(for SD Memory Card, MultiMediaCard(TM), Memory Stick(TM), xD

Combine Type Connector (for SD Memory Card, MultiMediaCard™, Memory Stick™, xD-Picture Card™)
SCDE Series
Push-in push-out eject mechanism applicable to four media types.
For
SD Memory
Card
For
microSD™
Card
For
SIM Card
8pins
For
W-SIM
For
Memory
Stick Micro™
For
Memory
Stick™
Features
●
●
●
Applications
Applicable to four memory card standards - SD Memory
Card, MultiMediaCardTM, Memory StickTM and xD-Picture
CardTM.
Push-push ejection mechanism applied in both card types.
Same insertion and ejection position applied for both cards.
●
●
●
Combine Type
For
Compact
Flash™
●
Typical Specifications
Items
Specifications
For PC cards
supporting
CardBus
SD Memory Card
MultiMediaCard™
For
Express
Card™
For CMOS
Camera Module
For desktop PCs, notebook PCs, various personal digital
assistants, digital still cameras, digital camcorders, facsimile
machines and printers.
For home audio equipment (TVs and set top boxes)
For audio systems
For headphone players
Applicable media
Memory StickTM
Structure
xD-Picture CardTM
Mounting type
Surface mounting type
Mounting style
Standard mount / Reverse mount
Media ejection
structure
Push-push type
Operating temperature
range
−10℃ to +60℃
Voltage proof
Performance
500V AC 1minute(SCDE1), 250V AC 1minute(SCDE2)
Insulation
resistance(Initial)
Contact
resistance
(Initial)
1,000MΩ min.
Connector
contacts
100mΩ max.(SCDE1), 150mΩ max.(SCDE2)
Detection
switch
500mΩ max.(SCDE1), 600mΩ max.(SCDE2)
Insertion and
removal cycle
10,000cycles(SD Memory Card, xD-Picture CardTM)
12,000cycles(Memory StickTM)
Product Line
Media ejection structure
Mounting system
Stand-off(mm) Packing system
Standard mount
Push-push type
0
Reverse mount
40
Product No.
Drawing
No.
SCDE1C0200
1
SCDE2B0100
2
Tray
Combine Type Connector(for SD Memory Card, MultiMediaCard™, Memory Stick™, xD-Picure Card™) SCDE Series
Dimensions
Unit:mm
Style
MS No.5
MS No.4
MS No.3
MS No.2
MS No.1
4.5
MS No.6
MS No.7
MS No.8
MS No.9
MS No.!0
13.95
19-1.1
27(P1.5×18)
13.025
10.475 10.475
SD No.3
SD No.2
SD No.1
SD No.9
8.65
48.1
SD No.4
SD No.5
SD No.6
SD No.7
SD No.8
For
SD Memory
Card
33.25
29.7
Common
(for SD)
(5.5)
(5)
Locked
position
WP switch
(for SD)
Eject
position
xD No.!8
xD No.!7
xD No.!6
xD No.!5
xD No.!4
xD No.!3
xD No.!2
xD No.!1
xD No.!0
Card center
Connector center
31
27
16.7
14.9
28.75
26.6
25.5
(hole)
ø2
For
W-SIM
27
6.25
15.5
1
ø1.55
(hole)
19.375
17.175
16.05
14.55
4.95
3.15
0.9
(1.2)Over travel
21
CD switch
(for SD)
For
microSD™
Card
For
SIM Card
8pins
1.55
1.4
13.7
No.
PC board mounting hole dimensions
(Viewed from the mounting face side)
Ground
For
Memory
Stick Micro™
15(P1×15)
xD No.1
xD No.0 (CD for xD)
xD No.2
xD No.3
xD No.4
xD No.5
xD No.6
xD No.7
xD No.8
xD No.9
For
Memory
Stick™
6.65
7.5
8.35
19-0.6
9.2
9.3
10
Combine Type
Land
No pattern area
For
Compact
Flash™
ø1.5
ø1
.7
1.5
8.475
7.525
xD card center
xD No.!3
xD No.!2
xD No.!1
xD No.!0
.5h
14
1.
1
0.75
ø3
.5
0.95
0.65
xD No.6
xD No.7
xD No.8
xD No.9
(GND for xD)
WP Switch
(for SD)
xD No.!8
xD No.!7
xD No.!6
xD No.!5
xD No.!4
For CMOS
Camera Module
ø1
ole
14
39.25
36.25
30.175
Connector
center
30.5
0.95
le 0.65
For
Express
Card™
12
GND
xD No.1
xD No.0
xD No.2
xD No.3
xD No.4
xD No.5
(5)
Eject Position
9.7
1.775
Lock Position
(5.5)
4.9
5.1
6.65
22
(1.2) Over travel
21.2
47.7
43.95
2
7.255 6.275
0.95
ho
1.5
SD No.4
SD No.3
(Dummy)
SD No.2
(Dummy)
SD No.1
SD No.9
5.7
2.2
5.3
15.85
23.6
SD No.5
(Dummy)
SD No.6
(Dummy)
SD No.7
SD No.8
Common(for SD)
CD Switch(for SD)
0.65
0.975
MS No.5
MS No.4
MS No.3
MS No.2
MS No.1
2.8
15.85
4.6
4.75
0.2
MS No.6
MS No.7
MS No.8
MS No.9
MS No.!0
For PC cards
supporting
CardBus
4.5
6
14.1
14.1
2.25
2.25
On the card entry side, the metal exposed part
is connected to terminal No.9 of the xD card.
No pattern area
2-φ1.3
No pattern exposure area
28
MS, SD card center
41
Small Memory Card Connectors
Soldering Conditions
Example of Reflow Soldering Condition(Reference)
For
SD Memory
Card
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA(K)or CC(T).
3. Temperature profile(Surface of products).
For
microSD™
Card
For
W-SIM
For
Memory
Stick Micro™
For
Memory
Stick™
Temperature (˚C )
For
SIM Card
8pins
240℃(max.)
230℃(min.)
200
180℃
150℃
100
Room
temperature
Time (s)
Pre-heating
90±30 sec.
10 sec.(max.)
Combine Type
Heating time
sec.
For
Compact
Flash™
For PC cards
supporting
CardBus
For
Express
Card™
For CMOS
Camera Module
50
Cautions for using this product
1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or
electrical degradation to occur depending on the conditions. Caution is therefore required.
2. Avoid use of water-soluble soldering flux, since it may corrode the product.
3. Check and conform to reflow soldering requirements under actual mass production conditions.
4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and
layout.
5. The card specifications are provided by the above manufactures. Products by other manufactures may not be
compliant with these specifications and are subject to change without prior notice.
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