4Gb DDR3 SDRAM
4Gb DDR3 SDRAM
4Gb DDR3 SDRAM
Lead-Free&Halogen-Free
(RoHS Compliant)
H5TQ4G83AFR-xxC
H5TQ4G83AFR-xxI
H5TQ4G83AFR-xxL
H5TQ4G83AFR-xxJ
H5TQ4G63AFR-xxC
H5TQ4G63AFR-xxI
H5TQ4G63AFR-xxL
H5TQ4G63AFR-xxJ
* SK Hynix reserves the right to change products or specifications without notice.
Rev. 1.1/ Jan 2013
1
Revision History
Revision No.
History
Draft Date
1.0
Official Version Release
Oct. 2012
1.1
x8 IDD update
Jan. 2013
Rev. 1.1/ Jan 2013
Remark
2
Description
The H5TQ4G83AFR-xxC,H5TQ4G63AFR-xxC, H5TQ4G83AFR-xxI, H5TQ4G63AFR-xxI, H5TQ4G83AFR-xxL,
H5TQ4G63AFR-xxL,H5TQ4G83AFR-xxJ and H5TQ4G63AFR-xxJ are a 4,294,967,296-bit CMOS Double Data
Rate III (DDR3) Synchronous DRAM, ideally suited for the main memory applications which requires large
memory density and high bandwidth. SK Hynix 4Gb DDR3 SDRAMs offer fully synchronous operations referenced to both rising and falling edges of the clock. While all addresses and control inputs are latched on
the rising edges of the CK (falling edges of the CK), Data, Data strobes and Write data masks inputs are
sampled on both rising and falling edges of it. The data paths are internally pipelined and 8-bit prefetched
to achieve very high bandwidth.
Device Features and Ordering Information
FEATURES
• VDD=VDDQ=1.5V +/- 0.075V
• 8banks
• Fully differential clock inputs (CK, CK) operation
• Average Refresh Cycle (Tcase of 0 oC~ 95 oC)
- 7.8 µs at 0oC ~ 85 oC
- 3.9 µs at 85oC ~ 95 oC
Commercial Temperature( 0oC ~ 85 oC)
Industrial Temperature( -40oC ~ 95 oC)
• Differential Data Strobe (DQS, DQS)
• On chip DLL align DQ, DQS and DQS transition with CK
transition
• DM masks write data-in at the both rising and falling
edges of the data strobe
• JEDEC standard 78ball FBGA(x8), 96ball FBGA (x16)
• All addresses and control inputs except data,
data strobes and data masks latched on the
rising edges of the clock
• Driver strength selected by EMRS
• Programmable CAS latency 5, 6, 7, 8, 9, 10, 11, 13
and 14 supported
• Asynchronous RESET pin supported
• Programmable additive latency 0, CL-1, and CL-2
supported
• TDQS (Termination Data Strobe) supported (x8 only)
• Programmable CAS Write latency (CWL) = 5, 6, 7, 8
9 and 10
• 8 bit pre-fetch
• Dynamic On Die Termination supported
• ZQ calibration supported
• Write Levelization supported
• Programmable burst length 4/8 with both nibble
sequential and interleave mode
• BL switch on the fly
* This product in compliance with the RoHS directive.
Rev. 1.1/ Jan 2013
3
ORDERING INFORMATION
Part No.
Configuration
H5TQ4G83AFR-*xxC
Power Consumption
Normal Consumption
H5TQ4G83AFR-*xxI
512M x 8
H5TQ4G83AFR-*xxL
H5TQ4G63AFR-*xxI
(IDD6 Only)
Industrial
256M x 16
H5TQ4G63AFR-*xxL
Industrial
Commercial
Normal Consumption
78ball FBGA
Commercial
Industrial
Low Power Consumption
Commercial
(IDD6 Only)
Industrial
H5TQ4G63AFR-*xxJ
Package
Commercial
Low Power Consumption
H5TQ4G83AFR-*xxJ
H5TQ4G63AFR-*xxC
Temperature
96ball FBGA
* xx means Speed Bin Grade
OPERATING FREQUENCY
Frequency [MHz]
Speed
Grade
(Marking)
CL5
CL6
CL7
CL8
-G7
667
800
1066
1066
-H9
667
800
1066
1066
1333
1333
-PB
667
800
1066
1066
1333
1333
1600
-RD
800
1066
1066
1333
1333
1600
1866
-TE
800
1066
1066
1333
1333
1600
1866
Rev. 1.1/ Jan 2013
CL9
CL10
CL11
CL12
CL13
CL14
Remark
(CL-tRCD-tRP)
DDR3-1066 7-7-7
DDR3-1333 9-9-9
DDR3-1600 11-11-11
DDR3-1866 13-13-13
2133
DDR3-2133 14-14-14
4
x8 Package Ball out (Top view): 78ball FBGA Package
1
2
3
VSS
VDD
B
VSS
C
VDDQ
D
E
A
4
5
6
7
8
9
NC
NF/TDQS
VSS
VDD
A
VSSQ
DQ0
DM/TDQS
VSSQ
VDDQ
B
DQ2
DQS
DQ1
DQ3
VSSQ
C
VSSQ
DQ6
DQS
VDD
VSS
VSSQ
D
VREFDQ
VDDQ
DQ4
DQ7
DQ5
VDDQ
E
F
NC
VSS
RAS
CK
VSS
NC
F
G
ODT
VDD
CAS
CK
VDD
CKE
G
H
NC
CS
WE
A10/AP
ZQ
NC
H
J
VSS
BA0
BA2
A15
VREFCA
VSS
J
K
VDD
A3
A0
A12/BC
BA1
VDD
K
L
VSS
A5
A2
A1
A4
VSS
L
M
VDD
A7
A9
A11
A6
VDD
M
N
VSS
RESET
A13
A14
A8
VSS
N
1
2
3
7
8
9
1 2 3
4
5
6
7 8 9
A
B
C
D
E
F
G
H
J
K
(Top View: See the balls through the Package)
Populated ball
Ball not populated
L
M
N
Rev. 1.1/ Jan 2013
5
x16 Package Ball out (Top view): 96ball FBGA Package
A
1
2
3
VDDQ
DQU5
4
5
6
7
8
9
DQU7
DQU4
VDDQ
VSS
A
B
VSSQ
VDD
VSS
DQSU
DQU6
VSSQ
B
C
VDDQ
DQU3
DQU1
DQSU
DQU2
VDDQ
C
D
VSSQ
VDDQ
DMU
DQU0
VSSQ
VDD
D
E
VSS
VSSQ
DQL0
DML
VSSQ
VDDQ
E
F
VDDQ
DQL2
DQSL
DQL1
DQL3
VSSQ
F
G
VSSQ
DQL6
DQSL
VDD
VSS
VSSQ
G
H
VREFDQ
VDDQ
DQL4
DQL7
DQL5
VDDQ
H
J
NC
VSS
RAS
CK
VSS
NC
J
K
ODT
VDD
CAS
CK
VDD
CKE
K
L
NC
CS
WE
A10/AP
ZQ
NC
L
M
VSS
BA0
BA2
NC
VREFCA
VSS
M
N
VDD
A3
A0
A12/BC
BA1
VDD
N
P
VSS
A5
A2
A1
A4
VSS
P
R
VDD
A7
A9
A11
A6
VDD
R
T
VSS
RESET
A13
A14
A8
VSS
T
1
2
3
7
8
9
1 2 3
4
5
6
7 8 9
A
B
C
D
E
F
G
(Top View: See the balls through the Package)
H
J
K
Populated ball
Ball not populated
L
M
N
P
R
T
Rev. 1.1/ Jan 2013
6
Pin Functional Description
Symbol
Type
Function
CK, CK
Input
Clock: CK and CK are differential clock inputs. All address and control input signals are
sampled on the crossing of the positive edge of CK and negative edge of CK.
CKE, (CKE0),
(CKE1)
Input
Clock Enable: CKE HIGH activates, and CKE Low deactivates, internal clock signals and
device input buffers and output drivers. Taking CKE Low provides Precharge Power-Down
and Self-Refresh operation (all banks idle), or Active Power-Down (row Active in any
bank).
CKE is asynchronous for Self-Refresh exit. After VREFCA and VREFDQ have become stable
during the power on and initialization sequence, they must be maintained during all
operations (including Self-Refresh). CKE must be maintained high throughout read and
write accesses. Input buffers, excluding CK, CK, ODT and CKE, are disabled during powerdown. Input buffers, excluding CKE, are disabled during Self-Refresh.
CS, (CS0),
(CS1), (CS2),
(CS3)
Input
Chip Select: All commands are masked when CS is registered HIGH.
CS provides for external Rank selection on systems with multiple Ranks.
CS is considered part of the command code.
ODT, (ODT0),
(ODT1)
Input
On Die Termination: ODT (registered HIGH) enables termination resistance internal to the
DDR3 SDRAM. When enabled, ODT is only applied to each DQ, DQS, DQS and DM/TDQS,
NU/TDQS (When TDQS is enabled via Mode Register A11=1 in MR1) signal for x4/x8
configurations. For x16 configuration, ODT is applied to each DQ, DQSU, DQSU, DQSL,
DQSL, DMU, and DML signal. The ODT pin will be ignored if MR1 is programmed to disable
ODT.
RAS,
CAS, WE
Input
Command Inputs: RAS, CAS and WE (along with CS) define the command being entered.
DM, (DMU),
(DML)
Input
Input Data Mask: DM is an input mask signal for write data. Input data is masked when
DM is sampled HIGH coincident with that input data during a Write access. DM is sampled
on both edges of DQS. For x8 device, the function of DM or TDQS/TDQS is enabled by
Mode Register A11 setting in MR1.
BA0 - BA2
Input
Bank Address Inputs: BA0 - BA2 define to which bank an Active, Read, Write or Precharge
command is being applied. Bank address also determines if the mode register or extended
mode register is to be accessed during a MRS cycle.
Input
Address Inputs: Provide the row address for Active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective
bank. (A10/AP and A12/BC have additional functions, see below).
The address inputs also provide the op-code during Mode Register Set commands.
A10 / AP
Input
Auto-precharge: A10 is sampled during Read/Write commands to determine whether
Autoprecharge should be performed to the accessed bank after the Read/Write operation.
(HIGH: Autoprecharge; LOW: no Autoprecharge).A10 is sampled during a Precharge
command to determine whether the Precharge applies to one bank (A10 LOW) or all
banks (A10 HIGH). If only one bank is to be precharged, the bank is selected by bank
addresses.
A12 / BC
Input
Burst Chop: A12 / BC is sampled during Read and Write commands to determine if burst
chop (on-the-fly) will be performed.
(HIGH, no burst chop; LOW: burst chopped). See command truth table for details.
A0 - A15
Rev. 1.1/ Jan 2013
7
Symbol
Type
Function
Active Low Asynchronous Reset: Reset is active when RESET is LOW, and inactive when
RESET is HIGH. RESET must be HIGH during normal operation.
RESET is a CMOS rail-to-rail signal with DC high and low at 80% and 20% of VDD, i.e.
1.20V for DC high and 0.30V for DC low.
RESET
Input
DQ
Input /
Output
Data Input/ Output: Bi-directional data bus.
Input /
Output
Data Strobe: output with read data, input with write data. Edge-aligned with read data,
centered in write data. The data strobe DQS, DQSL, and DQSU are paired with differential
signals DQS, DQSL, and DQSU, respectively, to provide differential pair signaling to the
system during reads and writes. DDR3 SDRAM supports differential data strobe only and
does not support single-ended.
Output
Termination Data Strobe: TDQS/TDQS is applicable for x8 DRAMs only. When enabled via
Mode Register A11 = 1 in MR1, the DRAM will enable the same termination resistance
function on TDQS/TDQS that is applied to DQS/DQS. When disabled via mode register A11
= 0 in MR1, DM/TDQS will provide the data mask function and TDQS is not used. x4/x16
DRAMs must disable the TDQS function via mode register A11 = 0 in MR1.
DQU, DQL,
DQS, DQS,
DQSU, DQSU,
DQSL, DQSL
TDQS, TDQS
NC
No Connect: No internal electrical connection is present.
NF
No Function
VDDQ
Supply
DQ Power Supply: 1.5 V +/- 0.075 V
VSSQ
Supply
DQ Ground
VDD
Supply
Power Supply: 1.5 V +/- 0.075 V
VSS
Supply
Ground
VREFDQ
Supply
Reference voltage for DQ
VREFCA
Supply
Reference voltage for CA
ZQ
Supply
Reference Pin for ZQ calibration
Note:
Input only pins (BA0-BA2, A0-A15, RAS, CAS, WE, CS, CKE, ODT, DM, and RESET) do not supply termination.
Rev. 1.1/ Jan 2013
8
ROW AND COLUMN ADDRESS TABLE
4Gb
Configuration
# of Banks
Bank Address
Auto precharge
BL switch on the fly
Row Address
Column Address
Page size 1
512Mb x 8
256Mb x 16
8
BA0 - BA2
A10/AP
A12/BC
A0 - A15
A0 - A9
1 KB
8
BA0 - BA2
A10/AP
A12/BC
A0 - A14
A0 - A9
2 KB
Note1: Page size is the number of bytes of data delivered from the array to the internal sense amplifiers
when an ACTIVE command is registered. Page size is per bank, calculated as follows:
page size = 2 COLBITS * ORG  8
where COLBITS = the number of column address bits, ORG = the number of I/O (DQ) bits
Rev. 1.1/ Jan 2013
9
Absolute Maximum Ratings
Absolute Maximum DC Ratings
Absolute Maximum DC Ratings
Symbol
VDD
VDDQ
Parameter
Rating
Units
Notes
Voltage on VDD pin relative to Vss
- 0.4 V ~ 1.975 V
V
1,3
Voltage on VDDQ pin relative to Vss
- 0.4 V ~ 1.975 V
V
1,3
V
1
VIN, VOUT Voltage on any pin relative to Vss
TSTG
- 0.4 V ~ 1.975 V
-55 to +100
Storage Temperature
o
C
1, 2
Notes:
1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any other conditions above
those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement
conditions, please refer to JESD51-2 standard.
3. VDD and VDDQ must be within 300mV of each other at all times; and VREF must not be greater than
0.6XVDDQ,When VDD and VDDQ are less than 500mV; VREF may be equal to or less than 300mV.
DRAM Component Operating
Temperature Range
Symbol
TOPER
Parameter
Normal Operating Temperature Range
Industrial Temperature Range
Rating
Units
Notes
0 to 85
oC
1,2
-40 to 95
oC
1,3
Notes:
1. Operating Temperature TOPER is the case surface temperature on the center / top side of the DRAM. For measurement conditions, please refer to the JEDEC document JESD51-2.
2. The Normal Temperature Range specifies the temperatures where all DRAM specifications will be supported. During operation, the DRAM case temperature must be maintained between 0 - 85oC under all operating conditions.
3. Some applications require operation of the DRAM in the Extended Temperature Range between 85oC and 95oC
case temperature. Full specifications are guaranteed in this range, but the following additional conditions apply:
a. Refresh commands must be doubled in frequency, therefore reducing the Refresh interval tREFI to 3.9 µs.
b. If Self-Refresh operation is required in the Extended Temperature Range, then it is mandatory to use the Manual Self-Refresh mode with Extended Temperature Range capability (MR2 A6 = 0b and MR2 A7 = 1b).
Rev. 1.1/ Jan 2013
10
AC & DC Operating Conditions
Recommended DC Operating Conditions
Recommended DC Operating Conditions
Symbol
VDD
VDDQ
Parameter
Rating
Units
Notes
1.575
V
1,2
1.575
V
1,2
Min.
Typ.
Max.
Supply Voltage
1.425
1.500
Supply Voltage for Output
1.425
1.500
Notes:
1. Under all conditions, VDDQ must be less than or equal to VDD.
2. VDDQ tracks with VDD. AC parameters are measured with VDD and VDDQ tied together.
Rev. 1.1/ Jan 2013
11
IDD and IDDQ Specification Parameters and Test Conditions
IDD and IDDQ Measurement Conditions
In this chapter, IDD and IDDQ measurement conditions such as test load and patterns are defined. Figure
1. shows the setup and test load for IDD and IDDQ measurements.
•
IDD currents (such as IDD0, IDD1, IDD2N, IDD2NT, IDD2P0, IDD2P1, IDD2Q, IDD3N, IDD3P, IDD4R,
IDD4W, IDD5B, IDD6, IDD6ET, and IDD7) are measured as time-averaged currents with all VDD balls
of the DDR3 SDRAM under test tied together. Any IDDQ current is not included in IDD currents.
•
IDDQ currents (such as IDDQ2NT and IDDQ4R) are measured as time-averaged currents with all
VDDQ balls of the DDR3 SDRAM under test tied together. Any IDD current is not included in IDDQ currents.
Attention: IDDQ values cannot be directly used to calculate IO power of the DDR3 SDRAM. They can
be used to support correlation of simulated IO power to actual IO power as outlined in Figure 2. In
DRAM module application, IDDQ cannot be measured separately since VDD and VDDQ are using one
merged-power layer in Module PCB.
For IDD and IDDQ measurements, the following definitions apply:
•
”0” and “LOW” is defined as VIN <= VILAC(max).
•
”1” and “HIGH” is defined as VIN >= VIHAC(max).
•
“MID_LEVEL” is defined as inputs are VREF = VDD/2.
•
Timing used for IDD and IDDQ Measurement-Loop Patterns are provided in Table 1.
•
Basic IDD and IDDQ Measurement Conditions are described in Table 2.
•
Detailed IDD and IDDQ Measurement-Loop Patterns are described in Table 3 through Table 10.
•
IDD Measurements are done after properly initializing the DDR3 SDRAM. This includes but is not limited to setting
RON = RZQ/7 (34 Ohm in MR1);
Qoff = 0B (Output Buffer enabled in MR1);
RTT_Nom = RZQ/6 (40 Ohm in MR1);
RTT_Wr = RZQ/2 (120 Ohm in MR2);
TDQS Feature disabled in MR1
•
Attention: The IDD and IDDQ Measurement-Loop Patterns need to be executed at least one time
before actual IDD or IDDQ measurement is started.
•
Define D = {CS, RAS, CAS, WE}:= {HIGH, LOW, LOW, LOW}
•
Define D = {CS, RAS, CAS, WE}:= {HIGH, HIGH, HIGH, HIGH}
Rev. 1.1/ Jan 2013
12
IDDQ (optional)
IDD
VDD
VDDQ
RESET
CK/CK
DDR3
SDRAM
CKE
CS
RAS, CAS, WE
DQS, DQS
DQ, DM,
TDQS, TDQS
A, BA
ODT
ZQ
VSS
RTT = 25 Ohm
VDDQ/2
VSSQ
Figure 1 - Measurement Setup and Test Load for IDD and IDDQ (optional) Measurements
[Note: DIMM level Output test load condition may be different from above]
Application specific
memory channel
environment
IDDQ
Test Load
Channel
IO Power
Simulation
IDDQ
Simulation
IDDQ
Simulation
Correction
Channel IO Power
Number
Figure 2 - Correlation from simulated Channel IO Power to actual Channel IO Power supported
by IDDQ Measurement
Rev. 1.1/ Jan 2013
13
Table 1 -Timings used for IDD and IDDQ Measurement-Loop Patterns
DDR3-1066
DDR3-1333
DDR3-1600
DDR3-1866
DDR3-2133
7-7-7
9-9-9
11-11-11
13-13-13
14-14-14
tCK
1.875
1.5
1.25
1.07
0.935
ns
CL
7
9
11
13
14
nCK
nRCD
7
9
11
13
14
nCK
nRC
27
33
39
45
50
nCK
nRAS
20
24
28
32
36
nCK
nRP
7
9
11
13
14
nCK
1KB page
size
20
20
24
26
27
nCK
2KB page
size
27
30
32
33
38
nCK
1KB page
size
4
4
5
5
6
nCK
2KB page
size
6
5
6
6
7
nCK
nRFC -512Mb
48
60
72
85
97
nCK
nRFC-1 Gb
59
74
88
103
118
nCK
nRFC- 2 Gb
86
107
128
150
172
nCK
nRFC- 4 Gb
139
174
208
243
279
nCK
nRFC- 8 Gb
187
234
280
328
375
nCK
Symbol
nFAW
nRRD
Unit
Table 2 -Basic IDD and IDDQ Measurement Conditions
Symbol
Description
Operating One Bank Active-Precharge Current
CKE: High; External clock: On; tCK, nRC, nRAS, CL: see Table 1; BL: 8a); AL: 0; CS: High between ACT
IDD0
and PRE; Command, Address, Bank Address Inputs: partially toggling according to Table 3; Data IO:
MID-LEVEL; DM: stable at 0; Bank Activity: Cycling with one bank active at a time: 0,0,1,1,2,2,... (see
Table 3); Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: stable at 0; Pattern Details:
see Table 3.
Rev. 1.1/ Jan 2013
14
Symbol
Description
Operating One Bank Active-Precharge Current
CKE: High; External clock: On; tCK, nRC, nRAS, nRCD, CL: see Table 1; BL: 8a); AL: 0; CS: High between
IDD1
ACT, RD and PRE; Command, Address; Bank Address Inputs, Data IO: partially toggling according to
Table 4; DM: stable at 0; Bank Activity: Cycling with on bank active at a time: 0,0,1,1,2,2,... (see Table
4); Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: stable at 0; Pattern Details: see
Table 4.
Precharge Standby Current
CKE: High; External clock: On; tCK, CL: see Table 1; BL: 8a); AL: 0; CS: stable at 1; Command, Address,
IDD2N
Bank Address Inputs: partially toggling according to Table 5; Data IO: MID_LEVEL; DM: stable at 0;
Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: stable
at 0; Pattern Details: see Table 5.
Precharge Standby ODT Current
CKE: High; External clock: On; tCK, CL: see Table 1; BL: 8a); AL: 0; CS: stable at 1; Command, Address,
IDD2NT
Bank Address Inputs: partially toggling according to Table 6; Data IO: MID_LEVEL; DM: stable at 0;
Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: toggling according to Table 6; Pattern Details: see Table 6.
Precharge Power-Down Current Slow Exit
CKE: Low; External clock: On; tCK, CL: see Table 1; BL: 8a); AL: 0; CS: stable at 1; Command, Address,
IDD2P0
Bank Address Inputs: stable at 0; Data IO: MID_LEVEL; DM: stable at 0; Bank Activity: all banks closed;
Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: stable at 0; Precharge Power Down
Mode: Slow Exitc)
Precharge Power-Down Current Fast Exit
CKE: Low; External clock: On; tCK, CL: see Table 1; BL: 8a); AL: 0; CS: stable at 1; Command, Address,
IDD2P1
Bank Address Inputs: stable at 0; Data IO: MID_LEVEL; DM: stable at 0; Bank Activity: all banks closed;
Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: stable at 0; Precharge Power Down
Mode: Fast Exitc)
Precharge Quiet Standby Current
IDD2Q
CKE: High; External clock: On; tCK, CL: see Table 1; BL: 8a); AL: 0; CS: stable at 1; Command, Address,
Bank Address Inputs: stable at 0; Data IO: MID_LEVEL; DM: stable at 0; Bank Activity: all banks closed;
Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: stable at 0
Rev. 1.1/ Jan 2013
15
Symbol
Description
Active Standby Current
CKE: High; External clock: On; tCK, CL: see Table 1; BL: 8a); AL: 0; CS: stable at 1; Command, Address,
IDD3N
Bank Address Inputs: partially toggling according to Table 5; Data IO: MID_LEVEL; DM: stable at 0;
Bank Activity: all banks open; Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: stable
at 0; Pattern Details: see Table 5.
Active Power-Down Current
IDD3P
CKE: Low; External clock: On; tCK, CL: see Table 1; BL: 8a); AL: 0; CS: stable at 1; Command, Address,
Bank Address Inputs: stable at 0; Data IO: MID_LEVEL; DM: stable at 0; Bank Activity: all banks open;
Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: stable at 0
Operating Burst Read Current
CKE: High; External clock: On; tCK, CL: see Table 1; BL: 8a); AL: 0; CS: High between RD; Command,
IDD4R
Address, Bank Address Inputs: partially toggling according to Table 7; Data IO: seamless read data burst
with different data between one burst and the next one according to Table 7; DM: stable at 0; Bank
Activity: all banks open, RD commands cycling through banks: 0,0,1,1,2,2,...(see Table 7); Output Buffer
and RTT: Enabled in Mode Registersb); ODT Signal: stable at 0; Pattern Details: see Table 7.
Operating Burst Write Current
CKE: High; External clock: On; tCK, CL: see Table 1; BL: 8a); AL: 0; CS: High between WR; Command,
IDD4W
Address, Bank Address Inputs: partially toggling according to Table 8; Data IO: seamless read data burst
with different data between one burst and the next one according to Table 8; DM: stable at 0; Bank
Activity: all banks open, WR commands cycling through banks: 0,0,1,1,2,2,...(see Table 8); Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: stable at HIGH; Pattern Details: see Table 8.
Burst Refresh Current
CKE: High; External clock: On; tCK, CL, nRFC: see Table 1; BL: 8a); AL: 0; CS: High between REF; Com-
IDD5B
mand, Address, Bank Address Inputs: partially toggling according to Table 9; Data IO: MID_LEVEL; DM:
stable at 0; Bank Activity: REF command every nREF (see Table 9); Output Buffer and RTT: Enabled in
Mode Registersb); ODT Signal: stable at 0; Pattern Details: see Table 9.
Self-Refresh Current: Normal Temperature Range
TCASE: 0 - 85 oC; Auto Self-Refresh (ASR): Disabledd);Self-Refresh Temperature Range (SRT): Normale);
IDD6
CKE: Low; External clock: Off; CK and CK: LOW; CL: see Table 1; BL: 8a); AL: 0; CS, Command, Address,
Bank Address Inputs, Data IO: MID_LEVEL; DM: stable at 0; Bank Activity: Self-Refresh operation; Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: MID_LEVEL
Rev. 1.1/ Jan 2013
16
Symbol
Description
Self-Refresh Current: Extended Temperature Range (optional)f)
TCASE: 0 - 95 oC; Auto Self-Refresh (ASR): Disabledd);Self-Refresh Temperature Range (SRT): ExtendIDD6ET
ede); CKE: Low; External clock: Off; CK and CK: LOW; CL: see Table 1; BL: 8a); AL: 0; CS, Command,
Address, Bank Address Inputs, Data IO: MID_LEVEL; DM: stable at 0; Bank Activity: Extended Temperature Self-Refresh operation; Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal:
MID_LEVEL
Operating Bank Interleave Read Current
CKE: High; External clock: On; tCK, nRC, nRAS, nRCD, NRRD, nFAW, CL: see Table 1; BL: 8a), f); AL: CL1; CS: High between ACT and RDA; Command, Address, Bank Address Inputs: partially toggling accord-
IDD7
ing to Table 10; Data IO: read data burst with different data between one burst and the next one
according to Table 10; DM: stable at 0; Bank Activity: two times interleaved cycling through banks (0,
1,...7) with different addressing, wee Table 10; Output Buffer and RTT: Enabled in Mode Registersb);
ODT Signal: stable at 0; Pattern Details: see Table 10.
a) Burst Length: BL8 fixed by MRS: set MR0 A[1,0]=00B
b) Output Buffer Enable: set MR1 A[12] = 0B; set MR1 A[5,1] = 01B; RTT_Nom enable: set MR1 A[9,6,2] = 011B;
RTT_Wr enable: set MR2 A[10,9] = 10B
c) Precharge Power Down Mode: set MR0 A12=0B for Slow Exit or MR0 A12 = 1B for Fast Exit
d) Auto Self-Refresh (ASR): set MR2 A6 = 0B to disable or 1B to enable feature
e) Self-Refresh Temperature Range (SRT): set MR2 A7 = 0B for normal or 1B for extended temperature range
f) Read Burst Type: Nibble Sequential, set MR0 A[3] = 0B
Rev. 1.1/ Jan 2013
17
Command
CS
RAS
CAS
WE
ODT
BA[2:0]
A[15:11]
A[10]
A[9:7]
A[6:3]
A[2:0]
0
ACT
0
0
1
1
0
0
00
0
0
0
0
-
1,2
D, D
1
0
0
0
0
0
00
0
0
0
0
-
3,4
D, D
1
1
1
1
0
0
00
0
0
0
0
-
0
0
0
-
Cycle
Number
Datab)
Sub-Loop
CKE
CK, CK
Table 3 - IDD0 Measurement-Loop Patterna)
0
...
nRAS
Static High
toggling
...
repeat pattern 1...4 until nRAS - 1, truncate if necessary
PRE
0
0
1
0
0
0
00
0
repeat pattern 1...4 until nRC - 1, truncate if necessary
1*nRC+0
ACT
0
0
1
1
0
0
00
0
0
F
0
-
1*nRC+1, 2
D, D
1
0
0
0
0
0
00
0
0
F
0
-
1*nRC+3, 4
D, D
1
1
1
1
0
0
00
0
0
F
0
-
0
-
...
1*nRC+nRAS
repeat pattern 1...4 until 1*nRC + nRAS - 1, truncate if necessary
PRE
0
0
1
0
0
0
00
0
0
...
repeat pattern 1...4 until 2*nRC - 1, truncate if necessary
1
2*nRC
repeat Sub-Loop 0, use BA[2:0] = 1 instead
2
4*nRC
repeat Sub-Loop 0, use BA[2:0] = 2 instead
3
6*nRC
repeat Sub-Loop 0, use BA[2:0] = 3 instead
4
8*nRC
repeat Sub-Loop 0, use BA[2:0] = 4 instead
5
10*nRC
repeat Sub-Loop 0, use BA[2:0] = 5 instead
6
12*nRC
repeat Sub-Loop 0, use BA[2:0] = 6 instead
7
14*nRC
repeat Sub-Loop 0, use BA[2:0] = 7 instead
F
a) DM must be driven LOW all the time. DQS, DQS are MID-LEVEL.
b) DQ signals are MID-LEVEL.
Rev. 1.1/ Jan 2013
18
CAS
WE
ODT
BA[2:0]
A[15:11]
A[10]
A[9:7]
A[6:3]
A[2:0]
ACT
0
0
1
1
0
0
00
0
0
0
0
-
D, D
1
0
0
0
0
0
00
0
0
0
0
-
3,4
D, D
1
1
1
1
0
0
00
0
0
0
0
-
0
0
00000000
0
0
0
-
0
F
0
-
nRCD
...
nRAS
...
1*nRC+0
Static High
Datab)
1,2
...
toggling
RAS
0
CS
0
Command
Cycle
Number
Sub-Loop
CKE
CK, CK
Table 4 - IDD1 Measurement-Loop Patterna)
repeat pattern 1...4 until nRCD - 1, truncate if necessary
RD
0
1
0
1
0
0
00
0
0
repeat pattern 1...4 until nRAS - 1, truncate if necessary
PRE
0
0
1
0
0
0
00
0
repeat pattern 1...4 until nRC - 1, truncate if necessary
ACT
0
0
1
1
0
0
00
0
1*nRC+1,2
D, D
1
0
0
0
0
0
00
0
0
F
0
-
1*nRC+3,4
D, D
1
1
1
1
0
0
00
0
0
F
0
-
...
1*nRC+nRCD
...
1*nRC+nRAS
repeat pattern nRC + 1,...4 until nRC + nRCE - 1, truncate if necessary
RD
0
1
0
1
0
0
00
0
0
F
0
00110011
repeat pattern nRC + 1,...4 until nRC + nRAS - 1, truncate if necessary
PRE
0
0
1
0
0
0
00
0
0
F
...
repeat pattern nRC + 1,...4 until *2 nRC - 1, truncate if necessary
1
2*nRC
repeat Sub-Loop 0, use BA[2:0] = 1 instead
2
4*nRC
repeat Sub-Loop 0, use BA[2:0] = 2 instead
3
6*nRC
repeat Sub-Loop 0, use BA[2:0] = 3 instead
4
8*nRC
repeat Sub-Loop 0, use BA[2:0] = 4 instead
5
10*nRC
repeat Sub-Loop 0, use BA[2:0] = 5 instead
6
12*nRC
repeat Sub-Loop 0, use BA[2:0] = 6 instead
7
14*nRC
repeat Sub-Loop 0, use BA[2:0] = 7 instead
0
-
a) DM must be driven LOW all the time. DQS, DQS are used according to RD Commands, otherwise MID-LEVEL.
b) Burst Sequence driven on each DQ signal by Read Command. Outside burst operation, DQ signals are MID_LEVEL.
Rev. 1.1/ Jan 2013
19
Static High
CS
RAS
CAS
WE
ODT
BA[2:0]
A[15:11]
A[10]
A[9:7]
A[6:3]
A[2:0]
0
D
1
0
0
0
0
0
0
0
0
0
0
-
1
D
1
0
0
0
0
0
0
0
0
0
0
-
2
D
1
1
1
1
0
0
0
0
0
F
0
-
3
D
1
1
1
1
0
0
0
0
0
F
0
-
Cycle
Number
Command
0
toggling
Datab)
Sub-Loop
CKE
CK, CK
Table 5 - IDD2N and IDD3N Measurement-Loop Patterna)
1
4-7
repeat Sub-Loop 0, use BA[2:0] = 1 instead
2
8-11
repeat Sub-Loop 0, use BA[2:0] = 2 instead
3
12-15
repeat Sub-Loop 0, use BA[2:0] = 3 instead
4
16-19
repeat Sub-Loop 0, use BA[2:0] = 4 instead
5
20-23
repeat Sub-Loop 0, use BA[2:0] = 5 instead
6
24-17
repeat Sub-Loop 0, use BA[2:0] = 6 instead
7
28-31
repeat Sub-Loop 0, use BA[2:0] = 7 instead
a) DM must be driven LOW all the time. DQS, DQS are MID-LEVEL.
b) DQ signals are MID-LEVEL.
Static High
CS
RAS
CAS
WE
ODT
BA[2:0]
A[15:11]
A[10]
A[9:7]
A[6:3]
A[2:0]
0
D
1
0
0
0
0
0
0
0
0
0
0
-
1
D
1
0
0
0
0
0
0
0
0
0
0
-
2
D
1
1
1
1
0
0
0
0
0
F
0
-
3
D
1
1
1
1
0
0
0
0
0
F
0
-
Cycle
Number
Command
0
toggling
Datab)
Sub-Loop
CKE
CK, CK
Table 6 - IDD2NT and IDDQ2NT Measurement-Loop Patterna)
1
4-7
repeat Sub-Loop 0, but ODT = 0 and BA[2:0] = 1
2
8-11
repeat Sub-Loop 0, but ODT = 1 and BA[2:0] = 2
3
12-15
repeat Sub-Loop 0, but ODT = 1 and BA[2:0] = 3
4
16-19
repeat Sub-Loop 0, but ODT = 0 and BA[2:0] = 4
5
20-23
repeat Sub-Loop 0, but ODT = 0 and BA[2:0] = 5
6
24-17
repeat Sub-Loop 0, but ODT = 1 and BA[2:0] = 6
7
28-31
repeat Sub-Loop 0, but ODT = 1 and BA[2:0] = 7
a) DM must be driven LOW all the time. DQS, DQS are MID-LEVEL.
b) DQ signals are MID-LEVEL.
Rev. 1.1/ Jan 2013
20
1
Static High
CAS
WE
ODT
BA[2:0]
A[15:11]
A[10]
A[9:7]
A[6:3]
A[2:0]
Datab)
RD
0
1
0
1
0
0
00
0
0
0
0
00000000
D
1
0
0
0
0
0
00
0
0
0
0
-
2,3
D,D
1
1
1
1
0
0
00
0
0
0
0
-
4
RD
0
1
0
1
0
0
00
0
0
F
0
00110011
D
1
0
0
0
0
0
00
0
0
F
0
-
D,D
1
1
1
1
0
0
00
0
0
F
0
-
5
toggling
RAS
0
CS
0
Command
Cycle
Number
Sub-Loop
CKE
CK, CK
Table 7 - IDD4R and IDDQ4R Measurement-Loop Patterna)
6,7
1
8-15
repeat Sub-Loop 0, but BA[2:0] = 1
2
16-23
repeat Sub-Loop 0, but BA[2:0] = 2
3
24-31
repeat Sub-Loop 0, but BA[2:0] = 3
4
32-39
repeat Sub-Loop 0, but BA[2:0] = 4
5
40-47
repeat Sub-Loop 0, but BA[2:0] = 5
6
48-55
repeat Sub-Loop 0, but BA[2:0] = 6
7
56-63
repeat Sub-Loop 0, but BA[2:0] = 7
a) DM must be driven LOW all the time. DQS, DQS are used according to RD Commands, otherwise MID-LEVEL.
b) Burst Sequence driven on each DQ signal by Read Command. Outside burst operation, DQ signals are MID-LEVEL.
Rev. 1.1/ Jan 2013
21
1
Static High
CAS
WE
ODT
BA[2:0]
A[15:11]
A[10]
A[9:7]
A[6:3]
A[2:0]
Datab)
WR
0
1
0
0
1
0
00
0
0
0
0
00000000
D
1
0
0
0
1
0
00
0
0
0
0
-
2,3
D,D
1
1
1
1
1
0
00
0
0
0
0
-
4
WR
0
1
0
0
1
0
00
0
0
F
0
00110011
D
1
0
0
0
1
0
00
0
0
F
0
-
D,D
1
1
1
1
1
0
00
0
0
F
0
-
5
toggling
RAS
0
CS
0
Command
Cycle
Number
Sub-Loop
CKE
CK, CK
Table 8 - IDD4W Measurement-Loop Patterna)
6,7
1
8-15
repeat Sub-Loop 0, but BA[2:0] = 1
2
16-23
repeat Sub-Loop 0, but BA[2:0] = 2
3
24-31
repeat Sub-Loop 0, but BA[2:0] = 3
4
32-39
repeat Sub-Loop 0, but BA[2:0] = 4
5
40-47
repeat Sub-Loop 0, but BA[2:0] = 5
6
48-55
repeat Sub-Loop 0, but BA[2:0] = 6
7
56-63
repeat Sub-Loop 0, but BA[2:0] = 7
a) DM must be driven LOW all the time. DQS, DQS are used according to WR Commands, otherwise MID-LEVEL.
b) Burst Sequence driven on each DQ signal by Write Command. Outside burst operation, DQ signals are MID-LEVEL.
Command
CS
RAS
CAS
WE
ODT
BA[2:0]
A[15:11]
A[10]
A[9:7]
A[6:3]
A[2:0]
0
0
REF
0
0
0
1
0
0
0
0
0
0
0
-
1
1.2
D, D
1
0
0
0
0
0
00
0
0
0
0
-
D, D
1
1
1
1
0
0
00
0
0
F
0
-
Cycle
Number
Datab)
Sub-Loop
CKE
CK, CK
Table 9 - IDD5B Measurement-Loop Patterna)
Static High
toggling
3,4
2
5...8
repeat cycles 1...4, but BA[2:0] = 1
9...12
repeat cycles 1...4, but BA[2:0] = 2
13...16
repeat cycles 1...4, but BA[2:0] = 3
17...20
repeat cycles 1...4, but BA[2:0] = 4
21...24
repeat cycles 1...4, but BA[2:0] = 5
25...28
repeat cycles 1...4, but BA[2:0] = 6
29...32
repeat cycles 1...4, but BA[2:0] = 7
33...nRFC-1
repeat Sub-Loop 1, until nRFC - 1. Truncate, if necessary.
a) DM must be driven LOW all the time. DQS, DQS are MID-LEVEL.
b) DQ signals are MID-LEVEL.
Rev. 1.1/ Jan 2013
22
Table 10 - IDD7 Measurement-Loop Patterna)
0
1
2
3
4
Static High
5
6
7
8
toggling
9
10
0
1
2
...
nRRD
nRRD+1
nRRD+2
...
2*nRRD
3*nRRD
4*nRRD
nFAW
nFAW+nRRD
nFAW+2*nRRD
nFAW+3*nRRD
nFAW+4*nRRD
2*nFAW+0
2*nFAW+1
2&nFAW+2
11
2*nFAW+nRRD
2*nFAW+nRRD+1
2&nFAW+nRRD+
2
12
13
2*nFAW+2*nRRD
2*nFAW+3*nRRD
14
2*nFAW+4*nRRD
15
16
17
18
3*nFAW
3*nFAW+nRRD
3*nFAW+2*nRRD
3*nFAW+3*nRRD
19
3*nFAW+4*nRRD
A[2:0]
A[6:3]
A[9:7]
A[10]
A[15:11]
BA[2:0]
ODT
WE
CAS
RAS
CS
Command
Cycle
Number
Sub-Loop
CKE
CK, CK
ATTENTION! Sub-Loops 10-19 have inverse A[6:3] Pattern and Data Pattern than Sub-Loops 0-9
ACT
0
0
1
1
0
0
00
0
0
0
0
RDA
0
1
0
1
0
0
00
1
0
0
0
D
1
0
0
0
0
0
00
0
0
0
0
repeat above D Command until nRRD - 1
ACT
0
0
1
1
0
1
00
0
0
F
0
RDA
0
1
0
1
0
1
00
1
0
F
0
D
1
0
0
0
0
1
00
0
0
F
0
repeat above D Command until 2* nRRD - 1
repeat Sub-Loop 0, but BA[2:0] = 2
repeat Sub-Loop 1, but BA[2:0] = 3
D
1
0
0
0
0
3
00
0
0
F
0
Assert and repeat above D Command until nFAW - 1, if necessary
repeat Sub-Loop 0, but BA[2:0] = 4
repeat Sub-Loop 1, but BA[2:0] = 5
repeat Sub-Loop 0, but BA[2:0] = 6
repeat Sub-Loop 1, but BA[2:0] = 7
D
1
0
0
0
0
7
00
0
0
F
0
Assert and repeat above D Command until 2* nFAW - 1, if necessary
ACT
0
0
1
1
0
0
00
0
0
F
0
RDA
0
1
0
1
0
0
00
1
0
F
0
D
1
0
0
0
0
0
00
0
0
F
0
Repeat above D Command until 2* nFAW + nRRD - 1
ACT
0
0
1
1
0
1
00
0
0
0
0
RDA
0
1
0
1
0
1
00
1
0
0
0
D
1
0
0
0
0
1
00
0
0
0
0
Repeat above D Command until 2* nFAW + 2* nRRD - 1
repeat Sub-Loop 10, but BA[2:0] = 2
repeat Sub-Loop 11, but BA[2:0] = 3
D
1
0
0
0
0
3
00
0
0
0
0
Assert and repeat above D Command until 3* nFAW - 1, if necessary
repeat Sub-Loop 10, but BA[2:0] = 4
repeat Sub-Loop 11, but BA[2:0] = 5
repeat Sub-Loop 10, but BA[2:0] = 6
repeat Sub-Loop 11, but BA[2:0] = 7
D
1
0
0
0
0
7
00
0
0
0
0
Assert and repeat above D Command until 4* nFAW - 1, if necessary
Datab)
00000000
00110011
-
-
00110011
00000000
-
-
-
a) DM must be driven LOW all the time. DQS, DQS are used according to RD Commands, otherwise MID-LEVEL.
b) Burst Sequence driven on each DQ signal by Read Command. Outside burst operation, DQ signals are MID-LEVEL.
Rev. 1.1/ Jan 2013
23
IDD Specifications
IDD values are for full operating range of voltage and temperature unless otherwise noted.
IDD Specification
Speed Grade
Bin
DDR3 - 1066
7-7-7
DDR3 - 1333
9-9-9
DDR3 - 1600
11-11-11
DDR3 - 1866
13-13-13
DDR3 - 2133
14-14-14
Symbol
Max.
Max.
Max.
Max.
Max.
35
37
38
39
41
mA
x8
48
49
50
51
55
mA
x16
43
44
46
48
49
mA
x8
60
61
61
63
70
mA
x16
11
11
11
11
11
mA
x8
17
17
17
17
17
mA
x16
12
13
13
14
14
mA
x8
18
18
19
20
21
mA
x16
20
20
21
22
23
mA
x8
26
27
29
29
32
mA
x16
22
24
26
27
29
mA
x8
30
31
34
36
40
mA
x16
20
21
22
22
22
mA
x8
27
27
29
30
33
mA
x16
20
20
21
21
21
mA
x8
23
23
24
25
27
mA
x16
28
29
31
32
33
mA
x8
32
33
35
37
40
mA
x16
IDD0
IDD01
IDD2P0
IDD2P1
IDD2N
IDD2NT
IDD2Q
IDD3P
IDD3N
IDD4R
IDD4w
IDD5B
IDD6
IDD6
(Low Power)
IDD6ET
IDD7
Unit
Notes
70
85
95
110
125
mA
x8
105
125
145
165
185
mA
x16
75
90
100
115
125
mA
x8
115
135
155
175
200
mA
x16
200
200
200
200
200
mA
x8/x16
15
15
15
15
15
mA
x8
x16
19
19
19
19
19
mA
12
12
12
12
12
mA
x8
14
14
14
14
14
mA
x16
19
19
19
19
19
mA
x8
23
23
23
23
23
mA
x16
120
145
150
160
175
mA
x8
185
215
220
225
250
mA
x16
Notes:
1. Applicable for MR2 settings A6=0 and A7=0. Temperature range for IDD6 is 0 - 85oC.
2. Applicable for MR2 settings A6=0 and A7=1. Temperature range for IDD6ET is 0 - 95oC.
Rev. 1.1/ Jan 2013
24
Input/Output Capacitance
Parameter
Symbo DDR3-1066 DDR3-1333 DDR3-1600 DDR3-1866 DDR3-2133 Units Notes
l
Min Max Min Max Min Max Min Max Min Max
Input/output capacitance
CIO
1.5
(DQ, DM, DQS, DQS,
TDQS, TDQS)
Input capacitance, CK
CCK
0.8
and CK
Input capacitance delta
CDCK
0
CK and CK
Input capacitance delta,
CDDQS
0
DQS and DQS
Input capacitance
CI
0.75
(All other input-only pins)
Input capacitance delta
CDI_CTR
-0.5
(All CTRL input-only pins)
L
Input capacitance delta
CDI_ADD
(All ADD/CMD input-only
-0.5
_CMD
pins)
Input/output capacitance
CDIO
-0.5
delta
(DQ, DM, DQS, DQS)
Input/output capacitance
CZQ
of ZQ pin
Notes:
2.7
1.5
2.5
1.5
2.3
1.4
1.4
1.4
2.1
pF
1,2,3
1.6
0.8
1.4
0.8
1.4
0.8
0.8
0.8
1.3
pF
2,3
0.15
0
0.15
0
0.15
0
0
0
0.15
pF
2,3,4
0.20
0
0.15
0
0.15
0
0
0
0.15
pF
2,3,5
1.35
0.75
1.3
0.75
1.3
0.75
0.75
0.75
1.2
pF
2,3,6
0.3
-0.4
0.2
-0.4
0.2
-0.4
0.2
-0.4
0.2
pF
2,3,7,8
0.5
-0.4
0.4
-0.4
0.4
-0.4
0.4
-0.4
0.4
pF
2,3,9,10
0.3
-0.5
0.3
-0.5
0.3
-0.5
0.3
-0.5
0.3
pF
2,3,11
3
-
3
-
3
-
3
-
3
pF
2,3,12
1. Although the DM, TDQS and TDQS pins have different functions, the loading matches DQ and DQS.
2. This parameter is not subject to production test. It is verified by design and characterization. The capacitance is
measured according to JEP147(“PROCEDURE FOR MEASURING INPUT CAPACITANCE USING A VECTOR NETWORK
ANALYZER(VNA)”) with VDD, VDDQ, VSS,VSSQ applied and all other pins floating (except the pin under test, CKE,
RESET and ODT as necessary). VDD=VDDQ=1.5V, VBIAS=VDD/2 and on-die termination off.
3. This parameter applies to monolithic devices only; stacked/dual-die devices are not covered here
4. Absolute value of CCK-CCK.
5. Absolute value of CIO(DQS)-CIO(DQS).
6. CI applies to ODT, CS, CKE, A0-A15, BA0-BA2, RAS, CAS, WE.
7. CDI_CTR applies to ODT, CS and CKE.
8. CDI_CTRL=CI(CNTL) - 0.5 * CI(CLK) + CI(CLK))
9. CDI_ADD_CMD applies to A0-A15, BA0-BA2, RAS, CAS and WE.
10. CDI_ADD_CMD=CI(ADD_CMD) - 0.5*(CI(CLK)+CI(CLK))
11. CDIO=CIO(DQ) - 0.5*(CIO(DQS)+CIO(DQS))
12. Maximum external load capacitance an ZQ pin: 5 pF.
Rev. 1.1/ Jan 2013
25
Standard Speed Bins
DDR3 SDRAM Standard Speed Bins include tCK, tRCD, tRP, tRAS and tRC for each corresponding bin.
DDR3-1066 Speed Bins
For specific Notes see “Speed Bin Table Notes” on page 31.
Speed Bin
DDR3-1066
CL - nRCD - nRP
Parameter
Symbol
Unit
7-7-7
Note
min
max
tAA
13.125
20
ns
ACT to internal read or
write delay time
tRCD
13.125
—
ns
PRE command period
tRP
13.125
—
ns
ACT to ACT or REF
command period
tRC
50.625
—
ns
ACT to PRE command
period
tRAS
37.5
9 * tREFI
ns
CWL = 5
tCK(AVG)
3.0
3.3
ns
CWL = 6
tCK(AVG)
CWL = 5
tCK(AVG)
ns
1, 2, 3, 6
CWL = 6
tCK(AVG)
Reserved
ns
1, 2, 3, 4
CWL = 5
tCK(AVG)
Reserved
ns
4
CWL = 6
tCK(AVG)
ns
1, 2, 3, 4
CWL = 5
tCK(AVG)
ns
4
CWL = 6
tCK(AVG)
ns
1, 2, 3
13
Internal read command to
first data
CL = 5
CL = 6
CL = 7
CL = 8
Reserved
2.5
ns
3.3
1.875
< 2.5
Reserved
1.875
< 2.5
Supported CL Settings
5, 6, 7, 8
nCK
Supported CWL Settings
5, 6
nCK
Rev. 1.1/ Jan 2013
1, 2, 3, 4, 6,
12,13
4
26
DDR3-1333 Speed Bins
For specific Notes see “Speed Bin Table Notes” on page 31.
Speed Bin
DDR3-1333
CL - nRCD - nRP
Parameter
Symbol
Unit
9-9-9
min
max
Internal read
command to first data
tAA
13.5
(13.125)5,11
20
ns
ACT to internal read or
write delay time
tRCD
13.5
(13.125)5,11
—
ns
PRE command period
tRP
13.5
(13.125)5,11
—
ns
ACT to ACT or REF
command period
tRC
49.5
(49.125)5,11
—
ns
ACT to PRE command
period
tRAS
36
9 * tREFI
ns
CWL = 5
tCK(AVG)
3.0
3.3
ns
CWL = 6, 7
tCK(AVG)
CWL = 5
tCK(AVG)
CWL = 6
tCK(AVG)
CWL = 7
Note
ns
1, 2, 3, 4,
7, 12,13
4
ns
1, 2, 3, 7
Reserved
ns
1, 2, 3, 4, 7
tCK(AVG)
Reserved
ns
4
CWL = 5
tCK(AVG)
Reserved
ns
4
CWL = 6
tCK(AVG)
ns
1, 2, 3, 4, 7
CWL = 7
tCK(AVG)
Reserved
ns
1, 2, 3, 4
CWL = 5
tCK(AVG)
Reserved
ns
4
CWL = 6
tCK(AVG)
ns
1, 2, 3, 7
CWL = 7
tCK(AVG)
Reserved
ns
1, 2, 3, 4
CWL = 5, 6
tCK(AVG)
Reserved
ns
4
CWL = 7
tCK(AVG)
ns
1, 2, 3, 4
CWL = 5, 6
tCK(AVG)
ns
4
CWL = 7
tCK(AVG)
(Optional)
ns
ns
1, 2, 3
5
Supported CL Settings
5, 6, 8, (7), 9, (10)
nCK
Supported CWL Settings
5, 6, 7
nCK
CL = 5
CL = 6
CL = 7
CL = 8
CL = 9
CL = 10
Rev. 1.1/ Jan 2013
Reserved
2.5
3.3
1.875
< 2.5
(Optional)5
1.875
< 2.5
1.5
<1.875
Reserved
1.5
<1.875
27
DDR3-1600 Speed Bins
For specific Notes see “Speed Bin Table Notes” on page 31.
Speed Bin
DDR3-1600
CL - nRCD - nRP
Parameter
Symbol
Unit
11-11-11
min
max
20
ns
Internal read
command to first data
tAA
13.75
(13.125)5,11
ACT to internal read or
write delay time
tRCD
13.75
(13.125)5,11
—
ns
PRE command period
tRP
13.75
(13.125)5,11
—
ns
ACT to ACT or REF
command period
tRC
48.75
(48.125)5,11
—
ns
ACT to PRE command
period
tRAS
35
9 * tREFI
ns
CWL = 5
tCK(AVG)
3.0
3.3
ns
CWL = 6, 7
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
CL = 5
CWL = 5
CL = 6
CWL = 6
CWL = 7
CWL = 5
CL = 7
CWL = 6
tCK(AVG)
CWL = 7
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
CWL = 8
CWL = 5
CL = 8
CWL = 6
CWL = 7
CWL = 8
CWL = 5, 6
CL = 9
CWL = 7
tCK(AVG)
tCK(AVG)
CWL = 5, 6 tCK(AVG)
tCK(AVG)
CL = 10 CWL = 7
tCK(AVG)
CWL = 8
CWL = 5, 6,7 tCK(AVG)
CL = 11
tCK(AVG)
CWL = 8
ns
1, 2, 3, 4,
8, 12,13
4
ns
1, 2, 3, 8
Reserved
ns
1, 2, 3, 4, 8
Reserved
ns
4
ns
4
ns
1, 2, 3, 4, 8
ns
1, 2, 3, 4, 8
ns
4
Reserved
2.5
3.3
Reserved
1.875
< 2.5
(Optional)5
Reserved
Reserved
Reserved
ns
4
ns
1, 2, 3, 8
Reserved
ns
1, 2, 3, 4, 8
Reserved
ns
1, 2, 3, 4
ns
4
ns
1, 2, 3, 4, 8
ns
1, 2, 3, 4
1.875
< 2.5
Reserved
1.5
<1.875
(Optional)5
Reserved
CWL = 8
Reserved
1.5
<1.875
Reserved
Reserved
1.25
<1.5
Supported CL Settings
5, 6, (7), 8, (9), 10, 11
Supported CWL Settings
5, 6, 7, 8
Rev. 1.1/ Jan 2013
Note
ns
4
ns
1, 2, 3, 8
ns
1, 2, 3, 4
ns
4
ns
1, 2, 3
nCK
nCK
28
DDR3-1866 Speed Bins
For specific Notes see “Speed Bin Table Notes” on page 31.
Speed Bin
DDR3-1866
CL - nRCD - nRP
Parameter
Symbol
Internal read command
tAA
to first data
13-13-13
ACT to internal read or
write delay time
tRCD
PRE command period
tRP
min
13.91
(13.125)5,14
13.91
(13.125)5,14
13.91
(13.125)5,14
ACT to PRE command
period
tRAS
34
ACT to ACT or PRE
command period
tRC
CL = 5
CL = 6
CL = 7
CL = 8
CL = 9
CL = 10
CL = 11
CL = 12
tCK(AVG)
CWL = 6,7,8,9 tCK(AVG)
tCK(AVG)
CWL = 5
tCK(AVG)
CWL = 6
CWL = 7,8,9 tCK(AVG)
tCK(AVG)
CWL = 5
tCK(AVG)
CWL = 6
CWL = 7,8,9 tCK(AVG)
tCK(AVG)
CWL = 5
tCK(AVG)
CWL = 6
tCK(AVG)
CWL = 7
tCK(AVG)
CWL = 8,9
tCK(AVG)
CWL = 5, 6
tCK(AVG)
CWL = 7
tCK(AVG)
CWL = 8
tCK(AVG)
CWL = 9
tCK(AVG)
CWL = 5, 6
tCK(AVG)
CWL = 7
tCK(AVG)
CWL = 8
CWL = 5,6,7 tCK(AVG)
tCK(AVG)
CWL = 8
tCK(AVG)
CWL = 9
CWL = 5,6,7,8 tCK(AVG)
tCK(AVG)
CWL = 9
CWL = 5,6,7,8 tCK(AVG)
tCK(AVG)
CWL = 9
CWL = 5
Unit
max
20
ns
—
ns
—
ns
9 * tREFI
ns
-
ns
3.3
ns
47.91
(47.125)5,14
3.0
Reserved
Note
1, 2, 3, 4, 9
ns
4
ns
1, 2, 3, 9
Reserved
ns
1, 2, 3, 4, 9
Reserved
ns
4
2.5
3.3
Reserved
ns
4
ns
1, 2, 3, 4, 9
Reserved
ns
4
Reserved
ns
4
ns
1, 2, 3, 9
Reserved
ns
1, 2, 3, 4, 9
Reserved
ns
4
1.875
< 2.5
1.875
< 2.5
Reserved
ns
4
ns
1, 2, 3, 4, 9
Reserved
ns
1, 2, 3, 4, 9
Reserved
ns
4
1.5
<1.875
Reserved
ns
4
ns
1, 2, 3, 9
Reserved
ns
1, 2, 3, 4, 9
Reserved
ns
4
ns
1, 2, 3, 4, 9
ns
1, 2, 3, 4
1.5
<1.875
1.25
<1.5
Reserved
Reserved
ns
4
Reserved
ns
1,2,3,4
ns
4
<1.25
ns
1, 2, 3
Supported CL Settings
6, 8, 10, 13, (7), (9), (11)
Supported CWL Settings
5, 6, 7, 8, 9
nCK
nCK
CL = 13
Rev. 1.1/ Jan 2013
Reserved
1.07
29
DDR3-2133 Speed Bins
For specific notes see “Speed Bin Table Notes” on page 31.
Speed Bin
CL - nRCD - nRP
Parameter
Symbol
Internal read command to
tAA
first data
ACT to internal read or write
tRCD
delay time
tRP
PRE command period
ACT to PRE command period tRAS
ACT to ACT or PRE
tRC
command period
tCK(AVG)
CWL = 5
CL = 5
CWL = 6,7,8,9,10 tCK(AVG)
tCK(AVG)
CWL = 5
tCK(AVG)
CL = 6
CWL = 6
tCK(AVG)
CWL = 7,8,910
tCK(AVG)
CWL = 5
tCK(AVG)
CWL = 6
CL = 7
tCK(AVG)
CWL = 7
tCK(AVG)
CWL = 8,9,10
tCK(AVG)
CWL = 5
tCK(AVG)
CWL = 6
CL = 8
tCK(AVG)
CWL = 7
tCK(AVG)
CWL = 8,9,10
tCK(AVG)
CWL = 5, 6
tCK(AVG)
CWL = 7
CL = 9
tCK(AVG)
CWL = 8
tCK(AVG)
CWL = 9,10
tCK(AVG)
CWL = 5, 6
tCK(AVG)
CWL = 7
tCK(AVG)
CWL = 8
CL = 10
tCK(AVG)
CWL = 9
tCK(AVG)
CWL = 10
tCK(AVG)
CWL = 5,6,7
tCK(AVG)
CWL = 8
CL = 11
tCK(AVG)
CWL = 9
tCK(AVG)
CWL = 10
tCK(AVG)
CWL = 5,6,7,8
CL = 12
tCK(AVG)
CWL = 9
tCK(AVG)
CWL = 10
tCK(AVG)
CWL = 5,6,7,8
tCK(AVG)
CWL = 9
CL = 13
tCK(AVG)
CWL = 10
CWL = 5,6,7,8,9 tCK(AVG)
CL = 14
tCK(AVG)
CWL = 10
Supported CL Settings
Supported CWL Settings
Rev. 1.1/ Jan 2013
DDR3-2133
Unit
14-14-14
min
max
13.09
20.0
ns
13.09
—
ns
13.09
33.0
—
9 * tREFI
ns
ns
46.09
-
ns
2.5
1.875
1.875
1.5
1.5
1.25
1.07
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
3.3
< 2.5
< 2.5
<1.875
<1.875
<1.5
<1.25
0.935
<1.07
5, 6, 7, 8, 9, 10, 11, 12, 13, 14
5, 6, 7, 8, 9, 10
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
nCK
nCK
Note
1, 2, 3, 4, 10
4
1, 2, 3, 10
1, 2, 3, 4, 10
4
4
1, 2, 3, 10
1, 2, 3, 4, 10
4
4
1, 2, 3, 10
1, 2, 3, 4, 10
4
4
1, 2, 3, 10
1, 2, 3, 4, 10
4
4
1, 2, 3, 10
1, 2, 3, 4, 10
1, 2, 3, 4, 10
4
4
1, 2, 3, 10
1, 2, 3, 4, 10
1, 2, 3, 4
4
1, 2, 3, 4, 10
1, 2, 3, 4
4
1, 2, 3, 10
1, 2, 3, 4
4
1, 2, 3
30
Speed Bin Table Notes
Absolute Specification (TOPER; VDDQ = VDD = 1.5V +/- 0.075 V);
1. The CL setting and CWL setting result in tCK(AVG).MIN and tCK(AVG).MAX requirements. When making
a selection of tCK(AVG), both need to be fulfilled: Requirements from CL setting as well as requirements
from CWL setting.
2. tCK(AVG).MIN limits: Since CAS Latency is not purely analog - data and strobe output are synchronized
by the DLL - all possible intermediate frequencies may not be guaranteed. An application should use
the next smaller JEDEC standard tCK(AVG) value (3.0, 2.5, 1.875, 1.5, or 1.25 ns) when calculating CL
[nCK] = tAA [ns] / tCK(AVG) [ns], rounding up to the next ‘Supported CL’, where tCK(AVG) = 3.0 ns
should only be used for CL = 5 calculation.
3. tCK(AVG).MAX limits: Calculate tCK(AVG) = tAA.MAX / CL SELECTED and round the resulting tCK(AVG)
down to the next valid speed bin (i.e. 3.3ns or 2.5ns or 1.875 ns or 1.25 ns). This result is
tCK(AVG).MAX corresponding to CL SELECTED.
4. ‘Reserved’ settings are not allowed. User must program a different value.
5. ‘Optional’ settings allow certain devices in the industry to support this setting, however, it is not a mandatory feature. Refer to SK Hynix DIMM data sheet and/or the DIMM SPD information if and how this
setting is supported.
6. Any DDR3-1066 speed bin also supports functional operation at lower frequencies as shown in the table
which are not subject to Production Tests but verified by Design/Characterization.
7. Any DDR3-1333 speed bin also supports functional operation at lower frequencies as shown in the table
which are not subject to Production Tests but verified by Design/Characterization.
8. Any DDR3-1600 speed bin also supports functional operation at lower frequencies as shown in the table
which are not subject to Production Tests but verified by Design/Characterization.
9. Any DDR3-1866 speed bin also supports functional operation at lower frequencies as shown in the table
which are not subject to Production Tests but verified by Design/Characterization.
10. Any DDR3-2133 speed bin also supports functional operation at lower frequencies as shown in the table
which are not subject to Production Tests but verified by Design/Characterization.
11. SK Hynix DDR3 SDRAM devices supporting optional down binning to CL=7 and CL=9, and tAA/tRCD/
tRP must be 13.125 ns or lower. SPD settings must be programmed to match. For example, DDR31333H devices supporting down binning to DDR3-1066F should program 13.125 ns in SPD bytes for
tAAmin (Byte 16), tRCDmin (Byte 18), and tRPmin (Byte 20). DDR3-1600K devices supporting down
binning to DDR3-1333H or DDR3-1600F should program 13.125 ns in SPD bytes for tAAmin (Byte 16),
tRCDmin (Byte 18), and tRPmin (Byte 20). Once tRP (Byte 20) is programmed to 13.125ns, tRCmin
(Byte 21,23) also should be programmed accordingly. For example, 49.125ns (tRASmin + tRPmin = 36
ns + 13.125 ns) for DDR3-1333H and 48.125ns (tRASmin + tRPmin = 35 ns + 13.125 ns) for DDR31600K.
12. DDR3 800 AC timing apply if DRAM operates at lower than 800 MT/s data rate.
13. For CL5 support, refer to DIMM SPD information. DRAM is required to support CL5. CL5 is not mandatory in SPD coding.
14. SK Hynix DDR3 SDRAM devices supporting optional down binning to CL=11, CL=9 and CL=7, tAA/
tRCD/tRPmin must be 13.125ns. SPD setting must be programed to match. For example, DDR3-1866M
devices supporting down binning to DDR3-1600K or DDR3-1333H or 1066F should program 13.125ns
in SPD bytes for tAAmin(byte 16), tRCDmin(byte 18) and tRPmin(byte 20) is programmed to 13.125ns,
tRCmin(byte 21,23) also should be programmed accordingly. For example, 47.125ns (tRASmin + tRPmin
= 34ns +13.125ns)
Rev. 1.1/ Jan 2013
31
Package Dimensions
Package Dimension(x8): 78Ball Fine Pitch Ball Grid Array Outline
9.000  0.100
A1 CORNER
INDEX AREA
1.100  0.100
(2.350)
11.100  0.100
(2.775)
0.340  0.050
3.0 X 5.0 MIN
FLAT AREA
TOP VIEW
SIDE VIEW
0.800 X 8 = 6.400
0.800
1.300  0.100
A1 BALL MARK
9
8
7
3
2
1
A
B
C
0.800
E
F
G
H
J
0.800 X 12 = 9.600
D
K
L
N
78 x 0.450  0.050
1.600
1.600
0.750  0.100
M
BOTTOM VIEW
Rev. 1.1/ Jan 2013
32
Package Dimension(x16): 96Ball Fine Pitch Ball Grid Array Outline
A1 CORNER
INDEX AREA
1.100  0.100
(2.250)
9.000  0.100
13.000  0.100
(3.250)
0.340  0.050
3.0 X 5.0 MIN
FLAT AREA
TOP VIEW
SIDE VIEW
0.800 X 8 = 6.400
0.800
9
8
7
3
1.300  0.100
2
1
A1 BALL MARK
A
B
C
0.800
E
F
G
H
J
0.800 X 15 = 12.000
D
K
L
M
N
P
T
96 x 0.450  0.050
Rev. 1.1/ Jan 2013
1.600
1.600
BOTTOM VIEW
0.500  0.100
R
33
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