INDUSTRIAL MEMORY SOLUTIONS
NAND FLASH PRODUCTS & DRAM MODULES
This datasheet has been downloaded from http://www.digchip.com at this page
Why choose Swissbit
Swissbit is the largest independent DRAM module and Flash storage manufacturer in Europe. This enables Swissbit to be a global leader in technology
supplying High Quality Memory solutions to the several key market areas
which include Industrial, Embedded, Communications & Networking, Military & Aerospace, Automotive, Casino Gaming and Medical Equipment.
Swissbit was created from a management buy-out from Siemens Memory
Products in 2001 and has over 20 years of experience in the memory industry.
Swissbit’s commitment to high quality, reliability, exceptional customer
service and competitive pricing is what enables our customers and partners
to enjoy a constant source of supply and product commitment for their past,
current and future requirements.
In more detail Swissbit offers to our customers the following areas of service:
Product Depth
Customization
Compliance to
-Complete line of DRAM modules
and NAND Flash Solid State Drives
with different interfaces and form factors
-Both leading edge technology and legacy product offerings
-Extended and Industrial temperature grade products
-Unique Chip-On-Board (COB) technology
-Small form factor removable NAND flash cards
-Memory In Package Solutions
-Custom DRAM module and Flash designs
-Security features
-Individual Labeling
-Design In support
-JEDEC, SDA, CFA, USB-IF, SATA-IO
-RoHS, REACH, WEEE
-UL
-FCC, CE
Sales Service and
Engineering Support
-Fast, effective and competent
sales staff on hand to serve your needs
-Our expert technical staff is available for quick response
-Joint product qualification service
-In-House Manufacturing in Germany
-Worlds only COB DRAM memory
module manufacturer
2
Quality Standard
OEM Services
-Controlled Bill of Materials (BOM)
-Serialization and Lot Code Tracking
-Support of long life cycles
-Stringent PCN and ECN process
Test for Reliability
-Advantest, King Tiger Technology
and Tanisys Technology test equipment
-World Class Application Testing
-System Level Test During Burn-In
(TDBI)
-Extended and Industrial Temperature Testing
-Environmental Testing
-ISO 9001:2008
Associations
-Member of CompactFlash Association (CFA)
-Member of JEDEC
-Member of Memory Implementers Forum
-Member of SATA-IO
-Member of SecureDigital Association (SDA)
-Member of USB Implementer Forum
-Member of Small Form Factor Special Interest Group SFF-SIG
nand flaSh ProductS
SD&MMCCards...................... 5
CompactFlash™Cards................ 7
PATA/IDESSD......................... 7
CFast™Cards........................... 9
SATASSD................................ 9
USBFlashDrives/Modules.........11
dram moduleS
UnbufferedDIMM.................... 13
SODIMM................................ 13
MicroDIMM........................... 13
RegisteredDIMM..................... 15
MiniRDIMM........................... 15
SORDIMM.............................. 15
chiP on board (cob)
Info..................................... 16
Features............................... 17
Part numberS
NANDFlashPartNumbers.......... 18
DRAMModulePartNumbers...... 19
3
Flash Management
Mechanism
- Optimized Error Correction Code
- Efficient Algorithms for Bad Block Management
- Real Life Time Monitoring
- Intelligent Wear Leveling
- Power Fail Robustness
Sd & MMC Card
Swissbit’s INDUSTRIAL product lines of SecureDigital (SD) &
Multimedia cards are specifically designed, manufactured
and tested to withstand extreme environmental conditions.
The use of SLC (Single Level Cell) Flash combined with a
32bit RISC controller provides a number of enhanced product
features such as built-in error correction, bad block manage­
ment, advanced wear leveling algorithms, power loss
protection and power saving modes. Special attention is
dedicated to the mechanical stability and enhanced ESD
protection. A high reliability housing with special connector
support provides resistance against bending and torque.
Furthermore, the gold plated SD connectors will last a
minimum of 10,000 insertions.
4
NanD Flash Products
microSd
Securedigital
Securedigital
(Sd)
high caPacity
multimedia card
(Sdhc)
Series
S-200µ
S-200
S-220
M-100
InterfaceCompliance
SDA2.0
SDA2.0
SDA2.0,SDHCclass10
MMC3.31,4.1&4.2
Connector
microSD
SD
SD
MMC
PhysicalForm
15.0x11.0x(0.7)1 mm
32.0x24.0x2.1 mm
32.0x24.0x2.1 mm
32.0x24.0x1.4 mm
FlashType
SLC
SLC
SLC
SLC
Density
512 MB-2 GB
512 MB-2 GB
4 GB-8 GB
128 MB
OperatingTemperature
Extended: -25°Cto+85°C
Industrial: -40°Cto+85°C
Extended: -25°Cto+85°C
Industrial: -40°Cto+85°C
Extended: -25°Cto+85°C
Industrial: -40°Cto+85°C
Extended: -25°Cto+90°C
Industrial: -40°Cto+90°C
StorageTemperature
-40°Cto+100°C
-40°Cto+100°C
-40°Cto+100°C
-40°Cto+100°C
Shock
1,000 G
1,000 G
1,000 G
1,000 G
Vibration
15 G
15 G
15 G
15 G
Humidity
85 %RH85°C,1000 hrs
85 %RH85°C,1000 hrs
85 %RH85°C,1000 hrs
85 %RH85°C,1000 hrs
DataTransferMode
1or4 bitSD,SPI
1or4 bitSD,SPI
1or4 bitSD,SPI
1bitMMC,SPI
BurstRate upto25 MB/s
ReadSeq. upto24 MB/s
WriteSeq. upto13 MB/s
BurstRate
ReadSeq.
WriteSeq.
BurstRate upto25 MB/s
ReadSeq. upto22 MB/s
WriteSeq. upto20 MB/s
BurstRate upto6.5 MB/s
ReadSeq. upto5.7 MB/s
WriteSeq. upto5.9 MB/s
Performance
Voltage
upto25 MB/s
upto24 MB/s
upto21 MB/s
(512 MB-13 MB/s)
2.7-3.6 VNormal
2.7-3.6 VNormal
2.7-3.6 VNormal
2.7-3.6 VNormal
2.0-3.6 VBasicCommunication 2.0-3.6 VBasicCommunication 2.0-3.6 VBasicCommunication 2.0-3.6 VBasicCommunication
PowerConsumption
RWtyp. 35 mA/max.50 mA
Sleep
0.3 mA(max)
RWtyp. 35 mA/max.50 mA
Sleep
0.3 mA(max)
Readtyp. 80 mA
Writetyp. 50 mA
Sleep
0.3 mA(max)
RWtyp. 8 mA/max.15 mA
Sleep
0.3 mA(max.)
Marking
Swissbit,PartNumber,
LotCode,Mfg.Date
Swissbit,Density,CE,Pbfree,
PartNumber,LotCode,
Mfg.Date
Swissbit,Density,CE,Pbfree,
PartNumber,LotCode,
Mfg.Date
Swissbit,Density,CE,Pbfree,
PartNumber,LotCode,
Mfg.Date
TargetApplication
Tools
PartNumber
IndustrialEmbeddedSystems,MedicalSolutions,Point-of-Sales,GamingIndustry,AutomationSolutions,etc.
LifeTimeMonitoringoverSDcommandset
LifeTimeMonitoringoverMMC
commandset
SFSDxxxxNxBNxxx-x-xx-1x1-STD SFSDxxxxLxBNxxx-x-xx-1x1-STD SFSDxxxxLxBNxxx-x-xx-1x1-STD SFMMxxxxOxBNxxx-x-xx-1x1-STD
-CompliantwithSDA2.0Specification
-OptimizedWearLeveling
-LifeTimeMonitoringoverextendedcommandset
-IntelligentPowerFailProtection&Recovery
-ESDProtectionupto15kV
- CompliantwithMMC
Specification
-OptimizedWearLeveling
-LifeTimeMonitoringover
extendedcommandset
-IntelligentPowerFail
Protection&Recovery
nand flaSh ProductS
5
PATA / IDE & CompactFlash™ Card
Solid State Drives (SSD) are drop-in replacements for traditional 2.5” hard
disk drives (HDD). Swissbit offers the Parallel ATA (PATA) interface SSD with
44-pin IDE connector and CompactFlash™ cards with up to 32GB of flash memory. Because SSD’s have no moving parts, vibration and shock tolerance is
extended significantly, making them a perfect choice for mobile applications
where durability and reliability are crucial. No moving parts also remove
the mechanical latencies found in traditional hard disk drives. This directly
translates into faster start-up times and extremely low read and write
latency times. Temperature ranges are extended and mean time between
failure (MTBF) is improved many times compared with traditional HDDs,
resulting in a longer operational life of the drive. Offered in standard or
industrial temperature ranges, the Swissbit 2.5” SSD is ideal for a wide range
of applications in both commercial and industrial markets. At Swissbit we
are committed to providing new, evolving and high-performance solid state
drive designs based on the ATA interface in combination with SLC NAND flash.
C-300
P-120
Power Fail Protection
++
++
++
Power Fail Recovery
++
++
++
Industrial Temperature Grade -40°C to 85°C
++
++
++
SLC NAND Flash
++
++
++
Controlled BOM / PCN Process
++
++
++
++
SBLifeTimeMonitoring (LTM)
++
++
Standard S.M.A.R.T. Support
+
++
++
SBLTM API/Library
+
++
++
SBLTM Application (Windows)
+
++
++
SBZoneProtection
-
+
+
SBZoneProtection Application (Windows)
-
+
+
Security Erase / Security Feature Set
-
+
+
++ default implemented; - not available; + on request
SBZoneProtection
C-320
Security Erase
Feature Comparison
SBLifeTimeMonitoring (LTM)
Security Feature Set
The device allows configuring multiple zones with either no protection, write protection or access protected. Each zone is protected
with a separate password. A Windows tool or a programming library
are available. With this library, the
functionality can easily be inte­
grated in applications built by the
customer.
6
NanD Flash Products
Security Erase is part of the stand­
ard security feature set. It allows
trigger­ing a quick erase of all user
data by a software command.
The security feature set also includes
a password system that restricts access to user data stored on a device.
That could be controlled by BIOS.
The Swissbit Life Time Monitoring
feature allows the device to report
its detailed Life Time status, which
allows users to predict imminent
failure to avoid data loss.
This feature uses and extends the
standard S.M.A.R.T. (Self-Monitoring,
Analysis and Reporting Technology)
interface or vendor command set
with Flash specific information.
comPactflaSh™
comPactflaSh™
Pata SSd 2.5"
card
card
Solid State drive
Series
C-300
C-320
P-120
InterfaceCompliance
CFA4.1/CFA3.0
CFA4.1/CFA3.0,
IDE/ATA133
Connector
CFCTypeI
CFCTypeI
ATA44 pin,2 mmpitch
Master/Slave
PhysicalForm
36.4x42.8x3.3 mm
36.4x42.8x3.3 mm
100.2x69.85x9.0 mm
FlashType
SLC
SLC
SLC
Density
128 MBto8 GB
2 GBto32 GB
2 GBto32 GB
OperatingTemperature
Commercial: 0°Cto+70°C
Industrial: -40°Cto+85°C
Commercial: 0°Cto+70°C
Industrial: -40°Cto+85°C
Commercial: 0°Cto+70°C
Industrial: -40°Cto+85°C
StorageTemperature
-50°Cto+100°C
-50°Cto+100°C
-50°Cto+100°C
Shock
1,500 G
1,500 G
1,500 G
Vibration
20 G
20 G
20 G
Humidity
85 %RH85°C,1000 hrs
85 %RH85°C,1000 hrs
85 %RH85°C,1000 hrs
DataTransferMode
uptoPIO6,MDMA4,UDMA4
uptoPIO6,MDMA4,UDMA4
uptoPIO4,MDMA2,UDMA4
Performance
BurstRate
upto66 MB/s
ReadSeq. 1chupto24 MB/s
2chupto37 MB/s
WriteSeq. 1chupto10 MB/s
2chupto20 MB/s
BurstRate upto66 MB/s
ReadSeq. upto45 MB/s
WriteSeq. upto35 MB/s
BurstRate upto66 MB/s
ReadSeq. upto45 MB/s
WriteSeq. upto35 MB/s
Voltage
3.3 V+/- 10 %,5 V +/- 10 %
3.3 V+/- 10 %,5 V +/- 10 %
5 V+/-10 %
PowerConsumption
PIOtyp. 50 mA@3.3 V
DMAtyp.70 mA@3.3 V
DMAtyp.110 mA@ 5 V
PIOtyp. 60 mA@3.3 V
DMAtyp.90 mA@3.3 V
DMAtyp.130 mA@ 5 V
PIOtyp. 55 mA@5 V
DMAtyp.135 mA@5 V
Marking
WEEE,Swissbit,Density,CE,Part
Number,LotCode,RoHS
WEEE,Swissbit,Density,CE,Part
Number,LotCode,RoHS
Swissbit,Density,CE,Pbfree,Part
Number,LotCode,Mfg.Date,
PinMode
TargetApplication
Tools
PartNumber
IndustrialEmbeddedSystems,MedicalSolutions,Point-of-Sales,GamingIndustry,
AutomationSolutions,etc.
WindowsFreewareApplication,API/DLLforextendedS.M.A.R.T.option
SFCFxxxxHxBK1xx-x-xx-5x3-SMA1ch
SFCFxxxxHxBOxxx-x-xx-5x3-SMA
SFCFxxxxHxBKxxx-x-xx-5x3-SMA2ch
-CompliantwithCFA4.1/CFA3.0Specification
-OptimizedWearLeveling
-S.M.A.R.T.supportwithextendedcommandset
-IntelligentPowerFailProtection&Recovery
-SecurityFeaturesavailable
SFPAxxxxQxBOxxx-x-xx-2x3-STD
- ATA133compliant
- OptimizedWearLeveling
- S.M.A.R.T.supportwith
extendedcommandset
- IntelligentPowerFail
Protection&Recovery
- SecurityFeaturesavailable
nand flaSh ProductS
7
Sata SSd & cfaSt™ card
TheCFast™cardcombinestheoriginalCompactFlash™(CF)
cardformfactorwithaSerialATA(SATA)interface.With
thismeltingoftwoindustrystandards,theCFast™card
specificationwascreatedtoallownewapplicationsin
theembeddedandindustrialmarkets.Ofteninthese
marketsperformance,speed,systemdowntimeand
flexibilityareimportantdesignconsiderations.
Swissbit’sCFast™addressesthesechallengeswhile
maintainingasmallpackagesizeandprovidinghighspeeddatatransfer.TheuseoftheSATAinterfaceon
CFast™cardsallowsforavastimprovementoverslower
paralleldatatransfermethodsbyofferingabandwidth
upto300 MB/s.ForengineersanddesignersCFast™
offersthesmallsize,flexibilityandfeaturesofaCFcard
whileprovidingthesimplicityandspeedofaSATA
communicationinterface.TheCFast™cardcanbeoperatedusingasingle3.3 V(+/-5 %)lowpowersourceand
supportsthreeSATApowermanagementstates:Active,
PartialandSlumber.TheCFast™isaperfectchoicefor
bothfixedandremovableapplicationswherelowto
mediumstoragedensitiesarerequiredandthephysicalsizeofconventionalmechanicalorsolidstatehard
drivesareimpractical.ThemigrationefforttoCFast™is
furthersimplifiedbecauseitelectricallycomplieswith
theSerialATAInternationalOrganizationstandardand
utilizesthesameSATAcommandset.
AlsoavailableistheSATA2.5”SSDformfactorforless
spacerelevantapplications.
hard disk drive
Solid State drive
hdd
SSd
advantages
advantages
- Cheaperprice
- Higherdensities
–NoR/WLimitation
- Fastersystemboottime
- Lighterweight
- Lowpowerconsumption
- Longlifetime
disadvantage
chance
- Loudernoise
- Shocksensitive
- LowerMTBFvalues
- Industrialstandardcompliance
- Industriallikedesignandrobustness
- RealS.M.A.R.T.valuesarepossible
drive technology comPariSon
8
nand flaSh ProductS
cfaSt™ card
Sata SSd 2.5" Solid
State drive
Series
F-100
X-200
InterfaceCompliance
CFast™-SATAII-3 GBit/s
SATAII-3 GBit/s
Connector
CFast™TypeI
15 +7 pinSerialATA
PhysicalForm
36.4x42.8x3.6 mm
100.2x69.85x9.0 mm
FlashType
SLC
SLC
Density
4 GB-32 GB
4 GB-64 GB
OperatingTemperature
Commercial: 0°Cto+70°C
Industrial: -40°Cto+85°C
Commercial: 0°Cto+70°C
Industrial: -40°Cto+85°C
StorageTemperature
-50°Cto+100°C
-50°Cto+100°C
Shock
1,500 G
1,500 G
Vibration
20 G
20 G
Humidity
85 %RH85°C,1000 hrs
85 %RH85°C,1000 hrs
DataTransferMode
uptoPIO4,MDMA2,UDMA6
PIO,MDMA,UDMA6
Performance
BurstRate upto300 MB/s
ReadSeq. upto105 MB/s
WriteSeq. upto90 MB/s
BurstRate upto300 MB/s
ReadSeq. upto120 MB/s
WriteSeq. upto100 MB/s
Voltage
3.3 V+/-5 %
5 V+/-10 %
PowerConsumption
UDMA6typ.300mA,max.420mA
Idle220mA
UDMA6typ.260mA,max.320mA
Idle140mA
Marking
WEEE,Swissbit,Density,CE,Part
Number,LotCode,Mfg.Date,RoHS
Swissbit,Density,CE,Pbfree,Part
Number,LotCode,Mfg.Date,RoHS
TargetApplication
IndustrialEmbeddedSystems,MedicalSolutions,Point-of-Sales,
GamingIndustry,AutomationSolutions,etc.
WindowsFreewareApplication,API/
DLLforextendedS.M.A.R.T.option
WindowsFreewareApplication,API/
DLLforextendedS.M.A.R.T.option
Tools
Evaluationkitwith2.5”SATAadapter
boardavailable
PartNumber
SFCAxxxxHxBRxxx-x-xx-2x6-STD
SFSAxxxxQxBRxxx-x-xx-2x6-STD
- AlternativeforExpensiveSATASSD
- ReplacementforCFCbySATA
Chipset
- CompliantwithCFast™Rev.1.0 Specification
- SATAIIInterfaceCompliant
- S.M.A.R.T.support
- AdvancedWearLeveling&Block
Management
- PowerFailProtection
- SecurityFeaturesavailable
- IdealReplacementfor2.5“
SATAHDDs
- LowPowerConsumption
- NoNoiseorTemperatureIssues
- LongUsefulLife
- S.M.A.R.T.support
- AdvancedWearLeveling&Block
Management
- PowerFailProtection
- SecurityFeaturesavailable
nand flaSh ProductS
9
Universal Serial Bus - USB Flash drive
Universal Serial Bus (USB) interface is very well established and has completely
overtaken other forms of serial or parallel interfaces for computer peripherals
and memory storage devices. Advantages of USB are its flexibility, reasonably
fast serial data transfer rate and its ability to obtain power through the connector. Almost every computer or embedded system supports devices with
the standard USB-A-Plug and several internal on-board con­nectors. Swissbit is
offering both in different form factors and in commercial and industrial operating temperature ranges. State of the art NAND Flash handling, stringent
component selection and control qualify Swissbit’s USB Flash Devices (UFDs)
not only for commercial but also and especially for embedded and industrial
markets. Security features and Life Time Monitoring Tools are supported and
already designed into many customer applications.
SLC
MLC
High Density
+
Low Cost Per Bit
+
Reliability & Durability
+
Industrial Temperature
+
Low-Power Consumption
+
Write Performance
+
Partial Program
+
Low ECC Requirement
+
Data Retention
+
Longevity
+
NAND Flash
Technology
Comparision
10
NanD Flash Products
Series
uSb SticK
uSb SticK
uSb flaSh module
miniTWIST/CAP
unitedCONTRASTII
U-110
InterfaceCompliance
USB2.0highspeed,USB1.1compliant
Standard: 2.54 mm-10Pin
LowProfile:2.00 mm-10Pin
Connector
USB2.0A-Plug
USB2.0A-Plug
PhysicalForm
55.0 mmx16.0 mmx7.0-8.0 mm 68.0 mmx18.0 mmx8.0 mm
36.8mmx26.65 mm
FlashType
SLC
SLC
SLC
Density
128 MBto4 GB
512 MBto8 GB
1 GBto8 GB
OperatingTemperature
Commercial: 0°Cto+70°C
Commercial: 0°Cto+70°C
Extended: -25°Cto+85°C
Commercial: 0°Cto+70°C
Extended: -25°Cto+85°C
StorageTemperature
-50°Cto+100°C
-50°Cto+100°C
-50°Cto+100°C
Shock
50 G
50 G
50 G
Vibration
15 G
15 G
15 G
Humidity
85 %RH85°C,1000 hrs
85 %RH85°C,1000 hrs
85 %RH85°C,1000 hrs
DataTransferMode
full/highspeed
full/highspeed
full/highspeed
Performance
480 Mbit/sUSB2.0highspeed
ReadSeq. upto18 MB/s
WriteSeq. upto12 MB/s
480 Mbit/sUSB2.0highspeed
ReadSeq. upto32 MB/s
WriteSeq. upto23 MB/s
480 Mbit/sUSB2.0highspeed
ReadSeq. upto32 MB/s
WriteSeq. upto23 MB/s
Voltage
5 V+/-10 %
5 V+/-10 %
5 V+/-10 %
PowerConsumption
FullSpeedmax. 80 mA
HighSpeedmax. 100 mA
FullSpeedtyp.
90 mA
HighSpeedtyp. 100 mA
FullSpeedtyp.
90 mA
HighSpeedtyp. 100 mA
Marking
WEEE,Swissbit
WEEE,Swissbit,Density
WEEE,Swissbit,Density,CE,FCC,
PartNumber,LotCode
TargetApplication
IndustrialEmbeddedSystems,MedicalSolutions,Point-of-Sales,GamingIndustry,
AutomationSolutions,etc.
Tools
WindowsSpareBlockreadout
WindowsSpareBlockreadout
WindowsSpareBlockreadout
PartNumber
SFU2xxxxDxBPxxx-x-xx-1x1-STD
SFU2xxxxExBPxxx-x-xx-1x1-STD
SFUIxxxxJxBPxxx-x-xx-2x1-STD
SFUIxxxxKxBPxxx-x-xx-2x1-STD
-LowPowerConsumption
-SmallFormFactor
-OptimizedWearLeveling
-RotatingCliporCapOption
-PasswordManageravailable
-ApprovedUSBHostSolution
-HotPluggable/Plug&Play
-OptimizedWearLeveling
-CustomPrintOption
-SecurityFeatures
-PasswordManageravailable
- BootableUSBDrive
- CompliantwithUSB
Specification2.0
- SupportlatestOSasFixedDrive
- ConnectorPitchVariations
- RobustDesignandShock
VibrationResistant
nand flaSh ProductS
11
DRAM Modules
Swissbit commits to offer highest quality, JEDEC standard and customized
DRAM modules for industrial applications. As a DRAM module manufacturer
Swissbit uses strategic dual sources of DRAM suppliers to offer our customers
a reliable, long term supply of leading edge and legacy memory module
products. Special focus is put into working with suppliers that offer extended
availability of DRAM die revisions, avoiding frequent requalification efforts
with our customers.
Swissbit’s quality focus starts with sourcing the highest quality grade DRAMs
and where defined, utilizing fully compliant JEDEC module raw cards either
as in-house PCB design or from top quality design partners. For all modules
the passives and other active components selected are of the highest quality
grade. Using Surface Mount Technology (SMT) and Chip-On-Board (COB)
processes in production on fully certified facilities in Germany allows
Swissbit to sustain a quality focus during the entire assembly process.
Traceability is guaranteed through the complete manufacturing and testing
flow. A means to ensure the highest quality level for our customer is
Swissbit’s world class application testing. Swissbit uses internally developed
application software which tests 100 % of all modules under real world
conditions with diverse pattern and stress methods and covers the complete
memory array including ECC components by constantly adapting to newest
memory controller features.
For industrial temperature grade modules the application tests are
performed at -40°C and 85°C TAMBIENT.
Accompanied by stringent internal product qualification, fast customer
return processing and the dedication to be an always improving company,
Swissbit constantly works on providing to our customers the best DRAM
modules available on the market at a competitive price.
Swissbit is able and committed to design, manufacture and test customer
specific module solutions. With broad experience from COB technology
Swissbit can offer PCB design and layout services, development of individual
test solutions, thermal simulations, DRAM component sourcing, controlled
manufacturing and special coating options.
With Swissbit DRAM modules you can keep the total system cost at a minimum.
12
DRAM MODULES
UnbUFFERED DiMM pRODUctS
LOng UDiMM / StAnDARD hEight / With AnD WithOUt Ecc
Data Rate / CL
Density
Org
Height
Voltage
Pins
Partnumber
Package
DDR3-UDiMM
1333 / CL9
1 GB - 4 GB
x64
1.18“ (29.97 mm)
1.50 V
240
SGUxxx64xxxxxxx-ssR
BGA
DDR3-UDiMM Ecc
1333 / CL9
1 GB - 4 GB
x72
1.18“ (29.97 mm)
1.50 V
240
SGUxxx72xxxxxxx-ssRT
BGA
DDR2-UDiMM
800 / CL6
512 MB - 2 GB
x64
1.18“ (29.97 mm)
1.80 V
240
SEUxxx64xxxxxxx-ssR
BGA
DDR2-UDiMM Ecc
800 / CL6
1 GB - 2 GB
x72
1.18“ (29.97 mm)
1.80 V
240
SEUxxx72xxxxxxx-ssR
BGA
DDR1-UDiMM
400 / CL3
512 MB - 1 GB
x64
1.25“ (31.75 mm)
2.50 V
184
SDUxxx64xxxxxxx-ssR
TSOP
DDR1-UDiMM
400 / CL3
512 MB - 1 GB
x64
1.00“ (25.40 mm)
2.50 V
184
SDUxxx64xxxxxxx-ssR
COB
DDR1-UDiMM Ecc
400 / CL3
512 MB - 1 GB
x72
1.25“ (31.75 mm)
2.50 V
184
SDUxxx72xxxxxxx-ssR
TSOP
DDR1-UDiMM Ecc
400 / CL3
512 MB - 1 GB
x72
1.00“ (25.40 mm)
2.50 V
184
SDUxxx72xxxxxxx-ssR
COB
SDR-UDiMM
133 / CL3
256 MB - 512 MB
x64
1.15“ (29.21 mm)
3.30 V
168
SSUxxx64xxxxxxx-ssR
TSOP
SDR-UDiMM Ecc
133 / CL3
256 MB - 512 MB
x72
1.15“ (29.21 mm)
3.30 V
168
SSUxxx72xxxxxxx-ssR
TSOP
SODiMM - SO-UDiMM / StAnDARD AnD REDUcED hEight /
With AnD WithOUt Ecc
Data Rate / CL
Density
Org
Height
Voltage
Pins
Partnumber
Package
DDR3-SODiMM
1333 / CL9
1 GB - 4 GB
x64
1.18“ (29.97 mm)
1.50 V
204
SGNxxx64xxxxxxx-ssRT
BGA
DDR3-SO-UDiMM
1333 / CL9
1 GB - 4 GB
x72
1.18“ (29.97 mm)
1.50 V
204
SGNxxx72xxxxxxx-ssRT
BGA
DDR2-SODiMM
800 / CL6
512 MB - 2 GB
x64
1.18“ (29.97 mm)
1.80 V
200
SENxxx64xxxxxxx-ssR
BGA
DDR2-SODiMM
800 / CL6
1 GB - 2 GB
x64
0.94“ / 1.18“
1.80 V
200
SENxxx64xxxxxxx-ssR
COB
DDR1-SODiMM
400 / CL3
256 MB - 1 GB
x64
1.25“ (31.75 mm)
2.50 V
200
SDNxxx64xxxxxxx-ssR
BGA
DDR1-SODiMM
400 / CL3
256 MB - 2 GB
x64
1.00“ (25.40 mm)
2.50 V
200
SDNxxx64xxxxxxx-ssR
BGA / COB
DDR1-SODiMM Ecc
400 / CL3
256 MB - 1 GB
x72
1.00“ (25.40 mm)
2.50 V
200
SDNxxx72xxxxxxx-ssR
COB
SDR-SODiMM
133 / CL3
128 MB - 1 GB
x64
1.00“ (25.40 mm)
3.30 V
144
SSNxxx64xxxxxxx-ssR
COB
SDR-SODiMM Ecc
133 / CL3
128 MB - 1 GB
x72
1.00“ (25.40 mm)
3.30 V
144
SSNxxx72xxxxxxx-ssR
COB
MicRODiMM / 100pin-DiMM
Data Rate / CL
Density
Org
Height
Voltage
Pins
Partnumber
Package
DDR2-MicroDiMM
667 / CL5
1 GB
x64
1.18“ (29.97 mm)
1.80 V
214
SEMxxx64xxxxxxx-ssR
BGA
DDR1-100pin-DiMM
333 / CL2.5
128 MB - 512 MB
x32
1.10“ (27.94 mm)
2.50 V
100
SDUxxx32xxxxxxx-ssR
TSOP
DRAM MODULES
13
Industrial Temperature Range
DDR2 Registered DIMM Selection Matrix
Swissbit offers different JEDEC
RDIMM form factors from standard
height RDIMM to VLP Mini RDIMM
or SO-RDIMM. Each product has
special benefits regarding space
requirements, cooling, electrical
performance and price per socket.
The following list will make it easier
for you to choose the right form factor.
Besides modules for commercial
temperature range 0°C to 70°C,
Swissbit also offers products for an
extended temperature range of 0°C
to 85°C TAMBIENT as well as full industrial
temperature range -40°C to
85°C TAMBIENT. With intensive application
testing of each individual module at
low and high temperature, Swissbit
ensures the highest quality and reliability of their products. Orientation
Board space
Height
requirement
Electrical
Performance
Max DIMM
Capacity
Cooling
Price per GB
+ socket
Std RDIMM
Top (std)
0
--
++
++
0
++
Std RDIMM
25°
-
0
++
++
-
+
Std RDIMM
22.5°
-
0
++
++
-
+
VLP RDIMM
Top (std)
0
0
++
+
+
+
Top (std)
+
0
++
0
+
0
25°
0
+
++
0
-
-
90°
-
+
++
0
--
-
SO-RDIMM
Top
++
--
+
0
++
-
SO-RDIMM
90° (std)
--
++
+
0
--
0
VLP Mini
RDIMM
VLP Mini
RDIMM
VLP Mini
RDIMM
registered DIMM comparison
++ optimal solution; + good; o neutral; - some limitations; -- higher restrictions for design
14
DRAM MODULES
REgiStERED DiMM pRODUctS
LOng RDiMM / StAnDARD hEight / With Ecc AnD c/A pARitY
DDR3-RDiMM
Ecc+pARitY
DDR2-RDiMM
Ecc+pARitY
DDR1-RDiMM
Ecc
SDR-RDiMM
Ecc
Data Rate / CL
Density
Org
Height
Voltage
Pins
Partnumber
Package
1333 / CL9
1 GB - 4 GB
x72
1.18“ (29.97 mm)
1.50 V
240
SGPxxx72xxxxxxx-ssRT
BGA
800 / CL6
1 GB - 4 GB
x72
1.18“ (29.97 mm)
1.80 V
240
SEPxxx72xxxxxxx-ssR
BGA
400 / CL3
512 MB - 2 GB
x72
1.20“ (30.48 mm)
2.50 V
184
SDRxxx72xxxxxxx-ssR
TSOP / BGA
133 / CL3
256 MB - 512 MB x72
1.20“ (30.48 mm)
3.30 V
168
SSRxxx72xxxxxxx-ssR
TSOP
LOW pROFiLE LOng RDiMM, UDiMM / With Ecc
DDR3-RDiMM
Ecc+pARitY
DDR3-UDiMM
Ecc
DDR2-RDiMM
Ecc+pARitY
Data Rate / CL
Density
Org
Height
Voltage
Pins
Partnumber
Package
1333 / CL9
2 GB - 4 GB
x72
0.70“ (17.78 mm)
1.50 V
240
SGPxxx72xxxxxxx-ssR
BGA
1333 / CL9
2 GB - 4 GB
x72
0.70“ (17.78 mm)
1.50 V
240
SGUxxx72xxxxxxx-ssR
BGA
800 / CL6
1 GB - 2 GB
x72
0.72“ (18.29 mm)
1.80 V
240
SEPxxx72xxxxxxx-ssR
BGA
VLp MiniRDiMM With Ecc, REgiStERED SO-RDiMM With Ecc
DDR2-MiniRDiMM
DDR2-SO-RDiMM
Data Rate / CL
Density
Org
Height
Voltage
Pins
Partnumber
Package
667 / CL5
1 GB
x72
0.72“ (18.29 mm)
1.80 V
244
SEHxxx72xxxxxxx-ssR
BGA
667 / CL5
1 GB - 2 GB
x72
1.18“ (29.97 mm)
1.80 V
200
SEGxxx72xxxxxxx-ssR
BGA
DRAM MODULES
15
chip On bOARD (cOb)
Bilddaten kommen
vom Kunden
Swissbit is the world’s only manufacturer utilizing ChipOn-Board (COB) technology to produce a robust line of
DRAM memory modules that lend themselves to demanding Industrial and Embedded applications. With over
20 years of experience and success in the assembly of
COB memory modules, Swissbit enables its customers
to take advantage of COB features not found in Surface
Mount Technology (SMT) memory modules.
cOb DEScRiptiOn
Bilddaten kommen
vom Kunden
16
Chip-On-board (COB) technology involves mounting
DRAM or Flash semiconductor dies directly on a substrate
without the need of a packaged component. Eliminating
the FBGA or TSOP component package reduces the required
substrate area and assembly weight. The saving in area
can be as much as 20% in some cases. Using conventional
printed circuit boards (PCBs) and standard wire bonding
technology, COB technology can yield up to a factor of
5 in weight and volume reduction. COB technology also
reduces the number of interconnects between an active
die and the substrate (i.e. the package pins) which
improves the overall circuit speed, leads to higher clock
rates, better electrical performance and improved signal
quality and increases the overall reliability of the module.
A coating of an Epoxy encapsulent (or Glob Top) is applied
that hermetically seals and protects the die and the wire
bonded interconnections. The Glob Top also acts like a
heat spreader between dies, improves heat emission,
adds low coefficients of thermal expansion (CTEs) and
provides a hermetically sealed module assembly. The
die is glued directly to the PCB to provide increased heat
dissipation from the die through the PCB. Swissbit encapsulates the semiconductor die onto the PCB as a total
module package, the complete assembly is extensively
temperature tested as a unit, not separate components
prior to SMT assembly. This also enables Swissbit to offer
its line of COB modules in four temperature grade levels.
cOb
bgA
Thermal Simulations done by
thERMAL cOMpARiSOn
FEAtURES
A COB memory module as offered by Swissbit provides customers with the
following advantages:
- Typically Swissbit SODIMMS are 1.00” (25.4 mm) high, low profile format.
Typical SMT modules are 1.25” or 1.18“. This enables Swissbit modules to be
used in more applications and allows better airflow.
- COB modules are 3.0mm thin; typical SMT modules are max. 3.8 mm thick.
A thinner design allows for better airflow around the installed module in
most applications resulting in cooler operation. (see diagram)
- The thermal properties of Swissbit modules are superior to typical SMT
modules. COB modules dissipate heat more efficiently and will run lower
die junction temperatures in demanding convective cooling conditions.
A cooler operating module runs faster and lasts longer.
- Our COB module has less lead frame connections then the typical SMT
modules, which results in better signal integrity and higher reliability.
- Swissbit COB modules are available in commercial temperature grade
(0°C to +70°C) and three extended temperature grades up to industrial
grade (-40°C to +85°C).
- COB modules accept conformal coating better than the typical SMT modules
do to their low profile and Glob Top encapsulation.
- Swissbit COB modules are inherently ruggedized for shock and vibration
due to the COB technology and the Glob Top encapsulation process; typical
SMT modules are not ruggedized.
- Swissbit COB modules are burned in and 100 % tested at the module level
as finished product, not at the IC level before assembly.
- All Swissbit COB modules are RoHS compliant.
chip On bOARD (cOb)
17
Flash Part number Decoder
S
1
F
2
CF
3
2048
4
H
5
4
6
B
7
K
8
2
9
SA - I 10
11
Q
12
T
13
-
*
14
-
*
15
Swissbit
Memory (1)
Design Option (15)
Memory Type (2)
F: Flash Products
Configuration (14)
PIN Mode (13)
0:Normal nCE & R/nB
Product Type (3)
1:Dual nCE & R/nB
U2: USB 2.0 Drive
2:Quad nCE & R/nB
CA: CFast™
A:LGA 1 nCE & R/nB
CF: CompactFlash™
B:LGA 2 nCE & R/nB
UI: UFD internal / Module
C:LGA 4 nCE & R/nB
SD: SecureDigital
M:TSOP 1 nCE & R/nB
MM:Multimedia Card
S:TSOP 2 nCE & R/nB
PA: PATA/IDE
T: TSOP 4 nCE & R/nB
SA: SATA
DIE Classification (12)
Density (4)
M:SLC MONO (single die package)
0016:16 MByte
2048:2 GByte
D:SLC DDP (dual die package)
0032:32 MByte
4096:4 GByte
Q:SLC QDP (quad die package)
0064:64 MByte
8192:8 GByte
N:SLC ODP (octal die package)
0128:128 MByte
016G:16 GByte
G:MLC MONO (single die package)
0256:256 MByte
032G:32 GByte
L: MLC DDP (dual die package)
0512:512 MByte
064G:64 GByte
H:MLC QDP (quad die package)
1024:1 GByte
128G:128 GByte
O:MLC ODP (octal die package)
Product Dimension (5)
Product Generation (6)
Memory Organization (7)
Temperature Rating (11)
I: Industrial Temp. (-40°C - + 85°C)
E:Extended Temp. (-25°C - + 85°C)
C:Commercial Temp. (0°C - + 70°C)
Flash Supplier (10 )
Technology (8)
SA: Samsung
MT:Micron Technologies
HY: Hynix
IT: Intel
TO: Toshiba
NX:Numonyx
Channels / Chips (9)
18
Part Numbers
DRAM Part Number Decoder
S
1
G
N
02G
64
E1
B
F
2
2
3
4
5
6
7
8
9
SA - BB
10
11
*
12
R
T
13
14
Swissbit
Thermal Sensor /
Memory (1)
Heat Spreader (14)
RoHs/ Lead Free (13)
Product Group (2)
Temperature Rating (12)
S:SDRAM SDR
D:SDRAM DDR
C: (or blank) (0°C to +70°C)
E:SDRAM DDR2
E: Ext. Temp.(0°C to +85°C)
G:SDRAM DDR3
I: Ext. Temp.(-25°C to +85°C)
W:Ind. Temp.(-40°C to +85°C)
Module Type (3)
SDR
U: 168 Pin UDIMM 3.3 V
R: 168 Pin RDIMM 3.3 V
N: 144 Pin SODIMM 3.3 V
DDR
U: 184 Pin UDIMM 2.5 V
R: 184 Pin RDIMM 2.5 V
N: 200 Pin SODIMM 2.5 V
M: 172 Pin Micro-DIMM 2.5 V
DDR2 U: 240 Pin UDIMM 1.8 V
R: 240 Pin RDIMM 1.8 V, w/o Parity
P: 240 Pin RDIMM 1.8 V, w/ Parity
F: 240 Pin FBDIMM
N: 200 Pin SODIMM 1.8 V
G: 200 Pin SO-RDIMM 1.8 V
H: 244 Pin Mini RDIMM 1.8 V, w/ Parity
M: 214 Pin MicroDIMM 1.8 V
DDR3 U: 240 Pin UDIMM 1.5 V
P: 240 Pin RDIMM 1.5 V
N: 204 Pin SODIMM/SOUDIMM 1.5 V
M: 214 Pin MicroDIMM 1.5 V
Speed (11)
DDR3 AA: DDR3-800 CL5
AB:DDR3-800 CL6
BA: DDR3-1066 CL6
BB:DDR3-1066 CL7
CA: DDR3-1333 CL7
CB:DDR3-1333 CL8
CC: DDR3-1333 CL9
DA:DDR3-1600 CL9
DC:DDR3-1600 CL11
DB:DDR3-1600 CL10
DDR2 50: DDR2-400 CL3
37: DDR2-533 CL4
30: DDR2-667 CL5
3A:DDR2-667 CL4
25: DDR2-800 CL6
2A:DDR2-800 CL5
BB: DDR2-1066 CL7
DDR
08: DDR-200 CL2
5: DDR-266B CL2.5
70: DDR-266A CL2
7A:DDR-266A CL2
60: DDR-333B CL2.5 6A:DDR-333A CL2
50: DDR-400B CL3
5A:DDR-400A CL2.5
SDR
10: PC-100 CL3
08: PC-100 CL2
75: PC-133 CL3
70: PC-133 CL2
DRAM Manufacturer (10 )
MT:Micron Technology
EP:Elpida
Data Depth (4)
QI: Qimonda
008: 64 MB
256: 2 GB
SA:Samsung
016: 128 MB
512: 4 GB
HY:Hynix
032: 256 MB
01G:1 GB
WI:Winbond
064: 512 MB
02G:2 GB
128: 1 GB
04G:4 GB
Module Ranks (9)
1:1 Rank Module
Data Width (5)
2:2 Rank Module
32: w/o Parity
DRAM Revision (8)
36: w/ Parity
64: w/o ECC
72: w/ ECC
Printed Circuit Board with Revision (6)
DRAM Organization (7)
A: x4
E: x8 TSOP Stack
D:x4 TSOP Stack
C: x16
B: x8
G: x4 BGA Stack
Part Numbers
19
Swissbit Sales locations worldwide
EMEA / APAC
North & South America
Japan
Swissbit AG
Industriestrasse 4
CH-9552 Bronschhofen
Switzerland
Swissbit NA
1202 E Winding Creek
Eagle, Idaho 83616
USA
Swissbit Japan Inc.
4F, 2-40-16 Umesato
Suginami-ku, Tokyo 166-0011
Japan
Tel.+41 71 913 03 03
Fax+41 71 913 03 15
industrial@swissbit.com
Tel.+1 208 938 4525
Fax+1 914 935 9865
sales@swissbitna.com
Tel.+81 3 33 17 12 11
Fax+81 3 33 17 12 22
industrial@swissbit.co.jp
Headquarter
Production Plant
Swissbit AG
Industriestrasse 4
CH-9552 Bronschhofen
Switzerland
Swissbit Germany AG
Wolfener-Strasse 36
D-12681 Berlin
Germany
Tel.+41 71 913 03 03
Fax+41 71 913 03 15
info@swissbit.com
Tel.+49 30 936 954 0
Fax+49 30 936 954 55
www.swissbit.com
20
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