Embedded Gaming Brochure
Intelligent Solutions
Gaming Specific
Baseboards and
COM Express™
CPU Modules
OS integration,
Software Drivers
Mainboards and
Graphics Cards
Embedded Gaming
Modular Design Approach for Future
Modifications and Scalability
Edition | 2015
Modular Design
Approach for Scalability
MSC Technologies an Avnet Company is a Ger-
COM Express
Graphics Cards
| 12
man manufacturer of embedded computers.
We are committed to serving gaming machine
manufacturers worldwide with the latest X86
and ARM based processor and graphics technologies integrated on Computer-On-Module
(COM). We aim to be a reliable partner in bringing these technologies as quick as possible
to the market. The main benefits of modular
COM based gaming platforms are numerous:
• Multisource – all our COM products are
based on embedded industry open standards
adopted by a number of embedded computer
• Scalability – modular approach allows a balance of performance and cost for CPU/GPU
• Availability – MSC only integrates CPU/ GPU
technologies placed on the embedded road
map guaranteeing 5+ years of availability
• Upgradability – easy to adopt the latest technologies by replacing the COM module only
and leaving all the gaming specific functions
integrated on the baseboard unchanged
• Reliability –the COM modules utilize industrial grade components and are designed for
24/7 operations
• Security – industry standard security features
implementation e.g. TPM and Chain-of-Trust
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BIOS and Secure Boot | 19
Products and Features
MSC’s range of products includes a number of
Graphics Performance
PICMG (PCI Industrial Computer Manufactur-
The modular architecture allows scalable
er Group) standard COM Express™, Qseven
graphics performance. The latest Intel® and
(Q7), ETX, and nanoRISC® standard modules.
AMD® Integrated Graphics Controllers (IGC)
We also offer design and manufacturing ser-
provide good graphics and can run multiple
vices to design or assist in designing customer
displays. For better graphics, the architecture
specific baseboards, featuring gaming specific
allows for an external PEG card, via PCIe x16
functionalities. A number of evaluation and de-
slot. The latest PEG cards have up to 6 video
velopment boards and kits with BSPs for the
outputs and comply with DP1.2 standard al-
most popular OS are available. This enables
lowing displays to be “daisy chained”.
easy evaluation and rapid prototyping of suitable technologies. In partnership with AMD
Gaming Specific Functions
and NVIDIA we offer a range of cost/perfor-
All the gaming specific functions are imple-
mance tailored embedded graphics cards with
mented on the gaming baseboard or gaming
guaranteed supply of 3 to 5 years.
plug-in board, isolating relatively slow changing gaming functions and peripherals from
the frequently changing high speed CPU/GPU
technologies integrated on the COM modules
CPU Processing Power
and mainboards.
A range of Intel , AMD, NVIDIA, Freescale, and
TI Quad, Dual, and Single-Core™ embedded
processors are being integrated in COM mod-
The platform provides numerous security fea-
ules to suit various applications. A suitable bal-
tures: TPM, customized BIOS/UEFI, battery
ance between TDP requirements, processing
powered security controller, and a smart card
power, and the cost of the system can be made.
that can further enhance system security.
Eight mechanical and four optical switches can
be monitored even when it is powered down.
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Standard COM
Express Module
Standard PEG Card
2x 220 pins
Power Supply
Multiple Displays
MST „Daisy
COM Express
PCIe x 16
DP 1.2
Multiple Displays
subject to PEG card
Multiple Displays
Off-The-Shelf (COTS)
Gaming Machine Peripherals & Systems
COM Express™ Modular Gaming Platforms
The modular gaming platforms based on COM
achieved by utilizing integrated graphics capabili-
Express™ technology consist of the gaming
ties built into COM Express™ module or an exter-
baseboard hosting all the gaming relevant func-
nal PEG graphics card. It offers the perfect solu-
tions and an embedded COM Express™ module
tion for security demanding applications through
plugged into the baseboard. The approach en-
the customized BIOS/UEFI and TPM security
ables scalable CPU solutions for future modifi-
implementations. The BSP provides a range of
cations and implementation of the latest CPU
standard and custom designed device drivers re-
technologies. Scalable graphics performance is
quired for driving gaming specific functions.
COM Express® Modules Highlights
• Rich complement of contemporary high
bandwidth serial interfaces, including PCI
Express , Serial ATA, USB 2.0 and 3.0, and
Gigabit Ethernet
• 32-bit PCI, LPC and Parallel ATA options
preserved for easy interface to a range of
peripherals when type 2 pin-out is used
• Extended power-management capabilities
• Robust thermal and mechanical concept
4 | www.msc-technologies.eu
• Off-the-shelf cooling solutions
• Cost-effective designs and
various systems configurations
• Compact module size with three
footprint options to satisfy a range
of performance requirement
• Windows® 7, XP (embedded)
and Linux supported
Custom Made
Type 6 / Type 2 Basic Module
• Intel® 4th generation Celeron and Core™ i3,
i5 and i7 dual- and quad-core processors
• DirectX 11.1, OpenGL 3.2, OpenCL 1.2
• Intel QM87 PCH with Intel
• Up to 16GB DDR3-1600 SDRAM, dual-channel
• Resolution up to 3800 x 2400
HD Graphics 4600
• Three DP/HDMI/DVI interfaces
• 4x USB 3.0, 4x USB 2.0, 4x SATA up to 6 Gb/s
• Triple independent display support
Type6 /Type 2/Type10 Modules
• Intel® SOC Atom® and Celeron® single to quadcore CPU
• One USB 3.0 and up to seven USB 2.0 interface
• MicroSD card socket
• Integrated Intel Gen. 7 HD graphics
• DisplayPort/HDMI/DVI interface
• Up to 8GB DDR3L SDRAM, dual-channel
• Two independent displays supported
• DirectX 11.1, OpenGL 3.2, OpenCL 1.1
• Trusted Platform Module (option)
Type 6 Compact Module
egments: Embedded and Server
bedded Solutions
• AMD R-Series Dual and Quad Core APU
Embedded Solutions
“R” Series X
Embedded Solutions
“R” Series A
• AMD R-Series
– X
cost saving option
(showcase specific Opteron X86
technology platform)
• Up to 16 GB DDR3-1333 SDRAM, dual-channel
Opteron A
(For future use)
• AMD Fusion Controller Hub A75
• Radeon HD7000G series integrated graphics
bedded Solutions
Series X
Embedded Solutions
“G” SeriesB
Embedded Solutions
edded Solutions
eon Graphics
Embedded Solutions
Opteron X
Embedded Solutions
Opteron A
(For future use)
• 4x USB 3.0, 4x USB 2.0, 4x SATA 3 Gb/s
• DirectX® 11, OpenCL™ 1.1, OpenGL 4.2
• Resolution up to 4096 x 2160 (DP),
1920 x 1200 (HDMI)
• Three Independent DisplayPort™ 1.2/
HDMI/DVI interfaces
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Qseven® Modules Highlights
The Qseven® open specification is the latest
The Qseven™ specification has been extended
embedded COM standard for entry level perfor-
to include module architectures based on the
mance and low power applications with a very
ARM processor which is known for its excellent
attractive price performance ratio. Qseven is
performance to power ratio. Providing differ-
an open standard of the SGeT Standardization
ent processor architectures and a wide range of
Group. Taking advantage of the on-going devel-
modules for commercial and extended tempera-
opment in processor technologies towards small-
ture together with matching baseboards, the
er and more power efficient CPUs, Qseven is be-
MSC Qseven family leads the way to feature rich,
coming the fastest widely adopted new standard
small, and low power modular systems.
for small form factor modules.
Module - AMD® X86
• AMD Embedded G-Series APU
with SC and DC processors
• AMD A50M I/O Controller Hub
• Up to 4GB DDR3-1066 SDRAM,
32GB SSD (optional)
• Dual independent DP1.1a/DVI/LVDS ports
• Resolution up to 1920x1200, @60fps
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Module – Intel® X86
• Intel® Atom™ E6xx (up to 1.6GHz) with integrated Graphics and EG20T Platform
Controller Hub
• LVDS interface (18 / 24 Bit) up to 1280 x 768 @
60Hz, SDVO interface
• up to 1920 x 1080, Dual Independent Display support
• Up to 2GB DDR2 SDRAM, soldered
• Windows 7 (embedded) and Linux support
• Up to 8GB on board Flash SSD, bootable
• Extended temperature options available
Module - Freescale ARM®
• Freescale™ i.MX6 CPU, ARM® single to quadcore Cortex™-A9
• Up to 4GB DDR3 SDRAM
• MPEG-4 encoding / decoding 1080p
• Dual independent HDMI/LVDS channels up to
1920x1080, @30fps
• Up to 32GB eMMC Flash memory
• Industrial Temperature version available
• Dual independent HDMI/DVI/LVDS ports
• GBE LAN interface
Module - Intel® Atom™ E3800
• Intel® SOC Atom™ E3800 single
to quad-core CPU
• HDMI up to 1920x1200
• DisplayPort 1.1a up to 2560x1600
• Integrated Intel Gen. 7 HD Graphics
• Dual-Channel LVDS 24 or 18 bit up to 1920x1200
• Up to 8 GB DDR3L SDRAM (opt. ECC)
• 3x PCI Express x1 Gen. 2.0 ports, GBE LAN
• Up to 64GB SATA Flash Disk (optional)
• Up to 6x USB 2.0 and 1x USB 3.0
• Up to 16GB eMMC Flash (optional)
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nanoRISC® Modules Highlights
The nanoRISC module standard has been created
ponent”, while users only need to add appli-
for applications requiring a small form factor and
cation-specific peripherals. The 230-pin MXM
lowest power consumption. The nanoRISC mod-
connector used as interface to the baseboard is
ules simplify the design of embedded systems by
proven, robust, and cheap interface solution. A
providing a processor core with an extensive set
variety of easy-to-use interfaces are available. All
of interfaces on a small form factor board. Boot
popular embedded interfaces are included, and
loader and adaptations for popular Operating
additional interfaces can be provided by adding
Systems will be provided by MSC so that design
suitable controllers on the baseboard and con-
times will be shortened dramatically. NanoRISC
necting them to the processor bus available on
modules can be used as a processing “super-com-
the MXM connector.
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Module - Freescale®
• Freescale® i.MX6 Cortex™-A9, single to quadcore SOC, up to 1.2GHz CPU clock
• Up to 4GByte DDR3 SDRAM soldered
• USB 2.0 OTG Host/Client High Speed
• Graphics Interfaces: HDMI/DVI, LVDS, RGB up to 1920 x
1080, dual independent display support
• Up to 4GByte SLC NAND Flash soldered
• Video decoder and scalar
• Up to 64Gbyte eMMC Flash
• CAN 2.0B, 3x UART, 2x SPI, 2x I²C
• Gigabit Ethernet interface
• Camera interface ITU656 / CSI
Module – TI ARM®
• Texas Instruments®, ARM® Cortex™-A8,
up to 800MHz
• Up to 512MB DDR3 SDRAM soldered
• I²S audio interface
• 10/100 LAN interface, option 2nd 10/100 LAN
or 1x GBE
• Up to 512MB SLC NAND Flash soldered
• CAN 2.0B, 3x UART, 2x SPI, 2x I²C
• Up to 64GB eMMC Flash soldered
• 4-wire resistive touch controller
• Graphics, RGB up to 1366x768, option SGX530
• Support for Linux (Android, Windows EC7
Development Kit
• Evaluation and development kit
for all nanoRISC® modules
• Includes 7” LCD panel 800x480 pixels
• Includes Power Supply
• Debug adapter provided
• SD card with pre-installed Linux OS should
be ordered separately to match the chosen
nanoRISC® module
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Mainboards Highlights
To complement our range of COM products, we
our embedded products' portfolio. As part of our
are cooperating with the world’s leading indus-
selection process these boards undergo through
trial embedded single board computer (SBC)
rigorous evaluation and qualification process for
manufacturers and have selected their highest
their design and production quality, high level of
quality, long-term available industrial embedded
support and long-term availability.
mainboards to offer to our customers as part of
Fujitsu D3243-S
Intel® HaswellTM Mini-ITX
• Socket LGA1150 for Intel® desktop 4th generation Core™ i3 / i5 / i7 processors
• Dual Power Supply (ATX compliant & 12V only)
• USB 2.0 / 3.0 and USB socket (stick/dongle) on-board
• Intel HD Graphics HD4600
• 2x Intel® GBE LAN on-board
• 1x PCIe x16 Gen3, 1 x MiniPCIe
• BIOS-POST/-Boot & OS, HW Watchdog on-board
• Intel® iAMT9.1
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Fujitsu D3313-S
AMD eKabini Mini-ITX
• AMD eKabini SOC single to quad-core CPU
• 6x USB 2.0 / 2x USB 3.0 on board
• AMD Radeon integrated graphics
• Socket for internal USB stick
• DVI-I, DP V1.2 and dual-channel LVDS
• 3x serial port and 1x parallel port on-board
• 2x GBE LAN on-board, 1 x mSATA (SATAIII)
• Dual-Range DC Power Supply 12V / 19-24V
• 1x PCIe x16 (4 Lanes) Gen2, 1x miniPCIe
• BIOS-POST/-Boot & OS – HW Watchdog
Avalue MX1900J
Intel® Bay Trial Mini-ITX
• Intel® quad-core CPU
• 1x Intel® i211-AT GBE LAN
• Fanless and thin (low profile)
• 12V DC Power
• Dual Display via DP, VGA, and/or 18/24-bit
• 1x Full Size Mini-PCIe with mSATA Support
dual-channel LVDS
• 1x Half Size Mini-PCIe
• 4x USB 3.0, 4x USB 2.0
Avalue ECM-BYT E3845
Intel® Bay Trial 3.5” SBC
• Intel® Celeron®/AtomTM SOC CPUs
• 12V DC Power
• Up to 8GB DDR3L 1066/1333 SDRAM
• 1x Mini-PCIe with mSATA Support
• Dual View, 2-CH LVDS, CRT, HDMI
• Optional Built-in Touch Screen Interface
• 2x GBE LAN
• Fanless and thin (low profile)
• HD Audio
• 1x CF, 1x SATA II, 1x Mini-PCIe, 1x USB 3.0, 5x
USB 2.0, 4x COM, 8-bit GPIO
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Graphics Cards
Graphics Processing Unit
• AMD Radeon E8860 GPU
• 1125 MHZ / 4.5 Gbps
Max. Frequency
• 625 MHz GPU Frequency
• 128-bit wide, 2 GB, GDDR5
• ATX form factor (145 x 111 mm)
Display Interface
• PCI Express 3.0 (x1, x2, x4, x8, x16)
• 5x Mini Display Port 1.2
• 640 shaders units
with latching
• DirectX 11.1
• Shader Model 5.0
• OpenGL 4.1+ and OpenCL 1.1/1.2+
• UVD for H.264, VC-1, MPEG-2/4,
AMD E6760
Graphics Processing Unit
• AMD Radeon E6760 GPU
• 800 MHz / 3.2 Gbps
• 600 MHz GPU Frequency (max) • 128-bit wide, 1 GB,
• ATX Form Factor (168 x 69 mm)
GDDR5, 51.2 GB/s
• PCI Express 2.1 (X16)
Display Interface
• DirectX 11
• 4x Mini Display Port 1.2
• Shader Model 5.0
• OpenGL 4.1
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with latching
GT 630 (GF108-300)
• NVIDIA GT630 (GF108-300) GPU
• 96 CUDA Cores
• 700 MHz max GPU Operating Frequency
• Memory Operating Frequency (max) 500 MHz / 1 Gbps
• Low profile Form Factor (14.48X 11.12 cm)
• 128-bit wide, 1 GB, DDR3
• PCI Express 2.0 (X16)
• VGA, DVI-I and 1x HDMI
• 3x Displays Supported - Dual Link DVI-I, HDMI, VGA
• PCI-Express 3.0 x16
• Low Profile (144X68.9MM
• Cores 512 Processor Cores
• Supported NVIDIA Technologies:
• GPU Clock 1020 MHz
TXAA, GPU Boost 2.0, PhysX, Adaptive Vertical Sync,
• 1024 MB GDDR5
CUDA, FXAA, OpenCL, OpenGL 4.4 , 3D Vision Ready
• 128-bit, 1250MHz Memory Clock
2, SLI, SHIELD Ready
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AMD eKabini
AGX30 Gaming Box Specification
• AMD eKabini GX-210JA, Dual core 1.0 GHz,
• Secure RTC Build in EIT chip
• Power Fail detector
• ATI HD8000 series Graphics
• JAMMA 72 Pin Golden Finger External Interface
• TDP 6W
• Edge I/O: Power LED and storage LED, DB-15 VGA0
• mini-ITX (170 x 170 mm)
connector, Optional VGA2, 1x RJ45 LAN connector
• On board DDR3 1GB or 2GB or 4GB
with two LEDs and two USB, Dual Two layer DB9
• RJ45 (10/100M/1000Mbps) LAN
connector, 3.5 Ф Phone Jack, CFSAT slot
• 1 to 255 Seconds / Minutes Programmable Watch Dog
• GPC2800 series Digital I/O IC
• RootSecu® Entry Secured RTC
• SRAM Battery Backup
• 0°C – 55°C, 20 - 80 % humidity Operating Environment
• Intrusion Logger and RTC
AMD Steppe Eagle
AGX50 Gaming Box Specification
Graphics Processing Unit
• AMD Steppe Eagle GX-424CC
Quad Core 2.4Ghz,
• Edge I/O: 32 Isolation Input + 32 High sink current output + 8 meter with feedback, Power LED and storage
• ATI HD8000 series Graphics
LED, DP x 2, up to 4 (optional), 2x RJ45 LAN connector
• TDP=25W
with two LEDs, USB 3.0 x 2, USB 2.0 x, 6 COM ports
• 2 x DDR3 SO-DIMM, up to 16GB
2, 15W audio output, 3.1 channels, CFSAT slot – push-
• 2 x RJ45 (10/100M/1000Mbps)
push type
• 1 to 255 Seconds / Minutes Programmable Watch Dog
• GPC3800 series Digital I/O IC
• RootSecu® Entry Secured RTC
• Up to 8MB,Battery Backed SRAM
• 0°C – 55°C, 20 - 80 % humidity Operating Environment
• SPI and iButton interface
14 | www.msc-technologies.eu
Intel Haswell
Industrial PC Specification
Embedded Mainboard
Mechanical Enclosure
• Intel Core™ i3-4330TE 2.4 GHz / 4MB /
• Solid high-quality industrial case
HD4600 / 2 Cores
• Incl. 2 x 8 cm system cooler fan,
• Up to 16 GB DDR3 RAM, 1600/1333 MHz,
4 GB equipped
temperature controlled
• Air filter easy replaceable (hot plug)
• Intel Q87 chipset
• Control LEDs
• Intel I217LM GigaBit LAN, Intel AMT 9.0
• Power supply:
• (remote maintenance)
• internal 220 Watt power supply, 100 - 240 Volt AC
• Intel I210AT GigaBit LAN, PCIe
• Dimensions WxDxH: 330 x 206 x 88 mm
• Intel HD4600 graphic (integrated in processor)
shared memory up to 1024 MB (Intel DVMT)
external 1 x DVI-I, 2 x DisplayPort 1.2
• Realtek ALC671 audio controller,
HD Audio, 5.1 CH
• Serial ATA for 5 SATA III 600,
• Operating temperatures: 0° ~ 50° C
• 1 x PCI Express x16 expansion slot (low profile) for
half-size cards
• 120 GB mSATA III quality SSD
(Solid State Drive) or larger
• 2 years warranty, burn-in, CE-compliant
• RAID 0, 1, 0+1, 5 configurable for all connectors
• 2 serial ports
(1 x RS232, 1 x RS232/RS422/RS485)
• 5 x USB 3.0 (2 x external, 2 x internal, 1 x stick)
• 8 x USB 2.0 (6 x external, 2 x internal), 2 x PS/2
• 1 x Mini-PCI-Express x1 slot (full-size)
or 1 x mSATA III
• 1 x Mini-PCI-Express x1 slot (half-size)
incl. USB 2.0
• CPU Intel® Core™ i5-4570TE 2.7 GHz / 4MB /
HD4600 / 2 Cores
• CPU Intel® Core™ i7-4770TE 2.3 GHz / 8MB /
HD4600 / 4 Cores
• 2.5“ HDD/SSD (Solid State Drive)
• Drive bay for 2 x 2.5“ removable HDD/SSD
(Solid State Drive)
• Power supply: internal 120 Watt power supply,
12/24 Volt DC
• Mounting rail or 19“ mounting angles (2 U)
www.msc-technologies.eu | 15
Intel Haswell
Industrial PC Specification
Embedded CPU Board
Mechanical Enclosure
• Intel Atom™ E3845 1.91 GHz /
• Solid high-quality industrial case
2MB / HD / 4 Cores
• Control LEDs
• (formerly known as Bay Trail-I)
• Power supply:
• Up to 8 GB DDR3L RAM, 1333 MHz,
- 12/24 VDC input
4 GB equipped
- via ext. power supply 100 - 240 VAC
• 2 x Intel I210IT GigaBit LAN, PCIe
• Incl. mounting rails
• Intel HD graphic (integrated in processor)
• Dimensions WxDxH: 200 x 200 x 51 mm
• shared memory up to 1024 MB (Intel DVMT)
• Operating temperatures: 0° ~ 45° C
• VGA, DVI-D and DisplayPort
• 30 GB quality mSATA II SSD (Solid State Drive) or larger
(only 2 ports at once)
• 2 years warranty, burn-in, CE-compliant
• internal Realtek ALC892 audio controller,
HD Audio, 7.1 CH
• Serial ATA for one SATA II 300 drive
• 2.5“ SSD (Solid State Drive)
• (2 x SATA II if no mSATA II drive)
• 4 serial ports
• Wall mount or DIN rail mount
(3 x RS232, 1 x RS232/RS422/RS485)
• 1 x USB 3.0, 4 x USB 2.0
• 2 x Mini-PCI Express x1 slot, internal
• (one slot selectable as Mini-PCI Express x1
or mSATA II)
16 | www.msc-technologies.eu
www.msc-technologies.eu | 17
MSC is uniquely positioned to deliver a range
MSC has established strategic, long-term part-
of gaming specific platforms and be your one
nerships with Intel®, AMD, Phoenix, AMI, Mic-
stop shop partner. Our board and system de-
rosoft, and NVIDIA® enabling premium services
sign competencies combined with state of the
and early implementation of the latest tech-
art production facilities guarantee long lasting
and reliable products. Today our products are
used in various industries including slot ma-
MSC has implemented a unique security con-
chines and gaming devices all over the world.
cept utilizing the TPM as the “Root of Trust” and
BIOS specific functions as the “Chain of Trust”,
MSC is a leading supplier of COM Express™,
ETX , Qseven™ and nanoRISC™ modules and
standard motherboards. All products are
MSC can integrate or assist you in integrating
based on open standards providing you with
these technologies into your gaming and kiosk
plenty of options. The boards and modules
terminal platforms.
utilize the latest embedded technologies including PCI Express®, SATA, USB 3.0, GBE, dual
MSC is your one-stop shop partner for speci-
channel memory interface, 3D graphics con-
fying, designing, component selection, pro-
troller, DP, DVI, etc.
duction, and life cycle management of Secure
Embedded Platforms.
18 | www.msc-technologies.eu
BIOS and Secure Boot
Built-in Security
Built-in Secure Booting
New technologies
In many of our COM products we have imple-
MSC continuously improves its BIOS solutions
mented the most advanced BIOS technologies
with new functions and technologies, such as
such as UEFI architecture plus MSC Secure Boot
UEFI, Intel® Virtualization Technology, VT-d Vir-
enhancements. Using encryption algorithms,
tualized I/O Support, Intel® Advanced Manage-
digitally signed storage devices and a Trusted
ment Technology and Intel® Trusted Execution
Platform Module (TPM) these products pro-
Technology. Continuous improvement of secu-
vide full TCG (Trusted Computing Group) com-
rity functions is also one of the most challeng-
pliance and additional security against attacks,
ing tasks to meet the growing demand for safer
protection from software theft or misuse.
embedded systems. MSC is maintaining user
friendly interfaces, such as EPI (Extended Pan-
BIOS customization
el interface) and EAPI (Embedded Application
Our BIOS solutions have been adapted to our
Programming Interface) to allow low-level con-
customers’ special industrial requirements,
trol of non-volatile memory, I2C bus, backlight,
such as flat panel display support, booting
watchdog timer etc.
from various devices, extensive power and
thermal management or initialization
Public Key System BIOS
Check signature
Signature System BIOS
Public Key MBR, Boot Loader
Check signatures
Signature MBR
Signature Boot Loader
Public Key OS etc. (optional)
Check signature
Signature OS etc.
www.msc-technologies.eu | 19
Intelligent Solutions
MSC Technologies GmbH
MSC Technologies Systems GmbH
Industriestraße 16
Munzinger Straße 3
Phone +49 7249 910 - 0
76297 Stutensee
79111 Freiburg im Breisgau
AUSTRIA (also responsible for Slovenia)
Pascalstr. 21
Phone +49 2408 709 0
Aredstrasse 13
52076 Aachen
A - 2544 Leobersdorf
Tempelhofer Ufer 37
Phone +49 30 720089 0
Industriestr. 25
10963 Berlin
CH - 8604 Volketswil
Phone +49 211 92593 0
Stadionstraat 2, 6th fl
Phone +49 761 88190
Phone +43 (2256) 63975-13
Phone +41 43 355 33 66
Phone +31 76 5722 400
40699 Erkrath
NL - 4815 NG BREDA
CZECH REPUBLIC (also responsible for Poland and Slovakia)
Gaußstraße 10
Phone +49 5132 5099 680
Nádražní 2369/10
31275 Lehrte
CZ - 678 01 Blansko
Rudolstädter Str. 68a
Phone +49 3641 6825 0
Budafoki út 91-93 West Irodahaz
07745 Jena
H - 1117 Budapest
Heerstraße 27-31
Phone +49 6122 5871 460
Inonu Cd. Seylan Is Merkezi 83/6 Kozyatagi
56179 Vallendar
TR - 34736 Istanbul
Torfstecherring 6
Phone +49 621 58649 113
R - 077190 Ilfov (Bucharest)
Phone +49 89 15798-0
Calle Chile 10, 2nd Planta, Oficina 222
81249 München
ES - 28290 Las Matas, Madrid
Fermín Calbetón Nº4 Planta 3
Zeppelinstr. 1a
Phone +49 8165 906 100
Phone +36 1 436 72 29
Phone +90 216 411-2333
Construdava Business Center S¸os. Pipera-Tunari 4c Voluntari
67067 Ludwigshafen
Am Loferfeld 50a
Phone +420 516 411 494-15
Phone +40 21 529 6911
Phone +34 91 721 69 51
Phone +34 943 257 105
ES - 20600 Eibar (Guipúzcoa/Basque)
85375 Neufahrn bei Freising
Phone +49 911 43970 0
90471 Nürnberg
Gutenbergstraße 15
Phone +49 711 78260 380
70771 Leinfelden-Echterdingen
Borsigstraße 36
Phone +49 6122 5871 222
65205 Wiesbaden
[email protected]
© MSC Technologies. All rights reserved. Although great care has been taken in preparing this printed matter, MSC can not be held responsible for any errors or omissions.
All information in here is subject to change without notice. All hardware and software names used are trade names and/or trademarks of the respective manufacturer.
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