Snapdragon for Embedded Applications Overview

Snapdragon for Embedded Applications Overview
Danny Petkevich, Director Business Development, Qualcomm
Prakash Iyer, Senior Manager of Software Development, Toshiba
Snapdragon Application Processors:
Best Practices for Device Driver
Development
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Mobile: A Vibrant, Unprecedented Opportunity
~6.6B+
$1.5T
#1
Mobile Connections
Global Mobile Revenues
Most Used Device
Source: Wireless Intelligence, Jan. 2013, CIA World Factbook, Dec. ’11, Chetan Sharma Consulting, May, 2012
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2
Continued Smartphone Momentum
Displacing Feature Phones
24% CAGR
2011–2016
Annual Forecasted Smartphone Unit Shipments
1,382
1,231
1,072
912
683
477
2011
2012
2013
2014
Cumulative Smartphone Unit Sales Forecast
Between 2012–2016
2015
2016
~5B
Source: Average of Gartner, Oct. ’12; Strategy Analytics, Aug. ’12
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3
Expanding Areas for Smartphone Innovation
Modems
LTE TDD
2MB L2 (8064 only)
High Performance
Floating Point
aSMP
Custom Krait
CPU
Custom System
Interconnect
Web Tech Innovations
FlexRender™
Technology
Unified Shader
Architecture
Low Power Innovations
20x Digital zoom
Stereo 3D video
GPU
Stereoscopic
Rendering
Accelerated WebGL
DSP/Multimedia
Indoor Location
GPS/GNSS
Connectivity
Coexistence
with WWAN
Profiling
Tools
Proximity
Temperature
5.1 Surround
Camcorder
Gyroscope
Ambient light
IR Sensing
Content Adaptive Backlight
Noise cancellation
3D
Wireless Display
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Pressure
BT
Miracast
Multiband
FM
Sensors
Accelerometer
7.1 Surround
21 MPix Zero Shutter Lag
Ultrasound
Playback
1080P HD video
Computational Camera
Browser with HTML5 and 1080p Flash
RF Multi-band TD-SCDMA
.11ac
GPGPU Compute for Imaging/Video
(Renderscript, OpenCL, LLVM)
Coexistence with
connectivity
VoLTE / SRVCC
Advanced Receivers
Power Optimization
LTE Broadcast
LTE World Mode
Displays
Gestures
Humidity
Magnetometer
MEMS
Color correction
Frame Buffer Compression
4
Mobile is Redefining Computing
High Performance Computing
Without Compromising Mobility
High resolution screens
Sleek, ultra-light
Responsive devices
Longer battery life
Fast, always-on connectivity
Thermal efficiency
Rich multimedia experience
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5
Snapdragon for Embedded
Delivers a Best in Class System Solution
Multimedia
Power Mgmt
CPU
RF
GPU
Software/
HLOS
Modem
Memory
Connectivity
DSP
GPS
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Benefits of Mobile Application Processors for Embedded
 Power, Power, Power
 No Fans, no noise
 Reduced thermal constraints rendering smaller industrial design
 Same platform for battery powered or wall powered products
 Lower cost power supplies
 Feature rich, new capabilities
 Multiple HD Cameras and microphone arrays
 Video/Audio/2D & 3D Graphics processors
 Multiple HD Displays, Miracast
 Sensors: 3D accelerometers, 3-axis gyro, compass, ambient light, proximity, temperature &
pressure, humidity, medical, chemical, ultrasound pen and gestures, finger print reader, etc
 Location services
 Computer vision
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7
Android Leading Global Smartphone OS Market Share
100%
Android
80%
68%
60%
49%
40%
23%
20%
5%
0%
2007
2008
2009
2010
2011
2012
Global Smartphone OS Market Share: 2007-2012
Source: Strategy Analytics Insight – Wireless Smartphone Strategies – Jan 28, 2013
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Why Android for Embedded?
 Known user experience
 Standardized development environment
 Skilled developer community
 Royalty free… (Google provides Android at no charge)
 Linux as the foundation
 Source code access, destiny in your hands
 Massive investment as a platform
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9
DragonBoard™
A powerful, feature-rich, versatile and easy-to-use exposed board
platform for component vendors, software and embedded developers. It
consists of a complete System on Module (SoM) with a Snapdragon
processor, a mini-ITX carrier board and a peripheral kit.
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8060a DragonBoard ™ Development Kit Specifications
 Hardware
 Software








 Preloaded with Android 4.0
 Additional OS support, including Debian Linux and
other operating systems are on the road map
Snapdragon S4 APQ8060A processor at up to 1.7GHz
1GB of LPDDR2 RAM
16GB of eMMC
MicroSD & Dual SATA I/F
HDMI out
GPS, Wi-Fi, Bluetooth 4.0 and FM radios
USB OTG & Host, UART, JTAG, & Ethernet
Front and back camera I/Fs – one 8MG Pix supplied
with the kit
 Dual Display I/F – one WVGA LCD with capacitive
touch supplied with the kit
 5.1 Audio Line In/Out
 Headset speaker and dual microphone I/Fs
 Sensors – compass, accelerometer, gyro, and pressure.
 PMIC with battery support
 Interface options for NFC, TV Tuner, IR remote
control, etc
Intrinsyc Confidential and Proprietary
11
17 April 2013
SYS 6400 – 8064 Development Platform
Processor and Memory
8064 SOM
• Qualcomm Snapdragon S4 – APQ8064
• ARM15 class, 4-core, 1.7GHz, 2MB L2 cache
• Up to 2 GB on-board DDR3 (PCDDR 533MHz)
Network Interfaces
• 10/100/1000bT Ethernet
Storage
• MicroSD card connector
• eMMC 4GB (exp. To 64GB)
• 2 x SATA2 Connectors
Multimedia
• HDMI for HD1080p
• LVDS
• MIPI-CSI (20MP camera)
• 5.1 Audio In/Out
Q7 Connector
• 2x USB2.0, 1x USB OTG
• Serial console
on-board connectors
• I2C, SPI, USB, SATA, LVDS
Power, Mechanical & Environmental
• Power: +5V Input Socket (5A typ.)
• Dimensions: 70mm x 70mm (Qseven)
17cm x 17cm (Mini-ITx Carrier)
• Operating Temp: 0 to 70 C
Software
• Android 4.1 Jellybean
• Ubuntu
Linux
12
Confidential
myDragonBoard.org, Snapdragon Community
Dev Tools, Projects, Forums, Blogs, …
Post your project and or
questions here
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ELECTRONIC COMPONENTS
Device Driver Development on Snapdragon™
Processor Based DragonBoard™ Development
Platforms – Best Practices
Using Toshiba Peripheral Devices to Enable Embedded Devices with SnapDragon™
Pico Projectors
Virtual Reality Glasses
Portable Video Recorder
HDMI
CSI
HDMI to
CSI
Converter
CSI
SnapDragon™
I2S
Projection
Chip
HDMI to
CSI
Converter
DSI
SnapDragon™
I2S
DSI to
LVDS
Converter
LVDS
Panel
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Toshiba Device driver development on Snapdragon™ Processor
Based DragonBoard™ Development Platforms
1. Mobile Peripheral Devices(MPD) Bridge Chips on DragonBoard™ 8060A
Development Kit
a) MIPI ® -DSI to LVDS Converter Low Power (D2LLP) - (TC358775XBG)
b) HDMI to MIPI ® -CSI Converter (H2C) - (TC358743XBG)
2. TransferJet ® Technology Compliant IC (TC35420XLG) on DragonBoard™
8060A Development Platform
3. Audio Codec IC (TC94B24WBG) on DragonBoard™ 8060 Development
Platform
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Device Driver Development – Best Practices
1. Hardware Feasibility
2. Determine DragonBoard™ Platform/Linux Release to use
a) Support for required hardware interfaces
3. Use Existing Linux Device driver frameworks, models and API’s
4. Determine device driver type - Built-in kernel driver or Module driver
5. Follow Linux Coding guidelines
6. Robust device driver with good error handling
7. Device driver interface with user space programs
a) Special functions
b) Debugging
8. Portability considerations
9. Debugging considerations
Dynamic Debugging, file system interfaces, user programs
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DragonBoard™ 8060A
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D2LLP Features
•
Receives video on the DSI receiver interface and transmits the video on the LVDS output
interface.
•
DSI Receiver
– Supports upto 4 data lanes with max bit rate of 1Gbps/lane
– Video input data formats: RGB565, RGB666 and RGB888
– Up to WUXGA resolutions (1920x1200 24-bit pixels) to dual-link LVDS display panel
•
LVDS FPD Link Transmitter
– Supports single-link or dual-link
– Maximum pixel clock speed of 135 MHz for single-link or 270 MHz for dual-link
– Supports display up to 1600x1200 24-bit/pixel resolution for single-link, or up to
WUXGA (24 bit/pixel) resolutions for dual-link
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D2LLP Driver - Overview
1. D2LLP chips could be programmed using either I2C or DSI
a) Programming of D2LLP chip done using DSI in this driver
2. Char driver interface provided to user layer to read and write D2LLP registers
3. Reused existing DSI subsystem interface code on Snapdragon™ processor
based platform
4. Initialization of D2LLP chip
5. Panel Timing configuration using the registers in D2LLP
a) HBP,HFP,HPW, HACT, VBP,VFP, VACT, VPW
6. Debugging using following D2LLP registers
a) Interrupt Status
b) Debug Registers
c) System Status
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H2C Features
• Converts HDMI Video Data to MIPI-CSI-2 Video Data
• HDMI-RX Interface
– HDMI 1.4 - Video Formats Support (Up to 1080P@60fps)
– RGB, YCbCr444: 24-bpp @60fps ,YCbCr422 24-bpp @60fps
• Supports 3D, HDCP, DDC, EDID,
• Maximum HDMI clock speed: 165MHz
• Supports up to 4 CSI2 data lanes at 1 Gbps per data lane
• Video, Audio and InfoFrame data can be transmitted over MIPI CSI-2
• I2C Slave interface used for configuring registers
• Support I2C speeds of 100Khx, 400Khz and 2 MHz
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H2C Driver - Overview
1. H2C driver is basically a MIPI-CSI input capture driver where MIPI-CSI input is
received from H2C chip in YUV format
2. Start with a working sensor source code as a template
3. Use existing framework functions where possible
4. Override other functions which need specific implementation for H2C
5. H2C registers can be read/written using the I2C interface.
6. H2C registers can be accessed as 8 bit, 16 bit or 32 bit registers.
User programs as well as /sys/* file system interface
7. Program H2C registers to
a) Output the appropriate format and frame rate on CSI
b) Do RGB to YUV conversion if required
c) Program EDID
8. Program settle time appropriately as per MIPI® specification
9. Dynamic Debugging
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H2C Driver Implementation
• Major interface with sensor - V4L2
struct msm_sensor_ctrl_t h2c_s_ctrl = {
.msm_sensor_reg = &h2c_regs,
.sensor_i2c_client = &h2c_i2c_client,
.sensor_i2c_addr = 0x0f << 1,
.sensor_output_reg_addr = &h2c_reg_addr,
.sensor_id_info = &h2c_id_info,
.cam_mode = MSM_SENSOR_MODE_INVALID,
.csic_params = &h2c_csic_params_array[0],
.csi_params = &h2c_csi_params_array[0],
.msm_sensor_mutex = &h2c_mut,
.sensor_i2c_driver = &h2c_i2c_driver,
.sensor_v4l2_subdev_info = h2c_subdev_info,
.sensor_v4l2_subdev_info_size = ARRAY_SIZE(h2c_subdev_info),
.sensor_v4l2_subdev_ops = &h2c_subdev_ops,
.func_tbl = &h2c_func_tbl,
};
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H2C Driver Implementation
•
sensor_output_reg_addr
struct msm_sensor_output_reg_addr_t h2c_reg_addr = {
.x_output = 0x0060,
.y_output = 0x0064,
.line_length_pclk = 0x0068,
.frame_length_lines = 0x006c }
struct msm_sensor_id_info_t h2c_id_info = {
.sensor_id_reg_addr = 0x0000, /*Chip and Rivsion ID*/
.sensor_id = 0x0000, /* As per data sheet it is read only register*/
};
• csic_params
struct msm_camera_csi_params h2c_csic_params = {
.data_format = CSI_8BIT,
.lane_cnt = 2,
.lane_assign = 0xe4,
.dpcm_scheme = 0,
.settle_cnt = H2C_SETTLE_CNT,
};
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H2C Driver Implementation
struct msm_camera_csid_vc_cfg h2c_cid_cfg[] = {
{0, CSI_YUV422_8, CSI_DECODE_8BIT},
};
struct msm_camera_csi2_params h2c_csi_params = {
.csid_params = {
.lane_assign = 0xe4,
.lane_cnt = 2,
.lut_params = {
.num_cid = ARRAY_SIZE(h2c_cid_cfg),
.vc_cfg = h2c_cid_cfg,
},
},
.csiphy_params = {
.lane_cnt = 2,
.settle_cnt = H2C_SETTLE_CNT,
},
};
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H2C Driver Implementation
•
•
Sensor_i2c_driver
struct i2c_driver h2c_i2c_driver = {
.id_table = h2c_i2c_id,
.probe = msm_sensor_i2c_probe,
.driver = {
.name = SENSOR_NAME,
},
};
sensor_v4l2_subdev_info
struct v4l2_subdev_info h2c_subdev_info[] = {
{
.code = V4L2_MBUS_FMT_YUYV8_2X8,
.colorspace = V4L2_COLORSPACE_JPEG,
.fmt = 1,
.order = 0,
},
};
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H2C Driver Implementation
•
•
sensor_v4l2_subdev_ops
static struct v4l2_subdev_core_ops h2c_subdev_core_ops = {
.ioctl = msm_sensor_subdev_ioctl,
.s_power = msm_sensor_power };
static struct v4l2_subdev_video_ops h2c_subdev_video_ops = {
.enum_mbus_fmt = msm_sensor_v4l2_enum_fmt };
static struct v4l2_subdev_ops h2c_subdev_ops = {
.core = &h2c_subdev_core_ops,
.video = &h2c_subdev_video_ops };
func_tbl
static struct msm_sensor_fn_t h2c_func_tbl = {
.sensor_start_stream = h2c_start_stream,
.sensor_stop_stream = h2c_stop_stream,
.sensor_csi_setting = h2c_csi2_setting,
.sensor_set_sensor_mode = msm_sensor_set_sensor_mode,
.sensor_mode_init = msm_sensor_mode_init,
.sensor_get_output_info = msm_sensor_get_output_info,
.sensor_config = msm_sensor_config,
.sensor_power_up = h2c_power_up,
.sensor_power_down = h2c_power_down,
.sensor_adjust_frame_lines = msm_sensor_adjust_frame_lines1,
.sensor_get_csi_params = msm_sensor_get_csi_params };
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A Simple, High Speed, M2M Wireless Transfer Technology
• Simple - Just Touch
• High Speed - 560*/375** Mbps
• Low Power - Comparable to
BT
• Toshiba Offers Total Solution
– IC, Module, Accessories (MicroSD Card and
USB Adaptor
* Raw Speed
** Effective Speed
DragonBoard™ Platform TransferJet® Technology Demo
APQ8060A DragonBoard™
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TransferJet® – Software Stack
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Audio CODEC
Mobile Audio Solution with Superb Noise and Echo Cancellations
TC94B24WBG
Handfree Call with Noise
Noise
Voice
I2C
Control
G-class stereo
headphone
4-ch Digital
microphone
interface
Ear speaker
amplifier
2-ch ADC for
analog
microphone
I2S I/F
(4input、4output)
After Noise Cancellation
DSP
CEVA-TeakLite-lllTM
Noise
Cancellation
Algorithm
Echo
Cancellation
Algorithm
• Excellent Noise Cancellation
Unique algorithm with statistical noise estimation and min mean square error approach
• Excellent Echo Cancellation
Unique algorithm with time-domain echo cancelling adaptive filter and frequency-domain echo suppression
• NC/EC Can be Achieved by 1 Mic
Voice
Audio Codec(TC94B24WBG) – Block Diagram
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Audio Codec Driver
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Q&A
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owners in the United States and other countries.
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Thank you
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www.qualcomm.com & www.qualcomm.com/blog
© 2013 Qualcomm Technologies, Inc. All rights reserved. Qualcomm, Snapdragon, and Gobi are trademarks of Qualcomm Incorporated, registered in the United
States and other countries. Trademarks of Qualcomm Incorporated are used with permission. Other products and brand names may be trademarks or registered
trademarks of their respective owners.
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