Express-HL2 - ADLINK Technology
Express-HL2
COM Express® Basic Size Type 2 Module with
Intel® Core™ and Celeron® Processor
Features
●
Intel® i7/i5/i3 and Celeron® 200XE series Processor with Mobile
Intel® QM87 Express Chipset
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Up to 16GB Dual Channel DDR3L at 1600MHz
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Dual Channel LVDS and VGA supporting 2 independent displays
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Six PCIe x1, one PCIe x16 and 32-bit PCI-bus
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GbE, four SATA 6 Gb/s, one PATA,IDE, eight USB 2.0
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Supports Smart Embedded Management Agent (SEMA®) functions
●
Extreme Rugged operating temperature: -40°C to +85°C
(build option)
Specifications
● Core System
CPU
Intel® Core™ i7 Processors (Mobile) - 22nm
i7-4860EQ 2.4 GHz (3.2 GHz Turbo), 47W (4C/GT3)
i7-4700EQ 2.4 GHz (3.4 GHz Turbo), 47W (4C/GT2)
i5-4400E 2.7 GHz (3.3 GHz Turbo), 37W (2C/GT2)
i5-4402E 1.6 GHz (2.7 GHz Turbo), 25W (2C/GT2)
i3-4100E 2.4 GHz (no Turbo) 3MB, 37W (2C/GT2)
i3-4102E 1.6 GHz (no Turbo) 3MB, 25W (2C/GT2)
Celeron® 2000E 2.2 GHz (no Turbo) 35W (2C/GT1)
Celeron® 2002E 1.5 GHz (no Turbo) 25W (2C/GT1) Supports : Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64
Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel®
AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX
Note: Availability of the features may vary between processor SKUs.
Memory
Dual channel non-ECC 1600/1333 MHz DDR3L memory up to 16GB in dual
SODIMM socket
Embedded BIOS
AMI EFI with CMOS backup in 8MB SPI BIOS with Intel® AMT 9.0 support
L3 Cache
6MB for i7-4650U, 3MB for i5-4400E, i5-4402E, i3-4100E and i3-4102E
Expansion Busses
PCI Express x16 (Gen3) or PCI Express (2 x8 or 1 x8 with 2 x4)
6 PCI Express x1: Lanes 0/1/2/3/4/5
32-bit PCI bus rev 2.3
LPC bus, SMBus (system) , I2C (user)
SEMA Board Controller ● Video
GPU Feature Support
Generation 7.5 graphics core architecture, supporting
2 independent and simultaneous display
combinations of VGA and LVDS monitors
Encode/transcode HD content
LVDS
Single/dual channel 18/24-bit LVDS from eDP (two lanes)
VGA
Analog VGA support with 300 MHz DAC
Analog monitor support up to QXGA (2048 x 1536)
● Audio
Chipset
Intel® HD Audio integrated in SOC
Audio Codec
Located on carrier Express-BASE6 (ALC886 standard supported)
● Ethernet
Intel® MAC/PHY: i217LM (Enterprise SKU) with AMT 9.0 support
Interface: 10/100/1000 GbE connection
● I/O Interfaces
USB: 8x USB 2.0 (USB 0,1,2,3,4,5,6,7)
SATA: Four ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3)
PATA: One PATA IDE single device only
GPIO: 4 GPO and 4 GPI with interrupt
Supports : Voltage/Current monitoring, Power sequence debug support, AT/
ATX mode control, Logistics and Forensic information, Flat Panel Control,
General Purpose I2C, Failsafe BIOS (dual BIOS ), Watchdog Timer and Fan
Control
● Super I/O
Debug Headers
● TPM
40-pin multipurpose flat cable connector
Use in combination with DB-40 debug module
Providing BIOS POST code LED, BMC access, SPI BIOS flashing, Power
Testpoints, Debug LEDs
60-pin XDP header for ICE debug of CPU/chipset
On carrier if needed (standard support for W83627DHG-P)
Chipset: Atmel
AT97SC3204
Type: TPM 1.2
Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
Specifications
● Power
Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
Wide Input: ATX = 8.5~20 V / 5Vsb ±5% or AT = 8.5~20V
Management: ACPI 4.0 compliant, Smart Battery support
Power States: C1-C6, S0, S1, S4, S3, S5 , S5 ECO mode (Wake on USB S3/S4,
WOL S3/S4/S5)
ECO mode: Supports deep S5 mode for power saving
● Operating Systems
Standard Support
Windows 7/8 32/64-bit, Linux 32/64-bit
Extended Support (BSP)
WES7/8, Linux, VxWorks, QNX
● Mechanical
Form Factor: PICMG COM.0: Rev 2.1 Type 2
Dimension: Basic size: 125 mm x 95 mm
Operating Temperature
Standard: 0°C to +60°C
Extreme Rugged: -40°C to +85°C (build option)
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table
214-I, Condition D
HALT Tested
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.
Functional Diagram
SODIMM 2
XDP
1333/1600 MHz
1~16 GB DDR3L
60-pin
4th Generation
SODIMM 2
Intel® Core™
1333/1600 MHz
1~16 GB DDR3L
i7/i5/i3 Processor
“Haswell”
FDI
eDP
2 lane
PCI Express x16 (GEN3)
2 x8 or 1x8 + 2x4
DMI
eDP - LVDS
RTD2136R/N
single / dual
18/24 -bit LVDS
CRT VGA
GbE LAN
i217LM
CD
AB
6x PCIe x1 (GEN2)
(port 0~5)
PCIe x1
(port 7)
4x SATA 3 (port 0/1/4/5)
8x USB v1.1/2.0 (port 0~3, 8~11)
HDA Audio
SATA
port 2
PCH
Mobile Intel® QM87
Express Chipset
PCIe x1
(port 6)
SATA to
PATA
PATA
PCIe to
PCI
PCI
TI XIO2001
TPM
Atmel
AT97SC3204
LPC bus
4x GP0
4x GPI
SPI 0
BIOS
GPIO
PCA9535
SPI_CS0
SPI_CS1
SMbus
GP I2C
DDC I2C
SPI_CS#
SPI
SEMA
BMC
SPI 1
BIOS
LM73
Ordering Information
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Accessories
Express-HL2-i3-4100E
COM Express® Basic Size Type 2 Module with Intel® Core™ i34100E at 2.4 GHz with GT2 level graphics
Express-HL2-i3-4102E
COM Express® Basic Size Type 2 Module with Intel® Core™ i34102E at 1.6 GHz with GT2 level graphics
Express-HL2-i5-4400E
COM Express® Basic Size Type 2 Module with Intel® Core™ i54400E at 2.7 GHz with GT2 level graphics
Express-HL2-i5-4402E
COM Express® Basic Size Type 2 Module with Intel® Core™ i54402E at 1.6 GHz with GT2 level graphics
Express-HL2-i7-4700EQ
COM Express® Basic Size Type 2 Module with Intel® Core™ i74700EQ at 2.4/1.7 GHz with GT2 level graphics
Express-HL2-i7-4860EQ
COM Express® Basic Size Type 2 Module with Intel® Core™ i74860EQ at 2.18GHz with GT3 level graphics
Express-HL2-Celeron 2000E
COM Express® Basic Size Type 2 Module with Intel® Celeron®
2000E 2.2 GHz (no Turbo) 35W (2C/GT1)
Express-HL2-Celeron 2002E
COM Express® Basic Size Type 2 Module with Intel® Celeron®
2002E 1.5 GHz (no Turbo) 25W (2C/GT1)
Heat Spreaders
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HTS-HL-B
Heatspreader for Express-HL2 with threaded standoffs for
bottom mounting
HTS-HL-BT
Heatspreader for Express-HL2 with through hole standoffs for
top mounting
Passive Heatsinks
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THS-HL-BL
Low profile heatsink for Express-HL2 with threaded standoffs
for bottom mounting
THSH-HL-BL
Low profile heatsink for Express-HL2 with through hole
standoffs for top mounting
THSF-HL-BL
High profile heatsink for Express-HL2 with threaded standoffs
for bottom mounting
Active Heatsink
●
THSF-HL-BL-WT
High profile heatsink with Fan for Express-HL2 with threaded
standoffs for bottom mounting
*Quad Core CPU at 47W cannot use above heatsinks
Starter Kit
●
COM Express Type 2 Starter Kit
Starter kit for Express-HL2 COM Express formfactor starter kit
with Express-BASE board, power supply, and accessory kit
www.adlinktech.com
All products and company name listed are trademarks or trade names of their respective companies.
Updated Jan. 19, 2017. ©2017 ADLINK Technology, Inc. All Rights Reserved.
All specifications are subject to change without further notice.
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