Intel(R) Desktop Board DQ67OW
product brief
Intel® Desktop Board DQ67OW
Executive Series
MicroATX Form Factor
Intel® Desktop Board DQ67OW
Executive Series
Solution for the Legacy Peripherals
Seamless PC Remote Manageability
Board DQ67OW is the award-winning antivi-
Introducing the Intel® Desktop Board
The Intel Desktop Board DQ67OW is
rus software ESET* Smart Security 4 with
DQ67OW, supporting the 2nd gen Intel®
equipped with improved KVM Remote
a one-year license.
Core™ vPro™ processors in the latest
Control manageability, enabling remote
LGA1155 package. Based on the Intel® Q67
access and control of a PC, even when
Express Chipset, this desktop board delivers
the PC is in OOB (out-of-band) state.
the newest PC manageability platform with
Desk-side troubleshooting is greatly
Intel® Active Management Technology1 7.0,
reduced with KVM Remote Control,
together with multiple legacy connectivity
saving both time and money.
options, including a parallel port, PS/2 port,
and a floppy header. With up to 32 GB2 DDR3
Data Security Features
1333 / 1066 MHz memory support and six
Protect sensitive office data with RAID built
onboard SATA ports including two SATA 6.0
into the Intel Q67 Express Chipset, with
Gb/s ports, the Intel Desktop Board DQ67OW
multiple configurations to support RAID 0,
delivers remarkable expansion possibilities
1, 5, and 10. Encryption and signature keys
for both legacy and the latest peripherals.
are protected from software-based attacks
with onboard Trusted Platform Module
(TPM).3 Also included with the Intel Desktop
Multiple Operating System
Certifications
The Intel Desktop Board DQ67OW is
certified with the following operating
systems: Windows* 7, Windows Vista*
Premium, openSUSE*, and RedHat* Linux*.
Intel® Desktop Board DQ67OW Executive Series
The boxed Intel® Desktop Board DQ67OW solution includes:
•ATX 2.2 compliant I/O shield
•SATA cables
•Board and back panel I/O layout stickers
•Quick reference guide
•Intel® Express Installer driver and software DVD
Software included:
2
CAPABILITY
SOFTWARE INCLUDED:
Utilities
•Intel® Core Utilities Bundle4
•Intel® Desktop Utilities
Security
•ESET* Smart Security 4 (one-year license)
•Wave* EMBASSY* Security Center
Manageability
•RealVNC* Viewer Plus (Internet download)
•Spiceworks* IT Desktop
Productivity
•Laplink* PCmover* Professional
Intel® Desktop Board DQ67OW Executive Series
Features and Benefits
Intel® Core™ i5 vPro™, and Intel®
Core™ i3 processors in the LGA1155
package: Features Intel® Turbo
Boost Technology5 and Intel® HyperThreading Technology6 for exceptional
performance and scalability.
2Intel® Q67 Express Chipset
3 Integrated Memory Controller (IMC):
Four connectors designed to support
up to 32 GB2 dual-channel DDR3 1333 /
1066 MHz memory.
4 Fourteen USB 2.0 ports (six back
panel ports and eight additional
ports via internal headers)
5 One PCI Express* 2.0 x16 graphics
connector
6 One PCI Express 2.0 x4 connector
7 One PCI Express 2.0 x1 connector
and one PCI connector
8 Four SATA 3.0 Gb/s ports with
two ports compatible with eSATA
extension
16
10 Eight-channel Intel® High Definition
10
Audio7 with multi-streaming
capability: Features internal S/PDIF
out and front panel audio headers.
4
13
Connection: Uses a new low-power
design to meet improved ENERGY
STAR* 5.0 specifications.
6
7
11
5
12 Trusted Platform Module (TPM)3:
Delivers encryption and signature
keys protection.
13 Dual independent display: DVI-D +
VGA graphics ports.8
14 Legacy connectivity with PS/2
and parallel ports
1
2
15 Floppy header
3
16 Lead-free: Meets all worldwide
regulatory requirements for lead-free
manufacturing.
17 MicroATX Form Factor: MicroATX
8
board supports smaller tower and
system designs.
12
9
15
9 Two SATA 6.0 Gb/s ports with
Intel® Rapid Storage Technology:
RAID 0, 1, 5, and 10.
14
11 Intel® PRO 10/100/1000 Network
9.6” (24.38cm)
1 Support for the Intel® Core™ i7 vPro™,
17
9.6” (24.38cm)
3
Intel® Desktop Board DQ67OW Executive Series
Technical Specifications
For ordering information, visit www.intel.com
For the most current product information, visit www.intel.com/go/idb
or http://ark.intel.com
For specific processor compatibility, visit http://processormatch.intel.com
Processor
Processor Support
•2nd gen Intel® Core™ i7 vPro™, Intel® Core™ i5 vPro™,
and Intel® Core™ i3 processors in the LGA1155 package
•Intel® Turbo Boost Technology5
•Intel® Hyper-Threading Technology6
•Integrated Memory Controller with support for up
to 32 GB2 of system memory using DDR3 1333 /
1066 MHz
•Intel® Fast Memory Access
•Supports Intel® 64 Architecture9
Front-Panel Connectors
•Reset, HD LED, Power LEDs, power on/off
•Four front panel Hi-Speed USB 2.0 headers
•Front panel audio header
Intel® 82579LM ENERGY STAR*-ready
Intel® PRO 10/100/1000 Network Connection
•High quality and reliability with Intel’s world-class
manufacturing and validation
•New low-power design
Expansion Capabilities
•One PCI Express* 2.0 x16 connector
•One PCI Express 2.0 x4 connector
•One PCI Express x1 connector
•One PCI connector
Audio
Chipset
Intel® Q67 Express Chipset
•Intel® 82Q67 Platform Controller Hub (PCH)
•Intel® Active Management Technology1 7.0
•Intel® Rapid Storage Technology (RAID 0, 1, 5, 10)
•Eight-channel Intel® High Definition Audio7 with
multi-streaming
•One front panel audio header
•One internal S/PDIF output header
Integrated Intel® PCH Controllers
•Six Hi-Speed USB 2.0 ports
•Eight additional ports via internal headers
•Two SATA 6.0 Gb/s ports and four SATA 3.0 Gb/s ports
System Memory
Memory Capacity
•Four 240-pin DIMM connectors supporting
up to four double-sided DIMMs
System BIOS
•32 Mb Flash EEPROM with Intel® Platform
Innovation Framework for EFI Plug and Play,
IDE drive auto-configure
•Advanced configuration and power interface
V1.0b, DMI 2.5
•Intel® Express BIOS update support
Memory Types
•DDR3 1333 / 1066 SDRAM memory support
•Non-ECC Memory
Memory Voltage
•Memory voltage control from 1.2 V to 1.8 V
•1.5 V standard JEDEC voltage
Jumpers and Front-Panel Connectors
Jumpers
•Single configuration jumper design
•Jumper access for BIOS maintenance mode
Hardware Management Features
•Processor fan speed control
•System chassis fan speed control
•Voltage and temperature sensing
•Fan sensor inputs used to monitor fan activity
•Power management support for ACPI 1.0b
Intel® Active Management Technology (Intel® AMT) requires
the computer to have an Intel® AMT-enabled chipset, network
hardware and software, connection with a power source, and a
network connection.
System resources and hardware (such as PCI and PCI Express*)
require physical memory address locations that can reduce available addressable system memory. This could result in a reduction
of as much as 1 GB or more of physical addressable memory being
available to the operating system and applications, depending on
the system configuration and operating system.
The original equipment manufacturer must provide TPM functionality, which requires a TPM-supported BIOS. TPM functionality
must be initialized and may not be available in all countries.
3
The Intel® Core Utilities Bundle includes Intel® Integrator Assistant,
Intel® Integrator Toolkit, Intel® Express Installer, and Intel® Express
BIOS Update.
4
Intel® Turbo Boost Technology requires a PC with a processor with
Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software, and
5
Board Size
•9.6” x 9.6” (24.38cm x 24.38cm)
Baseboard Power Requirements
•ATX 12 V
Environment
Operating Temperature
•0° C to +55° C
Storage Temperature
•-20° C to +70° C
Regulations and Safety Standards
United States and Canada
UL 1950, Third edition—CAN/CSA C22.2
No. 950-95 with recognized U.S. and Canadian
component marks
Europe
Nemko certified to EN 60950 International
Nemko certified to IEC 60950
(CB report with CB certificate)
architecture-enabled BIOS. Performance will vary depending on
your hardware and software configurations. See http://developer.
intel.com/technology/intel64/index.htm for more information.
Intel® Hyper-Threading Technology requires a computer system
with a processor supporting HT Technology and an HT Technologyenabled chipset, BIOS, and operating system. Performance will
vary depending on the specific hardware and software you use.
For more information including details on which processors support
HT Technology, see www.intel.com/info/hyperthreading.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION
WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY
RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,
INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO
SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY
OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
6
Intel® High Definition Audio requires a system with an appropriate
Intel® chipset and a motherboard with an appropriate codec and
the necessary drivers installed. System sound quality will vary
depending on actual implementation, controller, codec, drivers,
and speakers. For more information about Intel® HD Audio, refer
to www.intel.com/design/chipsets/hdaudio.htm.
7
Requires the use of a processor with Intel® HD Graphics.
8
64-bit computing on Intel® architecture requires a computer system
with a processor, chipset, BIOS, operating system, device drivers,
and applications enabled for Intel® 64 architecture. Processors
will not operate (including 32-bit operation) without an Intel 64
9
Europe
EMC directive 89/336/EEC; EN 55022:1998
Class B; EN 55024:1998
Australia/New Zealand
AS/NZS 3548, Class B
Taiwan
CNS 13438, Class B International
CISPR 22:1997, Class B
Power requirements vary. Complies with US CRF via
EN55022 +6 db in system configurations with an
open chassis and EU Directive 89/336/EEC and use
via EN55022 and EN50082-1 in a representative
chassis.
Lead-Free: The symbol is used to identify
electrical and electronic assemblies and
components in which the lead (Pb) concentration level in any of the raw materials and the end
product is not greater than 0.1% by weight (1000
ppm). This symbol is also used to indicate conformance to lead-free requirements and definitions
adopted under the European Union’s Restriction on
Hazardous Substances (RoHS) directive, 2002/95/EC.
EMC regulations (tested in representative
chassis)
United States
FCC Part 15, Class B
FCC Part 15, Class B open-chassis (cover off) testing
overall system configuration. Check with your PC manufacturer on
whether your system delivers Intel Turbo Boost Technology. See
www.intel.com/technology/turboboost for more information.
1
2
Mechanical
Board Style
•MicroATX
Canada
ICES-003, Class B
Intel products are not intended for use in medical, life-saving,
or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based
on current expectations, and are subject to change without
notice. Availability in different channels may vary.
Actual Intel® Desktop Board may differ from the image shown.
Intel, the Intel logo, Intel Core, Core Inside, and Intel vPro are
trademarks of Intel Corporation in the U.S. and other countries..
*Other names and brands may be claimed as the property of others.
Copyright © 2010 Intel Corporation. All rights reserved.
1210/TC/MS/PDF 324735-001US
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising