TI Designs Compact Full HD 1080p (up to 16

TI Designs
Compact Full HD 1080p (up to 16 Amps) Projection Display Reference
Design using DLP® Pico™ Technology
Design Overview
Design Features
®
This reference design, featuring the DLP Pico™
0.47-inch TRP Full-HD 1080p display chipset and
implemented in the DLP LightCrafter Display 4710
G2 evaluation module (EVM), enables use of full HD
resolution for projection display applications such as
accessory projectors, screenless displays,
interactive displays, wearables (including head
mounted displays), signage, industrial and medical
displays. The chipset used in the design is
comprised of the DLP4710 (.47 1080p) DMD, the
DLPC3439 display controller and the DLPA3005
PMIC/LED driver
Design Resources
TIDA-01226
Design Folder
DLPC3439
Product Folder
DLP4710
Product Folder
DLPA3005
Product Folder
TIDA-00576
Tools Folder
•
•
•
•
•
•
1920 x 1080 resolution
Brightness: 600 RGB lumens @ 16A LED
current
RGB LED-illuminated optical module
Driver board includes DLC3439 controllers,
DLPA3005 PMIC/LED driver
System board includes HDMI and USB
connectivity
PC software GUI to customize display
configurations
Featured Applications
•
•
•
•
•
Screenless TV (mobile smart TV)
Portable home cinema / business projector
Low latency gaming display
Digital signage
Interactive surface display for retail,
restaurant, or gaming applications
Board Image
Block Diagram
Key Test Result Graph
TIDUC88 – August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
1
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1
Key System Specifications
The DLP LightCrafter Display module consists of three subsystems:
1. Light engine – includes the optics, red, green, blue LEDs and a 1920 x 1080 (1080p) DMD
capable of 600 lumens out-of-the-box.
Parameter
Brightness @ Red 12A /
Green 16A / Blue 16A
LED current
Red LED Current
Green / Blue LED Current
Brightness Uniformity
Offset
Focus Range (Wide)
Image diagonal size
Min
Typ.
600
Max
12
16
73
100
40
40
120
100
Unit
Lum
A
A
%
%
inch
inch
Figure 1: Optical engine specification
2. DLP Driver – includes the DLP chipset comprising of DLPC3439 Controller and DLPA3005
PMIC/LED driver with up to 16A LED current.
3. System front end – includes MSP430, ITE HDMI receiver, USB-Serial Bridge Controller and
several connectors for external inputs (HDMI, USB, etc.)
2
2.1
System Description
DLPC3439
The 2x DLPC3439 digital controllers, part of the DLP4710 (.47 1080p) chipset, supports reliable operation of the
DLP4710 digital micromirror device (DMD). The DLPC3439 controller provides a convenient, multi-functional
interface between system electronics and the DMD, enabling small form factor, low power, and high resolution
full HD displays.
Figure 2: Functional Block Diagram
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
2
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2.2
DLPA3005
The DLPA3005 is a highly-integrated power management IC optimized for DLP™ Pico ™Projector systems. The
DLPA3005 supports LED projectors up to 16 A per LED, enabled by an integrated high efficiency buck controller.
Additionally, the drivers control the RGB switches, supporting the sequencing of R, G, and B LEDs. The
DLPA3005 contains five buck converters, two of which are dedicated for DLPC low voltage supplies. Another
dedicated regulating supply generates the three timing-critical DC supplies for the DMD: VBIAS, VRST, and
VOFS.
The DLPA3005 contains several auxiliary blocks which can be used in a flexible way. This enables a tailor-made
Pico Projector system. Three 8-bit programmable buck converters can be used, for instance, to drive projector
FANs or to make auxiliary supply lines. Two LDOs can be used for a lower-current supply, up to 200 mA. These
LDOs are pre-defined to 2.5 V and 3.3 V.
Through the SPI, all blocks of the DLPA3005 can be addressed. Features included are the generation of the
system reset, power sequencing, input signals for sequentially selecting the active LED, IC self-protections, and
an analog MUX for routing analog information to an external ADC.
Figure 3: System Block Diagram
2.3
DLP4710
The DLP4710 digital micromirror device (DMD) is a digitally controlled micro-opto-electromechanical system
(MEMS) spatial light modulator (SLM). When coupled to an appropriate optical system, the DLP4710 DMD
displays a very crisp and high quality image or video. DLP4710 is part of the chipset comprising of the DLP4710
DMD, DLPC3439 display controller and DLPA3000/DLPA3005 PMIC/LED drivers. The compact physical size of the
DLP4710 coupled with the controller and the PMIC/LED driver provides a complete system solution that enables
small form factor, low power, and high resolution HD displays.
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
3
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3
Block Diagram
Figure 4: DLP LightCrafter 4710EVM Block Diagram
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
4
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3.1
Highlighted Products
3.1.1 DLPC3439 Features





Supports Input Image Sizes up to 1080p
24 Bit, Input Pixel Interface Support:
o Parallel Interface
o Pixel Clock up to 150MHz
Pixel Data Processing
o IntelliBright™ Suite of Image Processing Algorithms
o Image Resizing (Scaling)
o Color Coordinate Adjustment
o Programmable Degamma
o Active Power Management Processing
o Color Space Conversion
Auto DMD Parking at Power Down
Compatible with the DLPA3000 and DLPA3005 PMIC/LED Drivers
3.1.2 DLPA3005 Features











High-Efficiency, High-Current RGB LED Driver
Drivers for External Buck FETs up to 16 A
Drivers for External RGB Switches
10-Bit Programmable Current per Channel
Inputs for Selecting Color-Sequential RGB LEDs
Generation of DMD High Voltage Supplies
Two High Efficiency Buck Converters to Generate the DLPC343x and DMD Supply
Three High Efficiency, 8-Bit Programmable Buck Converters for Fan Driver Application or General
Power Supply. General Purpose Buck2 (PWR6 currently supported, others may be available in the
future)
Two LDOs Supplying Auxiliary Voltages
Analog MUX for Measuring internal and external nodes such as a thermistor and reference levels
Monitoring/Protections: Thermal Shutdown, Hot Die, Low-Battery, and Undervoltage Lockout (UVLO)
3.1.3 DLP4710 Features



4
0.47-Inch (11.93-mm) Diagonal Micromirror Array
o 1920 × 1080 Array of Aluminum Micrometer-Sized Mirrors, in an Orthogonal Layout
o 5.4 – Micron Micromirror Pitch
o ±17° Micromirror Tilt (Relative to Flat Surface)
o Bottom Illumination for Optimal Efficiency and Optical Engine Size
o Polarization Independent Aluminum Micromirror Surface
32-Bit SubLVDS Input Data Bus
Dedicated DLPC3439 Display Controller and DLPA3000/DLPA3005 PMIC/LED Drivers for Reliable
Operation
Getting Started Hardware
This getting started procedure assumes that the EVM default conditions are as shipped.
1.
Power up the DLP LightCrafter™ Display 4710 EVM by applying an external DC power supply (19V DC, 4.74
A) to PWR_IN connector (J28).
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
5
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External Power Supply Requirements:
Nom Output voltage: 19 VDC
Max Output Current: 4.74 A
Efficiency Level: V
NOTE: TI recommends using an external power supply that complies with applicable regional safety
standards such as UL, CSA, VDE, CCC, PSE, etc.
2.
Move PS_ON/OFF slide switch (SW28) to the ON position.
+3.3V (D43) and INTZ (D57) LED will indicate when 19V power is applied.
3.
Push ON/OFF switch (SW21) to turn on the DLP LightCrafter™ Display 4710 EVM.
+3.3V (D43), SYS_ON-OFF (D36), M_IRQ (D33) and S_IRQ (D34) LED will indicate that the DLP LightCrafter™
Display 4710 EVM is turned on.
4.
After the DLP LightCrafter™ Display 4710 EVM is turned on, the projector will show a DLP LightCrafter™
Display splash image by default.
5.
The focus and zoom of the image can be adjusted on the optical engine.
Zoom adjustment
Focus adjustment
Figure 5:Optical engine with focus and zoom adjustment
6.
Connect USB to the LightCrafter™ Display 4710 EVM and open the GUI for 4710 EVM on your Computer.
Then you can communicate to the EVM over the GUI software. If needed, please connect a HDMI source to
the EVM.
7.
When turning off the projector, push ON/OFF switch (SW21) and then move slide switch (SW28) to the OFF
position before removing the power cable.
IMPORTANT NOTE: To avoid potential damage to the DMD, it is required to turn off the projector with the
above sequence before disconnecting the power.
5
Getting Started Firmware
The TIDA-01226 reference design needs firmware for the DLPC3439 and the MSP430. The EVM GUI connects
through the USB interface of the Cypress controller to the EVM.
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
6
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5.1
DLPC3439 firmware
The DLPC3439 firmware is stored on the two 64 bit flash devices on the PCB board. The firmware contains the
ARM code, LED sequences, Start up configuration, Splash images and LUT’s (Look up Table).
The firmware can be downloaded on the DLP LightCrafter 4710 EVM tool folder:
http://www.ti.com/tool/dlpdlcr4710evm-g2
5.2
MSP430 code
The MSP430 code is used as a front-end processor in the DLP LightCrafter 4710 EVM. It drives Proj_ON and
configures the DLPC3439 for the external HDMI input.
The full MSP430 code is available under the DLP LightCrafter4710EVM tool folder:
http://www.ti.com/tool/dlpdlcr4710evm-g2
It can be modified by using Code Composer and can be downloaded on the MSP430 with the USB Debugging
Interface.
5.3
DLP LightCrafter GUI
The GUI (Graphical User Interface) allows users to evaluate the capabilities of the DLP chipset by sending I2C
commands to the DLPC3439.
The DLP LightCrafter GUI is available under the DLP LightCrafter4710EVM tool folder:
http://www.ti.com/tool/dlpdlcr4710evm-g2
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
7
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6
Test Setup
Testing of the TIDA-01226 reference design was performed using the DLP LightCrafter Display 4710 EVM-G2
which is the TI’s implementation of the TIDA-01226 reference design. This EVM incorporates the DLP 0.47"
1080p chipset comprising of the DLP4710 DMD, DLPC3439 controller and DLPA3005 PMIC/Led Driver. The EVM
and TI design enable faster development cycles for applications requiring full HD resolution and higher
brightness projection display solutions. The entire test data contained below was measured on one DLP
LightCrafter Display 4710 EVM-G2 to provide an example from a typical unit. Please note that performance will
vary across EVMs due to variations in manufacturing. The performance data is not guaranteed
Figure 6: DLP LightCrafter 4710 EVM-G2
7
7.1
Test Data
Lumens Measurement
This section provides the lumens measured for the EVM, which is the TI’s implementation of
this reference design.
White Point: 6600K
Lumens: 600 (ANSI)
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
8
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7.2
Power Up and Power Down Timing Measurements
Power Up and Power Down timing requirements are described in detail in the DLP4710
datasheet. Key signals measured are PROJ_ON and the power supplies to the DMD- VBIAS,
VOFFSET and VRESET. For more details on the timing requirements please refer the DLP4710
device datasheet.
Both measurements are showing following configuration:
CH 1: PROJ_ON; CH 2: VBIAS; CH 3: VOFS ; CH 4: VRST
Power Up Timing Measurements
Power down Timing Measurements
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
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7.3
Optical engine size
DLP4710 is a key component of the 0.47" 1080p chipset and enables use of full HD resolution
for projection display applications. The optical engine used in this DLPDLCR4710EVM is
designed for +1000 Lumens applications. Dimensions are shown in mm.
Figure 7: 1080p Optical Engine
7.4
Throw Ratio
An optical engine’s throw ratio is defined as the ratio of the distance measured from lens to
screen and the width of the projected image.
Throw Ratio = Distance/Width
The throw ratio for the optical engine used in this ref design is 1.39
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
10
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8
8.1
Design Files
Schematics
To download the Schematics for each board, see the design files at http://www.ti.com/tool/TIDA-01226
LED_ANODE
VIN
VIN
Q15
TP165
VRST_REF
TP166
VBIAS
C312
1uF
TP167
VRST
100
VBIAS
99
VOFS
C317
0.47uF
1
ILLUM_HSIDE_DRIVE
ILLUM_A_SW
DRST_LS_IND
ILLUM_LSIDE_DRIVE
98
ILLUM_A_PGND
DRST_VRST_REF
DMD_VRESET
ILLUM_A_COMP1
ILLUM_A_COMP2
DMD_VBIAS
ILLUM_B_FB
DMD_VOFFSET
ILLUM_B_VIN
VOFS
TP173
ILLUM_B_BOOST
DPP_P1P8V
C319
C308
26
ILLUM_HS_DRV
31
ILLUM_SW
27
ILLUM_LS_DRV
TP164
R575
32
38
ILLUM_A_COMP1
39
ILLUM_A_COMP2
35
LED_ANODE_B
R572
0 DNI
C320
C322
1uF
CW_CLK
CW_CLK
43
CW_PWM
44
0.1uF
45
46
6 SPI1_CLK
30.1/1%
R584
6 SPI1_DIN
6 SPI1_CSZ0
SPI_MISO
47
48
49
6 SPI1_DOUT
DPP_P1P8V
6,11 PROJ_ON
5 PAD_RESETZ
5 PARKZ
6 LED_SEL_1
56
PAD_RESETZ
57
PARKZ
58
R611
300 PWM_IN_CAP
LED_SEL_0
60
LED_SEL_1
61
R592 10k/1%
6 CMP_PWM
6 GPIO10
6 CMP_OUT
C326
6
GPIO_7
R610 0
DNI
0.1uF
TP180
CLK_OUT
ILLUM_B_SW
CW_PWM_OUT
ILLUM_B_PGND
SPI_VIN
ILLUM_B_COMP1
ILLUM_B_COMP2
SPI_CLK
SPI_MISO
CH1_GATE_CTRL
SPI_CS_Z
CH2_GATE_CTRL
SPI_MOSI
CH3_GATE_CTRL
R617 10k DNI
PROJ_ON
59
6 LED_SEL_0
10k/1%
TP163
D50
D591
36
ILLUM_B_SW
DNI
1200pF
CMPR_REF
82
CMP_OUT
81
SENS_LABB
80
LABB_SAMPLE
55
SENS_FOCUS
77
SENS2
78
SENS3
79
CH1_SWITCH_1
PROJ_ON
CH1_SWITCH_2
RESET_Z
INTZ
CH2_SWITCH_1
DGND
CH2_SWITCH_2
CH_SEL_0
CH3_SWITCH_1
CH_SEL_1
CH3_SWITCH_2
ACMPR_REF
RLIM1_1
ACMPR_OUT
RLIM1_2
ACMPR_IN_LABB
RLIM2_1
ACMPR_LABB_SAMPLE
RLIM2_2
ACMPR_IN_1
ACMPR_IN_2
RLIM_K_1
ACMPR_IN_3
RLIM_K_2
RLIM_BOT_K_1
42
THERMAL_PAD
RLIM_BOT_K_2
B240A-13-F
1
2
3.9
3
LLUM_LS_DRV_Q
4
R582 10
THERMISTOR_P R571
0
37
S1
D1
S2
D2
S3
D3
G
D4
8
1
TP176
R585
0
CH1_GATE_CTRL
20
CH2_GATE_CTRL
R586
0
CH3_GATE_CTRL
R587
0
2
TP177
3
CH1_GATE_RED
9
4
10
S1
D1
S2
D2
S3
D3
G
D4
17
1
24
2
25
TP178
3
11
CH2_GATE_GRN
16
4
22
S1
D1
S2
D2
S3
D3
G
D4
5
13
R595
14
0.009
1
2
12
TP181
7
3
4
S1
D1
S2
D2
S3
D3
G
D4
5
7
7
91
V5P0
92
4
V2P5
4.7uF
0.1uF PWR1_B
3.3uH
L16
97
PWR1_SW 95
3
TP210
(DLPC3439_GPIO_12)
94
VIN
C342
C348
C349
22uF
22uF
73
PWR2_OUT
C353
C354
22uF
22uF
72
VIN_LDO
R602
10
C352
1uF
R604
TP191
P5V
PWR3_OUT
VIN_LDO
0
VIN
R608
C360
0
87
0
C363
1uF
89
R609
0 DNI
PWR4_OUT
P3P3V_INTF
DLPC3439 VINTF
TP211
C367
R650
1uF
0
Figure 8: DLPDLCR4710EVM-G2 Schematic
TIDUC88 - August 2016
SUP_5P0V
PWR_VIN
PWR_5P5V
PWR1_VIN
PWR5_VIN
PWR1_BOOST
PWR5_BOOST
PWR1_SWITCH
PWR5_SWITCH
PWR1_PGND
PWR5_PGND
PWR1_FB
PWR5_FB
PWR2_VIN
PWR6_VIN
PWR2_BOOST
PWR6_BOOST
PWR2_SWITCH
PWR6_SWITCH
PWR2_PGND
PWR6_PGND
PWR2_FB
PWR6_FB
PWR3_VIN
PWR7_VIN
PWR3_OUT
PWR7_BOOST
PWR7_SWITCH
P3P3V
DNI
SUP_2P5V
1uF
90
VIN_LDO
R606
10
9
8
7
6
5
4
3
2
1
J40
10
9
8
7
6
5
4
3
2
1
J41
10
9
8
7
6
5
4
3
2
1
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
11
PWR4_VIN
PWR4_OUT
PWR7_PGND
PWR7_FB
1uF
VIN
8
7
ILLUM_5P5V C329
C332
10uF
1uF
83
84
67
69
68
70
71
64
65
63
62
66
470pF
88
C358
C325
0.33uF
76
PWR2_SW 74
DPP_P2P5V
DNI
0.1uF PWR2_B
3.3uH
L18
DPP_P1P8V
TP189
ILLUM_VIN
ILLUM_5P5V
470pF
22uF
SENS_LABB
6 LS2_PWR
10
C346
TP174
R583 0
R598
75
SENS3
0
AGND
PWR_5P5V C333
TP185
1
22uF
VIN_SYSPWR
TP184
2.2uF
C331
PWR1_OUT
C341
C328
DLPA3005
85
93
0
C340
R600
LED_ANODE
ESDA18-1K
5
96
TP172
LED_BLU_CATHODE
D55
6
TP182
22uF
R596
LED_BLU_CATHODE
8
C330
C334
C337
22uF
DLPC3439 1.8V & DMD VDD
LED_ANODE
ESDA18-1K
5
VIN
VIN
0.33uF
LED_GRN_CATHODE
D54
6
86
C318
LED_GRN_CATHODE
8
TP183
C336
DNI
ESDA18-1K
U35-2
1uF
C327
PESD5V0U1BL
R579 0
LED_RED_CATHODE
D53
6
CSD17501Q5A
ED20
6 LS_PWR
LED_ANODE
LED_RED_CATHODE
8
78048-1043 Molex
Red LED Connector
78048-1043 Molex
Green LED Connector
Q19
DPP_P1P1V
(DLPC3439_GPIO_9)
22uF
EXT_RLIM
15
R576
TP209
22uF
CSD17501Q5A
23
TP187
22uF
6
Q18
18
SENS2
DLPC3439 1.1V Core
22uF
7
2
Thermistor
CONN
C315
CSD17501Q5A
t 100k
053261-0271 Molex
C314
Q17
TP175
19
0.01uF
1
2
C313
4300pF
C310
J45
LED_ANODE
DNI
C307
CSD17501Q5A
C321
ILLUM_5P5V
TP170
TP169
R574 30k/1%
TP168
1.5uH
Q16
Connect the RLIM_K pins to SENSE
Resistor(R595) with their own traces.
Also connect the RLIM_BOT_K pins
to the bottom of the SENSE Resistor
with their own traces.
6 THERM_PWR
22uF
5
DNI
CH3_GATE_BLU
(DLPC3439_GPIO_11)
22uF
D52
R578
VIN
C323
21
22uF
6
CSD17309Q3
15pF
TP171
ILLUM_B_COMP2
D4
C304
22uF
7
L14
C309
C311
ILLUM_B_BOOST R580 10
ILLUM_B_COMP1
G
B240A-13-F
34
41
D3
ILLUM_A_SW_L
B0530WS-7
2
33
40
D2
S3
0.1uF
0
10uF
CW_PWM
R591
4
D1
S2
3.9
1uF
R581
1000pF
2
DNI
TP162
DRST_HS_IND
2
VRST
ILLUM_A_BOOST
DRST_VIN
ILLUM_BOOST
28
S1
1
2
3
1
6
DRST_LS
C370
C303
2
DRST_HS
1
10uH
ILLUM_A_VIN
3.9
C302
1
5
L15
DRST_PGND
R570
29
30
C301
2
1uF
D51
MBR0540
ILLUM_A_FB
1
C306
TRP DMD:
VOFS = 10V
VBIAS = 18V
VRST = -14V
ILLUM_HS_DRV_Q
2
2
DRST_5P5V
8
2
4
1
1
DRST_5P5V 3
B0530WS-7
1
10uF
DLPA3005
C300 10uF
10uF
D58
2
U35-1
TP160
VIN
C305
C324
52
50
53
54
51
10uF
VIN
J42
78048-1043 Molex
Blue LED Connector
www.ti.com
8.2
Bill of Materials
To download the Bill of Materials for each board, see the design files at http://www.ti.com/tool/TIDA-01226
Table 1: Bill of Material
Qty
Reference
Value
Part Description
Manufacturer
Manufacturer
Part Number
Alternate Part
PCB
Footprint
47
C6,C49,C75,C190,C191,C225,C226,C2
27,C229,C233,C234,C236,C237,C238,
C248,C250,C286,C287,C288,C308,C3
22,C326,C334,C346,C368,C369,C378,
C379,C380,C381,C382,C383,C387,C3
88,C389,C390,C392,C393,C394,C395,
C396,C397,C398,C420,C423,C424,C4
27
0.1uF
0.10µF ±10% 16V X7R Ceramic
Capacitor
Yageo
CC0402KRX7R
7BB104
311-1338-1-ND
0402
2
75
C79,C89,C90,C91,C92,C93,C94,C95,C
96,C97,C98,C99,C100,C101,C103,C10
4,C105,C106,C107,C108,C109,C110,C
111,C112,C113,C114,C115,C116,C117
,C118,C119,C120,C121,C122,C123,C1
24,C125,C126,C127,C128,C130,C131,
C132,C146,C175,C176,C177,C178,C1
83,C186,C187,C188,C189,C194,C195,
C196,C197,C198,C199,C202,C209,C2
11,C213,C215,C219,C220,C221,C222,
C223,C224,C228,C276,C277,C278,C2
79
0.1uF
0.10µF ±10% 6.3V X5R Ceramic
Capacitor
Yageo
CC0201KRX5R
5BB104
311-1408-1-ND
0201
3
3
C102,C129,C310
0.01uF
10000pF ±10% 25V X7R Ceramic
Capacitor
Yageo
311-1337-1-ND
0402
4
3
C179,C323,C412
10uF
10µF ±10% 25V X5R Ceramic Capacitor
Yageo
311-1869-1-ND
0805
10uF
10µF ±20% 6.3V X5R Ceramic Capacitor
Yageo
CC0603MRX5R
5BB106
311-1448-1-ND
0603
1uF
1µF ±10% 10V X5R Ceramic Capacitor
Yageo
CC0402KRX5R
6BB105
311-1439-1-ND
0402
Item
1
C180,C181,C184,C193,C200,C206,C2
07,C208,C210,C212,C214,C218,C249,
C273,C285
C182,C185,C192,C201,C203,C235,C2
45,C247,C274,C289,C320,C360,C367,
C384,C386,C391
CC0402KRX7R
8BB103
CC0805KKX5R
8BB106
5
15
6
16
7
2
C216,C217
18pF
18pF ±5% 50V C0G, NP0 Ceramic
Capacitor
Yageo
CC0402JRNPO
9BN180
311-1415-1-ND
0402
8
9
C230,C231,C232,C239,C240,C241,C2
0.1uF
0.10µF ±10% 25V X5R Ceramic
Yageo
CC0402KRX5R
311-1697-1-ND
0402
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
12
Note
www.ti.com
70,C417,C419
Capacitor
8BB104
9
2
C262,C410
0.1uF
0.10µF ±10% 50V X7R Ceramic
Capacitor
Yageo
CC0603KRX7R
9BB104
311-1344-1-ND
0603
10
3
C263,C305,C324
10uF
Multilayer Ceramic Capacitors MLCC SMD/SMT 1206 10uF 50volt X5R +/-10%
Yageo
CC1206KKX7R
9BB106
GRM31CR61H106
KA12L
1206
11
1
C264
220uF
Aluminum Electrolytic Capacitors - SMD
50 Volts 220uF 20% 10x10.3
Lelon
VZH221M1HTR1010
12
1
C266
120pF
Multilayer Ceramic Capacitors MLCC SMD/SMT 120pF 50V NPO 5%
Yageo
CC0402JRNPO
9BN121
13
5
C268,C271,C269,C416,C418
22uF
22µF ±10% 25V X5R Ceramic Capacitor
Murata
14
4
C272,C300,C329,C333
10uF
10µF ±20% 10V X5R Ceramic Capacitor
Yageo
15
1
C283
0.22uF
0.22µF ±10% 25V X7R Ceramic
Capacitor
Yageo
16
10
C301,C302,C303,C304,C336,C337,C3
48,C349,C307,C313
22uF
22µF ±20% 35V X5R Ceramic Capacitor
TDK
17
6
C306,C327,C328,C332,C312,C319
1uF
1µF ±10% 50V X5R Ceramic Capacitor
Yageo
18
1
C309
1200pF
1200pF ±5% 50V C0G, NP0 Ceramic
Capacitor
Yageo
19
1
C311
15pF
20
1
C317
0.47uF
21
1
C321
4300pF
22
1
C330
2.2uF
23
1
C331
4.7uF
24
4
C340,C341,C353,C354
22uF
22µF ±20% 6.3V X5R Ceramic Capacitor
Yageo
25
2
C342,C352
470pF
470pF ±10% 50V X7R Ceramic
Capacitor
Yageo
26
2
C358,C363
1uF
1µF ±10% 25V X5R Ceramic Capacitor
Yageo
27
1
C370
1000pF
1µF ±10% 25V X5R Ceramic Capacitor
Yageo
28
1
C411
0.012uF
0.012µF ±10% 50V X7R Ceramic
Yageo
TIDUC88 - August 2016
15pF ±5% 50V C0G, NP0 Ceramic
Capacitor
0.47µF ±10% 50V X5R Ceramic
Capacitor
4300pF ±5% 50V U2J Ceramic Capacitor
2.2µF ±20% 6.3V X5R Ceramic
Capacitor
4.7µF ±20% 6.3V X5R Ceramic
Capacitor
GRM32ER61E2
26KE15L
CC0603MRX5R
6BB106
CC0603KRX7R
8BB224
C3216X5R1V22
6M160AC
CC0603KRX5R
9BB105
CC1206JRNPO
9BN122
CC0402JRNPO
9BN150
CC0603KRX7R
9BB474
GRM1887U1H4
32JA01
CC0402MRX5R
5BB225
CC0402MRX5R
5BB475
CC0603MRX5R
5BB226
CC0603KRX7R
9BB471
CC0402KRX5R
8BB105
CC0603KRX7R
9BB102
Yageo
Yageo
Murata
Yageo
Yageo
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
CC0603KRX7R
13
140VZH221M1HTR10
10
603CC402JRNPO9B
N121
EC-10
0402
490-3889-1-ND
1210
311-1817-1-ND
0603
311-1803-1-ND
0603
445-8045-1-ND
1206
311-1787-1-ND
0603
603CC126JRNPO9B
N122
1206
311-1017-1-ND
0402
UMK107ABJ474K
A-T
0603
490-6397-1-ND
0603
311-1442-1-ND
0402
311-1730-1-ND
0402
311-1815-1-ND
0603
311-1078-1-ND
0603
311-1698-1-ND
0402
311-1080-1-ND
0603
311-1807-1-ND
0603
(6 (c)); (7(c)
I). Date:
03/31/16
(6 (c)); (7(c)
I). Date:
03/31/16
www.ti.com
Capacitor
9BB123
29
1
C413
22uF
22µF ±20% 10V X5R Ceramic Capacitor
Yageo
30
2
C414,C415
4.7uF
4.7µF ±10% 25V X7R Ceramic Capacitor
Yageo
31
1
C425
3300pF
3300pF ±10% 50V X7R Ceramic
Capacitor
Yageo
32
36
ED1,ED2,ED3,ED4,ED5,ED6,ED7,ED8,
ED9,ED10,ED11,ED12,ED13,ED14,ED
15,ED16,ED19,D25,D26,ED21,ED22,E
D17,ED18,ED20,ED23,ED24,ED25,ED
26,ED27,ED36,ED37,ED38,ED39,ED40
,ED41,ED42
PESD5
V0U1B
L.315
TVS DIODE 5VWM SOD882
NXP
33
1
D32
DIODE ARRAY SCHOTTKY 30V
SOT323
34
11
D33,D34,D36,D44,D45,D46,D56,D57,D
66,D67,D43
35
1
D51
36
3
D53,D54,D55
37
2
D58,D59
38
2
D68,D69
BAT54
CW
16213SY
GC/S53
0E2/TR8
MBR05
40
ESDA1
8-1K
B0530
WS-7
SS0540
GMLB1608080070SN1
GMLB1005050120PN8
CC0805MKX5R
6BB226
CC0805KKX7R
8BB475
CC0402KRX7R
9BB332
311-1900-1-ND
0805
311-1885-1-ND
0805
311-1034-1-ND
0402
PESD5V0U1BL.
315
568-4803-1-ND
SOD882
Diodes Inc.
BAT54CW
568-1613-1-ND
SOT323
LED YELLOW-GRN CLEAR 0402 SMD
Everlight
16213SYGC/S530E2/TR8
16213SYGC/S530E3/TR8-ND
0402
DIODE SCHOTTKY 40V 500MA
SOD123
ON Semi
MBR0540
MBR0540T1GOS
CT-ND
SOD123
TVS DIODE 15VWM 34VC SOD523
STMicroelectronic
s
ESDA18-1K
497-10767-1-ND
SOD523
Diodes Inc.
B0530WS-7
PANJIT
SS0540
FERRITE BEAD 70 OHM 0603 1LN
MAG.LAYERS
GMLB-1608080070S-N1
490-5253-1-ND
0603
FERRITE BEAD 120 OHM 0402 1LN
MAG.LAYERS
GMLB-1005050120P-N8
490-4004-1-ND
0402
455-1627-ND
DIODE SCHOTTKY 30V 500MA
SOD323
DIODE SCHOTTKY 40V 500MA
SOD123
39
19
FB1,FB2,FB3,FB5,FB6,FB8,FB9,FB10,
FB11,FB12,FB30,FB31,FB32,FB33,L5,
L6,L7,L8,L9
40
6
FB20,FB22,FB23,FB24,FB25,FB26
41
1
J11
TU3007
WNR04
4 Positions Header, Shrouded Connector
0.098" (2.50mm) Through Hole, Right
Angle Tin
TYU
TU3007WNR-04
42
1
J18
471511101
HDMI Receptacle Connector 19 Position
Surface Mount, Right Angle, Horizontal
Molex
47151-1101
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
14
B0530WS-FDICTND
B0540W-FDICTND
SOD323
SOD123
www.ti.com
TU1501
WNV06
1040608017
6 Positions Header, Shrouded Connector
0.059" (1.50mm) Through Hole Tin
TYU
TU1501WNV-06
CONN FFC FPC 80POS 0.50MM R/A
Molex
104060-8017
TU1501
WNR03S
3 Positions Header, Shrouded Connector
0.059" (1.50mm) Surface Mount, Right
Angle Tin
TYU
TU1501WNR03S
455-1694-2-ND
J24,J43,J32,J33
TU1501
WNV03
3 Positions Header, Shrouded Connector
0.059" (1.50mm) Through Hole Tin
TYU
TU1501WNV-03
455-1658-ND
1
J26
TU1252
WNR08S
8 Positions Header, Shrouded Connector
0.049" (1.25mm) Surface Mount, Right
Angle Tin
TYU
TU1252WNR08S
WM7626TR-ND
48
1
J28
IDJD43B2
CON PWR JCK 2.5 X 6.0MM W/SHLD
HCH
IDJ-D43B2
CP-047BH-ND
49
1
J34
CH8714
2V200
14 Positions Header, Shrouded
Connector 0.100" (2.54mm) Through
Hole Gold
CviLux
CH87142V200
WM6547-ND
50
1
J35
TU5005
WNV1x02
2 Positions Header, Unshrouded,
Breakaway Connector 0.100" (2.54mm)
Through Hole Tin
TYU
TU5005WNV1x02
WM8072-ND
51
3
J40,J41,J42
780481043
Headers & Wire Housings PCB
HEADERS
Molex
78048-1043
52
1
J45
TU1252
WNR02S
2 Positions Header, Shrouded Connector
0.049" (1.25mm) Surface Mount, Right
Angle Tin
TYU
TU1252WNR02S
WM7620TR-ND
53
1
J47
MU05F424
USB - mini B USB 2.0 OTG Receptacle
Connector 5 Position Surface Mount,
Right Angle, Horizontal
OBJECTIVE
MU-05F4-24
WM5461CT-ND
43
1
J21
44
1
J22
45
1
J23
46
4
47
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
15
455-1661-ND
www.ti.com
54
1
J48
TU2001
WNV06
6 Positions Header, Shrouded Connector
0.079" (2.00mm) Through Hole Tin
TYU
TU2001WNV-06
455-1708-ND
55
1
L10
15uH
FIXED IND 15UH 6.25A 45 MOHM SMD
MAG.LAYERS
MMD-10DZ150M-M1
SRP1038A150MCT-ND
56
1
L11
2.2uH
Fixed Inductors XFL3012 Low DCR Ind
2.2 uH 20 % 1.9 A
MAG.LAYERS
MLPS-3015-2R2
994-XFL3012222MEC
57
1
L14
1.5uH
FIXED IND 1.5UH 23A 3.16 MOHM
MAG.LAYERS
58
1
L15
10uH
FIXED IND 10UH 1.8A 243 MOHM SMD
MAG.LAYERS
59
2
L16,L18
3.3uH
FIXED IND 3.3UH 6A 30 MOHM SMD
MAG.LAYERS
60
1
L21
CMM21
T900M-N
CMC 90 OHM 300MA 2 LN SMD
Chilisin
61
2
Q4,Q7
MOSFET N-CH 60V 0.36A SOT-23
NXP
62
1
Q8
MOSFET N-CH 20V 230MA SOT523
Diodes Inc.
63
1
Q15
MOSFET N-CH 30V 60A 8SON
64
4
Q16,Q17,Q18,Q19
2N7002
P,215
DMN26
D0UT
CSD17
309Q3
CSD17
501Q5A
65
2
Q20,Q21
BCP68
66
2
Q22,Q23
67
6
RP1,RP2,RP3,RP4,RP5,RP6
45
R1,R2,R6,R139,R149,R162,R172,R173
,R175,R176,R179,R209,R210,R349,R3
50,R351,R365,R367,R432,R433,R447,
R612,R651,R652,R661,R662,R665,R6
66,R667,R668,R670,R671,R677,R679,
R680,R685,R693,R699,R704,R706,R7
08,R769,R770,R795,R729
68
TIDUC88 - August 2016
MMBT2
222ALT
1G
YC124JR0733R
10K
MMD-12EZ1R5M-V1
MMD-04BZ100M-S1
MMD-06CZ3R3M-V1
CMM21T-900MN
283-4548-1-ND
SRP4020TA100MTR-ND
541-1009-1-ND
445-5193-1-ND
568-5818-1-ND
SOT23
DMN26D0UT
DMN26D0UT7DICT-ND
SOT523
Texas Instruments
CSD17309Q3
296-27250-1-ND
8SON
MOSFET N-CH 30V 100A 8SON
Texas Instruments
CSD17501Q5A
296-28437-1-ND
8SON
TRANS NPN 20V 1A SOT223
NXP
BCP68
568-6107-1-ND
SOT223
TRANS NPN 40V 0.6A SOT23
ON Semi
MMBT2222ALT
1G
MMBT2222ALT1G
OSCT-ND
SOT23
RES ARRAY 4 RES 33 OHM 0804
Yageo
YC124-JR0733R
YC124J-33CT-ND
0402*4
RES SMD 10K OHM 5% 1/16W 0402
Yageo
RC0402JR0710K
11-10KJRCT-ND
0402
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
2N7002P,215
16
www.ti.com
69
119
70
21
71
22
72
2
R9,R109,R116,R120,R125,R140,R141,
R171,R208,R211,R234,R235,R237,R2
39,R241,R242,R243,R356,R358,R359,
R366,R368,R376,R377,R379,R387,R3
88,R389,R394,R395,R396,R397,R398,
R399,R400,R402,R403,R404,R406,R4
08,R410,R411,R412,R413,R414,R415,
R416,R417,R419,R425,R427,R430,R4
31,R435,R451,R452,R477,R478,R487,
R488,R504,R505,R521,R525,R533,R5
34,R537,R538,R539,R540,R541,R542,
R571,R579,R583,R604,R614,R615,R6
23,R629,R630,R631,R632,R636,R637,
R638,R640,R641,R643,R644,R646,R6
50,R657,R659,R663,R664,R672,R673,
R674,R676,R678,R682,R683,R684,R6
87,R688,R696,R702,R774,R775,R778,
R779,R782,R798,R654,R655,R675,R6
19,R621
R12,R51,R52,R67,R68,R69,R71,R72,R
73,R74,R75,R76,R121,R122,R123,R16
4,R182,R184,R186,R344,R584
R35,R36,R37,R60,R63,R64,R65,R117,
R118,R119,R142,R143,R169,R183,R1
85,R189,R345,R373,R393,R401,R436,
R656
R114,R115
0
RES SMD 0.0OHM JUMPER 1/16W
0402
Yageo
RC0402JR070R
311-0.0JRCT-ND
0402
30.1
RES SMD 30.1 OHM 1% 1/16W 0402
Yageo
RC0402FR0730R1
YAG3111CT-ND
0402
100K
RES SMD 100K OHM 5% 1/16W 0402
Yageo
RC0402JR07100K
311-100KJRCTND
0402
43
RES SMD 43 OHM 5% 1/16W 0402
Yageo
311-43JRCT-ND
0402
73
6
R124,R126,R127,R136,R206,R207
7.5K
RES SMD 7.5K OHM 1% 1/16W 0402
Yageo
74
1
R348
300K
RES SMD 300K OHM 1% 1/16W 0402
Yageo
75
3
R352,R524,R474
47K
RES SMD 47K OHM 5% 1/16W 0402
Yageo
76
1
R355
2M
RES SMD 2M OHM 5% 1/16W 0402
Yageo
77
1
R357
22K
RES SMD 22K OHM 1% 1/16W 0402
Yageo
78
6
R360,R361,R363,R364,R362,R622
33
RES SMD 33 OHM 5% 1/16W 0402
Yageo
79
1
R375
4.75K
RES SMD 4.75K OHM 1% 1/16W 0402
Yageo
80
2
R378,R785
1M
RES SMD 1M OHM 1% 1/16W 0402
Yageo
81
1
R380
1.5K
RES SMD 1.5K OHM 1% 1/16W 0402
Yageo
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
RC0402JR0743R
RC0402FR077K5
RC0402FR07300K
RC0402JR0747K
RC0402JR072M
RC0402FR0722K
RC0402JR0733R
RC0402FR074K75
RC0402FR071M
RC0402FR071K5
17
311-7.50KLRCTND
311-300KLRCTND
0402
0402
311-47KJRCT-ND
0402
YAG3295CT-ND
0402
311-22.0KLRCTND
0402
311-33JRCT-ND
0402
311-4.75KLCT-ND
0402
311-1.00MLRCTND
311-1.50KLRCTND
0402
0402
www.ti.com
82
1
R381
3K
RES SMD 3K OHM 1% 1/16W 0402
Yageo
83
6
R383,R385,R613,R616,R689,R691
180
RES SMD 180 OHM 5% 1/16W 0402
Yageo
84
5
R437,R479,R526,R527,R528
390
RES SMD 390 OHM 5% 1/16W 0402
Yageo
85
1
R443
470K
RES SMD 470K OHM 1% 1/16W 0402
Yageo
86
5
R472,R575,R596,R600,R606
0
RES SMD 0.0 OHM JUMPER 1/4W 1206
Yageo
87
2
R480,R471
215K
RES SMD 215K OHM 1% 1/16W 0402
Yageo
88
1
R482
47.5K
RES SMD 47.5K OHM 1% 1/16W 0402
Yageo
89
4
R529,R530,R635,R749
2.2K
RES SMD 2.2K OHM 1% 1/16W 0402
Yageo
90
2
R570,R572
3.9
RES SMD 3.9 OHM 5% 1/10W 0603
Yageo
91
1
R574
30K
RES SMD 30K OHM 1% 1/16W 0402
Yageo
92
1
R576
100K
THERMISTOR NTC 100K OHM 1% 0402
THINKING
93
1
R578
3.9
Thick Film Resistors - SMD 3.9 OHM 5%
Yageo
94
2
R580,R582
10
RES SMD 10 OHM 1% 1/16W 0402
Yageo
95
3
R585,R586,R587
0
RES SMD 0.0OHM JUMPER 1/10W
0603
Yageo
96
2
R591,R592
10K
RES SMD 10K OHM 1% 1/16W 0402
Yageo
97
1
R595
0.009
Current Sense Resistors - SMD 3watts
.009ohms 1%
Ralec
98
2
R598,R602
10
RES SMD 10 OHM 1% 1/10W 0603
Yageo
99
1
R611
300
RES SMD 300 OHM 5% 1/16W 0402
Yageo
100
8
R743,R761,R762,R763,R765,R767,R7
68,R797
3.3K
RES SMD 3.3K OHM 5% 1/16W 0402
Yageo
101
1
R744
442
RES SMD 442 OHM 1% 1/10W 0603
Yageo
102
1
R745
140K
RES SMD 140K OHM 1% 1/10W 0603
Yageo
103
1
R747
30.9K
RES SMD 30.9K OHM 1% 1/16W 0402
Yageo
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
RC0402FR073K
RC0402JR07180R
RC0402JR07390R
RC0402FR07470K
RC1206JR070R
RC0402FR07215K
RC0402FR0747K5
RC0402FR072K2
RC0603JR073R9
RC0402FR0730K
TSM0A104F39H
1RZ
RC1210JR073R9
RC0402FR0710R
RC0603FR070R
RC0402FR0710K
LR251223R009F4
RC0603FR0710R
RC0402JR07300R
RC0402JR073K3
RC0603FR07442R
RC0603FR07140K
RC0402FR0730K9
18
311-3KLRCT-ND
0402
311-180JRCT-ND
0402
311-390JRCT-ND
0402
311-470KLRCTND
0402
311-0.0ERCT-ND
1206
YAG3055CT-ND
0402
311-47.5KLRCTND
311-2.20KLRCTND
0402
0402
311-3.9GRCT-ND
0603
311-30.0KLRCTND
0402
490-4803-2-ND
0402
603-RC1210JR073R9L
1210
311-10.0LRCT-ND
0402
311-0.0HRCT-ND
0603
311-10.0KLRCTND
71WSLP25129L000
FEA
311-10.0HRCTND
0402
2512
0603
311-300JRCT-ND
0402
311-3.3KJRCT-ND
0402
311-442HRCT-ND
0603
311-140KHRCTND
0603
YAG3110CT-ND
0402
(7(c) I).
Date:
05/01/16
www.ti.com
104
1
R793
75K
RES SMD 75K OHM 1% 1/16W 0402
Yageo
RC0402FR0775K
311-75KLRCT-ND
105
1
SW21
STS-D5
SWITCH TACTILE SPST-NO 0.05A 12V
HCH
STS-D5
EG4375CT-ND
SWITCH SLIDE SPDT 5A 120V
Dawning
DS_13P_S044
EG2478-ND
IC CLK BUFFER 1:2 250MHZ 8TSSOP
Texas Instruments
CDCLVC1102P
W
296-27610-1-ND
8-TSSOP
IC BUFF/DVR NON-INV 3.6V SC705
Texas Instruments
SN74AUP1G07
DCKR
296-18256-1-ND
SC70-5
IC FLASH 64MBIT 104MHZ 8SOIC
Winbond
W25Q64FVSSI
G
W25Q64FVSSIGND
8-SOIC
IC REG LDO 3.3V 0.8A SOT223
Texas Instruments
LM1117IMPX3.3/NOPB
LM1117IMPX3.3/NOPBCT-ND
SOT-223
IC EEPROM 2KBIT 400KHZ 8SOIC
Microchip
24LC02
24LC024TI/SNCT-ND
8-SOIC
IC SWITCH PWR DIST SNGL SOT23-5
Texas Instruments
TPS2061DBV
296-23968-1-ND
SOT23-5
HDMI Receiver
ITE Tech Inc
IT6801FN
Contact Business
Unit
76-QFN
IC REG LDO 1.2V 0.2A 5SOT
Texas Instruments
TLV70012DDC
296-27218-1-ND
SOT23-5
IC LV DUAL FET MUX/DEMUX 16SSOP
Texas Instruments
SN74CBTLV325
7D
296-9135-1-ND
16-SOIC
IC REG LDO 3.3V 0.2A 5SOT
Texas Instruments
TLV70033DDC
296-27937-1-ND
SOT23-5
IC REG BCK ADJ 3A SYNC
8SOPWRPAD
Texas Instruments
TPS54335ADD
AR
TPS54335ADDAR
-ND
8-SOIC
IC REG BCK ADJ 1.5A SYNC SOT23-5
Texas Instruments
TLV62565DBVR
TLV62565DBVRND
SOT23-5
IC MCU 16BIT 64KB FLASH 64VQFN
Texas Instruments
MSP430F5514I
RGC
296-31693-1-ND
64-QFN
IC PMIC/LED DRIVER DLP 100HTQFP
Texas Instruments
DLPA3005DPF
D
296-43149-1-ND
100-HTQFP
IC CTRLR DGRL DPP3439 176DLP
Texas Instruments
DLPC3439
296-42180-5-ND
201-VFBGA
106
1
SW28
107
1
U11
108
12
U15,U25,U26,U36,U37,U50,U51,U52,U
53,U54,U55,U56
109
2
U16,U18
110
1
U20
111
1
U21
112
1
U22
113
1
U23
114
1
U24
115
1
U27
116
2
U29,U47
117
1
U32
118
1
U33
119
1
U34
120
1
U35
121
2
U39,U40
TIDUC88 - August 2016
DS_13
P_S044
CDCLV
C1102P
W
SN74A
UP1G0
7DCKR
W25Q6
4FVSSI
G
LM1117
IMPX3.3/NO
PB
24LC02
TPS206
1DBV
IT6801
FN
TLV700
12DDC
SN74C
BTLV32
57D
TLV700
33DDC
TPS543
35ADD
AR
TLV625
65DBV
R
MSP43
0F5514I
RGC
DLPA3
005DPF
D
DLPC3
439
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
19
0402
www.ti.com
122
1
U44
123
2
U45,U46
124
1
U48
125
1
U49
126
1
U62
127
1
U65
128
1
X3
129
1
130
TXS010
2DCU
SN74A
VC4T77
4PWR
CY7C6
521532LTXI
SN74L
VC1G0
6DCK
LM2940
IMP-5
SN74L
VC1G0
8DCK
IC VOLT-LEVEL TRANSLATOR US8
Texas Instruments
TXS0102DCU
296-21931-1-ND
8-VSSOP
IC BUS TRANSCVR 4BIT DL 16TSSOP
Texas Instruments
SN74AVC4T774
PWR
296-24739-1-ND
16-TSSOP
IC USB TO SERIAL BRIDGE 32QFN
Cypress
CY7C6521532LTXI
CY7C6521532LTXI-ND
32-QFN
IC INVERTER SINGLE 1INPUT SC705
Texas Instruments
SN74LVC1G06
DCK
296-8484-1-ND
SC70-5
IC REG LDO 5V 1A SOT223
Texas Instruments
LAM2940IMP-5
LM2940IMP5.0/NOPBCT-ND
SOT-223
IC GATE AND 1CH 2-INP SC-70-5
Texas Instruments
SN74LVC1G08
DCK
296-11602-1-ND
SC70-5
24MHz
OSC XO 24.000MHZ CMOS SMD
YOKE
535-13158-1-ND
3.2*2.5mm
Y1
27MHz
27MHz ±30ppm Crystal 18pF 50 Ohm
YOKE
887-1093-1-ND
5*3.2mm
0
C11,C12,C13,C14,C204,C205,C246,C2
75,C385
0.1uF
311-1338-1-ND
0402
131
0
C318,C325
0.33uF
311-1683-1-ND
0402
132
0
C426
33nF
311-1695-2-ND
0402
133
0
D50,D52
134
0
FB4,FB7
135
0
FB21
136
0
J20
137
0
R3,R4,R107,R108,R128,R129,R382,R3
84,R653,R669,R681,R694,R698,R707,
R709,R790,R791,R792,R390,R374,R4
85,R486,R784,R617,R794,R353
TIDUC88 - August 2016
B240A13-F
GMLB1608080070SN1
GMLB1005050120PN8
TU5005
WNV1x02
10K
0.10µF ±10% 16V X7R Ceramic
Capacitor
0.33µF ±10% 6.3V X5R Ceramic
Capacitor
0.033µF ±10% 16V X5R Ceramic
Capacitor
SO3225024000-F1ABBA-YA
S5032B027000-FA-1630-YA
CC0402KRX7R
7BB104
CC0402KRX5R
5BB334
CC0402KRX5R
7BB333
Yageo
Yageo
Yageo
DIODE SCHOTTKY 40V 2A SMA
Diodes Inc.
B240A-13-F
B240A-FDICT-ND
DO-214AC,
SMA
FERRITE BEAD 70 OHM 0603 1LN
MAG.LAYERS
GMLB-1608080070S-N1
490-5253-1-ND
0603
FERRITE BEAD 120 OHM 0402 1LN
MAG.LAYERS
GMLB-1005050120P-N8
490-4004-1-ND
0402
2 Positions Header, Unshrouded,
TYU
TU5005WNV1x02
WM8072-ND
RES SMD 10K OHM 5% 1/16W 0402
Yageo
RC0402JR0710K
11-10KJRCT-ND
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
20
0402
www.ti.com
138
0
R131,R132,R145,R148,R150,R151,R1
77,R178,R197,R198,R220,R221,R240,
R354,R386,R392,R409,R418,R481,R4
89,R535,R536,R610,R618,R620,R624,
R639,R658,R660,R686,R690,R692,R7
01,R740,R757,R758,R759,R760,R764,
R766,R771,R772,R780,R781,R799,R5
81,R609,R695,R697,R700,R703,R705,
R776,R777,R796
139
0
R369,R370,R371,R372
100
RES SMD 100 OHM 5% 1/20W 0201
Yageo
140
0
R407,R483,R788,R789
100K
RES SMD 100K OHM 5% 1/16W 0402
Yageo
141
0
R608,R750
0
RES SMD 0.0 OHM JUMPER 1/4W 1206
Yageo
142
0
R783
330
RES SMD 330 OHM 5% 1/16W 0402
Yageo
IC BUFF/DVR NON-INV 3.6V SC705
Texas Instruments
Yageo
0
RES SMD 0.0OHM JUMPER 1/16W
0402
Yageo
143
0
U28,U63
SN74A
UP1G0
7DCKR
144
0
R144
7.5K
RES SMD 7.5K OHM 1% 1/16W 0402
Yageo
RC0402JR070R
311-0.0JRCT-ND
0402
311-100NCT-ND
0201
311-100KJRCTND
0402
311-0.0ERCT-ND
1206
311-330JRCT-ND
0402
SN74AUP1G07
DCKR
296-18256-1-ND
SC70-5
RTT027501FTH
311-7.50KLRCTND
Ralec
311-1602-1-ND
0201
445-8045-1-ND
1206
RC0201JR07100R
RC0402JR07100K
RC1206JR070R
RC0402JR07330R
145
0
C284
2.2nF
2200pF ±10% 16V X7R Ceramic
Capacitor
146
0
C314,C315
22uF
22µF ±20% 35V X5R Ceramic Capacitor
TDK
147
0
J29,J30
3 Positions Header, Unshrouded
TYU
TU5005WNV1x03
WM8073-ND
148
0
U64
IC VOLT SUPERVISOR ADJ 6SON
Texas Instruments
TPS3808G01D
RV
296-23656-1-ND
TIDUC88 - August 2016
TU5005
WNV1x03
TPS380
8G01D
RV
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
CC0201KRX7R
7BB222
C3216X5R1V22
6M160AC
21
6-SON
www.ti.com
8.3
PCB Layout Recommendations
The layout for the TIDA-01226 has been created in PADS. The PCB has been designed to fit the form factor of
the optical engine.
8.3.1 Layout Prints
To download the Layout Prints for each board, see the design files at http://www.ti.com/tool/TIDA-01226
TOP SILKSCREEN
Figure 9: Silkscreen TOP
TOP SOLDER MASK
Figure 10: Solder Mask TOP
TOP LAYER
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
22
www.ti.com
Figure 11: Top Layer
GROUND PLANE LAYER 2
Figure 12: Layer 2 GND
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
23
www.ti.com
SIGNAL LAYER 3
Figure 13: Layer 3 Signal
SIGNAL LAYER 4
Figure 14: Layer 4 Signal
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
24
www.ti.com
PWR LAYER 5
Figure 15: PWR Layer 5
BOTTOM LAYER
Figure 16: Bottom Layer
BOTTOM SOLDER MASK
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
25
www.ti.com
Figure 17: Bottom Solder Mask
BOTTOM SILKSCREEN
Figure 18: Bottom Silkscreen
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
26
www.ti.com
MECHANICAL DIMENSIONS
Figure 19: Mechanical Dimensions
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
27
www.ti.com
8.4
PADS Project
The PADS project files for each board can be downloaded from http://www.ti.com/tool/TIDA-01226
Figure 20: Layout
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
28
www.ti.com
8.5
Layout Guidelines
The layout guidelines shown here are subsets of the guidelines included in the component datasheets. Please
also refer to the DLPC3439, DLP4710 and DLPA3005 datasheet for more information.
8.5.1 DLPC3439 Layout Guidelines
TI recommends 1-oz. copper planes in the PCB design to achieve needed thermal connectivity.
8.5.1.1 PCB layout Guidelines for Internal ASIC PLL Power
The following guidelines are recommended to achieve desired ASIC performance relative to the internal PLL.
Each DLPC3439 contains 2 internal PLLs which have dedicated analog supplies (VDD_PLLM , VSS_PLLM,
VDD_PLLD, VSS_PLLD). As a minimum, VDD_PLLx power and VSS_PLLx ground pins should be isolated using a
simple passive filter consisting of two series ferrites and two shunt capacitors (to widen the spectrum of noise
absorption). It’s recommended that one capacitor be a 0.1uf capacitor and the other be a 0.01-µF capacitor. All
four components should be placed as close to the ASIC as possible but it’s especially important to keep the
leads of the high frequency capacitors as short as possible. Note that both capacitors should be connected
across VDD_PLLM and VSS_PLLM / VDD_PLLD and VSS_PLLD respectfully on the ASIC side of the ferrites.
The characteristics for the ferrite beads should be as follows:
 DC resistance less than 0.40 Ω
 Impedance at 10 MHz equal to or greater than 180 Ω
 Impedance at 100 MHz equal to or greater than 600 Ω
The PCB layout is critical to PLL performance. It is vital that the quiet ground and power are treated like analog
signals. Therefore, VDD_PLLM and VDD_PLLD must be a single trace from each DLPC3439 to both capacitors
and then through the series ferrites to the power source. The power and ground traces should be as short as
possible, parallel to each other, and as close as possible to each other.
Figure 21: PLL Filter Layout
8.5.1.2 DLPC3439 Reference Clock
The DLPC3439 requires an external reference clock to feed its internal PLL. A crystal oscillator can supply this
reference. For flexibility, the DLPC3439 accepts either of two reference clock frequencies, but both must have a
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
29
www.ti.com
maximum frequency variation of ±200 ppm (including aging, temperature, and trim component variation). The
two DLPC3439 devices require a single dedicated oscillator where the oscillator output drives both DLPC3439
devices. The oscillator must drive the PLL_REFCLK_I pin on each DLPC3439 and the PLL_REFCLK_O pins should
be left unconnected. The external oscillator must be able to drive at least a 15-pF load. Routing length from the
oscillator to each DLPC3439 should be closely matched.
8.5.1.3 Number of Layer Changes


Single-ended signals: Minimize the number of layer changes
Differential signals: Individual differential pairs can be routed on different layers, but the signals of a
given pair should not change layers.
8.5.1.4 Terminations





No external termination resistors are required on DMD_HS differential signals.
The DMD_LS_CLK and DMD_LS_WDATA signal paths should include a 43-Ω series termination resistor
located as close as possible to the corresponding ASIC pins.
The DMD_LS_RDATA signal path should include a 43-Ω series termination resistor located as close as
possible to the corresponding DMD pin.
DMD_DEN_ARSTZ does not require a series resistor.
Please refer to the DLPC3439 datasheet for length specifications.
8.5.1.5 Routing Vias and Stubs





There should be no more than two vias on any DMD_HS_signal.
Any and all vias on DMD_HS signals should be located as close to the ASIC as possible.
There should be now more than two vias on the DMD_LS_CLK and DMD_LS_WDATA signals.
Any and all vias on the DMD_LS_CLK and DMD_LS_WDATA signals should be located as close to the
ASIC as possible.
Stubs should be avoided.
8.5.2 DLPA3005 Layout Guidelines
For switching power supplies, the layout is an important step in the design, especially when it concerns high
peak currents and high switching frequencies. If the layout is not carefully done, the regulator could show
stability issues and/or EMI problems. Therefore, it is recommended to use wide and short traces for high
current paths and for their return power ground paths. For the DMD HV regulator, the input capacitor, output
capacitor, and the inductor should be placed as close as possible to the IC. In order to minimize ground noise
coupling between different buck converters it is advised to separate their grounds and connect them together
at a central point under the part. For the DMD HV regulator, the recommended value for the capacitors is 1 µF
for VRST and VOFS, 470 nF for VBIAS. The inductor value is 10 µH.
The high currents of the buck converters concentrate around pins VIN, SWITCH and PGND (Figure 22). The
voltage at the pins VIN, PGND and FB are DC voltages while the pin SWITCH has a switching voltage between
VIN and PGND. When the FET betweenpins 52 – 53 is closed the red line indicates the current flow while the
blue line indicates the current flow when the FET between pins 53 – 54 is closed. These paths carry the highest
currents and must be kept as short as possible.
For the LDO supply to the DMD, it is recommended to use a 1 µF/16 V capacitor on the input and a 10 µF/6.3 V
capacitor on the output of the LDO assuming an input voltage of 12 V. For LDO bucks, it is recommended to use
a 1 µF/16 V capacitor on the input and a 1 µF/6.3 V capacitor on the output of the LDO.
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
30
www.ti.com
Figure 22: High AC Current Paths in a Buck Converter
The trace to the VIN pin carries high AC currents. Therefore the trace should have the lowest possible resistance
to prevent voltage drop across the trace. Additionally the decoupling capacitors should be placed as close to the
VIN pin as possible. The SWITCH pin is connected back and forth between the VIN or GND. This means a square
wave voltage is present on the SWITCH pin with amplitude of VIN, and containing high frequencies. This can
lead to EMI problems if not properly handled. To reduce EMI problems a snubber network (RSN7 & CSN7) is
placed at the SWITCH pin to prevent and/or suppress unwanted high frequency ringing at the moment of
switching. The PGND pin sinks high current and should also be connected to a star ground point such that it
does not interfere with other ground connections.
The FB pin is the sense connection for the regulated output voltage which is a DC voltage; no current is flowing
through this pin. The voltage on the FB pin is compared with the internal reference voltage in order to control
the loop. The FB connection should be made at the load such that I•R drop is not affecting the sensed voltage.
8.5.2.1 SPI Connections
The SPI interface consists of several digital lines and the SPI supply. If routing of the interface lines is not done
properly, communication errors can occur. The SPI lines should not be routed close to potential interfering
sources. Noise cntamination can be prevented by ensuring that the SPI ground line is routed together with the
digital lines as much as possible to the respective pins. The SPI interface should have a dedicated ground
connection to the DGND of the DLPA3005 (Figure 23). This prevents ground noise between SPI ground
references of DLPA3005 and DLPC due to the high current in the system.
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
31
www.ti.com
Figure 23: SPI Connections
Interfering sources should be kept away from the interface lines as much as possible. Especially high current
lines such as neighboring PWR_7 should be routed carefully. If PWR_7 is routed too close to for instance the
SPI_CLK it could lead to false clock pulses and thus communication errors.
8.5.2.2 RLIM Routing
RLIM is used to sense the LED current. To accurately measure the LED current, the RLIM _K_1,2 lines should be
connected close to the top-side of measurement resistor RLIM, while RLIM_BOT_K_1,2 should be connected
close to the bottom-side of RLIM. The switched LED current is running through RLIM. Therefore a low-ohmic
ground connection for RLIM is strongly advised.
8.5.2.3 LED Connection
The wiring from the external RGB switches to the LEDs carries large switching currents. Special attention needs
to be paid to these connections.
Two perspectives apply to the LED-to-RGB switches wiring:
1. The resistance of the wiring, Rseries
2. The inductance of the wiring, Lseries
The location of the parasitic series impedances are depicted in Figure 24.
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
32
www.ti.com
Figure 24: Parasitic Inductance (LSeries) and Resistance (RSeries) in Series with LED
Currents up to 16 A can run through the wires connecting the LEDs to the RGB switches. Even small resistances
in these connections can cause noticeable power dissipation. Assuming 16A of LED current, every 10 mΩ of
series resistance results in a parasitic power dissipation of 2.5 W. This might cause PCB heating, but more
important overall system efficiency is deteriorated.
Additionally the resistance of the wiring might impact the control dynamics of the LED current. It should be
noted that the routing resistance is part of the LED current control loop. The LED current is controlled by VLED.
For a small change in VLED (ΔVLED) the resulting LED current variation (ΔILED) is given by the total differential
resistance in that path, as:
where
rLED is the differential resistance of the LED
Ron_SW_P,Q,R the on resistance of the strobe decoder switch.
In this expression Lseries is ignored since realistic values are usually too low to cause any noticeable impact on
the power dynamics. All the comprising differential resistances are in the range of 12.5 mΩ to several 100’s mΩ.
Without paying special attention a series resistance of 100 mΩ can easily be obtained. It is advised to keep this
series resistance sufficiently low, i.e. <10 mΩ. The series inductance plays an important role when considering
the switched nature of the LED current. While cycling through R, G and B LEDs, the current through these
branches is turned-on and turned-off in short time duration. Specifically turning off is fast. A current of 16 A
goes to 0 A in a matter of 50 ns. This implies a voltage spike of about 1 V for every 5 nH of parasitic inductance.
It is recommended to minimize the series inductance of the LED wiring by:
 Short wires
 Thick wires / Multiple parallel wires
 Small enclosed area of the forward and return current path
If the inductance cannot be made sufficiently low, a Zener diode needs to be used to clamp the drain voltage of
the RGB switch such it does not surpass the absolute maximum rating. The clamping voltage need to be chosen
between the maximum expected VLED and the absolute maximum rating. Be sure to maintain sufficient margin
of the clamping voltage relative to the mentioned minimum and maximum voltage.
8.5.3 DLP4710 Layout Guidelines
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
33
www.ti.com
There are no specific layout guidelines for the DMD as the DMD is typically connected using a board to board
connector to and a flex cable. The flex cable provides the interface of data and ctrl signals between the
DLPC3439 controller and the DLP4710 DMD. Some layout guideline for the flex cable interface to the DMD are:
 Match lengths for the LS_WDATA and LS_CLK signals.
 Minimize vias, layer changes, and turns for the HS bus signals.
 Minimum of two 220-nF decoupling capacitor close to VBIAS.
 Minimum of two 220-nF decoupling capacitor close to VRST.
 Minimum of two 220-nF decoupling capacitor close to VOFS.
 Minimum of four 220-nF decoupling capacitor close to VDDI and VDD.
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
34
www.ti.com
8.6
Gerber files
To download the Gerber files for each board, see the design files at http://www.ti.com/tool/TIDA-01226
Figure 25: Gerber Layer 1
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
35
www.ti.com
8.7
Assembly Drawings
To download the Assembly Drawings for each board, see the design files at http://www.ti.com/tool/TIDA-01226
Figure 26: Assembly TOP
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
36
www.ti.com
9
Software Files
To download the software files for this reference design, please see the link at http://www.ti.com/tool/DLPDLCR4710EVMG2
10 References
1. Texas Instruments E2E Community, https://e2e.ti.com/support/dlp__mems_micro-electromechanical_systems
2. Texas Instruments DLPC3439 datasheet http://www.ti.com/lit/ds/symlink/dlpc3439.pdf
3. Texas Instruments DLPA3005 datasheet http://www.ti.com/lit/ds/symlink/dlpa3005.pdf
4. Texas Instruments DLP4710 datasheet http://www.ti.com/lit/ds/symlink/dlp4710.pdf
TIDUC88 - August 2016
TIDA-01226
Copyright © 2016, Texas Instruments Incorporated
37
IMPORTANT NOTICE FOR TI REFERENCE DESIGNS
Texas Instruments Incorporated (‘TI”) reference designs are solely intended to assist designers (“Designer(s)”) who are developing systems
that incorporate TI products. TI has not conducted any testing other than that specifically described in the published documentation for a
particular reference design.
TI’s provision of reference designs and any other technical, applications or design advice, quality characterization, reliability data or other
information or services does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products, and
no additional obligations or liabilities arise from TI providing such reference designs or other items.
TI reserves the right to make corrections, enhancements, improvements and other changes to its reference designs and other items.
Designer understands and agrees that Designer remains responsible for using its independent analysis, evaluation and judgment in
designing Designer’s systems and products, and has full and exclusive responsibility to assure the safety of its products and compliance of
its products (and of all TI products used in or for such Designer’s products) with all applicable regulations, laws and other applicable
requirements. Designer represents that, with respect to its applications, it has all the necessary expertise to create and implement
safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the
likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any systems
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Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special
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