W32/W33 Datasheet

W32/W33 Datasheet
W32/W33 Datasheet
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W32/W33 Datasheet
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property of their respective owners and are at this moment acknowledged.
Attention
Due to product upgrades or other reasons, the content of this manual is subject to changes.
Shenzhen MOLMC Technology co., Ltd. keeps rights without any notices or warnings at the
substance of this manual is subject to change reservations. This manual can only be taken as a
guide. Shenzhen MOLMC Technology co., Ltd. makes every effort to provide accurate
information in this manual, but it does not guarantees that there is no error. This manual
contains all statements, information, and recommendations do not constitute any guarantee,
express or implied.
Rev 1.2
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W32/W33 Datasheet
Category
1
Overview ..................................................................................................................................... 5
1.1 Product Description ............................................................................................................. 5
2
Pin Description ............................................................................................................................ 8
2.1 Pin Definition ....................................................................................................................... 8
2.2 Stapping Pins ....................................................................................................................... 9
2.3 External Device Interfaces ................................................................................................. 10
3
Function Description ................................................................................................................. 15
3.1 CPU and RAM .................................................................................................................... 15
3.2 External Flash and SRAM ................................................................................................... 15
3.3 Crystal Oscillator................................................................................................................ 15
4
Electrical Characteristics ........................................................................................................... 16
4.1 Maximum Rating Values.................................................................................................... 16
4.2 Recommended Working Conditions ................................................................................. 16
4.3 Digital Port Characteristics ................................................................................................ 16
4.4 Wi-Fi RF Characteristics ..................................................................................................... 17
4.5 Low-Energy-Consumption Bluetooth FR ........................................................................... 17
4.5.1 Receiver .................................................................................................................... 17
4.5.2 Transmitter ............................................................................................................... 18
4.6 Power Consumption .......................................................................................................... 19
5 Mechanical Characteristics .......................................................................................................... 20
5.1 Recommended Temperature of SMT ................................................................................ 20
5.2 Module Weight.................................................................................................................. 21
5.3 Module Size ....................................................................................................................... 21
6 Hardware Schematics .................................................................................................................. 23
6.1 Hardware Schematics ........................................................................................................ 23
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W32/W33 Datasheet
Chart Category
Chart 1: Specification Table ........................................................................................................... 7
Chart 2: Pin Block Diagram (Front View) ....................................................................................... 8
Chart 3: Pin Definition and Description ........................................................................................ 8
Chart 4: Strapping Pins .................................................................................................................. 9
Chart 5: External Device Interfaces ............................................................................................. 10
Chart 6: Maximum Rating Values ................................................................................................ 16
Chart 7: Recommended Working Conditions .............................................................................. 16
Chart 8: Digital Port Characteristics ............................................................................................ 16
Chart 9: Wi-Fi RF Characteristics ................................................................................................. 17
Chart 10:BLE Receiver Characteristics .......................................................................................... 17
Chart 11:BLE Transmitter Characteristics ..................................................................................... 18
Chart 12:Operating Power Consumption ..................................................................................... 18
Chart 13:Power Consumption Under Different power-Save Modes ............................................ 20
Chart 14:Recommended Temperature of SMT ............................................................................ 20
Chart 15:Module Weight .............................................................................................................. 21
Chart 16:Fig.1-Module Size (Top View, Unit: mm) ....................................................................... 21
Chart 17:Fig.2-Module Size (Top View, Unit: mm) ....................................................................... 21
Chart 18:Fig.3-Recommended PCB Layout (Top View, Unit: mm) ................................................ 21
Chart 19:Fig.4-Module Layout Scheme 1(antenna is out of the frame, Unit: mm) ..................... 22
Chart 20:Fig.5-Module Layout Scheme 2(antenna is placed at the board side and the
corresponding place is excluded, Unit: mm) ................................................................. 22
Chart 21:Fig.6-Module Layout Scheme 3 (antenna is placed at the board side and the
corresponding below layers are not covered by copper, Unit: mm) ............................. 22
Chart 22:Hardware Schematics .................................................................................................... 23
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W32/W33 Datasheet
1
Overview
1.1 Product Description
IntoRobot-W32/ IntoRobot-W33 (W32/W33, for short) is the new Wi-Fi Bluetooth dual module
which integrates conventional Bluetooth, low-power-consumption Bluetooth and Wi-Fi. So it can
be applied to broad situations, especially to those sensor networks which require low energy
consumption such as speech encoding, audio stream, and MP3 decoding. W32/w33 has the
following characteristics: a. W32/W33 serials provide several antenna forms. For instance, W32
provides onboard PCB antenna; W33 provides onboard ceramic antenna and IPEX socket. b.
W32/W33 can meet the standards of Wi-Fi 802.11b/g/n/e/I and Bluetooth 4.2 completely. c. The
operating system of W32/W33 is freeRTOS with LWIP. d. The chips support OTA upgrade with
encryption, so developers can update the products even if they are released. e. W32/W33 is
compatible with Arduino programming and integrates IntoRobot cloud platform, which means
the programming work can be decreased dramatically so the product development cycle can also
be reduced. f. most creative ideas can be achieved when W32 is combined with IntoRobot and
IntoRobotAPP. In detail, W32 can be accessed to the internet via Imlink to reach different kinds
of internet control. g. The flexible structures of RAM/ROM of W32/W33 allow users to change
the configuration to satisfy some special requirements. h. W32/W33 can be used in both master
mode and slavery mode.
ESP32 chip, the core of W32/W33, is a type of SoC which combines both Wi-Fi and Bluetooth, has
the advantages of extensibility and self-adaption. In details, ESP32 chip has two 32-bite CPUs
which can be controlled independently; adopts a seven-class pipeline architecture; main
frequency ranges from 80MHZ to 240MHZ. To save energy, users can cut off the CPU power and
use low-power-consumption processor to monitor external devices’ state changes or detect
whether some analog quantities exceed their thresholds continuously; EPS32 has a complete
structure to launch/receive radio frequency, which includes RF balun, power amplifier, low noise
amplifier, filter, power management module and advanced auto calibration circuit.; Besides,
ESP32 also has abundant external devices such as capacitive touch sensor, hall sensor, an
interface for SD card, an interface for Ethernet network, high-speed SDIO/SPI, UART, I2S, and I2C.
W32/W33 Wi-Fi supports both long-range communication and internet connection via a router.
In addition, Bluetooth can make users connected to mobile phones or broadcast BLE Beacon so
that signals can be detected. The rate of data transmission for W32/W33 can be up to 150Mbps
and the output power amplified by power amplifier can be up to 22dBm so that maximum-range
wireless communication can be achieved. All in all, the type of Wi-Fi, Bluetooth module
possesses excellent characteristics when compared with other existing ones and has more
advantages from the perspectives of wireless transmission distance, power consumption,
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W32/W33 Datasheet
internet connectivity and degree of integration. Some fields which this production can be used in
are listed as follows:

Universal low-energy-consumption IoT sensor, recorder;

Video and picture transmission for cameras;

Intelligent home appliances;

Intelligent gardens;

Wi-Fi toys;

Web music players;

Audio stream media devices;

Wi-Fi speech recognition devices;

Mesh internet;

Industrial wireless control;’

Baby monitors;

Wi-Fi based position sensor;

Safe ID tag;

Healthcare;

Motion monitor;

Temperature recorder.

Specification Table
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W32/W33 Datasheet
Chart 1:Specification Table
Category
Parameters
Standard
Protocol
Wi-Fi
Frequency Range
Protocol
Specifications
FCC/CE/TELEC/KCC
802.11 b/g/n/d/e/i/k/r(802.11n,up to 150 Mbps)
Combine A-MPDU and A-MSDU,support 0.4 µs protection
interval
2.4 ~ 2.5 GHz
Satisfy the standards of Bluetooth v4.2 BR/EDR and BLE
Possess NZIF receiver with -98 dBm sensitivity
Bluetooth
Radio Frequency
Class-1, Class-2 and Class-3 launcher
AFH
Audio Frequency
CPU
Interfaces
Hardware
CVSD and SBC audio frequency
Xtensa® 32-bit LX6 dual-core processor, up to 600 DMIPS
448 KByte ROM
520 KByte SRAM
RTC 16 KByte SRAM
Up to four Flash /SRAM,each flash can have 16 Mbytes
storage
SD card、UART、SPI、SDIO、I2C、LED PWM、Motor PWM、
I2S、I2C、IR
GPIO、Capacitive touch sensor、ADC、DACLNA pre-amplifier
Onboard Sensors
Onboard Clock
Hall sensor、Temperature sensor
26 MHz Crystal Oscillator、32 kHz Crystal Oscillator
Operating Voltage 2.2 ~ 3.6V
Operating Current 80 mA on the average
Operating
-40°C ~ +85°C *
Temperate
Environment
Normal temperature
Temperature
Package Size
18 mm x 20 mm x 3 mm
Wi-Fi mode
Security
Mechanism
Encryption Type
Software
Station/softAP/SoftAP+station /P2P
WPA / WPA2 / WPA2-Enterprise/WPS
AES/RSA/ECC/SHA
Firmware Upgrade UART download/OTA
Software
Development
Support cloud servicer-based development/SDK for
firmware development
Network Protocol
IPv4、IPv6、SSL、TCP/UDP /HTTP/FTP/MQTT
User configuration AT+ instruction set、Cloud servicer、Android/iOS APP
Cloud Service
Rev 1.2
IntoRobot cloud platform(www.intorobot.com/)
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W32/W33 Datasheet
2
Pin Description
2.1 Pin Definition
Chart 2:Pin Block Diagram (Front View)
Chart 3:Pin Definition and Description
Pins
Names
1
GND
2
EN
Enable signal
3
SVP
SENSOR_VP, GPIO36, ADC1_CH0, RTC_GPIO0
4
SVN
SENSOR_VN, GPIO39, ADC1_CH3, RTC_GPIO3
5
GPIO34
GPIO34, ADC1_CH6, RTC_GPIO4
6
GPIO35
GPIO35, ADC2_CH7, RTC_GPIO5
7
GPIO32
GPIO32, 32K_XP, (Crystal Oscillator Input; 32.768 kHz),ADC1_CH4, TOUCH9,
RTC_GPIO9
8
GPIO33
GPIO33, 32K_XN,(Crystal Oscillator Input;32.768 kHz),ADC1_CH5, TOUCH8,
RTC_GPIO8
9
GPIO25
GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6
10
GPIO26
GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7
11
GPIO27
GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17
12
GPIO14
GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS,HSPICLK
13
GPIO12
GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI,HSPIQ
14
GPIO13
GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK,HSPID, U0CTS
15
GPIO15
GPIO15, ADC2_CH3, TOUCH3, RTC_GPIO13, MTDO,HSPICS0, U0RTS
16
GND
17
GPIO2
GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP
18
GPIO0
GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11,CLK_OUT1
19
GPIO4
GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD
Rev 1.2
Descriptions
Ground
Ground
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W32/W33 Datasheet
20
GPIO16
21
3V3
22
GPIO17
GPIO17, HS1_DATA5
23
GPIO5
GPIO5, VSPICS0, HS1_DATA6
24
GPIO18
GPIO18, VSPICLK, HS1_DATA7
25
GPIO23
GPIO23
26
GPIO19
GPIO19, VSPIQ, HS2_DATA2
27
GPIO22
GPIO22, VSPIWP, HS2_CLK
28
RXD
U0RXD, GPIO3, CLK_OUT2, HS2_DATA0
29
TXD
U0TXD, GPIO1, CLK_OUT3, HS2_DATA1
30
GPIO21
31
GND
GPIO16, HS1_DATA4
3.3V Power Supply
GPIO21, VSPIHD, HS2_CMD
Ground
2.2 Stapping Pins
There are six strapping pins in total, and the values of them can be read out from the register
GPIO_STRAPPING. During the start and reset stage, the strapping pins’ electric levels are sampled
and stored in a latch and the values will be kept until the chip is powered off.
Each Strapping pin is pulled up/ down internally, so the internal weak pull-up/down will
determine the Strapping pins’ values if they are not connected or the external circuit which they
are connected to are in high-impedance states.
To change the values of Strapping pins, users can apply external pulled-up/down resistors or
utilize MCU’ GPIO to control the Strapping pins’ values when ESP chip is started or reset.
Chart 4:Strapping Pins
Internal LDO (VDD_SDIO) Voltage
Pins
Default
3.3V
1.8V
MTDI
Pull down
0
1
System Start-up Mode
Pins
Default
SPI Flash Start-Up Mode
Download Satrt-Up Mode
GPIO0
Pull-Up
1
0
GPIO2
Pull-Down
Irrelevant Terms
0
U0TXD Prints Log Information During System Start-Up Stage
Pins
Default
U0TXD Overturn
U0TXD Remains Static
MTDO
Pull-Up
1
0
SDIO Input/Output Time Series of Slavary Machine Signal
Falling-Edge
Pins
Default
Rising-Edge
Falling-Edge Input
Input
Rising-Edge Intput
Intput
Falling-Edge Output
Rising-Edge
Falling-Edge Output
Rising-Edge
Output
Output
MTDO
Pull-Up
0
0
1
1
GPIO5
Pull-Up
0
1
0
1
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W32/W33 Datasheet
Remark: Firmware can change the internal LDO (VDD_SDIO) voltage and SDIO
Input/Output Time Series of Slavary Machine Signal by setting some registers.
2.3 External Device Interfaces
Chart 5:External Device Interfaces
Interface
ADC
Ultralow Noise
Pre-Amplifier
DAC
Touch Sensor
SDSDIO /
MMC Master
Machine
Controller
Rev 1.2
Signal
ADC1_CH0
ADC1_CH3
ADC1_CH4
ADC1_CH5
ADC1_CH6
ADC1_CH7
ADC2_CH0
ADC2_CH1
ADC2_CH2
ADC2_CH3
ADC2_CH4
ADC2_CH5
ADC2_CH6
ADC2_CH7
ADC2_CH8
ADC2_CH9
SENSOR_VP
SENSOR_VN
DAC_1
DAC_2
TOUCH0
TOUCH1
TOUCH2
TOUCH3
TOUCH4
TOUCH5
TOUCH6
TOUCH7
TOUCH8
TOUCH9
HS2_CLK
HS2_CMD
HS2_DATA0
HS2_DATA1
HS2_DATA2
HS2_DATA3
Pin
Function
SENSOR_VP
SENSOR_VN
IO32
IO33
IO34
IO35
IO4
IO0
Two 12-bit SAR ADCs
IO2
IO15
IO13
IO12
IO14
IO27
IO25
IO26
IO36
Supply about 60 dB gain for ADC by
implementing
larger capacity on PCB
IO39
IO25
Two 8-bit DACs
IO26
IO4
IO0
IO2
IO15
IO13
Capacitive Touch Sensor
IO12
IO14
IO27
IO33
IO32
MTMS
MTDO
IO2
SD card which satisfies V3.01 standard
IO4
MTDI
MTCK
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W32/W33 Datasheet
Interface
Motor PWM
LED PWM
UART
I2C
Rev 1.2
Signal
PWM0_OUT0~2
PWM1_OUT_IN0~2
PWM0_FLT_IN0~2
PWM1_FLT_IN0~2
PWM0_CAP_IN0~2
PWM1_CAP_IN0~2
PWM0_SYNC_IN0~2
PWM1_SYNC_IN0~2
LEDC_HS_SIG_OUT0~7
LEDC_LS_SIG_OUT 0~7
U0RXD_in
U0CTS_in
U0DSR_in
U0TXD_out
U0RTS_out
U0DTR_out
U1RXD_in
U1CTS_in
U1TXD_out
U1RTS_out
U2RXD_in
U2CTS_in
U2TXD_out
U2RTS_out
I2CEXT0_SCL_in
I2CEXT0_SDA_in
I2CEXT1_SCL_in
I2CEXT1_SDA_in
I2CEXT0_SCL_out
I2CEXT0_SDA_out
I2CEXT1_SCL_out
I2CEXT1_SDA_out
Pin
Function
All GPIOs
Three 16-bit timers for PWM
production ,and each timer produce a
pair of PWM signals;Three fault
detection signals ;Three even capture
signals;Three synchronous signals
All GPIOs
16 independent channels use 80
MHz-RTC clock。Bit of Duty of Cycle:
16-bit
All GPIOs
Two UART devices with DMA and
hardware flow control
All GPIOs
Two I2C devices,work in master mode
or in slavery mode
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W32/W33 Datasheet
Interface
Signal
Pin
Function
I2S0I_DATA_in0~15
I2S0O_BCK_in
I2S0O_WS_in
I2S0I_BCK_in
I2S0I_WS_in
I2S0I_H_SYNC
I2S0I_V_SYNC
I2S0I_H_ENABLE
I2S0O_BCK_out
I2S0O_WS_out
I2S0I_BCK_out
I2S0I_WS_out
I2S
I2S0O_DATA_out0~23
I2S1I_DATA_in0~15
all GPIOs
For the input ,output of serial stereo
data and the output of parallel LCD data
I2S1O_BCK_in
I2S1O_WS_in
I2S1I_BCK_in
I2S1I_WS_in
I2S1I_H_SYNC
I2S1I_V_SYNC
I2S1I_H_ENABLE
I2S1O_BCK_out
I2S1O_WS_out
I2S1I_BCK_out
I2S1I_WS_out
I2S1O_DATA_out0~23
IR remote control
Rev 1.2
RMT_SIG_IN0~7
RMT_SIG_OUT0~7
all GPIOs
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Eight IR Receivers/Launchers,support
different waveform standards
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W32/W33 Datasheet
Interface
Parallel QSPI
Signal
Pin
SPIHD
SHD/SD2
SPIWP
SWP/SD3
SPICS0
SCS/CMD
SPICLK
SCK/CLK
SPIQ
SDO/SD0
SPID
SDI/SD1
HSPICLK
IO14
HSPICS0
IO15
HSPIQ
IO12
HSPID
IO13
HSPIHD
IO4
HSPIWP
IO2
VSPICLK
IO18
VSPICS0
IO5
VSPIQ
IO19
VSPID
IO23
VSPIHD
IO21
VSPIWP
IO22
Function
Support Standard SPI、Dual SPI and Quad
SPI,can be connected to external Flash and
SRAM
HSPIQ_in/_out
HSPID_in/_out
Standard SPI includes clocks,chip
HSPICLK_in/_out
Universal SPI
selection,MOSI and MISO.These SPI can
HSPI_CS0_in/_out
be connected to LCD and other external
HSPI_CS1_out
devices.They have the following
HSPI_CS2_out
VSPIQ_in/_out
all GPIOs
characteristics:
(a) Master and slavery modes;
(b) Four SPI transmission forms selection
VSPID_in/_out
depeding on polarity and phase;
VSPICLK_in/_out
(c)Configurable CLK frequency;
VSPI_CS0_in/_out
(d) 64- Byte FIFO and DMA。
VSPI_CS1_out
VSPI_CS2_out
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W32/W33 Datasheet
Interface
JTAG
SDIO Slavery
EMAC
Signal
Pin
MTDI
IO12
MTCK
IO13
MTMS
IO14
MTDO
IO15
SD_CLK
IO6
SD_CMD
IO11
SD_DATA0
IO7
SD_DATA1
IO8
SD_DATA2
IO9
SD_DATA3
IO10
EMAC_TX_CLK
IO0
EMAC_RX_CLK
IO5
EMAC_TX_EN
IO21
EMAC_TXD0
IO19
EMAC_TXD1
IO22
EMAC_TXD2
IO14
EMAC_TXD3
IO12
EMAC_RX_ER
IO13
EMAC_RX_DV
IO27
EMAC_RXD0
IO25
EMAC_RXD1
IO26
EMAC_RXD2
TXD
EMAC_RXD3
IO15
EMAC_CLK_OUT
IO16
EMAC_CLK_OUT_1
IO17
80
EMAC_TX_ER
IO4
EMAC_MDC_out
Any GPIO
EMAC_MDI_in
Any GPIO
EMAC_MDO_out
Any GPIO
EMAC_CRS_out
Any GPIO
EMAC_COL_out
Any GPIO
Function
JTAG for software debug
SDIO interface satisfies V2.0 standards
MAC Ethenet MAC with MII/RMII interface
Remark: Any GPIO can be set for motor PWM, LED PWM, UART, I2C, I2S, universal SPI and IR
remote controller.
Rev 1.2
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W32/W33 Datasheet
3
Function Description
This chapter describes the detailed functions of W32/W33.
3.1 CPU and RAM
There are two internal low-energy-consumption Xtensa® 32-bit LX6 MCU in W32/W33. On-chip
memories mainly includes:

448-KBytes ROM for starting program and calling kernel functions;

520-KBytes SRAM for data and command storage;

8-KBytes SRAM in RTC(slow-speed memory of RTC) can be visited by co-processor under the
deep-sleep mode;

8-KBytes SRAM in RTC(fast-speed memory of RTC) can be used to store data and be visited
by master CPU when RTC is started under the deep-sleep mode;

1-Kbytes EFUSE among which 256 bits are only available for system(MAC address and chip
configuration), the rest 768 bits are reserved for user applications(flash encryption and chip ID)
3.2 External Flash and SRAM
EPS32 can support four 16-Mbytes external QSPI flash and SRAM at most and has AES based
hardware encryption function which can protect developers’ programs and data.

ESP32 can visit external QSPI Flash and SRAM via high-speed buffer. The external Flash
which is up to 18 Mbytes can be mapped to CPU program space and can be visited, executed by
8-bit, 16-bit and 32-bit method.

Flash can only be read, however, SRAM can be read and written.
3.3 Crystal Oscillator
The chip is compatible with 40MHZ, 26MHZ and 24MHZ crystal oscillator. The accuracy of the
crystal Oscillators is between 10PPM and -10PPM; the working temperature is between -40°C
and 85°C.
The type of crystal oscillator should be chosen correctly when a programmer is used. Tuning
capacities C1 and C2 are added to the input port and output port of crystal oscillator respectively.
The values of the two capacities can be set very flexibly and the range can be from 6 pf to 22 pf.
However, the values of capacities have to be matched with the frequency of the crystal oscillator.
The values of C1 and C2 are less than 10pf if the frequency of the crystal oscillator is 26MHZ; the
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W32/W33 Datasheet
values of C1 and C2 are larger than 10pf and less than 22pf if the frequency of the crystal
oscillator is 40MHZ.
The frequency of RTC crystal oscillator is 32KHZ or 32.768KHZ. The frequency drifts maybe more
than ±20 PPM because of the usage of internal calibration circuit. The device should choose
external low-speed 32KHZ crystal oscillator clock rather than internal RC oscillator to acquire
accurate wake-up time when the chip works under low-energy-consumption mode.
4
Electrical Characteristics
Remark: The following test environment is VBAT
= 3.3V, TA = 27°C if there is no special
notifications.
4.1 Maximum Rating Values
Chart 6:Maximum Rating Values
Items
Conditions
Values
Unit
Storage Temperature
/
-40 to 125
°C
Supply Voltage
IPC/JEDEC J-STD-020
+3.0 to +3.6
V
4.2 Recommended Working Conditions
Chart 7:Recommended Working Conditions
Items
Storage Temperature
Supply Voltage
Conditions
/
IPC/JEDEC J-STD-020
Values
Unit
-40 to 125
°C
+3.0 to +3.6
V
4.3 Digital Port Characteristics
Chart 8:Digital Port Characteristics
Maximum
Values
0.25VDD
Unit
VIL
Minimum
Values
-0.3
Input High
VIH
0.75VDD
VDD+0.3
V
Output Low
VOL
0.1VDD
V
Output High
VOH
AA
0.8VDD
-
V
Ports
Typical Values
Input Low
Rev 1.2
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V
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W32/W33 Datasheet
4.4 Wi-Fi RF Characteristics
Chart 9:Wi-Fi RF Characteristics
Items
Minimum Values
Typical Values
Maximum Values
Unit
Input Frequency
2412
-
2484
MHz
Input Impedance
-
50
-
ohm
Input Reflection
Value
-
-
-10
dB
PA Output Power
15.5
16.5
21.5
dBm
Receive Accuracy
DSSS, 1 Mbps
-
-98
-
dBm
CCK, 11 Mbps
-
-90
-
dBm
OFDM, 6 Mbps
-
-93
-
dBm
OFDM, 54 Mbps
-
-75
-
dBm
HT20, MCS0
-
-93
-
dBm
HT20, MCS7
-
-73
-
dBm
HT40, MCS0
-
-90
-
dBm
HT40, MCS7
-
-70
-
dBm
MCS32
-
-91
-
dBm
Near Frequency Suppression
OFDM, 6 Mbps
-
37
-
dB
OFDM, 54 Mbps
-
21
-
dB
HT20, MCS0
-
37
-
dB
HT20, MCS7
-
20
-
dB
4.5 Low-Energy-Consumption Bluetooth FR
4.5.1
Receiver
Chart 10:BLE Receiver Characteristics
Parameters
灵敏度@0.1% BER
Maximum Receive
Signal @0.1% BER
co-channe C/I
Conditions
Minimum
Typical
Maximum Values
Unit
-
Values
-
Values
-98
-
dBm
-
0
-
-
dBm
-
-
+10
-
dB
F = F0 + 1 MHz
-
-5
-
dB
F = F0 - 1 MHz
-
-5
-
dB
F = F0 + 2 MHz
-
-25
-
dB
F = F0 - 2 MHz
-
-35
-
dB
F = F0 + 3 MHz
-
-25
-
dB
F = F0 - 3 MHz
-
-45
-
dB
Adjacent Channel C/I
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W32/W33 Datasheet
30 MHz - 2000 MHz
-10
-
-
dBm
Anti Out-Of-Band Block
2000 MHz - 2400
-27
-
-
dBm
Performance
MHz
2500 MHz - 3000
-27
-
-
dBm
MHz
3000 MHz - 12.5 GHz
-10
-
-
dBm
-
-36
-
-
dBm
Intermodulation
Performance
4.5.2
Transmitter
Chart 11:BLE Transmitter Characteristics
-
Minimum
Values
-
Typical
Values
+7.5
Maximum
Values
+10
dBm
-
-
25
-
dB
F = F0 + 1 MHz
-
-14.6
-
dBm
F = F0 - 1 MHz
-
-12.7
-
dBm
F = F0 + 2 MHz
-
-44.3
-
dBm
F = F0 - 2 MHz
-
-38.7
-
dBm
F = F0 + 3 MHz
-
-49.2
-
dBm
F = F0 - 3 MHz
-
-44.7
-
dBm
F = F0 + > 3 MHz
-
-50
-
dBm
F = F0 - > 3 MHz
-
-50
-
dBm
∆ f1avg
-
-
-
265
kHz
∆ f2max
-
247
-
-
kHz
∆ f2avg /∆ f1avg
-
-
-0.92
-
-
ICFT
-
-
-10
-
kHz
Frequency Drift ratio
-
-
0.7
-
kHz/50 µs
Frequency Drift
-
-
2
-
kHz
Parameters
Conditions
RF Transmitter Power
RF Power Control Range
Adjacent Channel
Transmitter Power
Unit
Chart 12:Operating Power Consumption
modes
Tx
Standards
Speed
Typical Values
11b
1 Mbps
215
11 Mbps
197
6 Mbps
197
54 Mbps
145
MCS7
120
11g
11n
Rx
All rates
56
Values
mA
mA
Remark: The transmission package contains 2014 bytes under RX mode.
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W32/W33 Datasheet
4.6 Power Consumption
W32 possesses advanced battery management technology and can switch among different
power-save modes.

Power-save mode
-Active mode: Chip RF is under the working state, and the chip can receive, transmit and detect
signal;
-Modem-sleep mode: CPU keeps working, the clock can be configured, Wi-Fi/ Bluetooth
baseband and RF are turned off;
-Light-sleep mode: CPU is suspended, and RTC, ULP co-processor work. Any events (MAC, Master,
RTC timer or External interrupt) can wake up the chip;
-Deep-sleep mode: Only RTC keeps working, the data of Wi-Fi and Bluetooth is stored in RTC. ULP
co-processor keeps running.
-Hibernate mode: The internal 8-MHZ crystal oscillator and ULP co-processor are both prohibited,
the RTC memory recycle power is cut off. Only an RTC timer on the slow clock and some RTC
GPIO are activated, so RTC timer, and RTC GPIO can wake up the chip from hibernate mode;

Sleep mode
-Associated sleep mode: The power-save mode can switch among active mode, modem-sleep
mode, light-sleep mode. CPU, Wi-Fi, Bluetooth, and RF can wake up periodically according to the
pre-set mode so that Wi-Fi/Bluetooth connection can be guaranteed.
-The detection method of ultraslow-power-consumption sensor: The main processor is under the
Deep-sleep mode, and ULP co-processor is turned on, turned off periodically to measure the
sensor data, according to which ULP co-processor determines whether to wake up the main CPU
or not.
Specifically, the power consumption depends on whether the chip runs under the power-save
mode or sleep mode. Besides these, the working states of functional modules also can influence
power consumption.
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W32/W33 Datasheet
Chart 13:Power Consumption Under Different power-Save Modes
Power-Save Modes
Active(RF works)
Description
Power Consumption
Wi-Fi Tx packet 13 dBm~21 dBm
160~260 mA
Wi-Fi /BT Tx packet 0 dBm
Wi-Fi /BT Rx and intercept
120 mA
80~90 mA
Associated sleep mode(Associated with
Light-sleep)
0.9 mA@DTIM3, 1.2
mA@DTIM1
Maximum speed: 20 mA
5
Modem-sleep
CPU works
Light-sleep
-
Normal speed: 5~10 mA
Minimum speed: 3 mA
0.8 mA
ULP co-processor works
0.5 mA
Deep-sleep
Monitoring with ultra-low energy
RTC timer+
consumption
RTC storage
25 µA @1% duty
20 µA
Hibernate
Only RTC timer runs
2.5µA
Mechanical Characteristics
5.1
Recommended Temperature of SMT
Chart 14:Recommended Temperature of SMT
Temperature increases from TS to TL
Maximum value 3℃/s
Warm-up
150℃
Minimum temperature (TS Min.)
175℃
Typical temperature (TS Typ.)
200℃
Maximum temperature (TS Max.)
60~180 seconds
Time(TS)
Temperature increases from TL to TP
Maximum value 3℃/s
Temperature(TL)/Duration period
217℃/60~150 seconds
Peak temperature (TP)
Maximum value 260℃,duration period
10 ″
Target temperature
260℃+0/-5℃
Real peak temperature (TP) 5℃ duration period
20~40 ″
Temperature decreases
Maximum value 6℃/s
The time that Temperature increases from 25℃ to
peak value(t)
Rev 1.2
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8 minutes at most
Page 20 Total 23
W32/W33 Datasheet
5.2 Module Weight
Chart 15: Module Weight
Module Type
Weight
IntoRobot_W32
1.6 g
IntoRobot_W33
1.8 g
5.3 Module Size
Chart 16:Fig.1-Module Size (Top View, Unit: mm)
Chart 17:Fig.2-Module Size (Top View, Unit: mm)
Chart 18:Fig.3-Recommended PCB Layout (Top View, Unit: mm)
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W32/W33 Datasheet
Chart 19:Fig.4-Module Layout Scheme 1(antenna is out of the frame, Unit: mm)
Chart 20:Fig.5-Module Layout Scheme 2(antenna is placed at the board side and the
corresponding place is excluded, Unit: mm)
Chart 21:Fig.6-Module Layout Scheme 3 (antenna is placed at the board side and the
corresponding below layers are not covered by copper, Unit: mm)
The performances of the module layout scheme 1, 2 are close to that of recommended layout
scheme. Scheme 3 is recommended if the antenna has to be placed on the base
board ,however, the corresponding RF performance will be damaged slightly.
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W32/W33 Datasheet
6
Hardware Schematics
6.1
Hardware Schematics
Chart 22:Hardware Schematics
Rev 1.2
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