OR-421 Flux-Cored Wire Data Sheet

® OR421 Organic Cored W ire For Lead-bearing and Lead-free alloys Product Description Reliability Properties Kester OR421 is a high activity, water soluble, cored wire flux. The OR421 is more heat stable, exhibits better wetting capabilities and has less odor than competitive products. The residues left by OR421 are near neutral pH and therefore also less corrosive. The OR421 is classified as ORH1 per J-STD-004. Copper Mirror Corrosion: High Kester OR421 cored wire solder can be utilized with an open torch or a soldering iron. OR421 will solder copper as well as more difficult to solder materials such as brass and nickel. OR421 can be used on pipes or tubing for applications such as refrigeration coils and heat exchangers. The heat stability of Kester OR421 makes it ideal for high temperature alloys such as 95Sn/5Sb, 10Sn88Pb2Ag and 10Sn90Pb. Chloride and Bromides: 6.95% Performance Characteristics: • • • • Highest activity available Compatible with high temperature alloys Easy to clean Classified as ORH1 per J-STD-004 RoHS Compliance This product meets the requirements of the RoHS (Restriction of Hazardous Substances) Directive, 2002/95/EC Article 4 for the stated banned substances. (Applies only if this core flux is combined with a lead free alloy) Tested to J-STD-004, IPC-TM-650, Method 2.3.32 Corrosion Test: High Tested to J-STD-004, IPC-TM-650, Method 2.6.15 Silver Chromate: Fail Tested to J-STD-004, IPC-TM-650, Method 2.3.33 Tested to J-STD-004, IPC-TM-650, Method 2.3.35 Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1 OR421 Application Notes Availability: Kester OR421 is available in a wide variety of alloys, wire diameters and flux percentages. For most applications, Sn63Pb37 or Sn96.5Ag3.0Cu0.5 is used. Consult the alloy temperature chart in Kester’s product catalog for a comprehensive alloy list. The standard wire diameter for most applications is 1.00mm (0.031in). Wire diameters range from 0.25 - 6.00mm (0.010 to 0.250in). A "Standard Wire Diameters" chart also is also included in Kester’s product catalog. The amount of flux in the wire dictates the ease of soldering for an application. For most applications, core 66 (3.3% flux by weight) is recommended. Other core sizes, 50 and 58, (1.1% and 2.2% respectively) are available. Kester OR421 is packaged on spools of different sizes to accommodate a variety of applications. Process Considerations: Solder iron tip temperatures are most commonly between 315-371°C (600-700°F) for Sn63Pb37 and Sn62Pb36Ag02 alloys and 371-427°C (700-800°F) for lead-free alloys. Heat both the land area and component lead to be soldered with the iron prior to adding Kester OR421 cored wire. Apply the solder wire to the land area or component lead. Do not apply the wire directly to the soldering iron tip. If needed, Kester 2331-ZX organic flux may be used as a compatible liquid flux to aid in reworking soldered joints. Cleaning: Kester OR421 Flux leaves a residue after soldering that is hygroscopic and ionizable. Removal of ionizable salts can best be accomplished by washing the assembly with a 2-5% solution of Kester 5760 Neutralizer in water, followed by a thorough warm water rinse. The recommended water temperature is 54 ± 6°C (130 ± 10°F). If the residue is charred due to excessive heating during soldering, mechanical scrubbing can be used to remove the decomposed char. Storage, Handling, and Shelf Life: Storage must be in a dry, non-corrosive environment. The surface may lose its shine and appear a dull shade of grey. This is a surface phenomena and is not detrimental to product functionality. Flux cored solder wire has a limited shelf life determined by the alloy used in the wire. For alloys containing > 70% lead, the shelf life is two years from date of manufacture. Other alloys have a shelf life of three years from date of manufacture. Health & Safety: This product, during handling or use, may be hazardous to health or the environment. Read the Material Safety Data Sheet and warning label before using this product. World Headquarters: 800 West Thorndale Avenue, Itasca, Illinois, 60143 USA Phone: (+1) 847-297-1600 • Email: [email protected] • Website: www.kester.com Asia Pacific Headquarters 500 Chai Chee Lane Singapore 469024 (+65) 6449-1133 [email protected] European Headquarters Zum Plom 5 08541 Neuensalz Germany (+49) 3741 4233-0 [email protected] Japanese Headquarters 20-11 Yokokawa 2-Chome Sumida-Ku Tokyo 130-0003 Japan (+81) 3-3624-5351 [email protected] The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the potential hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used in the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details. Rev: 15Jun07
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