Intel® NUC Kit NUC6i7KYK
Technical Product Specification
September 2016
Order Number: H96677-007
Intel NUC Kit NUC6i7KYK may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata, if any, are documented in Intel NUC Kit NUC6i7KYK Specification Update.
Revision History
Revision
Revision History
Date
001
First release of the Intel NUC Kit NUC6i7KYK Technical Product Specification
April 2016
002
Specification Update
May 2016
003
Specification Change
May 2016
004
Specification Clarification
May 2016
005
Specification Update
July 2016
006
Specification Update
August 2016
007
Specification Update
September 2016
Disclaimer
This product specification applies to only the standard Intel NUC Kit with BIOS identifier KYSKLi70.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.
EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO
LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR
USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR
ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL
INJURY OR DEATH MAY OCCUR.
All Intel NUC Kits are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for
installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC
or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc.
may not be supported without further evaluation by Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property
rights that relate to the presented subject matter. The furnishing of documents and other materials and information does
not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or
other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or
“undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or
incompatibilities arising from future changes to them.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each
processor family, not across different processor families: Go to:
Learn About Intel® Processor Numbers
Intel NUC may contain design defects or errors known as errata, which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product
order.
Intel, the Intel logo, Intel NUC and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright  2016 Intel Corporation. All rights reserved.
Kit Identification Information
Basic Intel® NUC Kit NUC6i7KYK Identification Information
SA Revision
Power Cord
BIOS Revision
Notes
H90754-104
No Power Cord
KYSKLi70.86A.0037
1,2
H90755-104
US Power Cord
KYSKLi70.86A.0037
1,2
H90756-104
EU Power Cord
KYSKLi70.86A.0037
1,2
H90757-104
UK Power Cord
KYSKLi70.86A.0037
1,2
H90758-104
AU Power Cord
KYSKLi70.86A.0037
1,2
Notes:
1.
The SA number is found on a bottom side of the chassis.
2.
The Intel® Core™ i7-6670HQ processor is used on this SA revision consisting of the following component:
Device
Stepping
S-Spec Numbers
Intel Core i7-6770HQ
N0
SR2QY
Specification Changes or Clarifications
The table below indicates the Specification Changes or Specification Clarifications that apply to
the Intel NUC Board NUC6i7KYK.
Specification Changes or Clarifications
Date
Type of Change
Description of Changes or Clarifications
May 2016
Spec Clarification
 Updated Table 2 to add Raw Card Version C
 Updated Table 4 to correct a typo
 Updated Section 2.2.4.2 Add-in Card Connectors to change maximum
bandwidth information.
May 2016
Spec Change
Deleted the Near Field Communication (NFC) header and all related text.
May 2016
Spec Clarification
Updated Figure 17 to delete Japan.
July 2016
Spec Clarification
Removed UART Debug Header and add to note in Section 3.8
August 2016
Spec Change
Page 20 Table 5 from 192 kHz / 24 bit to 192 kHz 16 bit
September 2016
Spec Change
Added note to section 2.2.3.2, Updated figures 4, 6 and 8, Updated Tables 10
and 11
Errata
Current characterized errata, if any, are documented in a separate Specification Update. See
http://www.intel.com/content/www/us/en/nuc/overview.html for the latest documentation.
iii
Intel NUC Kit NUC6i7KYK Technical Product Specification
Preface
This Technical Product Specification (TPS) specifies the layout, components, connectors, power
and environmental requirements, and the BIOS for Intel® NUC Kit NUC6i7KYK.
NOTE
In this document, the use of “kit” will refer to Intel® NUC Kit NUC6i7KYK.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel® NUC Kit NUC6i7KYK
and its components to the vendors, system integrators, and other engineers and technicians who
need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter
Description
1
A description of the hardware used on Intel NUC Kit NUC6i7KYK
2
A map of the resources of the Intel NUC Kit NUC619KYK
3
The features supported by the BIOS Setup program
4
A description of the BIOS error messages, beep codes, and POST codes
5
Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of
these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iv
Other Common Notation
#
Used after a signal name to identify an active-low signal (such as USBP0#)
GB
Gigabyte (1,073,741,824 bytes)
GB/s
Gigabytes per second
Gb/s
Gigabits per second
KB
Kilobyte (1024 bytes)
Kb
Kilobit (1024 bits)
kb/s
1000 bits per second
MB
Megabyte (1,048,576 bytes)
MB/s
Megabytes per second
Mb
Megabit (1,048,576 bits)
Mb/s
Megabits per second
TDP
Thermal Design Power
Xxh
An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V
Volts. Voltages are DC unless otherwise specified.
*
This symbol is used to indicate third-party brands and names that are the property of their respective
owners.
v
Contents
Revision History ............................................................................................................... ii
Disclaimer .................................................................................................................................................................. ii
Kit Identification Information ........................................................................................................................... iii
Errata........................................................................................................................................................................... iii
Preface .............................................................................................................................. iv
Intended Audience ................................................................................................................................................ iv
What This Document Contains ........................................................................................................................ iv
Typographical Conventions .............................................................................................................................. iv
Contents .......................................................................................................................... vii
1 Product Description ............................................................................................... 11
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
1.11
1.12
1.13
Overview ...................................................................................................................................................... 11
1.1.1
Feature Summary .................................................................................................................. 11
1.1.2
Block Diagram ......................................................................................................................... 13
Online Support .......................................................................................................................................... 14
Processor ..................................................................................................................................................... 14
Platform Controller Hub (PCH) ........................................................................................................... 14
1.4.1
Direct Media Interface (DMI).............................................................................................. 14
System Memory ........................................................................................................................................ 15
1.5.1
Memory Configurations ...................................................................................................... 16
Processor Graphics .................................................................................................................................. 17
1.6.1
Integrated Graphics .............................................................................................................. 17
USB ................................................................................................................................................................. 20
Storage Interface ...................................................................................................................................... 21
1.8.1
AHCI Mode ................................................................................................................................ 21
1.8.2
Intel® Rapid Storage Technology / SATA RAID ......................................................... 21
SDXC Card Reader ................................................................................................................................... 21
Real-Time Clock ........................................................................................................................................ 22
Audio 22
1.11.1 Audio Software ....................................................................................................................... 23
LAN
23
1.12.1 Intel® Gigabit Ethernet Controller I219-LM ................................................................ 23
1.12.2 LAN Software ........................................................................................................................... 23
1.12.3 RJ-45 LAN Connector with Integrated LEDs .............................................................. 24
1.12.4 Wireless Network Module .................................................................................................. 25
Hardware Management Subsystem ................................................................................................. 25
1.13.1 Hardware Monitoring ........................................................................................................... 25
1.13.2 Fan Monitoring........................................................................................................................ 25
1.13.3 Thermal Solution ................................................................................................................... 26
vii
Intel NUC Kit NUC6i7KYK Technical Product Specification
1.14 Power Management ................................................................................................................................ 27
1.14.1 ACPI ............................................................................................................................................. 27
1.14.2 Hardware Support ................................................................................................................. 29
2 Technical Reference ............................................................................................... 31
2.1
2.2
2.3
2.4
2.5
2.6
Memory Resources .................................................................................................................................. 31
2.1.1
Addressable Memory ........................................................................................................... 31
Connectors and Headers....................................................................................................................... 31
2.2.1
Front Panel Connectors ...................................................................................................... 32
2.2.2
Back Panel Connectors ....................................................................................................... 34
2.2.3
Top-Side Headers and Connectors ................................................................................ 35
2.2.4
Bottom-Side Headers and Connectors ........................................................................ 38
VESA Bracket.............................................................................................................................................. 43
Power Supply ............................................................................................................................................. 45
2.4.1
Power Supply Connector ................................................................................................... 46
2.4.2
Fan Header Current Capability ......................................................................................... 46
Reliability ..................................................................................................................................................... 46
Environmental ........................................................................................................................................... 47
3 Overview of BIOS Features ................................................................................... 49
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
Introduction ................................................................................................................................................ 49
BIOS Flash Memory Organization ..................................................................................................... 49
System Management BIOS (SMBIOS) .............................................................................................. 49
Legacy USB Support ............................................................................................................................... 50
BIOS Updates ............................................................................................................................................. 50
3.5.1
Language Support ................................................................................................................. 51
3.5.2
Custom Splash Screen ........................................................................................................ 51
BIOS Recovery ........................................................................................................................................... 51
Boot Options .............................................................................................................................................. 52
3.7.1
Network Boot........................................................................................................................... 52
3.7.2
Booting Without Attached Devices ................................................................................ 52
3.7.3
Changing the Default Boot Device During POST...................................................... 52
3.7.4
Power Button Menu .............................................................................................................. 53
Hard Disk Drive Password Security Feature .................................................................................. 54
BIOS Security Features .......................................................................................................................... 55
4 Error Messages and Blink Codes ......................................................................... 57
4.1
4.2
viii
Front-panel Power LED Blink Codes ................................................................................................ 57
BIOS Error Messages............................................................................................................................... 57
Contents
Figures
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
Block Diagram ............................................................................................................................................ 13
Memory Channel and SO-DIMM Configuration ........................................................................... 16
4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out................................................................................. 22
LAN Connector LED Locations ............................................................................................................ 24
Thermal Solution and Fan Header .................................................................................................... 26
Front Panel Layout................................................................................................................................... 32
Consumer Infrared (CIR) Sensor......................................................................................................... 33
Back Panel Layout .................................................................................................................................... 34
Headers and Connectors (Top)........................................................................................................... 35
USB 3.0 Internal Header (1.25 mm Pitch) ..................................................................................... 36
Connection Diagram for the Internal IO Common Header (1.25 mm Pitch).................... 37
Headers and Connectors (Bottom) ................................................................................................... 38
BIOS Security Jumper ............................................................................................................................ 39
Kit Dimensions ........................................................................................................................................... 42
Install VESA Bracket ................................................................................................................................ 43
VESA Bracket Dimensions .................................................................................................................... 44
Power Adapter and Plugs Included with the Kit .......................................................................... 45
Tables
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
Feature Summary ....................................................................................................................................... 11
Supported DDR4/-RS Non-ECC SO-DIMM Module Configurations...................................... 15
DisplayPort Multi-Streaming Resolutions........................................................................................ 18
Multiple Display Configuration Maximum Resolutions .............................................................. 19
Audio Formats Supported by the HDMI and Mini DisplayPort Interfaces .......................... 20
LAN Connector LED States ..................................................................................................................... 24
Effects of Pressing the Power Switch ................................................................................................ 27
Power States and Targeted System Power ..................................................................................... 28
Wake-up Devices and Events ................................................................................................................ 29
Components Shown in Figure 6 ........................................................................................................... 32
Components Shown in Figure 8 ........................................................................................................... 34
Headers and Connectors Shown in Figure 9 .................................................................................. 35
Headers and Connectors Shown in Figure 12................................................................................ 38
BIOS Security Jumper Settings ............................................................................................................ 40
M.2 2280 Module (key type M) Connectors .................................................................................... 40
Fan Header Current Capability ............................................................................................................. 46
Environmental Specifications ............................................................................................................... 47
Acceptable Drives/Media Types for BIOS Recovery .................................................................... 51
Boot Device Menu Options .................................................................................................................... 52
Master Key and User Hard Drive Password Functions ............................................................... 54
Supervisor and User Password Functions ....................................................................................... 55
Front-panel Power LED Blink Codes .................................................................................................. 57
BIOS Error Messages................................................................................................................................. 57
ix
Intel NUC Kit NUC6i7KYK Technical Product Specification
x
1
Product Description
1.1
Overview
1.1.1
Feature Summary
Table 1 summarizes the major features of Intel® NUC Kit NUC6i7KYK.
Table 1. Feature Summary
Form Factor
8.31 inches by 4.57 inches by 1.10 inches (211 millimeters by 116 millimeters by
28 millimeters)
Processor
 A soldered-down 6th generation Intel® Core™ i7-6770HQ quad-core processor with up to
a maximum 45 W TDP
― Intel® Iris™ Pro Graphics 580
― Integrated memory controller
PCH
Intel® H170 Platform Controller Hub
Memory
 Two 260-pin DDR4 SDRAM Small Outline Dual Inline Memory Module (SO-DIMM)
sockets
 Support for DDR4 2133 MHz SO-DIMMs
 Support for 2 Gb and 4 Gb memory technology
 Support for up to 32 GB of system memory with two SO-DIMMs
 Support for non-ECC memory
 Support for 1.2 V and 1.35 V low voltage JEDEC memory only
Graphics
 Integrated graphics support for processors with Intel® Graphics Technology:
― One High Definition Full Size Multimedia Interface* (HDMI*) back panel connector
― One Mini DisplayPort* back panel connector
― One Type C back panel connector
Audio
 Intel® High Definition (Intel® HD) Audio via the HDMI v2.0, Mini DisplayPort 1.2 and Type C
interfaces through the processor
 Realtek HD Audio via a stereo microphone/headphone 3.5 mm jack on the front panel
and 3.5mm combination speaker/TOSLINK jack on the back panel
Storage
Two SATA 6.0 Gb/s or Gen3 PCIe X4 AHCI, NVMe ports are reserved for M.2 storage
modules supporting M.2 2242 and M.2 2280 (key type M) modules
Note: Supports key type M (PCI Express* x1/x2/x4 and SATA)
continued
11
Intel NUC Kit NUC6i7KYK Technical Product Specification
Table 1. Feature Summary (continued)
Peripheral Interfaces
 USB 3.0 ports:
― Two ports are implemented with external front panel connectors (one blue and one
yellow charging capable)
― Two ports are implemented with external back panel connectors (blue)
― Two ports are implemented via an internal header (blue)
― 1 port implemented via the external back panel Type C connector
 USB 2.0 ports:
― Two ports via an internal common IO header (white)
― One port is reserved for the M.2 2230 Wireless module
 Consumer Infrared (CIR)
Expansion Capabilities
 Two M.2 connectors supporting M.2 2242 and M.2 2280 (key type M) modules
 One Full Size SDXC Slot
BIOS
 Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device
 Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and
System Management BIOS (SMBIOS)
Instantly Available PC
Technology
 Suspend to RAM support
LAN
Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel® Gigabit Ethernet Controller
I219-LM
Hardware Monitor
Subsystem
Hardware monitoring subsystem, based on a Nuvoton NCT5577D SIO, including:
 Wake on PCI Express, LAN, front panel, CIR, and USB ports
 Voltage sense to detect out of range power supply voltages
 Thermal sense to detect out of range thermal values
 One processor fan header
 Fan sense input used to monitor fan activity
 Fan speed control
Wireless
Intel® Dual Band Wireless-AC 8260
 802.11ac, Dual Band, Wi-Fi + Bluetooth 4.2
 Supports Intel® Wireless Display 6.0 (WiDi)
12
Product Description
1.1.2
Block Diagram
Figure 1 is a block diagram of the major functional areas of Intel NUC Kit NUC6i7KYK.
Figure 1. Block Diagram
13
Intel NUC Kit NUC6i7KYK Technical Product Specification
1.2
Online Support
To find information about…
Visit this World Wide Web site:
Intel NUC Kit NUC6i7KYK
http://www.intel.com/NUC
Intel NUC Kit Support
http://www.intel.com/NUCSupport
Available configurations for Intel NUC Kit
NUC6i7KYK
http://ark.intel.com
BIOS and driver updates
http://downloadcenter.intel.com
Tested memory
http://www.intel.com/NUCSupport
Integration information
http://www.intel.com/NUCSupport
Processor datasheet
http://ark.intel.com
1.3
Processor
A soldered-down 6th generation Intel® Core™ i7-6770HQ quad-core processor with up to a
maximum 45 W TDP.


Intel Iris Pro Graphics 580
Integrated memory controller
NOTE
There are specific requirements for providing power to the processor. Refer to Section 2.5.1 on
page 45 for information on power supply requirements.
1.4
Platform Controller Hub (PCH)
A soldered-down Intel H170 Platform Controller Hub with Direct Media Interface (DMI)
interconnect provides interfaces to the processor and the USB, SATA, LAN, PCI Express interfaces.
The H170 is a centralized controller for the kit’s I/O paths.
1.4.1
Direct Media Interface (DMI)
Direct Media Interface (DMI) is the chip-to-chip connection between the processor and PCH. This
high-speed interface integrates advanced priority-based servicing allowing for concurrent traffic
and true isochronous transfer capabilities.
14
Product Description
1.5
System Memory
The kit has two 260-pin SO-DIMM sockets and supports the following memory features:








1.2V / 1.35V DDR4 SDRAM SO-DIMMs with gold plated contacts
Two independent memory channels with interleaved mode support
Unbuffered, single-sided or double-sided SO-DIMMs
32 GB maximum total system memory. Refer to Section 2.1.1 on page 31 for information on
the total amount of addressable memory.
Minimum recommended total system memory: 2048 MB
Non-ECC SO-DIMMs
Serial Presence Detect
DDR4 2133 MHz SDRAM SO-DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the kit should be
populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This
allows the BIOS to read the SPD data and program the chipset to accurately configure memory
settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to
correctly configure the memory settings, but performance and reliability may be impacted or the
SO-DIMMs may not function under the determined frequency.
Table 2 lists the supported SO-DIMM configurations.
Table 2. Supported DDR4/-RS Non-ECC SO-DIMM Module Configurations
Raw Card
Version
DIMM
Capacity
DRAM Device
Technology
DRAM
Organization
# of DRAM
Devices
# of
Ranks
# of Row/Col
Address Bits
# of
Banks
Inside
DRAM
A
4GB
4Gb
512M x 8
8
1
15/10
16
8K
A
8GB
8Gb
1024M x 8
8
1
16/10
16
8K
B
8GB
4Gb
512M x 8
16
2
15/10
16
8K
B
16GB
8Gb
1024M x 8
16
2
16/10
16
8K
C
2GB
4Gb
256M x 16
4
1
15/10
8
8K
C
4GB
8Gb
512M x 16
4
1
16/10
8
8K
E
8GB
4Gb
512M x 8
16
2
15/10
16
8K
E
16GB
8Gb
1024M x 8
16
2
16/10
16
8K
For information about…
Refer to:
Tested Memory
http://www.intel.com/NUCSupport
Page
Size
15
Intel NUC Kit NUC6i7KYK Technical Product Specification
1.5.1
Memory Configurations
The processor supports the following types of memory organization:


Dual channel (Interleaved) mode. This mode offers the highest throughput for real world
applications. Dual channel mode is enabled when the installed memory capacities of both
SO-DIMM channels are equal. Technology and device width can vary from one channel to the
other but the installed memory capacity for each channel must be equal. If different speed
SO-DIMMs are used between channels, the slowest memory timing will be used.
Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth
operation for real world applications. This mode is used when only a single SO-DIMM is
installed or the memory capacities are unequal. Technology and device width can vary from
one channel to the other. If different speed SO-DIMMs are used between channels, the
slowest memory timing will be used.
For information about…
Refer to:
Memory Configuration Examples
http://www.intel.com/NUCSupport
Figure 2 illustrates the memory channel and SO-DIMM configuration.
Figure 2. Memory Channel and SO-DIMM Configuration
16
Product Description
1.6
Processor Graphics
The kit supports graphics through Intel® Iris™ Pro Graphics 580.
1.6.1
Integrated Graphics
The kit supports integrated graphics via the processor.
1.6.1.1
Intel® High Definition (Intel® HD) Graphics
The Intel HD graphics controller features the following:

3D Features
― DirectX* 12.1 support
― OpenGL* 4.4 support
― OpenCL* 2.0 support








Video
Next Generation Intel® Clear Video Technology HD support is a collection of video playback
and enhancement features that improve the end user’s viewing experience
Encode/transcode HD content
Playback of high definition content including Blu-ray* disc
Superior image quality with sharper, more colorful images
DirectX* Video Acceleration (DXVA) support for accelerating video processing
Full AVC/VC1/MPEG2/HEVC HW Encode/Decode
Intel HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick Sync Video)
NOTE
Intel Quick Sync Video is enabled by an appropriate software application.
1.6.1.2
Video Memory Allocation
Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically allocating system
memory for use as graphics memory to balance 2D/3D graphics and system performance. If your
computer is configured to use DVMT, graphics memory is allocated based on system
requirements and application demands (up to the configured maximum amount). When memory
is no longer needed by an application, the dynamically allocated portion of memory is returned to
the operating system for other uses.
1.6.1.3
High Definition Multimedia Interface* (HDMI*)
The HDMI port supports standard, enhanced, or high definition video, plus multi-channel digital
audio on a single cable. The port is compatible with all ATSC and DVB HDTV standards and
supports eight full range channels at 24-bit/96 kHz audio of lossless audio formats. The
maximum supported resolution is 4096 x 2160 @ 60 Hz, 24 bpp. The HDMI port is compliant
with the HDMI 2.0 specification.
For information about
Refer to
HDMI technology
http://www.hdmi.org
17
Intel NUC Kit NUC6i7KYK Technical Product Specification
1.6.1.4
DisplayPort* via Mini DisplayPort and Type C
DisplayPort is a digital communication interface that utilizes differential signaling to achieve a
high bandwidth bus interface designed to support connections between PCs and monitors,
projectors, and TV displays. DisplayPort is suitable for display connections between consumer
electronics devices such as high definition optical disc players, set top boxes, and TV displays.
The maximum supported resolution is 4096 x 2304 @ 60 Hz, 224bpp. The Mini DisplayPort is
compliant with the DisplayPort 1.2 specification.
DisplayPort output supports Multi-Stream Transport (MST) which allows for multiple
independent video streams (daisy-chain connection with multiple monitors) over a single
DisplayPort. This will require the use of displays that support DisplayPort 1.2 and allow for this
feature.
For information about
Refer to
DisplayPort technology
http://www.displayport.org
1.6.1.4.1
DisplayPort 1.2 Multi-Stream Transport Daisy-Chaining
Table 3 lists the maximum resolutions available when using DisplayPort 1.2 Multi-Stream
Transport.
Table 3. DisplayPort Multi-Streaming Resolutions
18
DisplayPort Usage Models
Monitor 1
Monitor 2
Monitor 3
3 Monitors
1920 x 1200 @ 60 Hz
1920 x 1080 @ 60 Hz
1920 x 1080 @ 60 Hz
2 Monitors
2560 x 1600 @ 60 Hz
2560 x 1600 @ 60 Hz
3 Monitors
(with DisplayPort 1.2 hub)
1920 x 1080 @ 60 Hz
1920 x 1080 @ 60 Hz
1920 x 1080 @ 60 Hz
Product Description
1.6.1.5
Multiple DisplayPort, Type C and HDMI Configurations
Multiple DisplayPort and HDMI configurations feature the following:

Three independent displays with 4K support
― Mini DisplayPort, HDMI and Type C

Two independent displays with 4K support
― Mini DisplayPort and HDMI
― Mini DisplayPort and Type C
― Type C and HDMI


Single HDMI 2.0 with 4K support
Single DisplayPort 1.2 with 4K support
― Mini DisplayPort or Type C

Collage Display
Table 4. Multiple Display Configuration Maximum Resolutions
Single Display
HDMI
Dual Display
Mini DisplayPort and HDMI
Single Display
Mini DisplayPort or Type C
4096 x 2160 @ 60 Hz
4096 x 2304 @ 60 Hz (Mini DisplayPort)
4096 x 2160 @ 60 Hz (HDMI)
4096 x 2304 @ 60 Hz
Dual Display
Mini DisplayPort and
Type C
Dual Display
Type C and HDMI
Triple Display
Mini DisplayPort, HDMI and Type C
4096 x 2304 @ 60 Hz (Type C)
4096 x 2304 @ 60 Hz (Type C)
4096 x 2160 @ 60 Hz (HDMI)
4096 x 2304 @ 60 Hz (Mini DisplayPort)
4096 x 2304 @ 60 Hz (Mini
DisplayPort)
4096 x 2160 @ 60 Hz (HDMI)
4096 x 2304 @ 60 Hz (Type C)
For information about
Refer to
Multiple display maximum
resolutions
https://wwwssl.intel.com/content/www/us/en/processors/core/CoreTechnicalResources.html
1.6.1.6
High-bandwidth Digital Content Protection (HDCP)
HDCP is the technology for protecting high definition content against unauthorized copy or
interception between a source (computer, digital set top boxes, etc.) and the sink (panels,
monitor, and TVs). The PCH supports HDCP 1.4 and HDCP 2.2 for content protection over wired
displays (Mini DisplayPort and HDMI).
19
Intel NUC Kit NUC6i7KYK Technical Product Specification
1.6.1.7
Integrated Audio Provided by the HDMI and Mini DisplayPort
Interfaces
The HDMI and Mini DisplayPort interfaces from the PCH support audio. The processor supports
two High Definition audio streams on two digital ports simultaneously.
Table 5 shows the specific audio technologies supported by the PCH.
Table 5. Audio Formats Supported by the HDMI and Mini DisplayPort Interfaces
Audio Formats
HDMI
Mini DisplayPort
AC3 – Dolby* Digital
Yes
Yes
Dolby Digital Plus
Yes
Yes
DTS-HD*
Yes
Yes
LPCM, 192 kHz/16 bit, 8 channel
Yes
Yes
Dolby True HD, DTS-HD Master Audio* (Lossless Blu-ray Disc Audio
Format)
Yes
Yes
1.7
USB
The USB port arrangement is as follows:

USB 3.0 ports (maximum current is 900 mA for each blue port, 1.5 A for the yellow charging
port):
― Two ports are implemented with external front panel connectors (one blue and one yellow
charging capable)
― Two ports are implemented with external back panel connectors (blue)
― Two ports are implmented with an internal header (blue)
― One port is implemented with the external black panel Type C connector
All the USB 3.0 ports are super-speed, high-speed, full-speed, and low-speed capable.

USB 2.0 ports (maximum current is 500 mA for each port of the white header (1 A total):
― Two ports via internal common IO header (white)
― One port is reserved for the M.2 2230 Wireless module
All the USB 2.0 ports are high-speed, full-speed, and low-speed capable.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet FCC
Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets
the requirements for full-speed devices.
NOTE
The yellow USB charging port can be set in the BIOS to “Charging Only.” However this affects only
USB 2.0 devices and transfers and does not affect USB 3.0 devices and transfers.
20
Product Description
For information about
Refer to
The location of the USB connectors on the back panel
Figure 8, page 34
The location of the front panel USB headers
Figure 6, page 32
1.8
Storage Interface
The kit provides the following storage interface options via 2 M.2 2242 and M.2 2280 (key type M)
connectors:

SATA 6.0 Gb/s ports are reserved for the M.2 storage modules supporting M.2 2242 and
M.2 2280 (key type M) modules
― The PCH provides independent SATA ports with a theoretical maximum transfer rate of
6 Gb/s. A point-to-point interface is used for host to device connections.

Gen 3 PCIe X4 AHCI, NVMe ports are reserved for the M.2 storage modules supporting
M.2 2242 and M.2 2280 (key type M) modules
1.8.1
AHCI Mode
The kit supports AHCI storage mode.
NOTE
In order to use AHCI mode, AHCI must be enabled in the BIOS. Microsoft* Windows* 10 and
Windows 8.1 include the necessary AHCI drivers without the need to install separate AHCI drivers
during the operating system installation process; however, it is always good practice to update the
AHCI drivers to the latest available by Intel.
1.8.2
Intel® Rapid Storage Technology / SATA RAID
The PCH supports Intel® Rapid Storage Technology, providing both AHCI and integrated RAID
functionality. The RAID capability provides high-performance RAID 0 and 1 functionality on all
SATA ports. Other RAID features include hot spare support, SMART alerting, and RAID 0 auto
replace. Software components include an Option ROM for pre-boot configuration and boot
functionality, a Microsoft Windows compatible driver, and a user interface for configuration and
management of the RAID capability of the PCH.
NOTE
In order to use supported RAID features, you must first enable RAID in the BIOS.
1.9
SDXC Card Reader
The kit has a standard Secure Digital (SD) card reader that supports the Secure Digital eXtended
Capacity (SDXC) format, 3.01 specification with UHS-I support. SD Card sizes supported from
8GB to 128GB.
21
Intel NUC Kit NUC6i7KYK Technical Product Specification
1.10
Real-Time Clock
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the kit is not
plugged into a wall socket, the battery has an estimated life of three years. When the kit is
plugged in, the standby current from the power supply extends the life of the battery. The clock
is accurate to  13 minutes/year at 25 ºC with 3.3 VSB applied via the power supply 5 V STBY rail.
NOTE
If the battery and AC power fail, date and time values will be reset and the user will be notified
during the POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS
RAM (for example, the date and time) might not be accurate. Replace the battery with an
equivalent one. Figure 1 on page 32 shows the location of the battery.
1.11
Audio
The integrated audio supports the following features:


Analog line-out/Analog Headphone/Analog Microphone (front panel jack)
Analog stereo line-out/TOSLINK out (back panel jack)
― Analog Speakers only (Stereo)
― SPDIF optical output formats up to compressed 5.1/7.1



Support for 44.1 kHz/48 kHz/96 kHz/192 kHz sample rates on all analog outputs
Support for 44.1 kHz/48 kHz/96 kHz sample rates on all analog inputs
Front Panel Audio Jack Support (see Figure 3 for 3.5 mm audio jack pin out):
― Speakers only (Stereo)
― Headphones only (Stereo)
― Microphone only (mono)
― Combo Headphone (Stereo)/Microphone (mono)
Pin Number
Pin Name
Description
1
2
3
4
Tip
Ring
Ring
Sleeve
Left Audio Out
Right Audio Out
Common/Ground
Audio In/MIC
Figure 3. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out
NOTE
The analog circuit of the front panel audio connector is designed to power headphones or
amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
22
Product Description
1.11.1
Audio Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about
Refer to
Obtaining Audio software and drivers
http://downloadcenter.intel.com
1.12
LAN
The onboard LAN consists of the following:


Intel Gigabit Ethernet Controller I219-LM (10/100/1000 Mb/s)
RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
 CSMA/CD protocol engine
 LAN connect interface between the Processor and the LAN controller
 Power management capabilities
― ACPI technology support
― LAN wake capabilities

1.12.1
LAN subsystem software
Intel® Gigabit Ethernet Controller I219-LM
The Intel Gigabit Ethernet Controller I219-LM supports the following features:







1.12.2
Compliant with the 1 Gb/s Ethernet 802.3, 802.3u, 802.3z, 802.3ab specifications
Multi-speed operation: 10/100/1000 Mb/s
Full-duplex operation at 10/100/1000 Mb/s; Half-duplex operation at 10/100 Mb/s
Flow control support compliant with the 802.3X specification as well as the specific operation
of asymmetrical flow control defined by 802.3z
VLAN support compliant with the 802.3q specification
Supports Jumbo Frames (up to 9 kB)
― IEEE 1588 supports (Precision Time Protocol)
MAC address filters: perfect match unicast filters, multicast hash filtering, broadcast filter, and
promiscuous mode
LAN Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about
Refer to
Obtaining LAN software and drivers
http://downloadcenter.intel.com
23
Intel NUC Kit NUC6i7KYK Technical Product Specification
1.12.3
RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 4).
Item
Description
A
Link LED (Green)
B
Data Rate LED (Green/Yellow)
Figure 4. LAN Connector LED Locations
Table 6 describes the LED states when the board is powered up and the LAN subsystem is
operating.
Table 6. LAN Connector LED States
LED
Link
Data Rate
24
LED Color
Green
Green/Yellow
LED State
Condition
Off
LAN link is not established.
On
LAN link is established.
Blinking
LAN activity is occurring.
Off
10 Mb/s data rate is selected.
Green
100 Mb/s data rate is selected.
Yellow
1000 Mb/s data rate is selected.
Product Description
1.12.4
Wireless Network Module
The Intel Dual Band Wireless-AC 8260 module provides hi-speed wireless connectivity provided
with the following capabilities:










Compliant IEEE 802.11abgn, 802.11ac, 802.11d, 802.11e, 802.11i, 802.11h, 802.11w
specifications
Maximum bandwidth of 867 Mbps
Dual Mode Bluetooth* 4.2
OS certified with : Microsoft Windows 7, Microsoft Windows 8.1, Microsoft Windows 10,
Linux* (most features not available on Linux)
Wi-Fi Direct* for peer to peer device connections
Wi-Fi Miracast Source
Intel® Wireless Display 6.0
Wi-Fi Direct for peer to peer device connections
Authentication: WPA and WPA2, 802.1X (EAP-TLS, TTLS, PEAP, LEAP, EAP-FAST), EAP-SIM,
EAP-AKA
Encryption: 64-bit and 128-bit WEP, AES-CCMP, TKIP, WPA2, AES-CCMP
For information about
Refer to
Obtaining WLAN software and drivers
http://downloadcenter.intel.com
Full Specifications
http://intel.com/wireless
1.13
Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired for
Management (WfM) specification. The kit has several hardware management features, including
thermal and voltage monitoring.
For information about
Refer to
Wired for Management (WfM) Specification
www.intel.com/design/archives/wfm/
1.13.1
Hardware Monitoring
The hardware monitoring and fan control subsystem is based on a Nuvoton NCT5577DSIO, which
supports the following:




1.13.2
Processor and system ambient temperature monitoring
Chassis fan speed monitoring
Voltage monitoring of +5 V, +3.3 V, Memory Vcc (V_SM), +Vccp,
SMBus interface
Fan Monitoring
Fan monitoring can be implemented using third-party software.
25
Intel NUC Kit NUC6i7KYK Technical Product Specification
1.13.3
Thermal Solution
Figure 5 shows the location of the thermal solution and processor fan header.
Item
Description
A
Thermal solution
B
Processor fan header
Figure 5. Thermal Solution and Fan Header
26
Product Description
1.14
Power Management
Power management is implemented at several levels, including:


Software support through Advanced Configuration and Power Interface (ACPI)
Hardware support:
― Power Input
― Instantly Available PC technology
― LAN wake capabilities
― Wake from USB
― WAKE# signal wake-up support
― Wake from S5
― Wake from CIR
1.14.1
ACPI
ACPI gives the operating system direct control over the power management and Plug and Play
functions of a computer. The use of ACPI with this kit requires an operating system that provides
full ACPI support. ACPI features include:






Plug and Play (including bus and device enumeration)
Power management control of individual devices, add-in boards (some add-in boards may
require an ACPI-aware driver), video displays, and hard disk drives
Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
A Soft-off feature that enables the operating system to power-off the kit
Support for multiple wake-up events (see Table 9 on page 29)
Support for a front panel power and sleep mode switch
Table 7 lists the system states based on how long the power switch is pressed, depending on how
ACPI is configured with an ACPI-aware operating system.
Table 7. Effects of Pressing the Power Switch
If the system is in this state…
…and the power switch is pressed for
…the system enters this state
Off
(ACPI G2/G5 – Soft off)
Less than four seconds
Power-on
(ACPI G0 – working state)
On
(ACPI G0 – working state)
Less than four seconds
Soft-off/Standby
(ACPI G1 – sleeping state) Note
On
(ACPI G0 – working state)
More than six seconds
Fail safe power-off
(ACPI G2/G5 – Soft off)
Sleep
(ACPI G1 – sleeping state)
Less than four seconds
Wake-up
(ACPI G0 – working state)
Sleep
(ACPI G1 – sleeping state)
More than six seconds
Power-off
(ACPI G2/G5 – Soft off)
Note: Depending on power management settings in the operating system.
27
Intel NUC Kit NUC6i7KYK Technical Product Specification
1.14.1.1
System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The
operating system puts devices in and out of low-power states based on user preferences and
knowledge of how devices are being used by applications. Devices that are not being used can be
turned off. The operating system uses information from applications and user settings to put the
system as a whole into a low-power state.
Table 8 lists the power states supported by the kit along with the associated system power
targets. See the ACPI specification for a complete description of the various system and power
states.
Table 8. Power States and Targeted System Power
Global States
Sleeping States
Processor
States
Device States
Targeted System
Power (Note 1)
G0 – working
state
S0 – working
C0 – working
D0 – working state.
Full power > 30 W
G1 – sleeping
state
S3 – Suspend to RAM.
Context saved to
RAM.
No power
D3 – no power
except for wake-up
logic.
Power < 5 W
(Note 2)
G1 – sleeping
state
S4 – Suspend to disk.
Context saved to disk.
No power
D3 – no power
except for wake-up
logic.
Power < 5 W
(Note 2)
G2/S5
S5 – Soft off. Context
not saved. Cold boot
is required.
No power
D3 – no power
except for wake-up
logic.
Power < 5 W
(Note 2)
G3 – mechanical
off
No power to the
system.
No power
D3 – no power for
wake-up logic,
except when
provided by battery
or external source.
No power to the system.
Service can be performed
safely.
AC power is
disconnected
from the
computer.
Notes:
28
1.
Total system power is dependent on the system configuration, including add-in boards and peripherals powered by
the system chassis’ power supply.
2.
Dependent on the standby power consumption of wake-up devices used in the system.
Product Description
1.14.1.2
Wake-up Devices and Events
Table 9 lists the devices or specific events that can wake the kit from specific states.
Table 9. Wake-up Devices and Events
Devices/events that wake up the system…
…from this sleep state
Comments
Power switch
S3, S4, S51
RTC alarm
S3, S4, S51
Monitor to remain in sleep state
LAN
S3, S4, S51, 3
“S5 WOL after G3” must be supported;
monitor to remain in sleep state
USB
S3, S4, S51, 2, 3
Wake S4, S5 controlled by BIOS option
(not after G3)
WAKE#
S3, S4, S51
Via WAKE; monitor to remain in sleep
state
Consumer IR
S3, S4, S51, 3
Will not wake when in Deep S4/S5 sleep
state
Bluetooth
N/A
Wake from Bluetooth is not supported
Notes:
1. S4 implies operating system support only.
2. Will not wake from Deep S4/S5. USB S4/S5 Power is controlled by BIOS. USB S5 wake is controlled by BIOS. USB S4
wake is controlled by OS driver, not just BIOS option.
3. Windows 8.1 Fast startup will block wake from LAN, USB, and CIR from S5.
NOTE
The use of these wake-up events from an ACPI state requires an operating system that provides
full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake
events.
1.14.2
Hardware Support
The kit provides several power management hardware features, including:







Wake from Power Button signal
Instantly Available PC technology
LAN wake capabilities
Wake from USB (not after G3)
WAKE# signal wake-up support
Wake from S5
Wake from CIR
NOTE
The use of Wake from USB from an ACPI state requires an operating system that provides full
ACPI support.
29
Intel NUC Kit NUC6i7KYK Technical Product Specification
1.14.2.1
Power Input
When resuming from an AC power failure, the kit returns to the power state it was in before
power was interrupted (on or off). The kit’s response can be set using the Last Power State
feature in the BIOS Setup program’s Boot menu.
1.14.2.2
Instantly Available PC Technology
Instantly Available PC technology enables the kit to enter the ACPI S3 (Suspend-to-RAM) sleepstate. While in the S3 sleep-state, the computer will appear to be off (the power supply is only
supplying Standby power, and the front panel LED will be amber or secondary color if dual
colored, or off if single colored.) When signaled by a wake-up device or event, the system quickly
returns to its last known wake state. Table 9 on page 29 lists the devices and events that can
wake the computer from the S3 state.
The use of Instantly Available PC technology requires operating system support and drivers for
any installed M.2 add-in card.
1.14.2.3
LAN Wake Capabilities
LAN wake capabilities enable remote wake-up of the kit through a network. The LAN subsystem
monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet*
frame, the LAN subsystem asserts a wake-up signal that powers up the kit.
1.14.2.4
Wake from USB
USB bus activity wakes the computer from an ACPI S3 state (not after G3).
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.14.2.5
WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the kit wakes from an ACPI S3, S4, or
S5 state.
1.14.2.6
Wake from S5
When the RTC Date and Time is set in the BIOS, the kit will automatically wake from an ACPI S5
state.
1.14.2.7
Wake from Consumer IR
CIR activity wakes the kit from an ACPI S3, S4, or S5 state.
30
2
Technical Reference
2.1
Memory Resources
2.1.1
Addressable Memory
The kit utilizes 32 GB of addressable system memory. Typically the address space that is
allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash
device), and chipset overhead resides above the top of DRAM (total system memory). On a
system that has 32 GB of system memory installed, it is not possible to use all of the installed
memory due to system address space being allocated for other system critical functions. These
functions include the following:







BIOS/SPI Flash device (64 Mb)
Local APIC (19 MB)
Direct Media Interface (40 MB)
PCI Express configuration space (256 MB)
PCH base address registers PCI Express ports (up to 256 MB)
Memory-mapped I/O that is dynamically allocated for M.2 add-in cards (256 MB)
Integrated graphics shared memory (up to 512 MB; 64 MB by default)
The kit provides the capability to reclaim the physical memory overlapped by the memory
mapped I/O logical address space. The kit remaps physical memory from the top of usable DRAM
boundary to the 4 GB boundary to an equivalent sized logical address range located just above
the 4 GB boundary. All installed system memory can be used when there is no overlap of system
addresses.
2.2
Connectors and Headers
CAUTION
Only the following connectors and headers have overcurrent protection: back panel and front
panel USB.
The other internal connectors and headers are not overcurrent protected and should connect only
to devices inside the kit’s chassis, such as fans and internal peripherals. Do not use these
connectors or headers to power devices external to the kit’s chassis. A fault in the load presented
by the external devices could cause damage to the board, the power cable, and the external
devices themselves.
Furthermore, improper connection of USB header single wire connectors may eventually overload
the overcurrent protection and cause damage to the board.
31
Intel NUC Kit NUC6i7KYK Technical Product Specification
This section describes the connectors and headers. The connectors and headers can be divided
into these groups:




2.2.1
Front panel connectors
Back panel connectors
Top-Side headers and connectors
Bottom-Side headers and connectors
Front Panel Connectors
Figure 6 shows the location of the components on the front of the Intel NUC Kit NUC6i7KYK
chassis.
Figure 6. Front Panel Layout
Table 10. Components Shown in Figure 6
32
Item from Figure 6
Description
A
Power on/off button/LED
B
SDXC card reader slot
C
USB 3.0 connectors (one blue and one yellow charging capable)
D
Speaker/Headset
E
Consumer Infrared (CIR)
F
Anti-Theft key lock hole
Technical Reference
2.2.1.1
Consumer Infrared (CIR) Sensor
The Consumer Infrared (CIR) sensor on the front panel provides features that are designed to
comply with Microsoft Consumer Infrared usage models (RC-6).
The CIR feature is made up of the receiving sensor. The receiving sensor consists of a filtered
translated infrared input compliant with Microsoft CIR specifications.
Customers are required to provide their own media center compatible remote or smart phone
application for use with the Intel NUC. Figure 7 shows the location of the CIR sensor.
Figure 7. Consumer Infrared (CIR) Sensor
33
Intel NUC Kit NUC6i7KYK Technical Product Specification
2.2.2
Back Panel Connectors
Figure 8 shows the location of the components on the back of the Intel NUC Kit NUC6i7KYK
chassis.
Figure 8. Back Panel Layout
Table 11. Components Shown in Figure 8
34
Item from Figure 8
Description
A
Fan Exhaust
B
19V DC power input jack
C
Speaker/SPDIF
D
Ethernet port
E
USB 3.0 ports (blue)
F
Mini DisplayPort connector
G
Thunderbolt™ 3 port (Type C)
H
HDMI connector
Technical Reference
2.2.3
Top-Side Headers and Connectors
Figure 9 shows the location of the headers and connectors on the top-side of Intel NUC Kit
NUC6i7KYK.
Figure 9. Headers and Connectors (Top)
Table 12. Headers and Connectors Shown in Figure 9
Item from Figure 9
Description
A
Front panel USB 3.0 header (1.25 mm pitch) (blue)
B
Internal Common IO header (1.25 mm pitch) (white)
35
Intel NUC Kit NUC6i7KYK Technical Product Specification
2.2.3.1
Internal USB 3.0 Header (1.25 mm Pitch)
Figure 10 is a connection diagram for internal USB .30 header.
NOTE


The +5 V DC power on the USB header is fused.
Use only an internal USB connector that conforms to the USB 3.0 specification for high-speed
USB devices.
Figure 10. USB 3.0 Internal Header (1.25 mm Pitch)
NOTE
Connector is Molex part number 5041871874, 1.25 mm pitch header, surface mount, vertical.
36
Technical Reference
2.2.3.2
Internal Common IO Header (1.25 mm Pitch)
Figure 11 is a connection diagram for internal Common IO header.
NOTE


The +5 V DC power on the USB header is fused.
Use only an internal USB connector that conforms to the USB 2.0 specification for high-speed
USB devices.
Figure 11. Connection Diagram for the Internal
IO Common Header (1.25 mm Pitch)
NOTE
Pin number 13 on the connector is an output. The PCH asserts RST_N (out) to reset devices
attached to front panel header. Asserted during power-up and when software initiates a hard
reset.
NOTE
Connector is Entery part number 3950K-J20C-00L, 1.25 mm pitch header, surface mount, vertical.
2.2.3.2.1
Consumer Electronics Control (CEC) Header
The Consumer Electronics Control (CEC) is a 500 Mb/s bi-directional serial bus designed to be
used for controlling multiple HDMI devices with a single remote control.
For information about
Refer to
HDMI CEC technology
http://www.hdmi.org/pdf/whitepaper/DesigningCECintoYourNextH
DMIProduct.pdf
37
Intel NUC Kit NUC6i7KYK Technical Product Specification
2.2.4
Bottom-Side Headers and Connectors
Figure 12 shows the location of the headers and connectors on the bottom-side of Intel NUC Kit
NUC6i7KYK.
Figure 12. Headers and Connectors (Bottom)
Table 13. Headers and Connectors Shown in Figure 12
38
Item from Figure 12
Description
A
BIOS security jumper
B
M.2 connector B (key type M) for 2242 and 2280 modules
C
M.2 connector A (key type M) for 2242 and 2280 modules
Technical Reference
2.2.4.1
BIOS Security Jumper
CAUTION
Do not move a jumper with the power on. Always turn off the power and unplug the power cord
from the computer before changing a jumper setting. Otherwise, the board could be damaged.
Figure 13 shows the BIOS Security Jumper. The 3-pin jumper determines the BIOS Security
program’s mode.
Table 14 describes the jumper settings for the three modes: normal, lockdown, and
configuration.
Figure 13. BIOS Security Jumper
39
Intel NUC Kit NUC6i7KYK Technical Product Specification
Table 14 lists the settings for the jumper.
Table 14. BIOS Security Jumper Settings
Function/Mode
Jumper Setting
Configuration
Normal
1-2
The BIOS uses current configuration information and passwords for
booting.
Lockdown
2-3
The BIOS uses current configuration information and passwords for
booting, except:
• All POST Hotkeys are suppressed (prompts are not displayed and keys
are not accepted. For example, F2 for Setup, F10 for the Boot Menu).
• Power Button Menu is not available (see Section 3.7.4 Power Button
Menu).
BIOS updates are not available except for automatic Recovery due to flash
corruption.
Configuration
None
BIOS Recovery Update process if a matching *.bio file is found. Recovery
Update can be cancelled by pressing the Esc key.
If the Recovery Update was cancelled or a matching *.bio file was not
found, a Config Menu will be displayed. The Config Menu consists of the
following (selected Power Button Menu options):
[1]
Suppress this menu until the BIOS Security Jumper is replaced.
[2]
Clear BIOS User and Supervisor Passwords.
See Section 3.7.4 Power Button Menu.
2.2.4.2
Add-in Card Connectors
The kit supports M.2 2242 and 2280 (key type M) modules.

Supports M.2 SSD SATA-III drives
― Maximum bandwidth is approximately 540 MB/s

Supports M.2 SSD Gen 3 PCIe AHCI, NVMe drives (PCIe x1, x2, and x4)
― Using PCIe x4 M.2 SSD maximum bandwidth is approximately 4000 MB/s
Table 15. M.2 2280 Module (key type M) Connectors
Pin
Signal Name
Pin
Signal Name
74
3.3V
75
GND
72
3.3V
73
GND
70
3.3V
71
GND
68
SUSCLK(32kHz) (O)(0/3.3V)
69
PEDET (NC-PCIe/GND-SATA)
66
Connector Key
67
N/C
64
Connector Key
65
Connector Key
62
Connector Key
63
Connector Key
60
Connector Key
61
Connector Key
58
N/C
59
Connector Key
continued
40
Technical Reference
Table 15. M.2 2280 Module (key type M) Connectors (continued)
Pin
Signal Name
Pin
Signal Name
56
N/C
57
GND
54
PEWAKE# (I/O)(0/3.3V) or N/C
55
REFCLKP
52
CLKREQ# (I/O)(0/3.3V) or N/C
53
REFCLKN
50
PERST# (O)(0/3.3V) or N/C
51
GND
48
N/C
49
PETp0/SATA-A+
46
N/C
47
PETn0/SATA-A-
44
N/C
45
GND
42
N/C
43
PERp0/SATA-B-
40
N/C
41
PERn0/SATA-B+
38
DEVSLP (O)
39
GND
36
N/C
37
PETp1
34
N/C
35
PETn1
32
N/C
33
GND
30
N/C
31
PERp1
28
N/C
29
PERn1
26
N/C
27
GND
24
N/C
25
PETp2
22
N/C
23
PETn2
20
N/C
21
GND
18
3.3V
19
PERp2
16
3.3V
17
PERn2
14
3.3V
15
GND
12
3.3V
13
PETp3
10
DAS/DSS# (I/O)/LED1# (I)(0/3.3V)
11
PETn3
8
N/C
9
GND
6
N/C
7
PERp3
4
3.3V
5
PERn3
2
3.3V
3
GND
1
GND
41
Intel NUC Kit NUC6i7KYK Technical Product Specification
2.2.4.3
Kit Dimensions
Figure 14 illustrates the dimensions for the kit. Dimensions are given in millimeters.
Figure 14. Kit Dimensions
42
Technical Reference
2.3
VESA Bracket
Figure 15 illustrates how to install the VESA mount bracket included with the kit.
Figure 15. Install VESA Bracket
43
Intel NUC Kit NUC6i7KYK Technical Product Specification
Figure 16 shows the dimensions of the VESA bracket. Dimensions are given in millimeters.
Figure 16. VESA Bracket Dimensions
44
Technical Reference
2.4
Power Supply
The NUC6i7KYK uses an AC to DC power adapter with a six foot attached cable with a barrel
connector. Figure 17 shows the power adapter and plugs that may be included with the kit.



100-240V AC Input 50-60 Hz 2.0 A
19V 6.32 A DC output
3-pin AC Power Cord Plug
AC power cord options are as follows:





No AC Power Cord
US AC Power Cord
UK AC Power Cord
EU AC Power Cord
AU AC Power Cord
Figure 17. Power Adapter and Plugs Included with the Kit
45
Intel NUC Kit NUC6i7KYK Technical Product Specification
2.4.1
Power Supply Connector
The kit has the following power supply connector:

External Power Supply – the kit can be powered through a 19V DC connector on the back
panel (see Figure 17, C). The back panel DC connector is compatible with a 5.5 mm/OD (outer
diameter) and 2.5 mm/ID (inner diameter) plug, where the inner contact is +19 (±10%) V DC
and the shell is GND. The maximum current rating is 10 A.
NOTE
External power voltage, 19V DC, is dependent on the type of power brick used.
2.4.1.1.1
Power Sensing Circuit
The kit has a power sensing circuit that:


Manages CPU power usage to maintain system power consumption below 120 W.
Designed for use with 120 W AC-DC adapters.
NOTE
It is recommended that you disable this feature (via BIOS option) when using an AC-DC
adapter greater than 120 W.
2.4.2
Fan Header Current Capability
Table 16 lists the current capability of the fan header.
Table 16. Fan Header Current Capability
2.5
Fan Header
Maximum Available Current
Processor fan
.25 A
Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Telcordia SR-332 Issue 2,
Method I, Case 3, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare
parts requirements. The MTBF for Intel NUC6i7KYK Kit is 61,115 hours.
46
Technical Reference
2.6
Environmental
Table 17 lists the environmental specifications for the kit.
Table 17. Environmental Specifications
Parameter
Specification
Temperature
Non-Operating
-40 C to +60 C
Operating
0 C to +50 C
The operating temperature of the kit may be determined by measuring the air temperature
from the junction of the heatsink fins and fan, next to the attachment screw, in a closed
chassis, while the system is in operation.
Shock
Unpackaged
50 g trapezoidal waveform
Velocity change of 170 inches/s²
Packaged
Half sine 2 millisecond
Product Weight (pounds)
Free Fall (inches)
Velocity Change (inches/s²)
<20
36
167
21-40
30
152
41-80
24
136
81-100
18
118
Vibration
Unpackaged
5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged
5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
Note: Before attempting to operate this kit, the overall temperature of the kit must be above the minimum operating
temperature specified. It is recommended that the kit temperature be at least room temperature before
attempting to power on the kit. The operating and non-operating environment must avoid condensing humidity.
47
3
Overview of BIOS Features
3.1
Introduction
The kit uses Intel® Visual BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI
Flash) and can be updated using a disk-based program. The SPI Flash contains the Visual BIOS
Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and
Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision code. The
initial production BIOSs are identified as KYSKLi70.86A.
The Visual BIOS Setup program can be used to view and change the BIOS settings for the
computer. The BIOS Setup program is accessed by pressing the <F2> key after the Power-On
Self-Test (POST) memory test begins and before the operating system boot begins.
NOTE
The maintenance menu is displayed only when the kit is in configure mode. Section 2.2.4.1 on
page 39 shows how to put the kit in configure mode.
3.2
BIOS Flash Memory Organization
The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 64 Mb flash memory device.
3.3
System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in
a managed network.
The main component of SMBIOS is the Management Information Format (MIF) database, which
contains information about the computing system and its components. Using SMBIOS, a system
administrator can obtain the system types, capabilities, operational status, and installation dates
for system components. The MIF database defines the data and provides the method for
accessing this information. The BIOS enables applications such as third-party management
software to use SMBIOS. The BIOS stores and reports the following SMBIOS information:




BIOS data, such as the BIOS revision level
Fixed-system data, such as peripherals, serial numbers, and asset tags
Resource data, such as memory size, cache size, and processor speed
Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the SMBIOS
information. The BIOS supports an SMBIOS table interface for such operating systems. Using
this support, an SMBIOS service-level application running on a non-Plug and Play operating
system can obtain the SMBIOS information. Additional kit information can be found in the BIOS
under the Additional Information header under the Main BIOS page.
49
Intel NUC Kit NUC6i7KYK Technical Product Specification
3.4
Legacy USB Support
Legacy USB support enables USB devices to be used even when the operating system’s USB
drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and
to install an operating system that supports USB. By default, Legacy USB support is set to
Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and
configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB keyboards and mice
are recognized and may be used to configure the operating system. (Keyboards and mice are
not recognized during this period if Legacy USB support was set to Disabled in the BIOS
Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are
recognized by the operating system, and Legacy USB support from the BIOS is no longer
used.
7. Additional USB legacy feature options can be access by using Intel® Integrator Toolkit.
To install an operating system that supports USB, verify that Legacy USB support in the BIOS
Setup program is set to Enabled and follow the operating system’s installation instructions.
3.5
BIOS Updates
The BIOS can be updated using one of the following methods:





Intel Express BIOS Update Utility, which enables automated updating while in the Windows
environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB
drive (a flash drive or a USB hard drive), or a CD-ROM, or from the file location on the Web.
Intel Flash Memory Update Utility, which requires booting from DOS. Using this utility, the
BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive),
or a CD-ROM.
Intel® F7 switch during POST allows a user to select where the BIOS .bio file is located and
perform the update from that location/device. Similar to performing a BIOS Recovery without
removing the BIOS configuration jumper.
Intel® Visual BIOS has an option to update the BIOS from a valid .bio file located on a hard
disk or USB drive. Enter Intel Visual BIOS by pressing <F2> during POST.
Using Front Panel menu option
Both utilities verify that the updated BIOS matches the target system to prevent accidentally
installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS update.
50
Overview of BIOS Features
For information about
Refer to
BIOS update utilities
http://support.intel.com/support/motherboards/desktop/sb/CS034499.htm
3.5.1
Language Support
The BIOS Setup program and help messages are supported in US English. Check the Intel web
site for support.
3.5.2
Custom Splash Screen
During POST, an Intel® splash screen is displayed by default. This splash screen can be
augmented with a custom splash screen. The Intel Integrator’s Toolkit that is available from Intel
can be used to create a custom splash screen.
NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.
For information about
Refer to
Intel Integrator Toolkit
http://developer.intel.com/design/motherbd/software/itk/
Additional Intel® software tools
http://developer.intel.com/design/motherbd/software.htm
3.6
BIOS Recovery
It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the
BIOS could be damaged. Table 18 lists the drives and media types that can and cannot be used
for BIOS recovery. The BIOS recovery media does not need to be made bootable.
Table 18. Acceptable Drives/Media Types for BIOS Recovery
Media Type (Note)
Can be used for BIOS recovery?
Hard disk drive (connected to USB)
Yes
CD/DVD drive (connected to USB)
Yes
USB flash drive
Yes
USB diskette drive (with a 1.4 MB diskette)
No (BIOS update file is bigger than 1.4 MB size limit)
NOTE
Supported file systems for BIOS recovery:





NTFS (sparse, compressed, or encrypted files are not supported)
FAT32
FAT16
FAT12
ISO 9660
51
Intel NUC Kit NUC6i7KYK Technical Product Specification
For information about
Refer to
BIOS recovery
http://www.intel.com/support/motherboards/desktop/sb/cs-034524.htm
3.7
Boot Options
In the BIOS Setup program, the user can choose to boot from a hard drive, removable drive, or
the network. The default setting is for the hard drive first, removable drive second, and the
network third.
3.7.1
Network Boot
The network can be selected as a boot device. This selection allows booting from the onboard
LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key
during POST, the User Access Level in the BIOS Setup program's Security menu must be
set to Full.
3.7.2
Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing the POST,
the operating system loader is invoked even if the following devices are not present:



Video Display
Keyboard
Mouse
3.7.3
Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to be displayed. This menu
displays the list of available boot devices. Table 19 lists the boot device menu options.
Table 19. Boot Device Menu Options
52
Boot Device Menu Function Keys
Description
<> or <>
Selects a default boot device
<Enter>
Exits the menu, and boots from the selected device
<Esc>
Exits the menu and boots according to the boot priority defined
through BIOS setup
Overview of BIOS Features
3.7.4
Power Button Menu
As an alternative to Back-to-BIOS Mode or normal POST Hotkeys, the user can use the power
button to access a menu. The Power Button Menu is accessible via the following sequence:
1. System is in S4/S5/G2
2. User pushes the power button and holds it down for 3 seconds
3. The system will emit three short beeps from the front panel (FP) audio port, then stop to
signal the user to release the power button. The FP power button LED will also change from
Blue to Amber when the user can release the power button.
4. User releases the power button before the 4-second shutdown override
If this boot path is taken, the BIOS will use default settings, ignoring settings in VPD where
possible.
At the point where Setup Entry/Boot would be in the normal boot path, the BIOS will display the
following prompt and wait for a keystroke:
[ESC]
Normal Boot
[F2]
Intel Visual BIOS
[F3]
Disable Fast Boot
[F4]
BIOS Recovery
[F7]
Update BIOS
[F10]
Enter Boot Menu
[F12]
Network Boot
[F2] Enter Setup is displayed instead if Visual BIOS is not supported.
[F3] Disable Fast Boot is only displayed if at least one Fast Boot optimization is enabled.
[F9] Remote Assistance is only displayed if Remote Assistance is supported.
If an unrecognized key is hit, then the BIOS will beep and wait for another keystroke. If one of the
listed hotkeys is hit, the BIOS will follow the indicated boot path. Password requirements must
still be honored.
If Disable Fast Boot is selected, the BIOS will disable all Fast Boot optimizations and reset the
system.
53
Intel NUC Kit NUC6i7KYK Technical Product Specification
3.8
Hard Disk Drive Password Security Feature
The Hard Disk Drive Password Security feature blocks read and write accesses to the hard disk
drive until the correct password is given. Hard Disk Drive Passwords are set in BIOS SETUP and
are prompted for during BIOS POST. For convenient support of S3 resume, the system BIOS will
automatically unlock drives on resume from S3. Valid password characters are A-Z, a-z, and 0-9.
Passwords may be up to 19 characters in length.
The User hard disk drive password, when installed, will be required upon each power-cycle until
the Master Key or User hard disk drive password is submitted.
The Master Key hard disk drive password, when installed, will not lock the drive. The Master Key
hard disk drive password exists as an unlock override in the event that the User hard disk drive
password is forgotten. Only the installation of the User hard disk drive password will cause a hard
disk to be locked upon a system power-cycle.
Table 20 shows the effects of setting the Hard Disk Drive Passwords.
Table 20. Master Key and User Hard Drive Password Functions
Password Set
Password During Boot
Neither
None
Master only
None
User only
User only
Master and User Set
Master or User
During every POST, if a User hard disk drive password is set, POST execution will pause with the
following prompt to force the user to enter the Master Key or User hard disk drive password:
Enter Hard Disk Drive Password:
Upon successful entry of the Master Key or User hard disk drive password, the system will
continue with normal POST.
If the hard disk drive password is not correctly entered, the system will go back to the above
prompt. The user will have three attempts to correctly enter the hard disk drive password. After
the third unsuccessful hard disk drive password attempt, the system will halt with the message:
Hard Disk Drive Password Entry Error
A manual power cycle will be required to resume system operation.
NOTE
As implemented on Intel NUC Kit NUC6i7KYK, Hard Disk Drive Password Security is only supported
on SATA port 0 (M.2 ). The passwords are stored on the hard disk drive so if the drive is relocated
to another computer that does not support Hard Disk Drive Password Security feature, the drive
will not be accessible.
Currently, there is no industry standard for implementing Hard Disk Drive Password Security on
AHCI or NVME drives. Hard drive encryption can still be implemented and does not require Hard
Disk Drive Password Security.
54
Overview of BIOS Features
3.9
BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program and who can
boot the computer. A supervisor password and a user password can be set for the BIOS Setup
program and for booting the computer, with the following restrictions:








The supervisor password gives unrestricted access to view and change all the Setup options
in the BIOS Setup program. This is the supervisor mode.
The user password gives restricted access to view and change Setup options in the BIOS
Setup program. This is the user mode.
If only the supervisor password is set, pressing the <Enter> key at the password prompt of
the BIOS Setup program allows the user restricted access to Setup.
If both the supervisor and user passwords are set, users can enter either the supervisor
password or the user password to access Setup. Users have access to Setup respective to
which password is entered.
Setting the user password restricts who can boot the computer. The password prompt will be
displayed before the computer is booted. If only the supervisor password is set, the
computer boots without asking for a password. If both passwords are set, the user can enter
either password to boot the computer.
For enhanced security, use different passwords for the supervisor and user passwords.
Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 20 characters in
length.
To clear a set password, enter a blank password after entering the existing password.
Table 21 shows the effects of setting the supervisor password and user password. This table is
for reference only and is not displayed on the screen.
Table 21. Supervisor and User Password Functions
Password Set
Supervisor
Mode
User Mode
Setup Options
Password to
Enter Setup
Password
During Boot
Neither
Can change all
Can change all
None
None
None
options (Note)
options (Note)
Supervisor only
Can change all
options
Can change a
limited number
of options
Supervisor Password
Supervisor
None
User only
N/A
Can change all
options
Enter Password
Clear User Password
User
User
Supervisor and
user set
Can change all
options
Can change a
limited number
of options
Supervisor Password
Enter Password
Supervisor or
user
Supervisor or
user
Note:
If no password is set, any user can change all Setup options.
55
4
Error Messages and Blink Codes
4.1
Front-panel Power LED Blink Codes
Whenever a recoverable error occurs during POST, the BIOS causes the kit’s front panel power
LED to blink an error message describing the problem (see Table 22).
Table 22. Front-panel Power LED Blink Codes
4.2
Type
Pattern
Note
Power-on
Solid on primary color. Indicates S0 state.
Default to On; can be disabled
via BIOS Setup
S3 Standby
Blink primary color .25 seconds on, .25 seconds off,
indefinitely. Indicates S3 state.
Default behavior; can be
changed via BIOS Setup
Intel Ready Mode
Solid secondary color
Default behavior; can be
changed via BIOS Setup
BIOS update in progress
Off when the update begins, then primary color on for
0.5 seconds, then off for 0.5 seconds. The pattern
repeats until the BIOS update is complete.
Memory error
On-off (1.0 second each) three times, then 2.5-second
pause (off), entire pattern repeats (blinks and pause)
until the system is powered off.
Thermal trip warning
Blink primary color .25 seconds on, .25 seconds off, .25
seconds on, .25 seconds off. This will result in a total of
16 blinks (blink for 8 seconds).
BIOS Error Messages
Table 23 lists the error messages and provides a brief description of each.
Table 23. BIOS Error Messages
Error Message
Explanation
CMOS Battery Low
The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad
The CMOS checksum is incorrect. CMOS memory may have been
corrupted. Run Setup to reset values.
Memory Size Decreased
Memory size has decreased since the last boot. If no memory was
removed, then memory may be bad.
No Boot Device Available
System did not find a device to boot.
57
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