Intel | R1304BTSSFAN | Datasheet | Intel R1304BTSSFAN server barebone

Inte
el® Serrver Syste
S
m R1304B
BTSSF
FAN
Inte
el® Serrver Syste
S
BTLSF
FAN
m R1304B
Inte
el® Serrver Syste
S
BTLSH
HBN
m R1304B
Tech
hnical Produ
uct Spe
ecifica
ation
Intel order nu
umber G1745
55-004
Revision
n 2.0
January, 2
2012
Enterprise
E
Platforms and Servic
ces Divisio
on – Marke
eting
Revision History
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Revision History
Date
Revision Number
Modifications
September 2010
0.1
Initial release.
November 2010
January 2011
March 2011
May 2011
0.5
0.7
1.0
1.1
Updated the hardware info.
Updated S1200BTS info.
Updated Regulatory info.
ƒ Updated Chassis Dimensions info.
ƒ Updated Operation Temperature info.
January 2012
2.0
ƒ
ƒ
ii
Updated System Feature Set table.
Added a note in chapter 1.
Intel order number G17455-004
Revision 2.0
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Disclaimers
Disclaimers
Information in this document is provided in connection with Intel® products. No license, express
or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document. Except as provided in Intel®’s Terms and Conditions of Sale for such products, Intel®
assumes no liability whatsoever, and Intel® disclaims any express or implied warranty, relating
to sale and/or use of Intel® products including liability or warranties relating to fitness for a
particular purpose, merchantability, or infringement of any patent, copyright or other intellectual
property right. Intel® products are not intended for use in medical, life-saving, or life sustaining
applications. Intel® may make changes to specifications and product descriptions at any time,
without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked
“reserved” or “undefined”. Intel® reserves these for future definition and shall have no
responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
This document contains information on products in the design phase of development. Do not
finalize a design with this information. Revised information will be published when the product is
available. Verify with your local sales office that you have the latest datasheet before finalizing
a design.
The server boards/chassis referenced in this document may contain design defects or errors
known as errata which may cause the product to deviate from published specifications. Current
characterized errata are available on request.
Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others.
Copyright © Intel Corporation 2012. All rights reserved.
Revision 2.0
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Table of Contents
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Table of Contents
1.
Introduction .......................................................................................................................... 1
1.1
Chapter Outline........................................................................................................ 1
1.2
Server Board Use Disclaimer .................................................................................. 2
2. Product Overview ................................................................................................................. 3
2.1
System Views .......................................................................................................... 5
2.2
Chassis Dimensions ................................................................................................ 5
2.3
System Components ............................................................................................... 6
2.4
System Boards ........................................................................................................ 8
2.4.1
Intel® Server System R1304BTSSFAN .................................................................... 8
2.4.2
Intel® Server System R1304BTLSFAN .................................................................... 8
2.4.3
Intel® Server System R1304BTLSHBN .................................................................... 8
2.5
System Cooling ........................................................................................................ 8
2.6
Rack and Cabinet Mounting Options ....................................................................... 9
3. 250W Power Subsystem .................................................................................................... 10
3.1
Mechanical Specifications ..................................................................................... 10
3.2
Output Connectors ................................................................................................. 11
3.2.1
Baseboard power connector (P1) .......................................................................... 12
3.2.2
Processor Power Connector (P2) .......................................................................... 12
3.2.3
SATA Hard Drive Power Connectors (P4, P5, P6, P7) .......................................... 12
3.2.4
Mini SATA Hard Drive Power Connectors (P3) ..................................................... 13
3.3
AC Inlet Connector ................................................................................................ 13
3.3.1
AC Power Cord Specification Requirements ......................................................... 13
3.4
Marking and Identification ...................................................................................... 14
3.5
Efficiency ............................................................................................................... 14
3.6
AC Input Voltage .................................................................................................... 14
3.7
Output Power/Currents .......................................................................................... 14
3.8
Protection Circuits .................................................................................................. 14
3.8.1
Over Current Protection (OCP) .............................................................................. 15
3.8.2
Over Voltage Protection (OVP) .............................................................................. 15
3.8.3
Over Temperature Protection (OTP) ..................................................................... 15
4. 350W Power Subsystem .................................................................................................... 17
4.1
Mechanical Specifications ..................................................................................... 17
4.2
Output Connectors ................................................................................................. 18
4.2.1
Baseboard power connector (P1) .......................................................................... 19
4.2.2
Processor Power Connector (P2) .......................................................................... 19
4.2.3
SATA Hard Drive Power Connectors (P4, P5)....................................................... 20
4.2.4
Mini SATA Hard Drive Power Connectors (P8) ..................................................... 20
4.2.5
AUX Power Connector (P3) ................................................................................... 20
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Table of Contents
4.2.6
Hot-swap Backplane Power Connector (P7) ......................................................... 20
4.3
AC Inlet Connector ................................................................................................ 21
4.3.1
AC Power Cord Specification Requirements ......................................................... 21
4.4
Marking and Identification ...................................................................................... 21
4.5
Efficiency ............................................................................................................... 21
4.6
AC Input Voltage .................................................................................................... 21
4.7
Output Power/Currents .......................................................................................... 22
4.8
Protection Circuits .................................................................................................. 22
4.8.1
Over Current Protection (OCP) .............................................................................. 22
4.8.2
Over Voltage Protection (OVP) .............................................................................. 23
4.8.3
Over Temperature Protection (OTP) ..................................................................... 23
4.9
PMBus ................................................................................................................... 23
4.9.1
Related Documents ............................................................................................... 23
4.9.2
Addressing ............................................................................................................. 24
5. Cooling Subsystem ............................................................................................................ 25
5.1
Power Supply Fans ................................................................................................ 27
5.2
CPU Air Duct ......................................................................................................... 27
6. Peripheral and Hard Drive Support .................................................................................. 29
6.1
Optical Drive Support ............................................................................................. 30
6.1.1
Optical Drive Support ............................................................................................. 30
6.2
Hard Disk Drive Support ........................................................................................ 30
6.2.1
System Fan Connectors ........................................................................................ 30
7. Front Control Panel ............................................................................................................ 31
7.1.1
Power/Sleep LED .................................................................................................. 32
7.1.2
System Status LED ................................................................................................ 32
7.1.3
Drive Activity LED .................................................................................................. 32
8. PCI Riser Cards and Assembly ......................................................................................... 33
9. Intel® Server System R1304BTLSHBN Passive SAS/SATA Hot-swap Backplane ........ 34
9.1.1
Hot-swap Drive Trays ............................................................................................ 35
10. Supported Intel® Server Boards ........................................................................................ 36
11. Environmental Specifications ........................................................................................... 37
11.1
System Level Environmental Limits ....................................................................... 37
Appendix A: Integration and Usage Tips ................................................................................ 38
Appendix B: Integrated BMC Sensor Tables .......................................................................... 39
Appendix C: POST Code Diagnostic LED Decoder ............................................................... 51
Appendix D: POST Error Beep Codes .................................................................................... 54
Glossary..................................................................................................................................... 56
Reference Documents .............................................................................................................. 59
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List of Figures
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
List of Figures
Figure 1. Intel® Server System R1304BTSSFAN/R1304BTLSFAN .............................................. 5
Figure 2. Intel® Server System R1304BTLSHBN.......................................................................... 5
Figure 3. Intel® Server System R1304BTSSFAN/R1304BTLSFAN Major System Components . 6
Figure 4. Intel® Server System R1304BTLSHBN Major System Components ............................. 7
Figure 5. Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN Back Panel
Features ........................................................................................................................................ 8
Figure 6. Power Supply Enclosure Drawing ............................................................................... 11
Figure 7. AC Power Cord Specifications ..................................................................................... 13
Figure 8. Power Supply Enclosure Drawing ............................................................................... 18
Figure 9. AC Power Cord Specifications ..................................................................................... 21
Figure 10. Intel® Server System R1304BTSSFAN/R1304BTLSFAN Fan Module Assembly ..... 25
Figure 11. Intel® Server System R1304BTLSHBN Fan Module Assembly ................................. 26
Figure 12. Intel® Server System R1304BTSSFAN/R1304BTLSFAN Air Duct ............................ 27
Figure 13. Intel® Server System R1304BTLSHBN Air Duct ........................................................ 28
Figure 14. Intel® Server Systems R1304BTSSFAN/R1304BTLSFAN Drive Bays ...................... 29
Figure 15. Intel® Server Systems R1304BTLSHBN Drive Bays ................................................. 30
Figure 16. Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN Front
Control Panel .............................................................................................................................. 31
Figure 17. PCI–E Riser Card Assembly For Intel® Server System R1304BTSSFAN,
R1304BTLSFAN and R1304BTLSHBN ...................................................................................... 33
Figure 18. Intel® Server System R1304BTLSHBN Hot-swap Backplane.................................... 34
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List of Tables
List of Tables
Table 1. System Feature Set ........................................................................................................ 3
Table 2. Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN Dimensions5
Table 3. Input Voltage Range ..................................................................................................... 10
Table 4. Intel® 250W PSU Cable Lengths................................................................................... 11
Table 5. P1 Main Power Connector ............................................................................................ 12
Table 6. P2 Processor Power Connector .................................................................................... 12
Table 7. SATA Power Connector ................................................................................................ 12
Table 8. SATA Power Connector ................................................................................................ 13
Table 9. AC Input Rating ............................................................................................................. 14
Table 10. Load Ratings ............................................................................................................... 14
Table 11. Over Load Protection (OCP) Limits ............................................................................ 15
Table 12. Over Voltage Protection (OVP) Limits ........................................................................ 15
Table 13. Input Voltage Range ................................................................................................... 17
Table 14. 350W PSU Cable Lengths .......................................................................................... 19
Table 15. P1 Main Power Connector .......................................................................................... 19
Table 16. P2 Processor Power Connector .................................................................................. 19
Table 17. SATA Power Connector .............................................................................................. 20
Table 18. SATA Power Connector .............................................................................................. 20
Table 19. AUX Power Connector ................................................................................................ 20
Table 20. P7 HSBP Power Connector ........................................................................................ 21
Table 21. AC Input Rating........................................................................................................... 22
Table 22. Load Ratings ............................................................................................................... 22
Table 23. Over Load Protection (OCP) Limits ............................................................................ 23
Table 24. Over Voltage Protection (OVP) Limits ........................................................................ 23
Table 25. System Four-pin Fan Headers Pin-outs ...................................................................... 30
Table 26. Control Panel LED Functions ...................................................................................... 32
Table 27. SSI Power LED Operation .......................................................................................... 32
Table 28. Passive SATA/SAS Backplane Power Connector Pin-out .......................................... 35
Table 29. Passive SATA/SAS Backplane Connector to Hard Drive Pin-out ............................... 35
Table 30. System Environmental Limits Summary ..................................................................... 37
Table 31. BMC Core Sensors ..................................................................................................... 41
Table 32. POST Progress Code LED Example .......................................................................... 51
Table 33. POST Progress Codes ............................................................................................... 51
Table 34. POST Error Messages and Handling .......................................................................... 54
Table 35. POST Error Beep Codes ............................................................................................ 55
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List of Tables
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1.
Introduction
Introduction
The Intel® Server Systems R1304BTSSFAN, R1304BTLSFAN, and R1304BTLSHBN are 1U
server systems.
ƒ
The Intel® Server System R1304BTSSFAN supports up to four fixed Serial ATA (SATA)
hard disk drives. The Intel® Server System R1304BTSSFAN includes the Intel® Server
Board S1200BTS.
ƒ
The Intel® Server System R1304BTLSFAN supports up to four fixed Serial ATA (SATA)
hard disk drives. The Intel® Server System R1304BTLSFAN includes the Intel® Server
Board S1200BTL.
ƒ
The Intel® Server System R1304BTLSHBN supports up to four hot-swappable SATA
disk drives and includes the Intel® Server Board S1200BTL.
ƒ
The server boards and the server systems have features designed to support the highdensity server market. This chapter provides a high-level overview of the system
features. Subsequent chapters provide greater detail for each major system component
or feature.
Note: The products with the product codes of R1304BTLSFAN, R1304BTSSFAN, and
R1304BTLSHBN can only support Intel®Xeon® E3-1200 processor, the 2nd Generation Intel®
Core™ i3 Processor. The products with the product codes of R1304BTLSFANR and
R1304BTSSFANR or R1304BTLSHBNR can only support Intel®Xeon® E3-1200 processor, the
2nd Generation Intel® Core™ i3 Processor, Intel® Xeon® E3-1200 V2 processor, or the 3rd
Generation Intel® Core™ i3 Processor.
1.1
Chapter Outline
This document is divided into the following chapters:
ƒ
Chapter 1 – Introduction
ƒ
Chapter 2 – Product Overview
ƒ
Chapter 3 – 250W Power Sub-system
ƒ
Chapter 4 – 350W Power Sub-system
ƒ
Chapter 5 – Cooling Sub-system
ƒ
Chapter 6 – Peripheral and Drive Support
ƒ
Chapter 7 – Front Control Panel
ƒ
Chapter 8 – PCI Riser Cards and Assembly
ƒ
Chapter 9 – Intel® Server System R1304BTLSHBN Passive SAS/SATA Hot-swap
Backplane
ƒ
Chapter 10 – Supported Intel® Server Boards
ƒ
Chapter 11 – Environmental Specifications
ƒ
Appendix A – Integration and Usage Tips
ƒ
Appendix B – Integrated BMC Sensor Tables
ƒ
Appendix C – POST Code Diagnostic LED Decoder
ƒ
Appendix D – Post Error Message and Handling
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Intel order number G17455-004
1
Introduction
ƒ
Glossary
ƒ
Reference Documents
1.2
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Server Board Use Disclaimer
Intel Corporation server boards contain a number of high-density VLSI and power delivery
components that need adequate airflow to cool. Intel® ensures through its own chassis
development and testing that when Intel® server building blocks are used together, the fully
integrated system meets the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel® developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of
airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.
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Intel order number G17455-004
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Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
2.
Product Overview
Product Overview
The Intel® Server System R1304BTLSFAN and R1304BTLSHBN are both of 1U server system
designed to support the Intel® Server Board S1200BTL. The Intel® Server System
R1304BTSSFAN is 1U server system designed to support the Intel® Server Board S1200BTS.
Intel® Server Board S1200BTL, Intel® Server Board S1200BTS and the systems have features
designed to support the entry-level market. This chapter provides a high-level overview of the
system features. The following chapters provide greater detail for each major system
component or feature.
Table 1. System Feature Set
Feature
Server Board
Description
®
Intel Server System R1304BTLSFAN/R1304BTLSHBN:
ƒ Intel® Server Board S1200BTL
Intel® Server System R1304BTSSFAN:
ƒ Intel® Server Board S1200BTS
Processors
Support for one Intel® Xeon® E3-1200 processor, Intel® Xeon® E3-1200 V2
processor, the 2nd Generation Intel® Core™ i3 Processor or the 3rd Generation Intel®
Core™ i3 Processor in FC-LGA 1155 socket package.
ƒ 5.0 GT/s point-to-point DMI interface to PCH
ƒ LGA 1155 pin socket
ƒ TDP 95W
Memory
Two memory channels:.
ƒ Up to 2 UDIMMs per channel
ƒ 32 GB maximum with x8 ECC UDIMM (2 Gb DRAM)
Chipset
Intel® Server Board S1200BTL:
ƒ Support for Intel® C204 Platform Controller Hub (PCH)
ƒ ServerEngines* LLC Pilot III BMC controller (Integrated BMC)
Intel® Server Board S1200BTS:
ƒ Support for Intel® C202 Platform Controller Hub (PCH)
I/O
®
Intel Server System R1304BTLSFAN/R1304BTLSHBN:
External connections:
ƒ DB-15 video connector
ƒ DB-9 serial Port A connector
ƒ Four USB ports on two USB/LAN combo connectors at rear of board
ƒ Two USB ports on front panel
Internal connections:
ƒ Two USB 2x5 pin headers, each supporting two USB 2.0 ports
ƒ One 2x5 Serial Port B headers
ƒ One SATA RAID key connector
ƒ Two 6Gb/s SATA ports and four 3Gb/s SATA ports
ƒ One SAS mezzanine slot for optional SAS module
ƒ One TPM module connector
ƒ One RMM4 module connector
®
Intel Server System R1304BTSSFAN:
External connections:
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3
Product Overview
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Feature
Description
ƒ
ƒ
ƒ
ƒ
DB-15 video connector
DB-9 serial Port A connector
Four USB ports on two USB/LAN combo connectors at rear of board
Two USB ports on front panel
Internal connections:
ƒ Two USB 2x5 pin headers, each supporting two USB 2.0 ports
ƒ One 2x5 Serial Port B headers
ƒ One SATA RAID key connector
ƒ Six 3Gb/s SATA ports
Video
Intel® Server System R1304BTLSFAN/R1304BTLSHBN:
Onboard ServerEngines* LLC Pilot II BMC Controller
ƒ Integrated 2D Video Controller
ƒ External 32MB (or above) DDR3 800MHz memory
®
Intel Server System R1304BTSSFAN:
ƒ Silicon Motion SM712GX04LF02-BA
LAN
One Gigabit Ethernet device 82574L connect to PCI-E x1 interfaces on the PCH.
One Gigabit Ethernet PHY 82579 connected to PCH through PCI-E x1 interface
Expansion Capabilities
One x8 PCI Express* PCI riser slot capable of supporting a low-profile PCI Express*
add-in card which consumes power less than 25 W.
Hard Drive Options
Four SATA drives
Peripherals
Slimline bay for slimline SATA optical drive
One PCI Express* x8 Add-in Card slot (Gen 2)
Control Panel
Standard control panel
LEDS and displays
LEDs with standard control panel:
ƒ NIC1 Activity
ƒ NIC2 Activity
ƒ Power/Sleep
ƒ System Status
ƒ Hard Drive Activity
Power supply
®
Intel Server System R1304BTLSFAN/R1304BTSSFAN:
ƒ Single 250-W power supply
Intel® Server System R1304BTLSHBN:
ƒ Single 350-W power supply
Fans
Three non-redundant, variable-speed system cooling fans
Server Management
Intel® Server System R1304BTLSFAN/R1304BTLSHBN:
Onboard LLC Pilot III Controller (iBMC)
ƒ Integrated Baseboard Management Controller (Integrated BMC), IPMI 2.0
compliant
ƒ Integrated 2D video controller on PCI-E x1
ƒ Optional Intel® Remote Management Module 4 (RMM4) lite and optional
dedicated NIC module.
Security
Intel® TPM module connector
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Revision 2.0
Intel® Serve
er System R130
04BTSSFAN/R1304BTLSFAN
N/R1304BTLSH
HBN TPS
2.1
Product Oveerview
System
S
Vie
ews
Figu
ure 1. Intel® Server
S
Syste
em R1304BT
TSSFAN/R130
04BTLSFAN
Figure 2.
2 Intel® Serv
ver System R
R1304BTLSH
HBN
2.2
Chassis
C
Dim
mensions
Table 2. Intel® Serrver System R1304BTSSF
FAN/R1304B
BTLSFAN/R1304BTLSHBN Dimension
ns
Hight
H
Width
W
Depth
D
Revision 2.0
1.67 inches
s (4.24 centime
eters)
17.25inches
s (43.82 centim
meters)
21.8 inches
s (55.37 centim
meters)
Intel order number
n
G1745
55-004
5
Product Overview
2.3
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
System Components
A
Rack handles (two)
F
System Memory DIMM slots
B
Server Board
G
Cooling Fans
C
PCIe* Riser Assembly
H
Front Panel
D
Processor and Heatsink
I
Hard Drive Bays
E
Power supply
J
Front Panel Slimline optical drive
Figure 3. Intel® Server System R1304BTSSFAN/R1304BTLSFAN Major System Components
6
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Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
A
Rack handles (two)
F
System Memory DIMM slots
B
Server Board
G
Cooling Fans
C
PCIe* Riser Assembly
H
Front Panel Board
D
Processor and Heatsink
I
Hard Drive Bays
E
Power supply
J
Slimline optical drive
Product Overview
Figure 4. Intel® Server System R1304BTLSHBN Major System Components
The I/O connector locations on the back of the system are pre-cut, so an I/O shield is not
required. The EMI gasket is pre-installed to maintain electromagnetic interference (EMI)
compliance levels. The layout arrangement is the same for both the fixed and
hot-swap systems.
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Intel order number G17455-004
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Product Overview
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
A
AC Power Connector
E
NIC 2 Connector (10/100/1000 Mb)
B
Serial Port A
F
PCI Express* Slot
C
Video Connector
G
USB Ports
D
NIC 1 Connector (10/100/1000 Mb)
H
USB Ports
Figure 5. Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN Back Panel
Features
2.4
System Boards
The Intel® Server Systems R1304BTSSFAN, R1304BTLSFAN and R1304BTLSHBN include
system boards used as internal interconnects and provide feature accessibility. The following
section provides a brief description for each.
2.4.1
Intel® Server System R1304BTSSFAN
®
The Intel Server System R1304BTSSFAN includes an Intel® Server Board S1200BTS. This
board supports a PCI Express* riser card.
ƒ
2.4.2
PCI Express* Riser Card – Supports a single, low-profile x8 PCI Express* riser card.
Intel® Server System R1304BTLSFAN
The Intel® Server System R1304BTLSFAN includes an Intel® Server Board S1200BTL. This
board supports a PCI Express* riser card.
ƒ
2.4.3
PCI Express* Riser Card – Supports a single, low-profile x8 PCI Express* riser card.
Intel® Server System R1304BTLSHBN
The Intel® Server System R1304BTLSHBN includes an Intel® Server Board S1200BTL. This
board supports one riser card options. The Intel® Server System R1304BTLSHBN supports a
hot-swap SATA/SAS back plane with four SATA/SAS drives.
ƒ
2.5
PCI Express* Riser Card –Supports a single, low-profile x8 PCI Express* riser card.
System Cooling
The Intel® Server System R1304BTSSFAN, R1304BTLSFAN and R1304BTLSHBN provide
three, non-redundant system cooling fans. When external ambient temperatures remain within
specified limits, the cooling system provides sufficient air flow for all drive configurations,
processors, supported memory, and add-in cards.
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2.6
Product Overview
Rack and Cabinet Mounting Options
The server systems were designed to support 19-inches wide by up to 30-inches deep server
cabinets. The server systems support the following rack mount option:
Slide rail kit (Product order code – AXXVRAIL): Designed to mount the chassis into a standard
(19-inch by up to 30-inch deep) EIA-310D compatible server cabinet.
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Intel order number G17455-004
9
250W Power Subsystem
3.
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
250W Power Subsystem
The power subsystem of the server systems consists of a single, non-redundant 250-W power
supply with five outputs: 3.3 V, 5 V, 12 V, -12V and 5 VSB. The form factor fits into a 1U system
and provides a wire harness output to the system. An IEC connector is provided on the external
face for AC input to the power supply. The power supply provides one; non-redundant 40 mm
fan for self -cooling. The power supply fans also provide additional airflow for parts of
the system.
The power supply operates within the following voltage ranges and ratings:
Table 3. Input Voltage Range
PARAMETER
MIN
RATED
MAX
Max Input AC Current
Line Voltage (110)
90Vrms
100-127 Vrms
140Vrms
6 Arms1
2
Line Voltage (220)
180Vrms
200-240 Vrms
264Vrms
3 Arms
Frequency
47 Hz
50/60Hz
63 Hz
Notes:
1. Maximum input current at low input voltage range shall be measured at 90Vac, at max load.
2. Maximum input current at high input voltage range shall be measured at 180VAC, at max load.
The power supply must operate within all specified limits over the following input voltage ranges
shown in the table. Harmonic distortion of up to 10% Total Harmonic Distortion (THD) must not
cause the power supply to go out of specified limits.
3.1
Mechanical Specifications
The 1U 250 W power supply is designed specifically for use in the Intel® Server Systems
R1304BTSSFAN and R1304BTLSFAN. The physical size of the power supply enclosure is
intended to accommodate power ranges from 250 W. The power supply size is 40 mm x 81.5
mm x 150 mm and has a wire harness for the DC outputs. The AC input plugs directly into the
external face of the power supply; refer to the following figure for more information.
10
Intel order number G17455-004
Revision 2.0
Intel® Serve
er System R130
04BTSSFAN/R1304BTLSFAN
N/R1304BTLSH
HBN TPS
250
0W Power Subssystem
Figurre 6. Power Supply
S
Enclo
osure Drawin
ng
Notes:
1. All dimensions are
a in millimeter.
3.2
Output
O
Con
nnectors
Listed orr recognized component appliance wiring
w
materiial (AVLV2), CN, rated m
min 80°C, 3
300
VDC sho
ould be used
d for all outpu
ut wiring.
Table 4. Intel® 25
50W PSU Ca
able Lengths
s
Pow
wer Supply cov
ver exit hole
Length
(mm)
230
P1
Baseboard
d Power Conne
ector
Pow
wer Supply cov
ver exit hole
220
P2
Processorr Power Connector
Pow
wer Supply cov
ver exit hole
440
P7
SATA Drivve Power Conn
nector
From
Revision 2.0
To connector #
Description
Intel order number
n
G1745
55-004
11
250W Power Subsystem
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Power Supply cover exit hole
Length
(mm)
600
P3
Mini SATA Drive Power Connector
P7
185
P6
SATA Drive Power Connector
P6
185
P5
SATA Drive Power Connector
P5
185
P4
SATA Drive Power Connector
From
3.2.1
To connector #
Description
Baseboard power connector (P1)
Connector housing: 24-Pin Molex* Mini-Fit Jr. 39-01-2200 or equivalent.
Contact: Molex* Mini-Fit, HCS, female, crimp 44476-1111 or equivalent approved by Intel®.
Table 5. P1 Main Power Connector
1*
Pin
Signal
+3.3VDC
3.3V S
18 AWG Color
Orange
Orange (24AWG)
2
3
4
5
+3.3VDC
GND
+5VDC
GND
Orange
Black
Red
Black
6
7
8
9
10*
+5VDC
GND
PWR OK
5 VSB
+12V
12VRS
Red
Black
Gray
Purple
Yellow
Yellow/White (24AWG)
Pin
Signal
+3.3VDC
-12VDC
18 AWG Color
Orange
Blue
13
14
15*
GND
PSON#
GND
COMRS
Black
Green (24AWG)
Black
Black (24AWG)
16
17
18
19
20*
GND
GND
Reserved
+5VDC
+5VDC
5VRS
Black
Black
N.C.
Red
Red
Red/White (24AWG)
11
12
Notes:
1.
2.
3.2.2
Remote Sense wire double-crimped.
P1 add cable bend requirement at P1.
Processor Power Connector (P2)
Connector housing: 8-Pin Molex* 39-01-2085 or equivalent.
Contact: 44476-1111 or equivalent.
Table 6. P2 Processor Power Connector
Pin
1
2
3
4
3.2.3
Signal
COM
COM
COM
COM
20 AWG color
Black
Black
Black
Black
Pin
5
6
7
8
Signal
+12V
+12V
+12V
+12V
20 AWG Color
Yellow
Yellow
Yellow
Yellow
SATA Hard Drive Power Connectors (P4, P5, P6, P7)
Connector housing: JWT A3811H00-5P (94V2) or equivalent.
Contact: JWT A3811TOP-0D or equivalent.
Table 7. SATA Power Connector
12
Intel order number G17455-004
Revision 2.0
Intel® Serve
er System R130
04BTSSFAN/R1304BTLSFAN
N/R1304BTLSH
HBN TPS
Pin
P
1
2
3
4
5
3.2.4
Signal
+3.3V
GND
+5VDC
GND
+12V
250
0W Power Subssystem
18 AWG Colorr
Orange
Black
Red
Black
Yellow
Mini SATA
A Hard Drive Power Connectors (P
P3)
Connecto
or housing: AMPHENDO
A
OL* SSATA--111-1201-1 -3 or equiva
alent.
Table 8. SAT
TA Power Co
onnector
Pin
P
1
2
3
4
5
6
3.3
Signal
N/C
+5V
+5V
N/C
GND
GND
18 AWG Colorr
N/C
Red
Red
N/C
Black
Black
AC
A Inlet Connector
The AC input connec
ctor should be
b an IEC 32
20 C-14 pow
wer inlet. Thiis inlet is rate
ed for
10A/250 VAC.
3.3.1
AC Power Cord Specification Requirementss
The AC power
p
cord must
m
meet th
he following specificatio n requireme
ents:
Cable Type
T
Wire Size
Temperature
e Rating
Amperage Rating
R
Voltage Ratin
ng
SJT
16 AWG
10 5º C
13 A
12 5 V
Figu
ure 7. AC Power Cord Sp
pecifications
Revision 2.0
Intel order number
n
G1745
55-004
13
250W Power Subsystem
3.4
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Marking and Identification
The power supply module marking supports the following requirements: safety agency
requirements; government requirements (if required; for example, point of manufacturing);
power supply vendor requirements; and Intel® manufacturing and field support requirements.
3.5
Efficiency
The power supply should have a recommended efficiency of 85% at maximum load and over
the specified AC voltage.
3.6
AC Input Voltage
The power supply must operate within all specified limits over the following input voltage ranges,
shown in the following table.
Table 9. AC Input Rating
Parameter
Line Voltage (110)
Line Voltage (220)
Frequency
Min
90Vrms
180Vrms
47 Hz
Rated
Max
100-127 Vrms
200-240 Vrms
50/60Hz
140Vrms
264Vrms
63 Hz
Max Input AC Current
6 Arms1
3 Arms2
Notes:
1. Maximum input current at low input voltage range should be measured at 90 VAC at max load.
2. Maximum input current at high input voltage range should be measured at 180 VAC at max load.
3.7
Output Power/Currents
The following tables define two power and current ratings for this 350-W power supply. The
combined output power of all outputs should not exceed the rated output power. The power
supply must meet both static and dynamic voltage regulation requirements for the minimum
loading conditions.
Table 10. Load Ratings
Voltage
+3.3 V
+5 V
+12 V
-12 V
+5 VSB
Minimum
Maximum
Output Power
0.1 A
0.1 A
0.75 A
0A
0.05 A
6A
12 A
17 A
0.5 A
2.0 A
19.8 W
60 W
204 W
6W
10 W
Notes:
1. The total output for this PSU is 250W.
2. The total output of +3.3V&+5V will not exceed 60W
3. Peak power shall be 300W for 10sec. The peak 12V current shall be 1sec.
3.8
Protection Circuits
Protection circuits inside the power supply should cause only the power supply’s main outputs
to shut down. If the power supply latches off due to a protection circuit tripping, an AC cycle
14
Intel order number G17455-004
Revision 2.0
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
250W Power Subsystem
OFF for 15sec min (with +5VSB/0.1A) and a PSON# cycle HIGH for 1sec shall be able to reset
the power supply.
3.8.1
Over Current Protection (OCP)
Each output shall have individual OCP protection circuits. The PSU shall shutdown and latch off
after an over current condition occurs. Whereas OCP of +5VSB shall turn the power supply into
“hiccup mode” until the OCP condition removed. The values are measured at the PSU harness
connectors and shall not be damaged from repeated power cycling in this condition. There shall
be current sensors and limit circuits to shut down the entire power supply if the limit is
exceeded. The limits are listed below.
Table 11. Over Load Protection (OCP) Limits
Output Voltage
Continuous Load
Current Limit MIN
+12V
23A
25A
+5V
14.4 A
25A
15A
30A
+3.3V
-12V
4A
+5VSB
3.8.2
Current Limit MAX
4.5A
Over Voltage Protection (OVP)
Each output shall have individual OVP protection circuits built in and it shall be locally sensed.
The PSU shall shutdown and latch off after an over voltage condition occurs. The output
voltages are measured at the harness connectors. The voltage shall never exceed the
maximum levels when measured at the power pins of the output harness connector during any
single point of fail. The voltage shall never trip any lower than the minimum levels when
measured at the power pins of the connector.
Table 12. Over Voltage Protection (OVP) Limits
Output Voltage
+3.3V
+5V
+12V
-12V
+5VSB
3.8.3
OVP MIN (V)
3.7
5.6
13.3
-13.3
5.6
OVP MAX (V)
4.5
6.5
15.6
-15.6
6.5
Over Temperature Protection (OTP)
The power supply shall be protected against over temperature conditions caused by loss of fan
cooling or excessive ambient temperature. In an OTP condition the PSU will shut down. When
the power supply temperature drops to within specified limits, the power supply shall restore
Revision 2.0
Intel order number G17455-004
15
250W Power Subsystem
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
power automatically, while the +5VSB remains always on. The OTP trip level shall have a
minimum of 4º C of ambient temperature hysteresis, so that the power supply will not oscillate
on and off due to temperature recovery condition.
16
Intel order number G17455-004
Revision 2.0
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
4.
350W Power Subsystem
350W Power Subsystem
The power subsystem of the server systems consists of a single, non-redundant 350-W power
supply with five outputs: 3.3 V, 5 V, 12 V, -12V and 5 VSB. The form factor fits into a 1U system
and provides a wire harness output to the system. An IEC connector is provided on the external
face for AC input to the power supply. The power supply provides one; non-redundant 40 mm
fan for self-cooling. The power supply fans also provide additional airflow for parts of
the system.
The power supply operates within the following voltage ranges and ratings:
Table 13. Input Voltage Range
Parameter
Line Voltage (110)
Line Voltage (220)
Frequency
Min
90Vrms
180Vrms
47 Hz
Rated
Max
Max Input AC Current
100-127 Vrms
200-240 Vrms
50/60Hz
140Vrms
264Vrms
63 Hz
6 Arms1
3 Arms2
Notes:
1. Maximum input current at low input voltage range shall be measured at 90Vac, at max load.
2. Maximum input current at high input voltage range shall be measured at 180VAC, at max load.
The power supply must operate within all specified limits over the following input voltage ranges
shown in the table. Harmonic distortion of up to 10% Total Harmonic Distortion (THD) must not
cause the power supply to go out of specified limits.
4.1
Mechanical Specifications
The 1U 350 W power supply is designed specifically for use in the Intel® Server Systems
R1304BTLSHBN. The physical size of the power supply enclosure is intended to accommodate
power ranges from 350 W. The power supply size is 40 mm x 81.5mm x 150 mm and has a wire
harness for the DC outputs. The AC input plugs directly into the external face of the power
supply; refer to the following figure for more information.
Revision 2.0
Intel order number G17455-004
17
350W Power Subsystem
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Figure 8. Power Supply Enclosure Drawing
Note:
All dimensions are in millimeter.
4.2
Output Connectors
Listed or recognized component appliance wiring material (AVLV2), CN, rated min 80°C, 300
VDC should be used for all output wiring.
18
Intel order number G17455-004
Revision 2.0
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
350W Power Subsystem
Table 14. 350W PSU Cable Lengths
Power Supply cover exit hole
Length
(mm)
230
P1
Baseboard Power Connector
Power Supply cover exit hole
220
P2
Processor Power Connector
Power Supply cover exit hole
150
P3
AUX Power Connector
Power Supply cover exit hole
340
P7
2 x 4 HSBP Power Connector
P7
100
P5
SATA Drive Power Connector
P5
145
P4
SATA Drive Power Connector
Power Supply cover exit hole
600
P8
Mini SATA Drive Power Connector
From
4.2.1
To connector #
Description
Baseboard power connector (P1)
Connector housing: 24-Pin Molex* Mini-Fit Jr. 39-01-2200 or equivalent.
Contact: Molex* Mini-Fit, HCS, female, crimp 44476-1111 or equivalent approved by Intel®.
Table 15. P1 Main Power Connector
1*
Pin
Signal
+3.3VDC
3.3V S
18 AWG Color
Orange
Orange (24AWG)
2
3
4
5
+3.3VDC
GND
+5VDC
GND
Orange
Black
Red
Black
6
7
8
9
10*
+5VDC
GND
PWR OK
5 VSB
+12V
12VRS
Red
Black
Gray
Purple
Yellow
Yellow/White (24AWG)
Pin
Signal
+3.3VDC
-12VDC
18 AWG Color
Orange
Blue
13
14
15*
GND
PSON#
GND
COMRS
Black
Green (24AWG)
Black
Black (24AWG)
16
17
18
19
20*
GND
GND
Reserved
+5VDC
+5VDC
5VRS
Black
Black
N.C.
Red
Red
Red/White (24AWG)
11
12
Notes:
1.
2.
4.2.2
Remote Sense wire double-crimped.
P1 add cable bend requirement at P1.
Processor Power Connector (P2)
Connector housing: 8-Pin Molex* 39-01-2085 or equivalent.
Contact: 44476-1111 or equivalent.
Table 16. P2 Processor Power Connector
Pin
1
2
3
4
Revision 2.0
Signal
COM
COM
COM
COM
20 AWG color
Black
Black
Black
Black
Pin
5
6
7
8
Signal
+12V
+12V
+12V
+12V
Intel order number G17455-004
20 AWG Color
Yellow
Yellow
Yellow
Yellow
19
350W Power Subsystem
4.2.3
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
SATA Hard Drive Power Connectors (P4, P5)
Connector housing: JWT A3811H00-5P (94V2) or equivalent.
Contact: JWT A3811TOP-0D or equivalent.
Table 17. SATA Power Connector
Pin
1
2
3
4
5
4.2.4
Signal
18 AWG Color
+3.3V
GND
+5VDC
GND
+12V
Orange
Black
Red
Black
Yellow
Mini SATA Hard Drive Power Connectors (P8)
Connector housing: AMPHENDOL* SSATA-111-1201-1-3 or equivalent.
Table 18. SATA Power Connector
Pin
1
2
3
4
5
6
4.2.5
Signal
18 AWG Color
N/C
+5V
+5V
N/C
GND
GND
N/C
Red
Red
N/C
Black
Black
AUX Power Connector (P3)
The AUX Power Connector is used for the Power Management Bus- PMBUS.
Connector housing: Molex* 50-57-9705 or equivalent.
Contact: Molex* 16-02-0087 or equivalent.
Table 19. AUX Power Connector
1
2
Pin
Signal
SCL
SDA
24 AWG Color
White/Green
White/Yellow
3
N/C
N/C
4.2.6
Pin
4
5
Signal
COM
+3.3V
24 AWG Color
White/Black
White/Brown
Hot-swap Backplane Power Connector (P7)
Connector housing: Molex* 39-01-2085 or equivalent.
Contact: Molex* 39-00-0079 or equivalent.
20
Intel order number G17455-004
Revision 2.0
Intel® Serve
er System R130
04BTSSFAN/R1304BTLSFAN
N/R1304BTLSH
HBN TPS
350
0W Power Subssystem
Ta
able 20. P7 HSBP Power Connector
Pin
1
2
3
4
4.3
Signall
GND
GND
+5V
NC
18 AWG
A
Color
Black
Black
Red
NC
Pin
5
6
7
8
Signal
12V
V
NC
NC
3.3V
V
18
8 AWG Color
Yellow
NC
NC
Orange
AC
A Inlet Connector
The AC input connec
ctor should be
b an IEC 32
20 C-14 pow
wer inlet. Thiis inlet is rate
ed for
10A/250 VAC.
4.3.1
AC Power Cord Specification Requirementss
The AC power
p
cord must
m
meet th
he following specificatio n requireme
ents:
Cable Type
T
Wire Size
Temperature
e Rating
Amperage Rating
R
SJT
16 AWG
10 5º C
13 A
Voltage Ratin
ng
12 5 V
Figu
ure 9. AC Power Cord Sp
pecifications
4.4
Marking
M
an
nd Identificcation
The power supply mo
odule markin
ng supports the followin g requireme
ents: safety a
agency
requirem
ments; govern
nment requirrements (if required;
r
for example, po
oint of manu
ufacturing);
power su
upply vendorr requiremen
nts; and Inte
el® manufactu
uring and fie
eld support rrequirementss.
4.5
Efficiency
E
The power supply sh
hould have a recommend
ded efficienccy of 85% att maximum lload and ove
er
the specified AC volttage.
4.6
AC
A Input Vo
oltage
The power supply must operate within all specified limitss over the fo
ollowing inpu
ut voltage ran
nges,
shown in
n the followin
ng table.
Revision 2.0
Intel order number
n
G1745
55-004
21
350W Power Subsystem
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Table 21. AC Input Rating
Parameter
Line Voltage (110)
Line Voltage (220)
Frequency
Min
90Vrms
180Vrms
47 Hz
Rated
Max
100-127 Vrms
200-240 Vrms
50/60Hz
140Vrms
264Vrms
63 Hz
Max Input AC Current
6 Arms1
3 Arms2
Notes:
1.
2.
4.7
Maximum input current at low input voltage range should be measured at 90 VAC at max load.
Maximum input current at high input voltage range should be measured at 180 VAC at max load.
Output Power/Currents
The following tables define two power and current ratings for this 350-W power supply. The
combined output power of all outputs should not exceed the rated output power. The power
supply must meet both static and dynamic voltage regulation requirements for the minimum
loading conditions.
Table 22. Load Ratings
Voltage
+3.3 V
+5 V
+12 V1
+12 V2
-12 V
+5 VSB
Minimum
Maximum
Output Power
0.1 A
0.1 A
0.75 A
0.75 A
0A
0.05 A
10 A
16 A
18 A
18 A
0.5 A
2.5 A
33W
80W
216W
216W
6W
12.5W
Notes:
1.
2.
3.
4.8
The total current of +12V1/2 will not exceed 28A.
The total output for this PSU is 350W.
The total output of +3.3V&+5V will not exceed 100W
Protection Circuits
Protection circuits inside the power supply should cause only the power supply’s main outputs
to shut down. If the power supply latches off due to a protection circuit tripping, an AC cycle
OFF for 15sec min (with +5VSB/0.1A) and a PSON# cycle HIGH for 1sec shall be able to reset
the power supply.
4.8.1
Over Current Protection (OCP)
Each output shall have individual OCP protection circuits. The PSU shall shutdown and latch off
after an over current condition occurs. Whereas OCP of +5VSB shall turn the power supply into
“hiccup mode” until the OCP condition removed. The values are measured at the PSU harness
connectors and shall not be damaged from repeated power cycling in this condition. There shall
be current sensors and limit circuits to shut down the entire power supply if the limit is
exceeded. The limits are listed below.
22
Intel order number G17455-004
Revision 2.0
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
350W Power Subsystem
Table 23. Over Load Protection (OCP) Limits
Output Voltage
Continuous Load
Current Limit MIN
Current Limit MAX
18.2A
20A
18.2A
20A
19.2A
24A
12A
15A
4A
4.5A
+12V1
+12V2
+5V
+3.3V
-12V
+5VSB
4.8.2
Over Voltage Protection (OVP)
Each output shall have individual OVP protection circuits built in and it shall be locally sensed.
The PSU shall shutdown and latch off after an over voltage condition occurs. The output
voltages are measured at the harness connectors. The voltage shall never exceed the
maximum levels when measured at the power pins of the output harness connector during any
single point of fail. The voltage shall never trip any lower than the minimum levels when
measured at the power pins of the connector.
Table 24. Over Voltage Protection (OVP) Limits
Output Voltage
+3.3V
+5V
+12V1/+12V2
-12V
+5VSB
4.8.3
OVP MIN (V)
3.7
5.7
13.3
-13.3
5.7
OVP MAX (V)
4.5
6.5
15.6
-15.6
6.5
Over Temperature Protection (OTP)
The power supply shall be protected against over temperature conditions caused by loss of fan
cooling or excessive ambient temperature. In an OTP condition the PSU will shut down. When
the power supply temperature drops to within specified limits, the power supply shall restore
power automatically, while the +5VSB remains always on. The OTP trip level shall have a
minimum of 4°C of ambient temperature hysteresis, so that the power supply will not oscillate
on and off due to temperature recovery condition.
4.9
PMBus
The PMBus features included in this specification are requirements for ac/dc silver box power
supply for use in server systems. This specification is based on the PMBus™ Specifications
Parts I and II, revision 1.1X3.
4.9.1
Related Documents
PMBus™ Power System Management Protocol Specification Part I – General Requirements,
Transport And Electrical Interface; Revision 1.1X3
PMBus™ Power System Management Protocol Specification Part II – Command Language;
Revision 1.1X3 SMBus 2.0.
Revision 2.0
Intel order number G17455-004
23
350W Power Subsystem
4.9.2
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Addressing
The power supply device address locations are shown below. For redundant systems there are
two signals to set the address location of the power supply once it is installed in the system;
Address0 and Address1. For non-redundant systems the power supply device address locations
should align with the Address0/Address1 location of 0/0.
PDB addressing Address0/Address1
Power supply PMBusTM device
0/0
B0h
0/1
B2h
1/0
B4h
1/1
B6h
Note: Non-redundant power supplies will use the 0/0 address locations.
24
Intel order number G17455-004
Revision 2.0
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
5.
Cooling Subsystem
Cooling Subsystem
The Intel® Server System R1304BTSSFAN, R1304BTLSFAN and R1304BTLSHBN cooling
subsystem consists of three fans, CPU air duct, and PS/electronics bay isolation air baffle.
These components provide the necessary cooling and airflow to the system. A fan on the
processor heatsink is not needed.
To maintain the necessary airflow within the system, the air duct and the top cover must be
properly installed.
Note: The Intel® Server Systems R1304BTSSFAN, R1304BTLSFAN and R1304BTLSHBN do
not support redundant cooling. If a fan fails, the system should be powered down as soon as
possible to replace the failed fan blower. The system fans are not hot-swappable.
Figure 10. Intel® Server System R1304BTSSFAN/R1304BTLSFAN Fan Module Assembly
Revision 2.0
Intel order number G17455-004
25
Cooling Subsystem
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Figure 11. Intel® Server System R1304BTLSHBN Fan Module Assembly
26
Intel order number G17455-004
Revision 2.0
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
5.1
Cooling Subsystem
Power Supply Fans
The power supply supports one, non-redundant 40 mm fans. It is responsible for the cooling of
the power supply.
5.2
CPU Air Duct
The chassis requires the use of a CPU air duct to direct airflow through the processor’s heatsink
and memory area.
Figure 12. Intel® Server System R1304BTSSFAN/R1304BTLSFAN Air Duct
Revision 2.0
Intel order number G17455-004
27
Cooling Subsystem
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Figure 13. Intel® Server System R1304BTLSHBN Air Duct
28
Intel order number G17455-004
Revision 2.0
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
6.
Peripheral and Hard Drive Support
Peripheral and Hard Drive Support
The Intel® Server Systems R1304BTSSFAN/R1304BTLSFAN provides support for four fixed
hard drive bays and one slimline peripheral drive bay at the front of the chassis. The fixed hard
drive bays are designed to support SATA drives only.
A
Slimline optical drive bay
B
Hard drive bays
Figure 14. Intel® Server Systems R1304BTSSFAN/R1304BTLSFAN Drive Bays
The Intel® Server System R1304BTLSHBN provides support for four hot-swap hard drive bays
and one slimline peripheral drive bay at the front of the system. The hot-swap drive bays are
designed to support SATA/SAS drives.
Revision 2.0
Intel order number G17455-004
29
Peripheral and Hard Drive Support
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
A
Slimline optical drive bay
B
Hot-swap Drive Bays
Figure 15. Intel® Server Systems R1304BTLSHBN Drive Bays
6.1
Optical Drive Support
Both the fixed and hot-swap systems provide a slimline drive bay that you can configure for an
SATA optical CD-ROM or DVD/CDR drive. The slimline devices are not hot-swappable.
6.1.1
Optical Drive Support
The server systems support a slimline SATA optical drive.
6.2
Hard Disk Drive Support
The Intel® Server System R1304BTSSFAN/R1304BTLSFAN supports up to four, 3.5-inch by 1inch fixed SATA hard disk drives. The drives are mounted inside the chassis and are not hotswappable. The Intel® Server System R1304BTLSHBN supports up to four SATA hard disk
drives mounted in hot-swappable drive carriers.
6.2.1
System Fan Connectors
®
The Intel Server Systems R1304BTSSFAN, R1304BTLSFAN and R1304BTLSHBN support
three system cooling fans. The following table provides the pin-out for each connector.
Table 25. System Four-pin Fan Headers Pin-outs
Pin
30
Signal Name
Type
Description
1
Ground
Power
GROUND is the power supply ground.
2
Fan Power
Power
Fan Power
3
Fan Tach
Out
FAN_TACH signal is connected to the Heceta* to monitor the FAN
speed.
4
PWM
Control
Pulse Width Modulation – Fan Speed Control signal
Intel order number G17455-004
Revision 2.0
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
7.
Front Control Panel
Front Control Panel
The standard control panel supports a power button, status LED, hard drive activity LED, and
NIC 1 and NIC 2 activity LEDs. The control panel assembly comes pre-assembled into the
chassis. The control panel assembly module slides into a predefined slot on the front of the
chassis. Once installed, communication to the server board is achieved through a standard 24pin cable connected directly to the server board.
Note: The LAN3/4 LEDs are not used on the Intel® Server Systems R1304BTSSFAN,
R1304BTLSFAN or R1304BTLSHBN. Unstuffable ID Button with ID LED and Status/Fault LED
are not used on Intel® Server System R1304BTSSFAN.
A. Unstuffable ID Button with ID LED
F. Status/Fault LED
B. NMI Button
G. Power Button with power LED
C. LAN1 LED
H. LAN2 LED
D. LAN3 LED
I. LAN4 LED
E. Reset Button
J. HDD LED
Figure 16. Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN Front Control
Panel
Revision 2.0
Intel order number G17455-004
31
Front Control Panel
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Table 26. Control Panel LED Functions
LED
Color
State
Description
NIC1/NIC2
Activity
Green
On
NIC Link/no access
Green
Blink
LAN access
Power/Sleep
(on standby power)
Green
On
Power on
Blink
Sleep/ACPI S1 state
Off
Off
Power Off/ACPI S4 state
N/A
N/A
N/A
Green
Random blink
HDD access
Off
Off
No hard disk activity
System Status
(on standby power)
Disk Activity
7.1.1
Power/Sleep LED
Table 27. SSI Power LED Operation
State
Power Mode
LED
Description
Power Off
Non-ACPI
Off
System power is off, and the BIOS has not initialized the chipset.
Power On
Non-ACPI
On
System power is on, but the BIOS has not yet initialized the chipset.
S5
ACPI
Off
Mechanical is off, and the operating system has not saved any context
to the hard disk.
S4
ACPI
Off
Mechanical is off, and the operating system has saved context to the
hard disk.
S3-S1
ACPI
Slow blink 1
DC power is still on. The operating system has saved context and
gone into a level of low-power state.
S0
ACPI
Steady on
System and the operating system are up and running.
Note:
The blink rate is ~ 1 Hz at 50% duty cycle.
7.1.2
System Status LED
The system status LED is available on the Intel® Server Systems R1304BTLSFAN and
R1304BTLSHBN.
7.1.3
Drive Activity LED
The drive activity LED on the front panel indicates drive activity from the onboard hard
disk controllers.
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Intel order number G17455-004
Revision 2.0
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
8.
PCI Riser Cards and Assembly
PCI Riser Cards and Assembly
The Intel® Server System R1304BTSSFAN, R1304BTLSFAN and R1304BTLSHBN provides
one PCI Express* x8 slot which supports one riser card with one riser card slot. The riser card
supports one low-profile PCI Express* x8 add-in card that consumes power less than 15 W.
Figure 17. PCI–E Riser Card Assembly for Intel® Server System R1304BTSSFAN, R1304BTLSFAN,
and R1304BTLSHBN
Revision 2.0
Intel order number G17455-004
33
Intel® Server System R1304BTLSHBN Passive SAS/SATA Hot-swap Backplane
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
9.
Intel® Server System R1304BTLSHBN Passive SAS/SATA
Hot-swap Backplane
The Intel® Server System R1304BTLSHBN supports a passive backplane designed to be
compatible with the Intel® Server Board S1200BTL. The Intel® Server Board S1200BTL is
connected directly to the SATA backplane (default) or you can connect the backplane to an addin SAS or SATA adapter.
The system supports a multi-functional SATA/SAS backplane with the following features:
ƒ Four SATA/SAS compatible hot-swap hard drive connectors
ƒ Four SATA/SAS connectors to the baseboard
ƒ Hard Drive Activity LED for each hard drive connector
ƒ One 2x4-pin power connector
The Intel® Server Board S1200BTL on-board SATA controller supports the following
RAID arrays:
ƒ
ƒ
Intel® Embedded Server RAID Technology II – RAID 0, 1, and 10.
Intel® Matrix Storage Technology - RAID 0, 1, 10, or 5 (Microsoft Windows* only)
This system support drive status LEDs, You can determine a failed drive and drive rebuild
activity by observing the drive activity LED.
Figure 18. Intel® Server System R1304BTLSHBN Hot-swap Backplane
34
Intel order number G17455-004
Revision 2.0
Intel® Server System R1304BTLSHBN Passive SAS/SATA Hot-swap Backplane
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Table 28. Passive SATA/SAS Backplane Power Connector Pin-out
Pin #
Signal Name
1
2
Ground
3
P5V
4
P5V
5
P12V
6
P12V
7
No Connection
8
P3V3
Ground
Table 29. Passive SATA/SAS Backplane Connector to Hard Drive Pin-out
Pin #
9.1.1
Signal Name
S1
Ground
S2
SAS_DRVxA_RX_P
S3
SAS_DRVxA_RX_N
S4
Ground
S5
SAS_DRVxA_TX_N
S6
SAS_DRVxA_TX_P
S7
Ground
P1
TP
P2
TP
P3
TP
P4
Ground
P5
Ground
P6
Ground
P7
P5V_DRVx_PRECHG
P8
P5V
P9
P5V
P10
Ground
P11
LED_DRVx_READY_N
P12
Ground
P13
P12V_DRVx_PRECHG
P14
P12V
P15
P12V
Hot-swap Drive Trays
You must mount each hard drive to a hot-swap drive tray, making insertion and extraction of the
drive from the system very simple. Each drive tray has its own dual-purpose latching
mechanism, which is used to both insert/extract drives from the system and lock the tray in
place. Each drive tray supports a light pipe providing a drive activity indicator, located on the
backplane, which is viewable from the front of the system.
Revision 2.0
Intel order number G17455-004
35
Supported Intel® Server Boards
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
10. Supported Intel® Server Boards
The Intel® Server Systems R1304BTSSFAN, R1304BTLSFAN, and R1304BTLSHBN are
mechanically and functionally designed to support the Intel® Server Board S1200BT family. For
detailed server board information, refer to the Intel® Server Board S1200BT Technical
Product Specification.
36
Intel order number G17455-004
Revision 2.0
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Environmental Specifications
11. Environmental Specifications
11.1 System Level Environmental Limits
The following table defines the system-level operating and non-operating environmental limits.
Table 30. System Environmental Limits Summary
Parameter
Limits
Operating Temperature
+10° C to +35° C with the maximum rate of change not to exceed 10° C per hour
Non-Operating
Temperature
-40° C to +70° C
Non-Operating Humidity
90%, non-condensing at 35° C
Acoustic noise
Sound Power: 7.0 BA in an idle state at typical office ambient temperature. (23 +/2 degrees C)
Shock, operating
Half sine, 2 g peak, 11 msec
Shock, unpackaged
Trapezoidal, 25 g, velocity change 136 inches/sec (≧40 lbs to > 80 lbs)
Shock, packaged
Non-palletized free fall in height 24 inches (≧40 lbs to > 80 lbs)
Vibration, unpackaged
5 Hz to 500 Hz, 2.20 g RMS random
Shock, operating
Half sine, 2 g peak, 11 mSec
ESD
+/-12kV for air discharge and 8K for contact
System Cooling
Requirement in BTU/Hr
1660 BTU/hour
Revision 2.0
Intel order number G17455-004
37
Appendix A: Integration and Usage Tips
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Appendix A: Integration and Usage Tips
ƒ
When adding or removing components or peripherals from the server board, AC power
must be removed. With AC power plugged into the server board, 5-Volt standby is still
present even though the server board is powered off.
ƒ
When updating BIOS and BMC, AC power must be on.
ƒ
Supports only Intel® Xeon® Processor E3-1200 Series with 95 W and less Thermal
Design Power (TDP). Does not support previous generations of the Intel®
Xeon® processor.
ƒ
On the back edge of the server board are diagnostic LEDs that display a sequence of
amber POST codes during the boot process. If the server board hangs during POST, the
LEDs display the last POST event run before the hang.
ƒ
Supports only unbuffered DDR3 ECC DIMMs (UDIMMs). Does not support the mixing of
RDIMMs and UDIMMs.
ƒ
The Intel® Remote Management Module 4 (Intel® RMM4) lite connector is not compatible
with the Intel® Remote Management Module (Product Order Code - AXXRMM), Intel®
Remote Management Module 2 (Product Order Code - AXXRMM2) or Intel® Remote
Management Module 3 (Product Order Code – AXXRMM3)
ƒ
Clear the CMOS with the AC power cord plugged in. Removing the AC power before
performing the CMOS clear operation causes the system to automatically power up and
immediately power down after the CMOS clear procedure is followed and AC power is
re-applied. If this happens, remove the AC power cord, wait 30 seconds, and then reconnect the AC power cord. Power up the system and proceed to the <F2> BIOS Setup
utility to reset the needed settings.
ƒ
Normal Integrated BMC functionality is disabled with the force Integrated BMC update
jumper set to the “enabled” position (pins 2-3). The server should never be run with the
Integrated BMC force update jumper set in this position and should only be used when
the standard firmware update process fails. This jumper should remain in the default
(disabled) position (pins 1-2) when the server is running normally.
When performing a normal BIOS update procedure, the BIOS recovery jumper must be
set to its default position (pins 1-2).
ƒ
38
Intel order number G17455-004
Revision 2.0
Appendix B: Integrated BMC Sensor Tables
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Appendix B: Integrated BMC Sensor Tables
Intel® Server Board S1200BTL implements the below sensors:
Sensor Type Codes
Sensor table given below lists the sensor identification numbers and information regarding the
sensor type, name, supported thresholds, assertion and de-assertion information, and a brief
description of the sensor purpose. Refer to the Intelligent Platform Management Interface
Specification, Version 2.0 for sensor and event/reading-type table information.
ƒ
Sensor Type
The sensor type references the values in the Sensor Type Codes table in the Intelligent
Platform Management Interface Specification Second Generation v2.0. It provides a
context to interpret the sensor.
ƒ
Event/Reading Type
The event/reading type references values from the Event/Reading Type Code Ranges
and the Generic Event/Reading Type Code tables in the Intelligent Platform
Management Interface Specification Second Generation v2.0. Digital sensors are
specific type of discrete sensors that only have two states.
ƒ
Event Thresholds/Triggers
The following event thresholds are supported for threshold type sensors:
[u,l][nr,c,nc] upper non-recoverable, upper critical, upper non-critical, lower nonrecoverable, lower critical, lower non-critical
uc, lc upper critical, lower critical
Event triggers are supported event-generating offsets for discrete type sensors. The
offsets can be found in the Generic Event/Reading Type Code or Sensor Type Code
tables in the Intelligent Platform Management Interface Specification Second Generation
v2.0, depending on whether the sensor event/reading type is generic or a sensorspecific response.
ƒ
ƒ
ƒ
Assertion/De-assertion
Assertion and de-assertion indicators reveal the type of events this sensor generates:
As: Assertion
De: De-assertion
Readable Value/Offsets
Readable value indicates the type of value returned for threshold and other non-discrete
type sensors.
Readable offsets indicate the offsets for discrete sensors that are readable by means of
the Get Sensor Reading command. Unless otherwise indicated, event triggers are
readable. Readable offsets consist of the reading type offsets that do not
generate events.
Event Data
Event data is the data that is included in an event message generated by the associated
sensor. For threshold-based sensors, these abbreviations are used:
R: Reading value
Revision 2.0
Intel order number G17455-004
39
Appendix B: Integrated BMC Sensor Tables
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
ƒ
ƒ
T: Threshold value
Rearm Sensors
The rearm is a request for the event status for a sensor to be rechecked and updated
upon a transition between good and bad states. Rearming the sensors can be done
manually or automatically. This column indicates the type supported by the sensor. The
following abbreviations are used in the comment column to describe a sensor:
A: Auto-rearm
M: Manual rearm
I: Rearm by init agent
Default Hysteresis
The hysteresis setting applies to all thresholds of the sensor. This column provides the
count of hysteresis for the sensor, which can be 1 or 2 (positive or negative hysteresis).
ƒ
Criticality
Criticality is a classification of the severity and nature of the condition. It also controls the
behavior of the front panel status LED.
ƒ
Standby
Some sensors operate on standby power. These sensors may be accessed and/or
generate events when the main (system) power is off, but AC power is present.
.
40
Intel order number G17455-004
Revision 2.0
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Appendix B: Integrated BMC Sensor Tables
Table 31. BMC Core Sensors
Full Sensor Name
(Sensor name in SDR)
Sensor
#
Platform
Applicability
Sensor Type
Event/Reading
Type
Event Offset Triggers
Contrib. To
System Status
Assert/Deassert
Readable
Value/Off
sets
Event
Rearm
Stand-by
A
X
Data
00 - Power down
OK
04 - A/C lost
Power Unit Status
(Pwr Unit Status)
01h
All
Power Unit
09h
Sensor Specific
6Fh
05 - Soft power control
failure
Fatal
As and
De
–
Trig
Offset
06 - Power unit failure
Power Unit
Redundancy1
02h
(Pwr Unit Redund)
Revision 2.0
Chassisspecific
Power Unit
09h
Generic
0Bh
00 - Fully Redundant
OK
01 - Redundancy lost
Degraded
02 - Redundancy
degraded
Degraded
03 - Non-redundant:
sufficient resources.
Transition from full
redundant state.
Degraded
04 – Non-redundant:
sufficient resources.
Transition from
insufficient state.
Degraded
05 - Non-redundant:
insufficient resources
Fatal
06 – Redundant:
degraded from fully
redundant state.
Degraded
Intel order number G17455-004
As and
De
–
Trig
Offset
A
X
41
Appendix B: Integrated BMC Sensor Tables
Full Sensor Name
(Sensor name in SDR)
Sensor
#
Platform
Applicability
Sensor Type
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Event/Reading
Type
Event Offset Triggers
07 – Redundant:
Transition from nonredundant state.
Contrib. To
System Status
Assert/Deassert
Readable
Value/Off
sets
Event
Rearm
Stand-by
Data
Degraded
00 - Timer expired,
status only
IPMI Watchdog
03h
Watchdog 2
Sensor Specific
23h
6Fh
All
(IPMI Watchdog)
01 - Hard reset
02 - Power down
OK
As
–
OK
As and
De
–
OK
As
Fatal
OK
Trig
Offset
A
X
Trig
Offset
A
X
–
Trig
Offset
A
–
As and
De
–
Trig
Offset
A
–
As
–
Trig
Offset
A
X
03 - Power cycle
08 - Timer interrupt
Physical Security
04h
(Physical Scrty)
FP Interrupt
05h
(FP NMI Diag Int)
Chassis
Intrusion is
chassisspecific
Chassis specific
Physical
Security
05h
Critical
Interrupt
13h
SMI Timeout
Sensor Specific
04 - LAN leash lost
6Fh
Sensor Specific
6Fh
SMI Timeout
Digital Discrete
(SMI Timeout)
F3h
03h
System Event Log
Event
Logging
Disabled
Sensor Specific
06h
07h
(System Event Log)
00 - Chassis intrusion
00 - Front panel
NMI/diagnostic
interrupt
01 – State asserted
All
All
6Fh
02 - Log area
reset/cleared
10h
42
Intel order number G17455-004
Revision 2.0
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Full Sensor Name
(Sensor name in SDR)
Sensor
#
Platform
Applicability
System
Event
System Event
08h
All
Button Sensor
(Button)
09h
All
PCH Thermal Trip
(PCH Therm Trip)
0Dh
(System Event)
Baseboard
Temperature 1
20h
21h
Baseboard
Temperature 3
22h
24h
Contrib. To
System Status
Assert/Deassert
Readable
Value/Off
sets
OK
As
_
Trig
Offset
A
X
OK
AS
_
Trig
Offset
A
X
Fatal
As and
De
–
Trig
Offset
M
X
As and
De
Analog
R, T
A
X
As and
De
Analog
R, T
A
X
As and
De
Analog
R, T
A
X
As and
De
Analog
R, T
A
X
As and
De
Analog
R, T
A
X
04 – PEF action
6Fh
Button/Switc
h
14h
Sensor Specific
Temperature
Digital Discrete
01h
03h
Temperature
Threshold
6Fh
00 – Power Button
02 – Reset Button
01 – State Asserted
nc = Degraded
[u,l] [c,nc]
01h
01h
Temperature
Threshold
All
c = Non-fatal
nc = Degraded
[u,l] [c,nc]
01h
01h
Temperature
Threshold
All
c = Non-fatal
nc = Degraded
[u,l] [c,nc]
01h
01h
Temperature
Threshold
All
(Inlet Temp)
Event Offset Triggers
Event
Rearm
Stand-by
Data
Sensor Specific
All
(Front Panel Temp)
PCH
TemperatureNote1
(PCH Temp)
12h
Event/Reading
Type
All
(Baseboard Temp)
Front Panel
Temperature
Sensor Type
Appendix B: Integrated BMC Sensor Tables
c = Non-fatal
nc = Degraded
[u,l] [c,nc]
01h
01h
Temperature
Threshold
c = Non-fatal
Hot-swap Backplane
Temperature
29h
All
nc = Degraded
[u,l] [c,nc]
01h
01h
c = Non-fatal
(HSBP Temp)
Revision 2.0
Intel order number G17455-004
43
Appendix B: Integrated BMC Sensor Tables
Full Sensor Name
(Sensor name in SDR)
Fan Tachometer
Sensors
(Chassis specific
sensor names)
Power Supply 1
Status
Sensor
#
Platform
Applicability
30h–
34h
Chassisspecific
50h
Chassisspecific
(PS1 Status)
Power Supply 2
Status
51h
Chassisspecific
(PS2 Power In)
44
Fan
54h
Chassisspecific
55h
Chassisspecific
Event/Reading
Type
Event Offset Triggers
Threshold
Contrib. To
System Status
nc = Degraded
[l] [c,nc]
04h
Power
Supply
Power
Supply
08h
(PS1 Power In)
Power Supply 2
AC Power Input
Sensor Type
08h
(PS2 Status)
Power Supply 1
AC Power Input
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Other Units
01h
c = Non-fatal2
Sensor Specific
6Fh
Sensor Specific
6Fh
00 - Presence
OK
01 - Failure
Degraded
02 – Predictive Failure
Degraded
03 - A/C lost
Degraded
06 – Configuration
error
OK
00 - Presence
OK
01 - Failure
Degraded
02 – Predictive Failure
Degraded
03 - A/C lost
Degraded
06 – Configuration
error
OK
Threshold
nc = Degraded
[u] [c,nc]
0Bh
01h
c = Non-fatal
Other Units
Threshold
nc = Degraded
[u] [c,nc]
0Bh
01h
c = Non-fatal
Intel order number G17455-004
Assert/Deassert
Readable
Value/Off
sets
Event
Rearm
Stand-by
As and
De
Analog
R, T
M
–
As and
De
–
Trig
Offset
A
X
As and
De
–
Trig
Offset
A
X
As and
De
Analog
R, T
A
X
As and
De
Analog
R, T
A
X
Data
Revision 2.0
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Full Sensor Name
(Sensor name in SDR)
Sensor
#
Platform
Applicability
Power Supply 1
+12V % of Maximum
Current Output
58h
Chassisspecific
Sensor Type
Current
Event/Reading
Type
Appendix B: Integrated BMC Sensor Tables
Event Offset Triggers
Threshold
Contrib. To
System Status
nc = Degraded
[u] [c,nc]
03h
01h
c = Non-fatal
Current
Threshold
Assert/Deassert
Readable
Value/Off
sets
Event
Rearm
Stand-by
As and
De
Analog
R, T
A
X
As and
De
Analog
R, T
A
X
As and
De
Analog
R, T
A
X
As and
De
Analog
R, T
A
X
As and
De
–
Trig
Offset
M
X
–
Analog
R, T
A
–
As and
De
Analog
Trig
Offset
A
–
As and
De
–
Trig
Offset
M
–
Data
(PS1 Curr Out %)
Power Supply 2
+12V % of Maximum
Current Output
59h
Chassisspecific
nc = Degraded
[u] [c,nc]
03h
01h
c = Non-fatal
Temperature
Threshold
(PS2 Curr Out %)
Power Supply 1
Temperature
5Ch
Chassisspecific
(PS1 Temperature)
Power Supply 2
Temperature
5Dh
Chassisspecific
[u] [c,nc]
01h
Temperature
74h
78h
Catastrophic Error
(CATERR)
6Fh
Temperature
Threshold
01h
01h
Temperature
Threshold
All
(P1 Therm Ctrl %)
80h
07h
All
(P1 Therm Margin)
Processor Thermal
Control %
Fatal
07 - Presence
OK
–
–
nc = Degraded
[u] [c,nc]
01h
01h
Processor
Digital Discrete
All
01 – State Asserted
07h
Revision 2.0
01 - Thermal trip
c = Non-fatal
All
(P1 Status)
Processor Thermal
Margin
[u] [c,nc]
Sensor Specific
c = Non-fatal
nc = Degraded
01h
Processor
70h
01h
Threshold
(PS2 Temperature)
Processor Status
nc = Degraded
03h
Intel order number G17455-004
c = Non-fatal
Non-fatal
45
Appendix B: Integrated BMC Sensor Tables
Full Sensor Name
(Sensor name in SDR)
Sensor
#
Platform
Applicability
81h
All
MSID Mismatch
82h
90h
A0h
Power Supply 1 Fan
Tachometer 2
(PS1 Fan Tach 2)
A1h
Power Supply 2 Fan
Tachometer 1
(PS2 Fan Tach 1)
A4h
Power Supply 2 Fan
Tachometer 2
(PS2 Fan Tach 2)
A5h
Processor DIMM
Aggregate Thermal
Margin
(Mem P1 Thrm
Mrgn)
46
Chassisspecific
Chassisspecific
Chassisspecific
Chassisspecific
Event Offset Triggers
Contrib. To
System Status
Assert/Deassert
Rearm
Stand-by
01 – State Asserted
Non-fatal
As and
De
–
Trig
Offset
M
–
01 – State Asserted
Fatal
As and
De
–
Trig
Offset
M
–
01 - Limit exceeded
Fatal
As and
De
–
Trig
Offset
M
–
–
–
–
Analog
–
–
–
–
–
–
Analog
–
–
–
–
–
–
Analog
–
–
–
–
–
–
Analog
–
–
–
As and
De
Analog
R, T
A
–
Digital Discrete
07h
03h
Processor
Digital Discrete
07h
03h
Temperature
Digital Discrete
All
(P1 VRD Hot)
Power Supply 1 Fan
Tachometer 1
(PS1 Fan Tach 1)
Event/Reading
Type
All
(CPU Missing)
Processor VRD
Temperature
Sensor Type
Processor
(MSID Mismatch)
Processor
Population Fault
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
01h
05h
Fan
Threshold
04h
01h
Fan
Threshold
04h
01h
Fan
Threshold
04h
01h
Fan
Threshold
04h
01h
Readable
Value/Off
sets
Event
Data
nc = Degraded
Temperature
B0h
Threshold
All
[u,l] [c,nc]
01h
01h
Intel order number G17455-004
c = Non-fatal
Revision 2.0
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Full Sensor Name
(Sensor name in SDR)
Sensor
#
Platform
Applicability
C0h
All
Sensor Type
Event/Reading
Type
Appendix B: Integrated BMC Sensor Tables
Event Offset Triggers
Contrib. To
System Status
Assert/Deassert
Readable
Value/Off
sets
Fatal
As and
De
–
As and
De
Event
Rearm
Stand-by
Trig
Offset
M
X
Analog
R, T
A
–
As and
De
Analog
R, T
A
–
As and
De
Analog
R, T
A
–
As and
De
Analog
R, T
A
X
As and
De
Analog
R, T
A
X
As and
De
Analog
R, T
A
–
As and
De
Analog
R, T
A
–
Data
Processor DIMM
Temperature
Thermal Trip
Digital Discrete
01 – State Asserted
01h
03h
Voltage
02h
Threshold
01h
[u,l] [c,nc]
Voltage
02h
Threshold
01h
[u,l] [c,nc]
Voltage
02h
Threshold
01h
[u,l] [c,nc]
All
Voltage
02h
Threshold
01h
D4h
All
Voltage
02h
Threshold
01h
[u,l] [c,nc]
D6h
All
Voltage
02h
Threshold
01h
[u,l] [c,nc]
Voltage
02h
Threshold
01h
[u,l] [c,nc]
(Mem P1 Thrm Trip)
Baseboard +12V
D0h
All
(BB +12.0V)
Baseboard +5V
D1h
All
(BB +5.0V)
Baseboard +3.3V
D2h
All
(BB +3.3V)
Baseboard +5V
Stand-by
nc = Degraded
c = Non-fatal
nc = Degraded
c = Non-fatal
nc = Degraded
c = Non-fatal
nc = Degraded
D3h
[u,l] [c,nc]
c = Non-fatal
(BB +5.0V STBY)
Baseboard +3.3V
Auxiliary
nc = Degraded
c = Non-fatal
(BB +3.3V AUX)
Baseboard +1.2V
Processor Vccp
nc = Degraded
c = Non-fatal
(BB P1 Vccp)
Baseboard +1.5V
VDDQ
D8h
All
nc = Degraded
(BB +1.5V P1 MEM)
Revision 2.0
Intel order number G17455-004
c = Non-fatal
47
Appendix B: Integrated BMC Sensor Tables
Full Sensor Name
(Sensor name in SDR)
Baseboard CMOS
Battery
Sensor
#
Platform
Applicability
DEh
All
Sensor Type
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Event/Reading
Type
Event Offset Triggers
Contrib. To
System Status
nc = Degraded
Voltage
02h
Threshold
01h
[u,l] [c,nc]
Voltage
02h
Threshold
01h
[u,l] [c,nc]
Voltage
02h
Threshold
01h
[u,l] [c,nc]
Voltage
02h
Threshold
01h
[u,l] [c,nc]
Voltage
02h
Threshold
01h
[u,l] [c,nc]
Threshold
01h
[u,l] [c,nc]
Threshold
01h
[u,l] [c,nc]
c = Non-fatal
(BB +3.3V Vbat)
Assert/Deassert
Readable
Value/Off
sets
Event
Rearm
Stand-by
As and
De
Analog
R, T
A
–
As and
De
Analog
R, T
A
–
As and
De
Analog
R, T
A
–
As and
De
Analog
R, T
A
–
As and
De
Analog
R, T
A
X
As and
De
Analog
R, T
A
–
As and
De
Analog
R, T
A
–
Data
Baseboard
Processor Vcc
E0h
All
nc = Degraded
c = Non-fatal
(BB P1 Vcc)
Baseboard
Processor VccUSA
E1h
All
nc = Degraded
c = Non-fatal
(BB P1 VccUSA)
Baseboard +1.05V
PCH
E2h
All
nc = Degraded
c = Non-fatal
(BB +1.05V PCH)
Baseboard +1.05V
Auxiliary
E3h
All
nc = Degraded
c = Non-fatal
(BB +1.05V AUX)
Baseboard +1.35V
VDDQ
nc = Degraded
E4h
All
Voltage
02h
E8h
All
Voltage
02h
(BB +1.35V P1
MEM)
Baseboard +12.0V
V1
nc = Degraded
(BB +12.0V V1)
48
c = Non-fatal
Intel order number G17455-004
c = Non-fatal
Revision 2.0
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Full Sensor Name
(Sensor name in SDR)
Sensor
#
Baseboard +1.5V
Auxiliary
Platform
Applicability
Sensor Type
Event/Reading
Type
Appendix B: Integrated BMC Sensor Tables
Event Offset Triggers
Contrib. To
System Status
Assert/Deassert
Readable
Value/Off
sets
Event
Rearm
Stand-by
As and
De
Analog
R, T
A
X
As and
De
–
Trig
Offset
A
X
As and
De
–
Trig
Offset
A
X
As and
De
–
Trig
Offset
A
X
As and
De
–
Trig
Offset
A
Data
nc = Degraded
E9h
All
Voltage
02h
Threshold
01h
[u,l] [c,nc]
c = Non-fatal
(BB +1.5V AUX)
Hard Disk Drive 0
Status
F0h
Chassisspecific
(HDD 0 Status)
Drive Slot
0Dh
Sensor Specific
00 - Drive Presence
OK
01- Drive Fault
Degraded
02- Predictive Failure
Degraded
07 - Rebuild/Remap in
progress
6Fh
Degraded
Hard Disk Drive 1
Status
F1h
Chassisspecific
(HDD 1 Status)
Hard Disk Drive 2
Status
F2h
Chassisspecific
(HDD 2 Status)
Hard Disk Drive 3
Status
Revision 2.0
F3h
Chassisspecific
Drive Slot
Sensor Specific
0Dh
6Fh
Drive Slot
0Dh
Drive Slot
Sensor Specific
6Fh
Sensor Specific
00 - Drive Presence
OK
01- Drive Fault
Degraded
02- Predictive Failure
Degraded
07 - Rebuild/Remap in
progress
Degraded
00 - Drive Presence
OK
01- Drive Fault
Degraded
02- Predictive Failure
Degraded
07 - Rebuild/Remap in
progress
Degraded
00 - Drive Presence
OK
01- Drive Fault
Degraded
Intel order number G17455-004
49
Appendix B: Integrated BMC Sensor Tables
Full Sensor Name
(Sensor name in SDR)
(HDD 3 Status)
50
Sensor
#
Platform
Applicability
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Sensor Type
0Dh
Event/Reading
Type
Event Offset Triggers
6Fh
02- Predictive Failure
Degraded
07 - Rebuild/Remap in
progress
Degraded
Intel order number G17455-004
Contrib. To
System Status
Assert/Deassert
Readable
Value/Off
sets
Event
Rearm
Data
Revision 2.0
Stand-by
Appendix C: POST Code Diagnostic LED Decoder
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Appendix C: POST Code Diagnostic LED Decoder
During the system boot process, the BIOS executes a number of platform configuration
processes, each of which is assigned a specific hex POST code number. As each configuration
routine is started, the BIOS displays the POST code to the POST Code Diagnostic LEDs on the
back edge of the server board. To assist in troubleshooting a system hang during the POST
process, you can use the diagnostic LEDs to identify the last POST process executed.
Later in POST, the BIOS displays POST Error Codes on the video monitor in the Error Manager
display. Any POST Error Codes are automatically logged in the event log.
The Diagnostic LEDs are a set of LEDs found on the back edge of the server board. The exact
implementation may differ for some boards, but in general there are 8 Diagnostic LEDs which
form a 2 hex digit (8 bit) code read left-to-right as facing the rear of the server.
An LED which is ON represents a 1 bit value, and an LED which is OFF represents a 0 bit value.
The LED bit values are read as Most Significant Bit to the left, Least Significant Bit to the right.
In the following example, the BIOS sends a value of ACh to the diagnostic LED decoder. The
LEDs are decoded as follows:
Table 32. POST Progress Code LED Example
LEDs
Upper Nibble LEDs
Lower Nibble LEDs
MSB
LSB
LED #7
LED #6
LED #5
LED #4
LED #3
LED #2
LED #1
LED #0
8h
4h
2h
1h
8h
4h
2h
1h
Status
ON
OFF
ON
OFF
ON
OFF
ON
OFF
Results
1
0
1
0
1
1
0
0
Ah
Ch
Note:
Upper nibble bits = 1010b = Ah; Lower nibble bits = 1100b = Ch; the two are concatenated as ACh.
Table 33. POST Progress Codes
Progress Code
Diagnostic LED Decoder
O = On, X=Off
Upper Nibble
Lower Nibble
MSB 8h 4h 2h 1h 8h 4h 2h 1h LSB
#7 #6 #5 #4
#3 #2 #1 #0
SEC Phase
Description
0x01
X X X X
X X X O
First POST code after CPU reset
0x02
X X X X
X X O X
CPU Microcode load begin
0x03
X X X X
X X O O
Cache As RAM initialization begin
0x05
X X X X
X O X O
SEC Core at Power On Begin.
0x06
X X X X
X O O X
Early CPU initialization during Sec
Phase
Revision 2.0
Intel order number G17455-004
51
Appendix C: POST Code Diagnostic LED Decoder
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
0x07
X X X X
X O O O
Early South Bridge initialization
0x08
X X X X
O X X X
Early North Bridge initialization
0x09
X X X X
O X X O
End Of Sec Phase
0x0E
X X X X
O O O X
CPU Microcode Not Found.
0x0F
X X X X
O O O O
CPU Microcode Not Loaded.
0x10
X X X O
X X X X
PEI Core Starts
0x11
X X X O
X X X O
CPU PEI Module Starts
0x15
X X X O
X O X O
North Bridge PEI Module Starts
0x19
X X X O
O X X O
South Bridge PEI Module Starts
0x31
X X O O
X X X O
Memory Installed
0x32
X X O O
X X O X
CPU PEI Module for CPU initialization
0x33
X X O O
X X O O
CPU PEI Module for Cache
initialization
0x34
X X O O
X O X X
CPU PEI Module for Boot Strap
Processor Select
0x35
X X O O
X O X O
CPU PEI Module for Application
Processor initialization
0x36
X X O O
X O O X
CPU PEI Module for CPU SMM
initialization
0x4F
X O X X
O O O O
Dxe IPL started
PEI Phase
DXE Phase
52
0x60
X O O X
X X X X
DXE Core started
0x61
X O O X
X X X O
DXE NVRAM initialization
0x62
X O O X
X X O X
SB RUN initialization
0x63
X O O X
X X O O
Dxe CPU initialization
0x68
X O O X
O X X X
DXE PCI Host Bridge initialization
0x69
X O O X
O X X O
DXE NB initialization
0x6A
X O O X
O X O X
DXE NB SMM initialization
0x70
X O O O
X X X X
DXE SB initialization
0x71
X O O O
X X X O
DXE SB SMM initialization
0x72
X O O O
X X O X
DXE SB devices initialization
0x78
X O O O
O X X X
DXE ACPI initialization
0x79
X O O O
O X X O
DXE CSM initialization
0x90
O X X O
X X X X
DXE BDS Started
0x91
O X X O
X X X O
DXE BDS connect drivers
0x92
O X X O
X X O X
DXE PCI Bus begin
0x93
O X X O
X X O O
DXE PCI Bus HPC initialization
0x94
O X X O
X O X X
DXE PCI Bus enumeration
Intel order number G17455-004
Revision 2.0
Appendix C: POST Code Diagnostic LED Decoder
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
0x95
O X X O
X O X O
DXE PCI Bus resource requested
0x96
O X X O
X O O X
DXE PCI Bus assign resource
0x97
O X X O
X O O O
DXE CON_OUT connect
0x98
O X X O
O X X X
DXE CON_IN connect
0x99
O X X O
O X X O
DXE SIO initialization
0x9A
O X X O
O X O X
DXE USB start
0x9B
O X X O
O X O O
DXE USB reset
0x9C
O X X O
O O X X
DXE USB detect
0x9D
O X X O
O O X O
DXE USB enable
0xA1
O X O X
X X X O
DXE IDE begin
0xA2
O X O X
X X O X
DXE IDE reset
0xA3
O X O X
X X O O
DXE IDE detect
0xA4
O X O X
X O X X
DXE IDE enable
0xA9
O X O X
O X X O
DXE verifying SETUP password
0xAB
O X O X
O X O O
DXE SETUP start
0xAC
O X O X
O O X X
DXE SETUP input wait
0xAD
O X O X
O O X O
DXE Ready to Boot
0xAE
O X O X
O O O X
DXE Legacy Boot
0xAF
O X O X
O O O O
DXE Exit Boot Services
0xB0
O X O O
X X X X
RT Set Virtual Address Map Begin
0xB1
O X O O
X X X O
RT Set Virtual Address Map End
0xB2
O X O O
X X O X
DXE Legacy Option ROM init
0xB3
O X O O
X X O O
DXE Reset system
0xB4
O X O O
X O X X
DXE USB Hot plug
0xB5
O X O O
X O X O
DXE PCI BUS Hot plug
0xB6
O X O O
X O O X
DXE NVRAM cleanup
0xB7
O X O O
O O O O
DXE Configuration Reset
0x00
X X X X
X X X X
INT19
BIOS Recovery
0xF0
O O O O
X X X X
PEIM which detected forced Recovery
condition
0xF1
O O O O
X X X O
PEIM which detected User Recovery
condition
0xF2
O O O O
X X O X
Recovery PEIM (Recovery started)
0xF3
O O O O
X X O O
Recovery PEIM (Capsule found)
0xF4
O O O O
X O X X
Recovery PEIM (Capsule loaded)
Revision 2.0
Intel order number G17455-004
53
Appendix D: POST Error Beep Codes
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Appendix D: POST Error Beep Codes
The following table lists POST error beep codes. Prior to system video initialization, the BIOS
uses these beep codes to inform users of error conditions. The beep code is followed by a uservisible code on POST Progress LEDs.
Table 34. POST Error Messages and Handling
Error Code
Error Message
Response
0012
CMOS date/time not set
Major
0048
Password check failed
Major
0140
PCI component encountered a PERR error
Major
0141
PCI resource conflict
Major
0146
PCI out of resources error
Major
5220
CMOS/NVRAM configuration cleared
Major
5221
Passwords cleared by jumper
Major
5224
Password clear jumper is Set
Major
8160
Processor 01 unable to apply microcode update
Major
8180
Processor 01 microcode update not found
Minor
8190
Watchdog timer failed on last boot
Major
8198
OS boot watchdog timer failure
Major
8300
Baseboard management controller failed self-test
Major
8305
Hot Swap Controller failure
Major
83A0
Management Engine (ME) failed Selftest
Major
83A1
Management Engine (ME) Failed to respond.
Major
84F2
Baseboard management controller failed to respond
Major
84F3
Baseboard management controller in update mode
Major
84F4
Sensor data record empty
Major
84FF
System event log full
Minor
8500
Memory component could not be configured in the selected RAS mode
Major
8501
DIMM Population Error
Major
8520
DIMM_A1 failed test/initialization
Major
8521
DIMM_A2 failed test/initialization
Major
8523
DIMM_B1 failed test/initialization
Major
8524
DIMM_B2 failed test/initialization
Major
8540
DIMM_A1 disabled
Major
8541
DIMM_A2 disabled
Major
8543
DIMM_B1 disabled
Major
8544
DIMM_B2 disabled
Major
54
Intel order number G17455-004
Revision 2.0
Appendix D: POST Error Beep Codes
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Error Code
Error Message
Response
PEI module component encountered an illegal software state error.
Fatal
9687
PEI module component encountered an illegal software state error.
Fatal
96A7
PEI module component encountered an illegal software state error.
Fatal
A000
TPM device not detected.
Minor
9667
A001
TPM device missing or not responding.
Minor
A002
TPM device failure.
Minor
A003
TPM device failed self-test.
Minor
A100
BIOS ACM Error
Major
A421
PCI component encountered a SERR error.
Fatal
A5A0
PCI Express component encountered a PERR error.
Minor
A5A1
PCI Express component encountered a SERR error.
Fatal
POST Error Beep Codes
The following table lists POST error beep codes. Prior to system video initialization, the BIOS
uses these beep codes to inform users on error conditions. The beep code is followed by a
user-visible code on POST Progress LEDs.
Table 35. POST Error Beep Codes
Beeps
3
Error Message
Memory error
POST Progress Code
Multiple
Description
System halted because a fatal error related to the memory
was detected.
The following Beep Codes are from the BMC, and are controlled by the Firmware team. They are listed here for
convenience.
1-5-2-1
CPU socket
population error
N/A
CPU1 socket is empty.
1-5-2-4
MSID Mismatch
N/A
MSID mismatch occurs if a processor is installed into a
system board that has incompatible power capabilities.
1-5-4-2
Power fault
N/A
DC power unexpectedly lost (power good dropout) – Power
unit sensors report power unit failure offset
1-5-4-4
Power control fault
N/A
Power good assertion timeout – Power unit sensors report
soft power control failure offset
Revision 2.0
Intel order number G17455-004
55
Glossary
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Glossary
This section contains important terms used in the preceding chapters. For ease of use, numeric
entries are listed first (for example, “82460GX”) with alpha entries following (for example, “AGP
4x”). Acronyms are then entered in their respective place, with non-acronyms following.
Term
ACPI
AP
APIC
ARP
ASIC
ASMI
BIOS
BIST
Definition
Advanced Configuration and Power Interface
Application Processor
Advanced Programmable Interrupt Control
Address Resolution Protocal
Application Specific Integrated Circuit
Advanced Server Management Interface
Basic Input/Output System
Built-In Self Test
BMC
Bridge
BSP
Byte
CBC
Baseboard Management Controller
Circuitry connecting one computer bus to another, allowing an agent on one to access the other
Bootstrap Processor
8-bit quantity
Chassis Bridge Controller (A microcontroller connected to one or more other CBCs, together they
bridge the IPMB buses of multiple chassis.
CEK
CHAP
CMOS
Common Enabling Kit
Challenge Handshake Authentication Protocol
Complementary Metal-oxide-semiconductor
In terms of this specification, this describes the PC-AT compatible region of battery-backed 128 bytes
of memory, which normally resides on the server board.
Dynamic Host Configuration Protocal
Direct Platform Control
Electrically Erasable Programmable Read-Only Memory
Enhanced Host Controller Interface
Emergency Management Port
External Product Specification
Enterprise South Bridge 2
Fully Buffered DIMM
Flexible Mother Board
Fault Resilient Booting
Field Replaceable Unit
Front Side Bus
1024 MB
Guest Physical Address
General Purpose I/O
Gunning Transceiver Logic
Host Physical Address
Hot-swap Controller
Hertz (1 cycle/second)
Inter-Integrated Circuit Bus
Intel® Architecture
Input Buffer
DHCP
DPC
EEPROM
EHCI
EMP
EPS
ESB2
FBD
F MB
FRB
FRU
FSB
GB
GPA
GPIO
GTL
HPA
HSC
Hz
I2 C
IA
IBF
56
Intel order number G17455-004
Revision 2.0
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Term
ICH
ICMB
IERR
IFB
ILM
I/O Controller Hub
Intelligent Chassis Management Bus
Internal Error
I/O and Firmware Bridge
Independent Loading Mechanism
IMC
INTR
I/OAT
IOH
IP
IPMB
IPMI
IR
ITP
Integrated Memory Controller
Interrupt
I/O Acceleration Technology
I/O Hub
Internet Protocol
Intelligent Platform Management Bus
Intelligent Platform Management Interface
Infrared
In-Target Probe
KB
KCS
KVM
LAN
LCD
LDAP
LED
LPC
LUN
MAC
MB
MCH
MD2
MD5
ME
MMU
ms
MTTR
Mux
NIC
NMI
OBF
OEM
Ohm
OVP
PECI
PEF
PEP
PIA
PLD
PMI
POST
PSMI
1024 bytes
Keyboard Controller Style
Keyboard, Video, Mouse
Local Area Network
Liquid Crystal Display
Local Directory Authentication Protocol
Light Emitting Diode
Low Pin Count
Logical Unit Number
Media Access Control
1024 KB
Memory Controller Hub
Message Digest 2 – Hashing Algorithm
Message Digest 5 – Hashing Algorithm – Higher Security
Management Engine
Memory Management Unit
Milliseconds
Memory Type Range Register
Multiplexor
Network Interface Controller
Nonmaskable Interrupt
Output Buffer
Original Equipment Manufacturer
Unit of electrical resistance
Over-voltage Protection
Platform Environment Control Interface
Platform Event Filtering
Platform Event Paging
Platform Information Area (This feature configures the firmware for the platform hardware)
Programmable Logic Device
Platform Management Interrupt
Power-On Self Test
Power Supply Management Interface
Revision 2.0
Glossary
Definition
Intel order number G17455-004
57
Glossary
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Term
PWM
QPI
RAM
RASUM
RISC
Definition
Pulse-Width Modulation
QuickPath Interconnect
Random Access Memory
Reliability, Availability, Serviceability, Usability, and Manageability
Reduced Instruction Set Computing
RMII
ROM
RTC
SDR
SECC
SEEPROM
SEL
SIO
SMBUS
Reduced Media-Independent Interface
Read Only Memory
Real-Time Clock (Component of ICH peripheral chip on the server board)
Sensor Data Record
Single Edge Connector Cartridge
Serial Electrically Erasable Programmable Read-Only Memory
System Event Log
Server Input/Output
System Management BUS
SMI
SMM
SMS
SNMP
SPS
SSE2
SSE3
SSE4
TBD
TDP
TIM
UART
UDP
UHCI
URS
UTC
VID
VRD
VT
Word
WS-MAN
ZIF
Server Management Interrupt (SMI is the highest priority non-maskable interrupt)
Server Management Mode
Server Management Software
Simple Network Management Protocol
Server Platform Services
Streaming SIMD Extensions 2
Streaming SIMD Extensions 3
Streaming SIMD Extensions 4
To Be Determined
Thermal Design Power
Thermal Interface Material
Universal Asynchronous Receiver/Transmitter
User Datagram Protocol
Universal Host Controller Interface
Unified Retention System
Universal time coordinare
Voltage Identification
Voltage Regulator Down
Virtualization Technology
16-bit quantity
Web Services for Management
Zero Insertion Force
58
Intel order number G17455-004
Revision 2.0
Intel® Server System R1304BTSSFAN/R1304BTLSFAN/R1304BTLSHBN TPS
Reference Documents
Reference Documents
Refer to the following documents for additional information:
ƒ
Intel® Server Board S1200BT BIOS External Product Specification
ƒ
Intel® Server Board S1200BT Common Core Integrated BMC External
Product Specification
Revision 2.0
Intel order number G17455-004
59
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