OR-421 Flux-Cored Wire Data Sheet

OR-421 Flux-Cored Wire Data Sheet
Organic Cored W ire
For Lead-bearing and Lead-free alloys
Product Description
Reliability Properties
Kester OR421 is a high activity, water soluble,
cored wire flux. The OR421 is more heat stable,
exhibits better wetting capabilities and has less
odor than competitive products. The residues left
by OR421 are near neutral pH and therefore also
less corrosive. The OR421 is classified as ORH1
per J-STD-004.
Copper Mirror Corrosion: High
Kester OR421 cored wire solder can be utilized
with an open torch or a soldering iron. OR421 will
solder copper as well as more difficult to solder
materials such as brass and nickel. OR421 can
be used on pipes or tubing for applications such as
refrigeration coils and heat exchangers. The heat
stability of Kester OR421 makes it ideal for high
temperature alloys such as 95Sn/5Sb,
10Sn88Pb2Ag and 10Sn90Pb.
Chloride and Bromides: 6.95%
Performance Characteristics:
Highest activity available
Compatible with high temperature alloys
Easy to clean
Classified as ORH1 per J-STD-004
RoHS Compliance
This product meets the requirements of the RoHS
(Restriction of Hazardous Substances) Directive,
2002/95/EC Article 4 for the stated banned
substances. (Applies only if this core flux is
combined with a lead free alloy)
Tested to J-STD-004, IPC-TM-650, Method 2.3.32
Corrosion Test: High
Tested to J-STD-004, IPC-TM-650, Method 2.6.15
Silver Chromate: Fail
Tested to J-STD-004, IPC-TM-650, Method 2.3.33
Tested to J-STD-004, IPC-TM-650, Method 2.3.35
Fluorides by Spot Test: Pass
Tested to J-STD-004, IPC-TM-650, Method
Application Notes
Kester OR421 is available in a wide variety of alloys, wire diameters and flux percentages. For most
applications, Sn63Pb37 or Sn96.5Ag3.0Cu0.5 is used. Consult the alloy temperature chart in Kester’s product
catalog for a comprehensive alloy list. The standard wire diameter for most applications is 1.00mm (0.031in).
Wire diameters range from 0.25 - 6.00mm (0.010 to 0.250in). A "Standard Wire Diameters" chart also is also
included in Kester’s product catalog. The amount of flux in the wire dictates the ease of soldering for an
application. For most applications, core 66 (3.3% flux by weight) is recommended. Other core sizes, 50 and
58, (1.1% and 2.2% respectively) are available. Kester OR421 is packaged on spools of different sizes to
accommodate a variety of applications.
Process Considerations:
Solder iron tip temperatures are most commonly between 315-371°C (600-700°F) for Sn63Pb37 and
Sn62Pb36Ag02 alloys and 371-427°C (700-800°F) for lead-free alloys. Heat both the land area and component
lead to be soldered with the iron prior to adding Kester OR421 cored wire. Apply the solder wire to the land
area or component lead. Do not apply the wire directly to the soldering iron tip. If needed, Kester 2331-ZX
organic flux may be used as a compatible liquid flux to aid in reworking soldered joints.
Kester OR421 Flux leaves a residue after soldering that is hygroscopic and ionizable. Removal of ionizable
salts can best be accomplished by washing the assembly with a 2-5% solution of Kester 5760 Neutralizer in
water, followed by a thorough warm water rinse. The recommended water temperature is 54 ± 6°C (130 ±
10°F). If the residue is charred due to excessive heating during soldering, mechanical scrubbing can be
used to remove the decomposed char.
Storage, Handling, and Shelf Life:
Storage must be in a dry, non-corrosive environment. The surface may lose its shine and appear a dull
shade of grey. This is a surface phenomena and is not detrimental to product functionality. Flux cored solder
wire has a limited shelf life determined by the alloy used in the wire. For alloys containing > 70% lead, the
shelf life is two years from date of manufacture. Other alloys have a shelf life of three years from date of
Health & Safety:
This product, during handling or use, may be hazardous to health or the environment. Read the Material
Safety Data Sheet and warning label before using this product.
World Headquarters: 800 West Thorndale Avenue, Itasca, Illinois, 60143 USA
Phone: (+1) 847-297-1600 • Email: [email protected] • Website: www.kester.com
Asia Pacific Headquarters
500 Chai Chee Lane
Singapore 469024
(+65) 6449-1133
[email protected]
European Headquarters
Zum Plom 5
08541 Neuensalz
(+49) 3741 4233-0
[email protected]
Japanese Headquarters
20-11 Yokokawa 2-Chome
Tokyo 130-0003 Japan
(+81) 3-3624-5351
[email protected]
The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the
use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the potential hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used in
the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details.
Rev: 15Jun07
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