Express-HL2 COM Express® Basic Size Type 2 Module with Intel® Core™ and Celeron® Processor Features ● Intel® i7/i5/i3 and Celeron® 200XE series Processor with Mobile Intel® QM87 Express Chipset ● Up to 16GB Dual Channel DDR3L at 1600MHz ● Dual Channel LVDS and VGA supporting 2 independent displays ● Six PCIe x1, one PCIe x16 and 32-bit PCI-bus ● GbE, four SATA 6 Gb/s, one PATA,IDE, eight USB 2.0 ● Supports Smart Embedded Management Agent (SEMA®) functions ● Extreme Rugged operating temperature: -40°C to +85°C (build option) Specifications ● Core System CPU Intel® Core™ i7 Processors (Mobile) - 22nm i7-4860EQ 2.4 GHz (3.2 GHz Turbo), 47W (4C/GT3) i7-4700EQ 2.4 GHz (3.4 GHz Turbo), 47W (4C/GT2) i5-4400E 2.7 GHz (3.3 GHz Turbo), 37W (2C/GT2) i5-4402E 1.6 GHz (2.7 GHz Turbo), 25W (2C/GT2) i3-4100E 2.4 GHz (no Turbo) 3MB, 37W (2C/GT2) i3-4102E 1.6 GHz (no Turbo) 3MB, 25W (2C/GT2) Celeron® 2000E 2.2 GHz (no Turbo) 35W (2C/GT1) Celeron® 2002E 1.5 GHz (no Turbo) 25W (2C/GT1) Supports : Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX Note: Availability of the features may vary between processor SKUs. Memory Dual channel non-ECC 1600/1333 MHz DDR3L memory up to 16GB in dual SODIMM socket Embedded BIOS AMI EFI with CMOS backup in 8MB SPI BIOS with Intel® AMT 9.0 support L3 Cache 6MB for i7-4650U, 3MB for i5-4400E, i5-4402E, i3-4100E and i3-4102E Expansion Busses PCI Express x16 (Gen3) or PCI Express (2 x8 or 1 x8 with 2 x4) 6 PCI Express x1: Lanes 0/1/2/3/4/5 32-bit PCI bus rev 2.3 LPC bus, SMBus (system) , I2C (user) SEMA Board Controller ● Video GPU Feature Support Generation 7.5 graphics core architecture, supporting 2 independent and simultaneous display combinations of VGA and LVDS monitors Encode/transcode HD content LVDS Single/dual channel 18/24-bit LVDS from eDP (two lanes) VGA Analog VGA support with 300 MHz DAC Analog monitor support up to QXGA (2048 x 1536) ● Audio Chipset Intel® HD Audio integrated in SOC Audio Codec Located on carrier Express-BASE6 (ALC886 standard supported) ● Ethernet Intel® MAC/PHY: i217LM (Enterprise SKU) with AMT 9.0 support Interface: 10/100/1000 GbE connection ● I/O Interfaces USB: 8x USB 2.0 (USB 0,1,2,3,4,5,6,7) SATA: Four ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3) PATA: One PATA IDE single device only GPIO: 4 GPO and 4 GPI with interrupt Supports : Voltage/Current monitoring, Power sequence debug support, AT/ ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS ), Watchdog Timer and Fan Control ● Super I/O Debug Headers ● TPM 40-pin multipurpose flat cable connector Use in combination with DB-40 debug module Providing BIOS POST code LED, BMC access, SPI BIOS flashing, Power Testpoints, Debug LEDs 60-pin XDP header for ICE debug of CPU/chipset On carrier if needed (standard support for W83627DHG-P) Chipset: Atmel AT97SC3204 Type: TPM 1.2 Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times. Specifications ● Power Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5% Wide Input: ATX = 8.5~20 V / 5Vsb ±5% or AT = 8.5~20V Management: ACPI 4.0 compliant, Smart Battery support Power States: C1-C6, S0, S1, S4, S3, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) ECO mode: Supports deep S5 mode for power saving ● Operating Systems Standard Support Windows 7/8 32/64-bit, Linux 32/64-bit Extended Support (BSP) WES7/8, Linux, VxWorks, QNX ● Mechanical Form Factor: PICMG COM.0: Rev 2.1 Type 2 Dimension: Basic size: 125 mm x 95 mm Operating Temperature Standard: 0°C to +60°C Extreme Rugged: -40°C to +85°C (build option) Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT Tested Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times. Functional Diagram SODIMM 2 XDP 1333/1600 MHz 1~16 GB DDR3L 60-pin 4th Generation SODIMM 2 Intel® Core™ 1333/1600 MHz 1~16 GB DDR3L i7/i5/i3 Processor “Haswell” FDI eDP 2 lane PCI Express x16 (GEN3) 2 x8 or 1x8 + 2x4 DMI eDP - LVDS RTD2136R/N single / dual 18/24 -bit LVDS CRT VGA GbE LAN i217LM CD AB 6x PCIe x1 (GEN2) (port 0~5) PCIe x1 (port 7) 4x SATA 3 (port 0/1/4/5) 8x USB v1.1/2.0 (port 0~3, 8~11) HDA Audio SATA port 2 PCH Mobile Intel® QM87 Express Chipset PCIe x1 (port 6) SATA to PATA PATA PCIe to PCI PCI TI XIO2001 TPM Atmel AT97SC3204 LPC bus 4x GP0 4x GPI SPI 0 BIOS GPIO PCA9535 SPI_CS0 SPI_CS1 SMbus GP I2C DDC I2C SPI_CS# SPI SEMA BMC SPI 1 BIOS LM73 Ordering Information ● ● ● ● ● ● ● ● Accessories Express-HL2-i3-4100E COM Express® Basic Size Type 2 Module with Intel® Core™ i34100E at 2.4 GHz with GT2 level graphics Express-HL2-i3-4102E COM Express® Basic Size Type 2 Module with Intel® Core™ i34102E at 1.6 GHz with GT2 level graphics Express-HL2-i5-4400E COM Express® Basic Size Type 2 Module with Intel® Core™ i54400E at 2.7 GHz with GT2 level graphics Express-HL2-i5-4402E COM Express® Basic Size Type 2 Module with Intel® Core™ i54402E at 1.6 GHz with GT2 level graphics Express-HL2-i7-4700EQ COM Express® Basic Size Type 2 Module with Intel® Core™ i74700EQ at 2.4/1.7 GHz with GT2 level graphics Express-HL2-i7-4860EQ COM Express® Basic Size Type 2 Module with Intel® Core™ i74860EQ at 2.18GHz with GT3 level graphics Express-HL2-Celeron 2000E COM Express® Basic Size Type 2 Module with Intel® Celeron® 2000E 2.2 GHz (no Turbo) 35W (2C/GT1) Express-HL2-Celeron 2002E COM Express® Basic Size Type 2 Module with Intel® Celeron® 2002E 1.5 GHz (no Turbo) 25W (2C/GT1) Heat Spreaders ● ● HTS-HL-B Heatspreader for Express-HL2 with threaded standoffs for bottom mounting HTS-HL-BT Heatspreader for Express-HL2 with through hole standoffs for top mounting Passive Heatsinks ● ● ● THS-HL-BL Low profile heatsink for Express-HL2 with threaded standoffs for bottom mounting THSH-HL-BL Low profile heatsink for Express-HL2 with through hole standoffs for top mounting THSF-HL-BL High profile heatsink for Express-HL2 with threaded standoffs for bottom mounting Active Heatsink ● THSF-HL-BL-WT High profile heatsink with Fan for Express-HL2 with threaded standoffs for bottom mounting *Quad Core CPU at 47W cannot use above heatsinks Starter Kit ● COM Express Type 2 Starter Kit Starter kit for Express-HL2 COM Express formfactor starter kit with Express-BASE board, power supply, and accessory kit www.adlinktech.com All products and company name listed are trademarks or trade names of their respective companies. Updated Jan. 19, 2017. ©2017 ADLINK Technology, Inc. All Rights Reserved. All specifications are subject to change without further notice.
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