bq2430x/1x DSG EVM (HPA245) for Li+

bq2430x/1x DSG EVM (HPA245) for Li+
User's Guide
SLUU291B – August 2007 – Revised November 2016
bq2430x/1x/8x DSG EVM (HPA245) for Li+ Charger
Front-End Protection IC
The bq2430x/1x/8x evaluation module is a complete charger module for evaluating a charger front-end
protection and charger solution using the bq2430x/1x/8x and bq24080 devices. This user's guide presents
test summary information, printed-circuit board layout guidelines, bill of materials, board layout, and
schematics.
1
2
3
4
Contents
Introduction ...................................................................................................................
Test Summary ................................................................................................................
PCB Layout Guideline .......................................................................................................
Bill of Materials, Board Layout, and Schematics ........................................................................
1
Original Test Setup for HPA245 (bq2430x/1x/8x DSG EVM) .......................................................... 4
2
Charger IC Test Setup for HPA245 (bq2430x/1x/8x DSG EVM) ...................................................... 6
3
Chipset Test Setup for HPA245 (bq2430x/1x/8x DSG EVM) .......................................................... 6
4
Top Layer
5
Bottom Layer................................................................................................................ 10
6
Top Silkscreen .............................................................................................................. 10
7
Top Assembly ............................................................................................................... 11
1
3
7
8
List of Figures
1
Introduction
1.1
EVM Features
•
•
•
•
•
•
•
•
•
•
•
•
...................................................................................................................
10
Evaluation module for bq2430x, bq2431x, and bq2438x DSG
Evaluation module for bq24080 charger integrated circuit (IC)
Evaluation module for bq2430x/1x/8x and bq24080 chipset solution
Input operating range for bq2430x/1x/8x 4.5 V–26 V
Input operating range for bq24080 4.5 V–6.5 V
Input overvoltage protection
Input overcurrent protection
Battery overvoltage protection
Input reverse voltage protection for bq2430x
LED indication for status signals
Test points for key signals available for testing purpose. Easy probe hook-up
Jumpers available. Easy to change connections
SLUU291B – August 2007 – Revised November 2016
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1
Introduction
1.2
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General Description
The bq2430x/1x/8x evaluation module is a complete charger module for evaluating a charger front-end
protection and charger solution using the bq2430x/1x/8x and bq24080 devices. It is designed to deliver up
to 200 mA (bq2430x) or 700 mA (bq2431x/8x) of charge current to Li-ion or Li-polymer applications. The
charger front-end protection current is designed to 300 mA (bq2430x) or 1000 mA (bq2431x) or no limit
(bq2438x).
The bq2430x/1x8x protects the charging system against three types of failures: input overvoltage when
the AC adapter fails to regulate its voltage; load overcurrent when failures such as a short-circuit occurs in
the charging system; and battery overcharge.
In addition, bq2430x provide a PFET gate drive signal to an external PFET for input reverse-polarity
protection.
For details, see the relevant bq2430x/1x/8x data sheet.
1.3
1.4
1.5
I/O Description
Jack
Description
J1-DC+
AC adapter, positive output
J1-DC–
AC adapter, negative output, ground
J2-OUT
CFE OUT pin
J2-DC–
CFE VSS pin, ground
J2-BAT+
Connect to battery positive output
J2-FAULT
CFE FAULT pin
J3-CHGIN
bq24080 IN pin, connect to external power supply positive output
J3-DC–
bq24080 VSS pin, ground
J4-BAT+
Connect to battery positive output
J4-BAT–
Connect to battery negative output, ground
Controls and Key Parameters Setting
Jack
Description
Factory Setting
JMP1
CFE input voltage is indicated by LED.
Jumper On
JMP2
CFE output voltage is indicated by LED.
Jumper On
JMP3
CFE CE pin is connected to 5 V.
Jumper On
JMP4
bq24080 STAT1 pin is indicated by LED.
Jumper On
JMP5
bq24080 STAT2 pin is indicated by LED.
Jumper On
JMP6
bq24080 PG pin is indicated by LED
Jumper On
JMP7
bq24080 CE pin is connected to 5 V.
Jumper On
JMP8
CFE OUT pin is connected to bq24080 IN pin.
Jumper Off
Recommended Operating Conditions
Symbol
Description
Min
Supply voltage, VIN
Input voltage from ac adapter input
Battery voltage, VBAT
Voltage applied at VBAT terminal of J4
Supply current, IAC
Maximum input current from ac adapter
input
0
Charge current, Ichrg
Battery charge current
Max
4.5
5
26
V
0
3-4.2
5
V
1.5
A
0.02–0.07 0.2–0.7
Operating junction
temperature range, TJ
2
Typ
0
bq2430x/1x/8x DSG EVM (HPA245) for Li+ Charger Front-End Protection IC
Unit
1
A
125
°C
Notes
SLUU291B – August 2007 – Revised November 2016
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Test Summary
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2
Test Summary
2.1
Definitions
This procedure details how to configure the evaluation board. On the test procedure, the following naming
conventions are followed. See
the schematic for details.
VXXX :
LOADW:
V(TPyyy) :
V(Jxx):
V[TP(XXXXX)]:
V(XXX, YYY):
I[JXX(YYY)]:
Jxx(BBB):
Jxx ON :
Jxx OFF:
Jxx (-YY-) ON:
Measure:
Observe:
External voltage supply name (VIN, VBAT, VOUT)
External load name (LOADR, LOADI)
Voltage at internal test point TPyyy. For example, V(TP1) means the voltage at TP1.
Voltage at jack terminal Jxx.
Voltage at test point XXXXX. For example, V(ACDET) means the voltage at the test
point which is marked as ACDET.
Voltage across point XXX and YYY.
Current going out from the YYY terminal of jack XX.
Terminal or pin BBB of jack xx
Internal jumper Jxx terminals are shorted
Internal jumper Jxx terminals are open
Internal jumper Jxx adjacent terminals marked as YY are shorted
A,B Check specified parameters A, B. If measured values are not within specified
limits, the unit under test has failed.
A,B Observe if A, B occur. If they do not occur, the unit under test has failed.
Assembly drawings have location for jumpers, test points, and individual components.
2.2
2.2.1
Equipment
Power Supplies
Power Supply #1 (PS#1): a power supply capable of supplying 20 V at 2 A is required.
Power Supply #2 (PS#2): a power supply capable of supplying 5 V at 1 A is required.
2.2.2
Load #1
A 10-V (or above), 2-A (or above) electronic load that can operate at constant current mode.
2.2.3
Load #2
A 10-V (or above), 2-A (or above) electronic load that can operate at constant voltage mode.
2.2.4
Meters
Four Fluke 75 multimeters, (equivalent or better)
Or: Three equivalent voltage meters and one equivalent current meter. The current meters must be
capable of measuring 2-A+ current.
2.2.5
Wire Gauge
All wires connected to EVM input power supply and output load should use at least AWG 22. The
maximum current is up to 1 A.
2.3
Equipment Setup
(A) Set the power supply #1 for 0 V ± 100 mVDC, 2 ± 0.1-A current limit and then disable the output.
(B) Connect the output of power supply #1 to J1 (DC+, DC–)
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Test Summary
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(C) Connect a voltage meter across J1 (DC+, DC–).
(D) Set the power supply #2 for 3.7 V ± 100 mVDC, 0.2 ± 0.1-A current limit and then disable the output.
(E) Connect power supply #2 to J2 (BAT+, DC–).
(F) Connect a voltage meter across J2 (BAT+, DC–).
(G) Connect the output of the Load #1 in series with a current meter (multimeter) to J2 (OUT, DC–).
Ensure that a voltage meter is connected across J2 (OUT, DC–). Turn on the power of the Load #1.
Set the load current to 0.2 A ±50 mA but disable the output.
(H) JMP1: ON, JMP2: ON, JMP3: ON, JMP4: ON, JMP5: ON, JMP6: ON, JMP7: ON, JMP8: OFF.
After the preceding steps, the test setup for HPA245 (bq2430x/1x/8x DSG EVM) is shown in Figure 1.
Power
V
Supply #2
Load
V
#1
I
FAULT
BAT+
DCOUT
DCCHG IN
J3
J2
JMP8
JMP1 JMP2 JMP3 JMP4 JMP5 JMP6 JMP7
J1
Power
Supply #1
V
J4
DC+
U1
U2
BAT+
BAT-
DC-
APPLICATION CIRCUIT
HPA245 BQ2430x/1x/8x DSG EVM
Figure 1. Original Test Setup for HPA245 (bq2430x/1x/8x DSG EVM)
2.4
2.4.1
Procedure
CFE ENABLE and Voltage Regulation
Ensure that the preceding Equipment Setup steps are followed.
Enable output of PS#2.
Enable output of PS#1.
(For HPA245-001, -002, -003, -004, -009, -010, -013 only) Increase the output voltage of PS#1 to 6
V± 0.1 V.
Measure → V(J2(OUT)) = 0 V ± 500 mV
Observe → D2 on, D3 off.
5. (For HPA245-005, -006, -007, -008, -011, -012 only) Increase the output voltage of PS#1 to 5 V ± 0.1
V.
Measure → V(J2(OUT)) = 0 V ± 500 mV
Observe → D2 on, D3 off.
6. Uninstall JMP3 (enable U1).
Measure → V(J2(OUT)) = 5.5 V ± 200 mV (For HPA245-001, -002, -009 only)
Measure → V(J2(OUT)) = 4.5 V ± 200 mV (For HPA245-003 only)
Measure → V(J2(OUT)) = 5 V ± 200 mV (For HPA245-004, -005, -006, -007, -008, -010, -011, 012, 1.
2.
3.
4.
4
bq2430x/1x/8x DSG EVM (HPA245) for Li+ Charger Front-End Protection IC
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013 only)
Observe → D2 on, D3 on.
2.4.2
CFE Input Overvoltage Protection
1. (For HPA245-001, -002, -003, -004, -013 only) Increase the voltage of PS#1 to 11V ±0.1V
Measure → V(J2(OUT)) = 0 V ± 500 mV
Observe → D2 on, D3 off.
2. (For HPA245-005, -006, -007, -008, -009, -010, -011, -012 only) Increase the voltage of PS#1 to 8 V
±0.1 V.
Measure → V(J2(OUT)) = 0 V ± 500 mV
Observe → D2 on, D3 off.
3. Decrease the voltage of PS#1 to 5 V ±0.1 V.
Observe → D2 on, D3 on
2.4.3
CFE Load Overcurrent Protection
(For HPA245-009, -010, skip 2.4.3 test and go to 2.4.4 test.)
Enable the output of the Load #1.
Observe → D2 on, D3 on.
(For HPA245-001, -002, -003, -004, -013 only) Increase the current of Load #1 to 0.5A ±0.1A
Observe → D2 on, D3 off.
(For HPA245-005, -006, -007, -008, -011, -012 only) Increase the current of Load #1 to 1.2 A ±0.1 A.
Observe → D2 on, D3 off.
Turn off Load #1.
Decrease the voltage of PS#1 to 0 V ±0.1 V.
1.
2.
3.
4.
5.
6.
2.4.4
CFE Battery Overvoltage Protection
1. Increase the output voltage of PS#1 to 5 V ±0.1V.
Observe → D2 on, D3 on
2. Increase the voltage of PS #2 to 4.6 V ±0.1V.
Observe → D2 on, D3 off.
3. Decrease the voltage of PS #2 to 3.7 V ±0.1V.
Observe → D2 on, D3 on.
4. Turn off all the power supplies and loads. Remove all connection between test board and power
supplies or loads.
2.4.5
1.
2.
3.
4.
5.
6.
7.
Charge IC Test Setup
Set the power supply #1 for 0 V ±100 mVDC, 2-A ±0.1-A current limit and then disable the output.
Connect the output of power supply #1 to J3 (CHG IN, DC–).
Connect a voltage meter across J3 (CHG IN, DC–).
Set the voltage of Load #2 to 3.6 V ±0.1 V, disable output of Load #2.
Connect output of the Load #2 in series with a current meter (multimeter) to J4 (BAT+, BAT–). Ensure
that a voltage meter is connected across J4 (BAT+, BAT–).
JMP1: ON, JMP2: ON, JMP3: ON, JMP4: ON, JMP5: ON, JMP6: ON, JMP7: ON, JMP8: OFF
After the preceding steps, the test setup for HPA245 (bq2430x/1x/8x DSG EVM) is shown in Figure 2.
SLUU291B – August 2007 – Revised November 2016
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Test Summary
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Power
Supply #1
V
FAULT
BAT+
DCOUT
DCCHG IN
J3
J2
JMP8
JMP1 JMP2 JMP3 JMP4 JMP5 JMP6 JMP7
J1
J4
U1
DC+
U2
BAT+
V
Ibat
I
BAT-
DC-
Load
#2
APPLICATION CIRCUIT
HPA245 BQ2430x/1x/8x DSG EVM
Figure 2. Charger IC Test Setup for HPA245 (bq2430x/1x/8x DSG EVM)
2.4.6
Charge IC Test
1. Enable output of Load #2
2. Enable output of PS#1
3. Increase the voltage of PS #1 to 5 V ±0.1 V.
Observe → D4 off, D5 off, D6 on.
4. Uninstall JMP7 (enable U2).
Measure → Ibat = 200 mA ±20 mA (For HPA245-001, -002, -003, -004, -013 only).
Measure → Ibat = 700 mA ±70 mA (For HPA245-005, -006, -007, -008, -009, -010, -011, -012 only).
Observe → D4 on, D5 off, D6 on.
5. Disable the output of Load #2.
6. Disable the output of PS#1 and remove PS #1 from J3
2.4.7
1.
2.
3.
4.
CFE and Charge IC Chipset Test Setup
Connect the output of power supply #1 to J1 (DC+, DC–).
Connect a voltage meter across J1 (DC+, DC–).
JMP1: ON, JMP2: ON, JMP3: OFF, JMP4: ON, JMP5: ON, JMP6: ON, JMP7: OFF, JMP8: ON.
After the preceding steps, the test setup for HPA245 (bq2430x/1x/8x DSG EVM) is shown in Figure 3.
FAULT
BAT+
DCOUT
DCCHG IN
J3
J2
JMP8
JMP1 JMP2 JMP3 JMP4 JMP5 JMP6 JMP7
Power
Supply #1
J1
V
DC+
U1
U2
BAT+
V
Ibat
I
BAT-
DC-
Load
#2
APPLICATION CIRCUIT
HPA245 BQ2430x/1x/8x DSG EVM
Figure 3. Chipset Test Setup for HPA245 (bq2430x/1x/8x DSG EVM)
2.4.8
CFE and Charge IC Chipset Test
1. Enable output of Load #2.
2. Enable output of PS#1.
Measure → Ibat = 200 mA ±20 mA (For HPA245-001, -002, -003, -004, -013 only).
6
bq2430x/1x/8x DSG EVM (HPA245) for Li+ Charger Front-End Protection IC
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PCB Layout Guideline
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Measure → Ibat = 700 mA ±70 mA (For HPA245-005, -006, -007, -008, -009, -010, -011, -012 only).
Observe → D2 on, D3 on, D4 on, D5 off, D6 on.
3
PCB Layout Guideline
1. It is critical that the exposed power pad on the backside of the bq2430x/1x/8x package be soldered to
the PCB ground. Ensure that sufficient thermal vias are right underneath the IC, connecting to the
ground plane on the other layers.
2. The high-current charge paths into IN and from OUT pins must be sized appropriately for the maximum
charge current in order to avoid voltage drops in these traces.
3. Decoupling capacitors for IN and OUT pins should be placed on the board and the interconnections to
the IC made as short as possible.
4. Resistors for ILIM and VLIM must be placed close to the corresponding IC pins and the
interconnections to the IC made as short as possible.
SLUU291B – August 2007 – Revised November 2016
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7
Bill of Materials, Board Layout, and Schematics
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4
Bill of Materials, Board Layout, and Schematics
4.1
Bill of Materials — bq24300/02/04/10/14/16
b
q
2
4
3
0
0
0
0
1
b
q
2
4
3
0
2
0
0
2
b
q
2
4
3
0
4
0
0
3
b
q
2
4
3
0
8
0
0
4
b
q
2
4
3
1
0
0
0
5
b
q
2
4
3
1
2
0
0
6
b
q
2
4
3
1
4
0
0
7
b
q
2
4
3
1
6
0
0
8
RefDes
Value
Description
Size
Part Number
MFR
1
1
1
1
0
0
0
0
C1
1 μF
Capacitor, Ceramic, 35-V, X7R, 10%
805
Std
Std
1
1
1
1
1
1
1
1
C2
1 μF
Capacitor, Ceramic, 35-V, X7R, 10%
805
Std
Std
3
3
3
3
3
3
3
3
C3–C5
1 μF
Capacitor, Ceramic, 16-V, X7R, 10%
805
Std
Std
1
1
1
1
1
1
1
1
D1
BZT52C5V1S
Diode, Zener, 200mW, 5.1V
SOD-323
BZT52C5V1S
General
4
4
4
4
4
4
4
4
D2, D3, D5,
D6
LTSTC190GKT
Diode, LED, Green, 2.1-V, 20-mA, 6mcd
603
LTSTC190GKT
Liteon
1
1
1
1
1
1
1
1
D4
LTSTC190CKT
Diode, LED, Red, 1.8-V, 20-mA, 20mcd
603
LTSTC190CKT
Liteon
3
3
3
3
3
3
3
3
J1–J4
ED1514
Terminal Block, 2-pin, 6-A, 3,5mm
0.27 x 0.25 in
ED1514
OST
1
1
1
1
1
1
1
1
J2
ED1516
Terminal Block, 4-pin, 6-A, 3,5mm
0.55 x 0.25 in
ED1516
OST
8
8
8
8
8
8
8
8
JMP1–JMP8
PTC36SAAN
Header, 2-pin, 100mil spacing, (36-pin
strip)
0.100 in x 2
PTC36SAAN
Sullins
8
8
8
8
8
8
8
8
JMP1–JMP8
929950-00
Shorting jumpers, 2-pin, 100mil spacing
929950-00
3M/ESD
1
1
1
1
0
0
0
0
Q1
Si2343DS
MOSFET, Pch, –30 V, 4 A, 53 mΩ
SOT23
Si2343DS
Vishay
1
1
1
1
0
0
0
0
R1
100k
Resistor, Chip, 1/16W, 5%
603
Std
Std
0
0
0
0
1
1
1
1
R2
0
Resistor, Chip, 1/8W, 5%
1206
Std
Std
1
1
1
1
1
1
1
1
R3
20k
Resistor, Chip, 1/16W, 5%
603
Std
Std
0
0
0
1
0
0
0
0
R4
113k
Resistor, Chip, 1/16W, 1%
603
Std
Std
0
0
0
0
1
1
1
1
R5
24.9k
Resistor, Chip, 1/16W, 1%
603
Std
Std
1
0
1
1
1
1
1
1
R6
100k
Resistor, Chip, 1/16W, 5%
603
Std
Std
1
1
1
1
1
1
1
1
R7
6.2k
Resistor, Chip, 1/16-W, 5%
603
Std
Std
1
1
1
1
1
1
1
1
R9
20k
Resistor, Chip, 1/16-W, 5%
603
Std
Std
5
5
5
5
5
5
5
5
R8, R11–R14
1.5k
Resistor, Chip, 1/16-W, 5%
603
Std
Std
0
0
0
0
1
1
1
1
R10
1.13k
Resistor, Chip, 1/16-W, 1%
603
Std
Std
1
1
1
1
0
0
0
0
R10
4.02k
Resistor, Chip, 1/16-W, 1%
603
Std
Std
0
0
0
0
1
1
0
0
R15
137k
Resistor, Chip, 1/16-W, 1%
603
Std
Std
0
0
0
0
1
1
1
1
R16
100k
Resistor, Chip, 1/16-W, 5%
603
Std
Std
1
0
0
0
0
0
0
0
U1
bq24300DSG
IC, Li+ Charger Front-End Protection
DSG8
bq24300DSG
TI
0
1
0
0
0
0
0
0
U1
bq24302DSG
IC, Li+ Charger Front-End Protection
DSG8
bq24302DSG
TI
0
0
1
0
0
0
0
0
U1
bq24304DSG
IC, Li+ Charger Front-End Protection
DSG8
bq24304DSG
TI
0
0
0
1
0
0
0
0
U1
bq24308DSG
IC, Li+ Charger Front-End Protection
DSG8
bq24308DSG
TI
0
0
0
0
1
0
0
0
U1
bq24310DSG
IC, Li+ Charger Front-End Protection
DSG8
bq24310DSG
TI
0
0
0
0
0
1
0
0
U1
bq24312DSG
IC, Li+ Charger Front-End Protection
DSG8
bq24312DSG
TI
0
0
0
0
0
0
1
0
U1
bq24314DSG
IC, Li+ Charger Front-End Protection
DSG8
bq24314DSG
TI
0
0
0
0
0
0
0
1
U1
bq24316DSG
IC, Li+ Charger Front-End Protection
DSG8
bq24316DSG
TI
1
1
1
1
1
1
1
1
U2
bq24080DRC
IC, Single Chip, Li Ion/Li POL, Charger
DRC10
bq24080DRC
TI
1
1
1
1
1
1
1
1
—
HPA245
PCB, 1.2 In x 3 In x 0.031 In
PCB
Any
Notes:
1.
2.
3.
4.
Number 0 in left side columns means do not use this component.
OPEN in value column means do not use this component.
Std in part number column means standard manufacturer’s part number
Std in MFR column means standard manufacturer
4.2
Bill of Materials — bq24380/1/14A/15/05
8
bq2430x/1x/8x DSG EVM (HPA245) for Li+ Charger Front-End Protection IC
SLUU291B – August 2007 – Revised November 2016
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Copyright © 2007–2016, Texas Instruments Incorporated
Bill of Materials, Board Layout, and Schematics
www.ti.com
b
q
2
4
3
8
0
0
0
9
b
q
2
4
3
8
1
0
1
0
b
q
2
4
3
1
4
A
0
1
1
b
q
2
4
3
1
5
0
1
2
b
q
2
4
3
0
5
0
1
3
RefDes
Value
Description
Size
Part Number
MFR
0
0
0
0
1
C1
1 μF
Capacitor, Ceramic, 35-V, X7R, 10%
805
Std
Std
1
1
1
1
1
C2
1 μF
Capacitor, Ceramic, 35-V, X7R, 10%
805
Std
Std
3
3
3
3
3
C3–C5
1 μF
Capacitor, Ceramic, 16-V, X7R, 5%
805
Std
Std
1
1
1
1
1
D1
BZT52C5V1S
Diode, Zener, 200mW, 5.1V
SOD-323
BZT52C5V1S
General
4
4
4
4
4
D2,D3,D5,D6
LTST-C190GKT
Diode, LED, Green, 2.1-V, 20-mA, 6-mcd
603
LTST-C190GKT
Liteon
1
1
1
1
1
D4
LTST-C190CKT
Diode, LED, Red, 1.8-V, 20-mA, 20-mcd
603
LTST-C190CKT
Liteon
3
3
3
3
3
J1, J3, J4
ED1514
Terminal Block, 2-pin, 6-A, 3.5mm
0.27 × 0.25 inch
ED1514
OST
1
1
1
1
1
J2
ED1516
Terminal Block, 4-pin, 6-A, 3.5mm
0.55 × 0.25 inch
ED1516
OST
8
8
8
8
8
JMP1–JMP8
PTC36SAAN
Header, 2-pin, 100mil spacing, (36-pin strip)
0.100 inch × 2
PTC36SAAN
Sullins
8
8
8
8
8
JMP1–JMP8
929950-00
Shorting jumpers, 2-pin, 100mil spacing
929950-00
3M/ESD
0
0
0
0
1
Q1
Si2343DS
MOSFET, Pch, –30 V, 4 A, 53 mΩ
SOT23
Si2343DS
Vishay
0
0
0
0
1
R1
100k
Resistor, Chip, 1/16W, 5%
603
Std
Std
1
1
1
1
0
R2
0
Resistor, Chip, 1/16W, 5%
1206
Std
Std
1
1
1
1
1
R3
20k
Resistor, Chip, 1/16W, 5%
603
Std
Std
0
0
0
0
0
R4
113k
Resistor, Chip, 1/16W, 1%
603
Std
Std
0
0
1
1
0
R5
24.9k
Resistor, Chip, 1/16W, 1%
603
Std
Std
1
1
1
1
1
R6
100k
Resistor, Chip, 1/16W, 5%
603
Std
Std
1
1
1
1
1
R7
6.2k
Resistor, Chip, 1/16W, 5%
603
Std
Std
1
1
1
1
1
R9
20k
Resistor, Chip, 1/16W, 5%
603
Std
Std
5
5
5
5
5
R8, R11–R14
1.5k
Resistor, Chip, 1/16W, 5%
603
Std
Std
1
1
1
1
0
R10
1.13k
Resistor, Chip, 1/16W, 1%
603
Std
Std
0
0
0
0
1
R10
4.02k
Resistor, Chip, 1/16W, 1%
603
Std
Std
0
0
0
0
0
R15
137k
Resistor, Chip, 1/16W, 5%
603
Std
Std
1
1
1
1
0
R16
100k
Resistor, Chip, 1/16W, 5%
603
Std
Std
1
0
0
0
0
U1
BQ24380DSG
IC, Li+ Charger Front-End Protection
DSG8
BQ24380DSG
TI
0
1
0
0
0
U1
BQ24381DSG
IC, Li+ Charger Front-End Protection
DSG8
BQ24381DSG
TI
0
0
1
0
0
U1
BQ24314ADSG
IC, Li+ Charger Front-End Protection
DSG8
BQ24314ADSG
TI
0
0
0
1
0
U1
BQ24315DSG
IC, Li+ Charger Front-End Protection
DSG8
BQ24315DSG
TI
0
0
0
0
1
U1
BQ24305DSG
IC, Li+ Charger Front-End Protection
DSG8
BQ24305DSG
TI
1
1
1
1
1
—
HPA245
PCB, 1.2 In × 3 In × 0.031 In
PCB
Any
Notes:
1.
2.
3.
4.
Number 0 in left side columns means do not use this component.
OPEN in value column means do not use this component.
Std in part number column means standard manufacturer’s part number
Std in MFR column means standard manufacturer .
SLUU291B – August 2007 – Revised November 2016
Submit Documentation Feedback
bq2430x/1x/8x DSG EVM (HPA245) for Li+ Charger Front-End Protection IC
Copyright © 2007–2016, Texas Instruments Incorporated
9
Bill of Materials, Board Layout, and Schematics
4.3
www.ti.com
Board Layout
Figure 4. Top Layer
Figure 5. Bottom Layer
Figure 6. Top Silkscreen
10
bq2430x/1x/8x DSG EVM (HPA245) for Li+ Charger Front-End Protection IC
SLUU291B – August 2007 – Revised November 2016
Submit Documentation Feedback
Copyright © 2007–2016, Texas Instruments Incorporated
Bill of Materials, Board Layout, and Schematics
www.ti.com
Figure 7. Top Assembly
4.4
Schematics
The bq2430x/1x/8x DSG EVM schematic follows.
SLUU291B – August 2007 – Revised November 2016
Submit Documentation Feedback
bq2430x/1x/8x DSG EVM (HPA245) for Li+ Charger Front-End Protection IC
Copyright © 2007–2016, Texas Instruments Incorporated
11
Revision History
www.ti.com
Copyright © 2016, Texas Instruments Incorporated
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from A Revision (April 2008) to B Revision .................................................................................................... Page
•
12
Changed pin name for pin 3 in the IC pin names when U1 is: table of the schematics for the bq24312 from 'VLIM' to
'NC'......................................................................................................................................... 12
Revision History
SLUU291B – August 2007 – Revised November 2016
Submit Documentation Feedback
Copyright © 2007–2016, Texas Instruments Incorporated
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including demonstration software, components, and/or documentation
which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms
and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
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