InterBOARD 40 Gbps SNAP 12 Parallel Fiber Optic

InterBOARD 40 Gbps SNAP 12 Parallel Fiber Optic

PRODUCT DATA SHEET

InterBOARD

TM

40 Gbps SNAP 12 Parallel Fiber Optic

Transmitter and Receiver

Board Edge Modules

SN-T12-C00501 SNAP 12 Transmitter

SN-R12-C00501 SNAP 12 Receiver

Ideal for Board Edge Mounting

Product Summary:

The SNAP12 Transmitter and Receiver modules enable high performance multi-channel optical links designed for very short reach (VSR) high-speed data communication and computing applications where bandwidth bottlenecks are incumbent. In terms of Gbps, they offer the lowest cost solution and the highest packaging density. Consisting of 12 independent optical channels, each capable of transmitting 3.5 Gbps up to

300m on 50 micron multimode optical fiber, these modules have an aggregate link bandwidth in excess of

40 Gbps and operate at a wavelength of 850nm. They are optimized for applications which require line rates of

2.5, 2.7 or 3.3 Gbps.

The Transmitter and Receiver modules have been designed to meet the harshest external operating conditions including temperature, humidity and EMI interference using Reflex Photonics next generation,

LightABLE™

packaging technology. This unique technology also is expected to enable the modules to meet the most stringent Telcordia and Mil standard specifications. The modules offer very high functionality and feature integration, accessible via a two-wire serial interface.

Key Benefits:

SNAP 12 “Snap On” Pluggable for direct field replacements

Lowest profile Snap 12 form factor

Low power consumption < 1W per module

No heat sink requirement

Easy system design

Extended high reliability via advanced

LightABLE™ technology

Specifications and Features Highlights:

12 independent parallel optical channels

Channel Data rate of up to 3.5 Gbps

Aggregate Data rate in excess of 40 Gbps

(over 12 channels) per module

850-nm VCSEL/PD array technology

CML/LVDS/PECL compatible electrical I/O

DC or AC input data coupling

62.5µm and 50µm multimode fiber ribbon supported

Single 3.3V power supply

Drop in compatible with SNAP 12 MSA via

MEG-Array® connector

Protocol Agnostic

Applications:

Very high speed datacom and telecom VSR links:

Board to board interconnect

Rack to rack interconnect

System to system interconnect

Server farms and mass storage interconnects

12 channels of high speed serial data streams:

Infiniband™ - 12x

SONET/SDH (OC-16 and OC-48)

Multi-Lane PCI Express

Gigabit Ethernet

XAUI 3.125 Gbps

Fibre Channel (1/2/4 Gbps)

OIF-VSR5-01 (Very Short Reach OC-768)

Massively parallel/super computing systems

Reflex Photonics Inc. www.reflexphotonics.com

Doc # SN-970-004-00 Rev 3.6

PRODUCT DATA SHEET

1. Transmitter and Receiver Overview

Reflex Photonics transmitter and receiver modules offer twelve asynchronous channels operating at up to 3.5-

Gbps per channel. These modules are designed for very short reach application (1m to 300m) with support for both 62.5/125 micron and 50/125 micron multimode fiber.

As shown in Figure 1, a complete 12 channel parallel point-to-point optical link consists of a transmitter module, a 12-fiber optical ribbon cable, and a receiver module. The transmitter module consists of an array of 12

VCSELs (Vertical Cavity Surface Emitting Lasers) and associated circuitry, which converts 12 parallel electrical data inputs to 12 parallel optical data output signals. Conversely, the receiver module inputs 12 parallel optical signals and converts them into 12 parallel electrical signals through an array of 12 PIN photodiodes and associated circuitry.

Reflex’s Transmitter module

Ribbon cable 1-300m (12 fibers)

Reflex’s Receiver module

MTP/MPO connector

Control signals

12 Electrical input data channels

Figure 1. Complete point-to-point 12 channel parallel optical link.

The optical fiber ribbon cable has an MPO/MTP

MTP/MPO connector

Control signals

12 Electrical output data channels

TM

connector at each end, which plugs into the Transmitter and

Receiver module receptacle. The orientation of the ribbon cable is “keyed” and guide pins are present inside the module receptacle to ensure proper alignment. The cable usually has 180 degree twist (key up to key down) to ensure proper channel to channel alignment. Electrical connection is achieved though a vertically pluggable

10X10 Meg-Array

®

connector.

Figure 2 illustrates a typical board edge implementation of a

Transmitter and Receiver pair. The modules operate from a single

+3.3V power supply and LVCMOS/LVTTL global control signals such as fault/signal detection, reset, enable and disable are available with the modules.

Each parallel module is supplied with a receptacle process plug for the protection of the optics and a process plug for the pin protection of the electrical 10 X 10 Meg-Array

®

BGA connector. The transmitter module is Class 1 eye safe by design. Please refer to the regulatory compliance section for further details.

These modules are channel compliant with the IEEE 802.3z

1000Base-SX standard for Gigabit Ethernet. Therefore, they can be used in conjunction with an optical fiber fan-out to connect to single channel transceivers such as 850nm small form factor modules.

Figure 2. Board-edge application example.

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Page 2

Dec 2010

Doc # SN-970-004-00 Rev 3.6

PRODUCT DATA SHEET

2. Absolute Maximum Ratings

Absolute maximum ratings indicate values beyond which damage may occur.

Table 1. Absolute maximum ratings for Transmitter and Receiver

Parameter Symbol Min. Max.

Supply Voltage

Operating Ambient Air Temperature

Operating Case Temperature

Signaling Rate per Channel for Transmitter

Signaling Rate per Channel for Receiver

Differential Input Voltage Swing

Power Supply Noise

Unit Remarks

Storage Temperature

Operating Case Temperature

Supply Voltage

T

ST

-25 100 °C

T

C

0 90 °C

Vcc -0.5 4 V

Differential Input Voltage

Peak Input Voltage

Output Short Circuit Current

ESD Resistance

V

ID

2 V

2.

V

PEAK

I

SHORT

-30 30 mA

V

ESD

+/-

Relative Humidity

RH 5 95 %

1. Case temperature is measured at the case on opposite side on the electrical connector.

2. Maximum voltage that can be applied across the differential data inputs without damaging the device.

3. Recommended Operating Conditions

Recommended operating conditions indicate values at which performance and reliability is intended. Device functionality is not implied beyond the recommended operating conditions.

Table 2. Recommended operating conditions for Transmitter and Receiver

Parameter Symbol Min. Max. Unit Remarks

Vcc 3.1 3.5 V

T

OP

0 80 °C

T

C

0 75 °C

F

TX

F

RX

ΔV p-p

V

N

0.175 3.5 Gbps mV p-p

1. Air flow parallel to printed circuit board should be maintained above 0.5 m/s.

2. Case temperature is measured on the case on opposite side on the electrical connector.

3. -04 module rated from -40 to 75C. See ordering info in Section 10.

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Dec 2010

Doc # SN-970-004-00 Rev 3.6

PRODUCT DATA SHEET

4. Transmitter Specifications

4.1 Transmitter Functional Description

The transmitter module converts parallel electrical input signals via a laser driver and a Vertical Cavity Surface

Emitting Laser (VCSEL) array into parallel optical output signals. The transmitter module accepts electrical input signals which are voltage compatible with both Low Voltage Positive Emitter Coupled Logic (LVPECL) and

Current Mode Logic (CML) levels. All input data signals are differential and are internally terminated. The transmitter supports a data rate up to 3.5 Gbps for each channel. With a DC coupled configuration the transmitter module’s minimum data rate is DC otherwise bound by the selection of the AC coupling capacitors.

Figure 3, presents a detailed functional block diagram of the transmitter module with corresponding external connection pins. Inside the transmitter module, a control block provides, through individual channel settings, proper laser drive parameter, such as modulation and biasing and ensures proper operation of the device.

A single power supply, Vcc, is required to power up the module. The module offers 4 global control signals,

TXEN (Transmitter Enable), TXDIS (Transmitter Disable), RESET- and FAULT-. All control signals are LVCMOS

(Low Voltage Complementary Metal Oxide Semiconductor) compatible.

TXEN and TXDIS are complementary signals used to shutdown and enable the transmitter. For the transmitter optical output to be operational TXEN must be held to a logical High and TXDIS must be held at a logical Low. If either is not properly set, the transmitter optical outputs will be disabled. TXDIS is internally pulled and may be left unconnected; however TXEN must be connected and properly set for the transmitter to be functional.

A logical Low at the FAULT- pin indicates a problem with transmitter. A fault condition may arise from two reasons; either a VCSEL is operating improperly or the circuitry senses a short/open condition. When a fault is detected at a VCSEL the faulty channel is automatically powered down and the FAULT- signal will remain active

(Low) until the RESET- switch is toggled. A logic Low level at RESET- also switches all laser outputs to an off state. During power-up RESET- can be used as a power-on reset switch, which disables drive and control circuitry until the power supply has reached a 3.135 V level.

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Dec 2010

Doc # SN-970-004-00 Rev 3.6

4.2 Transmitter functional block diagram

Electrical Interface

DIN1+

DIN1-

DIN11+

DIN11-

DIN12+

DIN12-

50 Ohms

50 Ohms

50 Ohms

50 Ohms

50 Ohms

50 Ohms

RESET-

TXEN

TXDIS

PRODUCT DATA SHEET

100 Ω

100 Ω

100 Ω

Input buffer

Input buffer

Input buffer

Driver stage

Fault12

Fault1

Fault11

Fault1

EN1

Driver stage

EN11

Fault11

Driver stage

EN12

Fault12

EN12

EN1

EN11

Fault detect Channel Enable

VCSEL array

VCSEL array

VCSEL array

Optical Interface

50 um fiber

CH 1

MTP/MPO

Connector

50 um fiber

CH 11

50 um fiber

CH 12

FAULT-

Global settings

Controller

Supply

Monitor

Power Supplies

+3.3V - 0V

Temperature

Sensor

VCC

GND

Figure 3. Reflex transmitter functional block diagram.

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Page 5

Dec 2010

Doc # SN-970-004-00 Rev 3.6

PRODUCT DATA SHEET

4.3 Transmitter Pin Description and Assignment

Table 3, Transmitter Pin Description

Symbol Type I/O Description

DIN+[1:12]

CML/LVPECL Input Input Non-Inverting Data, internal differential termination at 100 Ohms.

DIN-[1:12]

CML/ LVPECL Input Input Inverting Data, internal differential termination at 100 Ohms.

VCC

Supply Input +3.3 V Transmitter Voltage Supply.

GND

FAULT-

Supply

CMOS

Input Transmitter Ground, connected to signal ground plane.

Output Transmitter Fault indicator, Logic Low indicates fault.

TXEN

TXDIS

RESET-

DNC

Do Not Connect.

Towards optical MTP/MPO connector

J I H G F E D C B A

6

7

8

1

2

3

4

5

9

10

DNC DNC DNC GND GND GND GND GND GND DNC

DNC DNC DNC GND GND DIN6+ GND GND DIN9+ GND

DNC VCC VCC GND DIN5+ DIN6- GND DIN8+ DIN9- GND

DNC VCC VCC DIN4+ DIN5- GND DIN7+ DIN8- GND DNC

DNC VCC VCC DIN4- GND DIN3+ DIN7- GND DIN10GND

GND

DIN2- GND GND DNC

DNC RESET- DIN12+ GND GND DNC

DNC TXEN TXDIS GND GND GND GND GND GND DNC

DNC DNC DNC DNC DNC DNC DNC DNC DNC DNC

Figure 4, Transmitter pin assignment - top view of printed circuit board layout (customer side) for

10X10 Meg-Array

®

connector.

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Page 6

Dec 2010

Doc # SN-970-004-00 Rev 3.6

PRODUCT DATA SHEET

4.4. Transmitter Characteristics

Table 4, Transmitter Optical Specifications (Room T = 25°C, VCC =3.3V +/- 5%)

Parameter

Optical Rise/Fall Time

Average Optical Power (per channel)

Average Optical Power (per channel) – Disabled

Launched Power (per channel)

Extinction Ratio

Center Wavelength

RMS Spectral Width

Symbol Min. Typ. Max. Unit Remarks

T

R

/T

F

P

OUT

-8 -2.5

2. 3.

P

OFF

P

L

ER

λ

C

λ

Deterministic Jitter

Total Jitter

Relative Intensity Noise

1. Measured at 20% to 80% levels using 550 Mb/s clock signal.

2. Measured at the output of the modules optical interface.

3. If using DC coupling, data must remain DC balanced otherwise rated optical power may be exceeded.

4. Optical power measured at the output of 1m 50/125 um breakout cable.

5. Measured 550 Mb/s with a 2

7

– 1 encoded pattern.

Table 5, Transmitter Electrical Specifications (Room T = 25°C, VCC =3.3V +/- 5%)

Parameter

Power Dissipation

Supply Current

Differential Input Impedance

Differential Input Voltage

Electrical Inter-Channel Skew

Control I/O Voltage, High

Control I/O Voltage, Low

Symbol Min. Typ. Max. Unit Remarks

P

DIS

I

CC

Z

IN

V

D

0.2 V p-p

1.

T

SK

V

IH

1.1 VCC V

V

IL

0 V

FAULT- Assert time

RESET- Duration

10

RESET De-assert time

TXEN Assert time

TXDIS Assert time

Power on time

1. Differential input impedance measure between DIN- and DIN+.

2. Defined as the difference in times of flight between the “slowest” channel (i.e. the channel having the longest effective time of flight), and the “fastest” channel (i.e., the channel having the shortest time of flight).

3. See figures 5,6,7 and 8 for timing diagrams.

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Doc # SN-970-004-00 Rev 3.6

PRODUCT DATA SHEET

4.5 Timing Diagrams

VCC

All data channels

< 50 ms

Shutdown

Normal

< 10 us

Normal

< 10 us

Shutdown

Figure 5, Typical transmitter power-up sequence.

TXEN

Normal

All data channels

< 10 us

Normal

< 10 us

Shutdown

TXDIS

Normal

RESET-

All data channels

Fault occurs

Figure 6, TXEN and TXDIS timing diagram.

> 10 us

< 10 us

Shutdown

Normal

< 50 ms

Figure 7, RESET Timing diagram.

FAULT-

RESET-

Valid data (All channels)

<10 us

Data

< 10 us

10 ns

Fault exists

Resetting

10 ns

10 ns

< 40 ms

Shutdown fault no longer exists fault is still present

Data

Figure 8, Reset timing diagram. The transmitter is reset to clear a fault. If the fault persists the FAULT- signal will remain active. Note that the RESET- signal must be held low for a minimum of 10 us.

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Dec 2010

Doc # SN-970-004-00 Rev 3.6

PRODUCT DATA SHEET

5. Receiver Specifications

5.1 Receiver Functional Description

The receiver module converts parallel optical input signals via a receiver and a photodetector array into parallel electrical output signals. The receiver module outputs electrical signals, which are voltage compatible with

Current Mode Logic (CML) levels. All output data signals are differential and support a data rate up to 3.5 Gbps for each channel. The receiver has a lower cut-off frequency of 175 kHz.

Figure 9, presents a detailed functional block diagram of the receiver module with corresponding external connection pins. Inside the receiver module, a control block ensures proper operation of the device and provides individual channel settings and monitoring.

A single power supply, VCC, is required to power up the module. The module offers 3 global control signals,

RXEN (Receiver Enable), SQEN (Squelch Enable) and SD (Signal Detect). All control signals are LVCMOS compatible.

RXEN is used to enable the receiver. RXEN is internally pulled-up and may be left unconnected in order for the receiver to be operational. RXEN must be set to a logical Low for the electrical outputs to be shutdown. SD is used to indicate the presence of sufficient optical power on all the channels. A Low output on SD indicates a loss of signal i.e. the presence of at least one data channel without sufficient optical power. SQEN is used to drive electrical data output to a logic zero on any channel that has a loss of signal; this feature is disabled when

SQEN is set to Low.

Reflex Snap 12 module with

integrated heatsink

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Dec 2010

Doc # SN-970-004-00 Rev 3.6

PRODUCT DATA SHEET

5.2 Detailed Receiver Block Diagram

Optical Interface

50 um fiber

CH 1

MTP/MPO

Connector

50 um fiber

PIN array

CH 11

CH 12

50 um fiber

RXEN

SQEN

PIN array

PIN array

TIA

TIA

TIA

Supply

Monitor

SD1

SD12

SD11

Signal detect

Global settings

Controller

Power Supplies

+3.3V, 0V

Output stage

SD1

EN1

Output stage

SD11

EN11

Output stage

EN12

SD12

EN1

EN12

EN11

Channel Enable

VCC

GND

Figure 9, Receiver block diagram.

100 Ω

100 Ω

100 Ω

Temperature

Sensor

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Electrical Interface

50 Ohms

50 Ohms

DOUT1-

50 Ohms

DOUT11+

50 Ohms

DOUT11-

50 Ohms

DOUT12+

50 Ohms

DOUT12-

SD

DOUT1+

Page 10

Dec 2010

Doc # SN-970-004-00 Rev 3.6

5.3 Pin Description and Assignment for Receiver

PRODUCT DATA SHEET

Table 6, Receiver pin description

Symbol

DOUT+[1:12]

Type

CML

I/O Description

Output Non-Inverting Data output, internal differential termination at 100 Ohms.

DOUT-[1:12]

VCC

GND

VPP

Supply

Supply

Supply

Input +3.3 V Voltage supply for receiver.

Input Receiver Ground, connect to signal ground plane.

Input Internally connected to VCC (Power supply pin for CML DC-coupling).

RXEN

ENSD

SD

SQEN

DNC

CMOS Input Squelch enable; asserted High.

Do not connect.

Towards optical connector

J I H G F E D C B A

7

8

9

5

6

3

4

1

2

10

VPP DNC DNC GND GND GND GND GND GND DNC

GND GND GND

DOUT GND DOUT8- DOUT9+ GND

DNC VCC VCC GND DOUT7- DOUT8+

DNC VCC VCC DOUT3- DOUT7+

VPP DNC DNC GND GND DOUT12-

GND DNC

GND DOUT10+ GND

DNC VCC VCC GND GND DOUT11+ DOUT10GND

DNC DNC SD DOUT1- DOUT2+ GND DOUT12+ DOUT11GND DNC

GND GND DNC

VPP RXEN ENSD GND GND GND GND GND GND DNC

SQEN DNC DNC DNC DNC DNC DNC DNC DNC DNC

Figure 10, Receiver pin assignment - top view of printed circuit board layout (customer side) for

10X10 Meg-Array

®

connector.

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Page 11

Dec 2010

Doc # SN-970-004-00 Rev 3.6

PRODUCT DATA SHEET

5.4 Receiver Characteristics

Table 7, Receiver Optical Specifications (Room T = 25°C, VCC =3.3V +/- 5%)

Parameter Symbol Min. Typ. Max. Unit Remarks

Optical Power Sensitivity (per channel)

Optical Power Saturation (per channel)

Stressed Receiver Sensitivity

Center Wavelength

Optical Return Loss

Signal Detect Assert

P

IN MIN

-16 dBm

P

IN MAX

P

λ

S

C

dBm

830 nm

R

L

T

SDA

12 dB

Signal Detect De-Assert

T

SDD

1. Defined as the average optical power necessary to produce a BER of 10

-12

at the center of the baud interval using a 2.5 Gbps PRBS of length 2

23-1 equivalent. Input power is provided as an ideal source and all receiver channels are not under test are operating and receiving an optical signals.

or

Table 8, Receiver Electrical Specifications (Room T = 25°C, VCC =3.3V +/- 5%)

Parameter

Power Dissipation

Supply Current

Low frequency cut-off

Electrical Rise / Fall Time

Differential Output Impedance

Differential Output Swing

Inter-Channel Skew

Symbol Min. Typ. Max. Unit Remarks

P

D

I

S

150 Mb/s

T

R

/T

F

Z

IN

V

D

T

SK mV p-p

Data Output Deterministic Jitter

Data Output Total Jitter

Control Input Voltage, High

Control Input Voltage, Low

V

IH

1.1 VCC V

V

IL

0 V

1. Measured at 20% to 80% levels using 550 Mb/s clock signal.

2. Defined as the difference in times of flight between the “slowest” channel (i.e. the channel having the longest effective time of flight), and the “fastest” channel (i.e., the channel having the shortest time of flight).

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Doc # SN-970-004-00 Rev 3.6

6. Mechanical and Layout Considerations

PRODUCT DATA SHEET

Figure 11a, Transmitter and Receiver mechanical outline, no heatsink

Figure 11b, Transmitter and Receiver mechanical outline, with heatsink

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Doc # SN-970-004-00 Rev 3.6

PRODUCT DATA SHEET

Key Up

Channel 12

Channel 1

Figure 12, Transmitter and Receiver fiber channel assignment.

A typical host board mechanical layout for attaching the pluggable parallel optical transmitter and receiver modules is shown in Figure 13. The host electrical connector must be a 100-position FCI Meg Array

®

plug (FCI

PN: 84512-101) or equivalent.

Host enclosures that use pluggable parallel optical modules should provide appropriate clearances between modules to allow insertion and extraction of the optical connector without the use of special tools. A recommended minimum center to center separation distance between modules is 18.42mm. Table 9 summarizes critical dimensions.

Figure 13, Host board mechanical layout.

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Doc # SN-970-004-00 Rev 3.6

PRODUCT DATA SHEET

Table 9, Mechanical compliance table.

Key Value (mm) Tolerance (mm) Comments

A2

B2

35.31

10.92

±0.75

MAX

Distance from rear post to inside surface of bezel

Distance from rear post to rear of module keep-out area

C2

∅0.58

±0.05

D2

E2

∅4.30

∅2.69

MIN

±0.12

F2

∅1.70

±0.12

G2

∅3.00

±MIN

7. Compliance

Table 10, Regulatory Compliance Table

Feature Test Method

Laser Eye Safety

Diameter of pad in BGA pattern

Diameter of keep-out pad for rear post

Diameter of hole for mounting screws: two rear and one front

Diameter of hole for front post

Diameter of keep-out pad for front post

IEC 60825-1 Amendment 2

CFR21 1040.10

Comments

TUV Certificate number: N/A

Electrostatic Discharge

(ESD) to Case

Electrostatic Discharge

(ESD) to Electrical

Connector

Electromagnetic Interference

(EMI)

IEC 61000-4-2

MIL-STD 883C; Method 3015.4

Class 1 (>1 kV)

TBD

Radiated Immunity

Component Recognition

IEC 6100-4-3 (TBD)

UL 1950

CSA C22.2 #950

Field strength of 10V/m swept from 80 MHz to 1 GHz.

No variation of Transmitter or Receiver performance detectable over those limits.

UL Certificate number: N/A

CSA Certificate number: N/A

DO NOT VIEW RADIATION DIRECTLY WITH

OPTICAL INSTRUMENTS - CLASS 1M LASER PRODUCT

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Doc # SN-970-004-00 Rev 3.6

PRODUCT DATA SHEET

8. Link distances and supported fiber types

Reflex Photonics Transmitter and Receiver modules support different link lengths depending on the fiber type used. The following table illustrates shows typical links distances with common multimode fiber types.

Table 11, Informative Link Reach

Fiber Type and

Modal Bandwidth

Max. Reach Distance

2.5 Gbps 2.7 Gbps 3.3 Gbps

62.5/125 MMF

200 MHz·km

50/125 MMF

500 MHz·km

130 m

325 m

120 m

270 m

100 m

200 m

50/125 MMF

900 MHz·km

500 m 450 m 300 m

9. Brief Application Information

9.1 Handling and Cleaning

The MTP/MPO optical connector plug should be kept on during module manipulation to prevent physical damage or particle deposition on the end face. In case of contamination, clean the end face with linear motions using either a Kimwipe or a Q-Tip damped in 91% isopropyl alcohol. Forced nitrogen or clean dry air can also be used to remove particles or to remove lint residue after cleaning.

Always handle modules with care. To prevent damage to the electrical connector, only remove the plug before insertion. As shown in figure 14, align both connectors by using the receptacle keys. Push down on the rear of the module and then move forward to the front of the module. Like mating, the connector pair can be unmated by pulling them straight apart. However, it requires less effort to un-mate if the force is originated from one of the slot/key ends of the assembly. Mating or un-mating of the connector by rolling in a direction perpendicular to alignment slot/keys may cause damage to the terminal contacts and is must be avoided.

Figure 14, mating and un-mating procedure.

9.2 ESD Discharge

The Transmitter and Receiver modules are shipped in Electrostatic Discharge ESD protective packaging, once removed normal handling precautions to prevent ESD are advised. They include grounding wrist straps, work benches and floor mats.

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Doc # SN-970-004-00 Rev 3.6

PRODUCT DATA SHEET

9.3 Electrical Signals

Reflex Photonics Transmitter and Receiver use a differential CML circuit interface for their input or output stages which may require the user to properly design its interface. CML is a high-speed point-to-point interface and typically does not require any external termination resistors as it is provided internally by both the driver and the receiver devices. This greatly simplifies the system interconnect and stub lengths are minimized, thus signal quality is optimized. CML supports data rates above 10 Gbps depending upon the process for the drivers and receiver integrated circuit (IC).

CML maybe DC coupled or AC coupled if encoding is used. CML uses a passive pull up to the supply rail, which is typically 50 Ohms. Due to the fact that one side is pulled to the rail, both the driver and receiver should be powered from the same supply potential for DC coupled applications. This is one reason that AC coupling is popular with CML interfaces. It provides common-mode tolerance, fault protection and also supply independency. CML tends to be vendor specific, so a careful review of datasheets is recommended to determine inter-operation especially in DC coupled applications.

Printed circuit board transmission traces to and from the modules should be designed to have a differential impedance of 100 Ohms. In order to preserve good signal quality, traces built on FR-4 printed circuit board material should be kept below 10 inches in length.

9.4 Power Supply and Grounding

Power supply filtering is highly recommended for both the transmitter and receiver. A filtering network should be placed on the host printed circuit board as close a possible to the transmitter and receiver electrical connector for enhanced performance. It is recommended to put the filtering network on the opposite side of the PCB directly under the modules.

The case or chassis of the modules is isolated from the signal ground. It is recommended to tie the module case ground through the three mounting screws.

9.5 Eye safety

The transmitter is a class 1M Laser Product per IEC/EN 60835-1 and should not be viewed directly with an optical instrument. Tampering or operating the product in a manner inconsistent with intended usage may result in hazardous radiation exposure.

9.6 Evaluation Kit:

Transmitter and Receiver evaluation boards designed for high-speed testing are available. Each board is fitted with a 10x10 BGA electrical Meg-Array

®

connector socket where the module can be plugged. 24 SMA connectors provide the connections for the 12 differential electrical signals, which can be AC or DC coupled.

The modules require a single 3.3V power supply.

The evaluation kit comes with a user manual to facilitate the evaluation process. In house application and design engineers are available to assist product evaluations and to support integration.

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Dec 2010

Doc # SN-970-004-00 Rev 3.6

10. Ordering information

Part Number

PRODUCT DATA SHEET

SN-T12-C00501-000-0-11

SN-R12-C00501-000-0-11

SN-T12-C00501-000-0-12

SN-R12-C00501-000-0-12

SN-T12-C00501-000-0-14

SN-R12-C00501-000-0-14

Description

12 X 3.5 Gbps 850 nm InterBoard™ SNAP 12 Transmitter

Module for Board Edge Mounting Applications; The Transmitter module meets IEC 60825-1 Class 1M laser eye safety specifications. No heatsink.

12 X 3.5 Gbps 850 nm InterBoard™ SNAP 12 Receiver Module for Board Edge Mounting Applications. No heatsink.

12 X 3.5 Gbps 850 nm InterBoard™ SNAP 12 Transmitter

Module for Board Edge Mounting Applications; The Transmitter module meets IEC 60825-1 Class 1M laser eye safety specifications. With heatsink shown in Figure 11b.

12 X 3.5 Gbps 850 nm InterBoard™ SNAP 12 Receiver Module for Board Edge Mounting Applications. With heatsink shown in

Figure 11b.

12 X 3.5 Gbps 850 nm InterBoard™ SNAP 12 Transmitter

Module for Board Edge Mounting Applications; The Transmitter module meets IEC 60825-1 Class 1M laser eye safety specifications. Module rated from -40 to 75C. Includes heatsink shown in Figure 11b.

12 X 3.5 Gbps 850 nm InterBoard™ SNAP 12 Receiver Module for Board Edge Mounting Applications. Module rated from -40 to 75C. Includes heatsink shown in Figure 11b.

SN-K12-X00501

12 channel InterBoard™ SNAP 12 Transmitter/Receiver

Evaluation Kit- includes Evaluation Board and User Guide.

© Copyright 2010, Reflex Photonics Inc.

This document including pictures and drawings contains information about a new product during its early phase of development. The information contained herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Reflex Photonics reserves the right to change the design or specifications of the product at any time without notice. The material is provided as is and without any warranties, including but not limited to warranties of noninfringement, description and fitness for a particular purpose.

www.reflexphotonics.com

For more information on this or other products:

Contact sales at [email protected]

Page 18

Dec 2010

Doc # SN-970-004-00 Rev 3.6

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