TI Embedded Processor for eBook Applications

TI Embedded Processor for eBook Applications
TI Embedded Processor for
eBook Applications
Anderson Hsiao
TI MCU/DSP Business Development
eBook Reader

eBook

Targeted mainly for Electronic download of published books and
magazines/newspapers.
 Optimized for best reading experience on Gray Scale ePaper including
easy content access.

Education SmartBook

Revolutionary multi-display (Gray Scale ePaper + Full Color LCD)
SmartBook where the user interacts with different documents, books,
notebooks, web pages and devices – like calculators, digital pens, etc.
•

User can combine information from multiple books, the internet, audios and
videos into a personal learning experience.
Education and teaching tool; Interactive computer based teaching system
PLUS Generic eBook reader & Netbook Web Browsing.
 Optimized for the learning experience of the INTERNET age.
eBook Readers
Education SmartBook
Opportunities

Education eBooks

Large growth due to penetration into each school/university bag
 High differentiation with OMAP due to the combination of MID features
with ebook reader functions in a mobile environment
 High potential to create a complete end to end offering using TI education
technology IP, market channels and branding

eBooks

High volume, large growth market
 Main differentiation is a complete solution with integrated epaper controller
 Key for success is the best in class integration with all important epaper
technologies and value chain partners
eBook System Block Diagram
PMIC
PMIC
Gate drivers
300
Flash
DMA
CPU
300
284
RAM
MEMIF
Main
SDRAM
Temp
Sensor(s)
EPSON
controller
Serial
Flash
284
Screen
284
Source drivers
E-ink EPD Panel
E-ink specific EPD solution
TI OMAP3x for eBook Applications
TI OMAP3 Application Processors
OMAP35x scalable platform of devices for
complete product portfolio
Applications
Software
Compatibility
Shared
Peripheral
Set
Production Now
OMAP™
OMAP3530
OMAP3525
OMAP3503
OMAP3515
™
OMAP
™
OMAP
OMAP3525
OMAP3515
OMAP3503
OMAP™
™
OMAP
OMAP3515
OMAP3503
OMAP™
OMAP3503
ARM
ARM
Cortex™-A8
Cortex™-A8
600 MHz
600 MHz
720
ARM
ARM
Cortex™-A8
Cortex™-A8
600 MHz
600 MHz
Peripherals
Peripherals
Peripherals
Peripherals
Open GL ES
2.0
Graphics
Open GL ES
2.0
POWERVR SGX™
Peripherals
Peripherals
ARM
Cortex™-A8
Peripherals
600 MHz
Graphics
POWERVR SGX™
ARM
ARM
Cortex™-A8
600
MHz
Cortex™-A8
600 MHz
DSP
2D/3D
Processing
Graphics
& Multimedia
Compatibility
Software
Compatibility
C64x+ DSP
& video
accelerator
C64x+ DSP
& video
accelerator
Graphics
Open GL ES
2.0
POWERVR SGX™
Pin-for-pin compatible
Availability subject to applicable lead times
POWERVR SGX™ 3D engine is licensed from Imagination Tech. Ltd.
Subject to Change
OMAP35x processor
Laptop like performance at handheld power level
Performance
 High-performance Superscalar ARM® Cortex™-A8 featuring NEON


co-processor with immersive 2D/3D Graphics accelerator
HD video decode utilizing TMS320C64x+ DSP and video hardware
accelerators
Low power utilizing TI’s SmartReflex™ technology with option for integrated
and discrete Power Management ICs
Features
 Cores
 Cortex A-8 with NEON™ SIMD Coprocessor / DSP-based


TMS320C64x+ DSP and video accelerators (max performance only)
 720 MHz / 520 MHz @ 1.35V (operating limits apply)
 600 MHz / 430 MHz @ 1.35V (operating limits apply)
 550 MHz / 400 MHz @ 1.27V
2D/3D Graphics Engine - Up to 10M polygons per second

Memory
 ARM:
 16 kB I-Cache; 16 kB D-Cache; 256kB L2
 TMS320C64x+ DSP and video accelerators
 L1 32kB Program Cache/32kB Data Cache + 48kB SRAM
 L2 64kB Program / Data Cache + 32 kB SRAM; 16 kB ROM
 On Chip: 64kB SRAM; 112kB ROM
Peripheral Highlights
 Support for LPDDR
 Support for NOR, NAND, SRAM, Pseudo SRAM
 USB 2.0 HS Compliant OTG Controller w/ 2 additional USB Host
Controllers
Display subsystem with LCD and TV interface. Supports PIP, color
space conversion, resize and rotation.
 Camera I/F with CCD controller and Image-pipe (Preview, Resize,
Statistics
Package 1 (CBB): 12x12 mm, 0.4mm pitch, Package On Package (POP); 515
pin PBGA; production now; can be used with discrete memory
Package 2 (CUS): 16x16 mm 0.65 mm pitch. 423 pin PBGA; production now.
Utilizes Via Channel™ Array Technology with 0.8mm pitch plus design rules.
Package 3 (CBC): 14x14 mm, 0.5 mm pitch POP; 515 pin PBGA; production
now; must use POP memory
Applications include:
 Automotive Infotainment

In-dash navigation
 Consumer

PND

PMP

Digital Video Camera


Subject to Change


Patient monitoring

Portable ultrasound
Industrial

Point of sale

Smart white goods
OMAP35x Processor
C64x+™ DSP and
video
accelerators
(3525/3530 only)
ARM®
Cortex™A8
CPU
POWERVR
SGX™ Graphics
(3515/3530 only)
Display
Subsystem
LCD
Controller
Video 10 bit DAC
Enc 10 bit DAC
Camera I/F
Image
Pipe
Parallel I/F
L3/L4 Interconnect
Peripherals
System
Connectivity
USB 2.0 HS
USB
OTG
Host
Controller Controller x3


 Medical
Serial Interfaces
McBSP
x5
McSPI
x4
I2 C
x3
UART
x2
UART
w/IRDA
HDQ /
1-wire
Timers
GP x12
WDT x2
Program/Data Storage
SDRC
GPMC
MMC/
SD/
SDIO
x3
Note: Peripheral limitations may apply among different packages
POWERVR SGX™ 3D engine is licensed from Imagination Tech. Ltd.
OMAP35x Windows® CE 6.0 DVSDK Overview
TI / BSQUARE’s Windows CE 6.0 R2 BSP is a free, source code offering included in the
OMAP35x WinCE DVSDK for the TI OMAP35x Evaluation Module (EVM) that helps customers
get to market faster with Windows CE O/S based product based on OMAP35x application
processor.
Windows CE by
http://www.bsquare.com/omap3/
EVM

Hardware based on OMAP3530

Features Cortex™-A8 running at
600MHz

VGA on-board display with
additional DVI and S-Video ports

Contains 128 MB LPDDR1/128 MB
Micron Flash or similar capacity
and function

Includes touch screen LCD display
with landscape/portrait modes

Expansion connector provides
flexible interface capability
DVSDK

Base, tested BSP available now

Features DirectShow Filter
integration

Contains Codec Engine and
DSPLink for utilization of DSP and
video accelerators inside WinCE

Full OMAP35x peripheral support

DVI and S-Video support

Comprehensive “Welcome Tour”
on-screen guide written in Flash

Adobe® Flash® Lite™ 3.1 support*

POWERVR SGX™ support for
high-end graphics capabilities
To get started:
•Get the OMAP35x EVM: www.ti.com/omapdevtools
•Register the board (instructions are in the box)
•Access the Windows CE Demo or Windows CE DVSDK through www.ti.com/omapsoftwareupdates
*Available for purchase from BSQUARE
Subject to Change
POWERVR SGX™ 3D engine is licensed from Imagination Tech. Ltd.
TI OMAP3 “Zoom 2” Development Platform
Subject to Change
Working with EPD
OMAP 3
NEON
Cortex A8
Display I/F Thin logic - CPLD Source and gate
(// or GPMC) (protocol adaptation drivers control
+ level shifting)
DSP
3D HW acc. SGX
+/-15V,
+/-22V
DSS/GPMC
Temp sensor
Temp.
sensing
Subject to Change
PMIC for E-INK
Auto VCOM
TI Sitara® Family for eBook Applications
Subject to Change
What is Sitara™?
High performance MPUs
Ideal for applications requiring
What’s new
• New platform of high-performance
ARM microprocessors:
– ARM9 to ARM® Cortex™-A8
MPU’s
• First new devices: AM3505 &
AM3517
• Software compatible roadmap for
customers using TI’s OMAP™
processors
•
•
•
•
High-level operating system
375 MHz – 1GHz+ in future devices
Advanced graphical user interfaces
Multiple connectivity and interface
options
• High system integration
• And…
• Scalability
• System cost constraints
• Application software portability
Sitara ARM MPUs – a good fit for industrial, instrumentation, POS
Industrial
automation
HVAC and
building
controls
Subject to Change
Medical
instrumentation
Test &
measurement
Point
of sale /
service
Single
board
computing
Sitara Processors are ideal for:
Applications such as
•
HVAC and building controls
•
Network appliances
•
Industrial automation
•
Point-of-sale machines
•
Test and measurement
•
Medical instrumentation
•
Educational Consoles
•
Single Board Computing
•
Low Power PC
Subject to Change
Design requirements
•
Network Connectivity
•
Multiple connectivity and interface options
•
High system integration
•
Scalability
•
System cost constraints
•
Operating System compatibility
•
Application software portability
•
Advanced graphical user interfaces
AM1808 Processor
Unmatched Connectivity & Integration for Power-Efficient Processors
The boxes with yellow border are features
found in AM1808 and not in AM1806
Example Applications:
•
•
•
•
Industrial Automation
Home Automation
Test & Measurement
Portable Data Terminals
ARM9
Subsystem
LCD
Controller
ARM
926EJ-S
CPU
uPP
PRU
128KB
RAM
Video IN/Out
Benefits:
• Multiple connectivity and
interface options
• Rich, intuitive user interfaces
• High system integration
• Reduced system cost
Switched Central Resource (SCR) / EDMA
Peripherals
UHPI
Connectivity
USB2.0
HS
USB
1.1
Serial Interfaces
SPI
(2)
McASP
McBSP
(2)
I2 C
(2)
TI Confidential – NDA Required
Subject to Change
EMAC
System
SATA
WD
Timer
PWM
(3)
Program/Data Storage
UART
(3)
mDDR/ Async
DDR2/
EMIF
SDRAM 16-bit
16-bit
MMC/SD
(2)
AM1808 Processor
Features
CPU Cores
The boxes with yellow border are features
found in AM1808 and not in AM1806
– ARM926EJ-S™ (MPU) up to 450 MHz
ARM9
Subsystem
 Memory
– ARM:
–
–
16KB – L1 Program Cache
16KB – L1 Data Cache
ARM
926EJ-S
CPU
– On-chip
–
High Speed ADC
FPGA, or DSP
interface
128KB RAM
– mDDR, DDR2, SDRAM
LCD
Controller
uPP
128KB
RAM
PRU
Video IN/Out
Peripherals (1.8/ 3.3V IOs)
–
–
–
–
–
VGA
LCD
10/100 Ethernet MAC
EMIFA - DDR (mDDR/DDR2)
EMIFB – SDRAM/NAND Flash
Video Port I/F – Video In/Out (BT.656)
SATA, uPP
Switched Central Resource (SCR) / EDMA
Peripherals
Connectivity
 Power (1.0-1.2V Core, 1.8/3.3V IOs)
– Total Power < 220 mW* @ 300MHz, 1.2V, 25C
– Standby Power
UHPI
USB2.0
HS
USB
1.1
EMAC
System
SATA
Timer
(4)
PWM
(3)
< 9mW @ 1.2V/ 25C
Serial Interfaces
 Package
– 13 x13mm nFBGA (0.65mm), 16x16mm BGA (0.8mm)
– Extended Temperature Grade Options
•
•
Commercial (0C to 70C)
Industrial (-40C to 85C)
– Pin to pin compatible processors:
•
SPI
(2)
McASP
McBSP
(2)
Internet
UART
(3)
I2 C
(2)
Bluetooth
Connectivity
OMAP-L138/AM1806/AM181x
Subject to Change
Program/Data Storage
TI Confidential
– NDA Required
TI Confidential
mDDR/ Async
DDR2/
EMIF
SDRAM 16-bit
16-bit
MMC/SD
(2)
AM1806 Processor
Unmatched Connectivity & Integration for Power-Efficient Processors
Example Applications:
•
•
•
•
Industrial Automation
Educational Consoles
Portable Data Terminals
Point of Sale (Wireless)
ARM9
Subsystem
LCD
Controller
ARM
926EJ-S
CPU
uPP
PRU
128KB
RAM
Video IN/Out
Benefits:
Switched Central Resource (SCR) / EDMA
• Multiple connectivity and
interface options
• Rich, intuitive user interfaces
• High system integration
• Reduced system cost
Peripherals
UHPI
System
USB2.0
HS
Timer
(4)
Serial Interfaces
SPI
(2)
McASP
McBSP
(2)
I2 C
(2)
TI Confidential – NDA Required
Subject to Change
PWM
(3)
Program/Data Storage
UART
(3)
mDDR/ Async
DDR2/
EMIF
SDRAM 16-bit
16-bit
MMC/SD
(2)
AM1806 Processor
High Speed ADC,
or FPGA interface
VGA
LCD
Features
CPU Cores
ARM9
Subsystem
– ARM926EJ-S™ (MPU) up to 450 MHz
 Memory
LCD
Controller
– ARM:
–
–
16KB – L1 Program Cache
16KB – L1 Data Cache
– On-chip (128KB RAM)
ARM
926EJ-S
CPU
– mDDR, DDR2, SDRAM
uPP
Peripherals (1.8/ 3.3V IOs)
–
–
–
–
Video IN/out
EMIFA - DDR (mDDR/DDR2)
EMIFB – SDRAM/NAND Flash
Video Port I/F – Video In/Out (BT.656)
uPP
Switched Central Resource (SCR) / EDMA
 Power (1.0-1.2V Core, 1.8/3.3V IOs)
Peripherals
System
– Total Power
•
< 220 mW* @ 300MHz, 1.2V, 25C
– Standby Power
•
128KB
RAM
PRU
UHPI
< 9mW @ 1.2V/ 25C
USB2.0
HS
Timer
(4)
PWM
(3)
– Extended Temperature Grade Options
•
•
Commercial (0C to 90C)
Industrial (-40C to 105C)
Serial Interfaces
SPI
(2)
Package
– 13 x13mm nFBGA (0.65mm)
16x16mm BGA (0.8mm)
– Pin to pin compatible processors: OMAP-L138, AM1818,
AM1808
McASP
McBSP
(2)
I2 C
(2)
UART
(3)
Bluetooth
Connectivity
TI Confidential – NDA Required
Subject to Change
Program/Data Storage
mDDR/ Async
DDR2/
EMIF
SDRAM 16-bit
16-bit
MMC/SD
(2)
TI Stellaris® Family – Cortex-M3
Subject to Change
Stellaris® Family Technology
ARM® Cortex™-M3 v7-M Processor Core
• Up to 100 MHz
• Up to 125 MIPS (at 100 MHz)
On-chip Memory
• 256 KB Flash; 96 KB SRAM
• ROM loaded with Stellaris DriverLib, BootLoader,
AES tables, and CRC
External Peripheral Interface (EPI)
• 32-bit dedicated parallel bus for external peripherals
• Supports SDRAM, SRAM/Flash, M2M
Advanced Serial Integration
• 10/100 Ethernet MAC and PHY
• 3 CAN 2.0 A/B Controllers
• USB (full speed) OTG / Host / Device
• 3 UARTs with IrDA and ISO 7816 support*
• 2 I2Cs
• 2 Synchronous Serial Interfaces (SSI)
• Integrated Interchip Sound (I2S)
System Integration
• 32-channel DMA Controller
• Internal Precision 16MHz Oscillator
• Two watchdog timers with separate clock domains
• ARM Cortex Systick Timer
• 4 32-bit timers (up to 8 16-bit) with RTC capability
• Lower-power battery-backed hibernation module
• Flexible pin-muxing capability
Advanced Motion Control
• 8 advanced PWM outputs for motion and energy applications
• 2 Quadrature Encoder Inputs (QEI)
Analog
• 2x 8-ch 10-bit ADC (for a total of 16 channels)
• 3 analog comparators
• On-chip voltage regulator (1.2V internal operation)
* One UART features full modem controls
Subject to Change
Stellaris® value proposition
Performance
Broad Portfolio
• 20-100 MHz ARM-M3 CPU
• Largest ARM MCU portfolio in the world
with 138 devices
• 8KB-256KB Flash and 96KB RAM
• 10-bit, 8ch ADCs from 250ksps-1MSPS
• Up to 8 advanced PWM modules
• RTC, BOR, and integrated LDO
• Analog comparators and temp sensor
• 28 to 108 pin from SOIC to BGA
• Optimized for single-cycle flash usage
• Thumb-2 ISA with high code density
• Flexible clock system sources up to 8 timers
• Single-cycle multiply and hardware divide
• Three power modes and battery-backed
hibernation with non-volatile memory
• Integrated 32-ch DMA for ease of use
& high data rate without CPU overhead
Connectivity
Only family in the industry with:
• Ethernet MAC & PHY with 1588 PTP support
• USB Host, Device, or On-The-Go
• CAN 2.0 A/B with 32 mailboxes
• Integrated UART, I2C, SSI modules
• Integrated I2S master or slave
• External Peripheral Interface supporting
SRAM, SDRAM, M2M, FPGA, CPLD
Ease of Use
• C friendly IDE and compilers from industry
leaders
• Low cost development tools
• Application specific and advanced
development kits
• Production-ready application modules
• StellarisWare on ROM includes driver and
peripheral libraries to ease development
23
Stellaris® target applications
Transaction
Control
•Point-of-sale
•Printers
•Data acquisition
•AutoID
•Tag Scanner
•Vehicle ID
•Inventory RFID
Building
Control
•Lighting controls
•LED drivers
•Panel motor controller
•HVAC
•Pump inverter
•Compressor motor
•Building automation
•Audio
Automation
•Machines
•Controllers
•Sorters
•Analyzers
•Component motors
•Monitors
•Ethernet bridges
•Sensors
Medical
•Connected Motor Control
•Dental Drilling Machine
•Robotic DNA Extraction
•Connected General Host
•Data Acquisition
24
OS for Embedded Platforms
.NET Micro Framework for Portable Device
DK-LM3S9B96 MCU Development Kit
10/100 Ethernet
MAC+PHY
IEEE 1588
CAN MAC
USB Full Speed
UART
I2C
SSI/SPI
I2S
ADC
Channels
ADC Speed
(Ksps)
Internal Temp
Sensor
LDO Voltage
Regulator
Analog
Comparators
Digital
Comparators
64
✓
✓
50
✓
4
8
2
8
✓
8
3
2
-
-
-
-
3
2
2
-
8
1000
✓
✓
3
7
60 ✓
LM3S2000s
26
256
96
✓
✓
80
✓
4
8
2
8
✓
8
4
2
-
-
2
-
3
2
2
✓
16
1000
✓
✓
3
7
60 ✓
LM3S3000s
9
128
64
✓
✓
50
✓
4
8
2
8
✓
8
4
1
-
-
-
O/H/D 3
2
2
-
8
1000
✓
✓
3
7
61 ✓
LM3S5000s
26
256
96
✓
✓
80
✓
4
8
2
8
✓
8
4
2
-
-
2
O/H/D 3
2
2
✓
16
1000
✓
✓
3
7
71 ✓
LM3S9000s
8
256
96
✓
✓
100
✓
4
8
2
8
✓
8
4
2
✓
✓
2
O/H/D 3
2
2
✓
16
1000
✓
✓
3
7
65 ✓




Evaluation version software tools included in
EPI – Breakout Board
Included
64-LQFP
100-LQFP
108-BGA
64-LQFP
100-LQFP
108-BGA
64-LQFP
100-LQFP
64-LQFP
100-LQFP
100-LQFP
LM3S9B96 Full-Featured Development Board

80 MHz Stellaris LM3S9B96 MCU



Package Options
QEI
256
ADC (10-bit)
Hibernate
Fault Inputs
37
PWM
GPIOs (5-V)
RTC
LM3S1000s
Max Speed
(MHz)
Internal
Precision
Oscillator
32-bit Timer
Outputs
Digital
16-bit Timer
Watchdog
Timers
CCP
Analog
Ext. Peripheral
Interface
Serial Interfaces
ROM SW
Library
Motion Control
SRAM (KB)
General Purpose
Timer Modules
Flash (KB)
Core
MCUs in Series
Memory and Speed
with fully-integrated Ethernet, CAN, and
USB OTG/Host/Device
Bright 3.5” QVGA LCD touch-screen display
Navigation POT and select pushbuttons
Integrated Interchip Sound (I2S) Audio Interface
EPI cards: I/O break-out board and 8 MB SDR SDRAM module
MicroSD card interface
LM3S9B96 I/O available on labeled break-out pads
ARM® 20-pin JTAG debug connector with input and output modes




1 GB MicroSD Card, 128 MB USB Flash Drive
Ethernet cable, CAN ribbon cable, USB and JTAG cables
CDs containing evaluation software tools, documentation, quickstart guide, StellarisWare®
Graphics,
the
kit: USB, and Peripheral Driver Libraries, and source code
EPI – 8MB SDRAM Board
EPI – Flash/SRAM/LCD Board
Coming
Soon!
EPI – FPGA and Camera Board
Coming
Soon!
www.ti.com
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