Robin Z5xx

Robin Z5xx
Robin Z5xx
Datasheet
Revision History
Date
Doc.
Rev.
Robin Z5xx
Versions
Changes
18-Nov-09
0.1
V2.0
Preliminary Release
04-Feb-10
1.0
V2.0
chapter LPC + note for LPC_CLK
grammar changes
chapter AC power adaptor 5.2.1
02-Jul-10
1.1
V2.0, V1.0
New chapter 2.2. Variants
New chapter: 4.9 TV out
Moved chapter: 8.1. Temperature Range
Moved chapter: 8.2. Notes for a custom heatsink…
13-Jul-10
1.2
V2.0, V1.0
Minor changes
16-Sept-10
1.3
V2.0, V1.0
Updated power consumption table
21-Sept-10
1.31
V2.0, V1.0
Minor correction in SDIO/GPIO chapter 3.3.1
22-Sept-10
1.32
V2.0, V1.0
Minor correction in Programming Guide to the Oak
Sensor Family chapter 1.1.3
01-Feb-11
1.33
V2.0, V1.0
Update external links in chapter 1.1.4
Additional remark to power up sequence chapter 5.3
New Disclaimer
05-May-11
1.34
V2.0, V1.0
Pins B93 & B94 changed to 5V Rail
Toradex AG l Altsagenstrasse 5 l 6048 Horw l Switzerland l +41 41 500 48 00 l www.toradex.com l [email protected]
Contents
1.
Introduction .................................................................................................................. 5
1.1. Reference Documents ........................................................................................................................ 5
1.1.1
COM Express™ Design Guide .................................................................................................. 5
1.1.2
COM Express™ Reference Board Schematics ......................................................................... 5
1.1.3
Programming Guide to the Oak Sensor Family......................................................................... 5
1.1.4
Cypress CY8C24794 ................................................................................................................. 5
1.1.5
Chrontel CH7022 ....................................................................................................................... 5
2.
Features ....................................................................................................................... 6
2.1. Block Diagram ..................................................................................................................................... 6
2.2. Variants ............................................................................................................................................... 7
2.3. CPU and Chipset ................................................................................................................................ 7
2.4. Interfaces ............................................................................................................................................ 8
2.5. Differences between Robin V2.0 to Robin V1.0 ................................................................................. 9
2.5.1
DDR2 x8 instead of x16 DDR2 .................................................................................................. 9
2.5.2
SDIO / GPIO switch ................................................................................................................... 9
2.5.3
PCB thickness ........................................................................................................................... 9
2.5.4
FFC shifted ................................................................................................................................ 9
2.5.5
Thermal sensor .......................................................................................................................... 9
3.
Robin Connectors ....................................................................................................... 10
3.1. Physical Location .............................................................................................................................. 10
3.2. Signal Notation .................................................................................................................................. 10
3.2.1
Signal Types ............................................................................................................................ 10
3.2.2
Signal Voltage Rail .................................................................................................................. 11
3.3. COM Express Connector Pin Assignment ........................................................................................ 11
3.3.1
SDIO / GPIO signals ................................................................................................................ 16
3.4. Assignment of additional FFC Connector ......................................................................................... 17
4.
Signal Description....................................................................................................... 19
4.1. System Memory ................................................................................................................................ 19
4.2. Serial ATA ......................................................................................................................................... 19
4.3. USB Interface .................................................................................................................................... 19
4.3.1
USB mapping ........................................................................................................................... 19
4.3.2
USB client ................................................................................................................................ 20
4.4. Ethernet Controller ............................................................................................................................ 20
4.5. PCI Express ...................................................................................................................................... 20
4.6. ExpressCard ..................................................................................................................................... 20
4.7. SDIO, SD Card and MMC ................................................................................................................. 20
4.8. VGA ................................................................................................................................................... 21
4.9. TV out ................................................................................................................................................ 21
4.10. Robin Z5xx Module LEDs ................................................................................................................. 21
4.11. LPC ................................................................................................................................................... 22
5.
Power Supply.............................................................................................................. 23
5.1. Power States ..................................................................................................................................... 23
5.2. Power Supply .................................................................................................................................... 24
5.2.1
AC Power Adaptor ................................................................................................................... 24
5.2.2
ATX-Like Configuration using SUS_S5# as PS_ON ............................................................... 25
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Page 2
5.2.3
ATX-Like Configuration using SUS_S3# as PS_ON ............................................................... 26
5.2.4
Configuration without Standby Supply..................................................................................... 27
5.2.5
Minimum Power Configuration ................................................................................................ 28
5.3. Power Sequences ............................................................................................................................. 29
5.3.1
G3 to S0 controlled by Power Button ...................................................................................... 29
5.3.2
G3 to S0 without Waiting for Power Button ............................................................................. 30
5.3.3
S0 to S5 Shutdown .................................................................................................................. 30
5.3.4
S0 to S3 Suspend to RAM ....................................................................................................... 31
5.3.5
S3 to S0 Resume..................................................................................................................... 31
5.3.6
Power Button Emergency Shutdown ....................................................................................... 32
Wakeup Events ......................................................................................................................................... 32
6.
Robin Embedded Controller ........................................................................................ 33
6.1. INTERRUPT OUT Report Contents (Real time data) ....................................................................... 33
6.1.1
GPIO Command ...................................................................................................................... 34
6.1.2
Watchdog ................................................................................................................................. 34
2
6.1.3
I C interface ............................................................................................................................. 34
6.2. INTERRUPT IN Report Contents (Real time data) ........................................................................... 35
6.2.1
Frame Number......................................................................................................................... 35
6.2.2
GPIO Values ............................................................................................................................ 35
2
6.2.3
I C interface ............................................................................................................................. 35
6.2.4
System Status .......................................................................................................................... 35
6.3. FEATURE Report Commands for GPIO ........................................................................................... 36
6.3.1
Report Mode ............................................................................................................................ 36
6.3.2
Sample Rate ............................................................................................................................ 36
6.3.3
GPIO Direction ......................................................................................................................... 37
6.3.4
GPIO Output Mode .................................................................................................................. 37
6.3.5
Standby Configuration ............................................................................................................. 38
6.4. FEATURE Report Commands for Watchdog.................................................................................... 38
6.4.1
Watchdog mode....................................................................................................................... 38
6.4.2
Strobe Interval ......................................................................................................................... 38
6.4.3
Watchdog Enable Delay .......................................................................................................... 39
6.4.4
Watchdog Source .................................................................................................................... 39
6.4.5
Service Watchdog.................................................................................................................... 39
6.4.6
Reset Watchdog Pin ................................................................................................................ 40
6.5. FEATURE Report Commands for Power Management ................................................................... 40
6.5.1
Boot Mode ............................................................................................................................... 40
6.5.2
S3 Signalization Mode ............................................................................................................. 40
6.5.3
Reset THRM Pin ...................................................................................................................... 41
6.6. Toradex Z5xx Tweaker Tool ............................................................................................................. 42
7.
Watchdog................................................................................................................... 43
8.
Thermal considerations ............................................................................................... 45
8.1. Temperature Range .......................................................................................................................... 45
8.2. Notes for a custom heatsink or heatspreader ................................................................................... 45
8.3. Temperature sensor chip .................................................................................................................. 46
8.3.1
Warning signal ......................................................................................................................... 46
8.3.2
Critical Temperature signal ...................................................................................................... 46
8.3.3
Default BIOS values ................................................................................................................ 46
9.
Technical Specification ................................................................................................ 47
9.1. Electrical Characteristics ................................................................................................................... 47
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Page 3
9.2. Power Consumption .......................................................................................................................... 47
9.3. Mechanical characteristics ................................................................................................................ 48
9.3.1
Mechanical characteristics of Robin Z5xx V1.0 ....................................................................... 48
9.3.2
Mechanical characteristics of Robin Z5xx V2.0 ....................................................................... 48
9.3.3
Details with height information ................................................................................................. 49
9.4. RoHS Compliance............................................................................................................................. 49
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Page 4
1. Introduction
Robin Z5xx is an embedded Nano COM Express™ computer module designed for high
performance computing with low power consumption. Robin Z5xx is based on the Intel® Atom™
Z530 or Z510 processors and the Intel® System Controller Hub US15W. Robin Z530 is based on
the Intel® Atom™ Z530 processor running at 1.6GHz. Robin Z510 is a lower cost module based on
the Intel® Atom™ Z510 processor running at 1.1GHz.
Robin Z530 offers a single PCI Express x1 lane, GLAN, HDA and up to 7 High Speed USB ports for
fast signal connectivity. One USB port can be configured as USB client. In standard configuration, it
features dual independent graphical outputs with VGA and LVDS.
Robin Z5xx provides various possibilities for storing data. A Solid State Drive (SSD) and a MicroSD
card slot are provided on the module itself. A SATA and SDIO interface are available on the COM
Express™ connector. A 30 pin FFC connector features an additional SDIO channel for SD cards,
MMC cards, WLAN adaptors, Bluetooth adaptors, modems, IrDA adapters, RFID readers or GPS
modules.
1.1. Reference Documents
For detailed technical information about the components of the Robin module and the COM
Express™ standard, please refer to the documents listed below.
1.1.1 COM Express™ Design Guide
Guidelines for designing a COM Express™ carrier board
http://www.comexpress-pnp.org/uploads/media/COMExpressPnP_DG_09.pdf
1.1.2 COM Express™ Reference Board Schematics
Schematic diagrams of the COM Express™ evaluation carrier board
http://www.comexpress-pnp.org/uploads/media/CEVAPnPSA0_09.pdf
1.1.3 Programming Guide to the Oak Sensor Family
Application note regarding the access of the Robin Embedded Controller (which is software
compatible with the Toradex Oak Sensor Family of Toradex)
http://files.toradex.com/Oak/Oak_ProgrammingGuide.pdf
1.1.4 Cypress CY8C24794
Embedded Controller
http://www.cypress.com/?docID=26676
1.1.5 Chrontel CH7022
SDVO to VGA converter
http://www.chrontel.com/pdf/7021-7022ds.pdf
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Page 5
2. Features
2.1. Block Diagram
Robin Z5xx Module
Diode
COM Express
Carrier Board
CPU
Intel Atom
Z530/Z510
Voltage
Regulators
Temp Sens
LM95245
Power
Supply
4.75-14.5V
Battery
Manage
ment 2)
SMB
Micro
SD Slot
FSB: 533/400 MHz 6)
2
SDIO
SDIO
HDA
Codec
HDA
Audio
SMB
DDR2
MemoryDown
IDE
DDR2
533/400 6)
SCH
US15W
IDE2SATA
JMH330
LVDS
1
LVDS
SATA
1
SATA
SSD
4,2,1GB
SIO
COM
LPT
PS/2
Floppy
1)
FWH
SST49L
F008A
ID
FWH 4)
Socket
LPC
Slot 0
VGA DAC
CH7022 5)
SDVO
Optional
Optional
Embedded
Controller
CY8C24794
VGA
1
VGA
SVDO
1
SDVO 5)
Optional
PCIe
SMB
Power Management Signals
Slot 1
Buzzer
PCIe to LAN
RTL8111C/D
or RTL8102E
PCIe
1x PCIe
(x1)
PCIe
1x PCIe
(x1) 7)
GLAN
1
LAN
USB
7
USB
PWR Button
Reset Button
PWR
RST
GPIO
8
GPIO
1) Super IO is only supported by the newest BIOS versions. Please contact Toradex for more
information.
2) Battery Management requires the customization of the BIOS/Driver. Please contact Toradex
for more information.
3) Assembly option for higher volumes: Realtek RTL8102E Fast Ethernet controller instead of
Realtek RTL8111C/D Gigabit Ethernet controller.
4) Optional firmware hub (FWH) on base board. Onboard FWH can be disabled.
5) Assembly option for higher volumes: SDVO output instead of on Module VGA DAC.
6) DDR2 and FSB are 533 for Robin Z530 and 400 on Z510.
7) Assembly option for higher volumes: Additional PCIe instead of Ethernet controller.
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Page 6
2.2. Variants
From Toradex, several variants are available. Those variants differ in the assembled key
components and price.
Variant
S
M
L
CPU
Z510
Z530
Z530
FSB, DDR Frequency
400MHz
533MHz
533MHz
DDR RAM
512MByte
512MByte
1GByte
Solid State Disk (SSD)
1/2GByte
2GByte
4GByte
PCB Version
V1.0
V1.0
V2.0
PCB thickness
1.6mm
1.6mm
2.0mm
2.3. CPU and Chipset
Robin with CPU Z530
Robin with CPU Z510
Processor
Intel® Atom™ Z530
Intel® Atom™ Z510
CPU Clock
1.6 GHz
1.1 GHz
Front Side Bus
533MHz
400MHz
Instruction Cache
32kByte
32kByte
L1 Cache
24kByte
24kByte
L2 Cache
512kByte
512kByte
Hyper Thread
Yes
No
Chipset
Intel® System Controller Hub US15W
Intel® System Controller Hub US15W
Video Controller
Integrated Intel® Graphics, Intel® GMA 500,
HDTV/HD capable
Decoder for MPEG2(HD) /H2.64
Integrated Intel® Graphics, Intel® GMA 500,
HDTV/HD capable
Decoder for MPEG2(HD) /H2.64
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Page 7
2.4. Interfaces
Robin Z5xx V1.0 / V2.0
PCI Express
1 PCIe x1
ExpressCard
1 Supported
Ethernet
10/100/1000 Mbit LAN
Audio
Intel® High Definition Audio (24bit/96kHz)
Serial ATA
1 (IDE bridge)
USB
7x USB 2.0 (1 channel configurable as client)
SD Memory Card
MicroSD slot on board
SDIO
1)
1 on Com Express connector (4bit)
1 on separate FFC connector (8bit)
LVDS
Single Channel 18/24 bit WXGA 1366x768
SDVO
No 2)
Analog VGA
Yes
TV out
Yes
LPC
Yes
SMB
Yes
I2C
Yes (over Embedded Controller)
GPIO
8 over Embedded Controller, available on
-Robin V1.0 FFC
-Robin V2.0 FFC or Com Express connector
Notes:
1) Assembly option for higher volumes: Realtek RTL8102E Fast Ethernet controller instead of
Realtek RTL8111C Gigabit Ethernet controller.
2) Assembly option for higher volumes: SDVO output instead of Chrontel CH7022.
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Page 8
2.5. Differences between Robin V2.0 to Robin V1.0
By Robin V1.0 and V2.0 the PCB version is meant.
2.5.1 DDR2 x8 instead of x16 DDR2
Robin V2.0 utilizes DDR2 RAM devices with a x8 bit bus width in contrast to Robin V1.0, which
utilizes DDR2 RAM devices with x16 bit bus width. This allows Robin V2.0 to provide up to 2GByte
of RAM, in comparison with the maximum 1GByte of RAM available on Robin V1.0.
2.5.2 SDIO / GPIO switch
Robin V2.0 provides either a GPIO or SDIO interface on the COM Express connector. The same
GPIO signals available on the FFC connector of Robin V1.0 are also available on Robin V2.0.
2.5.3 PCB thickness
The Robin V2.0 PCB has a nominal thickness of 2mm compared to 1.6mm for Robin V1.0.
This may have an impact for customers who have implemented a mechanical design that is
affected by PCB thickness. To ensure compatibility between Robin V1.0 and V2.0 in such designs,
Toradex will provide a dedicated Heatspreader for Robin V2.0, which will compensate for the PCB
height difference.
2.5.4 FFC shifted
The FFC connector has been shifted closer to the PCB edge with respect to the front edge of the
connector. Its position with respect to the adjacent PCB edge has not changed.
2.5.5 Thermal sensor
The thermal sensor has been moved away from the key heat sources (the Atom processor and
US15W system control hub) to provide a more accurate measurement of the module temperature.
The Atom processor temperature is still measured internally to the core.
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Page 9
3. Robin Connectors
3.1. Physical Location
The Robin Z530 and Z510 computer modules comply with the COM Express™ pin out type 1 for
most of the signals. Only one 220 pin COM Express™ connector is available. A 30 pin FFC
connector featuring an additional SDIO channel and 8 GPIOs is available. An on board MicroSD
slot is also available.
Top
Bottom
MicroSD
30 Pin FFC
3.2. Signal Notation
3.2.1 Signal Types
Type
I
Input to the module
O
Output from the module
IO
Bi-directional input/output signal
OD
Open drain bi-directional
ODI
Open drain input
ODO
Open drain output
NC
Not Connected
REF
Reference Signal
Note:
A “#” symbol after a signal name refers to an active low signal, indicating a signal is in the
active state when driven to a low level.
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Page 10
3.2.2 Signal Voltage Rail
Rail
5
5V
3.3
3.3V
3.3/5
Nominal 3.3V; 5V tolerant input
2.5
2.5V
A
Analog
PWR
Power supply and ground
LVDS
Low voltage differential signaling
PCIe
PCI Express differential signaling
SATA
Serial ATA differential signaling
3.3. COM Express Connector Pin Assignment
The following pin assignment is the same for both Robin Z530 and Z510. Optional pin
assignments are marked by a 1) whereas differences to the COM Express™ pin out type 1 are
marked by a 2).
Pin
Signal
A1
GND
A2
GBE0_MDI3-
A3
Type
Rail
Description
PWR
Ground
IO
A
Gigabit LAN pair 3 (negative); not used for fast Ethernet
GBE0_MDI3+
IO
A
Gigabit LAN pair 3 (positive); not used for fast Ethernet
A4
GBE0_LINK100#
O
3.3
LED LAN speed 100Mbps
A5
GBE0_LINK1000#
O
3.3
LED LAN speed 1Gbps
A6
GBE0_MDI2-
IO
A
Gigabit LAN pair 2 (negative); not used for fast Ethernet
A7
GBE0_MDI2+
IO
A
Gigabit LAN pair 2 (positive); not used for fast Ethernet
A8
GBE0_LINK#
O
3.3
LED LAN link indicator
A9
GBE0_MDI1-
IO
A
Gigabit LAN pair 1 (negative); fast Ethernet RX-
A10
GBE0_MDI1+
IO
A
Gigabit LAN pair 1 (positive); fast Ethernet RX+
A11
GND
PWR
Ground
A12
GBE0_MDI0-
IO
A
Gigabit LAN pair 0 (negative); fast Ethernet TX-
A13
GBE0_MDI0+
IO
A
Gigabit LAN pair 0 (positive); fast Ethernet TX+
A14
GBE0_CTREF
REF
A
Reference voltage for the magnetic center tap.
Robin: not connected.
A15
SUS_S3#
O
3.3
Indicates the system is suspended to RAM
A16
SATA0_TX+
O
SATA
Serial ATA transmit channel 0 (positive)
A17
SATA0_TX-
O
SATA
Serial ATA transmit channel 0 (negative)
A18
SUS_S4#
O
3.3
Indicates the system is suspended to disk.
Note: Robin does not distinguish suspend state S4 and S5
A19
SATA0_RX+
I
SATA
Serial ATA receive channel 0 (positive)
A20
SATA0_RX-
I
SATA
Serial ATA receive channel 0 (negative)
A21
GND
PWR
Ground
A22A23
NC
A24
SUS_S5#
NC
Not Connected
Indicates the system is in SoftOff state. Can be used to control an
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Page 11
Pin
Signal
Type
Rail
Description
ATX power supply.
Note: Robin does not distinguish suspend states S4 and S5
A25A26
NC
NC
A27
BATLOW#
ODI
3.3
Indicates that the external battery is low,
47kΩ pull-up on module
A28
ATA_ACT#
O
3.3
LED indicator for the activity of SATA
A29
AC_SYNC
O
3.3
48kHz audio codec synchronization signal
A30
AC_RST#
O
3.3
Reset output for audio codec
A31
GND
PWR
Ground
A32
AC_BITCLK
IO
3.3
12.228MHz audio codec serial clock
A33
AC_SDOUT
O
3.3
Serial data output to the audio codec
A34
BIOS_DISABLE#
ODI
3.3
Module BIOS disable. Pull low to disable BIOS on module,
10kΩ pull-up on module
A35
THRMTRIP#
O
3.3
Indicates the entering of the CPU in thermal shutdown
A36
USB6-
IO
3.3
USB channel 6 (negative) 4)
A37
USB6+
IO
3.3
USB channel 6 (positive) 4)
A38
USB_6_7_OC#
ODI
3.3
USB Over current channels 6 and 7,
10kΩ pull-up on module
A39
USB4-
IO
3.3
USB channel 4 (negative) 4)
A40
USB4+
IO
3.3
USB channel 4 (positive) 4)
A41
GND
PWR
Ground
A42
USB2-
IO
3.3
USB channel 2 (negative) 4)
A43
USB2+
IO
3.3
USB channel 2 (positive) 4)
A44
USB_2_3_OC#
ODI
3.3
USB Over current channels 2 and 3,
10kΩ pull-up on module
A45
USB0-
IO
3.3
USB channel 0 (negative) 4)
A46
USB0+
IO
3.3
USB channel 0 (positive) 4)
A47
VCC_RTC
I
PWR
RTC battery input, nominal 3.0V
A48
EXCD0_PERST#
O
3.3
ExpressCard card 0 reset signal
A49
EXCD0_CPPE#
I
3.3
ExpressCard card 0 request signal
A50
LPC_SERIRQ
IO
3.3
LPC serial interrupt
A51
GND
PWR
Ground
A52
SDVO_CLK+
O
PCIe
Serial digital video clock output (positive) 1)
A53
SDVO_CLK-
O
PCIe
Serial digital video clock output (negative) 1)
A54
SDIO0_DATA0
IO
3.3
SDIO Data 0 5)
A55
SDVO_BLUE+
O
PCIe
Serial digital video blue output (positive) 1)
A56
SDVO_ BLUE -
O
PCIe
Serial digital video blue output (negative) 1)
A57
GND
PWR
Ground
A58
SDVO_GREEN+
O
PCIe
Serial digital video green output (positive) 1)
A59
SDVO_ GREEN-
O
PCIe
Serial digital video green output (negative) 1)
A60
GND
PWR
Ground
A61
SDVO_RED+
O
PCIe
Serial digital video red output (positive) 1)
A62
SDVO_ RED-
O
PCIe
Serial digital video red output (negative) 1)
A63
SDIO0_DATA1
IO
3.3
SDIO Data 1 5)
Not Connected
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Page 12
Pin
Signal
Type
Rail
Description
A64
PCIE_TX1+
O
PCIe
PCI Express transmit pair 1 (positive) 2)
A65
PCIE_TX1-
O
PCIe
PCI Express transmit pair 1 (negative) 2)
A66
GND
PWR
Ground
A67
SDIO0_DATA2
IO
3.3
SDIO Data 2 5)
A68
PCIE_TX0+
O
PCIe
PCI Express transmit pair 0 (positive)
A69
PCIE_TX0-
O
PCIe
PCI Express transmit pair 0 (negative)
A70
GND
PWR
Ground
A71
LVDS_A0+
O
LVDS
LVDS channel A signal pair 0 (positive)
A72
LVDS_A0-
O
LVDS
LVDS channel A signal pair 0 (negative)
A73
LVDS_A1+
O
LVDS
LVDS channel A signal pair 1 (positive)
A74
LVDS_A1-
O
LVDS
LVDS channel A signal pair 1 (negative)
A75
LVDS_A2+
O
LVDS
LVDS channel A signal pair 2 (positive)
A76
LVDS_A2-
O
LVDS
LVDS channel A signal pair 2 (negative)
A77
LVDS_VDD_EN
O
3.3
LVDS panel power enable
A78
LVDS_A3+
O
LVDS
LVDS channel A signal pair 3 (positive)
A79
LVDS_A3-
O
LVDS
LVDS channel A signal pair 3 (negative)
A80
GND
PWR
Ground
A81
LVDS_A_CK+
O
LVDS
LVDS channel A clock (positive)
A82
LVDS_A_CK-
O
LVDS
LVDS channel A clock (negative)
A83
LVDS_I2C_CK
ODO
3.3
LVDS I2C Clock (DDC)
A84
LVDS_I2C_DAT
OD
3.3
LVDS I2C Data (DDC)
A85
SDIO0_DATA3
IO
3.3
SDIO Data 3 5)
A86
KBD_RST#
ODI
3.3
Reset input from optional keyboard controller,
47kΩ pull-up on module
A87
KBD_A20GATE
ODI
3.3
A20 gate input from optional keyboard controller,
10kΩ pull-up on module
A88
PCIE0_CK_REF+
O
PCIe
PCI Express clock reference output for all PCIe lanes (positive)
A89
PCIE0_CK_REF-
O
PCIe
PCI Express clock reference output for all PCIe lanes (negative)
A90
GND
PWR
Ground
A91A92
NC
NC
A93
SDIO0_CLK
O
A94A95
NC
NC
A96
GND
PWR
Ground
A97A99
VCC_Main
PWR
Main power input
A100
GND
PWR
Ground
A101A109
VCC_Main
PWR
Main power input
A110
GND
PWR
Ground
B1
GND
PWR
Ground
B2
GBE0_ACT#
O
3.3
LAN activation indicator LED
B3
LPC_FRAME#
O
3.3
Indicates the start of an LPC cycle
B4
LPC_AD0
IO
3.3
LPC multiplexed address, command and data bus 0
I
Not Connected
3.3
SDIO Clock output 5)
Not Connected
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Page 13
Pin
Signal
Type
Rail
Description
B5
LPC_AD1
IO
3.3
LPC multiplexed address, command and data bus 1
B6
LPC_AD2
IO
3.3
LPC multiplexed address, command and data bus 2
B7
LPC_AD3
IO
3.3
LPC multiplexed address, command and data bus 3
B8-B9
NC
NC
B10
LPC_CLK
O
B11
GND
B12
PWRBTN#
B13
Not Connected
3.3
LPC clock output, 33MHz, usage of a clock repeater in case of
external BIOS not allowed
PWR
Ground
ODI
3.3
Power button input (active on falling edge),
47kΩ pull-up on module
SMB_CK
OD
3.3
SMBus clock
B14
SMB_DAT
OD
3.3
SMBus data
B15
SMB_ALERT#
ODI
3.3
SMBus Alert, can be used to generate an SMI# or to wake the
system,
10kΩ pull-up on module
B16B17
NC
NC
B18
SUS_STAT#
O
B19B20
NC
NC
B21
GND
B22B23
NC
NC
B24
PWR_OK
I
B25B26
NC
NC
B27
WDT
O
3.3
Indicates that a watchdog time-out event has occurred. The pin
remains high until the software clears the bit.
B28
AC_SDIN2
I
3.3
Serial data input 1 from the audio codec 3)
B29
AC_SDIN1
I
3.3
Serial data input 1 from the audio codec
B30
AC_SDIN0
I
3.3
Serial data input 0 from the audio codec
B31
GND
PWR
Ground
B32
SPKR
O
3.3
Speaker output
B33
I2C_CK
OD
3.3
General purpose I2C clock, on the module provided by EC
B34
I2C_DAT
OD
3.3
General purpose I2C data, on the module provided by EC
B35
THRM#
ODI
3.3
Over temperature indication input from off-module temperature
sensor,
47kΩ pull-up on module
B36
USB7-
IO
3.3
USB channel 7 (negative); configurable as USB client 4)
B37
USB7+
IO
3.3
USB channel 7 (positive); configurable as USB client 4)
B38
USB_4_5_OC#
ODI
3.3
USB Over current channels 4 and 5,
10kΩ pull-up on module
B39B40
NC
NC
B41
GND
B42
USB3-
B43
B44
Not Connected
3.3
Indicates imminent suspend operation, used to notify LPC devices
Not Connected
PWR
Ground
Not Connected
3.3
Power OK from main power supply
Not Connected
Not Connected
PWR
Ground
IO
3.3
USB channel 3 (negative) 4)
USB3+
IO
3.3
USB channel 3 (positive) 4)
USB_0_1_OC#
ODI
3.3
USB Over current channels 0 and 1,
10kΩ pull-up on module
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Page 14
Pin
Signal
Type
Rail
Description
B45
USB1-
IO
3.3
USB channel 1 (negative) 4)
B46
USB1+
IO
3.3
USB channel 1 (positive) 4)
B47B48
NC
NC
B49
SYS_RESET#
ODI
3.3
Reset button input (active low),
47kΩ pull-up on module
B50
CB_RESET#
O
3.3
Reset output of the module for the carrier board
B51
GND
PWR
Ground
B52B53
NC
NC
B54
SDIO0_CMD
O
3.3
SDIO command output 5)
B55
SDVO_STALL+
I
PCIe
Serial digital video stall input (positive) 1)
B56
SDVO_ STALL -
I
PCIe
Serial digital video stall input (negative) 1)
B57
SDIO0_WP
I
3.3
SDIO write protect input 5)
B58
SDVO_INT+
I
PCIe
Serial digital video interrupt input (positive) 1)
B59
SDVO_ INT -
I
PCIe
Serial digital video interrupt input (negative) 1)
B60
GND
PWR
Ground
B61
SDVO_TVCLKIN+
I
PCIe
Serial digital video TV clock input (positive) 1)
B62
SDVO_ TVCLKIN -
I
PCIe
Serial digital video TV clock input (negative) 1)
B63
SDIO0_CD#
I
3.3
SDIO card detect input 5)
B64
PCIE_RX1+
I
PCIe
PCI Express receive pair 1 (positive) 2)
B65
PCIE_RX1-
I
PCIe
PCI Express receive pair 1 (negative) 2)
B66
WAKE0#
ODI
3.3
PCI Express wake up input,
1kΩ pull-up on module
B67
WAKE1#
ODI
3.3
General purpose wake up input,
47kΩ pull-up on module
B68
PCIE_RX0+
I
PCIe
PCI Express receive pair 0 (positive)
B69
PCIE_RX0-
I
PCIe
PCI Express receive pair 0 (negative)
B70
GND
PWR
Ground
B71B78
NC
NC
B79
LVDS_BKLT_EN
O
B80
GND
B81B82
NC
NC
B83
LVDS_BKLT_CTRL
O
3.3
Backlight brightness control for LVDS display
B84B87
VCC_5V_SBY
I
PWR
Optional standby power input, 5V nominal
B88
NC
NC
B89
VGA_RED
O
B90
GND
B91
VGA_GRN
B92
Not Connected
Not Connected
Not Connected
3.3
Backlight enable for LVDS display
PWR
Ground
Not Connected
Not Connected
A
VGA red output
PWR
Ground
O
A
VGA green output
VGA_BLU
O
A
VGA blue output
B93
VGA_HSYNC
O
5
VGA horizontal sync output
B94
VGA_VSYNC
O
5
VGA vertical sync output
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Page 15
Pin
Signal
Type
Rail
Description
B95
VGA_I2C_CK
ODO
3.3
VGA DDC clock output
B96
VGA_I2C_DAT
OD
3.3
VGA DDC data signal
B97
TV_DAC_A
O
3.3
TV DAC channel A
B98
TV_DAC_B
O
3.3
TV DAC channel B
B99
TV_DAC_C
O
3.3
TV DAC channel C
B100
GND
PWR
Ground
B101B109
VCC_Main
PWR
Main power input
B110
GND
PWR
Ground
I
1) Assembly option for higher volumes: SDVO instead of VGA /TV.
2) Assembly option for higher volumes: Additional PCIe instead of GLAN
3) Assembly option for higher volumes: B28 to B29 on module shorted
4) Refer to chapter 4.3.1 USB mapping
5) Refer to chapter 3.3.1 SDIO / GPIO signals
3.3.1 SDIO / GPIO signals
On Robin Z5xx V2.0, either the SDIO or GPIO signals can be switched to the COM Express
connector through a configuration setting in the BIOS. This feature is not available on Robin V1.0,
where the SDIO interface is permanently connected to the COM Express Connector. The BIOS
setting is available for Robin V1.0 BIOS, but is not changeable.
COM Express Pin
BIOS setting to “SDIO”, Robin V1.0 and V2.0
BIOS setting to “GPIO”, Robin V2.0
A54
SLOT0_DATA0
USB_GPIO0
A63
SLOT0_DATA1
USB_GPIO1
A67
SLOT0_DATA2
USB_GPIO2
A85
SLOT0_DATA3
USB_GPIO3
A93
SLOT0_CLK
USB_GPIO4
B54
SLOT0_CMD
USB_GPIO5
B57
SLOT0_WP
USB_GPIO6
B63
SLOT0_CD#
USB_GPIO7
Note: The same GPIO signals are always available on the FFC for both PCB versions 1.0 and 2.0.
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Page 16
3.4. Assignment of additional FFC Connector
Connector: FFC 30 pins, 0.5 mm pitch, bottom contact (example MOLEX 52437-3072)
Pin
Signal
Type
Rail
Description
1
SDIO2_CLK
O
3.3
SDIO channel 2 clock,
24 MHz for SD and SDIO, 48 MHz for MMC
2
GND
PWR
Ground
3
SDIO2_CMD
OD/
IO
3.3
SDIO channel 2 command,
used for card initialization and transfer of commands,
39kΩ pull-up on module
4
SDIO2_LED
O
3.3
SDIO channel 2 LED output,
can be used to drive an external LED over a transistor to indicate transfer
on the bus
5
SDIO2_CD#
ODI
3.3
SDIO channel 2 card detect,
the present of the card is signalized by pulling the signal to ground, 10kΩ
pull-up on module
6
SDIO2_WP
ODI
3.3
SDIO channel 2 write protect,
denote the state of the write-protect tab on SD card, pull signal to ground
to enable writing, 10kΩ pull-up on module
7
SDIO2_PWR#
O
3.3
SDIO channel 2 power enable,
can be used to enable the power being supplied to an SDIO/MMC device
8
VCC_3.3S_OUT
O
PWR
3.3V power output for powering a SDIO device.
The power rail is only available in S0 state.
9
SDIO2_DATA0
IO
3.3
SDIO channel 2 data line (channel 2 is 8 bit capable)
10
SDIO2_DATA1
IO
3.3
SDIO channel 2 data line (channel 2 is 8 bit capable)
11
GND
PWR
Ground
12
SDIO2_DATA2
IO
3.3
SDIO channel 2 data line (channel 2 is 8 bit capable)
13
SDIO2_DATA3
IO
3.3
SDIO channel 2 data line (channel 2 is 8 bit capable)
14
SDIO2_DATA4
IO
3.3
SDIO channel 2 data line (channel 2 is 8 bit capable)
15
SDIO2_DATA5
IO
3.3
SDIO channel 2 data line (channel 2 is 8 bit capable)
16
GND
PWR
Ground
17
SDIO2_DATA6
IO
3.3
SDIO channel 2 data line (channel 2 is 8 bit capable)
18
SDIO2_DATA7
IO
3.3
SDIO channel 2 data line (channel 2 is 8 bit capable)
19
VCC_3.3S_OUT
O
PWR
3.3V power output for powering a SDIO device.
The power rail is only available in S0 state.
20
USB_CLIENT_DET
I
3.3
USB client connect detection, indicates connection to an external USB host
has been established, needs voltage level shifter
21
SDIO0_LED
O
3.3
SDIO channel 0 LED output,
can be used to drive an external LED over a transistor to indicate transfer
on the bus
22
GPIO_0
IO
3.3
General Purpose input/output
23
GPIO_1
IO
3.3
General Purpose input/output
24
GND
PWR
Ground
25
GPIO_2
IO
3.3
General Purpose input/output
26
GPIO_3
IO
3.3
General Purpose input/output
27
GPIO_4
IO
3.3
General Purpose input/output
28
GPIO_5
IO
3.3
General Purpose input/output
29
GPIO_6
IO
3.3
General Purpose input/output
30
GPIO_7
IO
3.3
General Purpose input/output
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Page 17
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Page 18
4. Signal Description
4.1. System Memory
Robin Z5xx modules incorporate fast DDR2 on-board system memory with the following
characteristics:
Attribute
Robin Z5xx V1.0
Robin Z5xx V2.0
Size
512MByte
512MByte / 1GByte / 2GByte
Memory organization
X16 bits
X8 bits
Memory speed
533MT/s for Z530 (400MT/s for Z510)
533MT/s for Z530 (400MT/s for Z510)
4.2. Serial ATA
The Serial ATA (SATA) interface is provided through the JMH330 IDE to SATA Bridge from JMicron.
No additional driver is required for the SATA interface.
4.3. USB Interface
The US15W (System Controller Hub on the Robin module) features Enhanced Host Controller
Interface (EHCI) with 8 USB ports. All 8 ports support USB high speed (480Mbit/s). However, it
should be noted that only 6 of these ports support low speed (1.5Mbit/s) and full speed (12Mbit/s).
7 USB ports are available through the COM Express™ connector. Port 5 of the US15W is used for
communication with the Robin Embedded Controller and is therefore not available on the module
connector..
4.3.1 USB mapping
The following table shows how the US15W USB signals are mapped to the COM Express USB
channels.
COM Express™
Connector USB channel
US15W USB Port
0
0
1
1
2
3
3
4
4
6 (480MBit only)
5
Not available
6
7 (480MBit only)
7 (client)
2 (client)
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Page 19
4.3.2 USB client
USB port 7 on the connector can be configured as a client. The presence of a host device
connected to the client port is detected by monitoring the USB bus voltage. The detection
mechanism can be implemented using a level-shifting circuit (as shown below) connected to the
USB_CLIENT_DET signal (pin 20 of the FFC connector on the Robin module).
+3.3V
100k
4.7k
USB_CLIENT_DET
VCC
DD+
ID
GND
1
2
3
4
5
+5V_USB_CLIENT
USB_2_DATAUSB_2_DATA+
GND
4.7uF
100k
GND
GND
GND
GND
4.4. Ethernet Controller
The Robin Z5xx module features an onboard RTL8111C/D gigabit Ethernet controller from Realtek
which supports a 10/100/1000 Base-T interface. This controller is directly connected to the PCI
Express interface of the US15W. The device auto-negotiates the use of the different speeds and
includes features such as crossover detection with auto-correction, polarity correction and crosstalk cancellation.
For high volumes, the Robin module can be assembled with the RTL8102E Ethernet controller
instead of the RTL8111C/D. This offers a suitable solution for very price sensitive, high volume
projects requiring only a 10/100 Base-T fast Ethernet controller (please contact Toradex for further
information).
4.5. PCI Express
The US15W chipset features two x1 PCI Express lanes. PCIe lane 0 of the US15W is directly
available at the COM Express™ connector. PCIe lane 1is connected directly to the Ethernet
controller and is not available for general use.
4.6. ExpressCard
The Robin Z5xx module supports the two additional signals required for the ExpressCard interface
(card detect and card reset). The ExpressCard interface makes use of both a USB port and a single
PCI Express lane (although an attached ExpressCard device may only make use of one of these
interfaces).
4.7. SDIO, SD Card and MMC
The Intel® US15W features 3 SDIO buses. Each SDIO bus can be used for SD cards,
MultiMediaCards (MMC), as an SDIO interface or CE-ATA interface. The SD card and the SDIO
interface can run in either 1 bit or 4 bit mode, whereas MMC supports an additional 8 bit transfer
mode. Only SDIO slot 2 of the US15W is 8 bit capable; the other two are only 4bit capable.
SDIO slot 1 is available on the Robin module as MicroSD card holder. Slot 0 is on the COM
Express™ connector (see chapter 3.3.1) and slot 2 is available on the 30 pin FFC connector. This
connector also provides 3.3V power supply for SD or MMC cards. Please note that as the maximum
power rating of the 3.3V supply on this connector is limited, an additional power supply may be
required if the connected SDIO device has a power requirement which exceeds this rating.
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Page 20
4.8. VGA
The Robin module features a Chrontel SDVO to VGA and TV out converter CH7022. Please refer to
the datasheet for more information.
For application specific/custom carrier board designs, remember to include the 150R load resistors
required at each of the VGA color outputs.
For high volumes, it is an assembly option not to fit the CH7022. The SDVO signals would then be
routed to the COM Express connector. Please contact Toradex for further information regarding
assembly options.
4.9. TV out
The Robin module features a Chrontel SDVO to VGA and TV out converter CH7022. Please refer to
the datasheet for more information.
For application specific/custom carrier board designs, remember to include the 150R load resistors
required at each of the TV outputs.
For high volumes, it is an assembly option not to fit the CH7022. The SDVO signals would then be
routed to the COM Express connector. Please contact Toradex for further information regarding
assembly options.
The TV out signals can be configured as follows:
COM Express signal
Composite video
Component video
S-Video
TV_DAC_A
CVBS
Chrominance (Pb)
Not used
TV_DAC_B
Not used
Luminance (Y)
Luminance analog signal (Y)
TV_DAC_C
Not used
Chrominance (Pr)
Chrominance analog signal (C)
4.10. Robin Z5xx Module LEDs
Top View
LED3
LED1
LED2
Note: Robin Z5xx V1.0 shown; placement of the LEDs is the same for Robin V2.0.
LED1: Activity indication of the on board MicroSD slot (SDIO channel 0)
LED2: Activity indication of the SDIO channel 1 (available on COM express connector)
LED3: On board flash drive and SATA bridge activity indication. The LED shows the activity parallel
to the ATA_ACT# signal (pin A28 on COM express connector).
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Page 21
4.11. LPC
The LPC interface is a Low Pin Count PCI bus. Components on the carrier board such as Super IO
or an external BIOS are connected to this bus.
Note for external LPC devices:
devices: Don’t use a clock repeater on the carrier board for the clock signal
of the LPC.
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Page 22
5. Power Supply
5.1. Power States
State
Common Names
Behavior
G3
Mechanical Off
All power supplies except the RTC battery are removed. The power consumption of the
system is almost zero; only the RTC circuit consumes a small amount of power
S5
Soft Off
Only the embedded controller on the module is powered. The embedded controller waits
for the power button to be pushed before starting the system. The power consumption in
this state is very low.
S4
Suspend to Disk
Hibernation
The contents of RAM are written to a non-volatile storage medium (e.g. hard disc). This
allows recovery of the system to the state prior to entering suspend or hibernate. From the
hardware perspective, this state is equal to S5. The system is off except for the embedded
controller being powered. The embedded controller waits for the power button to be
pushed before starting the system. The power consumption in this state is very low. The
Robin hardware does not distinguish between S4 and S5.
S3
Suspend to RAM
Stand by, Sleep
The RAM subsystem is powered for a fast recovery of the system. Power supplies that are
not required are switched off. Wake on LAN is supported in this state (hence the network
subsystem is powered). The Robin module requires the main power supply to generate the
standby power supply.
S0
On
The system is working. All power supplies are switched on. The power consumption
depends on the CPU and peripheral load.
The COM Express Connector features three signals for signaling the different power states to the
carrier board. As the Robin module hardware does not distinguish between power states S4 and
S5, SUS_S4# and SUS_S5# are essentially the same signal.
State
SUS_S5#
SUS_S4#
SUS_S3#
G3
NA
NA
NA
S5
Low
Low
Low
S4
Low
Low
Low
S3
High
High
Low
S0
High
High
High
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Page 23
5.2. Power Supply
The Robin modules are designed to run from a single power supply with a wide nominal input
voltage range of +5V to +12V. Two power supplies are optional: a +5V standby power supply and
a +3V battery power supply (used to power the real-time clock on the module).
If the standby power supply is not provided by the carrier board, the Robin module will generate
the required standby power from the main power supply using a linear voltage regulator. Hence,
the Robin module supports both the S4 and S5 power states even if the standby power supply is
absent, as long as the main power supply is present.
The RTC power supply is powered in parallel by both the standby power supply and the 3V battery
power supply. This ensures that the real-time clock is running as long as either one of these power
supplies is present. Important: a diode must be placed between RTC Battery and the RTC Voltage
pin of the module connector.
5.2.1 AC Power Adaptor
Depending upon the specific hardware configuration, it is likely that the power supply to the carrier
board will be forwarded directly to the Robin module (this is true for Lily V1.0, V1.1, V2.0, V2.1
and Daisy V1.0, V1.1). If an AC power adaptor is being used, please ensure that its output voltage
is never beyond the limits of the module and carrier board. Simple AC power adaptors may have
significantly higher output voltages than their nominal voltage in no-load operation; usage of such
power adaptors can damage both the Robin Z5xx module and carrier board.
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Page 24
5.2.2 ATX-Like Configuration using SUS_S5# as PS_ON
COM Express Carrier Board
12V Source
Robin Module Z5xx
CPU/
Chipset/
Peripherals
Voltage
Regulators
VCC_12V
e.g. ATX:
PS_ON
LDO
Carrier Board
Peripherals
Voltage Reg.
PWR_OK
RPWR_OK
SUS_S3#
Embedded
Controller
SUS_S5#
5V Stby
Source
RTC Battery
VCC_5V_SBY
Autom.
Switch
Voltage
Regulators
VCC_RTC
RTC System
If the carrier board features a 5V standby power supply, the main power rail can be switched off in
power states S5 and S4. The SUS_S5# or SUS_S4# signal can be used for switching the main
power supply. If the carrier board features an ATX Power supply, the SUS_S5# signal is used to
drive the PS_ON pin of the ATX power supply through a level shifter. The Power good signal from
the ATX power supply can be used directly without level shifter as the PWR_OK signal for the Robin
module.
With this power control method, the carrier board must manage the following power sequence:
1. Robin module de-asserts the SUS_S5# and SUS_S4# signal.
2. The carrier board must switch on the main power supply and the necessary power supplies
for the peripherals on the carrier board.
3. If all required power supplies on the carrier board are stable, the carrier board shall
indicate this to the Robin module through the PWR_OK signal. This must be done within 15
seconds of the SUS_S5# signal being de-asserted. Otherwise the Robin module shall enter
the power state S5 (power fail). The Robin module can be configured to retry the power up
sequence after 1 minute (see section 6.5.1).
4. The Robin module ramps up all the necessary power supplies to enter power state S3 and
de-asserts the SUS_S3# signal.
5. The Robin module continues its power up process by ramping up the remaining on-board
power supplies, releasing the reset signal and booting.
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Page 25
5.2.3 ATX-Like Configuration using SUS_S3# as PS_ON
COM Express Carrier Board
12V Source
Robin Module Z5xx
CPU/
Chipset/
Peripherals
Voltage
Regulators
VCC_12V
e.g. ATX:
PS_ON
LDO
Carrier Board
Peripherals
Voltage Reg.
PWR_OK
RPWR_OK
SUS_S3#
Embedded
Controller
SUS_S5#
5V Stby
Source
RTC Battery
VCC_5V_SBY
Autom.
Switch
Voltage
Regulators
VCC_RTC
RTC System
It is also possible to use the signal SUS_S3# for controlling the main power supply, which is the
mechanism employed by some commercially available COM Express carrier boards. To support this
power control method, the Robin module requires a change to a setting in the embedded
controller which enables S3 Signaling Mode. When operating in S3 Signaling Mode, the module
de-asserts both SUS_S3# and SUS_S5# simultaneously. Section 6.5.2 describes this in more detail.
S3 Signaling Mode can be configured using the Toradex Z5xx Tweaker tool.
For new designs, Toradex does not recommend using this power control method and hence
hardware configuration, as it is not possible for the carrier board to differentiate between power
states S5 and S3.
With this power control method, the carrier board must manage the following power sequence:
1. The Robin module de-asserts signals SUS_S5#, SUS_S4#and, if S3 Signaling Mode is
enabled, SUS_S3#.
2. The carrier board must switch on the main power supply and the necessary power supplies
for any carrier board peripherals.
3. If all required power supplies on the carrier board are stable, the carrier board must assert
the PWR_OK signal within 10 seconds of the de-assertion of signal SUS_S5#. In the event
that this fails to happen, the Robin module will de-assert signal SUS_S3# if it has not
already done so in step 1 (this allows the Robin module to successfully power on in order to
enable S3 Signaling Mode). If a further 5 seconds elapses without the PWR_OK signal
asserted, the Robin module returns to power state S5 (power fail). The embedded
controller can be configured to retry the power up sequence after 1 minute (see section
6.5.1).
4. The module ramps up all the necessary power supplies to enter power state S3.
5. The Robin module continues its power up process by ramping up the remaining on-board
power supplies, releasing the reset signal and booting.
Note that it is very important to enable S3 Signaling Mode when using this power control method,
otherwise the shut-down and suspend power modes will not function correctly, and an additional
10 seconds will be added to the power on time.
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Page 26
5.2.4 Configuration without Standby Supply
COM Express Carrier Board
12V Source
Robin Module Z5xx
CPU/
Chipset/
Peripherals
Voltage
Regulators
VCC_12V
LDO
Carrier Board
Peripherals
Voltage Reg.
PWR_OK
RPWR_OK
SUS_S3#
Embedded
Controller
SUS_S5#
VCC_5V_SBY
Autom.
Switch
RTC Battery
Voltage
Regulators
VCC_RTC
RTC System
If the VCC_5V_SBY is not provided by the COM Express carrier board, the Robin module will
automatically generate its own standby power supply from the main power supply. It is therefore
still possible to make use of the power states S4 and S5 if the main power supply is available. In
this configuration, the standby power supply is generated using a linear voltage regulator, and so
the Robin module power consumption whilst in power state S3, S4 or S5 is slightly higher than
when the standby power supply is provided by the carrier board (power consumption
measurements are published in section 9.1).
By default, the embedded controller is programmed to start the system as soon as the main power
supply is available if the standby power supply from the carrier board is not available. The Robin
module can, however, be configured to stay in the power state S5 even after the main power
supply is made available. Section 6.5.1 describes the configuration of this behavior.
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5.2.5 Minimum Power Configuration
COM Express Carrier Board
12V Source
Robin Module Z5xx
CPU/
Chipset/
Peripherals
Voltage
Regulators
VCC_12V
LDO
Carrier Board
Peripherals
Voltage Reg.
PWR_OK
RPWR_OK
SUS_S3#
Embedded
Controller
SUS_S5#
VCC_5V_SBY
Autom.
Switch
Voltage
Regulators
VCC_RTC
RTC System
In the minimum power configuration, the carrier board only provides the main power supply to the
Robin module. As long as the main power supply is available, the real time clock will run. This
configuration may be suitable for battery powered systems with a non-removable main battery, or
for systems without the requirement for a real time clock.
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5.3. Power Sequences
The following signals are shown in the power control sequence diagrams:
Name
Module Direction
Description
5V_SBY
Input
Standby voltage
PWR_BTN#
Input
Power button
SUS_S5#
Output
Module output that indicates the system is in SoftOff state
12V_Main
Input
Primary power input: 12V nominal
PWR_OK
Input
Power OK from main power supply
Module S3 Power Rails
Module power rails that are used in S3 state (no need by carrier board)
SUS_S3#
Indicates the system is suspended to RAM
5V_CB
Carrier board 5V supply (no need by module)
3.3V_CB
Carrier board 3.3V supply (no need by module)
Module S0 Power Rails
Module power rails that are used in S0 state (no need by carrier board)
CB_RESET#
Output
Reset output of the module for the carrier board
5.3.1 G3 to S0 controlled by Power Button
G3
S5
S5 to S3
S3 to S0
S0
5V_SBY
PWR_BTN#
SUS_S5#
12V_Main
PWR_OK
Module S3 Power Rails
SUS_S3#
5V_CB
3.3V_CB
Module S0 Power Rails
CB_RESET#
>100ms
The above diagram shows the behavior if the boot mode is set to automatic and the standby
voltage ramps up before the main power supply. Please refer section 6.5.1 for more information to
the boot modes.
Important: The 12V_Main voltage needs to ramp up continuously if the boost converter is enabled.
Otherwise, the boost converter may be damaged during voltage drops.
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5.3.2 G3 to S0 without Waiting for Power Button
G3
S5
S5 to S3
S3 to S0
S0
5V_SBY
PWR_BTN#
SUS_S5#
12V_Main
PWR_OK
Module S3 Power Rails
SUS_S3#
5V_CB
3.3V_CB
Module S0 Power Rails
CB_RESET#
>100ms
The diagram shows the behavior if the boot mode is set to automatic and the main power supply
voltage ramps up with no standby supply available. If boot mode is set to boot always, the same
behavior can be achieved even if the standby power supply is available. Please refer section 6.5.1
for more information to the boot modes.
Important: The 12V_Main voltage needs to ramp up continuously if the boost converter is enabled.
Otherwise, the boost converter may be damaged during voltage drops.
5.3.3 S0 to S5 Shutdown
S0
S0 to S3
S3 to S5
S5
5V_SBY
PWR_BTN#
SUS_S5#
12V_Main
PWR_OK
Module S3 Power Rails
SUS_S3#
5V_CB
3.3V_CB
Module S0 Power Rails
CB_RESET#
Shutdown
Comman
from OS
Important: The 12V_Main voltage needs to ramp down continuously if the boost converter is
enabled. Otherwise, the boost converter may be damaged during voltage drops.
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5.3.4 S0 to S3 Suspend to RAM
S0
S0 to S3
S5
5V_SBY
PWR_BTN#
SUS_S5#
12V_Main
PWR_OK
Module S3 Power Rails
SUS_S3#
5V_CB
3.3V_CB
Module S0 Power Rails
CB_RESET#
Standby
Comman
from OS
Some carrier board power supplies may not be switched off in the event that they are used by a
wakeup source.
5.3.5 S3 to S0 Resume
S3
S3 to S0
S0
5V_SBY
PWR_BTN#
SUS_S5#
Or other Wake-Up source
12V_Main
PWR_OK
Module S3 Power Rails
SUS_S3#
5V_CB
3.3V_CB
Module S0 Power Rails
CB_RESET#
>100ms
The above diagram shows the power up sequence when the power button is used as a wake-up
source. Please refer to section 0 for other wake-up sources.
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5.3.6 Power Button Emergency Shutdown
S0
Emergency Shutdown
S5
5V_SBY
PWR_BTN#
SUS_S5#
12V_Main
PWR_OK
Module S3 Power Rails
SUS_S3#
5V_CB
3.3V_CB
Module S0 Power Rails
CB_RESET#
4s
The system can be forced to shut down by pressing and holding down the power button more than
4 seconds. The shutdown proceeds without verifying that each signal is de-asserted in the correct
sequence.
Wakeup Events
The following wake-up sources are available for waking up the system from the S3 state:
•
Power Button
•
Wake on LAN signal (WOL)
•
WAKE0# (Pin B66) PCI Express wake up signal
•
WAKE1# (Pin B67) General purpose wake up signal
The following wake-up sources are available for waking up the system from the S5 and S4 state:
•
Power Button
•
Ramping up of main power or standby voltage in combination with a compatible boot
mode setting (see section 6.5.1).
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6. Robin Embedded Controller
The embedded controller on the Robin computer module is a PSoC CY8C24794 from Cypress. The
PSoC is a powerful 8 bit microcontroller with USB interface and analog user blocks. The key
responsibilities of the embedded controller are to provide the power management, watchdog
functionality, user GPIO system and I2C interface.
The firmware used in the Robin Embedded Controller is compatible with the Toradex Oak Sensor
family. For core functionality, the same software libraries can be used. The embedded controller
appears in the operating system as standard USB Human Interface Device (HID). Therefore, for all
major operating systems, no additional drivers are necessary. The communication protocol
implemented in the embedded controller makes use of three different report modes. The
INTERRUPT OUT report mode is used to control the GPIO ports of the embedded controller and to
service the watchdog in real time with a maximum latency of 1ms. The INTERRUPT IN report mode
allows the embedded controller to transmit real time data relating to GPIO status and I2C bus data
back to the main processor. The FEATURE report mode is independent from the interrupt scheduled
report modes and is used as bidirectional non-real time communication channel for configuring
power management, watchdog and GPIO settings.
6.1. INTERRUPT OUT Report Contents (Real time data)
The interrupt out report contains two commands for switching the 8 I/O channels, watchdog
servicing information and I2C commands.
Byte Position
Size [Bit]
Name
Function
0
8
OUT1CMD
Command 1 for I/O port bit[7..0]
1
8
OUT2CMD
Command 2 for I/O port bit[7..0]
2
8
WDS
Watchdog serving
3
8
I2C_ID
Number to identify the I2C message
4
8
I2C_CMD
Command for the I2C Interface
5
8
I2C_ADDR
Slave Address for I2C command
6
8
I2C_COUNT
Number of Bytes to send/receive (I2C)
7...
11
5x8
I2C_DATA_OUT0 …
I2C_DATA_OUT4
I2C Data to send (payload 5 bytes)
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6.1.1 GPIO Command
The output report for the I/O consists of two commands. The following table defines these
commands.
OUT2CMD[x]
OUT1CMD[x]
Function
0
0
Set pin[x] to 0
0
1
Set pin[x] to 1
1
0
Toggle pin[x]
1
1
Hold previous state of pin[x]
6.1.2 Watchdog
The watchdog is serviced using the WDS byte. An interrupt out report with a WDS value unequal to
the previous sent value will service the watchdog. Populating the WDS byte with a simple toggle
signal or incremental counter value will be sufficient to service an enabled watchdog.
6.1.3 I2C interface
I2C_ID:
Identification number. This ID will be copied to the Interrupt In report if the I2C
read transaction from the I2C slave device was successful. This number can be
used to identify the corresponding Interrupt In report.
I2C_CMD[1..0]:
0x0
0x1
0x2
= Perform complete transfer from Start to Stop (standard transfer)
= Send Repeat Start instead of Start (used for combined transfer)
= Execute transfer without a Stop (use for combined transfer)
I2C_CMD[2]:
0
1
= Write to the slave device
= Read from the slave device
I2C_CMD[3]:
0
1
= Executes no I2C transfer
= Executes an I2C transfer
I2C_ADDR:
Address of the I2C slave device. Valid addresses are from 0 to 127
I2C_COUNT:
Number of bytes to send to or receive from the device. The maximum number
is 5 for transmit data and 4 for receive data. If more bytes are required for
either transmit or receive data, a combined transfer can be used.
I2C_DATA_OUT:
Payload data for transmission to the slave device (maximum 5 bytes)
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6.2. INTERRUPT IN Report Contents (Real time data)
Byte Position
Size [Bit]
Name
Function
0
16
FRAME
Frame number (millisecond resolution)
2
8
IO_DATA
GPIO values
3
8
I2C_ID
Identifier of the I2C message
4
8
I2C_COUNT
Number of Bytes received (I2C)
5...
8
4x8
I2C_DATA_IN0 …
I2C_DATA_IN3
Received I2C Data (payload 4 bytes)
9
8
STATE
Status of the System
6.2.1 Frame Number
The frame number is a millisecond counter that counts up to 2048 before rolling over. The USB
host controller polls the embedded controller requesting an interrupt in report every millisecond,
incrementing the frame number for each request. The embedded controller copies this frame
number into the interrupt in report to allow the corresponding request to be easily identified. The
frame number can therefore be used for measuring the time between two interrupt in report
requests or identify lost messages.
6.2.2 GPIO Values
This byte contains the actual state of all 8 GPIOs.
6.2.3 I2C interface
I2C_ID:
Identification number. This ID will be copied to the Interrupt Out report if the
I2C read transaction from the I2C slave device was successful. This number can
be used to identify the corresponding Interrupt In report.
I2C_COUNT:
The COUNT contains the number of bytes in the payload received from the
device if a new I2C message has been received successfully. If no new message
has been received from the device, this value will be zero.
I2C_DATA_OUT:
Payload received from the slave device (maximum 4 bytes)
6.2.4 System Status
STATE[0]:
BOOST_CONVERTER_ENABLED: This bit indicates the actual state of the main
power boost converter. A value of 1 indicates the boost converter is enabled.
The voltage range of the main power supply can be 5 to 14V.
STATE[1]:
BATLOW#: This bit represents the actual state of the BATLOW# pin of the
COM Express connector (pin A27).
STATE[2]:
WDT: This bit represents the actual state of the WDT pin on the COM Express
connector (pin B27). This pin is latched high if a watchdog event occurred
during the current power cycle.
STATE[3]:
reserved
STATE[4]:
THERMTRIP#: This bit represents the actual state of the THRMTRIP# pin on the
COM Express connector (pin A35). This pin is latched low if the system was shut
down due to an over temperature event during the current power cycle.
STATE[5]:
PWRBTN#: This bit represents the actual state of the PWRBTN# pin on the
COM Express connector (pin B12). The bit can be used to read the state of the
power button in a user application.
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STATE[6]:
reserved
STATE[7]:
5V_STBY_AV: This bit is high if the standby voltage rail on the COM Express
connector is available.
6.3. FEATURE Report Commands for GPIO
The feature report commands are used for writing and reading embedded controller settings.
Settings can be written into either RAM or flash. The settings stored in RAM are volatile and will be
lost when the main power supply and standby power supply are disconnected. Settings written to
flash will be automatically copied into RAM and will take effect immediately. Please also refer to
the “Programming Guide to the Oak Sensor Family” for a detailed description of using feature
report commands.
6.3.1 Report Mode
Byte#
Content
0
1
2
3
4
5
GnS
Tgt
0x01
0x00
0x00
RPTMODE
GnS:
0 = Set
1 = Get
Tgt
0 = RAM
1 = Flash
RPTMODE:
0 = After Sampling (factory default)
1 = After Change
6.3.2 Sample Rate
The sample rate setting defines the periodic rate at which the embedded controller reads the status
of all hardware signals and executes I2C communication requests. If Report Mode is set to 0, then
data will always be returned to the host on a feature report request after a new sampling event
has taken place. If Report Mode is set to 1, then data shall only be returned to the host on a
feature report request if the requested data changed between two sampling events.
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Byte#
Content
0
1
2
3
4
5
6
GnS
Tgt
0x02
0x01
0x00
SampRate
LSB
SampRate
MSB
GnS:
0 = Set
1 = Get
Tgt
0 = RAM
1 = Flash
SampRate:
Sample Rate [ms] (factory default 50 ms)
6.3.3 GPIO Direction
This configures the GPIO pins as inputs or outputs.
Byte#
Content
0
1
2
3
4
5
GnS
Tgt
0x01
0x01
0x00
DIR7..DIR0
GnS:
0 = Set
1 = Get
Tgt
0 = RAM
1 = Flash
DIR7..DIR0:
0 = Configures pin as input (factory default for Pin 3 to 0)
1 = Configures pin as output (factory default for Pin 7 to 4)
6.3.4 GPIO Output Mode
This configures individual GPIOs to operate as either CMOS compatible push-pull or open drain
outputs.
Byte#
Content
0
1
2
3
4
5
GnS
Tgt
0x01
0x02
0x00
OM7..OM0
GnS:
0 = Set
1 = Get
Tgt
0 = RAM
1 = Flash
OM7..OM0:
0 = Configures pin as CMOS compatible push-pull output (factory default)
1 = Configures pin as open drain output
This setting is ignored if the pin is configured as input
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6.3.5 Standby Configuration
This configures the behavior of the GPIO pins that are configured as output in the S3, S4 and S5
state.
Byte#
0
1
2
3
4
5
Content
GnS
Tgt
0x01
0x03
0x00
StbB7..
StbB0
GnS:
0 = Set
1 = Get
Tgt
0 = RAM
1 = Flash
StbB7..StbB0:
0 = Configures pin as high Z during standby (factory default)
1 = Configures pin not to change state during standby
Note: For power saving set all pins to the standby configuration “high Z during standby”.
Otherwise, depending on the external circuit, the board can consume more current in standby
mode than specified.
6.4. FEATURE Report Commands for Watchdog
6.4.1 Watchdog mode
Please exercise caution when changing watchdog settings. It is recommend that new settings be
tested by firstly writing them to RAM before committing them to flash. This way, the settings stored
in flash can be restored by unplugging all power supplies.
Byte#
Content
0
1
2
3
4
5
GnS
Tgt
0x01
0x05
0x00
WDT_M
GnS:
0 = Set
1 = Get
Tgt
0 = RAM
1 = Flash
WDT_M:
0 = Watchdog is switched off (factory default)
1 = Watchdog initiates a system reset if a watchdog event occurs.
The embedded controller switches off the watchdog after the fifth system
reset without it having been serviced in between resets. This
allows recovery from an erroneous watchdog configuration.
2 = Only the WDT pin on the COM Express™ will be asserted when a watchdog
event occurs; the system will not be reset.
6.4.2 Strobe Interval
The strobe interval defines the maximum permitted period between watchdog servicing events
without the occurrence of a watchdog event.
Byte#
Content
0
1
2
3
4
5
6
GnS
Tgt
0x02
0x02
0x00
WDT_Int
LSB
WDT_Int
MSB
GnS:
0 = Set
1 = Get
Tgt
0 = RAM
1 = Flash
WDT_Int:
Strobe interval [10-1s] (Factory Default 100 = 10s)
minimum value: 0.1s, maximum value: 100min
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6.4.3 Watchdog Enable Delay
This defines a delay period after system start within which the watchdog must be serviced for the
first time. Please set this value very carefully
carefully and test it by changing it only RAM before committing
changes to flash.
Byte#
Content
0
1
2
3
4
5
6
GnS
Tgt
0x02
0x03
0x00
WDT_Dly
LSB
WDT_Dly
MSB
GnS:
0 = Set
1 = Get
Tgt
0 = RAM
1 = Flash
WDT_Dly:
Watchdog enable delay [10-1s] (factory default 1200 = 2min)
minimum value: 1s, maximum value: 100min
6.4.4 Watchdog Source
This configures the source responsible for servicing the watchdog.
Byte#
0
1
2
3
4
Content
GnS
Tgt
GnS:
0 = Set
1 = Get
Tgt
0 = RAM
1 = Flash
0x01
0x06
0x00
5
WDT_Source
WDT_Source[0]: 0 = USB Interrupt out report not used for serving
1 = USB Interrupt out report used for serving (factory default)
WDT_Source[1]: 0 = USB feature report not used for serving
1 = USB feature report used for serving (factory default)
WDT_Source[2]: 0 = USB host polling not used for serving (factory default)
1 = USB host polling used for serving
WDT_Source[3]: 0 = US15W GPIO not used for serving (factory default)
1 = US15W GPIO used for serving
WDT_Source [7..4]:
Must be set to 0
6.4.5 Service Watchdog
This feature report command services the watchdog.
Byte#
Content
0
1
2
3
4
0x00
0x80
0x00
0x01
0x00
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6.4.6 Reset Watchdog Pin
This feature report command resets the state of the WDT pin on the COM Express™ connector.
Byte#
Content
0
1
2
3
4
0x00
0x80
0x00
0x02
0x00
6.5. FEATURE Report Commands for Power Management
6.5.1 Boot Mode
This feature configures the behavior of the module when the standby power supply and main powr
supply are ramped up.
Byte#
Content
0
1
2
3
4
5
GnS
Tgt
0x01
0x07
0x00
Boot_Mode
GnS:
0=
1=
Set
Get
Tgt
0=
1=
RAM
Flash
Boot_Mode [1..0]: 0x0 = Automatic Boot Mode detection (factory default).
The module goes into standby (S5) if the standby power supply is
available before the main supply and waits for the power button. If
the main power supply ramps up without the standby supply being
available, the module boots up without waiting for the power button.
0x1 = The module waits in S5 state for the power button when the power
supplies ramp up.
0x2 = System boots if the standby power supply or the main power supply are
ramped up without waiting for the power button.
Boot_Mode [2]:
0x0 = No reboot after power fail (factory default).
0x1 = Reboots 10 seconds after a power fail
Boot_Mode [3]:
0x0 = No reboot after an over temperature event (factory default).
0x1 = Reboots 1 minute after an over temperature event
Boot_Mode [4]:
0x0 = Disable the main power boost converter (main power 7 - 14V)
Shut down and reboot the system after a change of this setting
0x1 = Enables the main power boost converter (factory default,
main power 5 - 14V).
Shut down and reboot the system after changing this setting
Boot_Mode [7..5]:
Must be set to 0
6.5.2 S3 Signalization Mode
This feature configures the behavior of SUS_S3# together with SUS_S5# (see chapter 5.1 for more
information).
Byte#
Content
0
1
2
3
4
5
GnS
Tgt
0x01
0x04
0x00
S3_Sig
GnS:
0=
1=
Set
Get
Tgt:
0=
1=
RAM
Flash
S3_Sig
0=
SUS_S3# signal is independent of SUS_S5# signal and is low if the
system is in S3 state or S4/S5 (factory default).
SUS_S3# signal is a copy of the SUS_S5# signal. It is low only in the
S4/S5 state of the system
1=
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6.5.3 Reset THRM Pin
This feature report command resets the state of the thermal shut down pin on the COM Express™
connector.
Byte#
0
1
2
3
4
Content
0x00
0x80
0x00
0x00
0x00
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Page 41
6.6. Toradex Z5xx Tweaker Tool
The Toradex Z5xx Tweaker Tool is a powerful tool for configuring the settings of the embedded
controller. The program is divided into 4 sections: GPIO, Watchdog, Power Management and
Miscellaneous. The current settings of the embedded controller are read when the tool is invoked.
Changes to setting that are made in the program are written directly to the embedded controller
volatile memory (RAM). Changes can be made persistent using the save-to-flash-button available
for each section.
In addition to the feature report settings described in section 6.3, the Tweaker Tool allows the
embedded controller serial number to be changed. The serial number can be changed according
to user requirements - this serial number is not used by Toradex for module identification or
traceability purposes.
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Page 42
7. Watchdog
The watchdog is implemented in the embedded controller on the Robin module. It is designed to
enable the system to respond to and recover from unexpected events which cause the operating
system or application software to hang up or stop responding. The watchdog can either restart the
system or signal to the carrier board that a watchdog event has occurred. The configuration of the
watchdog is described in section 6.4. The following figure provides a functional description of the
watchdog in the form of a Mealy Finite State Machine (FSM).
S0
/ Set_timeout(Enable_Delay)
Wait first
service
Power UP
Serve
/ Set_timeout(Strobe_Interval)
Set_failCount(0)
WDT_on and not(S5 or S3)
/ Set_timeout(90s)
Serve
/ Set_timeout(Strobe_Interval)
S3 or S5
Timeout
/ restart_System
Timeout and failCount >= 5
Not(S0)
Watchdog
off
Running
Normally
Timeout and failCount <5
/ failCount++
Not(S0)
Not(S0)
WDT_mode == Reset_System
/ warmreset
Show_WDT_LED
WDT_mode != Reset_System
/ Show_WDT_LED
Watchdog
fault
Timeout
Serve
/ Set_timeout(Strobe_Interval)
Set_failCount(0)
Watchdog
temporary
off
Legend
Condition
/ Action
•
Watchdog
Watchdog off: If the system is in the S5, S4 or S3 state, the watchdog is in this state. The
FSM is also in this state if the watchdog is disabled.
•
Power UP: This state checks for malfunctions in the power up sequence. If the power up to
S0 exceeds 90 seconds, the watchdog initializes a restart of the power up sequence.
Important: this function only monitors the hanging up of the power up sequence. If a
power supply that was ramping up correctly fails later on in the sequence, the watchdog
will not restart the system. If the system needs to restart after such a power failure has
occurred, the boot mode must be set to reboot (see section 6.5.1)
•
Wait first service: After the correct power up sequence, the watchdog waits in this state for
a period of time equal to the watchdog enable delay (see section 6.4.3). This initial delay
allows extra time for the operating system and the application to start. As soon as the
watchdog is serviced for the first time, the watchdog transitions to the normal running
state. If a timeout occurs before the watchdog is initially serviced, the watchdog transitions
to fault state. If the watchdog transitions from the “Wait first service” state into the
“Watchdog fault” state more than 5 times without being serviced, then it will transition to
the “Watchdog temporary off” state.
•
Running Normally: The system is in the normal running state. If the watchdog is not
serviced within the strobe interval time, the watchdog transitions into the fault state.
Toradex AG l Altsagenstrasse 5 l 6048 Horw l Switzerland l +41 41 500 48 00 l www.toradex.com l [email protected] l
Page 43
•
Watchdog temporary off: If the watchdog is in this state, then the watchdog was not
serviced for 5 consecutive times prior to the enable delay timeout expiring. This could be
due to the enable delay time being set too short or the system takes a longer time to boot
than the time that has been allowed. This watchdog state allows such configuration issues
to be resolved.
•
Watchdog fault: Depending on the watchdog mode, the system may be reset on the exit
transition from this state. Irrespective of the watchdog mode, the of watchdog mode, the
WDT signal (COM Express Connector Pin B27) will be asserted on entry to this state. This
signals the watchdog event to the carrier board. The WDT signal must be reset using a USB
feature report.
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Page 44
8. Thermal considerations
Thermal management is an important part of a Design with a Robin Z5xx module. Designers must
analyze the application and design an appropriate thermal solution. Toradex provides heatsink or
heatspreader as a possible part for a final design.
8.1. Temperature Range
Robin Z5xx V1.0 / V2.0
Description
Min
Typ
Max
Unit
Operation Temperature 1)
0
60
°C
Storage Temperature
-10
85
°C
1) Maximum temperature depends on the cooling solution.
8.2. Notes for a custom heatsink or heatspreader
•
DO NOT use electrically conductive
conductive thermal
thermal grease, paste or interface material!!!
•
Using thermal grease is not recommended
•
The height of the SCH and CPU varies; the thermal solution must be adaptive to the
height. See chapter: 9.3.3 Details with height information
•
Using a thermal gap pad (=TIM (thermal interface material)) instead of thermal grease is
highly recommended.
•
Recommended TIM:
•
o
TIM thickness: 1mm
o
TIM Hardness: <40 (Shore 00)
o
TIM Thermal conductivity: >5 W/(mK)
o
TIM Resistance: >10^13 Ohm
Recommendation for distance from nominal CPU/SCH height to Heatsink: 0.5mm if using
recommended TIM (thermal interface material).
o
Distance from PCB to Heatsink for SCH:
2.4 mm
o
Distance from PCB to Heatsink for CPU:
1.9mm
Toradex AG l Altsagenstrasse 5 l 6048 Horw l Switzerland l +41 41 500 48 00 l www.toradex.com l [email protected] l
Page 45
8.3. Temperature sensor chip
Robin Z5xx uses a temperature sensor chip which continuously measures its own and the CPU
temperature. The temperature sensor chip reads the CPU temperature by means of a diode inside
the CPU.
The two temperatures measured from the sensor chip:
•
CPU temperature (BIOS: <Current CPU temperature>)
•
Module temperature (BIOS: <Current System temperature>)
The sensor chip has two output signals:
•
Warning signal
•
Critical Temperature signal
8.3.1 Warning signal
For the Warning signal, there is only one temperature limit, which applies for both, the CPU and
the module. It can be seen in the BIOS under <PC Health Status>.
The Warning signal may throttle the CPU by help of the OS and the BIOS.
8.3.2 Critical Temperature signal
For the Critical signal, there is a temperature limit for each, the CPU and the Module temperature.
They can be seen in the BIOS under <PC Health Status>.
8.3.3 Default BIOS values
The preconfigured BIOS values are:
Robin Version
Warning limit
Critical System Temp.
Critical CPU Temp
Robin Z5xx V1.0 a-i
70°C
77°C
89°C
Robin Z5xx V2.0 a-b
70°C
70°C
89°C
Toradex AG l Altsagenstrasse 5 l 6048 Horw l Switzerland l +41 41 500 48 00 l www.toradex.com l [email protected] l
Page 46
9. Technical Specification
9.1. Electrical Characteristics
Symbol
Robin Z530 V1.0/2.0
Robin Z510 V1.0/2.0
Min
Typ
Max
Min
Typ
Max
Description
Unit
VCC_Main
Main power supply
4.75
12.0
14.5
4.75
12.0
14.5
V
VCC_5V_SBY
Optional standby power supply
4.65
5.0
5.25
4.65
5.0
5.25
V
VCC_RTC
Optional RTC battery supply
2.0
3.0
3.6
2.0
3.0
3.6
V
IFFC_3V3
Total current on FFC 3.3V out (pins 8+19)
0.5
A
0.5
9.2. Power Consumption
Test conditions:
1) DOS command prompt, USB Keyboard & Mouse, no network connection, VGA display
(1280x1024), thermal solution applied.
2) Windows XP Embedded, USB Keyboard & Mouse, USB boot stick, SATA drive, MicroSD card,
no network connection, VGA display (1208x1024), thermal solution applied.
3) Windows XP Embedded with benchmark application, USB Keyboard & Mouse, 100% CPU
load, USB boot stick, SATA drive (active), SD card (active), GLAN (active), VGA display
(1280x1024), and thermal solution applied.
Module
Robin Z510 V1.0
Mode
DOS prompt 1)
XP Idle
2)
XP FullLoad
S3
2)
S5
3)
Robin Z530 V1.0
Robin Z530 V2.0
Main
[V]
Standby
[V]
Main
[mA]
SBY
[mA]
Total
[W]
Main
[mA]
SBY
[mA]
Total
[W]
Main
[mA]
SBY
[mA]
Total
[W]
12
5
380
9
4.6
420
9
5.1
420
9
5.1
12
5
370
9
4.5
390
9
4.7
390
9
4.7
12
5
490
9
5.9
570
9
6.9
570
9
6.9
12
5
26
13
0.38
26
13
0.38
26
13
0.38
12
5
2.4
0
0.029
2.4
0
0.029
2.4
0
0.029
5
5
2.4
0
0.012
2.4
0
0.012
2.4
0
0.012
NA
5
0
2.4
0.012
0
2.4
0.012
0
2.4
0.012
Specific Power consumptions
•
Current on Standby Input on a running module:
9mA
•
Power due to connected, but idle GLAN
432mW
•
Power due to connected, but idle 100MBit LAN
144mW
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Page 47
9.3. Mechanical characteristics
General characteristics:
•
The four mounting holes have a diameter of 2.7mm.
•
The PCB thickness is
•
o
Robin V1.0: 1.6mm.
o
Robin V2.0: 2.0mm
Toradex provides a heatspreader solution.
9.3.1 Mechanical characteristics of Robin Z5xx V1.0
84mm
80mm
4mm
Top View
2.5mm
20.8mm
6mm
51mm
4mm
FFC
Bottom View
COM Express Connector
16.5mm
4mm
7.55mm
microSD
14.5mm
55mm
CPU
SCH
21.6mm
9.3.2 Mechanical characteristics of Robin Z5xx V2.0
Toradex AG l Altsagenstrasse 5 l 6048 Horw l Switzerland l +41 41 500 48 00 l www.toradex.com l [email protected] l
Page 48
9.3.3 Details with height information
Note: Robin Z5xx V1.0 is shown, but the same guidelines for height apply to the Robin Z5xx V2.0.
•
Height of the SCH: 1.875+/-0.185mm
•
Height of the CPU: 1.427+/-0.110mm
•
Maximum component height of blue zone (top side): 3mm
•
Maximum component height of brown zone (top side): 5mm
•
Maximum component height of the whole module (bottom side): 3.8mm
o
Maximum component height on carrier board under module (5mm stack option): 1mm
o
Maximum component height on carrier board under module (8mm stack option): 4mm
9.4. RoHS Compliance
The Robin Z530 and Z510 modules comply with the European Union’s Directive 2002/95/EC:
“Restrictions of Hazardous Substances”
Toradex AG l Altsagenstrasse 5 l 6048 Horw l Switzerland l +41 41 500 48 00 l www.toradex.com l [email protected] l
Page 49
Disclaimer:
Copyright © Toradex AG. All rights reserved. All data is for information purposes only and not
guaranteed for legal purposes. Information has been carefully checked and is believed to be
accurate; however, no responsibility is assumed for inaccuracies. Brand and product names are
trademarks or registered trademarks of their respective owners. Specifications are subject to
change without notice.
Trademark Acknowledgement:
Brand and product names are trademarks or registered trademarks of their respective owners.
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Page 50
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