XMOS概述: XMOS 32-core device XU232-1024-FB37

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XMOS概述:
XMOS是一家无晶圆厂半导体公司,总部设在英国的布里斯托 (Bristol), 参考设计和IP设计部门在印度。XMOS芯片是独特的多
核构架,集MCU、FPGA和DSP的特点于一身, 并行处理多项任务,属于事件驱动,可预设处理器,
XMOS日前推出xCORE-200产品,与xCORE多核微控制器相比,新一代的xCORE-200产品系列提供了两倍的性能与四倍的片上
SRAM存储,它们在一个高性能的、可编程的XMOS USB 2.0接口之外,还增加了一个灵活的千兆以太网端口。它是第一种可商
用的、带有可编程MAC层的、支持互联网网页服务器的10/100/1000千兆以太网解决方案。
1. 程序存储在外部或内置QSPI / SPI Flash,运行在芯片内部集成的SRAM, 芯片内部有OTP (具备双重加密功能)。
2. I/O口应用灵活多样,具有定时,响应速度快,功能可编程等特性,比如I2S, I2C, UART, SPI, Ethernet MII, EtherCAT, CAN, CANopen, PowerLink, FOC, Modbus, Profibus, QEI, SRAM, GPIO等常用数字接口都可以通过编程来实现。
3. 4到32个逻辑核,相当于4到32个MCU,每个核可以同时独立执行自己的任务,片内集成硬件的任务调度器,任务之间切换时
间仅10nS。
4. XMOS芯片内部的核与核之间通过Channel通信,高达到1Gbps的速率,芯片之间通过快速的xCONNECT总线连接,通信速度可
以达到500Mbps。
5. 提供免费完善易用的编译仿真工具,用C, C++和 XC语言开发,免费提供的应用例子IP,标准LIB和应用方案。
6. 最多支持256个I/O口,目前提供QFN,TQFP,LQFP,PBGA等多种封装,支持商业级,工业级,汽车级。
XMOS 32-core device XU232-1024-FB374
Reference design:
A) Smart microphone arrays
xCORE-200 provides the perfect interface for digital MEMS microphone arrays. With proven multichannel support that allows up
to 32 microphones to be controlled by a single device, xCORE-200 also supports high-performance digital signal processing (DSP),
unparalleled GPIO and control flexibility, and has a rich backhaul of connectivity.
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Xcore-200: Voice Solutions
Smart Microphone (USB)
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Xcore-200: Voice Applications
B) Audio application solution reference design:
1. xCORE-200 Multi-Channel Audio Reference Design
xCORE-200 Multi- Channel Audio Platform Block Diagram
FEATURES
• Up to 32 in/32 out channels via TDM. 8-Channel analog input and output
• 16 X 16 channel mixer. MIDI input and output
• DSD128, DSD256 support. PCM 768K at 16, 24 or 32bits
• S/PDIF optical / coaxial optical I/O. ADAT input and output
• UAC 2.0 / 1.0 Support. Low loopback latency : 3ms. USB-C connector support
• Asynchronous Isochronous from / to host. Local crystal low-jitter audio clocking
• OS Support : Win XP, Win 7-10, Mac OSX , Apple iOS, Android
• 10/100/1000M bit Ethernet connectivity
• AVB standards compliant. Bit perfect network audio transfer
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2. MFA/ MFi – Multi-Function Audio solution for Androids, iOS devices, PC and Mac platforms.
FEATURES
• XU208 integrated USB PHY, UAC 2.0. Full Speed Host.
• 2 in 2 out , 44.1 – 192KHz hardware, 705.6 and 768KHz also supported by firmware
• DSD128, DSD256 support. SPDIF I/O , MIDI I/O
• Supported Windows XP / Vista / 7 / 8/10. Mac OSX 10.6.4 onwards
• Supported Apple 30 pin devices / Lightning devices (Role switch ready for MFi)
• Supported Android Jellbean 4.1.2+ with AOA
C) AVB (Audio Video Bridging) on Automotive / Conferencing system
XMOS endpoint reference design has passed AVnu Pro Audio Certification 1.0.
The XK-AVB-LC-SYS is AVnu Pro Audio Certified!
RSE: Rear Seat Entertainment system;
BroadR-Reach ready
VT: Video talker;
Automotive grade BGA324
MR: Media receiver;
AEC-Q100
VL: Video listener;
AL: Audio listener;
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D) Motor & motion control reference design
FEATURES
• EtherCAT (Linux master available). Drive interface module
• Brushless DC (BLDC), brushed DC and stepper motor
• Modular development platform
• Control communications and drive interface modules based on Synapticon SOMANET technology
• Dimensions: 40× 50×15mm, suitable for small volume production
xCORE provides a unique solution to the requirements of industrial robots, service robots, industrial machines, autonomous
vehicles and smart logistic systems in a single device. Applications can be distributed and provide more efficient and safer systems,
compared to centralized systems which often have a single point of failure.
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应用于下面几大领域:
A) Professional Audio
• USB DAC
• Multi-channel mixers
• Universal audio docks
• USB microphones
• Soundbar speakers
• Audiophile systems
• Ethernet AVB
• Musical instruments
• Digital DJ decks
• Audio DSP
B) Automotive
• Infotainment: Ethernet AVB
• In-Car networking
• Active noise cancellation
• Electronic control units
C) Robotics and Industrial control
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常用的芯片型号:
A) xCORE-200 (XU-SERIES)
Max
MIPS
Package
256
1000
TQFP128
16
512
2000
TQFP128
XU216-512-FB236-C20
16
512
2000
FBGA236
XU232-1024-FB324-C40
32
1024
4000
FBGA324
XUF216-512-TQ128-C20
16
512
2000
TQFP128
XUF216-512-FB236-C20
16
512
2000
FBGA236
XUF232-1024-FB324-C40
32
1024
4000
FBGA324
Part
Logical cores
RAM Kbytes
XE216-512-TQ128-C20
16
512
XE216-512-FB236-C20
16
512
XE232-1024-FB324-C40
32
1024
XEF216-512-TQ128-C20
16
512
XEF216-512-FB236-C20
16
512
XEF232-1024-FB324-C40
32
1024
4000
FBGA324
XEF224-1024-FB374-C40
24
1024
4000
FBGA374
Part
Logical cores
RAM Kbytes
XU208-256-TQ128-C20
8
XU216-512-TQ128-C20
I/O
B) xCORE-200 (XE-SERIES)
I/O
Max MIPS
Package
TQFP128
2000
FBGA236
2000
4000
FBGA324
TQFP128
2000
FBGA236
2000
C) xCORE GENERAL PURPOSE (L-SERIES)
Part
Logical cores
RAM Kbytes
I/O
Max MIPS
Package
XS1-L4A-64
4
64
28
400
TQFP48
XS1-L6A-64
6
64
64
500
TQFP48, LQFP64, TQFP128
XS1-L8A-64
8
64
64
500
TQFP48, LQFP64, TQFP128
XS1-L8A-128
8
128
84
1000
QFN124
XS1-L10A-128
10
128
84
1000
QFN124
XS1-L12A-128
12
128
84
1000
QFN124
XS1-L16A-128
16
128
84
1000
QFN124
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D) xCORE-USB (U-SERIES)
Part
Logical cores
RAM Kbytes
I/O
Max MIPS
Package
XS1-U6A-64
6
64
38
500
FBGA96
XS1-U8A-64
8
64
38
500
FBGA96
XS1-U8A-128
8
128
78
1000
FBGA217
XS1-U10A-128
10
128
78
1000
FBGA217
XS1-U12A-128
12
128
78
1000
FBGA217
XS1-U16A-128
16
128
78
1000
FBGA217
Part
Logical cores
RAM Kbytes
I/O
Max MIPS
Package
XS1-A6A-64
6
64
42
500
FBGA96
XS1-A8A-64
8
64
42
500
FBGA96
XS1-A8A-128
8
128
90
1000
FBGA217
XS1-A10A-128
10
128
90
1000
FBGA217
XS1-A12A-128
12
128
90
1000
FBGA217
XS1-A16A-128
16
128
90
1000
FBGA217
E) xCORE-ANALOG (A-SERIES)
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