Bluetooth® Audio Modules

Bluetooth® Audio Modules
BTM510/511
Innovative Technology
for a Connected World
The BTM510 and BTM511 are low-power Bluetooth® modules from Laird Technologies are designed for
adding robust audio and voice capabilities. Based on the market-leading Cambridge Silicon Radio BC05
chipset, these modules provide exceptionally low power consumption with outstanding range. Supporting
the latest Bluetooth Version 2.1+EDR specification, these modules provide the important advantage of
secure simple pairing that improves security and enhances easy use. BTM510 and BTM511 modules now
come standard with the apt-X™ audio codec for wireline quality stereo audio.
The compact size of the modules makes them ideal for battery-powered or headset form factor audio
and voice devices. With a 16-bit stereo codec and microphone inputs to support both stereo and mono
applications, these modules also contain a fully, integrated Bluetooth-qualified stack along with SPP,
HFP 1.5, HSP, AVRCP, DUN, and A2DP profiles.
The BTM510/511 modules include an embedded 32-bit, 64-MIPS DSP core within the BC05. This allows
designers to add significant product enhancements including features such as echo cancellation, noise
reduction, and audio enhancement using additional soft codecs.
BTM510 and BTM511 modules are provided with CSR’s apt-X codec without additional license fees.
CSR’s world renowned apt-X™ audio compression solutions retain the full integrity of original digital audio
and are optimized for instant real-time audio streaming (http://www.csr.com/products/technology/aptx).
To speed product development and integration, Laird Technologies has developed a comprehensive AT
command interface that simplifies application development, including support for audio and headset
functionality. Combined with a low-cost development kit, Laird Technologies’ Bluetooth modules provide
faster time to market.
FEATURES
• Fully featured Bluetooth multimedia chipset
• Bluetooth v2.1+EDR
• Supports mono and stereo
headset applications
• apt-X Audio Codec provided free of charge
• Adaptive frequency hopping to cope with
interference from other wireless devices
• 32-bit Kalimba DSP for enhanced
audio applications
• Support for secure simple pairing
• External or internal antenna options
• HSP, HFP, A2DP, and AVRCP audio profiles
• 16-bit stereo codec
• AAC: decoder only; Aptx and SBC: both
encoder and decoder (source and sink)
• CVC audio enhancement supported
• EIR fully supported
global solutions: local support
USA: +1.800.492.2320
Europe: +44.1628.858.940
Asia: +852.2268.6567
wirelessinfo@lairdtech.com
www.lairdtech.com/wireless
TM
• Integrated audio amplifiers for driving
stereo speaker
• Comprehensive AT interface for
simple programming
• Bluetooth End Product qualified
• Compact size
• Class 2 output – 4 dBm
• Low power operation
• WLAN co-existence hardware support
APPLICATION AREAS
• High-quality stereo headsets
• Mono voice headsets
• Hands-free devices
• Wireless audio cable replacement
• MP3 and music players
• Phone accessories
• VoIP products
• Cordless headsets
• Aftermarket automotive
applications
Bluetooth® Audio Modules
BTM510/511
Innovative Technology
for a Connected World
CATEGORIES
FEATURE
IMPLEMENTATION
Wireless Specification
Bluetooth®
Frequency
Version 2.1+EDR
2.402 – 2.480 GHz
Max Transmit Power
Class 2
4 dBm (at antenna pad – BTM510)
4 dBmi (from integrated antenna – BTM511)
Host Interface
Receive Sensitivity
Range
Data Rates
UART Data Transfer Rate
UART
Audio Interfaces
Codec
DSP
Additional I/O
I2S / PCM
Microphone
Integrated Kalimba DSP
4 x GPIO
Better than -86 dBm
30 meters
Up to 3 Mbps (over the air)
Greater than 300 Kbps
Supports DTR, DSR, DCD and RI, multiplexed with other functionality.
Internal 16 bit Stereo Codec
Integrated Amplifiers for driving Stereo Speaker
Master / Slave roles
Stereo microphone input
32-bit, 64 MIPS
Function Mapping e.g. button control
SPP – Serial Port Profile
HSP
HFP – Audio Gateway and Handset
A2DP – Source and Sink
AVRCP – Target and Controller
DUN
3.0 V – 3.6 V DC
1.7 V – 3.6 V DC
Operational - Less than 70 mA (including speaker amplifiers)
Idle (sleep) < 1.0 mA
Profiles
Supply Voltage
Supply
I/O
Power Consumption
Current Consumption
Coexistence /
Compatibility
Connections
802.11 (WLAN)
2 wire and 3 wire schemes supported
External Antenna
Internal Antenna
Connection via SMT pad – BTM510
Multilayer ceramic antenna – BTM511
AT Command Set (extended for audio and headset functions)
14.0 mm x 20.0 mm x 3.4 mm (integrated antenna – BTM510)
14.0 mm x 25.0 mm x 3.4 mm (integrated antenna – BTM511)
-30°C to +70°C
-40°C to +85°C
Lead-free and RoHS compliant
1 Year
Development board and software tools
End Product Approved
BTM510 - Limited Modular Approval
BTM511 - Full Modular Approval
Programming API
Physical
Dimensions
Environmental
Operating Temperature
Storage Temperature
Lead free
Warranty
Development Kit
Bluetooth
Miscellaneous
Development Tools
Approvals
FCC/IC & CE
ORDERING INFORMATION
BTM510 BTM511 DVK- BTM510
DVK- BTM511
Bluetooth Multimedia Module (external antenna)
Bluetooth Multimedia Module (with integrated antenna)
Development Kit (external antenna)
Development Kit (with integrated antenna)
The details contained within the document are subject to change. Download the product
specification from www.lairdtech.com/wireless for the most current specification.
LWS-DS-BTM510-511 0412
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice.
Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential
uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses.
Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms
and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2012 Laird Technologies, Inc. All Rights Reserved. Laird,
Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other
product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
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BTM510 BTM511 DVK-BTM510 DVK-BTM511
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