MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
General Description
The MAX2062 high-linearity, dual analog/digital variablegain amplifier (VGA) operates in the 50MHz to 1000MHz
frequency range with two independent attenuators in
each signal path. Each digital attenuator is controlled
as a slave peripheral using either the SPI-compatible
interface, or a 5-bit parallel bus with 31dB total adjustment range in 1dB steps. An added feature allows
rapid-fire gain selection among each of the four steps,
preprogrammed by the user through the SPI-compatible
interface. A separate 2-pin control lets the user quickly
access any one of four customized attenuation states
without reprogramming the SPI bus. Each analog attenuator is controlled using an external voltage or through the
SPI-compatible interface using an on-chip 8-bit DAC.
Since each of the stages has its own external RF input
and RF output, this component can be configured to
either optimize noise figure (NF) (amplifier configured
first), OIP3 (amplifier last), or a compromise of NF and
OIP3. The device’s performance features include 24dB
amplifier gain (amplifier only), 7.3dB NF at maximum
gain (includes attenuator insertion losses), and a high
OIP3 level of +41dBm. Each of these features makes
the device an ideal VGA for multipath receiver and transmitter applications.
In addition, the device operates from a single +5V
supply with full performance or a +3.3V supply for an
enhanced power-savings mode with lower performance.
The device is available in a compact 48-pin TQFN
package (7mm x 7mm) with an exposed pad. Electrical
performance is guaranteed over the extended temperature range, from TC = -40NC to +85NC.
Applications
Features
S Independently Controlled Dual Paths
S 50MHz to 1000MHz RF Frequency Range
S Pin-Compatible Family Includes
MAX2063 (Digital-Only VGA)
MAX2064 (Analog-Only VGA)
S 19.4dB (typ) Maximum Gain
S 0.34dB Gain Flatness Over 100MHz Bandwidth
S 64dB Gain Range (33dB Analog Plus 31dB Digital)
S 56dB Path Isolation (at 200MHz)
S Built-In 8-Bit DACs for Analog Attenuation Control
SSupports Four Rapid-Fire Preprogrammed
Attenuator States
Quickly Access Any One of Four Customized Attenuator States
Ideal for Fast-Attack, High-Level Blocker Protection
Protects ADC Overdrive Condition
SExcellent Linearity (Configured with Amp Last at
200MHz)
+41dBm OIP3
+56dBm OIP2
+19dBm Output 1dB Compression Point
S 7.3dB Typical Noise Figure (at 200MHz)
S Fast, 25ns Digital Switching
S Very Low Digital VGA Amplitude Overshoot/
Undershoot
S Single +5V Supply (or +3.3V Operation)
S Amplifier Power-Down Mode for TDD Applications
Ordering Information
IF and RF Gain Stages
Temperature-Compensation Circuits
TEMP RANGE
PIN-PACKAGE
GSM/EDGE Base Stations
MAX2062ETM+
-40NC to +85NC
48 TQFN-EP*
WCDMA, TD-SCDMA, and cdma2000M Base
Stations
MAX2062ETM+T
-40NC to +85NC
48 TQFN-EP*
WiMAXM,
LTE, and TD-LTE Base Stations and
Customer-Premise Equipment
PART
+Denotes lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
T = Tape and reel.
Fixed Broadband Wireless Access
Wireless Local Loop
cdma2000 is a registered certification mark and registered
service mark of the Telecommunications Industry Association.
WiMAX is a registered certification mark and registered service mark of the WiMAX Forum.
For pricing, delivery, and ordering information, please contact Maxim Direct
at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com.
19-5511; Rev 2; 8/15
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
ABSOLUTE MAXIMUM RATINGS
VCC_AMP_1, VCC_AMP_2, VCC_RG to GND...........-0.3V
STA_A_1, STA_A_2, STA_B_1, STA_B_2,
PD_1, PD_2, AMPSET to GND..........................-0.3V
A_VCTL_1, A_VCTL_2 to GND..............................-0.3V
DAT, CS, CLK, AA_SP, DA_SP to GND................-0.3V
D0_1, D1_1, D2_1, D3_1, D4_1, D0_2, D1_2,
D2_2, D3_2, D4_2 to GND................................-0.3V
AMP_IN_1, AMP_IN_2 to GND...........................+0.95V
AMP_OUT_1, AMP_OUT_2 to GND......................-0.3V
D_ATT_IN_1, D_ATT_IN_2, D_ATT_OUT_1,
D_ATT_OUT_2 to GND.......................................... 0V
A_ATT_IN_1, A_ATT_IN_2, A_ATT_OUT_1,
A_ATT_OUT_2 to GND.......................................... 0V
to +5.5V
to +3.6V
to +3.6V
to +3.6V
to +3.6V
to +1.2V
to +5.5V
to +3.6V
to +3.6V
REG_OUT to GND.................................................-0.3V to +3.6V
RF Input Power (D_ATT_IN_1, D_ATT_IN_2)................ +20dBm
RF Input Power (A_ATT_IN_1, A_ATT_IN_2) ............... +20dBm
RF Input Power (AMP_IN_1, AMP_IN_2)....................... +18dBm
qJC (Notes 1, 2).......................................................... +12.3NC/W
qJA (Notes 2, 3)............................................................. +38NC/W
Continuous Power Dissipation (Note 1)...............................5.3W
Operating Case Temperature Range (Note 4)... -40NC to +85NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Note 1: Based on junction temperature TJ = TC + (qJC x VCC x ICC). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150NC.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Note 3: Junction temperature TJ = TA + (qJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150NC.
Note 4:TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, VCC = VCC_AMP_1 = VCC_AMP_2 = VCC_RG = 4.75V to 5.25V, AMPSET = 0, PD_1 = PD_2 = 0,
TC = -40NC to +85NC. Typical values are at VCC_ = 5.0V and TC = +25NC, unless otherwise noted.)
PARAMETER
SYMBOL
Supply Voltage
VCC
Supply Current
IDC
Power-Down Current
Logic-Low Input Voltage
Logic-High Input Voltage
Input Logic Current
IDCPD
CONDITIONS
MIN
4.75
PD_1 = PD_2 = 1, VIH = 3.3V
TYP
MAX
5
5.25
V
148
210
mA
8
mA
0.5
V
5.3
VIL
UNITS
VIH
1.7
3.465
V
IIH, IIL
-1
+1
FA
3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, VCC = VCC_AMP_1 = VCC_AMP_2 = VCC_RG = 3.135V to 3.465V, AMPSET = 1, PD_1 = PD_2 = 0,
TC = -40NC to +85NC. Typical values are at VCC_ = 3.3V and TC = +25NC, unless otherwise noted.)
PARAMETER
SYMBOL
Supply Voltage
VCC
Supply Current
IDC
Power-Down Current
IDCPD
CONDITIONS
PD_1 = PD_2 = 1, VIH = 3.3V
MIN
TYP
MAX
UNITS
3.135
3.3
3.465
V
87
145
mA
4.5
8
mA
Logic-Low Input Voltage
VIL
0.5
V
Logic-High Input Voltage
VIH
1.7
V
2 Maxim Integrated
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER
RF Frequency
SYMBOL
fRF
CONDITIONS
(Note 5)
MIN
TYP
50
MAX
UNITS
1000
MHz
5.0V SUPPLY AC ELECTRICAL CHARACTERISTICS (Each Path, Unless Otherwise
Noted)
(Typical Application Circuit, VCC = VCC_AMP_1 = VCC_AMP_2 = VCC_RG = 4.75V to 5.25V, attenuators are set for maximum gain, RF
ports are driven from 50I sources, AMPSET = 0, PD_1 = PD_2 = 0, 100MHz P fRF P 500MHz, TC = -40NC to +85NC. Typical values
are at maximum gain setting, VCC_ = 5.0V, PIN = -20dBm, fRF = 350MHz, and TC = +25NC, unless otherwise noted.) (Note 6)
PARAMETER
Small-Signal Gain
SYMBOL
G
CONDITIONS
MIN
20.3
fRF = 100MHz
19.9
fRF = 200MHz
19.4
fRF = 350MHz, TC = +25NC
17.0
18.6
fRF = 750MHz
17.8
fRF = 900MHz
16.5
-0.01
Gain Flatness vs. Frequency
NF
Total Attenuation Range
Output Second-Order Intercept
Point
OIP2
Path Isolation
Output Third-Order Intercept
Point
OIP3
From 100MHz to 200MHz
0.5
Any 100MHz frequency band from 200MHz
to 500MHz
0.34
fRF = 50MHz
6.4
fRF = 100MHz
6.8
fRF = 200MHz
7.3
fRF = 350MHz
7.6
fRF = 450MHz
7.8
fRF = 750MHz
8.7
Maxim Integrated
P1dB
MAX
UNITS
21.0
dB
dB/NC
dB
dB
fRF = 900MHz
9.0
Analog and digital combined
64.1
dB
POUT = 0dBm/tone, Df = 1MHz, f1 + f2
52.1
dBm
RF input 1 amplified power measured at RF
output 2 relative to RF output 1, all unused
ports terminated to 50I
48.6
RF input 2 amplified signal measured at RF
output 1 relative to RF output 2, all unused
ports terminated to 50I
47.7
POUT = 0dBm/tone, Df = 1MHz, fRF = 50MHz
47.5
POUT = 0dBm/tone, Df = 1MHz, fRF = 100MHz
43.4
POUT = 0dBm/tone, Df = 1MHz, fRF = 200MHz
41.3
POUT = 0dBm/tone, Df = 1MHz, fRF = 350MHz
37.4
POUT = 0dBm/tone, Df = 1MHz, fRF = 450MHz
35.1
POUT = 0dBm/tone, Df = 1MHz, fRF = 750MHz
28.8
dB
fRF = 350MHz, TC = +25NC (Note 7)
dBm
25.8
POUT = 0dBm/tone, Df = 1MHz, fRF = 900MHz
Output -1dB Compression Point
18.9
fRF = 450MHz
Gain vs. Temperature
Noise Figure
TYP
fRF = 50MHz
17
18.8
dBm
3
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
5.0V SUPPLY AC ELECTRICAL CHARACTERISTICS (Each Path, Unless Otherwise
Noted) (continued)
(Typical Application Circuit, VCC = VCC_AMP_1 = VCC_AMP_2 = VCC_RG = 4.75V to 5.25V, attenuators are set for maximum gain, RF
ports are driven from 50I sources, AMPSET = 0, PD_1 = PD_2 = 0, 100MHz P fRF P 500MHz, TC = -40NC to +85NC. Typical values
are at maximum gain setting, VCC_ = 5.0V, PIN = -20dBm, fRF = 350MHz, and TC = +25NC, unless otherwise noted.) (Note 6)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Second Harmonic
POUT = +3dBm
-55.0
dBc
Third Harmonic
POUT = +3dBm
-72.7
dBc
Group Delay
Includes EV kit PCB delays
1.03
ns
Amplifier Power-Down Time
PD_1 or PD_2 from 0 to 1, amplifier DC
supply current settles to within 0.1mA
0.5
Fs
Amplifier Power-Up Time
PD_1 or PD_2 from 1 to 0, amplifier DC
supply current settles to within 1%
0.5
Fs
50I source
16.1
dB
50I load
30.8
dB
3.0
dB
Input Return Loss
Output Return Loss
RLIN
RLOUT
DIGITAL ATTENUATOR (Each Path, Unless Otherwise Noted)
Insertion Loss
Input Second-Order Intercept
Point
PIN1 = 0dBm, PIN2 = 0dBm (minimum
attenuation), Df = 1MHz, f1 + f2
53.6
dBm
Input Third-Order Intercept Point
PIN1 = 0dBm, PIN2 = 0dBm (minimum
attenuation), Df = 1MHz
41.5
dBm
Attenuation Range
fRF = 350MHz, TC = +25NC, VCC = 5.0V
30.9
dB
Step Size
29.5
1
dB
Relative Attenuation Accuracy
0.13
dB
Absolute Attenuation Accuracy
0.14
dB
Insertion Phase Step
fRF = 170MHz
0dB to 16dB
0
0dB to 24dB
1.1
0dB to 31dB
1.2
1.0
Degrees
Amplitude Overshoot/Undershoot
Between any two Elapsed time = 15ns
states
Elapsed time = 40ns
Switching Speed
RF settled to
within Q0.1dB
Input Return Loss
50I source
22.0
dB
Output Return Loss
50I load
21.9
dB
0.05
31dB to 0dB
25
0dB to 31dB
21
dB
ns
ANALOG ATTENUATOR (Each Path, Unless Otherwise Noted)
Insertion Loss
2.2
dB
Input Second-Order Intercept
Point
PIN1 = 0dBm, PIN2 = 0dBm (minimum
attenuation), Df = 1MHz, f1 + f2
61.9
dBm
Input Third-Order Intercept Point
PIN1 = 0dBm, PIN2 = 0dBm (minimum
attenuation), Df = 1MHz
37.0
dBm
4 Maxim Integrated
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
5.0V SUPPLY AC ELECTRICAL CHARACTERISTICS (Each Path, Unless Otherwise
Noted) (continued)
(Typical Application Circuit, VCC = VCC_AMP_1 = VCC_AMP_2 = VCC_RG = 4.75V to 5.25V, attenuators are set for maximum gain, RF
ports are driven from 50I sources, AMPSET = 0, PD_1 = PD_2 = 0, 100MHz P fRF P 500MHz, TC = -40NC to +85NC. Typical values
are at maximum gain setting, VCC_ = 5.0V, PIN = -20dBm, fRF = 350MHz, and TC = +25NC, unless otherwise noted.) (Note 6)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
29.5
33.2
dB
Analog control input
-13.3
dB/V
Maximum Gain Control Slope
Over analog control input range
-35.2
dB/V
Insertion Phase Change
Over analog control input range
17.6
Deg
Attenuation Range
fRF = 350MHz, TC = +25NC, VCC = 5.0V
Gain Control Slope
RF settled to
within Q0.5dB
Attenuator Response Time
AA_SP = 0, VA_VCTL__
from 2.75V to 0.25V
500
AA_SP = 1, DAC code
from 11111111 to
00000000, from CS rising
edge
500
AA_SP = 0, VA_VCTL__
from 0.25V to 2.75V
500
AA_SP = 1, DAC code
from 00000000 to
11111111, from CS rising
edge
500
Analog Control Input Range
UNITS
ns
Over analog control input from 0.25V to
2.75V
Group Delay vs. Control Voltage
MAX
-0.34
0.25
Analog Control Input Impedance
ns
2.75
V
19.2
kI
Input Return Loss
50I source
16.1
dB
Output Return Loss
50I load
16.8
dB
D/A CONVERTER
Number of Bits
8
DAC code = 00000000
Output Voltage
DAC code = 11111111
Bits
0.35
2.7
V
SERIAL PERIPHERAL INTERFACE (SPI)
Maximum Clock Speed
20
MHz
Data-to-Clock Setup Time
tCS
2
ns
Data-to-Clock Hold Time
tCH
2.5
ns
Clock-to-CS Setup Time
tES
3
ns
CS Positive Pulse Width
tEW
7
ns
CS Setup Time
Clock Pulse Width
tEWS
3.5
ns
tCW
5
ns
Maxim Integrated
5
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
3.3V SUPPLY AC ELECTRICAL CHARACTERISTICS (Each Path, Unless Otherwise Noted)
(Typical Application Circuit, VCC = VCC_AMP_1 = VCC_AMP_2 = VCC_RG = 3.135V to 3.465V, attenuators are set for maximum gain,
RF ports are driven from 50I sources, AMPSET = 1, PD_1 = PD_2 = 0, 100MHz P fRF P 500MHz, TC = -40NC to +85NC. Typical
values are at maximum gain setting, VCC_ = 3.3V, PIN = -20dBm, fRF = 350MHz, and TC = +25NC, unless otherwise noted.) (Note 6)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
Small-Signal Gain
MAX
UNITS
18.8
dB
29.4
dBm
Noise Figure
7.8
dB
Total Attenuation Range
64.1
dB
Output Third-Order Intercept Point
OIP3
POUT = 0dBm/tone
Path Isolation
Output -1dB Compression Point
P1dB
RF input 1 amplified power measured at RF
output 2 relative to RF output 1, all unused
ports terminated to 50I
49.1
RF input 2 amplified signal measured at RF
output 1 relative to RF output 2, all unused
ports terminated to 50I
48.0
(Note 7)
13.4
dB
dBm
Note 5: Operation outside this range is possible, but with degraded performance of some parameters. See the Typical Operating
Characteristics section.
Note 6: All limits include external component losses. Output measurements are performed at the RF output port of the Typical
Application Circuit.
Note 7: It is advisable not to continuously operate the RF input 1 or RF input 2 above +15dBm.
Typical Operating Characteristics
(Typical Application Circuit, VCC = VCC_AMP_1 = VCC_AMP_2 = VCC_RG = 5.0V, attenuators are set for maximum gain, RF ports are
driven from 50I sources, AMPSET = 0, PD_1 = PD_2 = 0, PIN = -20dBm, fRF = 350MHz, and TC = +25NC, unless otherwise noted.)
SUPPLY CURRENT vs. VCC
20
TC = +25°C
TC = +85°C
TC = +25°C
17
140
16
4.875
5.00
VCC (V)
6 5.125
5.250
VCC = 4.75V, 5.00V, 5.25V
19
18
17
TC = +85°C
16
15
130
4.750
21
20
19
18
MAX2062 toc03
TC = -40°C
MAX2062 toc02
NOTCH DUE TO SELF-RESONANCE OF
BIAS COIL. SEE TABLE 7.
21
22
GAIN (dB)
150
MAX2062 toc01
TC = -40°C
160
GAIN vs. RF FREQUENCY
GAIN vs. RF FREQUENCY
22
GAIN (dB)
SUPPLY CURRENT (mA)
170
15
14
14
50
250
450
650
RF FREQUENCY (MHz)
850
1050
50
250
450
650
850
1050
RF FREQUENCY (MHz)
Maxim Integrated
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
Typical Operating Characteristics (continued)
(Typical Application Circuit, VCC = VCC_AMP_1 = VCC_AMP_2 = VCC_RG = 5.0V, attenuators are set for maximum gain, RF ports are
driven from 50I sources, AMPSET = 0, PD_1 = PD_2 = 0, PIN = -20dBm, fRF = 350MHz, and TC = +25NC, unless otherwise noted.)
DIGITAL ATTENUATOR RELATIVE
ERROR vs. RF FREQUENCY
-8
0.25
0
-0.25
450
650
850
1050
0.25
0
-0.25
-0.75
-1.00
250
0.50
-0.50
ERROR FROM 23dB TO 24dB
-0.75
-18
MAX2062 toc06
MAX2062 toc05
0.50
0.75
-0.50
-1.00
50
250
450
650
850
1050
50
250
450
650
1050
850
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
INPUT MATCH OVER DIGITAL ATTENUATOR
SETTING vs. RF FREQUENCY
OUTPUT MATCH OVER DIGITAL
ATTENUATOR SETTING vs. RF FREQUENCY
CHANNEL-TO-CHANNEL ISOLATION
vs. RF FREQUENCY
8dB, 16dB
-20
-30
31dB
-40
4dB
2dB
-50
0
200
400
600
800
1000
-10
-20
2dB
0dB, 1dB, 4dB, 8dB
-30
-40
BOTH DIGITAL ATTENUATORS = 31dB
30
40
50
BOTH DIGITAL ATTENUATORS = 0dB
60
70
BOTH ANALOG ATTENUATORS = 0dB
16dB, 31dB
-50
80
0
200
400
600
800
1000
50
250
450
650
850
RF FREQUENCY (MHz)
REVERSE ISOLATION OVER DIGITAL
ATTENUATOR SETTING vs. RF FREQUENCY
DIGITAL ATTENUATOR PHASE CHANGE
BETWEEN STATES vs. RF FREQUENCY
GAIN OVER ANALOG ATTENUATOR
SETTING vs. RF FREQUENCY
DIGITAL ATTENUATOR 0dB
50
DIGITAL ATTENUATOR 31dB
60
70
80
REFERENCED TO HIGH GAIN STATE
40
30
20
10
0
-10
-20
POSITIVE PHASE = ELECTRICALLY SHORTER
-30
50
250
450
650
RF FREQUENCY (MHz)
Maxim Integrated
850
1050
MAX2062 toc11
MAX2062 toc10
40
50
50
250
450
650
RF FREQUENCY (MHz)
850
1050
22
1050
MAX2062 toc12
RF FREQUENCY (MHz)
GAIN OVER ANALOG ATTENUATOR SETTING (dB)
RF FREQUENCY (MHz)
30
MAX2062 toc09
1dB
20
CHANNEL-TO-CHANNEL ISOLATION (dB)
0dB
-10
0
MAX2062 toc08
0
OUTPUT MATCH OVER DIGITAL ATTENUATOR SETTING (dB)
RF FREQUENCY (MHz)
MAX2062 toc07
INPUT MATCH OVER DIGITAL ATTENUATOR SETTING (dB)
1.00
ABSOLUTE ERROR (dB)
2
50
REVERSE ISOLATION OVER DIGITAL
ATTENUATOR SETTING (dB)
0.75
RELATIVE ERROR (dB)
12
DIGITAL ATTENUATOR ABSOLUTE
ERROR vs. RF FREQUENCY
1.00
MAX2062 toc04
22
DIGITAL ATTENUATOR PHASE CHANGE
BETWEEN STATES (DEGREES)
GAIN OVER DIGITAL ATTENUATOR SETTING (dB)
GAIN OVER DIGITAL ATTENUATOR
SETTING vs. RF FREQUENCY
DAC CODE 64
17
12
DAC CODE 32
7
DAC CODE 0
2
-3
-8
DAC CODE 128
DAC CODE 255
250
650
-13
-18
50
450
850
1050
RF FREQUENCY (MHz)
7
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
Typical Operating Characteristics (continued)
(Typical Application Circuit, VCC = VCC_AMP_1 = VCC_AMP_2 = VCC_RG = 5.0V, attenuators are set for maximum gain, RF ports are
driven from 50I sources, AMPSET = 0, PD_1 = PD_2 = 0, PIN = -20dBm, fRF = 350MHz, and TC = +25NC, unless otherwise noted.)
GAIN vs. ANALOG ATTENUATOR SETTING
12
200MHz
GAIN (dB)
7
350MHz
1000MHz
-8
-8
-13
-13
-13
-18
32
64
96
128 160 192 224 256
-18
0
32
64
96
128 160 192 224 256
0
96
128 160 192 224 256
OUTPUT MATCH vs. ANALOG
ATTENUATOR SETTING
CHANNEL-TO-CHANNEL ISOLATION
vs. RF FREQUENCY
-20
-10
OUTPUT MATCH (dB)
-15
350MHz
-20
50MHz, 200MHz, 350MHz
-30
-40
1000MHz
-25
1000MHz
64
96
128 160 192 224 256
0
32
64
96
REVERSE ISOLATION OVER ANALOG
ATTENUATOR SETTING vs. RF FREQUENCY
S21 PHASE CHANGE
vs. ANALOG ATTENUATOR SETTING
50
DAC CODE 255
60
70
80
80
S21 PHASE CHANGE (DEGREES)
MAX2062 toc19
DAC CODE 0
REFERENCED TO HIGH GAIN STATE
60
40
250
450
650
RF FREQUENCY (MHz)
850
1050
50
60
BOTH ANALOG ATTENUATORS = CODE 0
70
BOTH DIGITAL ATTENUATORS = 0dB
1000MHz
350MHz
POSITIVE PHASE = ELECTRICALLY SHORTER
32
64
96
128 160 192 224 256
ANALOG ATTENUATOR SETTING (DAC CODE)
850
TC = +85°C
10
TC = +25°C
9
1050
8
7
6
TC = -40°C
5
50MHz
0
650
NOISE FIGURE vs. RF FREQUENCY
200MHz
-60
450
11
0
-20
250
RF FREQUENCY (MHz)
20
-40
90
40
50
MAX2062 toc20
ANALOG ATTENUATOR SETTING (DAC CODE)
40
30
128 160 192 224 256
ANALOG ATTENUATOR SETTING (DAC CODE)
30
BOTH ANALOG ATTENUATORS = CODE 255
20
80
-50
32
NOISE FIGURE (dB)
-30
10
CHANNEL-TO-CHANNEL ISOLATION (dB)
MAX2062 toc16
0
MAX2062 toc18
INPUT MATCH vs. ANALOG
ATTENUATOR SETTING
MAX2062 toc17
ANALOG ATTENUATOR SETTING (DAC CODE)
-10
50
64
ANALOG ATTENUATOR SETTING (DAC CODE)
200MHz
0
32
ANALOG ATTENUATOR SETTING (DAC CODE)
50MHz
MAX2062 toc15
2
-8
-5
INPUT MATCH (dB)
2
VCC = 4.75V, 5.00V, 5.25V
7
-3
0
REVERSE ISOLATION OVER ANALOG
ATTENUATOR SETTING (dB)
7
-3
0
8 12
TC = -40°C, +25°C, +85°C
-3
-18
fRF = 350MHz
17
MAX2062 toc21
2
fRF = 350MHz
17
GAIN vs. ANALOG ATTENUATOR SETTING
22
GAIN (dB)
12
GAIN (dB)
MAX2062 toc13
50MHz
17
22
MAX2062 toc14
GAIN vs. ANALOG ATTENUATOR SETTING
22
4
50
250
450
650
850
1050
RF FREQUENCY (MHz)
Maxim Integrated
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
Typical Operating Characteristics (continued)
(Typical Application Circuit, VCC = VCC_AMP_1 = VCC_AMP_2 = VCC_RG = 5.0V, attenuators are set for maximum gain, RF ports are
driven from 50I sources, AMPSET = 0, PD_1 = PD_2 = 0, PIN = -20dBm, fRF = 350MHz, and TC = +25NC, unless otherwise noted.)
OUTPUT P1dB vs. RF FREQUENCY
6
TC = +85°C
15
TC = +25°C
13
5
11
250
450
650
850
1050
250
RF FREQUENCY (MHz)
OUTPUT IP3 vs. RF FREQUENCY
POUT = 0dBm/TONE
40
TC = -40°C
35
TC = +85°C
30
650
850
40
35
VCC = 4.75V
44
250
fRF = 350MHz
850
TC = +25°C LSB, USB
TC = +85°C LSB, USB
84
126
168
ANALOG ATTENUATOR STATE (DAC CODE)
Maxim Integrated
POUT = -3dBm/TONE
0
210
4
8
12
16
20
24
28
POUT = 3dBm
2ND HARMONIC vs. RF FREQUENCY
60
TC = +25°C
50
TC = -40°C
70
POUT = 3dBm
60
VCC = 5.25V
VCC = 5.00V
50
VCC = 4.75V
40
30
25
42
TC = +85°C LSB
TC = +85°C USB
30
1050
40
30
0
36
DIGITAL ATTENUATOR STATE (dB)
TC = +85°C
2ND HARMONIC (dBc)
40
35
38
2ND HARMONIC vs. RF FREQUENCY
POUT = -3dBm/TONE
TC = -40°C LSB, USB
TC = +25°C LSB, USB
34
650
70
MAX2062 toc28
45
450
1050
TC = -40°C LSB
TC = -40°C USB
40
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
OUTPUT IP3 vs. ANALOG
ATTENUATOR STATE
fRF = 350MHz
42
32
50
1050
850
OUTPUT IP3 vs. DIGITAL
ATTENUATOR STATE
2ND HARMONIC (dBc)
450
650
OUTPUT IP3 vs. RF FREQUENCY
MAX2062 toc29
250
450
RF FREQUENCY (MHz)
VCC = 5.25V
30
250
50
RF FREQUENCY (MHz)
20
50
VCC = 5.00V
1050
25
20
OUTPUT IP3 (dBm)
850
VCC = 5.00V
TC = +25°C
25
650
POUT = 0dBm/TONE
45
OUTPUT IP3 (dBm)
OUTPUT IP3 (dBm)
45
450
50
MAX2062 toc25
50
15
11
50
OUTPUT IP3 (dBm)
50
VCC = 4.75V
13
MAX2062 toc26
4
17
MAX2062 toc27
7
17
MAX2062 toc30
8
VCC = 5.25V
19
OUTPUT P1dB (dBm)
9
TC = -40°C
19
OUTPUT P1dB (dBm)
NOISE FIGURE (dB)
VCC = 4.75V, 5.00V, 5.25V
21
MAX2062 toc23
MAX2062 toc22
10
OUTPUT P1dB vs. RF FREQUENCY
21
MAX2062 toc24
NOISE FIGURE vs. RF FREQUENCY
11
30
50
250
450
650
RF FREQUENCY (MHz)
850
1050
50
250
450
650
850
1050
RF FREQUENCY (MHz)
9
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
Typical Operating Characteristics (continued)
(Typical Application Circuit, VCC = VCC_AMP_1 = VCC_AMP_2 = VCC_RG = 5.0V, attenuators are set for maximum gain, RF ports are
driven from 50I sources, AMPSET = 0, PD_1 = PD_2 = 0, PIN = -20dBm, fRF = 350MHz, and TC = +25NC, unless otherwise noted.)
TC = -40°C
TC = +25°C
50
TC = +85°C
55
90
TC = -40°C
50
45
8
12
16
20
24
28
126
168
3RD HARMONIC vs. DIGITAL
ATTENUATOR STATE
MAX2062 toc34
3RD HARMONIC vs. RF FREQUENCY
85
VCC = 5.00V
70
VCC = 4.75V
TC = +85°C
80
75
250
450
650
850
1050
RF FREQUENCY (MHz)
3RD HARMONIC vs. ANALOG
ATTENUATOR STATE
POUT = 0dBm
TC = -40°C
50
90
TC = +25°C
TC = +85°C
POUT = 0dBm
TC = -40°C
85
3RD HARMONIC (dBc)
VCC = 5.25V
70
210
fRF = 350MHz
3RD HARMONIC (dBc)
90
60
84
ANALOG ATTENUATOR STATE (DAC CODE)
POUT = 3dBm
80
42
DIGITAL ATTENUATOR STATE (dB)
100
TC = +25°C
50
0
MAX2062 toc35
4
TC = -40°C
80
60
45
0
3RD HARMONIC (dBc)
TC = +25°C
60
POUT = 3dBm
TC = +25°C
fRF = 350MHz
MAX2062 toc36
55
fRF = 350MHz
3RD HARMONIC (dBc)
60
POUT = 0dBm
65
2ND HARMONIC (dBc)
2ND HARMONIC (dBc)
fRF = 350MHz
3RD HARMONIC vs. RF FREQUENCY
100
MAX2062 toc32
POUT = 0dBm
TC = +85°C
70
MAX2062 toc31
65
2ND HARMONIC vs. ANALOG
ATTENUATOR STATE
MAX2062 toc33
2ND HARMONIC vs. DIGITAL
ATTENUATOR STATE
80
75
TC = +85°C
70
65
450
650
850
60
70
1050
0
RF FREQUENCY (MHz)
MAX2062 toc37
70
60
16
20
24
28
TC = +25°C
50
VCC = 5.25V
50
40
30
65
126
168
210
POUT = -3dBm/TONE
fRF = 350MHz
60
TC = +85°C
55
TC = +25°C
50
650
RF FREQUENCY (MHz)
850
1050
TC = -40°C
45
40
30
450
84
VCC = 4.75V
40
250
42
OIP2 vs. DIGITAL ATTENUATOR STATE
VCC = 5.00V
TC = -40°C
50
0
ANALOG ATTENUATOR STATE (DAC CODE)
POUT = 0dBm/TONE
60
OIP2 (dBm)
OIP2 (dBm)
12
OIP2 vs. RF FREQUENCY
POUT = 0dBm/TONE
TC = +85°C
10 8
DIGITAL ATTENUATOR STATE (dB)
OIP2 vs. RF FREQUENCY
70
4
OIP2 (dBm)
250
MAX2062 toc38
50
MAX2062 toc39
50
50
250
450
650
RF FREQUENCY (MHz)
850
1050
0
4
8
12
16
20
24
28
DIGITAL ATTENUATOR STATE (dB)
Maxim Integrated
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
Typical Operating Characteristics (continued)
(Typical Application Circuit, VCC = VCC_AMP_1 = VCC_AMP_2 = VCC_RG = 5.0V, attenuators are set for maximum gain, RF ports are
driven from 50I sources, AMPSET = 0, PD_1 = PD_2 = 0, PIN = -20dBm, fRF = 350MHz, and TC = +25NC, unless otherwise noted.)
OIP2 vs. ANALOG ATTENUATOR STATE
50
TC = -40°C
45
40
2.0
1.5
1.0
TC = -40°C, +25°C, +85°C
0.5
42
0
84
126
168
32
64
DAC VOLTAGE DRIFT vs. DAC CODE
0
-0.01
TC CHANGED FROM +25°C TO +85°C
-0.03
0
-0.04
-0.0075
-0.05
0.0100
0
32
64
96
128 160 192 224 256
VCC CHANGED FROM 5.00V TO 4.75V
0
32
64
96
GAIN vs. RF FREQUENCY
(DIGITAL ATTENUATOR ONLY)
GAIN vs. RF FREQUENCY
(ANALOG ATTENUATOR ONLY)
GAIN (dB)
-1
VCC = 4.75V, 5.00V, 5.25V
-3
-4
-2
-3
250
450
650
RF FREQUENCY (MHz)
Maxim Integrated
850
1050
MAX2062 toc42
250
450
650
850
0
-1
1050
-2
-3
VCC = 4.75V, 5.00V, 5.25V
TC = +25°C
-4
-5
50
TC = +25°C
GAIN vs. RF FREQUENCY
(ANALOG ATTENUATOR ONLY)
-4
-5
50
TC = -40°C
TC = +85°C
TC = +85°C
RF FREQUENCY (MHz)
0
MAX2062 toc46
-2
-3
-5
128 160 192 224 256
DAC CODE
-1
TC = -40°C
-2
-4
DAC CODE
0
-1
0.0025
-0.0050
128 160 192 224 256
0
VCC CHANGED FROM 5.00V TO 5.25V
-0.0025
96
GAIN vs. RF FREQUENCY
(DIGITAL ATTENUATOR ONLY)
GAIN (dB)
-0.02
64
DAC VOLTAGE DRIFT vs. DAC CODE
0.0075
0.0050
32
DAC CODE
GAIN (dB)
0.01
VCC = 4.75V, 5.00V, 5.25V
0
MAX2062 toc44
MAX2062 toc43
TC CHANGED FROM +25°C TO -40°C
0.02
128 160 192 224 256
MAX2062 toc47
DAC VOLTAGE DRIFT (V)
0.03
96
0.0100
DAC VOLTAGE DRIFT (V)
0.04
1.0
DAC CODE
ANALOG ATTENUATOR STATE (DAC CODE)
0.05
1.5
0
0
210
2.0
0.5
0
35
GAIN (dB)
2.5
MAX2062 toc45
DAC VOLTAGE (V)
OIP2 (dBm)
TC = +25°C
2.5
MAX2062 toc48
fRF = 350MHz
55
DAC VOLTAGE (V)
POUT = -3dBm/TONE
DAC VOLTAGE vs. DAC CODE
3.0
MAX2062 toc41
TC = +85°C
DAC VOLTAGE vs. DAC CODE
3.0
MAX2062 toc40
60
-5
50
250
450
650
RF FREQUENCY (MHz)
850
1050
50
250
450
650
850
1050
RF FREQUENCY (MHz)
11
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
Typical Operating Characteristics (continued)
(Typical Application Circuit, VCC = VCC_AMP_1 = VCC_AMP_2 = VCC_RG = 3.3V, attenuators are set for maximum gain, RF ports are
driven from 50I sources, AMPSET = 1, PD_1 = PD_2 = 0, PIN = -20dBm, fRF = 350MHz, and TC = +25NC, unless otherwise noted.)
SUPPLY CURRENT vs. VCC
GAIN vs. RF FREQUENCY
19
18
TC = +85°C
17
3.2
3.1
3.3
3.4
16
16
15
15
MAX2062 toc51
14
50
250
450
650
850
1050
250
50
450
650
850
INPUT MATCH OVER DIGITAL ATTENUATOR
SETTING vs. RF FREQUENCY
OUTPUT MATCH OVER DIGITAL
ATTENUATOR SETTING vs. RF FREQUENCY
INPUT MATCH vs. ANALOG
ATTENUATOR SETTING
8dB, 16dB
-20
-30
4dB
31dB
-40
2dB
-50
200
0
400
600
800
1000
-10
2dB
-20
-30
0dB, 1dB, 4dB, 8dB
1000MHz
50MHz, 200MHz, 350MHz
-40
-50
32
64
96
-20
128 160 192 224 256
ANALOG ATTENUATOR SETTING (DAC CODE)
350MHz
1000MHz
-30
0
200
400
600
800
1000
0
VCC = 3.3V
TC = +85°C
10
64
96
128 160 192 224 256
NOISE FIGURE vs. RF FREQUENCY
9
8
7
TC = -40°C
6
32
ANALOG ATTENUATOR SETTING (DAC CODE)
11
VCC = 3.30V
10
VCC = 3.135V
9
8
7
VCC = 3.465V
6
TC = +25°C
5
4
-50
200MHz
-15
-25
5
0
-10
NOISE FIGURE vs. RF FREQUENCY
NOISE FIGURE (dB)
-10
-30
50MHz
16dB, 31dB
-40
11
MAX2062 toc55
VCC = 3.3V
-20
-5
RF FREQUENCY (MHz)
OUTPUT MATCH vs. ANALOG
ATTENUATOR SETTING
0
VCC = 3.3V
INPUT MATCH (dB)
1dB
1050
0
NOISE FIGURE (dB)
-10
VCC = 3.3V
MAX2062 toc56
0dB
0
MAX2062 toc53
VCC = 3.3V
OUTPUT MATCH OVER DIGITAL ATTENUATOR SETTING (dB)
RF FREQUENCY (MHz)
MAX2062 toc52
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
OUTPUT MATCH (dB)
VCC = 3.30V
VCC (V)
0
12 VCC = 3.135V
17
14
3.5
18
MAX2062 toc54
TC = +85°C
VCC = 3.465V
19
MAX2062 toc57
80
60
INPUT MATCH OVER DIGITAL ATTENUATOR SETTING (dB)
20
TC = +25°C
GAIN (dB)
90
70
21
20
TC = +25°C
100
TC = -40°C
22
MAX2062 toc50
TC = -40°C
GAIN vs. RF FREQUENCY
VCC = 3.3V
21
GAIN (dB)
SUPPLY CURRENT (mA)
110
22
MAX2062 toc49
120
4
50
250
450
650
RF FREQUENCY (MHz)
850
1050
50
250
450
650
850
1050
RF FREQUENCY (MHz)
Maxim Integrated
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
Typical Operating Characteristics (continued)
(Typical Application Circuit, VCC = VCC_AMP_1 = VCC_AMP_2 = VCC_RG = 3.3V, attenuators are set for maximum gain, RF ports are
driven from 50I sources, AMPSET = 1, PD_1 = PD_2 = 0, PIN = -20dBm, fRF = 350MHz, and TC = +25NC, unless otherwise noted.)
12
10
TC = +85°C
8
VCC = 3.465V
10
8
6
VCC = 3.135V
250
450
650
850
1050
TC = +25°C
25
TC = +85°C
20
10
250
50
450
650
850
1050
250
50
450
650
850
RF FREQUENCY (MHz)
OUTPUT IP3 vs. RF FREQUENCY
OUTPUT IP3
vs. DIGITAL ATTENUATOR STATE
OUTPUT IP3
vs. ANALOG ATTENUATOR STATE
32
30
OUTPUT IP3 (dBm)
VCC = 3.30V
25
20
VCC = 3.135V
POUT = -3dBm/TONE
fRF = 350MHz
VCC = 3.3V
TC = -40°C LSB, USB
30
TC = +25°C LSB, USB
28
35
fRF = 350MHz
TC = -40°C LSB, USB
OUTPUT IP3 (dBm)
VCC = 3.465V
34
MAX2062 toc62
POUT = 0dBm/TONE
MAX2062 toc61
RF FREQUENCY (MHz)
15
1050
POUT = -3dBm/TONE
VCC = 3.3V
30
TC = +25°C LSB, USB
25
TC = +85°C LSB, USB
26
TC = +85°C LSB, USB
450
650
850
20
24
1050
0
RF FREQUENCY (MHz)
2ND HARMONIC vs. RF FREQUENCY
TC = +85°C
POUT = 3dBm
VCC = 3.3V
TC = +25°C
45
35
25
16
20
24
250
450
650
RF FREQUENCY (MHz)
Maxim Integrated
850
1050
84
126
210
ANALOG ATTENUATOR STATE (DAC CODE)
2ND HARMONIC vs. RF FREQUENCY
2ND HARMONIC
vs. DIGITAL ATTENUATOR STATE
70
POUT = 0dBm
fRF = 350MHz
VCC = 3.3V
55
VCC = 3.135V
45
VCC = 3.30V
50
168
DIGITAL ATTENUATOR STATE (dB)
25
50
42
0
28
POUT = 3dBm
35
TC = -40°C
12
VCC = 3.465V
2ND HARMONIC (dBc)
55
8
65
MAX2062 toc64
65
4
2ND HARMONIC (dBc)
250
MAX2062 toc65
50
250
450
650
RF FREQUENCY (MHz)
850
1050
60
MAX2062 toc66
10
2ND HARMONIC (dBc)
30
RF FREQUENCY (MHz)
40
35
VCC = 3.3V
15
6
50
OUTPUT IP3 (dBm)
12
POUT = 0dBm/TONE
TC = -40°C
35
MAX2062 toc63
TC = +25°C
14
OUTPUT P1dB (dBm)
OUTPUT P1dB (dBm)
14
VCC = 3.30V
OUTPUT IP3 (dBm)
VCC = 3.3V
OUTPUT IP3 vs. RF FREQUENCY
40
MAX2062 toc59
MAX2062 toc58
TC = -40°C
OUTPUT P1dB vs. RF FREQUENCY
16
MAX2062 toc60
OUTPUT P1dB vs. RF FREQUENCY
16
TC = +85°C
TC = +25°C
TC = -40°C
50
40
0
4
8
12
16
20
24
28
DIGITAL ATTENUATOR STATE (dB)
13
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
Typical Operating Characteristics (continued)
(Typical Application Circuit, VCC = VCC_AMP_1 = VCC_AMP_2 = VCC_RG = 3.3V, attenuators are set for maximum gain, RF ports are
driven from 50I sources, AMPSET = 1, PD_1 = PD_2 = 0, PIN = -20dBm, fRF = 350MHz, and TC = +25NC, unless otherwise noted.)
3RD HARMONIC vs. RF FREQUENCY
TC = -40°C
50
TC = +25°C
60
50
70
VCC = 3.30V
60
VCC = 3.135V
50
TC = +85°C
40
84
126
210
450
650
850
RF FREQUENCY (MHz)
3RD HARMONIC
vs. DIGITAL ATTENUATOR STATE
3RD HARMONIC
vs. ANALOG ATTENUATOR STATE
3RD HARMONIC (dBc)
65
TC = +25°C
60
55
TC = -40°C
VCC = 3.3V
TC = +25°C
55
TC = +85°C
8
12
16
20
24
DIGITAL ATTENUATOR STATE (dB)
126
168
OIP2 (dBm)
40
VCC = 3.3V
TC = +85°C
50
450
650
850
1050
OIP2 vs. ANALOG ATTENUATOR STATE
70
POUT = -3dBm/TONE
fRF = 350MHz
VCC = 3.3V
TC = +85°C
60
TC = +25°C
TC = +25°C
50
40
VCC = 3.135V
TC = -40°C
20
30
50
250
450
650
RF FREQUENCY (MHz)
14 250
RF FREQUENCY (MHz)
40
30
TC = -40°C
50
210
POUT = -3dBm/TONE
fRF = 350MHz
60
VCC = 3.30V
50
84
70
MAX2062 toc73
VCC = 3.465V
40
OIP2 vs. DIGITAL ATTENUATOR STATE
POUT = 0dBm/TONE
60
TC = +25°C
50
ANALOG ATTENUATOR STATE (DAC CODE)
OIP2 vs. RF FREQUENCY
70
1050
20
42
0
28
850
VCC = 3.3V
TC = +85°C
30
TC = +85°C
OIP2 (dBm)
4
650
POUT = 0dBm/TONE
60
MAX2062 toc74
0
450
70
50
50
250
OIP2 vs. RF FREQUENCY
65
60
50
RF FREQUENCY (MHz)
POUT = 0dBm
fRF = 350MHz
70
1050
OIP2 (dBm)
VCC = 3.3V
TC = -40°C
70
75
MAX2062 toc70
POUT = 0dBm
fRF = 350MHz
OIP2 (dBm)
250
50
ANALOG ATTENUATOR STATE (DAC CODE)
75
3RD HARMONIC (dBc)
168
40
MAX2062 toc71
42
0
VCC = 3.465V
40
MAX2062 toc72
TC = +25°C
TC = -40°C
POUT = 3dBm
MAX2062 toc75
TC = +85°C
70
3RD HARMONIC (dBc)
60
POUT = 3dBm
VCC = 3.3V
3RD HARMONIC (dBc)
2ND HARMONIC (dBc)
VCC = 3.3V
3RD HARMONIC vs. RF FREQUENCY
80
MAX2062 toc68
POUT = 0dBm
fRF = 350MHz
80
MAX2062 toc67
70
MAX2062 toc69
2ND HARMONIC
vs. ANALOG ATTENUATOR STATE
850
1050
TC = -40°C
30
0
4
8
12
16
20
24
DIGITAL ATTENUATOR STATE (dB)
28
0
42
84
126
168
210
ANALOG ATTENUATOR STATE (DAC CODE)
Maxim Integrated
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
GND
AMP_IN_2
PD_2
GND
AMP_OUT_2
REG_OUT
AMPSET
AMP_OUT_1
GND
PD_1
GND
TOP VIEW
AMP_IN_1
Pin Configuration
36 35 34 33 32 31 30 29 28 27 26 25
VCC_AMP_2
VCC_AMP_1
37
24
A_ATT_OUT_1
38
23
A_ATT_OUT_2
A_VCTL_1
39
22
A_VCTL_2
AA_SP
40
21
DA_SP
A_ATT_IN_1
41
20
A_ATT_IN_2
D4_1
42
19
D4_2
MAX2062
D_ATT_OUT_1
43
18
D_ATT_OUT_2
D3_1
44
17
D3_2
D2_1
45
16
D2_2
D1_1
46
15
D1_2
D0_1
47
14
D0_2
13
GND
8
9
10 11 12
GND
DAT
7
D_ATT_IN_2
STA_B_1
6
STA_A_2
5
VCC_RG
4
STA_B_2
3
CS
2
CLK
1
STA_A_1
+
D_ATT_IN_1
48
GND
GND
EP
TQFN
Pin Description
PIN
NAME
1, 12, 13, 25,
28, 33, 36, 48
GND
2
D_ATT_IN_1
3
STA_A_1
4
STA_B_1
5
DAT
SPI Data Digital Input
6
CLK
SPI Clock Digital Input
7
CS
8
VCC_RG
Maxim Integrated
FUNCTION
Ground
5-Bit Digital Attenuator Input (50I), Path 1. Requires a DC-blocking capacitor.
Digital Attenuator Preprogrammed Attenuation-State Logic Input, Path 1
State A
State B
Digital Attenuator
Logic = 0
Logic = 0
Preprogrammed State 1
Logic = 1
Logic = 0
Preprogrammed State 2
Logic = 0
Logic = 1
Preprogrammed State 3
Logic = 1
Logic = 1
Preprogrammed State 4
SPI Chip-Select Digital Input
Regulator Supply Input. Connect to a 3.3V or 5V external power supply. VCC_RG powers all circuits
except for the driver amplifiers. Bypass with a 10nF capacitor as close as possible to the pin.
15
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
Pin Description (continued)
PIN
FUNCTION
Digital Attenuator Preprogrammed Attenuation-State Logic Input, Path 2
State A
State B
Digital Attenuator
Logic = 0
Logic = 0
Preprogrammed State 1
Logic = 1
Logic = 0
Preprogrammed State 2
Logic = 0
Logic = 1
Preprogrammed State 3
Logic = 1
Logic = 1
Preprogrammed State 4
9
STA_B_2
10
STA_A_2
11
D_ATT_IN_2
14
D0_2
1dB Attenuator Logic Input, Path 2. Logic 0 = disable, logic 1 = enable.
15
D1_2
2dB Attenuator Logic Input, Path 2. Logic 0 = disable, logic 1 = enable.
16
D2_2
4dB Attenuator Logic Input, Path 2. Logic 0 = disable, logic 1 = enable.
17
D3_2
8dB Attenuator Logic Input, Path 2. Logic 0 = disable, logic 1 = enable.
18
D_ATT_OUT_2
19
D4_2
20
A_ATT_IN_2
21
DA_SP
Digital Attenuator Serial/Parallel Control Select. Set DA_SP to logic 1 to select serial control.
Set DA_SP to logic 0 to select parallel control.
22
A_VCTL_2
Analog Attenuator Voltage Control Input, Path 2. Bypass to ground with a 150pF capacitor
if on-chip DAC is used (AA_SP = 1).
23
A_ATT_OUT_2
Analog Attenuator Output (50I), Path 2. Requires a DC-blocking capacitor. Connect to
AMP_IN_2 through a 1000pF capacitor.
24
VCC_AMP_2
Driver Amplifier Supply Voltage Input, Path 2. Bypass with a 10nF capacitor as close as
possible to the pin.
26
AMP_IN_2
Driver Amplifier Input (50I), Path 2. Requires a DC-blocking capacitor. Connect to
A_ATT_OUT_2 through a 1000pF capacitor.
27
29
PD_2
5-Bit Digital Attenuator Input (50I), Path 2. Requires a DC-blocking capacitor.
5-Bit Digital Attenuator Output (50I), Path 2. Requires a DC-blocking capacitor. Connect to
A_ATT_IN_2 through a 1000pF capacitor.
16dB Attenuator Logic Input, Path 2. Logic 0 = disable, logic 1 = enable.
Analog Attenuator Input (50I), Path 2. Requires a DC-blocking capacitor. Connect to
D_ATT_OUT_2 through a 1000pF capacitor.
Power-Down, Path 2. See Table 2 for operation details.
AMP_OUT_2 Driver Amplifier Output (50I), Path 2. Connect a pullup inductor from AMP_OUT_2 to VCC_.
30
REG_OUT
31
AMPSET
32
16 NAME
Regulator Output. Bypass with 1FF capacitor.
Driver Amplifier Bias Setting for 3.3V Operation. Set to logic 1 for 3.3V operation on pins
VCC_AMP_1 and VCC_AMP_2. Set to logic 0 for 5V operation.
AMP_OUT_1 Driver Amplifier Output (50I), Path 1. Connect a pullup inductor from AMP_OUT_1 to VCC_.
34
PD_1
Power-Down, Path 1. See Table 2 for operation details.
35
AMP_IN_1
Driver Amplifier Input (50I), Path 1. Requires a DC-blocking capacitor. Connect to
A_ATT_OUT_1 through a 1000pF capacitor.
37
VCC_AMP_1
Driver Amplifier Supply Voltage Input, Path 1. Bypass with a 10nF capacitor as close as
possible to the pin.
38
A_ATT_OUT_1
Analog Attenuator Output (50I), Path 1. Requires a DC-blocking capacitor. Connect to
AMP_IN_1 through a 1000pF capacitor.
39
A_VCTL_1
Analog Attenuator Voltage Control Input, Path 1. Bypass to ground with a 150pF capacitor
if on-chip DAC is used (AA_SP = 1).
Maxim Integrated
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
Pin Description (continued)
PIN
NAME
FUNCTION
DAC Enable/Disable Logic Input for Analog Attenuators. Set AA_SP to logic 1 to enable on-chip
DAC circuit and digital SPI control. Set AA_SP to logic 0 to disable DAC circuit and digital SPI
control. When AA_SP = 0, use analog control lines (A_VCTL_1 and A_VCTL_2).
40
AA_SP
41
A_ATT_IN_1
42
D4_1
43
D_ATT_OUT_1
44
D3_1
8dB Attenuator Logic Input, Path 1. Logic 0 = disable, logic 1 = enable.
45
D2_1
4dB Attenuator Logic Input, Path 1. Logic 0 = disable, logic 1 = enable.
46
D1_1
2dB Attenuator Logic Input, Path 1. Logic 0 = disable, logic 1 = enable.
47
D0_1
1dB Attenuator Logic Input, Path 1. Logic 0 = disable, logic 1 = enable.
—
EP
Analog Attenuator Input (50I), Path 1. Requires a DC-blocking capacitor. Connect to
D_ATT_OUT_1 through a 1000pF capacitor.
16dB Attenuator Logic Input, Path 1. Logic 0 = disable, logic 1 = enable.
5-Bit Digital Attenuator Output (50I), Path 1. Requires a DC-blocking capacitor. Connect to
A_ATT_IN_1 through a 1000pF capacitor.
Exposed Pad. Internally connected to GND. Connect to GND for proper RF performance and
enhanced thermal dissipation.
Detailed Description
The MAX2062 high-linearity analog/digital VGA is a
general-purpose, high-performance amplifier designed
to interface with 50I systems operating in the 50MHz to
1000MHz frequency range.
Each channel of the device integrates one digital attenuator and one analog attenuator to provide 64dB of total gain
control, as well as a driver amplifier optimized to provide
high gain, high IP3, low NF, and low power consumption.
Each digital attenuator is controlled as a slave peripheral using either the SPI-compatible interface, or a 5-bit
parallel bus with 31dB total adjustment range in 1dB
steps. An added feature allows rapid-fire gain selection
among each of the four steps, preprogrammed by the
user through the SPI-compatible interface. A separate
2-pin control lets the user quickly access any one of four
customized attenuation states without reprogramming
the SPI bus. Each analog attenuator is controlled using
an external voltage or through the SPI-compatible interface using an on-chip 8-bit DAC. See the Applications
Information section for attenuator programming details.
Because each of the three stages in the separate signal
paths has its own RF input and RF output, this component can be configured to either optimize NF (amplifier
configured first), OIP3 (amplifier last), or a compromise
of NF and OIP3. The device’s performance features
include 24dB amplifier gain (amplifier only), 7.3dB NF
at maximum gain (includes attenuator insertion losses),
Maxim Integrated
and a high OIP3 level of +41dBm. Each of these features
makes the device an ideal VGA for multipath receiver
and transmitter applications.
In addition, the device operates from a single +5V
supply with full performance, or a +3.3V supply for an
enhanced power-savings mode with lower performance.
The device is available in a compact 48-pin TQFN package (7mm x 7mm) with an exposed pad. Electrical performance is guaranteed over the extended temperature
range (TC = -40NC to +85NC).
Analog and 5-Bit Digital Attenuator Control
The device integrates two analog attenuators and two
5-bit digital attenuators to achieve a high level of dynamic range. Each analog attenuator has a 33dB range
and is controlled using an external voltage or through
the 3-wire SPI interface using an on-chip 8-bit DAC.
Each digital attenuator has a 31dB control range, a 1dB
step size, and is programmed either through the 3-wire
SPI or through a separate 5-bit parallel bus. See the
Applications Information section and Table 1 for attenuator programming details. The attenuators can be used
for both static and dynamic power control.
Note that when the analog attenuators are controlled
by the DACs through the SPI bus, the DAC output
voltage shows on pins A_VCTL_1 and A_VCTL_2 (pins
39 and 22, respectively). Therefore, in SPI mode, the
A_VCTL_1 and A_VCTL_2 pins must only connect to the
resistor and capacitor to ground, as shown in the Typical
Application Circuit.
17
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
Table 1. Control Logic
AA_SP
ANALOG ATTENUATOR
D/A CONVERTER
0
Controlled by external control voltage
Disabled
1
Controlled by on-chip DAC
Enabled (DAC output voltage shows on A_VCTL__ pins);
DAC uses on-chip voltage reference
DA_SP
DIGITAL ATTENUATOR
0
Parallel controlled
1
SPI controlled (control voltages show up on the parallel control pins)
Driver Amplifier
Each path of the device includes a high-performance
driver with a fixed gain of 24dB. The driver amplifier
circuits are optimized for high linearity for the 50MHz to
1000MHz frequency range.
Applications Information
Operating Modes
The device features an optional +3.3V supply voltage operation with reduced linearity performance. The
AMPSET pin needs to be biased accordingly in each
mode, as listed in Table 2. In addition, the driver amplifiers
can be shut down independently to conserve DC power.
See the biasing scheme outlined in Table 2 for details.
Path 1 DAC and Digital Attenuator Programming
D0:D7
Sent to DAC register
D0 = LSB, D7 = MSB
D8:D12
Preprogrammed Attenuation State 1
D8 = 1dB bit, D9 = 2dB Bit, D10 = 4dB bit,
D11 = 8dB bit, D12 = 16dB bit
D13:D17
Preprogrammed Attenuation State 2
D13 = 1dB bit, D14 = 2dB bit, D15 = 4dB
bit, D16 = 8dB bit, D17 = 16dB bit
D18:D22
Preprogrammed Attenuation State 3
D18 = 1dB bit, D19 = 2dB bit, D20 = 4dB
bit, D21 = 8dB bit, D22 = 16dB bit
D23:D27
Preprogrammed Attenuation State 4
D23 = 1dB bit, D24 = 2dB bit, D25 = 4dB
bit, D26 = 8dB bit, D27 = 16dB bit
SPI Interface and Attenuator Settings
The digital attenuators can be programmed through
the 3-wire SPI/MICROWIRE®-compatible serial interface
using 5-bit words. Fifty-six bits of data are shifted in
MSB first and are framed by CS. The first 28 bits set the
first attenuator and the following 28 bits set the second
attenuator. When CS is low, the clock is active and data
is shifted on the rising edge of the clock. When CS transitions high, the data is latched and the attenuator setting
changes (Figure 1). See Table 3 for details on the SPI
data format.
Table 2. Operating Modes
RESULT
All on
AMP1 off
AMP2 on
AMP1 on
AMP2 off
All off
VCC (V)
AMPSET
PD_1
PD_2
5
0
0
0
3.3
1
0
0
5
0
1
0
3.3
1
1
0
5
0
0
1
3.3
1
0
1
5
0
1
1
3.3
1
1
1
MICROWIRE is a registered trademark of National
Semiconductor Corp.
18 Path 2 DAC and Digital Attenuator Programming
D28:D35 Sent to DAC register
D28 = LSB, D35 = MSB
D36:D40
Preprogrammed Attenuation State 1
D36 = 1dB bit, D37 = 2dB bit, D38 = 4dB
bit, D39 = 8dB bit, D40 = 16dB bit
D41:D45
Preprogrammed Attenuation State 2
D41 = 1dB bit, D42 = 2dB bit, D43 = 4dB
bit, D44 = 8dB bit, D45 = 16dB bit
D46:D50
Preprogrammed Attenuation State 3
D46 = 1dB bit, D47 = 2dB bit, D48 = 4dB
bit, D49 = 8dB bit, D50 = 16dB bit
D51:D55
Preprogrammed Attenuation State 4
D51 = 1dB bit, D52 = 2dB bit, D53 = 4dB
bit, D54 = 8dB bit, D55 = 16dB bit
Maxim Integrated
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
Table 3. SPI Data Format
FUNCTION
BIT
D55 (MSB)
Digital Attenuator State 4
(Path 2)
Digital Attenuator State 3
(Path 2)
Digital Attenuator State 2
(Path 2)
Digital Attenuator State 1
(Path 2)
On-Chip DAC
(Path 2)
Digital Attenuator State 4
(Path 1)
Digital Attenuator State 3
(Path 1)
Maxim Integrated
DESCRIPTION
16dB step (MSB of the 5-bit word used to program the Path 2 digital attenuator state 4)
D54
8dB step
D53
4dB step
D52
2dB step
D51
1dB step
D50
16dB step (MSB of the 5-bit word used to program the Path 2 digital attenuator state 3)
D49
8dB step
D48
4dB step
D47
2dB step
D46
1dB step
D45
16dB step (MSB of the 5-bit word used to program the Path 2 digital attenuator state 2)
D44
8dB step
D43
4dB step
D42
2dB step
D41
1dB step
D40
16dB step (MSB of the 5-bit word used to program the Path 2 digital attenuator state 1)
D39
8dB step
D38
4dB step
D37
2dB step
D36
1dB step
D35
Bit 7 (MSB) of on-chip DAC used to program the Path 2 analog attenuator
D34
Bit 6 of DAC
D33
Bit 5 of DAC
D32
Bit 4 of DAC
D31
Bit 3 of DAC
D30
Bit 2 of DAC
D29
Bit 1 of DAC
D28
Bit 0 (LSB) of DAC
D27
16dB step (MSB of the 5-bit word used to program the Path 1 digital attenuator state 4)
D26
8dB step
D25
4dB step
D24
2dB step
D23
1dB step
D22
16dB step (MSB of the 5-bit word used to program the Path 1 digital attenuator state 3)
D21
8dB step
D20
4dB step
D19
2dB step
D18
1dB step
19
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
Table 3. SPI Data Format (continued)
FUNCTION
BIT
Digital Attenuator State 2
(Path 1)
Digital Attenuator State 1
(Path 1)
On-Chip DAC
(Path 1)
DESCRIPTION
D17
16dB step (MSB of the 5-bit word used to program the Path 1 digital attenuator state 2)
D16
8dB step
D15
4dB step
D14
2dB step
D13
1dB step
D12
16dB step (MSB of the 5-bit word used to program the Path 1 digital attenuator state 1)
D11
8dB step
D10
4dB step
D9
2dB step
D8
1dB step
D7
Bit 7 (MSB) of on-chip DAC used to program the Path 1 analog attenuator
D6
Bit 6 of DAC
D5
Bit 5 of DAC
D4
Bit 4 of DAC
D3
Bit 3 of DAC
D2
Bit 2 of DAC
D1
Bit 1 of DAC
D0 (LSB)
Bit 0 (LSB) of DAC
MSB
DAT
LSB
DN
D(N-1)
D1
D0
CLK
tCW
tCS
CS
tCH
tES
tEWS
tEW
NOTES: DATA ENTERED ON CLOCK RISING EDGE.
ATTENUATOR REGISTER STATE CHANGE ON CS RISING EDGE.
N = NUMBER OF DATA BITS.
Figure 1. SPI Timing Diagram
20 Maxim Integrated
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
Attenuator and DAC Operation
The two analog attenuators are controlled by an external
control voltage applied at A_VCTL_1 and A_VCTL_2
(pins 39 and 22) or by the on-chip 8-bit DACs, while
the digital attenuators are controlled through the SPIcompatible interface or through two independent,
parallel 5-bit buses. The DAC enable/disable logic-input
pin (AA_SP) and digital attenuator SPI/parallel control
selection logic-input pin (DA_SP) determine how the
attenuators are controlled.
Digital Attenuator Settings
Using the Parallel Control Bus
To capitalize on its fast 25ns switching capability, the
device offers a supplemental 5-bit parallel control interface. The digital logic attenuator control pins (D0_–D4_)
enable the attenuator stages (see Tables 3 and 4).
Direct access to these 5-bit buses enables the user to
avoid any programming delays associated with the SPI
interface. One of the limitations of any SPI bus is the
speed at which commands can be clocked into each
peripheral device. By offering direct access to the 5-bit
parallel interface, the user can quickly shift between
digital attenuator states needed for critical fast-attack
automatic gain control (AGC) applications.
Note that when the digital attenuators are controlled by
the SPI bus, the control voltages of each digital attenuator appears on the five parallel control pins (pins 14–17
and 19 for digital attenuator 2, pins 42 and 44–47 for
digital attenuator 1). When the digital attenuators are
in SPI mode, the parallel control pins must be left
unconnected.
Rapid-Fire Preprogrammed
Attenuation States
The device has an added feature that provides rapidfire gain selection among four preprogrammed attenuation steps. As with the supplemental 5-bit buses
previously mentioned, this rapid-fire gain selection allows
the user to quickly access any one of four customized
digital attenuation states without incurring the delays
associated with reprogramming the device through the
SPI bus.
The switching speed is comparable to that achieved
using the supplemental 5-bit parallel buses. However, by
employing this specific feature, the digital attenuator I/O
is further reduced by a factor of either 5 or 2.5 (5 control
bits vs. 1 or 2, respectively), depending on the number
of states desired.
The user can employ the STA_A_1 and STA_B_1
(STA_A_2 and STA_B_2 for digital attenuator 2) logicinput pins to apply each step as required (see Tables
5 and 6). Toggling just the STA_A_1 pin (1 control bit)
yields two preprogrammed attenuation states; toggling
both the STA_A_1 and STA_B_1 pins together (2 control
bits) yields four preprogrammed attenuation states.
Table 4. Digital Attenuator Settings (Parallel Control, DA_SP = 0)
INPUT
LOGIC = 0 (OR GROUND)
LOGIC = 1
D0
Disable 1dB attenuator
Enable 1dB attenuator
D1
Disable 2dB attenuator
Enable 2dB attenuator
D2
Disable 4dB attenuator
Enable 4dB attenuator
D3
Disable 8dB attenuator
Enable 8dB attenuator
D4
Disable 16dB attenuator
Enable 16dB attenuator
Table 5. Programmed Attenuation State
Settings for Attenuator 1 (DA_SP = 1)
STA_A_1
STA_B_1
0
0
1
0
0
1
SETTING FOR DIGITAL
ATTENUATOR 1*
SETTING FOR DIGITAL
ATTENUATOR 2**
STA_A_2
STA_B_2
Preprogrammed attenuation state 1
0
0
Preprogrammed attenuation state 1
Preprogrammed attenuation state 2
1
0
Preprogrammed attenuation state 2
1
Preprogrammed attenuation state 3
0
1
Preprogrammed attenuation state 3
1
Preprogrammed attenuation state 4
1
1
Preprogrammed attenuation state 4
*Defined by SPI programming bits D8:D27 (see Table 3 for
details).
Maxim Integrated
Table 6. Programmed Attenuation State
Settings for Attenuator 2 (DA_SP = 1)
**Defined by SPI programming bits D36:D55 (see Table 3 for
details).
21
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
As an example, assume that the AGC application
requires a static attenuation adjustment to trim out gain
inconsistencies within a receiver lineup. The same AGC
circuit can also be called upon to dynamically attenuate an unwanted blocker signal that could desensitize
the receiver and lead to an ADC overdrive condition.
In this example, the device would be preprogrammed
(through the SPI bus) with two customized attenuation
states—one to address the static gain-trim adjustment,
the second to counter the unwanted blocker condition.
Toggling just the STA_A_1 control bit enables the user to
switch quickly between the static and dynamic attenuation settings with only one I/O pin.
If desired, the user can also program two additional
attenuation states by using the STA_B_1 control bit as a
second I/O pin. These two additional attenuation settings
are useful for software-defined radio applications where
multiple static gain settings are needed to account for different frequencies of operation, or where multiple dynamic
attenuation settings are needed to account for different
blocker levels (as defined by multiple wireless standards).
Power-Supply Sequencing
The sequence to be used is:
1) Power supply
2) Control lines
Layout Considerations
The pin configuration of the device is optimized to facilitate a very compact physical layout of the device and its
associated discrete components. The exposed pad (EP)
of the device’s 48-pin TQFN-EP package provides a low
thermal-resistance path to the die. It is important that
the PCB on which the device is mounted be designed
to conduct heat from the EP. In addition, provide the EP
with a low inductance path to electrical ground. The EP
MUST be soldered to a ground plane on the PCB, either
directly or through an array of plated via holes. The layout of the PCB should include proper top-layer ground
shielding to isolate the amplifier’s inputs and outputs
from each other. Shielding between the paths (inputs and
outputs) is important for channel-to-channel isolation.
Table 7. Typical Application Circuit Component Values
DESIGNATION
C1, C2, C5, C6, C8,
C9, C12, C13
QTY
DESCRIPTION
COMPONENT SUPPLIER
8
1000pF ceramic capacitors (0402)
GRM1555C1H102J
Murata Electronics North America, Inc.
C3, C10
2
150pF ceramic capacitors (0402)
GRM1555C1H151J
Murata Electronics North America, Inc.
C4, C7, C11,
C14, C16
5
10nF ceramic capacitors (0402)
GRM155R71E103K
Murata Electronics North America, Inc.
C15
1
1FF ceramic capacitor (0603)
GRM188R71C105K
Murata Electronics North America, Inc.
L1, L2*
2
820nH inductors (1008)
Coilcraft 1008CS-821XJLC
Coilcraft, Inc.
R1, R2
2
47.5kI resistors (0402)
—
U1
1
48 TQFN-EP (7mm x 7mm)
Maxim MAX2062ETM
Maxim Integrated Products, Inc.
*Select the inductors to ensure that self-resonance of the inductors is outside the band of operation.
22 Maxim Integrated
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
Typical Application Circuit
RF
OUTPUT 1
C7
C6
RF
OUTPUT 2
C14
VCC
C13
L1
L2
D2_1
D1_1
D0_1
GND
38
39
AMP
23
22
21
ANALOG
ATTENUATOR
1
41
42
43
DAC 1
DAC 2
44
45
47
19
17
16
DIGITAL
ATTENUATOR
2
SPI
15
14
13
48
2
GND
1
3
4
5
6
RF
INPUT 1
7
8
9
10
11
C12
VCC_AMP_2
ANALOG
ATTENUATOR
CONTROL 2
A_ATT_OUT_2
A_VCTL_2
DA_SP
R2
A_ATT_IN_2
D4_2
C10
C9
D_ATT_OUT_2
D3_2
D2_2
D1_2
D0_2
GND
12
C8
VCC
C16
Chip Information
Maxim Integrated
20
MAX2062
DIGITAL
ATTENUATOR
1
46
ANALOG
ATTENUATOR
2
18
EXPOSED
PAD
C1
PROCESS: SiGe BiCMOS
GND
AMP_IN_2
PD_2
GND
AMP_OUT_2
REG_OUT
AMPSET
AMP_OUT_1
AMP
ACTIVE
BIAS
40
+
C11
25
GND
D3_1
26
D_ATT_IN_2
D_ATT_OUT_1
27
STA_A_2
C2
ACTIVE
BIAS
STA_B_2
D4_1
28
24
CS
A_ATT_IN_1
R1
29
VCC_RG
C3
30
VCC
37
CLK
AA_SP_1
31
32
DAT
A_VCTL_1
33
STA_B_1
A_ATT_OUT_1
34
STA_A_1
VCC_AMP_1
ANALOG
ATTENUATOR
CONTROL 1
35
36
GND
C4
D_ATT_IN_1
C5
GND
VCC
PD_1
AMP_IN_1
C15
RF
INPUT 2
Package Information
For the latest package outline information and land patterns, go
to www.maximintegrated.com/packages. Note that a “+”, “#”,
or “-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND PATTERN
NO.
48 TQFN-EP
T4877+7
21-0144
90-0133
23
MAX2062
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
Revision History
REVISION
NUMBER
REVISION
DATE
DESCRIPTION
PAGES
CHANGED
0
9/10
Initial release
—
1
11/10
Updated Output Voltage specification
5
2
8/15
Removed military reference from Applications
1
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent
licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and
max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
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Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000
Maxim Integrated Products, Inc.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
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