Intel Server Chassis SC5275-E

Intel Server Chassis SC5275-E
®
Intel Server Chassis
SC5275-E
Technical Product Specification
C75531-001
Revision 1.2
December, 2005
Enterprise Platforms and Services Division
Revision History
Intel® Server Chassis SC5275-E TPS
Revision History
Date
Revision
Number
Modifications
03/02/04
0.5
Initial review copy
06/16/04
1.0
Final Revision
12/21/04
1.1
Update Fan Information
12/09/05
1.2
Corrected Chassis Depth
Disclaimers
Information in this document is provided in connection with Intel® products. No license, express
or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel
assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular
purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel products are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked
"reserved" or "undefined." Intel reserves these for future definition and shall have no
responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel® Server Chassis SC5275-E may contain design defects or errors known as errata
which may cause the product to deviate from published specifications. Current characterized
errata are available on request.
Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others.
Copyright © Intel Corporation 2005.
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Intel® Server Chassis SC5275-E TPS
Table of Contents
Table of Contents
1.
Introduction .......................................................................................................................... 9
2.
Chassis................................................................................................................................ 10
3.
2.1
System Color ......................................................................................................... 10
2.2
Front Bezel Features ............................................................................................. 10
2.3
Security.................................................................................................................. 10
2.4
I/O Panel................................................................................................................ 11
2.5
Chassis Views ....................................................................................................... 11
Chassis Power Subsystem................................................................................................ 14
3.1
3.1.1
Mechanical Outline ................................................................................................ 14
3.1.2
Output Wire Harness ............................................................................................. 15
3.2
AC Inlet Connector ................................................................................................ 18
3.2.2
600W DC Output Specifications ............................................................................ 19
3.3
Protection Circuits.................................................................................................. 20
3.4
Current Limit (OCP) ............................................................................................. 20
3.5
Over Voltage Protection (OVP).............................................................................. 20
3.6
Over Temperature Protection (OTP)...................................................................... 20
3.7
Control and Indicator Functions............................................................................. 20
3.8
PSON# Input Signal............................................................................................... 20
3.9
PWOK (Power OK) Output Signal ......................................................................... 20
3.10
5.
6.
AC Input requirements........................................................................................... 18
3.2.1
3.9.1
4.
600W Power Supply .............................................................................................. 14
Mean Time Between Failures (MTBF) ................................................................... 20
SMBus Monitoring Interface .................................................................................. 21
System Cooling .................................................................................................................. 21
4.1
Fan Configuration .................................................................................................. 21
4.2
Fan Control ............................................................................................................ 21
4.3
Cooling Solution..................................................................................................... 21
4.4
Workstation Cooling Kit Solution ........................................................................... 23
System Peripheral Bays..................................................................................................... 24
5.1
3.5-in Peripheral Drive Bay.................................................................................... 24
5.2
5.25-in Peripheral Drive Bays ................................................................................ 24
Hard Disk Drive Bays ......................................................................................................... 25
Revision 1.2
iii
Table of Contents
6.1
Fixed Hard Drive Bay............................................................................................. 25
6.2
SCSI Interface ....................................................................................................... 25
6.2.1
SCSI Hot Swap Backplane Specifications............................................................. 25
6.2.2
FET Short Protection ............................................................................................. 26
6.2.3
Device SCSI ID...................................................................................................... 26
6.2.4
Hard Drive Activity LED ......................................................................................... 26
6.2.5
Hard Drive Fault LED............................................................................................. 27
6.2.6
Hot Swap Drive Bay Electronics ............................................................................ 27
6.3
SATA Hardware Overview ..................................................................................... 28
6.3.1
SATA Hot Swap Drive Cage Upgrade Kit .............................................................. 28
6.3.2
Connect SATA Backplane Cables ......................................................................... 28
6.4
7.
Intel® Server Chassis SC5275-E TPS
Front Panel ............................................................................................................ 28
System Interconnection..................................................................................................... 30
7.1
Signal Definitions ................................................................................................... 30
7.2
Chassis Internal Cables......................................................................................... 30
7.2.1
Front Panel Cable.................................................................................................. 30
7.2.2
USB Cable ............................................................................................................. 30
7.2.3
Fan Connector ....................................................................................................... 30
7.3
Server Board Internal Cables ................................................................................ 30
7.4
Accessory Cables .................................................................................................. 31
7.4.1
ICMB Interface Card Cable.................................................................................... 31
7.4.2
External SCSI Cable.............................................................................................. 31
7.5
I/O Panel Connectors ............................................................................................ 31
8.
Compatible Intel® Server Boards ...................................................................................... 32
9.
Product Regulatory Compliance....................................................................................... 32
iv
9.1
Product Safety Compliance ................................................................................... 32
9.2
Product EMC Compliance ..................................................................................... 32
9.3
Product Regulatory Compliance Markings ............................................................ 32
9.4
Electromagnetic Compatibility Notices .................................................................. 33
9.4.1
USA ....................................................................................................................... 33
9.4.2
FCC Verification Statement ................................................................................... 34
9.4.3
ICES-003 (Canada) ............................................................................................... 34
9.4.4
Europe (CE Declaration of Conformity) ................................................................. 34
9.4.5
Japan EMC Compatibility ...................................................................................... 34
9.4.6
BSMI (Taiwan) ....................................................................................................... 35
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Table of Contents
10. Environmental Limits......................................................................................................... 35
10.1
System Office Environment ................................................................................... 35
10.2
System Environmental Testing .............................................................................. 35
11. Reliability, Serviceability, and Availability ....................................................................... 36
11.1
MTBF ..................................................................................................................... 36
11.2
Serviceability.......................................................................................................... 36
12. Upgradeability .................................................................................................................... 37
12.1
SCSI Hot Swap Drive Bay Upgrade....................................................................... 37
12.2
External SCSI Adapter Cable ................................................................................ 37
12.3
SATA Hot Swap Drive Bay Upgrade...................................................................... 38
Appendix A: Chassis Spares and Accessories .................................................................... 39
Upgrade and Accessory Parts ................................................................................................. 39
Replacement and Spare Parts for Intel® Server Chassis SC5275-E ...................................... 39
Glossary..................................................................................................................................... 41
Reference Documents .............................................................................................................. 43
Revision 1.2
v
List of Figures
Intel® Server Chassis SC5275-E TPS
List of Figures
Figure 1. ATX 2.2 I/O Aperture .................................................................................................. 11
Figure 2. Front Closed View of the Intel® Server Chassis SC5275-E ....................................... 11
Figure 3. Rear Closed View of the Intel® Server Chassis SC5275-E........................................ 12
Figure 4. Front Internal View of the Intel® Server Chassis SC5275-E ...................................... 13
Figure 5. Rear Internal View of the Intel® Server Chassis SC5275-E....................................... 13
Figure 6. Mechanical Outline of Power Suppy........................................................................... 14
Figure 72:Cooling Fan Configuration .......................................................................................... 22
Figure 8: Drive Bay Locations for Server Chassis SC5275-E.................................................... 24
Figure 9: 6-HDD Hot Swap Drive Bay, Front/Rear Isometric View ............................................ 27
Figure 10: Drive Carrier with Air Baffle Installed ........................................................................ 27
Figure 11: Front Panel Controls and Indicators ......................................................................... 29
Figure 12: Replacing System Fan from IDE Drive Carrier to the SCSI Drive Carrier ................ 37
Figure 13. External SCSI Adapter Cable Detail ......................................................................... 38
Figure 14: Replacing System Fan from IDE Drive Carrier to the SATA Drive Carrier ............... 38
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Intel® Server Chassis SC5275-E TPS
List of Tables
List of Tables
Table 1. Chassis Dimensions (approximate) ............................................................................. 10
Table 2: Cable Lengths............................................................................................................... 15
Table 3. Pin-out Baseboard Power Connector P1 ..................................................................... 15
Table 4. Processor Power Connector P2................................................................................... 16
Table 5: Power Signal Connector .............................................................................................. 17
Table 6: PCI Express Connector ............................................................................................... 17
Table 7: Peripheral Power Connectors ....................................................................................... 17
Table8: Peripheral Power Connectors ........................................................................................ 17
Table 9. Floppy Power Connector P6 ........................................................................................ 18
Table 10: SATA Power Connector.............................................................................................. 18
Table 11: SATA Power Connector.............................................................................................. 18
Table 12: Voltage Regulation Limits ........................................................................................... 19
Table 13. SCSI ID Assignments ................................................................................................ 26
Table 14. Hard Drive Activity LED ............................................................................................. 26
Table 15. SATA Drive Connectors............................................................................................. 28
Table 16. Front Panel LED Functions........................................................................................ 29
Table 17. System Office Environment Summary ....................................................................... 35
Table 18. MTBF Calculations..................................................................................................... 36
Table 19. Maximum Maintenance Procedure Times ................................................................. 36
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List of Tables
Intel® Server Chassis SC5275-E TPS
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Appendix A: Chassis Spares and Accessories
Introduction
This specification details the feature set of the Intel® Server Chassis SC5275-E, an entry-level
server chassis designed for Intel® server board products. The Server Chassis SC5275-E is low
cost and allows for utilization of multiple platforms and configurations.
The Server Chassis SC5275-E addresses the value server market. It includes a single 600W
power factor correction (PFC) power supply and supports four non-hot-swap hard drives. Two
tachometer fans (one mounted in front of the fixed hard drive cage and one mounted at the rear
of the chassis) provide main chassis cooling. This chassis is currently compatible with the
following Intel® server boards: Intel® Server Board SE7320SP2, Intel® Server Board
SE7525GP2, and Intel® Server Board SE7520BD2.
Two 5.25-in, half-height drive bays are available for peripherals, such as CD-ROM drives and
tape drives. A removable access cover provides entry to the interior of the chassis. The rear I/O
panel conforms to the Advanced Technology Extended (ATX) Specification, Revision 2.2. The
chassis supports seven full-length expansion cards. A front panel board designed for Server
Standards Infrastructure (SSI) Entry E-Bay (EEB) 3.0-compliant server boards is also provided
with the server chassis.
An optional hot-swap SCSI drive bay kit provides an upgrade path to allow the Server Chassis
SC5275-E to support six hot-swap drives. This optional hot-swap SCSI hard disk drive bay
supports up to five 1-in single connector attachment (SCA) low-voltage differential SCSI (LVD)
hard drives to enhance serviceability, availability, and upgradeability of the system. When the
hot-swap drive bay is installed, it replaces the fixed hard drive bay. Refer to the Intel® Server
Chassis SC5300/SC5275-E Hot-swap SCSI Bay Upgrade Kit for complete installation
instructions.
An optional hot-swap SATA upgrade drive bay assembly is available for the Server Chassis
SC5275-E. It should be mounted in place of the middle three 5.25-in drive trays in the base,
non-redundant chassis models. For the redundant power models, the upgrade accessory
should be installed in the lower three 5.25-in drive trays to bring the total number of available
hot-swap SATA drives to eight. Refer to the Intel® Server Chassis SC5300/SC5275-E SATA
Hot-swap Bay Upgrade Kit for complete installation instructions. Note: Part of the replacement
process requires removing the fan from the fixed hard drive bay and attaching it to the rear of
the hot-swap drive bay.
This specification details the key features of the product. Reference documents listed at the
back of this document provide additional product specification details for the server boards,
backplanes, and power supplies validated for use with this chassis. Check the compatibility
section on the support website for more details:
http://support.intel.com/support/motherboards/server/chassis/SC5275E/.
Revision 1.2
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Appendix A: Chassis Spares and Accessories
2.
Intel® Server Chassis SC5275-E TPS
Chassis
Table 1. Chassis Dimensions (approximate)
Configuration
Pedestal
Height
17.8 inches (452mm)
17.6 inches (447mm) if feet are removed
Width
9.256 inches (235mm)
Depth
18 inches (485mm)
Clearance Front
17.83 inches (452mm).
19.1 inches with bezel (485mm)
Clearance Rear
5 inches (12.7mm)
Clearance Side
3 inches (7.62mm) additional side clearance is needed for service access
2.1
System Color
®
The Intel Server Chassis SC5275-E is offered in one color:
•
2.2
Black (GE701), Order code KPTBASE450BLK
Front Bezel Features
The standard front bezel is molded plastic and attaches to the front of the chassis with a hinge
on the right side and two snaps on the left. The snaps at the left attach behind the access cover,
thereby preventing accidental removal of the bezel. The bezel can only be removed by first
removing the server access cover. This provides additional security to the hard drive and
peripheral bay area. The bezel includes a key-locking door that covers the drive cage area.
The peripheral bays are covered with plastic snap-in cosmetic pieces that must be removed to
add peripherals to the system. Front panel buttons and lights are located along the right side of
the peripheral bays.
2.3
Security
A variety of chassis security options are provided at the system level:
•
A removable padlock loop at the rear of the system access cover can be used to prevent
access to the microprocessors, memory, and add-in cards. A variety of lock sizes can be
accommodated by the 0.270-inch diameter loop.
•
A two-position key lock/switch will unlock the front bezel.
•
A chassis intrusion switch is provided, allowing server management software to detect
unauthorized access to the system cover.
Note: See the technical product specification appropriate to the server board for a description of
BIOS and management security features for each specific supported platform. The technical
product specifications can be found at http://support.intel.com.
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Intel® Server Chassis SC5275-E TPS
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Appendix A: Chassis Spares and Accessories
I/O Panel
All input/output (I/O) connectors are accessible from the rear of the chassis. The SSI E-bay 3.0compliant chassis provides an ATX* 2.2-compatible cutout for I/O shield installation. Boxed
Intel® server boards provide the required I/O shield for installation in the cutout. The I/O cutout
dimensions are shown in the following figure for reference.
R 0.039 MAX, TYP
0.100 Min keepout around opening
1.750 ? 0.008
(0.150)
I/O Aperture
6.250 ? 0.008
Baseboard
Datum 0,0
5.196 ? 0.010
(0.650)
Figure 1. ATX 2.2 I/O Aperture
2.5
Chassis Views
A
B
C
D
E
F
TP00053B
A.
B.
C.
D.
E.
F.
Front panel controls and indicators
Two 5.25-inch removable media drive bays
3.5-inch removable media drive bay
Internal hard drive bay cage (behind door)
Security lock
USB port
Figure 2. Front Closed View of the Intel® Server Chassis SC5275-E
Revision 1.2
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Appendix A: Chassis Spares and Accessories
Intel® Server Chassis SC5275-E TPS
A
B
C
D
E
F
G
H
I
TP00054B
J
A.
B.
C.
D.
E.
F.
G.
H.
I.
J.
K.
K
Alternate Serial B port knockout
Alternate ICMB or external SCSI knockout
AC input power connector
Power supply
Fan
I/O ports
Expansion slot covers
ICMB or external SCSI knockout
Serial B port knockout
Location to install padlock loop
Chassis intrusion switch
Figure 3. Rear Closed View of the Intel® Server Chassis SC5275-E
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Intel® Server Chassis SC5275-E TPS
Appendix A: Chassis Spares and Accessories
TP00053C
Figure 4. Front Internal View of the Intel® Server Chassis SC5275-E
TP00054C
Figure 5. Rear Internal View of the Intel® Server Chassis SC5275-E
Revision 1.2
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Appendix A: Chassis Spares and Accessories
3.
Intel® Server Chassis SC5275-E TPS
Chassis Power Subsystem
The Server Chassis SC5275-E power supplies are SSI (Server System Infrastructure) compliant.
The SSI specifications are provided at the following website: www.ssifourm.org.
3.1
600W Power Supply
The 600W power supply has 8 outputs: 3.3V, 5V, 12V1, 12V2, 12V3, 12V4, -12V, and 5Vsb
(standby). The 600W power supply contains a single 80-mm fan for cooling the power supply,
which also provides part of the cooling for the system. The power supply contains a single
80mm fan for cooling the power supply and part of the system.
3.1.1
Mechanical Outline
The power supply size is 150mm x 180mm x 86mm and has a wire harness for the DC outputs.
The AC power cord plugs directly into the external face of the power supply.
Note: All dimensions are in mm.
Figure 6. Mechanical Outline of Power Suppy
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3.1.2
Appendix A: Chassis Spares and Accessories
Output Wire Harness
Listed or recognized component appliance wiring material (AVLV2), CN, rated min 105°C,
300VDC shall be used for all output wiring.
From
Length
(mm)
Power Supply cover exit hole
Power Supply cover exit hole
425
375
To
connector
#
P1
P2
Power Supply cover exit hole
375
Power Supply cover exit hole
Power Supply cover exit hole
Extension
Extension from P4
Power Supply cover exit hole
375
450
100
100
575
75 (cover with
sleeve)
740
75
740
75
740
Extension
Power Supply cover exit hole
Extension
Power Supply cover exit hole
Extension
Power Supply cover exit hole
Extension
75
No of pins
Description
24
8
Baseboard Power Connector
Processor Power Connector
P14
5
Power Signal Connector
P15
P3
P4
P5
P6
6
4
4
4
4
P7
4
P8
P9
P10
P11
4
4
4
4
P12
5
P13
5
PCI Express Connector
Peripheral Power Connector
Peripheral Power Connector
Floppy Power Connector
Peripheral Power Connector
Right-angle Peripheral Power
Connector
Peripheral Power Connector
Peripheral Power Connector
Peripheral Power Connector
Peripheral Power Connector
Right-angle SATA Power
Connector
SATA Power Connector
Table 2: Cable Lengths
3.1.2.1
Baseboard Power Connector (P1)
Connector housing: 24-Pin Molex* Mini-Fit, Jr. 39-01-2245 or equivalent
Contact: Molex Mini-Fit, HCS, Female, Crimp 44476 or equivalent
Table 3. Pin-out Baseboard Power Connector P1
Pin
1*
2
3*
4*
5
6
7
8
9
10
11
12
•
3.1.2.2
Signal
+3.3VDC
18 AWG Color
Orange
3.3V RS
Orange (24AWG)
+3.3VDC
COM
Orange
Black
COM RS
Black (24AWG)
+5VDC
Red
5V RS
Red (24AWG)
COM
+5VDC
COM
PWR OK
5 VSB
+12V3
+12V3
+3.3VDC
Black
Red
Black
Gray (24AWG)
Purple
Yellow
Yellow
Orange
Pin
13
14
15
16
17
18
19
20
21
22
23
24
Signal
+3.3VDC
-12VDC
COM
PSON#
COM
COM
COM
Reserved
+5VDC
+5VDC
+5VDC
COM
18 AWG Color
Orange
Blue
Black
Green (24AWG)
Black
Black
Black
N.C.
Red
Red
Red
Black
Remote Sense wire double crimped
Processor Power Connector (P2)
Connector housing: 8-Pin Molex, 39-01-2080 or equivalent
Revision 1.2
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Appendix A: Chassis Spares and Accessories
Intel® Server Chassis SC5275-E TPS
Contact: Molex, 44476-1111 or equivalent
Table 4. Processor Power Connector P2
Pin
1
2
3
4
16
Signal
COM
COM
COM
COM
18 AWG color
Black
Black
Black
Black
Pin
5*
Signal
+12V1
18 AWG Color
White
12V1 RS
Yellow (24AWG)
6
7
8
+12V1
+12V2
+12V2
White
Brown
Brown
Revision 1.2
Intel® Server Chassis SC5275-E TPS
3.1.2.3
Appendix A: Chassis Spares and Accessories
Power Signal Connector (P14)
Connector housing: 5-pin Molex 50-57-9405 or equivalent
Contacts: Molex 16-02-0087 or equivalent
Table 5: Power Signal Connector
Pin
1
2
3
4
5
3.1.2.4
Signal
I2C Clock
I2C Data
Reserved
COM
3.3RS
24 AWG Color
White
Yellow
N.C.
Black
Orange
PCI Express Connector (P15)
Connector housing: 6-pin Molex 39-01-2065 or equivalent
Contacts: Molex Mini-Fit, HCS, Female, Crimp 44476
Table 6: PCI Express Connector
3.1.2.5
PIN
SIGNAL
18 AWG Colors
PIN
SIGNAL
18 AWG Colors
1
+12V4
Green
4
COM
Black
2
3
+12V4
+12V4
Green
Green
5
6
COM
COM
Black
Black
Peripheral Power Connectors (P3, P4, and P6, P8 - P11)
Connector housing: Amp, 1-480424-0 or equivalent;
Contact: Amp, 61314-1 contact or equivalent
Table 7: Peripheral Power Connectors
Pin
1
2
3
4
3.1.2.6
Signal
+12V4
COM
COM
+5 VDC
18 AWG Color
Green
Black
Black
Red
Right-Angle Peripheral Power Connectors (P7)
Connector housing: JWT F6001HS2-4P or equivalent
Table8: Peripheral Power Connectors
Pin
1
2
3
4
3.1.2.7
Signal
+12V4
COM
COM
+5 VDC
18 AWG Color
Green
Black
Black
Red
Floppy Power Connector (P5)
Connector housing: Amp, 171822-4 or equivalent;
Contact: Amp, 170204-1 contact or equivalent
Revision 1.2
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Appendix A: Chassis Spares and Accessories
Intel® Server Chassis SC5275-E TPS
Table 9. Floppy Power Connector P6
Pin
3.1.2.8
Signal
22 AWG Color
1
+5VDC
Red
2
COM
Black
3
COM
Black
4
+12V4
Green
Right-Angle SATA Power Connector (P12)
Connector housing: JWT F6002HS0-5P-18 or equivalent;
Table 10: SATA Power Connector
Pin
1
2
3
4
5
3.1.2.9
Signal
+3.3V
COM
+5VDC
COM
+12V4
18 AWG Color
Orange
Black
Red
Black
Green
SATA Power Connector (P13)
Connector housing: JWT A3811H00-5P or equivalent;
Contact: JWT A3811TOP-0D or equivalent
Table 11: SATA Power Connector
Pin
1
2
3
4
5
3.2
Signal
+3.3V
COM
+5VDC
COM
+12V4
18 AWG Color
Orange
Black
Red
Black
Green
AC Input requirements
The power supply shall incorporate universal power input with active power factor correction,
which shall reduce line harmonics in accordance with the EN61000-3-2 and JEIDA MITI
standards, see section 10.2.
3.2.1
AC Inlet Connector
The AC input connector is an IEC 320 C-14 power inlet. This inlet is rated for 10A / 250VAC.
3.2.1.1
AC Input Voltage Specification
The power supply must operate within all specified limits over the following input voltage range,
shown in below Table 13. Harmonic distortion of up to 10% of the rated line voltage must not
cause the power supply to go out of specified limits. The power supply shall power off if the AC
input is less than 75VAC +/-5VAC range. The power supply shall start up if the AC input is
greater than 85VAC +/-4VAC. Application of an input voltage below 85VAC shall not cause
damage to the power supply, including a fuse blow.
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3.2.1.2
Appendix A: Chassis Spares and Accessories
Efficiency
The power has an efficiency of 68% at maximum load and over the specified AC voltage.
3.2.1.3
AC Line Fuse
The power supply shall have one line fused in the single line fuse on the line (Hot) wire of the
AC input. The line fusing shall be acceptable for all safety agency requirements. The input fuse
shall be a slow blow type. AC inrush current shall not cause the AC line fuse to blow under any
conditions. All protection circuits in the power supply shall not cause the AC fuse to blow unless
a component in the power supply has failed. This includes DC output load short conditions.
3.2.2
600W DC Output Specifications
3.2.2.1
Grounding
3.2.2.2
The output ground of the pins of the power supply provides the output
power return path. The output connector ground pins shall be connected
to the safety ground (power supply enclosure). Outputs
The 5VSB output shall be present when an AC input greater than the power supply turn on
voltage is applied.
3.2.2.3
Fan-less Operation
Fan-less operation requirement is the PS ability to work indefinitely in Stand-By mode: w/ power
on, PS off and the 5VSB at full load (=2A) under the environmental conditions (temperature,
humidity, altitude). In this mode the components’ max temperature should follow the same
guidelines.
3.2.2.4
Voltage Regulation
The power supply output voltages must stay within the following voltage limits when operating at
steady state and dynamic loading conditions. These limits include the peak-peak ripple/noise.
All outputs are measured with reference to the return remote sense signal (ReturnS). The
+12V3, +12V4, –12V and 5VSB outputs are measured at the power supply connectors
referenced to ReturnS. The +3.3V, +5V, +12V1, and +12V2 are measured at it remote sense
signal located at the signal connector.
Table 12: Voltage Regulation Limits
PARAMETER
+3.3V
+5V
+12V1
+12V2
+12V3
+12V4
- 12V
+5VSB
TOLERANCE
- 5% / +5%
- 5% / +5%
- 5% / +5%
- 5% / +5%
- 5% / +5%
- 5% / +5%
- 5% / +9%
- 5% / +5%
MIN
+3.14
+4.75
+11.40
+11.40
+11.40
+11.40
- 11.40
+4.75
NOM
+3.30
+5.00
+12.00
+12.00
+12.00
+12.00
-12.00
+5.00
MAX
+3.46
+5.25
+12.60
+12.60
+12.60
+12.60
-13.08
+5.25
UNITS
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
test, the probe clips and capacitors should be located close to the load.
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3.3
Intel® Server Chassis SC5275-E TPS
Protection Circuits
Protection circuits inside the power supply shall cause only the power supply’s main outputs to
shutdown. If the power supply latches off due to a protection circuit tripping, an AC cycle OFF
for 15sec and a PSON# cycle HIGH for 1sec shall be able to reset the power supply.
3.4
Current Limit (OCP)
The power supply shall have current limit to prevent the +3.3V, +5V, and +12V outputs from
exceeding the values shown in Table 23. If the current limits are exceeded the power supply
shall shutdown and latch off. The latch will be cleared by toggling the PSON# signal or by an
AC power interruption. The power supply shall not be damaged from repeated power cycling in
this condition. -12V and 5VSB shall be protected under over current or shorted conditions so
that no damage can occur to the power supply. 5Vsb will be auto-recovered after removing OCP
limit.
3.5
Over Voltage Protection (OVP)
The power supply over voltage protection shall be locally sensed. The power supply shall
shutdown and latch off after an over voltage condition occurs. This latch shall be cleared by
toggling the PSON# signal or by an AC power interruption.
3.6
Over Temperature Protection (OTP)
The power supply will be protected against over temperature conditions caused by loss of fan
cooling or excessive ambient temperature. In an OTP condition the PSU will shutdown. When
the power supply temperature drops to within specified limits, the power supply shall restore
power automatically, while the 5VSB remains always on.
3.7
Control and Indicator Functions
The following sections define the input and output signals from the power supply.
Signals that can be defined as low true use the following convention:
Signal# = low true
3.8
PSON# Input Signal
#
The PSON signal is required to remotely turn on/off the power supply. PSON# is an active low
signal that turns on the +3.3V, +5V, +12V, and -12V power rails. When this signal is not pulled
low by the system, or left open, the outputs (except the +5VSB) turn off. This signal is pulled to
a standby voltage by a pull-up resistor internal to the power supply
3.9
PWOK (Power OK) Output Signal
PWOK is a power OK signal and will be pulled HIGH by the power supply to indicate that all the
outputs are within the regulation limits of the power supply. When any output voltage falls below
regulation limits or when AC power has been removed for a time sufficiently long so that power
supply operation is no longer guaranteed, PWOK will be de-asserted to a LOW state.
3.9.1
Mean Time Between Failures (MTBF)
The power supply shall have a minimum MTBF at continuous operation of 100,000 hours at
80% load at 40°C, as calculated by the Bellcore* RPP, or 250,000 hours demonstrated at 80%
load at 40°C.
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Intel® Server Chassis SC5275-E TPS
3.10
Appendix A: Chassis Spares and Accessories
SMBus Monitoring Interface
The 600W is compatible with both SMBus 2.0 ‘high power’ and I2C Vdd based power and drive.
This bus operates at 3.3V. The SMBus pull-ups are located on the server board.
The SMBus provides power monitoring, failure conditions, warning conditions, and FRU data.
Two pins have been reserved on the connector to provide this information: one pin for the Serial
Clock (PSM Clock) and one pin for the Serial Data (PSM Data). Both pins are bi-directional and
are used to form a serial bus.
4.
System Cooling
4.1
Fan Configuration
The cooling sub-system in the Server Chassis SC5275-E consists of two system fans and one
power supply fan. A 92mm x 25mm fan located in the front of the fixed hard drive cage draws
fresh air into the chassis from the front and provides cooling for the hard drive bay. A 120mm x
38mm fan provides cooling at the rear of the chassis, exhausting warm air out of the system.
The power supply fan assists in drawing air through the peripheral bay area, through the power
supply and exhausting it out the rear of the chassis.
In addition to these pre-installed fans, locations for three additional fans are provided for
customized configurations. Intel does not provide order part numbers for these customizable fan
options. A 120mm fan can be mounted to the rear of the PCI card guide and provide additional
cooling to the PCI card area and two 80mm fans can be mounted at the front of the chassis to
the right of the hard drive bay opening to provide more cooling.
4.2
Fan Control
The fans provided in the Server Chassis SC5275-E contain a tachometer signal that can be
adjusted by the Server Management subsystem for the Intel® Server Board SE7520BD2 or
SE7320SP2. See the specific baseboard Technical Product Specification for details on how this
feature works.
4.3
Cooling Solution
Air should flow through the system from front to back as indicated by the arrows in the following
figure.
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Intel® Server Chassis SC5275-E TPS
Figure 72:Cooling Fan Configuration
The Server Chassis SC5275-E is engineered to provide sufficient cooling for all internal
components of the server. The Server Chassis SC5275-E cooling subsystem is dependent upon
proper airflow. The designated cooling vents on both the front and back of the chassis must be
left open and must not be blocked by improperly installed devices. All internal cables must be
routed in a manner that does not impede airflow.
Active heat sinks incorporate a fan to provide cooling. This thermal solution is included with all
boxed Intel® Xeon™ processors. Proper installation of the processor cooling solution is required
for circulating air toward the rear of the chassis (toward I/O connectors).
Latest BIOS and FRUSDR version is required to be configured for proper performance. In
addition, it is recommended that system fans be connected to the Intel® server board SYS Fan
header #2 and SYS Fan header #3 for the chassis fans for SE7525GP2 or Intel® Server Board
SE7320SP2.
Server
Products
Connecting the Correct Processor and Chassis Fan
Headers
Intel® Entry Server Chassis SC5275-E contains two system fans, and will need to be connected
to the correct fan headers of the Intel® Server Board SE7320SP2 and SE7525GP2. The
following information is provided to ensure the correct fan headers are using for the chassis.
Processor and System Fan Headers:
Header Designator
22
Label on Board
Action
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System Fan Header 1
SYS FAN 1
Ø
System Fan Header 2
SYS FAN 2
Rear Chassis Fan
System Fan Header 3
SYS FAN 3
Front Chassis
Fan
System Fan Header 4
SYS FAN 4
Ø
System Fan Header 5
SYS FAN 5
Ø
System Fan Header 6
SYS FAN 6
Ø
Processor Fan Header
1
CPU 1 FAN
CPU 1 fan
Processor Fan Header
2
(if 2nd processor is
installed)
CPU 2 FAN
CPU 2 fan
4.4
Workstation Cooling Kit Solution
The Workstation Cooling Kit was designed to work with the Intel® Server Board SE7525GP2 or
Intel® Server Board SE7320SP2 with the Intel® Entry Server Chassis SC5275-E, to
dramatically reduce system level acoustics making it an effective solution when acoustics is a
concern. Intel product code APTWKT2COOLKIT (Intel MM # 861825).
The Intel® Workstation Cooling Kit can be used to retrofit either a new or existing Intel® Server
Board SE7525GP2 or Intel® Server Board SE7320SP2 in the Intel® Entry Server Chassis
SC5275-E. Do not install the Intel® Workstation Cooling Kit in systems that have a passive
heat sink solution. This kit is designed only for systems that use an active fan-cooled heat sink.
The following item is included in the kit: Cooling Kit assembly (includes fan, fan bracket, heat
sink, thermal pad, and four screws).
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5.
5.1
Intel® Server Chassis SC5275-E TPS
System Peripheral Bays
3.5-in Peripheral Drive Bay
The Server Chassis SC5275-E provides for the installation of a 3.5-in peripheral, such as a
floppy drive, below the 5.25-in peripheral bays. The bezel must be removed prior to floppy drive
installation. When a floppy drive is not installed, a snap-in EMI shield must be in place to ensure
regulatory compliance. A cosmetic plastic filler is provided to snap into the bezel.
The 3.5-in bay is designed so that screws are only required on the left side of the chassis, as
indicated in the following figure. On the right side of the chassis, two protrusions in the sheet
metal hold the drive in place.
Figure 8: Drive Bay Locations for Server Chassis SC5275-E
5.2
5.25-in Peripheral Drive Bays
The Server Chassis SC5275-E supports two half-height or one full-height 5.25-in removable
media peripheral device, such as a magnetic/optical disk, CD-ROM drive, or tape drive. These
peripherals can be up to 9 inches (228.6 mm) deep. As a guideline, the maximum
recommended power per device is 18W. Thermal performance of specific devices must be
verified to ensure compliance to the manufacturer’s specifications.
The 5.25-in peripherals are removable from the front of the chassis after taking off the access
cover and removing the front bezel. EMI shield panels are installed and should be retained in
unused 5.25-in bays to ensure proper cooling and EMI conformance.
Note: Use caution when approaching the maximum level of integration for the 5.25-in drive bays.
Power consumption of the devices integrated needs must be carefully considered to ensure that
the maximum power levels of the power supply are not exceeded. Typical configurations can
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Intel® Server Chassis SC5275-E TPS
Appendix A: Chassis Spares and Accessories
supply enough power for a floppy drive, a tape drive, a CD-ROM drive, and four fixed hard
drives.
6.
Hard Disk Drive Bays
6.1
Fixed Hard Drive Bay
The Server Chassis SC5275-E comes with a removable hard drive bay that can accept up to six
cabled 3.5-in x 1-in hard drives. Power requirements for each individual hard drive may limit the
maximum number of drives that can be integrated into a Server Chassis SC5275-E. This bay
has a 92-mm (6.2 inches) x 25-mm fan mounted to the front to provide airflow to the hard drives.
The drive bay is secured with two screws in the front and two screws on the side.
Note: The hard drive bay must be slid forward or removed to install the baseboard.
The Server Chassis SC5275-E is capable of accepting a single SCSI hot swap backplane hard
drive enclosure in place of the fixed drive bay. The backplane is an LVD/SE SCSI design, which
provides support for SCSI devices using Low Voltage Differential Signaling, as well as provides
support for older SE SCSI devices (Ultra 160 and older). The backplane has a connector to
accommodate a SAF-TE controller on an add-in card. The backplane supports five 1-in hot
swap SCA-2 drives when mounted in the docking drive carrier.
6.2
SCSI Interface
6.2.1
SCSI Hot Swap Backplane Specifications
The SCSI hot swap backplane is an embedded application subsystem, which during normal
operation does the following:
•
•
•
Responds to SAF-TE messages (transmitted to the back plane via the SCSI bus).
Monitors the temperature on the back plane, and reports a warning or critical error if
outside programmed limits.
Monitors the speed of the fans (if present), and reports a warning or critical error if
outside programmed limits.
The SCSI hot swap backplane board set is made up of the following functional blocks:
•
•
•
•
•
•
•
•
SCSI Bus with SCA drive connectors, and active LVDS terminators
Microcontroller with program Flash and RAM
SCSI interface that allows the microcontroller to respond as a SCSI target
I2C interface to server board
SCSI drive power control
Fault indicator support
Support for two cooling fans (fan-tach inputs and power control)
Temperature sensor
The SCSI interface on the LVD SCSI backplane provides the link between the SCSI bus and the
SCSI Accessed Fault Tolerant Enclosure (SAF-TE) controller. The SAF-TE interface allows the
enclosure management controller to respond as a SCSI target to implement the SAF-TE
protocol.
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Intel® Server Chassis SC5275-E TPS
Power control on the LVD SCSI backplane supports the following features.
1. Spin-down of a drive when failure is detected and reported (using enclosure services
messages) via the SCSI bus. An application or RAID controller detects a drive-related
problem that indicates a data risk. In response, it removes the drive from service and
sends a spin-down SCSI command to the drive. This decreases the likelihood that the
drive will be damaged during removal from the hot-swap drive bay. When a new drive
is inserted, the power control waits a small amount of time for the drive to be fully seated,
and then applies power with a controlled power ramp.
2. If the system power is on, the LVD SCSI backplane immediately powers off a drive slot
when it detects that a drive has been removed. This prevents possible damage to the
drive when it is partially removed and re-inserted while full power is available, and
disruption of the entire SCSI array from possible sags in supply voltage and resultant
current spikes.
6.2.2
FET Short Protection
The Field Effect Transistor (FET) short protection circuit is useful for protecting both the 12-V
and 5-V power control FETs located on the LVD SCSI backplane.
6.2.3
Device SCSI ID
Each device on a SCSI bus must have a unique SCSI ID. The 6 x 1.0-in LVD SCSI backplane
device SCSI ID is dependent on whether it is configured as a primary backplane.
Table 13. SCSI ID Assignments
Drive 1
SCSI ID as Primary Backplane
I2C* connector (J2A1) pin1=1
0x0H
Drive 2
0x1H
Drive 3
0x2H
Drive 4
0x3H
Drive 5
0x4H
Drive 6
0x5H
SAF-TE Controller
0x8H (6 HDD)
Device
6.2.4
Hard Drive Activity LED
Each SCSI hard drive turns on a green LED when it is accessed. The LEDs are 4-terminal dualcolor (yellow and green) and are physically located on the backplane.
Table 14. Hard Drive Activity LED
Drive
26
1
HSBP LED Activated
1
LED Designator
TBD
LED Color
Green
2
2
TBD
Green
3
3
TBD
Green
4
4
TBD
Green
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6.2.5
Appendix A: Chassis Spares and Accessories
5
5
TBD
Green
6
6
TBD
Green
Hard Drive Fault LED
The hot-swap controller (HSC) is responsible for turning the drive fault LEDs on or off according
to the states specified via commands received from the SAF-TE controller and the IMB. The
drive fault LEDs are 4-terminal dual-color (yellow and green) and indicate the failure status for
each drive. The LEDs are physically located on the LVD SCSI backplane.
Figure 9: 6-HDD Hot Swap Drive Bay, Front/Rear Isometric View
Figure 10: Drive Carrier with Air Baffle Installed
6.2.6
Hot Swap Drive Bay Electronics
The hot swap SCSI backplane board set supports the following features:
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•
Intel® Server Chassis SC5275-E TPS
Hot-swapping of SCSI drives, which allows for connection of SCSI devices while the
system is powered on.
Enclosure management and monitoring functions conforming to the SCSI-Accessed
Fault-Tolerant Enclosures Specification (SAF-TE), Revision 1.00.
•
6.3
SATA Hardware Overview
One SATA backplane (supporting up to 6 drives) can be mounted in a Server Chassis SC5275E if a SATA controller is installed.
6.3.1
SATA Hot Swap Drive Cage Upgrade Kit
The Serial ATA (SATA) drive cage allows for installation of up to six SATA drives in the Server
Chassis SC5275-E. The kit includes a SATA hot-swap drive bay with mounting hardware.
With this kit, the SATA hot swap drive cage can be directly connected to the SATA connectors
on the server board for those server boards that have integrated Serial ATA, or to a Serial ATA
RAID card, such as the Intel® RAID Controller SRCS14L. The RAID level that is supported
depends on the feature set of the Serial ATA controller.
6.3.2
Connect SATA Backplane Cables
1. Connect the power cables from the power supply to the SATA hot swap backplane.
Regardless of the number of drives that will be installed, both power connectors
should be used.
2. Connect each SATA cable to the SATA hot swap backplane. The connectors and
associated drives are identified as follows.
Table 15. SATA Drive Connectors
Drive Bay
Drive Number
Connection Number and
Drive Number
Bottom
Drive 0
0
Second from bottom
Drive 1
1
Second from top
Drive 2
2
Top
Drive 3
3
TBD
Drive 4
4
TBD
Drive 5
5
3. The system BIOS may need to be updated for proper operation. See the server board
documentation for information and instructions on upgrading the BIOS.
6.4
Front Panel
The front panel control buttons and LED indicators are displayed in the following figure. Not
shown in the following figure is a tool-activated non-maskable Interrupt (NMI) switch, which is
located below the Status LED. The Server Chassis SC5275-E provides a 34-pin cable option
with the chassis kit. A 34-pin Entry Ebay SSI (rev 3.0) front panel header for Intel® server
boards is located on the back of the front panel. This allows for connection of a 34-pin ribbon
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Appendix A: Chassis Spares and Accessories
cable for use with SSI rev 3.0-compliant server boards. The connector cable is compatible with
the 24-pin SSI standard.
When the hot-swap drive bay is installed, a bi-color hard drive LED is located on each drive
carrier (six total) to indicate specific drive failure or activity. For pedestal systems, these LEDs
are visible upon opening the front bezel door.
A.
B.
C.
D.
E.
F.
G.
H.
I.
Power / Sleep LED
Power button
NMI button
Reset Button
Sleep Button
LAN # 1 Activity LED
LAN # 2 Activity LED
Hard Drive Activity LED
Status LED
Figure 11: Front Panel Controls and Indicators
Table 16. Front Panel LED Functions
LED Name
Power/Sleep LED
LAN # 1-Link/Activity
LAN # 2-Link/Activity
Hard drive activity
Status LED
Color
Green
Condition
ON
Power on
Amber
ON
Sleep (S1)
OFF
Power off or Sleep (S4)
Green
ON
Linked
Green
BLINK
LAN activity
OFF
Disconnected
ON
Linked
BLINK
LAN activity
OFF
Disconnected
Green
BLINK
Hard drive activity
Amber
ON
Fault
OFF
No Activity
Green
ON
System ready (not supported by all server boards)
Amber
Revision 1.2
Description
BLINK
Processor or memory disabled
ON
Critical temperature or voltage fault; CPU/Terminator missing
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Intel® Server Chassis SC5275-E TPS
BLINK
Power fault; Fan fault; Non-critical temperature or voltage fault
OFF
Fatal error during POST
For additional details about front panel functions supported for a specific board, refer to the
individual server board specifications.
7.
System Interconnection
7.1
Signal Definitions
The pin-out on the connectors referred to in this section are defined in the respective server
board Technical Product Specification (TPS).
7.2
Chassis Internal Cables
The following cables/connectors are provided as part of the chassis kit:
•
•
•
7.2.1
Front panel cable
USB cable
Fan connectors
Front Panel Cable
A 34-conductor ribbon cable with 34-pin IDC connectors links the front panel to the SSI EEB
Revision 3.0-compliant server board.
7.2.2
USB Cable
A 4-conductor USB cable with a 10-pin server board connector and a 4-pin external USB
connector is used to connect the front mounted USB connector to the server board.
7.2.3
Fan Connector
The installed system fans provide 3-pin connectors that are designed to mate with SSI (ATX*)compatible fan headers.
7.3
Server Board Internal Cables
Depending on the specific server board support for these features, some or all of the following
cables may be included as part of the boxed board kit:
•
•
•
30
IDE Cable: One or two 40-pin, 80-conductor DMA33/66/100 IDE cables.
SCSI Cable: One 68-pin, 68-conductor twisted-pair wide SCSI cable with terminator.
Cable supports connection of up to four SCSI drives to the server board.
Floppy Cable: One 34-conductor cable featuring two 34-pin IDC connectors (2x17)
floppy cable.
Revision 1.2
Intel® Server Chassis SC5275-E TPS
•
Appendix A: Chassis Spares and Accessories
Serial Cable: One 8-conductor cable terminated in a 2x5 header at one end and a 9-pin
panel mount D sub connector on the other.
7.4
Accessory Cables
7.4.1
ICMB Interface Card Cable
One 5-pin ICMB cable connects the server board to the ICMB interface card mounted on the
chassis rear panel or add-in card slot (included in the ICMB Interface Card Kit, AXX21CMBKIT).
7.4.2
External SCSI Cable
One 68-pin SCSI cable connects the server board or add-in SCSI card to the panel that mounts
to the back of the chassis (SCSI Card Add-in cable, AXXEXTSCSICBL).
7.5
I/O Panel Connectors
The Server Chassis SC5275-E provides an ATX 2.2 and SSI E-bay 3.0-compliant I/O aperture
for the backside I/O. The specific panel used will be provided in the boxed server board kit. The
following are typical panel connections:
•
•
•
•
•
•
•
PS/2 keyboard connector
PS/2 mouse connector
9-pin serial port(s)
25-pin parallel port
USB port(s)
15-pin video port
Ethernet RJ-45 connector(s)
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Intel® Server Chassis SC5275-E TPS
Compatible Intel® Server Boards
8.
The Intel Server Chassis SC5275-E supports the following Intel® server boards:
•
•
•
9.
Intel® Server Board SE7320SP2
Intel® Server Board SE7525GP2
Intel® Server Board SE7520BD2
Product Regulatory Compliance
The Server Chassis SC5275-E is designed and tested to meet the standards and regulations
listed in the following sections when configured with the Intel® server boards specified.
9.1
Product Safety Compliance
The Server Chassis SC5275-E complies with the following safety requirements:
•
•
•
•
•
9.2
UL 1950 – CSA 950 (US/Canada).
EN 60 950 (European Unión).
IEC 60 950 (International).
CE – Low Voltage Directive (73/23/EEC) (European Limits).
EMKO-TSE (74-SEC) 207/94 (Nordics).
Product EMC Compliance
The system has been tested and verified to comply with the following EMC regulations when
configured with the Intel server boards specified. For information on compatible server boards,
refer to Intel’s Server Builder website (http://www.intel.com/go/serverbuilder) or contact your
local Intel representative.
•
•
•
•
•
•
•
•
•
•
9.3
FCC (Class A Verification) – Radiated and Conducted Emissions (USA).
ICES-003 (Class A) – Radiated and Conducted Emissions (Canada).
CISPR 22, 3rd Edition (Class A) – Radiated and Conducted Emissions (International).
EN45022 (Class A) – Radiated and Conducted Emissions (European Union).
EN45024 (Immunity) (European Union).
EN6100-3-2 & -3 (Power Harmonics and Fluctuation and Flicker).
CE – EMC Directive (89/33/EEC) (European Union).
VCCI (Class A) – Radiated and Conducted Emissions (Japan).
RRL (Class A) – Radiated and Conducted Emissions (Korea).
BSMI (Class A) – Radiated and Conducted Emissions (Taiwan).
Product Regulatory Compliance Markings
This product is provided with the following Product Certification Markings:
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Intel® Server Chassis SC5275-E TPS
•
•
•
•
•
•
•
•
•
Appendix A: Chassis Spares and Accessories
UL/cUL Listing Mark.
CE Mark.
German GS Mark.
Russian GOST Mark.
FCC, Class A Verification Marking.
ICES-003 (Canada EMC Compliance Marking).
VCCI, Class A Mark.
Australian C-Tick Mark.
Taiwan BSMI Certification Number and Class A Warning.
9.4
Electromagnetic Compatibility Notices
9.4.1
USA
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference and (2), this device must accept
any interference received, including interference that may cause undesired operation.
For questions related to the EMC performance of this product, contact:
Intel Corporation
5200 N.E. Elam Young Parkway
Hillsboro, OR 97124
1-800-628-8686
This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by turning
the equipment off and on, the user is encouraged to try to correct the interference by one or
more of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and the receiver.
Connect the equipment to an outlet on a circuit other than the one to which the receiver
is connected.
Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the grantee of this device could void
the user’s authority to operate the equipment. The customer is responsible for ensuring
compliance of the modified product.
Only peripherals (computer input/output devices, terminals, printers, etc.) that comply with FCC
Class B limits may be attached to this computer product. Operation with noncompliant
peripherals is likely to result in interference to radio and TV reception.
Revision 1.2
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Intel® Server Chassis SC5275-E TPS
All cables used to connect to peripherals must be shielded and grounded. Operation with
cables, connected to peripherals that are not shielded and grounded, may result in interference
to radio and TV reception.
9.4.2
FCC Verification Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference and (2), this device must accept
any interference received, including interference that may cause undesired operation.
For questions related to the EMC performance of this product, contact:
Intel Corporation
5200 N.E. Elam Young Parkway
Hillsboro, OR 97124-6497
Phone: 1 (800)-INTEL4U or 1 (800) 628-8686
9.4.3
ICES-003 (Canada)
Cet appareil numérique respecte les limites bruits radioélectriques applicables aux appareils
numériques de Classe A prescrites dans la norme sur le matériel brouilleur: “Appareils
Numériques”, NMB-003 édictée par le Ministre Canadien des Communications.
English translation of the notice above:
“This digital apparatus does not exceed the Class A limits for radio noise emissions from digital
apparatus set out in the interference-causing equipment standard entitled “Digital Apparatus,”
ICES-003 of the Canadian Department of Communications.”
9.4.4
Europe (CE Declaration of Conformity)
This product has been tested in accordance to, and complies with the Low Voltage Directive
(73/23/EEC) and EMC Directive (89/336/EEC). The product has been marked with the CE Mark
to illustrate its compliance.
9.4.5
Japan EMC Compatibility
Electromagnetic Compatibility Notices (International).
English translation of the notice above:
“This is a Class A product based on the standard of the Voluntary Control Council for
Interference (VCCI) from Information Technology Equipment. If this is used near a radio or
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Appendix A: Chassis Spares and Accessories
television receiver in a domestic environment, it may cause radio interference. Install and use
the equipment according to the instruction manual.”
9.4.6
BSMI (Taiwan)
The BSMI Certification number and the following warning are located on the product safety label,
which is located on the bottom side of the chassis.
Installation of the Intel® Workstation Acoustic Kit does not effect original compliance to Safety
or EMC requirements. Refer to the system product guide for details on regulatory information.
10. Environmental Limits
10.1
System Office Environment
Table 17. System Office Environment Summary
Parameter
Operating Temperature
Limits
+5 degrees C to +35 degrees C with the maximum rate of change not to exceed
10 degrees C per hour.
Non-Operating Temperature
-40 degrees C to +70 degrees C
Non-Operating Humidity
95%, non-condensing @ 30 degrees C
Acoustic noise
50 dBA in a typical office ambient temperature (18-25 degrees C)
Operating Shock
No errors with a half sine wave shock of 2G (with 11-millisecond duration).
Package Shock
Operational after a free fall, 18 – 24 inch depending on the weight.
ESD
15kV per Intel Environmental Test Specification
10.2
System Environmental Testing
The system will be tested per the Environmental Standards Handbook, Intel Doc.#662394-05.
These tests shall include:
•
•
•
•
•
•
•
•
•
Temperature Operating and Non-Operating
Humidity Non-Operating
Packaged Shock
Packaged and Unpackaged Vibration
AC Voltage, Frequency, and Source Interrupt
AC Surge
Acoustics
Electrostatic Discharge (ESD)
EMC Radiated Investigation
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Intel® Server Chassis SC5275-E TPS
11. Reliability, Serviceability, and Availability
11.1
MTBF
Calculated Mean Time Between Failures (MTBF) at maximum configuration has been
calculated at 74,000 hours for KDK at 35 degrees C.
Table 18. MTBF Calculations
Subassembly
(Server at 35 degrees C ambient air)
600W power supply
Standard
Configuration
MTBF (hours)
100,000
Standard Configuration with Optional
Backplane
MTBF (hours)
100,000
Cooling fans (2 - non redundant)
300,000
300,000
Hot Swap BP and SAF-TE card
1,500,000
1,500,000
Hot Swap SATA backplane
2,024,479
2,024,479
Front Panel Board
7,000,000
7,000,000
Intrusion switch
25,000,000
25,000,000
Total chassis subassembly
74,000
70,000
11.2
Serviceability
The system is designed to be serviced only by qualified technical personnel.
The desired Mean Time To Repair (MTTR) of the system is 30 minutes, including diagnosis of
the system problem. To meet this goal, the system enclosure and hardware have been
designed to minimize the MTTR.
The following are the maximum times that a trained field service technician should take to
perform the listed system maintenance procedures after diagnosis of the system.
Table 19. Maximum Maintenance Procedure Times
36
Remove cover
1 minute
Remove and replace hard disk drive
5 minutes
Remove and replace 5.25-in peripheral device
5 minutes
Remove and replace power supply
5 minutes
Remove and replace drive cage fan
7 minutes
Remove and replace expansion board
5 minutes
Remove and replace front panel board
5 minutes
Remove and replace server board (with no expansion boards)
15 minutes
Overall MTTR
20 minutes
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12. Upgradeability
Listed below are accessory kits available for the Server Chassis SC5275-E. Illustrations are
provided to indicate some of the kit contents. Not all parts for each kit are shown and the actual
part may differ in appearance.
12.1
SCSI Hot Swap Drive Bay Upgrade
The optional hot swap SCSI six-drive bay, Product Code AXX6SCSIDB, is available for all of the
Server Chassis SC5275-E. It supports up to six 1-inch single connector attachment (SCA) lowvoltage differential SCSI (LVD) hard drives to enhance serviceability, availability, and
upgradeability of the system.
The kit includes a hot-swap drive bay with mounting hardware, a 68-pin LVD SCSI cable for
data transfer, and a 4-pin I2C cable for server management communication.
Figure 12: Replacing System Fan from IDE Drive Carrier to the SCSI Drive Carrier
12.2
External SCSI Adapter Cable
The 68-pin external LVD SCSI cable, Product Code AXXEXTSCSICBL, allows an internal SCSI
connection from the motherboard to be routed to the ICMB/SCSI knockout at the rear of the
chassis.
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Intel® Server Chassis SC5275-E TPS
Figure 13. External SCSI Adapter Cable Detail
12.3
SATA Hot Swap Drive Bay Upgrade
The SATA Hot Swap Drive Bay Kit, Product Code AXX6SATADB, includes a SATA hot swap
drive bay with mounting hardware. It supports up to six 1-inch single connector attachment
(SCA) low-voltage differential SATA (LVD) hard drives to enhance serviceability, availability,
and upgradeability of the system. When the hot-swap drive bay is installed, it utilizes the 6
available fixed bay positions.
Figure 14: Replacing System Fan from IDE Drive Carrier to the SATA Drive Carrier
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Appendix A: Chassis Spares and Accessories
Appendix A: Chassis Spares and Accessories
Upgrade and Accessory Parts
Product Code
AXX6SCSIDB
MM #
TBD
TBD
UPC
Qty.
1
AXX6SATADB
TBD
TBD
1
AXXEXTSCSICBL
830656
7 35858 13953 3
1
APT2WKTCOOLKIT
861825
00735858169059
1
Description
Hot-Swap SCSI Drive Upgrade Kit – Upgrade Base
Chassis 6 drives
Hot-Swap SATA Drive Upgrade Kit – Upgrade Base
Chassis 6 drives
External SCSI Cable Accessory. For use with SCSI
Knock-out on rear of chassis.
Workstation Cooling Kit for Intel® Server Board
SE7320SP2/Intel® Server Board SE7525GP2 boards
only and Inte® Server Chassis SC5275-E. Improves
system cooling and acoustics. Includes 2 heatsinks,
retention mechanisms, fans spacers, cooling duct,
screws and documentation.
Replacement and Spare Parts for Intel® Server Chassis SC5275-E
Product Code
MM #
UPC
Qty.
FPTCOSMKIT
852424
735858159739
1
FPT2PMKIT
857643
00735858164788
1
AXX6SATADB
TBD
TBD
1
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Description
Cosmetic Kit
• One black bezel
• One dusty beige bezel
• Four chassis feet
• Two side cover latches
Preventive Maintenance Kit
• One Front Panel Board
• One Front Panel cable
• One USB cable
• One Intrusion Switch/cable
• One 92-mm fan
• One 120-mm fan with fan guard attached
• One box of hardware which consist of:
- Two left side peripheral rails
- Two right side peripheral rails
- One lock plate
- Fifteen standoffs for server board mounting
- Nine screws to mount RM
- 38 screws to mount server board, etc (common
screw)
- Eleven countersunk screws to mount CDROM,
floppy drive, etc
- Four screws to mount fan to a HS bay
- Four tie wraps for cable management
- One cable clamp for cable management
- One cable tie to cable management with HS bay
- One rubber bumper for server board mounting
- Two mounting brackets for HS bay
Hot-swap SATA Drive Upgrade Kit – Upgrade. Base KDK
SKU to six SATA Drives
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Appendix A: Chassis Spares and Accessories
FHD3PS450
844924
FSATAHSDBBRD 85327
Intel® Server Chassis SC5275-E TPS
7 35858 15351 5
1
Non-redundant 600W Power Supply for Intel® Server
Chassis SC5275-E
007358-581 16062 9
1
Spare serial ATA backplane board.
8
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Glossary
Glossary
This appendix contains important terms used in the preceding chapters. For ease of use,
numeric entries are listed first (e.g., “82460GX”) with alpha entries following (e.g., “AGP 4x”).
Acronyms are then entered in their respective place, with non-acronyms following.
Term
AC
Alternating Current
Definition
ACPI
Advanced Configuration and Power Interface.
ATX
Advanced technology extended (motherboard type).
BKM
Best Known Method – a document, created by an Intel organization that details the proper or customary
steps used to perform a specific task (e.g., operating system installation).
BMC
Baseboard Management Controller – Provides monitoring, alerting, and logging of critical system
information obtained from embedded sensors on the baseboard.
DC
Direct Current
DDR
Double Data Rate
DIMM
Dual Inline Memory Module
DLT
Digital Linear Tape
ECC
Error Correcting Code
EEB
Entry E-Bay
EEPROM
Electrically Erasable Programmable Read-Only Memory
EMC
Electromagnetic compatibility
EMI
Electromagnetic Interference
EPS
Entry Power Supply; External Product Specification
EPG
Enterprise Products Group – a division of Intel Corporation.
ESD
Electrostatic Discharge
FET
Field Effect Transistor
FRU
Field Replaceable Unit
FWH
Firmware Hub
HCT
Hardware Compatibility Test
HSBP
Hot-Swap Backplane
HSC
Hot-Swap Controller
Hz
Hertz (1 cycle/second)
I2C
Inter-integrated circuit bus
ICMB
Intelligent Chassis Management Bus
IDE
Integrated Drive Electronics
I/O
Input / Output
IP
Internet protocol
IPMI
Intelligent Platform Management Interface
ISM
Intel® Server Management
LAN
Local Area Network
LED
Light Emitting Diode
LPC
Low Pin Count
LVDS
Low-voltage differential SCSI
MTBF
Mean Time Between Failures
MTTR
Mean Time to Repair
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Glossary
Intel® Server Chassis SC5275-E TPS
NMI
Nonmaskable Interrupt
OEM
Original Equipment Manufacturer
OS
Operating System
PCI
Peripheral Component Interconnect
PFC
Power Factor Correction
RPM
Revolutions Per Minute
RPS
Redundant Power Supply
PWT
Processor Wind Tunnel – Active cooling device included with the Intel® Boxed XeonTM Processors
SAF-TE
SCSI Accessed Fault –Tolerant Enclosure
SATA
Serial AT-Attachment interface
SCA
Single connector attachment.
SCSI
Small Computer Systems Interface.
SDR
Sensor Data Record
SKU
Stock Keeping Unit
SMBus
A subset of the I2C bus/protocol, developed by Intel.
SSI
Server System Infrastructure – Organization which defines and promotes specifications for the server
market
TBD
To Be Documented – Used when item being described has not yet been designed or formalized.
TPS
Thin Power Supply; Technical Product Specification
USB
Universal Serial Bus
VCCI
Voluntary Control Council for Interference
VRAM
Video Random Access Memory
VRM
Voltage Regulation Module
WfM
Wired for Management
WOL
Wake-on-LAN
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Reference Documents
Reference Documents
Refer to the following documents for additional information:
•
Intel® Server Chassis SC5275-E Subassembly Product Guide
•
Intel® Server Chassis SC5275-E Hot Swap Bay Upgrade Kit
•
Intel® Server Chassis SC5100 and SC5200 External SCSI Cable Install Guide
•
SCSI Accessed Fault-Tolerant Enclosures Specification, Revision 1.00
•
SSI Entry-Level Electronics–Bay Specification, Version 3.0
•
Advance Technology Extended (ATX) Specification, Revision 2.2
•
ANSI/IEEE STD C62.45-1992
•
Environmental Standards Handbook
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