Using CC1190 Front End With CC13xx Under FCC 15.247

Using CC1190 Front End With CC13xx Under FCC 15.247
Application Report
SWRA517 – March 2017
Using CC1190 Front End With CC13xx Under FCC 15.247
Torstein Ermesjo
ABSTRACT
The CC1190 device is a range extender for 850- to 950-MHz RF transceivers, transmitters, and wireless
MCUs from Texas Instruments™. The device increases the link budget by providing a power amplifier
(PA) for increased output power, and a low-noise amplifier (LNA) with low noise figure for improved
receiver sensitivity, in addition to switches and RF matching for simple design of high-performance
wireless systems.
This application note outlines the expected performance when using the CC1310-CC1190 LaunchPad™
Development Kit design under FCC 15.247 in the 902- to 928-MHz frequency band. This application note
assumes that the reader is familiar with CC1310 and FCC 15.247 regulatory limits. For details, see [1] and
[2].
Contents
1
Abbreviations ................................................................................................................. 2
2
Electrical Specifications ..................................................................................................... 2
3
Controlling the CC1190 ..................................................................................................... 8
4
SmartRF™ Software Studio ................................................................................................ 9
5
Reference Design With Integrated Passive Component (IPC) ........................................................ 9
6
Reference Design Discrete Components ............................................................................... 11
7
Disclaimer ................................................................................................................... 13
8
References .................................................................................................................. 13
Appendix A
Schematics ......................................................................................................... 14
Trademarks
Texas Instruments, LaunchPad, SmartRF, SimpleLink are trademarks of Texas Instruments.
Rohde and Schwarz is a registered trademark of Rohde and Schwarz GmbH and Co.
All other trademarks are the property of their respective owners.
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1
Abbreviations
1
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Abbreviations
Table 1 lists abbreviations used throughout this document.
Table 1. Abbreviations
Abbreviation
Bit Error Rate
HGM
High Gain Mode
LP
LaunchPad
PCB
Printed-Circuit Board
PER
Packet Error Rate
RF
Radio Frequency
RSSI
2
Full Term
BER
Receive Signal Strength Indicator
RX
Receive, Receive Mode
TX
Transmit, Transmit Mode
Electrical Specifications
NOTE: The characteristics in this section are valid only when using the CC1310-CC1190
LaunchPad reference design version 1.1.1 (US version, see [3]) with a 50-Ω load and
settings recommended by the SmartRF™ Studio software.
All
•
•
•
2.1
measurements are done with the following conditions if nothing else is stated:
TC = 25°C
VDD = 3.3 V
f = 915 MHz
Operating Conditions
Table 2. Operating Conditions
Minimum
Maximum
Unit
Operating frequency (1)
Parameter
902
928
MHz
Operating supply voltage
2.0
3.6
V
Operating temperature
–40
85
°C
(1)
2
The FCC 915-MHz band.
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2.2
Current Consumption
The current is measured for the radio part of the board only. The jumpers to the XDS110 part are
removed.
Table 3. Current Consumption
Parameter
Condition
Receive current, HGM (1)
Transmit current
(1)
2.3
Typical
Unit
50 kbps, 2GFSK, ±25-kHz deviation
11.0
mA
txPower = 0x00CE (26 dBm)
379
txPower = 0x00C9 (25 dBm)
338
txPower = 0x00C6 (24 dBm)
291
txPower = 0x00C5 (23 dBm)
269
txPower = 0x00C4 (22 dBm)
240
txPower = 0x00C3 (20 dBm)
204
txPower = 0x00C2 (18 dBm)
158
txPower = 0x00C1 (14 dbm)
112
txPower = 0x00C0 (7 dBm)
75
mA
Input signal at –100 dBm. VDD = 3.6 V.
Receive Parameters
Table 4. Receive Parameters
Parameter
Sensitivity (1), HGM
Saturation, HGM
Selectivity and blocking, HGM
(1)
Typical
Unit
50 kbps 2-GFSK
Condition
–111.5
dBm
SimpleLink™ LRM 5 kbps
–120.8
dBm
Maximum input power level for 1% BER
+10
dBm
±1 MHz from wanted signal
47
±2 MHz from wanted signal
59
±5 MHz from wanted signal
66
±10 MHz from wanted signal
74
dB
Sensitivity limit is defined as 1% bit error rate (BER). Packet length is 3 bytes.
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Electrical Specifications
2.3.1
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Typical RX Performance vs Temperature and VDD
(1)
Blue is VDDS = 3.3 V
(2)
Green is VDDS = 3.6 V
Figure 1. Typical Sensitivity vs Temperature, HGM, 50 kbps
Figure 2. Typical Selectivity
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2.3.2
Receive Signal Strength Indicator (RSSI)
Figure 3. Typical RSSI vs Input Level, HGM, 50 kbps
PER versus level was run, and the reported RSSI was compared with the signal generator level. The
RSSI level saturates when the input power level is above –24 dBm. To get the correct RSSI offset, the
following override must be modified:
Change 0x00FB88A3 to 0x000388A3.
2.4
Transmit Parameters
The output power variation as a function of temperature will be a combination of the CC1310 output power
variation and the CC1190 output power variation. Because the CC1190 device operates in saturation, the
CC1190 variation will have the largest contribution. For this reason, the temperature compensation of the
CC1310 output power is turned off.
Due to the current consumption and long power cables, the test system has a given IR drop from the
power supply to the DUT. The voltage on the supply was therefore increased some to give the stated
voltage on the power pins on the LaunchPad for 25-dBm output power (see Table 5 for the power
amplifier values).
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Electrical Specifications
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Table 5. PA Table
Parameter
Output power, HGM
Condition
Typical
txPower = 0x00CE
26
txPower = 0x00C9
25
txPower = 0x00C6
24
txPower = 0x00C5
23
txPower = 0x00C4
22
txPower = 0x00C3
20
txPower = 0x00C2
18
txPower = 0x00C1
14
txPower = 0x00C0
7
Unit
dBm
Table 6 lists the spurious emission values.
Table 6. Spurious Emission
Parameter
Spurious emission with txPower
=0x00C9 , HGM
6
Condition
Typical
Conducted below 1 GHz
–58
Conducted above 1 GHz
–55
Conducted second harmonic
–8
Conducted third harmonic
–55
Radiated second harmonic
–4
Radiated third harmonic
–46
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Unit
dBm
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2.4.1
Typical TX Performance vs Temperature and VDD
Figure 4 shows the output power versus temperature for txPower = 0x00C9.
(1)
Blue is VDDS = 3.3 V
(2)
Green is VDDS = 3.6 V.
Figure 4. Output Power vs Temperature, txPower = 0xC9
2.4.2
Typical TX Parameters vs Load Impedance
The load impedance presented to the CC1190 PA output is critical to the TX performance of the reference
design. The load impedance is selected as a compromise between several criteria, such as output power,
efficiency, and the level of the harmonics. The matching components between the PA output and the
antenna should transform the 50-Ω antenna impedance to the selected impedance (which the CC1190 PA
should detect). This is taken care of by the reference design (see [3]) and a well-matched antenna should
be used to get the required performance.
2.5
Duty Cycling
FCC Section 15.209 gives the general limits for the emission of intentional or unintentional radiators.
Above 960 MHz, the limit is –41.2 dBm (500 µV/m at a distance of 3 m). When operating under Section
15.247, the spurious emission must be 20 dB below the carrier unless it falls within one of the restricted
bands are defined in Section 15.205. When operating in the in the frequency range of 902 MHz to
928 MHz, the third, fourth, fifth, and sixth harmonics fall within restricted bands. In the restricted bands,
the general limits of –41.2 dBm apply.
Pulsed transmissions allow higher peak harmonic and spurious emissions above 1 GHz because an
averaging detector is required in the measurements. The average limit must be below
–41.2 dBm, but the maximum peak spurious level for pulsed transmission is 20 dB above the average
limit. If the duty cycle factor of the periodic signal is known, measuring the peak value and adding a duty
cycle relaxation factor determines the average value. The relaxation factor applies to the TX on-time as
measured over a 100-ms period. The relaxation factor is 20 log (TX on-time / 100 ms) [dB].
As an example, a 50% duty cycle allows for a 6-dB higher peak emission than without duty cycling.
Figure 5 shows the relaxation factor for different transmission on-times over a 100-ms period.
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Electrical Specifications
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Figure 5. Relaxation Factor vs Duty Cycling
2.6
Measurement Equipment
The measurement equipment used is as follows:
• Spectrum analyzer: Rohde and Schwarz® FSU
• Signal generator: SMIQ 03B
3
Controlling the CC1190
Three digital control pins (PA_EN, LNA_EN, and HGM) set the CC1190 mode of operation. See Table 7.
Table 7. CC1190 Control Logic
PA_EN
LNA_EN
HGM
Mode of Operation
0
0
X
Power Down
0
1
0
RX LGM
0
1
1
RX HGM
1
0
0
TX LGM
1
0
1
TX HGM
On the CC1310-CC1190 LaunchPad, the control signals are mapped to DIOs as follows:
• DIO28 – HGM
• DIO29 – LNA_EN
• DIO30 – PA_EN
HGM should be tied high or low using the pin driver. LNA_EN should be tied to RFC_GPO0 (portID 0x2F)
and PA_EN should be tied to RFC_GPO1 (portID 0x30) as described in the Control External LNA/PA
(Range Extender) With I/Os section in the CC1310 technical reference manual, CC13x0, CC26x0
SimpleLink™ Wireless MCU.
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Set the I/Os with the following code:
#include <ti/drivers/pin/PINCC26XX.h>
●
●
// LNA
PINCC26XX_setMux(<Handle>, <DIO_LNA>, PINCC26XX_MUX_RFC_GPO0);
//PA
PINCC26XX_setMux(<Handle>, <DIO_PA>, PINCC26XX_MUX_RFC_GPO1);
Where <Handle> is the handle returned by PIN_open() and <DIO_LNA> and <DIO_PA> are the pins used
to control the LNA_EN and the PA_EN, respectively, on the CC1190.
See the Packet Error Rate example as an example how to control CC1190 from CC1310.
4
SmartRF™ Software Studio
The CC1310-CC1190 LaunchPad can be configured using the SmartRF Studio 7 software.
Version 2.4.2 of SmartRF Studio does not have direct support for CC1310-CC1190. To set the CC1190
control signals click on the Configure Target button and set the DIOs as shown in Figure 6. In addition, the
frequency must be set to 915 MHz and the correct txPower must be written in the
CMD_PROP_RADIO_DIV_SETUP command.
Figure 6. Hardware Configuration
5
Reference Design With Integrated Passive Component (IPC)
The CC1310-CC1190 LaunchPad reference design version 1.1.1 (US) [3] includes schematics and Gerber
files. TI highly recommends following the reference design for optimum performance. The reference
design also includes a bill of materials (BOM) with manufacturers and part numbers.
5.1
Power Decoupling
Proper power supply decoupling must be used for optimum performance. Capacitors C26, C27, and C30
ensure good RF ground after L21 and thus prevent RF leakage into the power supply lines causing
oscillations. The power supply filtering consisting of C216, C217, and L163 ensure well-defined
impedance looking toward the power supply.
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Reference Design With Integrated Passive Component (IPC)
5.2
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I/O Matching and Filtering
The PA and the LNA of the CC1190 are single-ended I/O. A balun is required to transform the differential
impedance required by the RF_P/N pins to a single-ended 50-Ω interface. The values of the matching
components between the SAW filter and the CC1190 PA input are chosen to present optimum source
impedance to the CC1190 PA input with respect to stability.
If a SAW filter is not needed in both RX and TX, the RX and TX path can be split between CC1310 and
CC1190.
The CC1190 PA performance is highly dependent on the impedance presented at the output, and the LNA
performance is highly dependent on the impedance presented at the input. The impedance is defined by
L21 and all components toward the antenna. These components also ensure the required filtering of
harmonics to pass regulatory requirements.
The layout and component values must be copied exactly to obtain the same performance as presented in
this application note.
5.3
Bias Resistor
R141 is a bias resistor. The bias resistor is used to set an accurate bias current for internal use in the
CC1190.
5.4
SAW Filter
A SAW filter is recommended for the CC1310-CC1190 design to attenuate spurs below the carrier
frequency that will otherwise violate spurious emission limits under FCC section 15.205 and 15.209. The
SAW filter is matched to the CC1190 PA input/LNA output impedance using a series inductor and a shunt
capacitor.
A footprint for a 0603 component is placed below the SAW filter to enable testing without the SAW filter.
5.5
PCB Layout Considerations
The TI reference design uses a 1.6-mm (0.062”) 4-layer PCB solution.
NOTE: The different layers have different thickness. TI recommends following the recommendation
given in the CC1310-CC1190 LaunchPad reference design (US version, see [3]) to ensure
optimum performance.
The top layer (layer 1) is used for components and signal routing, and the open areas are filled with
metallization connected to ground using several vias. The areas under the two chips are used for
grounding and must be well connected to the ground plane with multiple vias. Footprint recommendation
for the CC1190 is given in the CC1190 data sheet (see [4]).
Layer 2 is a complete ground plane and is not used for routing. This is done to ensure short return current
paths. The low impedance of the ground plane prevents any unwanted signal coupling between any nodes
that are decoupled to it.
Layer 3 is a power plane. The power plane ensures low-impedance traces at radio frequencies and
prevents unwanted radiation from power traces. Two different power planes are used for CC1310 and
CC1190; the power planes are surrounded by ground to reduce unwanted radiation from the board.
Layer 4 is used for routing and ground.
5.6
Shield
TI recommends placing a shield over the CC1190 part of the design to attenuate the radiated third
harmonic.
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5.7
Attenuation
The CC1310 PA table has few settings that give lower output power than 5 dBm. If larger dynamic range
of output levels is needed, attenuation between the CC1310 and CC1190 can be added.
Attenuation could be achieved by a resistive pi attenuator formed by R154, R155, and R156. The
attenuator must be designed as 50-Ω in, 50-Ω out. The sensitivity will be a function of the value of the
shunt resistors. If R155 and R156 are mounted, C218 and C219 should be 47 pF.
If attenuation is not needed R154, R155, R156, C218, and C219 can be removed and L111 can be
connected directly to pin 10 (LNA_OUT) and pin 11 (PA_IN) on CC1190.
5.8
Antenna
The antenna used is described in DN024 (see [11]). Placeholders for a pi filter are included for antenna
matching purposes.
6
Reference Design Discrete Components
The CC1310-CC1190 LaunchPad uses the IPC due to space restrictions. The first version of the
LaunchPad used discrete components for the balun on CC1310.
The following sections list the measurement results measured for this version of the LaunchPad. The
results are average over five LaunchPads. The schematics for the CC1310 and CC1190 part of this
version are shown in Appendix A.
6.1
Current Consumption
Table 8. Current Consumption
Parameter
Receive current, HGM (1)
Transmit current
(1)
6.2
Typical
Unit
50 kbps, 2GFSK, ±25-kHz deviation
Condition
11.3
mA
txPower = C7
511
txPower = C6
424
txPower = C5
386
txPower = C4
362
txPower = C3
331
txPower = C2
284
txPower = C1
213
txPower = C0
118
mA
Input signal at –100 dBm
Receive Parameters
Table 9. Receive Parameters
Parameter
Condition
Typical
Unit
–111.9
dBm
Maximum input power level for 1% BER
10
dBm
±200 kHz from wanted signal
38
±1 MHz from wanted signal
45
±2 MHz from wanted signal
58
±5 MHz from wanted signal
64
±10 MHz from wanted signal
73
Sensitivity (1), HGM
Saturation, HGM
Selectivity and blocking, HGM
(1)
dB
Sensitivity limit is defined as 1% BER. Packet length is 3 bytes.
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PER versus level was run, and the reported RSSI was compared with the signal generator level. The
RSSI level saturates when the input power level is above –24 dBm. To get the correct RSSI offset, the
following override must be modified:
Change 0x00FB88A3 to 0x000388A3.
When doing a code export from SmartRF Studio, this override is part of the pOverrides[] structure.
6.3
Transmit Parameters
The output power variation as a function of temperature will be a combination of the CC1310 output power
variation and the CC1190 output power variation. Because the CC1190 device operates in saturation, the
CC1190 variation will have the largest contribution. For this reason, the temperature compensation of the
CC1310 output power is turned off.
At the time of measurement, high-quality cables fitting the JSC connector were not available, so semirigid
cables were used. These semirigid cables typically have a loss equal to 0.2 to 0.25 dB, which is not
accounted for in Table 10.
A CC1190 device was moved from a CC1310-CC1190 LaunchPad version 1.0.1 to a CC1310-CC1190
LaunchPad version 1.1.1 and the output power was increased by 1 dB (from 26 dBm to 27 dBm) with all
other settings equal. This indicates that the 1.0.1 version of the LP was populated with a production batch
of CC1190 that gives higher output power than the production batch that was used on the 1.1.1 version of
the board.
Table 10. PA Table
Parameter
Output power, HGM
Condition
Typical
Unit
txPower = 0x00C7
26.1
dBm
txPower = 0x00C6
26.7
dBm
txPower = 0x00C5
26.3
dBm
txPower = 0x00C4
25.8
dBm
txPower = 0x00C3
25.0
dBm
txPower = 0x00C2
23.6
dBm
txPower = 0x00C1
20.8
dBm
txPower = 0x00C0
14.1
dBm
Table 11 lists the spurious emission values.
Table 11. Spurious Emission
Parameter
Spurious emission with
txPower = 0x00C4, HGM
12
Typical
Unit
Conducted below 1 GHz
Condition
not measured
dBm
Conducted above 1 GHz
not measured
dBm
–20
dBm
Conducted third harmonic
–51
dBm
Radiated second harmonic
not measured
dBm
Radiated third harmonic
not measured
dBm
Conducted second harmonic
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Disclaimer
The CC1310-CC1190 Launchpad is intended for use for ENGINEERING DEVELOPMENT,
DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished
end-product fit for general consumer use. Persons handling the products must have electronics training
and observe good engineering practice standards. As such, the goods being provided are not intended to
be complete in terms of required design-, marketing-, and/or manufacturing-related protective
considerations, including product safety and environmental measures typically found in end products that
incorporate such semiconductor components or circuit boards. It is the end user's responsibility to ensure
that his system complies with applicable regulations.
8
References
The references for this document follow:
1. CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU data sheet
2. IEEE 15.247, see the Electronic Code of Federal Regulations website
3. CC1310-CC1190 reference design US
4. Texas Instruments™ CC1190 Data Sheet 850-MHz to 950-MHz RF Front End
5. Final draft ETSI EN 300 220-1 V2.4.1 (2012-01)
6. ERC Recommendation 70-03
7. SmartRF Studio
8. CC-Antenna-DK2 and Antenna Measurements Summary application report
9. DNO24—Monopole PCB Antenna with Single or Dual Band Option design note
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Appendix A
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Schematics
A.1
Schematics
CC1310 RF
CC1310_VDD
VDDS
VDDS Decoupling Capacitors
VDDR
FL1
2
VDDR Decoupling Capacitors
L1
1
Pin 13
Pin 22
Pin 44
DCDC_SW
Pin 34
BLM18HE152SN1
1
6.8uH
C6
C3
100nF
C4
100nF
C5
100nF
C7
100nF
22uF
Pin 45
2
Pin 48
C8
C9
100nF
22uF
C16
100nF
Place L1 and
C8 close to pin 33
VDDS
VDDS
VDDR
U1A
R1
100k
24
25
35
CC1310_TMS
CC1310_TCK
CC1310_RESET
DCDC_SW
C20
100nF
33
4
5
Y1
23
49
C17
32.768kHz
C18
C19
JTAG_TMSC
JTAG_TCKC
RESET_N
VDDS2
VDDS3
VDDS
VDDS_DCDC
VDDR
VDDR
DCDC_SW
X32K_Q1
X32K_Q2
RF_P
RF_N
RX_TX
DCOUPL
VSS
X24M_N
X24M_P
13
22
44
34
45
48
C11
3.6pF
1
L22
27nH
2
46
47
12pF
L23
7.5nH
1uF
Y2
24MHz
C15
CC1190_RFIO
C22
1
3.6pF
2
100pF
L162
DNM
2
CC1310F128RGZ
12pF
2
7.5nH
1
1
2
3
L12
1
1
3
C21
100pF
2
4
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Schematics
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CC1310_VDD
L163
1
2
11nH
C216
C217
220pF
10uF
CC1190_VDD
L131
1
2
1.5nH
R151
C131
15pF
C27
47pF
C28
1nF
C29
1uF
47
L161
1
FL2
CC1190_RFIO
L111
2
5
C111
1
3
4
6
2
11
PA_IN
10nH
0.8pF
VDD_LNA
VDD_PA2
VDD_PA1
PA_OUT
GND
B39921B3588U410
R141
10
14
LNA_OUT
BIAS
2
1
15nH
U11
1
13
15
16
C161
27pF
L21
22nH
2
2
L25
C210
1
TR_SW
4
2
DNM
DNM_0402
3.3k
1
3
9
12
17
GND
GND
GND
GND
GND
CC1190
LNA_IN
PA_EN
LNA_EN
HGM
P11
5
1
8
7
6
2
MM5829-2700
M1 M2
R66
10k
R71
10k
R81
10k
C24
Antenna PCB helix 868/915MHz
A1
DNM_0402
DIO28_CC1190_HGM
C215
DIO29_CC1190_LNA_EN
C213
DIO30_CC1190_PA_EN
L27
1
12pF
1
47pF
L24
2
1
2.9nH
L26
7.5nH
C212
3.3pF
2
R13
DNM
2
9.1nH
C25
7.5pF
R12
1
2
1
2.2pF
C218
C23
DNM_0402
DNM_0402
C214
12pF
To do conducted measurements,
remove C218 and R12.
Mount R13 with 0 ohm resistor
SC1
BMIS-202
1 2 3 4 5 6 7 8
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