User manual | OMAP5 mobile applications platform

OMAP™ 5 mobile
applications platform
Product Bulletin
TI’s OMAP 5 platform transforms the concept of “mobile” to deliver truly unique mobile experiences.
• Delivers transformational mobile experiences
• Software support for leading mobile OSes
and integrated and tested for real-world
use cases
• Optimized power management technology
to maximize battery life
• Pre-integrated, complementary WiLink™
single-chip connectivity (GPS, Wi-Fi®,
Bluetooth® and FM)
• Pre-validated modem interface software
to easily connect with any external modem
The OMAP 5 platform sets the stage for future
mobile devices to transform from content consumption devices to primary computing devices.
This includes support for content creation and
editing, as well as supporting advanced experiences such as immersive 3D gaming, gesture
recognition and augmented reality applications. The OMAP 5 system-on-chip (SoC) is the first
featuring ARM®’s Cortex™-A15 MPCore™ on
the market, as TI worked closely with ARM as
the Advanced Lead Partner on the Cortex-A15’s
development. Key features and benefits at a glance
Feature
Benefit
28 nanometer CMOS low-power
process
The highest levels of processor performance and lowest power
consumption
Smart multicore architecture with
Symmetric Multiprocessing (SMP)
including two ARM Cortex-A15
MPCore processors for SMP and
two Cortex-M4 processors for
low-power offload and real-time
control
• Higher mobile computing performance
• 2-3x higher performance versus previous generation
• Faster user interfaces and less power consumption
• Scalable performance activates only the cores that are needed
for a particular process
• Hardware virtualization through Hypervisor allows power and
performance-efficient, multiple operating system (OS) support
IVA 3 HD multimedia accelerator
• Full high definition 1080p60 multi-standard video encode/decode
and stereoscopic 3D encode/decode at 1080p30
Imagination Technologies'
POWERVR™ SGX544 graphics core
• 5x performance increase versus previous generation enables
compelling 2D and 3D interfaces and screens
Multi-core imaging and vision
processing unit
• High-quality, high-megapixel digital SLR-like images at up
to 24 MP (or 12 MP S3D)
• On-the-fly support with real-time face detection, stabilization,
noise filtering and 3D optimization to replace digital still cameras
TI proprietary M-Shield™ mobile
security technology enhanced
with ARM TrustZone® support and
based on open APIs
• Unprecedented security capable of supporting enterprise and
even premium content streaming applications on the go
SmartReflex™ 3 technology
• Dynamically controlled voltage, frequency and power based
on device activity, modes of operation and temperature
Low Power audio
• Provides up to 140+ hours of CD-quality audio playback
High-bandwidth memory interface
with 8.5 GB/s
• OMAP5430 – 2-channel LPDDR2 @532 MHz
• OMAP5432 – 2-channel DDR3 @532 MHz
Flexible system support
• Supports up to 4 displays: three high-resolution LCD displays and
external HDMI 1.4a HDTV output
• Enhanced, higher-speed industry-standard interfaces:
USB3, MIPI CSI-3/UniPort-M/LLI
Backwards compatibility
• Begin development with the OMAP 4 platform and migrate
easily later to the OMAP 5 platform
Best-in-class applications
processor platform overview
At the heart of the OMAP 5 platform is a
powerful system-on-chip that includes the
perfect balance of power efficiency and
high performance. The OMAP 5 processor
balances processing across multiple engines:
• A programmable multimedia engine based
on TI’s mini-C64x DSP and power-efficient, multi-format hardware accelerators;
• On-demand general-purpose processing
based on multiple ARM cores (two
Cortex-A15 MPCores capable of running up
to 2 GHz each and two Cortex-M4 cores)
supporting symmetric multiprocessing (SMP)
• Multiple high-performance programmable
graphics engines for the highest quality video
with more codec choices
• An Image Signal Processor (ISP) for
unparalleled video and imaging performance
for both 2D and stereoscopic 3D (S3D).
The family includes two applications
processors with package sizes and features
designed for space-sensitive smartphone/tablet
and cost-sensitive computing/consumer
designs. The OMAP5430 offers a smaller
14x14 mm2 package with PoP LPDDR2
memory, while the OMAP5432 offers a
17x17 mm2 package with non-PoP DDR3
memory. Both processors offer the full variety of
subsystems and applications discussed below
to deliver a transformed user experience with
hardware and software system solutions that
scale across customer roadmaps optimizing
time to market, flexibility and R&D efficiency. Its scalable performance activates only the
cores that are needed for that particular process
to reduce power consumption or substantially
increase performance. The Cortex-A15
processor also offers hardware virtualization
support, opening up a significant opportunity
for power and performance-efficient, multiple
guest operating system (OS) support.
ARM Cortex-A15 leadership
TI is the first company to bring ARM’s
Cortex-A15 MPcore to market, offering a
significant performance improvement and more
capabilities versus the previous Cortex-A9 core.
Developed in 28nm process technology, the
Cortex-A15 raises the bar for high performance,
energy-efficient computing delivering a 1.5x
improvement in single-thread performance
and a 1.6x improvement in floating point
and media performance.
The Cortex-A15 MPCore supports SMP
parallel processing for high performance
and efficiency to deliver next-generation
applications. SMP allows identical processing
subsystems to run the same instruction set;
have equal access to memory, I/Os and
external interrupts; and run a single copy of
the operating system to control all the cores.
Power management
The OMAP 5 platform makes extensive use of
TI’s SmartReflex™ 3 power and performance
management technologies, which include
a broad range of intelligent and adaptive
hardware and software techniques that
dynamically control voltage, frequency and
power based on device activity, modes of
operation and temperature. This technology
minimizes chip-level leakage power dissipation
at 28 nanometers allowing devices to have
ultra-low active and standby current drain,
thereby increasing battery life. SmartReflex 3
technologies help enable the OMAP 5 platform
to deliver the same performance as OMAP 4
with a nearly 60 percent power reduction,
a significant savings. TI OMAP5430 SoC
2x MIPI® HSI
LPDDR2
LPDDR2
NAND/NOR
Flash
EMIF 1
EMIF 2
GPMC
TI C2C
USB/HSIC
UART/SPI
Dynamic memory manager
L2 cache
McBSP
ARM®
Cortex™-A15
MPCore
WiLink™
2
ITI
C/SPI
C2C
(up to 2 GHz) (up to 2 GHz)
wireless
connectivity
SDIO
SDIO
UART
McBSP
TWL
Main
battery
Power
I2C
Monitor
HDQ/1-Wire
Clocks
REF/CLK
Serial devices
(4) UARTs
MMC/SD
SSD
SATA 2.0
ARM
Cortex-A15
MPCore
ARM
Cortex-M4
ARM
Cortex-M4
POWERVR™ miniIVA-HD
SGX544-MPx C64x
video
3D graphics DSP accelerator
2D
graphics
Image signal
processor
L3 Network-on-chip interconnect
Timers, Int Controller, Mailboxes,
System DMA
Audio processor
Boot/Secure ROM, L3 RAM
™
M-Shield system security technology: SHA-1/SHA-2/MD5,
DES/3DES, RNG, AES, PKA, secure WDT, keys, crypto DMA
Multi-pipe
L4 peripherals
display sub-system
(DSS)
Debug & trace
cJTAG/STP/PTM
Emulator
pod
OMAP5430 block diagram
eMMC
OMAP5430
MIPI LLI
3G/4G
modem
SD 3.0
Trace
analyzer
UART
Fast
IrDA
USB SS/HS
host/target
USB 3.0 OTG
3x USB 2.0
host
(ULPI/TLL/HSIC)
USB HS
target
MIPI LLI/
UniPortSM-M
Companion
device
MIPI CSI-3
Up to
four
cameras
3x MIPI CSI-2 +
CPI
Camera control
DIG MIC
TWL6041
Audio
Headset
I2C
PDM
SLIMbus®
Speakers
Vibrators
Amplifiers
Micro
MIPI DSI
MIPI DSI
MIPI DBI-B/DPI
LCD
LCD
LCD
GPIO
Keypad
I2C/SPI
HDMI 1.4a
Up to
four
displays
GPIO
Keypad
Touch
screen
controller
TPD12S015
3D
HDTV
32 kHz Crystal
In/Out
HF speakers
Handset
microphone
Premium security
TI’s M-Shield mobile security technology
enables robust protection of enterprise data
and premium copyrighted digital media content,
secure protocol applications and e-commerce
applications such as ticketing, banking,
brokering and shopping. The OMAP 5 platform
security offering is based on open APIs and
provides an environment for secure applications
that deliver robust performance, interoperability,
greater development speed and large
economies of scale. As the advanced hardware and software
security framework for the OMAP 5 platform,
M-Shield technology enables value-added
services and increased terminal security,
allowing operators, content providers and
manufacturers to secure sensitive assets and
usage rights for protection against revenue loss.
Features include secure flashing and booting,
so that only authorized software can be loaded
on the handset, terminal identity protection that
makes stolen phones useless, and network lock
protection that prevents users from arbitrarily
switching networks on the Web.
™
Complete systems expertise
TI’s pre-integrated, proven wireless
connectivity solutions ensure multi-mode
operation and access to a variety of wireless
network connections for service anytime and
anywhere on a variety of wireless networks.
TI’s highly integrated WiLink™ single-chip
connectivity solution (Bluetooth, Wi-Fi, GPS
and FM) give manufacturers a distinct
competitive advantage.
Additionally, TI offers a broad portfolio of
complementary hardware solutions optimized
for the OMAP 5 platform, including: DLP® Pico
projection technology, analog components,
embedded processors and logic solutions.
In-depth development support
The OMAP 5 platform is backed by TI’s
extensive development support. Code
compatibility with other OMAP processors
makes it easy to port software and a
sophisticated development environment
speeds programming for all on-chip processors.
Information about the independent OMAP
Technology Centers (OTCs), TI’s extensive
network of specialized system integrators
skilled in all aspects of HLOS porting and
integration is available at www.ti.com/wireless.
In addition, the OMAP 5 platform is supported
by the OMAP ecosystem, comprised of the
OMAP Developers Network and OMAP
Technology Centers (OTCs), as well as systems
integrators, development tool providers and
leading content providers worldwide. The OTC
program has been extended to include support
for TI’s WiLink technology and connectivity
solutions.
TI’s OTC program provides a system-level
approach with support for the OMAP platform
and non-cellular wireless solutions to give
handset manufacturers and developers access
to a broad range of wireless systems expertise.
Transformed mobile experiences
The OMAP 5 platform is the best-in-class
applications processor platform that delivers
unique mobile experiences only possible
with the OMAP 5 platform’s unique design. The table below gives some examples of the
unique, exciting mobile experiences possible
with the OMAP 5 platform.
Mobile Experience
OMAP™ 5 Technology Enablers
True mobile computing
• content creation
• multiple OS support
• desktop experiences
ARM Cortex -A15 processors with industry-leading performance, larger
memory and hardware virtualization, 2D and multi-core 3D graphics
acceleration, dual, high-bandwidth memory channels and multiple,
high-resolution displays support.
Computational photography
• enhanced images/video
• new camera capabilities
• embedded vision
Programmable imaging and video processors, stabilization hardware,
stereoscopic 3D optimizations, hardware face detection and four
simultaneous cameras
Natural user interface (NUI)
• stereoscopic 3D
• gesture control
• interactive projection
Stereoscopic 3D optimizations, wide spectrum of processing engines
(DSP, image accelerators, ARM NEON™ SIMD, multi-core GPU), DLP® Pico
projection support and software APIs
®
™
For more information
To learn more about the OMAP 5 platform, including the OMAP5430 and OMAP5432 platforms, or
about other OMAP applications processors from TI,
visit www.ti.com/omap5-pb.
Processor family comparison
OMAP5430
Target Markets
OMAP5432
Area-sensitive (Smartphones, Tablets)
Cost-sensitive (mobile computing,
consumer)
Process node
28 nanometer low-power process
ARM Cortex processors
Two ARM Cortex-A15 (up to 2 GHz)
Two ARM Cortex-M4
2D & 3D Graphics
Multi-core, hardware accelerated
®
™
Video performance (2D)
1080p60 multi-standard
Video Performance (3D)
1080p30 multi-standard
Imaging Performance
Up to 24 MP
Memory Support
(MIPI CSI-3+ 3x MIPI CSI-2+ CPI
interfaces)
(3x CSI-2+ CPI interfaces)
Peripheral Support
2xLPDDR2
2xDDR3/DDR3L
Package
UART (6x), HSIC (3x), SPI (4x), MIPI
UniPortSM-M, MIPI® LLI, HSI (2x)
®
Up to 20MP
®
®
UART (5x), HSIC (2x), SPI (3x)
MIPI® UniPortSM-M, MIPI® LLI, HSI
Availability disclaimer: The OMAP 5 platforms are intended for high-volume OEMs and ODMs and are not available
through distributors. If your company meets this description, please contact your TI sales representative.
Important Notice: The products and services of Texas Instruments Incorporated and its subsidiaries described herein are sold subject to TI’s standard terms and conditions of sale.
Customers are advised to obtain the most current and complete information about TI products and services before placing orders. TI assumes no liability for applications assistance,
customer’s applications or product designs, software performance, or infringement of patents. The publication of information regarding any other company’s products or services does
not constitute TI’s approval, warranty or endorsement thereof.
B122010
The platform bar, OMAP, WiLink, SmartReflex, and M-Shield are trademarks of Texas Instruments. The Bluetooth word mark and logos
are owned by the Bluetooth SIG, Inc., and any use of such marks by Texas Instruments is under license. All other trademarks are the
property of their respective owners.
© 2011 Texas Instruments Incorporated
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