32-Bit ARM Cortex-M4F MCU-Based Small Form Factor Serial

32-Bit ARM Cortex-M4F MCU-Based Small Form Factor Serial
TI Designs
32-Bit ARM® Cortex®-M4F MCU-Based Small Form Factor
Serial-to-Ethernet Converter
TI Designs
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help you accelerate your time to market.
•
Design Resources
•
TIDA-00226
Tool Folder Containing Design Files
TM4C129XNCZAD
TPD4E1U06
SN75HVD3082E
TPS62177
INA196AIDBVR
Product Folder
Product Folder
Product Folder
Product Folder
Product Folder
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TM4C129XNCZAD 32-Bit ARM Cortex-M4F MCUBased
Integrated 10/100 Ethernet MAC and
Physical Layer (PHY)
10/100 Ethernet MAC with Advanced IEEE 1588
PTP Hardware and Both Media Independent
Interface (MII) and Reduced Media Independent
Interface (RMII) Support
Provision to Connect to External Boards for
Isolated Communication Interface and POE
Onboard Nonisolated CAN and RS-485 PHY
50-Pin Connector for External Interface with
MII/RMII Ethernet PHY
Expansion Connectors for Access to
Communication, ADC, and GPIO Interfaces
1024-KB Flash Memory and 256-KB Single-Cycle
System SRAM
Featured Applications
•
•
•
Industrial Application: Circuit Breakers, Protection
Relays, Smart Meters (AMI), and Panel Mount
Multi-Function Power and Energy Meters
Substation Automation Products: RTU, Protection
Relay, IEDs, Converters, and Gateways
Industrial Remote Monitoring: Remote I/O and Data
Loggers
10 Pin Jtag
Ethernet PHY Current
5-LEDs
(Power 5 V ± 3.3 V)
TPS62177DQC
DEBUG
Amp
3.3 V
CAN ± Non Isolated
SN65HVD256D
50
Pin
SDCC
RS485 ± Non Isolated
SN65HVD3082ED
TM4C129XNCZAD
USB ± Non Isolated
RJ45
MII/RMII/SPI/I2C/UART interface
ADC and I/O
25M-Crystal
Internal
MAC/
PHY
ESD-TPD4E1U06
Eth0
Spare ± 10 Pin
Connector
Tiva, LaunchPad are trademarks of Texas Instruments.
ARM, Cortex, Thumb are registered trademarks of ARM Holdings plc.
All other trademarks are the property of their respective owners.
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1
System Description
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An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and other
important disclaimers and information.
1
System Description
A simple and effective design makes ethernet the most popular networking solution at the physical and
data link levels of the Open Systems Interconnection (OSI) model. With high speed options and a variety
of media types to choose from, ethernet is efficient and flexible. In addition, the low cost of hardware
makes ethernet an attractive option for industrial networking applications. The opportunity to use open
protocols such as TCP/IP over ethernet networks offers a high level of standardization and interoperability.
The result has been an ongoing shift to the use of ethernet for industrial control and automation
applications. Ethernet is increasingly replacing proprietary communications.
1.1
Serial-to-Ethernet Converter
Serial communications (RS-232/422/485) have traditionally been used in industrial automation to connect
various instruments such as sensors and data loggers to stand alone monitoring stations such as
computers. The limitations of serial communications, such as distance, accessibility, and the amount of
data transferred at any one time and speed, has led to a demand for a more flexible means of
communicating. When a legacy product contains only a serial port for a configuration or control interface,
continuing to access the legacy product through the serial interface can become challenging over time.
Newer computers, especially laptops, do not necessarily have serial ports, and a serial connection is
limited by cable length (typically 10 m). Using Ethernet in place of the serial port provides many benefits.
Although slow to catch up with IT infrastructure in commercial environments, Ethernet is increasingly
regarded as the defacto standard of communications in industrial markets. However, the sheer volume of
existing serial-based products and the low cost and ease of integrating these ‘legacy’ protocols means
that serial communication is strong in many areas of industry. Due to the minimal processing power
required, the ruggedness and reliability of connectors, even relatively new products such as GPS
receivers continue to adopt RS-232 and RS-485.
RS-485 has been the PHY protocol for industrial networks since Modbus was launched by Modicon in the
1970s. Other manufacturers followed Modicon and used protocols such as PROFIBUS DP and
INTERBUS. Contemporary systems are Ethernet-based to allow individual "islands of automation" to
share data captured throughout the plant and the company, "top floor to shop floor", and in some cases,
the world. To enable legacy serial based hardware to take advantage of Ethernet, Serial-to-Ethernet
device converters were designed.
Ethernet is a more common interface available on computing equipment today:
• The legacy product can be shared more easily (instead of changing a cable connection, a new
connection over the existing network is made).
• 10-m cable length is no longer an issue (subject to tolerance of the increased transmission delay if the
two pieces of equipment are separated by several routers or are located on a heavily loaded network
segment).
1.2
Gateway
Ethernet plays a critical role in automation. One important device in the sub-station of industrial
automation is the gateway . The gateway connects legacy devices with RS-485, RS-232, and CAN
interface to an Ethernet-enabled network. A gateway can be used to connect the IEDs (without Ethernet
connectivity) to supervision systems via Ethernet, TCP-IP, or radio communication. Web-enabled legacy
devices in the substation let the designer access information on the electrical installation via a PC with a
standard web browser.
The gateway functionality simplifies communications architecture and reduces leased line and connection
costs.
2
32-Bit ARM® Cortex®-M4F MCU-Based Small Form Factor Serial-to-Ethernet
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System Description
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Figure 1. Diagram of Data Flow in Gateways
1.2.1
Substation Automation Gateway
IEC61850 gateways are common applications of Ethernet gateways in substations. This communication
gateway maps signals between the protection and control IEDs in industrial or utility substations and
higher-level systems such as Network Control Centers (NCC) or Distributed Control Systems (DCS).
1.2.2
Modbus Gateways
Modbus gateways support the four most commonly used communication standards, RS-232/485/422 and
Ethernet. Modbus is the standard used for communication between a wide range of industrial devices,
including PLCs, DCSs, HMIs, instruments, meters, motors, and drives. Although Modbus can be used for
both serial devices (RS-232, RS-422, and RS-485) and newer Ethernet devices, the serial and Ethernet
protocols are so different that a specialized gateway is required for one protocol to communicate with the
other. Modbus gateways support standard Modbus protocols and are capable of converting the Modbus
protocols between Modbus RTU/ASCII (Master) to Modbus TCP (Slave).
1.3
Serial Over IP Ethernet Device Server
This converter is a bidirectional switching and transmission device from serial port to Ethernet TCP/IP
protocol. The converter changes the traditional serial communication to Ethernet communication and
realizes speed networking for serial device. The converter uses transparent communicate protocol so that
the user does not need to understand complex Ethernet TCP/IP protocol nor modify old serial programs.
The low price improves the designer product’s core competition and the easy, flexible configuration and
high-availability will satisfy steep demand.
1.4
Advances in Serial-to-Ethernet Technology
•
•
•
•
•
•
Secure data transfer: More traditional Serial-to-Ethernet device servers operated without data
encryption, leaving data vulnerable. Secure Socket Layer (SSL) is now used to provide secure end to
end data transfer.
Power over Ethernet (PoE): Device servers are now available with support for PoE (802.3af). This
reduces cabling and facilitates ease of installation, saving time and money.
Redundant ring operation: Ring redundancy has become common practice in industrial networks,
increasing the availability of serial-based devices. Ring redundancy also saves cost in not having to
employ an additional Ethernet switch.
Any baud rate: Serial-to-Ethernet device servers now support any data rate up to 1 Mbps, which is
useful for specialist devices.
Ethernet I/O modules and remote I/O: These modules integrate digital and analog signals to the
Ethernet network to assist Supervisory Control and Data Acquisition (SCADA). Distributed I/O
traditionally using RS-485 can now be connected to a Serial to Ethernet device server. These I/O
modules can use Simple Network Management Protocol (SNMP) traps, allowing information about the
status of digital or analog devices to be easily integrated into existing SNMP deployments (company
infrastructure for example).
Using the cellular network: GPRS, 3G, and HSPA are protocols based on IP. The use of software
drivers, together with cellular routers with serial connectivity enables virtual COM ports over a cellular
network. Mobile applications such as in vehicles and transport, variable message sign, and digital
signage are a few examples.
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3
Design Features
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This design allows an Ethernet-enabled Tiva™ microcontroller to be used as a cost-effective Serial-toEthernet converter. By placing a Serial-to-Ethernet converter on the serial port of a legacy product, the
converter can be given the ability to operate on the Ethernet without requiring any changes to the existing
hardware or software. This ability is especially useful when the legacy product cannot be modified (such
as in the case of third-party products). Ethernet's simple and effective design has made it the most
popular networking solution at the physical and data link levels.
This reference design platform demonstrates capabilities of TM4C129XNCZAD 32-bit ARM Cortex-M4F
MCU. This design supports 10/100 Base-T and is compliant with IEEE 802.3 standards. This design
operates from a single power supply (5 V with onboard regulator or 3.3 V).
The Tiva C Series ARM Cortex-M4 microcontrollers provide top performance and advanced integration.
The product family is positioned for cost-effective applications requiring significant control processing and
connectivity capabilities:
• Network appliances, gateways, and adapters
• Remote connectivity and monitoring
• Security and access systems
• HMI control panels
• Factory automation control
• Motion control and power inversion
• Electronic point-of-sale (POS) displays
• Smart energy and smart grid solutions
• Intelligent lighting control
An RS-485 interface is provided that can be used for the following applications:
• Energy meter networks
• Motor control
• Power inverters
• Industrial automation
• Building automation networks
• Battery-powered applications
2
Design Features
Table 1. Configuration of TIDA-00226
Microcontroller–MCU
TM4C129XNCZAD 32-bit ARM Cortex
10/100 internal PHY plus MAC
Ethernet
10/100 external MAC plus internal PHY
Activity
Ethernet LEDs
Link
Speed
RS-485
4
Half duplex transceiver: up to 200 Kbps
Power supply
Single supply: 3.3-V, 0.5-A output
External interface
MII connector: 50-pin with option for power input
32-Bit ARM® Cortex®-M4F MCU-Based Small Form Factor Serial-to-Ethernet
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Block Diagram
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3
Block Diagram
10 Pin Jtag
Ethernet PHY Current
5-LEDs
(Power 5 V ± 3.3 V)
TPS62177DQC
DEBUG
Amp
3.3 V
CAN ± Non Isolated
SN65HVD256D
50
Pin
SDCC
RS485 ± Non Isolated
SN65HVD3082ED
TM4C129XNCZAD
USB ± Non Isolated
RJ45
MII/RMII/SPI/I2C/UART interface
ADC and I/O
25M-Crystal
Internal
MAC/
PHY
ESD-TPD4E1U06
Eth0
Spare ± 10 Pin
Connector
Figure 2. Tiva MCU-Based Gateway Block Diagram
3.1
MCU
The Tiva TM4C129XNCZAD is an ARM Cortex-M4-based microcontroller with 1024-KB flash memory,
256-KB SRAM, 120-MHz operation, USB host/device/OTG, Ethernet controller, integrated Ethernet PHY,
hibernation module, and a wide range of other peripherals. See the TM4C129XNCZAD microcontroller
data sheet for complete device details. An internal multiplexer allows different peripheral functions to be
assigned to each of these GPIO pads. When adding external circuitry, the designer should consider the
additional load on the development board’s power rails. The Tiva PinMux Utility can be used to quickly
develop pin assignments and the code required to configure them.
The TM4C129XNCZAD microcontroller is factory-programmed with a quick start weather display program.
The quick start program resides in on-chip flash memory and runs each time power is applied, unless the
application has been replaced with a user program.
3.2
Ethernet
TM4C129XNCZAD supports the following Ethernet interfaces:
• 10/100 Ethernet interface with internal MAC and PHY.
• 10/100 Ethernet interface with external MAC and internal PHY. The external MAC is interfaced with the
MII/RMII.
3.3
Power Supply
TM4C129XNCZAD is powered by a single 5-V input power supply. TPS62177, a 28-V, 0.5-A step-down
converter, is used in this design.
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Block Diagram
3.4
www.ti.com
Nonisolated RS-485 Interface
SN75HVD3082E is the RS-485 transreceiver used .This device is a half-duplex transceiver designed for
RS-485 data bus networks. Powered by a 5-V supply, the device is fully compliant with TIA/EIA-485A
standards. With controlled transition times, the device is suitable for transmitting data over long twistedpair cables. SN75HVD3082E devices are optimized for signaling rates up to 200 kbps.
3.5
Expansion Connectors
Expansion outputs have been provided for further use as required.
3.6
PCB Dimensions and PCB Physical Layout
This reference design has been designed in a small form factor, four-layer PCB with a dedicated ground
and power plane.
3.7
Programming
Tiva microcontrollers support the JTAG interface for debugging and programming. The designer can place
headers on the board and connect them to the chip's JTAG pins (see the TM4C129XNCZAD data sheet
for pinout information). The designer would then need an external JTAG programmer to connect the PC to
the board. LaunchPad™ can be used as external programmer.
6
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Circuit Design and Component Selection
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4
Circuit Design and Component Selection
4.1
MCU
Tiva C Series microcontrollers integrate a large variety of rich communication features to enable a new
class of highly connected designs with the ability to allow critical, real-time control between performance
and power. The microcontrollers feature integrated communication peripherals along with other highperformance analog and digital functions to offer a strong foundation for many different target uses,
spanning from human machine interface to networked system management controllers.
In addition, Tiva C Series microcontrollers offer the advantages of ARM's widely available development
tools, System-on-Chip (SoC) infrastructure, and a large user community. Additionally, these
microcontrollers use ARM's Thumb®-compatible Thumb-2 instruction set to reduce memory requirements
and, thereby, cost. Finally, the TM4C129XNCZAD microcontroller is code-compatible to all members of
the extensive Tiva C Series, providing flexibility to fit precise needs.
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•
•
•
•
•
4.2
Performance
– ARM Cortex-M4F processor core, 120-MHz operation
– 150 DMIPS performance, 1024-KB flash memory
– 256-KB single-cycle system SRAM, 6 KB of EEPROM
Communication interfaces
– Eight universal asynchronous receivers/transmitters (UARTs)
– Four quad synchronous serial interface (QSSI) modules with bi-, quad-, and advanced SSI support
– Ten Inter-Integrated Circuit (I2C) modules with four transmission speeds, including a high-speed
mode
– Two controller area network (CAN) 2.0 A/B controllers
– 10/100 Ethernet MAC
– Ethernet PHY with IEEE 1588 PTP hardware support
– Universal Serial Bus (USB) 2.0 OTG/host/device with a ULPI-interface option and link power
management (LPM) support
Analog support
– Two 12-bit analog-to-digital converter (ADC) modules, each with a maximum sample rate of one
million samples per second
Operating range (ambient)
– Industrial (–40°C to 85°C) temperature range
– Extended (–40°C to 105°C) temperature range
One JTAG module with integrated ARM Serial Wire Debug (SWD)
212-ball BGA package
Ethernet
TM4C129x supports 10/100-Mbps Ethernet. The board is designed to connect directly to an Ethernet
network using RJ45 style connectors. The microcontroller contains a fully integrated Ethernet MAC and
PHY. This integration creates a simple, elegant, and cost-saving Ethernet circuit design. The example
code is available for both the uIP and LwIP TCP/IP protocol stacks. The embedded Ethernet on this
device can be programmed to act as an HTTP server, client, or both. The design and integration of the
circuit and microcontroller also enable users to synchronize events over the network using the IEEE1588
precision time protocol.
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Circuit Design and Component Selection
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D3
NOTE: Pull up resistors and decoupling cap should be located near U1
GND
NC
3.3V
1
49.9
R11
49.9
2
TCT
J1
V13
EN0RX-
RX+
11
RX-_RJ45
3.3V
7
2
R26
R27
9
75
GND
75
13
12
75
R28
C8
1000pF
CHGND
2
HX1198FNL
C9
4700 pF
1M
2
2
GND
SH2
RJ45_NOMAG_NOLED
1
NC3
NC4
1
RX-
NC1
NC2
75
4
5
SH1
1
RD-
2
R41
8
GND
TX+
CHASIS
TXRX+
TERM1A
TERM1B
RXTERM2A
TERM2B CHASIS
R34
0.1uF
0.1uF
2
C11
C13
4.87K
1
2
3
4
5
6
7
8
10
2
CMT
2
W15
RCT
R29
W15
RD+
TX+_RJ45
TX-_RJ45
RX+_RJ45
14
1
R17
P16
TX-
RECEIVE
1
EN0RX+
1
R17
P16
6
W13
1
V13
TD-
EN0TX-
V14
1
W13
CHGND
15
3.3V
1
P17
N16
CMT
EN0TX+ GND
2
P17
N16
16
1
49.9
3
V14
TX+
2
2
2
GND
V15
2
TM4C129XNCZAD
V15
TRANSMIT
TD+
0.1uF
3.3V
U2C
3
4
2
49.9
R13
1
1
R9
2
R10
2
1
C22
1
C24
0.1uF
1
6
T1
1
1
TPD4E1U06DCK
D2+
D2-
2
3.3V
D1+
D1-
5
NOTE: C40 and C66 must be located near pin 2 and 7 of T1
GND
CHGND
GND
Figure 3. Section of 10/100 Ethernet USB
The PHY controls three LEDs that indicate different functions. as shown in Table 2:
Table 2. LED Pins and Functions
PIN
FUNCTION
PK4
EN0LED0 – Link
PK6
EN0LED1 – Activity
PF1
EN0LED2 – Speed
RJ45 and isolation transformer magnetics with the choke on the side of the PHY has been used.
4.3
Power Supply
TPS62177 is programmed to a fixed output voltage of 3.3 V. For the fixed output voltage version, the FB
pin is pulled low internally by a 400-kΩ resistor. The designer can connect the FB pin to AGND to improve
thermal resistance.
Current Measure
+5V
L1
+5V
R22
0
GND
2
GND
GND
1
1
22uF, 6.3V
0.1uF
1
1
100K
GND
GND
GND
GND
1
R56
2
2
2
2
330
R12
0.1uF
D9
1SMB5915BT3G
3.9V
+5V
1
3.3V
22uF, 6.3V
2
1
C36
C42
TL1 TL3 TL2
PGND
11
0
AGND
3.3V
1
C37
R51
2
6
PG
C6
7
2
2
NC
FB
5
1
1K
SLEEP
2
10uH
10
1
1
VOS
1
2
HIB
SW
EN
R16
1 Ohm, 1%
2
330
HIB
2.2K
4
2
2
2
8
PWPD
2.2uF 50V
R49
VIN
3.3V
1
1
3
R21
9
1
R19
1
1
1
C43
TPS62177DQC
2
U5
2
IND-WE-7440
1
D15
1
D8
GND
GND
Figure 4. Schematic of TPS62177
8
32-Bit ARM® Cortex®-M4F MCU-Based Small Form Factor Serial-to-Ethernet
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External Component Selection
The external components have to fulfill the needs of the application, but also the stability criteria of the
device's control loop. The TPS62175/7 is optimized to work within a wide range of external components.
The LC output filter's inductance and capacitance have to be considered together, creating a double pole
that is responsible for the corner frequency of the converter.
Layout Considerations
The input capacitor needs to be placed as close as possible to the IC pins (VIN, PGND). The inductor
should be placed close to the SW pin and connect directly to the output capacitor, minimizing the loop
area between the SW pin, inductor, output capacitor, and PGND pin. Also, sensitive nodes like FB and
VOS should be connected with short wires, not nearby high dv/dt signals (for example, SW). The feedback
resistors should be placed close to the IC and connect directly to the AGND and FB pins.
Thermal Information
The TPS62175/7 is designed for a maximum operating junction temperature (TJ) of 125°C. Therefore, the
maximum output power is limited by the power losses. Since the thermal resistance of the package is
given, the size of the surrounding copper area and a proper thermal connection of the IC can reduce the
thermal resistance.
4.4
Nonisolated RS-485 Interface
The RS-485 can be either full-duplex or half-duplex. In a full-duplex implementation, four wires are
required, and a node can simultaneously drive one pair of wires while receiving data on the second pair of
wires. In half-duplex, a single pair of wires is used for both driving and receiving. In either case, the
operation of all the nodes on the bus must be controlled so that at most, one driver is active on each pair
of lines at any time.
2
1
CANH
CANL
J6
CANH
3.3V
CANH
U4
CAN1TX
CAN1RX
CAN1TX
CAN1RX
1
4
+5V
8
5
3
TXD CANH
RXD CANL
7
6
R45
120
CANL
S
VRXD
VCC GND
CANL
2
SN65HVD256D
C30
0.1µF
GND
GND
GND
Figure 5. Schematic of SN75HVD3082E
SN75HVD3082E is a half-duplex transceiver and has the following features:
• Available in a small MSOP-8 package
• Meets or exceeds the TIA/EIA\x92485A standard requirements
• Low quiescent power
• 0.3-mA active mode
• 1-nA shutdown mode
• Bus-pin ESD protection up to 15 kV
• Industry-standard SN75176 footprint
• Failsafe receiver (bus open, bus shorted, bus idle)
• Glitch-free power-up/down bus inputs and outputs
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Circuit Design and Component Selection
4.5
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Expansion Connectors
In the design, peripherals that are not currently used like SPI, UART, CAN, and I2C signals have been
terminated on the 50-pin SDCC connector.
+5V
D10
1
A K
2
1
2
2
DFLS1200-7
J8
+5V
3
D11
DESD1P0RFW-7
1
GND
+5V
1
R62
2
GND
0
J9
1
SPI0CS
SPI0SCK
SPI0SDO
SPI0SDI
U5TX
U5RX
U7TX
U7RX
EN0TXER
1_5V_PS
3.3V
R57
2
R58
GND
GND
INA196AIDBVR
MCU_ISENSE
VIN+
VINOUT
U6
GND
ERM8-025-05.0-L-DV-K-TR
4
5
0.1
V+
SPI0CS
SPI0SCK
SPI0SDO
SPI0SDI
U5TX
U5RX
U7TX
U7RX
EN0TXER
2
TX_CLK
RXD3
RXD2
RXD0
RXD1
RX_DV
RX_CLK
RX_ER
EN0INTRN
PG0/PPS
I2C8SCL
I2C8SDA
SPI3CS
SPI3SCK
SPI3SDO
SPI3SDI
CAN0RX
CAN0TX
RESET_N
3
TX_CLK
RXD3
RXD2
RXD0
RXD1
RX_DV
RX_CLK
RX_ER
EN0INTRN
PG0/PPS
I2C8SCL
I2C8SDA
SPI3CS
SPI3SCK
SPI3SDO
SPI3SDI
CAN0RX
CAN0TX
RESET_N
1
TX_EN
TXD0
TXD1
TXD2
TXD3
COL
CRS
MDIO
MDC
TX_EN
TXD0
TXD1
TXD2
TXD3
COL
CRS
MDIO
MDC
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
0
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
C44
0.1µF
MCU_ISENSE
GND
GND
Figure 6. Schematic of 50-Pin SDCC Connector
An option to measure the power consumption of 3.3 V supplied to external PHY interface has been
provided. The same 50-pin has CAN, UART, SPI, and I2C signals.
J10
1
2
3
4
5
6
CAN1RX
CAN1TX
U3TX
U3RTS
U3RX
HEADER_TMM-103-01-G-D-RA
GND
Figure 7. Interface for Isolated UART and CAN
The connector can be used to interface with high efficiency isolated CAN and PROFIBUS interface
reference design (TIDA-00012).
J3
SPARE1
SPARE2
SPARE3
SPARE4
I2C6SCL
1
2
3
4
5
6
7
8
9
10
I2C6SDA
ADC3
ADC2
ADC1
ADC0
HEADER_2041501
Figure 8. Interface for ADC and Spare I/Os
10
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GND
C3
2
3300pF
J5
ZX62R-AB-5P
$$$22985
8
D-
R7
1
GND
GND
+VBUS
D4
1
+5V
1
C17
2
D5
1
C21
4.7UF 6.3V
1
4.7UF 6.3V
2
2
D16
1
2
2
ACTIVITY(GREEN)
5
USB_EN 4
USB_EN
VIN OUT
EN
GND
1
OC
3
USB_EN
GND
USB_EN
USB_PLFT
R35
R36
R14
R15
USB0DP
USB0DM
USB0ID
USB0VBUS
USB0EPEN
USB0PLFT
33
33
33
33
USB0DM
USB0ID
USB0VBUS
USB0EPEN
USB0PLFT
TP19
TPS2051BDBVT
TP20
GND
1
1
10K
R42
2
2
GND
USB0DP
U3
GND
2
1M
5
4
2
3
1
G
7
CHGND
ID
9
D+
11
6
VB
10
GND
R44
10K
2
3.3V
Figure 9. USB Interface
2
1
CANH
CANL
J6
CANH
3.3V
CANH
U4
CAN1TX
CAN1RX
CAN1TX
CAN1RX
1
4
+5V
8
5
3
TXD CANH
RXD CANL
7
6
R45
120
CANL
S
VRXD
VCC GND
CANL
2
SN65HVD256D
C30
0.1µF
GND
GND
GND
Figure 10. CAN Interface
4.6
Board Size
The complete board is designed in a 2×3-inch form-factor PCB.
Figure 11. Assembly Drawing
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Programming
A JTAG interface has been provided for programming.
Table 3. JTAG Interface Options
OPTION
FUNCTION
TCK
JTAG test clock signal. This option is also the SWCLK signal for
SWD connections.
TMS
JTAG test mode select. This option is also the SWDIO signal for
SWD connections.
TDO
JTAG test data out. This is also the SWO signal for SWD
connections.
TDI
JTAG test data in.
Pull this pin low to tri-state the on board ICDI drive signals. This
action prevents the ICDI from interfering with an external debugin connection.
EXT-DBG
RESET
Target reset pin.
The designer will need to be sure that the two boards share a
common ground reference. Ground connections are available on
the lower left and lower right corners of the LaunchPad.
GND
1
1
1
R54
10K
R52
10K
2
2
R20
10K
2
R17
10K
3.3V
2
1
3.3V
J7
EXTDBG
EXTDBG
1
2
3
4
5
6
7
8
9
10
TMS
TCK
TDO
TDI
T_TRST
HEADER_2041501
GND
Figure 12. Schematic of JTAG Interface
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5
Software Description
5.1
Modbus Basics
Modbus protocol follows a master slave mechanism. A slave cannot initiate transaction. The master
requests for a read or write of a certain address in the slave. The request tells the slave what action the
slave has to perform based on the function code, address, and number of registers. The error check field
is used to ensure the integrity of message contents. If the slave prepares a normal message response, the
function code in the response is an echo of the function code in the request. If the slave prepares an error
response, the function code and data is modified to indicate the error. Modbus slaves can have an
address from 1 to 247.
See the Modbus Tools website and SPMA037 for more information.
Table 4. Modbus RTU Frame Format
NAME
LENGTH
FUNCTION
Start
3.5c idle
Address
8 bits
At least 3½ character times of silence (MARK condition)
Station address
Function
8 bits
Indicates the function codes like read coils or inputs
Data
n*8 bits
Data and length will be filled, depending on the message type
CRC check
16 bits
Error checks
End
3.5c idle
At least 3½ character times of silence between frames
Function 03 (03hex) Read Holding Registers
Read the binary contents of holding registers in the slave. The holding registers consist of requests and
responses.
The request message specifies the starting register and quantity of registers to be read.
Table 5. Example of a Request to Read 0...1 (Register 40001 to 40002) from Slave Device 1
FIELD NAME
RTU (HEX)
Header
None
Slave address
1
Function
3
Starting address Hi
0
Starting address Lo
0
Quantity of registers Hi
0
Quantity of registers Lo
2
CRC Lo
C4
CRC Hi
0B
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The register data in the response message are packed as two bytes per register with the binary contents
right justified within each byte. For each register, the first byte contains the high-order bits, and the second
byte contains the low-order bits.
Table 6. Example of a Response to the Request
FIELD NAME
RTU (HEX)
Header
None
Slave address
1
Function
3
Byte count
4
Data Hi
0
Data Lo
6
Data Hi
0
Data Lo
5
CRC Lo
DA
CRC Hi
31
Table 7. Modbus TCP Frame Format
5.2
NAME
LENGTH
FUNCTION
Transaction identifier
2 bytes
For synchronization between messages of server and client
Protocol identifier
2 bytes
Zero for Modbus/TCP
Length field
2 bytes
Number of remaining bytes in this frame
Unit identifier
1 byte
Slave address (255 if not used)
Function code
1 byte
Function codes as in other variants
Data bytes
n byte
Data as response or commands
MDC/MDIO Interface
The MDC/MDIO Interface is used by the MAC to speak to the PHY and set or read its configuration.
MDC is a clock that is active when there is traffic and is shut down when there is no traffic. MDIO is a
bidirectional communication line that is used to configure or read the status of PHY.
For example, the proper PHY ID is set in the firmware the device and a reset is issued. On reading the
BMSR register, the designer should read the default register values. If it is not the case, then something is
wrong and should be debugged. If the MDC/MDIO or PHY ID is not configured properly, the designer may
not be able to read or write any PHY register values.
It is possible that PHY can function with a default mode, (even respond to a ping) without being able to
read or write the PHY registers. The user should habitually read registers (for example, BMSR) and
ensure that the user reads the default values after the reset delay.
MII_MODE
The MII_MODE is selected by the pin 26 (RX_DV). This pin has internal weak pull down defaults to MII
mode. External pull up makes the PHY to operate in RMII mode.
PHY ID
PHY ID is decided by the pull-up registers (see the Bootstrap section of the TLK105L/106L data sheet).
Care has to be taken that appropriate PHY ID is used for appropriate hardware bootstrap configuration (as
per pull-up registers). The values of pins 29, 30, 31, 32, and 1 (PHYAD0/COL, PHYAD1/RXD0,
PHYAD2/RXD1, PHYAD3/RXD2, and PHYAD4/RXD3, respectively) are latched into an internal register at
hardware reset.
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5.3
Processor Initialization (as a Black Box)
The following steps initialize the processor:
1. Configure the clock.
2. Enable the peripheral clock gating for Ethernet MAC pins.
3. Initialize the peripherals according to proper pin multiplexing configuration for Ethernet MAC pins.
4. Configure the reset pin as output and toggle the reset to an appropriate level with a 10-µs delay.
5. Enable the peripheral clock gating for Ethernet MAC and issue a system control reset.
6. Wait for the reset to complete.
7. Select external MII mode and issue a MAC reset.
8. Initialize the MAC and set the DMA mode if applicable.
5.4
External MII PHY Initialization
1.
2.
3.
4.
5.
6.
7.
Set the external PHY address (as per the boot strap configuration).
All the read and write requests to the PHY shall use the configured external PHY address.
Reset the PHY.
Set the BMCR (0x00) register bit 15 to one to reset the MII.
Set PHYRCR (0x1F) data register bit 15 and bit 14 to one for a software or digital reset.
Issue a delay of 500 microseconds.
Set the BMCR (0x00) register auto negotiation enable and auto negotiation restart by setting bit 12 and
bit 8 to one.
8. Poll the BMSR (0x01) register bit 5 to check if auto negotiation is complete.
9. To configure the LEDs, issue an extended write to configure the MLEDCR (0x25) register to set the
value 0x060B. This action disables COL, routes the LED to pin 29, and sets up the link and activity
LEDs.
5.5
LED Configuration
Pins 17 and 29 can be used for LED configuration either as pull up or pull down. Pin 17 indicates link
status (fully lit) by default and activity is indicated by blinking the same LED. If the design needs to use pin
29 for indicating LED status, MLEDCR has to be configured. MLEDCR provides an option to route the
activity signal to pin 29 instead of 17. For this to happen, the COL signal has to be disabled. For further
details, see section 3.8 of the TLK105L/106L data sheet.
NOTE: If the Bootstrap address (in the software) does not match with that of the hardware, MDIO
commands will not work properly.
5.6
Flashing the Board
The PC software used to download the firmware to the board can be found here:
http://www.ti.com/tool/lmflashprogrammer. Follow these steps to program the flash:
1. Configuration tab: <> development board (For example, <TM4C129X> development board)
2. Copy the bin files into computer
3. Program tab: Select .bin file
(a) Select the path of binary file that needs to be flashed
(b) Select Erase entire flash
(c) Select Verify after program
(d) Program address offset 0
(e) Leave others blank
(f) Select Program to flash the code
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Test Results
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6
Test Results
6.1
Functional Testing
Table 8. Functional Testing Values
16
Clock
25 Mhz
VCC (3 to 3.6 V)
3.31 V
Internal 1.55 V
1.55
MII
OK
Link and activity LED
OK
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6.2
Communication Interface Testing (Computer to Device)
Figure 13. Screen Capture of Ping Test
Figure 14. Screen Capture of µIP Web Server Test
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Gateway Testing
Test setup:
• PC-based Modbus software (such as Mod Poll) works as a Modbus client requesting for information
• The board acts as a transparent gateway and converts the Modbus TCP data into Modbus serial
• Serial port monitor (such as Teraterm) to monitor Modbus RTU (serial) data
• Packet sniffer (such as Wireshark) to monitor Modbus TCP packets
-Convert Modbus MBAP to Modbus RTU
-Send to RS232 Device
Modbus serial Slave
Modbus Master Host PC
E
T
H
Ethernet Port
Modbus TCP/IP
Bridge
U
A
R
T
Rs232
Device
(Panel
Meter)
RS232 Po rt
- Convert Modbus RTU to ModBus MBAP
- Send to Ethernet port
Figure 15. Test Setup Diagram
Modbus client setup:
1. Configure the IP address of gateway (board), delay between polls, response timeout and port number.
2. Set up the slave ID, function (read holding register, write holding register, and so on), and register
starting address, length, and scan rate.
Modbus server:
1. Set the Modbus server as a black box, which receives Modbus RTU requests and replies back with
data.
2. Set the board as a gateway.
3. With the board, convert data from Modbus RTU to Modbus TCP and vice versa.
6.4
EMI-Radiated Emission
The test distance for radiated emission from EUT to Antenna is 10 m. The test was performed in a
semianeochic chamber, which conforms to the volumetric normalized site attenuation (VNSA) for tenmeter measurements.
Table 9. Specifications for Radiated Emissions
FREQUENCY RANGE
CLASS A LIMITS QUASI-PEAK
CLASS B LIMITS QUASI-PEAK
30 to 230 MHz and 230 MHz to 1 GHz
40 and 47 dB μV/m
30 and 37 dB μV/m
Table 10. Observation for Radiated Emissions
18
REQUIREMENTS
FREQUENCY
RESULT
EN 55011:2009+A1:2010, Class “A”
30 to 1000 MHz
Pass
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6.5
Test Result Graphs
Figure 16 and Figure 17 show the results from testing the TM4C129XNCZAD 32-bit ARM Cortex-M4F
MCU with internal MAC+PHY enabled.
Figure 16. Horizontal Polarization
Figure 17. Vertical Polarization
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Test Results
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ESD EMI-EMC Recommendations and Design Guidelines
The following recommendations are provided to improve EMI performance:
• Guard ring for crystal.
• Use a metal shielded RJ-45 connector, and connect the shield to chassis ground.
• Use magnetics with integrated common-mode choking devices with the choke on the side of the PHY
(for example, PULSE HX1198FNL).
• Do not overlap the circuit and chassis ground planes: keep the planes isolated. Connect chassis
ground and system ground together using one 4700 pF NPO 2000 V 10% across the void between the
ground planes on the 1, 2 pair side of the RJ-45.
See the Tiva TM4C1292NCZAD microcontroller data sheet for more information.
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Design Files
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7
Design Files
7.1
Schematics
R3
R1
1
1
2.2K
R2
2
2
2.2K
U7TX
U7RX
RX_CLK
PG0/PPS
U7TX
U7RX
RX_CLK
PG0/PPS
P4
R2
R1
T1
K3
L2
M1
M2
V5
R7
T14
N15
L19
L18
K19
K18
C12
A10
P4
R2
R1
T1
K3
L2
M1
M2
V5
R7
T14
N15
L19
L18
K19
K18
C12
E18
F17
B7
A8
T8
N5
N4
N2
N1
P3
P2
U8
V8
W9
R10
V9
T13
2
2
E18 CAN1RX
F17 CAN1TX
B7
A8
T8
N5
N4
N2
N1
P3
P2
U8
V8
W9
R10
V9
T13
MCU_ISENSE
PQ7/LED_G
ADC3
ADC2
ADC1
ADC0
EN0RREF_CLK
R43
33
TX_CLK
V18
V19
W18
W19
E13
C5
H16
E10
USB0DP
USB0DM
USB0VBUS
USB0ID
USB0EPEN
USB0PLFT
CAN1RX
CAN1TX
GND
1
1
2
1
2
2
C28
0.01uF
0.01uF
1
C27
0.1uF
1
C41
0.1uF
C31
C33
0.1uF 0.1uF
2
1
GND
C39
GND
3.3V
C35
C38
0.1uF
0.1uF
C40
C23
C5
0.1uF 0.1uF 0.1uF
V18
V19
W18
W19
E13
C5
1
GND
2.2K
GND
L10
L11
J8
J9
L12
M11
M12
P10
K11
K12
K7
K8
G10
H9
J10
GND
C25
0.1uF
2
C15
33pF
L10
L11
J8
J9
L12
M11
M12
P10
K11
K12
K7
K8
G10
H9
J10
2
C14
33pF
L8
L9
M8
M9
N10
V1
W1
W2
M10
K10
K13
K14
K6
K9
F10
J11
J12
H10
H11
H12
A1
A18
A19
A2
B1
B19
1
1
G4
2
L8
L9
M8
M9
N10
V1
W1
W2
M10
K10
K13
K14
K6
K9
F10
J11
J12
H10
H11
H12
A1
A18
A19
A2
B1
B19
2
C34
0.01 uF
GND
3.3V
1
G4
1
1
1
1
1
2
0
C26
1uF
2
2
Y1
25MHz
3.3V
F3
1
D18
C29
0.01UF
1
I2C8SCL
I2C8SDA
MCU_ISENSE
PQ7/LED_G
ADC3
ADC2
ADC1
ADC0
3.3V
2
2.2K
R59
WAKE
C32
1uF
2
2
I2C8SCL
I2C8SDA
USB0DP
USB0DM
USB0VBUS
USB0ID
USB0EPEN
USB0PLFT
D18
E19
D19
R4
1.0Meg
R61
HIB
F4
G5
2
GNDX2
GND
R5
2
1
VBAT
E19
D19
F4
G5
F3
U5RX
U5TX
HIB
WAKE
M17
U18
1
MOSC0
MOSC1
RESET_N
U5RX
U5TX
M17
U18
2
GND
T18
T19
R18
1
R37
B17
G16
H19
G18
J18
H18
G19
B12
D8
B13
C18
B18
B16
A16
B3
B2
T18
T19
R18
R32
0
2
GNDX
FB1
1000 OHM
R33
10K
1
GND
0.1uF
2
GND
P19
2
XOSC0
C48
33pF
0
RESET_N
P19
1
C47
33pF
P18
2
C46
33pF
RESET P18
51 2
C12
1
C45
33pF
1
TM4C129XNCZAD
2
2
U2B
1
1
1
TXD0
TXD1
TXD2
TXD3
PF1/LED2
R39
10K
2
0
R38
1
RESET
C19
1uF
0
R31
GND
VDDC_1P2V_INT
H16
E10
C20
1uF
C16
1
C18
B18
B16
A16
B3
B2
R30
NOTE: To guarantee risetime requirements
C18
C4
2.2 uF
0.1uF 0.01 uF
2
3.3V
B17
G16
H19
G18
J18
H18
G19
B12
D8
B13
3.3V
1
U10
R13
W10
V10
B8
C2
C1
A5
F18
E17
F2
F1
MII/RMII
External Ethernet PHY
2
CAN0RX
CAN0TX
PP6
PD0/AIN15
PD1/T0CCP0
PE4
U3RTS
U3CTS
I2C6SCL
I2C6SDA
CAN0RX
W10
CAN0TX
V10
PP6
B8
PD0/AIN15
C2
PD1/T0CCP0 C1
PE4
A5
U3RTS
F18
U3CTS
E17
I2C6SCL
F2
I2C6SDA
F1
3.3V
T_TRST
1
U10
R13
2.2k
B4
T2
C8
E7
T6
U5
V4
W4
C6
B6
MDIO
RX_DV
RX_ER
TX_CLK
TX_EN
EN0TXER
EN0INTRN
COL
CRS
RXD0
RXD1
RXD2
RXD3
EN0RREF_CLK
2
R60
B4
T2
C8
E7
T6
U5
V4
W4
C6
B6
A4
J1
J2
K1
K2
A13
B9
H17
F16
K5
U12
C10
B11
A11
U2
V2
G15
D12
D13
B14
A14
M4
D2
D1
A17
A7
M3
H3
H2
G1
G2
MDIO
RX_DV
RX_ER
TX_CLK
R46
33 TX_EN
EN0TXER
EN0INTRN
COL
CRS
RXD0
RXD1
RXD2
RXD3
EN0RREF_CLK
02 TXD0
R40
1
R47
02 TXD1
1
02 TXD2
1 R6
02 TXD3
1 R8
MDC
MDC
PF1/LED2
1
U3RX
U3TX
SPI0SCK
SPI0CS
SPI0SDO
SPI0SDI
U3RX
U3TX
SPI0SCK
SPI0CS
SPI0SDO
SPI0SDI
A4
D7
B10
B5
J1
J2
K1
K2
A13
B9
H17
F16
K5
U12
C10
B11
A11
U2
V2
G15
D12
D13
B14
A14
M4
D2
D1
A17
A7
M3
H3
H2
G1
G2
T7
U14
V12
V11
M16
T12
D6
N18
N19
W12
U15
V17
U19
M18
K17
K15
V16
W16
W6
V6
2
EXTDBG
D7
B10
B5
T7
U14
V12
V11
M16
T12
D6
N18
N19
W12
U15
V17
U19
M18
K17
K15
V16
W16
W6
V6
1
EXTDBG
SPARE4
SPARE5
SPARE6
E2
E3
H4
U6
V7
W7
R3
TM4C129XNCZAD
2
SPARE4
SPARE5
SPARE6
E2
E3
H4
U6
V7
W7
R3
V3
W3
B15
C15
D14
C14
2
SPI3CS
SPI3SCK
SPI3SDO
SPI3SDI
SPARE1
SPARE2
SPARE3
SPI3CS
SPI3SCK
SPI3SDO
SPI3SDI
SPARE1
SPARE2
SPARE3
V3
W3
B15
C15
D14
C14
2
DEBUG_RX
DEBUG_TX
TCK
TMS
TDI
TDO
1
U2A
2.2k
DEBUG_RX
DEBUG_TX
TCK
TMS
TDI
TDO
GND
GND
GND
GND
SW1
RESET
RESET 1
3
2
4
GND
A10
Figure 18. Microcontroller
TIDU348 – June 2014
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21
Design Files
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D3
3.3V
1
R11
49.9
TD+
TCT
CMT
TD-
TX-
CHGND
15
EN0TX+ GND
J1
3.3V
EN0TX6
W13
W13
EN0RX+
V13
EN0RX-
RD+
RECEIVE
RX+
TX+_RJ45
TX-_RJ45
RX+_RJ45
14
11
RX-_RJ45
3.3V
GND
NC3
NC4
75
75
SH2
RJ45_NOMAG_NOLED
1
1
75
13
12
R28
C8
1000pF
HX1198FNL
CHGND
2
GND
NC1
NC2
2
9
R27
C9
4700 pF
1M
2
2
4
5
R26
SH1
R34
RX-
75
GND
2
RD-
2
R41
8
R29
0.1uF
0.1uF
1
1
C13
4.87K
1
C11
1
W15
W15
2
R17
P16
2
CMT
2
RCT
TX+
CHASIS
TXRX+
TERM1A
TERM1B
RXTERM2A
TERM2B CHASIS
10
1
7
1
V13
R17
P16
1
2
3
4
5
6
7
8
1
V14
V14
P17
N16
16
1
49.9
3
P17
N16
TX+
2
49.9
2
2
GND
V15
49.9
2
2
TM4C129XNCZAD
V15
TRANSMIT
0.1uF
3.3V
U2C
3
4
2
R13
1
1
R9
2
R10
2
1
1
C22
0.1uF
1
6
T1
1
1
TPD4E1U06DCK
C24
D2+
D2-
2
3.3V
D1+
D1NC
GND
5
1
GND
GND
C3
CHGND
GND
2
3300pF
J5
ZX62R-AB-5P
$$$22985
1
TXD2
GND
1
1
1
2
LED0
LED1
LED2
2
GND
2
LED2
GND
1
OC
3
USB_EN
GND
USB_EN
USB_PLFT
R35
R36
R14
R15
33
33
33
33
LED2 2
D12
1
1
R50
2
SPEED(AMBER)
330
USB0DP
USB0DM
USB0ID
USB0VBUS
USB0EPEN
USB0PLFT
USB0DM
USB0ID
USB0VBUS
USB0EPEN
USB0PLFT
TP19
TPS2051BDBVT
TP20
GND
LED1
D14
LED1 2
R55
1
1
2
330
LED0
D13
LED0 2
R53
1
1
LINK(RED)
2
330
1
1
10K
R42
2
2
EN
LED0
LED1
LED2
2
0
2
USB0DP
VIN OUT
1
R48
2
0
0
D16
2
USB_EN 4
R23
D5
1
5
GND
USB_EN
1
D4
1
4.7UF 6.3V
U3
1
TXD2
PF1/LED2
PF1/LED2
R24
RXD3
GND
2
ACTIVITY(GREEN)
RXD3
8
C17
C21
4.7UF 6.3V
2
1M
+VBUS
+5V
R7
5
4
3
2
1
CHGND
D-
VB
7
G
9
ID
11
6
D+
10
GND
R44
10K
3.3V
2
GND
Figure 19. 10/100 Ethernet USB
NOTE: Pull-up resistors and decoupling cap should be located near U1.
C40 and C66 must be located near pin 2 of T1.
22
32-Bit ARM® Cortex®-M4F MCU-Based Small Form Factor Serial-to-Ethernet
Converter
Copyright © 2014, Texas Instruments Incorporated
TIDU348 – June 2014
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2
1
CANH
CANL
2
1
RS485-A
RS485-B
J6
J2
RS485-A
CANH
3.3V
CANH
CAN1TX
CAN1RX
CAN1TX
CAN1RX
1
4
+5V
8
5
3
7
6
TXD CANH
RXD CANL
U3TX
CANL
VRXD
VCC GND
1
2
U3RX
U3RTS
R45
120
S
RS485-A
U1
U4
U3TX
4
3
8
CANL
R
RE
D
DE
VCC
A
B
R25
120
6
7
RS485-B
GND
RS485-B
3.3V
5
SN65HVD3082ED
2
SN65HVD256D
C30
GND
0.1µF
GND
C1
10µF
C7
0.1µF
C2
0.1µF
C10
0.1µF
GND
GND
GND
3.3V
RS485-A
D2
DESD1P0RFW-7
1
2
3
4
5
6
3
1
D7
DESD1P0RFW-7
2
2
RS485-B
3
1
D6
DESD1P0RFW-7
3
1
CANL
1
CANH
2
2
J10
3
D1
DESD1P0RFW-7
CAN1RX
CAN1TX
U3TX
U3RTS
U3RX
HEADER_TMM-103-01-G-D-RA
GND
GND
Figure 20. CAN RS-485
TIDU348 – June 2014
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Design Files
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+5V
D10
1
A K
2
1
2
2
DFLS1200-7
J8
+5V
3
D11
1
DESD1P0RFW-7
GND
+5V
TP10
TP15
TP16
TP17
TP18
TP13
TP12
TP6
TP14
TP7
TP8
TP3
TP5
1
TP11
R62
2
GND
TP9
0
TP2
TP1
TP4
J9
I2C8SCL
I2C8SDA
SPI3CS
SPI3SCK
SPI3SDO
SPI3SDI
CAN0RX
CAN0TX
RESET_N
U5TX
U5RX
U7TX
U7RX
EN0TXER
1_5V_PS
3.3V
R57
2
R58
GND
OUT
GND
INA196AIDBVR
MCU_ISENSE
VIN+
U6
4
5
0.1
ERM8-025-05.0-L-DV-K-TR
V+
1
SPI0CS
SPI0SCK
SPI0SDO
SPI0SDI
3
SPI0CS
SPI0SCK
SPI0SDO
SPI0SDI
U5TX
U5RX
U7TX
U7RX
EN0TXER
I2C8SCL
I2C8SDA
SPI3CS
SPI3SCK
SPI3SDO
SPI3SDI
CAN0RX
CAN0TX
RESET_N
VIN-
TX_CLK
RXD3
RXD2
RXD0
RXD1
RX_DV
RX_CLK
RX_ER
EN0INTRN
PG0/PPS
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
GND
U5TX
U5RX
U7TX
U7RX
EN0TXER
TX_CLK
RXD3
RXD2
RXD0
RXD1
RX_DV
RX_CLK
RX_ER
EN0INTRN
PG0/PPS
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
TX_EN
TXD0
TXD1
TXD2
TXD3
COL
CRS
MDIO
MDC
2
SPI0CS
SPI0SCK
SPI0SDO
SPI0SDI
TX_EN
TXD0
TXD1
TXD2
TXD3
COL
CRS
MDIO
MDC
1
SPI0CS
SPI0SCK
SPI0SDO
SPI0SDI
U5TX
U5RX
U7TX
U7RX
EN0TXER
I2C8SCL
I2C8SDA
SPI3CS
SPI3SCK
SPI3SDO
SPI3SDI
CAN0RX
CAN0TX
RESET_N
0
I2C8SCL
I2C8SDA
SPI3CS
SPI3SCK
SPI3SDO
SPI3SDI
CAN0RX
CAN0TX
RESET_N
C44
0.1µF
MCU_ISENSE
GND
GND
Figure 21. MII/RMII
24
32-Bit ARM® Cortex®-M4F MCU-Based Small Form Factor Serial-to-Ethernet
Converter
Copyright © 2014, Texas Instruments Incorporated
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Current Measure
+5V
L1
+5V
PGND
7
1
2
GND
0.1uF
1
22uF, 6.3V
0.1uF
1
1
100K
GND
0
GND
GND
GND
1
2
2
2
2
R56
1
+5V
330
R12
22uF, 6.3V
R22
GND
3.3V
C42
R51
D9
1SMB5915BT3G
3.9V
330
GND
3.3V
1
C37
C36
TL1 TL3 TL2
AGND
C6
11
0
PG
5
2
6
NC
2
10uH
10
2
2
FB
1
4
1K
SLEEP
2
R49
1
2
1
VOS
R16
1 Ohm, 1%
2
1
HIB
2.2K
2
2
2
8
PWPD
2.2uF 50V
HIB
EN
3.3V
1
1
R21
9
1
3
1
R19
SW
2
1
1
C43
TPS62177DQC
VIN
1
U5
2
IND-WE-7440
1
D15
1
D8
GND
GND
Figure 22. Power Supply
J3
SPARE1
3.3V
SPARE2
SPARE3
R18
1
10k
2
EXTDBG
SPARE4
I2C6SCL
1
2
3
4
5
6
7
8
9
10
I2C6SDA
ADC3
ADC2
ADC1
ADC0
HEADER_2041501
1
1
2
2
R20
10K
2
R17
10K
3.3V
R54
10K
R52
10K
2
1
1
3.3V
J7
1
2
DEBUG_RX
DEBUG_TX
EXTDBG
EXTDBG
J4
1
2
3
4
5
6
7
8
9
10
TMS
TCK
TDO
TDI
T_TRST
HEADER_2041501
GND
Figure 23. Spare and Debug
TIDU348 – June 2014
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25
Design Files
7.2
www.ti.com
Bill of Materials
To download the bill of materials (BOM), see the design files at TIDA-00226.
Table 11. BOM
26
FITTED
QTY
REFERENCE
Fitted
1
C1
CAP, CERM, 10 µF, 6.3 V, ±20%, X5R, 0603
PART DESCRIPTION
Kemet
Fitted
3
C2, C7, C10
CAP, CERM, 0.1 µF, 16 V, ±10%, X5R, 0603
MuRata
Fitted
1
C3
Fitted
4
C4, C27, C28, C34
Capacitor, 3300 pF, 50 V, 10%, X7R, 0603
Capacitor, 0.01 µF, 25 V, 10% 0402 X7R
C5, C11, C12, C13, C16, C22, C23, C24,
Capacitor, 0.1 µF, 50 V, 20% 0603 X7R
C25, C35, C37, C38, C39, C40, C41, C42
MANUFACTURER
PARTNUMBER
C0603C106M9PACTU
GRM188R61C104KA01D
TDK Corporation
C1608X7R1H332K
Taiyo Yuden
TMK105B7103KV-F
TDK Corporation
C1608X7R1H104M
TDK Corporation
C2012X5R0J226M
Fitted
16
Fitted
1
C6
Capacitor, 22 µF, 6.3 V 20% X5R 0805
Fitted
1
C8
CAP CER 1000 pF, 2 kV, 20% X7R, 1210
KEMET
Fitted
1
C9
Capacitor, 4700 pF, 2 kV, 10%, X7R, 1812
AVX
Fitted
6
C14, C15, C45, C46, C47, C48
Fitted
2
C17, C21
Capacitor, 4.7 µF, 6.3 V, 10%, 0805, X5R
Taiyo Yuden
Fitted
1
C18
Capacitor, 2.2 µF, 16 V, 10%, 0603, X5R
Murata
GRM188R61C225KE15D
Fitted
4
C19, C20, C26, C32
TDK Corporation
C1005X5R1A105M050BB
Fitted
3
C29, C31, C33
Fitted
2
C30, C44
Fitted
1
C36
Capacitor, 22 µF, 6.3 V, 20%, X5R, 0805
TDK Corporation
C2012X5R0J226M/1.25
Fitted
1
C43
Capacitor, 2.2 µF, 50 V, 10%, X5R, 0805
TDK Corporation
C2012X5R1H225K
Fitted
5
D1, D2, D6, D7, D11
CAP, CERM, 33 pF, 50 V, ±5%, C0G/NP0, 0402
Capacitor, 1 µF , X5R, 10 V, 0402
Capacitor, 0.1 µF 16 V, 10%, X7R, 0402
CAP, CERM, 0.1 µF, 25 V, ±5%, X7R, 0603
Diode, P-N, 70 V, 0.2 A, SOT-323
Quad Channel High-Speed ESD Protection Device,
DCK0006A
MuRata
Taiyo Yuden
AVX
3
D4, D5, D16
Fitted
2
D8, D14
Fitted
1
D9
Diode, Zener, 3.9 V, 550 mW, SMB
Fitted
1
D10
Diode, Schottky, 200 V, 1 A, PowerDI123
Fitted
2
D12, D15
Fitted
1
D13
LED, Red 630 nm, Clear 0805 SMD
Fitted
1
FB1
FERRITE CHIP 1000 Ω, 300 mA 0603
Fitted
6
FID1, FID2, FID3, FID4, FID5, FID6
Fiducial mark. There is nothing to buy or mount.
N/A
H1, H2, H3, H4, H5, H6
Machine Screw, Round, 4-40 × ¼, Nylon, Philips
Panhead
B&F Fastener Supply
1
J1
4
J2, J4, J6, J8
EMK105B7104KV-F
06033C104JAT2A
TPD4E1U06DCK
Fitted
Fitted
JMK212BJ475KG-T
Texas Instruments
D3
Fitted
GRM1555C1H330JA01D
DESD1P0RFW-7
1
6
1812GC472KAT1A
Diodes Inc
Fitted
Fitted
C1210C102MGRACTU
Diode, 5.6-V ESD Suppressor 0402
Epcos
B72590D0050H160
LED, Green 565 nm, Clear 0805 SMD
Lite on
LTST-C171GKT
ON Semiconductor
1SMB5915BT3G
LED AMBER CLEAR 0805 SMD
Connector, RJ45 NO MAG, shielded THRU HOLE
Terminal Block, 4×1, 2.54 mm, TH
32-Bit ARM® Cortex®-M4F MCU-Based Small Form Factor Serial-to-Ethernet
Converter
Copyright © 2014, Texas Instruments Incorporated
Diodes Inc.
DFLS1200-7
Lite on
LTST-C170AKT
Lite on
LTST-C171EKT
TDK Corporation
MMZ1608B102C
TE connectivity
On Shore Technology Inc
N/A
NY PMS 440 0025 PH
6116526-1
OSTVN02A150
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Table 11. BOM (continued)
FITTED
QTY
REFERENCE
Fitted
2
J3, J7
Fitted
1
J5
Connector, USB micro AB Receptacle Reversed
SMD
Fitted
1
J9
CONN MICRO HS TERM STRP HDR 50 POS
Samtec
ERM8-025-05.0-L-DV-K-TR
Not Fitted
0
J10
Header, 2 mm, Low Profile 2×3
Samtec
TMM-103-01-G-D-RA
Fitted
1
L1
Inductor 10uH, SMD 2.8×2.8 mm, 0.5 A, 0.47 Ω
Fitted
000 per
roll
LBL1
Fitted
5
R1, R2, R19, R59, R61
Fitted
2
R3, R60
Fitted
12
R4, R6, R8, R23, R24, R30, R32, R37,
R38, R40, R47, R48
Not Fitted
0
R5
Fitted
1
R7
Fitted
4
R9, R10, R11, R13
Fitted
2
R12, R56
Fitted
5
R14, R15, R35, R36, R46
Fitted
1
Fitted
8
R16
PART DESCRIPTION
Header, 2×5 2-mm spacing
Harwin Inc
Thermal Transfer Printable Labels, 0.650 W x 0.200"
H - 10
1
R21
Fitted
4
R22, R49, R58, R62
Fitted
2
R25, R45
PARTNUMBER
M22-2020505
HIROSE ELECTRIC CO. LTD. ZX62R-AB-5P
Wurth Electronics Inc
Brady
744029100
THT-14-LBL1
Resistor, 2.2 KΩ, 1/10 W 5% 0603 SMD
Vishay-Dale
CRCW06032K20JNEA
RES, 2.2 kΩ, 5%, 0.063 W, 0402
Vishay-Dale
CRCW04022K20JNED
Resistor, 0 Ω, 1/10 W, 5%, 0402
Panasonic Electronic
Components
RES, 1.0 MΩ, 5%, 0.063 W, 0402
Vishay-Dale
ERJ-2GE0R00X
CRCW04021M00JNED
Resistor, 1 MΩ, 1/10 W, 5%, 0603 SMD
Panasonic Electronic
Components
ERJ-3GEYJ105V
Resistor, 49.9 Ω, 1/10 W, 1%, 0603 Thick
Panasonic Electronic
Components
ERJ-3EKF49R9V
Resistor, 330 Ω, 1/10W, 5%, 0402
Panasonic Electronic
Components
RC0402FR-07330RL
RES, 33 Ω, 5%, 0.063 W, 0402
Vishay-Dale
Resistor, 1 Ω, 1/10 W 1%, 0603, Thick
R17, R18, R20, R33, R39, R44, R52, R54 Resistor, 10 kΩ, 1/10 W, 5%, 0402 Thick Film
Fitted
MANUFACTURER
Panasonic Electronic
Components
Yageo America
CRCW040233R0JNED
ERJ-3RQF1R0V
RC0402FR-0710KL
Resistor, 1 kΩ, 1/10 W, 5%, SMD, Thick
Panasonic Electronic
Components
ERJ-3GEYJ102V
Resistor, 0 Ω, 1/10 W, 0603 SMD
Panasonic Electronic
Components
ERJ-3GEY0R00V
RES, 120 Ω, 1%, 0.25 W, 1206
Yageo America
RC1206FR-07120RL
Resistor, 75 Ω, 1/10 W, 1%, SMD, Thick
Panasonic Electronic
Components
ERJ-3EKF75R0V
Fitted
4
R26, R27, R29, R34
Fitted
1
R28
Resistor, 1 MΩ, 5%, 1206 TF
Panasonic Electronic
Components
ERJ-8GEYJ105V
Fitted
1
R31
Resistor, 51 Ω, 1/10 W, 5%, 0402
Panasonic Electronic
Components
ERJ-2GEJ510X
Fitted
1
R41
Resistor, 4.87 kΩ, 1/10 W, 1%, SMD, Thick
Panasonic Electronic
Components
ERJ-3EKF4871V
Fitted
1
R42
Resistor, 10 kΩ, 1/10 W, 5%, 0603 SMD
Panasonic Electronic
Components
ERJ-3GEYJ103V
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27
Design Files
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Table 11. BOM (continued)
28
FITTED
QTY
REFERENCE
Not Fitted
0
R43
Fitted
3
R50, R53, R55
Fitted
1
Fitted
1
PART DESCRIPTION
Resistor, 33 Ω, 5%, 0.063 W, 0402
MANUFACTURER
PARTNUMBER
Vishay-Dale
CRCW040233R0JNED
Resistor, 330 Ω, 1/10 W, 5%, 0603 SMD
Panasonic Electronic
Components
ERJ-3GEYJ331V
R51
Resistor, 100 kΩ, 1/10 W, 5%, 0603 Thick
Panasonic Electronic
Components
ERJ-3GEYJ104V
R57
Resistor, 0.1 Ω, 1%, 0.1 W, 0603
Panasonic
ERJ-3RSFR10V
SW1
Switch, Tact 6-mm SMT, 160gf
Omron Electronics Inc-EMC
Div
Fitted
1
Fitted
1
T1
Transformer, MDL, XFMR SGL ETHR LAN, SOIC-16
Pulse Electronics
HX1198FNL
Fitted
1
U1
IC, RS-485 Transceiver LP, 8-SOIC
Texas Instruments
SN65HVD3082ED
Fitted
1
U2
Stellaris MCU TM4C129XNCZAD 212 BGA, Super
Texas Instruments
TM4C129XNCZAD
Fitted
1
U3
Load Switch, 5.5 V, SOT23-5, TPS2051BDBV
Texas Instruments
TPS2051BDBVT
Fitted
1
U4
CAN Transceiver with Fast Loop Times for Highly
Loaded Networks, 85 mA, 5 V, –40 to 125°C, 8-pin
SOIC (D), Green (RoHS and no Sb/Br)
Texas Instruments
SN65HVD256D
Fitted
1
U5
Regulator, Step Down 3.3 V, 0.5 A
Texas Instruments
TPS62177DQC
Texas Instruments
INA196AIDBVR
Fitted
1
U6
IC, Current Shunt Monitor, –16 to 80-V CommonMode Range
Fitted
1
Y1
Crystal, 25.00 MHz 5.0×3.2-mm SMT
32-Bit ARM® Cortex®-M4F MCU-Based Small Form Factor Serial-to-Ethernet
Converter
Copyright © 2014, Texas Instruments Incorporated
CTS-Frequency Controls
B3S-1000
445I23D25M00000
TIDU348 – June 2014
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Design Files
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7.3
PCB Layer Plots
To download the layer plots, see the design files at TIDA-00226.
Figure 24. Top Overlay
TIDU348 – June 2014
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Figure 25. Top Solder Mask
32-Bit ARM® Cortex®-M4F MCU-Based Small Form Factor Serial-to-Ethernet
Converter
Copyright © 2014, Texas Instruments Incorporated
29
Design Files
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Figure 26. Top Layer
30
Figure 27. Layer 2: GND Plane
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Figure 28. Layer 3: Power Plane
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Figure 29. Bottom Layer
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Figure 30. Bottom Overlay
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Figure 31. Bottom Solder Mask
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7.4
Altium Project
To download the Altium project files, see the design files at TIDA-00226.
Figure 32. Multilayer Composite Print
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Design Files
7.5
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Gerber Files
To download the Gerber files, see the design files at TIDA-00226.
Figure 33. Drill Drawing
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7.6
Assembly Drawings
Figure 34. Top Paste
Figure 35. Bottom Paste
Figure 36. Assembly Top
Figure 37. Assembly Bottom
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References
8
References
1.
2.
3.
4.
9
www.ti.com
System Design Guidelines for the TM4C129x Family of Tiva C Series Microcontrollers, (SPMA056).
Tiva TM4C129x Development Board User's Guide, (SPMU360).
Tiva TM4C1292NCZAD Microcontroller Data Sheet, (SPMS432A).
Tiva C Series TM4C1294 Connected LaunchPad Evaluation Kit, (SPMU365A).
About the Author
KALLIKUPPA MUNIYAPPA SREENIVASA is a systems architect at Texas Instruments where he is
responsible for developing reference design solutions for the industrial segment. Sreenivasa brings to this
role his experience in high-speed digital and analog systems design. Sreenivasa earned his Bachelor of
Electronics (BE) in electronics and communication engineering (BE-E&C) from VTU, Mysore, India.
36
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