This document describes general precautions for using Hamamatsu mini-spectrometers.
If the product comes with special precautions on the delivery specification sheet, then be sure to strictly
comply with those instructions.
1. All models
 Mini-spectrometers (hereafter “the product”) are high precision optical components. Do not apply excessive
vibration and shock to the product. Avoid operating and storing it in dusty locations or in areas exposed to
water, high temperature or high humidity.
 When cleaning the enclosure, wipe it with a clean, soft, dry cloth. Do not use organic solvents such as
thinner and acetone.
 Do not apply excessive force to the connector. Doing so may cause a poor connection or damage the
 Use the product at incident light levels that do not cause the A/D count of each pixel to become saturated.
Correct measurement may not be possible when some pixels become saturated. Set a shorter integration
time if the A/D count is saturated. If the integration time cannot be shortened, we recommend you use a
neutral density filter.
 Even when no light is input, the product generates an output consisting of an offset component and dark
signal. The offset component is not dependent on integration time, but the dark signal is dependent on it.
 Coefficients for converting image sensor pixel numbers into wavelengths are described in the final
inspection sheet that comes with each product. For module types, those coefficients are also written into the
EEPROM in the mini-spectrometer. However, we do not provide coefficients for converting the output value
of each pixel to a value proportional to the incident light level.
2. Module type
 The optical connector is exposed to outside air, so when not using the product for extended periods, place a
cap on the optical connector or connect the input optical fiber to the connector. When connecting the optical
fiber, clean the ferrule on the optical fiber as needed.
 Power supplied through a USB port from a PC is limited to 5 V/500 mA per port due to USB specifications. So
power exceeding this limit cannot be supplied to the product. If connecting two or more products to one
USB port via a hub, use a hub with a power supply.
 Evaluation software differs according to the product model. Be sure to install the evaluation software that
supports the product you will be using.
 Never connect the product to the PC before installing the evaluation software into the PC. This might
prevent correctly installing the evaluation software.
 The supported OS is Microsoft® Windows®. Refer to the datasheet or operation manual for details on
versions and platforms.
 Depending on the PC model, the power-saving mode or screensaver might interrupt power supplied from
the USB port. Interruption of power supplied from the USB port will also stop the product operation and
might cause problems when power is later resupplied from the PC after recovering from power-saving or
screensaver mode. If the PC causes this problem, then please disable the power-saving mode and
screensaver. (See the PC operation manual to find PC functions and settings.)
(1) TG-CCD/TM-CCD series
An external power supply is required to operate the internal image sensor. Use the AC adapter that
comes supplied with the product.
(2) TG-cooled series
 An external power supply is required to operate the internal thermoelectric cooler and cooling fan. Please
prepare a low noise power supply and connect it to the product using the connector that came supplied with
it. Use caution when turning on the power supply because an inrush current flows at that time. Table 1
shows the maximum current in steady state and typical inrush current.
[Table 1] Maximum current in steady state and typical inrush current (TG-cooled series)
Power supply
For thermoelectric
For cooling fan
Mini-spectrometer type
Maximum current in
steady state
Typical inrush
All models
[Power supply examples]
Multi-output power supply: PW18-1.3ATS (Texio Technology Corporation)
Unit type power supply (+5 V): GT2.5-5-T (Cosel Co., Ltd.))
(+12 V): PBA10F12-N (Cosel Co., Ltd.)
 When the cooling fan filter becomes dirty, replace it by following the procedure described in the product
operation manual.
 Do not block the air intake and exhaust ports for the cooling fan during use. If the temperature inside the
product rises too high, the internal safety circuit acts to stop product operation. However, high temperatures
may cause a malfunction. If product operation stopped due to the safety circuit, then immediately turn off
the external power supply and disconnect this product from the USB port of the PC. Then, check and
eliminate the cause of the problem. Resume operation after making sure that the product temperature has
dropped to room temperature.
3. Head type
The electrical terminals of the head type are connected to the internal image sensor signal terminals. Take the
following precautions on static electricity management, circuit board design, and handling, etc.
3-1. Static electricity management
Electrostatic sensitive products come with an electrostatic warning label on the product packing. Handling of
the product requires taking precautions on the following points to avoid product damage and deterioration due
to static electricity.
【Figure 1】 Electrostatic warning label
(1) Workplace and facilities, etc.
● Lay a conductive mat (750 k to 1 G) on the surface of the workbench and ground it.
● Use conductive flooring material or lay a conductive mat on the workplace floor and ground it.
● Ground all manufacturing equipment and inspection devices.
● Keep moisture at approximately 50%. Low humidity tends to cause static electricity and high humidity is
prone to moisture absorption.
(2) Handling
● Using an ionizer or similar item to eliminate electrical charges is recommended when handling the product.
● Wear anti-static clothing and conductive shoes (100 k to 100 M).
● Attach a wrist strap (having protective resistance of 750 k to 35 MΩ) directly to the skin, and ground the
strap. If the wrist strap does not include protective resistance, there is a risk of electric shock hazard due to
electric leak. Also wear conductive finger sacks or gloves.
● Tools such as tweezers used to handle the product may sometimes become electrically charged. Connect a
ground line as needed.
● Use a soldering iron with an insulation resistance of 10 MΩ or higher. The soldering iron tip should be
● If the product is induction-charged and contacts with a metal, excessive current may flow due to electrostatic
discharge causing damage to the product. To prevent induction charging, keep objects (insulators such as
plastic and vinyl, PC display monitors and keyboards, etc. that may possibly be electrically charged) away
from the product. The product may be induction-charged even by just bringing such objects close to the
product. If keeping such objects near the product is unavoidable, then use an ionizer, etc. to remove
electrostatic charges from the objects that are apt to be electrostatically charged.
● Friction on the product causes electrostatic charges. If such friction is unavoidable, then remove the
electrostatic charges using an ionizer, etc.
● Peripheral devices must be properly grounded so that no surges are applied to the product by a leakage
voltage. Do not allow a voltage exceeding the absolute maximum ratings to be applied to the product from
the measurement instrument, etc. (This tends to occur during ON/OFF switching of power sources, so use
caution.) If there is the possibility of a surge voltage, insert a filter (made up of a resistor and capacitor) to
protect the product. During operation do not attach or detach any connector, etc. that are connected to the
power supply line or output line.
(3) Carrying, storage and packing
 Place the MS series and micro-spectrometers in a conductive case by inserting the leads into the conductive
mat (for shorting leads). For the RC series (head type), put the product in a conductive case. The PC board
to mount the head type should also be put in a conductive case. Avoid using plastic or styrofoam as they
may generate static electricity by vibration during shipping, etc. causing breakdown or deterioration of the
heed type.
 Use a conductive carrying case and storage shelf.
 Avoid storing the product near equipment that may generate high voltage or high electromagnetic fields.
 When packing the product, short the leads so that they are at the same electrical potential, and use
conductive packing materials.
Note: It is not always necessary to provide all the anti-electrostatic measures stated above. Implement these
measures according to the extent of deterioration or damage that may occur.
【Figure 2】 Electrostatic countermeasure example
Wrist strap
Conductive mat
Anti-static clothing
Conductive stool/chair
Conductive flooring (sheet)
Conductive shoes
3-2. Precautions for designing the circuit board
Driver circuits for mini-spectrometers are unique in that they contain a light input section and both digital and
analog circuits, so take the following precautions when designing the circuit board.
(1) Circuit board surface to mount a mini-spectrometer
 The circuit board surface to mount a mini-spectrometer should be inside an optical system that blocks
external light. So, attaching variable resistors, etc. to the back side of the circuit board surface makes it
easier to adjust them.
(2) Circuit board
 The mounting holes for equipment in the circuit board should be made slightly larger than the screw
diameter in order to allow making fine adjustments of the photosensitive area position. Additionally, use a
circuit board that will hardly warp due to temperature variations in order to prevent the focus position from
(3) Circuit components
 Changes in mini-spectrometer temperature will also cause changes in characteristics such as the sensitivity
and dark current. Using circuit components that emit as little heat as possible is recommended to suppress a
temperature rise in the mini-spectrometer. Besides keeping the product away from heat-emitting circuit
components, please take other measures for heat dissipation.
(4) Grounds
 To prevent digital circuit section noise from intruding into the analog circuit section through the ground,
isolate the digital section ground from the analog section ground, and use a thicker ground line to lower its
(5) Digital signals
 The input clock pulse line causes voltage fluctuations, so separate it as far as possible from the video signal
line and voltage supply line. Apply the input clock pulses at the specific timing and voltage to the product
connection terminals on the circuit board. Additionally, extra caution is needed during high-speed operation.
(6) Analog signals
 Keep the wiring width and wiring distance between the video output terminal and amplifier as short as
possible. For the product with the active video and dummy video, set the same wiring width and wiring
distance for both the active video and dummy video side signal lines so that they have the same capacitance
as much as possible. To prevent noise intrusion into the output signal, keep the video signal line away from
digital signal lines such as clock lines that are subject to voltage fluctuations, and also make sure that the
video signal lines and digital signal lines do not cross each other on the front or back of the circuit board.
This reduces clock feed-through.
(7) Supply voltage
 Fluctuations in mini-spectrometer supply voltage will cause unstable output characteristics. To avoid this, use
a power supply having minimal voltage fluctuations, and ensure that the mini-spectrometer supply voltage is
not affected by external voltage fluctuations. Do not allow voltage fluctuations on the power supply lines
caused by circuit board component operation to change the product supply voltage. Separate the power
supply lines to the product as far away as possible from digital signal lines such as clock lines where the
voltage changes.
(8) Others
 Noise generated from mechanically driven sections, etc. in equipment, into which the product and circuit
board are incorporated, may enter the output signal. Perform the circuit board shielding securely.
 Characteristics may deteriorate during operation at high temperature. Take heat dissipation measures as
RC series
 Avoid excessive or repeated bending and stretching of the flexible board, which may cause an open-circuit
fault. Do not bend the flexible board to the point where folds or creases occur.
 Avoid pulling, twisting or excessive bending of the optical fiber, which may damage the optical components
in the mini-spectrometer or the optical fiber itself. To prevent applying stress to the optical fiber, provide
slotted mounting holes in the equipment enclosure where the head-type mini-spectrometer is to be installed.
Make sure these slotted holes are aligned along the same direction as the optical fiber. When installing the
mini-spectrometer, first clamp the optical fiber SMA connector and then use the slotted holes to secure the
mini-spectrometer at a position where the optical fiber is free from stress.
[Figure 3] Precautions when connecting input optical fiber
[Correct connection]
 Connect the SMA connector.
 Secure in place while making sure no stress is applied to
Do not bend, push, pull, turn or twist the optical fiber.
the optical fiber.
MS series, Micro-spectrometer
(1) Window material
 Do not rub the window surface hard or do not apply strong pressure to the window to prevent scratches or
cracks. Do not allow the window surface to come in contact with a sharp or hard object.
 If dust is adhering to the window, blow it away with a blow gun. Use an ionizer along with the blow gun to
remove static electricity. When handling ESDS (electro-static charge sensitive) products, use an ionizer to
remove static electricity.
 If oil or grease adheres to the window, then gently wipe it away with cotton swabs, etc. moistened with
ethyl alcohol so that the window is not scratched. Rubbing strongly or wiping the same section over and
over may decrease the electrical and optical characteristics, or the reliability.
 Take precautions to protect the window from contamination or scratches when packing or shipping
equipment in which the product is installed.
(2) Precautions when mounting
 The product is a precision optical component, so placing excessive loads on the package may cause
problems such as package warping or damage, chip peeling, wire breakage, damage to thermoelectric
cooler, or poor optical characteristics. Take full precautions when mounting the product on the board,
inserting the product into the socket, or installing the heatsink.
 Never handle the product in the following ways since this may cause the package to break.
・ apply repeated stress to the leads.
・ suddenly cool or suddenly heat the product.
 Check the pin connection positions when mounting the product in the socket. Installing the product
reversely or in the wrong position may damage the product. Be sure to turn on the power after the product
has been properly installed.
 Be aware that inserting the product reversely, inserting it incorrectly, or causing short-circuit between
terminals may lead to malfunctions.
 If external force is repeatedly applied to the leads, this may damage the leads. When installing this product
in locations subject to vibration, secure it with resin or a holder, etc.
(3) Precautions for designing the circuit board
 The packaging of the micro-spectrometer is electrically conductive, so be careful when designing the circuit
to avoid short circuit caused by contact with a circuit pattern.
(1) Precautions during soldering
 Take sufficient care to make sure that the soldering iron tip temperature and soldering time are correct. Do
not attempt soldering at high temperatures or for long periods. Soldering at high temperatures or for long
periods may cause the package to crack or the window material to separate from the package.
 It is recommended that the MS series be soldered within 3 seconds at 370 °C or less and the
micro-spectrometers within 3.5 seconds at 350 °C or less when soldering by hand, and both be soldered
within 10 seconds at 260 °C or less when using reflow soldering.
 Take measures to prevent solder or flux from flying outward and sticking to the light input window,
contaminating it.
(2) Flux
 Use non-cleaning solder or rosin type flux. Using flux with relatively strong acid or alkali levels or inorganic
flux may cause corrosion on the leads.
(3) When using a soldering iron
 Set the soldering iron tip temperature by referring to the recommended soldering condition. If you cannot
provide these conditions, then grip the root of the lead you are soldering with tweezers or a similar tool to
prevent heat from conducting to the product package.
 Do not let the soldering iron directly contact the package section of the product. Direct contact with the
soldering iron may cause mechanical or optical damage.
 Avoid exposure to direct sunlight, harmful gases, or dust, or storage in a place with sudden temperature
 Do not lay a heavy object or load on the product or the bag. Also avoid stacking the products or bags when
storing them.
 When storing the product for a long period of time, seal it in a moisture-proof package containing silica gel or
keep it in a low-humidity desiccator.
4. Input optical fibers (option)
 When connecting the input optical fiber, clean the ferrule on the optical fiber as needed.
 Do not bend the HAMAMATSU input optical fibers to a radius smaller than that shown in Table 2. Doing so
may break the optical fiber.
[Table 2] Minimum bend radius of input optical fiber
Product name
Fiber for UV/visible range
(resistance to UV)
Fiber for visible/near infrared range
Type no.
Core diameter
Minimum bend radius
Cat. No. KACC9005E08 Dec. 2016
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