SAA7715AH Digital Signal Processor

SAA7715AH Digital Signal Processor
INTEGRATED CIRCUITS
DATA SHEET
SAA7715AH
Digital Signal Processor
Preliminary specification
2003 Mar 13
Philips Semiconductors
Preliminary specification
Digital Signal Processor
SAA7715AH
CONTENTS
9
I2C-BUS PROTOCOL
Addressing
Slave address (pin A0)
Write cycles
Read cycles
Program RAM
Data word alignment
I2C-bus memory map specification
I2C-bus memory map definition
Table definitions
1
FEATURES
1.1
1.2
Hardware
Possible firmware
2
APPLICATIONS
3
GENERAL DESCRIPTION
4
QUICK REFERENCE DATA
5
ORDERING INFORMATION
9.1
9.2
9.3
9.4
9.5
9.6
9.7
9.8
9.9
6
BLOCK DIAGRAM
10
SOFTWARE IN ROM DESCRIPTION
7
PINNING
11
LIMITING VALUES
8
FUNCTIONAL DESCRIPTION
12
THERMAL CHARACTERISTICS
8.1
PLL clock division factors for different clock
inputs
The word select PLL
The Filter Stream DAC (FSDAC)
Interpolation filter
Noise shaper
Function of pin POM
Power off plop suppression
Pin VREFDA for internal reference
Supply of the analog outputs
External control pins
Digital serial inputs/outputs and SPDIF inputs
Digital serial inputs/outputs
SPDIF inputs
I2C-bus interface (pins SCL and SDA)
Reset
Power-down mode
Power supply connection and EMC
Test mode connections (pins TSCAN, RTCB
and SHTCB)
13
CHARACTERISTICS
14
I2S-BUS TIMING
15
I2C-BUS TIMING
16
APPLICATION DIAGRAM
17
PACKAGE OUTLINE
18
SOLDERING
18.1
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
8.2
8.3
8.3.1
8.3.2
8.3.3
8.3.4
8.3.5
8.3.6
8.4
8.5
8.5.1
8.5.2
8.6
8.7
8.8
8.9
8.10
2003 Mar 13
18.2
18.3
18.4
18.5
2
19
DATA SHEET STATUS
20
DEFINITIONS
21
DISCLAIMERS
22
PURCHASE OF PHILIPS I2C COMPONENTS
Philips Semiconductors
Preliminary specification
Digital Signal Processor
1
1.1
SAA7715AH
FEATURES
Hardware
• 24-bit Philips 70 MIPS DSP core (24-bit data path and
12/24-bit coefficient path)
• 1.5 kbyte of downloadable DSP program memory
(PRAM)
• Incredible surround
• 2 kbyte of DSP program memory (PROM)
• Incredible mono (Imono)
• 2.875 kbyte of re-programmable DSP data memory
(XRAM)
• DPL virtualizer
• 1.5 kbyte of re-programmable DSP coefficient memory
(YRAM)
• Dynamic compressor
• Dolby digital virtualizer (DVD post-processing)
• Spectral enhancer
• Four stereo digital serial inputs (8 channels) with
common BCK and WS. To these inputs the I2S-bus
format or LSB-justified formats can be applied
• Equalizer with peaking/shelving filters
• DC filters
• One stereo bitstream DAC (2 channels) with 64 fold
oversampling and noise shaping
• Bass/treble control
• Selectable clock output (pin SYSCLK) for external slave
devices (128fs to 512fs)
• Tone/noise generator
• Dynamic loudness
• Graphical spectrum analyser
• Four stereo digital serial outputs (8 channels) with
selectable I2S-bus or LSB-justified format
• Configurable Delay Unit (DLU)
• Sound steering/elevation for car applications
• Two SPDIF inputs combined with digital serial input
• Sample Rate Conversion (SRC).
• On-board WS_PLL generates clock for on-board DAC
and output pin SYSCLK
• I2C-bus controlled (including fast mode)
2
• Programmable Phase-Locked Loop (PLL) derives the
clock for the DSP from the CLK_IN input
• As co-processor for a car radio DSP in a car radio
application for additional acoustic enhancements
(sound steering/sound elevation/signal processing)
• −40 to +85 °C operating temperature range
APPLICATIONS
• Power-down mode for low current consumption in
standby mode
• Multichannel audio: in DVD and Home theatre
applications as post-processing device such as signal
virtualization (virtual 3D surround) and acoustic
enhancement, tone control, volume control and
equalizers
• Optimized pinning for applications with other Philips
DACs (such as UDA1334, UDA1355 and UDA1328).
• Multichannel decoding: Dolby Pro Logic and virtual
3D surround
1.2
• PC/USB audio applications: stereo widening (Incredible
surround), sound steering, sound positioning and
speaker equalization.
• Supply voltage only 3.3 V
• All digital inputs are tolerant for 5 V input levels
Possible firmware
• Dolby®(1) Pro Logic decoding
• Smoothed volume control (without zipper noise)
• Automatic Volume Levelling (AVL)
• Dynamic bass enhancement
• Ultra bass
(1) Dolby — Available only to licensees of Dolby Laboratories
Licensing Corporation, San Francisco, CA94111, USA, from
whom licensing and application information must be obtained.
Dolby is a registered trade-mark of Dolby Laboratories
Licensing Corporation.
2003 Mar 13
3
Philips Semiconductors
Preliminary specification
Digital Signal Processor
3
SAA7715AH
GENERAL DESCRIPTION
The SAA7715AH can be configured for various audio
applications by downloading the dedicated DSP program
code into the DSP program RAM or using the ROM or a
combination of both. During the Power-down mode the
contents of the memories and all other settings will keep
their values. The SAA7715AH can be initialized using the
I2C-bus interface.
The SAA7715AH is a cost effective and powerful high
performance 24-bit programmable DSP for a variety of
digital audio applications. This DSP device integrates a
24-bit DSP core with programmable memories (program
RAM/ROM, data and coefficient RAM), 4 digital serial
inputs, 4 digital serial outputs, 2 separate SPDIF
receivers, a stereo FSDAC, a standard Philips I2C-bus
interface, a phase-locked loop for the DSP clock
generation and a second phase-locked loop for system
clock generation (internal and external DAC clocks).
4
Several system application examples, based on this
existing SAA7715AH, are available for a wide range of
audio applications (e.g car radio DSP,
DVD post-processing, Dolby Pro Logic, PC/USB audio
and more) which can be used as a reference design for
customers.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
VDD
operating supply voltage
all pins VDD with respect to 3.15
pins VSS
IDDD
supply current of the digital
part
high activity of the DSP at
DSPFREQ frequency
IDDA
supply current of the analog
part
Ptot
total power dissipation
IPOWERDOWN
TYP.
MAX.
UNIT
3.3
3.45
V
−
95
−
mA
zero input and output
signal
−
20
−
mA
high activity of the DSP at
DSPFREQ frequency
−
380
−
mW
DC supply current of the total pin POWERDOWN
chip in Power-down mode
enabled
−
400
−
µA
fs
sample frequency
at IIS_WS1, SPDIF1 or
SPDIF2 input
32
44.1
96
kHz
(THD + N)/SDAC
total harmonic
distortion-plus-noise to
signal ratio of DAC
at 0 dB
−
−85
−
dB(A)
at −60 dB
−
−37
−
dB(A)
S/NDAC
signal-to-noise ratio of DAC
code = 0
−
100
−
dB(A)
fCLK_IN
clock input frequency
DIV_CLK_IN = LOW
8.192
11.2896 12.288
DIV_CLK_IN = HIGH
16.384
−
24.576
MHz
DSPFREQ
maximum DSP clock
frequency
−
−
70
MHz
5
MHz
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
SAA7715AH
2003 Mar 13
NAME
DESCRIPTION
VERSION
QFP44
plastic quad flat package; 44 leads (lead length 1.3 mm);
body 10 × 10 × 1.75 mm
SOT307-2
4
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IIS_IN1
IIS_IN4
8
35
17
23
16
37
15
21
VSSI2
VSSI1
VSSE
VSSA2
VSSA1
VDDI1
VDDE
VDDA2
VDDA1
RESERVED3
RESERVED2
RESERVED1
SPDIF1
SPDIF2
IIS_WS1
7
4
10
14
31
1
30
2
XRAM
3
YRAM
29
28
5
33
SAA7715AH
IIS_IN2
32
IIS_OUT1
IIS_OUT2
Digital Signal Processor
IIS_BCK1
25
BLOCK DIAGRAM
24
Philips Semiconductors
6
2003 Mar 13
handbook, full pagewidth
IIS_OUT3
IIS_OUT4
IIS_BCK
IIS_WS
DSP CORE
6
5
34
36
STEREO
DAC
I2C-BUS
TCB
26
12
POM
VREFDA
WS_PLL
11
27
18
MHC320
Preliminary specification
Fig.1 Block diagram.
13
38
VOUTR
SAA7715AH
TSCAN
19
RTCB
20
SHTCB
40
POWERDOWN
42
DSP_INOUT5
43
DSP_INOUT6
44
DSP_INOUT7
41
DIV_CLK_IN
22
n × fs
CLOCK
SYSCLK
PLL
PROM
A0
PRAM
DSP CLOCK
SCL
S
SDA
÷2
39
DSP_RESET
9
CLK_IN
IIS_IN3
VOUTL
Philips Semiconductors
Preliminary specification
Digital Signal Processor
7
SAA7715AH
PINNING
SYMBOL
PIN
PIN TYPE
DESCRIPTION
IIS_BCK1
1
ipthdt5v
bit clock signal belonging to data of digital serial inputs 1 to 4
IIS_WS1
2
ipthdt5v
word select signal belonging to data of digital serial inputs 1 to 4
IIS_IN1
3
ipthdt5v
data pin of digital serial input 1
RESERVED1
4
ipthdt5v
not to be connected externally
IIS_IN4
5
ipthdt5v
data pin of digital serial input 4
IIS_IN2
6
ipthdt5v
data pin of digital serial input 2
RESERVED2
7
ipthdt5v
not to be connected externally
RESERVED3
8
ipthdt5v
not to be connected externally
IIS_IN3
9
ipthdt5v
data pin of digital serial input 3
VSSI2
10
vssi
ground supply (core only) (bond out to 2 pads)
A0
11
ipthdt5v
slave sub-address I2C-bus selection/serial data input test control block
SCL
12
iptht5v
clock input of I2C-bus
SDA
13
iic400kt5v
data input/output of I2C-bus
VSSI1
14
vssis
ground supply (core only)
VSSA2
15
vssco
ground supply analog of PLL, WS_PLL, SPDIF input stage
VDDI1
16
vddi
positive supply (core only) (bond out to 2 pads)
VDDA2
17
vddco
positive supply analog of PLL, WS_PLL, SPDIF input stage
DSP_RESET
18
ipthut5v
general reset of chip (active LOW)
RTCB
19
ipthdt5v
asynchronous reset test control block, connect to ground (internal pull down)
SHTCB
20
ipthdt5v
shift clock test control block (internal pull down)
VSSE
21
vsse
ground supply (peripheral cells only)
CLK_IN
22
iptht5v
system clock input
VDDE
23
vdde
positive supply (peripheral cells only)
SPDIF2
24
apio
SPDIF2 data input (internally multiplexed with digital serial input 3)
SPDIF1
25
apio
SPDIF1 data input (internally multiplexed with digital serial input 2)
TSCAN
26
ipthdt5v
scan control active HIGH (internal pull down)
SYSCLK
27
bpt4mthdt5v
n × fs output of SAA7715AH
IIS_OUT4
28
ops5c
data pin of digital serial output 4
IIS_OUT3
29
ops5c
data pin of digital serial output 3
IIS_OUT2
30
ops5c
data pin of digital serial output 2
IIS_OUT1
31
ops5c
data pin of digital serial output 1
IIS_WS
32
ops5c
word select output belonging to digital serial output 1 to 4
IIS_BCK
33
ops5c
bit clock output belonging to digital serial output 1 to 4
VOUTL
34
apio
analog left output pin.
VDDA1
35
vddo
FSDAC positive supply voltage (bond out to 2 pads)
VOUTR
36
apio
analog right output pin
VSSA1
37
vsso
FSDAC ground supply voltage (bond out to 2 pads)
VREFDA
38
apio
voltage reference pin of FSDAC
POM
39
apio
power-on mute pin of FSDAC
POWERDOWN
40
iptht5v
standby mode of chip
2003 Mar 13
6
Philips Semiconductors
Preliminary specification
Digital Signal Processor
SAA7715AH
SYMBOL
PIN
DIV_CLK_IN
41
ipthdt5v
divide the input frequency on pin CLK_IN by two
DSP_INOUT5
42
bpts5thdt5v
digital input/output flag of the DSP-core (F5 of the status register)
DSP_INOUT6
43
bpts5thdt5v
digital input/output flag of the DSP-core (F6 of the status register)
DSP_INOUT7
44
bpts5thdt5v
digital input/output flag of the DSP-core (F7 of the status register)
Table 1
PIN TYPE
DESCRIPTION
Brief explanation of used pin types
PIN TYPE
EXPLANATION
apio
analog I/O pad cell; actually pin type vddco
bpts5thdt5v
43 MHz bidirectional pad; push-pull input; 3-state output; 5 ns slew rate control; TTL; hysteresis;
pull-down; 5 V tolerant
bpts5tht5v
43 MHz bidirectional pad; push-pull input; 3-state output; 5 ns slew rate control; TTL; hysteresis; 5 V
tolerant
bpt4mthdt5v
bidirectional pad; push-pull input; 3-state output; 4 mA output drive; TTL; hysteresis; pull-down; 5 V
tolerant
iic400kt5v
I2C-bus pad; 400 kHz I2C-bus specification; 5 V tolerant
ipthdt5v
input pad buffer; TTL; hysteresis; pull-down; 5 V tolerant
iptht5v
input pad buffer; TTL; hysteresis; 5 V tolerant
ipthut5v
input pad buffer; TTL; hysteresis; pull-up; 5 V tolerant
ops5c
output pad; push-pull; 5 ns slew rate control; CMOS
op4mc
output pad; push-pull; 4 mA output drive
vddco
VDD supply to core only
vdde
VDD supply to peripheral only
vddi
VDD supply to core only
vddo
VDD supply to core only
vssco
VSS supply to core only (vssco does not connect the substrate)
vsse
VSS supply to peripheral only
vssi
VSS supply to core and peripheral
vssis
VSS supply to core only; with substrate connection
vsso
VSS supply to core only
2003 Mar 13
7
Philips Semiconductors
Preliminary specification
34 VOUTL
35 VDDA1
36 VOUTR
37 VSSA1
38 VREFDA
39 POM
40 POWERDOWN
41 DIV_CLK_IN
42 DSP_INOUT5
44 DSP_INOUT7
handbook, full pagewidth
SAA7715AH
43 DSP_INOUT6
Digital Signal Processor
IIS_BCK1 1
33 IIS_BCK
IIS_WS1 2
32 IIS_WS
IIS_IN1 3
31 IIS_OUT1
RESERVED1 4
30 IIS_OUT2
IIS_IN4 5
29 IIS_OUT3
IIS_IN2 6
28 IIS_OUT4
SAA7715AH
RESERVED2 7
27 SYSCLK
RESERVED3 8
26 TSCAN
IIS_IN3 9
25 SPDIF1
VSSI2 10
24 SPDIF2
23 VDDE
Fig.2 Pin configuration.
2003 Mar 13
8
CLK_IN 22
VSSE 21
SHTCB 20
RTCB 19
DSP_RESET 18
VDDA2 17
VDDI1 16
VSSA2 15
SDA 13
VSSI1 14
SCL 12
A0 11
MHC319
Philips Semiconductors
Preliminary specification
Digital Signal Processor
8
8.1
SAA7715AH
FUNCTIONAL DESCRIPTION
PLL clock division factors for different clock inputs
An on-chip PLL generates the clock for the DSP. The DSP runs at a selectable frequency of maximum 70 MHz. The clock
is generated with the PLL that uses the CLK_IN of the chip to generate the DSP clock. Table 2 gives the PLL clock
division factor and the values of the dsp_turbo and the DIV_CLK_IN bits that need to be set via the I2C-bus (see
Table 10).
Table 2
PLL clock division factor per clock input.
pll_div[4:0]
N
dsp_turbo
DIV_CLK_IN
DSP CLOCK
(MHz)
8.192 (32 kHz × 256)
10H
272
1
0
69.632
9.728 (38 kHz × 256)
09H
227
1
0
69.008
11.2896 (44.1 kHz × 256)
03H
198
1
0
69.854
12.288 (48 kHz × 256)
00H
181
1
0
69.504
16.384 (32 kHz × 512)
10H
272
1
1
69.632
18.432 (32 kHz × 576)
0BH
244
1
1
68.544
19.456 (38 kHz × 512)
09H
227
1
1
69.008
24.576 (96 kHz × 256)
00H
181
1
1
69.504
CLK_IN (MHz)
The above table does NOT imply that the clock input is restricted to the values given in this table. The clock input is
restricted to be within the range of 8.192 to 12.228 MHz. For higher clock frequencies pin DIV_CLK_IN should be set to
logic 1 performing a divide-by-2 of the CLK_IN signal and thereby doubling the CLK_IN frequency range that is allowed
(16.384 to 24.576 MHz).
8.2
The word select PLL
A second on-chip PLL generates a selectable multiple of the sample rate frequency supplied on the word select
pin IIS_WS (= IIS_WS1). The clock generated by this so called WS_PLL is available for the user at pin SYSCLK.
Tables 3 and 4 show the I2C-bus settings needed to generate the n × fs clock. The memory map of the I2C-bus bits is
shown in Table 10.
Table 3
Table 4
Word select input range selection
SAMPLE RATE OF fs (kHz)
sel_loop_div[1:0]
32 to 50
01
50 to 96
00
Selection of n × fs clock at SYSCLK output
sel2
sel1
sel0
SYSCLK (n × IIS_WS1)
DUTY FACTOR
1
0
0
512
50% for 32 to 50 kHz input;
66% for 50 to 96 kHz input
0
1
1
384
50%
0
1
0
256
50%
0
0
1
192
50%
0
0
0
128
50%
2003 Mar 13
9
Philips Semiconductors
Preliminary specification
Digital Signal Processor
8.3
SAA7715AH
The Filter Stream DAC (FSDAC)
8.3.4
POWER OFF PLOP SUPPRESSION
The FSDAC is a semi-digital reconstruction filter that
converts the 1-bit data stream of the noise shaper to an
analog output voltage. The filter coefficients are
implemented as current sources and are summed at
virtual ground of the output operational amplifier. In this
way very high signal-to-noise performance and low clock
jitter sensitivity is achieved. A post-filter is not needed due
to the inherent filter function of the DAC. On-board
amplifiers convert the FSDAC output current to an output
voltage signal capable of driving a line output.
To avoid plops in a power amplifier, the supply voltage of
the analog part of the DAC and the rest of the chip can be
fed from a separate supply of 3.3 V. A capacitor connected
to this supply enables to provide power to the analog part
at the moment the digital voltage is switching off fast.
In this event the output voltage will decrease gradually
allowing the power amplifier some extra time to switch off
without audible plops.
The output voltage of the FSDAC scales proportionally
with the power supply voltage.
With two internal resistors half the supply voltage VDDA1 is
obtained and used as an internal reference. This reference
voltage is used as DC voltage for the output operational
amplifiers and as reference for the DAC. In order to obtain
the lowest noise and to have the best ripple rejection, a
filter capacitor has to be added between this pin and
ground, preferably close to the analog pin VSSA1.
8.3.1
8.3.5
INTERPOLATION FILTER
The digital filter interpolates from 1 to 64fs by means of a
cascade of a recursive filter and an FIR filter.
Table 5
Digital interpolation filter characteristics
ITEM
CONDITIONS
VALUE (dB)
Pass band ripple
0 to 0.45fs
±0.03
Stop band
Dynamic range
Gain
8.3.2
>0.55fs
−50
0 to 0.45fs
116.5
DC
−3.5
8.3.6
NOISE SHAPER
8.4
External control pins
The flags DSP_INOUT5 to DSP_INOUT7 are available as
external pins. The flags can be used by the DSP
depending on the downloaded software.
FUNCTION OF PIN POM
With pin POM it is possible to switch off the reference
current of the DAC. The capacitor on pin POM determines
the time after which this current has a soft switch-on. So at
power-on the current audio signal outputs are always
muted. The loading of the external capacitor is done in two
stages via two different current sources. The loading starts
at a current level that is lower than the current loading after
the voltage on pin POM has passed a particular level. This
results in an almost dB-linear behaviour. This prevents
‘plop’ effects during power on/off.
2003 Mar 13
SUPPLY OF THE ANALOG OUTPUTS
The entire analog circuitry of the DACs and the OPAMPS
are supplied by 2 supply pins, VDDA1 and VSSA1. The
VDDA1 must have sufficient decoupling to prevent THD
degradation and to ensure a good Power Supply Rejection
Ratio (PSRR). The digital part of the DAC is fully supplied
from the chip core supply.
The 5th-order noise shaper operates at 64fs. It shifts
in-band quantization noise to frequencies well above the
audio band. This noise shaping technique enables high
signal-to-noise ratios to be achieved. The noise shaper
output is converted into an analog signal using a filter
stream digital-to-analog converter.
8.3.3
PIN VREFDA FOR INTERNAL REFERENCE
10
Philips Semiconductors
Preliminary specification
Digital Signal Processor
8.5
8.5.1
SAA7715AH
8.5.2
Digital serial inputs/outputs and SPDIF inputs
DIGITAL SERIAL INPUTS/OUTPUTS
Two separate SPDIF receivers are available, one shared
with digital serial input 2 (SPDIF1) and one with the digital
serial input 3 (SPDIF2). The sample frequency at which
the SPDIF inputs can be used must be in the range of
32 to 96 kHz.
For communication with external digital sources a digital
serial bus is implemented. It is a serial 3-line bus, having
one line for data, one line for clock and one line for the
word select. For external digital sources the SAA7715AH
acts as a slave, so the external source is master and
supplies the clock.
There are few control signals available from the SPDIF
input stage. These are connected to flags of the DSP:
• A lock signal indicating if the SPDIF input 1 or 2 is in
lock
For the I2S-bus format itself see the official specification
from Philips.
• The pcm_audio/non-pcm_audio bit indicating if an audio
or data stream is detected on SPDIF input 1 or 2. The
FSDAC output will NOT be muted in the event of
non-audio PCM stream. This status bit can be read via
the I2C-bus, the microprocessor controller can decide to
put the DAC into MUTE (via pin POM).
The digital serial input is capable of handling Philips
I2S-bus and LSB-justified formats of 16, 18, 20 and 24 bits
word sizes. The sampling frequency can be 32 up to
96 kHz. See “9.8 I2C-bus memory map definition” for the
bits that must be programmed, for selection of the desired
serial format.
Handling of channel status bits: The first 40 (of 192)
channel status bits of the selected SPDIF source (0FFBH,
bit 20), will come available in the I2C-bus registers
0FF2H to 0FF5H. Two registers 0FF2H to 0FF3H contain
the information for the right channel, the other two
(0FF4H to 0FF5H) contain the information for the left
channel. The information can be read via I2C-bus or by the
DSP program.
See Fig.3 for the general waveforms of the possible
formats.
When the applied word length exceeds 24 bits, the LSBs
are skipped.
The digital serial input/output circuitry is limited in handling
the number of BCK pulses per WS period. The maximum
allowed number of bit clocks per WS period is 256. Also
the number of bit clocks during WS LOW and HIGH must
be equal (50% WS duty factor) only for the LSB-justified
formats.
The design fulfils the digital audio interface specification
“IEC 60958-1 Ed2, part 1, general part IEC 60958-3 Ed2,
part 3, consumer applications”.
There are two modes in which the digital inputs can be
used (the mode is selectable via an I2C-bus bit):
• Use up to 4 digital serial inputs (8ch) with common WS
and BCK signal (8ch IN and 8ch OUT + 2ch FSDAC
output)
• Use one of the 2 SPDIF inputs as source instead of the
use of the digital serial inputs (2ch IN and
8ch OUT + One 2ch FSDAC output).
2003 Mar 13
SPDIF INPUTS
11
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>=8
3
2
3
MSB
B2
1
DATA
MSB
B2
>=8
MSB
INPUT FORMAT I2S-BUS
WS
LEFT
RIGHT
16
15
1
16
B15 LSB
MSB
2
15
2
1
BCK
DATA
MSB
B2
B2
Philips Semiconductors
2
Digital Signal Processor
1
BCK
handbook, full pagewidth
2003 Mar 13
RIGHT
LEFT
WS
B15 LSB
LSB-JUSTIFIED FORMAT 16 BITS
WS
LEFT
RIGHT
18
17
16
15
1
18
B17 LSB
MSB
2
17
16
15
2
1
BCK
12
DATA
MSB
B2
B3
B4
B2
B3
B4
B17 LSB
LSB-JUSTIFIED FORMAT 18 BITS
WS
LEFT
20
RIGHT
19
18
16
17
15
1
20
B19 LSB
MSB
2
19
18
17
16
15
2
1
BCK
DATA
MSB
B2
B3
B4
B5
B6
B2
B3
B4
B5
B6
B19 LSB
LSB-JUSTIFIED FORMAT 20 BITS
WS
LEFT
22
21
20
RIGHT
19
18
17
16
15
2
1
24
B23 LSB
MSB
23
22
21
20
19
18
17
16
15
2
1
BCK
DATA
MSB
B2
B3
B4
B5
B6
B7
B8
B9
B10
B2
B3
B4
B5
B6
B7
B8
B9
B10
B23 LSB
MGR751
LSB-JUSTIFIED FORMAT 24 BITS
Fig.3 All serial data input/output formats.
Preliminary specification
23
SAA7715AH
24
Philips Semiconductors
Preliminary specification
Digital Signal Processor
8.6
SAA7715AH
The reset sets all I2C-bus bits to their default value and it
restarts the DSP program.
I2C-bus interface (pins SCL and SDA)
The I2C-bus format is described in “The I2C-bus and how
to use it”, order no. 9398 393 40011.
8.8
I2C-bus
For the external control of the SAA7715AH a fast
is implemented. This is a 400 kHz bus which is downward
compatible with the standard 100 kHz bus.
The Power-down mode switches off all activity on the chip.
The Power-down mode can be switched on and off using
pin POWERDOWN. This pin needs to be connected to
ground if not used. The following applies for the
Power-down mode:
There are two different types of control instructions:
• Loading of the Program RAM (PRAM) with the required
DSP program
• Power-down mode may only be switched on when there
is no I2C-bus activity to or from the SAA7715AH
– Programming the coefficient RAM (YRAM)
• Power-down mode may not be switched on before the
complete chip has been reset (DSP_RESET
active LOW)
– Instructions to control the DSP program.
• Selection of the digital serial input/output format to be
used, the DSP clock speed.
• The clock signal on pin CLK_IN should be running
during Power-down mode
The detailed description of the I2C-bus and the description
of the different bits in the memory map is given in
Chapter 9.
8.7
Power-down mode
• It is advised to set pin POM to logic 0 before switching
on the Power-down mode and set it back to logic 1 after
the chip actually returns from Power-down mode as
shown in Fig.4
Reset
• All on-chip registers and memories will keep their values
during Power-down mode
The reset (pin DSP_RESET) is active LOW and needs an
external 22 kΩ pull-up resistor. Between this pin and the
VSSI ground a capacitor of 1 µF should be connected to
allow a proper switch-on of the supply voltage. The
capacitor value is such that the chip is in reset as long as
the power supply is not stabilized. A more or less fixed
relationship between the DSP reset and the POM time
constant is obligatory. The voltage on pin POM determines
the current flowing in the DACs.
• Digital serial outputs are not muted, the last value is kept
on the output
• The SAA7715AH will not ‘lock-up’ the I2C-bus during
Power-down mode (SDA line).
Figure 4 shows the time the chip actually is in Power-down
mode after switching on/off pin POWERDOWN.
handbook, full pagewidth
CLK_IN
POWERDOWN
device actually in
Power-down mode
tA
tB
POM
MGT828
tA = 4 × (256/CLK_IN); 8.192 MHz < CLK_IN < 12.288 MHz.
tA = 4 × (512/CLK_IN); 16.384 MHz < CLK_IN < 24.576 MHz.
tB = 128 × (256/CLK_IN); 8.192 MHz < CLK_IN < 12.288 MHz.
tB = 128 × (512/CLK_IN); 16.384 MHz < CLK_IN < 24.576 MHz.
Fig.4 Power-down mode.
2003 Mar 13
13
Philips Semiconductors
Preliminary specification
Digital Signal Processor
8.9
SAA7715AH
9.3
Power supply connection and EMC
The
configuration for a write cycle is shown
in Fig.5. The write cycle is used to write the bytes to the
DSP for manipulating the data and coefficients. More
details can be found in the I2C-bus memory map, see
Table 8.
The digital part of the chip has in total 4 positive supply line
connections and 5 ground connections. To minimize
radiation the chip should be put on a double layer
printed-circuit board with on one side a large ground plane.
The ground supply lines should have a short connection to
this ground plane. A coil/capacitor network in the positive
supply line of the peripheral power supply line can be used
as high frequency filter. The core supply lines (VDDI) have
an on-chip decoupling capacitance, for EMC reasons an
external decoupling capacitance must not be used on this
pin. A series resistor plus capacitance is required for
proper operation on pin VDDA2, see Fig.9.
8.10
The data length is 2, 3 or 4 bytes depending on the
accessed memory. If the Y-memory is addressed the data
length is 2 bytes, in the event of the X-memory the length
is 3 bytes. The slave receiver detects the address and
adjusts the number of bytes accordingly.
For this RAM-based product the internal P-memory
(PRAM) can be accessed via the I2C-bus interface. The
transmitted data stream should be 4 bytes.
Test mode connections (pins TSCAN, RTCB
and SHTCB)
9.4
Pins TSCAN, RTCB and SHTCB are used to put the chip
in test mode and to test the internal connections. Each pin
has an internal pull-down resistor to ground. In the
application these pins can be left open or connected to
ground.
9.1
Addressing
Before any data is transmitted on the I2C-bus, the device
that should respond is addressed first. The addressing is
always done with the first byte transmitted after the start
procedure.
9.2
The master generates a repeated START (Sr) and again
the SAA7715AH address ‘0011110’ but this time followed
by a logic 1 (read) of the read/write bit. From this moment
on the SAA7715AH will send the memory content in
groups of 3 (X/Y-memory or registers) or 4 (P-memory)
bytes to the I2C-bus each time acknowledged by the
master. The master stops this cycle by generating a
negative acknowledge, then the SAA7715AH frees the
I2C-bus and the master can generate a STOP condition.
Slave address (pin A0)
The SAA7715AH acts as a slave receiver or a slave
transmitter. Therefore the clock signal SCL is only an input
signal. The data signal SDA is a bidirectional line. The
slave address is shown in Table 6.
Table 6
0
The data is transferred from the DSP register to the
I2C-bus register at execution of the MPI instruction in the
DSP program. Therefore at least once every DSP routine
an MPI instruction should be added.
Slave address
MSB
LSB
0
1
1
1
1
A0
R/W
The sub-address bit A0 corresponds to the hardware
address pin A0 which allows the device to have 2 different
addresses. The A0 input is also used in test mode as serial
input of the test control block.
2003 Mar 13
Read cycles
The I2C-bus configuration for a read cycle is shown
in Fig.6. The read cycle is used to read the data values
from XRAM, YRAM or PRAM. The master starts with a
START condition S, the SAA7715AH address ‘0011110’
and a logic 0 (write) for the read/write bit. This is followed
by an acknowledge of the SAA7715AH. Then the master
writes the high memory address (ADDR H) and low
memory address (ADDR L) where the reading of the
memory content of the SAA7715AH must start. The
SAA7715AH acknowledges these addresses both.
I2C-BUS PROTOCOL
9
Write cycles
I2C-bus
14
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K
A
C
K
ADDR L
A
C
K
A
C
K
DATA 1
DATA ...
A
C
K
DATA 4
A
C P
K
auto increment if repeated n-groups of 2, 3 or 4 bytes
address
MGU331
R/W
S = START condition.
P = STOP condition.
ACK = acknowledge from SAA7715AH.
ADDR H and ADDR L = address DSP register.
DATA 1 to DATA 4 = 2, 3 or 4 bytes data word.
Philips Semiconductors
ADDR H
Digital Signal Processor
2003 Mar 13
A
S 0 0 1 1 1 1 0 0 C
Fig.5 Master transmitter writes to the SAA7715AH registers.
15
A
S 0 0 1 1 1 1 0 0 C
ADDR H
K
A
C
K
ADDR L
A
A
S 0 0 1 1 1 1 0 1 C
C
r
K
K
DATA 1
A
C
K
DATA ...
A
C
K
DATA 4
A
N
C R
A P
K
auto increment if repeated n-groups of 2, 3 or 4 bytes
address
R/W
R/W
Preliminary specification
Fig.6 Master transmitter reads from the SAA7715AH registers.
SAA7715AH
S = START condition.
Sr = repeated START condition.
P = STOP condition.
ACK = acknowledge from SAA7715AH (SDA LOW).
R = repeat n-times the 2, 3 or 4 bytes data group.
NA = Negative Acknowledge master (SDA HIGH).
ADDR H and ADDR L = address DSP register.
DATA 1 to DATA 4 = 2, 3 or 4 bytes data word.
MGU330
Philips Semiconductors
Preliminary specification
Digital Signal Processor
9.5
SAA7715AH
The DSP has an instruction word width of 32 bits which
means that this space should be accessed with 4 bytes in
consecutive order and does have the auto-increment
function.
Program RAM
The SAA7715AH has a 1.5 kbyte PRAM to store the DSP
instruction code into. Also a 2 kbyte PROM is on-chip
available and can be accessed (memory mapped) without
the need of selecting the PROM or PRAM. The DSP
instruction code can be downloaded into the PRAM via the
I2C-bus. The write and read cycle are shown in Figs 5
and 6 respectively.
Table 7
9.6
Data word alignment
It is possible to transfer data via the I2C-bus to a
destination where it can have different data word length.
Those destinations with data word are shown in Table 7.
Data word alignment
SOURCE
DESTINATION
DATA WORD
BYTES
(NUMBER)
I2C-bus
DSP-PRAM
I2C-bus
DSP and general control
MBBB BBBB BBBB BBBB BBBB BBBL
3
I2C-bus
I2C-bus registers
MBBB BBBB BBBB BBBB BBBB BBBL
3
I2C-bus
DSP-XRAM
MBBB BBBB BBBB BBBB BBBB BBBL
3
I2C-bus
DSP-YRAM
XXXX MBBB BBBB BBBL
2
2003 Mar 13
MBBB BBBB BBBB BBBB BBBB BBBB BBBB BBBL
16
4
Philips Semiconductors
Preliminary specification
Digital Signal Processor
9.7
SAA7715AH
I2C-bus memory map specification
The I2C-bus memory map contains all defined I2C-bus bits. The map is split up in two different sections: the hardware
memory registers and the RAM definitions. In Table 8 the preliminary memory map is depicted. The hardware registers
are memory map on the XRAM of DSP. Table 9 shows the detailed memory map of those locations. All locations are
acknowledged by the SAA7715AH even if the user tries to write to a reserved space. The data in these sections will be
lost. Reading from these locations will result in undefined data words.
Table 8
I2C-bus memory map
ADDRESS
FUNCTION
SIZE
I2C-bus)
2k × 32 bits
8000H to 87FFH
DSP to PROM (not readable via
602FH
DSP and general control
1 × 24 bits
2000H to 25FFH
DSP to PRAM
1.5k × 32 bits
1000H to 15FFH
DSP to YRAM
1.5k × 12 bits
0FF2H to 0FF5H, 0FFBH
I2C-bus
5 × 24 bits
0000H to 0B7FH
DSP to XRAM
Table 9
register
2.875k × 24 bits
I2C-bus memory map overview
ADDRESS
DESCRIPTION
Hardware registers
0FFBH
Selector register 1
0FF5H
SPDIF IN channel status register 1 left
0FF4H
SPDIF IN channel status register 2 left
0FF3H
SPDIF IN channel status register 1 right
0FF2H
SPDIF IN channel status register 2 right
DSP control
602FH
2003 Mar 13
DSP and general control register
17
Philips Semiconductors
Preliminary specification
Digital Signal Processor
9.8
SAA7715AH
I2C-bus memory map definition
Table 10 DSP and general control register (602FH)
NAME
SIZE
(BITS)
DESCRIPTION
DEFAULT
BIT
POSITION
1
reserved
0
0
pll_div[4:0]
5
PLL clock division factor according to Table 2
00011
5 to 1
dsp_turbo
1
PLL output frequency
1
6
1: double
0: no doubling
pc_reset_dsp
1
reserved
1
7
1
program counter reset DSP
0
8
1: reset on
0: reset off
2
reserved
00
10 to 9
sel[2:0]
3
selection of n × fs clock at SYSCLK output according to
Table 4
010
13 to 11
sel_loop_div[1:0]
2
word select input range selection for WS_PLL according
to Table 3
01
15 to 14
2
reserved
00
17 to 16
2
clock source for FSDAC
00
19 to 18
0
20
0
21
00
23 to 22
sel_FSDAC_clk
00: WS_PLL if no signal to pin CLK_IN
01: 512fs to pin CLK_IN
11: 256fs to pin CLK_IN
dis_SYSCLK
1
output on pin SYSCLK
1: disable
0: enable
256fs_n*Fs
1
signal on pin SYSCLK
1: fixed 256fs clock
0: n × fs clock; determined by bits 13 to 11
2
reserved
Table 11 SPDIF IN channel status register 2 right (0FF2H)
NAME
ch_stat_in right lsb
SIZE
(BITS)
20
DESCRIPTION
channel status SPDIF in right LSB bits 19 to 0
DEFAULT
00000H
BIT
POSITION
19 to 0
Table 12 SPDIF IN channel status register 1 right (0FF3H)
NAME
SIZE
(BITS)
ch_stat_in right msb
20
2003 Mar 13
DESCRIPTION
channel status SPDIF in right MSB bits 39 to 20
18
DEFAULT
00000H
BIT
POSITION
19 to 0
Philips Semiconductors
Preliminary specification
Digital Signal Processor
SAA7715AH
Table 13 SPDIF IN channel status register 2 left (0FF4H)
NAME
ch_stat_in left lsb
SIZE
(BITS)
20
DESCRIPTION
channel status SPDIF in2 left LSB bits 19 to 0
DEFAULT
00000H
BIT
POSITION
19 to 0
Table 14 SPDIF IN channel status register 1 left (0FF5H)
NAME
ch_stat_in left msb
SIZE
(BITS)
20
DESCRIPTION
channel status SPDIF in2 left MSB bits 39 to 20
DEFAULT
00000H
BIT
POSITION
19 to 0
Table 15 Selector register 1 (0FFBH)
NAME
SIZE
(BITS)
DESCRIPTION
DEFAULT
BIT
POSITION
format_in1
3
digital serial inputs 1 and 4 data format according to
Table 17
011
2 to 0
format_in2
3
digital serial input 2 data format according to Table 17
011
5 to 3
format_in3
3
digital serial input 3 data format according to Table 17
011
8 to 6
format_out
3
digital serial outputs 1 to 4 data format according to
Table 18
000
11 to 9
en_output
1
enable or disable digital serial outputs
1
12
1: enable
0: disable
master_source
1
reserved
0
13
4
source selection
0000
17 to 14
0
18
0
19
0
20
000
23 to 21
0000: digital serial input 1
0101: digital serial input 2 or SPDIF 1 (see bit 18)
1010: digital serial input 3 or SPDIF 2 (see bit 19)
all other values are reserved
spdif_sel1
1
SPDIF1 or digital serial input 2
1: SPDIF1
0: digital serial input 2
spdif_sel2
1
SPDIF2 or digital serial input 3
1: SPDIF2
0: digital serial input 3
sel_spdifin_chstat
1
select channel status information taken from SPDIF1 or
SPDIF2
1: from input SPDIF2
0: from input SPDIF1
3
2003 Mar 13
reserved
19
Philips Semiconductors
Preliminary specification
Digital Signal Processor
SAA7715AH
Table 16 Default settings of I2C-bus registers after power-up and reset
I2C-BUS ADDRESS
9.9
DEFAULT VALUE
602FH
0050C6H
0FFBH
0010DBH
0FF5H
000000H
0FF4H
000000H
0FF3H
000000H
0FF2H
000000H
Table definitions
Table 17 Digital serial format for inputs 1 to 4
format_in1, 2 and 3
INPUT
BIT 2
BIT 1
BIT 0
0
1
1
standard I2S-bus
1
0
0
LSB-justified, 16 bits
1
0
1
LSB-justified, 18 bits
1
1
0
LSB-justified, 20 bits
1
1
1
LSB-justified, 24 bits
Table 18 Digital serial formats for outputs 1 to 4
format_out
OUTPUT
BIT 2
BIT 1
BIT 0
0
0
0
standard I2S-bus
1
0
0
LSB-justified, 16 bits
1
0
1
LSB-justified, 18 bits
1
1
0
LSB-justified, 20 bits
1
1
1
LSB-justified, 24 bits
10 SOFTWARE IN ROM DESCRIPTION
The function of this chip is related to the PROM code (ROM code dependent).
2003 Mar 13
20
Philips Semiconductors
Preliminary specification
Digital Signal Processor
SAA7715AH
11 LIMITING VALUES
In accordance with the Absolute Maximum Ratings System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDD
supply voltage
−0.5
+3.6
V
VI
input voltage
−0.5
+5.5
V
IIK
input clamping diode current
VI < − 0.5 V or VI > VDD + 0.5 V
−
±10
mA
IOK
output clamping diode current
VO < − 0.5 V or VO > VDD + 0.5 V
−
±20
mA
−0.5 V < VO < VDD + 0.5 V
−
±20
mA
IO(sink/source) output source or sink current
IDD,ISS
VDD or VSS current per supply pin
−
±50
mA
Tamb
ambient temperature
−40
+85
°C
Tstg
storage temperature
−65
+125
°C
VESD
electrostatic handling voltage
note 1
200
−
V
note 2
2000
−
V
Ilu(prot)
latch-up protection current
CIC specification/test method
100
−
mA
Ptot
total power dissipation
−
600
mW
Notes
1. Machine model (R = 0 Ω; C = 100 pF; L = 2.5 µH).
2. Human body model (R = 1500 Ω; C = 100 pF).
12 THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
2003 Mar 13
PARAMETER
thermal resistance from junction to
ambient
CONDITIONS
mounted on printed-circuit board
21
VALUE
UNIT
60
K/W
Philips Semiconductors
Preliminary specification
Digital Signal Processor
SAA7715AH
13 CHARACTERISTICS
VDD = 3.15 to 3.45 V; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies; Tamb = −40 to +85 °C
VDD
operating supply voltage
IDDD
supply current of the digital part
IDDD(core)
supply current of the digital core
part
IDDD(peri)
3.15
3.3
3.45
V
−
95
−
mA
high activity of the
DSP at DSPFREQ
frequency
−
90
−
mA
supply current of the digital
periphery part
no external load to
ground
−
5
−
mA
IDDA
supply current of the analog part
zero input and output
signal
−
20
−
mA
IDDA(DAC)
supply current of the DAC
zero input and output
signal
−
6.5
13
mA
Power-down mode
−
250
−
µA
zero input and output
signals
−
13.5
27
mA
−
380
−
mW
−
400
−
µA
IDDA(SPDIF)
supply current of the SPDIF
inputs, on-chip PLL and WSPLL
Ptot
total power dissipation
IPOWERDOWN
DC supply current of the total chip
in Power-down mode
all pins VDD with
respect to pins VSS
pin POWERDOWN
enabled
Digital I/O; Tamb = −40 to +85 °C; VDD = 3.15 to 3.45 V; unless otherwise specified
VIH
HIGH-level input voltage all digital
inputs and I/Os
2.0
−
−
V
VIL
LOW-level input voltage all digital
inputs and I/Os
−
−
0.8
V
Vhys
Schmitt-trigger hysteresis
VOH
HIGH-level output voltage
2003 Mar 13
0.4
−
−
V
standard output;
IO = −4 mA
VDD − 0.4
−
−
V
5 ns slew rate output;
IO = −4 mA
VDD − 0.4
−
−
V
10 ns slew rate
output; IO = −2 mA
VDD − 0.4
−
−
V
20 ns slew rate
output; IO = −1 mA
VDD − 0.4
−
−
V
22
Philips Semiconductors
Preliminary specification
Digital Signal Processor
SYMBOL
VOL
PARAMETER
LOW-level output voltage
SAA7715AH
CONDITIONS
MIN.
TYP.
MAX.
UNIT
standard output;
IO = 4 mA
−
−
0.4
V
5 ns slew rate output;
IO = 4 mA
−
−
0.4
V
10 ns slew rate
output; IO = 2 mA
−
−
0.4
V
20 ns slew rate
output; IO = 1 mA
−
−
0.4
V
I2C-bus output;
IO = 4 mA
−
−
0.4
V
VO = 0 V or VDD
−
−
±5
µA
ILO
output leakage current 3-state
outputs
Rpd
internal pull-down resistor to VSS
24
50
140
kΩ
Rpu
internal pull-up resistor to VDD
30
50
100
kΩ
Ci
input capacitance
−
−
3.5
pF
ti(r),ti(f)
input rise and fall times
VDD = 3.45 V
−
6
200
ns
to(t)
output transition time
standard output;
CL = 30 pF
−
3.5
−
ns
5 ns slew rate output;
CL = 30 pF
−
5
−
ns
10 ns slew rate
output; CL = 30 pF
−
10
−
ns
20 ns slew rate
output; CL = 30 pF
−
20
−
ns
I2C-bus output;
CL = 400 pF
60
−
300
ns
AC characteristics SPDIF1 and SPDIF2 inputs; Tamb = 25 °C; VDDA2 = 3.3 V; unless otherwise specified
Vi(p-p)
AC input level (peak-to-peak level)
Ri
input impedance
Vhys
hysteresis of input voltage
at 1 kHz
0.2
0.5
3.3
V
−
6
−
kΩ
−
40
−
mV
Analog DAC outputs; VDDA1 = 3.3 V; fs = 44.1 kHz; Tamb = 25 °C; RL = 5 kΩ; all voltages referenced to ground;
unless otherwise specified
DC CHARACTERISTICS
−
0.13
3.0
Ω
−
0.22
−
mA
load resistance
3
−
−
kΩ
CL
load capacitance
−
−
200
pF
Ro(VREFDA)
VREFDA output resistance
−
28
−
kΩ
Ro(DAC)
DAC output resistance
Io(max)
maximum output current
RL
(THD + N)/S < 0.1%
RL = 5 kΩ
AC CHARACTERISTICS
Vo(rms)
output voltage (RMS value)
−
1000
−
mV
∆Vo
unbalance between channels
−
0.1
−
dB
2003 Mar 13
23
Philips Semiconductors
Preliminary specification
Digital Signal Processor
SYMBOL
PARAMETER
SAA7715AH
CONDITIONS
MIN.
TYP.
MAX.
UNIT
(THD + N)/S
total harmonic distortion plus
noise-to-signal ratio
at 0 dB
−
−85
−
dB(A)
at −60 dB
−
−37
−
dB(A)
S/N
signal-to-noise ratio
code = 0
−
100
−
dB(A)
αcs
channel separation
−
80
−
dB
PSRR
power supply rejection ratio
−
50
−
dB
2003 Mar 13
fripple = 1 kHz;
Vripple(p-p) = 1%
24
Philips Semiconductors
Preliminary specification
Digital Signal Processor
SAA7715AH
14 I2S-BUS TIMING
LEFT
handbook, full pagewidth
WS
RIGHT
tBCK(H)
tr
tsu(WS)
tf
th(WS)
td(D)
BCK
tBCK(L)
tsu(D)
th(D)
Tcy
LSB
DATA IN
MSB
LSB
DATA OUT
MSB
MGM129
Fig.7 Timing of the digital serial audio data inputs and outputs.
Table 19 Timing of the digital serial audio data inputs and outputs (see Fig.7)
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
162
−
−
ns
Tcy = 50 ns
−
−
0.15Tcy
ns
Tcy = 50 ns
−
−
0.15Tcy
ns
bit clock HIGH time
Tcy = 50 ns
0.35Tcy
−
−
ns
tBCK(L)
bit clock LOW time
Tcy = 50 ns
0.35Tcy
−
−
ns
tsu(D)
data set-up time
Tcy = 50 ns
0.2Tcy
−
−
ns
th(D)
data hold time
Tcy = 50 ns
0.2Tcy
−
−
ns
Tcy = 50 ns
Tcy
bit clock cycle time
tr
rise time
tf
fall time
tBCK(H)
td(D)
data delay time
−
−
0.15Tcy
ns
tsu(WS)
word select set-up time Tcy = 50 ns
0.2Tcy
−
−
ns
th(WS)
word select hold time
0.2Tcy
−
−
ns
2003 Mar 13
Tcy = 50 ns
25
Philips Semiconductors
Preliminary specification
Digital Signal Processor
SAA7715AH
15 I2C-BUS TIMING
handbook, full pagewidth
SDA
tLOW
tf
tSU;DAT
tr
tf
tHD;STA
tSP
tr
tBUF
SCL
S
tHD;STA
tHD;DAT
tHIGH
tSU;STA
tSU;STO
Sr
P
S
MSC610
Fig.8 Timing of the I2C-bus.
Table 20 Timing of the I2C-bus (see Fig.8)
SYMBOL
PARAMETER
CONDITIONS
STANDARD MODE
I2C-BUS
MIN.
FAST MODE I2C-BUS
UNIT
MAX.
MIN.
MAX.
fSCL
SCL clock frequency
0
100
0
400
kHz
tBUF
bus free time between a
STOP and START
condition
4.7
−
1.3
−
µs
tHD;STA
hold time (repeated)
START condition; after this
period, the first clock pulse
is generated
4.0
−
0.6
−
µs
tLOW
SCL LOW period
4.7
−
1.3
−
µs
tHIGH
SCL HIGH period
4.0
−
0.6
−
µs
tSU;STA
set-up time for a repeated
START condition
4.7
−
0.6
−
µs
tHD;DAT
DATA hold time
0
−
0
0.9
µs
tSU;DAT
DATA set-up time
250
−
100
−
ns
tr
rise time of both SDA and
SCL signals
Cb in pF
−
1000
20 + 0.1Cb 300
ns
tf
fall time of both SDA and
SCL signals
Cb in pF
−
300
20 + 0.1Cb 300
ns
tSU;STO
set-up time for STOP
condition
4.0
−
0.6
−
µs
Cb
capacitive load for each
bus line
−
400
−
400
pF
tSP
pulse width of spikes to be
suppressed by input filter
not applicable
0
50
ns
2003 Mar 13
26
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+3.3 V
47 µF
VSSA1
VSSA2
VSSE
VSSI1
VSSI2
8
VDDI1
7
VDDE
4
L2
VDDA2
25
10 Ω
VDDA1
24
47
µF
10 Ω
RESERVED3
SPDIF1
100 pF
SPDIF2
100 pF
47
µF
L1
RESERVED2
100 nF
RESERVED1
100 nF
100
nF
35
17
23
16
37
15
21
14
10
31 IIS_OUT1
IIS_BCK1 1
Philips Semiconductors
75 Ω
100
nF
Digital Signal Processor
75 Ω
100
nF
16 APPLICATION DIAGRAM
handbook, full pagewidth
2003 Mar 13
SPDIF
input signals
30 IIS_OUT2
IIS_WS1 2
XRAM
IIS_IN1 3
YRAM
29 IIS_OUT3
digital
outputs
28 IIS_OUT4
IIS_IN4 5
33 IIS_BCK
SAA7715AH
digital
inputs
32 IIS_WS
DSP CORE
IIS_IN2 6
27
10 kΩ
34 VOUTL
10 kΩ
47 µF
100 Ω
100 Ω
36 VOUTR
STEREO
DAC
IIS_IN3 9
÷2
S
PRAM
PLL
PROM
n × fs
CLOCK
DSP CLOCK
I2C-BUS
47 µF
100 nF
43
42
40
20
19
26
13
12
11
27
18
DIV_CLK_IN
DSP_INOUT7
DSP_INOUT6
DSP_INOUT5
POWERDOWN
SHTCB
RTCB
TSCAN
SDA
SCL
A0
SYSCLK
DSP_RESET
+5 V
+3.3 V
22 kΩ
microcontroller
4.7 kΩ
4.7 kΩ
22 kΩ
microcontroller
1 µF (1)
MHC321
I2C-bus
Fig.9 Application diagram.
Preliminary specification
44
(1) Omit this capacitor when a microcontroller is used.
microcontroller
4.7 µF
SAA7715AH
41
DSP flags
right output
WS_PLL
22
+5 V
47 µF
38 VREFDA
CLK_IN
TCB
39 POM
left output
Philips Semiconductors
Preliminary specification
Digital Signal Processor
SAA7715AH
17 PACKAGE OUTLINE
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm
SOT307-2
c
y
X
A
33
23
34
22
ZE
e
E HE
A A2
wM
(A 3)
A1
θ
bp
Lp
pin 1 index
L
12
44
1
detail X
11
wM
bp
e
ZD
v M A
D
B
HD
v M B
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HD
HE
L
Lp
v
w
y
mm
2.1
0.25
0.05
1.85
1.65
0.25
0.4
0.2
0.25
0.14
10.1
9.9
10.1
9.9
0.8
12.9
12.3
12.9
12.3
1.3
0.95
0.55
0.15
0.15
0.1
Z D (1) Z E (1)
1.2
0.8
1.2
0.8
θ
o
10
0o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
97-08-01
03-02-25
SOT307-2
2003 Mar 13
EUROPEAN
PROJECTION
28
Philips Semiconductors
Preliminary specification
Digital Signal Processor
SAA7715AH
If wave soldering is used the following conditions must be
observed for optimal results:
18 SOLDERING
18.1
Introduction to soldering surface mount
packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
18.2
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
18.3
18.4
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
2003 Mar 13
Manual soldering
29
Philips Semiconductors
Preliminary specification
Digital Signal Processor
18.5
SAA7715AH
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE(1)
WAVE
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
not suitable
suitable(3)
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not
PLCC(4), SO, SOJ
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
REFLOW(2)
suitable
suitable
suitable
not
recommended(4)(5)
suitable
not
recommended(6)
suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2003 Mar 13
30
Philips Semiconductors
Preliminary specification
Digital Signal Processor
SAA7715AH
19 DATA SHEET STATUS
DATA SHEET STATUS(1)
PRODUCT
STATUS(2)
DEFINITIONS
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
20 DEFINITIONS
21 DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2003 Mar 13
31
Philips Semiconductors
Preliminary specification
Digital Signal Processor
SAA7715AH
22 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
2003 Mar 13
32
Philips Semiconductors
Preliminary specification
Digital Signal Processor
SAA7715AH
NOTES
2003 Mar 13
33
Philips Semiconductors
Preliminary specification
Digital Signal Processor
SAA7715AH
NOTES
2003 Mar 13
34
Philips Semiconductors
Preliminary specification
Digital Signal Processor
SAA7715AH
NOTES
2003 Mar 13
35
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
SCA75
© Koninklijke Philips Electronics N.V. 2003
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753503/01/pp36
Date of release: 2003
Mar 13
Document order number:
9397 750 10206
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