Standard and Circular Upward-Looking Cameras Upward Looking

Upward Looking Cameras Using
Vision-on-the-Fly Technology
For components up to 32 mm square (1.25"),
the GSM Platform performs vision inspection
with Upward-Looking Cameras in a single
filed of view using “vision-on-the-fly” technology. It can pick components and pass over an
Upward-Looking Camera at 20" per second.
While the head passes over the camera,
the vision system captures component
images. The head then places the components
at the vision-adjusted coordinates.
For components that do not fit into a
single field of view, the head stops over the
Upward-Looking Camera, then captures
multiple fields of view to acquire the entire
component image.
The GSM Platform supports two UpwardLooking Cameras, one in the front feeder area
and one in the rear. Two cameras reduce the
travel distance to the camera and allow the
GSM Platform to efficiently handle a greater
range of components.
Standard and Circular Upward-Looking Cameras
Upward-Looking Cameras accommodate front
and back lighting for component inspection.
For front lighting, the inner LED banks are
strobed as the vision system captures the
front image of the component. For back
lighting, the back light towers strobe the two
outer LED banks, illuminating the special back
lighting nozzle. The vision system captures the
silhouette of the component. Back lighting
cannot be used with components that require
multiple fields of view.
The circular lighting camera provides a 360°
low angle lighting scheme for optimal
illumination of component features, such as
PLCC socket leads, BGA bumps, and standard
through hole leads. Circular lighting
applications should be reviewed by the
Universal GSM Platform Applications
Engineering Group due to the elimination of
component back lighting capability and the
elimination of two extra feeder slots (one on
each side of the camera).
Vision Specifications*
Maximum field of view1
Leadless components
minimum length
minimum length
Leaded components
minimum lead pitch2
minimum lead width
(without inspection)
minimum lead width
(with inspection)
Multi-pattern components
minimum feature length
minimum feature width
BGA & C4 components
minimum bump pitch3
minimum bump diameter3
1.0 mil per pixel
8.270 mm (0.326")
2.6 mil per pixel
4.0 mil per pixel
20.348 mm (0.326") 33.358 mm (1.313")
0.330 mm (0.013")
0.165 mm (0.007")
0.660 mm (0.026")
0.330 mm (0.013")
1.016 mm (0.040")
0.508 mm (0.020")
0.132 mm (0.005")
0.264 mm (0.010")
0.406 mm (0.016")
0.083 mm (0.003")
0.132 mm (0.005")
0.203 mm (0.008")
0.083 mm (0.003")
1.651 mm (0.065")
0.254 mm (0.010")
0.826 mm (0.033")
0.083 mm (0.003")
1.651 mm (0.065")
1.651 mm (0.065")
2.540 mm (0.100")
0.254 mm (0.010")
0.264 mm (0.010")
0.132 mm (0.005")
0.528 mm (0.021")
0.264 mm (0.010")
0.813 mm (0.032")
0.406 mm (0.016")
Assumes a default ±1.905 mm (0.075") pick tolerance.
Assumes a 2.0 pixel minimum separation distance between leads.
Maximum number of bumps is 2,500.
*Note: Specifications apply to Flex, HIgh Force, and UFP 300+ heads. Further limitations apply to FlexJet head.
Refer to Component Handling Capabilities table in the FlexJet section.
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