Express-SL/SLE
COM Express Basic Size Type6 Module with 6th Gen
Intel® Xeon®, CoreTM and Celeron® Processors
Features
Type 6
6th Generation Intel® Xeon®, Core™ and Celeron®
Processor with Intel® QM170, HM170 and CM236 Chipset
Up to 32 GB Dual Channel DDR4 at 1867/2133 MHz
(supports both ECC and non-ECC memory)
3x DDI channels, 1x LVDS (or 4 lanes eDP),
supports up to 3 independent displays
8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3)
GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
Supports Smart Embedded Management Agent (SEMA)
functions
Extreme Rugged operating temperature:
-40°C to +85°C (opt.)
Specifications
Digital Display Interface DDI1/2/3 supporting DisplayPort/HDMI/DVI
LVDS
Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC
eDP 4 lane support optional, in place of LVDS
Core System
CPU Mobile 6th Generation Intel® Xeon® and Core™ Processors 14nm (formerly “Skylake-H”)
Xeon® E3-1515M v5 2.8/3.7GHz (Turbo), 0.35-1.0GHz
(Graphics), 8MB, 45W(35W cTDP) (4C/GT4e)
Xeon® E3-1505M v5 2.8/3.7GHz (Turbo), 0.35-1.0GHz
(Graphics), 8M, 45/35W (cTDP) (4C/GT2)
Xeon® E3-1505L v5 2.0/2.8GHz (Turbo), 0.35-1.0GHz
(Graphics), 8M, 25W (4C/GT2)
Core™ i7-6820EQ 2.8/3.5GHz (Turbo), 0.35-1.0GHz
(Graphics), 8M, 45/35W (cTDP) (4C/GT2)
Core™ i7-6822EQ 2.0/2.8GHz (Turbo), 0.35-1.0GHz
(Graphics), 8M, 25W (4C/GT2)
Core™ i5-6440EQ 2.7/3.4GHz (Turbo), 0.35-1.0GHz
(Graphics), 6M, 45/35W (cTDP) (4C/GT2)
Core™ i5-6442EQ 1.9/2.7GHz (Turbo), 0.35-1.0GHz
(Graphics), 6M, 25W (4C/GT2)
Core™ i3-6100E 2.7GHz, 0.35-0.95GHz (Graphics), 3M, 35W (2C/GT2)
Core™ i3-6102E 1.9GHz, 0.35-0.95GHz (Graphics), 3M, 25W (2C/GT2)
Celeron® G3900E 2.4GHz, 0.35-0.95GHz(Graphics),
2MB, 35W (2C/GT1) Celeron® G3902E 1.6GHz,
0.35-0.95GHz(Graphics), 2MB, 25W (2C/GT1)
Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT
Technology, Intel® 64 Architecture, Execute Disable Bit, Intel®
Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI,
PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX.
Note: Availability of the features may vary between processor SKUs.
Memory
Dual channel 1867/2133 MHz DDR4 memory up to 32GB in
dual SODIMM sockets
(ECC/non-ECC support dependent on selected CPU/PCH)
Embedded BIOS
AMI EFI with CMOS backup in 16MB SPI BIOS with Intel®
AMT 11.0 support
Cache
8MB for Xeon® and Core™ i7, 6MB for Core™ i5, 3MB for
Core™ i3, 2MB for Celeron®
PCH
CM236 (supports ECC memory, Intel® AMT)
QM170 (supports non-ECC memory, Intel® AMT)
HM170 (supports non-ECC memory, no Intel® AMT support)
Expansion Busses
PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3)
6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5
2 PCI Express x2 (Gen3): CD connector, Lanes 6/7
LPC bus, SMBus (system) , I2C (user)
SEMA Board Controller Supports : Voltage/current monitoring, power sequence
debug support, AT/ATX mode control, logistics and forensic
information, flat panel control, general purpose I2C, failsafe
BIOS (dual BIOS ), watchdog timer and fan control
Debug Headers
40-pin multipurpose flat cable connector for use with DB-40
debug module providing BIOS POST code LED, BMC
access, SPI BIOS flashing, power testpoints, debug LEDs
60-pin XDP header for ICE debug of CPU/chipset
Video
GPU Feature Support
Intel® Generation 9 LP Graphics Core Architecture,
supporting 3 independent and simultaneous display
combinations of DisplayPort/HDMI/LVDS or eDP outputs
Hardware encode/transcode HD content (including HEVC)
DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX
10.1, DirectX 10, DirectX 9 support
OpenGL 4.4/4.3 and ES 2.0 support
OpenCL 2.1, 2.0/1.2 support
Audio
ChipsetIntel® HD Audio integrated in chipset
Audio Codec
located on carrier Express-BASE6 (ALC886 standard
supported)
Ethernet
Intel® MAC/PHY
Interface
I219LM with AMT 11.0 support
10/100/1000 GbE connection
I/O Interfaces
USB
SATA
Serial
GPIO
4x USB v. 3.0 (USB 0,1,2,3) and 4x USB 2.0 (USB 4,5,6,7)
Four ports SATA 6Gb/s (SATA0,1,2,3)
2 UART ports with console redirection
4 GPO and 4 GPI
Super I/O
Supported on carrier if needed (standard support for W83627DHG-P)
TPM
Chipset
Type
Atmel
AT97SC3204
TPM1.2/2.0 (TPM 2.0 release later)
Power
Standard Input
Wide Input
Management
Power States
ECO mode ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5 ~20V (Standard temp. only)
ACPI 5.0 compliant, Smart Battery support
C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB
S3/S4, WOL S3/S4/S5)
Supports deep S5 mode for power saving
Mechanical and Environmental
Form Factor PICMG COM.0, Rev 2.1 Type 6
Dimension
Basic size: 125 mm x 95 mm
Operating Temperature Standard: 0°C to 60°C
Extreme Rugged: -40°C to +85°C (optional)
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and
Method 214A, Table 214-I, Condition D
HALT
Thermal Stress, Vibration Stress, Thermal Shock and
Combined Test
Operating Systems
Standard Support
Windows 10/8.1 64-bit, Windows 7 32/64-bit, Linux 64-bit,
VxWorks (TBD)
Extended Support (BSP)WES 7 32/64-bit, Linux 64-bit, VxWorks (TBD)
http://www.adlinktech.com/Computer-on-Module
Functional Diagram
SODIMM 1
1867/2133 MHz
4-16 GB DDR4
SODIMM 2
DDI 1
DP/HDMI/DVI
Intel® Core™
i7/i5/i3 Processor
1867/2133 MHz
4-16 GB DDR4
DDI 2
DP/HDMI/DVI
Intel Celeron
Processor
®
single/dual
18/24 bit LVDS
XDP
60
Mobile 6th Gen
Intel® Xeon®
eDP - LVDS
®
DDI 3
DP/HDMI/DVI
(formerly “Skylake-H”)
eDP x4 lanes (optional)
PCIe x16 (Gen3)
UMI
2 x8 or 1 x8 + 2 x4
6x PCIex1 (Gen3)
(port 0-5)
2x PCIe x1 (Gen3)
(port 6/7)
PCIe x1
LAN
I219
4x SATA 6Gb/s
(port 0/1/2/3)
Mobile Intel®
QM170/HM170/
CM236
Chipset
8x USB 2.0
HD Audio
UART0/1
LPC to
UART
Debug
header
TPM
4x USB 3.0 (port 0/1/2/3)
LPC bus
SMBus
GPIO
SPI 0
BIOS
SMBus
4x GPO, 4x GPI
New
SEMA
BMC
GP I2C
DDC I2C
SPI 1
BIOS
LM73
Sensor
SPI_CS#
SPI
Ordering Information
Accessories
Modules
Model Number
Description/Configuration
Model Number
Express-SLE-E31505L v5
Basic COM Express Type 6 module with Intel® Xeon®
E3-1505L v5 and GT2 level graphics, CM236 chipset,
support ECC
Heat Spreaders
HTS-SL-B
Express-SLE-E31515M v5
Basic COM Express Type 6 module with Intel Xeon
E3-1515M v5 and GT4e level graphics, CM236 chipset,
support ECC
Heatspreader for Express-SL with threaded standoffs for
bottom mounting
HTS-SL-BT
Heatspreader for Express-SL with through hole standoffs
for top mounting
®
®
Express-SL-i7-6820EQ Basic COM Express Type 6 module with Intel® Core™
i7-6820EQ and GT2 level graphics, QM170 chipset
Express-SL-i7-6822EQ Basic COM Express Type 6 module with Intel Core™
i7-6822EQ, Celeron® G3900E, G3902E and Xeon® 1515M
and GT2 level graphics, QM170 chipset
Passive Heatsinks
THS-SL-BL
Low profile heatsink for Express-SL with threaded standoffs
for bottom mounting
THS-SL-BT
Low profile heatsink for Express-SL with through hole standoffs
for top mounting
THSH-SL-BL
High profile heatsink for Express-SL with threaded standoffs
for bottom mounting
®
Express-SL-i5-6440EQ Basic COM Express Type 6 module with Intel® Core™
i5-6440EQ and GT2 level graphics, QM170 chipset
Express-SL-i5-6442EQ Basic COM Express Type 6 module with Intel® Core™
i5-6442EQ and GT2 level graphics, QM170 chipset
Description/Configuration
Active Heatsink
THSF-SL-BL
High profile heatsink with Fan for Express-SL with threaded
standoffs for bottom mounting
Express-SL-i3-6100E
Basic COM Express Type 6 module with Intel® Core™
i3-6100E and GT2 level graphics, HM170 chipset
Express-SL-i3-6102E
Basic COM Express Type 6 module with Intel® Core™
i3-6102E and GT2 level graphics, HM170 chipset
Starter Kit
Express-SLE-E31505M v5
Basic COM Express Type 6 module with Intel® Xeon®
E3-1505M v5 and GT2 level graphics, CM236 chipset,
support ECC
Model Number
Description/Configuration
COM Express Type 6
Starter Kit Plus
Starter kit for COM Express Type 6
Express-SL-G3900E
Basic COM Express Type 6 module with Intel Celeron
G3900E and GT1 level graphics, HM170 chipset
Express-SL-G3902E
Basic COM Express Type 6 module with Intel Celeron
G3902E and GT1 level graphics, HM170 chipset
Notes: All specifications are subject to change without further notice. V05
* Part number not listed above might support as project base, please contact local sales
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