3.3 V USB 3.1 Single Channel Re-driver

NB7NPQ701M
3.3 V USB 3.1 Single
Channel Re-driver
Description
The NB7NPQ701M is a 3.3 V single channel re−driver for USB 3.1
Gen 1 and USB 3.1 Gen 2 applications that supports both 5 Gbps and
10 Gbps data rates. Signal integrity degrades from PCB traces,
transmission cables, and inter−symbol interference (ISI). The
NB7NPQ701M compensates for these losses by engaging varying
levels of equalization at the input receiver and de−emphasis on output
driver. The output transmitter circuitry provides user selectable
de−emphasis and output amplitude settings to create the best eye
openings for the outgoing data signals.
The NB7NPQ701M features an intelligent LFPS circuit. This
circuit senses the low frequency signals and automatically disables
driver de−emphasis for full USB 3.1 Gen 1 and USB 3.1 Gen 2
compliances.
After power up, the NB7NPQ701M periodically checks both of the
TX output pairs for a receiver connection. When the receiver is
detected the RX termination becomes enabled and the NB7NPQ701M
is set to perform the re−driver function.
The NB7NPQ701M comes in a small, 2 x 2 mm WDFN8 package
and is specified to operate across the entire industrial temperature
range, –40°C to 85°C.
Features
•
•
•
•
•
•
•
•
•
•
•
3.3 V ± 5% Power Supply
Device Supports USB 3.1 Gen 1 and USB 3.1 Gen 2 Data Rates
Automatic LFPS De−Emphasis Control
Automatic Receiver Termination Detection
Integrated Input and Output Termination
Selectable Equalization, De−Emphasis, and Output Swing
Hot−Plug Capable
ESD Protection ±4 kV HBM
Operating Temperature Range: –40°C to 85°C
Small 2 x 2 x 0.8 mm WDFN8 Package
This is a Pb−Free Device
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MARKING
DIAGRAM
1
1
NP MG
G
WDFN8, 2x2
CASE 511BE
NP = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NB7NPQ701MMTTBG
WDFN8
(Pb−Free)
3000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Typical Applications
•
•
•
•
•
Computer and Laptop
Docking Station and Dongle
Active Cable, Back Planes
Gaming Console, Smart T.V.
Servers and Storage
© Semiconductor Components Industries, LLC, 2017
March, 2017 − Rev. 0
1
Publication Order Number:
NB7NPQ701M/D
NB7NPQ701M
Figure 1. Logic Diagram of NB7NPQ701M
Figure 2. WDFN8 Package Pinout
(Top View)
Table 1. PIN DESCRIPTION
Pin
Number
Pin
Name
Type
1
VCC
Power
2
RX+
DIFF IN
3
RX-
4
OS
LVCMOS IN Sets output swing on the TX. The 3−state input with integrated 250 kW pull−up and pull−down resistors.
5
EQ
LVCMOS IN Sets the receiver equalizer gain. The 3−state input with integrated 250 kW pull−up and pull−down
resistors.
6
TX-
7
TX+
8
DE
EP
GND
DIFF OUT
Description
3.3 V power supply
Differential input pair for 5 / 10 Gbps USB signals. Must be externally AC−coupled.
Differential output for 5 / 10 Gbps USB signals. Must be externally AC−coupled.
LVCMOS IN Sets the output de−emphasis gain. The 3−state input with integrated 250 kW pull−up and pull−down
resistors.
GND
Exposed Pad (EP) on the package bottom is thermally and electronically connected to the die. The
exposed pad must electrically connected to GND.
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2
NB7NPQ701M
DEVICE CONFIGURATION
Table 2. CONTROL PIN EFFECTS (Typical Values)
Pin
Description
Logic State
Equalization Gain
EQ
Equalization Amount
Low
3 dB
Mid
6 dB
High
9 dB
De−emphasis Ratio (Note 1)
Pin
Description
Logic State
OS = LOW
OS = Float
OS = High
DE
De−Emphasis Amount
Low
0 dB
−4.5 dB
−6.5 dB
Mid
−4 dB
−6 dB
−7.5 dB
High
−6 dB
−7.5 dB
−8 dB
Pin
Description
Logic State
Output Swing
OS
Output Swing with DE Pin Low
(0 dB)
Low
850 mVPP
Mid
1050 mVPP
High
1200 mVPP
1. dB Decrease = 20 log * (VTX−DE / VTX−DIFF−PP)
Table 3. ATTRIBUTES
Parameter
ESD Protection
> 4 kV
> 1.5 kV
Human Body Model
Charged Device Model
Level 1
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 2)
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−O @ 0.125 in
703
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
2. For additional information, see Application Note AND8003/D.
Table 4. ABSOLUTE MAXIMUM RATINGS
Over operating free−air temperature range (unless otherwise noted)
Description
Parameter
Min
Max
Unit
Supply Voltage (Note 3)
VCC
−0.5
4.6
V
Voltage range at any input or
output terminal
Differential I/O
−0.5
1.89
V
LVCMOS inputs
−0.5
VCC + 0.5
V
−65
150
°C
125
°C
85
°C
Junction−to−Ambient Thermal Resistance @ 500 lfm, qJA (Note 4)
62
°C/W
Wave Solder, Pb−Free, TSOL
265
°C
Storage Temperature Range, TSG
Maximum Junction Temperature, TJ
Operating Ambient Temperature Range, TA
−40
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
3. All voltage values are with respect to the GND terminals.
4. JEDEC standard multilayer board − 2S2P (2 signal, 2 power).
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3
NB7NPQ701M
Table 5. RECOMMENDED OPERATING CONDITIONS
Over operating free−air temperature range (unless otherwise noted)
Description
Parameter
Main power supply
VCC
TA
CAC
Min
Nom
Max
Unit
3.135
3.3
3.465
V
+85
°C
265
nF
Operating free−air temperature
−40
AC coupling capacitor
75
100
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
Table 6. POWER SUPPLY CHARACTERISTICS
Parameter
Test Conditions
Min
Typ
(Note 5)
Max
Unit
Active
Link in U0 with SS data transmission
DE = low 0 dB, EQ = low 3 dB, OS = low
70
mA
Idle State
Link has some activity, not in U0
DE = mid −4 dB, EQ = mid 6dB OS = low
50
mA
U2/U3
Link in U2 or U3 power saving state
DE = mid −4 dB, EQ = mid 6 dB, OS = low
6.7
mA
No USB Connection
No connection state, termination disabled
DE = mid −4 dB, EQ = mid 6 dB, OS = low
6.7
mA
ICC
5. TYP values use VCC = 3.3 V, TA = 25°C.
Table 7. LVCMOS CONTROL PIN CHARACTERISTICS
Parameter
Test Conditions
Min
Typ
Max
Unit
VCC
V
3−State LVCMOS Inputs (EQ, DE, OS)
VIH
High−level input voltage
0.8 * VCC
VIM
Mid−level input voltage
0.4 * VCC VCC / 2 0.6 * VCC
V
VIL
Low−level input voltage
0.2 * VCC
V
VF
Floating voltage
GND
VIN = High impedance
VCC / 2
V
RPU
Internal pull−up resistance
250
kW
RPD
Internal pull−down resistance
250
kW
IIH
High−level input current
VIN = 1.89 V
IIL
Low−level input current
VIN = GND, VCC = 3.3 V
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4
20
−20
mA
mA
NB7NPQ701M
Table 8. RECEIVER AC/DC CHARACTERISTICS Over operating free−air temperature range (unless otherwise noted)
Parameter
VRX−DIFF−pp
VRX−CM
Input differential voltage swing
Test Conditions
AC−coupled, peak−to−peak
Min
Typ
250
Max
Unit
1200
mVPP
VCC−
0.25
Common−mode voltage bias in the
receiver (DC)
V
Differential input impedance (DC)
Present after an USB device is
detected on TX+/TX−
80
100
120
W
Common−mode input
impedance (DC)
Present after an USB device is
detected on TX+/TX−
20
25
30
W
ZRX−HIGH−IMP
Common−mode input impedance
with termination disabled (DC)
Present when no USB device is
detected on TX+
25
35
VTH−LFPS−pp
Low Frequency Periodic Signaling
(LFPS) Detect Threshold
Output voltage is considered
squelched below this threshold
voltage.
ZRX−DIFF
ZRX−CM
kW
300
mVPP
Table 9. TRANSMITTER AC/DC CHARACTERISTICS Over operating free−air temperature range (unless otherwise noted)
Parameter
Test Conditions
Min
Typ
OS = Low, 50 W to VCC
850
OS = Mid, 50 W to VCC
1050
OS = High, 50 W to VCC
1200
TX input capacitance to GND
At 2.5 GHz
1.25
Differential output impedance (DC)
Present after an USB device is detected on TX+/TX−
80
ZTX−CM
Common−mode output impedance (DC) Present after an USB device is detected on TX+/TX−
20
ITX−SC
TX short circuit current
VTX−CM
Common−mode voltage bias in the
transmitter (DC)
VTX−DIFF−PP
CTX
ZTX−DIFF
VTX−CM−ACpp
Output differential voltage swing at 5
Gbps, 10 Gbps with DE low
VCC−0.5
AC common−mode peak−to−peak volt- Within U0 and within LFPS
age swing in active mode
Differential voltage swing during
electrical idle
Tested with a high−pass filter
VTX−RXDET
Voltage change to allow receiver
detect
Positive voltage to sense receiver
termination
Output rise, fall time
20% − 80% of differential
voltage measured 1 inch from
the output pin
Output rise, Fall time mismatch
20% − 80% of differential
voltage measured 1 inch from
the output pin
Differential propagation delay
De−emphasis = −4 dB, OS = Low
propagation delay between
50% level at input and output
tRF−MM
tdiff−LH, tdiff−HL
tidleEntry,
tidleExit
Idle entry and exit times
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5
0
Unit
mVPP
pF
120
W
30
W
60
TX+ or TX− shorted to GND
VTX−IDLE−DIFF−
ACpp
tR, tF
100
Max
mA
VCC
V
100
mVPP
10
mVPP
600
mV
45
ps
5
ps
150
ps
30
ns
NB7NPQ701M
Table 10. TIMING AND JITTER CHARACTERISTICS
Parameter
Test Conditions
Min
Typ
Max
Unit
TIMING
tREADY
Time from power applied until RX termi- Apply 0 V to VCC, connect USB termination to TX±, apply 3.3 V to
nation is enabled
VCC, and measure when ZRX−DIFF
is enabled
10
ms
0.076
UI
(Note 8)
0.046
UI
(Note 8)
0.004
UI
(Note 8)
0.053
UI
(Note 8)
0.008
UI
(Note 8)
0.001
UI
(Note 8)
JITTER FOR 5 Gbps
TJTX−EYE
Total jitter (Notes 6, 7)
DJTX
Deterministic jitter (Note 7)
RJTX
Random jitter (Note 7)
EQ = Mid 6 dB, DE = High −6 dB,
OS = Low
JITTER FOR 10 Gbps
TJTX−EYE
Total jitter (Notes 6, 7)
DJTX
Deterministic jitter (Note 7)
RJTX
Random jitter (Note 7)
EQ = Mid 6dB, DE = High −6 dB,
OS = Low
6. Includes RJ at 10−12.
7. Measured at the ends of reference channel with a K28.5 pattern, VID = 1000 mVpp, −3.5 dB de−emphasis from source.
8. 5 Gbps, UI = 200 ps for 10 Gbps, UI = 100 ps.
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6
NB7NPQ701M
Pattern Gen.
Oscilloscope
TP1
50 W
X” FR−4
RX
TX
DUT
Soldered
TP2
Figure 3. Equalization Measurement Setup
Figure 4. 5 Gbps Signal with 24 inches of FR4 Before Input (Figure 3 TP1) to NB7NPQ701M and After (Figure 3
TP2) Using High EQ Setting
Figure 5. 10 Gbps Signal with 12 inches of FR4 Before Input (Figure 3 TP1) to NB7NPQ701M and After (Figure 3
TP2) with EQ Floating (Mid)
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7
NB7NPQ701M
Pattern Gen.
Oscilloscope
50 W
TX
RX
X” FR−4
DUT
Soldered
TP3
Figure 6. De−Emphasis Measurement Setup
Figure 7. 5 Gbps Signal After 24 inches of FR4 (No
DUT)
Figure 8. 5 Gbps Signal After 24 inches of FR4 at
Output (Figure 6 TP3) with Mid DE Setting to
NB7NPQ701M
Figure 9. 10 Gbps Signal After 12 inches of FR4 (No
DUT)
Figure 10. 10 Gbps Signal After 12 inches of FR4 at
Output (Figure 6 TP3) with Low DE Setting to
NB7NPQ701M
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8
NB7NPQ701M
PARAMETER MEASUREMENT DIAGRAMS
Rx−
Rx+
Tx−
Tx+
Figure 11. Transmitter Differential Voltage
dB Decrease = 20 log * (VTX−DE / VTX−DIFF−PP)
Figure 12. Propagation Delay
VOH
VOL
Figure 13. Output Rise and Fall Times
APPLICATION GUIDELINES
LFPS Compliance Testing
between host and peripheral devices. LFPS signaling
consists of bursts of frequencies ranging between 10 to
50 MHz and can have specific burst lengths or repeat rates.
As part of USB 3.1 compliance test, the host or peripheral
must transmit a LFPS signal that adheres to the spec
parameters. When using a real−time oscilloscope to capture
this data, the scope’s trigger must be below 0 V when making
single−ended measurements. Although the differential
signal is identical to that which is expected by the USB 3.1
system, the AC common mode voltage for LFPS may fall
below 0 V during short bursts of switching signal, which is
still within the spec’s limit.
Ping.LFPS for TX Compliance
During the transmitter compliance, the system under test
must transmit certain compliance patterns as defined by the
USB−IF. In order to toggle through these patterns for various
tests, the receiver must receive a ping. LFPS signal from
either the test suite or a separate pattern generator. The
standard signal comprises of a single burst period of 100ns
at 20 MHz. In order to pass this signal through
NB7NPQ701M, the duration of the burst must be extended
to at least 200 ns.
LFPS Functionality
USB 3.1 links use Low Frequency Periodic Signaling
(LFPS) to implement functions like exiting low−power
modes, performing warm resets and providing link training
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9
NB7NPQ701M
PACKAGE DIMENSIONS
WDFN8 2x2, 0.5P
CASE 511BE
ISSUE A
A
D
0.10 C
2X
0.10 C
2X
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L1
ÇÇ
ÇÇ
PIN ONE
REFERENCE
L
B
E
DETAIL A
ALTERNATE
CONSTRUCTIONS
TOP VIEW
ÇÇ
ÇÇ
ÉÉ
EXPOSED Cu
DETAIL B
A
0.10 C
A3
ÉÉ
ÉÉ
ÇÇ
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
A3
MOLD CMPD
A1
DETAIL B
ALTERNATE
CONSTRUCTIONS
0.08 C
A1
SIDE VIEW
NOTE 4
C
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
D2
DETAIL A
8X
1
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.50
1.70
2.00 BSC
0.80
1.00
0.50 BSC
0.25 REF
0.20
0.40
−−−
0.15
L
4
8X
1.70
PACKAGE
OUTLINE
0.50
E2
K
8
5
e
BOTTOM VIEW
8X
2.30
1.00
b
0.10 C A B
0.05 C
NOTE 3
1
0.50
PITCH
8X
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and solderin
details, please download the ON Semiconductor Soldering an
Mounting Techniques Reference Manual, SOLDERRM/D.
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NB7NPQ701M/D
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