teac dw-224e-v83

teac dw-224e-v83
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
TEAC DW-224E-V83/-V93
CD-RW/DVD-ROM DRIVE
HARDWARE SPECIFICATION
(PRELIMINARY)
Pre-Rev. B
8084pb
35 sheets in Total
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
TABLE OF CONTENTS
Title
Page
1. SCOPE ........................................................................................................................................ 1
2. OUTLINE ..................................................................................................................................... 1
3. CONSTRUCTION ........................................................................................................................ 2
3.1 External Construction ........................................................................................................... 2
3.2 Installation ............................................................................................................................. 4
4. DISC SPECIFICATION ................................................................................................................ 5
4.1 Applicable Disc Format ........................................................................................................ 5
4.2 Rotational Speed ................................................................................................................... 5
4.3 Data Capacity ........................................................................................................................ 6
4.4 Write methods ....................................................................................................................... 6
4.5 Readable disc ........................................................................................................................ 6
4.6 Recordable Disc (Recording Speed) ................................................................................... 6
5. PERFORMANCE ......................................................................................................................... 7
5.1 Operating Performance ........................................................................................................ 7
5.2 Audio ...................................................................................................................................... 7
5.3 Acoustic Noise ...................................................................................................................... 7
6. ENVIRONMENTAL CONDITIONS .............................................................................................. 8
7. RELIABILITY ............................................................................................................................... 9
8. SAFETY STANDARDS ............................................................................................................... 9
9. FRONT INDICATOR .................................................................................................................... 9
10. DRIVE CONFIGURATION ......................................................................................................... 9
11. INTERFACE CONNECTOR .................................................................................................... 11
12. AUDIO INTERFACE ................................................................................................................ 12
13. POWER INTERFACE .............................................................................................................. 12
14. IDE HARDWARE INTERFACE ............................................................................................... 13
14.1 Outline ................................................................................................................................ 13
14.2 Electrical Characteristics ................................................................................................. 13
14.3 Input/Output Signals ......................................................................................................... 14
14.4 Interface Timing ................................................................................................................ 15
14.5 COMMAND SET ................................................................................................................. 27
14.5.1 ATA COMMAND ........................................................................................................... 27
14.5.2 ATAPI COMMAND ....................................................................................................... 28
15. POWER MANAGEMENT SPECIFICATION ........................................................................... 30
15.1 Power Management Modes .............................................................................................. 30
15.1.1 Transition in power management mode ................................................................... 30
15.2 Active Mode ....................................................................................................................... 31
15.3 Idle Mode ............................................................................................................................ 31
15.4 Standby Mode .................................................................................................................... 32
15.5 Sleep Mode ........................................................................................................................ 32
15.5.1 Tray ejection/insertion in the sleep mode ................................................................. 32
16. OTHERS .................................................................................................................................. 32
16.1 Using the Lens Cleaner .................................................................................................... 32
16.2 RoHS Compliance ............................................................................................................. 32
16.3 Safety of Laser Products .................................................................................................. 33
–i–
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
1. SCOPE
This is hardware specification of the TEAC DW-224E-V83/-V93 built-in type CD-RW/DVD-ROM drive
(hereinafter referred to as drive). As for the software specification, refer to "DW-224E-V Software
Specification".
2. OUTLINE
The outline of this drive is given in Table 2-1.
(Table 2-1) Outline of the specification
Model name
TEAC P/N
Applicable safety standards
Data transfer rate (burst)
DW-224E-V83
1977098V83
UL, CSA, TÜV, CE
33.3MBytes/sec max
Average access time
90msec (CD-ROM)/110msec (DVD-ROM), average by TEAC
standards
Disc speed (24X CAV speed
mode)
Host interface
IDE input/output signal
Power source
Starting time
Readable discs
CD
DVD
5,090min-1 (Approx)
Recordable disc
Applicable format
CD
DVD
Write methods
Front bezel
Eject button
Access indicator
Laser class
RoHS directive
DW-224E-V93
1977098V93
IDE (ATAPI)
CSEL
–CSEL
+5VDC
19sec max
CD-DA, CD-ROM, CD-R, CD-RW
DVD-ROM, DVD-R, DVD-R DL, DVD-RW, DVD+R, DVD+R DL,
DVD+RW, DVD-RAM
CD-R, CD-RW (Refer to item 4.6)
CD-DA, CD-ROM (Mode1, Mode2)
CD-ROM XA Mode2 (Form1, Form2), Photo CD (Single/Multi-session)
CD-i, Video-CD, CD-Extra (CD-Plus), CD-Text
DVD-ROM, DVD-Video, DVD-R (Single/Multi-border)
DVD-R DL (Single/Multi-border), DVD-RW (Single/Multi-border)
DVD+R (Single/Multi-session), DVD+R DL (Single/Multi-session)
DVD+RW (Single/Multi-session), DVD-RAM (4.7GB, 2.6GB)
Disc at once, Session at once, Packet write, Track at once
Black
Black
Green
Class 1 laser product
Complies with
–1–
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
3. CONSTRUCTION
3.1 External Construction
(1) Dimensions
(a) Height
: 12.7mm (excluding the front bezel)
(b) Width
: 128mm (excluding the front bezel)
(c) Depth
: 129.4mm (excluding the eject button)
(2) Mass
: 178g or less
(3) Disc clamp system
: Ball clamp
(4) Loading
: Manual loading using the tray
(5) Ejection
(a) Manual eject using the eject button
(b) Automatically eject using the command
(c) Eject distance
: 10mm or more
(6) External view
: Refer to Fig. 3.1-1.
–2–
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
( ± 0.4 )
(Unit : mm)
(Fig. 3.1-1) External view of the drive
–3–
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
3.2 Installation
(1) Installation direction
(2) Tilt
(3) Installation method
: Refer to Fig. 3.2-1
: Refer to Fig. 3.2-1 below.
: The fixing holes in the side of the unit are used.
Separate discussions and arrangements are required when the
installation holes are not used.
(a)
30° or less
30° or less
(b)
0° or less
30° or less
30° or less
30° or less
(c)
30° or less
30° or less
30° or less
0° or less
30° or less 30° or less
(Fig. 3.2-1) Tilt of the drive
–4–
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
4. DISC SPECIFICATION
4.1 Applicable Disc Format
(Table 4.1-1) Applicable disc format
CD
CD-DA
CD-ROM (Mode1, Mode2)
CD-ROM XA Mode2 (Form1, Form2)
Photo CD (Single/Multi-session)
CD-i
Video-CD
CD-Extra (CD-Plus)
CD-Text
DVD
DVD-ROM
DVD-Video
DVD-R (Single/Multi-border)
DVD-R DL (Single/Multi-border)
DVD-RW(Single/Multi-border)
DVD+R (Single/Multi-session)
DVD+R DL (Single/Multi-session)
DVD+RW (Single/Multi-session)
DVD-RAM (4.7GB, 2.6GB)
4.2 Rotational Speed
Refer to Table 4.2-1 for the rotational speed.
(Table 4.2-1) Rotational speed (read mode)
Operation/Disc format
Read speed/Disc speed
Idle mode (DVD)
4x CAV 2,297rpm
Idle mode (CD)
10x CAV 2,140rpm
Read (DVD-ROM)
8x CAV 4,594rpm
Read (DVD-Video)
4x CAV 2,297rpm
Read (CD-ROM Model)
24x CAV 5,137rpm
Read (DVD-RAM, 4.7GB)
5x CAV 3,246rpm
Read (DVD-RAM, 2.6GB)
2.5x CAV 1,626rpm
Read (CD-ROM Mode2form2)
20x CAV 4,280rpm
Read (CD-DA)
20x CAV 4,280rpm
Play Audio
4x CLV 856 - 1,984rpm
Read (Mixed, CD-ROM Model and Mode2form2 or CD-DA) 20x CAV 4,280rpm
Read (Mixed, DVD-ROM and DVD-Video)
8x CAV 4,594rpm
Read (CD-RW)
24x CAV 5,137rpm
Read (DVD-R, DVD-RW, DVD+R, DVD+RW)
8x CAV 4,594rpm
–5–
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
(Table 4.2-2) Rotational speed (write mode)
Disc
Read speed/ Disc speed
24x CAV 5,137rpm
16x CAV 3,425rpm
10x CLV 2,140 - 4,954rpm
4x CLV 856 - 1,984rpm
4x CLV 856 - 1,984rpm
10x CLV 2,140 - 4,954rpm
10x CAV 2,140rpm
4x CLV 856 - 1,984rpm
24x CAV 5,137rpm
10x CLV 2,140 - 4,954rpm
CD-R
Multi speed
High speed
CD-RW
Ultra speed
4.3 Data Capacity
• 650MB/700MB
• 738MB/795MB
• 74min/79min
• 4.7GB/side
• 8.5GB/side
• 2.6GB/side
:
:
:
:
:
CD-ROM Mode1
CD-ROM XA Mode2 Form1
CD-ROM XA Mode2 Form2
CD-DA
DVD-ROM, DVD-Video, DVD-R, DVD-RW, DVD-RAM,
DVD+R, DVD+RW
: DVD-ROM, DVD-Video DL
: DVD-RAM
4.4 Write methods
Disc at once, Track at once, Session at once, and Packet write
4.5 Readable disc
CD-DA, CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-R, DVD-R DL, DVD-RW, DVD+R, DVD+R DL,
DVD+RW, DVD-RAM
4.6 Recordable Disc (Recording Speed)
Recommended as the recordable disc to be used in this drive is a 79-minute disc for 8x speed manufactured by
Taiyo Yuden Co., Ltd. (TEAC Part No.: T0006613, CD-R80-BULK). The use of other recordable discs is
conditional on mutual understanding between TEAC and specific users.
With the recommended type of discs, the following speeds of recording are available:
4x speed, 10x speed, 16x speed and 24x speed
–6–
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
5. PERFORMANCE
5.1 Operating Performance
(1) Average random access time : 90msec average (CD-ROM, 24x), 110msec average (DVD-ROM, 8x)
(2) Disc speed
: Refer to 4.2
(3) Data transfer rate
(a) Read sustained
: 1,545 to 3,600kB/sec (CD-ROM model)
4,469 to 10,816kB/sec (DVD-ROM)
(b) Programmed I/O
: 16.7MB/sec max (Mode 0 to 4)
(c) Multi-word DMA
: 16.7MB/sec max (Mode 0 to 2)
(d) Ultra DMA
: 33.3MB/sec max
(4) Starting time
(a) When power is switched on/when disc is loaded
: 19sec max (excluding the multi-session CD)
(b) Return time from the standby mode
: 4sec or less
(5) Data buffer capacity
: 2MB
5.2 Audio
(1) Line output
The following specifications apply during audio play.
(a) Number of channels
: 2 channels (stereo)
(b) Frequency response
: 20 to 20kHz (±3dB)
(c) Dynamic range
: 83dB or more (IHF A, 1kHz, LPF 20kHz)
(d) S/N
: 85dB or more (IHF A, 1kHz, LPF 20kHz)
(e) Distortion factor
: 0.05% or less (1kHz, 20kHz LPF)
(f) Channel separation
: 70dB or more (1kHz, 20kHz LPF)
(g) Output level
: 0.8Vrms ±3dB (load = 47kΩ ATT = 0dB)
(h) Muting
: each channel independent (using the ATAPI command)
(i) Volume
: Software volume using the ATAPI command;
255 steps from volume level 0 to −∞ (infinity) dB; variable for each
channel independently.
5.3 Acoustic Noise
(1) Operating
(2) Ejecting
: 45dBA or less (during seek/read/write/Active/Idle, distance 0.5m)
: 65dBA or less (distance 0.5m)
–7–
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
6. ENVIRONMENTAL CONDITIONS
The environmental conditions as specified here do not include the environmental conditions of the disc. The
environmental conditions of the disc should follow the specifications of the applicable disc.
(1) Ambient temperature
(a) During operation
: 5 to 45°C (Surface temperature on the top cover; 5 to 50°C)
(b) During non-operation
: –20 to 60°C
(c) During transportation (packaged)
: –40 to 65°C
(2) Temperature gradient
(a) During operation
: 11°C/hour or less (noncondensing)
(b) During non-operation/transportation
: 20°C/hour or less (noncondensing)
(3) Relative humidity
(a) During operation
: 8 to 80% (noncondensing)
provided that the maximum wet-bulb temperature is 29.4°C or less.
(b) During non-operation/transportation
: 5 to 95% (noncondensing)
provided that the maximum wet-bulb temperature is 29.4°C or less.
(c) During transportation (packaged)
: 5 to 95% (noncondensing)
provided that the maximum wet-bulb temperature is 29.4°C or less.
(4) Vibrations
(a) During operation:
When installed horizontally: 2.9m/s2 (0.3G) or less
When installed vertically : 1.96m/s2 (0.2G) or less
provided that the sweep frequency is 5 to 500Hz and sweep rate,
1oct/min.
excepting recording mode.
(b) Transportation (packaged) : 19.6m/s2 (2G) or less provided that the sweep frequency is 5 to 500Hz
and sweep rate, 1oct/min.
(5) Shock
(a) During operation (free from malfunction)
When installed horizontally: 68.6m/s2 (7G) or less (half-sine shock
pulse; 11msec, intervals; 10sec)
When installed vertically : 49m/s2 (5G) or less (half-sine shock pulse;
11msec, intervals; 10sec)
excepting recording mode and CD-DA play mode.
(b) During operation (while the CD-DA is playing)
: 19.6m/s2 (2G) or less (half-sine shock pulse; 11msec., intervals; 10sec)
(c) During non-operation/transportation
: 588m/s2 (60G) or less (half-sine shock pulse; 11msec)
1,960m/s2 (200G) or less (half-sine shock pulse; 2msec)
However, tray ejection is allowed.
(6) Dust
: office environment
(7) Cooling
: natural air cooling
–8–
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
7. RELIABILITY
(1) Mean time between failures (MTBF)
: 60,000POH or more (the frequency of use should be 10% at normal
temperature and humidity)
(2) Mean time to repair (MTTR) : 30minutes
(3) Loading/ejecting life
: 10,000times or more
(4) Power ON/OFF life
: 60,000 times or more
(5) Laser diode life
: MTTF 9,000 hours (Duty 50% pulse 83mW, 60°C)
(6) Seeking life
: 2 × 106 times or more (random access, 25°C, duty; 20% or less)
(7) Error rate
(a) Read error rate
DVD
: Once per 1012 bits or less
CD
: MODE 1 and MODE 2 (FORM 1) : Once per 1012 bits or less
MODE 2 (FORM 2) and CDDA : Once per 109 bits or less
(b) Seek error rate
: Once per 106 seeks or less
(c) Seek error rate
: Once per 106 seeks or less
(8) Self-diagnosis
(a) When power is switched ON: Various controllers, ROM, RAM, buffer, ECC circuit, etc.
(b) When disc is inserted
: Servo circuit, signal processors, etc.
8. SAFETY STANDARDS
The drive complies with the following safety standards:
(1) UL standard
(2) CSA standard
(3) TÜV standard
(4) CE standard
9. FRONT INDICATOR
(1) Location
: Refer to Fig. 3.1-1.
(2) Color
: Green
(3) Lighting conditions
(a) Continuous on
• During seek
• Transfer of the read data to the host is under way.
(b) Flashing with a period of 3 second (Duty 50%)
• During write
• While audio is being played
(c) Flashing with a period of 1 second (Duty 50%)
• From POR or tray loading to the end of TOC read (when the disc is present)
• From POR or tray loading to the end of detecting the disc (when the disc is not present). If an error
which is considered to arise from the disc occurs, flashing continues until the disc is ejected. If an error
which seems to rest with the drive’s hardware, flashing continues until the power is switched OFF.
10. DRIVE CONFIGURATION
The setting to master or slave is determined by the CSEL signal (interface connector 47 pin).
• DV-224E-V83:
If the signal is at low level, the drive is set to the master, and if it is open or at high level, it is set to the
–9–
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
slave.
• DV-224E-V93:
If the signal is at low level, the drive is set to the slave, and if it is open or at high level, it is set to the
master.
– 10 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
11. INTERFACE CONNECTOR
(1) Connector on the drive
: JAE KX15-50KLDLE or equivalent
(2) Applicable connector on the host : JAE KX14-50K5D1 or equivalent
(3) Pin assignment
: Refer to Table 11-1, Fig. 11-1.
(Table 11-1) Interface connector pin assignment
No.
SIGNAL
1
LOUT
3
AGND
5
–RESET
7
DD7
9
DD6
11
DD5
13
DD4
15
DD3
17
DD2
19
DD1
21
DD0
23
GROUND
25
–DIOW (STOP)
27 IORDY (–DDMARDY/DSTROBE)
29
INTRQ
31
DA1
33
DA0
35
–CS0
37
–DASP
39
+5V
41
+5V
43
GROUND
45
GROUND
47
CSEL
49
RESERVED
No.
SIGNAL
2
ROUT
4
N.C
6
DD8
8
DD9
10
DD10
12
DD11
14
DD12
16
DD13
18
DD14
20
DD15
22
DMARQ
24 –DIOR (–HDMARDY/HSTROBE)
26
GROUND
28
–DMACK
30
–IOCS16
32
–PDIAG (–CBLID)
34
DA2
36
–CS1
38
+5V
40
+5V
42
+5V
44
GROUND
46
GROUND
48
GROUND
50
RESERVED
Pin No. 1
Pin No. 50
(Fig. 11-1) Interface connector assignment
– 11 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
12. AUDIO INTERFACE
(1) LOUT
: Line output of the left channel (unbalanced)
(2) ROUT
: Line output of the right channel (unbalanced)
(3) AGND
: Ground of audio line output.
For the electrical specification of the line output, refer to 5.2.
13. POWER INTERFACE
The following specifications apply to the interface connector terminals of the drive. The power should be
supplied from a power supply unit with reinforced insulation or double insulation.
(1) Allowable supply voltage range
: +5VDC ±5% (4.75 to 5.25V)
There should be no abnormal operations by DC +5V ±10%.
(2) Allowable ripple voltage
: 100mVp-p or less, 50 to 20MHz (including the spike noise)
(3) Current consumption
: Refer to Table 13-1.
(Table 13-1) Current consumption
Mode
Standby/Sleep
Write 24x
Active
Random access (Duty 100%)
During starting/seek
During eject
Average current max (A)
0.025
1.0
0.9
1.2
Peak current max (A)
1.5
1.5
1.5
Remarks:
1. The supply voltage should be 5V+5%.
2. For each of the sleep, standby, and active modes, refer to "15. POWER MANAGEMENT
SPECIFICATION".
3. Does not include pulse-like current below 1msec.
– 12 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
14. IDE HARDWARE INTERFACE
14.1 Outline
(1) Applicable standard
ANSI standard
SFFC
: X3T13/1321D (ATA-5)
: SFF-8020i Rev. 2.6 and SFF-8090v3
14.2 Electrical Characteristics
The following specifications apply to the interface connector terminal for the IDE signal of the drive. The input
signals refer to the signals input to the drive whereas the output signals refer to the signals output from the drive.
(1) Tri-state input/output signals (DD0 to DD15, –PDIAG)
(a) Input signal level
• Low level
: 0 to 0.8VDC
• High level
: 2.0 to 5.25VDC
• Hysteresis
: possessed
• Maximum input current
: ±25µA
(b) Output signal level
• Low level
: 0 to 0.4VDC (output sink current 12mA)
• High level
: 2.7 to 3.3VDC (output source current 1mA)
• Maximum output current at high impedance
: ±25µA
(c) Termination (DD0 to DD15)
• Pull-up resistance
: Not equipped
• Series resistance
: 33Ω
(d) Termination (–PDIAG)
• Pull-up resistance
: 10kΩ
• Series resistance
: 0Ω
(2) Open drain input/output signals (–DASP)
(a) Input signal level
• Low level
: 0 to 0.8VDC
• High level
: 2.0 to 5.25VDC
• Hysteresis
: possessed
• Maximum input current
: ±25µA (excluding the pull-up resistance)
(b) Output signal level
• Low level
: 0 to 0.4VDC (output sink current 12mA)
• Maximum output current at high impedance
: ±25µA
(c) Termination
• Pull-up resistance
: 10kΩ
• Series resistance
: 0Ω
(3) Tri-state output signals (DMARQ, INTRQ, IORDY)
• Low level
: 0 to 0.4VDC (output sink current 12mA)
• High level
: 2.7 to 3.3VDC (output source current 1mA)
• Maximum output current at high impedance
: ±25µA
• Series resistance
: 22Ω
– 13 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
(4) Open-drain output signals ( –IOCS16)
• Low level
: 0 to 0.4VDC (output sink current 12mA)
• Maximum output current at high impedance
: ±25µA
(5) Input signals (–RESET, –DIOW, –DIOR, CSEL, –DMACK, DA0 to DA2, –CS0, –CS1)
(a) Input signal level
• Low level
: 0 to 0.8VDC
• High level
: 2.0 to 5.25VDC
• Hysteresis (excluding RESET, CSEL)
: possessed
• Maximum input current
: ±25µA (excluding the pull-up resistance)
• Pull-up resistance
–RESET
: 10kΩ
CSEL
: 47kΩ
• Series resistance (–RESET, –DIOW, –DIOR, –DMACK, DA0 to DA2, –CS0, –CS1)
: 82Ω
14.3 Input/Output Signals
Refer to Table 14.3-1.
Among the following signals, the input signal refers to the signal input to the drive and the output signal refers
to the signal output from the drive and the input/output signal refers to the bidirectional signal.
(Table 14.3-1) IDE Interface signal summary (Sheet 1 of 2)
Signal
CSEL
–CS0
–CS1
DD0
DD1
DD2
DD3
DD4
DD5
DD6
DD7
DD8
DD9
DD10
DD11
DD12
DD13
DD14
DD15
–DASP
Description
Cable select
Chip select0
Chip select1
Data bus bit 0
Data bus bit 1
Data bus bit 2
Data bus bit 3
Data bus bit 4
Data bus bit 5
Data bus bit 6
Data bus bit 7
Data bus bit 8
Data bus bit 9
Data bus bit 10
Data bus bit 11
Data bus bit 12
Data bus bit 13
Data bus bit 14
Data bus bit 15
Device active/Slave present
Direction
IN
IN
IN
IN/OUT
IN/OUT
IN/OUT
IN/OUT
IN/OUT
IN/OUT
IN/OUT
IN/OUT
IN/OUT
IN/OUT
IN/OUT
IN/OUT
IN/OUT
IN/OUT
IN/OUT
IN/OUT
IN/OUT
– 14 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
(Table 14.3-1) IDE Interface signal summary (Sheet 2 of 2)
Signal
DA0
DA1
DA2
–DMACK
DMARQ
INTRQ
–IOCS16
Description
Device address bit 0
Device address bit 1
Device address bit 2
DMA acknowledge
DMA request
Interupt request
Drive 16 bit I/O
–IOR
I/O read
–HDMARDY DMA ready during Ultra DMA data in bursts
HSTROBE
Data strobe during Ultra DMA data out bursts
Direction
IN
IN
IN
IN
OUT
OUT
OUT
IN
IN
IN
IORDY
I/O ready
OUT
–DDMARDY DMA ready during Ultra DMA data out bursts OUT
DSTROBE
Data strobe during Ultra DMA data in bursts
OUT
–DIOW
STOP
I/O write
Stop during Ultra DMA data bursts
IN
IN
–PDIAG
–CBLID
Passed diagnostics
Cable assembly type identifier
IN/OUT
–
–RESET
Reset
IN
14.4 Interface Timing
The following specifications all apply to the signal interface connector terminal of the drive. In timing
description, H indicates high level (false) and L low level (true).
(1) Reset timing (master/slave)
: Fig. 14.4-1
(2) Reset timing (slave)
: Fig. 14.4-2
(3) PIO write cycle timing
: Fig. 14.4-3
(4) PIO read cycle timing
: Fig. 14.4-4
(5) DMA single word transfer timing
: Fig. 14.4-5
(6) DMA multi word transfer timing
: Fig. 14.4-6
(7) Ultra DMA transfer timing (Data in burst) : Fig. 14.4-7
(8) Ultra DMA transfer timing (Data out burst) : Fig. 14.4-8
– 15 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
–RESET
H
L
–DASP
H
L
–PDIAG
H
L
t1
Symbol
t1
–HRST pulse width
Item
Min
25
Typ
Max
Unit
µs
Typ
70
0.2
Max
400
30
Unit
ms
s
(Fig. 14.4-1) Reset timing (master)
–RESET
H
L
–DASP
H
L
–PDIAG
t2
t4
H
L
Symbol
Item
t2
–DASP assert time
t4
–PDIAG assert start
Min
(Fig. 14.4-2) Reset timing (slave)
– 16 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
H
–CS0, CS1
DA0 ~ DA2 L
–DIOW
IORDY
H
L
t5
t6
t9
H
L
t7
t8
t14
t10
t11
t12
H
DD0 ~ DD15 L
Symbol
t5
t6
t7
t8
t9
t10
t11
t12
t14
Item
Min
25
70
10
25
Address setup time
–IOW pulse width
Address hold time
–IOW interactive pulse width
IORDY delay time
IORDY pulse width
Write data setup time
Write data hold time
Write cycle time
Max
35
1,250
20
10
120
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
(Fig. 14.4-3) PIO write cycle timing
– 17 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
H
–CS0, CS1
DA0 ~ DA2 L
–DIOR
IORDY
H
L
t15
t16
t19
H
L
t17
t18
t24
t20
t22
H
DD0 ~ DD15 L
Symbol
t15
t16
t17
t18
t19
t20
t22
t24
Item
Min
25
70
10
25
Address setup time
–DIOR pulse width
Address hold time
–DIOR interactive pulse width
IORDY delay time
IORDY pulse width
Read data hold time
Read cycle time
90
5
120
Max
35
1,250
Unit
ns
ns
ns
ns
ns
ns
ns
ns
(Fig. 14.4-4) PIO read cycle timing
– 18 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
DMARQ
H
L
–DMACK
H
L
–DIOW
H
L
DD0 ~ DD15
H
L
–DIOR
H
L
DD0 ~ DD15
H
L
Symbol
t26
t27
t28
t30
t31
t32
t33
t34
t36
t26
t34
t36
t27
t28
t30
t32
t31
t33
Item
From –DMACK assert to –DMAREQ negate
From –DMACK assert to –DIOW low
–DIOW, –DIOR pulse width
Write data setup time
Write data hold time
Read data delay time
Read data hold time
From –DIOW, –DIOR high to –DMACK negate
Cycle time
Min
Max
80
0
120
35
20
60
5
0
240
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
(Fig. 14.4-5) DMA single word transfer timing
– 19 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
DMARQ
H
L
–DMACK
H
L
H
L
–DIOW
t45
t38
t39
H
L
DD0 ~ DD15
H
L
Symbol
t38
t39
t40
t41
t42
t43
t44
t45
t46
t48
t49
t46
t40
t41 t42
H
DD0 ~ DD15 L
–DIOR
t48
t43
t44
Item
From –DMACK assert to –DIOW low
–DIOW, –DIOR pulse width
–DIOW, –DIOR interactive pulse width
Write data setup time
Write data hold time
Read data delay time
Read data hold time
From –DIOW, –DIOR low to DMARQ negate
From –DIOW, –DIOR high to –DMACK negate
Write cycle time
Read cycle time
t49
Min
0
70
25
20
10
Max
50
5
35
5
120
120
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
(Fig. 14.4-6) DMA multi word transfer timing
– 20 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
Initiating an Ultra DMA data in burst
DMARQ
(device)
H
L
–DMACK
(host)
H
L
STOP
(host)
t50
t53
t51
t52
t51
t52
t56
H
L
−HDMARDY
(host)
H
L
DSTROBE
(device)
H
L
DD(15:0)
(device)
H
L
t53
t56
t54
t57
t55
t58
t51
DA0, DA1, DA2 H
L
(host)
t51
H
L
−CS0, −CS1
(host)
Sustained Ultra DMA data in burst
t60
t59
DSTROBE
(device)
H
L
DD(15:0)
(device)
H
L
t58
t59
t57
t58
t60
t57
t58
Host pausing an Ultra DMA data in burst
DMARQ
(device)
H
L
–DMACK
(host)
STOP
(host)
H
L
−HDMARDY
(host)
H
L
H
L
DSTROBE
(device)
H
L
DD(15:0)
(device)
H
L
t61
t62
(Fig. 14.4-7) Ultra DMA transfer timing (Data in burst) (Fig. 1 of 3)
– 21 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
Device terminating an Ultra DMA data in burst
DMARQ
(device)
H
L
–DMACK
(host)
H
L
STOP
(host)
H
L
−HDMARDY
(host)
H
L
DSTROBE
(device)
H
L
t63
t64
t51
t64
t51
t64
t65
t66
t67
t68
t55
DD(15:0)
(device)
H
L
t69
CRC
t51
DA0, DA1, DA2 H
L
(host)
−CS0, −CS1
(host)
t51
H
L
Host terminating an Ultra DMA data in burst
DMARQ
(device)
H
L
–DMACK
(host)
H
L
t64
t63
t55
STOP
(host)
H
L
−HDMARDY
(host)
H
L
DSTROBE
(device)
H
L
DD(15:0)
(device)
H
L
t67
t51
t51
t62
t64
t65
t63
t68
CRC
t51
DA0, DA1, DA2 H
L
(host)
−CS0, −CS1
(host)
t69
t51
H
L
(Fig.14.4-7) Ultra DMA transfer timing (Data in burst) (Fig. 2 of 3)
– 22 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
Symbol
Item
t50
Unlimited interlock time
t51
Setup time/Hold time (to –DMACK ↓ )
t52
Envelope time (–DMACK ↓ to STOP/
–HDMARDY ↓ )
t53
DSTROSE negate start time (STOP/–HDMARDY
↓ to DSTROBE ↓ )
t54
DSTROBE drive delay time (to –DMACK ↓)
t55
Output data, release delay time (to –DMACK ↓)
t56
Output data, drive start time (to STOP ↓/
–HDMARDY ↓)
t57
Valid data, setup time (to DSTROBE edge)
t58
Valid data, hold time (to DSTROBE edge)
t59
DSTROBE cycle time
Mode 2
Mode 1
Mode 0
t60
DSTROBE x 2-cycle time
Mode 2
Mode 1
Mode 0
DSTROBE Average x 2-cycle time
Mode 2
Mode 1
Mode 0
t61
DSTROBE stop shift time (DSTROBE Mode 2
edge to –HDMARDY ↑)
Mode 1
Mode 0
t62
Final DSTROBE stop time (to –HDMARDY ↑)
t63
DSTROBE ↑ to –DMACK ↑ delay time
t64
Limited interlock time
t65
DSTROBE release time (to –DMACK ↑)
t66
DSTROBE edge to HDMARQ ↓ delay time
t67
HDMARQ ↓ to CRC data output delay time
t68
Data setup time (to –DMACK ↑)
t69
Data hold time (to –DMACK ↑)
Min
0
20
20
Max
70
Unit
ns
ns
ns
0
170
ns
10
ns
ns
ns
0
0
30
6
54
73
112
115
154
230
120
160
240
20
30
50
60
20
0
150
20
50
20
30
6
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
(Fig.14.4-7) Ultra DMA transfer timing (Data in burst) (Fig. 3 of 3)
– 23 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
Initiating an Ultra DMA data out burst
DMARQ
(device)
H
L
–DMACK
(host)
H
L
STOP
(host)
H
L
t70
t71
t72
t74
t73
−DDMARDY
(device)
H
L
HSTROBE
(host)
H
L
DD(15:0)
(host)
H
L
t71
t75
t76
t71
DA0, DA1, DA2 H
L
(host)
−CS0, −CS1
(host)
t70
t71
H
L
Sustained Ultra DMA data out burst
t78
t77
t77
HSTROBE
(host)
H
L
DD(15:0)
(host)
H
L
t76
t78
t75 t76
t75 t76
Device pausing an Ultra DMA data out burst
DMARQ
(device)
H
L
–DMACK
(host)
STOP
(host)
H
L
H
L
−DDMARDY
(device)
HSTROBE
(host)
H
L
H
L
DD(15:0)
(host)
H
L
t80
t79
(Fig. 14.4-8) Ultra DMA transfer timing (Data out burst) (Fig. 1 of 3)
– 24 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
Host terminating an Ultra DMA data out burst
t74
DMARQ
(device)
H
L
–DMACK
(host)
H
L
STOP
(host)
H
L
−DDMARDY
(device)
H
L
t74
t81
t71
t83
t82
t74
t71
HSTROBE
(host)
H
L
DD(15:0)
(host)
H
L
t75
t76
CRC
t71
DA0, DA1, DA2 H
L
(host)
t71
H
−CS0, −CS1
L
(host)
Device terminating an Ultra DMA data
DMARQ
(device)
H
L
–DMACK
(host)
H
L
STOP
(host)
H
L
−DDMARDY
(device)
H
L
HSTROBE
(host)
H
L
t74
t81
t71
t82
t80
t74
t81
t71
t75
DD(15:0)
(host)
H
L
CRC
t71
DA0, DA1, DA2 H
L
(host)
−CS0, −CS1
(host)
t76
t71
H
L
(Fig.14.4-8) Ultra DMA transfer timing (Data out burst) (Fig. 2 of 3)
– 25 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
Symbol
t70
t71
t72
t73
t74
t75
t76
t77
t78
t79
t80
t81
t82
t83
Item
Unlimited interlock time
Setup time/Hold time (to –DMACK ↓ )
Envelope time(–DMACK ↓ to STOP ↓)
–DDMARDY drive delay time (to –DMACK ↓)
Limited interlock time
Data setup time (to –HSTROBE edge/to
–DMACK ↑)
Data hold time (to HSTORE edge/ to –DMACK ↑)
HSTORE cycle time
Mode 2
Mode 1
Mode 0
HSTROBE x 2-cycle time
Mode 2
Mode 1
Mode 0
HSTROBE Average x 2-cycle time
Mode 2
Mode 1
Mode 0
Receipt stop shift time (HSTROBE edge Mode 2
to –DDMARDY ↑)
Mode 1
Mode 0
–DDMARDY ↑ to DMARQ ↓ delay time
HSTROBE ↑ to –DMACK ↑ delay time
–DDMARDY release time (to –DMACK ↑)
–HSTROBE edge to STOP ↑ delay time
Min
0
20
20
0
0
7
Max
70
150
5
54
73
112
115
154
230
120
160
240
20
30
50
100
20
20
50
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
(Fig.14.4-8) Ultra DMA transfer timing (Data out burst) (Fig. 3 of 3)
– 26 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
14.5 COMMAND SET
14.5.1 ATA COMMAND
Refer to table 14.5.1-1.
(Table 14.5.1-1) ATA COMMAND
CODE
08
E5
90
E3
E1
00
A0
A1
EF
E6
E2
E0
A2
COMMAND
ATAPI SOFT RESET
CHECK POWER MODE
EXECUTE DRIVE DIAGNOSTIC
IDLE
IDLE IMMEDIATE
NOP
ATAPI PKT.
ATAPI IDENTIFY DEVICE
SET FEATURE
SLEEP
STANDBY
STANDBY IMMEDIATE
SERVICE
– 27 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
14.5.2 ATAPI COMMAND
Refer to table 14.5.2-1.
(Table 14.5.2-1) List of the ATAPI commands (Sheet 1 of 2)
CODE
A1
5B
04
4A
12
BD
55
5A
4B
45
A5
47
49
A9
1E
28
A8
5C
25
BE
B9
51
44
42
43
52
03
53
01
BA
2B
5D
54
BB
1B
4E
35
COMMAND
BLANK
CLOSE TRACK/SESSION
FORMAT UNIT
GET EVENT STATUS NOTIFICATION
INQUIRY
MECHANISM STATUS
MODE SELECT
MODE SENSE
PAUSE/RESUME
PLAY AUDIO (10)
PLAY AUDIO (12)
PLAY AUDIO MSF
PLAY TRACK RELATIVE (10)
PLAY TRACK RELATIVE (12)
PREVENT/ALLOW MEDIUM REMOVAL
READ (10)
READ (12)
READ BUFFER CAPACITY
READ CD/DVD CAPACITY
READ CD
READ CD MSF
READ DISC INFORMATION
READ HEADER
READ SUB-CHANNEL
READ TOC
READ TRACK/RZONE INFORMATION
REQUEST SENSE
RESERVE TRACK
REZERO UNIT
SCAN
SEEK
SEND CUE SHEET
SEND OPC INFORMATION
SET CD-ROM SPEED
START/STOP UNIT
STOP PLAY/SCAN
SYNCHRONIZE CACHE
– 28 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
(Table 14.5.2-1) List of the ATAPI commands (Sheet 2 of 2)
CODE
00
2A
AA
AD
23
A4
A3
A7
46
AC
A2
COMMAND
TEST UNIT READY
WRITE (10)
WRITE (12)
READ DVD STRUCTURE
READ FORMATTED CAPACITIES
REPORT KEY
SEND KEY
SET READ AHEAD
GET CONFIGURATION
GET PERFORMANCE
SEND EVENT
– 29 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
15. POWER MANAGEMENT SPECIFICATION
This drive has a power management function to reduce power consumption.
15.1 Power Management Modes
The drive has the following four power management modes. The transition between these modes is performed
by the timer within the drive or a command issued by the host.
• Active mode
• Idle mode
• Standby mode
• Sleep mode
15.1.1 Transition in power management mode
The transition in the power management mode is shown in Fig. 15.1.1-1.
POWER ON
(1)
SELF DIAGNOSTIC
NO
DISK PRESENCE ?
(2)
(3)
YES
(9)
ACTIVE
MODE
(4)
(5)
TRAY EJECT
(6)
IDLE
MODE
(5)
STANDBY
MODE
(10)
(11)
(8)
TRAY LOADING
(7)
SLEEP MODE
(12) NO
DISK PRESENCE ?
(13)
YES
(Fig. 15.1.1-1) Transition in power management mode
– 30 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
(1)
(2)
(3)
(4)
When the RESET signal is released, the disc detection is performed after self-diagnostics are completed.
If the disc is loaded, the mode will switch to the active mode and starting operation will begin.
If the disc is not loaded, the mode will switch to the standby mode.
Using the power management command (IDLE, IDLE IMMEDIATE, STANDBY, STANDBY
IMMEDIATE, SLEEP), the transition from the active mode to the idle, standby or sleep mode, from the
idle mode to the standby or sleep mode, or from the standby mode to the idle or sleep mode is possible.
(5) The transition from the active mode to the idle mode or from the idle mode to the standby mode is also
performed by the timer the has. The timer will be initialized to the specified value when disc detection
operation is under way or when a command which requires disc access is executed. The timer will not be
initialized when a command which does not require disc access is executed in the active mode.
(6) The resumption from the idle or standby mode to the active mode is initiated when a command which
requires disc access is executed.
(7) The resumption after the sleep mode is possible only after the RESET signal, the SRST (bit 2 of the
DEVICE Control Register) or the ATAPI SOFT RESET command is detected. If resumption after the
sleep mode is initiated using the RESET signal, an operation similar to when the power is switched ON
occurs.
(8) If resumption after the sleep mode is initiated using the SRST or the ATAPI SOFT RESET command,
the drive enters the standby mode.
(9) Tray ejection in each of the active, idle, standby and sleep modes is possible.
(10) If the tray is ejected in the active, idle or standby mode, the drive enters the standby mode when the tray
is out or the sleep mode when the tray is ejected in the sleep mode.
(11) If the tray is inserted when the tray is out, the disc detection operation is performed.
(12) If no disc is loaded, the drive will resume a mode when the tray is out.
(13) If the disc is loaded, the drive will resume the active mode. However, the drive resumes the sleep mode
following the TOC read only when the tray is ejected in the sleep mode.
15.2 Active Mode
A state in which the drive is capable of responding in the shortest possible time to an access using a command,
and all the electrical circuitry of the drive, the pickup, spindle motor and sled motor are operating. In the
following cases, the drive will enter the active mode:
(1) While it is being booted after the power is switched ON and self diagnosis is under way.
(2) While the booting operation or Reading of the TOC is under way when the tray is inserted and the disc
is loaded.
(3) While the booting operation or Reading of the TOC is in progress with the power ON and the disc loaded.
(4) While an command that requires disc access is being executed.
(5) Until the drive switches over to other power management mode using the timer in the drive or the
command after either (2), (3) or (4) above is performed.
15.3 Idle Mode
The idle mode has the same operational functions as the active mode. However, the current consumption is
reduced by lowering the rotational speed of the spindle motor in the idle mode.
The transition to the idle mode comes in the following two ways:
(1) When using the timer in the drive:
After executing (2), (3) and (4) in 14.2, if the specified time elapses by the timer in the drive, the mode
will switch from the active mode to the idle mode.
The specified time of the timer is set to 8 seconds.
(2) When using the power management command (IDLE, IDLE IMMEDIATE):
– 31 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
The transition from the active or standby mode is possible using the power management command
(IDLE, IDLE IMMEDIATE).
For details, refer to the Software Specification.
15.4 Standby Mode
Except for the functions required for the reception of a command, all other functions are in the power save
condition. And although the command can be received, a time is required to restore the functions that are in the
power save condition for the command that requires disc access. The transition to the standby mode comes in
the following three ways:
(1) When using the timer in the drive:
After executing (2), (3) and (4) in 15.2, if the specified time elapses by the timer in the drive, the mode
will switch from the active to the standby mode via the idle mode.
Although the specified time of the timer can be preset using the STANDBY command or MODE
SELECT command, it is set to 32 seconds by default. The transition time to the idle mode is included in
the preset value of the timer.
For details, refer to the Software Specification. The timer will be initialized to the specified value after
executing (2), (3) and (4) in 15.2. The timer will not be initialized when a command which does not
require disc access is executed in the active mode.
(2) When using the power management command (STANDBY, STANDBY IMMEDIATE) or START/
STOP UNIT command:
The transition from the active or idle mode is possible using the power management command
(STANDBY, STANDBY IMMEDIATE) or START/STOP UNIT command.
For details, refer to the Software Specification.
(3) When the power is switched ON or a disc is not detected by the disc detection operation while the tray is
being retracted, the drive will enter the standby mode.
15.5 Sleep Mode
The drive enters a state in which all functions are stopped and no command can be received.
The transition to the sleep mode is possible using the SLEEP command.
For details, refer to the Software Specification. The resumption from the sleep mode is possible using the
RESET signal, the SRST (bit 2 of the Device Control Register) or the ATAPI SOFT RESET command.
15.5.1 Tray ejection/insertion in the sleep mode
If the eject button is pressed in sleep mode, the tray will be ejected before sleep mode is entered. If the tray is
inserted while in this state, disc detection is performed; If the disc is loaded on the tray, the start-up operation
is performed before sleep mode is entered. If the disc is not loaded on the tray, sleep mode is entered.
16. OTHERS
16.1 Using the Lens Cleaner
Some commercially available wet-type lens cleaners may sometimes actually make the lens dirtier rather than
cleaning it. In general, we recommend that you avoid using a wet-type lens cleaner.
Use a dry-type lens cleaner.
16.2 RoHS Compliance
The drive complies with European directive "2002/95/EC".
– 32 –
Copyright  2007 TEAC Corporation, All rights reserved.
HARDWARE SPECIFICATION, DW-224E-V83/-V93, Pre-Rev.B
16.3 Safety of Laser Products
When selling this unit or a system with this unit to an end user, print the following text in the instruction manual
or enclose the separate sheet on which the following text is printed with the instruction manual.
This product has been designed and manufactured according to FDA regulations "title 21.
CFR. chapter1, subchapter J. based on the radiation Control for Health and Safety Act of
1968", and is classified as a class 1 laser product. There is no hazardous invisible laser radiation
during operation because invisible laser radiation emitted inside of this product is completely
confined in the protective housings.
The label required in this regulation is shown bellow.
CAUTION
Use of controls or adjustments or performance of procedures other than those specified herein
may result in hazardous radiation exposure.
Optical pickup
Type
Manufacturer
Laser output
Wavelength
Standard
: HOP-6202T
: Hitachi Media Electronics Co., Ltd.
: Less than 1.4mW (Play) and 75mW (Record) on the
objective lens
: 777-787nm (CD)
645-664nm (DVD)
: IEC60825-1 : 2001
(Fig. 16.3-1)
– 33 –
Copyright  2007 TEAC Corporation, All rights reserved.
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising