Intel STL2 Server Board Memory List Test Report Summary

Intel STL2 Server Board Memory List Test Report Summary
Intel® STL2 Server Board
Memory List Test Report Summary
Revision 59.0
April, 2003
Revision History
Date
Rev
Sept/00
0.5
Modifications
Initial post-launch release for review.
Sept/00
1.0
Release
Oct/00
2.0
Added Dataram 128MB part. Added Silicon Tech & Simple Tech 256MB parts. Added Viking & ATP
Electronics 512MB parts. (In shaded area).
Oct/00
3.0
Added Hyundai, Micron & Samsung 128MB parts. Added ATP Electronics, Kentron & Samsung
256MB parts. (In shaded area).
Nov/00
4.0
Added Dataram 256MB & 512MB parts. Added Viking, Corsair and Kingston 256MB parts. Added
Dan-Elec, ATP, Silicon Tech, Simple Tech & Infineon 128MB parts. Added Legacy Elec. 1GB part.
Made correction on Hyundai 128MB part. Added Distributor information. (In shaded area).
Nov/00
5.0
Added Kingston 128MB part. (In shaded area).
Dec/00
6.0
Part number correction for Legacy Elec. Removed Infineon 1G part. Added Corsair 256MB part.
Added Dataram 128MB part. (In shaded area).
Dec/00
7.0
Added Micron & Dane-Elec 64MB parts. Added Samsung & ATP Electronics 128MB parts. Added
Dataram, ATP Electronics & Legacy Electronics 256MB parts. Added Dane-Elec, ATP Electronics &
Corsair 512MB parts. Added Samsung 1G part. (In shaded area).
Jan/01
8.0
Added Samsung, ATP Electronics & Viking 256MB parts. Added ATP Electronics & Aved Memory
Products 128MB parts. Added ATP Electronics 512 & 1G parts. (In shaded area).
Jan/01
9.0
Added Viking 128MB part. Added Silicon Tech & Simple Tech 256MB parts. Added Virtium
Technology Inc., Kingston GolenRAM, Simple Tech, Silicon Tech, Unigen, Aved Memory Products,
nd
Dataram & Corsair 512MB parts. Added 2 part number for Viking 256MB part. (In shaded area).
Feb/01
10.0
Added Dane-Elec, Micron & Samsung 128MB part. Added Aved Memory Products, & Infineon
256MB part. Added Dataram 512MB part. (In shaded area).
Mar/01
11.0
Added Corsair 256MB & 1G parts. Added Viking 256MB part. Added Legend 512MB part. Added
Aved Memory Products 256MB part. Added Dane-Elec 256MB parts. Added Samsung 64MB, 128MB,
256MB & 512MB parts. Made correction for Samsung 1G part. (In shaded area).
April/01
12.0
Added Dane-Elec 1G & 128MB part. Added Aved Memory Products 256MB part. Added Itaucom
128MB parts. Added Avant Technology 256MB part. Added GoldemRAM 64MB & 128MB part. Added
Dataram 512MB part. (In shaded area).
May/01
13.0
Correction on vendor name from Legend to Legacy Electronics Inc. for 512MB part. Correction made
for ATP 1G part, this part is low profile. Wrong listing for Aved Memory Products 256MB part, moved
from 128MB part section. Correction on vendor name from Aved Memory Products to GolenRAM
256MB part. Added Aved Memory Products, Aved Memory Products & Virtium Technology Inc, &
PYN 256MB parts. Added Dane-Elec & Samsung 128MB part. (In shaded area).
June/01
14.0
Added Datram 512MB & 1G parts. Added Dane-Elec 256MB part. Added Legend 512MB part. Added
Kingston 1G part. Added Legacy Electronics Inc.1G part. Added Avant Technology 512MB part.
Added Itaucon 256MB part. Added ATP Elec. 512MB part. Added Ramaxel Technology Limited
128MB part. Added Infineon 256MB part. (In shaded area).
June/01
15.0
Added ATP Electronics 256, 512 and 1GB parts, Centon’s 512MB part, Dataram 256MB and 1GB
parts, Ituacom 256MB part, Kingston 1GB part, PNY 256 and 512MB parts, Simple Tech 512MB part,
Viking 256 and 512MB parts. Added Infineon 256MB, 512MB & 1G parts. Added Samsung 256MB &
512MB parts. (In shaded area).
June/01
16.0
Added Dataram 256MB, Ramax 256 & 512MB, Micron 256MB, PNY 1GB parts. (In shaded area)
June/01
17.0
Added Dataram 256MB, PNY 128 & 256MB, Avant Technology 512MB, ATP 1GB parts. Correction
made on Infineon 256MB part & added new part. (In shaded area)
June/01
18.0
Added PNY 128MB, Micron 128MB, ATP Electronics 1GB, Ventura Technology 256MB, Dataram
512MB parts. (In shaded area).
July/01
19.0
Added Dataram 128MB, ATP 256MB parts. (in shaded area).
July/01
20.0
Added Simple Tech 1GB part. (In shaded area).
July/01
21.0
Added Aved 128MB part. (In shaded area).
Aug/01
22.0
Added Dataram 256MB part. (In shaded area).
Aug/01
23.0
Added Apacer 256MB and 1GB parts. (In shaded area). Made corrections to Itaucom part #’s.
Aug/01
24.0
Added Micro Memory Bank 256MB and 512MB parts, Apacer 512MB parts. (In shaded area)
Aug/01
25.0
Added Micron 1GB, Dane 256MB, PNY 512MB parts. (In shaded area)
Aug/01
26.0
Added Ventura Technology 512MB parts (in shaded area) and updated Vendor Information.
Sept/01
27.0
Added Kingston 1GB, Dane 256mb (in shanded area).
Revision History
Date
Rev
Oct./01
28.0
Modifications
Added Legend 256, 512MB and 1G. Dataram 256MB part. Added Century Micro 512MB Correction
on Kentron 1G part. (in shaded area).
Oct./01
29.0
Added Peripheral Enhancements 256MB part. Added Legend 256MB part. Added Viking 1GB part.
(in shaded area).
Nov./01
30.0
Added ATP 1GB, 256MB and 128MB parts, Netlist 1GB parts, Viking 1GB parts, Dataram 256MB part,
Aved 512MB and 256MB parts. (In shaded area)
Dec./01
31.0
Added Aved 128 and 256MB parts. Smart 256MB parts. Dataram 512MB part. Legend 1GB part. (In
shaded area)
Jan./02
32.0
Added Dataram & Samsung 512MB parts. (In shaded area)
Jan./02
33.0
Added Samsung 1G part. (In shaded area)
Jan./02
34.0
Added Dataram 256MB & 1G parts. Legend 512MB part. (In shaded area)
Feb./02
35.0
Added Dataram 256MB parts. Added SMART Modular 256MB, 512MB & 1GB parts. (In shaded area)
Feb./02
36.0
Added Dataram 512MB & 1GB parts. (In shaded area)
Mar./02
37.0
Added Dataram 512MB part. Samsung 128MB & 125MB parts. (In shaded area)
Mar./02
38.0
Added ATP 256MB parts. Added Dataram 256MB parts. (In shaded area)
April/02
39.0
Added MSC 512MB parts. Updated Dataram part numbers (~ noted by this symbol).
April/02
40.0
Added Dane-Elec & Dataram 256MB parts. (In shaded area)
May/02
41.0
Added Dataram 128MB parts. Added TechnoLinc 256MB parts. Added MSC 512MB parts. Added
Samsung 128MB, 256MB & 512MB parts. Added Micron 512MB part. Added Infineon 128MB part.
(In shaded area).
May/02
42.0
Added Aved 256MB parts. (In shaded area)
May/02
43.0
Added MSC 256MB parts. (In shaded area)
June/02
44.0
Added Dataram 1GB parts. Added Technolinc 512MB parts. (In shaded area)
June/02
45.0
Added Beijing Winward 256MB parts. (In shaded area)
July/02
46.0
Added Buffalo 512MB parts. Added Dataram 256MB & 512MB parts. (In shaded area)
July/02
47.0
Added Buffalo 256MB parts. (In shaded area)
Aug/02
48.0
Added MSC 256MB parts. (In shaded area)
Aug/02
49.0
Added Dataram 512MB & 1GB parts. Added Kingston 1GB parts. (In shaded area)
Sept/02
50.0
Added Dataram 1GB parts. Added MSC 512MB parts. (In shaded area)
Sept/02
51.0
Added MSC 256MB & 512MB parts. (In shaded area)
Oct/02
52.0
Added Dataram 256 & 512MB parts. Added Legend 256MB parts. Added MSC 512MB parts. (In
shaded area)
Oct/02
53.0
Added Dataram, Legend & MSC 512MB parts. (In shaded area)
Nov/02
54.0
Added Avant 1GB parts. Added Dataram 256MB & 512MB parts. Added MSC 512MB parts. (In
shaded area)
Dec/02
55.0
Added MSC 1GB parts. Added Avant 512MB parts. (In shaded area)
Jan/03
56.0
Added Avant & Dataram 1GB parts. Added ATP 512MB parts. (In shaded area)
Jan/03
57.0
Added Avant 1GB parts. (In shadeda area)
Feb/03
58.0
Added Buffalo 256MB & 512MB parts. (In shaded area)
Apr/03
59.0
Added Avant 512MB parts. (In shaded area)
INTEL DISCLAIMS ALL LIABILITY FOR THESE DEVICES, INCLUDING LIABILITY FOR
INFRINGEMENT OF ANY PROPRIETARY RIGHTS RELATING TO THESE DEVICES OR THE
IMPLEMENTATION OF INFORMATION IN THIS DOCUMENT. INTEL DOES NOT WARRANT
OR REPRESENT THAT SUCH DEVICES OR IMPLEMENTATION WILL NOT INFRINGE SUCH
RIGHTS. INTEL IS NOT OBLIGATED TO PROVIDE ANY SUPPORT, INSTALLATION, OR
OTHER ASSISTANCE WITH REGARD TO THESE DEVICES.
THE INTEL PRODUCT REFERRED TO IN THIS DOCUMENT IS INTENDED FOR STANDARD
COMMERCIAL USE ONLY. CUSTOMERS ARE SOLELY RESPONSIBLE FOR ASSESSING
THE SUITABILITY OF THE PRODUCT AND/OR DEVICES FOR USE IN PARTICULAR
APPLICATIONS. THE REFERENCED INTEL PRODUCT IS NOT INTENDED FOR USE IN
CRITICAL CONTROL OR SAFETY SYSTEMS OR IN NUCLEAR FACILITY APPLICATIONS.
Information in this document is provided in connection with Intel products. No license, express or
implied, by estoppel or otherwise, to any intellectual property rights is granted by this document
or by the sale of Intel products. Except as provided in Intel's Terms and Conditions of Sale for
such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied
warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right. Intel products are not intended for use in medical, life saving, or life
sustaining applications. Intel retains the right to make changes to its test specifications and
memory list at any time, without notice.
The hardware vendor remains solely responsible for the design, sale and functionality of its
product, including any liability arising from product infringement or product warranty. Only
approved software drivers and accessories that are recommended for the revision number of the
boards and system being operated should be used with Intel products. Please note that, as a
result of warranty repairs or replacements, alternate software and firmware versions may be
required for proper operation of the equipment.
The STL2 Server Board may contain design defects or errors known as errata which may cause
the product to deviate from published specifications. Current characterized errata are available
on request.
Copyright © Intel Corporation 2003.
* Other brands and names are the property of their respective owners.
Please Note: DIMM devices with gold contacts should NOT be placed into DIMM sockets with
tin-lead contacts or vice-versa. Mixing dissimilar metal contact types has been shown to result in
unreliable memory operation. Intel recommends similar manufacturer and similar speeds in each
bank on the memory module. Mixing of dissimilar memory manufacturer and similar speeds in
each bank on the memory module is NOT recommended
Table of Contents
OVERVIEW OF MEMORY TESTING .....................................................................................................6
REGISTERED, ECC, 133MHZ SDRAM DIMM MODULES
64MB SIZES (8MX72)..................................................................................................................................8
REGISTERED, ECC, 133MHZ SDRAM DIMM MODULES
128MB SIZES (16MX72)..............................................................................................................................9
REGISTERED, ECC, 133MHZ SDRAM DIMM MODULES
256MB SIZES (32MX72)............................................................................................................................11
REGISTERED, ECC, 133MHZ SDRAM DIMM MODULES
512 MB SIZES (64MX72)...........................................................................................................................15
REGISTERED, ECC, 133MHZ SDRAM DIMM MODULES
1G SIZES (64MX72)...................................................................................................................................19
SALES INFORMATION............................................................................................................................22
CMTLSM (COMPUTER MEMORY TEST LABS)................................................................................24
INTEL® PRODUCT DEALERS AND PRODUCT INTEGRATORS ..................................................24
Overview of Memory Testing
The following procedure is used to test memory modules for use in the Intel® STL2 Server Board.
Memory is a vital subsystem in a platform. Intel Corporation requires strict guidelines to be met
before a memory vendor and part is put onto the qualified memory list. Each Intel Server Board
product has a separate qualified memory list.
Memory qualification for Intel®’s Server Board products is performed by Intel’s Memory Validation
Laboratory (MVL), and by an independent external test laboratory, Computer Memory Test Lab
(CMTL)1. CMTL is a leading memory testing organization responsible for testing a broad range
of memory products. Memory devices tested by Intel’s MVL or CMTL must undergo rigorous
tests to ensure that the product will perform the intended server functions.
Intel®’s Server and Workstation Board qualified memory lists categorize memory modules as
Advanced Tested. The Advanced Testing process involves a paper qualification, a standard
voltage and room temperature functional test, and a voltage and temperature margin functional
test. A paper qualification is a review of critical timings, electrical characteristics, timing
requirements, environmental requirements, and packaging requirements in order to see if the
memory meets Intel’s memory specifications. The standard voltage and room temperature test
involves testing the memory module on the particular Intel® board for which it is being qualified
with test software operating under Microsoft* Windows*2000 Advanced Server for no less than
24 hours. The voltage and temperature margin testing involves testing the memory module on
the particular Intel board for which it is being qualified with various test software and operating
systems for 48-72 hours under various voltage and temperature margin conditions. Memory
modules that have completed Advanced Testing are known to be compatible with the product on
which they were tested, and with the test software and operating system that was utilized during
the test procedure.
For information regarding the testing procedure required to reach each phase, please contact
your Intel Representative.
1
CMTL is a leading memory testing organization responsible for testing a broad range of memory
products. Receiving a “PASS” after being tested by CMTL, means that a product functions
correctly and consumers can use it to perform the intended server functions. In order to pass
these stringent standards, memory products must maintain the highest manufacturing procedures
and pass an exacting battery of tests. Testing is performed with equipment and a procedure as
defined by Intel’s various functional testing levels. CMTL contact:
John Deters
714-960-1243 (voice)
714-960-4695 (fax)
Computer Memory Test Lab (CMTL)
101 Main Street, Suite 2G
Huntington Beach, CA 92648
http://www.cmtlabs.com/
Qualified Memory for the STL2 Server Board
The memory module on the STL2 server board has 4 DIMM sockets, which can hold up to 4 GB
of Registered ECC PC133 memory using four 72 bit DIMM modules. The following memory
features are supported:
•
•
•
133 MHz, Registered ECC PC-133 compatible 3.3V registered SDRAM modules (in
compliance with the PC-133 Registered DIMM Specification)
DIMMs with capacity of 64MB, 128MB, 256 MB, 512 MB and 1G. Other DRAM sizes may
function correctly but will not be validated.
Minimum configuration is 64MB using one 64MB DIMM.
Below is a chart that lists the current supported memory types: Note:
PC-133 Registered SDRAM Module Configurations for Cas Latency 2 & 3
DIMM
DIMM
Capacity Organization
SDRAM
Density
SDRAM
Organization
# SDRAM
# Address bits
Devices/rows/Banks rows/Banks/column
64MB
8M x 72
64Mbit
8M x 8
9/1/4
12/2/9
128MB
16M x 72
64Mbit
16M x 4
18/1/4
12/2/10
128MB
16M x 72
64Mbit
8M x 8
18/2/4
12/2/10
128MB
16M x 72
128Mbit
16M x 8
9/1/4
12/2/10
256MB
32M x 72
64Mbit
16M x 4
36/2/4
12/2/10
256MB
32M x 72
128Mbit
32M x 4
18/1/4
12/2/11
256MB
32M x 72
128Mbit
16M x 8
18/2/4
12/2/10
256MB
32M x 72
256Mbit
64M x 4
9/1/4
13/2/11
256MB
32M x 72
256Mbit
32M x 8
9/1/4
13/2/10
512MB
64M x 72
128Mbit
32M x 4
36/2/4
12/2/11
512MB
64M x 72
256Mbit
64M x 4
18/1/4
13/2/11
512MB
64M x 72
256Mbit
32M x 8
18/2/4
13/2/10
1GB
128M x 72
256Mbit
64M x 4
36/2/4
13/2/11
Memory features are detailed in the STL2 Server Board Technical Product Specification
available on-line at http://support.intel.com/support/motherboards/server/STL2/
The following table lists DIMM devices known to be compatible with the Intel STL2 Server Board.
Intel recommends that Advanced Tested DIMMs be used to establish reliable system operation.
DIMM devices not listed can be used; but, in the event of unreliable system operation, the DIMM
devices should be replaced with functionally Advanced Tested DIMMs to determine whether the
DIMM devices are causing the problem.
Caution: Third party memory vendors may use the same module part number with different
DRAM vendors and die revisions. To insure proper system operation, verify that each DRAM
vendor and die revision has been separately tested and qualified. Please notify CMTL if there is a
discrepancy.
Note: This list is not intended be all-inclusive. It is provided as a convenience to Intel’s general
customer base, but Intel does not make any representations or warranties whatsoever regarding
the quality, reliability, functionality, or compatibility of these memory modules.
This list is subject to change without notice.
STL2 Server Board
Registered, ECC, 133MHz SDRAM DIMM Modules
64MB Sizes (8Mx72)
Manufacturer
Part Number
Hyundai
Samsung
HYM7V73AC801BTHG75
M390S0823DT1-C75
9/12/00
3
Micron
MT9LSDT872G-133C3
10/30/00
3
+Dane-Elec
DP133R072083A
Samsung
M390S0823ET1-C75
+GoldenRAM
7550010-GR
DRAM Part Number
NT56V6610C0T-75
MT48LC8M8A2-7.5
rev C
DRAM
Vendor
Nanya
Micron
PCB Part
Number
Date
CMTL
CAS
Low EOL
Test # Latency Profile
9/21/00
3
16-25600B
12/09/00 B767
rev B
3/5/01
10302383/27/01 B630
001A rev A
3
3
+ This vendor is part of the CMTL Gold or Advance Certification program. This means this part has/will been tested
across all compatible Intel Server Boards. For further information contact CMTL @ http://cmtlabs.com/
STL2 Server Board
Registered, ECC, 133MHz SDRAM DIMM Modules
128MB Sizes (16Mx72)
Manufacturer
Part Number
Hitachi
HB52F169E1-75F
9/21/00
Hyundai
HYM7V73AC1601BTNG75
M390S1620DT1-C75
9/21/00
3
9/12/00
3
Samsung
+Dataram
DTM60158
DRAM Part
Number
MT48LC16M8A2
TG-75 rev B
DRAM
Vendor
Micron
PCB Part
Number
40484 rev A
Date
10/9/00
Micron
MT9LSDT1672G-133B1
10/12/00
Infineon
+ATP
Electronics
HYS72V16301GR-7.5-C
10/26/00
K4S280832BSR168L08V
AR16V72L8S4GAS
TC75 rev B
Samsung
rev 1
D45128841G5Silicon Tech INT72R8E16M4H-B75AV
A75
NEC
918 rev A
SINT7216118RD1D45128841G5Simple Tech
75AVG
A75
NEC
918 rev A
D45128441G52025031Kingston
KVR133X72RC3L/128-IS
NEC
A75-9JF
002 rev A00
MT48LC16M8A2
+Dataram
DTM60168
Micron 40506 rev A
TG-75 rev B
Samsung
M390S1723CTU-C75
+ATP
K4S640832DSR168M08V
AR16V72M8S4GAS
Samsung
Electronics
TC75 die D
rev 1
+ATP
K4S640432DSR168N04V
AR16V72N4S4GAS
Samsung
Electronics
TC75 die D
rev 2
+AVED Memory
AMP377P1723AT2HY57V28820AT105399 rev
Hyundai
Products
C75/H
H rev A
B
UPD45128841G5
+Viking
INT12818
NEC
9001689G
-A75-9JF
K4S280832ASRBF 2568
+Dane-Elec
DP133R072163EL
Samsung
TC75
rev A
Samsung
M390S1723CT1-C75
MT18LSDT1672GMicron
133C2
MT48LC16M4A2DE0401 rev
+Dane-Elec
DP133R072163C
Micron
75
A
ICMM16M6872A6MCRITAUCOM
ICM4V280806-5 Itaucom 4200-06A2
5Q
MT48LC8M8A21030238+GoldenRAM
7550020-GR
Micron
75 rev C
001A rev A
Continued
CMTL
CAS
Low EOL
Test # Latency Profile
3
B547
3
3
3
Yes
3
Yes
3
Yes
10/18/00
B549
10/19/00
B573
10/19/00
B574
11/9/00
B728
3
Yes
11/20/00
B722
3
Yes
3
Yes
12/4/00
12/09/00
B833
3
12/22/00
B929
3
Yes
12/29/00
B762
3
Yes
1/8/01
C035
3
1/30/01
B945
Yes
1/31/01
3
2/1/01
3
3/7/01
C534
3
3/27/01
C478
3
4/201
B633
3
Registered, ECC, 133MHz SDRAM DIMM Modules
128MB Sizes (16Mx72) (Continued)
Manufacturer
Part Number
+Dane-Elec
DP133R072163C
Ramaxel
Technology
Limited
RMD311S18B4T-7
DRAM Part
Number
DRAM
Vendor
TC59S6404CFT75
Toshiba
HYB39S128800C
Infineon
T-75 rev C
7216ZHSTM4G13TWI- TC59SM708AFTToshiba
PK0
75 rev A
7216ZHSTM4G13TWI- HYB39S128800C
+PNY
Infineon
PH0
T-7.5 rev C
MT48LC32M4A2Micron
MT9LSDT1672G-133B1
Micron
75
DTM60168C (Old Part# MT48LC16M8A2
+Dataram
Micron
DTM60168(M))
TG-75 rev E
MT48LC16M8A2
+Dataram
DTM60158(60158Z)(M)
Micron
TG-75 rev E
+Aved Memory
AMP377P1723AT2MT48LC16M8A2
Micron
Products
C7B/MI
TG-7E rev A
+ATP
K4S280832DAR16V72L8S4GAS
Samsung
Electronics
TC75 rev D
+Aved Memory
AMP377P1723DT2K4S280832DSamsung
Products
C75/S
TC75 rev D
+PNY
PCB Part
Number
168327201C
rev C
Date
CMTL
CAS
Low EOL
Test # Latency Profile
10/30/00
B647
3
5/21/01
D063
3
6/18/01
C127
3
YES
6/24/01
C187
3
YES
0129 rev A
6/24/01
D839
3
40506 rev A
7/9/01
D693
3
40484 rev A
7/9/01
D701
3
D006
3
Yes
F204
3
Yes
E916
3
Yes
RPD118208
0R62 rev 2
40000494
rev A
40000494
rev A
105399 rev
7/24/01
B
SR168L08V
11/01/01
rev 1
105399 rev
11/14/01
B
Samsung
M390S1620ET1-C75
K4S6408232ETC75
Samsung
2/14/02
3
Samsung
M390S1620FT1-C7A
K4S640432FTC75
Samsung
2/6/02
3
Infineon
HYS72V16301GR-7.5C2
Infineon
3/22/02
3
+Dataram
DTM60168D
HYB39S128800C
Infineon
T-75 rev C
40506 rev A
4/21/02
I187
3
Modules shaded in blue are low profile
+ This vendor is part of the CMTL Gold or Advance Certification program. This means this part has/will been tested
across all compatible Intel Server Boards. For further information contact CMTL @ http://cmtlabs.com/
Caution: Some modules on this list may contain “stacked” DRAM parts. These parts may
have thermal & physical limitations in some chassis configurations. It is advised to verify that
your chassis configuration will support “stacked” parts before purchase.
Yes
Yes
STL2 Server Board
Registered, ECC, 133MHz SDRAM DIMM Modules
256MB Sizes (32Mx72)
Manufacturer
Part Number
Kentron
KT3272SSN3R-07L
Silicon Tech
INT72R8F32M8HB75AV
SINT7232218RD175AVG
M390S3320BT1-C75
Simple Tech
Samsung
+ATP
Electronics
AR32V72L8S8GAS
DRAM Part Number
48LC32M4A2
DRAM
Vendor
Micron
PCB Part
Number
1672SSR2
CMTL
CAS
Low EOL
Test # Latency Profile
9/12/00
3
YES
K4S560832B-TC75
Samsung
00918 rev A
10/9/00
B575
K4S560832B-TC75
Samsung
00918 rev A
10/9/00
B576
YES
10/12/00 B550
YES
K4S560832A-TC75 Samsung SR168L08V
die A
rev 1
MT48LC32M4A2TG+Dataram
DTM60125
Micron
40481 rev A
75 rev B
INT25621 And
K4S560832A-TC75
+Viking
Samsung 9001689 rev A
rev A
PC13332X72RCL3-IA
KVR133X72RC3/2562022254-001
Kingston
TC59SM704FT-75
Toshiba
IS
rev A00
MT48LC32M4A2TG50-00096 rev
Corsair
CM766S256-133/M
Micron
75 rev B
A
2025031-002
KVR133X72RC3L/256- TC59SM808BFTKingston
IS
75
Toshiba
rev A00
K4S560832A-TC75
50-00104 rev
Corsair
CM764S256ALP-133/S
Samsung
rev A
B
~DTM60172D (Old
HYB39S256800CT+Dataram
Infineon
40506 rev A
Part# DTM60172)
7.5 rev C
SR168M08V
+ATP
K4S280832B-TC75
Samsung
rev 1 Aug
AR32V72M8S4GAS
Electronics
rev B
2000
Legacy
LE32872R rev
37L6HS0R-1HAG
LES32808TA-7.5
Legacy
Electronics Inc.
A
Samsung
M390S3253BTU-C75
+ATP
K4S280432B-TC75
SR168N04V
AR32V72N4S4GAS
Samsung
Electronics
rev B
rev 2
+Viking
INT25624
HY57V28820AT-H
Hyundai 9001742 rev A
INT72R8E32M4HSilicon Tech
K4S280832C-TC75 Samsung
814
A75AV
SINT7232118RD2Simple Tech
K4S280832C-TC75 Samsung
814
75AVG
Infineon
HYS72V32300GR-7.5
Continued
Date
3
YES
10/11/00
10/21/00 B545
10/25/00 B544
3
10/25/00 B554
10/30/00 B581
11/9/00
B729
3
Yes
11/18/00 B726
Yes
12/5/00
B724
Yes
12/5/00
B812
12/7/00
B831
Yes
12/11/00
3
Yes
12/21/00 B891
3
Yes
12/22/00 B887
3
1/25/01
C193
3
1/25/01
C196
3
1/25/01
3
Registered, ECC, 133MHz SDRAM DIMM Modules
256MB Sizes (32Mx72) (continued…………)
Manufacturer
Part Number
Samsung
M390S3320CT1-C75
Corsair
CM766S256-133/S
+Viking
INT25624
+AVED
Memory
Products
AMP377P3323AT2C75/H
+Dane-Elec
DP133R072323IL
#+GoldenRAM
7550030-GR
Avant
Technology
+AVED
Memory
Products
Virtium
Technology Inc
+PNY
TNV7232837A3EE0
AMP377P3253BTEC75/S
DRAM Part
Number
K4S280432CTC75
HY57V28820AT-H
rev. A
HY57V28820AT-H
rev A
K4S560832BTC75
MT48LC16M8A275
MT48LC32M4A2
REV. B
K4S560832BTC75 REV.B
K4S280432CTC75
7232ZHSTM4G24TWR- TC59SM708AFTPK0
75 REV. A
VM375S3320E-GAS
DRAM
Vendor
PCB Part
Number
Date
2/5/01
50-00096
Samsung
2/6/01
REV. A-RV1
9001742 rev.
Hyundai
2/13/01
A
Hyundai
Samsung
Micron
Micron
Samsung
Samsung
Toshiba
105352 rev B 2/19/01
16-25140A
rev A
40000476
rev B
C305
3
C463
C484
3
C525
3
Yes
B637
3
Yes
C836
3
2/2/01
C288
3
Yes
1/19/01
C106
3
Yes
4/16/01
C134
3
SRBF 2568
3/1/01
rev. A
10302383/21/01
001A rev A
50135501 rev
3/26/01
A
105399 REV.
B
CMTL
CAS
Low EOL
Test # Latency Profile
3
+AVED
Memory
Products
AMP377P3323AT2C75/MV
V54C3128804VAT
-7 rev. A
MoselVitelic
105352
Rev.B
4/13/01
C518
3
+Dane-Elec
DP133R072323E
HYB39S128800CT
-7.5 rev B
Infineon
16-25600B
rev B
5/11/01
C895
3
Itaucom
4200-06A2
5/24/01
C985
3
Infineon
DIM-168-3703
5/16/01
D170
3
ITAUCOM
Infineon
Infineon
Samsung
Infineon
+ATP
Electronics
+ATP
Electronics
+Dataram
ICMM32M6872A6MCRICM4V280806-5
5Q
HYS72V32301GR-7.5- HYB39S128400CT
C2
-7.5
HYS72V32300GR-7.5
M390S3320CTU-C75
HYS72V32600GR-7.5-C2
AR32V72N4S4GAS
AR32V72N4S4GAS
DTM60172(60172Z)(H)
Continued
K4S280432ATC75 rev A
K4S280432CTC75 rev C
HM5225805BTT75 rev B
Samsung
Samsung
Hitachi
SR168N04V
rev 2
SR168N04V
rev 2
40506 rev A
1/25/01
3
5/22/01
3
5/22/01
3
Yes
5/31/01
D058
3
Yes
5/31/01
D175
3
Yes
6/6/01
C227
3
Yes
Registered, ECC, 133MHz SDRAM DIMM Modules
256MB Sizes (32Mx72) (continued…………)
Manufacturer
ITAUCOM
+PNY
+Viking
+Dataram
Ramax
Micron
+Dataram
Part Number
DRAM
Vendor
PCB Part
Number
ICMM32M6872A6MCRICM4V280806-5
Itaucom
4200-06A2
5Q
7232ZHSTM4G24TWR HYB39S128800CT
40000476
Infineon
-PH0
-7.5 rev C
rev B
K4S560832B-TC75
9001689 rev
INT25628
Samsung
rev B
A
MT48LC32M4A2T
DTM60188(60188Z)
Micron
40506 rev A
G-75 rev B
HYB39S128800CT
RPD118208
RMD311S18B5T-7
Infineon
-75 rev C
0R62 rev 2
MT18LSDT3272GMT48LC32M4A2Micron
0129 rev A
133B1
75
HYB39S128400CT
DTM60188(60188Z)
Infineon 40506 rev A
-7.5 rev C
Ventura
Technology
Group
S26SSJ23MV
ATP Electronics
AMR32V72J4S4GAS
ATP Electronics
AMR32V72F8S4GAS
+Dataram
DTM60125(60125Z)(M)
Apacer
AM256LS52R13301
Micro Memory
Bank
M15M3272-060CCMAU
+Dane-Elec
DP133R072323IL
+Dane-Elec
DP133R072323IL
DTM60125 (68014Z)
(Y)
+Dataram
DRAM Part
Number
MT48LC16M8A2TG75 rev E
K4S280432CTC75 rev C
K4S280832CTC75 rev C
MT48LC32M4A2T
G-75 rev E
K4S280432CTC75
48LC32M4A2TG75
HYB39S256800CT
-7.5
K4S560832B-TC75
HY57V28420AT-H
rev A
HY57V56820T-H
rev A
#Legend
L3272QC3-59AHSC3A
Legend
L1272QC3-HRAHSD3A HY57V56420T-H
#Peripheral
Enhancements
INTEL-00-256M-STL2
Legend
L3272QC3
+Dataram
DTM60188 (60188)
+Aved Memory
Products
+Aved Memory
Products
AMP377P3253ATEC75/MV
AMP377P3323DT2C75/S
Continued
Micron
V204
SR168J 04V
rev 1
SR168F08V
Samsung
rev 1
Samsung
Date
CMTL
Test #
CAS
Low EOL
Latency Profile
5/26/01
C985
3
6/7/01
C120
3
5/26/01
D022
3
6/13/01
C918
3
6/14/01
D071
3
6/14/01
D416
3
6/19/01
C910
3
6/27/01
D759
3
7/2/01
D592
3
7/2/01
D607
3
YES
YES
Micron
40481 rev A
8/1/01
D651
3
Samsung
48.16103.01
2
8/8/01
D398
3
Micron
128MX72R
08/14/01
E285
3
Infineon
DE082030
8/21/01
E236
3
Yes
Samsung
DE082030
651219-G1
rev 1
9/5/01
E220
3
Yes
9/12/01
E459
3
9/10/01
E471
3
E473
3
E611
3
10/06/01
E615
3
11/08/01
E007
3
Yes
11/08/01
E666
3
Yes
11/16/01
E702
3
Hyundai
Hyundai
Hyundai
B5982 rev A
0114-1 rev
10/01/01
A
1672SSR209/27/01
PCB rev 2
K4S280432CSamsung
TC75 rev 4
HYB39S128800CT
Infineon B5982 rev A
-7.5
MT48LC32M4A2T
Micron
40506 rev A
G-75 rev E
V54C3256804VAT- Mosel105399 rev
7 rev A
Vitelic
B
K4S280832D105352 rev
Samsung
TC75 rev D
B
Registered, ECC, 133MHz SDRAM DIMM Modules
256MB Sizes (32Mx72) (continued…………)
Manufacturer
Part Number
+Smart Modular
SM572324574E03R
~DTM60172C (Old
Part# DTM60172(M))
~DTM68014B (Old
Part# DTM68014(M))
+Dataram
+Dataram
+SMART
Modular
Technologies
Samsung
+ATP
Electronics
DRAM Part
Number
K4S280432DTC75
MT48LC32M8A2T
G-75 rev A
MT48LC32M4A2T
G-75 rev E
DRAM
Vendor
PCB Part
Date
CMTL
Number
Test #
P51G168NE
Samsung
11/16/01 F619
BSIB33 rev B
3
Micron
40506 rev A
1/11/02
F627
3
Micron
651219-G
rev 1
1/24/02
F774
3
P51G168NE
BSIBP3
1/28/02
H206
3
SM3272SR301-ICA
TC59S6404CFT75
rev C
Toshiba
M390S1620ET1-C75
K4S6408232E-TC75
Samsung
K4S560832CAR32V72L8S8GAS
TC/L75
~DTM60199A (Old
MT48LC32M4A2T
+Dataram
Part# DTM60199(M))
G-75 rev E
NT5SV32M8AT+Dane-Elec
DP133R072323IL
7KT
HYB39S256800CT
+Dataram
DTM60172D
-75 rev C
K4S280432DSamsung
M390S3320DTU-C7A
TC75
TechnoLinc
K4S560832CSL32X072TC75DSG
Corporation
TC75 rev C
+Aved Memory
AMP377P3323AT2NT5SV16M8CTProducts
C75/N
7K rev C
+MSC Vertriebs
K4S560832C-TC
MSC256M00036
GmbH
rev C
BEIJING
K4S280432DWMB6R1358TN-243
WINWARD
TC75 rev D
HYB39S256800DT
+Dataram
DTM60172E
-7 rev D
48LC16M8A2-75
+Buffalo
VS133-R256/ME
rev E
+MSC Vertriebs
HYB39S256800CT
MSC256M00040
GmbH
-7.5 rev C
+MSC Vertriebs
HYB39S256800CT
MSC256M00142
GmbH
-7.5 rev C
HYB39S128800CT
+Legend
L3272QC3-59AIS73C
-7.5 rev C
MT48LC32M8A2T
+Dataram
DTM60172F
G-75 rev C
MT48LC32M8A2T
Buffalo+
VS133-RS256/MC
G-75 rev C
Modules shaded in blue are low profile
CAS
Low EOL
Latency Profile
2/14/02
SR168L08V1
Samsung
3/14/02
rev 1
3
Yes
H751
3
Yes
Micron
40551 rev A
3/1/02
H598
N/A
Yes
Nanya
DE082030
rev B
4/5/02
H879
2
Yes
Infineon
40506 rev A
4/11/02
I054
3
Yes
3
Yes
Samsung
2/12/02
Samsung
BRSA80A
4/21/02
I292
3
Yes
Nanya
105352 rev B
5/6/02
I334
3
Yes
Samsung
M0508LA1
5/22/02
I257
3
Samsung
128MX72R
6/19/02
J234
3
Infineon
40506 rev A
6/26/02
I445
3
Micron
ZEY8RWFAA
7/11/02
J232
3
Infineon
M0508LA1
7/30/02
I284
3
Infineon
M0493LA2
9/10/02
J876
3
Infineon
B5982 rev A
7/25/02
J745
3
Micron
40506 rev A
11/8/02 000555
3
Micron
YEY8RWFAA
2/3/03
3
002702
# Part number change/correction
+
Yes
This vendor is part of the CMTL Gold or Advance Certification program. This means this part has/will been tested
across all compatible Intel Server Boards. For further information contact CMTL @ http://cmtlabs.com/
Yes
Yes
Yes
STL2 Server Board
Registered, ECC, 133MHz SDRAM DIMM Modules
512 MB Sizes (64Mx72)
Manufacturer
Part Number
DRAM Part
Number
DRAM
Vendor
PCB Part
Number
Date
Hitachi
HB52F649E1-75B
9/21/00
Infineon
9/12/00
Samsung
HYS72V64300GR7.5-C2
M390S6450AT1-C75
+Viking
INT51209
+ATP
Electronics
AR64V72L8SSGAS
+Dataram
DTM60133
+Dane-Elec
DP133R072643H
K4S560432A-TC75
Samsung
+ATP
Electronics
AR64V72M8S8GAS
K4S560832A-TC75
rev A
Samsung
Corsair
CM766S512-133/S
K4S560432A-TC75
Samsung
Simple Tech
Silicon Tech
Unigen
7550040-GR
K4S560832A-TC75
die A
HYB39S256400CT7.5 rev C2
K4S560832A-TC75
SINT7264118IRD2K4S280432C-TC75
75AVG
INT72R4J64M4HK4S280432C-TC75
A75AV
UG564T7588KG-PL HN5225805BTT-75
+AVED Memory AMP377P6453BT2K4S560832B-TC75
Products
C75/S
Virtium
VM375S3320E-GAS K4S280432C-TC75
Technology Inc
HM5225405BTT-75
+Dataram
DTM60133(60133Z)
rev A
Corsair
CM766S512-133/S K4S560432B-TC/75
K4S560432A-TC75
rev A
+AVED Memory AMP377P6450BT3- K4S560432B-TC75
Products
C75/S
REV. B
+Dataram
DTM60133(60133Z)
Continued
3
9/21/00
K4S560832A-TC75
+ATP
K4S560432A-TC75
AR64V72N4S8GAS
Electronics
rev A
Virtium
VM375S6550E-GAS K4S560432A-TC75
Technology Inc
KVR133X72RC3/512 HYB39S256400ATKingston
-IS
75
+GoldenRAM
CMTL
CAS
Low EOL
Test # Latency Profile
3
Samsung
Samsung
Infineon
Samsung
Samsung
Infineon
Samsung
9001742
SR168L08
V rev 1
40481 rev
A
168327201C
rev C
SR168M08
V rev 1
Aug 2000
50-00096
rev A
SR168N04
V rev 2
16-25140A
rev A
2022254001
1030238001 rev A
3
10/9/00
B543
10/9/00
B548
10/20/00
B546
12/4/00
B645
12/8/00
B811
12/12/00
B582
12/29/00
B935
3
Yes
1/9/01
B995
3
Yes
1/15/01
B578
3
1/13/01
B639
3
YES
Samsung
758
1/17/01
C033
3
Samsung
758
1/17/01
C034
3
1/19/01
C069
3
1/18/01
C102
3
1/19/01
C106
3
1/29/01
C023
1/29/01
C089
3
1/30/01
C020
3
2/6/01
C277
3
Hitachi
Samsung
Samsung
Hitachi
Samsung
Samsung
Samsung
RAWCARD
-E
105352
REV. B
16-25140A
REV. A
40481 rev
a2
50-00096
REV. ARV1
40481 rev
A2
105349
REV. C
Registered, ECC, 133MHz SDRAM DIMM Modules
512 MB Sizes (64Mx72)(Continued…………)
Manufacturer
Part Number
Samsung
M390S6450BT1-C75
Legacy
Electronics Inc
38L6JS0R-1HAG
+Dataram
DTM60176 (60176Z)
Avant
Technology
TNV72648E38A3EE0
Legend
L6472QC3
+ATP
Electronics
AR64V72N4S8GAS
+Dataram
DTM60176(60176Z)
Infineon
Samsung
+ATP
Electronics
Avant
Technology
Centon
Electronics
+PNY
Simple Tech
+Viking
Ramax
Avant
Technology
+Dataram
Apacer
Micro Memory
Bank
+PNY
DRAM Part
Number
DRAM
Vendor
CINT512M/RP133S
Date
1/15/01
LES64408TA-7.5
Legacy
HYB39S256800CT
Infineon
-7.5
HY57V56420T-H
CMT
CAS
Low EOL
L
Latency Profile
Test
#
3
LEIG472R133A 2/19/01 C457
3
Hyundai 50135501 rev A 5/18/01 C838
3
HYB39S256800CT
Infineon
-7.5 rev C
K4S560432B-TC75
Samsung
rev B
HM5225805BTTHitachi
75 rev B
40511 rev A
5/14/01 D062
3
SR168N04V
rev 2
5/21/01 D037
3
Yes
40511 rev A
5/16/01 C238
3
Yes
5/30/01
3
Yes
5/30/01
3
5/26/01 D037
3
Hyundai 50135501 rev A 5/26/01 C838
3
K4S560432B-TC75 Samsung CPCB-00505-G 5/30/01 D679
3
HY57V56420T-H
SR168N04V
rev 2
NT5SV64M4AT-7K
Nanya
50135501 rev A 6/20/01 D716
MT48LC32M4A2T
Micron
40481 rev A
G-75 rev E
AM512LS62R13302 K4S560432B-TC75 Samsung 48.16103.012
48LC64M4A2TGM15M6472-060BCMAU
Micron
128MX72R
75
7264WHSTM8G24TW TC59SM808BFTToshiba 40000476 rev B
R-PK0
75 rev B
DTM60116(60116Z)(M)
Ventura
Technology
Group
S52SVJ23EV
Legend
L6472QC3-59AHSC3A
Continued
Yes
B5982 rev A
7264WHSTM8G24TW HYB39S256800CT
Infineon 40000476 rev B 6/6/01 C166
R-PH0
-7.5 rev C
UPD45128441G5ST72R4E64-A75A
NEC
758
6/6/01 D092
A75
K4S560832B-TC75
INT51214
Samsung 9001742 rev A 5/30/01 D016
rev B
HYB39S256800CT
RPD1182080R
RMD311S28B6T-7
Infineon
6/12/01 D171
-75 rev C
62 rev 2
TNV7264E38A2EE0
3
3/27/01 C245
HYS72V64500GR-7.5C2
M390S6450BTU-C75 K4S560432B-TC75 Samsung
K4S560432B-TC75
AR64V72N4S8GAS
Samsung
rev B
TNV72648E38A3EE0
PCB Part
Number
HYB39S256800CT Infineon
HY57V562820T-H
rev A
Hyundai
3
3
3
3
3
6/26/01 D722
3
08/14/01 D400
3
08/14/01 E283
3
8/20/01 C150
3
V204
08/29/01 E436
3
B5982 rev A
9/10/01 E472
3
Yes
Registered, ECC, 133MHz SDRAM DIMM Modules
512 MB Sizes (64Mx72)(Continued…………)
Manufacturer
Part Number
DRAM Part
Number
+Century
DTR3S4
K4S560432B-TC75
Microelectronics Inc
+Aved Memory
AMP377P6453AT2- V54C3256804VATProducts
C75/MV
7 rev A
K4S560432C+ATP Electronics AR64V72N4S8GAS
TC75 rev C
DTM60194
MT48LC64M4A2T
+Dataram
(60194Z)
G-75
DTM60133
+Dataram
HY57V56420T-H
(68015Z)
M390S6450CT1K4S560432CSamsung
C7A
TC75
L6472WC3K4S560432C+Legend
21ASSG3C
TC75 rev C
+SMART Modular
K4S560432CSM6472SR301-ICA
Technologies
TC75 rev C
~DTM68015B (Old MT48LC64M4A2T
+Dataram
Part#DTM68015(M)
G-75 rev B
~DTM60194C (Old HYB39S256400CT
+Dataram
Part#DTM60194(E))
-75 rev C
+MSC Vertriebs
HYB39S256400CT
MSC512M00001
GmbH
-7.5
M390S6450CTUSamsung
C7A
MT18LSDT6472GMicron
133B1
+MSC Vertriebs
K4S560432CMSC512M00002
GmbH
TC75 rev C
M390S6450DTUSamsung
C7A
M390S6450DT1K4S560432DSamsung
C7A
TC75
Techno Linc
SL64X072TC75DS
K4S560832DCorporation
D
TC75 rev D
48LC32M8A2-75
+Buffalo
VS133-R512/MB
rev B
HYB39S256400DT
+Dataram
DTM60194D
-7 rev D
K4S560432D+Dataram
DTM60194E
TC75 rev D
+MSC Vertriebs
K4S560832C-TC
MSC512M00037
GmbH
rev C
+MSC Vertriebs
HYB39S256400DT
MSC512M00149
GmbH
-7 rev D
Continued
DRAM
Vendor
PCB Part
Number
Date
Samsung
CE021
10/03/01
E627
3
MoselVitelic
105352 rev B
11/08/01
E658
3
Samsung
SR168N04V
rev 2
11/01/01
F191
3
Yes
Micron
40551 rev A
12/7/01
F744
3
Yes
Hyundai 651219-G rev 1 12/27/01
G071
3
Samsung
CMTL
CAS
Low EOL
Test # Latency Profile
01/04/02
Samsung 16-21040 rev A
Yes
3
1/9/02
F865
3
Samsung
P51G168NEBS
1/30/02
IBP3
G553
3
Micron
651219-G rev 1 2/10/02
F767
3
Yes
Infineon
40551 rev A
2/25/02
H001
3
Yes
Infineon
M0507LA1
3/24/02
H856
3
Yes
Yes
Samsung
3/7/02
3
Micron
3/11/02
3
Samsung
M0507LA1
4/25/02
I204
3
Samsung
5/1/02
3
Samsung
5/1/02
3
Yes
Samsung
BRSA80A
6/5/02
J003
3
Yes
Micron
ZEY8RWF-AA
6/24/02
J244
3
Infineon
40551 rev A
7/3/02
I441
3
Yes
Samsung
40551 rev A
8/16/02
J301
3
Yes
Samsung
M0508LA1
8/26/02
I266
3
Infineon
M0507LA1
9/3/02
J886
2
Registered, ECC, 133MHz SDRAM DIMM Modules
512 MB Sizes (64Mx72)(Continued…………)
+Dataram
DTM68015E
+MSC Vertriebs
GmbH
MSC512M00148
+Dataram
DTM68015E
+Legend
L6472QC359BHSC3B
+MSC Vertriebs
GmbH
MSC 512M00153
+Dataram
DTM60194F
+MSC Vertriebs
GmbH
+MSC Vertriebs
GmbH
MSC 512M00151
MT48LC64M4A2T
Micron
40544 rev A
G-75 rev C
K4S510832CSamsung
M0493LA2
KC75 rev C
MT48LC64M4A2T
Micron
40544 rev A
G-75 rev C
HY57V56820BT-H
Hyundai
B5982 rev B
rev B
HYB
39S256800DT-7.5 Infineon PCB M0508LA1
rev D
MT48LC64M4A2T
Micron
40551 rev A
G-75 rev C
MSCS8608A8A-75
Fujitsu
+
3
10/7/02
3
I977
10/14/02 000547
3
10/16/02 001559
3
10/21/02 000762
3
11/12/02 000563
3
PCB M0508LA1 10/30/02 000383
3
MT48LC64M4A2T
Micron
M0507LA1
G-75 rev A
AVE7264R38A3133
K4S560432D501412-01A rev
+Avant Technology
Samsung
E1-A
TC75 rev D
A
AVE7264R38A2133 NT5SV64M4AT-7K
501412-01-A
+Avant Technology
Nanya
E1-A
rev A
rev A
K4S560832D+ATP Electronics AR64V72Q8S8GAS
Samsung
BRSA80A
TC75 rev D
MT48LC32M8A2T
+Buffalo
VS133-R512/MC
Micron
ZEY8RWF-AA
G-75 rev C
AVE7264R39A3133 HY57V56820BT-H
+Avant Technology
Hyundai BRSA80A rev A
E4-A
rev B
Modules shaded in blue are low profile
MSC512M00003
10/14/02 000547
10/29/02
I521
Yes
Yes
3
11/21/02 001516
3
Yes
11/25/02 001500
2
Yes
12/6/02 001749
3
Yes
2/7/03
002679
3
3/31/03 002790
3
This vendor is part of the CMTL Gold or Advance Certification program. This means this part has/will been tested
across all compatible Intel Server Boards. For further information contact CMTL @ http://cmtlabs.com/
Yes
STL2 Server Board
Registered, ECC, 133MHz SDRAM DIMM Modules
1G Sizes (64Mx72)
Manufacturer
Part Number
DRAM Part
Number
+Legacy
Electronics Inc.
39B6JS0C-1AAG
K4S560432A-TC75
Samsung
~M390S2858BT1-C75
DRAM
Vendor
PCB Part
Date
CMTL
CAS
Number
Test # Latency
LE1G472R
Samsung 133 rev A 11/9/00 B623
+ATP Electronics
AR128V72N4SSGAS
K4S560432A-TC75
rev A
Corsair
CM744S1024-133/S
K4S560432b-TC/75 Samsung
+Dane-Elec
DP133R072283H-S
K4S560432A-TC75
Samsung
+Dataram
DTM60126(60126Z)
K4S560432B-TC75
rev B
Samsung
Kingston
KVR133X72RC3/1024IS
K4S560432B-TC75
rev B
Samsung
Legacy
Electronics Inc.
39L6JS0C-1HAG
LES64408TA-7.5
Legacy
Infineon
HYS72V128320GR-7.5C2
+ATP Electronics
+Dataram
Kingston
K4S560432B-TC75
rev B
HM5225405BTT-75
DTM60126(60126Z)(H)
rev B
K4S560432B-TC75
rev B
Samsung
Hitachi
Samsung
72A0UHSTM8G24KWR- HYB39S256400CTInfineon
PH0
7.5 rev C
K4S560432B-TC75
+ATP Electronics AR128V72N4SSGAS
Samsung
rev B
K4S560432B-TC75
+ATP Electronics AR128V72J4SMGAS
Samsung
rev B
72A0UHSTM8G24KWR- TC59SM804BFT-75
+PNY
Toshiba
PK0
rev B
+PNY
+ATP Electronics
AR128V72J4SGGAS
K4560432B-TC75
Samsung
Simple Tech
ST72R4L128-A75A
K4S560432B-TC75
Samsung
Apacer
AM1024LS72R13302
K4S560432B-TC75
Samsung
~Micron
MT36LSDF12872G133B1
MT48LC64M4A2FB75 rev B
Micron
Kentron
KT12872SRN3R-14V8
K4S560432B-TC75
Samsung
Continued
11/9/00
3
12/26/00 B923
3
2/6/01
C198
3
3/26/01
C764
3
5/11/01
C053
3
5/24/01
C458
5/16/01
C548
5/4/01
AR128V72N4SMGAS
KVR133X72RC3/1024IS
Samsung
SR168N04
V rev 2
50-00096
rev. A-RV1
DE042001
rev A
40481 rev
A
2022254001 rev
A00
LE1G472R
133 rev A
SR168N04
V rev 2
40481 rev
A
2022254001 rev
A00
40000475
rev B
SR168N04
V rev 2
SR168J
04V rev 1
40000475
rev B
SR168J
04V rev 1
930
48.16103.0
12
Yes
3
3
5/30/01
D147
3
5/26/01
C049
3
5/26/01
C458
3
6/14/01
D729
3
6/18/01
D030
3
6/20/01
D143
3
6/18/01
D737
3
6/26/01
D658
3
7/18/01
D871
3
8/9/01
D399
3
0142 rev B 8/24/01
E289
3
3272SRN8
-PCB
E287
3
9/7/01
Low
Profile
YES
Yes
Yes
EO
L
STL2 Server Board
Registered, ECC, 133MHz SDRAM DIMM Modules
1G Sizes (64Mx72) (Continued……….)
Manufacturer
Part Number
DRAM Part
Number
DRAM
Vendor
Legend
L1272QC3-HRAHSD3A
HY57V56420T-H
Hyundai
Legend
L1272QC3-HRAHSD3A
HY57V56420T-H
Hyundai
PCB Part
Date
Number
0114-1 rev
10/01/01
A
0114-1 rev
10/01/01
A
0000891
10/25/01
rev A
HM5225405BTT75
Hitachi
rev B
NL3127RS64043-D75KK4S560432CNetlist Inc
Samsung 0139-10 10/26/01
S2
TC75000 rev C
HM5225405BTT75
9001690
+Viking
INT102409
Hitachi
10/26/01
rev B
rev B
K4S560432C-TC75
SR168N04
+ATP Electronics AR128V72N4SMGAS
Samsung
11/02/01
rev C
V rev 2
16-21040
+Legend
L1272WC3-21ASSG3C K4S560432C-TC75 Samsung
11/28/01
rev A
K4S560432C-TC75 Samsung
Samsung
M390S2858CT1-C7A
1/14/02
~DTM60193A (Old Part# MT48LC64M4A2FB
40554 rev
+Dataram
Micron
1/14/2002
DTM60193(M))
-75 rev B
A
+SMART
K4S560432C-TC75
P51G168N
Modular
SM12872SR301-ICA
Samsung
1/22/02
rev C
EBSIBP3
Technologies
~DTM60192A (Old Part# MT48LC64M4A2TG
40481 rev
+Dataram
Micron
2/12/02
DTM60192(M))
-75 rev B
A
HYB39S256400DT40481 rev
+Dataram
DTM60192D
Infineon
5/31/02
7 rev D
A
K4S560432D-TC75
40481 rev
+Dataram
DTM60192E
Samsung
8/9/02
rev D
A
2025186Kingston
KVR133X72RC3/1024I
D644SWH-75
Kingston
8/14/02
001 rev A
MT48LC64M4A2FB
40554A rev
+Dataram
DTM60193C
Micron
8/20/02
-75 rev B
A
V54C3256404VBS- Mosel40554 rev
+Dataram
DTM60193B
7/23/02
7
Vitelic
A
+Avant
AVE7228R38A2133E3- NT5SV64M4AT-7K
BRSB43A
Nanya
11/4/02
Technology
A
rev A
rev A
+MSC Vertriebs
HYB39S256400DTMSC 001G00150
Infineon M0507LA1 11/18/02
GmbH
7 rev D
+Viking
INT102410
Continued
CMTL
CAS
Low EOL
Test # Latency Profile
E473
3
E473
3
F209
3
E696
3
F017
2
F197
3
Yes
F496
N/A
Yes
3
G464
2
Yes
G565
3
G064
3
I425
3
J292
3
000939
3
Yes
000202
3
Yes
I616
3
Yes
000370
2
001042
2
STL2 Server Board
Registered, ECC, 133MHz SDRAM DIMM Modules
1G Sizes (64Mx72) (Continued……….)
Manufacturer
+Dataram
+Avant
Technology
+Avant
Technology
Part Number
DRAM Part
Number
MT48LC64M4A2FB
DTM60193E
-75 rev C
AVE7228R38A3133E3- NT5SV64M4AT-7K
A
rev A
AVE7228R82A3133E1- NT5SV64M4AT-7K
A
rev A
Modules shaded in blue are low profile
DRAM
Vendor
Micron
Nanya
Nanya
PCB Part
Number
40554A rev
A
Date
001714
3
12/20/02 001822
3
501412-0112/31/02 002046
A rev A
3
BRSB43A
12/5/02
CMTL
CAS
Low EOL
Test # Latency Profile
~ Part number change/correction
+ This vendor is part of the CMTL Gold or Advance Certification program.
This means this part has/will been tested
across all compatible Intel Server Boards. For further information contact CMTL @ http://cmtlabs.com/
Caution: Some modules on this list may contain “stacked” DRAM parts. These parts may have
thermal & physical limitations in some chassis configurations. It is advised to verify that your
chassis configuration will support “stacked” parts before purchase.
Yes
Yes
Sales Information
Vendor Name
Web URL
ATP Electronics
http://www.atpusa.com/
ATP Electronics -Taiwan Inc.
http://www.atpusa.com/
Avant Technology
http://www.avanttechnology.com
Aved Memory Products
Buffalo Technology
http://www.avedmemory.com/
http://www.buffalotech.com/
Corsair
Dane-Elec
http://www.corsairmicro.com/
http://www.dane-memory.com/
Dataram
GoldenRAM
http://www.dataram.com/
http://www.goldenram.com
Hitachi
Hyundai/Hynix
Semiconductor
Infineon
http://semiconductor.hitachi.com/pointer/
http://www.hea.com/
ITAUCOM
Kentron
Kingston
Legacy Electronics Inc.
Micron
MSC Vertriebs GmbH
Peripheral Enhancements
PNY
Samsung
Silicon Tech
http://www.infineon.com/business/distribut
/index.htm
http://www.itaucom.com.br
http://www.kentrontech.com/New_Product
_pages/products.htm
http://www.kingston.com
http://www.legacyelectronics.com
http://silicon.micron.com/mktg/'http://silic
on.micron.com/mktg/mbqual/qual_data.cf
m
http://www.msc-ge.com
http://www.peripheral.com/
http://www.pny.com/internet_explorer/LP
B.HTML
http://www.korea.samsungsemi.com/locate
/buy/list_na.html
http://www.silicontech.com/contact/salesco
ntacts.shtml
Continued on next page……………..
Vendor Direct Sales Info
Florence Hsieh
Tel 408-732-5831
Fax 408-732-5055
sales@atpusa.com
Patty Kuo
Tel 011-886-2-2659-6368
Fax 886-2-2659-4982
Brad Scoggins
Phone: (512)491-7411
Fax: (512)491-7412
brads@avanttechnology.com
(800) 456-9799
memory@buffalotech.com
http://www.corsairmicro.com/sales.htm
Michal Hassan @ (949)450-2941 or email @
Michal@Dane-memory.com
Robert Olszak @ 800-822-0071 ext. 2404
Jason M. Barrette @ 800-222-861 x7546
jasonb@goldenram.com
or Michael E. Meyer @800-222-8861 x7512
michaelm@goldenram.com
Brian Newburn @ (978) 988-9100 Ext. 2135 or email
@ bnewburn@kentrontech.com
US.- Call (877) 435-8726
Asia – Call 886-3-564-1539
Europe – Call +44-1932-755205
William Perrigo
49-7249-910-417
Fax: 49-7249-910-229
wpe@msc-ge.com
For US customers go to:
http://www.mymemorystore.com/
Vendor Name
Web URL
Simple Tech
http://www.simpletech.com
SMART Modular
Technologies
http://www.smartm.com
TechnoLinc Corporation
http://www.technolinc.com
Unigen
Ventura Technology Inc
http://www.unigen.com
http://www.venturatech.com
Viking InterWorks
Virtium Technology Inc
http://www.vikinginterworks.com
http://www.virtium.com
Legend
http://www.legend.com.au
Vendor Direct Sales Info
Ron Darwish @ (949) 260-8230 or email @
Rdarwish@Simpletech.com
Leo Alafriz
949-753-0116 ext. 125
leo.alafriz@smartm.com
David Curtis
510-445-7400
davidc@technolinc.com
Don Hummel @ 805-581-0800 x 108 or email @
don@venturatech.com
Tod Skelton @ (949) 460-0020 ext. 146 or email @
tod.skelton@virtium.com
Tel: 800-338-2361
Fax: 949-459-8577
orderdesk@vikingcomponents.com
CMTL* (Computer Memory Test Labs)
CMTL is a privately owned and operated memory testing organization responsible for testing a broad
range of memory products. Memory devices tested by CMTL must undergo a rigorous battery of tests to
ensure that the product will perform the intended server functions. Memory capability is a major factor
your customers consider. CMTL has the ability to test and certify memory on Intel-based server platforms.
The list of memory modules, which have undergone testing through the CMTL facility, should be
referenced when considering modules for integration into this Intel server product. Stringent standards with
regard to manufacturing procedures and quality must be met to pass the exacting tests required for
qualification through the independent testing facility. Testing is performed by CMTL with Intel server
products and test procedures defined by Intel’s Memory Validation Lab. Intel routinely audits the CMTL
facility to ensure all procedures, process handling, and testing methodologies are met.
Intel® Product Dealers and Product Integrators
The Intel Product Dealer program was designed in North America to support system integrators building
and selling a limited number of systems per year. More information on this program is available through
the Intel web site at http://channel.intel.com. Similar programs exist in European, Middle Eastern, African,
Asia-Pacific and South American regions.
IMPORTANT NOTE
DIMM devices with gold contacts should NOT be placed into DIMM sockets with tin-lead contacts or
vice-versa. Mixing dissimilar metal contact types has been shown to result in unreliable memory operation.
Intel recommends similar manufacturer and similar speeds in each bank on the memory module. Mixing of
dissimilar memory manufacturer devices or dissimilar memory device speeds is not recommended. This
document contains information which is the proprietary property of Intel Corporation. Nothing in this
document constitutes a guaranty, warranty, or license, express or implied. Intel has tested the following
DIMMs for minimum electrical and functional compatibility with boxed Pentium® III processors. This
listing is not intended to be all inclusive; it only represents the DIMMs Intel or CMTL has tested. Users of
this list are reminded to check with the DIMM manufacturer or Distributor to ensure that a particular
DIMM model is adequate for the intended purpose on the boxed processor baseboard. Intel provides no
indemnities for and expressly disclaims all liabilities for any and all such guaranties, representations, and
warranties (oral or written) whether express or implied, related to DIMMs in a Intel® Server Board
product, including without limitation to: fitness for a particular purpose; merchantability; noninfringement
of intellectual property or other rights of any third party or of Intel. The reader is advised that third parties
may have intellectual property rights which may be relevant to this document and the technologies
discussed herein, and is advised to seek the advice of competent legal counsel, without obligation of Intel.
Intel retains the right to make changes to this document at any time, without notice. Intel makes no
warranty or representation with respect to the use of this document or reliance by the reader upon its
contents, and assumes no responsibility for any errors which may appear in the document nor does it make
a commitment to update the information contained herein.
Product and corporate names listed in this document may be trademarks of their respective companies.
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