Si5316 - Silicon Labs
S i53 1 6
PRECISION CLOCK JITTER ATTENUATOR
Features





Fixed frequency jitter attenuator
with selectable clock ranges at
19, 38, 77, 155, 311, and
622 MHz (710 MHz max)
Support for SONET, 10GbE,
10GFC, and corresponding FEC
rates
Ultra-low jitter clock output with
jitter generation as low as
0.3 psRMS (50 kHz–80 MHz)
Integrated loop filter with
selectable loop bandwidth
(100 Hz–7.9 kHz)
Meets OC-192 GR-253-CORE
jitter specifications








Dual clock inputs with integrated
clock select mux
One clock input can be 1x, 4x, or
32x the frequency of the second
clock input
Single clock output with
selectable signal format:
LVPECL, LVDS, CML, CMOS
LOL, LOS alarm outputs
Pin programmable settings
On-chip voltage regulator for 1.8
±5%, 2.5 ±10%, or 3.3 V ±10%
operation
Small size (6 x 6 mm 36-lead
QFN)
Pb-free, RoHS compliant
Ordering Information:
See page 20.
Pin Assignments
Si5316
Applications



Optical modules
SONET/SDH OC-48/OC-192/
STM-16/STM-64 line cards
10GbE, 10GFC line cards




ITU G.709 line cards
Wireless basestations
Test and measurement
Synchronous Ethernet
Description
The Si5316 is a low jitter, precision jitter attenuator for high-speed
communication systems, including OC-48, OC-192, 10G Ethernet, and
10G Fibre Channel. The Si5316 accepts dual clock inputs in the 19, 38,
77, 155, 311, or 622 MHz frequency range and generates a jitterattenuated clock output at the same frequency. Within each of these clock
ranges, the device can be tuned approximately 15% higher than nominal
SONET/SDH frequencies, up to a maximum of 710 MHz in the 622 MHz
range. The Si5316 is based on Silicon Laboratories' 3rd-generation
DSPLL® technology, which provides any-frequency synthesis and jitter
attenuation in a highly integrated PLL solution that eliminates the need for
external VCXO and loop filter components. The DSPLL loop bandwidth is
digitally programmable, providing jitter performance optimization at the
application level. Operating from a single 1.8, 2.5, or 3.3 V supply, the
Si5316 is ideal for providing jitter attenuation in high performance timing
applications.
Rev. 1.0 7/12
Copyright © 2012 by Silicon Laboratories
Patents pending
Si5316
Si5 316
Functional Block Diagram
2
Rev. 1.0
Si5316
TA B L E O F C O N T E N T S
Section
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Typical Phase Noise Plot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
2.1. Example: SONET OC-192 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
3. Typical Applications Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
4.1. External Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
4.2. Further Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
5. Pin Descriptions: Si5316 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
6. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
7. Package Outline: 36-Lead QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
8. Recommended PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
9. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
9.1. Si5316 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
9.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Rev. 1.0
3
Si5 316
1. Electrical Specifications
Table 1. Recommended Operating Conditions
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 ºC)
Parameter
Temperature Range
Supply Voltage
Symbol
Test Condition
Min
Typ
Max
Unit
–40
25
85
ºC
3.3 V nominal
2.97
3.3
3.63
V
2.5 V nominal
2.25
2.5
2.75
V
1.8 V nominal
1.71
1.8
1.89
V
TA
VDD
Note: All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.
Typical values apply at nominal supply voltages and an operating temperature of 25 °C unless otherwise noted.
Table 2. DC Characteristics
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 ºC)
Parameter
Symbol
Test Condition
Min
Typ
Max
Units
Supply Current
(Supply current is independent of VDD)
IDD
LVPECL Format
622.08 MHz Out
—
217
243
mA
CMOS Format
19.44 MHz Out
—
194
220
mA
1.8 V ±5%
0.9
—
1.4
V
2.5 V ±10%
1.0
—
1.7
V
3.3 V ±10%
1.1
—
1.95
V
Single-ended
20
40
60
k
0
—
VDD
V
fCKIN < 212.5 MHz
See Figure 6.
0.2
—
—
VPP
fCKIN > 212.5 MHz
See Figure 6.
0.25
—
—
VPP
fCKIN < 212.5 MHz
See Figure 6.
0.2
—
—
VPP
fCKIN > 212.5 MHz
See Figure 6.
0.25
—
—
VPP
CKIN Input Pins
Input Common Mode
Voltage
(Input Threshold Voltage)
Input Resistance
Input Voltage Level Limits
Single-ended Input Voltage
Swing
Differential Input
Voltage Swing
VICM
CKNRIN
CKNVIN
VISE
VID
See note
2
Notes:
1. LVPECL outputs require nominal VDD > 2.5 V.
2. No overshoot or undershoot.
3. This is the amount of leakage that the 3L inputs can tolerate from an external driver. See Figure 3 on page 10. In most
designs, an external resistor voltage divider is recommended.
4
Rev. 1.0
Si5316
Table 2. DC Characteristics (Continued)
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 ºC)
Parameter
Symbol
Test Condition
Min
Typ
Max
Units
CKOVCM
LVPECL 100  load
line-to-line
VDD –
1.42
—
VDD –
1.25
V
Differential Output Swing
CKOVD
LVPECL 100  load
line-to-line
1.1
—
1.9
VPP
Single-ended Output Swing
CKOVSE
LVPECL 100  load
line-to-line
0.5
—
0.93
VPP
Differential Output Voltage
CKOVD
CML 100  load
line-to-line
350
425
500
mVPP
Common Mode
Output Voltage
CKOVCM
CML 100  load
line-to-line
—
VDD –
0.36
—
V
Differential
Output Voltage
CKOVD
LVDS 100  load
line-to-line
500
700
900
mVPP
Low swing LVDS 100  load
line-to-line
350
425
500
mVPP
CKOVCM
LVDS 100  load
line-to-line
1.125
1.2
1.275
V
CKORD
CML, LVDS, LVPECL
—
200
—

Output Voltage Low
CKOVOLLH
CMOS
—
—
0.4
V
Output Voltage High
CKOVOHLH
VDD = 1.71 V
CMOS
0.8 x VDD
—
—
V
Output Drive Current
CKOIO
CMOS
Driving into CKOVOL for output low or CKOVOH for output
high. CKOUT+ and CKOUT–
shorted externally.
VDD = 1.8 V
—
7.5
—
mA
VDD = 3.3 V
—
32
—
mA
Output Clock (CKOUT)1
Common Mode
Common Mode
Output Voltage
Differential Output
Resistance
Notes:
1. LVPECL outputs require nominal VDD > 2.5 V.
2. No overshoot or undershoot.
3. This is the amount of leakage that the 3L inputs can tolerate from an external driver. See Figure 3 on page 10. In most
designs, an external resistor voltage divider is recommended.
Rev. 1.0
5
Si5 316
Table 2. DC Characteristics (Continued)
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 ºC)
Parameter
Symbol
Test Condition
Min
Typ
Max
Units
VIL
VDD = 1.71 V
—
—
0.5
V
VDD = 2.25 V
—
—
0.7
V
VDD = 2.97 V
—
—
0.8
V
VDD = 1.89 V
1.4
—
—
V
VDD = 2.25 V
1.8
—
—
V
VDD = 3.63 V
2.5
—
—
V
2-Level LVCMOS Input Pins
Input Voltage Low
Input Voltage High
VIH
Input Low Current
IIL
—
—
50
μA
Input High Current
IIH
—
—
50
μA
Weak Internal Input Pull-up
Resistor
RPUP
—
75
—
k
Weak Internal Input
Pull-down Resistor
RPDN
—
75
—
k
Input Voltage Low
VILL
—
—
0.15 x VDD
V
Input Voltage Mid
VIMM
0.45 x VDD
—
0.55 x VDD
V
Input Voltage High
VIHH
0.85 x VDD
—
—
V
Input Low Current
IILL3
–20
—
—
μA
Input Mid Current
IIMM3
IIHH3
–2
—
2
μA
—
—
20
μA
3-Level Input Pins
Input High Current
Notes:
1. LVPECL outputs require nominal VDD > 2.5 V.
2. No overshoot or undershoot.
3. This is the amount of leakage that the 3L inputs can tolerate from an external driver. See Figure 3 on page 10. In most
designs, an external resistor voltage divider is recommended.
6
Rev. 1.0
Si5316
Table 2. DC Characteristics (Continued)
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 ºC)
Parameter
Symbol
Test Condition
Min
Typ
Max
Units
VOL
IO = 2 mA
VDD = 1.71 V
—
—
0.4
V
IO = 2 mA
VDD = 2.97 V
—
—
0.4
V
IO = –2 mA
VDD = 1.71 V
VDD – 0.4
—
—
V
IO = –2 mA
VDD = 2.97 V
VDD – 0.4
—
—
V
RST = 0
–100
—
100
μA
—
12
—
k
0
—
1.2
V
0.5
—
1.2
VPP
—
12
—
k
0
—
1.2
V
0.5
—
2.4
VPP
LVCMOS Output Pins
Output Voltage Low
Output Voltage High
Disabled Leakage Current
VOH
IOZ
Single-Ended Reference Clock Input Pin XA (XB with cap to gnd)
Input Resistance
XARIN
Input Voltage Level Limits
XAVIN
Input Voltage Swing
XAVPP
XTAL/RefCLK
RATE[1:0] = LM, ML, MH, or
HM
Differential Reference Clock Input Pins (XA/XB)
Input Resistance
XA/XBRIN
Differential Input Voltage
Level Limits
XA/XBVIN
Input Voltage Swing
XTAL/RefCLK
RATE[1:0] = LM, ML, MH, or
HM
XAVPP/XBVPP
Notes:
1. LVPECL outputs require nominal VDD > 2.5 V.
2. No overshoot or undershoot.
3. This is the amount of leakage that the 3L inputs can tolerate from an external driver. See Figure 3 on page 10. In most
designs, an external resistor voltage divider is recommended.
Figure 1. Voltage Characteristics
Rev. 1.0
7
Si5 316
Table 3. AC Characteristics
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 ºC)
Parameter
Symbol
Test Condition
Min
Typ
Max
Units
CKF
FRQSEL[1:0] = LL
FRQSEL[1:0] = LM
FRQSEL[1:0] = LH
FRQSEL[1:0] = ML
FRQSEL[1:0] = MM
FRQSEL[1:0] = MH
19.38
38.75
77.5
155.0
310.0
620.0
—
—
—
—
—
—
22.28
44.56
89.13
178.25
356.5
710.0
MHz
Whichever is smaller
(i.e., the 40%/60% limitation applies only to high
clock
frequencies)
40
—
60
%
2
—
—
ns
—
—
3
pF
—
—
11
ns
—
—
212.5
MHz
CMOS Output
VDD = 1.71
Cload = 5 pF
—
—
8
ns
CMOS Output
VDD = 2.97
Cload = 5 pF
—
—
2
ns
CKIN Input Pins
Input/Output Clock Frequency
(CKIN1, CKIN2, CKOUT)
Input Duty Cycle (Minimum Pulse
Width)
CKNDC
Input Capacitance
CKNCIN
Input Rise/Fall Time
CKNTRF
20–80%
See Figure 6
CKOUT Output Pins
Maximum Output Frequency in
CMOS Format
CKOFMC
Single-ended Output Rise/Fall
(20–80%)
CKOTRF
Differential Output Rise/Fall Time
CKOTRF
20 to 80 %, fOUT = 622.08
—
230
350
ps
Output Duty Cycle Differential
Uncertainty
CKODC
100  Load
Line to Line
Measured at 50% Point
(not for CMOS)
—
—
±40
ps
tRSTMIN
1
—
—
μs
CIN
—
—
3
pF
—
25
—
ns
—
750
μs
LVCMOS Input Pins
Minimum Reset Pulse Width
Input Capacitance
LVCMOS Output Pins
Rise/Fall Times
LOSn Trigger Window
tRF
CLOAD = 20 pf
See Figure 6
LOSTRIG
From last CKIN to LOS
*Note: Input to output skew is not controlled and can assume any value.
8
Rev. 1.0
Si5316
Table 3. AC Characteristics (Continued)
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 ºC)
Parameter
Symbol
Time to Clear LOL after LOS Cleared tCLRLOL
Test Condition
Min
Typ
Max
Units
fin unchanged and XA/XB
stable.
LOS to  LOL
—
10
—
ms
PLL Performance
Lock Time
tLOCKHW
Whenever RST, FRQTBL,
RATE, BWSEL, or FRQSEL are changed, with valid
CKIN to LOL;
BW = 100 Hz
—
0.035
1.2
sec
Output Clock Phase Change
tP_STEP
After clock switch
f3  128 kHz
—
200
—
ps
—
0.05
0.1
dB
Closed Loop Jitter Peaking
JPK
Jitter Tolerance
Spurious Noise
Phase Change due to Temperature
Variation*
JTOL
BW determined by
BWSEL[1:0]
5000/
BW
—
—
ns pkpk
SPSPUR
Max spur @ n x f3
(n > 1, n x f3 < 100 MHz)
—
–93
–70
dBc
tTEMP
Max phase changes from –
40 to +85 ºC
—
300
500
ps
*Note: Input to output skew is not controlled and can assume any value.
Figure 2. Rise/Fall Time Characteristics
Rev. 1.0
9
Si5 316
Table 4. Three-Level Input Pins1,2,3,4
Parameter
Min
Max
Input Low Current
–30 μA
—
Input Mid Current
–11 μA
–11 μA
Input High Current
—
–30 μA
Notes:
1. The current parameters are the amount of leakage that the 3L inputs can tolerate from an external driver using the
external resistor values indicated in this example. In most designs, an external resistor voltage divider is
recommended.
2. Resistor packs are only needed if the leakage current of the external driver exceeds the current specified in Table 2.
Any resistor pack may be used (e.g., Panasonic EXB-D10C183J). PCB layout is not critical.
3. If a pin is tied to ground or VDD, no resistors are needed.
4. If a pin is left open (no connect), no resistors are needed.
Figure 3. Three-Level (3L) Input Pins (No External Resistors)
Figure 4. Three-Level Input Pins (Example with External Resistors)
10
Rev. 1.0
Si5316
Table 5. Performance Specifications1, 2, 3, 4, 5
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 ºC)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Jitter Generation
fIN = fOUT = 622.08 MHz,
LVPECL Output Format
BW = 120 Hz
JGEN
50 kHz–80 MHz
—
0.27
0.42
ps rms
12 kHz–20 MHz
—
0.25
0.41
ps rms
800 Hz–80 MHz
—
0.28
0.45
ps rms
Phase Noise
fIN = fOUT = 622.08 MHz
LVPECL Output Format
CKOPN
1 kHz offset
—
–106
—
dBc/Hz
10 kHz offset
—
–121
—
dBc/Hz
100 kHz offset
—
–122
—
dBc/Hz
1 MHz offset
—
–132
—
dBc/Hz
Notes:
1. BWSEL [1:0] loop bandwidth settings provided in “Si53xx-RM: Any-Frequency Precision Clocks Si53xx Family
Reference Manual.”
2. 114.285 MHz 3rd OT crystal used as XA/XB input.
3. VDD = 2.5 V
4. TA = 85 °C
5. Test condition: fIN = 622.08 MHz, fOUT = 622.08 MHz, LVPECL clock input: 1.19 Vppd with 0.5 ns rise/fall time
(20-80%), LVPECL clock output.
Table 6. Thermal Conditions
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 ºC)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Thermal Resistance
Junction to Ambient
JA
Still Air
—
32
—
ºC/W
Thermal Resistance
Junction to Case
JC
Still Air
—
14
—
ºC/W
Rev. 1.0
11
Si5 316
Table 7. Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
DC Supply Voltage
VDD
–0.5 to 3.8
V
LVCMOS Input Voltage
VDIG
–0.3 to (VDD + 0.3)
V
CKINn Voltage Level Limits
CKNVIN
0 to VDD
V
XA/XB Voltage Level Limits
XAVIN
0 to 1.2
V
Operating Junction Temperature
TJCT
–55 to 150
C
Storage Temperature Range
TSTG
–55 to 150
C
2
kV
ESD MM Tolerance; All pins except CKIN+/CKIN–
150
V
ESD HBM Tolerance (100 pF, 1.5 kΩ); CKIN+/CKIN–
750
V
ESD MM Tolerance; CKIN+/CKIN–
100
V
ESD HBM Tolerance (100 pF, 1.5 k);
All pins except CKIN+/CKIN–
Latch-Up Tolerance
JESD78 Compliant
Note: Permanent device damage may occur if the Absolute Maximum Ratings are exceeded. Functional operation should be
restricted to the conditions as specified in the operation sections of this data sheet. Exposure to absolute maximum
rating conditions for extended periods of time may affect device reliability.
12
Rev. 1.0
Si5316
2. Typical Phase Noise Plot
The following is the typical phase noise performance of the Si5316. The clock input source was a Rohde and
Schwarz model SML03 RF Generator. The phase noise analyzer was an Agilent model E5052B. The Si5316
operates at 3.3 V with an ac coupled differential PECL output and an ac coupled differential sine wave input from
the RF generator at 0 dBm. Note that, as with any PLL, the output jitter that is below the loop BW is caused by the
jitter at the input clock. The loop BW was 120 Hz.
2.1. Example: SONET OC-192
Figure 5. Typical Phase Noise Plot
Jitter Band
Jitter, RMS
SONET_OC48, 12 kHz to 20 MHz
250 fs
SONET_OC192_A, 20 kHz to 80 MHz
274 fs
SONET_OC192_B, 4 to 80 MHz
166 fs
SONET_OC192_C, 50 kHz to 80 MHz
267 fs
Brick Wall, 800 Hz to 80 MHz
274 fs
Note: SONET jitter bands include the SONET skirts. The phase noise plot is brick wall integration.
Rev. 1.0
13
Si5 316
3. Typical Applications Schematic
Figure 6. Si5316 Typical Application Circuit
14
Rev. 1.0
Si5316
4. Functional Description
4.1. External Reference
The Si5316 is a precision jitter attenuator for high-speed
communication systems, including OC-48/STM-16, OC192/STM-64, 10G Ethernet, and 10G Fibre Channel.
The Si5316 accepts dual clock inputs in the 19, 38, 77,
155, 311, or 622 MHz frequency range and generates a
jitter-attenuated clock output at the same frequency.
Within each of these clock ranges, the device can be
tuned approximately 15% higher than nominal SONET/
SDH frequencies, up to a maximum of 710 MHz in the
622 MHz range. The Si5316 is based on Silicon
Laboratories' 3rd-generation DSPLL® technology, which
provides any-frequency synthesis and jitter attenuation
in a highly integrated PLL solution that eliminates the
need for external VCXO and loop filter components. For
applications which require input clocks at different
frequencies, the frequency of CKIN1 can be 1x, 4x, or
32x the frequency of CKIN2 as specified by the CK1DIV
and CK2DIV inputs.
The Si5316 PLL loop bandwidth is selectable via the
BWSEL[1:0] pins and supports a range from 100 Hz to
7.9 kHz. To calculate potential loop bandwidth values
for a given input/output clock frequency, Silicon
Laboratories offers a PC-based software utility,
DSPLLsim, that calculates valid loop bandwidth settings
automatically. This utility can be downloaded from http://
www.silabs.com/timing.
The Si5316 supports manual active input clock
selection. The Si5316 monitors both input clocks for
loss-of-signal and provides a LOS alarm when it detects
missing pulses on either input clock. Hitless switching is
not supported by the Si5316. During a clock transition,
the phase of the output clock will slew at a rate defined
by the PLL loop bandwidth until the original input clock
phase to output clock phase is restored. The device
monitors the lock status of the PLL. The lock detect
algorithm works by continuously monitoring the phase
of the input clock in relation to the phase of the
feedback clock.
An external, 38.88 MHz clock or a low-cost
114.285 MHz 3rd overtone crystal is used as part of a
fixed-frequency oscillator within the DSPLL. This
external reference is required for the device to operate.
Silicon Laboratories recommends using a high quality
crystal. Specific recommendations may be found in the
Family Reference Manual. An external 38.88 MHz clock
from a high quality OCXO or TCXO can also be used as
a reference for the device.
In digital hold, the DSPLL remains locked to this
external reference. Any changes in the frequency of this
reference when the DSPLL is in digital hold will be
tracked by the output of the device. Note that crystals
can have temperature sensitivities.
4.2. Further Documentation
Consult the Silicon Laboratories Any-Frequency
Precision Clock Family Reference Manual (FRM) for
detailed information about the Si5316. Additional design
support is available from Silicon Laboratories through
your distributor.
Silicon Laboratories has developed a PC-based
software utility called DSPLLsim to simplify device
configuration, including frequency planning and loop
bandwidth selection. The FRM and this utility can be
downloaded from http://www.silabs.com/timing.
The Si5316 has one differential clock output. The
electrical format of the clock output is programmable to
support LVPECL, LVDS, CML, or CMOS loads. For
system-level debugging, a bypass mode is available
which drives the output clock directly from the input
clock, bypassing the internal DSPLL. The device is
powered by a single 1.8, 2.5, or 3.3 V supply.
Rev. 1.0
15
Si5 316
5. Pin Descriptions: Si5316
Table 8. Si5316 Pin Descriptions
Pin #
1
Pin Name
2, 9, 28,
29, 36
NC
3
C1B
O
4
C2B
O
5, 10, 32
VDD
VDD
RST
I/O
I
Signal Level
Description
LVCMOS External Reset.
Active low input that performs external hardware reset of device.
Resets all internal logic to a known state. Clock outputs are tristated
during reset. After rising edge of RST signal, the Si5316 will perform
an internal self-calibration when a valid signal is present.
This pin has a weak pull-up.
No Connection.
Leave floating. Make no external connection to this pin for normal
operation.
LVCMOS CKIN1 Loss of Signal.
Active high Loss-of-signal indicator for CKIN1. Once triggered, the
alarm will remain active until CKIN1 is validated.
0 = CKIN1 present
1 = LOS on CKIN1
LVCMOS CKIN2 Loss of Signal.
Active high Loss-of-signal indicator for CKIN2. Once triggered, the
alarm will remain active until CKIN2 is validated.
0 = CKIN2 present
1 = LOS on CKIN2
Supply
Supply.
The device operates from a 1.8, 2.5, or 3.3 V supply. Bypass capacitors should be associated with the following VDD pins:
5
0.1 μF
10
0.1 μF
32
0.1 μF
A 1.0 μF should also be placed as close to device as is practical.
*Note: Denotes 3-Level input pin with states designated as L (ground), M (VDD/2), and H (VDD).
16
Rev. 1.0
Si5316
Table 8. Si5316 Pin Descriptions (Continued)
Pin #
7
6
Pin Name
XB
XA
8, 19,
20, 31
GND
11
15
RATE0
RATE1
12
13
CKIN2+
CKIN2–
14
DBL_BY
16
17
CKIN1+
CKIN1–
18
LOL
I/O
I
Signal Level
Description
Analog
External Crystal or Reference Clock.
External crystal should be connected to these pins to use internal
oscillator based reference. Refer to Family Reference Manual for
interfacing to an external reference. External reference must be
from a high-quality clock source (TCXO, OCXO). Frequency of crystal or external clock is set by the RATE pins.
GND
Supply
Ground.
Must be connected to system ground. Minimize the ground path
impedance for optimal performance of this device. Grounding these
pins does not eliminate the requirement to ground the GND PAD on
the bottom of the package.
Pins 19 and 20 may be left NC.
I
3-Level*
External Crystal or Reference Clock Rate.
Three level inputs that select the type and rate of external crystal or
reference clock to be applied to the XA/XB port. Refer to the Family
Reference Manual for settings. These pins have both a weak pull-up
and a weak pull-down; they default to M. The "HH" setting is not
supported.
Some designs may require an external resistor voltage divider when
driven by an active device that will tri-state.
I
Multi
Clock Input 2.
Differential input clock. This input can also be driven with a singleended signal.
I
3-Level*
Output Disable/Bypass Mode Control.
Controls enable of CKOUT divider/output buffer path and PLL
bypass mode.
L = CKOUT enabled
M = CKOUT disabled
H = Bypass mode with CKOUT enabled
This pin has a weak pull-up and weak pull-down and defaults to M.
Some designs may require an external resistor voltage divider when
driven by an active device that will tri-state. Bypass mode is not supported for CMOS clock outputs.
I
Multi
Clock Input 1.
Differential input clock. This input can also be driven with a singleended signal.
O
LVCMOS PLL Loss of Lock Indicator.
This pin functions as the active high PLL loss of lock indicator.
0 = PLL locked
1 = PLL unlocked
*Note: Denotes 3-Level input pin with states designated as L (ground), M (VDD/2), and H (VDD).
Rev. 1.0
17
Si5 316
Table 8. Si5316 Pin Descriptions (Continued)
Pin #
21
Pin Name
CS
I/O
I
23
22
BWSEL1
BWSEL0
I
25
24
FRQSEL
1
FRQSEL
0
I
26
CK1DIV
I
27
CK2DIV
I
Signal Level
Description
LVCMOS Input Clock Select.
This pin functions as the input clock selector. This input is internally
deglitched to prevent inadvertent clock switching during changes in
the CKSEL input state.
0 = Select CKIN1
1 = Select CKIN2
Must be driven high or low.
3-Level*
Bandwidth Select.
Three level inputs that select the DSPLL closed loop bandwidth.
Detailed operations and timing characteristics for these pins may be
found in the Any-Frequency Precision Clock Family Reference Manual.
These pins are both pull-ups and pull-downs and default to M.
Some designs may require an external resistor voltage divider when
driven by an active device that will tri-state.
3-Level*
Frequency Select.
Sets the output frequency of the device. When the frequency of
CKIN1 is not equal to CKIN2, the lower frequency input clock must
be equal to the output clock frequency. These pins have both weak
pull-ups and weak pull-downs and default to M. For the pin settings,
see Table 3 on page 8.
Some designs may require an external resistor voltage divider when
driven by an active device that will tri-state.
3-Level*
Input Clock 1 Pre-Divider Select.
Pre-divider on CKIN1. Used with CK2DIV to divide input clock
frequencies to a common value.
L = CKIN1 input divider set to 1.
M = CKIN1 input divider set to 4.
H = CKIN1 input divider set to 32.
This pin has a weak pull-up and weak pull-down and defaults to M.
Some designs may require an external resistor voltage divider when
driven by an active device that will tri-state.
3-Level*
Input Clock 2 Pre-Divider Select.
Pre-divider on CKIN2. Used with CK1DIV to divide input clock
frequencies to a common value.
L = CKIN2 input divider set to 1.
M = CKIN2 input divider set to 4.
H = CKIN2 input divider set to 32.
This pin has a weak pull-up and weak pull-down and defaults to M.
Some designs may require an external resistor voltage divider when
driven by an active device that will tri-state.
*Note: Denotes 3-Level input pin with states designated as L (ground), M (VDD/2), and H (VDD).
18
Rev. 1.0
Si5316
Table 8. Si5316 Pin Descriptions (Continued)
Pin #
33
30
Pin Name
SFOUT0
SFOUT1
I/O
I
Signal Level
Description
3-Level*
Signal Format Select.
Three level inputs that select the output signal format (common
mode voltage and differential swing) for CKOUT. Valid settings
include LVPECL, LVDS, and CML. Also includes selections for
CMOS mode, tristate mode, and tristate/sleep mode.
SFOUT[1:0]
34
35
CKOUT–
CKOUT+
O
Multi
GND PAD
GND
GND
Supply
Signal Format
HH
Reserved
HM
LVDS
HL
CML
MH
LVPECL
MM
Reserved
ML
LVDS—low swing
LH
CMOS
LM
Disabled
LL
Reserved
These pins have both weak pull-ups and weak pull-downs and
default to M.
Some designs may require an external resistor voltage divider when
driven by an active device that will tri-state.
Clock Output.
Differential output clock with a frequency selected from a table of
values. Output signal format is selected by SFOUT pins. Output is
differential for LVPECL, LVDS, and CML compatible modes. For
CMOS format, both output pins drive identical single-ended clock
outputs.
Ground Pad.
The ground pad must provide a low thermal and electrical
impedance to a ground plane.
*Note: Denotes 3-Level input pin with states designated as L (ground), M (VDD/2), and H (VDD).
Rev. 1.0
19
Si5 316
6. Ordering Guide
Ordering Part Number
Package
ROHS6, Pb-Free
Temperature Range
Si5316-C-GM
36-Lead 6 x 6 mm QFN
Yes
–40 to 85 °C
Note: Add an R at the end of the device to denote tape and reel options.
20
Rev. 1.0
Si5316
7. Package Outline: 36-Lead QFN
Figure 7 illustrates the package details for the Si5316. Table 9 lists the values for the dimensions shown in the
illustration.
Figure 7. 36-Pin Quad Flat No-lead (QFN)
Table 9. Package Dimensions
Symbol
A
A1
b
D
D2
e
E
E2
Millimeters
Min
0.80
0.00
0.18
3.95
3.95
Nom
0.85
0.02
0.25
6.00 BSC
4.10
0.50 BSC
6.00 BSC
4.10
Symbol
Max
0.90
0.05
0.30
L

aaa
bbb
ccc
ddd
eee
4.25
Millimeters
Min
0.50
—
—
—
—
—
—
Nom
0.60
—
—
—
—
—
—
Max
0.70
12º
0.10
0.10
0.08
0.10
0.05
4.25
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to JEDEC outline MO-220, variation VJJD.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Components.
Rev. 1.0
21
Si5 316
8. Recommended PCB Layout
Figure 8. PCB Land Pattern Diagram
Figure 9. Ground Pad Recommended Layout
22
Rev. 1.0
Si5316
Table 10. PCB Land Pattern Dimensions
Dimension
MIN
MAX
e
0.50 BSC.
E
5.42 REF.
D
5.42 REF.
E2
4.00
4.20
D2
4.00
4.20
GE
4.53
—
GD
4.53
—
X
—
0.28
Y
0.89 REF.
ZE
—
6.31
ZD
—
6.31
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
Solder Mask Design
5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
solder mask and the metal pad is to be 60 μm minimum, all the way around the pad.
Stencil Design
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be
used to assure good solder paste release.
7. The stencil thickness should be 0.125 mm (5 mils).
8. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
9. A 4 x 4 array of 0.80 mm square openings on 1.05 mm pitch should be used for the
center ground pad.
Card Assembly
10. A No-Clean, Type-3 solder paste is recommended.
11. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for
Small Body Components.
Rev. 1.0
23
Si5 316
9. Top Marking
9.1. Si5316 Top Marking
Figure 10. Si5316 Top Marking
9.2. Top Marking Explanation
Mark Method:
Laser
Line 1 Marking:
Si5316
Customer Part Number
Line 2 Marking:
C-GM
C = Product Revision
G = Temperature Range –40 to 85 °C (RoHS6)
M = QFN Package
Line 3 Marking:
YYWWRF
YY = Year
WW = Work Week
R = Die Revision
F = Internal code
Assigned by the Assembly House. Corresponds to the year and
work week of the mold date.
Line 4 Marking:
Pin 1 Identifier
Circle = 0.75 mm Diameter
Lower-Left Justified
XXXX
Internal Code
24
Rev. 1.0
Si5316
DOCUMENT CHANGE LIST
Revision 0.23 to 0.24





Changed LVTTL to LVCMOS in Table 2, “Absolute
Maximum Ratings,” on page 5.
Added Figure 5, “Typical Phase Noise Plot,” on page
13.
Showed preferred interface for an external reference
clock in Figure 6, “Si5316 Typical Application
Circuit,” on page 14.
Updated "3. Ordering Guide" on page 11.
Added “5. Recommended PCB Layout” .
Revision 0.24 to Revision 0.3







Changed 1.8 V operating range ±5%.
Updated Table 1 on page 4.
Updated Table 2 on page 5.
Updated Table 8 on page 16.
Added table under Figure 5 on page 13.
Updated "1. Functional Description" on page 6.
Clarified "2. Pin Descriptions: Si5316" on page 7
including pull-up/pull-down.
Revision 0.3 to Revision 0.4





Updated Table 1, “Performance Specifications1,” on
page 4.
Updated Table 8, “Si5316 Pin Descriptions,” on
page 16.
Updated Figure 6, “Si5316 Typical Application
Circuit,” on page 14.
Updated "4.1. External Reference" on page 15.
Updated "2. Pin Descriptions: Si5316" on page 7.
Revision 0.4 to Revision 1.0





Expanded and rearranged specification tables in
section “1. Electrical Specifications” .
Updated "2. Typical Phase Noise Plot" on page 13.
Changed “any-rate” to “any-frequency” throughout.
Added "9. Top Marking" on page 24.
Added recommended ground pad drawing in "8.
Recommended PCB Layout" on page 22.
Rev. 1.0
25
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