Solid State Drive CG2 Series
Solid State Drive CG2 Series
Key Features
•
•
•
•
•
•
Low capacity series
Slim and light design
Low power consumption
High reliability
Intelligent Interface
Data integrity
Applications
• Suitable for mobile internet terminal and consumer
electronics
Specifications and Features
mSATATM Module*1
TOSHIBA® 24 nm MLC NAND Flash Memory
ATA-8 ACS*2, SATA revision 2.6 3 Gbit/s
16/32 GB
Sequential 128 KiB Read : up to 150 MiB/s , Sequential 128 KiB Write : up to 50 MiB/s
3.3 V ±5%
Active : 1.0 W typ.
Idle : 30 mW typ.
Operating : 0°C - 70°C (case temperature)
14.709 km/s2 {1500 G} at 0.5 ms
Operating / Non-operating : 30.2 m/s2 {3.08 Grms} at 7-800 Hz
Mean Time to Failure (MTTF) : 1,000,000 hours
Product Life : Approximately 3 years or 20,000 power on hours, whichever comes earlier
Size
50.95 mm x 30.00 mm x 3.95 mm
Weight
7.5 g typ.
More Features ・ Translation mode which enables any drive configuration
・ 28-bit LBA mode commands and 48-bit LBA mode commands support
・ Multi word DMA
・ Ultra-DMA
・ Advanced PIO mode
・ Automatic retries and corrections for read errors
Compliance
UL, CSA, TUV, KCC, FCC, BSMI, CE, C-Tick
NOTE: *1) © 2009 by Serial ATA International OrganizationSM. mSATA™ is an unregistered trademark of Serial
ATA International Organization. All rights reserved.
*2) WWN is not supported.
Form Factor
Memory
Interface
Capacity
Performance
Supply Voltage
Power
Consumption
Temperature
Shock
Vibration
Reliability
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Copyright © 2012 Toshiba Corporation. All rights reserved.
Solid State Drive CG2 Brochure Rev.1.0
1
Solid State Drive CG2 Brochure Rev.1.0
Ordering Information
THN SX X XXXG X X X
1
2 3
4
5 6 7
1.
Model Name
THN: Toshiba NAND drive
2.
Model Type
SN: Normal SSD
3.
Controller Type T: Type T
4.
Capacity
016G / 032G
016G is 16 GB and 032G is 32 GB
(1 GB = 1,000,000,000 bytes)
5.
Form Factor
M: Module type
6.
Host I/F Type
C: Mini SATA
7.
NAND Process R: 24nm MLC
Product Line up
Product Number
Capacity
THNSNT016GMCR
16 GB
THNSNT032GMCR
32 GB
Form Factor
Mini SATA module
Copyright © 2012 Toshiba Corporation.
All rights reserved.
2
Solid State Drive CG2 Brochure Rev.1.0
Contents
Ordering Information ................................................................................................................................................. 2
Product Line up .......................................................................................................................................................... 2
Contents..................................................................................................................................................................... 3
1.
General Description ........................................................................................................................................... 4
2.
Product Specifications ....................................................................................................................................... 4
2.1.
Capacity..................................................................................................................................................... 4
2.2.
Performance.............................................................................................................................................. 4
Sequential 128 KiB Read ............................................................................................................................................ 4
Up to 150 MiB/s ......................................................................................................................................................... 4
Sequential 128 KiB Write ........................................................................................................................................... 4
Up to 50 MiB/s ........................................................................................................................................................... 4
3.
Electrical Characteristics .................................................................................................................................... 5
3.1.
Supply Voltage........................................................................................................................................... 5
3.2.
Power Consumption.................................................................................................................................. 5
4.
Environmental Conditions ................................................................................................................................. 6
4.1.
Temperature and Humidity ....................................................................................................................... 6
4.2.
Shock and Vibration .................................................................................................................................. 6
5.
Compliance ........................................................................................................................................................ 7
6.
Reliability ........................................................................................................................................................... 7
7.
Mechanical Specifications ................................................................................................................................. 8
7.1.
8.
mSATATM Module ...................................................................................................................................... 8
Interface Connector........................................................................................................................................... 9
8.1.
9.
10.
mSATATM Module ...................................................................................................................................... 9
Command Descriptions ................................................................................................................................... 11
Revision History ........................................................................................................................................... 13
RESTRICTIONS ON PRODUCT USE ............................................................................................................................ 14
Copyright © 2012 Toshiba Corporation.
All rights reserved.
3
Solid State Drive CG2 Brochure Rev.1.0
1. General Description
The TOSHIBA SSD CG2 series is a memory storage device using NAND Flash Memories, which is suitable
for mobile internet terminal and consumer electronics.
The drive features an ATA-8 and Serial ATA revision 2.6 interface embedded controller that requires a
simplified adapter board for interfacing to a Serial ATA or Serial ATA compatible bus. The drive is
distinctive for its small and light body.
2. Product Specifications
2.1. Capacity
Table 2-1. User Addressable Sectors in LBA Mode
NOTE:
Capacity
Total Number of User Addressable Sectors in LBA Mode
16 GB
31,277,232
32 GB
62,533,296
1 GB (Gigabyte) = 1,000,000,000 bytes
Bytes per sector: 512 bytes
2.2. Performance
Table 2-2. Interface Speed and Data Transfer Rate in Read/Write
Parameter
Transfer Rate
Interface Speed
300 MB/s
Sequential 128 KiB Read
Up to 150 MiB/s
Sequential 128 KiB Write
Up to 50 MiB/s
Copyright © 2012 Toshiba Corporation.
All rights reserved.
4
Solid State Drive CG2 Brochure Rev.1.0
3. Electrical Characteristics
3.1. Supply Voltage
Table 3-1. Supply Voltage
mSATATM Module
Allowable voltage
3.3 V ±5%
Allowable noise/ripple
100 mV p-p or less
Allowable supply rise time
NOTE:
2 –100 ms
The drive has over current protection circuit. (Rated current: 3.15 A)
3.2. Power Consumption
Table 3-2. Power Consumption
mSATATM Module
Operation
(at 25°C)
THNSNT016GMCR
THNSNT032GMCR
Read *1
1.0 W typ.
1.0 W typ.
*1
1.0 W typ.
1.0 W typ.
30 mW typ.
30 mW typ.
30 mW typ.
30 mW typ.
30 mW typ.
30 mW typ.
Write
Idle
*2
Standby *3
Sleep
*3
NOTE:
*1) The read/write current is specified under maximum speed of read/write operation.
*2) The values are based on using SATA power management features. The Slumber mode is used for
the idle mode power consumption measurements. In Idle mode, if a background write operation
occurs, the drive power consumption may temporally rise to that in write operation.
*3) The values are based on using SATA power management features. The Slumber mode is used for
Standby and Sleep modes power consumption measurements. In Standby mode, if a background write
operation occurs, the drive power consumption may temporally rise to that in write operation.
Copyright © 2012 Toshiba Corporation.
All rights reserved.
5
Solid State Drive CG2 Brochure Rev.1.0
4. Environmental Conditions
4.1. Temperature and Humidity
Table 4-1. Temperature
Condition
Operating
NOTE:
*1
Range
Gradient
0°C (Tc) – 70°C (Tc)
30°C (Ta) / h max.
*1) Ta: Ambient Temperature, Tc: Case Temperature
Table 4-2. Humidity
Condition
Range
Operating
8% – 90% R.H. (No condensation)
Non-operating
Under Shipment
NOTE:
8% – 95% R.H. (No condensation)
*1
5% – 95% R.H.
*1) Packaged in Toshiba’s original shipping package
4.2. Shock and Vibration
Table 4-3. Shock
Condition
Range
Operating
14.709 km/s2 {1500 G}, 0.5 ms, half sine wave
Non-operating
14.709 km/s2 {1500 G}, 0.5 ms, half sine wave
Under Shipment *1
100 cm free drop
NOTE:
*1) Apply shocks in each direction of the drive’s three mutually perpendicular axes, one axis at a time.
Packaged in Toshiba’s original shipping package.
Table 4-4. Vibration
Condition
Range
Operating
30.2 m.s2 {3.08 Grms}, 7-800 Hz,
(20 minutes per axis) x3 axis
Non-operating
30.2 m.s2 {3.08 Grms}, 7-800 Hz,
(12 cycles per axis) x3 axis, x20 minutes
Copyright © 2012 Toshiba Corporation.
All rights reserved.
6
Solid State Drive CG2 Brochure Rev.1.0
5. Compliance
TOSHIBA SSDs CG2 series comply with the following.
Table 5-1. Compliance
Title
Description
UL
(Underwriters Laboratories)
UL 60950-1
Region
USA
CSA
(Canadian Standard Association)
CSA-C22.2 No.60950-1
Canada
*Included UL logo mark
TÜV
(Technischer Überwachungs Verein)
EN 60950-1
Germany
KCC
KN22 (CISPR Pub. 22),
(Korea Communication Commission)
KN24 (CISPR Pub. 24)
FCC
FCC part 15 Subpart B Class B
Korea
USA
BSMI
(Bureau of Standards, Metrology and
CNS13438(CISPR Pub. 22)
Taiwan
EN 55022, EN 55024
Europe
Inspection)
CE Mark
Declaration of Conformity
C-Tick
AS/NZS CISPR Pub. 22 Class B
Australia,
New Zealand
6. Reliability
Table 6-1. Reliability
Parameter
Value
Mean Time to Failure
1,000,000 hours
Product Life
Approximately 3 years or 20,000 power on hours, whichever comes earlier
Copyright © 2012 Toshiba Corporation.
All rights reserved.
7
Solid State Drive CG2 Brochure Rev.1.0
7. Mechanical Specifications
7.1. mSATATM Module
Table 7-1. Weight and Dimensions
Model
THNSNT016GMCR
THNSNT032GMCR
Weight
Width
Height
Length
7.5 g typ.
30.00 mm
3.95 mm
50.95 mm
Figure 7-1. mSATATM Module Drive Dimension
Unit : mm
Copyright © 2012 Toshiba Corporation.
All rights reserved.
8
Solid State Drive CG2 Brochure Rev.1.0
8. Interface Connector
8.1. mSATATM Module
Figure 8-1. mSATATM Interface Connector
Copyright © 2012 Toshiba Corporation.
All rights reserved.
9
Solid State Drive CG2 Brochure Rev.1.0
Table 8-1. Pin Assignment on mSATATM Connector
Pin #
Name
Description
1
Reserved
NC
3
Reserved
5
Pin #
Name
Description
2
V33
3.3V power
NC
4
GND
Return Current Path
Reserved
NC
6
V15
1.5V power (Unused)
7
Reserved
NC
8
Reserved
NC
9
GND
Return Current Path
10
Reserved
NC
11
Reserved
NC
12
Reserved
NC
13
Reserved
NC
14
Reserved
NC
15
GND
Return Current Path
16
Reserved
NC
Key
17
Reserved
NC
18
GND
Return Current Path
19
Reserved
NC
20
Reserved
NC
21
GND
Return Current Path
22
Reserved
NC
23
B+
Differential Signal Pair B
24
V33
3.3V power
25
B-
26
GND
Return Current Path
27
GND
(Device Tx)
Return Current Path
28
V15
1.5V power (Unused)
29
GND
Return Current Path
30
Vendor
NC
31
A-
Differential Signal Pair A
32
Vendor
NC
33
A+
34
GND
Return Current Path
35
GND
(Device Rx)
Return Current Path
36
Reserved
NC
37
GND
Return Current Path
38
Reserved
NC
39
V33
3.3V power
40
GND
Return Current Path
41
V33
3.3V power
42
Reserved
NC
NC
44
Reserved
NC
No connect at Host side
46
Reserved
NC
43
Device Type
45
Vendor
47
Vendor
49
51
*3
No connect at Host side
48
V15
1.5V power (Unused)
*1
Drive Activity Signal
50
GND
Return Current Path
*2
Presence Detection
52
V33
3.3V power
DAS/DSS
Presence
Note: *1) DAS/DSS signal is not used for this drive. (DAS Signal output is optional)
*2) Presence pin is connected to GND by device side. (220 Ω Pull Down)
*3) Pin43 is NC for mSATA device. (This product complies with specification SATA-IO ECN#045)
Copyright © 2012 Toshiba Corporation.
All rights reserved.
10
Solid State Drive CG2 Brochure Rev.1.0
9. Command Descriptions
Table 9-1. Supported ATA Command Set
Op-Code
Command Description
10h
RECALIBRATE
20h
READ SECTOR(S)
21h
READ SECTOR(S) without retry
24h
READ SECTOR(S) EXT
25h
READ DMA EXT
27h
READ NATIVE MAX ADDRESS EXT
29h
READ MULTIPLE EXT
2Fh
READ LOG EXT
30h
WRITE SECTOR(S)
31h
WRITE SECTOR(S) without retry
34h
WRITE SECTOR(S) EXT
35h
WRITE DMA EXT
37h
SET MAX ADDRESS EXT
39h
WRITE MULTIPLE EXT
3Dh
WRITE DMA FUA EXT
3Fh
WRITE LOG EXT
40h
READ VERIFY SECTOR(S)
41h
READ VERIFY SECTOR(S) without retry
42h
READ VERIFY SECTOR(S) EXT
45h
WRITE UNCORRECTABLE EXT
70h
SEEK
90h
EXECUTE DEVICE DIAGNOSTIC
91h
INITIALIZE DEVICE PARAMETERS
92h
DOWNLOAD MICROCODE
B0h
SMART
B1h
DEVICE CONFIGURATION OVERLAY
C4h
READ MULTILE
C5h
WRITE MULTIPLE
C6h
SET MULTIPLE MODE
C8h
READ DMA
C9h
READ DMA without retry
CAh
WRITE DMA
CBh
WRITE DMA without retry
Copyright © 2012 Toshiba Corporation.
All rights reserved.
11
Solid State Drive CG2 Brochure Rev.1.0
Op-Code
Command Description
CEh
WRITE MULTIPLE FUA EXT
E0h
STANDBY IMMEDIATE
E1h
IDLE IMMEDIATE
E2h
STANDBY
E3h
IDLE
E4h
READ BUFFER
E5h
CHECK POWER MODE
E6h
SLEEP
E7h
FLUSH CACHE
E8h
WRITE BUFFER
EAh
FLUSH CACHE EXT
ECh
IDENTIFY DEVICE
EFh
SET FEATURES
F1h
SECURITY SET PASSWORD
F2h
SECURITY UNLOACK
F3h
SECURITY ERASE PREPARE
F4h
SECURITY ERASE UNIT
F5h
SECURITY FREEZE LOCK
F6h
SECURITY DISABLE PASSWORD
F8h
READ NATIVE MAX ADDRESS
F9h
SET MAX ADDRESS
Copyright © 2012 Toshiba Corporation.
All rights reserved.
12
Solid State Drive CG2 Brochure Rev.1.0
10.
Revision History
Rev.
1.0
Description
First version
Date
Jun. 08, 2012
Copyright © 2012 Toshiba Corporation.
All rights reserved.
13
Solid State Drive CG2 Brochure Rev.1.0
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export
laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export
Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in
compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
Copyright © 2012 Toshiba Corporation.
All rights reserved.
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