IBM | 7870A2G | Datasheet | IBM eServer BladeCenter BladeCenter HS22

IBM eServer BladeCenter BladeCenter HS22
Versatile, easy-to-use blade optimized for performance,
power and cooling
IBM BladeCenter HS22
Built for performance
The HS22 provides outstanding per­
formance with support for the latest
Intel® Xeon® processors, high-speed
I/O, and support for high memory
capacity and fast memory throughput.
The HS22 can run applications up to
twice as fast compared to previous
generation blades. In fact, you can run
many applications faster than even
competitor four-socket blades.
Optimized for power, cooling efficiency
■ Improve service with unparal­
leled RAS features and innova­
tive management
■ Reduce cost through increased
performance, utilization and
■ Manage growth and reduce risk
on a BladeCenter platform with
proven stability
Designed for versatility
The HS22 features an innovative
The IBM® BladeCenter® HS22 offers
mechanical design optimized for cool­
flexible options to support a broad
ing capability to help keep the blade
range of workloads, including virtualiza­
running smoothly even under demand­
tion and enterprise applications. Along
ing conditions. Combined with
with intuitive UEFI-based tools, the
low-voltage components, the industry’s
HS22 can be customized and deployed
most energy-efficient chassis, and
quickly while best-in-class reliability fea­
robust power management tools, the
tures help keep you up and running.
HS22 helps control power consumption
Mix and match the HS22 with the
and maximize efficiency.
industry’s most diverse set of chassis
and blades and that go beyond x86.
IBM BladeCenter HS22 at a glance
Form factor
Single-wide (30 mm)
Processor (max)
Choice of two Intel Xeon 5500 series processors, up to 2.93 GHz
Number of processors (std/max) 1/2
© Copyright IBM Corporation 2009
Cache (max)
8 MB (quad-core)
Memory (max)
Twelve DDR-3 VLP DIMM slots (up to 96 GB of total memory
capacity and memory speeds up to 1333 MHz)
Expansion slots
1 CIOv slot (standard PCI-Express daughter card) and 1 CFFh
slot (high-speed PCI-Express daughter card) for a total of 8 ports
of I/O to each blade, including 4 ports of high-speed I/O
Disk bays (total/hot-swap)
Maximum internal storage
1, 2
2 hot-swap bays supporting SAS HDDs or solid-state drives
Up to 600 GB total internal storage
Network interface
Broadcom 5709S onboard NIC with dual Gigabit Ethernet ports
with TOE
Hot-swap components
Internal storage bays
RAID support
RAID-0, -1 and -1E (optional RAID-5 with battery-backed cache)
Systems management
Unified Extensible Firmware Interface (UEFI), IBM Integrated
Management Module (IMM), Predictive Failure Analysis®,
optional embedded hypervisor for virtualization, IBM Systems
Director Active Energy Manager™, light path diagnostics,
IBM Systems Director and IBM ServerGuide™
Operating systems supported
Limited warranty
Microsoft® Windows®, Linux®, Sun Solaris and VMware
3-year customer replaceable unit and onsite and offsite limited
For more information
World Wide Web
Maximum internal hard disk and memory
capacities may require the replacement of any
standard hard drives and/or memory and the
population of all hard disk bays and memory
slots with the largest capacity supported drives
available. When referring to variable speed
CD-ROMs, CD-Rs, CD-RWs and DVDs, actual
playback speed will vary and is often less than
the maximum possible.
IBM hardware products are made from new
parts, or new and serviceable used parts.
Regardless, our warranty terms apply. For a
copy of applicable product warranties, write to:
Warranty Information, P.O. Box 12195, RTP,
NC 27709, Attn: Dept. JDJA/B203. IBM makes
no representation or warranty regarding thirdparty products or services, including those
designates as ServerProven or ClusterProven.
March 2009
All Rights Reserved
This publication could include technical
inaccuracies or photographic or typographical
errors. This publication was produced in the
United States. IBM may not offer the products,
services or features discussed in this document
in other countries, and the information may be
subject to change without notice. References
herein to IBM products and services do not
imply that IBM intends to make them available in
other countries. Consult your local IBM business
contact for information on the products or
services available in your area.
Information about non-IBM products is obtained
from the manufacturers of those products or
their published announcements. IBM has not
tested those products and cannot confirm the
performance, compatibility or any other claims
related to non-IBM products. Questions on the
capabilities of non-IBM products should be
addressed to the suppliers of those products.
IBM, the IBM logo, and BladeCenter
are trademarks or registered trademarks of
IBM Corporation in the United States,
other countries or both. If these and other
IBM trademarked terms are marked on their
first occurrence in this information with a
trademark symbol (® or ™), these symbols
indicate U.S. registered or common law
trademarks owned by IBM at the time this
information was published. Such trademarks
may also be registered or common law
trademarks in other countries. A current list of
IBM trademarks is available on the Web at
Intel and Xeon are registered trademarks of
Intel Corporation or its subsidiaries in the
United States and other countries.
Linux is a registered trademark of Linus Torvalds
in the United States, other countries or both.
Microsoft and Windows are trademarks or
registered trademarks of Microsoft Corporation
in the United States, other countries or both.
Other company, product and service names
may be trademarks or service marks of others.
GB and TB = 1,000,000,000 and
1,000,000,000,000 bytes, respectively, when
referring to storage capacity. Accessible
capacity is less.
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