TPS65986-EVM User`s Guide (Rev. A)

TPS65986-EVM User`s Guide (Rev. A)
User's Guide
SLVUAN9A – June 2016 – Revised July 2016
TPS65986 EVM User's Guide
This document is the user's guide for the TPS65986 evaluation module (TPS65986EVM). The
TPS65986EVM allows for evaluation of the TPS65986 device as part of a stand-alone testing kit and for
development and testing of USB Type-C and power-delivery (PD) end products.
LaunchPad is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
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About this Manual
1
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About this Manual
This user's guide describes the TPS65986EVM. The guide consists of an introduction, setup instructions,
the EVM schematic, board layouts, component views, internal power (PWR) and ground (GND) plane
layouts, and a bill of materials (BOM).
2
Information About Cautions and Warnings
ATTENTION
STATIC SENSITIVE DEVICES
HANDLE ONLY AT
STATIC SAFE WORK STATIONS
CAUTION
This EVM contains components that can potentially be damaged by
electrostatic discharge. Always transport and store the EVM in the supplied
ESD bag when not in use. Handle using an antistatic wristband. Operate on an
antistatic work surface. For more information on proper handling, see
Electrostatic Discharge (ESD).
3
Items Required for Operation
The following items are required to use the TPS65986EVM:
• TPS65986 data sheet (TPS65986 USB Type-C and USB PD Controller and Power Switch)
• TPS65986EVM
• DP-EXPANSION-EVM (DP-EXPANSION-EVM User Guide)
– Testing for DisplayPort, USB data, or both
– Mini DisplayPort to DisplayPort cable
– USB3.0 Standard-A to -B cable
• TotalPhase Aardvark I2C/SPI Host Adapter and USB Standard-B to -A cable
– TPS65986 register access, firmware updating, firmware testing, or a combination of these
– TPS6598x Utilities GUI
• TPS6598x Configuration GUI (www.ti.com/tool/tps6598x-config)
• Barrel-jack adapter or DC power supply
• USB Type-C cable
• USB Type-C to Standard-A cable
4
Introduction
The TPS65986 device is a stand-alone USB Type-C and power-delivery (PD) controller providing cableplug and orientation detection at the USB Type-C connector. Upon cable detection, the TPS65986 device
communicates on the CC wire using the USB PD protocol. When cable detection and USB-PD negotiation
are complete, the TPS65986 device enables the appropriate power path and configures alternate mode
settings for internal and (optional) external multiplexers.
This user's guide describes the TPS65986EVM and the capabilities of the EVM with the DP-EXPANSIONEVM. This guide also contains testing procedures of various PD-power and alternate mode configurations.
The EVM comes with pre-loaded configurations for out of the box functionality and is also customizable
through the TPS6598x Configuration Tool. The TPS65986EVM is a module-based design, allowing the
user to design a custom board to prototype a Type-C PD product using the TPS65986 device. The EVM
has four main connectors which are the Type-C receptacle, barrel-jack power, expansion-board connector,
2
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and two BoosterPack headers. The Type-C receptacle is a full-feature port, with power, SSTX, SSRX,
SBU1, SBU2, DP, and DN signals. The TPS65986 device can be used in self-powered and bus-powered
configurations for added flexibility. When self powered, the EVM can provide up to 60 W of power (20 V, 3
A). The EVM is also capable of sinking 60 W of power (20 V, 3 A) when the device is in powered, dead
battery, or consumer mode. The EVM can perform a power-role swap to provide power when the barrel
jack (external power) is connected. The expansion board connector routes the power, SSTX, SSRX,
USB_RP_P, USB_RP_N, AUX_P, AUX_N, HPD, I2C, and GPIO control for the DP-EXPANSION-EVM.
The BoosterPack headers give access to the GPIO, 3.3-V and 5-V rails, SPI pins, I2C, AUX_P, AUX_N,
USB_RP_P, and USB_RP_N. The BoosterPack headers are configured for mounting on any TI MCU
LaunchPad™ development kit. Custom PCBs may be built as a mechanical interface to the Aardvark if the
I2C, SPI, and GND pins of the BoosterPack headers are wired to the associated pins on a 10-pin male
header to mate with the Aardvark.
5
Setup
This section describes the various EVM features and how to test the various configurations.
5.1
Switch, Push Button, Connector, and Test Point Descriptions
5.1.1
S2 Switch Bank
This switch bank is used to configure the EVM with the pre-loaded firmware. A total of 8 configurations are
set by the state of the switches on S2. The top switch represents bit 0 and the bottom switch represents
bit 3. The left position is low and the right position is high when looking at the EVM with the Type-C
receptacle facing down. Bit 0, bit 1, and bit 2 are used for setting the configuration, and bit 3 is reserved
for future use (should always be set low for now). Bit 0, bit 1, bit 2, and bit 3 are connected to GPIO1,
DEBUG3, DEBUG4, and GPIO5 respectively. The high position is pulled up through an 11-kΩ resistor to
LD0_3V3, and GPIO1, DEBUG3, DEBUG4, and GPIO5 are pulled down through a 100-kΩ resistor.
5.1.1.1
S2: DisplayPort Pin Assignment C to Pin Assignment D Switch
The TPS65986EVM allows for Configuration ID 0 to toggle between 4-lane DisplayPort, 2-lane
DisplayPort, and USB3.0 Multifunction. The first switch in S2 is used to toggle between configurations and
does not change the configuration that was selected within Table 2. When switched to the right position,
the TPS65986EVM changes the configuration to prefer USB3.0 Multifunction and renegotiates the
DisplayPort alternate mode. When switched back to the left position, the TPS65986EVM changes the
configuration to not prefer USB3.0 Multifunction and renegotiates the DisplayPort alternate mode.
5.1.2
S1 HRESET Push-Button
S1 is located on the top-left corner of the EVM, under the Expansion Board Connector. This switch is a
push-button that pulls the HRESET pin (D6), of the TPS65986 device high when pressed. Releasing the
push-button pulls HRESET low again, and the TPS65986 device goes through a hardware reset, which
consists of reloading firmware from the non-volatile memory of the external flash. When changing a
configuration on S2, S1 can be used to reset the TPS65986 device, which loads the updated
configurations without disconnecting power from the EVM.
5.1.3
J4: Barrel-Jack Power Connector
The barrel-jack power connector accepts a 19-V to 20-V DC supply. A standard Dell or HP notebook
adaptor (or similar adaptor) provides the required power. This input provides the PP_HV power rail with
the 19 V to 20 V for high-power PD contracts up to 60 W. Select an appropriate power-capable adapter of
60-W operation. For example, the 130-W Dell part number 492-BBGP could be used.
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5.1.3.1
Barrel Jack Detect
The TPS65986EVM is capable of requesting a power-role swap when the barrel jack is connected on an
EVM that is currently bus powered which is valid for the configuration IDs that are capable of delivering
power. The barrel jack voltage is sensed by a comparator, which drives GPIO2 on the TPS65986 device.
For enabling barrel jack detect or other GPIOs, refer to TPS6598x Utilities Tool User Guide and
TPS65982 and TPS65986 Firmware User’s Guide.
5.1.4
TP3 and TP4: GND Test Points
Two GND test points are provided for attaching an oscilloscope, multi-meter, or external load GND. These
test points are connected to the board GND planes through 4 vias.
5.1.5
TP1 and TP2: CC1/CC2 Test Points
These test points can be used to tie a PD protocol analyzer for PD BMC data or to verify the BMC signal
integrity with an oscilloscope (depending on the cable orientation). A multi-meter or oscilloscope can be
used to measure VCONN when an electronically marked Type-C cable is connected. These test points
are not intended to provide an external load on VCONN. Figure 1 shows the BMC data oscilloscope
capture.
Figure 1. TPS65986 BMC Data
5.1.6
TP5: VBUS Test Point
The VBUS test point is used to measure VBUS at the connector.
CAUTION
With PD power possibly going up to 20 V, use caution when connecting and
disconnecting probes on the TPS65986EVM. The VBUS test point is capable of
drawing up to 3 A for an external load.
A PD-power contract with the necessary capability must be negotiated to draw current from the VBUS test
point. Refer to TPS6598x Configuration GUI User Guide for configuration instruction. Figure 2 shows the
VBUS voltage during PD power negotiation.
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Figure 2. TPS65986 VBUS Voltage Transition
5.1.7
TP6: PP_HV Test Point
This test point is the same power rail as the barrel jack, and it can be used to either provide power to the
TPS65986EVM or measure the voltage supply for the PP_HV. When a custom configuration is created
using the TPS6598x Configuration Tool, the voltage of PP_HV can be set to a minimum of 12 V for highvoltage contracts. The pre-loaded TPS65986EVM firmware expects to have 20 V at PP_HV (or on barrel
jack) for the configured power capabilities. The PP_HV test point can also be used to sink power when
acting as a consumer or a bus powered device. PP_HV is capable of sinking up to 3 A when acting as a
consumer.
5.1.8
J2 and J3: BoosterPack Headers
These headers allow the EVM to be connected to any TI MCU LaunchPad™ development kit. See
Figure 29 for names of all connections.
NOTE: Some of the header pins are not connected unless a 0-Ω option resistor is placed.
5.2
LED Indicators Description
The EVM has multiple LEDs to notify the user what type of connection is present. The LEDs are
separated into two groups: mux control LEDs (MXCTL1-3) and status LEDs.
NOTE: The LEDs are enabled through GPIO in the pre-loaded firmware. Therefore, each must be
enabled separately if configuring a custom image (see TPS6598x Configuration GUI User
Guide and TPS65982 and TPS65986 Firmware User’s Guide).
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MXCTL1-3 LEDs (Super-Speed Mux Contol LED)
These LEDs correspond to the GPIOs required to drive a super-speed multiplexer for the SSTX and
SSRX signals to a Type-C connector. Table 1 summarizes the LED behavior according to the type of
connection.
Table 1. MXCTLx LED Functions
5.2.2
LED Indicator
GPIO
Function
MXCTL1
GPIO_0
Plug Present
MXCTL2
GPIO_3
HD3SS460 AMSEL
MXCTL3
GPIO_6
DP Connection
Status LEDs
The status LEDs indicate the cable orientation, the voltage present on VBUS, and the type of connection.
The CC1 and CC2 LEDs indicate the orientation of the Type-C cable (only one of these LEDs turns on at
a time). LED A is on when 5 V is sourced on VBUS and blinks when a high-voltage contract is in place
(when acting as a source or sink of power). LED B indicates if a USB3 connection is present.
6
Using the TPS65986EVM
This section describes the EVM configurations on the pre-loaded firmware, getting started, and debugging
the EVM.
6.1
Powering the TPS65986EVM
The main power supply for the EVM is J1 barrel jack, which accepts 19 V to 20 V through a barrel jack
adaptor. The EVM can also be powered with an external power supply on TP6. The input voltage can
range to 12 V to 20 V, but the appropriate power profile for PP_HV should be configured in the firmware
using the configuration tool. The EVM can also be powered from a TI MCU LaunchPad™ development kit
by placing R30 and R31 with 0-Ω resistors. If powering with a LaunchPad™ development kit, the EVM
does not support high-voltage contracts or provide high currents at 5 V because of the limited power
capability. The EVM can also be bus powered from the Type-C connector and accepts 5 V to 20 V on
VBUS, depending on the sink configuration.
6.2
Firmware Configurations
The EVM is shipped with a preloaded firmware image that supports various Type-C and PD products. The
firmware is loaded at start-up and the configuration is defined by the state of the S2 switch (see
Section 5.1.1). The top three switches in the switch bank represent B0, B1, and B2, respectively (see
Figure 3). The top switch is used for toggling between DisplayPort configurations for 2-lane DP, USB3
multi-function, and 4-lane DP after the configuration in the table has been loaded. Table 2 lists the eight
configurations on the EVM.
Figure 3. S2 Switch Board
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Table 2. TPS65986EVM Configuration Table
Port Type
CFG
ID
Type-C
Power
PD Sink
Capabilities
PD Source
PD Control Response
Switch S1
PD Control
DP Support
Data Power
A
V at
A
V at
A
V at
A
V at
A
V at
A
V at
A
Data Role Preferred
Power Role Preferred
Initiated DR/PR Swaps
Application
FET Paths Used
0
■←
■←
■←
■←
0
0
0
0
DRP
Rp/Rd
3
5 at
3
20 at
3
—
5 at
0
—
—
UFP_D
Config C and
D
UFP
DR Swap to DFP - Reject
DR Swap to UFP - Accept
Source
PR Swap to Src - Accept
PR Swap to Snk - Reject
Initiate DR swap to UFP
Initiate PR swap to Src
Selfpowered
docking
system
Source: 5 V at 3-A
PP_5V0
Source: 20 V at 3-A
PP_HV
1
1→■
■←0
■←0
■←0
DRP
Rp/Rd
3
5 at
3
—
—
5 at
0
12 to
20 at
2
—
DFP_D
Config C, D
and E
DFP
DR Swap to DFP - Accept
DR Swap to UFP - Reject
Sink
PR Swap to Src - Accept
PR Swap to Snk - Accept
Initiate DR swap to DFP
Initiate PR swap to Snk
Notebook
system
Source: 5 V at 3-A
PP_5V0
Sink: PP_HV
2
■←0
1→■
■←0
■←0
DRP
Rp/Rd
3
5 at
3
20 at
3
—
5 at
0
—
—
DFP_D
Config C, D
and E
DFP
DR Swap to DFP - Accept
DR Swap to UFP - Reject
Source
PR Swap to Src - Accept
PR Swap to Snk - Reject
Initiate DR swap to DFP
Initiate PR swap to Src
Add-in card
Source: 5 V at 3-A
PP_5V0
Source: 20 V at 3-A
PP_HV
3
1→■
1→■
■←0
■←0
DRP
Rp/Rd
3
5 at
3
20 at
3
—
5 at
0
—
—
—
UFP
DR Swap to DFP - Reject
DR Swap to UFP - Accept
Source
PR Swap to Src - Accept
PR Swap to Snk - Reject
Initiate DR swap to UFP
Initiate PR swap to Src
Charging
hard drive
Source: 5 V at 3-A
PP_5V0
Source: 20 V at 3-A
PP_HV
4
■←0
■←0
1→■
■←0
UFP
Rp/Rd
—
—
—
—
5 at
0.9
—
—
UFP_D
Config C and
D
UFP
DR Swap to DFP - Reject
DR Swap to UFP - Accept
Sink
PR Swap to Src - Reject
PR Swap to Snk - Accept
—
Display
dongle
Sink: PP_HV
5
1→■
■←0
1→■
■←0
DRP
Rp/Rd
3
5 at
3
20 at
3
—
5 at
0.9
12 to
20 at
2
—
UFP_D
Config C and
D
UFP
DR Swap to DFP - Reject
DR Swap to UFP - Accept
Source
PR Swap to Src - Accept
PR Swap to Snk - Reject
Initiate DR swap to UFP
Initiate PR swap to Src
Mini-dock
and
multifunction
dongle
Source: 5 V at 3-A
PP_5V0
Source: 20 V at 3-A
PP_HV
Sink: PP_HV
6
■←0
1→■
1→■
■←0
DFP
Rp
3
5 at
3
20 at
3
—
—
—
—
—
DFP
DR Swap to DFP - Accept
DR Swap to UFP - Reject
Source
PR Swap to Src - Accept
PR Swap to Snk - Reject
—
DFP only
host
Source: 5 V at 3-A
PP_5V0
Source: 20 V at 3-A
PP_HV
7
1→■
1→■
1→■
■←0
UFP
Rd
—
—
—
—
5 at
3
12 at
3
20 at
3
—
UFP
DR Swap to DFP - Reject
DR Swap to UFP - Accept
Sink
PR Swap to Src - Reject
PR Swap to Snk - Accept
—
UFP only
host
Sink: PP_HV
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Configuration ID 0: Self-Powered Docking System
This configuration represents a docking system that is connected to an external source of power. The
configuration is a DRP product that accepts power-role swaps to source and data-role swaps to UFP. The
firmware is also configured to automatically request a power-role swap to source or data-role swap to UFP
when appropriate.
Table 3. Configuration ID 0
CFG
ID
Port Type
Switch S1
■
■
■
■
0
←
←
←
←
0
0
0
0
6.2.1.1
Type-C
Power
PD Sink
Capabilities
PD Source
Data Power
A
V at
A
DRP
Rp/Rd
3
5 at
3
V at
A
V at
A
V at
A
V at
A
20 at
3
—
5 at
0
—
V at
A
—
PD Control Response
PD Control
DP Support
UFP_D
Config C and
D
Application
Data Role Preferred
Power Role Preferred
Initiated DR/PR Swaps
UFP
DR Swap to DFP - Reject
DR Swap to UFP - Accept
Source
PR Swap to Src - Accept
PR Swap to Snk - Reject
Initiate DR swap to UFP
Initiate PR swap to Src
Selfpowered
docking
system
FET Paths Used
Source: 5 V at 3-A
PP_5V0
Source: 20 V at 3-A
PP_HV
Power Configurations
This configuration supports sourcing up to 60 W and has two source profiles. This configuration can
provide 5 V at 3 A and 20 V at 3 A through the PP_HV path. This configuration only requests a 5-V at 0 A
contract as a sink because it is a docking system that is externally powered.
6.2.1.2
Data Configurations
This configuration is a UFP in terms of data for USB and DisplayPort functionality. When connected to
another DisplayPort UFP_D product, the DisplayPort alternate mode is not established because two
UFP_D products are connected. The ideal connections are to a DFP_D DisplayPort product or a USB
Host. The DP-EXPANSION-EVM (DisplayPort sink board) allows the user to use the USB and DisplayPort
signals.
6.2.2
Configuration ID 1: Notebook System
This configuration represents a notebook system that is battery powered. The configuration is a DRP
product that accepts power-role swaps to source or sink and data-role swaps to DFP. The firmware is also
configured to automatically request a power-role swap to sink or data-role swap to DFP when appropriate.
This configuration rejects any data-role swaps to UFP because it is a data host.
Table 4. Configuration ID 1
Port Type
CFG
ID
Switch S1
1
1→ ■
■← 0
■← 0
■← 0
6.2.2.1
Type-C
Power
PD Sink
Capabilities
PD Source
Data Power
A
V at
A
DRP
Rp/Rd
3
5 at
3
V at
A
V at
A
V at
A
V at
A
V at
A
—
—
5 at
0
12 to
20 at
2
—
PD Control Response
PD Control
DP Support
DFP_D
Config C, D
and E
Application
Data Role Preferred
Power Role Preferred
Initiated DR/PR Swaps
DFP
DR Swap to DFP - Accept
DR Swap to UFP - Reject
Sink
PR Swap to Src - Accept
PR Swap to Snk - Accept
Initiate DR swap to DFP
Initiate PR swap to Snk
Notebook
system
FET Paths Used
Source: 5 V at 3-A
PP_5V0
Sink: PP_HV
Power Configurations
This configuration supports sourcing up to 15 W and has one source profile. This configuration can
provide 5 V at 3 A, and has two sink profiles through the PP_HV path: 5 V at 0 A and 12 V to 20 V at 2 A.
When an appropriate source capability is advertised, it requests a high-voltage contract because the
notebook requires a higher voltage to charge.
6.2.2.2
Data Configurations
This configuration is a DFP in terms of data for USB and DisplayPort functionality. When connected to
another DisplayPort DFP_D product, the DisplayPort alternate mode is not established because of two
DFP_D products being connected. The ideal connections are to a UFP_D DisplayPort product or a USB
device. The DP-EXPANSION-EVM (DisplayPort source board) allows the user to use the USB and
DisplayPort signals into a legacy notebook.
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6.2.3
6.2.3 Configuration ID 2: Add-In Card
This configuration represents an add-in card or motherboard host that is self-powered. The configuration is
a DRP product that accepts power-role swaps to source and data-role swaps to DFP. The firmware is also
configured to automatically request a power-role swap to source or data-role swap to DFP when
appropriate. This configuration rejects a data-role swap to UFP because it is a data host.
Table 5. Configuration ID 2
Port Type
CFG
ID
Switch S1
2
■← 0
1→ ■
■← 0
■← 0
6.2.3.1
Type-C
Power
PD Sink
Capabilities
PD Source
Data Power
A
V at
A
DRP
Rp/Rd
3
5 at
3
V at
A
V at
A
V at
A
V at
A
V at
A
20 at
3
—
5 at
0
—
—
PD Control Response
PD Control
DP Support
DFP_D
Config C, D
and E
Application
Data Role Preferred
Power Role Preferred
DFP
DR Swap to DFP - Accept
DR Swap to UFP - Reject
Source
PR Swap to Src - Accept
PR Swap to Snk - Reject
FET Paths Used
Initiated DR/PR Swaps
Initiate DR swap to DFP
Add-in card
Initiate PR swap to Src
Source: 5 V at 3-A
PP_5V0
Source: 20 V at 3-A
PP_HV
Power Configurations
This configuration supports sourcing up to 60 W and has two source profiles. This configuration can
provide 5 V at 3 A and 20 V at 3 A through the PP_HV path. This configuration only requests a 5 V at 0 A
contract because it is an add-in card or motherboard that is externally powered.
6.2.3.2
Data Configurations
This configuration is a DFP in terms of data for USB and DisplayPort functionality. When connected to
another DisplayPort DFP_D product, the DisplayPort alternate mode is not established because two
DFP_D products are connected. The ideal connections are to a UFP_D DisplayPort product or a USB
device. The DP-EXPANSION-EVM (DisplayPort source board) allows the user to route the USB and
DisplayPort signals into a legacy notebook.
6.2.4
Configuration ID 3: Charging Hard Drive
This configuration represents a charging hard drive that is self-powered. The configuration is a DRP
product that accepts power-role swaps to source and data-role swaps to UFP. The firmware is configured
to automatically request a power-role swap to source or data-role swap to DFP when appropriate. The
configuration rejects a data-role swap to DFP because it is a data device.
Table 6. Configuration ID 3
Port Type
CFG
ID
Switch S1
3
1→ ■
1→ ■
■← 0
■← 0
6.2.4.1
Type-C
Power
PD Sink
Capabilities
PD Source
Data Power
A
V at
A
DRP
Rp/Rd
3
5 at
3
V at
A
V at
A
V at
A
V at
A
V at
A
20 at
3
—
5 at
0
—
—
PD Control Response
PD Control
DP Support
Application
Data Role Preferred
—
UFP
DR Swap to DFP - Reject
DR Swap to UFP - Accept
Power Role Preferred
Initiated DR/PR Swaps
Source
PR Swap to Src - Accept
PR Swap to Snk - Reject
Initiate DR swap to UFP
Initiate PR swap to Src
Charging
hard drive
FET Paths Used
Source: 5 V at 3-A
PP_5V0
Source: 20 V at 3-A
PP_HV
Power Configurations
This configuration supports sourcing up to 60 W and has two source profiles. The configuration can
provide 5 V at 3 A and 20 V at 3 A through the PP_HV path. This configuration only requests a 5 V at 0 A
contract because it is a hard drive that is externally powered.
6.2.4.2
Data Configurations
This configuration is a UFP in terms of data for USB data only. The DP-EXPANSION-EVM( DisplayPort
source board) can be used to bring out the USB signals.
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Configuration ID 4: Display Dongle
This configuration represents a display dongle that is bus-powered only. The configuration is a UFP
product that accepts power-role swaps to sink and data-role swaps to UFP. This configuration rejects a
data-role swap to DFP because it is a data device.
Table 7. Configuration ID 4
CFG
ID
Switch S1
4
■← 0
■← 0
1→ ■
■← 0
6.2.5.1
Port Type
Type-C
Power
PD Sink
Capabilities
Data Power
A
V at
A
V at
A
V at
A
V at
A
V at
A
V at
A
UFP
Rp/Rd
—
—
—
—
5 at
0.9
—
—
PD Source
PD Control Response
PD Control
DP Support
Data Role Preferred
UFP_D
Config C and
D
UFP
DR Swap to DFP - Reject
DR Swap to UFP - Accept
Power Role Preferred
Sink
PR Swap to Src - Reject
PR Swap to Snk - Accept
Application
FET Paths Used
Display
dongle
Sink: PP_HV
Initiated DR/PR Swaps
—
Power Configurations
This configuration does not support source profiles. It will request a 5-V at 900 mA contract to connect as
a bus powered device to all existing Type-C PD notebooks.
6.2.5.2
Data Configurations
This configuration is a UFP in terms of data for USB and DisplayPort functionality. When connected to
another DisplayPort UFP_D product, the DisplayPort alternate mode is not established because two
UFP_D products are connected. The ideal connections are to a DFP_D DisplayPort product or a USB
host. The DP-EXPANSION-EVM (DisplayPort sink board) can be used to route the USB and DisplayPort
signals.
6.2.6
Configuration ID 5: Mini-Dock or Multifunction Dongle
This configuration represents a mini-docking system or multifunction dongle device that can be self or bus
powered. This configuration is a DRP product that accepts power-role swaps to source and data-role
swaps to UFP. The firmware is also configured to automatically request a power-role swap to source or
data-role swap to UFP when appropriate. The configuration rejects a data-role swaps to DFP because it is
a device.
Table 8. Configuration ID 5
Port Type
CFG
ID
Switch S1
5
1→ ■
■← 0
1→ ■
■← 0
6.2.6.1
Type-C
Power
PD Sink
Capabilities
PD Source
Data Power
A
V at
A
DRP
Rp/Rd
3
5 at
3
V at
A
V at
A
V at
A
V at
A
V at
A
20 at
3
—
5 at
0.9
12 to
20 at
2
—
PD Control Response
PD Control
DP Support
Application
Data Role Preferred
UFP_D
Config C and
D
UFP
DR Swap to DFP - Reject
DR Swap to UFP - Accept
Power Role Preferred
Source
PR Swap to Src - Accept
PR Swap to Snk - Reject
FET Paths Used
Initiated DR/PR Swaps
Mini-dock
Initiate DR swap to UFP
and
Initiate PR swap to Src multifunction
dongle
Source: 5 V at 3-A
PP_5V0
Source: 20 V at 3-A
PP_HV
Sink: PP_HV
Power Configurations
This configuration supports sourcing up to 60 W and has two source profiles. The configuration can
provide 5 V at 3 A and 20 V at 3 A through the PP_HV path. This configuration requests a 5 V at 900 mA
contract to connect as a bus powered device to all existing Type-C PD notebooks.
6.2.6.2
Data Configurations
This configuration is a UFP in terms of data for USB and DisplayPort functionality. When connected to
another DisplayPort UFP_D product, the DisplayPort alternate mode is not established because two
UFP_D products are connected. The ideal connections are to a DFP_D DisplayPort product or a USB
host. The DP-EXPANSION-EVM (DisplayPort sink board) can be used to bring out the USB and
DisplayPort signals.
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6.2.7
Configuration ID 6: DFP Only Host
This configuration represents a DFP only host that is self-powered. The DFP product rejects a data-role
swap to UFP and a power-role swap to sink.
Table 9. Configuration ID 6
Port Type
CFG
ID
Switch S1
6
■← 0
1→ ■
1→ ■
■← 0
6.2.7.1
Type-C
Power
PD Sink
Capabilities
PD Source
Data Power
A
V at
A
DFP
Rp
3
5 at
3
V at
A
V at
A
V at
A
V at
A
V at
A
20 at
3
—
—
—
—
PD Control Response
PD Control
DP Support
Application
Data Role Preferred
Power Role Preferred
Initiated DR/PR Swaps
DFP
DR Swap to DFP - Accept
DR Swap to UFP - Reject
Source
PR Swap to Src - Accept
PR Swap to Snk - Reject
—
DFP only
host
FET Paths Used
Source: 5 V at 3-A
PP_5V0
Source: 20 V at 3-A
PP_HV
Power Configurations
This configuration supports sourcing up to 60 W and has two source profiles. The configuration can
provide 5 V at 3 A and 20 V at 3 A through the PP_HV path. This configuration is a DFP only and does
not have sink power profiles.
6.2.7.2
Data Configurations
This configuration is a DFP in terms of data for USB only. The DP-EXPANSION-EVM (DisplayPort source
board) can be used to route the USB signal into a legacy notebook.
6.2.8
Configuration ID 7: UFP Only Device
This configuration represents a UFP only device that is bus powered. The UFP product rejects a data-role
swap to DFP and a power-role swap to source.
Table 10. Configuration ID 7
CFG
ID
Switch S1
7
1→ ■
1→ ■
1→ ■
■←0
6.2.8.1
Port Type
Type-C
Power
PD Sink
Capabilities
Data Power
A
V at
A
V at
A
V at
A
V at
A
UFP
Rd
—
—
—
—
5 at
3
PD Source
V at
A
V at
A
12 at 20 at
3
3
PD Control Response
PD Control
DP Support
Data Role Preferred
—
UFP
DR Swap to DFP - Reject
DR Swap to UFP - Accept
Power Role Preferred
Sink
PR Swap to Src - Reject
PR Swap to Snk - Accept
Application
FET Paths Used
UFP only
host
Sink: PP_HV
Initiated DR/PR Swaps
—
Power Configurations
This configuration is UFP only and does not have source profiles. This configuration supports three sink
profiles: 5 V at 3 A, 12 V at 3 A, and 20 V at 3 A.
6.2.8.2
Data Configurations
This configuration is a UFP in terms of data for USB only. The DP-EXPANSION-EVM (DisplayPort sink
board) can be used to route the USB signals.
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6.3
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Connecting the TPS65986EVM
Various Type-C cables can be used to connect the EVM to a legacy Type-A host, legacy Type-A device,
or Type-C device.
6.3.1
Connecting to a Legacy Type-A Host
Using a Type-A plug to Type-C cable allows connection to a legacy host. When the billboarding and
endpoint functions are enabled on the EVM, the user can access the registers and update the firmware by
using the TPS6598x Utilities GUI. The EVM can be powered from the Type-A to Type-C cable and does
not require a power-supply function with the TPS65986x Utilities GUI. Figure 4 shows how the TPS65986
device is connected to a notebook with the TPS6598x Utilities GUI.
Notebook with
TPS6598x Utilities
GUI
(Connected with
Type-A)
Type-A to Type-C Cable
TPS65986-EVM
Figure 4. Connecting EVM to Legacy Host
6.3.2
Connecting to a Legacy Type-A Device
Using a Type-C to Type-A receptacle cable allows for connection to a legacy USB device, such as a flashdrive. The TPS65986 device cannot act as a host but can pass the USB connection to a host by using the
DP-EXPANSION-EVM (DisplayPort source board). Figure 5 shows how the notebook, DP-EXPANSIONEVM, TPS65986EVM, cable, and flash drive are connected
Notebook
(DP and USB
Source)
USB Source
DP Source
DP-EXPANSIONEVM
(Source)
TPS65986-EVM
Type-C to Type-A
Flash Drive
Figure 5. Connecting EVM to Type-A Device
6.3.3
Connecting to Type-C Devices
Using a Type-C cable allows for connection to a Type-C device or host. When two TPS65986EVMs are
used with the DP-EXPANSION-EVM (source and sink boards), a complete Type-C system can be verified.
The DisplayPort alternate mode is entered when the two setups appropriately configure as defined in
Table 2. The source setup requires a USB source with DisplayPort to provide data to the sink board. A
monitor can be connected to sink board, along with a USB device to connect to the source board. Figure 6
shows how the boards are connected.
NOTE: Signal integrity can be a factor on USB and DisplayPort video quality because of going
through multiple connectors and cables.
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Notebook
(DP and USB
Source)
USB Source
Monitor
(DisplayPort)
DP Source
USB
Device
DP SInk
DP-EXPANSIONEVM
(Source)
USB Sink
DP-EXPANSIONEVM
(Sink)
TPS65986-EVM
Type-C Cable
TPS65986-EVM
Figure 6. Connecting EVM to EVM for Type-C System
Figure 7 shows how a source setup can be connected to a Type-C device (DisplayPort, USB, or both),
such as a Type-C flash drive, Type-C to DisplayPort dongle, Type-C to HDMI, or Type-C docking system.
Notebook
(DP and USB
Source)
Connection Options
USB Source
DP Source
Type-C Cable
Type-C
Docking System
Type-C to Type-A Cable
Type-A
Flash Drive
Type-C to DP/HDMI Dongle
Monitor
DP-EXPANSIONEVM
(Source)
TPS65986-EVM
Figure 7. Connecting EVM to Type-C Devices
Figure 8 shows how a sink setup can be connected to a Type-C host, such as MacBook or ChromeBook
Pixel, to enter the DisplayPort alternate mode. The sink allows DisplayPort and USB connections to the
notebooks.
Monitor
(DisplayPort)
USB
Device
DP SInk
USB Sink
DP-EXPANSIONEVM
(Sink)
Type-C Notebook
(MacBook/
ChromeBook)
Type-C Cable
TPS65986-EVM
Figure 8. Connecting EVM to Type-C Host
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6.3.4
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Testing DisplayPort Alternate Mode
The DisplayPort alternate mode can be tested with a non-Type-C notebook, allowing the user to simulate
a DisplayPort DFP_D (video source) or UFP_D (video sink). Table 11 lists the testing flow used to verify
DisplayPort functionality with two TPS65986EVMs and the DP-EXPANSION-EVM (DIsplayPort source
and sink boards).
CAUTION
Do not connect the DP-EXPANSION-EVM to the TPS65986EVM when the
barrel jack is connected—this may result in a short if the J5 expansion board
connectors are misaligned.
The required hardware is listed as follows:
• A Windows PC with a USB Type-A receptacle and DisplayPort video output
– USB3.0 Type-A to Type-B cable
– USB3.0 flash drive
– USB2.0 Type-A to Type-B cable
• USB Type-C Cable
• 1080p Monitor with DisplayPort input
• Mini DisplayPort to DisplayPort cable
• Aardvark I2C/SPI Host Adapter (Used for programming the TPS695986-EVM and interfacing with
Utilities GUI)
• ACS002 DP-EXPANSION-EVM (source and sink board)
• Two TPS65986EVMs with base firmware (preloaded before shipping)
• Dell laptop power-supply model: DA130PE1-00
Table 11. DisplayPort Testing Table
Test Step
Pass Criteria
Left switch setting:
B0: →
B1: ←
B2: ←
Right switch setting:
B0: ←
B1: ←
B2: ←
Connect the ACS002
DisplayPort source board to
board on left output of the PC
and USB3.0 output of the PC.
14
DisplayPort source board should be connected to the DisplayPort
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Table 11. DisplayPort Testing Table (continued)
Test Step
Pass Criteria
Connect the ACS002
DisplayPort sink board to board
DisplayPort sink board should be connected to the DisplayPort input
on right of the monitor and to a
USB3.0 flash drive.
Connect the two EVM setups
with a Type-C cable and
connect barrel jack
EVMs negotiate a high-voltage 20-V contract (on VBUS) and enter the DisplayPort alternate
mode.
Check for video on DisplayPort
Successfully copy and paste a file to and from the USB flash drive. Extend the PC to the
monitor and verify USB flash
DisplayPort monitor and play video to verify video stream.
drive is accessible
6.4
Debugging the EVM
This section describes various debugging examples.
NOTE: The testing and debugging approaches on the EVM can be applied to an actual system to
help identify any issues.
6.4.1
Connection Not Established
The following checks can help resolve issues when connecting the EVM to another Type-C device or EVM
and no status LEDs are on:
• Verify that a firmware image is loaded in on the TPS65986 device using the TPS6598x Utilities GUI.
• Verify the CC lines are toggling for dual-role port functionality (see Figure 9).
• Verify the following system supplies:
– VIN_3V3: 3.3 V
– LDO_3V3: 3.3 V
– LDO_1V8D/A: 1.8 V
– PP_5 V0/PP_CABLE: 5 V
– PP_HV: 20 V
• Verify that the devices connected are compatible (see Table 2). Some of the compatible connections
are listed as follows:
– Dual Role Port → UFP
– Dual Role Port → DFP
– DFP → UFP
• Verify that VBUS is reaching 5 V when connected (see Figure 10)
.
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Figure 9. DRP CC1 and CC2 Toggling
6.4.2
Figure 10. Type-C Connection and VBUS
Reseting Behavior
Improper configurations and shorts can cause a Type-C PD system to constantly reset. Use the following
checks to debug these types of issues:
• Verify that the required power paths have the correct voltages:
– PP_5 V0/PP_CABLE: 5 V
– PP_HV: 20 V (or appropriately configured voltage)
• Probe VBUS, CC1, and CC2 to check for any anomalies. Figure 11 shows a successful power
contract.
• When a short occurs on VBUS, the initial 5 V on VBUS is not present.
• Check for a small spike during a cable attach event to verify that the 5-V switch is closed and is
opened once the overcurrent event is detected.
Figure 11. Type-C Connection and PD Negotiation
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Programming the TPS65986EVM Firmware
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7
Programming the TPS65986EVM Firmware
This section describes loading firmware onto the TPS65986EVM, using the Aardvark adapter as the
hardware interface and explains that there are multiple interface options available in the software GUI.
NOTE: Other methods of firmware loading are available and are discussed in the TPS6598x Utilities
Tool User Guide. For example, when performing firmware updates in the field the TPS65986
will act as the SPI Master and firmware data is written to the TPS65986 using I2C.
7.1
Connecting the TPS65986EVM to the Aardvark SPI Pins with Jumper Wires
Wire the Aardvark SPI pins to the corresponding SPI pins on the TPS65986EVM J2 and J3 headers as
shown in Figure 12. Note that Figure 12 matches the Top view of headers J2 and J3 of the
TPS65986EVM and jumper wires may be connected to the Top (pins) or Bottom (receptacle) side of the
BoosterPack headers. This method is used to directly program the SPI Flash from the Aardvark,
bypassing the TPS65986EVM, either to write a firmware image on a blank SPI Flash IC or during debug
when multiple firmware images are written in a short period of time to test the effects of firmware
configuration settings.
NOTE: Once wire connections are made, connect the Dell Power Adapter (Barrel Jack AC Adapter)
to the TPS65986EVM to power up the board.
Figure 12. Aardvark Wired to SPI Pins of TPS65986EVM J2 & J3 Headers
7.2
Establishing a Connection to the TPS65986EVM Using the Host Interface SW Tool
Use the following steps to connect the software (SW) of the Host Interface Utility Tool to the
TPS65986EVM through the interface adapter (Aardvark, FTDI-based, or USB Endpoint):
Step 1. Open the TPS6598x Utilities GUI, click the Configure link on the left side of the GUI, verify
the settings, and confirm connection by clicking the Test Configuration Settings button (see
Figure 13). When using an Aardvark adapter, select Aardvark for USB to I2C/SPI Adapter
and Port 0 for both I2C Port and SPI Port.
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Figure 13. FTDI-based Adapter Configuration Settings
Step 2.
Step 3.
Wait until the results are displayed in the Connection Results section. An EVM that does not
have firmware displays BOOT after the Mode Register returns field (see Figure 14).
Click the Save Settings as Default button to save configuration settings.
Figure 14. Host Interface Adapter Configuration Test (Error-Free Results)
7.3
Loading the EVM Firmware
Use the following steps to load the EVM firmware:
Step 1. Click the SPI FW Update link on the left side of the GUI (see Figure 15).
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Figure 15. SPI Firmware Update Screen
Step 2.
Choose the TPS65986EVM firmware image to load by clicking on the Choose File button
(see Figure 16). Select the appropriate EVM image (2 region binary file) in the window and
verify that it is 191 KB in size. Click the Open button to load the file to the TPS6598x Utilities
GUI (see Figure 17).
Figure 16. SPI Firmware Update—Choose File
Figure 17. Figure 19. SPI Firmware Update—Select Flash Image (191-KB .bin file)
Step 3.
Click the Program Flash Image button (see Figure 18).
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Figure 18. SPI Firmware Update—Start Flash Update
Step 4.
Step 5.
Wait until the programming process is complete.
Verify that the firmware was successfully loaded. Figure 19 shows a successful firmware
update.
Figure 19. SPI Firmware Update—Firmware Update Complete
Step 6.
Step 7.
20
Press the RESET button (S1) on the top-left side of the TPS65986EVM. Pressing this button
causes the EVM to load the new firmware from flash. Failure to press the Reset button will
result in the TPS65986 continuing to run the previous firmware in volatile memory until a
power cycle occurs or the Reset button is pressed, even though the new firmware image is
successfully written into the Flash IC's non-volatile memory.
On the TPS6598x Utilities GUI, click the Register List link on the left side of the GUI and then
click MODE (see .Figure 20). This register will check the I2C communication and verify that
the firmware was loaded on the EVM.
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TPS65986EVM Schematic
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Figure 20. Register List
Step 8.
Verify the that the MODE register reads APP (see Figure 21).
Figure 21. Mode Register
8
TPS65986EVM Schematic
Figure 22 shows the block diagram of the main components of the TPS65986EVM. The main schematic
blocks are the processor (Figure 23), power path (Figure 24), power supply (Figure 25), LED indicators
(Figure 26), Type-C (Figure 27), inter PCB (Figure 28), booster connectors (Figure 29), and hardware.
The main power comes from the barrel jack (J4) and has a TVS diode (D1) for any transient voltage
spikes introduced by connecting the barrel jack.
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TPS65986EVM Schematic
J1
9
8
7
6
5
4
SHIELD
SHIELD
SHIELD
SHIELD
GND
GND
www.ti.com
U_ACS001A_Power_Supply
ACS001A_Power_Supply.SchDoc
P3V3
POWER
SENSE
POWER
2
EXT_Power
VExt
1
P3V3
USB_5V
D1
3
USB_5V
PGood
P5V
JPD1135-509-7F
GND
GND
U_ACS001A_Power_Path
ACS001A_Power_Path.SchDoc
P5V
VBUS
PPHV
LDO_3V3
VOUT_3V3
VBUS_SENSE
VOUT_3V3
U_ACS001A_Processor
ACS001A_Processor.SchDoc
U_ACS001A_Booster_Connectors
ACS001A_Booster_Connectors.SchDoc
SWD_DATA
SWD_CLK
P3V3
LDO_3V3
VBUS_SENSE
GPIO0
GPIO1
GPIO2
GPIO3
GPIO5
GPIO6
GPIO7
GPIO8
DEBUG1
DEBUG2
DEBUG3
DEBUG4
DEBUG_CTL1
DEBUG_CTL2
U_ACS001A_Hardware_ANSI-B
ACS001A_Hardware_ANSI-B.SchDoc
SWD_DATA
SWD_CLK
MRESET
RESETZ
MRESET
RESETZ
BP_GPIO0
BP_GPIO1
BP_GPIO2
BP_GPIO3
BP_GPIO5_HPD
BP_GPIO6
BP_GPIO7
BP_GPIO8
BP_DEBUG_1
BP_DEBUG_2
BP_DEBUG_3
BP_DEBUG_4
DEBUG_CTL1
DEBUG_CTL2
SPI_MOSI
SPI_MISO
SPI_SSZ
SPI_CLK
C_USB_T_P
C_USB_T_N
C_USB_B_P
C_USB_B_N
C_CC1
C_CC2
C_SBU_P
C_SBU_N
P3V3
P5V
VOUT_3V3
VOUT_3V3
GPIO0
GPIO1
GPIO2
GPIO3
GPIO5
GPIO6
GPIO7
GPIO8
DEBUG1
DEBUG2
DEBUG3
DEBUG4
DEBUG_CTL1
DEBUG_CTL2
SPI_MOSI
SPI_MISO
SPI_SSZ
SPI_CLK
UART_TX
UART_RX
UART_TX
UART_RX
LDO_3V3
I2C_SDA1
I2C_SCL1
I2C_IRQ1Z
AUX_N
AUX_P
I2C_IRQ1Z
I2C_SCL1
I2C_SDA1
USB_RP_P
USB_RP_N
AUX_N
AUX_P
GPIO4_HPD
U_ACS001A_Inter_PCB
ACS001A_Inter_PCB.SchDoc
LDO_3V3
PPHV
P3V3
USB_5V
P5V
AUX_N
AUX_P
GPIO4_HPD
U_ACS001A_Type_C
ACS001A_Type_C.SchDoc
USB2_RP_P
USB2_RP_N
VBUS
C_USB_T_P
C_USB_T_N
C_USB_B_P
C_USB_B_N
C_CC1
C_CC2
C_SBU_P
C_SBU_N
C_SSRX1_P
C_SSRX1_N
C_SSTX1_P
C_SSTX1_N
C_SSRX2_P
C_SSRX2_N
C_SSTX2_P
C_SSTX2_N
I2C1_IRQz
I2C1_SCL
I2C1_SDA
U_ACS001A_LED_Indicators
ACS001A_LED_Indicators.SchDoc
HPD
LED_Supply
USB2_P
USB2_N
C_SSRX1_P
C_SSRX1_N
C_SSTX1_P
C_SSTX1_N
C_SSRX2_P
C_SSRX2_N
C_SSTX2_P
C_SSTX2_N
C_SSRX1_P
C_SSRX1_N
C_SSTX1_P
C_SSTX1_N
C_SSRX2_P
C_SSRX2_N
C_SSTX2_P
C_SSTX2_N
GPIO_0
GPIO_2
GPIO_3
GPIO_6
GPIO_7
GPIO_8
DEBUG_1
DEBUG_2
BP_GPIO0
BP_GPIO2
BP_GPIO3
BP_GPIO6
BP_GPIO7
BP_GPIO8
BP_DEBUG_1
BP_DEBUG_2
MUX_CTL_1
MUX_CTL_2
MUX_CTL_3
CC1_LED
TI_MODE_LED
PDIO_LED
CC2_LED
Copyright © 2016, Texas Instruments Incorporated
Figure 22. TPS65986EVM Block Diagram
22
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TPS65986EVM Schematic
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Figure 23 shows the processor block, which contains the TPS65986 PD protocol functions, flash for the TPS65986 device, S2 for the firmware
configuration, and the required passives.
LDO_3V3
LDO_3V3
C1
R1
3.3k
0.1µF
U1
8
SPI_SSZ
VCC
1
CS
6
CLK
GND
SPI_CLK
DI/IO0
DO/IO1
WP/IO2
HOLD/IO3
5
2
3
7
GND
4
SPI_MOSI
SPI_MISO
R2
3.3k
R3
3.3k
R4
3.3k
W25Q80DVSNIG
GND
GPIO1
DEBUG3
DEBUG4
GPIO5
U2A
R5
R6
GPIO0
8
7
6
5
GPIO2
GPIO3
GPIO4_HPD
R13
R14
R15
R16
100k
100k
100k
100k
S1
11.0k 1
11.0k 2
11.0k 3
11.0k 4
GND
GPIO6
GPIO7
GPIO8
I2C_SCL1
I2C_SDA1
I2C_IRQ1Z
F1
SPI_MOSI
SPI_MISO
SWD_DATA
SWD_CLK
DEBUG_CTL1
R19
100k
DNP
R20
100k
DNP
R22
100k
GND
I2C_SCL1 D2
I2C_SDA1 D1
I2C_IRQ1Z C1
F4
G4
E4
D5
DEBUG_CTL2
R21
100k
B2
C2
D10
G11
C10
E10
G10
D7
H6
B4
A4
B3
A3
SPI_SSZ
SPI_CLK
LDO_3V3
0
GND
LDO_3V3
R7
R8
R10
R11
15.0k G2
UART_RX
UART_TX
AUX_P
AUX_N
USB2_RP_P
USB2_RP_N
DEBUG1
DEBUG2
R27
R28
R29
3.83k I2C_SCL1
3.83k I2C_SDA1
10.0k I2C_IRQ1Z
GND
I2C_ADDR
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
C_CC1
L9
RPD_G1
K9
C_CC2
I2C_SCL1
I2C_SDA1
I2C_IRQ1Z
SPI_MOSI
SPI_MISO
SPI_SSZ
SPI_CLK
0
C_CC2
B10
SENSEN
A10
HRESET
D6
RESET
F11
MRESET
E11
C3
330pF
0
VBUS_SENSE
GND
S2
R17
C4
0.01µF
RESETZ
C_USB_TP
C_USB_TN
C_USB_T_P
C_USB_T_N
C_USB_BP
C_USB_BN
K7
L7
C_USB_B_P
C_USB_B_N
C_SBU1
C_SBU2
K8
L8
C_SBU_P
C_SBU_N
H7
J1
J2
AUX_P
AUX_N
L5
K5
USB_RP_P
USB_RP_N
SS
DEBUG1
DEBUG2
NC
NC
NC
NC
NC
DEBUG3
DEBUG4
P3V3
1.00k
R18
100k
MRESET
K6
L6
DEBUG_CTL1
DEBUG_CTL2
C_CC1
TP2
L10
SENSEP
UART_RX
UART_TX
L2
K2
R9
K10 L11_NC R12
SWD_DAT
SWD_CLK
TP1
C2
330pF
RPD_G2
F2
E2
L3
K3
LDO_3V3
R_OSC
GND
C_USB_T_P
C_USB_T_N
C_USB_B_P
C_USB_B_N
C_SBU_P
C_SBU_N
C5 0.22µF
R23
R24
R25
R26
DNP
DNP
DNP
DNP
1.00M
1.00M
1.00M
1.00M
LDO_3V3
A9
B6
B9
K4
L11 L11_NC
GND
GND
TPS65986ABZQZR
Copyright © 2016, Texas Instruments Incorporated
Figure 23. TPS65986EVM Processor Block
SLVUAN9A – June 2016 – Revised July 2016
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TPS65986EVM Schematic
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Figure 24 shows the power-path block, which contains the power portion of the TPS65986 device and the required passives.
TP3
TP4
VBUS_SENSE
C6
1µF
GND
GND
GND
D2
GND
TP5
U2B
C7
1µF
E1
F10
GND
LDO_3V3
R68
0
DNP
LDO_1V8D R69
A1
A5
B5
B8
D8
E5
E6
E7
E8
F5
F6
F7
F8
G5
G6
G7
G8
H4
H5
H8
L1
L4
0
LDO_BMC
BUSPOWERZ
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
L1
VBUS
VBUS
VBUS
VBUS
H11
J10
J11
K11
PP_HV
PP_HV
PP_HV
PP_HV
A8
A7
A6
B7
C12
10µF
C13
0.1µF
PP_5V0
PP_5V0
PP_5V0
PP_5V0
A11
B11
C11
D11
C14
22µF
C15
0.1µF
PP_CABLE
C8
0.01µF
C9
0.01µF
C10
0.01µF
C11
0.01µF
TP6
GND
PPHV
GND
C16
150µF
P5V
H10
GND
VDDIO
B1
VIN_3V3
H1
VOUT_3V3
H2
LDO_3V3
G1
LDO_1V8A
LDO_1V8D
VBUS
21 ohm
P3V3
GND
C17
1µF
LDO_3V3
C18
10µF
K1
LDO_1V8A
C19
1µF
A2
LDO_1V8D
C20
1µF
VOUT_3V3
LDO_3V3
TPS65986ABZQZR
GND
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 24. TPS65986EVM Power Path Block
24
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TPS65986EVM Schematic
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Figure 25 shows the power-supply block, which has all of the board supplies generated and the comparator circuit for barrel jack detection. This
block generates two 5-V supplies and one 3.3-V supply. The P3V3 rail is on in bus-powered and self-powered conditions, and it has the ability to
operate at 4 V to compensate for IR drop through the Type-C cable. The P5V supply can operate at 4.5 V at 100% duty cycle, but it is intended to
supply the 5 V at 3 A when the barrel jack (J4) is connected to the EVM only. USB_5 V is supplied by a boost converter from the main 3.3-V rail
and is intended to ensure there is 5 V for the USB DFP port on the DP-EXPANSION_EVM, when acting bus-powered or self-powered. The
minimum voltage for VExt is 12 V. When using a lower voltage, the comparator circuit can be adjusted to trip at a lower voltage for proper barrel
jack detection.
V5V_Sense
U3
C21
1
VExt
C22
22µF
C23
0.1µF
R70
100k
VIN
BOOT
L2
9
Overlap capacitor footprints since only ever 1 populated
0.1µF
6
VSENSE
PH
2
P5V
C24
22µF
10uH
GND
8
R72
12k
EN
10
COMP
GND
GND
GND
PAD
RT
7
3
4
5
11
C25
22µF
C26
0.1µF
R71 DNPC27
100k
DNP
IMax = 3A
GND
R73
19.1k DNPC28
DNP
R74
8.45k
TPS54335ADRCR
GND
R75 DNPC30
47.5k
DNP
C29
100pF
GND
GND
C31
2200pF
GND
GND
U4
C32
2
C33
22µF
C34
0.1µF
VIN
0.1µF
R78
66.5k
SS
6
C41
22pF
C35
22µF
10uH
VSENSE
5
GND
PAD
7
9
C36
22µF
C37
0.1µF
R77 DNPC38
100k
DNP
IMax = 3A
V3V3_Sense
COMP
GND
R79
32.4k
C40
0.027µF
P3V3
EN
4
GND
Overlap capacitor footprints since only ever 1 populated
8
PH
3
GND
L3
1
BOOT
R76
150k
C42
1800pF
R80 DNPC39
32.4k
DNP
D3
B320A-13-F
TPS54332DDAR
GND
GND
GND
GND
C43
0.1µF
Good @ 11.2V
!Good @9.5V
Peak current 4.5A
L4
GND
0
C46
22pF
R83
15.0k
U5
TLV3012AIDCKR
4
3
5
V+
V-
1
U6
PGood
3
C44
22µF
C45
0.1µF
4
R84
DNP
39k
R85
DNP
560k
GND
2.2µH
6
R82
2
R81
100k
GND
GND
ILim set
Max 1100mA
Typ 900mA
Min 700mA
SW
1
AUX
10
EN
GND
6
Hysterisis
Vh 1.376V
Vl 1.16V
IN
ILIM
ENUSB
7
FAULT
8
USB
PGND
GND
PAD
R86
32.4k
C47
22µF
IMax = 1100 mA (adjustable Ilim)
GND
C48
150µF
9
2
5
11
USB_5V
TPS2500DRCR
GND
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 25. TPS65986EVM Power Supply Block
SLVUAN9A – June 2016 – Revised July 2016
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TPS65986EVM Schematic
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Figure 26 shows the LED indicators block, which contains the LEDs and GPIO control scheme.
2
2
Q3
MUX_CTL_2
Q4
1
2
1
2
MUX_CTL_1
3
R90
1.00k
3
Q2
1
2
TI_MODE_LED
2
Q1
1
D7
White
R89
1.00k
3
R88
1.00k
3
R87
1.00k
PDIO_LED
D6
White
2
D5
White
2
D4
White
1
1
1
1
LED_Supply
1
1
1
GND
2
3
Q6
1
CC1_LED
Q7
1
2
2
CC2_LED
2
Q5
1
R93
1.00k
3
R92
1.00k
3
R91
1.00k
MUX_CTL_3
D10
White
2
D9
White
2
D8
White
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 26. TPS65986EVM LED Indicators Block
26
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Figure 27 shows the Type-C block, which includes the Type-C connector and ESD protection.
U7
Feedthrough
1
2
D1+
D1-
6
7
9
10
NC
NC
NC
NC
U8
D2+
D2-
GND
GND
TPD4E05U06DQAR
4
5
1
2
D1+
D1-
D2+
D2-
4
5
8
3
6
7
9
10
NC
NC
NC
NC
GND
GND
8
3
Feedthrough
GND
TPD4E05U06DQAR
GND
J5
C_SSRX2_N
C_SSRX2_P
H5
1
1
H5
GND
RX1+
RX1VBUS
SBU2
DD+
CC2
VBUS
TX2TX2+
GND
3
C_CC1
C_USB_T_P
C_USB_T_N
C_SBU_P
C_CC1
C_USB_T_P
C_USB_T_N
C_SBU_P
GND
TX1+
TX1VBUS
CC1
D+
DSBU1
VBUS
RX2RX2+
GND
2
C_SSTX1_P
C_SSTX1_N
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
H1
H2
H4
H3
VBUS
B12
B11
B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
VBUS
GND
C_SSRX1_P
C_SSRX1_N
C_SBU_N
C_USB_B_N
C_USB_B_P
C_CC2
C_SBU_N
C_USB_B_N
C_USB_B_P
C_CC2
C_SSTX2_N
C_SSTX2_P
H1
H2
3
GND
H4
H3
H6
2
H6
20-0000016-01
GND
GND
U9
1
2
D1+
D1-
6
7
9
10
NC
NC
NC
NC
Feedthrough
U10
D2+
D2-
GND
GND
TPD4E05U06DQAR
4
5
1
2
D1+
D1-
D2+
D2-
4
5
6
7
9
10
NC
NC
NC
NC
GND
GND
8
3
Feedthrough
8
3
GND
TPD4E05U06DQAR
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 27. TPS65986EVM Type-C Block
SLVUAN9A – June 2016 – Revised July 2016
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TPS65986EVM Schematic
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Figure 28 shows the inter PCB block, which has the connections that go to the DP-EXPANSION-EVM.
J4
I2C1_IRQz
I2C1_SCL
I2C1_SDA
AUX_P
AUX_N
USB2_N
USB2_P
C_SSRX2_P
C_SSRX2_N
C_SSTX1_N
C_SSTX1_P
C_SSTX2_P
C_SSTX2_N
C_SSRX1_N
C_SSRX1_P
1
2
3
4
5
6
LDO_3V3
HPD
7
8
AUX _P
9
10
AUX _N
11
12
USB2_N
13
14
USB2_P
15
16
17
18
C_SSRX
2_P
19
20
C_SSRX
2_N
21
22
23
24
C_SSTX
1_N
25
26
C_SSTX
1_P
27
28
29
30
C_SSTX
2_P
31
32
C_SSTX
2_N
33
34
35
36
C_SSRX
1_N
37
38
C_SSRX
1_P
39
40
GPIO_0
GPIO_2
GPIO_3
GPIO_6
GPIO_7
GPIO_8
DEBUG_2
DEBUG_1
PPHV
USB_5V
P5V
P3V3
LSEM-120-03.0-F-DV-A-N-K-TR
GND
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 28. TPS65986EVM Inter PCB Block
28
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TPS65986EVM Schematic
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Figure 29 shows the booster connectors block, which contain the connections to the BoosterPack headers.
P3V3
UART_TX
UART_RX
VOUT_3V3
AUX_P
AUX_N
SPI_CLK
I2C_IRQ1Z
I2C_SCL1
I2C_SDA1
DNP
R30
DNP
DNP
R32
DNP
R33
DNP
R35
DNP
DNP
R37
DNP
DNP
R38
0
R40
0
R42
0
R44
0
R46
BP_TIVA_3V3
BP_UART_TX
BP_UART_RX
BP_VOUT_3V3
AUX_P
AUX_N
SPI_CLK
I2C_IRQ1Z
I2C_SCL1
I2C_SDA1
1
3
5
7
9
11
13
15
17
19
2
4
6
8
10
12
14
16
18
20
DNP
DNP
R31
BP_TIVA_5V
DNP
R34
DNP
DNP
R36
DNP
DNP
R39
DNP
R41
DNP
R43
DNP
0
R45
0
R47
P5V
DEBUG_CTL1
DEBUG_CTL2
BP_GPIO7
BP_GPIO0
BP_GPIO1
SWD_DATA
R48
3.83k
SWD_CLK
J2
100k
R50
DNP
100k
GND
GPIO4_HPD
GPIO2
GPIO5
GPIO3
GPIO8
DEBUG2
DEBUG4
DEBUG3
USB_RP_P
GND
GPIO7
GPIO0
GPIO1
LDO_3V3
R49
GND
BP_GPIO4_HPD
BP_GPIO2
BP_GPIO5_HPD
BP_GPIO3
0
R51
DNP
DNP
R52
DNP
DNP
R53
DNP
DNP
R55
BP_GPIO8
BP_DEBUG_2
BP_DEBUG_4
BP_DEBUG_3
BP_USB2_RP_P DNP
DNP
R58
DNP
DNP
R60
DNP
DNP
R62
DNP
DNP
R64
DNP
R66 BP_RP_P
DNP
1
3
5
7
9
11
13
15
17
19
2
4
6
8
10
12
14
16
18
20
BP_MRESET
DNP
R54
DNP
DNP
R56
BP_RESETZ
BP_GPIO6
DNP
R57
DNP
BP_SPI_MOSI
0
R59
BP_SPI_MISO
0
R61
DNP
R63
BP_DEBUG_1
DNP
BP_SPI_CSZ
0
R65
BP_RP_N DNP
R67 BP_USB2_RP_N
DNP
MRESET
RESETZ
GPIO6
SPI_MOSI
SPI_MISO
DEBUG1
SPI_SSZ
USB_RP_N
GND
J3
Copyright © 2016, Texas Instruments Incorporated
Figure 29. TPS65986EVM Booster Connector Block
SLVUAN9A – June 2016 – Revised July 2016
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TPS65986EVM Board Layout
9
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TPS65986EVM Board Layout
The following figures contain the PCB layouts of the TPS65986EVM.
30
Figure 30. TPS65986EVM Top Layer
Figure 31. TPS65986EVM Top Layer Component View
Figure 32. TPS65986EVM GND Plane 1
Figure 33. TPS65986EVM Mid Layer 1
TPS65986 EVM User's Guide
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Figure 34. TPS65986EVM GND Plane 2
Figure 35. TPS65986EVM Mid Layer 2
Figure 36. TPS65986EVM Mid Layer 3
Figure 37. TPS65986EVM GND Plane 3
SLVUAN9A – June 2016 – Revised July 2016
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TPS65986EVM Board Layout
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Figure 38. TPS65986EVM Bottom Layer
32
Figure 39. TPS65986EVM Bottom Layer Component
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TPS65986EVM Bill of Materials
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10
TPS65986EVM Bill of Materials
Table 12 list the bill of materials (BOM) for the TPS65986EVM.
Table 12. BOM
Value
Package
Reference
Designator
Quantity
Description
Part Number
Manufacturer
!PCB1
1
C1, C15
2
0.1µF
CAP, CERM, 0.1 µF, 10 V, ±10%, X5R, 0201
ACS001
Any
CL03 A104KP3NNNC
C2, C3
2
330pF
Samsung
CAP, CERM, 330 pF, 16 V, ±10%, X7R, 0201 0201
GRM033R71C331KA01D
MuRata
0201
GRM033R61A103KA01D
MuRata
Printed Circuit Board
0201
C4
1
0.01µF
CAP, CERM, 0.01 µF, 10 V, ±10%, X5R,
0201
C5
1
0.22µF
CAP, CERM, 0.22 µF, 6.3 V, ±20%, X5R,
0201
0201
GRM033R60J224ME90
MuRata
C6
1
1µF
CAP, CERM, 1 µF, 35 V, ±10%, JB, 0402
0402
C1005JB1V105K050BC
TDK
C7, C17, C19, C20
4
1µF
CAP, CERM, 1 µF, 10 V, ±20%, X5R, 0201
0201
CL03 A105MP3NSNC
Samsung
0402
GRM155R71H103KA88D
MuRata
C8, C9, C10, C11
4
0.01µF
CAP, CERM, 0.01 µF, 50 V, ±10%, X7R,
0402
C12
1
10µF
CAP, CERM, 10 µF, 25 V, ±20%, X5R, 0603
0603
GRM188R61E106MA73
MuRata
0402
C1005X7R1H104M
TDK
C13
1
0.1µF
CAP, CERM, 0.1 µF, 50 V, ±20%, C0G/NP0,
0402
C14, C44, C47
3
22µF
CAP, CERM, 22 µF, 10 V, ±20%, X5R, 0603
0603
GRM188R61A226ME15D
MuRata
7343-31
TPSD157K016R0100
AVX
C16, C48
2
150µF
CAP, TA, 150 µF, 16 V, ±10%, 0.1 ohm,
SMD
C18
1
10µF
CAP, CERM, 10 µF, 10 V, ±20%, X5R, 0402
0402
CL05A106MP5NUNC
Samsung
C21, C23, C26, C32,
C34, C43, C45
7
0.1µF
CAP, CERM, 0.1µF, 50V, +/-20%, C0G/NP0,
0402
0402
C1005X7R1H104M
TDK
C22, C24, C25, C33,
C35, C36
6
22µF
CAP, CERM, 22 µF, 35 V, ±20%, X5R, 0805
0805
C2012X5R1V226M125AC TDK
C29
1
100pF
CAP, CERM, 100 pF, 50 V, ±10%, X7R, 0402 0402
CC0402KRX7R9BB101
Yageo America
0402
GRM155R61H222KA01D
MuRata
C31
1
2200pF
CAP, CERM, 2200 pF, 50 V, ±10%, X5R,
0402
C37
1
0.1µF
CAP, CERM, 0.1 µF, 25 V, ±10%, X7R, 0402
0402
GRM155R71E104KE14D
MuRata
0402
GRM155R71E273KA88D
MuRata
C40
1
0.027µF
CAP, CERM, 0.027 µF, 25 V, ±10%, X7R,
0402
C41, C46
2
22pF
CAP, CERM, 22 pF, 50 V, ±5%, C0G/NP0,
0402
0402
C1005C0G1H220J050BA
TDK
C42
1
1800pF
CAP, CERM, 1800 pF, 50 V, ±10%, X7R,
0402
0402
GRM155R71H182KA01D
MuRata
D1
1
24V
Diode, TVS, Bi, 24 V, 200 W, SOD323, 2Leads, Body 1.9x1.45mm, No Polarity Mark
SOD323, 2Leads, Body
1.9x1.45mm, No
Polarity Mark
PESD24VL1BA,115
NXP Semiconductor
D2
1
40V
Diode, Schottky, 40 V, 3 A, SMA
SMA
B340 A-13-F
Diodes Inc.
(1)
Alternate Part
Number (1)
Alternate
Manufacturer (1)
Unless otherwise noted in the alternate part number and alternate manufacturer columns, all parts may be substituted with equivalents.
SLVUAN9A – June 2016 – Revised July 2016
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www.ti.com
Table 12. BOM (continued)
Designator
Quantity
Value
Description
Package
Reference
Part Number
Manufacturer
D3
1
20 V
Diode, Schottky, 20 V, 3 A, SMA
SMA
B320 A-13-F
Diodes Inc.
D4, D5, D6, D7, D8,
D9, D10
7
White
LED, White, SMD
0402, White
LW QH8G-Q2S2-3K5L-1
OSRAM
FID1, FID2, FID3,
FID4, FID5, FID6
6
Fiducial mark. There is nothing to buy or
mount.
Fiducial
N/A
N/A
J1
1
Connector, DC Power Jack, R/A, 3 Pos, TH
Power connector
JPD1135-509-7F
Foxconn
SSQ-110-03-T-D
Samtec
J2, J3
2
Receptacle, 2.54mm, 10x2, Tin, TH
Receptacle,
2.54mm, 10x2,
TH
J4
1
Socket, 0.8mm, 20x2, Gold, SMT
Socket, 0.8mm,
20x2, Gold, SMT
LSEM-120-03.0-F-DV-AN-K-TR
Samtec
J5
1
Connector, Receptacle, USB Type C, R/A,
SMT
Connector,
Receptacle, USB
Type C, SMT
20-0000016-01
Lintes Technology
L1
1
Ferrite Bead, 21 ohm @ 100MHz, 6A, 0805
0805
FBMJ2125HM210NT
Taiyo Yuden
7.2 mm x 6.65
mm
ASPI-0630LR-100M-T15
ABRACON
21 ohm
L2, L3
2
10uH
L4
1
2.2uH
Inductor, Flat Wire, Powdered Iron, 2.2 µH, 4
A, 0.033 ohm, SMD
Inductor,
4.8x2x4mm
SRP4020-2R2M
Bourns
Q1, Q2, Q3, Q4, Q5,
Q6, Q7
7
50 V
Transistor, NPN, 50 V, 0.05 A, SOT-323
SOT-323
DTC114EUAT106
Rohm
R1, R2, R3, R4
4
3.3k
RES, 3.3 k, 5%, 0.063 W, 0402
0402
CRCW04023K30JNED
Vishay-Dale
R5, R83
2
15.0k
RES, 15.0 k, 1%, 0.063 W, 0402
0402
CRCW040215K0FKED
Vishay-Dale
R6, R9, R12, R32,
R33, R38, R39, R40,
R41, R42, R44, R45,
R46, R47, R55, R56,
R59, R61, R65, R69
20
0
RES, 0, 5%, 0.05 W, 0201
0201
ERJ-1GE0R00C
Panasonic
R7, R8, R10, R11
4
11.0k
RES, 11.0 k, 1%, 0.05 W, 0201
0201
CRCW020111K0FKED
Vishay-Dale
R13, R14, R15, R16,
R18, R21, R22, R49
8
100k
RES, 100 k, 1%, 0.05 W, 0201
0201
CRCW0201100KFKED
Vishay-Dale
R17, R87, R88, R89,
R90, R91, R92, R93
8
1.00k
RES, 1.00 k, 1%, 0.05 W, 0201
0201
CRCW02011K00FKED
Vishay-Dale
R27, R28, R48
3
3.83k
RES, 3.83 k, 1%, 0.05 W, 0201
0201
CRCW02013K83FKED
Vishay-Dale
R29
1
10.0k
RES, 10.0 k, 1%, 0.05 W, 0201
0201
MCR006YRTF1002
Rohm
R70
1
100k
RES, 100 k, 5%, 0.063 W, 0402
0402
CRCW0402100KJNED
Vishay-Dale
R71, R77, R81
3
100k
RES, 100 k, 1%, 0.063 W, 0402
0402
CRCW0402100KFKED
Vishay-Dale
R72
1
12k
RES, 12 k, 5%, 0.063 W, 0402
0402
CRCW040212K0JNED
Vishay-Dale
R73
1
19.1k
RES, 19.1 k, 1%, 0.063 W, 0402
0402
CRCW040219K1FKED
Vishay-Dale
R74
1
8.45k
RES, 8.45 k, 1%, 0.063 W, 0402
0402
CRCW04028K45FKED
Vishay-Dale
R75
1
47.5k
RES, 47.5 k, 1%, 0.063 W, 0402
0402
CRCW040247K5FKED
Vishay-Dale
34
TPS65986 EVM User's Guide
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TPS65986EVM Bill of Materials
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Table 12. BOM (continued)
Designator
Quantity
Value
Description
Package
Reference
Part Number
Manufacturer
R76
1
150k
RES, 150 k, 1%, 0.063 W, 0402
0402
CRCW0402150KFKED
Vishay-Dale
R78
1
66.5k
RES, 66.5 k, 1%, 0.063 W, 0402
0402
CRCW040266K5FKED
Vishay-Dale
R79, R80, R86
3
32.4k
RES, 32.4 k, 1%, 0.063 W, 0402
0402
CRCW040232K4FKED
Vishay-Dale
R82
1
0
RES, 0, 5%, 0.063 W, 0402
0402
CRCW04020000Z0ED
Vishay-Dale
S1
1
DIP Switch, SPST 4Pos, Slide, SMT
6.2x2.0x6.2mm
TDA04H0SB1
CandK Components
S2
1
SWITCH TACTILE SPST-NO 0.05A 12 V
3x1.6x2.5mm
B3U-1000P
Omron Electronic
Components
TP1, TP2, TP3, TP4,
TP5, TP6
6
Test Point, Miniature, SMT
Test Point,
Miniature, SMT
5019
Keystone
U1
1
3V, 8Mbit, Serial Flash Memory with Dual
and Qual SPI, SOIC-8
SOIC-8
W25Q80DVSNIG
Winbond
U2
1
USB Type-C and USB PD Controller and
Power Switch, ZQZ0096A
ZQZ0096A
TPS65986ABZQZR
Texas Instruments
U3
1
4.5- to 28-V Input, 3-A Output, Synchronous
SWIFT Step-Down DC-DC Converter,
DRC0010J
DRC0010J
TPS54335ADRCR
Texas Instruments
TPS54335ADRCT
Texas Instruments
U4
1
3.5-A, 28-V, 1-MHz, Step-Down DC-DC
Converter With Eco-Mode, DDA0008H
DDA0008H
TPS54332DDAR
Texas Instruments
TPS54332DDA
Texas Instruments
U5
1
Nanopower, 1.8V, Comparator with Voltage
Reference, DCK0006A
DCK0006A
TLV3012 AIDCKR
Texas Instruments
TLV3012 AIDCKT
Texas Instruments
U6
1
Integrated USB Power Switch with Boost
Converter, DRC0010J
DRC0010J
TPS2500DRCR
Texas Instruments
TPS2500DRCT
Texas Instruments
U7, U8, U9, U10
4
1, 4, 6 CHANNEL PROTECTION SOLUTION
FOR SUPER-SPEED (UP TO 6 GBPS)
INTERFACE, DQA0010 A
DQA0010 A
TPD4E05U06DQAR
Texas Instruments
C27, C28, C30, C38,
C39
0
120pF
CAP, CERM, 120 pF, 50 V, ±5%, C0G/NP0,
0402
0402
GRM1555C1H121JA01D
MuRata
R19, R20, R50
0
100k
RES, 100 k, 1%, 0.05 W, 0201
0201
CRCW0201100KFKED
Vishay-Dale
0201
RK73H1HTTC1004F
KOA Speer
R23, R24, R25, R26
0
1.00Meg
RES, 1.00 M, 1%, 0.05 W, AEC-Q200 Grade
0, 0201
R30,
R36,
R52,
R58,
R64,
0
0
RES, 0, 5%, 0.05 W, 0201
0201
ERJ-1GE0R00C
Panasonic
R84
0
39k
RES, 39 k, 5%, 0.063 W, 0402
0402
CRCW040239K0JNED
Vishay-Dale
R85
0
560k
RES, 560 k, 5%, 0.063 W, 0402
0402
CRCW0402560KJNED
Vishay-Dale
R31,
R37,
R53,
R60,
R66,
R34,
R43,
R54,
R62,
R67,
R35,
R51,
R57,
R63,
R68
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35
Revision History
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Changes from Original (June 2016) to A Revision ......................................................................................................... Page
•
36
Deleted references to USB2MANY board and replaced with Aardvark or FTDI-based adapter ................................ 2
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Copyright © 2016, Texas Instruments Incorporated
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
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