XC9272 Series - Torex Semiconductor

XC9272 Series
ETR05057-001
Ultra Low Quiescent Current Synchronous Step-Down PFM DC/DC Converter for Low Output Voltage
☆GreenOperation compatible
■GENERAL DESCRIPTION
XC9272 series are Ultra Low Quiescent Current synchronous-rectification for Low Output Voltage type PFM step down DC/DC
converters with a built-in 0.4Ω (TYP.) Pch driver and 0.4Ω (TYP.) Nch synchronous switching transistor, designed to allow the
use of ceramic capacitor.
PFM control enables a low quiescent current, making these products ideal for battery operated devices that require high
efficiency and long battery life.
Only inductor, CIN and CL capacitors are needed as external parts to make a step down DC/DC circuit.
Operation voltage range is from 2.0V to 6.0V. This product has fixed output voltage from 0.6V to 0.95V(accuracy: ±20mV) in
increments of 0.05V.
During stand-by, all circuits are shutdown to reduce consumption to as low as 0.1μA(TYP.) or less.
With the built-in UVLO (Under Voltage Lock Out) function, the internal P-channel MOS driver transistor is forced OFF when
input voltage gets lower than UVLO detection voltage. Besides, XC9272 series has UVLO release voltage of 1.8V (Typ.).
The product with CL discharge function, XC9272B type, can discharge CL capacitor during stand-by mode due to the internal
resistance by turning on the internal switch between VOUT -GND. This enables output voltage restored to GND level fast.
■APPLICATIONS
■FEATURES
●
Electric devices with GPS
●
Wearable devices
●
Energy Harvest devices
●
Backup power supply circuits
●
Devices with 1 Lithium cell
Input Voltage Range
:
2.0V~6.0V
Output Voltage Setting
:
0.6V~0.95V (±20mV, 0.05V step increments)
Output Current
:
50mA
Driver Transistor
:
0.4Ω (Pch Driver Tr)
0.4Ω (Nch Synchronous rectifier Switch Tr)
Supply Current
:
0.50μA @ VOUT(T)=0.7V (TYP.)
Control Method
:
PFM control
High Speed Transient
PFM Switching Current
:
:
50mV (VIN=3.6V, VOUT=0.7V, IOUT=10μA→50mA)
180mA
Function
:
Short Protection function
CL Discharge(XC9272B type)
UVLO function
Ceramic Capacitor Compatible
Operation Ambient Temperature
:
-40~+85℃
Package
:
SOT-25, USP-6EL
Environmentally Friendly
:
EU RoHS compliant, Pb Free
■TYPICAL APPLICATION CIRCUIT
■TYPICAL PERFORMANCE
CHARACTERISTICS
●Efficiency vs. Output Current
XC9272A071xR-G(VOUT=0.7V)
L=10μH(VLF302512M-100M),C IN =10μF(LMK107BJ106MA),
CL =22μF(JMK107BJ226MA)
CIN
(Ceramic)
L
VIN
LX
VOUT
CE
GND
100
VIN=2.0V
VOUT
CL
(Ceramic)
Ef f iciency : EFFI (%)
VIN
80
60
VIN=3.6V
40
20
0
0.01
0.1
1
10
100
Output Current : I OUT (mA)
1/23
XC9272 Series
■ BLOCK DIAGRAM
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
XC9272A type does not have CL Discharge function.
■PRODUCT CLASSIFICATION
●Ordering information
XC9272①②③④⑤⑥-⑦
DESIGNATOR
ITEM
①
Product Type
②③
Output Voltage
Output Voltage Type
④
⑤⑥-⑦
(*1)
(*1)
Packages (Order Unit)
SYMBOL
DESCRIPTION
A
Without CL Discharge
B
With CL Discharge
06 ~ 09
Output Voltage : e.g. VOUT=0.7V⇒②=0, ③=7
Output Voltage Range: 0.6V~0.95V (0.05V step)
1
Output Voltage {x.x0V} (the 2nd decimal place is “0”)
B
Output Voltage {x.x5V} (the 2nd decimal place is “5”)
4R-G
USP-6EL (3,000pcs/Reel)
MR-G
SOT-25 (3,000pcs/Reel)
The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
2/23
XC9140 (Design Target)
XC9272
Series
■PIN CONFIGURATION
LX
VOUT
5
4
1
2
3
VIN
GND
CE
VIN 6
1 LX
NC 5
2 GND
CE 4
3 VOUT
USP-6EL
(BOTTOM VIEW)
SOT-25
(TOP VIEW)
* The dissipation pad for the USP-6EL package should be solder-plated in
reference mount pattern and metal masking so as to enhance mounting
strength and heat release.
The mount pattern should be connected to GND pin (No.2).
■PIN ASSIGNMENT
PIN NUMBER
USP-6EL
SOT-25
PIN NAME
FUNCTIONS
1
5
LX
Switching
2
2
GND
Ground
3
4
VOUT
Output Voltage
4
3
CE
Chip Enable
5
-
NC
No Connection
6
1
VIN
Power Input
■ CE PIN FUNCTION
PIN NAME
CE
SIGNAL
STATUS
H
Operation (All Series)
L
Standby (All Series)
* Please do not leave the CE pin open.
■ABSOLUTE MAXIMUM RATINGS
Ta=25˚C
PARAMETER
SYMBOL
RATINGS
UNITS
VIN Pin Voltage
VIN
-0.3 ~ +7.0
V
LX Pin Voltage
VLX
-0.3 ~ VIN+0.3 or +7.0 (*1)
V
VOUT Pin Voltage
VOUT
-0.3 ~ VIN+0.3 or +7.0 (*1)
V
CE Pin Voltage
VCE
-0.3 ~ +7.0
V
LX Pin Current
ILX
1000
mA
Power Dissipation
SOT-25
USP-6EL
Pd
250
120
mW
Operating Ambient Temperature
Topr
-40 ~ +85
˚C
Storage Temperature
Tstg
-55 ~ +125
˚C
* All voltages are described based on the GND.
(*1)
The maximum value is the lower of either VIN + 0.3 or +7.0.
3/23
XC9272 Series
■ELECTRICAL CHARACTERISTICS
Ta=25˚C
●XC9272A Type, without CL discharge function
PARAMETER
SYMBOL
Input Voltage
VIN
CONDITIONS
-
MIN.
TYP.
MAX.
UNITS
CIRCUIT
2.0
-
6.0
V
①
V
②
Resistor connected with LX pin.
Output Voltage
VOUT(E) (*2)
Voltage which LX pin changes “L” to “H” level
E1
while VOUT is decreasing.
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
UVLO Release Voltage
VUVLO(E)
Voltage which LX pin changes “L” to “H” level
1.65
1.8
1.95
V
②
0.1
0.15
0.23
V
②
VIN=VCE=2.0V, VOUT=VOUT(T)+0.5V (*1), LX=Open.
-
0.5
0.8
μA
③
while VIN is increasing.
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
UVLO Hysteresis Voltage
VHYS(E)
VUVLO(E) - Voltage which LX pin changes “H” to “L”
level while VIN is decreasing.
Supply Current
Iq
Standby Current
ISTB
VIN=5.0V, VCE=VOUT=0V, LX=Open.
-
0.1
1.0
μA
③
LX SW “H” Leak Current
ILEAKH
VIN=5.0V, VCE=VOUT=0V, VLX=0V.
-
0.1
1.0
μA
③
LX SW “L” Leak Current
ILEAKL
VIN=5.0V, VCE=VOUT=0V, VLX=5.0V.
-
0.1
1.0
μA
③
115
180
250
mA
①
-
85
-
%
①
PFM Switching Current
Efficiency (*3)
LX SW “Pch”
ON Resistance (*4)
LX SW “Nch”
ON Resistance
Output Voltage
Temperature
Characteristics
IPFM
EFFI
VIN=VCE=VOUT(T)+2.0V
(*1)
, IOUT=10mA.
VIN=VCE=3.6V,
VOUT(T)=0.7V (*1), IOUT=30mA.
RLXP
VIN=VCE=5.0V, VOUT=0V, ILX=50mA.
-
0.4
0.65
Ω
④
RLXN
VIN=VCE=5.0V.
-
0.4 (*5)
-
Ω
-
-40℃≦Topr≦85℃.
-
±100
-
ppm/℃
②
1.2
-
6.0
V
⑤
GND
-
0.3
V
⑤
ΔVOUT/
(VOUT・ΔTopr)
VOUT=0V. Resistor connected with LX pin.
CE “High” Voltage
VCEH
Voltage which LX pin changes “L” to “H” level while
VCE=0.2→1.5V.
VOUT=0V. Resistor connected with LX pin.
CE “Low” Voltage
VCEL
Voltage which LX pin changes “H” to “L” level while
VCE=1.5→0.2V.
CE “High” Current
ICEH
VIN=VCE=5.0V, VOUT=0V, LX=Open.
-0.1
-
0.1
μA
⑤
CE “Low” Current
ICEL
VIN=5.0V, VCE=VOUT=0V, LX=Open.
-0.1
-
0.1
μA
⑤
0.14
0.3
0.48
V
②
Short Protection
Threshold Voltage
Resistor connected with LX pin.
VSHORT
Voltage which LX pin changes “H” to “L” level while
VOUT= VOUT(T)+0.1V→0V(*1).
Unless otherwise stated, VIN=VCE=5.0V
(*1)
VOUT(T)=Nominal Output Voltage
(*2)
VOUT(E)=Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC.
Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value.
Please refer to the characteristic example.
(*3)
EFFI=[{ (Output Voltage)×(Output Current)] / [(Input Voltage)×(Input Current)}]×100
(*4)
LX SW “Pch” ON resistance = (VIN – VLX pin measurement voltage) / 50mA
(*5) )
Designed value
4/23
XC9140 (Design Target)
XC9272
Series
■ELECTRICAL CHARACTERISTICS (Continued)
●XC9272B Type, with CL discharge function
PARAMETER
SYMBOL
Input Voltage
VIN
CONDITIONS
-
MIN.
TYP.
MAX.
UNITS
CIRCUIT
2.0
-
6.0
V
①
V
②
Resistor connected with LX pin.
Output Voltage
VOUT(E) (*2)
Voltage which LX pin changes “L” to “H” level
E1
while VOUT is decreasing.
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
UVLO Release Voltage
VUVLO(E)
Voltage which LX pin changes “L” to “H” level
1.65
1.8
1.95
V
②
0.1
0.15
0.23
V
②
VIN=VCE=2.0V, VOUT=VOUT(T)+0.5V (*1), LX=Open.
-
0.5
0.8
μA
③
while VIN is increasing.
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
UVLO Hysteresis Voltage
VHYS(E)
VUVLO(E) - Voltage which LX pin changes “H” to “L”
level while VIN is decreasing.
Supply Current
Iq
Standby Current
ISTB
VIN=5.0V, VCE=VOUT=0V, LX=Open.
-
0.1
1.0
μA
③
LX SW “H” Leak Current
ILEAKH
VIN=5.0V, VCE=VOUT=0V, VLX=0V.
-
0.1
1.0
μA
③
LX SW “L” Leak Current
ILEAKL
VIN=5.0V, VCE=VOUT=0V, VLX=5.0V.
-
0.1
1.0
μA
③
115
180
250
mA
①
-
85
-
%
①
PFM Switching Current
Efficiency (*3)
LX SW “Pch”
ON Resistance (*4)
LX SW “Nch”
ON Resistance
Output Voltage
Temperature
Characteristics
IPFM
EFFI
VIN=VCE=VOUT(T)+2.0V
(*1)
, IOUT=10mA.
VIN=VCE=3.6V,
VOUT(T)=0.7V (*1), IOUT=30mA.
RLXP
VIN=VCE=5.0V, VOUT=0V, ILX=50mA.
-
0.4
0.65
Ω
④
RLXN
VIN=VCE=5.0V.
-
0.4 (*5)
-
Ω
-
-40℃≦Topr≦85℃.
-
±100
-
ppm/℃
②
1.2
-
6.0
V
⑤
GND
-
0.3
V
⑤
ΔVOUT/
(VOUT・ΔTopr)
VOUT=0V. Resistor connected with LX pin.
CE “High” Voltage
VCEH
Voltage which LX pin changes “L” to “H” level while
VCE=0.2→1.5V.
VOUT=0V. Resistor connected with LX pin.
CE “Low” Voltage
VCEL
Voltage which LX pin changes “H” to “L” level while
VCE=1.5→0.2V.
CE “High” Current
ICEH
VIN=VCE=5.0V, VOUT=0V, LX=Open.
-0.1
-
0.1
μA
⑤
CE “Low” Current
ICEL
VIN=5.0V, VCE=VOUT=0V, LX=Open.
-0.1
-
0.1
μA
⑤
0.14
0.3
0.48
V
②
55
80
105
Ω
③
Short Protection
Threshold Voltage
CL Discharge
Resistor connected with LX pin.
VSHORT
Voltage which LX pin changes “H” to “L” level while
VOUT= VOUT(T)+0.1V→0V(*1).
RDCHG
VIN=VOUT=5.0V, VCE=0V, LX=Open.
Unless otherwise stated, VIN=VCE=5.0V
(*1)
VOUT(T)=Nominal Output Voltage
(*2)
VOUT(E)=Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC.
Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value.
Please refer to the characteristic example.
(*3)
EFFI=[{ (Output Voltage)×(Output Current)] / [(Input Voltage)×(Input Current)}]×100
(*4)
LX SW “Pch” ON resistance = (VIN – VLX pin measurement voltage) / 50mA
(*5)
Designed value
5/23
XC9272 Series
■ELECTRICAL CHARACTERISTICS (Continued)
XC9272 series voltage specification chart
SYMBOL
E1
PARAMETER
Output Voltage
UNITS: V
UNITS: V
OUTPUT
MIN.
MAX.
0.60
0.58
0.62
0.65
0.63
0.67
0.70
0.68
0.72
0.75
0.73
0.77
0.80
0.78
0.82
0.85
0.83
0.87
0.90
0.88
0.92
0.95
0.93
0.97
VOLTAGE
6/23
XC9140 (Design Target)
XC9272
Series
■TEST CIRCUITS
7/23
XC9272 Series
■TYPICAL APPLICATION CIRCUIT
L
VIN
CIN
(Ceramic)
VIN
LX
CE
VOUT
VOUT
CL
(Ceramic)
GND
【Typical Examples】
MANUFACTURE
PRODUCT NUMBER
VALUE
TDK
VLF302512M-100M
10μH
Coilcraft
LPS3015-103MRB
10μH
TOKO
DFE201610E-100M
10μH
CIN
TAIYO YUDEN
LMK107BJ106MA
10μF/10V
CL
TAIYO YUDEN
JMK107BJ226MA
22μF/6.3V
L
* Take capacitance loss, withstand voltage, and other conditions into consideration when selecting components.
* Characteristics are dependent on deviations in the coil inductance value. Test fully using the actual device.
* A value of 10μH is recommended for the coil inductance.
* If a tantalum or electrolytic capacitor is used for the load capacitance CL, ripple voltage will increase, and there is a possibility that operation will
become unstable. Test fully using the actual device.
8/23
XC9140 (Design Target)
XC9272
Series
■ OPERATIONAL EXPLANATION
The XC9272 series consists of a reference voltage supply, PFM comparator, Pch driver Tr, Nch synchronous rectification switch Tr, current
sensing circuit, PFM control circuit, CE control circuit, and others. (Refer to the block diagram below.)
An ultra-low quiescent current circuit and synchronous rectification enable a significant reduction of dissipation in the IC, and the IC operates with
high efficiency at both light loads and heavy loads. Current limit PFM is used for the control method, and even when switching current
superposition occurs, increases of output voltage ripple are suppressed, allowing use over a wide voltage and current range. The IC is compatible
with low-capacitance ceramic capacitors, and a small, high-performance step-down DC-DC converter can be created.
The actual output voltage VOUT(E) in the electrical characteristics is the threshold voltage of the PFM comparator in the block diagram. Therefore
the average output voltage of the step-down circuit, including peripheral components, depends on the ripple voltage. Before use, test fully using
the actual device
<Reference voltage supply (VREF)>
Reference voltage for stabilization of the output voltage of the IC.
<PFM control>
(1) The feedback voltage (FB voltage) is the voltage that results from dividing the output voltage with the IC internal dividing resistors RFB1 and
RFB2. The PFM comparator compares this FB voltage to VREF. When the FB voltage is lower than VREF, the PFM comparator sends a signal to the
buffer driver through the PFM control circuit to turn on the Pch driver Tr. When the FB voltage is higher than VREF, the PFM comparator sends a
signal to prevent the Pch driver Tr from turning on.
(2) When the Pch driver Tr is on, the current sense circuit monitors the current that flows through the Pch driver Tr connected to the Lx pin. When the
current reaches the set PFM switching current (IPFM), the current sense circuit sends a signal to the buffer driver through the PFM control circuit. This
signal turns off the Pch driver Tr and turns on the Nch synchronous rectification switch Tr.
(3) The on time of the Nch synchronous rectification switch Tr is dynamically optimized inside the IC. After the off time elapses and the PFM
comparator detects that the VOUT voltage is higher than the set voltage, the PFM comparator sends a signal to the PFM control circuit that
prevents the Pch driver Tr from turning on. However, if the VOUT voltage is lower than the set voltage, the PFM comparator starts Pch driver Tr on.
By continuously adjusting the interval of the linked operation of (1), (2) and (3) above in response to the load current, the output voltage is
stabilized with high efficiency from light loads to heavy loads.
9/23
XC9272 Series
■OPERATIONAL EXPLANATION (Continued)
<PFM Switching Current >
The PFM switching current monitors the current that flows through the Pch driver Tr, and is a value that limits the Pch driver Tr current.
The Pch driver Tr remains on until the coil current reaches the PFM switching current (IPFM). An approximate value for this on-time tON can be
calculated using the following equation:
tON = L × IPFM / (VIN – VOUT)
<Maximum on-time function>
To avoid excessive ripple voltage in the event that the coil current does not reach the PFM switching current within a certain interval even though
the Pch driver Tr has turned on and the FB voltage is above VREF, the Pch driver Tr can be turned off at any timing using the maximum on-time
function of the PFM control circuit. If the Pch driver Tr turns off by the maximum on-time function instead of the current sense circuit, the Nch
synchronous rectification switch Tr will not turn on and the coil current will flow to the VOUT pin by means of the parasite diode of the Nch
synchronous rectification switch Tr.
<VIN start mode>
When the VIN voltage rises, VIN start mode stops the short-circuit protection function during the interval until the FB voltage approaches VREF. After
the VIN voltage rises and the FB voltage approaches VREF by step-down operation, VIN start mode is released. In order to prevent an excessive
rush current while VIN start mode is activated, Nch synchronous rectification switch Tr will not turn on and the coil current flows to the VOUT pin by
means of the parasitic diode of the Nch synchronous rectification Tr. In VIN start mode as well, the coil current is limited by the PFM switching
current.
<Short-circuit protection function>
The short-circuit protection function monitors the VOUT voltage. In the event that the VOUT pin is accidentally shorted to GND or an excessive load
current causes the VOUT voltage to drop below the set short-circuit protection voltage, the short-circuit protection function activates, and turns off
and latches the Pch driver Tr at any selected timing. Once in the latched state, the IC is turned off and then restarted from the CE pin, or operation
is started by re-applying the VIN voltage.
<UVLO function>
When the VIN pin voltage drops below the UVLO detection voltage, the IC stops switching operation at any selected timing, turns off the Pch driver
Tr and Nch synchronous rectification switch Tr (UVLO mode). When the VIN pin voltage recovers and rises above the UVLO release voltage, the
IC restarts operation.
<CL discharge function>
On the XC9272 series, a CL discharge function is available as an option (XC9272B type). This function enables quick discharging of the CL load
capacitance when “L” voltage is input into the CE pin by the Nch Tr connected between the VOUT-GND pins, or in UVLO mode. This prevents
malfunctioning of the application in the event that a charge remains on CL when the IC is stopped. The discharge time is determined by CL and
the CL discharge resistance RDCHG, including the Nch Tr (refer to the diagram below). Using this time constant τ= CL×RDCHG, the discharge time
of the output voltage is calculated by means of the equation below.
V = VOUT × e - t /τ, or in terms of t, t = τIn(VOUT / V)
V: Output voltage after discharge
VOUT : Set output voltage
t: Discharge time
CL: Value of load capacitance (CL)
RDCHG : Value of CL discharge resistance Varies by power supply voltage.
τ: CL × RDCHG
The CL discharge function is not available on the XC9272A type.
10/23
XC9140 (Design Target)
XC9272
Series
■NOTE ON USE
1. Be careful not to exceed the absolute maximum ratings for externally connected components and this IC.
2. The DC/DC converter characteristics greatly depend not only on the characteristics of this IC but also on those of externally connected
components, so refer to the specifications of each component and be careful when selecting the components. Be especially careful of the
characteristics of the capacitor used for the load capacity CL and use a capacitor with B characteristics (JIS Standard) or an X7R/X5R (EIA
Standard) ceramic capacitor.
3. Use a ground wire of sufficient strength. Ground potential fluctuation caused by the ground current during switching could cause the IC
operation to become unstable, so reinforce the area around the GND pin of the IC in particular.
4. Mount the externally connected components in the vicinity of the IC. Also use short, thick wires to reduce the wire impedance.
5. When the voltage difference between VIN and VOUT is small, switching energy increases and there is a possibility that the ripple voltage will be
too large. Before use, test fully using the actual device.
6. The CE pin does not have an internal pull-up or pull-down, etc. Apply the prescribed voltage to the CE pin.
7. If other than the inductance and capacitance values listed in the “Typical example” are used, excessive ripple voltage or a drop in efficiency
may result.
8. If other than the inductance and capacitance values listed in the “Typical example” are used, a drop of output voltage at load transient may
cause the short-circuit protection function to activate. Before use, test fully using the actual device.
9. At high temperature, excessive ripple voltage may occur and cause a drop in output voltage and efficiency. Before using at high temperature,
test fully using the actual device
10. At light loads or when IC operation is stopped, leakage current from the Pch driver Tr may cause the output voltage to rise.
11. The average output voltage may vary due to the effects of output voltage ripple caused by the load current. Before use, test fully using the
actual device.
12. If VIN voltage is high or the CL capacitance or load current is large, the output voltage rise time will lengthen when the IC is started, and coil
current overlay may occur during the interval until the output voltage reaches the set voltage (refer to the diagram below).
13. When the IC is started, the short-circuit protection function does not operate during the interval until the VOUT voltage reaches a value near the
set voltage.
14. If the load current is excessively large when the IC is started, it is possible that the VOUT voltage will not rise to the set voltage. Before use, test
fully using the actual device.
11/23
XC9272 Series
■NOTE ON USE (Continued)
15. In actual operation, the maximum on-time depends on the peripheral components, input voltage, and load current. Before use, test fully using
the actual device.
16. When the VIN voltage is turned on and off continuously, excessive rush current may occur while the voltage is on. Before use, test fully using
the actual device.
17. When the VIN voltage is high, the Pch driver may change from on to off before the coil current reaches the PFM switching current (IPFM), or
before the maximum on-time elapses. Before use, test fully using the actual device.
18. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded.
19. Torex places an importance on improving our products and their reliability.
We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems.
12/23
XC9140 (Design Target)
XC9272
Series
■NOTE ON USE (Continued)
●Instructions of pattern layouts
1. To suppress fluctuations in the VIN potential, connect a bypass capacitor (CIN) in the shortest path between the VIN pin and ground pin.
2. Please mount each external component as close to the IC as possible.
3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance.
4. Make sure that the ground traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of
switching may result in instability of the IC.
5. Internal driver transistors bring on heat because of the transistor current and ON resistance of the driver transistors.
●Reference Pattern Layout (USP-6EL)
Top view
Bottom view
●Reference Pattern Layout (SOT-25)
Top view
Bottom view
13/23
XC9272 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output Current
(2) Output Voltage vs. Output Current
14/23
XC9140 (Design Target)
XC9272
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(2) Output Voltage vs. Output Current
(3) Ripple Voltage vs. Output Current
15/23
XC9272 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(4) Output Voltage vs. Ambient Temperature
(5) Supply Current vs. Ambient Temperature
(6) Standby Current vs. Ambient Temperature
16/23
XC9140 (Design Target)
XC9272
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(7) UVLO Release Voltage vs. Ambient Temperature
(8) PFM Switching Current vs. Ambient Temperature
(9) Maximum Frequency vs. Ambient Temperature
17/23
XC9272 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(10) Pch Driver ON Resistance vs. Ambient Temperature
(12) Lx SW "H" Leakage Current vs. Ambient Temperature
(14) CE "High" Voltage vs. Ambient Temperature
18/23
(11) Nch Driver ON Resistance vs. Ambient Temperature
(13) Lx SW "L" Leakage Current vs. Ambient Temperature
(15) CE "Low" Voltage vs. Ambient Temperature
XC9140 (Design Target)
XC9272
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(16) CL Discharge vs. Ambient Temperature
(17) Short Protection Threshold vs. Ambient Temperature
(18) Rising Output Voltage
19/23
XC9272 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(19) Load Transient Response
20/23
XC9140 (Design Target)
XC9272
Series
■PACKAGING INFORMATION
●SOT-25
(unit: mm)
●USP-6EL (unit: mm)
1.8±0.05
1PIN INDENT
0.3±0.05
1
6
2
3
5
4
(0.55)
1.5±0.05
※構造上、端子の一部がパッケージ側面よ
A part of the pin may appear from
り露出する場合があります。
the side of the package because of
its structure.
●USP-6EL Reference Pattern Layout (unit: mm)
●USP-6EL Reference Metal Mask Design (unit: mm)
21/23
XC9272 Series
■MARKING RULE
●SOT-25(Under dot仕様)
dot)
SOT-25(Under
5
4
①
②
1
③
2
④
⑤
3
Magnified
拡大
●USP-6EL
USP-6EL
6
①
1
④
②
⑤
③
2
5
4
3
① represents product series
MARK
PRODUCT SERIES
C
XC9272A/B*****-G
② represents output voltage
MARK
N
OUTPUT VOLTAGE
0.6
PRODUCT SERIES
0.65
XC9272*06***-G
P
0.7
0.75
XC9272*07***-G
R
0.8
0.85
XC9272*08***-G
S
0.9
0.95
XC9272*09***-G
③ represents product type and output voltage type
MARK
PRODUCT TYPE
OUTPUT VOLTAGE TYPE
PRODUCT SERIES
N
Without CL Discharge
Output Voltage {x.x0V} (the 2nd decimal place is “0”)
XC9272A**1**-G
P
Without CL Discharge
Output Voltage {x.x5V} (the 2nd decimal place is “5”)
XC9272A**B**-G
R
With CL Discharge
Output Voltage {x.x0V} (the 2nd decimal place is “0”)
XC9272B**1**-G
S
With CL Discharge
Output Voltage {x.x5V} (the 2nd decimal place is “5”)
XC9272B**B**-G
④⑤ represents production lot number
01~09、0A~0Z、11~9Z、A1~A9、AA~AZ、B1~ZZ
(G, I, J, O, Q, W excluded)
* No character inversion used.
22/23
XC9140 (Design Target)
XC9272
Series
1.
The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2.
The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3.
Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4.
The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or equipment
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and
other transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5.
Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent
personal injury and/or property damage resulting from such failure, customers are required to
incorporate adequate safety measures in their designs, such as system fail safes, redundancy and
fire prevention features.
6.
Our products are not designed to be Radiation-resistant.
7.
Please use the product listed in this datasheet within the specified ranges.
8.
We assume no responsibility for damage or loss due to abnormal use.
9.
All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
23/23
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