Thermal Design Manual (BG series)

Thermal Design Manual (BG series)
CCD・CMOS Camera
BG Series
Thermal Design Manual
Ver.3.1
※This document is the reference data for using it on condition of
“Ambient temperature : below 40℃”currently written on an operation manual
“Operation Ambient condition”.
Contents of this document are subject to change for improvement without notice
1. Overview
This camera has extremely high frame rate, compact size and light weight.
Even some customers might be worried about heat because the products have compact size and
high frame rate. However, by devising general lens mounting and installation conditions to chassis,
this camera can be used comfortably in high surrounding temperature.
This document contains supporting data of thermal design with customer’s machines or
equipment.
2. Relation of cabinet surface temperature against attaching chassis
The relation of camera surface temperature increase and surface area of attaching chassis is
plotted by thermal simulation with attaching chassis for each material. Below graph shows Al
(black color) is the most preferable as material of attaching chassis.
Camera surface temperature increase [℃]
Camera surface temperature increase
- surface area of attaching chassis
0
-5
Al
SUS
-10
Fe
-15
-20
-25
0
100
200
300
400
Surface area of attaching chassis[cm2]
D4220136B
1
Copyright © 2013-2015 TOSHIBA TELI CORPORATION, All rights reserved.
www.toshiba-teli.co.jp/en/
3. Representative model using aluminum attaching chassis “PoE”,“DC12V”
The graph below shows a correlation of surface area of attaching aluminum chassis and ambient
temperature. By using a certain size of attaching chassis, the camera can be used in ambient
temperature of 40℃.
Correlation graph of surface area of attaching aluminum
chassis and ambient temperature[PoE][DC12V]
Surface area of attaching chasis[cm2]
0
100
200
300
400
50
Ambient temperature[℃]
DC12V
45
40
red:NG zone
35
yellow:DC12V-good zone
PoE
PoE-NG zone
30
blue:good zone
25
20
15
A
B
C
D
E
Setting condition
Attaching chassis [mm]
Surface area [cm2]
A
NIL
-
B
t10x50x75
approx.100
C
t2x70x90(Bending height:20)
approx.200
D
t10x70x115
approx.200
E
t10x90x140
approx.300
F
t10x110x155
approx.400
F
<Seeing the graph>
Upon the PoE power supply, ambient
temperature should be below 27℃ in case of
no attaching chassis. The camera can be used
in ambient temperature of approximately 40℃
by using E or equivalent attaching chassis.
Upon the DC12V power supply, ambient
temperature should be below 34℃ in case of
no attaching chassis. The camera can be used
in ambient temperature of approximately 40℃
by using B or equivalent attaching chassis.
Above correlation graph is based on representative value of BG series cameras. Correlation of attaching
chassis area and ambient temperature changes depend on model. Please check attaching chassis size
with thermal design guide line of “Documents” tub in below link according to ambient temperature.
http://www.toshiba-teli.co.jp/en/products/industrial/gige/index.htm
D4220136B
2
Copyright © 2013-2015 TOSHIBA TELI CORPORATION, All rights reserved.
www.toshiba-teli.co.jp/en/
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