier Board
Qseven Carrier Board
Q7X-151
EXPANSION
Line-out
DC-in
DP
Mic-in/Center+
Subwoofer
USB 2.0
1 PCIe x4
1 SDIO
DISPLAY OUTPUTS 1 LVDS, 1 DP
LAN
1 LAN
COM
2 COM
USB
1 USB 3.0, 6 USB 2.0
STORAGE
1 SATA 3.0
1 mSATA
DIMENSIONS
170mm x 170mm (6.7" x 6.7")
COM 3
LAN
Line-in/ Surround
USB 3.0
COM 4
I2C
Specifications
MXM
Connector
ONBOARD AUDIO FEATURES
• Realtek ALC886 5.1-channel High Definition Audio
• Audio outputs: Mic-in/Center+Subwoofer, line-in/surround and line out
ONBOARD USB FEATURES
• 1 USB 3.0 and 6 USB 2.0 ports
STORAGE
• 1 SATA 3.0 port with data transfer rate up to 6Gb/s
- SATA port provides adequate space for SATA DOM
• 1 mSATA port
CAN-bus
USB 3.0
SATA 3.0
12V DC-in
GbE LAN
System
Fan_1
For BT700
CAN-bus
LVDS LCD
panel
LPC
LCD/Inverter
power
System
Fan_3
Q7X-151
System
Fan_2
USB 2.0
BT700
REAR PANEL I/O PORTS
• 1 12V DC-in jack
• 2 DB-9 RS232 serial ports
• 1 DP port
• 1 RJ45 LAN port
• 1 USB 3.0 port
• 2 USB 2.0 type A ports
• Mic-in/Center+Subwoofer, line-in/surround and line out jacks
I/O CONNECTORS
• 1 connector for 2 external USB 2.0/1.1 ports
• 2 UART ports
- 1 supports TX/RX signal only (UART 2)
• 1 LVDS LCD panel connector
• 1 LCD/inverter power connector
• 1 Serial ATA connector
• 1 Serial ATA power connector
• 1 mSATA port
• 1 LPC connector
• 1 I2C connector
• 1 SMBus connector
• 1 CAN-bus connector
• 1 front panel connector
• 3 fan connectors
EXPANSION SLOTS
• 1 PCIe x4 slot
• 1 SDIO socket
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
DAMAGE FREE INTELLIGENCE
• Monitors system temperature and overheat alarm
• Monitors system fan speed and failure alarm
ROM INTERFACE
• 1 SPI interface
- Supports up to 64Mbit
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 5% to 90%
BOARD TO BOARD CONNECTORS
• One MXM connector
DIMENSIONS
• Mini-ITX form factor
• 170mm (6.7") x 170mm (6.7")
Computer-On-Module
Block Diagram
151.76
124.83
114.95
94.89
73.83
53.45
39.79
21.23
1.73
0.00
6.35
SM Bus
0.00
GLAN
I C Bus
PCIe x4
2
SATA 3.0
Serial Port
22.86
SATA 1x
CAN Bus
46.23
46.78
53.34
mSATA
Display Port
Q7
Connector
SLP & LID
SDIO
Audio
ALC886
COM 2x
SIO Fan
Super I/O
LPC Bus
USB 3.0 port 0
USB 2.0 port 0-1
USB 2.0 port 2-5
LPC
154.94
154.94
SPI ROM
SPI Header
157.48
35.19
0.00
10.19
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
USB 3.0 1x
USB 2.0 4x
Packing List
LVDS
•
•
•
•
•
1
1
1
1
1
Q7X-151 board
Serial ATA data with power cable: 332-553001-005G
I/O shield: A49-Q7X151-000G
QR (Quick Reference)
DVD
Optional Items
• USB port cable: 332-253010-026G
• I/O shield: A49-Q7X151-000G
• Power adapter (100W, 12V) : 671-110001-100G
Qseven Carrier Board
Mechanical Drawing
* Optional and is not supported in standard model. Please contact your sales representative for more information.
ONBOARD GRAPHICS FEATURES
• Display ports
- 1 dual channel LVDS
- 1 DP port
UART
SM Bus
SATA Power
SATA 3.0
PCIe x4
mSATA
www.dfi.com
Q7X-151
Features
Intel® AtomTM E600 Series
Qseven
Intel® AtomTM E600 Series
Qseven
QB702-B
MEMORY
EXPANSION
Atom
1GB DDR2 onboard
3 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 1 CAN-bus, 1 serial
1 LVDS, 1 SDVO
8 USB 2.0
2 SATA 2.0
1 SDIO/MMC
1 ExpressCard
1 LAN
Qseven R1.2
70mm x 70mm (2.76" x 2.76")
Intel
Atom E6x0T
Intel EG20T
DDR2
SPI Flash
16Mbit BIOS
LAN
DIMENSIONS
DDR2
DDR2
DDR2
TOP
-400C
DDR2
onboard
Wide
Temperature
ExpressCard
SD/MMC
CAN-bus
DDR2
DDR2
DDR2
DDR2
BOTTOM
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
(512KB L2 cache, 600 MHz, 3.3W)
(512KB L2 cache, 1.0 GHz, 3.6W)
EXPANSION INTERFACES
• Supports 8 USB 2.0 interfaces:
- 7 Host and 1 Host/Client (selectable)
• Supports 3 PCIe x1 interfaces
• Supports 1 LPC interface
• Supports 1 SMBus interface
• Supports 1 I2C interface
• Supports CAN-bus (Controller-Area Network) interface
• Supports ExpressCard (PCIe signal only)
• Supports 1 serial interface (TX/RX)
(512KB L2 cache, 1.3 GHz, 3.6W)
(512KB L2 cache, 1.6 GHz, 4.5W)
CHIPSET
• Intel® EG20T PCH
ENERGY EFFICIENT DESIGN
• Supports ACPI 2.0/1.0 specification
• Enhanced Intel® SpeedStep Technology
ONBOARD GRAPHICS FEATURES
• Intel® GMA 600
• Supports up to 400MHz graphics frequency
• Ultra low power integrated 3D graphics
• High definition hardware video decoder and encoder engine
• Supports LVDS and SDVO interfaces
- LVDS: Supports pixel clock depths of 18/24-bit, single channel,
max. pixel clock of 80MHz, equates to 1280x768 @ 60Hz
- SDVO: Up to 160MHz pixel clock, equates to 1280x1024 @ 85Hz
BIOS
• AMI BIOS
- 16Mbit SPI Flash BIOS (UEFI BIOS)
WATCHDOG TIMER
• Software programmable from 1 to 255 seconds
POWER
• Input: VCC_RTC, 5V standby, 5V
• Supports ATX/AT mode
POWER CONSUMPTION
• 7.6 W with E680 at 1.6GHz and 1GB DDR2 onboard
ONBOARD LAN FEATURES
• Integrated Intel® PCH GbE MAC
• One Micrel KSZ9021RNI Ethernet PHY
• Supports 10Mbps, 100Mbps and 1Gbps data transmission
• IEEE 802.3 (10/100Mbps) and IEEE 802.3ab (1Gbps) compliant
0.00
Top View
32.86
PROCESSOR
• QB702-B620T102
- Intel® AtomTM E620T
• QB702-B640T102
- Intel® AtomTM E640T
• QB702-B660T102
- Intel® AtomTM E660T
• QB702-B680T102
- Intel® AtomTM E680T
* Optional and is not supported in standard model. Please contact your sales representative for more information.
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
70.00
56.48
52.00
27.74
Block Diagram
18.00
Mechanical Drawing
Specifications
SYSTEM MEMORY
• 1GB DDR2 onboard
• Supports memory down (single 32-bit channel)
850C
0.00
QB702-B
Features
33.33
LVDS
Processor
SDVO
56.50
CORE CORE
LPC
CORE CORE
SM Bus
Atom E6xx Series
PCIe x1 3x
Ø2.50 (*4pcs)
LVDS_DIMMING
Micro
controllerPIC16F690
CB_PWRBTN
WDI
I2C_DAT/CLO
AMXM Golden Finger
WDTO
Bottom View
+5V
5
Graphics
CORE
SPI
Memory
Controller
PMIC
DC/DC
LDO
PCIe x1
CLK Gen
HUMIDITY
• 10% to 90%
SSD*
• 2GB/4GB/8GB/16GB/32GB
SDIO/MMC INTERFACE
• Supports 1 SDIO/MMC
• Supports SDA Standard Ver 1.0, SD memory card specification Ver 2.0,
SDIO card specification Ver 1.0, MMC System specification Ver 4.1
• Conforms to Secure Digital Host Controller (SDHC) speed class 6
PCB
• Dimensions
- Qseven form factor
- 70mm (2.76") x 70mm (2.76")
• Compliance
- Qseven specification revision 1.2
SDIO/MMC
2
I C Bus
Ordering Information
CAN Bus
8.00
USB Cli
Clientt
20.20
EG20T
Serial RX/TX
USB 0
0-4
4
USB Hub
USB 5-7
USB 5
SPI
EEPROM
Model Name
QB702-B620T102
QB702-B640T102
QB702-B660T102
QB702-B680T102
Part Number
777-QB7021-4C0G
777-QB7021-5C0G
777-QB7021-6C0G
777-QB7021-7C0G
Description
Intel® AtomTM
Intel® AtomTM
Intel® AtomTM
Intel® AtomTM
E620T,
E640T,
E660T,
E680T,
600 MHz, 3.3W, onboard DDR2 1GB, RoHS
1.0 GHz, 3.6W, onboard DDR2 1GB, RoHS
1.3 GHz, 3.6W, onboard DDR2 1GB, RoHS
1.6 GHz, 4.5W, onboard DDR2 1GB, RoHS
SATA 2x
SSD
5.00
1.20
GbE
Heatsink
Port 1 (optional)
PHY
KSZ9021RNI
GMII
Module PCB
Carrier PCB
1.60
Heatspreader
Standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
• 1 QB702-B board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
•
•
•
•
Q7-100 carrier board kit
Heat spreader with heat sink: 761-Q70000-000G
Heat spreader: A71-012002-000G
1 Bracket
Qseven
SPI Flash
16Mbit
DDR2 8x
1Gbit x8
TEMPERATURE
• Operating: -40oC to 85oC
• Storage: -40oC to 85oC
SERIAL ATA (SATA) INTERFACE
• Supports 2 SATA interfaces
- One port shared with SSD
• SATA speed up to 3Gb/s (SATA 2.0)
Computer-On-Module
70.00
HDA
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
Intel® AtomTM E600 Series
Qseven
Intel® AtomTM E600 Series
Qseven
QB701-B
MEMORY
EXPANSION
Atom
512MB/1GB/2GB DDR2 SDRAM onboard
3 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 1 CAN-bus, 1 serial
1 LVDS, 1 SDVO
7 USB Host and 1 USB Host/Client
2 SATA 2.0
1 SDIO/MMC
1 LAN
Qseven R1.2
70mm x 70mm (2.76" x 2.76")
Intel
Atom E6xx
Intel EG20T
DDR2
SPI Flash
16Mbit BIOS
LAN
DIMENSIONS
DDR2
DDR2
DDR2
TOP
700C
SSD
-200C
Optional
DDR2
onboard
Wide
Temperature
2 SATA
CAN-bus
DDR2
DDR2
DDR2
BOTTOM
PROCESSOR
• Intel® AtomTM E600 Series processors
Please refer to the Ordering Information below
CHIPSET
• Intel® EG20T PCH (Platform Controller Hub)
ONBOARD GRAPHICS FEATURES
• Intel® GMA 600
• Supports up to 400MHz graphics frequency
• Ultra low power integrated 3D graphics
• High definition hardware video decoder and encoder engine
• Supports LVDS and SDVO interfaces
- LVDS: Supports pixel clock depths of 18/24-bit, single channel,
max. pixel clock of 80MHz, equates to 1280x768 @ 60Hz
- SDVO: Up to 160MHz pixel clock, equates to 1280x1024 @ 85Hz
0.00
LVDS
33.33
Processor
SDVO
CORE CORE
LPC
CORE CORE
SM Bus
Atom E6xx Series
PCIe x1 3x
70.00
Ø2.50 (*4pcs)
SPI Flash
16Mbit
Bottom View
Micro
controllerPIC16F690
CB_PWRBTN
WDI
I2C_DAT/CLO
AMXM Golden Finger
WDTO
LVDS_DIMMING
+5V
5
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
PCB
• Dimensions
- Qseven form factor
- 70mm (2.76") x 70mm (2.76")
• Compliance
- Qseven specification revision 1.2
CERTIFICATION
• CE, FCC Class B, UL, RoHS
DDR2 8x
1Gbit x8
Memory
Controller
PCIe x1
CLK Gen
SDIO/MMC
2
I C Bus
CAN Bus
USB Cli
Clientt
EG20T
Serial RX/TX
USB 0
0-4
4
USB Hub
USB 5
SATA 2x
SSD
POWER CONSUMPTION
• 12.42 W with E660T at 1.3GHz and 1GB DDR2 onboard
Graphics
CORE
SPI
PMIC
DC/DC
LDO
USB 5-7
POWER
• Input: VCC_RTC, 5V standby, 5V
Port 1 (optional)
SPI
EEPROM
Ordering Information
Model Name
QB701-B620T201
QB701-B620T101
QB701-B620T011
QB701-B640T201
QB701-B640T101
QB701-B640T121
QB701-B660T101
QB701-B680T101
QB701-B680T201
QB701-B620100
QB701-B640100
QB701-B660100
QB701-B680100
Part Number
777-QB7011-4F0G
777-QB7011-4C0G
777-QB7011-4A0G
777-QB7011-5F0G
777-QB7011-5C0G
777-QB7011-5E0G
777-QB7011-6C0G
777-QB7011-7C0G
777-QB7011-7F0G
777-QB7011-0C0G
777-QB7011-1C0G
777-QB7011-2C0G
777-QB7011-3C0G
Description
Intel® AtomTM E620T, onboard DDR2 2GB, -20oC to 70oC
Intel® AtomTM E620T, onboard DDR2 1GB, -20oC to 70oC
Intel® AtomTM E620T, onboard DDR2 512MB, 2GB SSD onboard, -20oC to 70oC
Intel® AtomTM E640T, onboard DDR2 2GB, -20oC to 70oC
Intel® AtomTM E640T, onboard DDR2 1GB, -20oC to 70oC
Intel® AtomTM E640T, onboard DDR2 1GB, 4GB SSD onboard, -20oC to 70oC
Intel® AtomTM E660T, onboard DDR2 1GB, -20oC to 70oC
Intel® AtomTM E680T, onboard DDR2 1GB, -20oC to 70oC
Intel® AtomTM E680T, onboard DDR2 2GB, -20oC to 70oC
Intel® AtomTM E620, onboard DDR2 1GB, 0oC to 60oC
Intel® AtomTM E640, onboard DDR2 1GB, 0oC to 60oC
Intel® AtomTM E660, onboard DDR2 1GB, 0oC to 60oC
Intel® AtomTM E680, onboard DDR2 1GB, 0oC to 60oC
20.00
Heatsink
GbE
5.00
Standoff
GMII
1.60
1.20
Carrier PCB
PHY
KSZ9021RNI
20.00
Module PCB
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
• 1 QB701-B board
• 1 QR (Quick Reference)
• 1 Drivers/utilities disk
Optional Items
• Q7-100 carrier board kit
• Heat sink: A71-012001-000G
• 1 Bracket
Qseven
HDA
ENERGY EFFICIENT DESIGN
• Supports ACPI 2.0/1.0 specification
• Enhanced Intel® SpeedStep Technology
Computer-On-Module
56.50
WATCHDOG TIMER
• Software programmable from 1 to 255 seconds
HUMIDITY
• 10% to 90%
SDIO/MMC INTERFACE
• Supports 1 SDIO/MMC
• Supports SDA Standard Ver 1.0, SD memory card specification Ver 2.0,
SDIO card specification Ver 1.0, MMC System specification Ver 4.1
• Conforms to Secure Digital Host Controller (SDHC) speed class 6
Top View
EXPANSION INTERFACES
• Supports USB interface:
- 7 Host and 1 Host/Client (selectable)
• Supports 3 PCIe x1 interfaces
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports CAN-bus (Controller-Area Network) interface
• Supports 1 serial interface (TX/RX)
BIOS
• 16Mbit SPI Flash BIOS (UEFI BIOS)
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
70.00
56.48
52.00
* Optional and is not supported in standard model. Please contact your sales representative for more information.
SERIAL ATA (SATA) INTERFACE
• Supports two Serial ATA interfaces
- One port shared with SSD
• SATA speed up to 3Gb/s (SATA 2.0)
Block Diagram
27.74
18.00
Mechanical Drawing
0.00
Specifications
ONBOARD LAN FEATURES
• Integrated Intel® PCH GbE MAC
• One Micrel KSZ9021RNI Ethernet PHY
• Supports 10Mbps, 100Mbps and 1Gbps data transmission
• IEEE 802.3 (10/100Mbps) and IEEE 802.3ab (1Gbps) compliant
DDR2
32.86
QB701-B
Features
Qseven Carrier Board
Qseven Carrier Board
Q7-100
Line-in/ Surround
LAN 2
EXPANSION
LAN 1
1 PCIe x1, 1 Mini PCIe
1 ExpressCard
DISPLAY OUTPUTS 1 DVI-I, 1 VGA, 1 LVDS
LAN
2 LAN
COM
2 COM
USB
8 USB 2.0
STORAGE
2 SATA 3.0
1 SD/MMC
DIO
8-bit DIO
DIMENSIONS
170mm x 170mm (6.7" x 6.7")
COM 1
VGA
Line-out
Mic-in/Center+
Subwoofer
COM 2
USB 0-1
DVI-I
(DVI-D signal)
USB 2-3
Q7-100
Features
Front Audio
S/PDIF
Specifications
GRAPHICS FEATURES
• Chrontel CH7317B (SDVO to RGB DAC)
LAN FEATURES
• 2 LAN ports
- LAN1: Gigabit Ethernet supported by the Qseven module
- LAN2: Realtek RTL8111DL PCIe Gigabit Ethernet controller
AUDIO FEATURES
• Realtek ALC886 5.1-channel High Definition Audio
• Audio outputs: Mic-in/Center+Subwoofer, line-in/surround
and line out
• S/PDIF audio interface
LCD/
Inverter
power
Realtek
ALC886
LVDS LCD
panel
MXM
Connector
SPI
PCIe x1
Mini PCIe
CAN-bus
ExpressCard
8 USB
2 SATA
2 GbE LAN
SATA
USB
DIO
ExpressCard
Front panel
CAN-bus
System Fan
Q7-100
ATX power
SD/MMC slot
QB701-B/QB702-B
EXPANSION SLOTS
• 1 PCIe x1 slot
• 1 Mini PCIe slot
- Supports half/full size Mini PCIe card
• 1 ExpressCard slot
REAR PANEL I/O PORTS
• 2 DB-9 RS232 serial ports
• 1 DB-15 VGA port
• 1 DVI-I port (DVI-D signal)
• 2 RJ45 LAN ports
• 4 USB 2.0/1.1 ports
• Mic-in/Center+Subwoofer, line-in/surround and line out
I/O CONNECTORS
• 2 connectors for 4 external USB 2.0/1.1 ports
• 1 LPC connector
• 1 I2C connector
• 1 CAN-bus connector
• 1 LVDS LCD panel connector
- 18/24-bit single channel
• 1 LCD/inverter power connector
• 1 8-bit Digital I/O connector
• 1 front audio connector for line-out and mic-in jacks
• 1 S/PDIF connector
• 2 Serial ATA connectors
• 1 24-pin ATX power connector
• 1 chassis intrusion connector
• 1 front panel connector
• 2 fan connectors
DAMAGE FREE INTELLIGENCE
• Monitors system temperature and overheat alarm
• Monitors system fan speed and failure alarm
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• Operating: 10% to 90%
BOARD TO BOARD CONNECTORS
• One MXM connector
Dimensions
• Mini-ITX form factor
• 170mm (6.7") x 170mm (6.7")
CERTIFICATION
• CE
• FCC Class B
• RoHS
163.83
157.48
151.78
148.65
125.71
89.62
10.16
10.16
0.00
SPI
Interface
17
1
22.86
1
2
5
6
3
2
1
46.94
54.80
68.30
149.90
85.90
8
1
2
1
122.30
3
SPI
VGA
CH7317
CH7318
DVI
LVDS
ALC886
GLAN
(RTL8111DL)
GLAN
SDVO
Interface
USB
Interface
LVDS
Interface
Serial ATA
Q7
Interface
Connector SDIO
Interface
PCIe x1
Interface
W83627DHG-P
USB 2.0 8x
GPIO 8 Ports
H/W Monitor
CASE Open
CPU/SYS FAN
KB/MS
RS232 2x
SATA II 2x
SD CARD
Mini PCIe x1
PCIe x1
Front
Audio
SPDIF
A
Packing List
C
1
154.94
160.02
154.94
160.02
157.48
163.83
149.90
134.90
100.90
85.90
0.00
6.35
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
•
•
•
•
•
1
1
1
1
1
Q7-100 board
Serial ATA data cable
I/O shield
QR (Quick Reference)
DVD
Optional Items
•
•
•
•
Serial ATA data cable
Serial ATA power cable
I/O shield
USB port cable
Qseven
Block Diagram
59.43
36.91
17.75
6.35
1.57
0.00
Computer-On-Module
Mechanical Drawing
STORAGE
• 2 SATA 3.0 ports with data transfer rate up to 6Gb/s
• 1 SD/MMC slot
I/O CHIP FEATURES
• Winbond 83627DHG-P controller
• LPC interface
• Supports system fan
• Default I/O port address "2Eh"
For QB702-B, QB701-B
I2C
SM Bus
* Optional and is not supported in standard model. Please contact your sales representative for more information.
Intel® AtomTM E600 Series
Qseven
Intel® AtomTM E600 Series
Qseven
QB700-B
MEMORY
EXPANSION
Atom
512MB DDR2 SDRAM onboard
3 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 1 CAN-bus
1 LVDS, 1 SDVO
6 USB 2.0, 1 USB Client
2 SATA 2.0
1 SDIO/MMC
1 LAN
Qseven R1.1
70mm x 70mm (2.76" x 2.76")
Intel EG20T
SPI EEPROM
512Kbit
DDR2
1Gbit x8
Intel Atom
E6xx
DDR2
1Gbit x8
SPI Flash
16Mbit BIOS
LAN
DIMENSIONS
CAN-bus
1 GbE LAN
2 SATA
7 USB
Specifications
PROCESSOR
• Intel® AtomTM
• Intel® AtomTM
• Intel® AtomTM
• Intel® AtomTM
DDR2
onboard
70.00
52.00
Watchdog
Processor
67.00
41.11
Max 1GB
HDA
POWER
• Input: VCC_RTC, 5V standby, 5V
POWER CONSUMPTION
• 15.94 W with E680 at 1.6GHz and 512MB DDR2 onboard
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
SDIO/MMC INTERFACE
• Supports 1 SD/SDIO/MMC
• Supports SDA Standard Ver 1.0, SD memory card specification Ver 2.0,
SDIO card specification Ver 1.0, MMC System specification Ver 4.1
• Conforms to Secure Digital Host Controller (SDHC) speed class 6
HUMIDITY
• 10% to 90%
PCB
• Dimensions
- Qseven form factor
- 70mm (2.76") x 70mm (2.76")
• Compliance
- Qseven specification revision 1.1
CERTIFICATION
• CE
• FCC Class B
• RoHS
®
Intel Atom™
E6xx Series
SM Bus
B
SPI
PCIe 3x
Bottom View
PMIC
DC/DC
LDO
PCIe
Chipset
SATA 2x
Ordering Information
USB 6x
Model Name
USB Client
QB700-B680
Intel® EG20T PCH
(Platform
Controller Hub)
SDIO/MMC
2
I C Bus
20.00
Heatsink
QB700-B660
QB700-B640
CAN Bus
GbE
CLK Gen
RGMII
QB700-B620
Part Number
777-QB7001-310G
777-QB7001-300G
777-QB7001-210G
777-QB7001-200G
777-QB7001-110G
777-QB7001-100G
777-QB7001-010G
777-QB7001-000G
Description
Intel® AtomTM E680, onboard DDR2 1GB
Intel® AtomTM E680, onboard DDR2 512MB
Intel® AtomTM E660, onboard DDR2 1GB
Intel® AtomTM E660, onboard DDR2 512MB
Intel® AtomTM E640, onboard DDR2 1GB
Intel® AtomTM E640, onboard DDR2 512MB
Intel® AtomTM E620, onboard DDR2 1GB
Intel® AtomTM E620, onboard DDR2 512MB
PHY
KSZ9021RNI
5.00
Standoff
1.60
1.20
Carrier PCB
20.00
Module PCB
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
• 1 QB700-B board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
• Q7-951 carrier board kit
• Heat sink: A71-012000-000G
• 1 Bracket
Qseven
LPC
ENERGY EFFICIENT DESIGN
• Supports ACPI 2.0/1.0 specification
• Enhanced Intel® SpeedStep Technology
Computer-On-Module
3.00
DDR2
Onboard
BIOS
• 16Mbit SPI Flash BIOS (UEFI BIOS)
TEMPERATURE
• 0oC to 60oC
SERIAL ATA (SATA) INTERFACE
• Supports two Serial ATA interfaces
• SATA speed up to 3Gb/s (SATA 2.0)
LVDS
Ø2.50 (*4pcs)
ONBOARD GRAPHICS FEATURES
• Intel® GMA 600
• Supports up to 400MHz graphics frequency
• Ultra low power integrated 3D graphics
• High definition hardware video decoder and encoder engine
• Supports LVDS and SDVO interfaces
- LVDS: Supports pixel clock depths of 18/24-bit, single channel,
max. pixel clock of 80MHz, equates to 1280x768 @ 60Hz
- SDVO: Up to 160MHz pixel clock, equates to 1280x1024 @ 85Hz
ONBOARD LAN FEATURES
• Integrated Intel® PCH GbE MAC
• One Micrel KSZ9021RNI Ethernet PHY
• Supports 10Mbps, 100Mbps and 1Gbps data transmission
• IEEE 802.3 (10/100Mbps) and IEEE 802.3ab (1Gbps) compliant
Top View
SDVO
EXPANSION INTERFACES
• Supports 6 USB ports (USB 1.1/2.0 host controllers)
• Supports 1 USB Client interface
• Supports LPC interface
• Supports SMB and I2C interfaces
• Supports 3 PCIe x1 interfaces
• Supports CAN-bus (Controller-Area Network) interface
QB700-B680
QB700-B660
QB700-B640
QB700-B620
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
21.15
56.50
:
:
:
:
SYSTEM MEMORY
• Supports memory down (single 32-bit channel)
• Supports DDR2 800MHz
• Supports up to 1GB system memory (default: 512MB)
0.00
2.50
49.47
E680
E660
E640
E620
* Optional and is not supported in standard model. Please contact your sales representative for more information.
CHIPSET
• Intel® EG20T PCH (Platform Controller Hub)
Block Diagram
36.41
18.00
0.00
Mechanical Drawing
70.00
QB700-B
Features
Qseven Carrier Board
Qseven Carrier Board
Q7-951
Line-out
LAN
USB 0-1
Q7-951
Features
COM1
VGA
EXPANSION
DISPLAY OUTPUTS
LAN
COM
USB
STORAGE
12V DC-in
2
IC
DIO
DIO Power
COM2
CAN-bus
Front Audio
Realtek
ALC262
DIO
DIMENSIONS
Specifications
1 Mini PCIe
1 VGA, 1 LVDS
1 LAN
2 COM
6 USB 2.0, 1 USB Client
2 SATA 2.0
1 SDIO/MMC
8-bit DIO
102mm x 147mm (4.02" x 5.79")
* Optional and is not supported in standard model. Please contact your sales representative for more information.
GRAPHICS FEATURES
• Chrontel CH7317B (SDVO to RGB DAC)
AUDIO FEATURES
• Realtek ALC262 audio codec
• 2-channel audio output
SERIAL ATA (SATA) FEATURES
• Two Serial ATA ports
• SATA speed up to 3Gb/s (SATA 2.0)
Mini PCIe
USB Client
MXM
USB 2-3
USB 4-5
SATA1
7 USB
2 SATA
1 GbE LAN
2 Displays
CAN-bus
LVDS
LCD panel
SATA0
External
power
LPC
TPM FEATURES*
• Infineon SLB9635TT12
I/O CHIP FEATURES
• Winbond 83627DHG-P controller
• LPC interface
• Supports system fan
• Default I/O port address "2Eh"
For QB700-B
LCD/Inverter power
Q7-951
DAMAGE FREE INTELLIGENCE
• Monitors system temperature and overheat alarm
• Monitors system fan speed and failure alarm
QB700-B
Block Diagram
HUMIDITY
• Operating: 10% to 90%
DIMENSIONS
• 3.5" form factor
• 102mm (4.02") x 147mm (5.79")
CERTIFICATION
• CE
• FCC Class B
• RoHS
142.80
133.90
125.82
103.32
85.47
69.80
43.02
25.11
9.94
0.00
3.20
3.18
0.00
3.18
0. 00
LPC Bus
Audio Codec
24.47
39.47
USB 6x
73.47
SDIO
88.47
I C Bus
101.82
101.82
85.47
0.00
3.20
142.80
139.47
133.90
95.22
111.34
95.22
USB 2.0
USB Client
SATA 2x
SATA II
Winbond
LPC
TPM (Opt.)
Q7
MXM
Connector
System Fan
Digital I/O
COM 1
COM 2
LVDS
SDVO
Chrontel
CH7317
VGA
Mini PCIe
2
Giga LAN
Packing List
•
•
•
•
•
•
www.dfi.com
TEMPERATURE
• 0oC to 60oC
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
1
1
1
1
1
1
Q7-951 board
Serial ATA data cable
Power cable
COM cable
QR (Quick Reference)
DVD
Optional Items
•
•
•
•
SATA data cable
COM port cable
I/O shield
Power adapter (100W, 12V) : 671-110001-100G
Computer-On-Module
REAR PANEL I/O PORTS
• 1 12V DC-in jack
• 1 DB-15 VGA port
• 1 DB-9 RS232 serial port
• 2 USB 2.0/1.1 ports
• 1 RJ45 LAN port
• 1 line-out jack
BOARD TO BOARD CONNECTORS
• One MXM connector
Qseven Carrier Board
Mechanical Drawing
EXPANSION SLOTS
• 1 SDIO/MMC socket
• 1 Mini PCIe socket
- Supports half/full size Mini PCIe card
I/O CONNECTORS
• 2 connectors for 4 external USB 2.0/1.1 ports
• 1 connector for an external RS232/422/485 serial port
• 1 LPC connector
• 1 SMBus connector
• 1 I2C connector
• 1 CAN-bus connector
• 1 USB client connector
• 1 LVDS LCD panel connector
- 18/24-bit single channel
• 1 LCD/inverter power connector
• 1 8-bit Digital I/O connector
• 1 Digital I/O power connector
• 1 audio connector for line-in, line-out and mic-in jacks
• 1 S/PDIF connector
• 2 Serial ATA connectors
• 1 4-pin 12V power connector
• 1 chassis intrusion connector
• 1 front panel connector
• 1 fan connector
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